MiniLED display module encapsulation film, its preparation method and application

Abstract

This invention discloses an adhesive film for encapsulating MiniLED display modules, its preparation method, and its application, belonging to the field of MiniLED display module encapsulation technology. It includes a first adhesive film and a second adhesive film, both thermally bonded. The first adhesive film comprises a first release film, a curing layer, and a quantum dot black layer, stacked sequentially. The second adhesive film comprises a second release film and a diffusion layer. The diffusion layer contains multi-walled carbon nanotubes and surface-modified silica. The multi-walled carbon nanotubes are carboxylated and dispersed at a concentration of 0.1-1.0 wt%. The surface-modified silica is grafted with epoxy groups, has a particle size of 20-100 nm, and the mass ratio of surface-modified silica to multi-walled carbon nanotubes is 1:0.5-2. This invention significantly improves the longitudinal thermal conductivity compared to traditional adhesive films, addressing the problem of thermal failure in MiniLEDs. The multi-walled carbon nanotubes and carbon black in the quantum dot black layer construct an electromagnetic shielding network, ensuring high luminous efficiency, wide color gamut, and high static contrast of the quantum dots under thermal bonding.

Description

Technical Field

[0001] This invention relates to the field of MiniLED display module packaging technology, specifically to the adhesive film used for MiniLED display module packaging, its preparation method, and its application. Background Technology

[0002] LED packaging technology is a systematic engineering process that integrates LED chips into a protective casing using precision manufacturing techniques, achieving electrical connections, optical control, and heat dissipation management. Its core objective is to transform fragile semiconductor chips into reliable light sources suitable for industrial applications. The packaging process and the quality of the encapsulating adhesive directly affect the brightness, lifespan, light quality, and cost of the LED. With the continuous development of LED technology, MiniLED encapsulating films are the invisible engine driving the evolution of display technology, balancing the extreme performance of light, heat, force, and electricity at the micrometer scale, directly determining the image quality and lifespan of the final product.

[0003] The existing publication CN116435443A provides a method for manufacturing an adhesive film used in the substrate encapsulation of MiniLED display modules, which uses carbon black to enhance blackness, but does not solve the thermal management problem; the existing publication CN218372148U provides a multilayer laminated optical tape for direct display encapsulation of MiniLED and MicroLED, which uses a quantum dot layer, but the high-temperature process causes color deviation and also causes the LED junction temperature to rise and lifespan to decrease.

[0004] Therefore, how to provide encapsulating films for MiniLED display modules, their preparation methods and applications, and improve the performance of encapsulating films are technical problems that urgently need to be solved by those skilled in the art. Summary of the Invention

[0005] Therefore, the present invention provides an encapsulating film for MiniLED display modules, its preparation method and application, in order to solve the related technical problems existing in the prior art.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] According to a first aspect of the present invention, an adhesive film for encapsulating a MiniLED display module is provided, comprising a first adhesive film and a second adhesive film thermally bonded together. The first adhesive film comprises a first release film, a curing layer, and a quantum dot black layer stacked sequentially. The second adhesive film comprises a second release film and a diffusion layer, wherein the diffusion layer comprises multi-walled carbon nanotubes and surface-modified silica. The multi-walled carbon nanotubes are carboxylated and have a dispersion concentration of 0.1-1.0 wt%. The surface-modified silica is grafted with epoxy groups and has a particle size of 20-100 nm. The mass ratio of the surface-modified silica to the multi-walled carbon nanotubes is 1:0.5-2.

[0008] Furthermore, the diffusion layer further includes hollow glass microspheres with a dispersion concentration of 3-5 wt%, the hollow glass microspheres having a diameter of 1-10 μm, and forming a core-shell structure with the surface-modified silica to coat the multi-walled carbon nanotubes.

[0009] Furthermore, the cured layer comprises surface-modified silica nanoparticles with a particle size of 20-50 nm and an addition amount of 3-8 wt%.

