An apparatus for improving the efficiency of use of target material in a plasma coating

Abstract

The application belongs to the technical field of material coating, and discloses a device for improving the use efficiency of target material in a plasma coating layer, which comprises a coating furnace serving as a support structure of the whole device, a cathode body connected with the coating furnace, a cooling structure connected with the coating furnace, a placing box fixed to the coating furnace, a copper plate connected with the placing box, target material connected with the placing box through the copper plate, a coil connected with the cathode body, and a multi-channel time sequence power switching controller connected with the coil. The multi-channel time sequence power switching controller is used for intermittently controlling power-off of the multiple coils, so that the ionization position can be flexibly changed, the limitation of fixed ionization position of the traditional device is broken, the evaporation surface area between the target material and the device is increased, the use area of the target material is increased, more target material surfaces are used for sputtering, and the "edge blind area" or "bottom blind area" that is not used is reduced.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of material coating, and particularly relates to a device for improving the use efficiency of target material in plasma coating. BACKGROUND

[0002] Plasma coating technology plays an important role in many industrial applications, especially in the fields of electronics, aerospace and automobiles, which forms a uniform coating on the substrate by transferring atoms or molecules of the target material (target material) to the substrate in a high-energy plasma environment, thereby improving the performance of the substrate.

[0003] Due to the shape of the target material and the shape of the single coil on the back, in the sputtering process, the atoms or molecules of the target material in some areas are sputtered in large quantities, while the sputtering in other areas does not occur, resulting in low utilization of the target material, thereby causing the problem of waste of the target material. SUMMARY

[0004] The application aims at the problem in the prior art that in the sputtering process, the atoms or molecules of the target material in some areas are sputtered in large quantities, while the sputtering in other areas does not occur, resulting in low utilization of the target material, thereby causing the problem of waste of the target material, and proposes the following technical scheme:

[0005] A device for improving the use efficiency of target material in plasma coating, comprising: a coating furnace as a support structure of the whole device:

[0006] A cathode body connected to the coating furnace;

[0007] A cooling structure connected to the coating furnace;

[0008] A placing box fixed to the coating furnace;

[0009] A copper plate connected to the placing box;

[0010] A target material connected to the placing box through the copper plate;

[0011] A coil connected to the cathode body;

[0012] A multi-channel time sequence power switching controller connected to the coil;

[0013] An AC power source connected to the multi-channel time sequence power switching controller, which intermittently powers on / off the multiple coils through the multi-channel time sequence power switching controller;

[0014] The shielding and heat dissipation structure comprises a mounting plate, an outer shielding cover, an inner shielding cover, a spoiler structure and a driving structure;

[0015] The mounting plate is connected to the coil, the outer shield is connected to the mounting plate, the inner shield is connected to the outer shield, the turbulence structure is connected to the inner shield, and the driving structure is connected to the mounting plate. The driving structure drives the inner shield to rotate and makes the gas flow between the inner shield and the coil through the turbulence structure.

[0016] As a preferred embodiment of the above technical solution, the turbulence structure comprises:

[0017] A rotating shaft is connected to the inner shield.

[0018] A driving wheel is connected to the rotating shaft.

[0019] A fan blade is connected to the outside of the rotating shaft and is symmetrically arranged on both sides of the driving wheel. The driving wheel drives the fan blade to rotate through the rotating shaft.

[0020] As a preferred embodiment of the above technical solution, the fan blade is symmetrically arranged along the center line of the driving wheel, and the blade directions of the fan blades on both sides of the driving wheel are opposite.

[0021] As a preferred embodiment of the above technical solution, the driving structure comprises:

[0022] A driving member is connected to the mounting plate.

[0023] A magnetic member is connected to the driving member.

[0024] A connecting plate is connected to the magnetic member.

[0025] A round rod is connected to the connecting plate.

[0026] A rotating block is connected to the round rod.

[0027] The driving member drives the connecting plate to displace through the magnetic member, and the connecting plate drives the rotating block to displace through the round rod.

