Silicone pad with pattern structure for manufacturing semiconductors

Abstract

Provided is a silicone pad having excellent uniformity, characterized in that a pattern is formed on the silicone pad, the silicone pad according to the present invention has very excellent uniformity when pressurized by a pattern structure even if the silicone pad is large in area, and further, the silicone pad has excellent uniformity in accordance with the combination of the pattern and the weight-average molecular weight. Excellent uniformity can be obtained even when a large area (at least 50 cm or more) of pressure is applied.

Description

Technical Field

[0001] The present invention relates to a silicone resin pad for manufacturing semiconductors having a pattern structure, and more particularly, to a silicone resin pad for manufacturing semiconductors having a pattern structure capable of pressing and mounting electronic components such as semiconductor chips with excellent uniformity when pressing. Background Art

[0002] As semiconductor line widths continue to shrink, various packaging technologies are being developed. However, this packaging process requires technology to stack chips in multiple layers, which requires the use of rubber-based gaskets such as silicone.

[0003] However, as the area of ​​these silicone resin pads increases, there is a problem of reduced uniformity across the entire area during pressurization (used for mounting electronic components such as chips). Therefore, there is a need to develop new silicone resin pads that can solve these problems. Summary of the Invention Technical issues

[0004] Therefore, the technical problem to be solved by the present invention is to provide a silicone resin pad having excellent uniformity and a method for manufacturing the same. Technical Solution

[0005] In order to solve the above-mentioned technical problems, the present invention provides a silicone resin pad having excellent uniformity, characterized in that a pattern is formed on the silicone resin pad.

[0006] In one embodiment of the present invention, the pattern is a quadrilateral, and the length of the pattern is 0.20 mm to 0.21 mm.

[0007] In addition, the horizontal / vertical length ratio of the pattern is 1.00 to 1.02, and the weight average molecular weight of the silicone resin pad is 20,000 to 70,000.

[0008] Furthermore, in the present invention, the silicone resin pad is manufactured by injecting it into a mold and then curing it, and a pattern corresponding to the pattern is formed on the mold surface of the mold. Technical Effects

[0009] According to the silicone resin pad of the present invention, even a large area has very excellent uniformity when pressed due to the pattern structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 This is a pattern photo of a pad (Example) according to an embodiment of the present invention. Figure 2 These are photographs of patterns on pads (Comparative Example 1) with different shapes and numbers of patterns.

[0011] Figure 3 and Figure 4 These are the pressure test results according to Example and Comparative Example 1.

[0012] Figure 5 are respectively through 9kgf / cm 2 The force measurement results of the uniformity of the silicone resin pads of Example 1 and Comparative Examples 2, 3, and 4 are shown. Best Mode for Carrying Out the Invention

[0013] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0014] Before describing the present invention in detail, the terms and words used in this specification should not be interpreted unconditionally with the conventional or dictionary meanings. In order to describe the present invention in the best way, the inventors of the present invention may appropriately define the concepts of various terms and use them.

[0015] Furthermore, it should be understood that these terms or words should be interpreted as meanings and concepts consistent with the technical ideas of the present invention.

[0016] That is, the terms used in this specification are only used to describe the preferred embodiments of the present invention, and are not intended to specifically limit the contents of the present invention.

[0017] It should be understood that these terms are terms defined in consideration of various possibilities of the present invention.

[0018] Furthermore, in this specification, a singular expression may include a plural expression unless the context clearly indicates otherwise.

[0019] In addition, it should be understood that even if a plural number is expressed, the singular number may also be included.

[0020] Throughout this specification, when it is stated that a certain component “includes” other components, unless otherwise clearly indicated to the contrary, it may mean that any other components may also be included rather than excluding any other components.

[0021] A silicone resin pad according to one embodiment of the present invention provides a pad that can prevent over-compression in specific areas during pressurization by using a predetermined pattern. Furthermore, bubbles can be expelled to the outside, achieving excellent uniformity. In one embodiment of the present invention, the predetermined pattern can be a quadrilateral, but its shape can be freely changed using a mold as described below.

[0022] In this specification, the "pattern" has a certain degree of repetition and refers to a curved structure of intaglio-relief formed on the surface. DETAILED DESCRIPTION

[0023] Figure 1is a pattern photo of a pad according to an embodiment of the present invention (Example), Figure 2 These are photographs of patterns on pads (Comparative Example 1) with different shapes and numbers of patterns.

[0024] The following table 1 is Figure 1 and Figure 2 The sizes of the silicone mat patterns and the number of patterns per horizontal / vertical length of each unit length are sorted in a table.

