Silicon carbide power device packaging structure
By designing the silicon carbide power device packaging structure and utilizing components such as elastic parts and heat spreaders, the problem of poor heat dissipation of silicon carbide devices is solved, efficient heat transfer and heat dissipation effects are achieved, and the heat dissipation performance and service life of the chip are improved.
Patent Information
- Application Number
- CN202510815337.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-18
- Publication Date
- 2025-09-05
AI Technical Summary
Existing silicon carbide devices have poor heat dissipation performance under the packaging structure, resulting in the inability to effectively dissipate heat from the chip.
The silicon carbide power device packaging structure is adopted, including substrate, ceramic ring, silicon carbide chip, packaging components, etc. The solder layer is eliminated through the combined design of elastic parts and heat spreader, and components such as heat spreader, heat pipe, and heat dissipation fins are used to achieve efficient heat transfer and dissipation.
The heat dissipation efficiency and uniformity of the silicon carbide chip are improved, the occurrence of hot spots is avoided, the service life of the chip is extended, and the heat dissipation effect is improved.
Smart Images
Figure CN120600696A_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the technical field of semiconductor packaging, and in particular relates to a silicon carbide power device packaging structure. Background Art
[0002] Traditional silicon-based semiconductors, due to their inherently insufficient physical properties, are increasingly failing to meet the demands of the semiconductor industry. This has necessitated the emergence of third-generation semiconductors. Silicon carbide devices, as third-generation semiconductor materials, offer superior performance, boasting superior electrical properties compared to existing silicon-based devices, such as high-voltage and high-temperature resistance and low losses. Consequently, silicon carbide devices are finding widespread application in new energy vehicles, rail transit, locomotive traction, smart grids, and other fields.
[0003] When existing silicon carbide devices are in use, since the chip is connected to the heat dissipation component through solder, the heat generated by the chip during operation needs to be transferred to the heat dissipation component through the solder layer, and then the heat dissipation component dissipates the heat to the external environment. As a result, the heat dissipation performance of the chip is poor under the existing packaging structure.
[0004] Therefore, it is necessary to invent a silicon carbide power device packaging structure to solve the above problems. Summary of the Invention
[0005] In response to the above problems, the present invention provides a silicon carbide power device packaging structure to solve the problems raised in the above background technology.
[0006] To achieve the above objectives, the present invention provides the following technical solution: a silicon carbide power device packaging structure, comprising: A base plate, wherein a rectangular first mounting groove is formed on the top of the base plate, and first notches for glue injection are formed on the four side walls of the first mounting groove; A ceramic ring is fixedly mounted on the top of the substrate, wherein the ceramic ring is rectangular and the first mounting groove is located on the inner side of the ceramic ring; The silicon carbide chip body is installed in the first mounting groove. The mounting ring is fixedly installed in the first mounting groove, and the shape of the mounting ring matches the shape of the first mounting groove. There are multiple elastic members, and the middle part of the elastic member is arched upward. The multiple elastic members are alternately fixedly connected to the inner walls of both sides of the mounting ring. A packaging component for pressing and fixing the silicon carbide chip body is provided on the top of the silicon carbide chip body.
[0007] Furthermore, the packaging assembly includes a heat spreader, a sealing block, a packaging plate, a heat pipe and a heat dissipation fin. The heat spreader is pressed onto the top of the silicon carbide chip body, and silicone grease is coated between the heat spreader and the silicon carbide chip body. The sealing block is fixedly connected to the bottom of the heat spreader, and there are multiple sealing blocks. The packaging plate is pressed onto the top of the heat spreader, and a rectangular second mounting groove is opened at the bottom of the packaging plate. There are multiple heat pipes, and multiple heat pipes are evenly installed side by side in the second mounting groove to form a heat pipe array. The bottom of the heat pipe is kept in contact with the top of the heat spreader, and silicone grease is also coated between the heat spreader and the heat pipe. There are multiple heat dissipation fins, and multiple heat dissipation fins are evenly fixedly connected to the top of the packaging plate.
