Test seat for reducing contact resistance by using mask plate method

Abstract

The invention relates to the technical field of module testing, in particular to a testing seat for reducing contact resistance through a mask plate method, which comprises a testing seat and a mask plate. A containing groove is formed in the testing seat, a plurality of probes are installed at the bottom of the containing groove, the probes are sleeved with elastic pieces, the elastic pieces are elastically connected with the probes, a covering plate is installed on the elastic pieces, the elastic pieces drive the covering plate to be away from the bottom of the containing groove, and a to-be-tested hole and an installation hole are formed in the covering plate. The mask plate is inserted into the mounting hole, the mask plate is made of a conductive material, a mounting groove is formed in the side, close to the probe, of the mask plate, the probe is inserted into the mounting groove, a plurality of probes are fixedly connected to the side, away from the probe, of the mask plate, and the number of the probes connected to the mask plate is larger than that of the connected probes. The multiple probes abut against the bonding pad, the number of contact points and the contact area of the probes and the bonding pad are increased, the contact resistance is reduced, and the production efficiency is improved.

Description

Technical Field

[0001] The present application relates to the technical field of module testing, and in particular to a test socket that uses a mask plate method to reduce contact resistance. Background Art

[0002] Power modules are power supplies that can be mounted directly on printed circuit boards. They are designed to power application-specific integrated circuits, digital signal processors, microprocessors, memory, programmable gate arrays, and other digital or analog loads. These modules are known as load power supply systems or point-of-use power supply systems. Due to their numerous advantages, power modules are widely used in communications applications such as switching equipment, access devices, mobile communications, microwave communications, optical transmission, and routers, as well as in automotive electronics, aerospace, and other fields.

[0003] When testing point-of-load power supply modules, a probe contact test method is typically used, where probes are fixed to a test socket. Currently, common test sockets on the market include the BGA series, QFN series, and BGA series, all of which utilize probe contact testing. In a probe contact test, each pin test point is assigned a specific probe. When power modules have a large number of pins, it's difficult to ensure that each probe is aligned, resulting in uneven contact between the probes and the power module pins.

[0004] Regarding the aforementioned related technologies, when power is applied and the load is energized, the probe tip carries a large current. Due to uneven contact between the probe and the power module pin, contact resistance is high where there is a large gap between the probe and the power module pin, and the probe tip carries a large current. At this time, discharge occurs in the gap between the probe and the power module pin, oxidizing the probe tip and further increasing the contact resistance, causing a decrease in the power module output voltage. This not only results in significant errors in the power module's electrical performance indicators, but also requires frequent probe repair and replacement during production testing, increasing testing costs and reducing production efficiency. Summary of the Invention

[0005] In order to reduce contact resistance, lower the frequency of probe repair and replacement, and improve production efficiency, the present application provides a test socket that uses a mask plate method to reduce contact resistance.

[0006] The present application provides a test socket for reducing contact resistance using a mask plate method, which adopts the following technical solution: A test socket for reducing contact resistance using a mask plate method, comprising: A test seat, wherein the test seat is provided with a receiving groove, a plurality of probes are installed at the bottom of the receiving groove, the probe cover is provided with an elastic member, the elastic member is elastically connected to the probe, a cover plate is installed on the elastic member, the elastic member drives the cover plate away from the bottom of the receiving groove, and the cover plate is provided with a hole to be tested and a mounting hole, the hole to be tested is used for a probe to pass through, and the mounting hole is used for a plurality of probes in the same functional area to pass through; A mask plate is inserted into the mounting hole. The mask plate is made of conductive material. A plurality of mounting grooves are provided on a side of the mask plate close to the probes. The plurality of probes are inserted into the mounting grooves one by one. A plurality of probes are fixedly connected to a side of the mask plate away from the probes. The number of probes connected to the mask plate is greater than the number of probes connected.

[0007] By adopting the above technical solution, mounting holes are opened on the cover plate near the probes in the same functional area of ​​the test socket to allow the probes in the same functional area to pass through. Then the mask plate is inserted into the mounting hole to ensure electrical connection between the probes, mask plate and probes.

