Optical module

Abstract

An optical module (200) comprises a circuit board (300), an optical fiber support (500) and a lens assembly (400), a photoelectric chip is arranged on the circuit board (300), an optical fiber is fixed in the optical fiber support (500), and a positioning hole (502) is formed in the side face of one end of the optical fiber support (500); the lens assembly (400) is arranged on the photoelectric chip in a covering mode, a positioning column (402) and a supporting arm are arranged on the side face of one end of the lens assembly (400), and the positioning column (402) and the positioning hole (502) are oppositely arranged. The optical fiber support (500) is provided with a boss, and the supporting arm supports the boss, so that a gap exists between the optical fiber support (500) and the surface of the circuit board (300). A groove (403) is formed in the side face of the lens assembly (400), a first lens (404) is arranged in the groove (403), and the optical fiber is in coupling butt joint with the first lens (404). The optical fiber support (500) and the lens assembly (400) are positioned through the positioning column (402) and the positioning hole (502), the optical fiber support (500) is supported and fixed through the supporting arm, the stability of the optical fiber support (500) and the lens assembly (400) is improved, the optical fiber support (500) is arranged in a suspended mode, a photoelectric chip, a signal line and the like can be placed on the circuit board (300) below the optical fiber support (500), and therefore the layout space on the circuit board (300) is enlarged.

Description

optical modules

[0001] This application claims priority to the application number 202211401103.X filed with the China Patent Office on November 9, 2022; and priority to the application number 202310802982.5 filed with the China Patent Office on June 30, 2023; all contents of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Art

[0003] With the development of new services and applications such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for converting optical and electrical signals, and are key components in optical communication equipment. Furthermore, the transmission rates of optical modules are constantly increasing as optical communication technology evolves.

[0004] Summary of the Invention

[0005] The present application provides an optical module, comprising:

[0006] a circuit board on which an optoelectronic chip is disposed;

[0007] An optical fiber bracket, in which an optical fiber is inserted, and a positioning hole is provided on the side surface of one end;

[0008] A lens assembly is provided on the optoelectronic chip;

[0009] The optical fiber holder is provided with a boss, with a gap between it and the surface of the circuit board; a positioning post and a support arm are provided on the side surface of one end of the lens assembly, and the positioning post is provided corresponding to the positioning hole; the support arm extends from the side surface toward the optical fiber holder, and the support arm supports the boss; a groove is provided on the side surface, and the groove is recessed in the side surface, and a first lens is provided in the groove, and the optical fiber is coupled and docked with the first lens;

[0010] And / or, the optoelectronic chip includes an optical monitoring chip, an optical transmitting chip, and an optical receiving chip; the optical fiber includes a first optical fiber array and a second optical fiber array, the first optical fiber array and the second optical fiber array are arranged side by side along the width direction of the circuit board and at the same height; the lens assembly is connected to the optical fiber bracket, and the surface thereof is respectively formed with:

[0011] The first inclined surface has a first preset angle with the axis in the longitudinal direction of the circuit board, and is used to receive the optical signal emitted by the optical emitting chip and split the optical signal into a first split light and a second split light;

[0012] The second inclined surface has a second preset angle with the axis in the length direction of the circuit board and one end is connected to the first inclined surface, and is used to receive and transmit the first split light;

[0013] The third inclined surface has a third preset angle with the axis in the longitudinal direction of the circuit board and is connected to the other end of the second inclined surface, and is used to receive the first split light from the second inclined surface and change the transmission direction of the first split light by the interaction between the third preset angle, the second preset angle and the first preset angle, so as to transmit the first split light to the first optical fiber array;

[0014] The fourth inclined surface has a fourth preset angle with the axis in the longitudinal direction of the circuit board, and is used to receive the second split light and transmit the second split light to the optical monitoring chip through the cooperation of the fourth preset angle and the first preset angle;

[0015] The fifth inclined plane has a fifth preset angle with the axis in the length direction of the circuit board, the surface height of the fifth inclined plane is different from the surface height of the third inclined plane, the fifth preset angle is different from the third preset angle, and the fifth inclined plane and the third inclined plane are arranged along the width direction of the circuit board, and are used to receive the optical signal transmitted by the second optical fiber array and change the transmission direction of the optical signal to transmit the optical signal to the optical receiving chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0017] FIG1 is a connection diagram of an optical communication system according to some embodiments of the present disclosure;

[0018] FIG2 is a structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0019] FIG3 is a schematic structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0020] FIG4 is a partially exploded schematic diagram of an optical module provided according to some embodiments of the present disclosure;

[0021] FIG5 is a schematic diagram of the assembly of a circuit board, a lens assembly, and an optical fiber holder in an optical module according to some embodiments of the present disclosure;

[0022] FIG6 is a first schematic diagram of an assembly structure of a lens assembly and an optical fiber holder in an optical module according to some embodiments of the present disclosure;

[0023] FIG7 is an exploded schematic diagram of a lens assembly and an optical fiber holder in an optical module according to some embodiments of the present disclosure;

[0024] FIG8 is a first structural diagram of a lens assembly in an optical module according to some embodiments of the present disclosure;

[0025] FIG9 is a second structural diagram of a lens assembly in an optical module according to some embodiments of the present disclosure;

[0026] FIG10 is a cross-sectional view of a lens assembly in an optical module according to some embodiments of the present disclosure;

[0027] FIG11 is a schematic diagram of the assembly of a lens assembly, an optical fiber holder, and an optoelectronic chip in an optical module according to some embodiments of the present disclosure;

[0028] FIG12 is a first structural diagram of an optical fiber support in an optical module according to some embodiments of the present disclosure;

[0029] FIG13 is a second structural diagram of an optical fiber support in an optical module according to some embodiments of the present disclosure;

[0030] FIG14 is a third structural diagram of an optical fiber support in an optical module according to some embodiments of the present disclosure;

[0031] FIG15 is a second schematic diagram of the assembly structure of a lens assembly and an optical fiber holder in an optical module according to some embodiments of the present disclosure;

[0032] FIG16 is an enlarged schematic diagram of point A in FIG15;

[0033] FIG17 is a cross-sectional view of an assembly of a lens assembly and an optical fiber support in an optical module according to some embodiments of the present disclosure;

[0034] FIG18 is a top view of an assembly of a lens assembly and an optical fiber support in an optical module according to some embodiments of the present disclosure;

[0035] FIG19 is a schematic diagram of an emission light path of an optical module according to some embodiments of the present disclosure;

[0036] FIG20 is a schematic diagram of a receiving optical path of an optical module according to some embodiments of the present disclosure;

[0037] FIG21 is an exploded schematic diagram of a lens assembly, an optical fiber holder, and a chip protection cover according to some embodiments of the present disclosure;

[0038] FIG22 is an exploded schematic diagram of a lens assembly and an optoelectronic chip according to some embodiments of the present disclosure;

[0039] FIG23 is a cross-sectional schematic diagram of a lens assembly, an optical fiber holder, and a chip protection cover according to some embodiments of the present disclosure;

[0040] FIG24 is a second structural diagram of a lens assembly provided according to some embodiments of the present disclosure;

[0041] FIG25 is a first cross-sectional view of a lens assembly according to some embodiments of the present disclosure;

[0042] FIG26 is a third structural diagram of a lens assembly according to some embodiments of the present disclosure;

[0043] FIG27 is a first schematic diagram of an emission light path of a lens assembly according to some embodiments of the present disclosure;

[0044] FIG28 is a second schematic diagram of an emission light path of a lens assembly according to some embodiments of the present disclosure;

[0045] FIG29 is a first diagram illustrating a principle of optical path design of a lens assembly according to some embodiments of the present disclosure;

[0046] FIG30 is a second diagram showing a light path design principle of a lens assembly according to some embodiments of the present disclosure;

[0047] FIG31 is a third diagram showing a light path design principle of a lens assembly according to some embodiments of the present disclosure;

[0048] FIG32 is a second cross-sectional view of a lens assembly according to some embodiments of the present disclosure;

[0049] FIG33 is a first schematic diagram of a receiving optical path of a lens assembly according to some embodiments of the present disclosure;

[0050] FIG34 is a second schematic diagram of a receiving optical path of a lens assembly according to some embodiments of the present disclosure;

[0051] Figure 35 is a third schematic diagram of the receiving light path of a lens assembly provided according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0052] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0053] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0054] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0055] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. For example, when describing some embodiments, the term "connected" may be used to indicate that two or more components are in direct physical or electrical contact with each other. For another example, when describing some embodiments, the term "coupled" may be used to indicate that two or more components are in direct physical or electrical contact. However, the term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0056] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0057] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0058] The use of "adapted to" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0059] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0060] In optical communication technology, to establish information transmission between information processing devices, it is necessary to load the information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When transmitting optical signals within information transmission equipment, they can reduce optical power loss, thereby enabling high-speed, long-distance, and low-cost information transmission. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment typically includes optical fibers and optical waveguides.

[0061] Optical modules can convert optical signals into electrical signals between information processing devices and information transmission devices. For example, at least one of the optical signal input or output ends of an optical module is connected to an optical fiber, and at least one of the electrical signal input or output ends of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber. Because multiple information processing devices can transmit information via electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is referred to as the optical module's host computer. Furthermore, the optical signal input or output end of the optical module can be referred to as an optical port, and the electrical signal input or output end of the optical module can be referred to as an electrical port.

[0062] FIG1 is a partial structural diagram of an optical communication system according to some embodiments. As shown in FIG1 , the optical communication system mainly includes a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 , and a network cable 103 .

[0063] One end of optical fiber 101 extends toward remote information processing device 1000, and the other end of optical fiber 101 is connected to optical module 200 through the optical port of optical module 200. Optical signals can be totally reflected in optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal undergoes multiple total reflections in optical fiber 101 to transmit the optical signal from remote information processing device 1000 to optical module 200, and vice versa, thereby achieving long-distance, low-power information transmission.

[0064] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 may be detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0065] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0066] The host computer 100 also includes an external electrical interface that can access an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to access a network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing device 2000 and the host computer 100 via the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is transmitted to the remote server 1000 via the optical fiber 101. For example, a first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that optical modules are tools for converting optical signals into electrical signals. During this conversion process, the information does not change, but the encoding and decoding methods of the information can change.

[0067] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0068] Figure 2 is a partial structural diagram of a host computer according to some embodiments. To clearly illustrate the connection between the optical module 200 and the host computer 100, Figure 2 only shows the structure of the host computer 100 related to the optical module 200. As shown in Figure 2, the host computer 100 also includes a PCB circuit board 105 disposed within the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed within the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has raised structures such as fins to increase the heat dissipation area.

[0069] The optical module 200 is inserted into the cage 106 of the host computer 100. The cage 106 secures the optical module 200. Heat generated by the optical module 200 is transferred to the cage 106 and then dissipated through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 connects to the electrical connector inside the cage 106, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, thereby establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0070] Figure 3 is a structural diagram of an optical module according to some embodiments, and Figure 4 is an exploded view of an optical module according to some embodiments. As shown in Figures 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed within the housing, and optical components.

[0071] The housing includes an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing with two openings. The outer contour of the housing is generally a square.

[0072] In some embodiments of the present disclosure, the lower shell 202 includes a base plate and two lower side plates located on both sides of the base plate and arranged perpendicular to the base plate; the upper shell 201 includes a cover plate, which is covered on the two lower side plates of the lower shell 202 to form the above-mentioned shell.