[0028] As a preferred embodiment of the above technical solution, the driving structure further comprises:

[0029] A reset member is connected to the connecting plate and the mounting plate at both ends, respectively.

[0030] A mounting cover is connected to the mounting plate, and the driving member is connected to the mounting plate through the mounting cover.

[0031] As a preferred embodiment of the above technical solution, the magnetic member is a permanent magnet, the driving member is an electromagnet, and the on-off of the electromagnet realizes the reciprocating displacement of the connecting plate.

[0032] As the preferred technical scheme of the above, the cooling structure comprises a cooling liquid circulating pipeline, a heat dissipation fin and a box body, the cooling liquid circulating pipeline and the heat dissipation fin are located inside the box body, the box body is fixed with the coating furnace, the cooling liquid circulating pipeline is S-shaped, the heat dissipation fin is arranged outside the cooling liquid circulating pipeline, and the cooling liquid circulating pipeline is provided with a connecting joint penetrating through the coating furnace at each end.

[0033] As the preferred technical scheme of the above, the rotating block is internally provided with an inclined groove, and the round rod is located inside the inclined groove, and the round rod drives the rotating block to rotate when being lifted through the inclined groove.

[0034] As the preferred technical scheme of the above, the mounting plate is composed of a concave shielding plate and a convex cover plate, the concave shielding plate and the convex cover plate are fixed through screws, and the driving structure is located between the concave shielding plate and the convex cover plate.

[0035] The beneficial effects of the present application are:

[0036] (1) The intermittent power-off control of the plurality of coils by the multi-channel time sequence power switching controller can flexibly change the ionization position, break the limitation of the fixed ionization position of the traditional equipment, increase the evaporation surface area between the target material and the target material, thereby increasing the use area of the target material, making more target material surfaces participate in sputtering, and reducing the "edge blind area" or "bottom blind area" that is not utilized.

[0037] (2) Compared with the existing single electromagnetic shielding area, the device can more comprehensively and effectively shield electromagnetic interference, and through the heat dissipation structure driven by the rotation of the inner shielding cover, synchronous heat dissipation is realized. The existing electromagnetic shielding area often only focuses on the shielding function and ignores the influence of the heat generated during the operation of the device on the performance, resulting in performance degradation or even failure of the device due to overheating after long-time operation. However, the present device can shield electromagnetic interference and dissipate heat generated by the coil in time, ensuring stable operation of the device and prolonging the service life of the device. BRIEF DESCRIPTION OF DRAWINGS

[0038] Figure 1 A structure schematic diagram of a device for improving the use efficiency of target material in plasma coating in Example 1 is shown.

[0039] Figure 2 A mounting structure schematic diagram of a multi-channel time sequence power switching controller in Example 1 is shown.

[0040] Figure 3 A mounting structure schematic diagram of a coil in Example 1 is shown.

[0041] Figure 4 A mounting structure schematic diagram of a rotating shaft in Example 1 is shown.

[0042] Figure 5 A sectional view of the outer shield in Example 1 is shown.

[0043] Figure 6 A schematic diagram of the mounting structure of the inner shield in Example 1 is shown.

[0044] Figure 7 A schematic diagram of the mounting structure of the inner shield in Example 1 is shown. Figure 6 A schematic diagram of the mounting structure of the inner shield in Example 1 is shown.

[0045] Figure 8 A schematic diagram of the mounting structure of the inner shield in Example 1 is shown.

[0046] In the figure: 1, coating furnace; 2, cathode body; 3, cooling structure; 4, placing box; 5, copper plate; 6, target material; 7, coil; 8, protective cover; 9, multi-channel time sequence power supply switching controller; 10, AC power supply; 111, mounting plate; 112, outer shield; 113, inner shield; 114, rotating shaft; 115, driving wheel; 116, fan blade; 117, groove; 118, mounting cover; 119, driving member; 120, magnetic member; 121, connecting plate; 122, reset member; 123, round rod; 124, rotating block. DETAILED DESCRIPTION

[0047] In order to make the purpose, technical scheme and advantages of the embodiments of the present application more clear, the technical scheme of the present application will be described clearly and completely below in conjunction with the embodiments.