[0008] When testing the module to be tested, the pads of the module to be tested are brought into contact with the plurality of probes on the mask plate, and then the test socket is powered on, thereby completing the test of the module to be tested.

[0009] During the test of the module to be tested, multiple probes are in contact with the pads, which increases the number of contact points and contact area between the probes and the pads, reduces the contact resistance between the probes and the module to be tested during the test, thereby improving the stability of the module to be tested during the test, improving production efficiency, reducing the possibility of damaging the test socket, and reducing production costs.

[0010] Optionally, a guiding slope is provided on one side of the mask plate close to the bottom of the accommodating groove.

[0011] By adopting the above technical solution, the setting of the guiding slope makes it easier for the mask plate to be inserted into the mounting hole.

[0012] Optionally, a plurality of the mounting holes and the mask plates are provided, and the mask plates are inserted into the mounting holes in a one-to-one correspondence.

[0013] By adopting the above technical solution, a mounting hole can be opened in each identical functional area, and the contact resistance of multiple functional areas can be reduced by using a mask plate and a probe, so that the probe on the test socket is less susceptible to damage.

[0014] Optionally, the probes on each of the mask plates are on the same plane.

[0015] By adopting the above technical solution, during the manufacturing process, it is convenient to process the probes on each mask plate on the same plane, thereby ensuring that the probes on the mask plate are located on the same plane when they abut against the pads of the module to be tested, making the contact between the probes and the pads of the module to be tested more stable and the contact resistance smaller.

[0016] Optionally, conductive silver glue is applied between the mask plate and the probe to fix the mask plate and the probe, and the end of the probe head and the end of the probe located in the hole to be measured are located in the same plane.

[0017] By adopting the above technical solution, the probe and the mask plate are fixedly connected using conductive silver glue, so that there is good conductivity between the probe and the mask plate, and the connection of the mask plate is more stable and not easy to shake at will.

[0018] Optionally, a locking piece is installed on the cover plate, and the locking piece is used to lock the mask plate and the cover plate.

[0019] By adopting the above technical solution, the mask plate and the cover plate are locked by using the locking piece, thereby reducing the possibility of the mask plate being separated from the installation hole.

[0020] Optionally, the locking member includes a locking spring, one end of which is inserted into the cover plate and the other end extends into the mounting hole. A locking groove is provided on the mask plate so that the locking spring is inserted into the locking groove.

[0021] By adopting the above technical solution, when the mask plate is inserted into the mounting hole, the locking spring is inserted into the locking groove, and the locking spring limits the locking groove, thereby reducing the possibility of the mask plate detaching from the mounting hole.

[0022] Optionally, the locking spring is passed between the two probes, and an abutment rod is fixedly connected between the probes. The abutment rod is located on a side of the locking spring close to the bottom of the accommodating groove, and the abutment rod is used to abut the locking spring.

[0023] By adopting the above technical solution, when testing the module, the module to be tested presses the cover plate so that the cover plate moves toward the bottom of the receiving groove, the elastic member is compressed, and the probe passes through the test hole and contacts the pad of the module to be tested.

[0024] As the cover plate moves toward the bottom of the accommodating groove, the abutment rod abuts against the locking spring piece, causing the locking spring piece to bend, so that the end of the locking spring piece extending to the mounting hole is retracted into the cover plate, thereby releasing the locking spring piece from the mask plate, causing the mask plate to be lifted by the probe, thereby causing the probe to abut against the solder pad of the module to be tested.

[0025] When the test is completed, the module to be tested and the cover plate are driven by the elastic member to slowly move away from the bottom of the accommodating groove. At this time, the mask plate is inserted into the mounting hole again, and the locking spring is reset to lock the mask plate again.

[0026] When the mask plate needs to be replaced, the cover plate can be pressed directly. When the cover plate moves downward, the abutment rod abuts against the locking spring piece, causing the locking spring piece to bend, thereby releasing the lock of the locking spring piece on the mask plate, so that the mask plate is lifted by the probe, and then the mask plate is pushed out of the mounting hole, making it easier to disassemble the mask plate.