[0073] In some embodiments, the lower shell 202 includes a base plate and two lower side plates located on both sides of the base plate and arranged perpendicularly to the base plate; the upper shell 201 includes a cover plate and two upper side plates located on both sides of the cover plate and arranged perpendicularly to the cover plate, and the two upper side plates are combined with the two lower side plates to achieve the upper shell 201 covering the lower shell 202.

[0074] The direction of the line connecting the two openings 204 and 205 can be consistent with the length direction of the optical module 200, or it can be inconsistent with the length direction of the optical module 200. For example, opening 204 is located at the end of the optical module 200 (the right end in Figure 3), and opening 205 is also located at the end of the optical module 200 (the left end in Figure 3). Alternatively, opening 204 is located at the end of the optical module 200, while opening 205 is located on the side of the optical module 200. Opening 204 is an electrical port, from which the gold finger of the circuit board 300 extends and is inserted into the host computer (for example, the optical network terminal 100); opening 205 is an optical port, configured to connect to the external optical fiber 101, so that the external optical fiber 101 can connect to the optical components inside the optical module 200.

[0075] The combined assembly of upper and lower housings 201 and 202 facilitates the installation of components such as the circuit board 300 and optical components within the housing, with these components encapsulated and protected by the upper and lower housings 201 and 202. Furthermore, during assembly of the circuit board 300 and optical components, the positioning, heat dissipation, and electromagnetic shielding components of these components are easily arranged, facilitating automated production.

[0076] In some embodiments, the upper shell 201 and the lower shell 202 are generally made of metal materials, which are conducive to electromagnetic shielding and heat dissipation.

[0077] In some embodiments, the optical module 200 further includes an unlocking component 203 located outside its housing. The unlocking component 203 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0078] For example, the unlocking component 203 is located on the outer walls of the two lower side panels of the lower housing 202 and has engaging features that mate with the cage of the host computer (e.g., the cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the cage of the host computer, the engaging features of the unlocking component 203 secure the optical module 200 in the cage. When the unlocking component 203 is pulled, the engaging features of the unlocking component 203 move accordingly, thereby changing the connection between the engaging features and the host computer, thereby releasing the engaging relationship between the optical module 200 and the host computer, and allowing the optical module 200 to be removed from the cage of the host computer.

[0079] The circuit board 300 includes circuit traces, electronic components, and chips. The circuit traces connect the electronic components and chips together according to the circuit design to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips include, for example, microcontroller units (MCUs), laser driver chips, limiting amplifiers, clock and data recovery (CDR) chips, power management chips, and digital signal processing (DSP) chips.

[0080] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably support the above-mentioned electronic components and chips; when the optical component is located on the circuit board, the rigid circuit board can also provide stable support; the rigid circuit board can also be inserted into the electrical connector in the upper computer cage.

[0081] The circuit board 300 also includes gold fingers formed on its end surfaces. The gold fingers are composed of multiple independent pins. The circuit board 300 is inserted into the cage 106, and the gold fingers are electrically connected to the electrical connector inside the cage 106. The gold fingers can be provided only on one side of the circuit board 300 (for example, the upper surface shown in FIG4 ), or they can be provided on both the upper and lower surfaces of the circuit board 300 to accommodate applications requiring a large number of pins. The gold fingers are configured to establish an electrical connection with the host computer to achieve power supply, grounding, I2C signal transmission, data signal transmission, etc.

[0082] Of course, some optical modules also use flexible printed circuits. They are typically used in conjunction with rigid printed circuits to complement them. For example, a flexible printed circuit can be used to connect a rigid printed circuit to an optical component.

[0083] FIG5 is a schematic diagram of the assembly of the circuit board, lens assembly, and optical fiber holder in the optical module provided in an embodiment of the present application, FIG6 is a schematic diagram of the assembly structure of the lens assembly and optical fiber holder in the optical module provided in an embodiment of the present application, and FIG7 is a schematic diagram of the exploded view of the lens assembly and optical fiber holder in the optical module provided in an embodiment of the present application. As shown in FIG5, FIG6, and FIG7, the optical assembly includes an optoelectronic chip, a lens assembly 400, an optical fiber holder 500, and an optical fiber array 600. The optoelectronic chip is directly mounted on the circuit board 300. In order to couple light to the optical fiber array 600, the lens assembly 400 needs to be covered on the optoelectronic chip to collimate and converge the light, and then the light spot is coupled to the optical fiber end face of the optical fiber array 600. This requires precise fixation between the optical fiber holder 500 and the lens assembly 400, and the optical fiber array 600 is fixed to the appropriate position of the lens assembly 400 by the support of the optical fiber holder 500.

[0084] Specifically, the lens assembly 400 is arranged on the circuit board 300 and is covered above the optoelectronic chip on the circuit board 300 in a cover-type manner (the optoelectronic chip mainly refers to the light emitting chip, driver chip, light receiving chip, transimpedance amplifier chip, limiting amplifier chip and other chips related to the photoelectric conversion function). The lens assembly 400 and the circuit board 300 form a cavity that encapsulates optoelectronic chips such as the light emitting chip and the light receiving chip. The lens assembly 400 and the circuit board 300 together form a structure for encapsulating the optoelectronic chip. The light emitted by the light emitting chip enters the optical fiber array 600 after being reflected by the lens assembly 400. The light from the optical fiber array 600 enters the optical receiving chip after being reflected by the lens assembly 400. The lens assembly 400 establishes a mutual optical connection between the light emitting chip and the optical fiber array. The lens assembly 400 not only seals the optoelectronic chip, but also establishes an optical connection between the optoelectronic chip and the optical fiber array.

[0085] The lens assembly 400 can be made of a polymer material through an injection molding process. Specifically, the material made of the lens assembly 400 includes a material with good light transmittance, such as PEI (Polyetherimide) plastic (Ultem series). Since all the light beam propagation elements in the lens assembly 400 are formed of a single piece of the same polymer material, the molding mold can be greatly reduced, thereby reducing the manufacturing cost and complexity. At the same time, the embodiment of the present application only needs to adjust the position of the incident light beam and the optical fiber based on the lens assembly 400 structure set above, and installation and debugging are simple.

[0086] One end of the fiber array 600 is optically connected to the lens assembly 400, and the other end is optically connected to the fiber adapter 700. The fiber array 600, composed of multiple optical fibers, transmits light from the lens assembly 400 to the fiber adapter 700, thereby emitting optical signals. The fiber array 600 also transmits light from the fiber adapter 700 to the lens assembly 400, thereby receiving optical signals from outside the optical module.

[0087] There is a good optical coupling structure design between the optical fiber array 600 and the lens assembly 400. The multi-path converged light from the lens assembly 400 is incident on the multi-path optical fibers of the optical fiber array 600, and the optical structure of the lens assembly 400 is used to realize optical connection with the light emitting chip; the multi-path light from the optical fiber array 600 is incident on the lens assembly 400, and the optical structure of the lens assembly 400 is used to realize optical connection with the light receiving chip.

[0088] The optical fiber array 600 and the lens assembly 400 have a good fixed structure design, which can achieve relative fixation between the optical fiber array 600 and the lens assembly 400, thereby forming a relative fixation between the lens assembly 400 and the circuit board 300, and a relative fixation between the optical fiber array 600 and the lens assembly 400.

[0089] The fiber optic adapter is located at the optical interface formed by the upper shell 201 and the lower shell 202. It is a connector that connects the optical module to the external optical fiber of the optical module. In addition, in order to connect with the external optical fiber, it is often necessary to set a matching structure at the upper shell 201, the lower shell 202, and the optical interface. The fiber optic adapter generally has a standard shape and size to facilitate the insertion of the external fiber optic connector / plug. It has multiple fiber optic docking interfaces inside, including interfaces for outgoing optical signals and interfaces for incoming optical signals. Common fiber optic connectors / plugs are MT-type fiber optic connectors (such as MPO (Multi-fiber Push On) fiber optic jumper connectors). By inserting the fiber optic adapter of the optical module through the fiber optic connector, the optical signal inside the optical module can be transmitted to the external optical fiber, and the optical signal outside the optical module can be transmitted to the inside of the optical module.

[0090] In the embodiment of the present application, to achieve relative fixation between the optical fiber array 600 and the lens assembly 400, the optical module provided in the embodiment of the present application further includes an optical fiber holder 500. The optical fiber holder 500 is fixedly connected to the lens assembly 400 and has the optical fibers of the optical fiber array 600 fixed inside. Specifically, an optical fiber includes a core layer, a cladding layer, and a protective layer. The protective layer is wrapped around the cladding layer, which is wrapped around the core layer. The optical signal is transmitted in the core layer.

[0091] Figure 8 is a schematic diagram of the structure of the lens assembly in the optical module according to an embodiment of the present application, and Figure 9 is a schematic diagram of the structure of the lens assembly in the optical module according to an embodiment of the present application. As shown in Figures 8 and 9, the lens assembly 400 includes a limiting wall 401, a first side wall 409, and a second side wall 4010. The limiting wall 401 faces the optical fiber holder 500, and the first side wall 409 and the second side wall 4010 are arranged opposite each other. The two ends of the limiting wall 401 are respectively connected to the first side wall 409 and the second side wall 4010.

[0092] A positioning post 402 is provided on the limiting wall 401. The positioning post 402 extends from the limiting wall 401 toward the optical fiber holder 500 to position the optical fiber holder 500. In the embodiment of the present application, the positioning post 402 on the lens assembly 400 is a circular positioning post.

[0093] A groove 403 is provided on the limiting wall 401 of the lens assembly 400, and the side wall of the groove 403 is parallel to the limiting wall 401, and the side wall of the groove 403 is recessed in the limiting wall 401; a first lens 404 is provided on the side wall of the groove 403, and the first lens 404 is connected to the interior of the lens assembly 400. The first lens 404 is used to convert the light reflected from the inside of the lens assembly 400 into a convergent light beam, and the convergent light beam is coupled to the optical fiber array 600 fixed by the optical fiber bracket 500, so as to converge the multi-channel convergent light from the lens assembly 400 into the multi-channel optical fiber of the optical fiber array 600, thereby realizing light emission; similarly, the first lens 404 is also used to converge the light from the multi-channel optical fiber of the optical fiber array 600 to the lens assembly 400, and transmit it to the optical receiving chip after reflection by the lens assembly 400, thereby realizing light reception.

[0094] In some embodiments, two positioning posts 402 are provided on the limiting wall 401 . The two positioning posts 402 are located on both sides of the groove 403 to ensure the positioning connection between the lens assembly 400 and the optical fiber bracket 500 .

[0095] The lens assembly 400 further includes a first support arm 410 and a second support arm 420. The first support arm 410 and the second support arm 420 are disposed opposite each other, with a gap therebetween. The two positioning posts 402 are positioned within this gap. Specifically, the first support arm 410 extends from the limiting wall 401 toward the optical fiber holder 500, with the outer sidewall of the first support arm 410 flush with the second sidewall 4010. The second support arm 420 extends from the limiting wall 401 toward the optical fiber holder 500, with the outer sidewall of the second support arm 420 flush with the first sidewall 409.

[0096] Figure 10 is a cross-sectional view of the lens assembly in the optical module provided by an embodiment of the present application. As shown in Figure 10, a first support platform 4101 is provided at one end of the first support arm 410 facing the optical fiber holder 500. The first support platform 4101 extends from the bottom surface of the first support arm 410 toward the circuit board 300. The vertical thickness of the first support arm 410 is less than the vertical thickness of the lens assembly 400. The vertical thickness of the first support platform 4101 is h1. In this way, the first support platform 4101 is fixed to the surface of the circuit board 300, and a gap exists between the bottom surface of the first support arm 410 and the surface of the circuit board 300.

