A high-precision circuit board substrate dividing apparatus and a method of using the same

Abstract

The application relates to the technical field of integrated circuit manufacturing, and discloses a high-precision circuit board substrate dividing device and a use method thereof, which comprises a carrier, the side of which is provided with containing grooves for containing circuit board panels; a linear reciprocating member which moves linearly reciprocatingly on the side of the containing grooves of the carrier; a flexible pressing body which moves along with the linear reciprocating member and applies pressure to the circuit board panels; a plurality of horizontal turnover frames which are hinged in the containing grooves and correspond to vertical rows of circuit board panels respectively; and a plurality of vertical turnover frames which are hinged in the containing grooves and located on the inner sides of the horizontal turnover frames and correspond to the circuit board panels. The application can divide the array circuit board panels with multiple rows and multiple columns by gradually turning over the circuit board panels through the horizontal turnover frames and the vertical turnover frames. The flexible pressing body can adaptively deform in cooperation with the turnover frames, support the broken circuit board panels, improve the stability in the breaking process, and promote the resetting of the circuit board panels after being broken.

Description

Technical Field

[0001] This invention relates to the field of integrated circuit manufacturing technology, specifically to a high-precision dicing device for circuit board substrates and its usage method. Background Technology

[0002] Printed circuit boards (PCBs), also known as integrated circuit boards, are indispensable components in various electronic devices. They connect and support electronic components, enabling electrical connections between them. Most PCBs are relatively small, typically produced by mass-producing PCB substrate panels, which are then divided into smaller PCBs.

[0003] Circuit board panelization has many advantages: it can significantly improve the utilization rate of raw materials and reduce production costs; it can improve production efficiency, as multiple circuit boards can be processed in the same step after panelization, which is especially suitable for mass production scenarios; it helps to ensure product consistency, as the stress and processing conditions of each circuit board in the panelized state are more uniform during processes such as electroplating and etching, reducing quality fluctuations caused by process differences of individual circuit boards; it can also simplify subsequent processing procedures, reduce losses in transportation and turnover, and optimize the production cycle. Therefore, it is widely used in the field of integrated circuit manufacturing to achieve efficient and low-cost large-scale production.

[0004] Before dividing the circuit board panel into multiple circuit boards, stamp holes are usually made on the edge of each circuit board or V-cuts are made to form a V-cut. Then, each circuit board is separated from the circuit board panel along the stamp holes or V-cuts.

[0005] The process of manufacturing circuit boards involves first creating V-grooves or designing stamp holes before cutting, rather than directly cutting them. This is mainly due to the following key reasons: controlling mechanical stress to prevent damage to the traces. Directly cutting the circuit board will cause mechanical stress to concentrate on the dividing line, which may damage the circuit board, especially for thin boards or large boards. Direct cutting may lead to warping or structural instability. Direct cutting makes it difficult to guarantee the flatness of the edges, while slotting or stamp holes can significantly optimize the cutting effect and reduce burrs on the cut edges. Direct cutting may produce metal or substrate debris.

[0006] V-Cut facilitates subsequent segmentation operations. It involves using a tool to cut dividing lines at specific locations on the PCB. These cut lines resemble the shape of the English letter "V," hence the name V-Cut. V-Cut is widely used in mass production of PCBs, allowing for easy assembly and soldering of the separated small panels.

[0007] Circuit board segmentation methods mainly include: manual segmentation, sliding cutter cutting, guillotine cutting, milling cutter cutting, and laser cutting. Milling cutter cutting and laser cutting offer flexible cutting trajectories but are costly. Sliding cutter cutting and guillotine cutting have simple structures but can only cut in straight lines, requiring high precision in positioning; deviation from the predetermined trajectory will result in scrapped boards. V-Cut panels can be precisely segmented by manual breaking, but manual segmentation is inefficient and has high long-term costs. Patent CN107708308B discloses a positioning-type fully automatic edge-folding and segmenting machine, and patent CN118973117B discloses a circuit board breaking and separation device, simulating manual segmentation operations to achieve automated segmentation of circuit board substrate panels. However, the above-mentioned existing technologies can only be used for segmenting single-row or double-row circuit boards, while multi-row, multi-column square array circuit board substrate panels widely used in the prior art are difficult to segment by breaking. Summary of the Invention

[0008] The purpose of this invention is to solve at least one of the problems in the prior art and to provide a high-precision segmentation device for circuit board substrates and a method for using the same.

