Device for improving infrared radiation detection precision of target to be detected

Abstract

The invention provides a device for improving infrared radiation detection precision of a to-be-detected target. The device comprises a heating furnace for accommodating and heating the to-be-detected target; the high-temperature background radiation shielding piece is arranged on the inner side of an observation window of the heating furnace and is used for installing and positioning a to-be-detected target and shielding high-temperature background radiation around the to-be-detected target; the infrared detector is used for receiving infrared radiation emitted by the target to be detected; the supporting device is used for fixing the infrared detector; the computer is used for receiving a detection result of the infrared detector and displaying the infrared radiation characteristics of the target to be detected in an infrared image form; the console is used for uniformly controlling the heating furnace, the infrared detector and the supporting device. By arranging the high-temperature background radiation shielding piece, positioning supporting of the to-be-detected target and isolation of a high-temperature background heat source can be achieved at the same time, and therefore the detection precision of infrared radiation of the to-be-detected target is effectively improved.

Description

Technical Field

[0001] The present invention relates to the field of infrared detection technology, and in particular to a device for improving the infrared radiation detection accuracy of a target to be detected. Background Art

[0002] Accurately measuring a target's infrared radiation characteristics is crucial in many fields, such as aviation, industrial production, healthcare, target detection, and scientific research. Traditional non-contact infrared radiation detection methods typically use infrared detectors to detect the infrared radiation emitted by a target and display the target's infrared radiation characteristics in the form of an infrared image. However, this detection method suffers from the problem of high-temperature background radiation during the detection process, which affects the accuracy of the target's infrared radiation characteristics.

[0003] Therefore, a device is needed to improve the infrared radiation detection accuracy of a target to be detected, so as to solve the problem of high temperature background radiation. Summary of the Invention

[0004] The present invention provides a device for improving the infrared radiation detection accuracy of a target to be detected, aiming to solve the problem of high-temperature background radiation existing in traditional non-contact infrared radiation detection methods.

[0005] To achieve the above-mentioned objectives, the present invention discloses a device for improving the accuracy of infrared radiation detection of a target to be detected, comprising: a heating furnace, which is used to accommodate and heat the target to be detected; a high-temperature background radiation shielding member, which is arranged on the inner side of an observation window of the heating furnace for installing and positioning the target to be detected and shielding the high-temperature background radiation around the target to be detected; an infrared detector, which is used to receive infrared radiation emitted by the target to be detected; a supporting device, which is used to fix the infrared detector; a computer, which is used to receive the detection results of the infrared detector and display the infrared radiation characteristics of the target to be detected in the form of an infrared image; and a control console, which is used to uniformly control the heating furnace, the infrared detector and the supporting device.

[0006] In some embodiments, the high-temperature background radiation shielding member includes: a shielding member body; a mounting frame, the mounting frame being arranged around the shielding member body; at least one mounting hole for the target to be detected, the high-temperature heat source in the heating furnace heats the target to be detected through the at least one mounting hole for the target to be detected, the size and shape of the at least one mounting hole for the target to be detected being smaller than the target to be detected; and a positioning contour, the positioning contour being arranged at the edge of the at least one mounting hole for the target to be detected, the size and shape of the at least one mounting hole for the target to be detected matching the contour of the target to be detected, so as to be used for installing and positioning the target to be detected.

[0007] In some embodiments, the mounting frame has a width of 10-20 mm and a thickness of 40-100 mm.

[0008] In some embodiments, the depth of the at least one target installation hole to be detected is 10-30 mm.

[0009] In some embodiments, the size of the mounting hole of the target to be detected is 3-5 mm smaller than the outline of the target to be detected.

[0010] In some embodiments, the supporting device is a height-adjustable tripod.

[0011] In some embodiments, the supporting device is a three-axis gantry, and one or more infrared detectors that can move in one or more directions of the X-axis, Y-axis, and Z-axis are installed on the three-axis gantry.

