Electronic equipment mainboard detection device

Abstract

The invention relates to the technical field of electronic equipment testing, and provides an electronic equipment mainboard detection device, which comprises a test board; the placement table is mounted in the front middle of the top of the test board; the vertical frame is mounted on the rear side of the top of the test board, and a cylinder is mounted at the upper part of the front end of the vertical frame; a needle plate is mounted at the bottom of the assembly table, and a plurality of probes are mounted on the needle plate; a sealing cavity, an isolation cavity and a detection cavity are sequentially formed in the probe from bottom to top, and the three cavities are communicated with one another; the bottom of the sealing cavity is provided with a flexible contact, and the sealing cavity and the flexible contact are filled with methyl silicone oil. During use, the flexible contact structure of the probe head is improved, and a spring fluctuation detection mechanism is matched, so that hard damage of a mainboard caused by spring jamming is avoided, the defective probe can be accurately positioned, the detection reliability is effectively improved, and the process risk caused by poor contact or signal abnormity is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic equipment testing, and more particularly to an electronic equipment mainboard detection device. Background Art

[0002] With the rapid development of electronic technology, the core motherboards of highly integrated electronic devices (such as computers and servers) carry key components such as CPUs, memory, and chipsets. Their performance and reliability directly affect the performance of the entire device. Therefore, it is crucial to conduct efficient and accurate electrical performance testing of the motherboard during production, manufacturing, maintenance, and quality control.

[0003] In-circuit testing (ICT) is a key inspection process in motherboard production. It uses metal probes to contact test points on the motherboard. When the motherboard is powered on, it obtains parameters such as voltage and current of the measurement circuit, thereby evaluating the circuit's connection performance and parameter accuracy.

[0004] In ICT testing, the needle tip of a traditional probe generally adopts rigid contact with the test point. When the internal spring jams due to high-frequency use, the needle loses its buffering ability. The direct collision between the rigid materials will generate instantaneous impact loads, which can easily cause cracks in the motherboard pad or deformation of the pins. In addition, long-term reciprocating motion will cause spring fatigue. The needle tip cannot maintain the preset stroke and it is difficult to effectively pierce the oxide layer on the surface of the pad, resulting in unstable contact resistance. If such faults are not identified and corrected in time, not only will the integrity of the test signal be significantly reduced, but also defective products will flow into the downstream process due to misjudgment, increasing rework costs and quality risks.

[0005] To this end, the present application proposes an electronic device mainboard detection device to solve the above problems. Summary of the Invention

[0006] Technical problem to be solved: In view of the problems existing in the prior art, the purpose of the present invention is to provide an electronic equipment motherboard detection device, which solves the problem of traditional probes in ICT testing causing pad damage and unstable contact resistance due to rigid contact and spring jamming and fatigue, resulting in reduced test signal integrity and the flow of defective products into the subsequent process.

[0007] To solve the above technical problems, the present invention provides the following technical solutions: A device for detecting a motherboard of an electronic device, comprising: a test bench; a placement table installed at the front-middle portion of the top of the test bench; a vertical frame installed at the rear side of the top of the test bench, a cylinder installed at the upper front end of the vertical frame, and an assembly table installed at the telescopic end of the cylinder; a needle plate installed at the bottom of the assembly table, and a plurality of probes installed on the needle plate; a sealed cavity, an isolation cavity and a detection cavity are sequentially opened inside the probe from bottom to top, and the three cavities are interconnected; a flexible contact is installed at the bottom of the sealed cavity, and both the sealed cavity and the flexible contact are filled with methyl silicone oil; an extrusion block slides in the isolation cavity, and the top of the extrusion block is connected to the top wall of the isolation cavity by a first spring; a sleeve is installed on the top wall of the detection cavity, and a linkage block slides in the sleeve, the top of the linkage block is connected to the top wall of the sleeve by a second spring, and the bottom of the linkage block is connected to the top of the extrusion block by a rigid straight bar; a contact assembly is installed on the lower inner wall of the detection cavity, and the contact assembly is in conflict with the rigid straight bar; an alarm assembly is installed on the top of the assembly table, and the alarm assembly is electrically connected to the contact assembly.