[0048] Example 1

[0049] The present application provides a device for improving the use efficiency of target material in plasma coating, such as Figures 1 to 8As shown, it comprises: a coating furnace 1, a cathode body 2, a cooling structure 3, a placing box 4, a copper plate 5, a target material 6, a coil 7, a multi-channel time sequence power supply switching controller 9, an AC power supply 10 and a shielding heat dissipation structure; the coating furnace 1 is a support structure of the whole device: the cathode body 2 is connected with the coating furnace 1; the cooling structure 3 is connected with the coating furnace 1; the placing box 4 is fixed to the coating furnace 1; the copper plate 5 is connected with the placing box 4; the target material 6 is connected with the placing box 4 through the copper plate 5; the coil 7 is connected with the cathode body 2; the multi-channel time sequence power supply switching controller 9 is connected with the coil 7; the AC power supply 10 is connected with the multi-channel time sequence power supply switching controller 9, and the AC power supply 10 makes the multiple coils 7 intermittent power on / off through the multi-channel time sequence power supply switching controller 9; the shielding heat dissipation structure comprises: a mounting plate 111, an outer shielding cover 112, an inner shielding cover 113, a spoiler structure and a driving structure; the mounting plate 111 is connected with the coil 7, the outer shielding cover 112 is connected with the mounting plate 111, the inner shielding cover 113 is connected with the outer shielding cover 112, the spoiler structure is connected with the inner shielding cover 113, and the driving structure is connected with the mounting plate 111; the driving structure drives the inner shielding cover 113 to rotate and makes the gas flow between the inner shielding cover 113 and the coil 7 through the spoiler structure.

[0050] Due to the shape of the target material 6 and the shape of the single coil 7, in the sputtering process, the atoms or molecules of the target material 6 in some areas are sputtered in large quantities, while in other areas, no sputtering occurs, resulting in low utilization of the target material 6, thereby causing the problem of waste of the target material 6 (the utilization rate of the target material 6 of a single coil 7 is 7%-12%), therefore, by arranging multiple coils 7, the evaporation surface area between the multiple coils 7 and the target material 6 is increased, thereby increasing the use area of the target material 6, so that more surface of the target material 6 participates in sputtering, reducing the "edge blind area" or "bottom blind area" that is not utilized (the utilization rate of the target material 6 of multiple coils 7 is 15%-18%), and because multiple coils 7 are prone to cause ionization of arc outside the target material 6 when used at the same time, therefore, the AC power supply 10 makes the multiple coils 7 intermittent power off in sequence through the multi-channel time sequence power supply switching controller 9 (for example, the first coil 7 is powered on, the remaining coils 7 are powered off, then the second coil 7 is powered on, the remaining coils 7 are powered off, and so on), so that the ionization position is irregular, thereby preventing ionization of arc outside the target material 6, and being able to induce large-area uniform ionization.