[0097] Similarly, a second support platform 4201 is provided at one end of the second support arm 420 facing the optical fiber bracket 500, and the second support platform 4201 extends from the bottom surface of the second support arm 420 toward the circuit board 300. The thickness dimension of the second support arm 420 in the up and down directions is smaller than the thickness dimension of the lens assembly 400 in the up and down directions. The thickness dimension of the second support platform 4201 in the up and down directions is h1. In this way, the second support platform 4201 is fixed on the surface of the circuit board 300, and there is a gap between the bottom surface of the second support arm 420 and the surface of the circuit board 300.

[0098] In some embodiments, a first glue dispensing groove 4011 is provided at the connection between the limiting wall 401 and the first side wall 409, the side wall of the first glue dispensing groove 4011 is recessed in the limiting wall 401 and the first side wall 409, the top surface of the first glue dispensing groove 4011 is provided with an opening, and the bottom surface of the first glue dispensing groove 4011 is flush with the top surface of the second support arm 420; a second glue dispensing groove 4012 is provided at the connection between the limiting wall 401 and the second side wall 4010, the side wall of the second glue dispensing groove 4012 is recessed in the limiting wall 401 and the second side wall 4010, the top surface of the second glue dispensing groove 4012 is provided with an opening, and the bottom surface of the second glue dispensing groove 4012 is flush with the top surface of the first support arm 410.

[0099] The glue points for fixing the lens assembly 400 and the optical fiber bracket 500 are in the first glue spot groove 4011 and the second glue spot groove 4012, so as to achieve a fixed connection between the lens assembly 400 and the optical fiber bracket 500 through glue.

[0100] In some embodiments, the optoelectronic chip is disposed on the circuit board 300. In order to both adhere the lens assembly 400 to the circuit board 300 and cover the optoelectronic chip on the circuit board 300, a cavity 406 is provided on the side of the lens assembly 400 facing the circuit board 300. The cavity 406 is provided with an opening on the side facing the circuit board 300, and the optoelectronic chip is disposed in the space formed by the cavity 406 and the circuit board 300.

[0101] In order to reflect the light beam, the inner surface of the lens assembly 400 is provided with a second lens 407 and a third lens 408, and the outer surface is provided with a reflector 405. The reflective surface 4051 of the reflector 405 is located above the second lens 407 and the third lens 408. The second lens 407 is an emitting lens, which is used to convert the light beam emitted by the light emitting chip on the circuit board 300 into a collimated light beam. The collimated light beam is reflected by the reflective surface 4051 and then enters the first lens 404. Thereafter, the light beam is converged and coupled to the optical fiber array 600 through the first lens 404.

[0102] The third lens 408 is a receiving lens for converting the light beam incident on the lens assembly 400 through the first lens 404 into a collimated light beam. The collimated light beam is reflected by the reflective surface 4051 and then incident on the light receiving chip on the circuit board 300 .

[0103] Figure 11 is a schematic diagram illustrating the assembly of the lens assembly, optical fiber support, and optoelectronic chip in an optical module according to an embodiment of the present application. As shown in Figure 11, after the lens assembly 400 is fabricated according to the above scheme, it is affixed to the surface of the circuit board 300, and the optoelectronic chip on the circuit board 300 is positioned within the cavity 406 of the lens assembly 400. The optoelectronic chip includes a light emitting chip 310, a light emitting driver chip 320, a light receiving chip 330, and a light receiving driver chip 340. The light emitting chip 310 is positioned directly below the second lens 407 to facilitate directing the light beam emitted by the light emitting chip 310 to the second lens 407.

[0104] The light emission driver chip 320 can be set on the right side of the light emission chip 310 (located in the cavity 406). The light emission driver chip 320 is signal-connected to the circuit board 300 and the light emission chip 310 respectively. The circuit board 300 provides an electrical signal to the light emission driver chip 320. The light emission driver chip 320 outputs a driving electrical signal according to the electrical signal to drive the light emission chip 310 to emit a light beam.

[0105] The optical receiving chip 330 is arranged directly below the third lens 408 to facilitate the collimated light beam emitted by the third lens 408 to reach the optical receiving chip 330; the optical receiving driver chip 340 can be arranged on the left side of the optical receiving chip 330 (close to the direction of the optical fiber bracket 500), and the optical receiving driver chip 340 is signal-connected to the optical receiving chip 330, and is used to drive the optical receiving chip 330 to convert the optical signal into an electrical signal.

[0106] The light emitting driver chip 320 can also be arranged side by side with the light receiving driver chip 340 on the right side of the light emitting chip 310 and the light receiving chip 330, that is, the light emitting chip 310, the light emitting driver chip 320, the light receiving chip 330, and the light receiving driver chip 340 are arranged side by side on the same side.

[0107] In the embodiment of the present application, the placement of the optoelectronic chip on the circuit board 300 in the cavity 406 of the lens assembly 400 is not limited to the above-mentioned placement, and can be arranged accordingly according to the size of the optoelectronic chip.

[0108] FIG12 is a first schematic diagram of the structure of the optical fiber holder in the optical module provided in an embodiment of the present application, FIG13 is a second schematic diagram of the structure of the optical fiber holder in the optical module provided in an embodiment of the present application, and FIG14 is a third schematic diagram of the structure of the optical fiber holder in the optical module provided in an embodiment of the present application. As shown in FIG12, FIG13, and FIG14, a positioning hole 502 is provided on the side of the optical fiber holder 500 facing the lens assembly 400. The positioning hole 502 is arranged opposite to the positioning post 402 on the lens assembly 400. When the optical fiber holder 500 is fixedly connected to the lens assembly 400, the positioning post 402 is inserted into the positioning hole 502, thereby achieving a positioning connection between the optical fiber holder 500 and the lens assembly 400 through the positioning hole 502 and the positioning post 402.

[0109] Specifically, the optical fiber holder 500 includes a first side 501 (the first side 501 is the side of the optical fiber holder 500 facing the lens assembly 400), a second side 505, a third side 506 and a fourth side 512. The fourth side 512 is arranged opposite to the first side 501, and the second side 505 is arranged opposite to the third side 506. The two ends of the first side 501 are respectively connected to the second side 505 and the third side 506, and the second side 505 and the third side 506 are located between the first support arm 410 and the second support arm 420.

[0110] The positioning hole 502 is disposed on the first side surface 501 . The positioning hole 502 can penetrate the first side surface 501 and the fourth side surface 512 , so that the positioning post 402 can be fully inserted into the positioning hole 502 to position the lens assembly 400 .

[0111] In some embodiments, a fiber array 600 is fixed on the inner side of the fiber bracket 500. After the fiber bracket 500 is fixedly connected to the lens assembly 400 through the positioning column 402 and the positioning hole 502, the optical fiber coupling of the lens assembly 400 and the fiber array 600 is docked, and the light reflected by the lens assembly 400 is coupled to the optical fiber in the fiber array 600.

[0112] In order to fix the optical fiber array 600, an optical fiber fixing groove 504 is provided in the optical fiber bracket 500, and an optical fiber hole is provided on the fourth side 512 of the optical fiber bracket 500. The optical fiber hole is connected to the optical fiber fixing groove 504, so that the optical fiber of the optical fiber array 600 is inserted into the optical fiber fixing groove 504 through the optical fiber hole; the top surface of the optical fiber fixing groove 504 is provided with an opening, through which the optical fiber fixed in the optical fiber fixing groove 504 can be seen.

[0113] A through hole 503 is also provided on the first side 501 of the optical fiber holder 500, and the through hole 503 is connected to the optical fiber fixing groove 504. The optical fiber of the optical fiber array 600 is inserted into the optical fiber holder 500 through the optical fiber hole on the fourth side, and then continues to be inserted to the right so that the optical fiber is embedded in the optical fiber fixing groove 504, and then continues to be inserted to the right and comes out from the through hole 503 on the first side 501.

[0114] In some embodiments, after the optical fiber passes through the through hole 503 of the first side surface 501 , there may be a certain distance between the fiber end face of the optical fiber and the first side surface 501 , that is, the fiber end face of the optical fiber protrudes from the first side surface 501 .

[0115] In some embodiments, after the optical fibers of the optical fiber array 600 are inserted into the optical fiber bracket 500 through the optical fiber hole, the optical fiber fixing groove, and the through hole 503, glue can be injected into the optical fiber fixing groove 504 through the opening of the optical fiber fixing groove 504, and glue can also be dispensed around the optical fiber hole on the fourth side 512 to achieve a fixed connection between the optical fiber array 600 and the optical fiber bracket 500.

[0116] A fifth side surface 507 is provided on the second side surface 505 of the optical fiber bracket 500. The fifth side surface 507 is connected to the first side surface 501 and is recessed in the second side surface 505. The fifth side surface 507 is connected to the second side surface 505 through the first connecting surface 508, so that the second side surface 505 and the fifth side surface 507 form a step surface.

[0117] A first boss 510 is provided on the fifth side surface 507, and the first boss 510 extends outward from the fifth side surface 507. The first boss 510 includes a top surface, a first surface 5101, a second surface 5102, a third surface 5103 and a fourth surface. The top surface of the first boss 510 is flush with the top surface of the optical fiber bracket 500, and the first surface 5101 is arranged opposite to the top surface of the first boss 510. The thickness dimension of the first surface 5101 and the top surface of the first boss 510 in the up and down direction is smaller than the thickness dimension of the optical fiber bracket 500 in the up and down direction, that is, the first surface 5101 is recessed in the bottom surface of the optical fiber bracket 500.

[0118] The second surface 5102 is connected to the top surface of the first boss 510 and the first surface 5101. The second surface 5102 is disposed opposite the fifth side surface 507 and protrudes from the second side surface 505. In this way, the first boss 510 protrudes from the second side surface 505. The fourth surface is flush with the first side surface 501, and the third surface 5103 is disposed opposite the fourth surface.

[0119] Similarly, a sixth side 509 is provided on the third side 506 of the optical fiber bracket 500. The sixth side 509 is connected to the first side 501 and is recessed in the third side 506. The sixth side 509 is connected to the third side 506 through the second connecting surface 511, so that the third side 506 and the sixth side 509 form a step surface.

[0120] A second boss 520 is provided on the sixth side surface 509, and the second boss 520 extends outward from the sixth side surface 509. The second boss 520 includes a top surface, a first surface 5201, a second surface 5202, a third surface 5203 and a fourth surface. The top surface of the second boss 520 is flush with the top surface of the optical fiber bracket 500, and the first surface 5201 and the top surface of the second boss 520 are arranged opposite to each other. The thickness dimension of the first surface 5201 and the top surface of the first boss 510 in the up and down direction is smaller than the thickness dimension of the optical fiber bracket 500 in the up and down direction, that is, the first surface 5201 is recessed in the bottom surface of the optical fiber bracket 500.

[0121] The second surface 5202 is connected to the top surface of the second boss 520 and the first surface 5201. The second surface 5202 is disposed opposite the sixth side surface 509 and protrudes from the third side surface 506. In this way, the second boss 520 protrudes from the third side surface 506. The fourth surface is flush with the first side surface 501, and the third surface 5203 is disposed opposite the fourth surface.

