Immersion liquid cooling device

Abstract

The present application discloses an immersion liquid cooling device, which relates to the field of heat dissipation technology. The immersion liquid cooling device includes a sensor that can float on the liquid surface, which can capture phase change characteristics such as bubble dynamics and liquid surface disturbances, generate real-time phase change signals, and realize direct and rapid monitoring of the phase change process. When the sensor detects that the phase change is not intense enough and the temperature of the heating device exceeds the preset temperature, the control component can control the drive component and / or the condensation component to reduce the pressure in the accommodating chamber and reduce the boiling point of the coolant to enhance the phase change, so that the immersion liquid cooling device can respond to overheating risks more quickly and accurately, and effectively control the temperature of the heating device within the preset range, thereby improving the heat dissipation efficiency of the immersion liquid cooling device.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to an immersion liquid cooling device. Background Art

[0002] With the rapid development of information technology, electronic devices are moving towards higher performance and higher integration, but this also presents increasingly severe heat dissipation challenges. The continuous shrinking of chip manufacturing processes and the widespread use of multi-core processors have led to a sharp increase in the amount of heat generated per unit area by electronic components, far exceeding previous levels. At the same time, the continued miniaturization and integration of electronic devices and systems has further compressed the physical space available for heat dissipation, making heat dissipation a particularly prominent issue.

[0003] Traditional air cooling technology relies on air as a heat transfer medium. However, air's inherently low thermal conductivity and specific heat capacity make it difficult to meet cooling efficiency requirements in high-heat-flux conditions. Furthermore, air cooling systems typically require bulky components such as fans and heat sinks, which not only take up a lot of space but also generate high noise levels during operation, impacting the user experience.

[0004] In contrast, immersion cooling technology completely immerses electronic components in a coolant with high thermal conductivity and high specific heat capacity. This allows for efficient heat transfer through full contact between the liquid and the heat-generating device, significantly improving heat dissipation efficiency. Furthermore, immersion cooling systems offer advantages such as silence, a compact footprint, and a high level of protection. They effectively protect electronic components from dust and moisture, providing a stable and reliable cooling solution for high-heat-load equipment and becoming a key path to breaking through current cooling technology bottlenecks.

[0005] In the actual operation of immersion cooling systems, phase change heat transfer is a core and complex process. Whether the coolant reaches a phase change state and the intensity of the phase change are directly related to the heat dissipation efficiency. Summary of the Invention

[0006] The present application provides an immersion liquid cooling device to at least solve the problem of improving the heat dissipation efficiency of the immersion liquid cooling device in the related art.

[0007] The present application provides an immersion liquid cooling device, comprising: a box body, a receiving chamber is formed inside, and a coolant capable of generating a gas-liquid phase change is arranged in the receiving chamber; a heating device is arranged in the box body and is at least partially immersed in the coolant, and the coolant changes phase to generate steam when the temperature of the heating device is higher than a preset temperature; a condensing component is arranged outside the box body and is suitable for condensing the steam; a driving component is suitable for circulating the condensed coolant into the receiving chamber; a sensor is placed in the receiving chamber and floats on the liquid surface of the coolant, and is suitable for generating a phase change signal indicating the degree of phase change of the coolant; a control component is suitable for reducing the pressure in the receiving chamber through the driving component and / or the condensing component when the phase change signal is lower than a preset range value and the temperature of the heating device is higher than a preset temperature, thereby reducing the boiling point of the coolant, enhancing phase change heat generation, and reducing the temperature of the heating device.

[0008] Through this application, by providing a sensor that can float on the liquid surface, it is possible to capture phase change characteristics such as bubble dynamics and liquid surface disturbances, and generate real-time phase change signals. This changes the limitations of related technologies that rely on manual observation or infer the phase change state through indirect parameters such as pressure and temperature, and realizes direct and rapid monitoring of the phase change process. When the sensor detects that the phase change is not intense enough (the phase change signal is lower than the preset range) and the temperature of the heating device exceeds the preset temperature, the control component can control the drive component and / or the condensation component to reduce the pressure in the containment chamber and lower the boiling point of the coolant to enhance the phase change, so that the immersion liquid cooling device can respond to overheating risks more quickly and accurately, effectively controlling the temperature of the heating device within the preset range, thereby improving the heat dissipation efficiency of the immersion liquid cooling device. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0010] Figure 1 A schematic diagram of an immersion liquid cooling device provided in an embodiment of the present application;

[0011] Figure 2 A cross-sectional view of a sensor provided in an embodiment of the present application;

[0012] Figure 3 Schematic diagram of the sensor provided in the embodiment of the present application;

[0013] Figure 4 A cross-sectional view of another sensor provided in an embodiment of the present application;

[0014] Figure 5A cross-sectional view of another sensor provided in an embodiment of the present application;

[0015] Figure 6 A circuit diagram of a circuit module provided in an embodiment of the present application;

[0016] Figure 7 A circuit diagram of a processing unit provided in an embodiment of the present application.

[0017] The above drawings include the following reference numerals:

[0018] 1. Box body;

[0019] 2. Heating equipment;

[0020] 3. Condensation assembly; 31. First pipeline; 32. Condenser; 33. Liquid storage tank; 34. Heat exchanger; 35. First valve; 36. Second valve;

[0021] 4. Drive assembly; 41. Circulation pump; 42. Third valve;

[0022] 5. Sensor; 51. Housing; 52. Friction layer; 53. Transmission unit; 531. First conductive layer; 532. Second conductive layer; 533. Third conductive layer; 534. Sensing layer; 54. Circuit module; 541. Processing unit; 5411. Modulator; 5412. Filter unit; 5413. Amplification unit; 55. Connecting rod; 56. First bracket; 57. Second bracket; 58. Third bracket.