[0012] In some embodiments, the three-axis gantry includes: one or more X-axis guide rails; one or more Y-axis guide rails; one or more Z-axis guide rails; one or more X-axis displacement motors, one or more X-axis displacement motors are installed on each of the X-axis guide rails, and each X-axis displacement motor is used to drive one of the infrared detectors to move along the Z-axis guide rail; one or more Y-axis displacement motors, the Y-axis displacement motor is used to drive the Z-axis guide rail to move along the Y-axis guide rail; and one or more Z-axis displacement motors, the Z-axis displacement motor is used to drive the X-axis guide rail to move along the Z-axis guide rail.

[0013] To sum up, the present invention can at least achieve the following beneficial effects: by setting a high-temperature background radiation shielding member, it is possible to simultaneously achieve positioning support for the target to be detected and isolation of the high-temperature background heat source, thereby effectively improving the detection accuracy of infrared radiation of the target to be detected; by setting a support device in the form of a height-adjustable tripod or a three-axis gantry, the infrared detector can be made to face the corresponding target to be detected, thereby avoiding the influence of the incident angle of infrared rays relative to the infrared detector. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0015] Figure 1 This is a schematic diagram of the overall structure of some embodiments of this specification.

[0016] Figure 2It is a front view of a high-temperature background radiation shielding member in some embodiments of this specification.

[0017] Figure 3 is a cross-sectional view of a high-temperature background radiation shielding member in some embodiments of the present specification.

[0018] Figure 4 It is a front view of a high-temperature background radiation shielding member in some embodiments of this specification.

[0019] Figure 5 It is a front view of a high-temperature background radiation shielding member in some embodiments of this specification.

[0020] Figure 6 It is a schematic structural diagram of the supporting device in some embodiments of this specification.

[0021] Figure 7 This is a schematic diagram of the overall structure of some embodiments of this specification.

[0022] Figure 8 is a schematic flow chart of a method 800 for detecting infrared emissivity of an object in some embodiments of this specification.

[0023] Figure numerals: 1. Heating furnace; 2. High-temperature background radiation shielding member; 3. Target to be detected; 4. Infrared detector; 5. Support device; 6. Control console; 7. Computer; 8. Signal processing system; 9. Temperature acquisition system; 21. Mounting frame; 22. Shielding member body; 23. Positioning contour; 24. Mounting hole for target to be detected; 51. X-axis guide rail; 52. Y-axis guide rail; 53. Z-axis guide rail; 54. X-axis displacement motor; 55. Y-axis displacement motor; 56. Z-axis displacement motor. DETAILED DESCRIPTION

[0024] Hereinafter, only certain exemplary embodiments are briefly described. As will be appreciated by those skilled in the art, the described embodiments may be modified in various ways without departing from the spirit or scope of the embodiments of the present invention. Therefore, the drawings and description are to be regarded as illustrative in nature and not restrictive.

[0025] The disclosure below provides many different embodiments or examples for implementing different structures of the embodiments of the present invention. In order to simplify the disclosure of the embodiments of the present invention, the components and configurations of specific examples are described below. Of course, these are merely examples and are not intended to limit the embodiments of the present invention. In addition, the embodiments of the present invention may repeat reference numerals and / or reference letters in different examples. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and / or configurations discussed.

[0026] Figure 1This is a schematic diagram of the overall structure of some embodiments of this specification.

[0027] like Figure 1 As shown, a device 100 for improving the infrared radiation detection accuracy of a target to be detected disclosed in the present invention may include a heating furnace 1, a high-temperature background radiation shielding member 2, an infrared detector 4, a supporting device 5, a console 6 and a computer 7.

[0028] The heating furnace 1 is used to accommodate and heat the target to be inspected 3. The target to be inspected 3 can enter and exit the heating furnace 1 through an observation window (not shown) of the heating furnace 1. In some embodiments, the heating furnace 1 can provide a high temperature or ultra-high temperature environment above 1200K.

