Centering jig, wafer positioning device and semiconductor processing equipment

Abstract

The invention discloses a centering jig, a wafer positioning device and semiconductor processing equipment, relates to the technical field of semiconductor manufacturing, and aims to solve the problems that the centering position of a jig and a chuck cannot be accurately adjusted, and the center position of a wafer on the chuck cannot be demonstrated, so that the precision of the carrying position of a mechanical arm is not enough, and the production of the wafer is influenced. The centering jig is used for the semiconductor processing equipment, the semiconductor processing equipment comprises a chuck and a mechanical arm, the chuck is used for bearing a wafer, the mechanical arm is used for carrying the wafer to the chuck, the centering jig comprises at least three supporting arms, adjusting assemblies arranged at the ends of the supporting arms and a center reference part, and the adjusting assemblies are suitable for adjusting the position of the centering jig relative to the chuck. Therefore, the chuck and the center reference part are concentrically arranged, and the mechanical arm can correct the wafer carrying path according to the center reference part. In this way, the centering jig can assist the chuck in positioning, and therefore it is guaranteed that the wafer carried by the mechanical arm is accurately aligned with the chuck in position.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a centering fixture, a wafer positioning device, and semiconductor processing equipment. Background Art

[0002] In some semiconductor manufacturing processes, a wafer handling robot picks up a wafer from a processing system, moves it into a work chamber, and places the wafer on a chuck for various processing steps, such as deposition and etching. These wafer processing processes require that the chuck and the work chamber, and the wafer and chuck, be aligned. This means that the center of the work chamber, the center of the wafer, and the center of the chuck must be aligned, or within a certain range, to ensure optimal processing.

[0003] However, in related technologies, the centering position of the fixture and the chuck cannot be accurately adjusted, and the center position of the wafer on the chuck cannot be taught, resulting in insufficient accuracy of the robotic arm's transport position, affecting wafer production, and even causing problems such as wafer collision and breakage. Summary of the Invention

[0004] The present application discloses a centering jig, a wafer positioning device and a semiconductor processing equipment for solving the problem that the centering position of the jig and the chuck cannot be accurately adjusted, the center position of the wafer on the chuck cannot be taught, resulting in insufficient accuracy of the robot arm's transport position and affecting wafer production.

[0005] In the first aspect, the present application provides a centering jig, and provides a centering jig, which is used for semiconductor processing equipment. The semiconductor processing equipment includes a chuck and a robotic arm, the chuck is used to carry the wafer, and the robotic arm is used to transport the wafer to the chuck. The centering jig includes: at least three arms and an adjustment component arranged at the end of the arm and a center reference part, the adjustment component is suitable for adjusting the position of the centering jig relative to the chuck so that the chuck is concentrically arranged with the center reference part, and the robotic arm can correct the wafer transport path according to the center reference part.

[0006] In the embodiment of the present application, the centering jig can assist in positioning the chuck, ensure that the chuck and the centering jig are concentrically arranged and accurately define the relative position of the chuck, and the central reference part of the centering jig can teach the position of the robot arm, thereby ensuring that the wafer carried by the robot arm is accurately aligned with the position of the chuck.

[0007] In one possible embodiment, the centering jig further includes a first surface and a second surface facing away from each other, with the first surface facing the chuck, the center reference portion being located on the second surface, and the adjustment assembly extending from the first surface away from the second surface. In this manner, the first surface is used to interface with the chuck, assisting in moving the chuck to a predetermined position relative to the base, while the second surface can receive the wafer locator to teach the position of the robotic arm, thereby ensuring that the wafer and wafer locator are centered. Ultimately, the chuck, centering jig, and wafer can remain coaxially positioned with high relative positioning accuracy.

[0008] In one possible embodiment, the centering jig further includes a positioning flange provided on the second surface, and the number of the positioning flanges is multiple. The semiconductor processing equipment further includes a wafer positioning member, and the multiple positioning flanges are respectively provided on the support arm and are suitable for limiting the position of the wafer positioning member. The wafer positioning member is in the shape of a disc, and the wafer positioning member is the same size as the wafer. In this way, when the robotic arm sets the wafer positioning member on the centering jig, the multiple positioning flanges can be provided on the outer edge of the wafer positioning member to limit its position, ensuring that the wafer positioning member can be aligned with the centering jig. At this time, the position of the robotic arm can be recorded, and the robotic arm can be taught to carry wafers.

[0009] In one possible embodiment, the wafer aligner further includes a centering hole; when the plurality of positioning flanges define the position of the wafer aligner, the center reference portion is disposed within the centering hole. Thus, the center reference portion, in conjunction with the centering hole, ensures accurate relative positioning of the wafer aligner and the centering jig, further improving wafer placement accuracy.

[0010] In one possible embodiment, the centering jig further includes a centering collar, which is removably mounted on the center reference portion and adapted to engage with the center arc of the robotic arm to teach the position of the robotic arm. Thus, by mounting the centering collar on the center reference portion, the robotic arm can be moved so that the center arc of the robotic arm rests against the collar, ensuring the accuracy of the taught position of the robotic arm. The collar prevents the robotic arm from directly contacting the center reference portion, thereby damaging the surface of the center reference portion.