[0023] 6. Control components;

[0024] 7. Third pipeline; 8. Liquid level sensor; 9. Pressure sensor; 10. Coolant. DETAILED DESCRIPTION

[0025] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0026] It should be noted that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely for ease of description and simplification of the present application. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present application. The terms "mounted," "connected," and "connected" should be interpreted broadly, and may include, for example, fixed, removable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. The terms "parallel," "perpendicular," and "equal" encompass the described conditions and conditions similar to the described conditions, provided that the range of the similar conditions is within an acceptable range of deviation, as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes both absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism may be, for example, within 5°; "perpendicular" includes both absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity may also be, for example, within 5°. "Equal" includes both absolute equality and approximate equality, where the acceptable deviation range for approximate equality may be, for example, that the difference between the two is less than or equal to 5% of either. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0027] During the implementation of this application, we discovered that in related technologies, determining the phase change state of the coolant typically relies on manual observation or inference through indirect parameters such as pressure and temperature in the monitoring system. While this indirect parameter and manual judgment method is feasible to a certain extent, it may suffer from problems such as response lag and incomplete information. It is difficult to accurately and real-timely grasp the dynamic changes of the phase change, which may affect the optimization of the cooling strategy and the stability of the system.

[0028] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0029] An embodiment of the present application provides an immersion liquid cooling device. The device is described in detail in combination with the structure and working principle of the immersion liquid cooling device (the technical terms involved must be explained).

[0030] Figure 1This is a schematic diagram of an immersion liquid cooling device provided in an embodiment of the present application.

[0031] The present application embodiment provides an immersion liquid cooling device, such as Figure 1 As shown, the immersion liquid cooling device includes a housing 1, a heat generating device 2, a condensing assembly 3, a drive assembly 4, a sensor 5, and a control assembly 6. The housing 1 defines a chamber within which coolant 10 capable of undergoing a gas-liquid phase change is disposed. The heat generating device 2 is disposed within the housing 1 and at least partially submerged in the coolant 10. When the temperature of the heat generating device 2 exceeds a preset temperature, the coolant 10 undergoes a phase change, generating steam. The condensing assembly 3 is disposed outside the housing 1 and is adapted to condense the steam. The drive assembly 4 is adapted to circulate the condensed coolant 10 back into the chamber. The sensor 5 is disposed within the chamber and floats on the surface of the coolant 10, generating a phase change signal indicating the degree of phase change of the coolant 10. When the phase change signal is below a preset range and the temperature of the heat generating device 2 is above a preset temperature, the control assembly 6 is adapted to reduce the pressure within the chamber via the drive assembly 4 and / or the condensing assembly 3, thereby lowering the boiling point of the coolant 10, enhancing phase change heat generation, and reducing the temperature of the heat generating device 2.

[0032] Through the present application, by providing a sensor 5 capable of floating on the liquid surface, phase change characteristics such as bubble dynamics and liquid surface disturbances can be captured, generating a real-time phase change signal. This overcomes the limitations of the related art of relying on manual observation or inferring the phase change state through indirect parameters such as pressure and temperature, and achieves direct and rapid monitoring of the phase change process. When the sensor 5 detects that the phase change is not intense enough (the phase change signal is below a preset range) and the temperature of the heating device 2 exceeds a preset temperature, the control component 6 can control the drive component 4 and / or the condensation component 3 to reduce the pressure in the receiving chamber and lower the boiling point of the coolant 10 to enhance the phase change, allowing the immersion liquid cooling device to respond to overheating risks more quickly and accurately, effectively controlling the temperature of the heating device 2 within a preset range, and thereby improving the heat dissipation efficiency of the immersion liquid cooling device.

[0033] According to the embodiments of the present application, Figure 1 As shown, a certain amount of coolant 10 is contained within the housing 1, forming a vapor phase space between the surface of the coolant 10 and the top of the housing 1. This vapor phase space is used to accommodate vapor generated by the coolant 10 after the coolant 10 undergoes a phase change under the heat provided by the heat generating device 2. The heat generating device 2 is at least partially immersed in the coolant 10. The coolant 10 has a low boiling point and can easily undergo a phase change to form vapor by absorbing heat, or to form a liquid by releasing heat.

[0034] According to an embodiment of the present application, heat-generating device 2 refers to an electronic or electrical component that generates a large amount of heat during operation, such as a combination of at least one or more of a central processing unit (CPU), a graphics processing unit (GPU), a chipset, and a memory module (RAM). Alternatively, heat-generating device 2 may be a complex electronic device containing many heat-generating electronic components, such as a server.

[0035] In some exemplary embodiments, the number of the heat generating devices 2 may be one or more.

[0036] According to an embodiment of the present application, the coolant 10 has insulating properties. For example, it can be any of fluorinated liquids (Fluorinated Liquids / Fluorinert analogs), synthetic hydrocarbons (Synthetic Hydrocarbons), silicone oils, etc.

[0037] When the temperature of the heating device 2 is higher than the preset temperature, the coolant 10 undergoes phase change under the heat generated by the heating device 2 . The degree of phase change during cooling can be used to determine whether the heating device 2 is in a state higher than the preset temperature.

[0038] The preset temperature may be greater than or equal to the boiling point of the coolant 10 .

[0039] As an example, the preset temperature may be 55°C-70°C, for example, the preset temperature may be any value among 55°C, 58°C, 60°C, 62°C, 65°C, 68°C and 70°C.

[0040] According to the embodiments of the present application, Figure 1 As shown, the condensing assembly 3 includes a first pipe 31, a condenser 32, and a liquid storage tank 33. One end of the first pipe 31 is connected to the upper portion of the housing 1, and the condenser 32 is connected to the other end of the first pipe 31 to condense the steam from the accommodating chamber. The liquid storage tank 33 is suitable for storing the coolant 10 condensed by the condenser 32.

[0041] like Figure 1 As shown, one end of the first pipe 31 is in communication with the gas phase space of the housing 1 , and the vapor of the vaporized coolant 10 is transmitted from the gas phase space to the condenser 32 through the first pipe 31 .

