Probe preparation method, probe preparation device and probe

Abstract

Embodiments of the present invention provide techniques for manufacturing probes in microstructured devices. Specifically, the embodiment of the invention provides a sensor probe preparation method, a sensor probe preparation device and a sensor probe. The preparation method of the sensor probe according to the embodiment of the invention comprises the following steps: fixing a substrate of a quality factor enhanced qPlus sensor probe, wherein the substrate of the probe is used for bearing the probe; the position between the tail end of the qPlus sensor cantilever beam and the probe is adjusted, so that the tail end of the qPlus sensor cantilever beam is aligned with the rear end of the probe; coating a curing agent at a position where the qPlus sensor cantilever beam needs to be contacted with the rear end of the probe; enabling the qPlus sensor cantilever beam to be in contact with the probe, and enabling the curing agent at the contact position to be cured; and moving the qPlus sensor cantilever beam or the probe, and removing the probe from the substrate of the probe.

Description

Technical Field

[0001] The present invention relates to a technique for providing a probe for use in an apparatus for manufacturing and processing microstructures. Specifically, the present invention relates to a sensor probe technique for detecting and processing microstructures. The present invention also relates to a sensor probe preparation method, a sensor probe preparation apparatus, and a sensor probe. Background Art

[0002] Devices or systems for fabricating and processing microstructures have a wide range of applications in various fields. Specifically, high-resolution magnetic force microscopes, for example, can be used to detect or process microstructures, particularly in the study of the properties and behavior of magnetic materials at the nanoscale. Conventional magnetic force microscope sensor probes can be fabricated using micromachining techniques and coated with magnetic material at the tip, allowing their size to reach tens of micrometers, achieving a high resolution (e.g., approximately 10-20 nm).

[0003] However, when performing magnetic force microscope measurements in an extremely low temperature environment (for example, the measurement temperature is less than 1K), a low-temperature cooling system is required to maintain the extremely low temperature. Since the sensor probe of the above-mentioned magnetic force microscope needs to be used in conjunction with the optical path, it is difficult to meet the requirements of a stable extremely low temperature environment.

[0004] In contrast, another type of sensor probe, the quality-factor-enhanced qPlus sensor probe, which manufactures and processes microstructures, is well-suited for ultra-low-temperature measurement environments. Using a quartz tuning fork as a cantilever, it performs measurements based on the principle of piezoelectric self-induction, eliminating the need for other measurement methods such as optical paths. It offers advantages such as compact structure, excellent stability, and temperature control. However, for qPlus sensors' magnetic measurement operations at extremely low temperatures, the conventional magnetic tip used is only millimeters long, resulting in slow changes in the magnetic field gradient and limited measurement resolution to approximately 100 nm.

[0005] Therefore, it is necessary to prepare a quality factor enhanced qPlus sensor probe suitable for ultra-low temperature measurement environments to meet the needs of high-resolution sensor measurements at ultra-low temperatures. Summary of the Invention

[0006] To solve the above technical problems, according to one aspect of the present invention, a probe preparation method is provided, comprising: fixing a base of a quality factor enhanced qPlus sensor probe, wherein the base of the probe is used to support the probe; adjusting the position between the end of the qPlus sensor cantilever and the probe so that the end of the qPlus sensor cantilever is aligned with the rear end of the probe; applying a curing agent to the position where the qPlus sensor cantilever needs to contact the rear end of the probe; bringing the qPlus sensor cantilever into contact with the probe, and curing the curing agent at the contact position; moving the qPlus sensor cantilever or the probe to remove the probe from the base of the probe.

[0007] In one example, the base for fixing the probe includes: a base to which the probe is fixed by a spring sheet or a curing agent, and the base of the probe is used to support the probe; the end of the qPlus sensor cantilever includes a connector fixed to the qPlus sensor cantilever and used to support the probe; the probe is a laser reflection atomic force microscope probe or a piezoresistive cantilever probe; and / or the probe is a magnetic silicon probe or a non-magnetic probe.

[0008] In one example, the method further includes: using a micro-motion platform to adjust the position between the qPlus sensor cantilever and the probe; wherein the micro-motion platform is a micron-level XYZ micro-motion platform.

[0009] In one example, adjusting the position between the end of the qPlus sensor cantilever and the probe so that the end of the qPlus sensor cantilever is aligned with the rear end of the probe includes: adjusting the position between the end of the qPlus sensor cantilever and the probe in two mutually perpendicular directions so that the end of the qPlus sensor cantilever is aligned with the rear end of the probe.

[0010] In one example, the curing agent is epoxy resin glue; contacting the qPlus sensor cantilever with the probe and curing the curing agent at the contact position includes: heating the qPlus sensor cantilever and the probe coated with the curing agent to solidify the curing agent.

[0011] According to another aspect of the present invention, a probe preparation device is provided, comprising: a probe fixing seat for fixing a base of a quality factor enhanced qPlus sensor probe, the base of the probe being used to carry the probe; a qPlus sensor fixing seat for fixing a qPlus sensor; a connecting device, the connecting device rigidly connecting a position adjustment device to the probe fixing seat or the qPlus sensor fixing seat; a position adjustment device, the position adjustment device carrying the probe fixing seat or the qPlus sensor fixing seat, and being used to adjust the position between the end of the qPlus sensor cantilever and the probe, and aligning the end of the qPlus sensor cantilever with the rear end of the probe, wherein, after the qPlus sensor cantilever is in contact with the probe and cured using a curing agent, the position adjustment device is used to move the qPlus sensor cantilever or the probe so that the probe is removed from the base of the probe.