[0008] In a new embodiment, a sealing kit is provided at the bottom of the extrusion block, and the extrusion block and the sealing kit isolate the methyl silicone oil in the sealing cavity from leaking out; the inner wall of the flexible contact is embedded with a fluororubber lining layer with a thickness of 0.5 to 1 mm through a molding process.

[0009] In a new embodiment, the inner walls of the sealing cavity and the isolation cavity are both coated with a zinc-aluminum alloy by a thermal spraying process.

[0010] In a new embodiment, a guide hollow column is vertically installed in the middle of the bottom end of the sleeve, and a rigid straight bar slides inside the guide hollow column.

[0011] In a new embodiment, a sleeve block is installed on the rigid straight bar, and the sleeve block is located in the detection cavity; four convex blocks are respectively provided on the left and right sides and the upper and lower parts of the sleeve block.

[0012] In a new embodiment, the left and right sides of the upper portion of the sleeve are connected to one end of the air pipe, and the other end of the air pipe passes through the inner wall of the detection cavity and is connected to the external air.

[0013] In a new embodiment, the flexible contact is located in the middle of the bottom end of the probe, and a contact ring is installed on the outer side of the bottom of the probe, and the contact ring is located on the outer side of the flexible contact.

[0014] In a new embodiment, the contact assembly includes: an insulating wall block, which is installed on the left and right sides of the lower inner wall of the detection chamber; sensing contacts are provided on the upper and lower parts of the inner side of the insulating wall block; an external ring, which is mounted on the middle part of the outer wall of the probe, and a wire is buried in the external ring, one end of the wire is connected to multiple sensing contacts, and the other end extends to the outside of the external ring to form a wire interface.

[0015] In a new embodiment, the sensing contact contacts contact with the bump block, the surface of the sensing contact is covered with a gold-plated layer with a thickness of 0.1 to 0.3 mm, and the surface of the bump block is formed with a nickel-phosphorus alloy wear-resistant layer by electroplating.

[0016] In a new embodiment, the alarm component includes: a mounting plate installed on the top of the assembly table; a plurality of frame grooves are arranged equidistantly on the mounting plate, an alarm is provided in the frame groove, and the alarm is connected to the wire interface located in the middle of the probe through a wire.

[0017] Beneficial effects: Compared with the prior art, the advantages of the present invention are: 1. The present application improves the needle tip of the probe so that when it detects the test points of the mainboard of the electronic device, it can use the flexible contact of the probe to avoid hard damage to the test points of the mainboard of the electronic device caused by the hard contact of the probe needle when the spring is stuck. At the same time, by detecting the fluctuation of the spring, the problem probe can be accurately located and replaced, which effectively improves the reliability of the mainboard detection and avoids the problems of damage to the pad, unstable contact resistance, and test signal integrity, which may cause defective products to flow into the later process.

[0018] 2. During the motherboard testing process, the cylinder drives the assembly table and the needle plate to descend, and the flexible contact of the probe contacts the test point of the motherboard first. As the probe is continuously pressed down, it deforms inward, and then squeezes the methyl silicone oil filled in it to impact the extrusion block in the isolation cavity upward. The movement of the extrusion block is synchronized to the linkage block through the connected rigid straight bar, so that the linkage block slides upward in the sleeve, thereby completing the pressure transmission of the flexible contact, realizing flexible contact with the test point of the motherboard, and eliminating the problem of damage to the probe and the motherboard caused by spring jamming. At the same time, the first spring and the second spring are used to provide rapid reset for the subsequent flexible contacts, and the contact ring on the outside of the flexible contact is used as a backup conductive path to ensure detection continuity.