[0009] To achieve the above objectives, the present invention provides the following technical solution:

[0010] A high-precision segmentation device for circuit board substrates, comprising:

[0011] The carrier has a receiving groove on its side to accommodate circuit board panels; the circuit board panels include several columns and rows of small circuit board panels.

[0012] A linear reciprocating component moves linearly back and forth on the receiving groove side of the carrier;

[0013] The flexible pressure body moves with the linear reciprocating component and applies pressure to the circuit board panel;

[0014] Several horizontally rotating frames are hinged in the receiving slots and correspond to the small boards of each vertical column of circuit boards.

[0015] Several vertical flip frames are hinged in the receiving slot and located inside the horizontal flip frame, corresponding to each circuit board.

[0016] The circuit board panel is placed in the receiving groove; the linear reciprocating component moves towards the carrier, causing the flexible pressure body to apply pressure to the circuit board panel; each horizontal flipping frame flips and resets in sequence, driving the corresponding small circuit board in the same column to flip, causing the circuit board panel to break into several columns of circuit boards; each row of vertical flipping frames flips and resets in sequence, driving the corresponding small circuit board in the same row to flip, causing each small circuit board in the same column to break in sequence; the linear reciprocating component moves away from the carrier, releasing the divided small circuit boards;

[0017] When a circuit board in the receiving slot is partially flipped and broken, the flipped circuit board portion applies pressure to the flexible pressure body, causing the flexible pressure body to undergo adaptive deformation; the flexible pressure body forms an outer clamp on the broken circuit board portion, with the clamping surface being the pressure contact surface.

[0018] When the horizontal and vertical flip frames are flipped and reset, the flexible pressure body applies pressure to the circuit board, so that the broken part of the circuit board is accurately reset into the receiving groove.

[0019] Furthermore, the carrier side has an alignment groove for accommodating the end of the linear reciprocating component, and the accommodating groove is located in the middle of the alignment groove; the accommodating groove is provided with several vertical frame grooves for accommodating the horizontal flipping frame.

[0020] Furthermore, the receiving groove is provided with several positioning ribs that cooperate with the V-grooves of the circuit board panel.

[0021] Furthermore, the carrier is provided with a control box on the side facing away from the receiving groove. The control box contains several drive structures that drive each horizontal flipping frame to flip and drive each row of vertical flipping frames to flip synchronously.

[0022] Furthermore, the drive structure includes a geared motor, a rotating shaft, and several gears; the rotating shaft is rotatably installed in the control box, the geared motor drives the rotating shaft to rotate, and the gears are arranged along the rotating shaft; both the horizontal flipping frame and the vertical flipping frame are connected to several arc-shaped racks that slide through the carrier, and the arc-shaped racks mesh with the gears.

[0023] Furthermore, the flexible pressure body includes a flexible sealing cover, and a fluid medium is filled between the flexible sealing cover and the linear reciprocating component.

[0024] Furthermore, the linear reciprocating component is provided with several compensation cavities communicating with the inner side of the flexible sealing cover, and a piston is provided inside the compensation cavity, with an elastic support provided outside the piston.

[0025] Furthermore, the flexible sealing cover is provided with a rectangular ring-shaped cover on the outside; when the flexible pressure body applies pressure to the circuit board panel, the ring-shaped cover surrounds the outside of the receiving slot.

[0026] Furthermore, the linear reciprocating component includes a base shell, and the compensation cavity communicates with the inner side of the base shell; the base shell and the annular cover are connected by a flange, and the annular edge of the flexible sealing cover is clamped by a flange connection structure.

[0027] This invention also provides the following technical solutions:

[0028] A method of using a high-precision segmentation device for circuit board substrates, the method comprising the following steps:

[0029] S1. Place the circuit board panel into the receiving slot;

[0030] S2. The linear reciprocating component moves toward the carrier, causing the flexible pressure body to apply pressure to the circuit board panel;

[0031] S3. Each horizontal flip frame flips and resets in sequence, causing the small boards in each column of circuit boards to break.

[0032] S4. Each vertical flipping frame flips and resets in sequence, causing each circuit board to break.

[0033] S5. The linear reciprocating component moves away from the carrier, releasing the segmented circuit board.