[0051] In use, the target 6 is fixed in the placing box 4 and corresponds to the copper plate 5, then the inside of the coating furnace 1 is vacuumized to remove impurity gases such as air and create a high vacuum environment to avoid gas molecules interfering with the sputtering process and the film quality, then an appropriate amount of inert gas such as argon is introduced into the coating furnace 1 as working gas to provide necessary conditions for the sputtering process, the AC power supply 10 supplies power to the coil 7 through the multi-channel time sequence power switching controller 9, the coil 7 generates a magnetic field, under the principle of magnetron sputtering, the magnetic field and the electric field interact to constrain the electron motion trajectory, making the electron make spiral motion near the surface of the target 6, increasing the collision probability of the electron and the argon atom, the collision of the electron and the argon atom ionizes the argon atom to produce argon ions Ar + and secondary electrons, the argon ions are accelerated under the action of the electric field and bombard the surface of the target 6 at high speed, due to momentum transfer, the atoms or molecules on the surface of the target 6 obtain energy and are sputtered from the surface of the target 6 to become sputtered particles, the sputtered target 6 atoms or molecules move in all directions in the vacuum environment, some particles will reach the surface of the workpiece to be coated and deposit, condense and crystallize on the surface of the workpiece to gradually form the required coating. In the magnetron sputtering device, the target 6 is connected with the cathode body 2 and together constitutes a cathode, which is the core area of the entire sputtering process. The cathode body 2 conducts current to establish an electric field around the target 6, which cooperates with the magnetic field generated by the coil 7 to realize the constraint and acceleration of charged particles such as electrons and argon ions. Under the action of the electric field, the copper plate 5 can ensure stable conduction of current in the entire cathode system, reduce resistance loss, maintain the stability of the electric field, provide a good electrical environment for the sputtering process, and in the sputtering process, the heat generated by the target 6 can be transferred out to play the role of auxiliary heat dissipation. The cooling structure 3 removes the heat generated by the target 6 in the sputtering process through the circulating cooling water, so that the temperature of the target 6 is maintained within a reasonable range. When the predetermined coating thickness or process time is reached, the power supply to the coil 7 is stopped, the working gas supply is turned off, the pressure in the coating furnace 1 is restored to normal pressure, the workpiece is taken out, and the coating preparation process is completed.

[0052] When the coil 7 is powered, an electromagnetic field is generated, and the electromagnetic field needs to be shielded. After shielding by the shielding cover, the shielding cover blocks the heat dissipation channel, making it difficult for the coil 7 to dissipate heat, and long-term operation can cause the temperature of the coil 7 to be too high. This not only reduces the performance of the coil 7 and shortens the service life, but also can cause damage to the insulation layer, short circuit and other faults due to overheating, affecting the normal operation of the entire sputtering device, making the sputtering process stability worse, affecting the uniformity of the target material 6 sputtering, and further reducing product quality. Therefore, a shielding layer is formed between the mounting plate 111, the outer shielding cover 112 and the inner shielding cover 113, and during power-on, the driving structure is powered on, the driving structure drives the inner shielding cover 113 to rotate when powered on, the holes on the outer side of the inner shielding cover 113 and the outer shielding cover 112 correspond, causing external gas to enter the outer side of the coil 7, and the inner shielding cover 113 drives the turbulence structure to run when rotating, the turbulence structure makes the gas outside the coil 7 agitated, causing the gas to form convection, not only accelerating the heat dissipation process, but also exchanging internal and external gases.

[0053] Specifically, the coating furnace 1 is internally provided with a cathode body 2, and the coating furnace 1 is provided at one end with a cooling structure 3, which comprises a cooling liquid circulation pipeline, heat dissipation fins and a box body. The cooling liquid circulation pipeline and the heat dissipation fins are located inside the box body, and the box body is fixed to the coating furnace 1. The cooling liquid circulation pipeline is S-shaped and located inside the box body, and the heat dissipation fins are arranged outside the cooling liquid circulation pipeline. The two ends of the cooling liquid circulation pipeline are respectively provided with connecting joints penetrating through the coating furnace 1, which are used to connect with external water sources, so that water flows along the inside of the cooling liquid circulation pipeline. The coating furnace 1 is fixedly provided at one end with a placing box 4, and the placing box 4 is internally provided with a copper plate 5 which is clamped and installed. One end of the copper plate 5 is clamped and installed with a target material 6. The coating furnace 1 is provided at the other end with a protective cover 8, and the protective cover 8 is internally provided with a plurality of coils 7 (the number of coils 7 in this application is four). The protective cover 8 is provided at the end away from the coating furnace 1 with a multi-channel time sequence power supply switching controller 9, which is connected with the coils 7 through wires. One end of the multi-channel time sequence power supply switching controller 9 is connected with an AC power supply 10 through wires. The protective cover 8 is internally provided at the position of one end of the coil 7 with a mounting plate 111. One end surface of the mounting plate 111 is provided at the position outside the coil 7 with an outer shielding cover 112. One end surface of the mounting plate 111 is rotatably connected with an inner shielding cover 113 at the position inside the outer shielding cover 112. One end surface of the inner shielding cover 113 is welded with a protruding ring. A sliding groove is formed in the mounting plate 111 at the position outside the protruding ring, and the protruding ring is located inside the sliding groove. The inner shielding cover 113 is concave in shape. The inner shielding cover 113 is internally provided with a turbulence structure. The mounting plate 111 is internally provided with a driving structure. A plurality of holes are formed in the inner shielding cover 112 and the outer shielding cover 113 for the flow of gas. The maximum outer diameter of the mounting plate 111 is greater than the maximum outer diameter of the outer shielding cover 112 for the flow of gas.