[0027] Optionally, a groove is provided in the cover plate, the cross section of the groove is arc-shaped, and a protrusion is provided on the abutment rod, and the protrusion matches the groove so that the protrusion can squeeze the locking spring into the groove.

[0028] By adopting the above technical solution, the arc-shaped groove and the protrusion cooperate with each other, so that the locking spring is not easily squeezed by the protrusion and bent, causing the locking spring to fail, thereby extending the service life of the locking spring.

[0029] Optionally, a side of the mask plate away from the bottom of the accommodating groove is located in the mounting hole, so that the probe is located in the mounting hole, or an end of the probe away from the mask plate is flush with the surface of the cover plate.

[0030] By adopting the above technical solution, when testing the module to be tested, the pad of the module to be tested is made to abut against the cover plate, thereby preventing the module to be tested from being abutted by the probe when the module to be tested is placed, causing the module to be tilted.

[0031] In summary, this application includes at least one of the following beneficial technical effects: By cooperating with the test socket, probes, elastic parts, cover plates, mounting holes, mask plates, and probes, multiple probes are brought into contact with the pads of the module under test during the test process, thereby increasing the number of contact points and contact area between the probes and the pads, reducing the contact resistance between the probes and the module under test during the test process, and thus improving the stability of the module under test during the test process, thereby achieving the effects of improving production efficiency, reducing the possibility of damaging the test socket, and reducing production costs; By applying conductive silver glue between the mask plate and the probe, the mask plate and the probe are fixedly connected, and the probe is installed on the same plane as the probes in other areas, so that the mask plate is installed more stably during installation and testing, and is not easy to shake at will; The mask plate is locked on the cover plate by the cooperation of the cover plate, the mask plate, the locking spring and the abutment rod. The locking of the mask plate by the locking spring can be released by pressing the cover plate, thereby facilitating the replacement of the mask plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 This is a structural schematic diagram of a test socket for reducing contact resistance using a mask plate method in Example 1 of the present application.

[0033] Figure 2 This is an exploded view of the test socket in Example 1 of the present application.

[0034] Figure 3 It is a structural schematic diagram of the mask plate in Example 1 of the present application.

[0035] Figure 4 This is an exploded view of the probe in Example 1 of the present application.

[0036] Figure 5 This is a schematic diagram of the structure of the test socket in Example 2 of the present application.

[0037] Figure 6 yes Figure 5 Cross-sectional view at AA in the middle.

[0038] Figure 7 yes Figure 6 Enlarged view of point B in the middle.

[0039] Description of reference numerals: 1. Test seat; 11. Receiving groove; 12. Limit rod; 2. Mask plate; 21. Mounting groove; 22. Probe; 23. Guide slope; 24. Locking groove; 3. Probe; 31. Elastic member; 311. Spring; 312. Sliding sleeve; 4. Cover plate; 41. Hole to be tested; 42. Mounting hole; 43. Groove; 5. Cover plate; 51. Pressing plate; 52. Knob; 53. Snap-fit ​​ear; 6. Locking member; 61. Locking spring; 62. Abutting rod; 63. Bump. DETAILED DESCRIPTION

[0040] The following is combined with Figure 1-7 This application is described in further detail.

[0041] The embodiment of the present application discloses a test socket that reduces contact resistance using a mask plate method. Example

[0042] Reference Figure 1-3A test socket for reducing contact resistance by using a mask plate method includes a test socket 1 and a mask plate 2. A receiving groove 11 is provided on the test socket 1, and a plurality of probes 3 are installed at the bottom of the receiving groove 11. An elastic member 31 is sleeved on the probe 3, and the elastic member 31 is elastically connected to the probe 3. A cover plate 4 is installed on the elastic member 31, and the elastic member 31 drives the cover plate 4 away from the bottom of the receiving groove 11. A test hole 41 and a mounting hole 42 are provided on the cover plate 4. The test hole 41 is used for one probe 3 to pass through, and the mounting hole 42 is used for multiple probes 3 in the same functional area to pass through. The mask plate 2 is inserted into the mounting hole 42. The mask plate 2 is made of a conductive material. A mounting groove 21 is provided on the side of the mask plate 2 close to the probe 3. The probe 3 is inserted into the mounting groove 21. A plurality of probes 22 are fixedly connected to the side of the mask plate 2 away from the probe 3. The number of probes 22 connected to the mask plate 2 is greater than the number of probes 3 connected.