[0010] Furthermore, the quantum dot black layer comprises multi-walled carbon nanotubes, carbon black, and quantum dots, and the amounts of multi-walled carbon nanotubes, carbon black, and quantum dots added are 0.5-1.5wt%, 0.5-2.0wt%, and 0.3-1.2wt%, respectively.

[0011] Furthermore, the thickness of the cured layer is 5-25 μm, the thickness of the quantum dot black layer is 10-100 μm, and the thickness of the diffusion layer is 30-180 μm.

[0012] Furthermore, the carboxylation treatment of multi-walled carbon nanotubes follows these steps:

[0013] The multi-walled carbon nanotubes were placed in a mixed acid solution at a solid-liquid ratio of 1g:50mL, wherein the mixed acid solution was a mixture of concentrated sulfuric acid and concentrated nitric acid in a volume ratio of 3:1.

[0014] Disperse ultrasonically at 0-5℃ for 10-20 min, then heat to 40-42℃ and continue ultrasonic treatment for 4-6 h.

[0015] After centrifugation, the mixture was dialyzed until the conductivity was ≤5μS / cm, then freeze-dried and heat-treated at 150℃ for 1h under nitrogen protection to enhance the reactivity of the carboxyl groups.

[0016] Furthermore, the step of grafting epoxy groups onto the surface-modified silica is as follows:

[0017] Silica nanoparticles were calcined at 550℃ for 4 hours.

[0018] Dissolve KH-560 silane coupling agent in 90% ethanol solution and hydrolyze for 30 min at pH 4.5-5.0;

[0019] The calcined silica nanoparticles were mixed with hydrolyzed KH-560 at a mass ratio of 1:0.3 and reacted at 75°C under nitrogen protection for 6 hours.

[0020] Vacuum drying at 60℃ for 12 hours and heat treatment at 120℃ for 1 hour enhances the reactivity of epoxy groups.

[0021] According to a second aspect of the present invention, a method for preparing an encapsulating film for a MiniLED display module is provided, comprising the steps of:

[0022] A diffusion layer adhesive is applied to the second release film and pre-cured at 80-120℃ to form a semi-crosslinked diffusion layer.

[0023] A curing layer adhesive is applied to the first release film and cured by ultraviolet light to form a curing layer. A quantum dot black layer adhesive is applied to the curing layer and cured by baking to form a quantum dot black layer.

[0024] The quantum dot black layer of the first adhesive film and the diffusion layer of the second adhesive film are thermally bonded together at 80-150℃.

[0025] Furthermore, the pre-cured crosslinking degree of the diffusion layer is 40-60%, and the final curing is completed at 120-160℃ for 60-120 minutes.

[0026] According to a third aspect of the present invention, the application of an adhesive film for MiniLED display module encapsulation in MiniLED display module encapsulation is provided.

[0027] The present invention has the following advantages:

[0028] Carboxylated multi-walled carbon nanotubes and epoxy-modified silica form a chemically bonded thermally conductive chain, significantly improving the longitudinal thermal conductivity compared to traditional films. The core-shell encapsulation structure of hollow glass microspheres reduces the coefficient of thermal expansion, resulting in a thermal delamination rate of less than 3% after aging tests, thus improving the problem of MiniLED thermal failure. In the quantum dot black layer, multi-walled carbon nanotubes and carbon black construct an electromagnetic shielding network, ensuring high luminous efficiency of quantum dots under hot pressing. Combined with the precise light scattering of modified silica, it offers a wide color gamut coverage and high static contrast. The 40-60% pre-cured diffusion layer design achieves thermal self-leveling, and a single hot pressing replaces the traditional pressing process, reducing energy consumption and improving interfacial peel strength. Detailed Implementation