[0122] FIG15 is a second schematic diagram of the assembly structure of the lens assembly and the optical fiber holder in the optical module provided by an embodiment of the present application, FIG16 is an enlarged schematic diagram of point A in FIG15 , and FIG17 is a cross-sectional view of the assembly structure of the lens assembly and the optical fiber holder in the optical module provided by an embodiment of the present application. As shown in FIG15 , FIG16 and FIG17 , when the lens assembly 400 is fixedly connected to the optical fiber holder 500, the first support arm 410 of the lens assembly 400 first supports the first boss 510 of the optical fiber holder 500, and the second support arm 420 supports the second boss 520 of the optical fiber holder 500, so that the optical fiber holder 500 is placed between the first support arm 410 and the second support arm 420, and the optical fiber holder 500 is supported by the first support arm 410 and the second support arm 420.

[0123] Specifically, the top surface of the first support arm 410 is supported and connected to the first surface 5101 of the first boss 510, and the inner side wall of the first support arm 410 can be in contact and connected to the second side surface 505 of the optical fiber bracket 500; the top surface of the second support arm 420 is supported and connected to the first surface 5201 of the second boss 520, and the inner side wall of the second support arm 420 can be in contact and connected to the third side surface 506 of the optical fiber bracket 500, so that the positioning column 402 on the lens assembly 400 is aligned with the positioning hole 502 on the optical fiber bracket 500.

[0124] Then move the optical fiber holder 500 from left to right so that the positioning column 402 is inserted into the positioning hole 502, and then continue to move the optical fiber holder 500 to the right so that the first side 501 of the optical fiber holder 500 contacts the limiting wall 401 of the lens assembly 400, and the positioning column 402 is completely inserted into the positioning hole 502.

[0125] The optical fiber holder 500 is positioned relative to the lens assembly 400 via the positioning posts 402 and the positioning holes 502. The optical fiber holder 500 is supported by the first support arm 410 and the second support arm 420 of the lens assembly 400. After the first side surface 501 of the optical fiber holder 500 is bonded and fixed to the limiting wall 401, the optical fiber holder 500 is suspended above the circuit board 300 and does not support the circuit board 300. In other words, a gap exists between the bottom surface of the optical fiber holder 500 and the surface of the circuit board 300, which can be used for placing chips, bonding wires, etc.

[0126] In some embodiments, the groove 403 of the lens assembly 400 is recessed in the limiting wall 401, and the optical fiber end face protrudes from the first side 501 of the optical fiber bracket 500. When the lens assembly 400 is fixedly connected to the optical fiber bracket 500, the protruding optical fiber end face can be located in the groove 403.

[0127] Figure 18 is a top view of the assembly of a lens assembly and a fiber holder in an optical module provided by an embodiment of the present application. As shown in Figure 18, the lens assembly 400 and the fiber holder 500 are positioned and connected via positioning posts 402 and positioning holes 502. After the fiber holder 500 is supported and fixed by the first support arm 410 and the second support arm 420 of the lens assembly 400, the positioning posts 402 and the positioning holes 502 are used to ensure that the optical fibers of the fiber array 600 fall at the convergence point of the lens assembly 400, and then the entire assembly is coupled to the optical transmitter chip and the optical receiver chip.

[0128] After the optical fiber holder 500 and the lens assembly 400 are installed in place, glue is applied to the first glue dispensing groove 4011 and the second glue dispensing groove 4012 of the lens assembly 400 to bond and secure the first side surface 501 of the optical fiber holder 500 to the limiting wall 401 of the lens assembly 400. Glue is applied to the top surface of the first support arm 410 to bond and secure the inner side wall of the first support arm 410 to the second side surface 505 of the optical fiber holder 500. Glue is applied to the top surface of the second support arm 420 to bond and secure the inner side wall of the second support arm 420 to the third side surface 506 of the optical fiber holder 500. Glue is applied to the junction between the bottom surface of the lens assembly 400 and the surface of the circuit board 300 to bond and secure the lens assembly 400 to the circuit board 300. Thus, a fixed connection between the lens assembly 400 and the circuit board 300 is achieved, and a fixed connection between the lens assembly 400 and the optical fiber holder 500 is achieved.

[0129] Figure 19 is a schematic diagram of the transmitting optical path of the optical module provided in an embodiment of the present application, and Figure 20 is a schematic diagram of the receiving optical path of the optical module provided in an embodiment of the present application. As shown in Figures 19 and 20, after the optoelectronic chips such as the optical transmitter chip 310, the optical transmitter driver chip 320, the optical receiver chip 330, and the optical receiver driver chip 340 are attached to the circuit board 300 in a certain arrangement, the lens assembly 400 is covered on the optoelectronic chips and attached to the surface of the circuit board 300; then, the multiple optical fibers of the optical fiber array 600 are inserted into the optical fiber holder 500 through the optical fiber hole, optical fiber fixing groove 504, and through hole 503 of the optical fiber holder 500, and the optical fiber end faces of the optical fibers protrude from the first side surface 501 of the optical fiber holder 500.

[0130] Then move the optical fiber holder 500, place the first boss 510 of the optical fiber holder 500 on the first support arm 410 of the lens assembly 400, and place the second boss 520 on the second support arm 420 of the lens assembly 400, so as to support the optical fiber holder 500 through the first support arm 410 and the second support arm 420 of the lens assembly 400; then continue to move the optical fiber holder 500, insert the positioning column 402 of the lens assembly 400 into the positioning hole 502 of the optical fiber holder 500, and continue to move the optical fiber holder 500 until the first side surface 501 of the optical fiber holder 500 contacts the limiting wall 401 of the lens assembly 400.

[0131] Then apply glue to the first glue groove 4011 and the second glue groove 4012 of the lens assembly 400, and use glue to fix the limiting wall 401 of the lens assembly 400 to the first side 501 of the optical fiber bracket 500; apply glue to the top surface of the first support arm 410, and use glue to fix the first support arm 410 to the first boss 510 of the optical fiber bracket 500; apply glue to the top surface of the second support arm 420, and use glue to fix the second support arm 420 to the second boss 520 of the optical fiber bracket 500.

[0132] After the optical fiber holder 500 is fixed to the lens assembly 400, there is a gap between the bottom surface of the optical fiber holder 500 and the surface of the circuit board 300. The gap size is at least the height size of the optoelectronic chip + 0.07mm, that is, the gap size h2 between the bottom surface of the optical fiber holder 500 and the top surface of the optoelectronic chip is at least 0.07mm, to ensure that the optoelectronic chip can be placed in the gap and wired.

[0133] In some embodiments, for safety reasons, the gap between the bottom surface of the optical fiber holder 500 and the surface of the circuit board 300 is generally equal to the height of the optoelectronic chip + 0.15 mm.

[0134] The first support arm 410 on the lens assembly 400 cooperates with the first boss 510 on the fiber optic support 500, and the second support arm 420 cooperates with the second boss 520 to vertically elevate the fiber optic support 500. The first support arm 410 is connected to the surface of the circuit board 300 via a first support platform 4101 at its end. The middle bottom of the first support arm 410 is suspended, and this suspended portion can be used to place optoelectronic chips, wire bonding, etc. The second support arm 420 is connected to the surface of the circuit board 300 via a second support platform 4201 at its end. The middle bottom of the second support arm 420 is suspended, and this suspended portion can be used to place optoelectronic chips, wire bonding, etc.

[0135] In some embodiments, the first support platform 4101 of the first support arm 410 can protrude from the fourth side 512 of the optical fiber holder 500, and the second support platform 4201 of the second support arm 420 can protrude from the fourth side 512 of the optical fiber holder 500. If the first support platform 4101 and the second support platform 4201 are placed between the first side 501 and the fourth side 512 of the optical fiber holder 500, when the optoelectronic chip is set in the space below the optical fiber holder 500, the optoelectronic chip also needs to avoid the first support platform 4101 and the second support platform 4201.

[0136] When the first support platform 4101 and the second support platform 4201 are located on the left side of the fourth side surface 512, the space below the optical fiber bracket 500, the first support arm 410 and the second support arm 420 is increased, and more optoelectronic chips, bonding wires, etc. can be arranged in this space.

[0137] In some embodiments, depending on the optoelectronic chips, bonding wires, etc. arranged under the first support arm 410 and under the second support arm 420, the width dimension of the first support arm 410 in the front-to-back direction may be different from the width dimension of the second support arm 420 in the front-to-back direction. For example, if there are more optoelectronic chips under the first support arm 410 than under the second support arm 420, the width dimension of the first support arm 410 is greater than the width dimension of the second support arm 420 to better protect the optoelectronic chips under the first support arm 410.

[0138] When the optoelectronic chip under the first support arm 410 is the same as the optoelectronic chip under the second support arm 420 , the width of the first support arm 410 in the front-to-back direction may also be the same as the width of the second support arm 420 in the front-to-back direction.

[0139] After the optoelectronic chip, lens assembly 400, optical fiber bracket 500 and optical fiber array 600 are assembled, the light emitting chip 310 generates a light beam driven by the light emitting driver chip 320. The light beam is converted into a collimated light beam through the second lens 407. The collimated light beam is emitted to the reflector 405 and reflected at the reflecting surface 4051. The reflected light beam is horizontally emitted to the first lens 404. The light beam is converged and coupled into the optical fiber of the optical fiber array 600 by the first lens 404, thereby realizing light emission.

[0140] The optical fiber of the optical fiber array 600 directs the light beam transmitted from the external optical fiber to the first lens 404, and then directs the light beam to the reflector 405 via the first lens 404, where it is reflected at the reflecting surface 4051. The reflected light beam is directed to the third lens 408, where it is converted into a convergent light beam by the third lens 408, and then converged to the optical receiving chip 330. The optical receiving chip 330 converts the optical signal into an electrical signal, thereby realizing light reception.

[0141] The optical module provided by the embodiment of the present application includes a circuit board, an optoelectronic chip arranged on the circuit board, a lens assembly covered on the optoelectronic chip, an optical fiber bracket and an optical fiber array, the lens assembly includes a limiting wall, a first side wall and a second side wall, the limiting wall faces the optical fiber bracket, a positioning column and a groove are provided on the limiting wall, the groove is recessed in the limiting wall, and a first lens is provided in the groove, and the first lens is connected to the inner cavity of the lens assembly; the lens assembly also includes a first support arm and a second support arm, the first support arm and the second support arm extend from the limiting wall toward the direction of the optical fiber bracket, and there is a gap between the first support arm and the second support arm; the optical fiber bracket includes a first side surface, a second side surface and a third side surface The first side surface faces the lens assembly, and the two ends of the first side surface are respectively connected to the second side surface and the third side surface; a positioning hole is provided on the first side surface, and the positioning post on the lens assembly is inserted into the positioning hole to position and connect the lens assembly and the optical fiber holder; a first boss protruding outward is provided on the second side surface, and the first support arm supports the first boss; a second boss protruding outward is provided on the third side surface, and the second support arm supports the second boss to raise the optical fiber holder in the up and down directions so that the optical fiber holder is suspended; the optical fibers of the optical fiber array are inserted into the optical fiber holder, and after the lens assembly is fixedly connected to the optical fiber holder, the optical fibers of the optical fiber array are coupled with the first lens in the lens assembly.

[0142] In the present application, the optical fiber holder is positioned by means of a positioning column, a positioning hole and a lens assembly, and the first support arm and the second support arm of the lens assembly support and fix the optical fiber holder. The optical fiber is fixed in a suitable position of the lens assembly by means of the support of the optical fiber holder, thereby improving the stability of the optical fiber holder and the lens assembly, so that the optical fiber fixed in the optical fiber holder will not be offset, ensuring that the light spot reflected by the lens assembly can reach the center of the optical fiber according to the theoretical value, thereby improving the coupling efficiency of the optical signal; the first support arm and the second support arm of the lens assembly enable the optical fiber holder to be suspended in the air, so that optoelectronic chips, signal lines, etc. can be placed on the circuit board below the optical fiber holder, thereby improving the layout space on the circuit board.

