Feeding and discharging device for heat sink and wafer

Abstract

The invention provides a heat sink and wafer feeding and discharging device, and relates to the technical field of wafer testing. The bearing platform is provided with the bearing structure used for bearing the heat sink, and the bearing structure is further provided with the notch. The pushing mechanism is installed at the notch and comprises a first driving part and a push rod which are in transmission connection, and under driving of the first driving part, the push rod moves in the direction close to the heat sink and pushes the heat sink, so that the outer side wall of the heat sink abuts against the inner wall of the bearing structure, and therefore the heat sink is positioned. According to the technical scheme, the pushing mechanism is integrated on the bearing platform, positioning of the heat sink can be achieved only by pushing the outer side wall of the heat sink to abut against the inner wall of the bearing structure through the push rod, the structure is simple, and the occupied space is small.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer testing, and in particular to a heat sink and a wafer loading and unloading device. Background Art

[0002] During the wafer testing process, a wafer handling mechanism is required to transport the wafer under test. However, the wafer under test is relatively thin and generally cannot be directly contacted with the wafer under test. Therefore, the wafer under test is usually placed on a heat sink, and the wafer under test and the heat sink are transported as a whole. The wafer handling mechanism is in direct contact with the heat sink.

[0003] During the loading and unloading process of the heat sink and wafer, the heat sink needs to be positioned, which is equivalent to positioning the wafer under test. The existing heat sink positioning structure is relatively complex, resulting in the wafer loading and unloading device taking up a lot of space. Therefore, it is urgent to design a simple loading and unloading device that can position the heat sink. Summary of the Invention

[0004] An object of the present invention is to provide a device for loading and unloading a heat sink and a wafer, so as to solve the technical problem in the prior art that the structure for positioning the heat sink is relatively complex and occupies a large space.

[0005] A further object of the present invention is to avoid contact with the front side of the wafer which may result in contamination of the front side of the wafer.

[0006] In particular, the present invention provides a heat sink and wafer loading and unloading device, comprising:

[0007] At least one bearing platform, each bearing platform having a bearing structure for receiving a heat sink, and the bearing structure is further provided with a notch;

[0008] A pushing mechanism is installed at the notch, and the pushing mechanism includes a first driving member and a push rod that are transmission-connected; under the drive of the first driving member, the push rod moves toward the direction approaching the heat sink and pushes the heat sink, so that the outer wall of the heat sink is pressed against the inner wall of the supporting structure, thereby positioning the heat sink.

[0009] Optionally, the bearing structure is designed to imitate the shape of the heat sink.

[0010] Optionally, the pushing mechanism further includes:

[0011] At least one first slide rail, mounted on the carrying platform;

[0012] The first connecting member is slidably mounted on each of the first slide rails. The first connecting member is rotationally connected to the push rod and is connected to the first driving member.

[0013] Optionally, the heat sink is in a disk-like structure;

[0014] The pushing surface of the push rod is configured to conform to the outer side wall of the matched heat sink so as to be closely fitted with the outer side wall of the heat sink.

[0015] Optionally, the pushing mechanism further includes:

[0016] A plurality of adjusting members are mounted on the push rod and protrude from the push rod to abut against the heat sink.

[0017] Optionally, the carrying platform has a first avoidance hole that penetrates vertically, the heat sink has a second avoidance hole that penetrates vertically, and the loading and unloading device further includes:

[0018] At least one lifting mechanism is provided, and the lifting mechanism is arranged in a one-to-one correspondence with the carrying platform. The lifting mechanism includes a second driving member and a plurality of lifting members, and the second driving member is transmission-connected to each of the lifting members; under the drive of the second driving member, the lifting member can be driven to move upward and pass through the first avoidance hole and the second avoidance hole to receive the wafer under test; under the drive of the second driving member, the lifting member can also be driven to move downward to drive the wafer under test to move downward onto the heat sink.

