Wafer film coating device for integrated circuit manufacturing

Abstract

The utility model discloses a wafer film covering device for integrated circuit manufacturing relates to the field of integrated circuit manufacturing, including closed box, be provided with the film covering mechanism in the upper end in closed box, be provided with wafer bearing mechanism in the lower end in closed box, be provided with the loading positioning mechanism in closed box, and the loading positioning mechanism includes the positioning support, a plurality of circumferentially uniformly arranged deflection rods are rotationally connected on the positioning support, the cross connecting disc is fixed in the top of deflection rod, and the adjacent cross connecting disc is hinged through the connecting rod, and the other end fixed with the material receiving tray of deflection rod, and the material receiving tray is fixed with the positioning ring, and the positioning cylinder is hinged between one deflection rod on the positioning support. The beneficial effect lies in: before loading, the wafer is supported through a plurality of circumferentially uniformly arranged material receiving trays, and then a plurality of positioning rings synchronous movement is centered clamped to the wafer, thereby realizing the centring positioning of wafer, and this positioning mode has high centring accuracy, positioning speed is fast, and is convenient for taking and placing.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit manufacturing, and in particular to a wafer coating device for integrated circuit manufacturing. Background Technology

[0002] An integrated circuit wafer is a silicon wafer used to fabricate silicon semiconductor circuits. It is the basic material for manufacturing semiconductor chips. Various circuit components in an integrated circuit, such as transistors, resistors, and capacitors, are fabricated on the surface of the wafer through a series of complex processes including photolithography, etching, and doping. The wafer provides a flat and stable foundation for these components, ensuring that they can be laid out and connected according to design requirements to achieve specific electrical functions.

[0003] Wafer coating is a process of applying a protective film to the surface of a wafer. It is mainly used to protect the wafer, fix its position, and facilitate handling and transportation.

[0004] For example, patent document CN222507557U discloses a wafer coating apparatus for integrated circuit manufacturing, including a worktable, a control panel on the front surface of the worktable, a first side plate fixedly connected to the top surface of the worktable, and a film roller on the back of the first side plate; a second side plate, mounted on the top surface of the worktable, with a stabilizing ring on its front surface, a rotating shaft on its front surface, and a bonding pad on the outer surface of the rotating shaft. The apparatus uses an electric push rod to drive a connecting ring and an annular blade to rise inside the cutting groove, allowing the annular blade to cut the film on the outer surface of the placement cylinder as a whole, resulting in a more complete cut and better operational effect. After the operation is completed, the wafer is removed, and the process is repeated. The waste film is then wrapped around the outer surface of the rotating shaft, facilitating film recycling.

[0005] In the prior art, before wafer coating, the wafer needs to be placed on a carrier platform and positioned by contoured grooves through manual operation or a feeding device. However, with the increasingly high processing requirements, this positioning method cannot meet the requirements for centered positioning of the wafer. Therefore, a wafer coating device that can accurately center the wafer is proposed. Utility Model Content

[0006] The purpose of this invention is to provide a wafer coating apparatus for integrated circuit manufacturing in order to solve the above-mentioned problems.

[0007] This utility model achieves the above objectives through the following technical solutions:

[0008] A wafer coating apparatus for integrated circuit manufacturing includes a sealed box. A coating mechanism is located at the upper end of the sealed box, and a wafer carrier mechanism is located at the lower end of the sealed box. A loading and positioning mechanism is also located inside the sealed box. The loading and positioning mechanism includes a positioning bracket slidably connected to the sealed box. Several circumferentially evenly arranged deflecting rods are rotatably connected to the positioning bracket. A cross-shaped connecting plate is fixedly connected to the top of each deflecting rod. Adjacent cross-shaped connecting plates are hinged together by two connecting rods. A material receiving plate is fixedly connected to the other end of each deflecting rod. A positioning ring is fixedly connected to the material receiving plate, and the diameter of the material receiving plate is larger than the diameter of the positioning ring. A positioning cylinder is hinged to the positioning bracket, and the other end of the positioning cylinder is hinged to one of the deflecting rods. A driving component for driving the positioning bracket to slide is provided on the positioning bracket.