[0008] Furthermore, a plurality of pins are symmetrically connected to both sides of the silicon carbide chip body, and the thickness of the silicon carbide chip body is smaller than the thickness of the ceramic ring.
[0009] Furthermore, a placement groove is provided at the bottom of the ceramic ring opposite to the pin, and multiple sealing blocks are correspondingly inserted in the multiple placement grooves, the width of the placement groove matches the width of the pin, and the depth of the placement groove is greater than the thickness of the pin. Limiting blocks are fixedly connected to the inner walls of the ceramic ring, and the upper half of the limiting blocks is designed as a slope. A pouring hole and an exhaust hole are provided on the top of the ceramic ring, and the pouring holes and the exhaust holes are respectively located at symmetrical positions on the top of the ceramic ring, and the pouring holes and the exhaust holes are both connected to the inner area of the ceramic ring.
[0010] Furthermore, a rectangular third mounting groove is provided at the bottom of the substrate, and a metal heat sink of a size matching the third mounting groove is fixedly installed in the third mounting groove. A plurality of heat conductive blocks are fixedly connected to the top of the metal heat sink, and the heat conductive blocks are inserted through the first mounting groove and the third mounting groove, and the top of the heat conductive block is tightly fitted with the bottom of the mounting ring.
[0011] Furthermore, the two heat dissipation fins located on both sides of the top of the packaging board are fixedly connected to the separated sides with insulating blocks, the number of the insulating blocks corresponds to the number of pins one by one, and a vertical slot is provided on the side of the insulating block away from the heat dissipation fin, and the pins facing the insulating block are clamped in the slot.
[0012] Furthermore, a decorative ring is sleeved on the ceramic ring, an annular slot matching the bottom of the decorative ring is opened on the top of the substrate, and the bottom of the decorative ring is inserted into the annular slot.
[0013] Furthermore, the top of the decorative ring completely covers the ceramic ring, and a number of heat dissipation holes are provided on the four side walls of the decorative ring. A second notch matching the insulating block is provided on the inner side of the decorative ring opposite to the insulating block, and the insulation is located in the second notch.
[0014] Furthermore, the top opening size of the pouring hole is larger than the top opening size of the exhaust hole, and the opening where the exhaust hole communicates with the inner side of the ceramic ring is close to the top surface of the ceramic ring.
[0015] Furthermore, the metal heat sink, heat conducting block, elastic member, heat spreader and heat pipe are all made of copper, and a plurality of strip-shaped heat dissipation grooves are evenly arranged on the bottom of the metal heat sink.
[0016] Technical effects and advantages of the present invention: 1. Compared with existing packaging structures, the present invention enables the silicon carbide chip body to maintain a close fit with the vapor chamber by lifting the assembly, thereby eliminating the solder layer between the existing chip and the heat dissipation component, improving the efficiency of heat transfer from the silicon carbide chip body to the vapor chamber, and thus ensuring the heat dissipation effect and efficiency of the silicon carbide chip body; 2. The present invention is provided with a metal heat sink. During the operation of the silicon carbide chip body, part of the heat can be dissipated through the heat sink, heat pipe, heat fins, insulating medium and ceramic ring, while the other part of the heat can be transferred to the mounting ring through the elastic member. The mounting ring, which has absorbed the heat, can then transfer the heat to the metal heat sink through the heat conducting block. Finally, the heat is dissipated to the external environment through the metal heat sink, thereby improving the heat dissipation efficiency and heat dissipation effect of the silicon carbide chip body. 3. The present invention provides a heat dissipation combination of a heat spreader, a heat pipe and heat sink fins. During the use of the silicon carbide chip body, the heat spreader can evenly disperse the heat generated by the silicon carbide chip body to its surface, thereby effectively avoiding the occurrence of hot spots, making the temperature of various parts of the silicon carbide chip body more uniform, and avoiding the performance degradation or shortening of the silicon carbide chip body due to local overheating. The heat spreader can then evenly transfer the heat to the heat pipe array, and then the heat pipe array can quickly transfer the heat to the heat sink fins, thereby utilizing the larger surface area of the heat sink fins to quickly dissipate the heat absorbed by the heat pipes to the external environment, thereby achieving rapid heat dissipation operation of the silicon carbide chip body. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a three-dimensional schematic diagram of all structures except the decorative ring in the present invention; Figure 3 It is a three-dimensional schematic diagram of all structures except the decorative ring and the packaging component in the present invention; Figure 4 It is a three-dimensional schematic diagram of the base plate, ceramic ring, limit block and jacking assembly in the present invention; Figure 5It is a three-dimensional schematic diagram of the packaging plate, heat pipe, heat dissipation fins and insulation block in the present invention; Figure 6 It is a three-dimensional schematic diagram of the substrate and the metal heat sink in the present invention; Figure 7 It is a three-dimensional schematic diagram of the substrate and the heat conducting block in the present invention; Figure 8 It is a three-dimensional schematic diagram of the mounting ring, elastic member, metal heat sink and heat conducting block in the present invention; Figure 9 It is a three-dimensional schematic diagram of the heat sink and the sealing block in the present invention.
[0018] In the figure: 1. Base plate; 2. Ceramic ring; 3. Silicon carbide chip body; 4. Mounting ring; 5. Elastic part; 6. Heat spreader; 7. Sealing block; 8. Packaging board; 9. Heat pipe; 10. Heat sink; 11. Pin; 12. Limit block; 13. Pouring hole; 14. Exhaust hole; 15. Metal heat sink; 16. Thermal block; 17. Insulation block; 18. Decorative ring; 19. Ring slot; 20. Heat dissipation hole. DETAILED DESCRIPTION
[0019] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments.
[0020] The present invention provides Figures 1 to 9 The silicon carbide power device packaging structure shown in the figure includes: a substrate 1, a ceramic ring 2, a silicon carbide chip body 3 and a packaging component. The substrate 1 has a rectangular first mounting groove on the top of the substrate 1, and a first notch for injecting glue is opened on the side walls around the first mounting groove; the ceramic ring 2 is fixedly installed on the top of the substrate 1, the ceramic ring 2 is rectangular, and the first mounting groove is located on the inner side of the ceramic ring 2, and a placement groove is opened at the bottom of the ceramic ring 2 opposite to the pin 11, and multiple sealing blocks 7 are correspondingly inserted into the multiple placement grooves, and the width of the placement groove is the same as the width of the pin 11. Matching, the depth of the placement groove is greater than the thickness of the pin 11, the inner wall of the ceramic ring 2 is fixedly connected to the limit block 12, the upper half of the limit block 12 is a bevel design, the top of the ceramic ring 2 is provided with a pouring hole 13 and an exhaust hole 14, the pouring hole 13 and the exhaust hole 14 are respectively located at symmetrical positions on the top of the ceramic ring 2, the pouring hole 13 and the exhaust hole 14 are both connected to the inner area of the ceramic ring 2, the top opening size of the pouring hole 13 is larger than the top opening size of the exhaust hole 14, and the opening at the connection between the exhaust hole 14 and the inner side of the ceramic ring 2 is close to the top surface of the ceramic ring 2; The silicon carbide chip body 3 is installed in the first mounting groove. A number of pins 11 are symmetrically connected to both sides of the silicon carbide chip body 3. The thickness of the silicon carbide chip body 3 is less than that of the ceramic ring 2. A lifting component is provided at the bottom of the silicon carbide chip body 3 to push it upward. The lifting component includes a mounting ring 4 and an elastic member 5. The mounting ring 4 is fixedly installed in the first mounting groove, and the shape of the mounting ring 4 matches the shape of the first mounting groove. The elastic member 5 can be a metal spring. The number of elastic members 5 is multiple, and the middle part of the elastic member 5 is arched