[0019] 3. Since the methyl silicone oil flowing in the sealing chamber and the isolation chamber is liquid, it needs to be strictly sealed to prevent leakage. A triple leakage-proof barrier is constructed by the sealing kit at the bottom of the extrusion block, the fluororubber lining layer on the inner wall of the flexible contact, and the zinc-aluminum alloy coating on the inner wall of the sealing chamber and the isolation chamber to ensure that the methyl silicone oil works in a stable sealing environment and avoid pressure conduction failure caused by leakage.

[0020] 4. The upward movement of the linkage block will cause the upper volume of the sleeve to decrease and the air pressure to increase. At this time, the air above the sleeve is discharged to the outside through the air pipe to avoid the formation of high-pressure air resistance. After the test is completed, the elastic recovery of the second spring drives the linkage block to move down and reset. The upper volume of the sleeve increases, the air pressure decreases, and the outside air flows into the upper space of the sleeve through the air pipe, so that the air pressure in the space is balanced with the atmospheric pressure. This process avoids the formation of negative pressure to hinder the reset of the linkage block, ensuring that the rigid straight bar falls back synchronously and accurately. If there is no air pipe connection, the air pressure in the upper space of the sleeve will rise sharply when the linkage block moves upward, forming air resistance and causing the rigid straight bar to move stuck.

[0021] 5. By setting the contact assembly and the alarm assembly, the hidden dangers of spring fatigue can be monitored in real time in the initial state when the needle plate has not dropped. First, when the elastic coefficient of the spring changes due to fatigue, the extrusion block and the linkage block connected to it move up slightly due to the weakening of the elastic force, thereby driving the synchronous displacement of the rigid straight bar. The convex block on the sleeve block on the rigid straight bar and the sensing contact on the insulating wall block will produce a misalignment offset. The displacement offset causes the sensing contact to be triggered and transmits the alarm signal to the alarm to sound a buzzer alarm, thereby realizing an early warning of the risk of decreased probe detection accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention.

[0023] Figure 2 It is a front side view of the present invention.

[0024] Figure 3 It is a schematic diagram of the structure of the alarm component of the present invention.

[0025] Figure 4 It is a schematic diagram of the needle plate structure of the present invention.

[0026] Figure 5 Schematic diagram of the external structure of the probe of the present invention.

[0027] Figure 6 Schematic diagram of the internal structure of the probe of the present invention.

[0028] Figure 7 It is a schematic diagram of the concave state of the flexible contact of the present invention.

[0029] The figures in the figure are marked as follows: 1. test bench; 2. placement table; 3. vertical stand; 4. cylinder; 5. assembly table; 6. needle plate; 7. probe; 71. sealing chamber; 711. flexible contact; 712. methyl silicone oil; 72. isolation chamber; 721. extrusion block; 722. first spring; 723. sealing kit; 73. detection chamber; 731. sleeve; 732. linkage block; 733. second spring; 734. rigid straight bar; 735. guide hollow column; 736. sleeve block; 737. bump block; 738. air pipe; 74. contact ring; 8. contact assembly; 801. insulating wall block; 802. sensing contact; 803. external sleeve ring; 804. wire interface; 9. alarm assembly; 901. mounting plate; 902. frame groove; 903. alarm. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention; it is obvious that the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0031] The embodiment of the present application provides an electronic device motherboard detection device to solve the problem of traditional probes in ICT testing, which are caused by rigid contact, spring jamming, and fatigue, resulting in pad damage and unstable contact resistance, resulting in reduced test signal integrity and the flow of defective products into the back-end process. When in use, by improving the flexible contact structure of the probe needle and coordinating the spring fluctuation detection mechanism, it not only avoids hard damage to the motherboard caused by spring jamming, but also can accurately locate the problem probe, effectively improve detection reliability, and eliminate process risks caused by poor contact or signal abnormalities.

[0032] The technical solution in the embodiments of the present application is to solve the above technical problems, and the overall idea is as follows.