[0011] In one possible embodiment, the adjustment assembly includes a graduated handwheel and a side handwheel seat, the side handwheel seat extending from the first surface in a direction away from the second surface, the graduated handwheel passing through the side handwheel seat, and the graduated handwheel is rotated to adjust its relative position to the side handwheel seat and engage with the chuck. Thus, the graduated handwheel and the side handwheel seat cooperate, and the relative position of the graduated handwheel and the side handwheel seat can be adjusted by adjusting the scale of the graduated handwheel, thereby cooperating with the chuck to achieve marking of the adjustment assembly.

[0012] In one possible embodiment, the side handwheel seat is formed with a threaded hole, and the graduated handwheel includes a dial, a threaded post, and a ball head. The threaded post is inserted into the threaded hole, and the dial and ball head are respectively disposed at opposite ends of the threaded post. The dial is rotated to adjust the ball head so that it abuts the outer edge of the chuck. In this manner, the dial, threaded post, and ball head can be an integral structural component. The threaded post is disposed in the threaded hole and rotates relative to the threaded hole to enable the ball head to move relative to the side handwheel seat. Furthermore, the distance traveled by the ball head can be compared with the dial to ensure the adjustment accuracy of the adjustment assembly.

[0013] In one possible embodiment, the centering jig further includes a calibration disk adapted to calibrate the graduated handwheel. Thus, the calibration disk can be calibrated in conjunction with the centering jig to ensure that the centering jig can adjust the position of the chuck.

[0014] In one possible embodiment, the calibration disk includes a calibration outer circle, an intermediate pin, and an upper support surface; the centering jig also includes a lower surface plastic seat and a center hole. The centering jig is detachably mounted on the calibration disk, the upper support surface supports the lower surface plastic seat, the intermediate pin engages the center hole to limit the position of the centering jig and the calibration disk, and the calibration outer circle cooperates with the scale disk to adjust the position of the ball head. In this way, the intermediate pin engages the center hole to limit the position of the centering jig and the calibration disk, while the upper support surface supports the lower surface plastic seat, so that the calibration outer circle can be on the same horizontal plane as the scale handwheel, and the scale handwheel can be adjusted by the calibration outer circle.

[0015] In one possible embodiment, there are multiple adjustment assemblies, one at each end of the support arm. The rotation angles of each scale plate are the same, ensuring the same ball head feed rate, and each ball head abuts against the edge of the chuck. Thus, adjusting the multiple adjustment assemblies ensures the same ball head feed rate, allowing the chuck to be positioned in multiple directions.

[0016] In the second aspect, the present application provides a wafer positioning device, comprising: a centering jig, a chuck and a base as described in any one of the above embodiments, the chuck is used to support the wafer, the base comprises a working cavity and a connecting column, the connecting column is movably arranged in the working cavity and at least partially extends from the working cavity, and the chuck is arranged at one end of the connecting column away from the working cavity.

[0017] In one possible embodiment, the wafer positioning apparatus further includes a positioning fixture, wherein the centering jig is detachably mounted on the chuck, and the positioning fixture is adapted to define the relative position of the chuck and the working chamber via the centering jig. In this manner, the positioning fixture can be adjusted and defined relative to the centering jig, thereby adjusting the relative position of the chuck.

[0018] In one possible embodiment, the positioning fixture includes a cylindrical pin adapted to be inserted into the center hole of the centering fixture to define the relative position of the chuck and the working chamber. Thus, the positioning fixture precisely adjusts the chuck's position by coordinating the center hole and the cylindrical pin.

[0019] In one possible embodiment, the wafer positioning apparatus further includes a dynamic deflection correction system configured to control and record the robotic arm's placement of the wafer positioner at a predetermined position on the centering fixture, and to control the robotic arm's placement of the wafer at a predetermined position on the chuck. In this manner, the dynamic deflection correction system can record the robotic arm's position and, further, can determine the actual position of the wafer to be processed using the wafer positioner.

[0020] In a third aspect, the present application provides a semiconductor processing equipment, comprising a wafer positioning device according to any of the above technical solutions and a robotic arm, wherein the robotic arm is used to transport the wafer to the chuck. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0022] Figure 1 A structural diagram of a wafer positioning device provided in an embodiment of the present application;

[0023] Figure 2 A structural diagram of a centering fixture provided in an embodiment of the present application;

[0024] Figure 3 Another structural diagram of the centering fixture provided in an embodiment of the present application;

[0025] Figure 4 A structural diagram of a calibration disk provided in an embodiment of the present application;

[0026] Figure 5 Another structural diagram of the calibration disk provided in an embodiment of the present application;

[0027] Figure 6 This is another structural diagram of the centering fixture provided in an embodiment of the present application;

[0028] Figure 7 This is another structural diagram of the centering fixture provided in an embodiment of the present application;

[0029] Figure 8 This is another structural diagram of the centering fixture provided in an embodiment of the present application;

[0030] Figure 9 This is another structural diagram of the centering fixture provided in an embodiment of the present application;

[0031] Figure 10 Another structural diagram of the wafer positioning device provided in an embodiment of the present application;

[0032] Figure 11 Another structural diagram of the wafer positioning device provided in an embodiment of the present application;

[0033] Figure 12 A diagram showing another structure of the wafer positioning device provided in an embodiment of the present application;

[0034] Figure 13 This is another structural diagram of the wafer positioning device provided in an embodiment of the present application.