[0029] In some embodiments, the observation window can be made of transparent glass made of high-temperature resistant or ultra-high-temperature resistant (above 1200K) materials such as quartz glass (i.e., fused silica), sapphire (i.e., single-crystal aluminum oxide, Al2O3), and spinel transparent ceramic (i.e., MgAl2O4).

[0030] A high-temperature background radiation shielding member 2 is disposed inside the observation window of the heating furnace 1 to accommodate and locate the target 3 to be detected and to shield the high-temperature background radiation surrounding the target 3. In some embodiments, the high-temperature background radiation shielding member 2 can be located between a heating source (not shown) within the heating furnace 1 and the observation window. In some embodiments, the distance between the high-temperature background radiation shielding member 2 and the heating source within the heating furnace 1 can be adjusted based on actual needs.

[0031] Regarding the structure of the high temperature background radiation shielding element 2, please refer to the following for details. Figure 2 、 Figure 3 and Figure 4 、 Figure 5 Description content.

[0032] In some embodiments, the target 3 to be detected can be fixed in position in the heating furnace 1 by a high-temperature background radiation shielding member 2 .

[0033] In some embodiments, the target to be detected 3 may include only one type of object, and the corresponding high temperature background radiation shielding element 2 may be Figure 2 、 Figure 3 The structure shown.

[0034] In some embodiments, the target to be detected 3 may include a series of objects with the same shape and size but different coating materials and / or thicknesses, and the corresponding high temperature background radiation shielding element 2 may be made of Figure 4 The structure shown. Figure 4 The high-temperature background radiation shielding member 2 of the structure shown can detect multiple targets 3 to be detected at one time, which can greatly improve the detection efficiency.

[0035] In some embodiments, the target to be detected 3 may be two or more objects of different shapes and / or sizes, and the corresponding high temperature background radiation shielding element 2 may be a Figure 5 The structure shown. Figure 5 The high-temperature background radiation shielding member 2 of the structure shown can detect multiple targets 3 to be detected at one time, which can greatly improve the detection efficiency.

[0036] After being heated in the heating furnace 1, the target 3 emits infrared radiation due to its high temperature. The wavelength and intensity of the radiation vary depending on the temperature of the target 3. Under high or ultra-high temperature conditions, the target 3 emits mainly infrared radiation.

[0037] Infrared detector 4 is used to receive infrared radiation emitted by target 3. Infrared detector 4 is a device that converts infrared radiation from target 3 into electrical signals. When the infrared radiation focused on infrared detector 4 changes, infrared detector 4 generates corresponding electrical signals, the magnitude of which is proportional to the intensity of the received infrared radiation.

[0038] The detection result in the form of an electrical signal output by the infrared detector 4 is usually very weak and needs to be amplified, filtered, and digitized by a signal amplification and processing circuit so as to finally convert the detection result into a data format that can be processed by the computer 7.

[0039] The supporting device 5 is used to fix the infrared detector 4. In some embodiments, the supporting device 5 can be a lifting type.

[0040] In some embodiments, a movement device (not shown) may be mounted on the bottom of the support device 5. The movement device allows the support device 5 to move horizontally in a direction parallel to the plane of the high-temperature background radiation shielding member 2, thereby aligning the infrared detector 4 with one or a portion of the targets 3 to be detected. The movement device can move the support device 5 away from or closer to the high-temperature background radiation shielding member 2 to adjust the number of targets 3 to be detected that the infrared detector 4 can be aligned with.

[0041] In some embodiments, the lifting and lowering of the supporting device 5 can be controlled by the control console 6 .

[0042] The control console 6 is used for centrally controlling the heating furnace 1 , the infrared detector 4 and the supporting device 5 .

[0043] The console 6 is the control center of the apparatus 100, allowing the operator to monitor and control components such as the heating furnace 1, infrared detector 4, and support device 5 through a software interface or a physical control panel. In some embodiments, the console 6 may integrate functions such as data acquisition, processing, display, and storage.