[0034] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0035] This invention uses a horizontal and vertical flipping frame to gradually flip and break off some small boards of a circuit board panel, which can divide multi-row and multi-column array circuit board panels. The flexible pressure body can adapt to the flipping frame and support the broken circuit board, improve the stability during the breaking process, and promote the reset of the broken circuit board.

[0036] This invention uses a driving structure to make the small boards in the same column flip and break synchronously. After each column of small boards is broken, the small boards in the same row flip and break synchronously, breaking them both vertically and horizontally, ensuring that the panel segmentation is highly efficient.

[0037] The present invention uses an arc-shaped rack to support the flipping frame. When the flipping frame flips, the arc-shaped rack can also limit the opening formed by the flipping of the small plate, prevent the flexible pressure body from entering the back side of the small plate, ensure that the small plate is accurately reset after being broken, and realize the unified release of the small plate after being broken.

[0038] This invention uses a fluid medium and a flexible sealing cover to form a flexible pressure body, which can meet the adaptive deformation during the breaking process of the spliced ​​panels. After the small panel is broken, it is clamped by the flipping frame to absorb vibration and reduce the misalignment of the small panel.

[0039] This invention, through the compensation cavity and its inner elastic support, cooperates with the fluid medium and the flexible sealing cover to compensate for the deformation of the flexible pressure body and compensate for the pressure of the fluid medium when the flexible pressure body is compressed.

[0040] The flexible sealing cover of this invention has a detachable structure, which can be quickly replaced after the flexible sealing cover is damaged. Attached Figure Description

[0041] Figure 1 This is a first-view perspective stereoscopic diagram of the present invention.

[0042] Figure 2 This is a second-view perspective stereoscopic diagram of the present invention.

[0043] Figure 3This is a schematic diagram of the first side of the carrier of the present invention.

[0044] Figure 4 This is a schematic diagram of the second side of the carrier of the present invention.

[0045] Figure 5 This is a schematic diagram of the first column of horizontal flipping frames in the flipped state of the present invention.

[0046] Figure 6 This is a schematic diagram of the flipped state of the bottom vertical flipping frame of the present invention.

[0047] Figure 7 This is a schematic diagram of the circuit board panel of the present invention.

[0048] Figure 8 This is a schematic diagram of the second-row circuit board of the present invention being subjected to pressure, flipped, and broken.

[0049] Figure 9 This is a schematic diagram of the state where the lower second row of circuit boards of the present invention is broken by pressure and flipping.

[0050] Figure 10 This is a schematic diagram of the carrier load structure of the present invention.

[0051] Figure 11 This is a schematic diagram of the flipping frame of the present invention.

[0052] Figure 12 This is a schematic diagram of the carrier body of the present invention.

[0053] Figure 13 This is a partial schematic diagram of the carrier body of the present invention.

[0054] Figure 14 This is a schematic diagram of the driving structure of the present invention.

[0055] Figure 15 This is a schematic diagram of the gear and the arc-shaped rack of the present invention.

[0056] Figure 16 This is a first-view exploded view of the linear reciprocating component of the present invention.

[0057] Figure 17 This is a second-view exploded view of the linear reciprocating component of the present invention.

[0058] In the diagram: 1. Carrier; 2. Receiving groove; 3. Linear reciprocating component; 4. Horizontal flipping frame; 5. Vertical flipping frame; 6. Flexible sealing cover; 7. Compensating cylinder; 8. Alignment groove; 9. Positioning rib; 10. Frame groove; 11. Control box; 12. Box cover plate; 13. Arc rack; 14. Gear motor; 15. Rotating shaft; 16. Gear; 17. Arc hole; 18. First hinge shaft; 19. Blind hole; 20. Second hinge shaft; 21. Hinge seat; 22. Flange ring; 23. Piston; 24. Spring; 25. Cylinder cover; 26. Valve body; 27. Housing; 28. Guide rail; 29. ​​Slide seat; 30. Hydraulic telescopic cylinder; 31. Filter screen; 301. Base shell; 302. Annular cover. Detailed Implementation

[0059] The present invention will now be described in further detail. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the invention; that is, the described embodiments are merely some, not all, of the embodiments of the present invention.

[0060] Specific embodiments of the high-precision dicing equipment for circuit board substrates and its usage method provided by the present invention:

[0061] Please see Figure 1-17 A high-precision segmentation device for circuit board substrates includes a housing 27, a carrier 1, a linear reciprocating component 3, a flexible press body, several horizontal flipping frames 4, and several vertical flipping frames 5.