[0009] Preferably, the enclosed box includes a box body, a front platform fixedly connected to the front end of the box body, an observation and maintenance window hinged to the upper side of the front end of the box body, the other end of the observation and maintenance window being connected to the box body by a buckle, a first cylinder fixedly connected to the top of the box body, a fixed bracket fixedly connected to the output end of the first cylinder, a cutting motor fixedly connected to the fixed bracket, a cutting blade fixedly connected to the output end of the cutting motor, the cutting blade being gate-shaped, and two symmetrically arranged slide rails fixedly connected inside the box body, the slide rails being positioned above the front platform, and the slide rails being slidably connected to the positioning bracket.

[0010] Preferably, the laminating mechanism includes a laminating bracket fixedly connected to the upper end of the housing, a film roller assembly mounted on one side of the laminating bracket, a waste roller assembly mounted on the other side of the laminating bracket, the same set of film being rolled between the film roller assembly and the waste roller assembly, a translation bracket slidably connected to the laminating bracket, a transverse screw rotatably connected to the front side of the laminating bracket, the translation bracket being threadedly connected to the transverse screw, a laminating motor fixedly connected to the laminating bracket, the output end of the laminating motor being fixedly connected to the transverse screw, a second cylinder fixedly connected to the translation bracket, and a laminating roller mounted on the output end of the second cylinder through the roller bracket, the laminating roller being able to contact the film.

[0011] Preferably, the wafer carrying mechanism includes two symmetrically arranged second hydraulic cylinders fixedly connected to the bottom of the housing. A second piston rod is slidably and sealed to the top of the second hydraulic cylinder. A wafer coating stage is fixedly connected to the second piston rod. Several negative pressure suction cups are evenly arranged circumferentially on the wafer coating stage. A groove is provided in the middle of the wafer coating stage. A third lifting cylinder is fixedly connected in the groove in the middle of the wafer coating stage. A lifting pick-up platform is fixedly connected to the output end of the third lifting cylinder. An anti-slip layer is provided on the surface of the lifting pick-up platform.

[0012] Preferably, the drive assembly includes two feeding screws symmetrically arranged on the left and right sides of the housing, which are rotatably connected. The feeding screws are threadedly connected to the positioning bracket. The two feeding screws are connected to a synchronous belt via a synchronous pulley. A feeding motor is fixedly connected to the rear side of the housing, and the output end of the feeding motor is fixedly connected to the feeding screws.

[0013] Preferably, the bottom of the front platform is fixedly connected to a first hydraulic cylinder symmetrically arranged on both sides, the rear end of the first hydraulic cylinder is slidably sealed to a first piston rod, a spring is fixedly connected between the end face of the first piston rod and the inner end face of the first hydraulic cylinder, the first hydraulic cylinder and the second hydraulic cylinder are connected through a pipe, the first hydraulic cylinder and the second hydraulic cylinder are filled with hydraulic oil, and two symmetrically arranged pushing and fixing blocks are fixedly connected to the rear side of the positioning bracket, the pushing and fixing blocks can contact the first piston rod.

[0014] The beneficial effects are as follows: by setting up the feeding and positioning mechanism, before feeding, the wafer is supported by several circumferentially evenly arranged support trays. Then, several positioning rings move synchronously to clamp the wafer in a centered manner, thereby achieving the centered positioning of the wafer. This positioning method has high centered accuracy, fast positioning speed, and is easy to pick up and put down.

[0015] The additional technical features and advantages of this utility model will become more apparent from the following description, or may be learned through specific practice of this utility model. Attached Figure Description

[0016] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the following detailed description to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0017] Figure 1 This is a perspective view of a wafer coating apparatus for integrated circuit manufacturing according to the present invention;

[0018] Figure 2 This is a front view of a wafer coating apparatus for integrated circuit manufacturing according to the present invention;

[0019] Figure 3 This is a right-side cross-sectional view of the wafer coating apparatus for integrated circuit manufacturing described in this utility model;

[0020] Figure 4 This is a perspective view showing the relative positions of the feeding screw and the dustproof box of the wafer coating device for integrated circuit manufacturing described in this utility model.