[0019] Optionally, a first adsorption member is provided on the top of each lifting member, and the first adsorption member is used to adsorb the wafer to be tested.

[0020] Optionally, the loading and unloading device further includes a bracket, and the carrying platform is mounted on the bracket; the lifting mechanism further includes:

[0021] a second slide rail connected to the bracket and arranged vertically;

[0022] a second connecting member, arranged vertically and slidably connected to the second slide rail, the second connecting member being connected to each of the lifting members;

[0023] a roller, mounted on the second connecting member;

[0024] A cam is connected to the second driving member and cooperates with the roller; under the drive of the second driving member, the cam rotates so that the roller drives the second connecting member to rise and fall, thereby driving the lifting member to rise and fall.

[0025] Optionally, the heat sink is provided with a plurality of through holes penetrating vertically, and the loading and unloading device further comprises:

[0026] At least one adsorption component, each of the adsorption components is arranged at the first avoidance hole of the supporting platform, and each of the adsorption components includes a plurality of second adsorption parts, which are docked with the through holes to adsorb the wafer to be tested on the heat sink.

[0027] Optionally, the number of the carrying platforms is two; the loading and unloading device further includes:

[0028] The rotating mechanism includes a third driving member and a rotating platform, and the rotating platform is connected to the third driving member and the bracket; under the drive of the third driving member, the rotating platform rotates to drive one of the two supporting platforms to move to the unloading station and the other to move to the loading station.

[0029] The supporting platform of the present invention comprises a supporting structure for supporting a heat sink, and the supporting structure is further provided with a notch. A pushing mechanism is mounted in the notch and comprises a first drive member and a push rod in a transmission connection. Driven by the first drive member, the push rod moves toward the heat sink and pushes the heat sink, causing the outer wall of the heat sink to abut against the inner wall of the supporting structure, thereby positioning the heat sink. The above technical solution integrates the pushing mechanism on the supporting platform. The heat sink can be positioned by simply pushing the outer wall of the heat sink against the inner wall of the supporting structure. This results in a simple structure and a small footprint.

[0030] Furthermore, in the present invention, the lifting mechanism and the carrying platform are arranged in a one-to-one correspondence, and the lifting mechanism includes a second driving member and a plurality of lifting members, and the second driving member is connected to each lifting member. Driven by the second driving member, the lifting member can be driven to move upward and pass through the first avoidance hole and the second avoidance hole to receive the wafer to be measured. Driven by the second driving member, the lifting member can also be driven to move downward to drive the wafer to be measured to move downward to the heat sink. The above technical solution contacts the back side of the wafer to be measured by the lifting member, and drives the wafer to be measured to move to the heat sink by lifting the lifting member, which can avoid the front side of the wafer to be measured from being contaminated.

[0031] Based on the following detailed description of specific embodiments of the present invention in conjunction with the accompanying drawings, those skilled in the art will become more aware of the above and other objects, advantages and features of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Hereinafter, some specific embodiments of the present invention will be described in detail in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the accompanying drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the accompanying drawings:

[0033] Figure 1 1 is a schematic structural diagram of a heat sink and a wafer loading and unloading device according to an embodiment of the present invention from one angle;

[0034] Figure 2 is a schematic structural diagram of a heat sink and a wafer loading and unloading device according to an embodiment of the present invention from another angle;

[0035] Figure 3 yes Figure 1 A schematic structural diagram of part A is shown;

[0036] Figure 4 yes Figure 1 A schematic enlarged view of the pushing mechanism of the loading and unloading device shown;

[0037] Figure 5 yes Figure 1 A schematic structural diagram of the lifting mechanism of the loading and unloading device shown;

[0038] Figure 6 yes Figure 1 Schematic structural diagram of the adsorption component of the loading and unloading device shown.