[0062] The carrier 1 is installed on the upper part of the housing 27 and passes through the upper side wall of the housing 27. One side of the carrier 1 inside the housing 27 has a receiving groove 2 for accommodating the circuit board panel, and one side of the carrier 1 is exposed outside the housing 27.

[0063] The linear reciprocating component 3 is located on the upper inner side of the housing 27, with a height corresponding to that of the carrier 1. The linear reciprocating component 3 moves laterally and linearly in a straight line on the receiving groove 2 side of the carrier 1, causing the distance between them to change.

[0064] The flexible pressure body moves with the linear reciprocating component 3, and is used to directly contact the circuit board panel and apply pressure to the circuit board panel.

[0065] The flexible pressure body includes a flexible sealing cover 6, with a fluid medium filling the space between the flexible sealing cover 6 and the linear reciprocating component 3. The flexible sealing cover 6 and the fluid medium supported inside the flexible sealing cover 6 form the flexible pressure body. The flexible pressure body applies pressure to the circuit board at the receiving groove 2. When a part of the circuit board in the receiving groove 2 flips and breaks, the flipped circuit board portion applies pressure to the flexible pressure body, causing the flexible pressure body to undergo adaptive forced deformation.

[0066] In this embodiment, the flexible sealing cover 6 is made of PVC mesh fabric, which has good sealing performance, surface abrasion resistance, strength, and stability. The fluid medium is a liquid medium, preferably oil.

[0067] The linear reciprocating component 3 includes a base shell 301 and an annular cover 302. The annular cover 302 is a rectangular ring structure that surrounds the outside of the flexible sealing cover 6. When the flexible pressure body applies pressure to the circuit board panel, the annular cover 302 surrounds the outside of the receiving groove 2 and restricts the uncontrollable deformation of the flexible sealing cover 6.

[0068] The base shell 301 and the annular cover 302 are connected by a flange, and the annular edge of the flexible sealing cover 6 is clamped by the flange connection structure. The base shell 301 has a groove-shaped structure with a square annular flange ring 22 at the groove opening. One end of the annular cover 302 also has a square annular flange ring 22. The flange rings 22 of the two are tightly connected to each other by bolts. The edge of the flexible sealing cover 6 is located between the flange rings 22 of the two. After the base shell 301 and the annular cover 302 are connected, the edge of the flexible sealing cover 6 is pressed between the two, forming a seal for the fluid medium inside. The flange ring 22 is provided with a through hole for bolt engagement. In some embodiments, the edge of the flexible sealing cover 6 is also provided with a through hole for bolt engagement and corresponding to the through hole of the flange ring 22.

[0069] A fluid medium is contained between the flexible sealing cover 6 and the base shell 301. The pressurized fluid medium fills the space, allowing the outer end of the flexible sealing cover 6 to pass through the annular cover 302 to the outer end of the annular cover 302. The flexible sealing cover 6 then directly contacts the circuit board panel, applying pressure to the panel. Preferably, in the absence of external force, the surface area of ​​the flexible sealing cover 6 protruding from the annular cover 302 is 1.2-1.3 times the cross-sectional area of ​​the annular cover 302. This allows for partial circuit board flipping and, when the flexible sealing cover 6 is recessed, the pressure from the flexible sealing cover 6 to ensure positional stability for other adjacent circuit boards. Furthermore, it prevents the back of the circuit board from being invaded by the outwardly flipped-out flexible sealing cover 6.

[0070] A valve body 26 is provided at the lower end of the base shell 301. When the valve body 26 is opened, the internal fluid medium can be released. Using an external oil pump or other oil filling equipment, the fluid medium can be pressurized and filled into the inside of the flexible sealing cover 6 through the opened valve body 26 to achieve the filling of the fluid medium.

[0071] Because the annular cover 302 restricts the uncontrollable deformation of the flexible sealing cover 6, but the flexible sealing cover 6 is subjected to pressure from the broken circuit board, and part of the space is compressed, in order to make the flexible sealing cover 6 achieve adaptive deformation more smoothly, the linear reciprocating component 3 is provided with several compensation cavities communicating with the inner side of the flexible sealing cover 6. Similarly, the compensation cavities are communicating with the inner side of the base shell 301. Specifically, in this embodiment, several compensation cylinders 7 are connected to the side wall of the base shell 301 facing away from the annular cover 302, and the inner side of the compensation cylinder 7 is the aforementioned compensation cavity.