[0044] In some embodiments, the console 6 can control parameters such as the temperature setting, heating rate, holding time, and cooling process of the heating furnace 1. The operator can start and stop the operation of the heating furnace 1 through the console 6 and monitor the temperature in the furnace in real time.

[0045] In some embodiments, the console 6 can control operations such as calibration and data acquisition of the infrared detector 4. The operator can set parameters of the infrared detector 4, such as sensitivity and sampling frequency, and view detection results from the console 6.

[0046] In some embodiments, the console 6 can be programmed to automatically control the entire testing process. For example, a series of testing steps, such as heating, testing, data recording, and slide movement, can be preset, and the console 6 will automatically execute these steps according to the preset program.

[0047] In some embodiments, the console 6 can store, process, analyze, and display the collected data. The operator can view real-time data, historical data, and generate reports through the console 6.

[0048] In some embodiments, the console 6 can monitor the safety status of the equipment, such as overheating of the heating furnace 1, and issue an alarm or automatically shut down the equipment to prevent damage when a problem is detected.

[0049] In some embodiments, the control system of the heating furnace 1 can be controlled by the console 6 to control the temperature inside the heating furnace 1. Therefore, the surface temperature of the target 3 to be detected can be monitored in real time by the console 6 without being determined by calculation.

[0050] In some embodiments, the surface temperature of the target 3 to be detected determined by calculation may be compared with the surface temperature of the target 3 to be detected monitored by the console 6 to determine the temperature error range.

[0051] The computer 7 is used to receive the detection results of the infrared detector 4 and display the infrared radiation characteristics of the target to be detected 3 in the form of an infrared image.

[0052] Because the infrared radiation of the target 3 to be detected is related to its temperature, the computer 7 can perform calculations based on the Stefan-Boltzmann law to determine the surface temperature of the target 3 to be detected. The computer 7 can then use Planck's blackbody radiation law to calculate the infrared emissivity of the target 3 to be detected based on the detected infrared radiation intensity and the known temperature of the target 3 to be detected. Finally, the computer 7 can use the processed data (e.g., the surface temperature of the target 3 to be detected, the detected infrared radiation intensity, and the infrared emissivity of the target 3 to be detected) to generate images. These images can be thermal images showing the temperature distribution of the object, or infrared emissivity distribution maps showing the emissivity distribution of the surface of the target 3 to be detected.

[0053] Figure 2 It is a front view of the high temperature background radiation shielding member 2 in some embodiments of this specification. Figure 3 is a cross-sectional view of the high-temperature background radiation shielding member 2 in some embodiments of this specification.

[0054] like Figure 2 、 Figure 3 As shown, the high temperature background radiation shielding element 2 includes a shielding element mounting frame 21 , a main body 22 , a positioning profile 23 and at least one to-be-detected target mounting hole 24 .

[0055] The materials of the mounting frame 21, main body 22, positioning profile 23 and other structures of the high-temperature background radiation shielding member 2 can be oxide ceramics, such as alumina (Al2O3) ceramics, silicon carbide (SiC) ceramics, silica bricks (SiO2), mullite (3Al2O3·2SiO2), etc. Alumina (Al2O3) ceramics can withstand ultra-high temperatures of 1600°C for a long time, and even ultra-high temperatures of 1800°C for a short time, making them suitable for use as furnace linings in high-temperature environments. Silicon carbide (SiC) ceramics can withstand ultra-high temperatures of 1600°C, and even ultra-high temperatures of 2000°C in an inert gas environment. Silica bricks (SiO2) can withstand ultra-high temperatures of 1600°C, making them suitable for use as furnace linings in high-temperature furnaces. Mullite (3Al2O3·2SiO2) can withstand ultra-high temperatures of 1800°C, making it suitable for use as furnace linings in high-temperature furnaces.