[0021] Figure 5 This is a three-dimensional structural view of the wafer carrier mechanism of the wafer coating apparatus for integrated circuit manufacturing described in this utility model;

[0022] Figure 6 yes Figure 3 Enlarged view of point A in the middle;

[0023] Figure 7 This is a three-dimensional structural view of the coating mechanism of the wafer coating apparatus for integrated circuit manufacturing described in this utility model;

[0024] Figure 8 This is a three-dimensional view of the feeding and positioning mechanism of the wafer coating device for integrated circuit manufacturing described in this utility model;

[0025] Figure 9 This is a perspective view of the relative positions of the positioning bracket and the positioning cylinder of the wafer coating device for integrated circuit manufacturing described in this utility model.

[0026] The annotations in the attached figures are explained as follows:

[0027] 101. Housing; 102. Front platform; 103. Observation and maintenance window; 104. First cylinder; 105. Fixed bracket; 106. Cutting motor; 107. Cutting blade; 108. Slide rail; 201. Coating bracket; 202. Film roller assembly; 203. Waste roller assembly; 204. Coating motor; 205. Transverse screw; 206. Translation bracket; 207. Second cylinder; 208. Coating roller; 301. Positioning bracket; 302. 303. Deflection rod; 304. Cross connecting plate; 305. Connecting rod; 306. Material receiving plate; 307. Positioning ring; 308. Positioning cylinder; 309. Push fixing block; 310. Feeding motor; 401. Feeding screw; 402. First hydraulic cylinder; 403. Second hydraulic cylinder; 404. Second piston rod; 405. Wafer coating stage; 406. Negative pressure suction cup; 407. Lifting and unloading stage; 408. Third lifting cylinder. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0029] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0030] The present invention will be further described below with reference to the accompanying drawings:

[0031] like Figures 1-9As shown, a wafer coating apparatus for integrated circuit manufacturing includes a sealed box. A coating mechanism is located at the upper end of the sealed box, and a wafer carrying mechanism is located at the lower end. A loading and positioning mechanism is also located within the sealed box. The loading and positioning mechanism includes a positioning bracket 301 slidably connected to the sealed box. Several circumferentially evenly arranged deflection rods 302 are hinged to the positioning bracket 301. In this embodiment, four deflection rods 302 are used. A cross-shaped connecting plate 303 is fixedly connected to the top of each deflection rod 302. Adjacent cross-shaped connecting plates 303 are hinged together by two connecting rods 304. A material receiving plate 305 is welded and fixed to the other end of each deflection rod 302. A positioning ring 306 is fixedly connected to the material receiving plate 305. The diameter of the material receiving plate 305 is larger than the diameter of the positioning ring 306. A positioning cylinder 307 is hinged to the positioning bracket 301. The other end of the positioning cylinder 307 is hinged to one of the deflection rods 302. The positioning bracket 301 is equipped with a drive assembly for sliding the positioning bracket 301. The operator places the wafer inside the positioning bracket 301, which is supported by four circumferentially distributed support trays 305. The positioning cylinder 307 drives one of the deflection rods 302 to deflect and clamp the wafer. At the same time, the deflection rod 302 drives the cross connecting plate 303 to deflect. The cross connecting plate 303 drives the other cross connecting plates 303 to deflect in the same direction and at the same time through the action of the connecting rod 304. In this way, the four circumferentially distributed positioning rings 306 clamp the wafer at the same time, thus realizing the positioning and clamping of the wafer. In the next step, the drive assembly drives the positioning bracket 301 into the closed box. The wafer carrying mechanism removes the wafer from the positioning bracket 301. Then, the positioning bracket 301 leaves the box 101 under the action of the drive assembly. The wafer carrying mechanism rises and brings the wafer close to the coating mechanism. The coating mechanism adheres a film to the surface of the wafer.