[0012] In one example, the probe holder fixes the base of the probe by a spring sheet or a curing agent; the end of the qPlus sensor cantilever includes a connector fixed to the qPlus sensor cantilever and used to support the probe; the probe is a laser reflection atomic force microscope probe or a piezoresistive cantilever probe; and / or the probe is a magnetic silicon probe or a non-magnetic probe.

[0013] In one example, the position adjustment device is a micron-scale XYZ fine-motion platform; the curing agent is epoxy resin glue; and / or the length, width and / or height of the connecting device are in the range of 5-20 cm.

[0014] In one example, the position adjustment device is used to adjust the position between the end of the qPlus sensor cantilever and the probe in two mutually perpendicular directions so that the end of the qPlus sensor cantilever is aligned with the rear end of the probe.

[0015] According to another aspect of the present invention, a sensor probe is provided, comprising: a qPlus sensor cantilever; and a quality factor-enhanced qPlus sensor probe, wherein the probe is a laser reflection atomic force microscope probe or a piezoresistive cantilever probe, fixed at the end of the qPlus sensor cantilever.

[0016] In one example, the end of the qPlus sensor cantilever includes a connector fixed to the qPlus sensor cantilever and used to carry the probe; and / or the probe is a magnetic silicon probe or a non-magnetic probe.

[0017] The sensor probe preparation method, sensor probe preparation device and sensor probe according to the present invention can meet the requirements for compact, stable and high-resolution sensor probe preparation and measurement in ultra-low temperature microscopic material measurement and processing environments and other types of measurement and processing environments, thereby cooperating with the acquisition, measurement, processing and application of atomic force, magnetic force and other parameters according to users' different physical property measurement requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and other objects, features and advantages of the present invention will become more apparent by describing in detail the embodiments of the present invention with reference to the accompanying drawings.

[0019] Figure 1 A schematic flow chart showing a method for preparing a sensor probe according to an embodiment of the present invention is shown;

[0020] Figure 2 A schematic diagram showing an example of an embodiment of the present invention, in which the probe and the base of the probe are connected via a cantilever beam;

[0021] Figure 3 A schematic structural diagram illustrating a probe fixing base for fixing a probe base through a spring sheet according to an embodiment of the present invention;

[0022] Figure 4 A schematic structural diagram illustrating a probe fixing base for fixing a probe base through a spring sheet according to an embodiment of the present invention;

[0023] Figure 5 A schematic structural diagram of a qPlus sensor mounting base for carrying the qPlus sensor according to an embodiment of the present invention is shown;

[0024] Figure 6 A schematic structural diagram of a sensor probe preparation device according to one embodiment of the present invention is shown;

[0025] Figure 7 A schematic structural diagram of a sensor probe preparation device according to one embodiment of the present invention is shown;

[0026] Figure 8 A schematic diagram illustrating a method of making the sensor cantilever beam contact the probe by using the sensor probe preparation device according to an example of an embodiment of the present invention is shown;

[0027] Figure 9 A schematic structural diagram of a sensor probe according to an example of an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0028] The following describes a sensor probe preparation method, a sensor probe preparation apparatus, and a sensor probe according to embodiments of the present invention with reference to the accompanying drawings. Like reference numerals denote like elements throughout the accompanying drawings. It should be understood that the embodiments described herein are merely illustrative and should not be construed as limiting the scope of the present invention.

[0029] When detecting and processing microscopic material structures, under special measurement environments (such as ultra-low temperatures), conventional magnetic force microscopes, which rely on optical paths for signal acquisition, struggle to maintain stable cryogenic conditions. Therefore, the quality factor-enhanced qPlus sensor offers advantages such as compactness, excellent stability, and temperature controllability.

[0030] However, the magnetic tip commonly used in qPlus sensors has a length of mm, which results in a slow change in the magnetic field gradient and a measurement resolution of only around 100 nm, making it impossible to obtain high-resolution measurement images.

[0031] To address these issues, a microfabricated magnetic force microscope (MFM) sensor probe could be attached to the end of the qPlus sensor's cantilever using specialized methods and equipment to improve the sensor's measurement resolution. This approach allows the MFM tip to detect signals, achieving high-resolution measurements, while also utilizing the qPlus sensor's quartz cantilever to directly convert vibration signals into electrical signals, eliminating the need for an optical path. This allows for high-resolution atomic force microscopy and MFM measurements under extremely low-temperature conditions.

[0032] However, when preparing qPlus sensor probes, the probes required for attachment, such as magnetic silicon probes, can be less than 10 μm in size and typically attached to a 2 mm square, 0.5 mm thick substrate. When using these probes for qPlus sensor probe preparation, the probes must be broken off from the substrate and transferred to the end of the quartz tuning fork in the qPlus sensor. The probes' tiny size makes them impossible to grasp and attach using tools such as tweezers, making their preparation considerably more challenging.

[0033] To address the above issues, an embodiment of the present invention provides a probe transfer process based on a micro-motion platform, which can completely transfer the probe to the end of the quartz tuning fork cantilever of the qPlus sensor, thereby realizing the integration of the micron-sized probe and the qPlus sensor cantilever, and achieving stable and high-resolution measurement results of the qPlus sensor.

[0034] An embodiment of the present invention provides a method for preparing a sensor probe. Figure 1 A schematic flow chart of a method for preparing a sensor probe according to an embodiment of the present invention is shown.

[0035] like Figure 1 As shown, in step S101 , a substrate of a quality factor enhanced qPlus probe is fixed, where the substrate of the probe is used to carry the probe.