[0042] The condenser 32 condenses the steam from the first pipe 31 . The liquid storage tank 33 is disposed downstream of the condenser 32 along the flow direction of the coolant 10 and is used to store the coolant 10 condensed by the condenser 32 .

[0043] The driving component 4 circulates the coolant 10 in the liquid storage tank 33 into the accommodating space, thereby realizing the recycling of the coolant 10 and preventing the liquid level of the coolant 10 in the accommodating cavity from being too low due to continuous evaporation, thereby affecting the cooling effect.

[0044] According to the embodiments of the present application, Figure 1 As shown, the condensing assembly 3 further includes a first valve 35. The first valve 35 is disposed on the first pipe 31. The control assembly 6 is configured to control the opening of the first valve 35 to increase when the phase change signal is below a preset range value, thereby accelerating the discharge of vapor above the liquid surface from the accommodating chamber, reducing the pressure within the accommodating chamber, thereby lowering the boiling point of the coolant 10, increasing the phase change degree of the coolant 10, enhancing heat transfer, and allowing the coolant 10 to quickly remove heat generated by the heat-generating device 2, thereby improving heat exchange efficiency.

[0045] When the sensor 5 detects that the phase change signal is higher than the preset range, or the temperature of the heating device 2 exceeds the preset temperature, the control component 6 can reduce the opening of the first valve 35 to slow down the discharge of steam in the accommodating chamber, thereby increasing the pressure in the accommodating chamber, increasing the boiling point of the coolant 10, and reducing the phase change degree of the coolant 10.

[0046] According to the embodiments of the present application, Figure 1 As shown, the condensation assembly 3 further includes a second valve 36, which is disposed on a second pipe located above the condenser 32 and communicating with the outside. The control assembly 6 is configured to control the second valve 36 to open when the phase change signal is below a preset range value, so as to at least partially discharge uncondensed gas in the condensation assembly 3 and reduce the pressure in the accommodation chamber.

[0047] The uncondensed gas may include air leaked into the immersion liquid cooling device, a small amount of non-condensable gas generated by decomposition of the cooling liquid 10, and the like.

[0048] It can be understood that the control component 6 is configured to simultaneously reduce the opening of the first valve 35 and control the opening of the second valve 36 when the phase change signal is lower than the preset range value, so as to quickly reduce the pressure in the accommodating chamber.

[0049] According to the embodiments of the present application, Figure 1 As shown, the condensing assembly 3 further includes a heat exchanger 34 , which is disposed in the liquid storage tank 33 and is adapted to perform heat exchange on the coolant 10 in the liquid storage tank 33 to reduce the temperature of the coolant 10 .

[0050] In some exemplary embodiments, the heat exchanger 34 may be a coil type, disposed outside the liquid storage tank 33, to exchange heat with the coolant 10 in the liquid storage tank 33, thereby reducing the temperature of the coolant 10 in the liquid storage tank 33. It should be understood that the embodiments of the present application are not limited thereto.

[0051] According to an embodiment of the present application, the drive assembly 4 circulates the condensed coolant 10 into the accommodating chamber via the third pipe 7. The outlet end of the third pipe 7 is disposed at the lower portion of the housing 1 and is configured to face the heat-generating device 2 to enhance the flow of the coolant 10 around the heat-generating device 2 and strengthen convective heat transfer.

[0052] In such an embodiment, the liquid outlet end of the third pipe 7 extends into the accommodating chamber and faces the heat-generating device 2. That is, the third pipe 7 aligns the liquid outlet end of the coolant 10 directly with the heat-generating device 2, so that the relatively cold coolant 10 that has just flowed out of the liquid storage tank 33 can directly and quickly contact the surface of the heat-generating device 2. This direct impact can quickly remove the heat generated by the heat-generating device 2, avoiding the delay of the coolant 10 mixing and heating in the accommodating chamber before contacting the heat-generating component, thereby improving the heat transfer efficiency of the immersion liquid cooling device. In addition, the coolant 10 flows directly to the heat-generating device 2, which can enhance the fluid flow around the heat-generating device 2, strengthen convective heat transfer, and more effectively transfer heat from the heat-generating device 2 to the coolant 10, further improving the heat exchange efficiency.

[0053] In the case where there are multiple heat-generating devices 2 in the accommodating cavity, the third pipe 7 can be provided with multiple liquid outlets, and the multiple liquid outlets can be respectively aligned with the multiple heat-generating devices.

[0054] In some exemplary embodiments, Figure 1 As shown, the immersion liquid cooling device may further include a nozzle. The nozzle is immersed in the coolant 10 and is adapted to direct the coolant 10 in the receiving chamber toward the heat-generating device 2, thereby enhancing fluid flow around the heat-generating device 2, strengthening convective heat transfer, and more efficiently transferring heat from the heat-generating device 2 to the coolant 10.

[0055] According to the embodiments of the present application, Figure 1 As shown, the driving assembly 4 includes a circulation pump 41. The circulation pump 41 is provided on the third pipeline 7, and is adapted to circulate the coolant in the liquid storage tank 33 into the housing 1.

[0056] In the process of implementing this application, it was found that traditional sensors rely on wired transmission, and the transmission cables are susceptible to coolant corrosion and electromagnetic interference, resulting in signal distortion. The wiring is complex, which increases the difficulty of maintaining the immersion liquid cooling device. In addition, traditional sensors generate heat themselves and have complex wiring, which interferes with the uniform flow of coolant, resulting in local hot spots and affecting the heat dissipation effect.

[0057] Figure 2 A cross-sectional view of a sensor provided in an embodiment of the present application is shown. Figure 3 This is a schematic diagram of the sensor provided in an embodiment of the present application.