[0032] The enclosed enclosure includes a housing 101. A front platform 102 is bolted to the front end of the housing 101. An observation and maintenance window 103 is hinged to the upper front side of the housing 101. The other end of the observation and maintenance window 103 is connected to the housing 101 via a clip. The observation and maintenance window 103 facilitates the observation of the wafer coating condition by the staff and does not provide a maintenance passage. A first cylinder 104 is fixedly connected to the top of the housing 101. A fixed bracket 105 is fixedly connected to the output end of the first cylinder 104. A [missing information - likely a device or component] is fixedly connected to the fixed bracket 105. A cutting motor 106 is used, and a cutting blade 107 is fixedly connected to the output end of the cutting motor 106. The cutting blade 107 is designed as a gate shape. Two symmetrically arranged slide rails 108 are fixedly connected inside the housing 101. The slide rails 108 are located above the front platform 102 and are slidably connected to the positioning bracket 301. After the film coating is completed, the first cylinder 104 drives the fixed bracket 105 to go down into the well. The fixed bracket 105 drives the cutting motor 106 to descend. The cutting motor 106 drives the cutting blade 107 to rotate, and the cutting blade 107 cuts the film.

[0033] The laminating mechanism includes a laminating bracket 201 fixedly connected to the upper end of the housing 101. A film roller assembly 202 is mounted on one side of the laminating bracket 201, and a waste roller assembly 203 is mounted on the other side of the laminating bracket 201. The same set of film is rolled between the film roller assembly 202 and the waste roller assembly 203. A translation bracket 206 is slidably connected to the laminating bracket 201. A transverse screw 205 is rotatably connected to the front side of the laminating bracket 201. The translation bracket 206 is threadedly connected to the transverse screw 205. A laminating motor 204 is fixedly connected to the laminating bracket 201. The output end of the laminating motor 204 is fixedly connected to the transverse screw 205. A second cylinder 207 is fixedly connected to the translation bracket 206. A coating roller 208 is installed at the output end of the second cylinder 207 through the roller bracket. The coating roller 208 can contact the film. The film roller group 202 and the waste roller group 203 rotate simultaneously to transfer the new film above the wafer. Then, the wafer is close to the film under the action of the wafer coating stage 405. Then, the coating motor 204 drives the transverse screw 205 to rotate. The transverse screw 205 drives the translation bracket 206 to translate. The second cylinder 207 drives the coating roller 208 to approach the film and the wafer and apply a certain pressure, thereby adhering the film to the wafer.

[0034] The wafer carrier mechanism includes two symmetrically arranged second hydraulic cylinders 403 fixedly connected to the bottom of the housing 101. A second piston rod 404 is slidably and sealed to the top of each second hydraulic cylinder 403. A wafer coating stage 405 is fixedly connected to the second piston rod 404. Several circumferentially evenly arranged negative pressure suction cups 406 are mounted on the wafer coating stage 405. A groove is provided in the middle of the wafer coating stage 405. A third lifting cylinder 408 is fixedly connected to the groove in the middle of the wafer coating stage 405. The output end of the third lifting cylinder 408 is fixed... A lifting platform 407 is connected, and the surface of the lifting platform 407 is provided with an anti-slip layer. The third lifting cylinder 408 drives the lifting platform 407 to rise until it holds the wafer on the positioning bracket 301. Then the deflection rod 302 resets, releasing the centering clamp on the wafer. Then the lifting platform 407 resets, and the wafer falls onto the wafer coating stage 405. At this time, the negative pressure suction cup 406 adsorbs the wafer. The second cylinder 403 drives the second piston rod 404 to rise, and the second piston rod 404 drives the wafer coating stage 405 to rise.

[0035] The drive assembly includes two symmetrically arranged feeding screws 310 rotatably connected to the left and right sides of the housing 101. The feeding screws 310 are threadedly connected to the positioning bracket 301. The two feeding screws 310 are connected to a synchronous belt via a synchronous pulley. A feeding motor 309 is fixedly connected to the rear side of the housing 101. The output end of the feeding motor 309 is fixedly connected to the feeding screws 310. The feeding motor 309 drives the feeding screws 310 to rotate. The positioning bracket 301 drives the other feeding screw 310 to rotate synchronously and in the same direction via belt drive. The feeding screws 310 drive the positioning bracket 301 to move along the slide rail 108.