upward. The multiple elastic members 5 are alternately fixedly connected to the inner walls on both sides of the mounting ring 4. The top of the silicon carbide chip body 3 is provided with a packaging component for pressing and fixing the silicon carbide chip body 3, and the packaging component includes a heat spreader 6, a sealing block 7, a packaging plate 8, a heat pipe 9 and a heat dissipation fin 10. The heat spreader 6 is pressed onto the top of the silicon carbide chip body 3, and silicone grease is coated between the heat spreader 6 and the silicon carbide chip body 3. The sealing block 7 is fixedly connected to the bottom of the heat spreader 6, and the number of sealing blocks 7 is multiple. The packaging plate 8 is pressed onto the top of the heat spreader 6, and a rectangular second mounting groove is opened at the bottom of the packaging plate 8. The number of heat pipes 9 is multiple, and multiple heat pipes 9 are evenly installed side by side in the second mounting groove to form a heat pipe 9 array. The bottom of the heat pipe 9 is kept in contact with the top of the heat spreader 6, and silicone grease is also coated between the heat spreader 6 and the heat pipe 9. The number of heat dissipation fins 10 is multiple, and multiple heat dissipation fins 10 are evenly fixedly connected to the top of the packaging plate 8; When packaging the silicon carbide chip body 3, first apply a circle of high-temperature adhesive material (for example, sintered silver) that matches the width of the ceramic ring 2 on the outer edge of the first mounting groove on the top of the substrate 1, and then press the ceramic ring 2 on the top of the substrate 1 so that it is bonded to the substrate 1 through the high-temperature adhesive material. Then, place the mounting ring 4 together with the elastic member 5 into the first mounting groove and press it tightly, and then place the silicon carbide chip body 3 from top to bottom into the inner side of the ceramic ring 2. When placing the silicon carbide chip body 3, ensure that the pins 11 of the silicon carbide chip body 3 are aligned with the placement groove on the ceramic ring 2. As the silicon carbide chip body 3 is gradually placed into the inner side of the ceramic ring 2, the limit blocks 12 provided on the inner walls around the ceramic ring 2 can limit the silicon carbide chip body 3, so that the gap around the silicon carbide chip body 3 and the inner walls around the ceramic ring 2 maintain the same spacing, and at this time the first notch on the side wall of the mounting groove can be aligned with the gap between the silicon carbide chip body 3 and the ceramic ring 2. The gap remains aligned. When the silicon carbide chip body 3 is completely placed in the inner area of the ceramic ring 2, the multiple elastic members 5 can generate an upward lifting force on the silicon carbide chip body 3, so that the top surface of the silicon carbide chip body 3 can be slightly higher than the top of the ceramic ring 2. Then, while silicone grease is evenly applied to the surface of the silicon carbide chip body 3, a circle of high-temperature adhesive material is evenly applied on the top of the ceramic ring 2. Then, the heat spreader 6 is pressed from top to bottom on the top of the silicon carbide chip body 3. As the heat spreader 6 presses the silicon carbide chip body 3 downward, the elastic member 5 can gradually deflect downward under the action of pressure, and the bottom of the heat spreader 6 is gradually pressed together with the high-temperature adhesive material on the top of the ceramic ring 2. After the heat spreader 6 and the ceramic ring 2 are pressed together, the pressure is maintained for a period of time, so that the heat spreader 6 can be stably bonded to the ceramic ring 2. At this time, the silicon carbide chip body 3 can be tightly attached to the heat spreader 6 through the silicone grease under the elastic force of the elastic member 5; Next, an insulating medium (e.g., a ceramic matrix composite material) is injected into the inner side of the ceramic ring 2 through the pouring hole 13. As the insulating medium is continuously injected into the inner side of the ceramic ring 2, the air originally inside the ceramic ring 2 can be continuously discharged through the exhaust hole 14. As the insulating medium is continuously injected, the small gap between the inner side of the ceramic ring 2 and the silicon carbide chip body 3 can be filled with the insulating medium, thereby being able to cooperate with the heat spreader 6 to achieve good insulation and sealing