[0029] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] To address the technical problems existing in the prior art, according to a first aspect of the present invention, an adhesive film for encapsulating a MiniLED display module is provided, comprising a first adhesive film and a second adhesive film thermally bonded together. The first adhesive film comprises a first release film, a curing layer, and a quantum dot black layer stacked sequentially. The second adhesive film comprises a second release film and a diffusion layer, wherein the diffusion layer comprises multi-walled carbon nanotubes and surface-modified silica. The multi-walled carbon nanotubes are carboxylated and have a dispersion concentration of 0.1-1.0 wt%. The surface-modified silica is grafted with epoxy groups, has a particle size of 20-100 nm, and the mass ratio of surface-modified silica to multi-walled carbon nanotubes is 1:0.5-2.

[0031] Furthermore, the diffusion layer also includes hollow glass microspheres with a dispersion concentration of 3-5 wt%, the hollow glass microspheres having a diameter of 1-10 μm, and forming a core-shell structure with surface-modified silica to coat multi-walled carbon nanotubes.

[0032] Furthermore, the cured layer contains surface-modified silica nanoparticles with a particle size of 20-50 nm and an addition amount of 3-8 wt%.

[0033] Furthermore, the quantum dot black layer comprises multi-walled carbon nanotubes, carbon black, and quantum dots, with the amounts of multi-walled carbon nanotubes, carbon black, and quantum dots being 0.5-1.5 wt%, 0.5-2.0 wt%, and 0.3-1.2 wt%, respectively.

[0034] Furthermore, the thickness of the curing layer is 5-25 μm, the thickness of the quantum dot black layer is 10-100 μm, and the thickness of the diffusion layer is 30-180 μm.

[0035] Furthermore, the carboxylation treatment of multi-walled carbon nanotubes follows these steps:

[0036] Multi-walled carbon nanotubes were placed in a mixed acid solution at a solid-liquid ratio of 1g:50mL. The mixed acid solution was a mixture of concentrated sulfuric acid and concentrated nitric acid in a volume ratio of 3:1.

[0037] Disperse ultrasonically at 0-5℃ for 10-20 min, then heat to 40-42℃ and continue ultrasonic treatment for 4-6 h.

[0038] After centrifugation, the mixture was dialyzed until the conductivity was ≤5μS / cm, then freeze-dried and heat-treated at 150℃ for 1h under nitrogen protection to enhance the reactivity of the carboxyl groups.

[0039] Furthermore, the steps for surface-modified silica grafted with epoxy groups are as follows:

[0040] Silica nanoparticles were calcined at 550℃ for 4 hours.

[0041] Dissolve KH-560 silane coupling agent in 90% ethanol solution and hydrolyze for 30 min at pH 4.5-5.0;

[0042] The calcined silica nanoparticles were mixed with hydrolyzed KH-560 at a mass ratio of 1:0.3 and reacted at 75°C under nitrogen protection for 6 hours.

[0043] Vacuum drying at 60℃ for 12 hours and heat treatment at 120℃ for 1 hour enhances the reactivity of epoxy groups.

[0044] According to a second aspect of the present invention, a method for preparing an encapsulating film for a MiniLED display module is provided, comprising the steps of:

[0045] A diffusion layer adhesive is applied to the second release film and pre-cured at 80-120℃ to form a semi-crosslinked diffusion layer.

[0046] A curing layer adhesive is applied to the first release film and cured by ultraviolet light to form a curing layer. A quantum dot black layer adhesive is applied to the curing layer and cured by baking to form a quantum dot black layer.

[0047] The quantum dot black layer of the first adhesive film and the diffusion layer of the second adhesive film are thermally laminated at 80-150℃.

[0048] Furthermore, the pre-cured crosslinking degree of the diffusion layer is 40-60%, and the final curing is completed at 120-160℃ for 60-120 minutes.

[0049] According to a third aspect of the present invention, the application of an adhesive film for MiniLED display module encapsulation in MiniLED display module encapsulation is provided.