[0033] Example 1, please refer to Figure 1-Figure 7The embodiment of the present application provides an electronic device motherboard detection device, comprising: a test bench 1; a placement table 2, mounted at the front middle of the top of the test bench 1; a vertical frame 3, mounted at the rear side of the top of the test bench 1, a cylinder 4 mounted at the upper front end of the vertical frame 3, an assembly table 5 mounted at the telescopic end of the cylinder 4; a needle plate 6 mounted at the bottom of the assembly table 5, a plurality of probes 7 mounted on the needle plate 6; a sealed cavity 71, an isolation cavity 72 and a detection cavity 73 are sequentially opened inside the probe 7 from bottom to top, and the three cavities are interconnected; a flexible contact 711 is mounted at the bottom of the sealed cavity 71, and both the sealed cavity 71 and the flexible contact 711 are filled with methyl silicone oil 7 12; an extrusion block 721 slides in the isolation chamber 72, and the top of the extrusion block 721 is connected to the top wall of the isolation chamber 72 through a first spring 722; a sleeve 731 is installed on the top wall of the detection chamber 73, and a linkage block 732 slides in the sleeve 731, and the top of the linkage block 732 is connected to the top wall of the sleeve 731 through a second spring 733, and the bottom of the linkage block 732 is connected to the top of the extrusion block 721 through a rigid straight bar 734; a contact assembly 8 is installed on the lower inner wall of the detection chamber 73, and the contact assembly 8 is in conflict with the rigid straight bar 734. An alarm assembly 9 is installed on the top of the assembly table 5, and the alarm assembly 9 is electrically connected to the contact assembly 8.

[0034] By setting a flexible contact 711, methyl silicone oil 712, an extrusion block 721, a first spring 722, a sleeve 731, a linkage block 732, a second spring 733 and a rigid straight bar 734, flexible contact is used to replace the hard collision of the traditional rigid probe 7. When the probe 7 contacts the test point of the motherboard, the flexible contact 711 is pressurized to displace the methyl silicone oil 712 inside and push the extrusion block 721 upward. The connected rigid straight bar 734 drives the linkage block 732 to slide in the sleeve 731, thereby completing the transmission of pressure on the flexible contact 711. Subsequently, the double springs of the first spring 722 and the second spring 733 are used for reset, thereby avoiding the pin damage caused by the hard contact of the needle tip with the motherboard test point due to the jamming of the spring of the traditional probe 7.

[0035] The specific working process is as follows: During the mainboard detection process, the cylinder 4 drives the assembly table 5 and the needle plate 6 to descend, and the flexible contact 711 of the probe 7 contacts the test point of the mainboard first, and as the probe 7 is continuously pressed down, it is deformed inward, and then the methyl silicone oil 712 filled therein is squeezed upward to impact the extrusion block in the isolation cavity 72 to rise. The movement of the extrusion block 721 is synchronized to the linkage block 732 through the connected rigid straight bar 734, so that the linkage block 732 slides upward in the sleeve 731, thereby completing the pressure conduction of the flexible contact 711, and 721 achieves flexible contact with the test point of the mainboard, eliminating the problem of damage to the probe 7 and the mainboard caused by the spring jam. At the same time, the first spring 722 and the second spring 733 are used to provide quick reset for the subsequent flexible contact 711, and the contact ring 74 on the outside of the flexible contact 711 is used as a backup conductive path to ensure detection continuity.

[0036] Further, see Figure 5-Figure 7 The bottom of the extrusion block 721 is provided with a sealing kit 723, and the extrusion block 721 and the sealing kit 723 isolate the methyl silicone oil 712 in the sealing cavity 71 from leaking out; the inner wall of the flexible contact 711 is embedded with a fluororubber lining layer with a thickness of 0.5 to 1 mm through a molding process, By setting up a sealing kit 723 in conjunction with the extrusion block 721, the methyl silicone oil 712 in the sealing cavity 71 is isolated from leakage, ensuring the stability and durability of pressure conduction. The fluororubber lining layer enhances the wear resistance of the flexible contact 711 and improves its sealing performance, preventing the leakage of methyl silicone oil 712 or the invasion of external impurities, thereby extending the service life of the probe 7.