[0039] Reference numerals:

[0040] 100-loading and unloading device, 200-heat sink, 210-second avoidance hole, 220-through hole, 10-carrying platform, 20-pushing mechanism, 30-rotating mechanism, 40-bracket, 50-lifting mechanism, 60-adsorption component, 70-lifting mechanism, 80-collecting pipe, 11-carrying structure, 12-supporting surface, 111-inner wall, 112-notch, 13-sensor, 14-first avoidance hole, 21-first driving member, 22-first A slide rail, 23-first connecting member, 24-push rod, 25-adjusting member, 26-rotating rod, 31-third driving member, 32-rotating platform, 41-first frame, 42-second frame, 51-second driving member, 52-lifting member, 521-first adsorption member, 53-cam, 54-roller, 55-second connecting member, 56-second slide rail, 61-mounting plate, 611-third avoidance hole, 62-adsorption rod, 621-second adsorption member. DETAILED DESCRIPTION

[0041] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present invention, but are not to be construed as limiting the present invention.

[0042] In the description of the present invention, it should be understood that the terms "upper" and "lower" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0043] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features, that is, include one or more of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. When a feature "includes or contains" one or more of the features it covers, unless otherwise specifically described, this indicates that other features are not excluded and may further include other features.

[0044] Unless otherwise specified or limited, the terms "connection" and "installation" should be interpreted broadly. For example, they can refer to fixed or detachable connections, or integration; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art should be able to understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0045] Unless otherwise defined, all terms (including technical terms and scientific terms) used in the description of this embodiment have the same meaning as commonly understood by ordinary technicians in the technical field to which this application belongs.

[0046] Figure 1 1 is a schematic structural diagram of a heat sink and a wafer loading and unloading device 100 according to an embodiment of the present invention, Figure 2 FIG. 1 is a schematic structural diagram of a heat sink and a wafer loading and unloading device 100 according to an embodiment of the present invention from another angle. Figure 3 yes Figure 1 The schematic structure diagram of part A is shown. Figure 4 yes Figure 1 A schematic enlarged view of the pushing mechanism 20 of the loading and unloading device 100 is shown.

[0047] like Figures 1 to 4As shown, in some embodiments, a heat sink and wafer loading and unloading device 100 includes at least one supporting platform 10 and a pushing mechanism 20. Each supporting platform 10 has a supporting structure 11 for receiving a heat sink 200, and the supporting structure 11 also has a notch 112. The pushing mechanism 20 is mounted at the notch 112 and includes a first driving member 21 and a push rod 24 connected in a transmission manner. Driven by the first driving member 21, the push rod 24 moves toward the heat sink 200 and pushes the heat sink 200, so that the outer wall of the heat sink 200 abuts against the inner wall 111 of the supporting structure 11, thereby positioning the heat sink 200. Here, the notch 112 in the supporting structure 11 is equivalent to making room for the pushing mechanism 20 to move, allowing the push rod 24 to contact the heat sink 200, and the supporting structure 11 is in the shape of a boss. When the heat sink 200 is placed on the supporting platform 10, the placement position may vary each time, and some may not necessarily abut the inner wall 111. At this point, the push rod 24 pushes the heat sink 200 in a direction opposite to the push mechanism 20, causing the outer wall of the heat sink 200 to abut against the inner wall 111. This allows each heat sink 200 to be positioned so that the loading position of each heat sink 200 is the same, ensuring that the wafers under test are in the same position when they are transported to the loading and unloading device 100. The supporting structure 11 has a receiving surface 12, which is arranged horizontally and perpendicular to the inner wall 111, and is used to support the heat sink 200.

[0048] In this embodiment, the pushing mechanism 20 is integrated on the carrying platform 10 , and the positioning of the heat sink 200 can be achieved by only pushing the push rod 24 to push the heat sink 200 into contact with the inner wall 111 . The structure is simple and the space occupied is small.

[0049] In some embodiments, the first driving member 21 is connected to the push rod 24 and is installed on the carrying platform 10 .