[0036] In an embodiment of the present invention, the probe may be, for example, a laser reflection atomic force microscope probe. For example, the probe may be a probe prepared based on a micromachining process, and its size may be, for example, less than 10um. For the above-mentioned probe, a magnetic probe may be formed by coating a magnetic material on the tip of the probe (such as coating a magnetic material on the tip of a silicon probe to form a magnetic silicon probe), or it may be a non-magnetic probe. In addition, for another example, the probe may also be a piezoresistive cantilever probe. The above types and descriptions of the probes to be prepared are all examples. In actual applications, various corresponding types of probes can be selected according to the specific needs of the user and the collected parameters, and there is no limitation here.

[0037] In another embodiment of the present invention, the probe can be connected to the base of the probe, and the base of the probe can be used to carry the probe. Optionally, the base of the probe can be, for example, the base adopted in the aforementioned magnetic force microscope of about 2 mm square and about 0.5 mm thick. Wherein, optionally, the base can be a silicon base made of silicon. In addition, the base of the probe can also be a base of any other shape or size according to different application requirements. Optionally, the shape of the base can be, for example, a trapezoid, triangle, circle, ellipse, polygon or other irregular shapes, and in terms of thickness, it can be a sheet with uniform thickness or a wedge-shaped with thickness changing back and forth, etc. Various thickness forms. In addition, the size of the base can also have various options according to actual needs. For example, the length and width of the base can be 1 mm, 2 mm, 2.5 mm, 3 mm, etc., respectively, without limitation.

[0038] In one embodiment of the present invention, optionally, the probe may be directly connected to the base of the probe; furthermore, optionally, the probe may be connected to the base of the probe via a cantilever beam. Figure 2 FIG. 1 shows a schematic diagram of a probe and a base of the probe connected via a cantilever beam according to an example of an embodiment of the present invention. Figure 2 As shown, the cantilever beam can be fixed to the base of the probe by gluing or other means, and the probe can be connected to the cantilever beam. Optionally, the cantilever beam can be parallel to the plane where the base of the probe is located. In addition, optionally, the probe can be perpendicular to the cantilever beam. The description of the connection and relative position of the base of the above-mentioned probe and the probe is only an example. In actual applications, any other connection method and relative position relationship can be selected according to the specific application scenario, and are not limited here.

[0039] According to one embodiment of the present invention, the base of the probe may optionally be fixed by various fixing methods such as a spring sheet, a curing agent, and a curing glue. Figure 3 A schematic structural diagram of a probe fixing base for fixing a probe base through a spring sheet according to an embodiment of the present invention is shown. Figure 4 FIG. 1 is a schematic diagram showing the physical structure of a probe fixing base for fixing a probe through a spring sheet according to an embodiment of the present invention. Figure 3 and Figure 4 As shown, the probe holder can include a spring sheet secured, for example, by screws, and the probe base can be secured to the probe holder via the spring sheet. Optionally, the probe can be perpendicular to the plane of the probe base and also perpendicular to the plane of the spring sheet securing the probe base. Furthermore, given that the end of the qPlus sensor cantilever beam must be bonded and cured to the rear end of the probe, the tip of the fixed probe can be positioned away from the qPlus sensor cantilever beam to facilitate subsequent curing operations.

[0040] In step S102 , the position between the end of the qPlus sensor cantilever and the probe is adjusted so that the end of the qPlus sensor cantilever is aligned with the rear end of the probe.

[0041] In one embodiment of the present invention, a qPlus sensor holder can optionally be used to fix the qPlus sensor. The qPlus sensor can include a qPlus sensor cantilever beam for subsequently supporting the probe. In one example, the qPlus sensor cantilever beam can be a quartz tuning fork. Figure 5 FIG. 1 shows a schematic structural diagram of a qPlus sensor holder for carrying the qPlus sensor according to an embodiment of the present invention. Figure 5 As shown, the qPlus sensor holder can be used to secure a qPlus sensor. A qPlus sensor cantilever, which can be a quartz tuning fork, is affixed to the qPlus sensor. The qPlus sensor cantilever can be U-shaped, with one end secured to the qPlus sensor and the other end suspended in the air, allowing for free oscillation to connect to a probe for signal acquisition in atomic force microscopes or magnetic force microscopes.

[0042] In one example, to enable more precise and effective fixation with the probe, the end of the qPlus sensor cantilever can optionally include a connector fixed to the qPlus sensor cantilever and used to support the probe. In one example, the connector can optionally be a metal wire, such as a tungsten wire. The tungsten wire can be pre-processed to provide a sharp tip for supporting the probe.

[0043] When it is necessary to adjust the qPlus sensor cantilever and the aforementioned probe so that the two are in contact and fixed to each other, optionally, a position adjustment device can be used to carry the probe holder or the qPlus sensor holder to accurately adjust the position between the end of the qPlus sensor cantilever and the probe. In one example, the position between the qPlus sensor cantilever and the probe can be adjusted by an XYZ translational micro-motion platform. Specifically, the XYZ micro-motion platform can be used to adjust the end of the qPlus sensor cantilever to align with the rear end of the probe. Optionally, the XYZ micro-motion platform can be an XYZ micro-motion platform with a displacement accuracy of, for example, micrometer level.

[0044] The operation of the method according to the embodiment of the present invention will be described below in conjunction with the specific structure of the sensor probe preparation device. Figure 6 FIG. 1 is a schematic diagram showing the structure of a probe preparation device according to an embodiment of the present invention. Figure 6 In the embodiment, the probe holder is used to support the base of the probe connected to the quality factor enhanced qPlus sensor probe, and the qPlus sensor holder is used to support the qPlus sensor and fix the qPlus sensor cantilever. The position adjustment device can be an XYZ micro-motion stage used to support the qPlus sensor holder. In addition, an L-shaped connecting device can be rigidly connected to the probe holder and the position adjustment device. Figure 6 The structure of the qPlus sensor probe preparation device shown is only an example. In another example, the position adjustment device can also be used to support the probe fixing seat, and the connecting device can be used to connect the position adjustment device and the qPlus sensor fixing seat. There is no limitation here.