[0035] Description of reference numerals:

[0036] 10-Centering fixture; 11-Support arm; 12-Adjustment assembly; 121-Scaled handwheel; 1211-Scaled dial; 1212-Threaded post; 1213-Ball head; 122-Side handwheel seat; 13-Center reference portion; 14-First surface; 15-Second surface; 16-Location flange; 17-Centering ring; 18-Lower surface plastic seat; 19-Center hole; 191-Upper bump;

[0037] 20-mechanical arm; 21-center arc opening;

[0038] 30-calibration plate; 31-calibration outer circle; 32-middle pin; 33-upper support surface; 34-lower support;

[0039] 40-base; 41-working chamber; 42-connecting column; 43-chuck;

[0040] 50-positioning tool; 51-cylindrical pin;

[0041] 60-wafer positioning piece; 61-centering hole;

[0042] 100-Wafer positioning device. DETAILED DESCRIPTION

[0043] To make the objectives, technical solutions, and advantages of the present invention more clear, the technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0044] It should also be noted that, for ease of description, only the parts related to the invention are shown in the drawings. In the absence of conflict, the embodiments and features of the embodiments of the present invention may be combined with each other.

[0045] In the embodiments of the present application, the terms "first," "second," "third," "fourth," "fifth," and "sixth" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, a feature specified as "first," "second," "third," "fourth," "fifth," and "sixth" may explicitly or implicitly include one or more of the features.

[0046] In the embodiments of the present application, the terms "comprises," "comprising," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not preclude the presence of other identical elements in the process, method, article, or apparatus comprising the element.

[0047] In the embodiments of the present application, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within an acceptable deviation range, wherein the acceptable deviation range is as determined by a person of ordinary skill in the art taking into account the measurement being discussed and the errors associated with the measurement of a specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equals is less than or equal to 5% of either one.

[0048] The present embodiment provides a semiconductor processing device, which may include an epitaxial device, a rapid thermal processing device, a chemical vapor deposition device, etc. The present embodiment does not impose any particular restrictions on the specific form of the semiconductor processing device.

[0049] In the field of semiconductor manufacturing technology, in order to ensure the quality of wafer processing, it is necessary to ensure the accuracy of the placement of the wafer in the working chamber of the semiconductor equipment. Figure 1 The present application provides a wafer positioning device 100, which is used to ensure the accuracy of the placement position of the wafer during the processing.

[0050] In some embodiments of the present application, the semiconductor processing equipment may include, in addition to the wafer positioning device 100 , a robotic arm 20 . The robotic arm 20 may be used to cooperate with the wafer positioning device 100 to transport the wafer to an accurate placement position.

[0051] See also Figure 1 In some embodiments of the present application, the wafer positioning device 100 includes a centering jig 10 and a chuck 43. The chuck 43 is used to carry the wafer and the chuck 43 can be relatively positioned with reference to the centering jig 10 to ensure that the wafer can be accurately placed on the chuck 43. For example, it can ensure that the wafer is accurately placed at the center of gravity of the chuck.

[0052] The robot arm 20 is used to move the wafer to the chuck 43. Of course, the robot arm 20 can also be used to move the wafer from the chuck 43, and this application does not impose specific limitations on this. When the robot arm 20 picks up a wafer from one processing position and moves it to another processing position (such as deposition, etching, etc.), the centering fixture 10 can also help determine the exact position where the robot arm 20 places the wafer on the chuck.

[0053] See also Figures 1 to 13 In some embodiments of the present application, the centering fixture 10 includes: at least three arms 11 and an adjustment component 12 and a center reference portion 13 arranged at the end of the arm 11. The adjustment component 12 can support and limit the position of the chuck 43 to ensure that the chuck 43 is concentrically arranged with the center reference portion 13. The center reference portion 13 is suitable for teaching the predetermined position of the robot arm 20, so that the robot arm 20 can correct the wafer handling path according to the center reference portion 13.

[0054] It should be noted that, in the embodiments of the present application, "teaching" refers to teaching an automated device (such as the robotic arm 20) how to accurately perform a specific task through a series of operations. "Teaching the robotic arm 20 to a predetermined position" means that the semiconductor processing equipment uses the center reference portion 13 as a reference point, and through the movement method, movement path, and relative position relationship of the robotic arm 20 relative to the reference point, sets the path and end position that the robotic arm 20 should follow, corrects the wafer handling path, and ensures that the robotic arm can accurately place the wafer on the correct position on the chuck 43.

[0055] The center reference portion 13 serves as a physical reference point or datum point, indicating the ideal location where the wafer should be placed. The location of this datum point is pre-set, ensuring that the chuck 43 is concentric with it to ensure accuracy during subsequent handling of the wafer by the robotic arm to the chuck 43.

[0056] Exemplarily, the central reference portion 13 may be formed as a central boss, that is, the central reference portion protrudes from each support arm 11 .