[0050] In some embodiments, the supporting structure 11 is designed to be contoured to the heat sink 200 .

[0051] In some embodiments, the shape of the inner wall 111 matches the shape of the outer wall of the heat sink 200 , so that the outer wall of the heat sink 200 fits more closely to the inner wall 111 , allowing the heat sink 200 to better abut against the supporting structure 11 .

[0052] In some embodiments, the pushing mechanism 20 further includes at least one first slide rail 22 and a first connecting member 23. The first slide rail 22 is mounted on the supporting platform 10, and the first connecting member 23 is slidably mounted on each first slide rail 22. The first connecting member 23 is rotatably connected to a push rod 24 and is connected to the first driving member 21. Here, the first driving member 21 is a cylinder. There are two first slide rails 22, and the two first slide rails 22 are mounted on opposite sides of the first driving member 21. A slider is mounted on each first slide rail 22, and the slider slides along the first slide rail 22. The first connecting member 23 is connected to the two sliders. The push rod 24 is mounted on the end of the first connecting member 23. Here, the push rod 24 is mounted on the first connecting member 23 via a rotating rod 26, thereby achieving a rotational connection with the first connecting member 23. The arrangement direction of the first slide rail 22 is the direction in which the heat sink 200 needs to be pushed to move, and can be determined according to specific design requirements.

[0053] Since the position of each heat sink 200 when placed on the supporting structure 11 is definitely different, this embodiment designs the push rod 24 to be rotatable relative to the first connecting member 23, so that the push rod 24 can adaptively adjust its own position according to each heat sink 200, so that the push rod 24 can better abut against each heat sink 200.

[0054] In some embodiments, the heat sink 200 has a disc-like structure. The pushing surface of the push rod 24 is contoured to the outer sidewall of the heat sink 200 so as to closely mate with the outer sidewall of the heat sink 200. In this embodiment, the pushing surface of the push rod 24 is aligned with the outer sidewall of the heat sink 200, thereby achieving better contact between the push rod 24 and the heat sink 200 and making the push rod 24 fit more closely to the heat sink 200. Here, the heat sink 200 has four curved corners, one of which is disposed opposite the pushing mechanism 20. The shape of the supporting structure 11 is consistent with the outer shape of the heat sink 200 and is slightly larger than the size of the heat sink 200.

[0055] In some embodiments, the pushing mechanism 20 further includes a plurality of adjusting members 25 mounted on the push rod 24 and protruding from the push rod 24 to abut against the heat sink 200. It can be understood that the adjusting members 25 contact the heat sink 200, while the push rod 24 does not. The push rod 24 can rotate relative to the first connecting member 23 to adjust the position of the adjusting members 25. Here, the adjusting members 25 are rollers.

[0056] In this embodiment, the adjusting member 25 contacts the heat sink 200 , which can reduce the contact area with the heat sink 200 and avoid scratching the heat sink 200 .

[0057] In some embodiments, there are two adjusting members 25, which are respectively mounted on two ends of the push rod 24. In other embodiments, the number of adjusting members 25 can also be determined according to specific design requirements.

[0058] In some embodiments, the carrying platform 10 has a first avoidance hole 14 that penetrates vertically, and the heat sink 200 has a second avoidance hole 210 that penetrates vertically. The loading and unloading device 100 also includes at least one lifting mechanism 50, and the lifting mechanism 50 is arranged in a one-to-one correspondence with the carrying platform 10. The lifting mechanism 50 includes a second driving member 51 and a plurality of lifting members 52, and the second driving member 51 is in transmission connection with each lifting member 52. Under the drive of the second driving member 51, the lifting member 52 can be driven to move upward and pass through the first avoidance hole 14 and the second avoidance hole 210 to receive the wafer under test. Under the drive of the second driving member 51, the lifting member 52 can also be driven to move downward to drive the wafer under test to move downward onto the heat sink 200. Here, the second driving member 51 is a stepping motor. This embodiment is equivalent to placing the heat sink 200 on the support surface 12, with the bottom of the heat sink 200 being empty, and the lifting member 52 aligning with the second avoidance hole 210 of the heat sink 200, passing through the heat sink 200 and being able to move to the top of the heat sink 200. Here, the lifting member 52 is rod-shaped.