[0072] The outer end of the compensation cylinder 7 is provided with a cylinder cover 25, and a piston 23 is provided inside the compensation cavity. An elastic support is provided on the outside of the piston 23. In this embodiment, the elastic support is a spring 24. When the flexible sealing cover 6 is compressed by the flipped part of the circuit board, the flexible sealing cover 6 is compressed and retracts. The fluid medium flows into the compensation cavity and applies pressure to the piston 23 and compresses the spring 24. The piston 23, which moves elastically in the compensation cavity, can fill the space for accommodating the fluid medium, so that the outer end of the flexible sealing cover 6 adapts to the deformation of the circuit board flipped and compressed. At the same time, the spring 24 keeps the flexible sealing cover 6 under a certain pressure, ensuring pressure on the other unflipped parts of the circuit board, so that the unflipped parts of the circuit board are stably attached to the receiving groove 2.

[0073] When a section of the circuit board is flipped and broken, the flexible pressure body absorbs the vibration and reduces misalignment. The flexible sealing cover 6 is made of PVC, which not only avoids hard contact and abrasion of the circuit board surface, but also has a certain degree of deformation capability, allowing it to fit tightly against the uneven surface of the circuit board, preventing misalignment and ensuring accurate repositioning after breakage. During breakage, the flexible pressure body forms an outer clamp on the broken portion of the circuit board, with the clamping surface being the main pressure contact surface, preventing misalignment and ensuring stability during breakage and accurate repositioning after the circuit board is broken.

[0074] After the circuit board is broken and reset, the spring 24 compresses the piston 23 to discharge the fluid medium in the compensation chamber back to the inside of the flexible sealing cover 6. The flexible sealing cover 6 applies pressure to the broken circuit board and pushes the broken circuit board back to its original position.

[0075] In this embodiment, the cylinder cover 25 and the compensation cylinder 7 are connected by threads. One end of the spring 24 is connected to the piston 23, and the other end abuts against the inside of the cylinder cover 25. By opening the cylinder cover 25 and replacing different springs 24 and pistons 23, i.e., using springs 24 with different pressure ratings, the pressure can be adjusted, thereby adjusting the pressure of the flexible pressure body on the circuit board.

[0076] The upper inner side of the housing 27 is provided with guide rails 28. In this embodiment, the guide rails 28 are four transverse guide rods, with two guide rods in each of the upper and lower layers, located on the upper side of the linear reciprocating component 3. The upper and lower sides of the base shell 301 and the upper and lower sides of the annular cover 302 are each provided with slide blocks 29 that slide along the guide rods. There are eight slide blocks 29 in total, arranged in two groups of four, located on the outer side of the base shell 301 and the outer side of the annular cover 302, respectively. In this embodiment, the slide blocks 29 are plate-shaped structures, with notches at the ends of the slide blocks 29 that slide along the guide rods.

[0077] When disassembling the flange connection structure, separate the base shell 301 and the annular cover 302. Tilt the base shell 301 and the annular cover 302 first, and then remove the base shell 301 and the annular cover 302 from between the four guide rods. After the base shell 301 and the annular cover 302 are separated, the flexible sealing cover 6 can also be replaced; before disassembly, the fluid medium must be released.

[0078] A hydraulic telescopic cylinder 30 is connected between the base shell 301 and the upper part of the side wall of the housing 27 away from the carrier 1. In some embodiments, the hydraulic telescopic cylinder 30 is bolted to both the housing 27 and the base shell 301. There are two hydraulic telescopic cylinders 30, which operate synchronously. The hydraulic telescopic cylinders 30 drive the linear reciprocating component 3 to move laterally along the guide rail 28, thereby moving closer to or away from the carrier 1.

[0079] The upper part of the housing 27 is provided with a glass window corresponding to the linear reciprocating component 3 and the hydraulic telescopic cylinder 30. In some embodiments, the glass window may be a sliding window. The upper part of the housing 27 also has a loading hole corresponding to the linear reciprocating component 3 and the carrier 1. When the linear reciprocating component 3 is away from the carrier 1, the worker places the circuit board panel to be divided into the receiving groove 2 through the loading hole.

[0080] Several horizontal flipping frames 4 are hinged in the receiving groove 2 and correspond to the small circuit boards in each vertical column respectively; several vertical flipping frames 5 are hinged in the receiving groove 2 and located inside the horizontal flipping frames 4, corresponding to each small circuit board.