[0057] In this way, the centering jig 10 can assist in positioning the chuck 43, ensuring that the chuck 43 and the centering jig 10 are concentrically arranged and accurately limit the relative position of the chuck 43, and the center reference part 13 of the centering jig 10 can teach the position of the robot arm 20, thereby ensuring that the wafer transported by the robot arm 20 is accurately aligned with the position of the chuck 43.

[0058] In other possible implementations, during the semiconductor processing process, it may be necessary to combine sensor technology to monitor the chuck position, wafer position and robot arm movement in real time.

[0059] In the embodiment of the present application, the centering jig 10 is detachably connected to the chuck 43. On the one hand, the position of the chuck 43 can be adjusted by the centering jig 10. On the other hand, the chuck 43 can be arranged coaxially with the centering jig 10 so that the center of the chuck 43 is determined based on the center of the centering jig 10. In addition, the centering jig 10 can assist the robot 20 in confirming its specific movement path during wafer handling. Specifically, the robot 20 can carry the wafer positioning member 60 to the centering jig 10 to enable the centering jig 10 to teach the robot 20 the position. In this way, the robot 20 can accurately carry the wafer to the center of the chuck 43.

[0060] See also Figure 1 In some possible embodiments of the present application, the wafer positioning device 100 further includes a base 40, the base 40 includes a working chamber 41 and a connecting column 42, the connecting column 42 is movably disposed in the working chamber 41 and at least partially extends from the working chamber 41, and the chuck 43 is disposed at one end of the connecting column 42 away from the working chamber 41.

[0061] In the centering jig 10 and wafer positioning device 100 of the present embodiment, the base 40 can serve as a workbench, and a connecting post 42 extends from the working chamber 41. The end of the connecting post 42 can be connected to the chuck 43, and the connecting post 42 and the chuck 43 can move freely relative to the working chamber 41. A wafer refers to a silicon wafer used in the processing and manufacturing of silicon semiconductor integrated circuits, and its raw material is silicon. The wafer positioning member 60 serves as a calibration disc to simulate the wafer, and its diameter is exactly the same as that of a real wafer.

[0062] In the centering jig 10 and the wafer positioning device 100 of the embodiment of the present application, the size and model of the wafer, the wafer positioning member 60 and the chuck 43 are not limited to meet different needs. In one embodiment, the wafer and the wafer positioning member 60 are similar in shape, both of which are flat-plate structures in the shape of a perfect circle. The wafer positioning member 60 is used to teach the position of the wafer and the robot arm 20, that is, the wafer positioning member 60 is set on the side of the centering jig 10 away from the chuck 43. At this time, the robot arm 20 moves to the lower side of the wafer positioning member 60 to lift the wafer positioning member 60 from the centering jig 10 and record the position of the robot arm 20. After removing the centering jig 10 and the wafer positioning member 60, the robot arm 20 can place the wafer above the chuck 43 according to the recorded position data. In this way, it can be ensured that the chuck 43 and the wafer are coaxially arranged and the position of the chuck 43 and the wafer is accurate. Then, the wafer can be etched and exposed.

[0063] It should be noted that in the embodiment of the present application, the chuck 43, the centering jig 10, and the wafer are described as being circular in shape. However, the shapes of the centering jig 10, the chuck 43, and the wafer are not limited thereto. The centering jig 10 of the embodiment of the present application can also be applied to wafers and chucks 43 of other shapes, such as square or rectangular. In one example, the wafer positioning member 60 and the wafer are both circular.

[0064] See also Figure 1-Figure 3 In one possible embodiment, the centering jig 10 further includes a first surface 14 and a second surface 15 that face each other. The first surface 14 faces the chuck 43, the center reference portion 13 is located on the second surface 15, and the adjustment assembly 12 extends from the first surface 14 away from the second surface 15. In this manner, the first surface 14 is used to dock with the chuck 43, allowing the auxiliary chuck 43 to move to a predetermined position relative to the base 40. The second surface 15 can receive the wafer locator 60 to teach the position of the robotic arm 20, thereby ensuring that the wafer and wafer locator 60 are centered. Ultimately, the chuck 43, the centering jig 10, and the wafer remain coaxially positioned, achieving high relative positioning accuracy.

[0065] See also Figure 1-Figure 3In one possible embodiment, the centering jig 10 further includes a positioning flange 16 disposed on the second surface 15. There are multiple positioning flanges 16, each disposed on the support arm 11 and adapted to define the position of the wafer locator 60. The wafer locator 60 is in the shape of a disc and is the same size as the wafer. Thus, when the robotic arm 20 places the wafer locator 60 on the centering jig 10, the multiple positioning flanges 16 can be disposed on the outer edge of the wafer locator 60 to define its position, ensuring that the wafer locator 60 can be aligned with the centering jig 10. At this point, the position of the robotic arm 20 can be recorded, thereby teaching the robotic arm 20 how to handle wafers.