[0054] As shown in Figures 5 to 7 The driving structure comprises a mounting cover 118, a driving member 119, a magnetic member 120, a connecting plate 121, a reset member 122, a round rod 123 and a rotating block 124; the driving member 119 is connected to the mounting plate 111; the magnetic member 120 is connected to the driving member 119; the connecting plate 121 is connected to the magnetic member 120; the round rod 123 is connected to the connecting plate 121; the rotating block 124 is connected to the round rod 123; the driving member 119 drives the connecting plate 121 to displace through the magnetic member 120, and the connecting plate 121 drives the rotating block 124 to displace through the round rod 123; the reset member 122 has two ends respectively connected to the connecting plate 121 and the mounting plate 111; the mounting cover 118 is connected to the mounting plate 111, and the driving member 119 is connected through the mounting cover 118 and the mounting plate 111.

[0055] The inner shielding cover 113 is driven to rotate by the driving structure, but needs to be reset after rotating. Therefore, the reset member 122 is arranged to reset the inner shielding cover 113 through the action of the reset member 122, so that the inner shielding cover 113 and the outer shielding cover 112 are in staggered opening and closing or closing state, thereby making the inner shielding cover 113 and the outer shielding cover 112 close to shield the magnetic field outside the coil 7 when the coil 7 is powered on, and making the inner shielding cover 113 and the outer shielding cover 112 open to make the external gas enter the outside of the coil 7 when the coil 7 is powered off.

[0056] In use, the multi-channel time sequence power switching controller 9 supplies power to the driving member 119 to make the driving member 119 generate magnetism. When the driving member 119 generates magnetism, the opposite poles of the relative surface of the magnetic member 120 are opposite (N / N or S / S). At this time, the same polarity repulsion drives the magnetic member 120 to move. When the magnetic member 120 moves, it drives the connecting plate 121 to move. When the connecting plate 121 moves, it drives the round rod 123 to move. When the round rod 123 moves, it drives the rotating block 124 to move through the inclined slot. Since the rotating block 124 is connected to the inner shielding cover 113, at this time, the inner shielding cover 113 and the mounting plate 111 are rotationally connected, so that when the round rod 123 rises along the inside of the inclined slot, the inner shielding cover 113 is driven to rotate through the rotating block 124, so that the inner shielding cover 113 and the hole of the outer shielding cover 112 coincide, and at the same time, the connecting plate 121 drives the reset member 122 to stretch.

[0057] When powered off, the reset member 122 resets, and the reset member 122 drives the connecting plate 121 to reset. At this time, the above process is reversed, so that the holes of the inner shielding cover 113 and the outer shielding cover 112 are staggered, and then the external gas enters the outside of the coil 7, thereby achieving the purpose of heat dissipation of the coil 7.

[0058] Specifically, the mounting plate 111 is combined by a concave shielding plate and a convex cover plate, the concave shielding plate and the convex cover plate are fixed by screws, the driving structure is located between the concave shielding plate and the convex cover plate, the top end of the convex cover plate of the mounting plate 111 is welded with a mounting cover 118, the mounting cover 118 is fixedly installed with a driving piece 119 inside, a magnetic piece 120 is slidingly connected to the top end position of the driving piece 119 inside the mounting cover 118, a connecting plate 121 is clamped and installed at the top end of the convex cover plate and the bottom of the outer surface of the connecting plate 121, four reset pieces 122 are clamped and installed between the connecting plate 121 and the top end of the convex cover plate, a plurality of round rods 123 are embedded and installed on the outer side of the connecting plate 121, a rotating block 124 is sleeved on the outer side of the round rod 123, an inclined groove is formed in the rotating block 124, and the round rod 123 is located in the inclined groove. When the round rod 123 rises and falls, the rotating block 124 is driven to rotate through the inclined groove, and a groove 117 is formed in the mounting plate 111 at a position corresponding to the outer side of the round rod 123. The groove 117 limits the round rod 123, so that the round rod 123 can only move up and down.