[0043] During the test process of the module to be tested, multiple probes 22 are used to abut against the pads of the module to be tested, which increases the number of contact points and contact area between the probes 22 and the pads of the module to be tested, thereby reducing the contact resistance between the probes 3 and the module to be tested during the test process, thereby improving the stability of the module to be tested during the test process, improving production efficiency, reducing the possibility of damaging the test socket, and reducing production costs.

[0044] The test seat 1 in this embodiment is also rotatably connected to a cover plate 5, and a pressure plate 51 is inserted into the cover plate 5. The part of the pressure plate 51 that passes through the cover plate 5 is connected to a limiting block so that the pressure plate 51 can only slide in a direction perpendicular to the cover plate 5. The end of the cover plate 5 away from the test seat 1 is threadedly connected to a knob 52, and the knob 52 is clamped on the side of the cover plate 5 away from the test seat 1 so that the knob 52 can only rotate on the cover plate 5.

[0045] One side of the test socket 1 is fixedly connected to a limit rod 12 , and a snap-in ear 53 is rotatably connected to the cover 5 . The test socket 1 and the cover 5 are closed by snapping the snap-in ear 53 onto the limit rod 12 .

[0046] Reference Figure 2 and 4 The elastic member 31 includes a spring 311 and a sliding sleeve 312. The sliding sleeve 312 is mounted on the probe 3. One end of the spring 311 is fixedly connected to the probe 3, and the other end is fixedly connected to the sliding sleeve 312. The spring 311 drives the sliding sleeve 312 to move away from the bottom of the receiving groove 11. The cover plate 4 overlaps the sliding sleeve 312, so that when the spring 311 drives the sliding sleeve 312 to move away from the bottom of the receiving groove 11, the cover plate 4 is simultaneously driven to move away from the bottom of the receiving groove 11.

[0047] When testing the module to be tested, first open the cover plate 5, place the module to be tested on the cover plate 4, cover the cover plate 5 and make the snap-on ear 53 snap onto the limit rod 12, rotate the knob 52 to make the pressure plate 51 press the module to be tested, and the module to be tested presses the cover plate 4, and the cover plate 4 compresses the spring 311 until the probe 3 located in the hole to be tested 41 and the probe head 22 on the mask plate 2 abut against the pad of the module to be tested, and then start testing the module to be tested.

[0048] The mask plate 2 can be made of silver or copper. To save costs, copper is used in this embodiment. The size of the mask plate 2 is precisely matched to the size of the mounting hole 42, so that the sidewalls of the mask plate 2 fit snugly against the inner sidewalls of the mounting hole 42. This makes the mask plate 2 more stable when inserted into the mounting hole 42.

[0049] In this embodiment, there are two probes 3 in the same functional area. The same functional area means that the test socket contains similar circuit elements, signal transmission paths, or other related functions, so similar test steps or test methods can be used for testing. Mounting holes 42 are opened in the area where two adjacent probes 3 in the same functional area are located on the cover plate 4, and the ends of the probes 3 in the same functional area are processed into a columnar shape. The columnar probes 3 are conveniently inserted into the mounting grooves 21 of the mask plate 2. Five probes 22 are fixedly connected to the cover plate 4. The position and shape of the probes 22 can be set according to the pads of the module to be tested in the corresponding area.