[0050] To better illustrate the technical effects of this application, several embodiments and comparative examples are provided below.

[0051] Preparation Example 1

[0052] Carboxylated multi-walled carbon nanotubes form chemically bonded thermally conductive chains with epoxy-modified silica, improving the longitudinal thermal conductivity of the film. Therefore, carboxylation of multi-walled carbon nanotubes is a crucial step. The carboxylation process for multi-walled carbon nanotubes is as follows:

[0053] Prepare concentrated sulfuric acid and concentrated nitric acid, and mix them at a volume ratio of 3:1 at low temperature. Stir and mix thoroughly before use.

[0054] Select multi-walled carbon nanotubes with a diameter of about 20 nm, weigh 10 g of multi-walled carbon nanotubes and add them to 500 mL of mixed acid. Control the ice bath temperature at 5 °C, the ultrasonic power at 400 W, and the ultrasonic time at 15 min to obtain the primary treatment solution.

[0055] The above primary treatment solution was heated to 40℃ and sonicated for 5 hours under the same conditions. The precipitate was separated by centrifugation and then dialyzed until the conductivity was 4.8 μS / cm to obtain the secondary treatment solution.

[0056] The above secondary treatment solution was freeze-dried at -25℃ and then heat-treated at 150℃ for 1 hour. Nitrogen activation was then performed to obtain carboxylated multi-walled carbon nanotubes, which enhanced the carboxyl reactivity and were ready for use.

[0057] Preparation Example 2

[0058] The steps for surface-modified silica grafted with epoxy groups are as follows:

[0059] Select silica with a particle size of about 50nm and calcine it at 550℃ for 4 hours.

[0060] Dissolve KH-560 silane coupling agent in 90% ethanol solution and hydrolyze at pH 4.8 for 30 min;

[0061] The calcined silica nanoparticles were mixed with hydrolyzed KH-560 at a mass ratio of 1:0.3 and reacted at 75°C under nitrogen protection for 6 hours.

[0062] Vacuum drying at 60℃ for 12 hours and heat treatment at 120℃ for 1 hour enhances the reactivity of epoxy groups, resulting in surface-modified silica.

[0063] Example 1

[0064] A method for preparing the encapsulating film for MiniLED display modules, including the following steps:

[0065] Prepare the first release film, which is made of PET. Coat the first release film with an adhesive containing 5 wt% surface-modified silica, and cure it with ultraviolet light to form a cured layer with a thickness of 18 μm.

[0066] An adhesive containing 1.0 wt% multi-walled carbon nanotubes, 1.5 wt% carbon black and 0.8 wt% CdSe / ZnS quantum dots was coated on the surface of the above-mentioned cured layer. After curing at 120°C, a 50 μm thick black quantum dot layer was formed.

[0067] Prepare a second release film made of PET. Coat the second release film with an adhesive layer containing 0.3 wt% carboxylated multi-walled carbon nanotubes, 0.6 wt% surface-modified silica and 4 wt% hollow glass microspheres. Pre-cur at 100°C to 50% crosslinking to form a diffusion layer with a thickness of 60 μm.

[0068] The first and second adhesive films formed above are thermally laminated, specifically, the quantum dot black layer and the diffusion layer are rolled and laminated at 120°C.

[0069] Example 2

[0070] A method for preparing the encapsulating film for MiniLED display modules, including the following steps:

[0071] Prepare the first release film, which is made of PET. Coat the first release film with an adhesive containing 5 wt% surface-modified silica, and cure it with ultraviolet light to form a cured layer with a thickness of 18 μm.

[0072] An adhesive containing 1.5 wt% multi-walled carbon nanotubes, 0.5 wt% carbon black and 0.3 wt% CdSe / ZnS quantum dots was coated on the surface of the above-mentioned cured layer. After curing at 120°C, a 50 μm thick black quantum dot layer was formed.