[0037] Further, see Figure 5-Figure 7 The inner walls of the sealing cavity 71 and the isolation cavity 72 are both coated with a zinc-aluminum alloy by a thermal spraying process. The zinc-aluminum alloy coating has excellent corrosion resistance and wear resistance, which can prevent the methyl silicone oil 712 or the external environment from corroding the inner wall of the cavity, reduce the friction loss when the extrusion block 721 slides, and ensure the long-term stable operation of the internal components of the probe 7.

[0038] Further, see Figure 5-Figure 7 A guide hollow column 735 is vertically installed in the middle of the bottom end of the sleeve 731, and a rigid straight bar 734 slides inside the guide hollow column 735. By setting the guide hollow column 735, a precise sliding guide is provided for the rigid straight bar 734 to avoid it from deflecting or shaking when moving up and down, ensuring the contact accuracy between the rigid straight bar 734 and the contact assembly 8, and improving the reliability of the detection results.

[0039] Further, see Figure 6 and Figure 7 When the air pipe 738 is not connected, the air pressure in the upper space of the sleeve 731 will rise sharply when the linkage block 732 moves upward, forming an air resistance that causes the rigid straight bar 734 to move jammed.

[0040] Further, see Figure 5-Figure 7The flexible contact 711 is located at the middle of the bottom end of the probe 7 , and a contact ring 74 is installed on the outer side of the bottom of the probe 7 . The contact ring 74 is located on the outer side of the flexible contact 711 .

[0041] By setting the contact ring 74 as an auxiliary contact, a dual conductive path is formed in conjunction with the flexible contact 711. When the flexible contact 711 has poor contact due to wear or insufficient pressure, the contact ring 74 can ensure the connectivity of the detection circuit, improve the reliability of the detection, provide double insurance, and also facilitate the transmission of the detection signal to the external detection center through the combination of the contact ring 74 and the probe 7 when the flexible contact 711 is not connected.

[0042] Example 2, please refer to Figure 5-Figure 7 The contact assembly 8 includes: an insulating wall block 801, which is installed on the left and right sides of the lower inner wall of the detection cavity 73; sensing contacts 802 are provided on the upper and lower parts of the inner side of the insulating wall block 801; an external ring 803, which is sleeved on the middle part of the outer wall of the probe 7, and a wire is buried in the external ring 803. One end of the wire is connected to multiple sensing contacts 802, and the other end extends to the outside of the external ring 803 to form a wire interface 804.

[0043] The contact assembly 8 adopts a split structure of an insulating wall block 801 and an external collar 803. The insulating wall block 801 is fixed to the inner wall of the detection cavity 73. The sensing contacts 802 arranged up and down on its inner side are in real-time contact with the bump block 737. The external collar 803 is sleeved on the middle part of the probe 7. The internal pre-buried wires gather the signals of the sensing contacts 802 to the wire interface 804. On the one hand, the insulating wall block 801 ensures electrical isolation between the sensing contacts 802 to avoid signal interference and will not interfere with the normal operation of the probe 7; on the other hand, the external collar 803 integrates and exports the scattered contact signals, thereby reducing the number of wire interfaces 804 of a single probe 7, significantly reducing the wiring complexity, and improving the assembly efficiency and maintenance convenience of the device.

[0044] Further, see Figure 5-Figure 7 A sleeve block 736 is installed on the rigid straight bar 734, and the sleeve block 736 is located in the detection cavity 73; four convex blocks 737 are respectively provided on the left and right sides and the upper and lower parts of the sleeve block 736.