[0066] Specifically, in the embodiment of the present application, the centering jig 10 adopts a double-sided structure to achieve coordinated optimization of the calibration of the chuck 43 and the teaching of the robot arm 20. The first surface 14 is arranged toward the chuck 43, and is used to physically contact the chuck 43 and assist in its precise positioning. The second surface 15 serves as a teaching reference surface for cooperating with the wafer positioning member 60 and the robot arm 20. The center reference portion 13 provided on the second surface 15 serves as the absolute coordinate reference of the robot arm 20. The boss surface can be integrated with optical markings to enhance visual recognition accuracy.

[0067] Furthermore, when the robotic arm 20 places the wafer locator 60 on the centering jig 10, the positioning flange 16 automatically corrects its positional deviation through radial constraints. The gap between the wafer locator 60 and the positioning flange 16 is controlled within a small range, ensuring smooth placement while eliminating the risk of free deviation. Thus, after removing the centering jig 10, the robotic arm 20 can grasp the actual wafer according to the teaching data and place it on the chuck 43 along the same trajectory, ensuring the coaxiality of the wafer, chuck 43, and centering jig 10.

[0068] See also Figure 1 In one possible embodiment, wafer locator 60 further includes a centering hole 61. When multiple positioning flanges 16 define the position of wafer locator 60, center reference portion 13 is disposed within centering hole 61. Thus, center reference portion 13 cooperates with centering hole 61 to ensure accurate relative positioning of wafer locator 60 and centering jig 10, further improving wafer placement accuracy.

[0069] See also Figure 1-Figure 3 Specifically, the center reference portion 13 and the positioning flanges 16 cooperate to position the wafer locator 60 on the second surface 15. In this case, the center reference portion 13 is disposed within the centering hole 61, and the multiple positioning flanges 16 are disposed around the periphery of the wafer locator 60. In this way, the center reference portion 13 and the centering hole 61 cooperate to determine the concentricity of the centering jig 10 and the wafer locator 60. Furthermore, the multiple positioning flanges 16 can form a circular shape around the wafer locator 60, further improving the placement accuracy of the wafer locator 60.

[0070] Exemplarily, the centering jig 10 may include three arms 11 , and a positioning flange 16 is provided on the second surface 15 of each arm 11 . The three positioning flanges 16 may be arranged around the periphery of the wafer positioning member 60 and define the outer circle of the wafer positioning member 60 .

[0071] See also Figure 1-Figure 2 In one possible embodiment, the centering jig 10 further includes a centering collar 17 detachably mounted on the center reference portion 13. The centering collar 17 is adapted to engage with the center arc opening 21 of the robotic arm 20 to teach the position of the robotic arm 20. Thus, by mounting the centering collar 17 on the center reference portion 13, the robotic arm 20 is moved so that the center arc opening 21 of the robotic arm 20 rests against the centering collar 17, ensuring the accuracy of the taught position of the robotic arm 20. The centering collar 17 prevents the robotic arm 20 from directly contacting the center reference portion 13 and thereby damaging the surface of the center reference portion 13.

[0072] See also Figure 2-Figure 3 In one possible embodiment, the adjustment assembly 12 includes a graduated handwheel 121 and a side handwheel seat 122. The side handwheel seat 122 extends from the first surface 14 in a direction away from the second surface 15. The graduated handwheel 121 is inserted into the side handwheel seat 122. The graduated handwheel 121 is rotated to adjust its relative position to the side handwheel seat 122 and engages with the chuck 43. Thus, the graduated handwheel 121 and the side handwheel seat 122 cooperate, and the relative position of the graduated handwheel 121 and the side handwheel seat 122 can be adjusted by adjusting the scale of the graduated handwheel 121, thereby cooperating with the chuck 43 to achieve marking of the adjustment assembly 12.

[0073] See also Figure 2-Figure 3 In one possible embodiment, a threaded hole is formed in the side handwheel seat 122, and the scale handwheel 121 includes a scale plate 1211, a threaded post 1212, and a ball head 1213. The threaded post 1212 is inserted into the threaded hole, and the scale plate 1211 and the ball head 1213 are respectively disposed at opposite ends of the threaded post 1212. The scale plate 1211 is rotated to adjust the ball head 1213 so that the ball head 1213 abuts the outer edge of the chuck 43. In this way, the scale plate 1211, the threaded post 1212, and the ball head 1213 can be an integral structural component. The threaded post 1212 is disposed in the threaded hole and rotates relative to the threaded hole, thereby enabling the ball head 1213 to move relative to the side handwheel seat 122. Furthermore, the travel distance of the ball head 1213 can be compared with the scale plate 1211 to ensure the adjustment accuracy of the adjustment assembly 12.

[0074] See also Figure 4-Figure 6 and combined Figure 2In one possible embodiment, the centering jig 10 further includes a calibration disk 30, which is suitable for calibrating the scale handwheel 121. In this way, the calibration disk 30 can cooperate with the centering jig 10 for calibration, ensuring that the centering jig 10 can adjust the position of the chuck 43.