[0025] [Table 1]

[0026] Referring to the above results, it can be seen that in the case of the present invention, the ratio of the horizontal direction to the vertical direction of the quadrilateral pattern is more uniform than that of Comparative Example 1, and is relatively smaller than that of Comparative Example 1.

[0027] In particular, a comparison of the present invention, where the horizontal to vertical ratio (C = A / B) is 1.01, with Comparative Example 1, where C is 0.98, reveals a significant difference in the horizontal to vertical ratio. Therefore, the horizontal to vertical ratio (C) of the pattern is preferably between 1.00 and 1.02.

[0028] Figure 3 and Figure 4 These are the pressure test results according to Example and Comparative Example 1.

[0029] Reference Figure 3 and Figure 4 It was confirmed that the silicone resin pad according to the present invention can prevent over-compression in specific areas during pressurization by using a predetermined pattern, and can expel bubbles and the like to the outside, thereby achieving excellent uniformity. In particular, when the pattern size is 0.21 mm or larger, or when there is a difference in the horizontal / vertical ratio, it is known that there may be problems with the expulsion of bubbles and the like during pressurization.

[0030] In the process of manufacturing a mat by injection molding of the pattern according to the present invention, the pattern is formed in a mold so that the mold pattern can be transferred to the mat. In this case, the mat pattern can be obtained by bonding a separate layer having the shape of the pattern to the mold itself or the mold.

[0031] The present invention further notes that the combination of these curvature radii and molecular weights has a significant impact on the pressure uniformity of large-area silicone pads.

[0032] In one embodiment of the present invention, based on the aforementioned example, liquid silicone rubber (LSR) was cured at 100°C in a 100 cm x 100 cm square with a thickness of 20 mm. As a comparative example, a commercial silicone resin, high-constency rubber (HCR; Shin-Etsu Co., Japan), was prepared using the same pattern as in Example 1.

[0033] The following Table 2 shows the molecular weight measurement results.

[0034] [Table 2]

[0035] The molecular weight measurements above are based on the GPC method, where the endpoint is the portion of the baseline close to zero or the lowest point, and the molecular weight and distribution are calculated. The results above demonstrate a significant difference in weight-average molecular weight between the Examples and Comparative Examples.

[0036] Figure 5 are 9kgf / cm 2 The force measurement results of the uniformity of the silicone resin pads of Example 1 and Comparative Examples 2, 3, and 4 are shown.

[0037] Reference Figure 5 , it can be seen that even for the same pattern, the uniformity is greatly affected by the molecular weight (especially the weight-average molecular weight).

[0038] Regarding molecular weight, when the weight average molecular weight (not number average molecular weight) is 20,000 to 70,000 (more preferably 40,000 to 60,000), uniformity may be affected when pressing a large area (minimum 50 cm or more) of the silicone pad. This is a concern.

[0039] The silicone pad according to an embodiment of the present invention is manufactured by injecting liquid silicone rubber (LSR) into a mold and then curing the mold.

[0040] To this end, the silicone resin pad according to an embodiment of the present invention is manufactured by a method including the following steps: injecting liquid silicone rubber (LSR) into a mold; and curing the injected liquid silicone rubber (LSR), at which time, a corresponding pattern for obtaining the above-mentioned pattern is formed on the surface of the mold.

[0041] As described above, the silicone resin pad according to the present invention exhibits excellent uniformity during pressurization, even over large areas, thanks to its patterned structure. Furthermore, the combination of pattern and weight-average molecular weight enables excellent uniformity even when pressurizing large areas (minimum 50 cm or more). Industrial applicability

[0042] The present invention relates to a silicone resin pad with a pattern structure for manufacturing semiconductors, and has industrial applicability.

Claims

1. A silicone resin pad having excellent uniformity, characterized in that A pattern is formed on the silicone resin pad.

2. The silicone resin pad according to claim 1, characterized in that The pattern is a quadrilateral.

3. The silicone resin pad according to claim 2, characterized in that The length of the pattern is 0.20 mm to 0.21 mm.

4. The silicone resin pad according to claim 3, characterized in that The silicone resin pad has a transverse / longitudinal length ratio of 1.00 to 1.

02.

5. The silicone resin pad according to any one of claims 1 to 4, characterized in that The silicone resin pad has a weight average molecular weight of 20,000 to 70,000.

6. A silicone resin pad, characterized in that: The silicone pad is manufactured by injecting liquid silicone rubber into a mold and then curing the mold. The silicone pad is the silicone pad according to any one of claims 1 to 4.

7. The silicone resin pad according to claim 6, characterized in that A corresponding pattern for obtaining the pattern is formed on a mold surface of the mold.

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