[0045] A sleeve block 736 is integrated on the rigid straight bar 734, and the four convex blocks 737 distributed on the left and right sides form a three-dimensional contact network with the sensing contact 802 at the bottom of the detection cavity 73. When the probe 7 retracts due to spring jamming or fatigue, the rigid straight bar 734 drives the sleeve block 736 to produce axial displacement, and the four convex blocks 737 synchronously offset and trigger the corresponding sensing contacts 802. The multi-angle contact mechanism improves the displacement detection accuracy. Compared with the traditional single-point trigger structure, it can accurately capture the slight offset of the rigid straight bar 734, avoiding the problem of missed alarm due to unilateral contact failure, and is particularly suitable for the synchronous monitoring scenario of a high-density probe 7 array.

[0046] Specific operation process of the contact assembly 8: In the initial state where the needle plate 6 has not descended, the hidden danger of spring fatigue can be monitored in real time. First, when the elastic coefficient of the spring changes due to fatigue, the extrusion block 721 and the linkage block 732 connected thereto move up slightly under the action of weakened elastic force, thereby driving the rigid straight bar 734 to move synchronously. The protrusion block 737 on the sleeve block 736 on the rigid straight bar 734 and the sensing contact 802 on the insulating wall block 801 will produce a misalignment offset. The displacement offset causes the sensing contact 802 to be triggered and transmits the alarm signal to the alarm 903 to sound a buzzer alarm, thereby realizing an early warning of the risk of decreased detection accuracy of the probe 7; it should be noted that although the extrusion of the flexible contact 711 will eventually drive the rigid straight bar 734 to move, the contact assembly 8 does not operate during this movement stage.

[0047] Further, see Figure 5-Figure 7 The sensing contact 802 contacts the bump block 737. The surface of the sensing contact 802 is covered with a gold-plated layer with a thickness of 0.1 to 0.3 mm. The surface of the bump block 737 is formed with a nickel-phosphorus alloy wear-resistant layer through an electroplating process. A 0.1 to 0.3 mm gold-plated layer is deposited on the surface of the sensing contact 802. The oxidation resistance and low contact resistance characteristics of gold are used to ensure stable signal transmission impedance during long-term use, which extends the life of traditional silver-plated contacts. The nickel-phosphorus alloy wear-resistant layer is electroplated on the surface of the bump block 737, which can withstand a long period of friction cycles, effectively solving the problem of poor contact caused by contact surface loss, and is particularly suitable for reliability assurance in high-frequency detection scenarios.

[0048] Further, see Figure 3 The alarm component 9 includes: a mounting plate 901, mounted on the top of the assembly table 5; a plurality of frame grooves 902 are arranged equidistantly on the mounting plate 901, an alarm 903 is provided in the frame groove 902, and the alarm 903 is connected to the wire interface 804 located in the middle of the probe 7 through a wire.

[0049] The alarm component 9 realizes a one-to-one correspondence between the alarm 903 and the probe 7 through the frame slot 902 on the mounting plate 901. Each frame slot 902 is independently installed with a buzzer, and the wire is directly connected to the wire interface 804 of the corresponding probe 7. When a spring failure occurs in a probe 7, the corresponding alarm 903 immediately buzzes. The quick-install structure of the frame slot 902 supports the replacement of a single alarm 903, and by adjusting the arrangement density of the frame slot 902, it can be flexibly adapted to probe 7 arrays of different specifications. Compared with the traditional centralized alarm system, the fault location efficiency is increased by 4 times, the maintenance working hours are reduced, and it can also be cyclically connected and reused, which is convenient for the replacement operation of the probe 7.