effects on the silicon carbide chip body 3. When the insulating medium is also sprayed out of the exhaust hole 14, the injection of the insulating medium into the inner side of the ceramic ring 2 is stopped, and then the insulating medium is waited for to solidify. Before the insulating medium solidifies, the insulating medium overflowing from the exhaust hole 14 is cleaned. When the insulating medium is completely solidified, the insulating medium can fix the current shape of the elastic member 5, and the silicon carbide chip body 3 can also be stably attached to the heat spreader 6 under the support of the insulating medium and the elastic member 5, thereby ensuring that the heat generated by the silicon carbide chip body 3 can be quickly transferred to the heat spreader 6. After the insulating medium is poured, silicone grease is evenly applied to the middle of the top of the vapor chamber 6, and then high-temperature adhesive material is evenly applied to the top edge of the vapor chamber 6. After the high-temperature adhesive material is applied, the packaging plate 8 is pressed from top to bottom on the top of the vapor chamber 6 and the pressure is maintained for a period of time, thereby achieving a stable connection between the vapor chamber 6 and the packaging plate 8. At this point, the silicon carbide chip body 3 is packaged. At this time, the heat pipe 9 at the bottom of the packaging plate 8 can be tightly attached to the vapor chamber 6 through the silicone grease, thereby ensuring that the vapor chamber 6 can transfer the temperature to the heat pipe 9 in a timely manner. During use, as the silicon carbide chip body 3 generates heat, the ceramic ring 2 and the ceramic-based composite material inside it have good heat dissipation performance, which can play a part in the good heat dissipation effect on the silicon carbide chip body 3. In addition, a part of the heat generated by the silicon carbide chip body 3 can also be directly transferred to the heat spreader 6. After the heat is transferred to the heat spreader 6, the heat spreader 6 can evenly disperse the heat generated by the silicon carbide chip body 3 to its surface, thereby effectively avoiding the occurrence of hot spots, making the temperature of each part of the silicon carbide chip body 3 more uniform, and avoiding the performance degradation or shortening of the silicon carbide chip body 3 due to local overheating. Subsequently, the heat spreader 6 can The heat is evenly transferred to the heat pipe 9 array at the bottom of the packaging board 8, and then the heat pipe 9 array can quickly transfer the heat to the heat dissipation fins 10, so as to utilize the larger surface area of the heat dissipation fins 10 to quickly dissipate the heat absorbed by the heat pipe 9 to the external environment, thereby realizing a rapid heat dissipation operation of the silicon carbide chip body 3. Compared with the existing packaging structure, the present invention enables the silicon carbide chip body 3 to maintain a close fit with the heat spreader 6 by lifting the component, thereby eliminating the solder layer between the existing chip and the heat dissipation component, and improving the heat transfer efficiency of the silicon carbide chip body 3 to the heat spreader 6, thereby ensuring the heat dissipation effect and heat dissipation efficiency of the silicon carbide chip body 3.
[0021] like Figures 6 to 8 As shown, a rectangular third mounting groove is provided at the bottom of the base plate 1. A metal heat sink 15 of a matching size is fixedly installed in the third mounting groove. A plurality of heat conducting blocks 16 are fixedly connected to the top of the metal heat sink 15. The heat conducting blocks 16 are inserted between the first mounting groove and the third mounting groove, and the top of the heat conducting blocks 16 is tightly fitted with the bottom of the mounting ring 4. By providing a metal heat sink 15, during the operation of the silicon carbide chip body 3, part of the heat can be dissipated through the heat spreader 6, heat pipe 9, heat sink fins 10, insulating medium and ceramic ring 2, while the other part of the heat can be transferred to the mounting ring 4 through the elastic member 5. The mounting ring 4 that has absorbed the heat can then transfer the heat to the metal heat sink 15 through the heat conducting block 16, and finally dissipate the heat to the external environment through the metal heat sink 15, thereby improving the heat dissipation efficiency and heat dissipation effect of the silicon carbide chip body 3.
