Preparation method of high-temperature-resistant self-back ultraviolet viscosity-reducing film

Abstract

The invention relates to the technical field of visbreaking films, and particularly provides a preparation method of a high-temperature-resistant self-back ultraviolet visbreaking film which comprises a base material layer, a high-temperature-resistant release layer located on one side of the base material layer and an ultraviolet visbreaking layer located on the other side of the base material layer. Compared with a traditional ultraviolet anti-adhesion film for wafer cutting in the market, the high-temperature-resistant self-back ultraviolet anti-adhesion film has the advantages that the tedious procedure of tearing off a surface release film is reduced; and meanwhile, the relatively high adhesive force can prevent the wafer from falling off during cutting, the characteristic that the adhesive force is remarkably reduced after ultraviolet curing can prevent adhesive layer residues, and most importantly, the cost is far lower than that of a traditional ultraviolet viscosity-reducing film on the market.

Description

Technical Field

[0001] The invention relates to the technical field of anti-viscosity films, and in particular to a method for preparing a high-temperature resistant, self-backside ultraviolet anti-viscosity film. Background Art

[0002] In recent years, with the continuous upgrading of downstream end-use electronic products (5G smartphones, tablets, laptops, etc.), the demand for protective films in processes such as wafer dicing and electronic glass processing has been growing. Traditional protective films suffer from insufficient adhesion or excessive peeling. However, UV-resistant adhesive films can dynamically adjust the adhesion from high to low by adjusting the intensity of UV light.

[0003] Currently, commercially available UV adhesive-reducing films are prepared by coating PET with a layer of UV adhesive and then applying a release film for curing. Because UV curing itself generates significant heat, the release film's release force becomes unstable after heating, leading to a tight bond with the UV adhesive. During processing, the release film may not be peeled off by the machine, or excessive force may cause deformation of the UV adhesive. Consequently, UV light must be used to reduce the adhesive before peeling, making it very cumbersome.

[0004] Based on the above situation, the present invention provides a high temperature resistant, self-back UV anti-viscosity film, which can effectively solve the above problems. Summary of the Invention

[0005] In light of this, the present invention proposes a high-temperature-resistant, self-backside UV-cured adhesive reduction film. This film features stable geometric dimensions, high tensile strength, high temperature resistance, and initial high adhesion, which significantly decreases after UV curing. Its production cost is also far lower than conventional commercially available UV-cured adhesive reduction films.

[0006] The technical solution of the present invention is achieved as follows: The present invention provides a high temperature resistant, self-back UV anti-viscosity film, comprising: substrate layer; a high temperature resistant release layer located on one side of the substrate layer; A UV anti-adhesion layer is located on the other side of the substrate layer.

[0007] In some embodiments, the high-temperature-resistant release layer is made from the following raw materials in percentage by weight: 25-35% toluene, 20-30% butanone, 10-20% ethyl acetate, 20-30% organosilicon-modified acrylic resin with a molecular weight of 14,000-16,000, and 2-3% curing agent. The organosilicon-modified acrylic resin has a silicon content of 5-8% by weight and a Tg of 45-60°C.

[0008] In some embodiments, the UV adhesion-reducing layer is made of the following raw materials in weight percentage: 80-90% trimethylolpropane triacrylate, 5-10% benzophenone, 5-10% titanium dioxide, and 0.5-1% antioxidant.

[0009] In some embodiments, the substrate layer is a PET film.

[0010] In some embodiments, the substrate layer has a thickness of 50-75 μm.

[0011] In some embodiments, the thickness of the high temperature resistant release layer is 0.1-0.2 μm.

[0012] In some embodiments, the thickness of the UV anti-viscosity layer is 10-20 μm.

[0013] The second aspect of the present invention further provides a method for preparing the above-mentioned high-temperature resistant, self-back UV-reducing film, comprising the following steps: (1) Preparation of a high-temperature resistant release layer coating liquid: 25-35% toluene, 20-30% butanone, 10-20% ethyl acetate, 20-30% silicone-modified acrylic resin with a molecular weight of 15,000, and 2-3% curing agent are mixed according to weight percentage and stirred evenly; (2) Coating and curing the release layer: coating the coating liquid obtained in step (1) on one side of the substrate layer, and curing it in an oven at 140°C for 15 seconds to form a high-temperature resistant release layer; (3) Preparation of UV viscosity-reducing coating liquid: 80-90% trimethylolpropane triacrylate, 5-10% benzophenone, 5-10% titanium dioxide, and 0.5-1% antioxidant were mixed according to weight percentage and stirred evenly; (4) Coating and photocuring of a viscosity-reducing layer: The coating solution obtained in step (3) is applied to the other side of the substrate layer and irradiated with a medium-pressure mercury lamp with a wavelength of 340-380 nm for 1-2 minutes to form a UV viscosity-reducing layer.