[0045] In one embodiment of the present invention, optionally, when adjusting the position between the end of the qPlus sensor cantilever and the probe, taking into account the specific dimensions of the probe and the qPlus sensor cantilever used for fixing at both ends, the adjustment process by the position adjustment device (XYZ micro-motion platform) can be carried out under a stereo microscope. Specifically, during the adjustment process, the position between the end of the qPlus sensor cantilever and the probe can be adjusted in two mutually perpendicular directions. For example, it can be first ensured that the qPlus cantilever is perpendicular to the probe, and the qPlus cantilever is perpendicular to the cantilever of the probe. In one example, when the end of the qPlus sensor cantilever includes a connector for carrying the probe, the XYZ micro-motion platform can be used to keep the direction of the connector of the probe consistent with the direction of the probe. Subsequently, the XYZ micro-motion platform can be used to accurately adjust the position between the end of the qPlus sensor cantilever and the probe to keep the end of the qPlus sensor cantilever aligned with the rear end of the probe.

[0046] In step S103, a curing agent is applied to the portion where the qPlus sensor cantilever beam contacts the rear end of the probe.

[0047] In one embodiment of the present invention, a position adjustment device, such as an XYZ micro-motion stage, can be used to retract the qPlus sensor cantilever or the probe to a sufficient distance between them for application of the curing agent. The curing agent can be epoxy resin glue or any other glue of comparable rigidity, without limitation.

[0048] When applying the curing agent, the curing agent can be applied to the location where the qPlus sensor cantilever beam contacts the rear end of the probe. In addition, in one example, when the end of the qPlus sensor cantilever beam includes a connector for supporting the probe, the curing agent can be applied to the location where the connector contacts the rear end of the probe. In another example, if the size is appropriate and the operation is convenient, the curing agent can also be applied to the base of the probe or the cantilever beam for supporting the probe. The curing agent can be used to rigidly connect the qPlus sensor cantilever beam to the probe.

[0049] In step S104 , the qPlus sensor cantilever is brought into contact with the probe, and the curing agent at the contact position is cured.

[0050] In one embodiment of the present invention, the qPlus sensor cantilever or the probe may be pushed forward by a position adjustment device so that the qPlus sensor cantilever is in full contact with the probe, thereby facilitating a rigid connection between the two.

[0051] Optionally, when the curing agent needs to be heated and solidified, the qPlus sensor cantilever and the probe coated with the curing agent can be heated to solidify the curing agent. Alternatively, when the curing agent needs to solidify over a certain period of time, the qPlus sensor cantilever and the probe coated with the curing agent can be placed at a specific temperature (e.g., room temperature) for a period of time to solidify the curing agent.

[0052] The above-mentioned curing agent selection and the method for solidifying the curing agent are examples. In actual application, various corresponding curing agents and solidification methods can be selected according to the needs of different scenarios and materials, and are not limited here.

[0053] In step S105 , the qPlus sensor cantilever or the probe is moved to remove the probe from the probe base.

[0054] In an embodiment of the present invention, optionally, when the qPlus sensor cantilever is rigidly fixed to the probe and the curing agent is cured, a position adjustment device, such as an XYZ micro-motion platform, can be used to retract the qPlus sensor cantilever or the probe so that the probe is separated from the base of the probe to transfer the probe to the qPlus sensor cantilever. In one example, if a cantilever for supporting the probe is included between the probe and the base of the probe, the cantilever or a portion thereof can also be transferred together to the qPlus sensor cantilever. In addition, in another example, if the qPlus sensor cantilever includes a connector for supporting the probe, the probe can be fixed to the connector and transferred to the end of the qPlus sensor cantilever.

[0055] The above-mentioned quality factor enhanced qPlus atomic force microscope sensor probe preparation method according to the embodiment of the present invention can provide a sensor preparation method that meets the requirements of compact, stable, and high-resolution sensor preparation and measurement in ultra-low temperature measurement environments and other types of measurement environments, thereby cooperating with the acquisition and application of atomic force, magnetic force and other parameters according to the different physical property measurement requirements of users.

[0056] Below, refer to the above Figure 6 as well as Figure 7 A sensor probe preparation apparatus according to an embodiment of the present invention will be described.

[0057] exist Figure 6In the embodiment, the probe holder is used to support the base of the probe connected to the probe, and the qPlus sensor holder is used to support the qPlus sensor and fix the qPlus sensor cantilever. The position adjustment device can be an XYZ micro-motion platform for supporting the qPlus sensor holder. In addition, an L-shaped connecting device can be rigidly connected to the probe holder and the position adjustment device. Figure 6 similar, Figure 7 A schematic structural diagram of a qPlus atomic force microscope sensor probe preparation device according to one embodiment of the present invention is shown. Figure 6 and Figure 7 The structure of the qPlus sensor probe preparation device shown is only an example. In another example, the position adjustment device can also be used to support the probe fixing seat, and the connecting device can be used to connect the position adjustment device and the qPlus sensor fixing seat. There is no limitation here.

[0058] like Figure 6 and Figure 7 As shown, a quality factor enhanced qPlus sensor probe preparation device may include: a probe fixing seat for fixing the base of the probe, the base of the probe being used to carry the probe; a qPlus sensor fixing seat for fixing the qPlus sensor; a connecting device, the connecting device rigidly connecting a position adjustment device to the probe fixing seat or the qPlus sensor fixing seat; a position adjustment device, the position adjustment device carrying the probe fixing seat or the qPlus sensor fixing seat, for adjusting the position between the end of the qPlus sensor cantilever beam and the probe, and aligning the end of the qPlus sensor cantilever beam with the rear end of the probe, wherein, after the qPlus sensor cantilever beam contacts the probe and is cured using a curing agent, the position adjustment device is used to move the qPlus sensor cantilever beam or the probe so that the probe is removed from the base of the probe.