[0050] Since the pads of the module to be tested are usually larger than the actual contact area of ​​the probe 3, in this embodiment, five probes 22 are used to abut the pads of the module to be tested, so that the five probes 22 can abut the edge positions of the pads of the module to be tested. Compared with two probes 3 abutting the pads of the module to be tested, the contact points and contact area with the pads of the module to be tested are greatly increased, thereby reducing the contact resistance.

[0051] Since the probes 3 are relatively small and densely packed on the test socket 1, it is difficult to improve the area where a single probe 3 is located in the existing process. In order to increase the number of contact points and contact area between the probe 3 and the pad of the module under test, thereby reducing the contact resistance between the probe 3 and the module under test (for specific formulas, please refer to Yang Jinghua's "A Brief Discussion on the Calculation Method of Contact Resistance and Electrodynamic Repulsion of Isolation Contacts"), this application integrates the probe 3 areas in the same functional area of ​​the module under test, and uses laser to separate the corresponding areas of the cover plate 4 and the probe 3, thereby increasing the operable area. This facilitates increasing the number of contact points and contact area between the pad and the probe 22 in the same functional area of ​​the module under test, thereby reducing the contact resistance between the probe 3 and the module under test.

[0052] Reference Figure 2 and Figure 3In an optional embodiment, a guide slope 23 is provided on one side of the mask plate 2 close to the bottom of the accommodating groove 11. The setting of the guide slope 23 reduces the area of ​​an end face of the mask plate 2 close to the end of the accommodating groove 11, making it easier for the mask plate 2 to be inserted into the mounting hole 42.

[0053] There are multiple mounting holes 42 and mask plate 2. In this embodiment, there are three mounting holes 42 and mask plate 2. The number of mounting holes 42 can be divided according to the functional area of ​​the module to be tested. The cover plate 4 around the probe 3 for testing the same functional area can be provided with mounting holes 42, and the mask plates 2 are inserted into the mounting holes 42 one by one.

[0054] The cover plate 4 corresponding to each identical functional area can be provided with a mounting hole 42 , and the mask plate 2 and the probe 22 can be used to reduce the contact resistance of each functional area, making the probes 3 of multiple functional areas on the test socket 1 less susceptible to damage.

[0055] Due to the large number of probes 3, it is difficult to ensure that all probes 3 on the test socket 1 are located on the same plane during the processing. However, since each mask plate 2 has five probes 22, it is easier to process the probes 22 on the mask plate 2 to be located on the same plane. Probes 22 on the same plane are less likely to form gaps when contacting the pads of the module under test, making the test process of the module under test more stable.

[0056] The probes 22 on each mask plate 2 are all on the same plane, thereby ensuring that the probes 22 on each mask plate 2 can be located on the same plane when abutting against the module pads, making the contact between the probes 22 in each functional area and the module pads more stable, thereby reducing the contact resistance.

[0057] In order to prevent the mask plate 2 from falling off during use after being installed on the probe 3, conductive silver glue is applied between the mask plate 2 and the probe 3. The conductive silver glue is used to fix the mask plate 2 and the probe 3, and the conductive silver glue is used to fix the probe 3 and the mask plate 2. This ensures good conductivity between the probe 3 and the mask plate 2, and at the same time makes the connection of the mask plate 2 more stable and not easy to shake at will.

[0058] The end of the probe 22 on the mask plate 2 and the end of the probe 3 located in the hole to be tested 41 are located in the same plane, so that when the probe 22 on the mask plate 2 contacts the pad on the module to be tested, the end of the probe 3 can also contact the pad, thereby avoiding poor contact between the probe 3 or the probe 22 and the pad on the module to be tested.

[0059] The implementation principle of Example 1 of the present application is as follows: determine the same functional area of ​​the module to be tested, then open the mounting hole 42 of the corresponding area on the cover plate 4, and replace the end of the probe 3 located in the area of ​​the mounting hole 42 with a columnar shape, and apply conductive silver glue to the end of the probe 3, then make the mounting groove 21 on the mask plate 2 correspond to the probe 3, and insert the probe 3 into the mounting groove 21, and at the same time make the end of the probe 22 and the end of the probe 3 in other areas be in the same plane.