[0058] According to the embodiments of the present application, Figure 2 and Figure 3 As shown, the sensor 5 comprises a housing 51, a friction layer 52, a transmission unit 53, and a circuit module 54. The friction layer 52 is positioned at the bottom of the housing 51 and forms a cavity with the housing 51. In response to the phase change of the coolant 10, the friction layer 52 changes its contact area with the coolant 10, generating charge transfer. The transmission unit 53 is adapted to transmit the current signal I generated by the charge transfer. The circuit module 54 is positioned in the cavity and electrically connected to the transmission unit 53 to generate a phase change signal based on the current signal I for wireless transmission.

[0059] According to the embodiments of the present application, Figure 2 As shown, the sensor 5 includes a housing 51 and a friction layer 52. The friction layer 52 is disposed at the bottom of the housing 51. A cavity is formed between the main structure of the housing 51 and the friction layer 52. The cavity is suitable for accommodating internal electronic components such as a circuit module 54. The cavity is isolated from the coolant 10 by the housing 51 and the friction layer 52.

[0060] like Figure 3 As shown, when the sensor 5 floats on the surface of the coolant 10, the liquid surface contacts the friction layer 52. When the coolant 10 is in a phase change state, the rapid vaporization, bubble formation, and bursting of the coolant 10 cause the contact state between the friction layer 52 and the coolant 10 to dynamically change (for example, the contact area frequently increases and decreases), thereby triggering a triboelectric effect and causing charge transfer between the friction layer 52 and the coolant 10, generating a current signal I.

[0061] In detail, when the coolant 10 is only at rest or undergoing a slight phase change, the bubble activity is relatively low, the friction between the friction layer 52 and the coolant 10 is slight, the amount of charge transfer generated is small, and the generated current signal I is also relatively weak.

[0062] When the coolant 10 undergoes a dramatic phase change, a large number of bubbles burst at high frequency on the surface of the friction layer 52. At the moment of bubble collapse, droplets impact or rub against the surface of the friction layer 52 at high speed, inducing intense friction. Rapid, high-frequency electron transfer occurs between the friction layer 52 material and the coolant 10 (or the ions it contains), resulting in instantaneous, pulsed charge accumulation and release on the surface of the friction layer 52. This rapid charge change creates a significant potential difference between the friction layer 52 and the first conductive layer 531, generating a series of pulsed current signals I. The more dramatic the phase change, the higher the frequency and intensity of bubble collapse, the more frequent and intense the friction, the greater the charge transfer, and the resulting intensity (amplitude) and frequency of the resulting current signal I.

[0063] The friction layer 52 can be made of any of a polymer material (e.g., nylon (PA12), polytetrafluoroethylene (PTFE), polyethylene (PE), etc.), a composite material (e.g., carbon fiber reinforced composite material), and alumina ceramic. The ability of the friction layer 52 to gain or lose electrons differs from that of the coolant 10.

[0064] In this embodiment, the electrical energy generated by friction is converted into high-frequency electromagnetic waves through the built-in circuit module 54, which can be used for both powering the device and as a carrier for wireless signal transmission. This wireless transmission method not only avoids the drawbacks of wired transmission, but also reduces the number of connectors, mitigates the problem of poor contact caused by loose or corroded connectors, and improves the stability and reliability of signal transmission. It also facilitates the modular design and expansion of the immersion liquid cooling device and avoids the risk of leakage in the cabinet 1 caused by wired connections.

[0065] like Figure 1 As shown, the control component 6 performs corresponding regulation by comparing the phase change signal S1 from the sensor 5 with the set optimal phase change state (preset range value) S0.

[0066] When the phase change signal S1 is within the preset range S0 , the phase change state of the coolant 10 is relatively ideal, and the control component 6 does not need to perform any action.

[0067] When S1 is less than S0, the phase change of the coolant 10 is poor. The control component 6 increases the opening of the first valve 35 or opens the second valve 36 for exhaust to reduce the pressure in the accommodating chamber to reduce the boiling point of the coolant 10, so that the coolant 10 changes phase at a lower temperature, thereby enhancing the phase change heat transfer; at the same time, the nozzle can also be made to spray the fluid in the direction of the heating device 2 to enhance local convective heat transfer.

[0068] When S1>S0, the phase change of the coolant 10 is excessive. The control component 6 reduces the opening of the first valve 35 to reduce the steam flowing to the condenser 32, and / or reduces the opening of the second valve 36, or controls the speed of the circulation pump 41 and increases the opening of the third valve 42 to replenish the liquid, so as to increase the pressure in the accommodating chamber to reduce the phase change and maintain the normal phase change state of the immersion liquid cooling device.

[0069] In some exemplary embodiments, Figure 2 and Figure 3As shown, the transmission unit 53 includes a first conductive layer 531 and a second conductive layer 532. The first conductive layer 531 contacts the friction layer 52, is located on the side of the friction layer 52 facing away from the coolant 10, and is electrically connected to the circuit module 54. The second conductive layer 532 is spaced apart from the friction layer 52, is located below the housing 51, and is electrically connected to the circuit module 54. The second conductive layer 532 cooperates with the first conductive layer 531 to transmit current signals to the circuit module 54. The second conductive layer 532 is immersed in the coolant 10, with the liquid surface between the second conductive layer 532 and the friction layer 52 in contact with the friction layer 52.

[0070] In such an embodiment, the friction layer 52 is in direct contact with the first conductive layer 531. Due to the formation and rupture of bubbles or liquid sloshing, the friction layer 52 surface and the coolant 10 frequently come into contact and separate, thereby generating charge transfer.

[0071] The first conductive layer 531 may be coated on the friction layer 52. The second conductive layer 532 may have a rod-shaped or column-shaped structure to reduce obstruction to the coolant 10.

[0072] When the coolant 10 changes phase, the contact area between the friction layer 52 and the coolant 10 changes, causing charge transfer and forming a current signal. The current signal needs to be transmitted to the circuit module 54 for processing.