[0073] Prepare a second release film made of PET. Coat the second release film with an adhesive layer containing 1 wt% carboxylated multi-walled carbon nanotubes, 2 wt% surface-modified silica and 4 wt% hollow glass microspheres. Pre-cur at 100°C to 50% crosslinking to form a diffusion layer with a thickness of 60 μm.

[0074] The first and second adhesive films formed above are thermally laminated, specifically, the quantum dot black layer and the diffusion layer are rolled and laminated at 150°C.

[0075] Example 3

[0076] A method for preparing the encapsulating film for MiniLED display modules, including the following steps:

[0077] Prepare the first release film, which is made of PET. Coat the first release film with an adhesive containing 8wt% surface-modified silica, and cure it with ultraviolet light to form a cured layer with a thickness of 5μm.

[0078] An adhesive containing 1.0 wt% multi-walled carbon nanotubes, 1.5 wt% carbon black and 1.2 wt% CdSe / ZnS quantum dots was coated on the surface of the above-mentioned cured layer. After curing at 120°C, a 10 μm thick black quantum dot layer was formed.

[0079] Prepare a second release film made of PET. Coat the second release film with an adhesive layer containing 0.3 wt% carboxylated multi-walled carbon nanotubes, 0.6 wt% surface-modified silica and 4 wt% hollow glass microspheres. Pre-cur at 100°C to 60% crosslinking to form a diffusion layer with a thickness of 30 μm.

[0080] The first and second adhesive films formed above are thermally laminated, specifically, the quantum dot black layer and the diffusion layer are rolled and laminated at 120°C.

[0081] Example 4

[0082] A method for preparing the encapsulating film for MiniLED display modules, including the following steps:

[0083] Prepare the first release film, which is made of PET. Coat the first release film with an adhesive containing 5 wt% surface-modified silica, and cure it with ultraviolet light to form a cured layer with a thickness of 18 μm.

[0084] An adhesive containing 0.5 wt% multi-walled carbon nanotubes, 2.0 wt% carbon black and 1.2 wt% CdSe / ZnS quantum dots was coated on the surface of the above-mentioned cured layer. After curing at 120°C, a 50 μm thick black quantum dot layer was formed.

[0085] Prepare a second release film made of PET. Coat the second release film with an adhesive layer containing 0.3 wt% carboxylated multi-walled carbon nanotubes, 0.6 wt% surface-modified silica and 5 wt% hollow glass microspheres. Pre-cur at 80°C to 40% crosslinking degree to form a diffusion layer with a thickness of 60 μm.

[0086] The first and second adhesive films formed above are thermally laminated, specifically, the quantum dot black layer and the diffusion layer are rolled and laminated at 120°C.

[0087] Comparative Example 1

[0088] A method for preparing the encapsulating film for MiniLED display modules, including the following steps:

[0089] Prepare the first release film, which is made of PET. Coat the first release film with an adhesive containing 5 wt% surface-modified silica, and cure it with ultraviolet light to form a cured layer with a thickness of 18 μm.

[0090] An adhesive containing 2 wt% carbon black and 0.8 wt% CdSe / ZnS quantum dots is coated on the surface of the above-mentioned cured layer. After curing at 120°C, a 50 μm thick black quantum dot layer is formed.

[0091] Prepare a second release film made of PET. Coat the second release film with an adhesive layer containing 4 wt% hollow glass microspheres and pre-cur it at 100℃ to 50% crosslinking degree to form a diffusion layer with a thickness of 60 μm.

[0092] The first and second adhesive films formed above are thermally laminated, specifically, the quantum dot black layer and the diffusion layer are rolled and laminated at 120°C.

[0093] Comparative Example 2

[0094] A method for preparing the encapsulating film for MiniLED display modules, including the following steps:

[0095] Prepare the first release film, which is made of PET. Coat the first release film with an adhesive containing 5 wt% surface-modified silica, and cure it with ultraviolet light to form a cured layer with a thickness of 18 μm.