[0143] In some other embodiments of the present disclosure, FIG21 is an exploded schematic diagram of a lens assembly 900, an optical fiber bracket, and a chip protection cover 900b according to some embodiments.

[0144] In some embodiments, the optical fibers fixed to the inner side of the optical fiber holder include a first optical fiber array 900a1 and a second optical fiber array 900a2; the first optical fiber array 900a1 and the second optical fiber array 900a2 are arranged side by side along the width of the circuit board. Compared to a single-fiber bidirectional design, in this application, the side-by-side arrangement of the first optical fiber array 900a1 and the second optical fiber array 900a2 allows the optical transmitter and the optical receiver to transmit signals via unused optical fibers, thereby avoiding crosstalk between the optical transmission signal and the optical reception signal. Furthermore, the side-by-side arrangement of the first optical fiber array 900a1 and the second optical fiber array 900a2 along the width of the circuit board fully utilizes the space along the width of the circuit board and optimizes the placement of the optical fiber arrays.

[0145] The first fiber array 900a1 and the second fiber array 900a2 are each composed of multiple optical fibers. They transmit light from the lens assembly 900 to the fiber adapter to transmit optical signals externally, and transmit light from the fiber adapter to the lens assembly 900 to receive optical signals from outside the optical module. The first fiber array 900a1 and the second fiber array 900a2 each have a well-designed optical coupling structure with the lens assembly 900, ensuring relative fixation between the fiber arrays and the lens assembly 900. For example, the first fiber array 900a1 is a transmitting fiber array, and the second fiber array 900a2 is a receiving fiber array.

[0146] The light emitted by the light emitting chip enters the first optical fiber array 900a1 after being transmitted through the lens assembly 900, and the light from the second optical fiber array 900a2 enters the light receiving chip after being transmitted through the lens assembly 900. Therefore, the lens assembly 900 establishes a mutual optical connection between the light emitting chip and the first optical fiber array 900a1, and establishes a mutual optical connection between the light receiving chip and the second optical fiber array 900a2.

[0147] A first inclined surface 901 , a third inclined surface 903 , and a fifth inclined surface 905 are formed on the surface of the lens assembly 900 . The first inclined surface 901 , the third inclined surface 903 , and the fifth inclined surface 905 are arranged obliquely relative to the surface of the circuit board.

[0148] The first inclined surface 901 has a first preset angle relative to the surface of the circuit board, the third inclined surface 903 has a third preset angle relative to the surface of the circuit board, and the fifth inclined surface 905 has a fifth preset angle relative to the surface of the circuit board. The first inclined surface 901, the third inclined surface 903, and the fifth inclined surface 905 exhibit different refraction or reflection characteristics to light. By tilting the inclined surfaces and cooperating with each other at different preset angles, the propagation direction of the optical signal is changed, thereby achieving transmission of the optical signal according to a specific optical path design.

[0149] The third bevel 903 and the fifth bevel 905 are arranged side by side along the width direction of the circuit board, and the third preset angle is different from the fifth preset angle. The third bevel 903 and the fifth bevel 905 have a certain height difference in height. For example, the surface height of the third bevel 903 is higher than the surface height of the fifth bevel 905, that is, the third bevel 903 and the fifth bevel 905 are misaligned along the width direction of the circuit board, presenting a misaligned arrangement.

[0150] Figure 22 is an exploded schematic diagram of a lens assembly and optoelectronic chip according to some embodiments. As shown in Figure 22, the surface of the lens assembly is formed with a first inclined surface 901, a third inclined surface 903, a fifth inclined surface 905, a first stepped surface 911, and a second stepped surface 912. The lens assembly 900 is mounted on an optoelectronic chip 900c, which includes a first optoelectronic chip, a second optoelectronic chip, a third optoelectronic chip, a fourth optoelectronic chip, and a fifth optoelectronic chip. In some embodiments, the first optoelectronic chip is a first driver chip 900c1, the second optoelectronic chip is a light emitting chip 900c2, the third optoelectronic chip is a light monitoring chip 900c3, the fourth optoelectronic chip is a second driver chip 900c4, and the fifth optoelectronic chip is a light receiving chip 900c5. Exemplarily, the light monitoring chip 900c3 is an optical power detector used to monitor the light transmission power of the light emitting chip 900c2. The first driver chip 900c1 is a transmitting driver chip, and the second driver chip 900c4 is a receiving driver chip.

[0151] One end of the first driver chip 900c1 is electrically connected to a gold finger on the surface of the circuit board via a high-frequency signal line, and the other end is electrically connected to the light emitting chip 900c2. The circuit board 300 outputs a modulation current and a bias current to the first driver chip 900c1 via the gold finger. After receiving the modulation current, the first driver chip 900c1 generates a high-frequency signal and then transmits the high-frequency signal and bias current to the transmitting driver chip. The transmitting driver chip generates a light beam under the action of the bias current and then modulates the high-frequency signal into the light beam to generate an optical signal.

[0152] One end of the second driver chip 900c4 is electrically connected to the gold finger on the surface of the circuit board through a high-frequency signal line, and the other end is electrically connected to the light receiving chip 900c5. The circuit board 300 provides an electrical signal to the second driver chip 900c4 through the gold finger. After receiving the electrical signal, the second driver chip 900c4 generates a light receiving drive signal and transmits the light receiving drive signal to the light receiving chip 900c5. Under the action of the light receiving drive signal, the light receiving chip 900c5 converts the electrical signal transmitted by the circuit board 300 into an optical signal.

[0153] In some embodiments, the optical monitoring chip 900c3 and the first driver chip 900c1 are respectively arranged on both sides of the optical emission chip 900c2, and the first driver chip 900c1 is arranged on the side close to the gold finger of the circuit board. This arrangement is conducive to the routing of high-frequency signal lines between the first driver chip 900c1 and the gold finger of the circuit board, reduces the difficulty of routing, shortens the routing length, and thus improves the high-frequency signal transmission performance; the optical monitoring chip 900c3 is arranged on the side close to the optical fiber bracket, that is, the side close to the optical port; this does not occupy the position of the first driver chip 900c1, so that there is sufficient space between the gold finger and the optical emission chip 900c2 to place the first driver chip 900c1, as well as the routing between the first driver chip 900c1 and the gold finger.

[0154] Since the optical monitoring chip 900c3 is arranged on one side of the optical emitting chip 900c2, there is enough space between the gold finger and the optical emitting chip 900c2 to place the first driver chip 900c1 and the wiring between the first driver chip 900c1 and the gold finger, which is more suitable for the transmission of multi-channel optical signals.

[0155] When the optical monitoring chip 900c3 and the first driver chip 900c1 are respectively arranged on either side of the light emitting chip 900c2, the vertical height from the first optical fiber array 900a1 to the surface of the circuit board 300 is relatively high, that is, the vertical height from the optical port to the surface of the circuit board 300 is relatively high. The vertical height from the first optical fiber array 900a1 to the surface of the circuit board 300 is greater than the vertical height from the first inclined surface 901 to the surface of the circuit board 300. This ensures that a portion of the optical signal emitted by the light emitting chip 900c2 can be incident on the optical monitoring chip 900c3, and a portion of the optical signal can be incident on the first optical fiber array 900a1. Therefore, when the optical monitoring chip 900c3 and the first driver chip 900c1 are respectively arranged on either side of the light emitting chip 900c2, there are certain restrictions on the optical port height. For example, the vertical height from the first optical fiber array 900a1 to the surface of the circuit board 300 can be 2 mm, etc.

[0156] In some embodiments, the optical port height is relatively low, and it is not suitable to respectively place the optical monitoring chip 900c3 and the first driving chip 900c1 on both sides of the optical emitting chip 900c2.

[0157] In some embodiments, the second step surface 912 is used to support the chip protection cover 900b; the first step surface 911 is connected to the fifth inclined surface 905. Since the inclination angle of the fifth inclined surface 905 is large, if the first step surface 911 is not connected to the fifth inclined surface 905, the extension length of the fifth inclined surface 905 will be longer, thereby causing the lens assembly to be larger in size; therefore, the connection between the first step surface 911 and the fifth inclined surface 905 is beneficial to reducing the size of the lens assembly.

[0158] Figure 23 is a cross-sectional schematic diagram of a lens assembly, optical fiber holder, and chip protection cover according to some embodiments. As shown in Figure 23, the lens assembly 900 is positioned over the optoelectronic chip 900c. In some embodiments, the first and second driver chips are exposed relative to the lens assembly 900, so a chip protection cover 900b is provided to protect the exposed chips. The first end of the chip protection cover 900b is connected to the surface of the circuit board 300, and the second end is connected to the end of the lens assembly 900. In some embodiments, the second end has an opening, through which the cover is inserted into the end of the lens assembly 900 and then connected to the end of the lens assembly 900. The first end has an escape notch to avoid the wiring between the first driver chip 900c1 and the gold finger. Exemplarily, the width of the chip protection cover 900b is greater than the sum of the widths of the first and second driver chips to protect the first and second driver chips.

[0159] The surface of the lens assembly 900 facing the optical fiber support is provided with a first lens array and a second lens array. The first lens array is coupled to the first optical fiber array 900a1, and the second lens array is coupled to the second optical fiber array 900a2. In some embodiments, the first lens array includes a plurality of transmitting and converging lenses, and the second lens array includes a plurality of receiving and collimating lenses.

[0160] The optical signal emitted by the optical emitting chip 900c2 enters the first lens array after the transmission direction is turned, and then the optical signal is converged by the converging lens in the first lens array, converged to the optical fiber end face and enters the first optical fiber array 900a1, thereby improving the optical coupling efficiency.

[0161] The second lens array receives the optical signal from the second optical fiber array 900 a 2 , and then the collimating lens in the second lens array collimates the optical signal to obtain parallel light, which enters the lens assembly 900 .

[0162] Figure 24 is a second structural diagram of a lens assembly according to some embodiments. As shown in Figure 24, the bottom end of lens assembly 900 is provided with a third lens array 908 and a fourth lens array 909. In some embodiments, third lens array 908 includes several transmitting collimating lenses, and fourth lens array 909 includes several receiving converging lenses.

[0163] In some embodiments, the third lens array 908 and the fourth lens array 909 are staggered along the width direction of the circuit board. Correspondingly, the light emitting chip 900c2 and the light receiving chip 900c5 are also staggered along the width direction of the circuit board, thereby avoiding crosstalk between the transmitting optical path and the receiving optical path. Due to the optical path design, the third lens array 908 is relatively far away from the fourth lens array 909. If the fourth lens array 909 is set to be flush with the third lens array 908, the optical path of the receiving optical path will inevitably be increased. Therefore, when the third lens array 908 and the fourth lens array 909 are staggered along the width direction of the circuit board, the optical path of the receiving optical path can be shortened, which is beneficial to the transmission of the received optical signal.

[0164] In some embodiments, the third lens array 908 is disposed between the light emitting chip 900 c 2 and the first inclined surface 901 , and the third lens array 908 is disposed on a projection area of ​​the first inclined surface 901 on the bottom surface of the lens assembly 900 .

[0165] In some embodiments, the fourth lens array 909 is disposed between the light receiving chip 900 c 5 and the fifth inclined surface 905 , and the fourth lens array 909 is disposed on a projection area of ​​the fifth inclined surface 905 on the bottom surface of the lens assembly 900 .

[0166] Since the optical signal emitted by the light emitting chip 900 c 2 is divergent light, the divergent light is converted into parallel light by the third lens array 908 .