[0073] like Figure 2 and Figure 3 As shown, Figure 3 The resistor R is the equivalent resistance of the circuit module 54 . The first conductive layer 531 , the second conductive layer 532 and the circuit module 54 together form a complete current loop, so that the current signal I can be guided to the circuit module 54 .

[0074] When the friction layer 52 comes into contact with the coolant 10 and undergoes triboelectric charging, a charge (either positive or negative) is generated on its surface. The first conductive layer 531, located closely on the inner side of the friction layer 52 (the side facing away from the coolant 10), effectively collects these friction-generated charges. These collected charges generate a weak current signal. Both the first and second conductive layers 531, 532 are electrically connected to the circuit module 54. These layers transmit the current signal representing the charge transfer to the circuit module 54 for processing.

[0075] like Figure 2As shown, the edge of the housing 51 extends downward to form a plurality of connecting rods 55, which are disposed around the periphery of the friction layer 52. A second conductive layer 532 is disposed on the connecting rods 55, spaced apart from the friction layer 52 and allowing coolant 10 to flow between the friction layer 52 and the second conductive layer 532. A wire electrically connected to the second conductive layer 532 has one end electrically connected to the second conductive layer 532 and the other end passes through the connecting rods 55 and extends into the housing 51 to be electrically connected to the circuit module 54.

[0076] The first conductive layer 531 may be electrically connected to the circuit module 54 through a wire.

[0077] In such an embodiment, the second conductive layer 532 can also serve as a counterweight for the sensor 5 , lowering the center of gravity of the sensor 5 and allowing the sensor 5 to float more steadily on the liquid surface.

[0078] Figure 4 A cross-sectional view of another sensor provided in an embodiment of the present application.

[0079] like Figure 4 As shown, the sensor 5 may further include a first bracket 56 and a second bracket 57. The first conductive layer 531 is disposed on the lower surface of the first bracket 56, and the friction layer 52 is disposed below the first conductive layer 531. The first bracket 56 is mounted on the housing 51 to form a cavity with the housing 51, and the circuit module 54 is disposed in the cavity.

[0080] A plurality of connecting rods 55 extend downward from the lower surface of the housing 51 and are disposed around the periphery of the friction layer 52. A second bracket 57 is disposed at one end of the connecting rods 55 facing away from the housing 51. A second conductive layer 532 is formed on the second bracket 57. This allows the second conductive layer 532 to be spaced apart from the friction layer 52 and allows the coolant 10 to pass through the connecting rods 55 and flow between the second conductive layer 532 and the friction layer 52.

[0081] Figure 5 A cross-sectional view of another sensor provided in an embodiment of the present application.

[0082] In some alternative embodiments, such as Figure 1 and Figure 5 As shown, the transmission unit 53 includes a third conductive layer 533 and a sensing layer 534. The third conductive layer 533 contacts the friction layer 52 and is arranged on the side of the friction layer 52 away from the coolant 10 (i.e. Figure 5 The sensing layer 534 is spaced apart from the third conductive layer 533 and disposed within the cavity. The sensing layer 534 is electrically connected to the circuit module 54 to form a capacitor structure with the third conductive layer 533. The sensing layer 534 senses the change in potential difference caused by charge transfer between the friction layer 52 and the liquid surface, generates a current signal, and transmits the current signal to the circuit module 54.

[0083] In such an embodiment, when the friction layer 52 contacts the liquid surface of the coolant 10 and undergoes relative motion (for example, due to bubble bursting, liquid surface fluctuations, etc. caused by phase change), charge transfer occurs between the friction layer 52 and the coolant 10 according to the triboelectric effect.

[0084] Assuming that the friction layer 52 is negatively charged (gained electrons) due to friction, the surface of the coolant 10 in contact with the friction layer 52 will correspondingly be positively charged (lost electrons), or vice versa. This creates an instantaneous potential difference between the friction layer 52 and the liquid surface.

[0085] Since phase change is a dynamic process, the liquid surface fluctuates continuously, and the contact area, contact pressure, and relative movement speed between the friction layer 52 and the liquid surface are constantly changing, causing the amount of charge on the friction layer 52 and the potential difference between the friction layer 52 and the liquid surface to also constantly change.

[0086] The third conductive layer 533 is in close contact with the friction layer 52, and changes in the potential of the friction layer 52 are almost instantaneously transmitted to the third conductive layer 533. When the friction layer 52 is negatively charged, the potential of the third conductive layer 533 also decreases.

[0087] When the potential difference between the friction layer 52 and the liquid surface (i.e., the potential of the friction layer 52) changes, the potential of the third conductive layer 533 also changes accordingly. Because the third conductive layer 533 and the sensing layer 534 form a capacitor, changes in the potential of the third conductive layer 533 cause changes in the electric field between the third conductive layer 533 and the sensing layer 534.

[0088] Both the induction layer 534 and the third conductive layer 533 are connected to the circuit module 54. Based on the principle of electromagnetic induction (or, the redistribution of charge caused by a change in voltage across a capacitor), the induction layer 534 senses changes in the electric field. Specifically, if the potential of the third conductive layer 533 increases, it attracts positive charges on the induction layer 534 or repels negative charges on the induction layer 534, resulting in a brief current flow (charging or discharging current) between the induction layer 534 and the circuit module 54. The magnitude and direction of this current reflect the rate and magnitude of change in the potential difference between the friction layer 52 and the liquid surface. This current signal, representing the change in potential difference, generated by the induction layer 534, is transmitted to the circuit module 54.

[0089] The third conductive layer 533 may be coated on the friction layer 52 . The circuit module 54 may be installed in the housing 51 via a third bracket 58 .

[0090] The third bracket 58 may be a plate-shaped or sheet-shaped structure. Furthermore, the third bracket 58 may be made of an insulating material.

[0091] In some exemplary embodiments, the friction layer 52 is configured as a downwardly protruding arc-shaped structure so as to float on the liquid surface and respond to the fluctuation of the liquid surface in a phase change state and / or the bubbles generated by the phase change to change the contact area between the coolant 10 and the friction layer 52 to generate charge transfer.