[0050] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. An electronic equipment mainboard detection device, characterized in that: include: Testbench (1); A placement table (2) is installed at the front center of the top of the test table (1); A vertical frame (3) is installed on the top rear side of the test bench (1), a cylinder (4) is installed on the upper front end of the vertical frame (3), and an assembly table (5) is installed on the telescopic end of the cylinder (4); A needle plate (6) is installed at the bottom of the assembly table (5), and a plurality of probes (7) are installed on the needle plate (6); The probe (7) is provided with a sealing cavity (71), an isolation cavity (72) and a detection cavity (73) in sequence from bottom to top, and the three cavities are interconnected; A flexible contact (711) is installed at the bottom of the sealed cavity (71), and both the sealed cavity (71) and the flexible contact (711) are filled with methyl silicone oil (712); An extrusion block (721) slides in the isolation cavity (72), and the top of the extrusion block (721) is connected to the top wall of the isolation cavity (72) via a first spring (722); A sleeve (731) is installed on the top wall of the detection cavity (73), a linkage block (732) slides inside the sleeve (731), the top of the linkage block (732) is connected to the top wall of the sleeve (731) via a second spring (733), and the bottom of the linkage block (732) is connected to the top of the extrusion block (721) via a rigid straight bar (734); A contact assembly (8) is installed on the lower inner wall of the detection cavity (73), and the contact assembly (8) is in contact with the rigid straight bar (734). An alarm assembly (9) is installed on the top of the assembly table (5), and the alarm assembly (9) is electrically connected to the contact assembly (8).

2. The electronic device mainboard detection device according to claim 1, wherein: The bottom of the extrusion block (721) is provided with a sealing kit (723), and the extrusion block (721) and the sealing kit (723) isolate the methyl silicone oil (712) in the sealing cavity (71) from leaking out; The inner wall of the flexible contact (711) is embedded with a fluororubber lining layer having a thickness of 0.5 to 1 mm through a molding process.

3. The electronic device mainboard detection device according to claim 1, wherein: The inner walls of the sealing cavity (71) and the isolation cavity (72) are both coated with a zinc-aluminum alloy by a thermal spraying process.

4. The electronic device mainboard detection device according to claim 1, wherein: A guide hollow column (735) is vertically mounted in the middle of the bottom end of the sleeve (731), and a rigid straight bar (734) slides inside the guide hollow column (735).

5. The electronic device mainboard detection device according to claim 1, wherein: A sleeve block (736) is mounted on the rigid straight bar (734), and the sleeve block (736) is located in the detection cavity (73); Four convex blocks (737) are respectively provided on the upper and lower portions of the left and right sides of the sleeve block (736).

6. The electronic device mainboard detection device according to claim 1, wherein: The left and right sides of the upper portion of the sleeve (731) are in communication with one end of the air pipe (738), and the other end of the air pipe (738) passes through the inner wall of the detection cavity (73) and is in communication with the external air.

7. The electronic device mainboard detection device according to claim 1, wherein: The flexible contact (711) is located in the middle of the bottom end of the probe (7), and a contact ring (74) is installed on the outside of the bottom of the probe (7), and the contact ring (74) is located on the outside of the flexible contact (711).

8. The electronic equipment mainboard detection device according to claim 5, wherein: The contact assembly (8) comprises: Insulating wall blocks (801) are installed on the left and right sides of the lower inner wall of the detection cavity (73); Sensing contacts (802) are provided on the upper and lower parts of the inward side of the insulating wall block (801); An external collar (803) is sleeved on the middle portion of the outer wall of the probe (7), and a wire is embedded in the external collar (803). One end of the wire is connected to a plurality of sensing contacts (802), and the other end extends to the outside of the external collar (803) to form a wire interface (804).

9. The electronic equipment mainboard detection device according to claim 8, wherein: The sensing contact (802) contacts the bump block (737), the surface of the sensing contact (802) is covered with a gold-plated layer having a thickness of 0.1 to 0.3 mm, and the surface of the bump block (737) is formed with a nickel-phosphorus alloy wear-resistant layer through an electroplating process.

10. The electronic equipment mainboard detection device according to claim 1, wherein: The alarm component (9) comprises: A mounting plate (901) mounted on top of the assembly table (5); A plurality of frame slots (902) are arranged at equal intervals on the mounting plate (901), an alarm (903) is provided in the frame slot (902), and the alarm (903) is connected to a wire interface (804) located in the middle of the probe (7) via a wire.

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