[0081] The carrier 1 has a alignment groove 8 on its side to accommodate the end of the linear reciprocating component 3. The edge of the alignment groove 8 is chamfered to facilitate the entry of the end of the linear reciprocating component 3. Specifically, the alignment groove 8 corresponds to the annular cover 302. The outer side of the end of the annular cover 302 is attached to the inner wall of the alignment groove 8, excluding the lower side wall. The lower end of the alignment groove 8 extends to the lower side of the carrier 1. After the entire circuit board panel is divided into small circuit board boards, the flexible pressure body moves away, and the small circuit board boards fall. Since the alignment groove 8 has no lower side wall, it will not obstruct the falling small circuit board boards.

[0082] The receiving groove 2 is located in the center of the alignment groove 8; the receiving groove 2 is provided with several vertical frame grooves 10 for accommodating the horizontal flipping frames 4. One frame groove 10 corresponds to one row of circuit board small boards, and one frame groove 10 accommodates one horizontal flipping frame 4. Both the horizontal flipping frame 4 and the vertical flipping frame 5 are planar frames, and the vertical flipping frame 5 is located inside the horizontal flipping frame 4. Both the horizontal flipping frame 4 and the vertical flipping frame 5 are located in the frame grooves 10 within the receiving groove 2, and their thickness corresponds to that of the frame grooves 10. In the non-flipped state, they do not extend into the receiving groove 2.

[0083] The receiving groove 2 is provided with several positioning ribs 9 that mate with the V-grooves of the circuit board panel. The positioning ribs 9 are used for positioning the circuit board panel. The cross-section of the positioning ribs 9 is triangular and can extend into the V-grooves of the circuit board panel. The receiving groove 2 is provided with several horizontal short positioning ribs 9 and several vertical long positioning ribs 9. The long positioning ribs 9 are located on the inner wall of the receiving groove 2 between the frame grooves 10. Some of the short positioning ribs 9 intersect the long positioning ribs 9 perpendicularly and correspond to the intersection points of the V-grooves of the circuit board panel. Some of the short positioning ribs 9 are located at the edge of the receiving groove 2.

[0084] When placing the circuit board panel in the receiving groove 2, the circuit board panel is pressed into the receiving groove 2, with one-third of the thickness of the circuit board panel extending into the receiving groove 2. The positioning rib 9 extends into the V-groove of the circuit board panel, and then the linear reciprocating member 3 carries the flexible pressing body to apply pressure to the circuit board panel. In some other embodiments, the carrier 1 is slightly tilted, and the matching linear reciprocating member 3 and guide rail 28 are also slightly tilted to correspond to the carrier 1.

[0085] like Figure 11 and Figure 12 As shown, the horizontal flipping frame 4 has a coaxial first hinge shaft 18 at the corners on the same side at the top and bottom ends, and a blind hole 19 is provided on the inner wall of the frame groove 10 to support the rotation of the first hinge shaft 18. The two corners at the top of the vertical flipping frame 5 are notched, and a second hinge shaft 20 is provided on the inner side of each notched corner. A hinge seat 21 is provided in the frame groove 10 to support the rotation of the second hinge shaft 20.

[0086] A control box 11 is provided on the side of the carrier 1 facing away from the receiving groove 2. Specifically, the side of the carrier 1 facing away from the receiving groove 2, that is, the side of the carrier 1 exposed outside the housing 27, is recessed inward to form the control box 11. The opening of the control box 11 is connected to the box cover 12 by bolts. The box cover 12 can be opened from the outside of the housing 27, which facilitates the inspection and maintenance of the internal structure of the control box 11.

[0087] The control box 11 is equipped with several drive structures that drive each horizontal flipping frame 4 to flip and drive each row of vertical flipping frames 5 to flip synchronously. The drive structure includes a geared motor 14, a rotating shaft 15 and several gears 16; the rotating shaft 15 is rotatably installed in the control box 11, the geared motor 14 drives the rotating shaft 15 to rotate, and the gears 16 are arranged along the rotating shaft 15.

[0088] In this embodiment, the circuit board panel includes four columns of small circuit board panels and four rows of small circuit board panels; one circuit board panel includes sixteen small circuit board panels. The drive structure is arranged in eight groups: four groups are arranged vertically with their rotating shafts 15 arranged vertically; and four groups are arranged horizontally with their rotating shafts 15 arranged horizontally.