[0075] See also Figure 4-Figure 6 and combined Figure 2 In one possible embodiment, the calibration disk 30 includes a calibration outer circle 31, an intermediate pin 32, and an upper support surface 33; the centering jig 10 also includes a lower surface plastic seat 18 and a center hole 19. The centering jig 10 is detachably mounted on the calibration disk 30, with the upper support surface 33 supporting the lower surface plastic seat 18. The intermediate pin 32 engages with the center hole 19 to limit the position of the centering jig 10 and the calibration disk 30, and the calibration outer circle 31 cooperates with the scale disk 1211 to adjust the position of the ball head 1213. In this way, the intermediate pin 32 engages with the center hole 19 to limit the position of the centering jig 10 and the calibration disk 30, while the upper support surface 33 supports the lower surface plastic seat 18, so that the calibration outer circle 31 can be on the same horizontal plane as the scale handwheel 121, and the scale handwheel 121 can be adjusted by the calibration outer circle 31.

[0076] See also Figure 7-Figure 9 In one possible embodiment, there are multiple adjustment assemblies 12, one at the end of each arm 11. The rotation angles of each dial 1211 are the same, ensuring the same feed rate for the ball head 1213. Each ball head 1213 abuts against the edge of the chuck 43. In this way, adjustment of the multiple adjustment assemblies 12 ensures the same feed rate for the ball head 1213, allowing the chuck 43 to be positioned in multiple directions.

[0077] See also Figure 4-Figure 9 Specifically, when the number of arms 11 is three, the calibration disk 30 can also have three long arms, and the periphery of the three long arms can form a calibration outer circle 31. The adjustment component on each arm 11 corresponds to the end of the long arm. When the middle pin 32 docks with the center hole 19, the upper support surface 33 can dock with the supporting lower surface plastic seat 18 to ensure the concentric setting of the calibration disk 30 and the centering fixture 10. Then, the feed amount of the ball head 1213 can be adjusted by adjusting the rotating dial 1211. The ball heads 1213 are all abutted on the calibration outer circle 31, so that the inner edges of the multiple ball heads 1213 form a circular shape corresponding to the chuck 43. Subsequently, the calibration disk 30 can be separated from the centering jig 10, and the centering jig 10 can be placed on the chuck 43. At this time, the rotation angle of the scale plate 1211 is the same so that the feed amount of the ball head 1213 is the same. Each ball head 1213 is abutted against the edge of the chuck 43, thereby locking the relative position of the chuck 43 and the centering jig 10, ensuring the coaxiality of the centering jig 10 and the chuck 43.

[0078] See also Figure 10-11 In one possible embodiment, the wafer positioning apparatus 100 further includes a positioning fixture 50. The centering jig 10 is detachably mounted on the chuck 43. The positioning fixture 50 is adapted to define the relative position of the chuck 43 and the working chamber 41 via the centering jig 10. In this manner, the positioning fixture 50 can be adjusted and defined relative to the centering jig 10, thereby adjusting the relative position of the chuck 43.

[0079] See also Figure 10-11 In one possible embodiment, the positioning fixture 50 includes a cylindrical pin 51 that is adapted to be inserted into the center hole 19 of the centering fixture 10 to define the relative position of the chuck 43 and the working chamber 41. Thus, the positioning fixture 50 achieves precise adjustment of the position of the chuck 43 through the cooperation between the center hole 19 and the cylindrical pin 51.

[0080] In one possible embodiment, the wafer positioning device 100 further includes an Active Wafer Centering (AWC) system, which is used to control and record the robot arm 20 placing the wafer locator 60 at a predetermined position on the centering fixture 10, and to control the robot arm 20 to place the wafer at a predetermined position on the chuck 43. In this way, the dynamic AWC system can record the position of the robot arm 20 and, further, can determine the actual position of the wafer to be processed through the wafer locator 60.

[0081] Specifically, the dynamic correction system can automatically correct the deviation between the actual center and the teaching center during the movement of the robot arm 20 when the robot arm 20 transfers the wafer, ensuring that the wafer is accurately transported to the designated position.

[0082] In the related art, in some processes of semiconductor manufacturing, a wafer handling robot picks up a wafer from a processing system, moves it into a working chamber, and places the wafer on a chuck 43 for different processing procedures, such as deposition, etching, etc. These wafer processing processes require that the chuck 43 be centered with the working chamber, and the wafer be centered with the chuck 43, that is, it is required that there is no deviation or the deviation is within a certain range between the center of the working chamber, the center of the wafer, and the center of the chuck 43 to ensure the processing effect. However, in the related art, the calibration disk is directly embedded in the chuck 43 to locate the center of the chuck 43, and the positioning accuracy of the center of the chuck 43 is low. At the same time, the centering position of the fixture and the chuck 43 cannot be accurately adjusted, and the center position of the wafer on the chuck 43 cannot be taught.

[0083] The embodiment of the present application discloses an adjustable chuck 43 centering fixture 10, which has the functions of centering the chuck 43, teaching the wafer handling robot 20, and centering the wafer and the chuck 43. Before the deposition process is carried out, the device is first used to calibrate the centering of the chuck 43 and the wafer, which can improve the wafer production process effect.