[0059] In one embodiment of the present invention, the probe can be, for example, a laser reflection atomic force microscope probe. For example, the probe can be a probe prepared based on a micromachining process, and its size can be, for example, less than 10um. For the above-mentioned probe, a magnetic probe can be made by coating a magnetic material on the tip of the probe (such as coating a magnetic material on the tip of a silicon probe to make a magnetic silicon probe), or it can be a non-magnetic probe. In addition, for another example, the probe can also be a piezoresistive cantilever probe. The above types and descriptions of the probes to be prepared are all examples. In actual applications, various corresponding types of probes can be selected according to the specific needs of the user and the collected parameters, and there is no limitation here.

[0060] In another embodiment of the present invention, the probe can be connected to the base of the probe, and the base of the probe can be used to carry the probe. Optionally, the base of the probe can be, for example, the base adopted in the aforementioned magnetic force microscope of about 2 mm square and about 0.5 mm thick. Wherein, optionally, the base can be a silicon base made of silicon. In addition, the base of the probe can also be a base of any other shape or size according to different application requirements. Optionally, the shape of the base can be, for example, a trapezoid, triangle, circle, ellipse, polygon or other irregular shapes, and in terms of thickness, it can be a sheet with uniform thickness or a wedge-shaped with thickness changing back and forth, etc. Various thickness forms. In addition, the size of the base can also have various options according to actual needs. For example, the length and width of the base can be 1 mm, 2 mm, 2.5 mm, 3 mm, etc., respectively, without limitation.

[0061] In one embodiment of the present invention, optionally, the probe may be directly connected to the base of the probe; furthermore, optionally, the probe may be connected to the base of the probe via a cantilever beam. Figure 2 and Figure 6 As shown, the cantilever beam can be fixed to the base of the probe by gluing or other means, and the probe can be connected to the cantilever beam. Optionally, the cantilever beam can be parallel to the plane where the base of the probe is located. In addition, optionally, the probe can be perpendicular to the cantilever beam. The description of the connection and relative position of the base of the above-mentioned probe and the probe is only an example. In actual applications, any other connection method and relative position relationship can be selected according to the specific application scenario, and are not limited here.

[0062] According to one embodiment of the present invention, the base of the probe may optionally be fixed by various fixing methods such as a spring sheet, a curing agent, and a curing glue. Figure 3 A schematic structural diagram of a probe fixing base for fixing a probe base through a spring sheet according to an embodiment of the present invention is shown. Figure 4 FIG. 1 is a schematic diagram showing the physical structure of a probe fixing base for fixing a probe through a spring sheet according to an embodiment of the present invention. Figure 3 and Figure 4 As shown, the probe holder can include a spring sheet secured, for example, by screws, and the probe base can be secured to the probe holder via the spring sheet. Optionally, the probe can be perpendicular to the plane of the probe base and also perpendicular to the plane of the spring sheet securing the probe base. Furthermore, given that the end of the qPlus sensor cantilever beam must be bonded and cured to the rear end of the probe, the tip of the fixed probe can be positioned away from the qPlus sensor cantilever beam to facilitate subsequent curing operations.

[0063] When operating the quality factor enhanced qPlus sensor probe preparation apparatus to prepare a qPlus sensor probe, the position between the end of the qPlus sensor cantilever and the probe can be adjusted first so that the end of the qPlus sensor cantilever is aligned with the rear end of the probe.

[0064] In one embodiment of the present invention, a qPlus sensor holder may be used to fix the qPlus sensor, and the qPlus sensor may include a qPlus sensor cantilever beam for subsequently supporting the probe. In one example, the qPlus sensor cantilever beam may be, for example, a quartz tuning fork. Figure 5 and Figure 6 As shown, the qPlus sensor holder can be used to secure a qPlus sensor. A qPlus sensor cantilever, which can be a quartz tuning fork, is affixed to the qPlus sensor. The qPlus sensor cantilever can be U-shaped, with one end secured to the qPlus sensor and the other end suspended in the air, allowing for free oscillation to connect to a probe for signal acquisition in atomic force microscopes or magnetic force microscopes.

[0065] In one example, to enable more precise and effective fixation with the probe, the end of the qPlus sensor cantilever can optionally include a connector fixed to the qPlus sensor cantilever and used to support the probe. In one example, the connector can optionally be a metal wire, such as a tungsten wire. The tungsten wire can be pre-processed to provide a sharp tip for supporting the probe.

[0066] When it is necessary to use the qPlus sensor probe preparation device to adjust the qPlus sensor cantilever and the aforementioned probe so that the two are in contact and fixed to each other, optionally, a position adjustment device can be used to carry the probe holder or the qPlus sensor holder to accurately adjust the position between the end of the qPlus sensor cantilever and the probe. In one example, the position between the qPlus sensor cantilever and the probe can be adjusted by an XYZ translational micro-motion platform. Specifically, the XYZ micro-motion platform can be used to adjust the end of the qPlus sensor cantilever to align with the rear end of the probe. Optionally, the XYZ micro-motion platform can be an XYZ micro-motion platform with a displacement accuracy of, for example, micrometer level.