[0092] In such an embodiment, the friction layer 52 is configured in a downwardly convex arc structure, so that the sensor 5 can float on the liquid surface like a boat, and the friction layer 52 maintains contact with the liquid surface.

[0093] According to the triboelectric effect, the contact area, frequency, and speed of contact / separation all influence the amount and rate of charge transfer. The arc-shaped friction layer 52 increases the surface area in contact with the liquid surface, resulting in a larger contact / separation area or a greater amplitude of change under the same liquid level fluctuations, potentially generating a stronger charge transfer signal. When the liquid level fluctuates due to phase changes, the arc-shaped structure can more comprehensively respond to these fluctuations.

[0094] The fluctuation of the liquid surface will directly act on the curved surface. Compared with the friction layer 52 with a flat structure, the contact area between the liquid surface and the friction layer 52 with an arc structure can change more significantly and frequently when the coolant 10 changes phase, which can improve the detection sensitivity of the sensor 5 to the phase change state.

[0095] In some exemplary embodiments, the sensor 5 may further include an additional counterweight (not shown in the figures) to increase the total weight of the sensor 5 , lower the center of gravity of the sensor 5 , and make the sensor 5 more stable when the liquid level fluctuates.

[0096] The counterweight can be arranged outside the housing 51. For example, the counterweight can be tied to the bottom of the housing 51 by a rope and immersed in the coolant 10.

[0097] The sensor 5 based on friction nano-power generation floats directly on the surface of the coolant 10. When the coolant 10 changes phase, the liquid surface will have obvious rolling and fluctuations. According to the different phase changes, the sensor 5 will generate different phase change signals to monitor the phase change state and ensure that the heating device 2 is in the best heat dissipation state.

[0098] Figure 6 A circuit diagram of a circuit module provided in an embodiment of the present application, Figure 7 A circuit diagram of a processing unit provided in an embodiment of the present application.

[0099] According to the embodiments of the present application, Figure 6 As shown, the circuit module 54 includes a processing unit 541. Figure 7As shown, processing unit 541 includes resistor R1, amplifier unit 5413, and modulator 5411. Resistor R1 is adapted to convert a current signal into a voltage signal, and amplifier unit 5413 is adapted to amplify the voltage signal to obtain an amplified signal. Modulator 5411 is adapted to modulate the amplified signal and transmit the phase-change signal via radio electromagnetic waves.

[0100] Friction nano-power generation technology can convert energy in the environment into AC energy, but it cannot directly power amplifiers, etc. In practical applications, it is necessary to convert AC into DC, charge the capacitor, store energy through the capacitor, and then power the amplifier, etc. through the capacitor.

[0101] As an example, the modulator 5411 may be a high frequency wave transmission modulator.

[0102] According to the embodiments of the present application, Figure 6 As shown, the circuit module 54 further includes a rectifier bridge and a capacitor C1. The rectifier bridge is adapted to rectify the current signal into a DC signal. The capacitor C1 is electrically connected to the output end of the rectifier bridge and adapted to filter the DC signal and store charge to power the processing unit 541.

[0103] A rectifier bridge can be composed of 4 diodes.

[0104] like Figures 3 to 6 As shown, the first input terminal A1 and the second input terminal A2 of the rectifier bridge are electrically connected to the first conductive layer 531 and the second conductive layer 532 respectively. Alternatively, the first input terminal A1 and the second input terminal A2 of the rectifier bridge are electrically connected to the third conductive layer 533 and the induction layer 534 respectively.

[0105] According to the embodiments of the present application, Figure 6 As shown, the circuit module 54 may further include another load R4.

[0106] According to the embodiments of the present application, Figure 7 As shown, amplification unit 5413 includes an operational amplifier Q, a resistor R2, and a resistor R3. Resistors R2 and R3 are connected in series and electrically connected to the output terminal of operational amplifier Q. Specifically, one end of resistor R3 is electrically connected to the output terminal of operational amplifier Q, and resistor R2 is connected in series between resistor R3 and a ground electrode. One input terminal of operational amplifier Q is used to receive a current signal I, and the other input terminal of the operational amplifier is connected between resistor R2 and resistor R3.

[0107] like Figures 3 to 7As shown, the AC power generated by the triboelectric nano-power generation sensor 5 is converted to DC power after passing through a rectifier bridge and stored in capacitor C1. The energy storage element capacitor C1 can provide a stable power supply for the amplifier and modulator 5411 when needed, allowing the triboelectric nano-power generation sensor 5 to operate stably without an external power supply. When the monitored phase change signal needs to be transmitted, the processing unit 541 further converts the DC power energy into high-frequency AC power through the high-frequency wave transmission modulator, generating high-frequency electromagnetic waves and modulating them to prepare for carrying and transmitting the phase change signal.

[0108] The energy stored in capacitor C1 can power the operational amplifier Q. Figure 7 As shown, capacitor C1 is connected to the power supply terminal of the operational amplifier Q to provide voltage V CC .

[0109] The electrical energy stored in the capacitor C1 can power the modulator 5411. Alternatively, the modulator 5411 can be a passive modulator 5411.

[0110] According to the embodiments of the present application, Figure 7 As shown, the processing unit 541 further includes a filtering unit 5412 , which is disposed between the amplifying unit 5413 and the modulator 5411 and is adapted to filter the amplified signal.

[0111] The filtering unit 5412 includes an inductor L and a capacitor C2. A first end of the inductor L is connected to the output end of the operational amplifier Q, a second end of the inductor L is connected to the modulator 5411, one end of the capacitor C2 is connected to the second end of the inductor, and the other end of the capacitor C2 is grounded.