[0084] See also Figures 1-13 In summary, in the embodiment of the present application, the centering jig 10 is first calibrated using a calibration disk 30. The calibration disk 30 includes a lower support 34, an upper support surface 33, a middle pin 32, and a calibration outer circle 31. The lower support 34 contacts the plane to ensure the stability of the calibration disk 30. The upper support surface 33 contacts the plastic seat 18 on the lower surface of the centering jig 10. The middle pin 32 engages with the center hole 19 of the centering jig 10. The calibration outer circle 31 engages with the inner circle formed by the plastic ball heads 1213 of the three scale handwheels 121 on the centering jig 10 to achieve calibration of the centering jig 10.

[0085] Next, the centering jig 10 is removed from the calibration plate 30 and placed on the chuck 43. The centering jig 10 comprises: a lower plastic seat 18, a positioning flange 16, an upper bump 191, a center collar 17, a center reference portion 13, a center hole 19, a side handwheel seat 122, a graduated handwheel 121, and a plastic ball head 1213. After calibration, the centering jig 10 is placed on the chuck 43, with the lower plastic seat 18 aligned with the upper surface of the chuck 43. The three graduated handwheels 121 are screwed in at the same feed amount until the plastic ball head 1213 contacts the side edge of the chuck 43, ensuring the centering jig 10 and chuck 43 are coaxial. The inner cylinder formed by the three upper flanges is coaxial with the center reference portion 13, used to receive the wafer and verify its alignment with the chuck 43.

[0086] After the centering fixture 10 is engaged with the chuck 43, the center ring sleeve 17 can be placed on the center reference part 13, and the center arc opening 21 of the robot arm 20 is aligned with the center ring sleeve 17 and inserted. The center arc opening 21 of the robot arm 20 and the center ring sleeve 17 are engaged together, and the engagement is confirmed. The software marks the position coordinates of the robot arm 20 at this time, and the XY direction teaching of the robot arm 20 is completed.

[0087] After the robot arm 20 is taught, the centering jig 10 and the chuck 43 are kept engaged, the center ring 17 is removed, and the wafer positioning member 60 with the centering hole 61 is placed on the centering jig 10, contacting the upper protrusion 191. The centering hole 61 passes through the center reference portion 13 of the centering jig 10, and the outer edge of the wafer falls into the positioning flange 16 of the centering jig 10. At this time, the wafer positioning member 60 is coaxial with the chuck 43, and the ejector pin on the chuck 43 lifts the wafer positioning member 60. The robot arm 20 removes the wafer positioning member 60, and the AWC (Active Wafer Centering) system records the position of the wafer positioning member 60 removed by the robot arm 20 to complete the zero position calibration and store it. The subsequent robot arm 20 carries the wafer in the same teaching direction to ensure the centering accuracy of the wafer transferred by the robot arm 20 and the chuck 43. Thus, the centering jig 10 of the embodiment of the present application can be used for precise positioning of the center of the chuck 43 and is suitable for position teaching of the robot arm 20 inside the semiconductor equipment and wafer center position teaching.

[0088] For example, after calibration, the centering jig 10 is placed on the chuck 43, with the lower plastic seat 18 in contact with the upper surface of the chuck 43. The three graduated handwheels 121 are screwed in by the same amount until the contact ball head 1213 contacts the side edge of the chuck 43, and the centering jig 10 and chuck 43 are engaged, ensuring the coaxiality of the centering jig 10 and chuck 43. After ensuring the coaxiality of the centering jig 10 and chuck 43, the position of the chuck 43 is adjusted so that the center hole 19 of the centering jig 10 is coaxial with the hole representing the working chamber 41. The cylindrical pin 51 is then used to test until the cylindrical pin 51 can pass through the center hole 19 of the working chamber 41 and is inserted into the center hole 19 of the centering jig 10, achieving coaxiality between the chuck 43 and the center of the working chamber 41. After achieving coaxiality between the chuck 43 and the center of the working chamber 41, the center ring 17 is placed on the center reference portion 13, the center arc 21 of the robot 20 is aligned with the center ring 17, and the robot 20 is inserted and matched. After confirming that the match is in place, the software marks the position coordinates of the robot 20 at this time, and the robot 20 XY direction teaching is completed. After the robot 20 is taught, the center ring 17 is removed, and the wafer with the center hole 19 is placed on the centering fixture 10, contacting the upper protrusion 191. The center hole 19 of the wafer passes through the center reference portion 13 of the centering fixture 10, and the outer edge of the wafer falls into the positioning flange 16 of the centering fixture 10. The ejector pin on the chuck 43 lifts the wafer, and the robot 20 removes the wafer. The program records the position of the wafer removed by the robot 20, and the wafer subsequently transferred by the robot 20 is aligned with the chuck 43. By utilizing the above structure, the centering fixture 10 can realize the center positioning of the chuck 43, the centering of the chuck 43 and the working chamber 41, the teaching of the robot arm 20 and the wafer center teaching.

[0089] The graduated handwheel 121 can be aligned with the calibration disk 30 from three directions, allowing precise adjustment of the three-point cocircularity. By adjusting the graduated handwheel 121 and calibrating the coaxiality on the calibration disk 30, the center hole 19 of the fixture can be precisely positioned with the center of the chuck 43 by placing it on the chuck 43 and screwing it in with the same feed amount. The graduated handwheel 121 quantifies the feed amount, and the plastic ball head 1213 contacts the chuck 43 to avoid scratches. The calibration disk 30 can ensure that the outer circle of the centering fixture 10 is coaxial with the center hole 19. The removable center ring 17 enables centering teaching of the robot arm 20 to prevent subsequent wafer center teaching from scratching the robot arm 20. The center hole 19 and positioning flange 16 are used to center the wafer with a hole and the chuck 43, enabling wafer center teaching.