[0036] The bottom of the front platform 102 is fixedly connected to a first hydraulic cylinder 401 symmetrically arranged on both sides. The rear end of the first hydraulic cylinder 401 is slidably sealed to a first piston rod 402. A spring is fixedly connected between the end face of the first piston rod 402 and the inner end face of the first hydraulic cylinder 401. The first hydraulic cylinder 401 and the second hydraulic cylinder 403 are connected through a pipe. Hydraulic oil is filled into the first hydraulic cylinder 401 and the second hydraulic cylinder 403. Two symmetrically arranged pushing and fixing blocks 308 are fixedly connected to the rear side of the positioning bracket 301. The pushing and fixing blocks 308 can contact the first piston rod 402. When the positioning bracket 301 moves outward, the pushing and fixing blocks 308 abut against the first piston rod 402 and push the first piston rod 402 to retract into the first hydraulic cylinder 401. In this way, the hydraulic oil in the first hydraulic cylinder 401 enters the second hydraulic cylinder 403. The hydraulic oil in the second hydraulic cylinder 403 pushes the wafer coating stage 405 to rise.

[0037] Working principle: The operator places the wafer in the positioning bracket 301, which is supported by four circumferentially distributed support trays 305. The positioning cylinder 307 drives one of the deflection rods 302 to deflect and clamp the wafer. Simultaneously, the deflection rod 302 drives the cross connecting plate 303 to deflect. The cross connecting plate 303, through the connecting rod 304, drives the other cross connecting plates 303 to deflect simultaneously in the same direction. Thus, the four circumferentially distributed positioning rings 306 simultaneously clamp the wafer, achieving wafer positioning and clamping. Next, the feeding motor 309 drives the feeding screw 31. With the rotation at 0, the positioning bracket 301 drives another feeding screw 310 to rotate synchronously in the same direction via belt drive. The feeding screw 310 drives the positioning bracket 301 to move along the slide rail 108, thus the positioning bracket 301 enters the enclosed box. Next, the third lifting cylinder 408 drives the lifting platform 407 to rise until it holds the wafer on the positioning bracket 301. Then, the deflection rod 302 resets, releasing the centering clamp on the wafer. Subsequently, the lifting platform 407 resets, and the wafer falls onto the wafer coating stage 405. At this time, the negative pressure suction cup 406 adsorbs the wafer. Next, the positioning bracket 301 moves away from the housing 101 under the action of the drive assembly. During the outward movement of the positioning bracket 301, it pushes the fixing block 308 to abut against the first piston rod 402 and pushes the first piston rod 402 to retract into the first cylinder 401. As a result, the hydraulic oil in the first cylinder 401 enters the second cylinder 403. The hydraulic oil in the second cylinder 403 pushes the wafer coating stage 405 to rise. The rising wafer coating stage 405 brings the wafer closer to the coating mechanism. In the next step, the film roller group 202 and the waste roller group 203 rotate simultaneously to apply a new film. The wafer is moved above the wafer, and then the wafer is brought close to the film under the action of the wafer coating stage 405. Then the coating motor 204 drives the transverse screw 205 to rotate, and the transverse screw 205 drives the translation bracket 206 to translate. The second cylinder 207 drives the coating roller 208 to approach the film and the wafer and apply a certain pressure, thereby adhering the film to the wafer. After the coating is completed, the first cylinder 104 drives the fixed bracket 105 to go down, and the fixed bracket 105 drives the cutting motor 106 to descend. The cutting motor 106 drives the cutting blade 107 to rotate, and the cutting blade 107 cuts the film.

[0038] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A wafer film coating device for integrated circuit manufacturing, comprising an enclosed box, a film coating mechanism is arranged at the upper end of the enclosed box, and a wafer supporting mechanism is arranged at the lower end of the enclosed box, characterized in that: The enclosed box is equipped with a feeding and positioning mechanism, which includes a positioning bracket (301) slidably connected to the enclosed box. Several deflection rods (302) are rotatably connected to the positioning bracket (301) and are evenly arranged in a circle. A cross connecting plate (303) is fixedly connected to the top of the deflection rod (302). Two adjacent cross connecting plates (303) are hinged together by two connecting rods (304). A material receiving plate (305) is fixedly connected to the other end of the deflection rod (302). A positioning ring (306) is fixedly connected to the material receiving plate (305). The diameter of the material receiving plate (305) is larger than the diameter of the positioning ring (306). A positioning cylinder (307) is hinged to the positioning bracket (301). The other end of the positioning cylinder (307) is hinged to one of the deflection rods (302). A driving component for driving the positioning bracket (301) to slide is provided on the positioning bracket (301).