[0059] In this embodiment, the lifting member 52 contacts the back side of the wafer under test, and the lifting member 52 is lifted and lowered to move the wafer under test onto the heat sink 200 , thereby preventing the front side of the wafer under test from being contaminated.

[0060] In some embodiments, each lifting mechanism 50 corresponds to a carrying platform 10 and is disposed below the corresponding carrying platform 10 .

[0061] In some embodiments, there are three lifting members 52 , which are arranged in an equilateral triangle. This structure is more stable and can more stably support the wafer to be tested.

[0062] In a preferred embodiment, a first adsorption member 521 is provided on the top of each lifting member 52, and the first adsorption member 521 is used to adsorb the wafer to be measured. It can be understood that when the lifting member 52 is lifted and the wafer to be measured is placed on the top of the lifting member 52, the first adsorption member 521 adsorbs the wafer to be measured, and then drives the wafer to be measured to move downward, which can prevent the wafer to be measured from falling during the movement. Here, the lifting member 52 is provided with an exhaust channel inside, and the exhaust channel is connected to the external exhaust equipment and is connected to the first adsorption member 521, and the adsorption of the wafer to be measured is achieved by vacuuming. Here, the first adsorption member 521 is a suction cup.

[0063] Figure 5 yes Figure 1 The schematic structural diagram of the lifting mechanism 50 of the loading and unloading device 100 is shown in FIG. Figure 5 As shown, and see Figure 3 In some embodiments, the loading and unloading device 100 further includes a bracket 40, and the carrying platform 10 is mounted on the bracket 40. The lifting mechanism 50 further includes a second slide rail 56, a second connecting member 55, a roller 54 and a cam 53. The second slide rail 56 is connected to the bracket 40 and is arranged vertically. The second connecting member 55 is arranged vertically and is slidingly connected to the second slide rail 56. The second connecting member 55 is connected to each lifting member 52. The roller 54 is mounted on the second connecting member 55. The cam 53 is connected to the second driving member 51 and cooperates with the roller 54. Driven by the second driving member 51, the cam 53 rotates so that the roller 54 drives the second connecting member 55 to rise and fall, thereby driving the lifting member 52 to rise and fall. Here, the slider is slidably mounted on the second slide rail 56, and the second connecting member 55 is connected to the slider.

[0064] In this embodiment, the lifting member 52 can be lifted and lowered by the cooperation of the cam 53 and the roller 54 . The lifting member 52 can be lifted and lowered by the rotation of the cam 53 . The structure is simple and easy to implement.

[0065] Figure 6 yes Figure 1 The schematic structural diagram of the adsorption component 60 of the loading and unloading device 100 is shown. Figure 6 As shown, and see Figure 3 In some embodiments, the heat sink 200 is provided with a plurality of through-holes 220 extending vertically therethrough. The loading and unloading device 100 further includes at least one adsorption assembly 60. Each adsorption assembly 60 is disposed at a first avoidance hole 14 of a support platform 10. Each adsorption assembly 60 includes a plurality of second adsorption members 621, which interface with the through-holes 220 to adsorb the wafer under test onto the heat sink 200. Here, when the wafer under test follows the lifting member 52 downward onto the heat sink 200, the second adsorption members 621 evacuate air through the through-holes 220, thereby adsorbing the wafer under test onto the heat sink 200. Here, the second adsorption members 631 are suction cups.