[0067] In one embodiment of the present invention, optionally, when adjusting the position between the end of the qPlus sensor cantilever and the probe using the qPlus sensor probe preparation device, taking into account the specific dimensions of the probe and the qPlus sensor cantilever used for fixing at both ends, the adjustment process by the position adjustment device (XYZ micro-motion platform) can be performed under a stereo microscope. Specifically, during the adjustment process, the position between the end of the qPlus sensor cantilever and the probe can be first adjusted in two mutually perpendicular directions. For example, it can be first ensured that the qPlus cantilever is perpendicular to the probe, and that the qPlus cantilever is perpendicular to the cantilever of the probe. In one example, when the end of the qPlus sensor cantilever includes a connector for carrying the probe, the XYZ micro-motion platform can be used to keep the direction of the connector of the probe consistent with the direction of the probe. Subsequently, the XYZ micro-motion platform can be used to accurately adjust the position between the end of the qPlus sensor cantilever and the probe to keep the end of the qPlus sensor cantilever aligned with the rear end of the probe.

[0068] After the end of the qPlus sensor cantilever is aligned with the rear end of the probe, a curing agent may be applied to the portion where the qPlus sensor cantilever is to contact the rear end of the probe.

[0069] In one embodiment of the present invention, a position adjustment device, such as an XYZ micro-motion stage, can be used to retract the qPlus sensor cantilever or the probe to a sufficient distance between them for application of the curing agent. The curing agent can be epoxy resin glue or any other glue of comparable rigidity, without limitation.

[0070] When applying the curing agent, the curing agent can be applied to the location where the qPlus sensor cantilever beam contacts the rear end of the probe. In addition, in one example, when the end of the qPlus sensor cantilever beam includes a connector for supporting the probe, the curing agent can be applied to the location where the connector contacts the rear end of the probe. In another example, if the size is appropriate and the operation is convenient, the curing agent can also be applied to the base of the probe or the cantilever beam for supporting the probe. The curing agent can be used to rigidly connect the qPlus sensor cantilever beam to the probe.

[0071] After applying the curing agent, the qPlus sensor cantilever can be brought into contact with the probe, and the curing agent at the contact location can be cured.

[0072] In one embodiment of the present invention, the qPlus sensor cantilever or the probe may be pushed forward by a position adjustment device so that the qPlus sensor cantilever is in full contact with the probe, thereby facilitating a rigid connection between the two. Figure 8 FIG. 1 is a schematic diagram showing a method of making the qPlus sensor cantilever beam contact the probe using the qPlus sensor probe preparation device according to an example of an embodiment of the present invention. Figure 8 As shown, it can be seen that through a position adjustment device such as an XYZ micro-motion platform, the position between the qPlus sensor cantilever and the probe can be accurately adjusted so that the two are aligned and in contact with each other, so that the curing agent at the contact position is cured.

[0073] Optionally, when the curing agent needs to be heated and solidified, the qPlus sensor cantilever and the probe coated with the curing agent can be heated to solidify the curing agent. Alternatively, when the curing agent needs to solidify over a certain period of time, the qPlus sensor cantilever and the probe coated with the curing agent can be placed at a specific temperature (e.g., room temperature) for a period of time to solidify the curing agent.

[0074] The above-mentioned curing agent selection and the method for solidifying the curing agent are examples. In actual application, various corresponding curing agents and solidification methods can be selected according to the needs of different scenarios and materials, and are not limited here.

[0075] After the qPlus sensor cantilever is brought into contact with the probe and cured using a curing agent, the qPlus sensor cantilever or the probe can be moved to remove the probe from the probe substrate.

[0076] In an embodiment of the present invention, optionally, when the qPlus sensor cantilever is rigidly fixed to the probe and the curing agent is cured, a position adjustment device, such as an XYZ micro-motion platform, can be used to retract the qPlus sensor cantilever or the probe so that the probe is separated from the base of the probe to transfer the probe to the qPlus sensor cantilever. In one example, if a cantilever for supporting the probe is included between the probe and the base of the probe, the cantilever or a portion thereof can also be transferred together to the qPlus sensor cantilever. In addition, in another example, if the qPlus sensor cantilever includes a connector for supporting the probe, the probe can be fixed to the connector and transferred to the end of the qPlus sensor cantilever.

[0077] According to the above-mentioned sensor probe preparation device of the embodiment of the present invention, a sensor preparation method can be provided to meet the requirements of compact, stable and high-resolution sensor preparation and measurement in ultra-low temperature measurement environments and other types of measurement environments, thereby cooperating with the acquisition and application of parameters such as atomic force and magnetism according to the different physical property measurement requirements of users.

[0078] Next, a sensor probe according to an example of an embodiment of the present invention is described. Figure 9 FIG. 1 shows a schematic diagram of the structure of a qPlus sensor probe according to an example of an embodiment of the present invention. Figure 9 As shown, the qPlus sensor probe may include: a qPlus sensor cantilever; and a probe, which may be a laser reflection atomic force microscope probe or a piezoresistive cantilever probe, fixed at the end of the qPlus sensor cantilever.

[0079] like Figure 9 As shown, optionally, the end of the qPlus sensor cantilever includes a connector fixed to the qPlus sensor cantilever and used to carry the probe, and the probe is connected to the qPlus sensor cantilever through the connector.

[0080] In an embodiment of the present invention, the probe may be, for example, a laser reflection atomic force microscope probe. For example, the probe may be a probe prepared based on a micromachining process, and its size may be, for example, less than 10um. For the above-mentioned probe, a magnetic probe may be formed by coating a magnetic material on the tip of the probe (such as coating a magnetic material on the tip of a silicon probe to form a magnetic silicon probe), or it may be a non-magnetic probe. In addition, for another example, the probe may also be a piezoresistive cantilever probe. The above types and descriptions of the probes to be prepared are all examples. In actual applications, various corresponding types of probes can be selected according to the specific needs of the user and the collected parameters, and there is no limitation here.