[0112] like Figures 2 to 7 As shown, when the friction layer 52 contacts the liquid surface of the coolant 10 and a relative motion occurs (for example, due to the bursting of bubbles caused by phase change, fluctuations in the liquid surface, etc.), an induced current, i.e., a current signal I, is generated due to friction electrification and electrostatic induction. The current signal I generates an induced voltage V through the resistor R1 and transmits the induced voltage V to the non-inverting input terminal of the operational amplifier Q. The inverting input terminal of the operational amplifier Q is connected to the middle position of the resistors R2 and R3. After being processed by the operational amplifier Q, an amplified signal is obtained. (analog signal).

[0113] (1);

[0114] Where V is the induced voltage, To amplify the signal, R2 is the resistance value of resistor R2, and R3 is the resistance value of resistor R3.

[0115] After passing through a low-pass filter composed of inductor L and capacitor C2, analog voltage U1 is filtered out of high-frequency interference. Analog voltage U1 is processed by modulator 5411 and then applied to a high-frequency electromagnetic wave. This high-frequency electromagnetic wave, carrying the phase-change signal, is then transmitted to the outside world as an electromagnetic wave. Control component 6 is equipped with an antenna and signal demodulation device corresponding to modulator 5411. When the antenna receives the high-frequency electromagnetic wave, the demodulation device separates the phase-change signal from the high-frequency electromagnetic wave and restores it to the original physical quantity data, thus achieving wireless signal transmission.

[0116] According to the embodiments of the present application, Figure 1 As shown, the immersion liquid cooling device further includes a pressure sensor 9. The pressure sensor 9 is disposed above the liquid surface and separated from the cooling liquid 10. The pressure sensor 9 is adapted to obtain a pressure signal within the accommodation cavity (specifically, the gas phase space).

[0117] The control component 6 is configured to control the third valve 42 to increase its opening or control the drive component 4 to increase the flow rate of the coolant 10 flowing into the accommodating chamber, or control the opening of the first valve 35 to decrease, so as to reduce the pressure in the accommodating chamber when the pressure signal is lower than the preset pressure range and the phase change signal is higher than the preset range value, so as to maintain the pressure in the accommodating chamber within the preset pressure range.

[0118] In some exemplary embodiments, the pressure sensor 9 may be wired or wireless. For example, the pressure sensor 9 may be a pressure sensor based on tribo-nanoelectric power generation technology.

[0119] The control component 6 performs corresponding regulation by comparing the actual pressure signal P1 of the gas phase space with the size of the preset pressure range P0.

[0120] When the pressure signal P1 is within the preset pressure range P0 , the pressure of the gas phase space is normal.

[0121] When P1<P0, it means that the working pressure of the gas phase space is relatively small. The control component 6 can replenish liquid by controlling the rotation speed of the circulation pump 41 and increasing the opening of the third valve 42, or reduce the opening of the first valve 35 to reduce steam outflow, thereby increasing the working pressure of the gas phase space.

[0122] When P1>P0, it indicates that the working pressure of the gas phase space is relatively high. The control component 6 can exhaust gas by increasing the opening of the first valve 35 or opening the second valve 36 to reduce the working pressure of the gas phase space.

[0123] According to the embodiments of the present application, Figure 1As shown, the immersion liquid cooling device further includes a liquid level sensor 8, and the drive assembly 4 includes a third valve 42. The liquid level sensor 8 is adapted to detect the liquid level of the coolant 10. When the liquid level is below a target level, the control assembly 6 is configured to increase the opening of the third valve 42 or the speed of the circulation pump 41 to increase the flow rate of the coolant 10 into the receiving chamber, thereby maintaining the liquid level at the target level.

[0124] like Figure 1 As shown, there can be multiple liquid level sensors 8 , which are arranged at intervals along the height direction on the side wall of the box body 1 and are respectively used to detect the liquid level of the coolant 10 .

[0125] In some exemplary embodiments, the liquid level sensor 8 may be wired or wireless. For example, the pressure sensor 9 may be a liquid level sensor 8 based on tribo-nanoelectricity generation technology or a float switch.

[0126] As an example, Figure 1 As shown, the number of liquid level sensors 8 can be 3, respectively along different heights (i.e. Figure 1 H1, H2 and H3 in <H2

[0127] When the on-position signals at H1, H2 and H3 can all be monitored, it indicates that the liquid level of the coolant 10 is in a normal working state and no control adjustment is required.

[0128] If only the on-site signals at H2 and H3 are detected, the coolant 10 level is below the normal operating level and the heat-generating device 2 may not be fully immersed in the coolant 10. To ensure optimal operation of the immersion cooling system, refilling is necessary. Control assembly 6 increases the speed of circulating pump 41 and the opening of third valve 42 to allow coolant 10 in reservoir 33 to enter the accommodating chamber.

[0129] When only the on-site signal at H3 is detected, the coolant 10 level has fallen below the low level and cannot fully submerge the heat-generating device 2. This low level may cause the heat-generating device 2 to overheat or be damaged. When the control component 6 receives the low level signal, it increases the speed of the circulating pump 41 and the opening of the third valve 42 to replenish the coolant, while also triggering an alarm to prevent unnecessary losses.

[0130] ​According to the immersion liquid cooling device of the embodiment of the present application, in order to address the pain points of existing immersion liquid cooling system sensors, such as reliance on external power supply, complex wiring, high cost, slow response, and insufficient control accuracy, a sensor 5 based on friction nano-power generation technology is introduced to achieve self-powered, low-cost, high-sensitivity and wireless transmission of phase change sensing, thereby improving the heat transfer efficiency and reliability of the immersion liquid cooling device.