[0167] The fourth lens array 909 converts the parallel light from the fifth inclined surface 905 into convergent light, and then transmits the convergent light to the light receiving chip 900c5, thereby improving the light coupling efficiency.

[0168] FIG25 is a cross-sectional view of a lens assembly according to some embodiments. As shown in FIG25 , the surface of the lens assembly 900 is formed with a first inclined surface 901, a second inclined surface 902, a third inclined surface 903, a fourth inclined surface 904, and a fifth inclined surface 905. These inclined surfaces exhibit different refractive or reflective properties to light. In some embodiments, the first inclined surface 901 exhibits both refraction and reflection to light, the second inclined surface 902 exhibits refraction to light, the third inclined surface 903 exhibits total internal reflection to light, the fourth inclined surface 904 exhibits refraction to light, and the fifth inclined surface 905 exhibits total internal reflection to light. From the perspective of the functions implemented, the first inclined surface 901 is a splitting surface; the second inclined surface 902 is a refractive surface; the third inclined surface 903 is a light path turning surface, at which the light path is turned to the first optical fiber array 900a1; the fourth inclined surface 904 is a refractive surface, allowing the second split light to pass through and be incident on the optical monitoring chip 900c3; the fifth inclined surface 905 is a light path turning surface, at which the light path is turned to the optical receiving chip 900c5.

[0169] The first bevel 901, the second bevel 902, the third bevel 903, the fourth bevel 904 and the fifth bevel 905 are all surfaces on the lens assembly 900, that is, the materials made of these bevels are the same as the materials made of the lens assembly 900; these bevels have different preset angles relative to the surface of the circuit board, and these bevels have different degrees of inclination. Through the mutual cooperation between the various bevels, the transmission direction of light is changed, and the optical signal emitted by the light emitting chip 900c2 is emitted, and the optical signal transmitted from the outside is received by the light receiving chip 900c5.

[0170] The first bevel 901 , the second bevel 902 , the third bevel 903 , the fourth bevel 904 and the fifth bevel 905 are all surfaces on the lens assembly 900 , thereby avoiding the need for additional reflective sheets or filters, thereby preventing the reflective surfaces or filters from falling off.

[0171] The first inclined surface 901 divides the collimated light into the first split light and the second split light according to a certain splitting ratio; since the material properties of the first inclined surface 901 are determined and the size of the first preset angle α1 is determined, the splitting ratio of the first inclined surface 901 is relatively stable. In some embodiments, the splitting ratio of the first inclined surface 901 is a fixed value.

[0172] In some embodiments, light splitting is achieved through filters and reflective surfaces. The light splitting ratios exhibited by these light splitting methods are related to the laser spot size, the light splitting point size, etc., so the light splitting ratios may fluctuate to a certain extent.

[0173] FIG26 is a third structural diagram of a lens assembly according to some embodiments. As shown in FIG26 , the first inclined surface 901 forms a first predetermined angle α1 with the horizontal axis, where the horizontal axis is the longitudinal axis of the circuit board 300. The angle between the first inclined surface 901 and the longitudinal axis of the circuit board 300 is the first predetermined angle α1.

[0174] The included angle between the second inclined surface 902 and the axis of the circuit board 300 in the length direction is a second preset angle α2.

[0175] The angle between the third inclined surface 903 and the axis of the circuit board 300 in the length direction is a third preset angle α3.

[0176] The included angle between the fourth inclined surface 904 and the axis of the circuit board 300 in the length direction is a fourth preset angle α4.

[0177] In some embodiments, there is a preset relationship among the first preset angle α1 , the second preset angle α2 , and the third preset angle α3 , so that a portion of the transmitted light signal is transmitted to the first optical fiber array 900 a 1 .

[0178] In some embodiments, there is a preset relationship between the first preset angle α1 and the fourth preset angle α4, so that a portion of the transmitted light signal is transmitted to the light receiving chip 900c5.

[0179] In some embodiments, various inclined surfaces are formed on the surface of the lens assembly 900, and each inclined surface has a different inclination angle. Since each inclined surface exhibits different refraction or reflection characteristics to light, the different inclination angles of the inclined surfaces cooperate with each other to change the transmission direction of the optical signal, so that a portion of the proportional optical signal emitted by the optical emitting chip is transmitted to the optical monitoring chip 900c3, and a portion of the proportional optical signal is transmitted to the first optical fiber array 900a1 and emitted.

[0180] FIG27 is a schematic diagram of a first optical transmission path of a lens assembly according to some embodiments, and FIG28 is a schematic diagram of a second optical transmission path of a lens assembly according to some embodiments. As shown in FIG27 and FIG28 , the optical signal emitted by the optical emission chip 900c2 is divergent light. The divergent light is converted into collimated light by the collimating lens in the third lens array 908. The collimated light is then transmitted to the first inclined surface 901. The collimated light is refracted and reflected at the first inclined surface 901, thereby splitting the collimated light into a first light beam and a second light beam. The first light beam is transmitted to the second inclined surface 902. The first light beam is refracted at the second inclined surface 902, thereby transmitting the first light beam to the third inclined surface 903. The first light beam is totally reflected at the third inclined surface 903, thereby transmitting the first light beam to the first lens array. After being converged by the converging lens in the first lens array, the collimated light is converted into converged light. The converged light is then transmitted to the first optical fiber array 900a1, thereby being transmitted out of the first optical fiber array 900a1.

[0181] Of course, in addition to the above-mentioned method in which the first split light enters the first lens array and the first optical fiber array 900a1 via the second inclined surface 902 and the third inclined surface 903, the following method can also be adopted: for example, the second inclined surface 902 is eliminated, and a portion of the first lens array is integrally formed above the third inclined surface 903, so that the surface of the newly formed portion of the first lens array forms the third inclined surface 903. In this case, after exiting the first inclined surface 901, the first split light first passes through the air, then directly reaches the third inclined surface 903 and is reflected, and finally enters the first lens array and the first optical fiber array 900a1. That is, the optical path of the first split light is changed from an inclined direction to a horizontal direction and finally enters the first optical fiber array 900a1.

[0182] Compared with the above-mentioned setting method of eliminating the second bevel 902, the method of Figures 27 and 28 is adopted. From the overall point of view, the first bevel 901, the second bevel 902 and the third bevel 903 on the surface of the lens assembly 900 are all exposed in the same direction, that is, the physical structure of the lens assembly 900 is located on the same side. This setting facilitates the production of the lens assembly 900. For example, the lens assembly 900 is produced by a molding process, which facilitates the production of the mold and the pressurization of the molten optical glass material placed in the mold, thereby improving the quality of the lens assembly 900 and improving the production efficiency of the lens assembly 900.

[0183] The second split light is reflected onto the fourth inclined surface 904 , and the second split light is refracted on the surface of the fourth inclined surface 904 , thereby transmitting the second split light to the optical monitoring chip 900 c 3 .

[0184] In some embodiments, a converging lens is provided on the fourth inclined surface 904 . The second split light is converted from parallel light to convergent light after passing through the converging lens, and is incident on the light monitoring chip 900 c 3 in the form of convergent light.

[0185] In some embodiments, a converging lens may not be provided on the fourth inclined surface 904, and the second split light is incident on the optical monitoring chip 900c3 in the form of parallel light. At this time, the light incident surface area on the optical monitoring chip 900c3 is larger than the beam diameter when the second split light is incident in the form of parallel light.

[0186] In some embodiments, there is a certain relationship between the first preset angle α1 and the fourth preset angle α4, so that the transmission direction of the second split light does not change when it is refracted on the surface of the fourth inclined surface 904, that is, the second split light is transmitted out of the surface of the fourth inclined surface 904 and is transmitted into the light monitoring chip 900c3.

[0187] In some embodiments, there is a certain relationship between the first preset angle α1 and the fourth preset angle α4, so that the transmission direction of the second split light changes when refracted on the fourth inclined surface 904, thereby transmitting the second split light to the light monitoring chip 900c3.

[0188] In the present application, after the second split light is totally reflected at the position of the third bevel 903, it is directly transmitted to the first optical fiber array 900a through the internal medium of the lens assembly, thereby preventing the second split light from undergoing other forms of reflection between the third bevel 903 and the first optical fiber array 900a, and thus preventing the light from returning to the light emitting chip 900c2, thereby ensuring the quality of the signal emitted by the light emitting chip 900c2; at the same time, the emitted light power of the second split light can also be guaranteed.

[0189] In some embodiments, after total reflection, the optical signal propagates in the air and enters the internal medium of the lens assembly, and then is transmitted to the first optical fiber array 900a through the internal medium of the lens assembly. The optical signal will then undergo a certain degree of reflection at the interface between the air and the medium and be reflected back to the light emitting chip 900c2, thereby affecting the quality of the signal emitted by the light emitting chip 900c2.

[0190] Figure 29 is a schematic diagram of an optical path design principle of a lens assembly according to some embodiments. As shown in Figure 29, in some embodiments, by controlling the magnitude of the first preset angle α1, the transmission direction of the reflected light can be controlled, thereby causing the reflected light to be incident on the light monitoring chip.

[0191] In some embodiments, the first preset angle α1 ranges from 10° to 38°; if the first preset angle α1 is too small, the emission light path of the optical signal emitted by the optical emitting chip and the reflection light path on the first inclined surface 901 cannot be separated, which easily causes crosstalk of the optical paths; if the first preset angle α1 is too large, the optical signal emitted by the optical emitting chip will be totally reflected on the surface of the first inclined surface 901, and the optical signal will all enter the optical monitoring chip 900c3, and light splitting cannot be achieved.

[0192] In some embodiments, there is a certain relationship between the first preset angle α1 and the fourth preset angle α4, so that the transmission direction of the second split light does not change when it is refracted on the surface of the fourth inclined surface 904, that is, the second split light is transmitted out of the surface of the fourth inclined surface 904 and is transmitted into the light monitoring chip 900c3.

[0193] In some embodiments, the distance between the center of the light emitting chip 900c2 and the center of the light monitoring chip 900c3 is L; the angle between the first inclined surface 901 and the horizontal axis is a first preset angle α1; the angle between the incident light and the reflected light of the light signal emitted by the light emitting chip 900c2 on the surface of the first inclined surface 901 is θ. According to the geometric relationship, θ=2α1.

[0194] The angle between the fourth inclined surface 904 and the horizontal axis is a fourth preset angle α4. According to the geometric relationship, when α4=2α1, the reflected light of the transmitted light signal on the surface of the first inclined surface 901 is vertically incident on the surface of the fourth inclined surface 904.

[0195] In some embodiments, when the first preset angle α1 is determined, the intersection between the light signal emitted by the light emitting chip and the first inclined surface 901 is determined, that is, the intersection between the collimated light passing through the collimating lens and the first inclined surface 901 is determined, and the transmission direction of the reflected light on the first inclined surface 901 is determined; when the fourth preset angle α4 is determined, the intersection between the reflected light on the first inclined surface 901 and the fourth preset angle α4 is determined, and the vertical distance between the intersection between the light signal emitted by the light emitting chip and the first inclined surface 901 and the intersection between the reflected light and the fourth preset angle α4 is determined, and the vertical distance is determined, and the vertical distance is referred to as H1.

[0196] The vertical distance from the intersection of the reflected light and the fourth preset angle α4 to the central axis is H2, where the central axis is the central axis of the converging lens in the third lens array. The vertical distance H2 is also a fixed value.

[0197] The focal length of the converging lens in the third lens array refers to the distance from its central axis to the surface of the light emitting chip, which is referred to as F. Since the focal length of the converging lens is fixed, the distance F is also fixed.