[0014] In some embodiments, the substrate layer is a PET film with a thickness of 50-75 μm.

[0015] In some embodiments, the irradiation time of the medium-pressure mercury lamp in step (4) is 2 minutes.

[0016] In some embodiments, after the light curing in step (4), the obtained viscosity-reducing film is further rolled up, and during the rolling up, the high-temperature resistant release layer is located on the outside.

[0017] The present invention has the following beneficial effects compared to the prior art: Compared with the traditional UV anti-viscosity film for wafer cutting on the market, the high-temperature resistant, self-backside UV anti-viscosity film of the present invention reduces the tedious process of tearing off the surface release film; at the same time, the higher adhesion can prevent the wafer from falling off during cutting, and the characteristic of significantly reduced adhesion after UV light curing can prevent the adhesive layer from remaining. The most important point is that its cost is much lower than the traditional UV anti-viscosity film on the market. DETAILED DESCRIPTION

[0018] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0019] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which embodiments of the present invention belong. If the definitions set forth in this section are contrary to or otherwise inconsistent with definitions set forth in the patents, patent applications, published patent applications, and other publications incorporated herein by reference, the definitions listed in this section take precedence over the definitions incorporated herein by reference.

[0021] Unless otherwise specified, the methods used in the following examples are conventional methods. The materials, reagents, and instruments used are conventional materials, reagents, and instruments in the art, unless otherwise specified, and can be obtained commercially by those skilled in the art.

[0022] When an amount, concentration or other value or parameter is expressed as a range, a preferred range or a range defined by a series of upper preferred values ​​and lower preferred values, this should be understood as specifically disclosing all ranges formed by any pairing of any upper range limit or preferred value with any lower range limit or preferred value, regardless of whether the range is disclosed alone. For example, when a range "1 to 5" is disclosed, the described range should be interpreted as including the ranges "1 to 4", "1 to 3", "1 to 2", "1 to 2 and 4 to 5", "1 to 3 and 5", etc. When a numerical range is described herein, unless otherwise stated, the range is intended to include its endpoints and all integers and fractions within the range. In the present specification and claims, range definitions may be combined and / or interchanged, and if not otherwise stated, such ranges include all subranges contained therein.

[0023] In the following embodiments: The silicone-modified acrylic resin has a silicon content of 5.8 wt %, a Tg of 47°C, and is Dow Syl-Off 7900.

[0024] The curing agent is polyisocyanate with a functionality of 3.1 and an NCO content of 20 wt%, Evonik Vestanat T1890.

[0025] The antioxidant is hindered phenol with a molecular weight of 531 and a hydroxyl value of 3.8, Songnox 1076.

[0026] Example 1.

[0027] A high-temperature resistant, self-back UV-resistant adhesive reduction film comprises a substrate layer, a high-temperature resistant release layer provided on one side of the substrate layer, and an UV-resistant adhesive reduction layer provided on the other side of the substrate layer; the substrate layer is a PET film, and the thickness of the substrate layer is 50 μm; the high-temperature resistant release layer is made of the following raw materials in weight percentage: 25% toluene, 30% butanone, 20% ethyl acetate, 23% silicone-modified acrylic resin with a molecular weight of approximately 15,000, and 2% curing agent; the UV-resistant adhesive reduction layer is made of the following raw materials in weight percentage: 90% trimethylolpropane triacrylate, 5% benzophenone, 4.5% titanium dioxide, and 0.5% antioxidant.

[0028] During the production, toluene, butanone, ethyl acetate, silicone-modified acrylic resin and curing agent are first mixed and stirred evenly according to the above ratio, coated on PET and placed in a 140°C oven for curing for 15 seconds to form a high-temperature resistant release layer with a dry film thickness of 0.15μm. Then, trimethylolpropane triacrylate, benzophenone, titanium dioxide and antioxidant are mixed and stirred evenly according to the above ratio, coated on the other side of the PET, and irradiated with a medium-pressure mercury lamp (340-380nm wavelength) for 1 minute to form a UV-reducing layer with a dry film thickness of 12μm. The finished product is rolled up (the release layer is on the outside).