[0060] When testing the module to be tested, the module to be tested is mounted on the cover plate 4, then covered with the cover plate 5, and the knob 52 is rotated so that the pressure plate 51 abuts the module to be tested against the probe 3 and the probe 22 abuts against the pad of the module to be tested, and then the module to be tested is tested.

[0061] During the test, multiple probes 22 are used to abut against the pads, which increases the number of contact points and contact area between the probes 22 and the pads, thereby reducing the contact resistance between the probes 3 and the module to be tested during the test, thereby improving the stability of the module during the test, improving production efficiency, reducing the possibility of damaging the test socket, and reducing production costs. Example

[0062] During the testing of the module under test, the end of the probe 22 is most likely to discharge, causing oxidation. Once oxidation occurs, the entire mask plate 2 must be replaced. However, in Example 1, the mask plate 2 and the probe 3 are fixedly connected by conductive silver glue, making the mask plate 2 in Example 1 inconvenient to replace.

[0063] Reference Figure 5-7 The difference between Example 2 and Example 1 is that in Example 2, a locking member 6 is used to lock the mask plate 2 and the cover plate 4 to prevent the mask plate 2 from detaching from the cover plate 4, and at the same time, the locking member 6 can be used to unlock the cover plate 4 to replace the cover plate 4.

[0064] The locking member 6 includes a locking spring piece 61 and an abutment rod 62. One end of the locking spring piece 61 is inserted into the cover plate 4, and the other end extends into the mounting hole 42. The end located in the cover plate 4 is fixedly connected to the cover plate 4. A locking groove 24 is provided on the mask plate 2. When the mask plate 2 is inserted into the mounting hole 42, the locking spring piece 61 is inserted into the locking groove 24. The locking spring piece 61 is used to limit the locking groove 24, thereby reducing the possibility of the mask plate 2 detaching from the mounting hole 42.

[0065] Furthermore, since the mask plate 2 is provided with a guide bevel 23 on one side near the bottom of the receiving groove 11, the guide bevel 23 not only facilitates the insertion of the mask plate 2 into the mounting hole 42, but also allows the guide bevel 23 and the locking groove 24 to be located on the same side of the mask plate 2. Thus, when the mask plate 2 is installed in the mounting hole 42, the guide bevel 23 first abuts against the locking spring 61, causing the locking spring 61 to retract into the cover plate 4 under the gradual pressure of the guide bevel 23, thereby facilitating the mask plate 2 to continue moving toward the interior of the mounting hole 42 until the locking groove 24 moves to a position corresponding to the locking spring 61, at which point the locking spring 61 pops out again, locking the mask plate 2 to the cover plate 4.

[0066] When the locking spring 61 locks the mask plate 2 on the cover plate 4, the side of the mask plate 2 away from the bottom of the receiving groove 11 is located in the mounting hole 42, and the probe 22 is located in the mounting hole 42, or the end of the probe 22 away from the mask plate 2 is flush with the surface of the cover plate 4. In this embodiment, it is preferred that the end of the probe 22 away from the mask plate 2 is flush with the surface of the cover plate 4. Since the module to be tested is placed on the cover plate 4, in order to prevent the module to be tested from directly abutting against the probe 22 when the pressure plate 51 presses the module to be tested, thereby causing damage to the end of the probe 22, the end of the probe 22 is completely accommodated in the mounting hole 42, thereby preventing the module to be tested from being abutted by the probe 22 when the module to be tested is placed, thereby preventing the module to be tested from being uneven and causing damage to the end of the probe 22.

[0067] The locking spring piece 61 in this embodiment is inserted between two adjacent probes 3, and the abutment rod 62 is fixedly connected to the probe 3 or the test socket 1. The abutment rod 62 is located on the side of the locking spring piece 61 close to the bottom of the accommodating groove 11. When the cover plate 4 moves toward the bottom of the accommodating groove 11, the abutment rod 62 can abut against the locking spring piece 61.