[0066] In some embodiments, each adsorption assembly 60 includes multiple adsorption rods 62, each adsorption rod 62 is provided with an exhaust channel inside, and each adsorption rod 62 is provided with a second adsorption component 621 on the top. The exhaust channel is connected to the second adsorption component 621 and is connected to an external exhaust device to adsorb the wafer to be tested by vacuuming.

[0067] In some embodiments, each adsorption assembly 60 further includes a mounting plate 61, which is mounted at the first avoidance hole 14 and connected to the corresponding supporting platform 10, and a plurality of adsorption rods 62 are mounted on the corresponding mounting plate 61. An air duct is provided inside the mounting plate 61, and the air duct is connected to the exhaust channel of each adsorption rod 62 and the external exhaust equipment for vacuuming. A third avoidance hole 611 is provided on the mounting plate 61, and a plurality of lifting members 52 are passed through the third avoidance hole 611. The third avoidance hole 611 provided in this embodiment is equivalent to avoiding the lifting members 52. Here, each adsorption assembly 60 includes five adsorption rods 62, and the five adsorption rods 62 are evenly arranged on the mounting plate 61, so that vacuuming can be performed evenly, so that the wafer to be tested is flatly attached to the heat sink 200. In other embodiments, the number of adsorption rods 62 can also be determined according to specific design requirements.

[0068] In some embodiments, the loading and unloading device 100 further includes a sensor 13, which is mounted at the first avoidance hole 14 and connected to the carrying platform 10, for sensing the heat sink 200. When the sensor 13 senses that the heat sink 200 is mounted on the carrying platform 10, the pushing mechanism 20 pushes the heat sink 200 to achieve positioning of the heat sink 200.

[0069] In some embodiments, there are two loading platforms 10. The loading and unloading device 100 also includes a rotating mechanism 30, which includes a third drive member 31 and a rotating platform 32. The rotating platform 32 is connected to the third drive member 31 and the bracket 40. Driven by the third drive member 31, the rotating platform 32 rotates, driving one of the two loading platforms 10 to the unloading station and the other to the loading station. Here, the rotating platform 32 rotates 180 degrees each time, thereby swapping the positions of the two loading platforms 10.

[0070] This embodiment designs two carrying platforms 10 and drives the carrying platforms 10 to rotate through the rotating mechanism 30. When one carrying platform 10 is unloading, the other carrying platform 10 can be loading, realizing synchronous loading and unloading, which can save the testing time of the wafers under test and improve the testing efficiency of the wafers under test. The wafer production capacity is shortened from the previous 8pcs / min to 4.5pcs / min.

[0071] In some embodiments, see Figure 2 The bracket 40 includes a first frame 41 and a second frame 42. The first frame 41 is mounted on top of the rotating platform 32 and rotates with the rotating platform 32. The lifting mechanism 50 and the supporting platform 10 are both mounted on the first frame 41. In other words, the rotating platform 32 drives the lifting mechanism 50 and the supporting platform 10 to rotate together. The second frame 42 is set below the rotating platform 32 and is used to install the rotating platform 32. The second frame 42 does not rotate.

[0072] In some embodiments, the heat sink and wafer loading and unloading device 100 also includes a lifting mechanism 70, which is connected to the second frame 42 of the bracket 40 and is used to drive the entire bracket 40 to rise and fall, thereby driving the carrying platform 10 to rise and fall, and also driving the rotating mechanism 30 and the lifting mechanism 50 to rise and fall.

[0073] In some embodiments, see Figure 2 The loading and unloading device 100 also includes a cable collection pipe 80, which is used for routing cables and air pipes to prevent the cables and air pipes from affecting the normal rotation of the carrying platform 10 when the carrying platform 10 rotates.

[0074] The heat sink and wafer loading and unloading device 100 of this embodiment integrates a pushing mechanism 20, a lifting mechanism 50, a rotating mechanism 30 and an adsorption component 60, which realizes the positioning of the heat sink 200, the loading and unloading of the wafer to be tested, and the adsorption of the wafer to be tested, etc., which is equivalent to integrating more functional mechanisms, and on the basis of integrating many functional mechanisms, the structure of the loading and unloading device 100 is more compact, saving the layout space of the entire equipment.