[0029] Example 2 A high-temperature resistant, self-back UV-resistant adhesive reduction film comprises a substrate layer, a high-temperature resistant release layer provided on one side of the substrate layer, and an UV-resistant adhesive reduction layer provided on the other side of the substrate layer; the substrate layer is a PET film, and the thickness of the substrate layer is 50 μm; the high-temperature resistant release layer is made of the following raw materials in weight percentage: 30% toluene, 25% butanone, 18% ethyl acetate, 25% silicone-modified acrylic resin with a molecular weight of approximately 15,000, and 2% curing agent; the UV-resistant adhesive reduction layer is made of the following raw materials in weight percentage: 85% trimethylolpropane triacrylate, 8% benzophenone, 6% titanium dioxide, and 1% antioxidant.

[0030] During the production, toluene, butanone, ethyl acetate, silicone-modified acrylic resin and curing agent are first mixed and stirred evenly according to the above ratio, coated on PET and placed in a 140°C oven for curing for 15 seconds to form a high-temperature resistant release layer with a dry film thickness of 0.15μm. Then, trimethylolpropane triacrylate, benzophenone, titanium dioxide and antioxidant are mixed and stirred evenly according to the above ratio, coated on the other side of the PET, and irradiated with a medium-pressure mercury lamp (340-380nm wavelength) for 2 minutes to form a UV-reducing layer with a dry film thickness of 12μm. The finished product is rolled up (the release layer is on the outside).

[0031] Example 3 A high-temperature resistant, self-back UV-resistant adhesive reduction film comprises a substrate layer, a high-temperature resistant release layer is provided on one side of the substrate layer, and a UV-resistant adhesive reduction layer is provided on the other side of the substrate layer; the substrate layer is a PET film, and the thickness of the substrate layer is 50 μm; the high-temperature resistant release layer is made of the following raw materials in weight percentage: 35% toluene, 20% butanone, 10% ethyl acetate, 33% silicone-modified acrylic resin with a molecular weight of approximately 15,000, and 2% curing agent; the UV-resistant adhesive reduction layer is made of the following raw materials in weight percentage: 80% trimethylolpropane triacrylate, 10% benzophenone, 9% titanium dioxide, and 1% antioxidant.

[0032] During the production, toluene, butanone, ethyl acetate, silicone-modified acrylic resin and curing agent are first mixed and stirred evenly according to the above ratio, coated on PET and placed in a 140°C oven for curing for 15 seconds to form a high-temperature resistant release layer with a dry film thickness of 0.15μm. Then, trimethylolpropane triacrylate, benzophenone, titanium dioxide and antioxidant are mixed and stirred evenly according to the above ratio, coated on the other side of the PET, and irradiated with a medium-pressure mercury lamp (340-380nm wavelength) for 2 minutes to form a UV-reducing layer with a dry film thickness of 12μm. The finished product is rolled up (the release layer is on the outside).

[0033] Example 4 A high-temperature resistant, self-back UV-resistant adhesive reduction film comprises a substrate layer, a high-temperature resistant release layer is provided on one side of the substrate layer, and a UV-resistant adhesive reduction layer is provided on the other side of the substrate layer; the substrate layer is a PET film, and the thickness of the substrate layer is 50 μm; the high-temperature resistant release layer is made of the following raw materials in weight percentage: 28% toluene, 28% butanone, 15% ethyl acetate, 27% silicone-modified acrylic resin with a molecular weight of approximately 15,000, and 2% curing agent; the UV-resistant adhesive reduction layer is made of the following raw materials in weight percentage: 88% trimethylolpropane triacrylate, 6% benzophenone, 5% titanium dioxide, and 1% antioxidant.

[0034] During the production, toluene, butanone, ethyl acetate, silicone-modified acrylic resin and curing agent are first mixed and stirred evenly according to the above ratio, coated on PET and placed in a 140°C oven for curing for 15 seconds to form a high-temperature resistant release layer with a dry film thickness of 0.15μm. Then, trimethylolpropane triacrylate, benzophenone, titanium dioxide and antioxidant are mixed and stirred evenly according to the above ratio, coated on the other side of the PET, and irradiated with a medium-pressure mercury lamp (340-380nm wavelength) for 2 minutes to form a UV-reducing layer with a dry film thickness of 12μm. The finished product is rolled up (the release layer is on the outside).

[0035] Example 5 A high-temperature resistant, self-back UV-resistant adhesive reduction film comprises a substrate layer, a high-temperature resistant release layer is provided on one side of the substrate layer, and a UV-resistant adhesive reduction layer is provided on the other side of the substrate layer; the substrate layer is a PET film, and the thickness of the substrate layer is 50 μm; the high-temperature resistant release layer is made of the following raw materials in weight percentage: 33% toluene, 22% butanone, 18% ethyl acetate, 25% silicone-modified acrylic resin with a molecular weight of approximately 15,000, and 2% curing agent; the UV-resistant adhesive reduction layer is made of the following raw materials in weight percentage: 82% trimethylolpropane triacrylate, 10% benzophenone, 7% titanium dioxide, and 1% antioxidant.