[0056] The shielding member body 22 is used to block high-temperature background radiation. In some embodiments, the shielding member body 22 can appear as an undifferentiated background color on the image finally formed by the computer 7 , and the background color can form a significant contrast with the image portion of the target 3 to be detected.

[0057] A mounting frame 21 is provided around the shielding body 22. In some embodiments, the mounting frame 21 and the shielding body 22 are integrally formed. In some embodiments, the mounting frame 21 and the shielding body 22 are detachably connected to facilitate replacement of the shielding body 22 with different numbers and shapes of mounting holes for the target to be detected. The high-temperature background radiation shielding member 2 is directly placed within the heating furnace 1 via the mounting frame 21.

[0058] At least one target installation hole 24 to be detected, the high temperature heat source in the heating furnace 1 heats the target 3 to be detected through the at least one target installation hole 24 to be detected, and the size and shape of the at least one target installation hole 24 to be detected are smaller than the target 3 to be detected. In some embodiments, the number of the target installation hole 24 to be detected can be one, such as Figure 2 、 Figure 3In some embodiments, the number of the target installation holes 24 to be detected can be two or more, and the shapes of the target installation holes 24 to be detected can be the same, such as Figure 4 As shown, it can also be different, such as Figure 5 shown.

[0059] A positioning contour 23 is provided at the edge of at least one mounting hole 24 for the target to be detected. The size and shape of the at least one mounting hole 24 for the target to be detected matches the contour of the target to be detected 3, thereby locating and positioning the target to be detected 3. When the target to be detected 3 is aligned with the mounting hole 24 and placed, the contour edge of the target to be detected 3 is caught by the positioning contour 23 and matches the positioning contour 23, thereby achieving the placement and positioning of the target to be detected 3.

[0060] In some embodiments, the width B of the mounting frame 21 is 10-20 mm, and in some embodiments, the thickness d1 of the mounting frame 21 is 40-100 mm. Figure 3 As shown in .

[0061] In some embodiments, the depth h of the at least one target mounting hole 24 to be detected is 10-30 mm.

[0062] In some embodiments, the size of the target installation hole 24 is 3-5 mm smaller than the outline of the target 3. Figure 2 As shown in d2.

[0063] In some embodiments, the supporting device 5 is a height-adjustable tripod. In some embodiments, the height-adjustable function of the tripod can be achieved by a hydraulic cylinder, a pneumatic cylinder, etc.

[0064] Figure 6 Schematic diagram of the structure of the support device 5 in some embodiments of this specification. Figure 6 As shown, in some embodiments, the supporting device 5 can be a three-axis gantry, on which one or more infrared detectors 4 that can move in one or more directions of the X-axis, Y-axis, and Z-axis are installed.

[0065] In some embodiments, the three-axis gantry may include one or more X-axis guide rails 51 , a Y-axis guide rail 52 , a Z-axis guide rail 53 , one or more X-axis displacement motors 54 , one or more Y-axis displacement motors 55 , and one or more Z-axis displacement motors 56 .

[0066] One or more X-axis displacement motors 54 are installed on each X-axis guide rail 51. Each X-axis displacement motor 54 is used to drive an infrared detector 4 to move along the X-axis direction. Different infrared detectors 4 can be aimed at different targets 3 to be detected.

[0067] The Y-axis displacement motor 55 is used to drive the Z-axis guide rail 53 to move along the Y-axis guide rail 52. In some embodiments, there may be at least two Y-axis guide rails 52, each of which drives one Z-axis guide rail 51 to move along the Y-axis direction.

[0068] The Z-axis displacement motor 56 is used to drive the X-axis guide rail 51 to move along the Z-axis direction. In some embodiments, there may be at least two Y-axis guide rails 52 , which respectively drive the two ends of the X-axis guide rail 51 .