[0068] The abutting rod 62 abuts against the locking spring piece 61, causing the locking spring piece 61 to deform, thereby shrinking the portion extending into the mounting hole 42 into the cover plate 4, and then causing the locking spring piece 61 to disengage from the locking groove 24, releasing the locking spring piece 61 from the mask plate 2.

[0069] In an alternative embodiment, a groove 43 is formed in the cover plate 4. The cross-section of the groove 43 is arc-shaped. The arc-shaped groove 43 facilitates a better transition when the locking spring 61 is deformed, thereby facilitating the resetting of the locking spring 61. A protrusion 63 is fixedly connected to the abutment rod 62. The protrusion 63 matches the groove 43 so that the protrusion 63 can squeeze the locking spring 61 into the groove 43.

[0070] The arc-shaped groove 43 and the protrusion 63 cooperate to prevent the locking spring 61 from bending significantly when repeatedly squeezed, thereby preventing the locking spring 61 from losing its shape and thus preventing the locking spring 61 from failing. The squeezing effect of the arc-shaped groove 43 and the protrusion 63 ensures that the locking spring 61 can rebound effectively even when repeatedly bent, thereby extending the service life of the locking spring 61.

[0071] The implementation principle of Example 2 is as follows: when the mask plate 2 needs to be replaced, the cover plate 4 is manually pressed to move the cover plate 4 toward the bottom of the receiving groove 11. At this time, the abutment rod 62 abuts against the locking spring 61, causing the locking spring 61 to bend. The end of the locking spring 61 extending to the mounting hole 42 shrinks into the cover plate 4, and the locking spring 61 disengages from the locking groove 24, releasing the lock on the mask plate 2. At this time, the probe 3 is inserted from the mounting groove 21 into the mask plate 2 and abuts against the mask plate 2. The mask plate 2 is abutted by the probe 3 and disengaged from the mounting hole 42. The cover plate 4 is released and is quickly reset by the elasticity of the elastic member 31. At this time, the mounting groove 21 cannot enter the mounting hole 42 due to the friction between the mounting groove 21 and the inner wall of the mounting hole 42, causing the probe 3 to disengage from the mounting groove 21 and the mask plate 2 to fall onto the cover plate 4, thereby completing the removal of the mask plate 2.

[0072] Align the mask plate 2 to be replaced with the mounting hole 42 , and press the mask plate 2 until the locking spring piece 61 is inserted into the locking groove 24 , thereby completing the installation of the mask plate 2 .

[0073] When testing the module to be tested, the knob 52 is rotated to cause the pressure plate 51 to press the module to be tested and move it, so that the pad of the module to be tested abuts against the probe 3 or the probe head 22. At this time, the module to be tested will also press the cover plate 4 to move toward the bottom of the receiving groove 11. Since the cover plate 4 moves toward the bottom of the receiving groove 11, the abutting rod 62 abuts against the locking spring 61, causing the locking spring 61 to bend, so that the end of the locking spring 61 extending to the mounting hole 42 shrinks into the cover plate 4, thereby releasing the lock of the locking spring 61 on the mask plate 2. At this time, the mask plate 2 is lifted by the probe head 3, so that the probe head 22 on the mask plate 2 abuts against the pad of the module to be tested. When testing the module to be tested, the mask plate 2 can be detached from the cover plate 4, so that the probe head 22 can be better fitted with the pad of the module to be tested.

[0074] When the test is completed, the knob 52 is rotated in the opposite direction to make the pressure plate 51 gradually move away from the bottom of the accommodating groove 11. At this time, the module to be tested and the cover plate 4 are slowly driven away from the bottom of the accommodating groove 11 by the elastic member 31. The mask plate 2 is squeezed by the module to be tested and inserted into the mounting hole 42 again until the locking spring 61 is reset to lock the mask plate 2 again. Therefore, after the module to be tested is taken out, the mask plate 2 is still locked in the mounting hole 42, which is convenient for continuous testing of the module to be tested.