[0198] In some embodiments, the distance between the center of the light emitting chip 900c2 and the center of the light monitoring chip 900c3 is L = (H1 + H2 + F) * tanθ, that is, L = (H1 + H2 + F) * tan2α1. Therefore, when the conditions α4 = 2α1 and L = (H1 + H2 + F) * tan2α1 are satisfied, the light reflected from the first inclined surface 901 is perpendicularly incident on the light monitoring chip 900c3. The condition α4 = 2α1 allows the light reflected from the first inclined surface 901 to be perpendicularly incident on the fourth inclined surface 904, and the condition L = (H1 + H2 + F) * tan2α1 allows the light reflected from the first inclined surface 901 to be emitted from the fourth inclined surface 904 and then reach the light monitoring chip 900c3.

[0199] Figure 30 is a second schematic diagram of a light path design principle of a lens assembly according to some embodiments. As shown in Figure 30 , in some embodiments, the second split light changes its transmission direction when it is refracted by the fourth inclined surface 904, thereby transmitting the second split light to the light monitoring chip 900c3.

[0200] The vertical distance between the intersection of the light signal emitted by the light emitting chip and the first inclined surface 901 and the intersection of the reflected light and the fourth preset angle α4 is H1.

[0201] A vertical distance from the intersection of the reflected light and the fourth preset angle α4 to the central axis is H2.

[0202] The distance from the central axis of the converging lens to the surface of the light emitting chip is F, where F is the focal length of the converging lens.

[0203] The distance between the center of the light emitting chip 900c2 and the center of the light monitoring chip 900c3 is L=L1+L2.

[0204] Among them, L1=H1*tanθ, and since θ=2α1, therefore, L1=H1*tan2α1.

[0205] Wherein, L2=(H2+F)*tanω. Angle ω is the angle between the refractive optical fiber of the fourth inclined surface 904 and the vertical axis.

[0206] The angle between the normal of the fourth inclined surface 904 and the horizontal axis is λ1, and the angle between the reflected light on the first inclined surface 901 and the normal of the fourth inclined surface 904 is λ2, which is also the incident angle of the fourth inclined surface 904.

[0207] The refraction angle of the fourth inclined surface 904 is λ3, and the refraction law is satisfied between λ2 and λ3: n*sinλ2=1*sinλ3, where “1” refers to the refractive index of air and n is the refractive index of the lens assembly 900; therefore, sinλ3=n*sinλ2.

[0208] The angle between the normal line of the fourth inclined surface 904 and the vertical axis is λ4.

[0209] According to the geometric relationship, Set θ = 2α1, Bring in, get,

[0210] Substituting λ2=α4-2α1 into sinλ3=n*sinλ2, we obtain: sinλ3=n*sin(α4-2α1), so λ3=arcsin[n*sin(α4-2α1)].

[0211] According to the geometric relationship, λ4=α4.

[0212] Then ω=λ4-λ3=α4-arcsin[n*sin(α4-2α1)].

[0213] Therefore, L2=(H2+F)*tanω=(H2+F)*tan{α4-arcsin[n*sin(α4-2α1)]}.

[0214] The distance L between the center of the light emitting chip 900c2 and the center of the light monitoring chip 900c3 must satisfy the following condition: L = L1 + L2 = H1*tan2α1 + (H2 + F)*tan{α4-arcsin[n*sin(α4-2α1)]}. At this time, the transmission direction of the second split light changes when it is refracted and emitted on the surface of the fourth inclined surface 904, thereby transmitting the second split light to the light monitoring chip 900c3.

[0215] Therefore, when L=L1+L2=H1*tan2α1+(H2+F)*tan{α4-arcsin[n*sin(α4-2α1)]}, the transmission direction of the second split light changes when it is refracted on the surface of the fourth inclined surface 904, thereby transmitting the second split light to the optical monitoring chip 900c3.

[0216] Figure 31 is a third schematic diagram of the optical path design principle of a lens assembly according to some embodiments. As shown in Figure 31 , in some embodiments, the transmission direction of the first split light is changed from vertical incidence to horizontal, thereby allowing the first split light to enter the first optical fiber array 900a1 and then be emitted.

[0217] In some embodiments, the first preset angle α1, the second preset angle α2 and the third preset angle α3 must satisfy a certain relationship so that the transmission direction of the first split light can be changed from vertical incidence to horizontal direction and total reflection occurs on the surface of the third inclined surface 903.

[0218] The angle between the light signal emitted by the light emitting chip and the normal line of the first inclined surface 901 is γ1. According to the geometric relationship, γ1=α1, where α1 is the first preset angle α1.

[0219] The refraction angle on the first inclined surface 901 is γ2. According to the law of refraction, n*sinγ1=sinγ2, that is, n*sinα1=sinγ2, and γ2=arcsin(n*sinα1).

[0220] The angle between the refracted light emitted from the first inclined surface 901 and the first inclined surface 901 is γ3, and the angle between the first inclined surface 901 and the second inclined surface 902 is β. According to the geometric relationship, it can be seen that: β=α1+α2 (1)

[0221] According to the geometric relationship:

[0222] According to the geometric relationship, we know that: γ4=π-β-γ3 (3)

[0223] Substituting equations (1) and (2) into equation (3), we obtain:

[0224] Wherein, γ4 is the angle between the refracted light emitted from the first inclined surface 901 and the second inclined surface 902 .

[0225] According to the geometric relationship:

[0226] Here, γ5 is the incident angle of the second inclined surface 902 .

[0227] Substituting equation (4) into equation (5) yields:

[0228] According to the law of refraction, sinγ5=nsinγ6, where γ6 is the refraction angle of the second inclined surface 902; then sinγ6=n / sinγ5=n / sin[(α1+α2)-arcsin(n*sinα1)], and substituting equation (6) into it, we obtain: γ6=arcsin{n / sin[(α1+α2)-arcsin(n*sinα1)]} (7)

[0229] According to the geometric relationship:

[0230] Here, γ7 is the angle between the refracted light at the second inclined surface 902 and the second inclined surface 902 .

[0231] Substituting equation (7) into equation (8) yields:

[0232] According to the geometric relationship, we know that: γ8=π-(α2+α3)-γ7 (10)

[0233] Here, γ8 is the angle between the incident light on the third inclined surface 903 and the third inclined surface 903 .

[0234] Substituting equation (9) into equation (10) yields:

[0235] According to the geometric relationship:

[0236] Here, γ9 is the incident angle of the third inclined surface 903 .

[0237] Substituting equation (11) into equation (12) yields:

[0238] In some embodiments of the present application, the first split light needs to be totally reflected at the third inclined surface 903 , and therefore γ9 should be greater than or equal to the critical angle of total reflection of the lens assembly 900 .

[0239] The critical angle of total reflection refers to the incident angle at which the refraction angle is 90°, and is represented by C. Then sinC=1 / n, n is the refractive index of the lens assembly 900, and the critical angle of total reflection C=arcsin(1 / n).

[0240] Then γ9 is greater than or equal to arcsin(1 / n), that is, π+(α2+α3)-arcsin{n / sin[(α1+α2)-arcsin(n*sinα1)]} is greater than or equal to arcsin(1 / n).

[0241] In some embodiments of the present application, when the first preset angle α1, the second preset angle α2, and the third preset angle α3 satisfy the relationship: π+(α2+α3)-arcsin{n / sin[(α1+α2)-arcsin(n*sinα1)]}≥arcsin(1 / n), the transmission direction of the first split light can be changed from vertical incidence to a horizontal direction, and then total internal reflection occurs on the surface of the third inclined surface 903. The first preset angle α1, the second preset angle α2, and the third preset angle α3 that meet the above conditions can be combined in various forms. When the first preset angle α1 and the second preset angle α2 are determined, the third preset angle α3 is also determined.

[0242] In some embodiments of the present application, in the lens assembly 900, the first preset angle α1, the second preset angle α2 and the third preset angle α3 satisfy a certain relationship, and the first preset angle α1 and the fourth preset angle α4 satisfy a certain relationship. Therefore, the lens assembly 900 is a lens assembly with specific inclined surfaces. Through the mutual cooperation of the different inclination angles of the inclined surfaces, the transmission direction of the optical signal is changed, and a portion of the proportional optical signal emitted by the optical emitting chip is transmitted to the optical monitoring chip, and a portion of the proportional optical signal is transmitted to the first optical fiber array and emitted.

[0243] FIG32 is a second cross-sectional view of a lens assembly according to some embodiments. As shown in FIG32 , the fifth inclined surface 905 is inclined to a certain extent. In some embodiments, the angle between the second inclined surface 902 and the longitudinal axis of the circuit board 300 is a fifth preset angle α5.

[0244] Figure 33 is a schematic diagram of a receiving optical path of a lens assembly according to some embodiments; Figure 34 is a schematic diagram of a receiving optical path of a lens assembly according to some embodiments. As shown in Figures 33 and 34, the optical signal from the second optical fiber array is transmitted to the fifth inclined surface 905, and after being reflected by the fifth inclined surface 905, it is transmitted to the optical receiving chip 900c5.

[0245] The optical signal from the second optical fiber array is processed by the collimating lens in the second lens array and converted into collimated light. The collimated light is reflected by the fifth inclined surface 905 and transmitted downward. The collimated light is processed by the converging lens in the fourth lens array 909 and converted into convergent light, which is transmitted to the optical receiving chip 900c5.

[0246] In some embodiments, in order to ensure the light receiving power, when the light signal from the second optical fiber array is transmitted to the fifth inclined surface 905 , it should be totally reflected at the fifth inclined surface 905 .

[0247] In some embodiments, the incident angle of the light signal from the second optical fiber array transmitted to the fifth inclined surface 905 is μ. According to the geometric relationship, In order to allow the optical signal from the second optical fiber array to be transmitted to the fifth inclined surface 905 and to be totally reflected, the incident angle μ should be greater than or equal to the critical angle of total reflection of the lens assembly 900 .

[0248] The critical angle of total reflection refers to the incident angle at which the refraction angle is 90°, and is represented by C. Then sinC=1 / n, n is the refractive index of the lens assembly 900, and the critical angle of total reflection C=arcsin(1 / n).

[0249] but That is, Therefore, in some embodiments of the present application, the fifth preset angle α5 should satisfy the following conditions:

[0250] In some embodiments, the fifth preset angle α5 may be 45°, so that the optical signal is horizontally incident on the fifth inclined surface 905 , and then vertically incident on the optical receiving chip 900 c 5 after the optical path of the fifth inclined surface 905 is turned.

[0251] FIG35 is a third schematic diagram of a receiving optical path of a lens assembly according to some embodiments. As shown in FIG35 , in some embodiments, the fifth preset angle can be other than 45°. Thus, the optical signal is horizontally incident on the fifth inclined surface 905, then deflects through the optical path of the fifth inclined surface 905, and is incident on the optical receiving chip 900c5 at an angle rather than perpendicularly. This prevents the reflected light from the optical receiving chip 900c5 from returning along its original path, thereby reducing interference with the optical signal transmitted by the optical transmitter.