[0059] In this application, the magnetic piece 120 is a permanent magnet, the driving piece 119 is an electromagnet, the on-off of the electromagnet realizes the reciprocating displacement of the connecting plate 121, the reset piece 122 belongs to an elastic expansion structure, specifically to a spring expansion rod and externally provided with an electromagnetic shielding coating, and the electromagnetic shielding coating specifically belongs to a powder electromagnetic shielding coating.

[0060] As shown in the figure, Figures 4 to 8 The disturbance structure includes a rotating shaft 114, a driving wheel 115 and a fan blade 116; the rotating shaft 114 is connected to the inner shielding cover 113; the driving wheel 115 is connected to the rotating shaft 114; the fan blade 116 is connected to the outer side of the rotating shaft 114 and is symmetrically arranged along the two sides of the driving wheel 115, and the driving wheel 115 drives the fan blade 116 to rotate through the rotating shaft 114.

[0061] When in use, since the inner shielding cover 113 drives the rotating shaft 114 to move when rotating, at this time the driving wheel 115 and the outer side of the coil 7 are in close contact, and the driving wheel 115 drives the rotating shaft 114 to rotate through the friction force, and the rotating shaft 114 drives the fan blade 116 to rotate when rotating. Since the blade directions of the fan blades 116 on the two sides of the driving wheel 115 are opposite, although the rotating directions of the fan blades 116 on the two sides are the same (both clockwise), since the bending directions of the blades are opposite, the pushing directions of the fluid by the fan blades 116 on the two sides are also opposite, and the fan blades 116 on the two sides will generate fluid acting forces in opposite directions (relative flow / flow in opposite directions) when rotating in the same direction, thereby accelerating the heat dissipation of the outer side of the coil 7.

[0062] Specifically, the rotating shaft 114 is rotatably connected to the inside of the inner shield cover 113 through a bearing, a driving wheel 115 is installed on the middle part of the outer surface of the rotating shaft 114 through key clamping, and the fan blades 116 are symmetrically installed on both sides of the outer surface of the rotating shaft 114. The fan blades 116 are symmetrically arranged along the center line of the driving wheel 115, and the blade directions of the fan blades 116 on both sides of the driving wheel 115 are opposite, so that the gas flows to each other or flows in opposite directions.

[0063] Working principle: In the ion coating process, the working process of the target material utilization efficiency device is as follows: first, the target material 6 is firmly installed and fixed in the placing box 4, and is accurately corresponded with the copper plate 5, then the inside of the coating furnace 1 is subjected to vacuumizing treatment to remove impurity gases such as air, so as to create a high vacuum environment, avoid the interference of gas molecules to the sputtering process, and ensure that the film quality is not affected. Next, a proper amount of inert gas (such as argon) is introduced into the coating furnace 1 as working gas to provide necessary conditions for the sputtering process;

[0064] At this time, the AC power supply 10 supplies power to the coil 7 through the multi-channel time sequence power switching controller 9, and the coil 7 generates a magnetic field. Under the principle of magnetron sputtering, the magnetic field and the electric field interact with each other, effectively restricting the electron motion trajectory, so that the electron makes spiral motion near the surface of the target material 6, significantly increasing the collision probability of the electron and the argon atom. After the electron collides with the argon atom, the argon atom is ionized to generate argon ions Ar + and secondary electrons. The argon ions are accelerated under the action of the electric field and bombard the surface of the target material 6 at a high speed. Through momentum transfer, the atoms or molecules on the surface of the target material 6 obtain enough energy and sputter out of the surface of the target material 6 to become sputtered particles. The sputtered particles move in all directions in the vacuum environment, and part of the particles will reach the surface of the workpiece to be coated and deposit, condense and crystallize on the surface of the workpiece to gradually form the required coating;