[0089] Both the horizontal flipping frame 4 and the vertical flipping frame 5 are connected to several arc-shaped racks 13 that slide through the carrier 1, and the arc-shaped racks 13 mesh with gears 16; each horizontal flipping frame 4 is connected to at least three arc-shaped racks 13 on the back edge away from its hinge, and each horizontal flipping frame 4 is driven by a set of drive structures. Each vertical flipping frame 5 is connected to at least one arc-shaped rack 13 on the back edge away from its hinge, and the vertical flipping frames 5 in the same horizontal row are driven by a set of drive structures.

[0090] An arc-shaped rack 13 passes through a carrier 1, which has arc-shaped holes 17 corresponding to the racks 13 for sliding. The inner arc side of the arc-shaped rack 13 has teeth that mesh with the gear 16, while the outer arc side is smooth. The rotation of the drive shaft 15 causes the gear 16 connected to it to rotate, which in turn drives the arc-shaped rack 13, which meshes with the gear 16, to slide along the arc-shaped holes 17 through the carrier 1. The movement of the arc-shaped rack 13 causes the horizontal flipping frame 4 or the vertical flipping frame 5 to flip. In some embodiments, the arc-shaped rack 13 is hinged to the flipping frame.

[0091] The transmission structure of the arc-shaped rack 13 and gear 16 is similar to the opening and closing structure of the ventilation window of the greenhouse, but the arc-shaped rack 13 plays a special role in the structure of this embodiment. When the horizontal flipping frame 4 flips, it flips the longitudinal row of circuit board small boards, and when the vertical flipping frame 5 flips, it flips the transverse row of circuit board small boards. Some of the circuit board small boards flip and press against the flexible sealing cover 6, forming an opening. The outer arc side of the arc-shaped rack 13 is smooth. Multiple arc-shaped racks 13 can prevent the flexible sealing cover 6 from intruding into the opening of the circuit board small boards, that is, into the back side of the circuit board small boards. Multiple arc-shaped racks 13 form a block against the flexible sealing cover 6, ensuring that after the flipping frame is broken, it can be smoothly reset, and some of the circuit board small boards can be smoothly reset without being intruded and blocked by the flexible sealing cover 6.

[0092] After the circuit board is divided, the linear reciprocating component 3 resets, causing all horizontal flip frames 4 to flip and push out all the small circuit boards, which then fall down. The lower part of the housing 27 is a storage cavity, and an inclined filter 31 is provided inside the storage cavity. The filter 31 can be a taut flexible filter 31 or a rigid filter 31. The small circuit boards fall on the upper side of the filter 31, and the small debris generated from breaking falls on the lower side of the filter 31. The lower sidewall of the housing 27 is provided with material picking holes on the upper and lower sides of the filter 31, respectively, for picking up materials.

[0093] This embodiment also provides a method for using a high-precision circuit board substrate segmentation device, including the following steps: placing the circuit board panel in the receiving groove 2; the linear reciprocating component 3 moves towards the carrier 1 to apply pressure to the circuit board panel by the flexible pressure body; each horizontal flipping frame 4 flips and resets sequentially, that is, after one horizontal flipping frame 4 flips and resets, the next horizontal flipping frame 4 moves again, causing each row of circuit board sub-boards to break and separate sequentially; each row of vertical flipping frames 5 flips and resets sequentially, that is, after one row of vertical flipping frames 5 flips and resets, the next row of vertical flipping frames 5 moves, causing each circuit board sub-board to break and separate sequentially; the linear reciprocating component 3 moves away from the carrier 1 to release the segmented circuit board sub-boards. In this embodiment, the flipping angle of each flipping frame is set to forty-five degrees.