[0252] In some embodiments of the present application, the first optical fiber array 900a1 and the second optical fiber array 900a2 are at the same height, and the parallel light after being turned by the third inclined surface 903 and the fifth inclined surface 905 respectively is at the same height in the horizontal direction, and the light emitting chip and the light receiving chip are also at the same height. Therefore, the vertical height from the first optical fiber array 900a1 to the light emitting chip is the same as the vertical height from the second optical fiber array 900a2 to the light receiving chip. Since the transmitted light signal changes its transmission direction through the first inclined plane 901, the second inclined plane 902 and the third inclined plane 903 in sequence, and the received light signal only passes through the turning of the fifth inclined plane 905, in some embodiments, the inclination angle of the third inclined plane 903 is different from the inclination angle of the fifth inclined plane 905, that is, the third preset angle α3 is different from the fifth preset angle α5. Only then can the comprehensive angle of the first inclined plane 901, the second inclined plane 902 and the third inclined plane 903 changing the transmission direction of the light path be the same as the angle of the fifth inclined plane 905 changing the transmission direction of the light path, thereby achieving the parallel light after turning through the third inclined plane 903 and the fifth inclined plane 905 respectively at the same height in the horizontal direction.

[0253] In some embodiments, the third inclined surface 903 and the fifth inclined surface 905 are offset to a certain extent along the width direction of the circuit board, presenting a staggered arrangement.

[0254] In some embodiments, the third preset angle α3 is smaller than the fifth preset angle α5.

[0255] In some embodiments, the first optical fiber array 900a1 and the second optical fiber array 900a2 are arranged side by side along the width direction of the circuit board, the third inclined plane 903 and the fifth inclined plane 905 are arranged side by side along the width direction of the circuit board, and the third preset angle α3 is smaller than the fifth preset angle α5, thereby realizing the transmission and reception of multi-channel optical signals.

[0256] In some embodiments, the position where the transmitted optical signal is emitted from the third slope 903 is relatively high, located above the central axis of the third slope 903, and the position where the received optical signal is coupled to the fifth slope 905 is relatively low, located at the central axis of the fifth slope 905.

[0257] In some embodiments, the first optical fiber array 900a1 and the second optical fiber array 900a2 are at the same height. Since the light emission undergoes multiple returns, the height of the third inclined surface 903 is higher than the height of the fifth inclined surface 905. At this time, through the compensation of the inclined surface inclination angle, that is, the third preset angle α3 is smaller than the fifth preset angle α5, the light transmission optical signal and the light reception optical signal can be coupled to the first optical fiber array 900a1 and the second optical fiber array 900a2 at the same height respectively.

[0258] The present application forms various inclined surfaces on the surface of the lens assembly, and each inclined surface has a different inclination angle; since each inclined surface exhibits different refraction or reflection characteristics to light, the different inclination angles of the inclined surfaces cooperate with each other to change the transmission direction of the optical signal, and a portion of the proportional optical signal emitted by the optical emitting chip is transmitted to the optical monitoring chip, and a portion of the proportional optical signal is transmitted to the first optical fiber array and emitted; at the same time, the present application arranges the first optical fiber array and the second optical fiber array side by side along the width direction of the circuit board, arranges the third inclined surface and the fifth inclined surface side by side along the width direction of the circuit board, and arranges the optical emitting chip and the optical receiving chip side by side along the width direction of the circuit board, with a compact structure, thereby realizing the transmission and reception of multi-channel optical signals.

[0259] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in the present disclosure should be included within the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. An optical module, comprising: a circuit board on which an optoelectronic chip is disposed; An optical fiber bracket, in which an optical fiber is inserted, and a positioning hole is provided on the side surface of one end; A lens assembly is provided to cover the optoelectronic chip; The optical fiber holder is provided with a boss, and there is a gap between the boss and the surface of the circuit board; a positioning post and a support arm are provided on the side surface of one end of the lens assembly, and the positioning post is provided corresponding to the positioning hole; the support arm extends from the side surface toward the optical fiber holder, and the support arm supports the boss; a groove is provided on the side surface, and the groove is recessed in the side surface, and a first lens is provided in the groove, and the optical fiber is coupled and docked with the first lens; And / or, the optoelectronic chip includes an optical monitoring chip, an optical transmitting chip, and an optical receiving chip; the optical fiber includes a first optical fiber array and a second optical fiber array, the first optical fiber array and the second optical fiber array are arranged side by side along the width direction of the circuit board and at the same height; the lens assembly is connected to the optical fiber bracket, and the surface thereof is respectively formed with: The first inclined surface has a first preset angle with the axis in the longitudinal direction of the circuit board, and is used to receive the optical signal emitted by the optical emitting chip and split the optical signal into a first split light and a second split light; a second inclined surface, having a second preset angle with the axis in the longitudinal direction of the circuit board and one end connected to the first inclined surface, for receiving and transmitting the first split light; a third inclined surface, having a third preset angle with the axis in the longitudinal direction of the circuit board and connected to the other end of the second inclined surface, for receiving the first split light from the second inclined surface and changing the transmission direction of the first split light through the interaction among the third preset angle, the second preset angle, and the first preset angle, so as to transmit the first split light to the first optical fiber array; a fourth inclined surface, having a fourth preset angle with the axis in the longitudinal direction of the circuit board, for receiving the second split light and transmitting the second split light to the optical monitoring chip through the cooperation of the fourth preset angle and the first preset angle; a fifth inclined plane having a fifth preset angle with the axis in the length direction of the circuit board, the surface height of the fifth inclined plane being different from the surface height of the third inclined plane, the fifth preset angle being different from the third preset angle, and the fifth inclined plane and the third inclined plane being arranged along the width direction of the circuit board, for receiving the optical signal transmitted by the second optical fiber array and changing the transmission direction of the optical signal to transmit the optical signal to the optical receiving chip.

2. The optical module according to claim 1, wherein: The lens assembly includes a limiting wall, a first side wall and a second side wall, the limiting wall faces the optical fiber bracket, and the first side wall and the second side wall are arranged opposite to each other; The positioning post and the groove are arranged on the limiting wall, and the positioning post is located at the outer periphery of the groove.

3. The optical module according to claim 2, wherein: The support arm includes a first support arm and a second support arm, the first support arm and the second support arm are arranged opposite to each other, and the positioning column is located between the first support arm and the second support arm; the first support arm extends from the limiting wall toward the direction of the optical fiber bracket, and the outer side surface of the first support arm is flush with the first side wall; The second supporting arm extends from the limiting wall toward the optical fiber bracket, and the outer side surface of the second supporting arm is flush with the second side wall.

4. The optical module according to claim 3, wherein: A first support platform is provided at one end of the first support arm, the bottom surface of the first support platform is connected to the surface of the circuit board, and a gap is formed between the first support arm and the surface of the circuit board; A second supporting platform is provided at one end of the second supporting arm, the bottom surface of the second supporting platform is connected to the surface of the circuit board, and a gap is provided between the second supporting arm and the surface of the circuit board.

5. The optical module according to claim 3, wherein: The optical fiber bracket includes a first side surface, a second side surface, a third side surface, and a fourth side surface, wherein the first side surface faces the lens assembly, the fourth side surface is arranged opposite to the first side surface, and the positioning hole passes through the first side surface and the fourth side surface; The third side surface is arranged opposite to the fourth side surface, and both ends of the first side surface are connected to the third side surface and the fourth side surface respectively; a first boss protruding outward is provided on the third side surface, and a second boss protruding outward is provided on the fourth side surface.

6. The optical module according to claim 5, wherein: The optical fiber bracket further includes a fifth side surface and a sixth side surface, wherein the fifth side surface is recessed in the second side surface and connected to the second side surface via a first connecting surface; and the first boss protrudes outward from the fifth side surface; The sixth side surface is recessed in the third side surface, and the sixth side surface is connected to the third side surface via a second connecting surface; the second boss protrudes outward from the sixth side surface.

7. The optical module according to claim 6, wherein: The first boss includes a first surface, a second surface, a third surface, and a fourth surface, the first surface is arranged opposite to the top surface of the optical fiber holder, and the first surface is recessed in the bottom surface of the optical fiber holder; The second surface is arranged opposite to the fifth side surface, and the second surface protrudes from the second side surface; the fourth surface is flush with the first side surface, and the third surface is arranged opposite to the fourth surface.

8. The optical module according to claim 7, wherein: The second boss includes a first surface, a second surface, a third surface, and a fourth surface, wherein the first surface is arranged opposite to the top surface of the optical fiber holder, and the first surface is recessed into the bottom surface of the optical fiber holder; The second surface is arranged opposite to the sixth side surface, and the second surface protrudes from the third side surface; the fourth surface is flush with the first side surface, and the third surface is arranged opposite to the fourth surface.

9. The optical module according to claim 8, wherein: The top surface of the first support arm is in supporting connection with the first surface, and the inner side wall of the first support arm is in contact connection with the second side surface; The top surface of the second support arm is supported and connected to the first surface, and the inner side wall of the second support arm is in contact and connected to the third side surface.

10. The optical module according to claim 1, wherein: The gap between the bottom surface of the optical fiber bracket and the surface of the circuit board is greater than or equal to the height of the optoelectronic chip+0.07 mm.

11. The optical module according to claim 1, wherein: The surface of the lens assembly is respectively provided with a first lens array and a second lens array; A third lens array is provided between the light emitting chip and the first inclined surface, the third lens array being provided on a projection of the first inclined surface on the bottom surface of the lens assembly, the third lens array comprising a plurality of collimating lenses, the collimating lenses being used to convert the light signal emitted by the light emitting signal into collimated light; A fourth lens array is provided between the light receiving chip and the fifth inclined surface, and the fourth lens array is provided on a projection of the fifth inclined surface on the bottom surface of the lens assembly.

12. The optical module according to claim 11, wherein: A vertical height from the first lens array to the surface of the circuit board is greater than a vertical height from the first inclined surface to the surface of the circuit board.

13. The optical module according to claim 11, wherein: The first preset angle and the fourth preset angle satisfy: α4=2α1, and L=(H1+H2+F)*tan2α1; wherein, α1 is the first preset angle, α4 is the fourth preset angle, L is the distance between the light emitting chip and the light monitoring chip, H1 is the vertical distance from the intersection of the collimated light and the first inclined plane to the intersection of the second split light and the fourth inclined plane, H2 is the vertical distance from the intersection of the second split light and the fourth inclined plane to the central axis of the collimating lens, and F is the focal length of the collimating lens.

14. The optical module according to claim 11, wherein: The first preset angle and the fourth preset angle satisfy: L = H1*tan2α1+(H2+F)*tan{α4-arcsin[n*sin(α4-2α1)]}; wherein α1 is the first preset angle, α4 is the fourth preset angle, L is the distance between the light emitting chip and the light monitoring chip, H1 is the vertical distance from the intersection of the collimated light and the first inclined plane to the intersection of the second split light and the fourth inclined plane, H2 is the vertical distance from the intersection of the second split light and the fourth inclined plane to the central axis of the collimating lens, and F is the focal length of the collimating lens.

15. The optical module according to claim 1, wherein The first preset angle, the second preset angle and the third preset angle satisfy the following relationship: π+(α2+α3)-arcsin{n / sin[(α1+α2)-arcsin(n*sinα1)]}≥arcsin(1 / n), wherein α1 is the first preset angle, α2 is the second preset angle, α3 is the third preset angle, and n is the refractive index of the lens assembly.

16. The optical module according to claim 1, wherein: The surface of the circuit board is also provided with a first driver chip and a second driver chip; The light emitting chip is arranged between the first driving chip and the light monitoring chip; The light receiving chip is arranged on one side of the second driving chip.

17. The optical module according to claim 16, wherein: The optical module further includes a chip protection cover; The chip protection cover is arranged on surfaces of the first driving chip and the second driving chip that are exposed relative to the lens assembly.

18. The optical module according to claim 1, wherein: The third preset angle is smaller than the fifth preset angle.

19. The optical module according to claim 1, wherein: The third inclined surface and the fifth inclined surface are staggered.

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