[0081] In one embodiment of the present invention, the probe removed from the probe base can be directly connected to the probe base; further, the probe can be connected to the probe base via a cantilever beam. When the probe is connected to the probe base via a cantilever beam, as shown in FIG. Figure 9 As shown, the probe may include a portion of the cantilever beam connected thereto when removed. Alternatively, the probe may be perpendicular to the cantilever beam.

[0082] In one example, the qPlus sensor may include a qPlus sensor cantilever beam for subsequently supporting the probe. Optionally, the qPlus sensor cantilever beam may be, for example, a quartz tuning fork. The qPlus sensor cantilever beam may be U-shaped, with one end secured to the qPlus sensor and the other end suspended in the air, allowing for free oscillation to connect to a probe and collect signals for atomic force microscopy or magnetic force microscopy.

[0083] In one example, to enable more precise and effective fixation with the probe, the end of the qPlus sensor cantilever can optionally include a connector fixed to the qPlus sensor cantilever and used to support the probe. In one example, the connector can optionally be a metal wire, such as a tungsten wire. The tungsten wire can be pre-processed to provide a sharp tip for supporting the probe.

[0084] The probe and the qPlus sensor cantilever or the connector can be fixed by a curing agent. Optionally, the curing agent can be epoxy resin glue or other various glues with comparable rigidity, which are not limited here.

[0085] Of course, the above-mentioned specific embodiments are merely examples and not limitations, and those skilled in the art can, based on the concept of the present invention, merge and combine some steps and devices from the various embodiments described separately above to achieve the effects of the present invention. Such merged and combined embodiments are also included in the present invention, and such merges and combinations are not described one by one here.

[0086] Note that the advantages, benefits, and effects mentioned in the present invention are merely illustrative and non-limiting, and should not be construed as necessarily possessed by each embodiment of the present invention. Furthermore, the specific details of the invention described above are provided for illustrative purposes and to facilitate understanding, and are not intended to be limiting. The details do not necessarily limit the present invention to being implemented using the specific details.

[0087] The block diagrams of the devices, apparatuses, equipment, and systems involved in the present invention are intended to be illustrative examples only and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As will be appreciated by those skilled in the art, these devices, apparatuses, equipment, and systems may be connected, arranged, or configured in any manner. Words such as "include," "comprise," "have," and the like are open-ended words, meaning "including but not limited to," and may be used interchangeably therewith. The words "or" and "and" used herein refer to the words "and / or" and may be used interchangeably therewith, unless the context clearly indicates otherwise. The word "such as" used herein refers to the phrase "such as but not limited to," and may be used interchangeably therewith.

[0088] The step flow charts and the above method descriptions in the present invention are intended to be illustrative examples only and are not intended to require or imply that the steps of the various embodiments must be performed in the order given. As will be appreciated by those skilled in the art, the order of the steps in the above embodiments can be performed in any order. Words such as "thereafter," "then," "next," and the like are not intended to limit the order of the steps; these words are only used to guide the reader through the description of these methods. In addition, any reference to an element in the singular, such as using the articles "a," "an," or "the," is not to be construed as limiting the element to the singular.

[0089] In addition, the steps and devices in the various embodiments of this document are not limited to being implemented in a certain embodiment. In fact, based on the concept of the present invention, relevant partial steps and partial devices in the various embodiments of this document can be combined to conceive new embodiments, and these new embodiments are also included in the scope of the present invention.

[0090] Each operation of the method described above may be performed by any suitable means capable of performing the corresponding functions, which may include various hardware and / or software components and / or modules, including but not limited to circuits, application specific integrated circuits (ASICs), or processors.

[0091] The various illustrated logic blocks, modules, and circuits may be implemented or performed using a general-purpose processor, a digital signal processor (DSP), an ASIC, a field programmable gate array signal (FPGA) or other programmable logic device (PLD), discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described herein. A general-purpose processor may be a microprocessor, but as an alternative, the processor may be any commercially available processor, controller, microcontroller, or state machine. A processor may also be implemented as a combination of computing devices, such as a combination of a DSP and a microprocessor, a plurality of microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration.

[0092] The steps of the method or algorithm described in conjunction with the present invention can be directly embedded in hardware, in a software module executed by a processor, or in a combination of the two. The software module can exist in any form of tangible storage medium. Some examples of storage media that can be used include random access memory (RAM), read-only memory (ROM), flash memory, EPROM memory, EEPROM memory, registers, hard disks, removable disks, CD-ROMs, etc. A storage medium can be coupled to a processor so that the processor can read information from the storage medium and write information to the storage medium. In an alternative embodiment, the storage medium can be integral to the processor. A software module can be a single instruction or many instructions and can be distributed over several different code segments, between different programs, and across multiple storage media.

[0093] The methods herein include one or more actions for implementing the methods described. The methods and / or actions may be interchangeable with one another without departing from the scope of the claims. In other words, unless a specific order of actions is specified, the order and / or use of the specific actions may be modified without departing from the scope of the claims.

[0094] The functions described can be implemented by hardware, software, firmware or any combination thereof. If implemented in software, the functions can be stored as one or more instructions on a tangible computer-readable medium. The storage medium can be any available tangible medium that can be accessed by a computer. By way of example and not limitation, such computer-readable media can include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage device or any other tangible medium that can be used to carry or store the desired program code in the form of instructions or data structures and can be accessed by a computer. As used herein, disc includes compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disk and Blu-ray disc.

[0095] Thus, a computer program product can perform the operations presented herein. For example, such a computer program product can be a computer-readable tangible medium having instructions tangibly stored (and / or encoded) thereon, the instructions being executable by one or more processors to perform the operations described herein. The computer program product can include packaging materials.