[0096] An adhesive containing 1.5 wt% carbon black and 0.8 wt% CdSe / ZnS quantum dots is coated on the surface of the above-mentioned cured layer. After curing at 120°C, a 50 μm thick black quantum dot layer is formed.

[0097] Prepare a second release film made of PET. Coat the second release film with an adhesive layer containing 0.3 wt% carboxylated multi-walled carbon nanotubes and 0.6 wt% surface-modified silica. Pre-cur the adhesive layer at 100°C to 50% crosslinking degree to form a diffusion layer with a thickness of 60 μm.

[0098] The first and second adhesive films formed above are thermally laminated, specifically, the quantum dot black layer and the diffusion layer are rolled and laminated at 120°C.

[0099] Comparative Example 3

[0100] A method for preparing the encapsulating film for MiniLED display modules, including the following steps:

[0101] Prepare the first release film, which is made of PET. Coat the first release film with an adhesive containing 5 wt% surface-modified silica, and cure it with ultraviolet light to form a cured layer with a thickness of 18 μm.

[0102] An adhesive containing 1.0 wt% multi-walled carbon nanotubes, 1.5 wt% carbon black and 0.8 wt% CdSe / ZnS quantum dots was coated on the surface of the above-mentioned cured layer. After curing at 120°C, a 50 μm thick black quantum dot layer was formed.

[0103] Prepare a second release film made of PET. Coat the second release film with an adhesive layer containing 0.3 wt% carboxylated multi-walled carbon nanotubes, 0.6 wt% surface-modified silica and 4 wt% hollow glass microspheres. Pre-cur at 120°C to 30% crosslinking to form a diffusion layer with a thickness of 60 μm.

[0104] The first and second adhesive films formed above are thermally laminated, specifically, the quantum dot black layer and the diffusion layer are rolled and laminated at 120°C.

[0105] Test case

[0106] The films prepared in Examples 1-4 and Comparative Examples 1-3 were subjected to performance tests. Specifically, the thermal conductivity was tested according to standard JESD51-14, the thermal delamination rate was tested according to standard IPC-TM-650 2.4.9, the quantum dot efficiency retention rate was tested according to standard IEC 62938, the color gamut was tested according to standard ANSI / IES LM-80, and the peel strength was tested according to standard ASTM D903. The test results are as follows:

[0107]

[0108] In summary, in Examples 1-4 of the MiniLED encapsulation film of this invention, the longitudinal thermal conductivity of 1.31-1.70 W / mK is achieved through the synergistic effect of the multi-walled carbon nanotube-silica thermal conductive chain and the core-shell structure of hollow glass microspheres, which is 5-7 times higher than that of traditional films. After aging at 85°C for 500 hours, the thermal delamination rate is only 2.0-3.6%, while that of Comparative Example 1 reaches 32%. In the quantum dot black layer, the multi-walled carbon nanotubes and carbon black construct an electromagnetic shielding network, and the quantum dot efficiency retention rate is 96.1-97.9%, with a color gamut coverage of 105-114% of NTSC, while that of Comparative Example 1 is only 76%. In terms of process, the 40-60% pre-curing design of the diffusion layer enables the interfacial peel strength to reach 7.2-8.2 N / cm, while that of Comparative Example 1 is 3.0 N / cm, and the energy consumption of a single hot-pressing is reduced by 30%.

[0109] Although the present invention has been described in detail above with general descriptions and specific embodiments, modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, all such modifications or improvements made without departing from the spirit of the present invention fall within the scope of protection claimed by the present invention.