2. The wafer coating device for integrated circuit manufacturing according to claim 1, wherein: The enclosed box includes a box body (101), a front platform (102) is fixedly connected to the front end of the box body (101), an observation and maintenance window (103) is hinged to the upper side of the front end of the box body (101), the other end of the observation and maintenance window (103) is connected to the box body (101) by a buckle, a first cylinder (104) is fixedly connected to the top of the box body (101), a fixed bracket (105) is fixedly connected to the output end of the first cylinder (104), a cutting motor (106) is fixedly connected to the fixed bracket (105), a cutting blade (107) is fixedly connected to the output end of the cutting motor (106), the cutting blade (107) is set in a door shape, two symmetrically arranged slide rails (108) are fixedly connected inside the box body (101), the slide rails (108) are set above the front platform (102), and the slide rails (108) are slidably connected to the positioning bracket (301).

3. The wafer coating device for integrated circuit manufacturing according to claim 2, wherein: The coating mechanism includes a coating bracket (201) fixedly connected to the upper end of the housing (101). A film roller group (202) is installed on one side of the coating bracket (201), and a waste roller group (203) is installed on the other side of the coating bracket (201). The same set of film is rolled between the film roller group (202) and the waste roller group (203). A translation bracket (206) is slidably connected to the coating bracket (201), and a transverse axial connection is rotatably connected to the front side of the coating bracket (201). The screw (205) is threadedly connected to the translation bracket (206). A coating motor (204) is fixedly connected to the coating bracket (201). The output end of the coating motor (204) is fixedly connected to the translation bracket (205). A second cylinder (207) is fixedly connected to the translation bracket (206). A coating roller (208) is installed on the output end of the second cylinder (207) through a roller bracket. The coating roller (208) can contact the film.

4. The wafer coating device for integrated circuit manufacturing according to claim 2, wherein: The wafer carrying mechanism includes two symmetrically arranged second hydraulic cylinders (403) fixedly connected to the bottom of the housing (101). The top of the second hydraulic cylinder (403) is slidably and sealed with a second piston rod (404). A wafer coating stage (405) is fixedly connected to the second piston rod (404). Several circumferentially evenly arranged negative pressure suction cups (406) are installed on the wafer coating stage (405). A groove is provided in the middle of the wafer coating stage (405). A third lifting cylinder (408) is fixedly connected in the groove in the middle of the wafer coating stage (405). A lifting pick-up platform (407) is fixedly connected to the output end of the third lifting cylinder (408). An anti-slip layer is provided on the surface of the lifting pick-up platform (407).

5. The wafer coating device for integrated circuit manufacturing according to claim 2, wherein: The drive assembly includes two feeding screws (310) rotatably connected to the left and right sides of the housing (101) and symmetrically arranged. The feeding screws (310) are threadedly connected to the positioning bracket (301). The two feeding screws (310) are connected to a synchronous belt via a synchronous pulley. A feeding motor (309) is fixedly connected to the rear side of the housing (101). The output end of the feeding motor (309) is fixedly connected to the feeding screws (310).

6. The wafer coating device for integrated circuit manufacturing according to claim 4, wherein: The bottom of the front platform (102) is fixedly connected to a first hydraulic cylinder (401) symmetrically arranged on both sides. The rear end of the first hydraulic cylinder (401) is slidably sealed to a first piston rod (402). A spring is fixedly connected between the end face of the first piston rod (402) and the inner end face of the first hydraulic cylinder (401). The first hydraulic cylinder (401) and the second hydraulic cylinder (403) are connected through a pipe. Hydraulic oil is filled into the first hydraulic cylinder (401) and the second hydraulic cylinder (403). The rear side of the positioning bracket (301) is fixedly connected to two symmetrically arranged pushing and fixing blocks (308). The pushing and fixing blocks (308) can contact the first piston rod (402).

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