[0069] In some embodiments, the displacements of the X-axis displacement motors 54 , the Y-axis displacement motors 55 , and the Z-axis displacement motors 56 may be uniformly controlled by the control console 6 .

[0070] Since the support device 5 of some of the aforementioned embodiments adopts the form of a three-axis gantry, it can simultaneously drive multiple infrared detectors 4 to move along the X-axis, Y-axis, and Z-axis directions to align with different targets 3 to be detected, thereby realizing batch detection with high detection efficiency.

[0071] Figure 7 This is a schematic diagram of the overall structure of some embodiments of this specification.

[0072] like Figure 7 As shown, in some embodiments, the device 100 may include a signal processing system 8, which is used to receive the electrical signal generated by the infrared detector 4, and amplify and convert the electrical signal into a temperature grayscale value.

[0073] like Figure 7 As shown, in some embodiments, the device 100 may include a temperature acquisition system 9, which is used to monitor the temperature of each target 3 to be detected in real time and transmit it to the console 6. The console 6 controls the heating furnace 1 based on the temperature data fed back by the temperature acquisition system 9 to achieve real-time adjustment or maintenance of the temperature inside the heating furnace 1.

[0074] This specification also discloses a method 800 for detecting infrared emissivity of an object, such as Figure 7 In some embodiments, the method 800 may be implemented by the device 100 .

[0075] Step 810 , placing the target 3 to be detected in the heating furnace 1 .

[0076] In some embodiments, the target to be detected 3 may include a series of objects of different shapes, sizes, and materials. During detection, different targets to be detected 3 are selected according to detection requirements.

[0077] In some embodiments, the target 3 to be detected is placed within the positioning contour 23 of the high-temperature background radiation shielding member 2. The entire high-temperature background radiation shielding member 2 is then placed within the heating furnace 1, and the observation window is closed. In some embodiments, the target 3 to be detected may be an irregularly shaped object. By adjusting the position, direction, and angle of the high-temperature background radiation shielding member 2 relative to the target 3 to detect the target 3, multi-angle detection of the target 3 can be achieved.

[0078] In step 820, the infrared detector 4 is aligned with the target 3 to be detected on the high-temperature background radiation shielding member 2 in the heating furnace 1. The infrared detector 4 is used for non-contact temperature measurement and can convert thermal radiation into electrical signals to provide temperature, heat distribution or other heat-related data.

[0079] In some embodiments, the infrared detector 4 may be aimed at only one target 3 to be detected at a time. In some embodiments, the infrared detector 4 may be aimed at multiple targets 3 to be detected at a time.

[0080] In some embodiments, the control console 6 can be used to control the lifting and lowering of the support device 5 to adjust the height of the infrared detector 4 to accommodate targets 3 to be detected at different heights.

[0081] In some embodiments, the position of the supporting device 5 can be adjusted to align with the target 3 to be detected at different positions.

[0082] Step 830 : heating the target 3 to be inspected by the heating furnace 1 .

[0083] The process of heating the target 3 by the heating furnace 1 can be divided into one or more of the following stages:

[0084] 1. Preheating: The heating furnace 1 heats the target 3 to a relatively low temperature to slowly increase the temperature and reduce thermal shock.

[0085] 2. Heating: The target 3 to be detected is heated to the required detection temperature. The target 3 to be detected made of different materials has different characteristics, and the detection temperature may also be different.

[0086] 3. Insulation: After reaching the required detection temperature, keep the target 3 in the heating furnace 1 for a period of time to ensure temperature uniformity and heat treatment effect.

[0087] In some embodiments, various stages of the heating furnace 1 , such as preheating, heating and / or heat preservation, can be controlled by the control console 6 .

[0088] Step 840 , the infrared radiation emitted by the target 3 is detected by the infrared detector 4 , and the detection result is transmitted to the computer 7 .