[0094] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still make modifications to the technical solutions described in the foregoing embodiments without creative effort, or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A high-precision segmentation device for circuit board substrates, characterized in that, include: The carrier (1) has a receiving groove (2) on its side for accommodating the circuit board panel; the circuit board panel includes several columns and several rows of small circuit boards; The linear reciprocating component (3) moves in a straight line back and forth on the receiving groove (2) side of the carrier (1); The flexible pressure body moves with the linear reciprocating component (3) and applies pressure to the circuit board panel; Several horizontally rotating frames (4) are hinged in the receiving groove (2) and correspond to the small boards of each vertical column of circuit boards respectively; Several vertical flip frames (5) are hinged in the receiving groove (2) and located inside the horizontal flip frame (4), corresponding to each circuit board small board; The circuit board panel is placed in the receiving groove (2); the linear reciprocating component (3) moves toward the carrier (1) to make the flexible pressure body press on the circuit board panel; each horizontal flipping frame (4) flips and resets in sequence, and the horizontal flipping frame (4) drives the corresponding small circuit board in the same column to flip, so that the circuit board panel is broken into several columns of circuit boards; each row of vertical flipping frames (5) flips and resets in sequence, and the vertical flipping frame (5) drives the corresponding small circuit board in the same row to flip, so that each small circuit board in the same column is broken in sequence; the linear reciprocating component (3) moves away from the carrier (1) to release the divided small circuit board; When the circuit board in the receiving groove (2) is partially flipped and broken, the flipped circuit board part applies pressure to the flexible pressure body, and the flexible pressure body undergoes adaptive deformation; the flexible pressure body forms an outer clamp on the broken circuit board part, and the clamping surface is the pressure contact surface; When the horizontal flip frame (4) and the vertical flip frame (5) are flipped and reset, the flexible pressure body applies pressure to the circuit board, so that the broken part of the circuit board is accurately reset into the receiving groove (2).

2. The high-precision dicing equipment for circuit board substrates according to claim 1, characterized in that, The carrier (1) has a alignment groove (8) on its side to accommodate the end of the linear reciprocating component (3), and the accommodating groove (2) is located in the middle of the alignment groove (8); the accommodating groove (2) is provided with several vertical frame grooves (10) for accommodating the horizontal flipping frame (4).

3. The high-precision dicing equipment for circuit board substrates according to claim 1, characterized in that, The receiving groove (2) is provided with several positioning ribs (9) that cooperate with the V grooves of the circuit board panel.

4. The high-precision dicing equipment for circuit board substrates according to claim 1, characterized in that, The carrier (1) has a control box (11) on the side facing away from the receiving groove (2). The control box (11) has several drive structures that drive each horizontal flipping frame to flip (4) and drive each row of vertical flipping frames (5) to flip synchronously.

5. The high-precision dicing equipment for circuit board substrates according to claim 4, characterized in that, The drive structure includes a geared motor (14), a rotating shaft (15), and several gears (16); the rotating shaft (15) is rotatably installed in the control box (11), the geared motor (14) drives the rotating shaft (15) to rotate, and the gears (16) are arranged along the rotating shaft (15); the horizontal flipping frame (4) and the vertical flipping frame (5) are both connected with several arc-shaped racks (13) that slide through the carrier (1), and the arc-shaped racks (13) mesh with the gears (16).

6. The high-precision dicing equipment for circuit board substrates according to claim 1, characterized in that, The flexible pressure body includes a flexible sealing cover (6), and a fluid medium is filled between the flexible sealing cover (6) and the linear reciprocating component (3).

7. The high-precision dicing equipment for circuit board substrates according to claim 6, characterized in that, The linear reciprocating component (3) is provided with several compensation cavities that communicate with the inner side of the flexible sealing cover (6). A piston (23) is provided in the compensation cavity, and an elastic support is provided on the outer side of the piston (23).

8. The high-precision dicing equipment for circuit board substrates according to claim 7, characterized in that, The flexible sealing cover (6) has a rectangular ring-shaped cover (302) on its outside; when the flexible pressure body applies pressure to the circuit board panel, the ring cover (302) surrounds the outside of the receiving groove (2).

9. The high-precision dicing equipment for circuit board substrates according to claim 8, characterized in that, The linear reciprocating component (3) includes a base shell (301), and the compensation cavity is connected to the inner side of the base shell (301); the base shell (301) and the annular cover (302) are connected by a flange and the annular edge of the flexible sealing cover (6) is clamped by the flange connection structure.

10. The method of using the high-precision dicing equipment for circuit board substrates according to any one of claims 1-9, characterized in that, The method of use includes the following steps: S1. Place the circuit board panel into the receiving slot (2); S2, the linear reciprocating component (3) moves toward the carrier (1) to apply pressure to the circuit board panel by the flexible pressure body; S3. Each horizontal flipping frame (4) flips and resets in sequence, causing the small boards of each column of circuit boards to break; S4. Each vertical flipping frame (5) flips and resets in sequence, causing each circuit board to break. S5, the linear reciprocating component (3) moves away from the carrier (1) and releases the segmented circuit board.

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