[0065] During the power-on process, the multi-channel time sequence power switching controller 9 supplies power to the driving part 119, so that the driving part 119 generates magnetism. When the driving part 119 generates magnetism, the opposite faces of the driving part 119 and the magnetic part 120 have the same magnetic pole (N / N or S / S), and under the action of the same repulsive force, the driving magnetic part 120 moves. When the magnetic part 120 moves, the connecting plate 121 moves, and when the connecting plate 121 moves, the round rod 123 moves. When the round rod 123 moves, the rotating block 124 moves through the inclined slot. Since the rotating block 124 is connected to the inner shield cover 113, and the inner shield cover 113 and the mounting plate 111 are rotatably connected, when the round rod 123 rises along the inside of the inclined slot, the inner shield cover 113 is rotated through the rotating block 124, so that the inner shield cover 113 and the hole of the outer shield cover 112 coincide to form a shielding structure;

[0066] In addition, when the inner shielding cover 113 rotates, the rotating shaft 114 moves, at this time, the driving wheel 115 is attached to the outer side of the coil 7, through the friction force, the driving wheel 115 drives the rotating shaft 114 to rotate, when the rotating shaft 114 rotates, the fan blade 116 rotates, because the blade direction of the fan blade 116 on both sides of the driving wheel 115 is opposite, although the rotating direction of the fan blade 116 on both sides is the same (both clockwise), but because the blade bending direction is opposite, the pushing direction of the fluid by the fan blade 116 on both sides is also opposite, so that the fan blade 116 on both sides generates opposite fluid action force (relative flow / opposite flow) when rotating in the same direction, thereby accelerating the heat dissipation of the outer side of the coil 7, compared with the existing single electromagnetic shielding area, not only can more comprehensively and effectively shield electromagnetic interference, but also through the heat dissipation structure driven by the inner shielding cover 113 when rotating, synchronous heat dissipation is realized, the existing electromagnetic shielding area often only focuses on the shielding function, ignores the influence of heat generated during the operation of the device on the performance, resulting in performance decline or even failure of the device due to overheating after long time operation, while the device shields electromagnetic interference, dissipates the heat generated by the coil 7 in time, ensures the stable operation of the device, and prolongs the service life of the device;

[0067] In view of the fact that the number of coils 7 is set to be multiple, the AC power supply 10 controls the multiple coils 7 to be intermittently powered off in turn through the multi-channel time sequence power switching controller 9, for example, the first coil 7 is powered on, and the remaining coils 7 are powered off, then the second coil 7 is powered on, and the remaining coils 7 are powered off, and so on, such operation can make the ionization position irregular, thereby effectively preventing the arc from generating ions outside the target material 6, and can induce large-area uniform ionization, in the process of powering on each coil 7, the corresponding driving part 119 is connected to the power supply, through the intermittent power-off control of the multiple coils 7 by the multi-channel time sequence power switching controller 9, the ionization position can be flexibly changed, breaking the limitation of fixed ionization position of the traditional device, and increasing the evaporation surface area between the target material 6, thereby increasing the use area of the target material 6, so that more surface of the target material 6 participates in sputtering, reducing the "edge blind area" or "bottom blind area" that is not utilized.

[0068] The above embodiments are only used to illustrate the technical solutions of the present application, but not limit it.