[0036] During the production, toluene, butanone, ethyl acetate, silicone-modified acrylic resin and curing agent are first mixed and stirred evenly according to the above ratio, coated on PET and placed in a 140°C oven for curing for 15 seconds to form a high-temperature resistant release layer with a dry film thickness of 0.15μm. Then, trimethylolpropane triacrylate, benzophenone, titanium dioxide and antioxidant are mixed and stirred evenly according to the above ratio, coated on the other side of the PET, and irradiated with a medium-pressure mercury lamp (340-380nm wavelength) for 1.5 minutes to form a UV-reducing layer with a dry film thickness of 12μm. The finished product is rolled up (the release layer is on the outside).

[0037] Comparative Example 1 Commercially available Nitto UV anti-viscosity film was used.

[0038] Comparative Example 2 This comparative example is based on Example 1, except that: Release layer materials: Toluene 25%, butanone 30%, ethyl acetate 20%, Shin-Etsu KR-5102 silicone-modified acrylic resin 23% (silicon content 3.0wt%, Tg=45℃, Mw=14000) Evonik Vestanat T1890 curing agent 2% (functionality 3.1, NCO content 20.1wt%); Other Conditions Bucket Example 1.

[0039] The viscosity-reducing films prepared in the above examples and comparative examples were subjected to corresponding performance tests, including: Long-term thermal stability test: Release force change rate after being placed at 155°C for 48 hours; Humidity and heat aging test: peel strength retention after 168h storage in 85℃ / 85%RH environment; Actual cutting test: wafer cutting yield comparison.

[0040] The results are shown in the following table:

[0041] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A high temperature resistant, backside UV-reducing film, characterized in that: include: substrate layer; a high temperature resistant release layer located on one side of the substrate layer; A UV anti-adhesion layer is located on the other side of the substrate layer.

2. The high temperature resistant, self-back UV anti-viscosity film according to claim 1, characterized in that: The high-temperature resistant release layer is made of the following raw materials in percentage by weight: 25-35% toluene, 20-30% butanone, 10-20% ethyl acetate, 20-30% organosilicon-modified acrylic resin with a molecular weight of 15,000, and 2-3% curing agent.

3. The high temperature resistant, self-back UV anti-viscosity film according to claim 1, characterized in that: The ultraviolet viscosity-reducing layer is made of the following raw materials in percentage by weight: 80-90% of trimethylolpropane triacrylate, 5-10% of benzophenone, 5-10% of titanium dioxide, and 0.5-1% of antioxidant.

4. The high temperature resistant, self-back UV anti-viscosity film according to claim 1, characterized in that: The substrate layer is a PET film.

5. The high temperature resistant, self-back UV anti-viscosity film according to claim 1, characterized in that: The thickness of the substrate layer is 50-75 μm.

6. The high temperature resistant, self-back UV anti-viscosity film according to claim 1, characterized in that: The thickness of the high temperature resistant release layer is 0.1-0.2 μm.

7. The high temperature resistant, self-back UV anti-viscosity film according to claim 1, characterized in that: The thickness of the ultraviolet anti-viscosity layer is 10-20 μm.

8. A method for preparing a high temperature resistant, backside UV-reducing film according to any one of claims 1 to 7, characterized in that: The following steps are involved: (1) Preparing a high-temperature resistant release layer coating liquid: 25-35% toluene, 20-30% butanone, 10-20% ethyl acetate, 20-30% silicone-modified acrylic resin with a molecular weight of 15,000, and 2-3% curing agent are mixed according to weight percentage and stirred evenly; (2) Coating and curing the release layer: coating the coating solution obtained in step (1) on one side of the substrate layer, and curing it in an oven at 140° C. for 15 seconds to form a high-temperature resistant release layer; (3) preparing a UV viscosity-reducing coating liquid: mixing 80-90% of trimethylolpropane triacrylate, 5-10% of benzophenone, 5-10% of titanium dioxide, and 0.5-1% of an antioxidant according to weight percentage and stirring uniformly; (4) Coating and photocuring of a viscosity-reducing layer: The coating solution obtained in step (3) is applied to the other side of the substrate layer and irradiated with a medium-pressure mercury lamp with a wavelength of 340-380 nm for 1-2 minutes to form a UV viscosity-reducing layer.

9. The preparation method according to claim 8, wherein The substrate layer is a PET film with a thickness of 50-75 μm.

10. The preparation method according to claim 8, characterized in that The irradiation time of the medium-pressure mercury lamp in step (4) is 2 minutes.

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