[0089] Infrared radiation is a type of electromagnetic wave. Objects at different temperatures emit infrared radiation of varying intensities. When the target 3 is heated, it emits infrared radiation whose intensity is directly related to the surface temperature of the target 3. When the infrared radiation is converted into an electrical signal by the infrared detector 4, the magnitude of this signal is proportional to the intensity of the received infrared radiation, thus being used to determine the intensity of the infrared radiation emitted by the target 3.

[0090] The electrical signal output by the infrared detector 4 is converted into a digital signal, and the converted digital signal is transmitted as a detection result to the computer 7 via one or more of the following communication interfaces, such as USB, Ethernet, wireless network (such as Wi-Fi or Bluetooth), or other communication interfaces suitable for high temperature environments. After being transmitted to the computer 7, the digital signal can be further processed and analyzed, such as real-time monitoring, recording, analysis, and storage of temperature data.

[0091] In step 850 , based on the detection result, the computer 7 calculates the infrared emissivity of the target 3 to be detected and displays it in the form of an image.

[0092] Infrared emissivity is a measure of an object's ability to emit infrared radiation, with values ​​ranging from 0 (no emission) to 1 (full emission). Different materials have different infrared emissivities, depending on the material's properties, surface condition, and temperature.

[0093] Computer 7 preprocesses these signals to remove noise and correct for various influencing factors, such as ambient temperature and detector response characteristics. Computer 7 then uses physical models and algorithms to calculate the infrared emissivity of target 3. This calculation involves physical laws such as the Stefan-Boltzmann law and Planck's blackbody radiation law, as well as the object's temperature. This calculation may require an iterative algorithm to optimize the emissivity estimate.

[0094] Computer 7 converts the calculated infrared emissivity data into an image using graphics processing software or specialized imaging algorithms. The image can be a temperature-variable thermal image, where different colors or grayscale levels represent different emissivity or temperature values. The generated image can be displayed on a computer screen for viewing by an operator or analyst.

[0095] In some embodiments, the image display software may have functions such as zooming, measuring, marking, and annotation to facilitate user analysis and interpretation of the image.

[0096] In some embodiments, the computer 7 may also store the images and data for subsequent analysis, reporting, or further research.

[0097] The present invention constructs a directional shielding structure in the heating furnace 1 by setting a high-temperature background radiation shielding member 2, effectively eliminating the interference of high-temperature background radiation on infrared detection, so that the infrared radiation imaging only presents the characteristic information of the target 3 to be detected, thereby improving the target detection accuracy.

[0098] The above embodiments are intended to illustrate the present invention, not to limit the present invention. Therefore, changes in illustrative values ​​or substitutions of equivalent components should still fall within the scope of the present invention.

[0099] From the above detailed description, it will be clear to those skilled in the art that the present invention can indeed achieve the aforementioned objectives and is in compliance with the provisions of the Patent Law.

[0100] Although preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they become aware of the basic inventive concepts. Therefore, the appended claims are intended to be interpreted as covering the preferred embodiments and all changes and modifications that fall within the scope of the invention. The foregoing description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. It should be noted that any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention are intended to be included within the scope of protection of the present invention.

[0101] The basic concepts have been described above. It will be apparent to those skilled in the art after reading this application that the above disclosures are merely illustrative and do not constitute limitations on this application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and amendments to this application. Such modifications, improvements, and amendments are suggested in this application and remain within the spirit and scope of the exemplary embodiments of this application.

[0102] At the same time, this application uses specific terms to describe the embodiments of this application. For example, "one embodiment," "an embodiment," and / or "some embodiments" refer to a certain feature, structure, or characteristic related to at least one embodiment of this application. Therefore, it should be emphasized and noted that "one embodiment," "an embodiment," or "an alternative embodiment" mentioned twice or more in different places in this specification does not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of this application may be appropriately combined.