Claims

1. An adhesive film for encapsulating a MiniLED display module, comprising a first adhesive film and a second adhesive film which are thermally compounded, characterized in that: the first adhesive film comprises a first release film, a curing layer and a quantum dot black layer which are sequentially stacked; the second adhesive film comprises a second release film and a diffusion layer, wherein the diffusion layer comprises multi-walled carbon nanotubes and surface-modified silica; the multi-walled carbon nanotubes are carboxylated, and the dispersion concentration is 0.1-1.0wt%; the surface-modified silica is grafted with epoxy groups, the particle size is 20-100nm, and the mass ratio of the surface-modified silica to the multi-walled carbon nanotubes is 1:0.5-2; wherein the diffusion layer further comprises hollow glass microspheres with a dispersion concentration of 3-5wt%, the hollow glass microspheres have a diameter of 1-10μm, and form a core-shell structure with the surface-modified silica to coat the multi-walled carbon nanotubes.

2. The adhesive film for encapsulating a MiniLED display module according to claim 1, characterized in that: the curing layer comprises surface-modified silica nanoparticles with a particle size of 20-50nm and an addition amount of 3-8wt%.

3. The adhesive film for encapsulating a MiniLED display module according to claim 1, characterized in that: the quantum dot black layer comprises multi-walled carbon nanotubes, carbon black and quantum dots, and the addition amounts of the multi-walled carbon nanotubes, carbon black and quantum dots are 0.5-1.5wt%, 0.5-2.0wt% and 0.3-1.2wt%, respectively.

4. The adhesive film for encapsulating a MiniLED display module according to claim 1, characterized in that: the thickness of the curing layer is 5-25μm, the thickness of the quantum dot black layer is 10-100μm, and the thickness of the diffusion layer is 30-180μm. The carboxylation treatment of the multi-walled carbon nanotubes is as follows: The multi-walled carbon nanotubes are placed in a mixed acid solution with a solid-liquid ratio of 1g:50mL, and the mixed acid solution is a mixture of concentrated sulfuric acid and concentrated nitric acid with a volume ratio of 3:1; Ultrasonic dispersion is performed at 0-5℃ for 10-20min, and then the temperature is raised to 40-42℃ for continuous ultrasonic treatment for 4-6h; wherein After centrifugal separation, dialysis is performed until the conductivity is ≤5μS / cm, and then freeze-drying is performed, followed by heat treatment at 150℃ for 1h under nitrogen protection to enhance the carboxyl reaction activity. The steps for grafting epoxy groups on the surface-modified silica are as follows: wherein Silica nanoparticles are calcined at 550℃ for 4h; KH-560 silane coupling agent is dissolved in a 90% ethanol solution, and hydrolysis is performed at pH 4.5-5.0 for 30min; wherein, The calcined silica nanoparticles are mixed with the hydrolyzed KH-560 at a mass ratio of 1:0.3, and reaction is performed at 75℃ under nitrogen protection for 6h; 5.The adhesive film for encapsulating a Mini LED display module according to claim 1, wherein: Vacuum drying is performed at 60℃ for 12h, and then heat treatment is performed at 120℃ for 1h to enhance the epoxy reaction activity. The steps include: A diffusion layer adhesive solution is coated on the second release film, and pre-curing is performed at 80-120℃ to form a semi-crosslinked diffusion layer; A curing layer adhesive is coated on the first release film, and a curing layer is formed after ultraviolet curing, and a quantum dot black layer adhesive is coated on the curing layer, and a quantum dot black layer is formed after baking and curing; 6.The adhesive film for encapsulating a Mini LED display module according to claim 1, wherein: ​ ​ ​ ​ ​ 7. The preparation method of the adhesive film for Mini LED display module packaging according to claim 1, characterized in that: ​ ​ ​ The quantum dot black layer of the first adhesive film and the diffusion layer of the second adhesive film are hot compounded at 80-150 DEG C.

8. The production method according to claim 7, characterized by: Wherein, The pre-cured crosslinking degree of the diffusion layer is 40-60%, and the final curing is completed at 120-160 DEG C for 60-120 min.

9. Application of the adhesive film for MiniLED display module packaging according to any one of claims 1-6 in MiniLED display module packaging.

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