[0090] The embodiments of the present application can also realize other steering functions that conventional front-wheel steering vehicles and conventional four-wheel steering vehicles can realize.

[0091] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0092] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any modifications or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

[0093] The above preferred embodiments further illustrate the objectives, technical solutions and advantages of the present invention in detail. It should be understood that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A centering fixture for semiconductor processing equipment, the semiconductor processing equipment comprising a chuck and a robotic arm, the chuck being used to carry a wafer, the robotic arm being used to transport the wafer to the chuck, characterized in that: The centering jig includes: at least three arms and an adjustment component arranged at the end of the arm and a center reference part. The adjustment component is suitable for adjusting the position of the centering jig relative to the chuck so that the chuck is concentrically arranged with the center reference part. The robotic arm can correct the wafer handling path according to the center reference part.

2. The centering fixture according to claim 1, characterized in that: The centering fixture further includes a first surface and a second surface facing each other, wherein the first surface is disposed toward the chuck, the center reference portion is disposed on the second surface, and the adjustment component extends from the first surface toward a direction away from the second surface.

3. The centering fixture according to claim 2, characterized in that: The centering fixture also includes a positioning flange arranged on the second surface, and the number of the positioning flanges is multiple. The semiconductor processing equipment also includes a wafer positioning part, and the multiple positioning flanges are respectively arranged on the support arms and are suitable for limiting the position of the wafer positioning part. The wafer positioning part is in the shape of a disc, and the wafer positioning part is the same size as the wafer.

4. The centering fixture according to claim 3, characterized in that: The wafer positioning member further includes a centering hole; When the plurality of positioning flanges define the position of the wafer positioning member, the central reference portion is disposed within the centering hole.

5. The centering fixture according to claim 4, characterized in that: The centering fixture further includes a center ring sleeve, which is detachably mounted on the center reference portion. The center ring sleeve is suitable for cooperating with the center arc opening of the robotic arm to teach the position of the robotic arm.

6. The centering fixture according to claim 2, characterized in that: The adjustment assembly includes a scale handwheel and a side edge handwheel seat, the side edge handwheel seat extends from the first surface in a direction away from the second surface, the scale handwheel is inserted into the side edge handwheel seat, and the scale handwheel is adjusted in relative position with the side edge handwheel seat by rotation and engaged with the chuck.

7. The centering fixture according to claim 6, characterized in that: A threaded hole is formed on the side edge handwheel seat, and the scale handwheel includes a dial, a threaded column and a ball head. The threaded column is passed through the threaded hole, and the dial and the ball head are respectively arranged at both ends of the threaded column. The dial adjusts the ball head by rotating so that the ball head abuts against the outer edge of the chuck.

8. The centering fixture according to claim 7, characterized in that: The centering fixture further includes a calibration disk, which is suitable for calibrating the scale handwheel.

9. The centering fixture according to claim 8, characterized in that: The calibration plate includes a calibration outer circle, an intermediate pin and an upper support surface; The centering jig also includes a lower surface plastic seat and a center hole. The centering jig is detachably arranged on the calibration disk. The upper support surface supports the lower surface plastic seat. The middle pin shaft is connected to the center hole to limit the position of the centering jig and the calibration disk. The calibration outer circle cooperates with the scale dial to adjust the position of the ball head.

10. The centering fixture according to claim 9, characterized in that: There are multiple adjustment components, and each end of the support arm is provided with one adjustment component; The rotation angle of each scale plate is the same so that the feeding amount of the ball head is the same, and each ball head abuts against the edge of the chuck.

11. A wafer positioning device, characterized in that: include: The centering jig according to any one of claims 1 to 10; a chuck, used for carrying the wafer; The base comprises a working cavity and a connecting column, wherein the connecting column is movably arranged in the working cavity and at least partially extends from the working cavity, and the chuck is arranged at one end of the connecting column away from the working cavity.

12. The wafer positioning device according to claim 11, wherein: The wafer positioning device further includes a positioning tool, wherein the centering fixture is detachably arranged on the chuck, and the positioning tool is suitable for limiting the relative position of the chuck and the working chamber through the centering fixture.

13. The wafer positioning device according to claim 12, wherein: The positioning tool includes a cylindrical pin, which is suitable for passing through the center hole of the centering fixture to define the relative position of the chuck and the working cavity.

14. The wafer positioning device according to claim 11, wherein: The wafer positioning device also includes a dynamic correction system, which is used to control and record the robot arm to place the wafer positioning member at the predetermined position of the centering fixture, and to control the robot arm to place the wafer at the predetermined position of the chuck.

15. A semiconductor processing equipment, characterized in that: include: The wafer positioning device according to any one of claims 11 to 14; A robotic arm is used to transport the wafer to the chuck.

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