[0131] The above is a detailed introduction to an immersion liquid cooling device provided by the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core ideas of the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the principles of the present application, several improvements and modifications can be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. An immersion liquid cooling device, characterized in that: include: The box body has an accommodating cavity formed therein, and a coolant capable of generating a gas-liquid phase change is arranged in the accommodating cavity; a heat generating device disposed in the housing and at least partially immersed in the coolant, wherein the coolant undergoes a phase change to generate steam when the temperature of the heat generating device is higher than a preset temperature; A condensing assembly, disposed outside the box and adapted to condense the steam; a drive assembly adapted to circulate the condensed coolant into the accommodating cavity; A sensor is placed in the accommodating cavity and floats on the surface of the coolant, and is adapted to generate a phase change signal indicating the degree of phase change of the coolant. The sensor includes: case; a friction layer disposed at the bottom of the housing and forming a cavity with the housing, wherein the friction layer changes its contact area with the coolant in response to the coolant being in a phase change state, thereby generating charge transfer; a transmission unit adapted to transmit a current signal generated by the charge transfer; a circuit module, disposed in the cavity and electrically connected to the transmission unit, to generate the phase change signal for wireless transmission based on the current signal; The control component is adapted to reduce the pressure in the accommodating chamber through the driving component and / or the condensing component when the phase change signal is lower than a preset range value and the temperature of the heating device is higher than the preset temperature, thereby reducing the boiling point of the coolant, enhancing the phase change heat transfer, and reducing the temperature of the heating device.

2. The immersion liquid cooling device according to claim 1, characterized in that: The transmission unit includes: a first conductive layer, contacting the friction layer, disposed on a side of the friction layer facing away from the coolant, and electrically connected to the circuit module; a second conductive layer, spaced apart from the friction layer, disposed below the housing and electrically connected to the circuit module to cooperate with the first conductive layer to transmit the current signal to the circuit module; The second conductive layer is immersed in the coolant, and the liquid surface is in contact with the friction layer between the second conductive layer and the friction layer.

3. The immersion liquid cooling device according to claim 1, characterized in that: The transmission unit includes: a third conductive layer, contacting the friction layer and disposed on a side of the friction layer facing away from the coolant; The sensing layer is separated from the third conductive layer and is disposed in the cavity. The sensing layer is electrically connected to the circuit module to form a capacitor structure with the third conductive layer, senses the change in potential difference caused by charge transfer between the friction layer and the liquid surface, generates the current signal, and transmits the current signal to the circuit module.

4. The immersion liquid cooling device according to claim 1, characterized in that: The friction layer is configured as a downwardly convex arc structure so as to float on the liquid surface and respond to the fluctuation of the liquid surface in a phase change state and / or the bubbles generated by the phase change to change the contact area between the coolant and the friction layer to generate the charge transfer.

5. The immersion liquid cooling device according to any one of claims 1 to 4, characterized in that: The circuit module includes: Processing unit, including: a resistor, adapted to convert the current signal into a voltage signal; an amplifying unit, adapted to amplify the voltage signal to obtain an amplified signal; The modulator is adapted to modulate the amplified signal and transmit the phase change signal in the form of wireless electromagnetic waves.

6. The immersion liquid cooling device according to claim 5, characterized in that: The processing unit further includes: The filtering unit is arranged between the amplifying unit and the modulator, and is suitable for filtering the amplified signal.

7. The immersion liquid cooling device according to claim 5, characterized in that: The circuit module further includes: a rectifier bridge, adapted to rectify the current signal into a DC signal; The capacitor is electrically connected to the output end of the rectifier bridge and is suitable for filtering the DC signal and storing charge to power the processing unit.

8. The immersion liquid cooling device according to claim 1, characterized in that: The condensation assembly comprises: a first pipe, one end of which is in communication with the upper portion of the box; a condenser, connected to the other end of the first pipe, for condensing the steam from the accommodating chamber; The liquid storage tank is suitable for storing the coolant condensed by the condenser.

9. The immersion liquid cooling device according to claim 8, characterized in that: The condensation assembly further comprises: a first valve, disposed on the first pipeline; The control component is configured to control the opening of the first valve to increase when the phase change signal is lower than the preset range value, so that the steam located above the liquid surface is discharged from the accommodating chamber more quickly, thereby reducing the pressure in the accommodating chamber and thus reducing the boiling point of the coolant.

10. The immersion liquid cooling device according to claim 8 or 9, characterized in that: The condensing assembly further comprises: a second valve, provided on a second pipe located on the upper portion of the condenser and communicating with the outside; The control component is configured to control the second valve to open when the phase change signal is lower than the preset range value, so as to at least partially discharge the uncondensed gas in the condensation component and reduce the pressure in the accommodating chamber.

11. The immersion liquid cooling device according to claim 8, characterized in that: The condensation assembly further comprises: The heat exchanger is arranged in the liquid storage tank and is suitable for exchanging heat with the coolant in the liquid storage tank to reduce the temperature of the coolant.

12. The immersion liquid cooling device according to claim 9, characterized in that: The driving component circulates the condensed coolant into the accommodating cavity through the third pipe; The liquid outlet end of the third pipe is arranged at the lower part of the box body and is configured to face the heat-generating device to enhance the flow of the cooling liquid around the heat-generating device and strengthen the convection heat exchange.

13. The immersion liquid cooling device according to claim 12, characterized in that: Also includes: a liquid level sensor, adapted to obtain the liquid level of the coolant; The drive assembly includes: a circulation pump, disposed on the third pipeline; a third valve, arranged on the third pipeline; The control component is configured to increase the opening of the third valve and / or increase the speed of the circulation pump when the liquid level is lower than the target liquid level, so as to increase the flow rate of the coolant flowing into the accommodating chamber and keep the liquid level at the target liquid level.

14. The immersion liquid cooling device according to claim 13, characterized in that: Also includes: a pressure sensor, disposed above the liquid surface and adapted to obtain a pressure signal within the accommodating chamber; The control component is configured to control the third valve to increase its opening and / or control the circulation pump to increase the flow rate of the coolant flowing into the accommodating chamber, or control the opening of the first valve to decrease, when the pressure signal is lower than a preset pressure range and the phase change signal is higher than the preset range value.

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