[0103] In addition, unless expressly stated in the claims, the order of the processing elements and sequences described in this application, the use of alphanumeric characters, or the use of other names are not intended to limit the order of the processes and methods of this application. Although the above disclosure discusses some embodiments of the invention that are currently considered useful through various examples, it should be understood that such details are only for illustrative purposes, and the attached claims are not limited to the disclosed embodiments. On the contrary, the claims are intended to cover all modifications and equivalent combinations that are consistent with the essence and scope of the embodiments of this application. For example, although the implementation of the various components described above can be embodied in a hardware device, it can also be implemented as a pure software solution, for example, installation on an existing server or mobile device.

[0104] Similarly, it should be noted that in order to simplify the presentation of this disclosure and thereby facilitate understanding of one or more of the invention's embodiments, the foregoing descriptions of the embodiments of this disclosure sometimes combine multiple features into a single embodiment, figure, or description thereof. However, this approach should not be interpreted as reflecting an intention that the claimed subject matter requires more features than expressly recited in each claim. Rather, the subject matter of the invention may possess fewer features than the single embodiment described above.

Claims

1. A device for improving the accuracy of infrared radiation detection of a target to be detected, characterized in that: include: A heating furnace, the heating furnace being used to accommodate and heat the target to be detected; A high-temperature background radiation shielding member, which is arranged inside the observation window of the heating furnace and is used for installing and positioning the target to be detected and shielding the high-temperature background radiation around the target to be detected; an infrared detector, configured to receive infrared radiation emitted by the target to be detected; A supporting device, the supporting device is used to fix the infrared detector; a computer, the computer being configured to receive the detection result of the infrared detector and display the infrared radiation characteristics of the target to be detected in the form of an infrared image; A control console is used for uniformly controlling the heating furnace, the infrared detector and the supporting device.

2. The device for improving the infrared radiation detection accuracy of a target to be detected according to claim 1, characterized in that: High temperature background radiation shielding components include: a shielding member body; An installation frame, the installation frame being arranged around the shielding member body; at least one mounting hole for an object to be detected, through which a high-temperature heat source in the heating furnace heats the object to be detected, and the size and shape of the at least one mounting hole for an object to be detected are smaller than the object to be detected; and A positioning contour is provided on the edge of the at least one mounting hole of the target to be detected, and the size and shape of the at least one mounting hole of the target to be detected match the contour of the target to be detected, so as to be used for installing and positioning the target to be detected.

3. The device for improving the infrared radiation detection accuracy of a target to be detected according to claim 2, characterized in that: The installation frame has a width of 10-20 mm and a thickness of 40-100 mm.

4. The device for improving the infrared radiation detection accuracy of a target to be detected according to claim 2, characterized in that: The depth of the at least one target installation hole to be detected is 10-30 mm.

5. The device for improving the infrared radiation detection accuracy of a target to be detected according to claim 2, characterized in that: The size of the mounting hole of the target to be detected is 3-5 mm smaller than the outline of the target to be detected.

6. The device for improving the infrared radiation detection accuracy of a target to be detected according to claim 1, characterized in that: The supporting device is a tripod with adjustable height.

7. The device for improving the infrared radiation detection accuracy of a target to be detected according to claim 1, characterized in that: The supporting device is a three-axis gantry, on which one or more infrared detectors are mounted that can move in one or more directions of the X-axis, Y-axis, and Z-axis.

8. The device for improving the infrared radiation detection accuracy of a target to be detected according to claim 7, characterized in that: The three-axis gantry comprises: One or more X-axis guide rails; One or more Y-axis guide rails; One or more Z-axis guide rails; One or more X-axis displacement motors, one or more X-axis displacement motors are installed on each of the X-axis guide rails, and each X-axis displacement motor is used to drive one of the infrared detectors to move along the Z-axis guide rail; One or more Y-axis displacement motors, wherein the Y-axis displacement motor is used to drive the Z-axis guide rail to move along the Y-axis guide rail; and One or more Z-axis displacement motors, wherein the Z-axis displacement motors are used to drive the X-axis guide rail to move along the Z-axis guide rail.

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