[0096] Software or instructions may also be transmitted via a transmission medium. For example, software may be transmitted from a website, server, or other remote source using a transmission medium such as coaxial cable, fiber optic cable, twisted pair, digital subscriber line (DSL), or wireless technologies such as infrared, radio, or microwave.

[0097] In addition, the modules and / or other appropriate means for performing the methods and techniques described herein can be downloaded and / or otherwise obtained by the user terminal and / or base station when appropriate. For example, such a device can be coupled to a server to facilitate the transmission of the means for performing the methods described herein. Alternatively, the various methods described herein can be provided via a storage component (e.g., RAM, ROM, a physical storage medium such as a CD or floppy disk) so that the user terminal and / or base station can obtain the various methods when being coupled to the device or providing a storage component to the device. In addition, any other appropriate technology for providing the methods and techniques described herein to a device can be utilized.

[0098] Other examples and implementations are within the scope and spirit of the invention and the appended claims. For example, due to the nature of software, the functions described above can be implemented using software executed by a processor, hardware, firmware, hardwiring, or any combination of these. Features that implement the functions can also be physically located in various locations, including being distributed so that parts of the functions are implemented at different physical locations. Moreover, as used herein, including as used in the claims, "or" used in a list of items that begin with "at least one" indicates a separate list, so that, for example, a list of "at least one of A, B, or C" means A or B or C, or AB or AC or BC, or ABC (i.e., A and B and C). In addition, the wording "exemplary" does not mean that the example described is preferred or better than other examples.

[0099] Various changes, substitutions, and modifications may be made to the technology described herein without departing from the teachings as defined by the appended claims. Moreover, the scope of the claims is not limited to the specific aspects of the processes, machines, manufacture, compositions of things, means, methods, and actions described above. Currently existing or later developed processes, machines, manufacture, compositions of things, means, methods, or actions that perform substantially the same function or achieve substantially the same results as the corresponding aspects described herein may be utilized. Accordingly, the appended claims include within their scope such processes, machines, manufacture, compositions of things, means, methods, or actions.

[0100] The above description of the invented aspects is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present invention. Therefore, the present invention is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features of the invention herein.

[0101] The above description has been presented for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of the present invention to the forms invented herein. Although a number of example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A probe preparation method comprising: A substrate for fixing a quality factor enhanced qPlus sensor probe, wherein the probe substrate is used to support the probe; Adjusting the position between the end of the qPlus sensor cantilever beam and the probe so that the end of the qPlus sensor cantilever beam is aligned with the rear end of the probe; Applying a curing agent to the area where the qPlus sensor cantilever is in contact with the rear end of the probe; placing the qPlus sensor cantilever in contact with the probe and curing the curing agent at the contact position; The qPlus sensor cantilever or the probe is moved to remove the probe from the probe base.

2. The method according to claim 1, wherein The base for fixing the probe includes: a base for fixing the probe via a spring sheet or a curing agent; The end of the qPlus sensor cantilever beam includes a connector fixed to the qPlus sensor cantilever beam and used to carry the probe; The probe is a laser reflection atomic force microscope probe or a piezoresistive cantilever probe; and / or The probe is a magnetic silicon probe or a non-magnetic probe.

3. The method according to claim 1, wherein The method further includes: adjusting the position between the qPlus sensor cantilever and the probe using a micro-motion platform; Wherein, the micro-motion platform is a micron-level XYZ micro-motion platform.

4. The method according to claim 1, wherein Adjusting the position between the end of the qPlus sensor cantilever beam and the probe so that the end of the qPlus sensor cantilever beam is aligned with the rear end of the probe includes: The position between the end of the qPlus sensor cantilever beam and the probe is adjusted in two mutually perpendicular directions so that the end of the qPlus sensor cantilever beam is aligned with the rear end of the probe.

5. The method according to claim 1, wherein The curing agent is epoxy resin glue; Bringing the qPlus sensor cantilever into contact with the probe and curing the curing agent at the contact position includes: heating the qPlus sensor cantilever and the probe coated with the curing agent to solidify the curing agent.

6. A probe preparation device comprising: A probe fixing seat, used to fix the base of the quality factor enhanced qPlus sensor probe, the base of the probe is used to support the probe; qPlus sensor fixing base, used to fix the qPlus sensor; A connecting device rigidly connects the position adjustment device to the probe holder or the qPlus sensor holder; A position adjustment device, which carries the probe holder or the qPlus sensor holder and is used to adjust the position between the end of the qPlus sensor cantilever beam and the probe, and align the end of the qPlus sensor cantilever beam with the rear end of the probe, Wherein, after the qPlus sensor cantilever is in contact with the probe and is cured using a curing agent, the position adjustment device is used to move the qPlus sensor cantilever or the probe so that the probe is removed from the base of the probe.

7. The device according to claim 6, wherein The probe fixing seat fixes the base of the probe through a spring sheet or a curing agent; The probe is a laser reflection atomic force microscope probe or a piezoresistive cantilever probe; and / or The probe is a magnetic silicon probe or a non-magnetic probe.

8. The device according to claim 6, wherein The position adjustment device is a micron-level XYZ fine-motion platform; The curing agent is epoxy resin glue; and / or The length, width and / or height of the connecting device is in the range of 5-20 cm.

9. The device according to claim 6, wherein The position adjustment device is used to adjust the position between the end of the qPlus sensor cantilever beam and the probe in two mutually perpendicular directions so that the end of the qPlus sensor cantilever beam is aligned with the rear end of the probe.

10. A sensor probe comprising: qPlus sensor cantilever beam; as well as A quality factor enhanced qPlus sensor probe is a laser reflection atomic force microscope probe or a piezoresistive cantilever probe, which is fixed at the end of the qPlus sensor cantilever.

Images