Claims

1. An apparatus for improving the utilization efficiency of a target material in a plasma coating, characterized by The application relates to a coating furnace, which comprises the following components: a coating furnace (1) as a supporting structure of the whole device; a cathode body (2) connected to the coating furnace (1); a cooling structure (3) connected to the coating furnace (1); a placing box (4) fixed to the coating furnace (1); a copper plate (5) connected to the placing box (4); a target material (6) connected to the placing box (4) through the copper plate (5); a coil (7) connected to the cathode body (2); a multi-channel time sequence power switch controller (9) connected to the coil (7); an AC power source (10) connected to the multi-channel time sequence power switch controller (9), which intermittently powers on / off the multiple coils (7) through the multi-channel time sequence power switch controller (9); a shielding and heat-dissipating structure, which comprises a mounting plate (111), an outer shielding cover (112), an inner shielding cover (113), a turbulence structure and a driving structure; the mounting plate (111) is connected to the coil (7), the outer shielding cover (112) is connected to the mounting plate (111), the inner shielding cover (113) is connected to the outer shielding cover (112), the turbulence structure is connected to the inner shielding cover (113), and the driving structure is connected to the mounting plate (111) and drives the inner shielding cover (113) to rotate and makes the gas flow between the inner shielding cover (113) and the coil (7) through the turbulence structure.

2. The apparatus for improving the utilization efficiency of a target material in a plasma coating layer according to claim 1, characterized in that, The turbulence structure comprises: a rotating shaft (114) connected to the inner shielding cover (113); a driving wheel (115) connected to the rotating shaft (114); a fan blade (116) connected to the outer side of the rotating shaft (114) and symmetrically arranged along the two sides of the driving wheel (115), wherein the driving wheel (115) drives the fan blade (116) to rotate through the rotating shaft (114).

3. The apparatus for improving the utilization efficiency of a target material in a plasma coating layer according to claim 2, characterized in that, The fan blade (116) is symmetrically arranged along the center line of the driving wheel (115), and the blade directions of the fan blades (116) located on the two sides of the driving wheel (115) are opposite.

4. The apparatus for improving the utilization efficiency of a target material in a plasma coating layer according to claim 1, characterized in that, The driving structure comprises: a driving member (119) connected to the mounting plate (111); a magnetic member (120) connected to the driving member (119); a connecting plate (121) connected to the magnetic member (120); a round rod (123) connected to the connecting plate (121); a rotating block (124) connected to the round rod (123); the driving member (119) drives the connecting plate (121) to displace through the magnetic member (120), and the connecting plate (121) drives the rotating block (124) to displace through the round rod (123).

5. The apparatus for improving the utilization efficiency of a target material in a plasma coating layer according to claim 4, characterized in that, The driving structure further comprises: a reset member (122) with two ends respectively connected to the connecting plate (121) and the mounting plate (111); a mounting cover (118) connected to the mounting plate (111), and the driving member (119) is connected to the mounting plate (111) through the mounting cover (118).

6. The apparatus for improving the utilization efficiency of a target material in a plasma coating layer according to claim 4, characterized in that, The magnetic piece (120) is a permanent magnet, the driving piece (119) is an electromagnet, and the on-off electricity of the electromagnet realizes the reciprocating displacement of the connecting plate (121).

7. The apparatus for improving the utilization efficiency of a target material in a plasma coating layer according to claim 1, characterized in that, The cooling structure (3) comprises cooling liquid circulation pipelines, heat dissipation fins and a box body, the cooling liquid circulation pipelines and the heat dissipation fins are located inside the box body, the box body is fixed with the coating furnace (1), the cooling liquid circulation pipelines are S-shaped, the heat dissipation fins are arranged outside the cooling liquid circulation pipelines, and the two ends of the cooling liquid circulation pipelines are respectively provided with connecting joints penetrating through the coating furnace (1).

8. The apparatus for improving the utilization efficiency of a target material in a plasma coating layer according to claim 5, wherein, The rotating block (124) is internally provided with an inclined groove, and the round rod (123) is located inside the inclined groove; when the round rod (123) is lifted and lowered, the rotating block (124) is driven to rotate through the inclined groove.

9. The apparatus for improving the utilization efficiency of a target material in a plasma coating layer according to claim 1, wherein, The mounting plate (111) is composed of a concave shielding plate and a convex cover plate, the concave shielding plate and the convex cover plate are fixed through screws, and the driving structure is located between the concave shielding plate and the convex cover plate.

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