[0075] At this point, those skilled in the art will recognize that, although a number of exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications consistent with the principles of the present invention may be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and deemed to cover all such other variations or modifications.

Claims

1. A heat sink and wafer loading and unloading device, characterized in that: include: At least one bearing platform, each bearing platform having a bearing structure for receiving a heat sink, and the bearing structure is further provided with a notch; A pushing mechanism is installed at the notch, and the pushing mechanism includes a first driving member and a push rod that are transmission-connected; under the drive of the first driving member, the push rod moves toward the direction approaching the heat sink and pushes the heat sink, so that the outer wall of the heat sink is pressed against the inner wall of the supporting structure, thereby positioning the heat sink.

2. The loading and unloading device according to claim 1, characterized in that: The bearing structure is designed to conform to the shape of the heat sink.

3. The loading and unloading device according to claim 2, characterized in that: The pushing mechanism further comprises: At least one first slide rail, mounted on the carrying platform; The first connecting member is slidably mounted on each of the first slide rails. The first connecting member is rotationally connected to the push rod and is connected to the first driving member.

4. The loading and unloading device according to claim 3, characterized in that: The heat sink is in a disk-like structure; The pushing surface of the push rod is configured to conform to the outer side wall of the matched heat sink so as to be closely fitted with the outer side wall of the heat sink.

5. The loading and unloading device according to claim 4, characterized in that: The pushing mechanism further comprises: A plurality of adjusting members are mounted on the push rod and protrude from the push rod to abut against the heat sink.

6. The loading and unloading device according to any one of claims 1 to 5, characterized in that: The carrying platform has a first avoidance hole that penetrates vertically, and the heat sink has a second avoidance hole that penetrates vertically. The loading and unloading device also includes: At least one lifting mechanism is provided, and the lifting mechanism is arranged in a one-to-one correspondence with the carrying platform. The lifting mechanism includes a second driving member and a plurality of lifting members, and the second driving member is transmission-connected to each of the lifting members; under the drive of the second driving member, the lifting member can be driven to move upward and pass through the first avoidance hole and the second avoidance hole to receive the wafer under test; under the drive of the second driving member, the lifting member can also be driven to move downward to drive the wafer under test to move downward onto the heat sink.

7. The loading and unloading device according to claim 6, characterized in that: A first adsorption member is provided on the top of each lifting member, and the first adsorption member is used to adsorb the wafer to be tested.

8. The loading and unloading device according to claim 6, characterized in that: The loading and unloading device further includes a bracket, and the carrying platform is mounted on the bracket; the lifting mechanism further includes: a second slide rail connected to the bracket and arranged vertically; a second connecting member, arranged vertically and slidably connected to the second slide rail, the second connecting member being connected to each of the lifting members; a roller, mounted on the second connecting member; A cam is connected to the second driving member and cooperates with the roller; under the drive of the second driving member, the cam rotates so that the roller drives the second connecting member to rise and fall, thereby driving the lifting member to rise and fall.

9. The loading and unloading device according to claim 6, characterized in that: The heat sink is provided with a plurality of through holes penetrating vertically, and the loading and unloading device further comprises: At least one adsorption component, each of the adsorption components is arranged at the first avoidance hole of the supporting platform, and each of the adsorption components includes a plurality of second adsorption parts, which are docked with the through holes to adsorb the wafer to be tested on the heat sink.

10. The loading and unloading device according to claim 8, characterized in that: The number of the carrying platforms is two; The loading and unloading device also includes: The rotating mechanism includes a third driving member and a rotating platform, and the rotating platform is connected to the third driving member and the bracket; under the drive of the third driving member, the rotating platform rotates to drive one of the two supporting platforms to move to the unloading station and the other to move to the loading station.

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