[0075] The provision of the locking member 6 in this embodiment not only facilitates the disassembly and replacement of the mask plate 2, but also allows the mask plate 2 to be detached from the mounting hole 42 and abut against the pad of the module to be tested when the module to be tested is being tested. After the test is completed, the mask plate 2 can be installed back into the mounting hole 42, allowing the test seat to perform continuous testing, thereby greatly improving the test efficiency.

[0076] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A test socket for reducing contact resistance using a mask plate method, characterized in that: include: A test seat (1), wherein a receiving groove (11) is provided on the test seat (1), a plurality of probes (3) are installed at the bottom of the receiving groove (11), an elastic member (31) is sleeved on the probe (3), the elastic member (31) is elastically connected to the probe (3), a cover plate (4) is installed on the elastic member (31), the elastic member (31) drives the cover plate (4) away from the bottom of the receiving groove (11), and a hole to be tested (41) and a mounting hole (42) are provided on the cover plate (4), the hole to be tested (41) is used for one probe (3) to pass through, and the mounting hole (42) is used for multiple probes (3) in the same functional area to pass through; A mask plate (2) is inserted into the mounting hole (42), the mask plate (2) is made of a conductive material, a mounting groove (21) is provided on a side of the mask plate (2) close to the probe (3), the probe (3) is inserted into the mounting groove (21), and a plurality of probes (22) are fixedly connected to a side of the mask plate (2) away from the probe (3), and the number of the probes (22) connected to the mask plate (2) is greater than the number of the probes (3) connected.

2. The test socket for reducing contact resistance by using a mask method according to claim 1, characterized in that: A guiding slope (23) is provided on one side of the mask plate (2) close to the bottom of the accommodating groove (11).

3. The test socket for reducing contact resistance by using a mask method according to claim 1, characterized in that: A plurality of the mounting holes (42) and the mask plates (2) are provided, and the mask plates (2) are inserted into the mounting holes (42) in a one-to-one correspondence.

4. The test socket for reducing contact resistance by using a mask method according to claim 3, characterized in that: The probes (22) on each mask plate (2) are on the same plane.

5. A test socket for reducing contact resistance using a mask method according to any one of claims 1 to 4, characterized in that: Conductive silver glue is applied between the mask plate (2) and the probe (3) to ensure that the mask plate (2) and the probe (3) are fixedly connected, and the end of the probe (22) and the end of the probe (3) located in the hole to be measured (41) are located in the same plane.

6. A test socket for reducing contact resistance using a mask method according to any one of claims 1 to 4, characterized in that: A locking piece (6) is installed on the cover plate (4), and the locking piece (6) is used to lock the mask plate (2) and the cover plate (4).

7. The test socket for reducing contact resistance by using a mask method according to claim 6, characterized in that: The locking member (6) comprises a locking spring (61), one end of the locking spring (61) is inserted into the cover plate (4), and the other end extends into the mounting hole (42), and a locking groove (24) is provided on the mask plate (2) so that the locking spring (61) is inserted into the locking groove (24).

8. The test socket for reducing contact resistance by using a mask method according to claim 7, characterized in that: The locking spring (61) is inserted between the two probes (3), and an abutment rod (62) is fixedly connected between the probes (3). The abutment rod (62) is located on one side of the locking spring (61) close to the bottom of the accommodating groove (11), and the abutment rod (62) is used to abut the locking spring (61).

9. The test socket for reducing contact resistance by using a mask method according to claim 8, characterized in that: A groove (43) is provided in the cover plate (4), and the cross section of the groove (43) is arc-shaped. A protrusion (63) is provided on the abutting rod (62), and the protrusion (63) matches the groove (43) so that the protrusion (63) can squeeze the locking spring (61) into the groove (43).

10. The test socket for reducing contact resistance by using a mask method according to claim 6, characterized in that: The side of the mask plate (2) away from the bottom of the accommodating groove (11) is located in the mounting hole (42), so that the probe (22) is located in the mounting hole (42), or the end of the probe (22) away from the mask plate (2) is flush with the surface of the cover plate (4).

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