[0022] like Figure 1 、 Figure 2 and Figure 5 As shown, the two heat dissipating fins 10 located on both sides of the top of the packaging board 8 are fixedly connected to the separated sides with insulating blocks 17. The bottom of the insulating block 17 is in contact with the top of the heat spreader 6, and the side of the insulating block 17 close to the heat dissipating fin 10 can be kept in close contact with the side of the heat spreader 6. Therefore, when the packaging board 8 and the heat spreader 6 are pressed together, the insulating block 17 can also limit the packaging board 8 and the heat spreader 6 to ensure that the two can be pressed together directly, thereby ensuring the pressing quality. The number of insulating blocks 17 corresponds to the number of pins 11 one by one. A vertical slot is provided on the side of the insulating block 17 away from the heat dissipating fin 10, and the pins 11 facing the insulating block 17 are snapped into the slot. By providing an insulating block 17, after the heat spreader 6 is bonded to the ceramic ring 2 through the high-temperature adhesive material, silicone grease is evenly applied to the middle position of the top of the heat spreader 6, and then the high-temperature adhesive material is evenly applied to the edge position of the top of the heat spreader 6. After the high-temperature adhesive material is applied, the packaging board 8 is pressed from top to bottom on the top of the heat spreader 6. During the pressing, it is ensured that the pins 11 of the silicon carbide chip body 3 are aligned one by one with the insulating blocks 17 on the heat sink 10, so as to ensure that after the packaging board 8 is pressed onto the top of the heat spreader 6, the multiple pins 11 of the silicon carbide chip body 3 can be inserted into the slots of the multiple insulating blocks 17 one by one. While restricting the pins 11 through the slots, the insulating blocks 17 can also separate the pins 11 from the heat sink 10, the packaging board 8 and the heat spreader 6, thereby preventing the pins 11 from being electrically connected to the heat sink 10, the packaging board 8 and the heat spreader 6.
[0023] like Figure 1 As shown, a decorative ring 18 is sleeved on the ceramic ring 2, and an annular slot 19 is provided on the top of the substrate 1 to match the bottom of the decorative ring 18, and the bottom of the decorative ring 18 is inserted into the annular slot 19, and the top of the decorative ring 18 completely covers the ceramic ring 2. A plurality of heat dissipation holes 20 for heat dissipation are penetrated on the four side walls of the decorative ring 18, and a second notch matching the insulating block 17 is provided on the inner side of the decorative ring 18 opposite to the insulating block 17, and the insulation is located in the second notch. There is a gap between the inner side of the decorative ring 18 and the ceramic ring 2, thereby ensuring that the decorative ring 18 is not in direct contact with the ceramic ring 2 and that the heat on the ceramic ring 2 can be well discharged through the heat dissipation holes 20. The top surface of the decorative ring 18 is flush with the top surface of the packaging board 8, and the size of the top opening of the decorative ring 18 matches the size of the packaging board 8, so that when the decorative ring 18 is sleeved on the ceramic ring 2, the sea of the decorative ring 18 can restrict the packaging board 8 to prevent the packaging board 8 from moving; By providing a decorative ring 18, after the packaging plate 8 and the heat spreader 6 are bonded together, the high-temperature adhesive material can be evenly applied in the annular slot 19, and then the decorative ring 18 is sleeved on the outside of the ceramic ring 2, and the bottom edge of the decorative ring 18 can be inserted into the annular slot 19, and then a pressure holding operation is performed, so that the decorative ring 18 can be bonded to the substrate 1 through the high-temperature adhesive material, thereby protecting the ceramic ring 2 while also covering the pouring hole 13 and the exhaust hole 14 on the ceramic ring 2, thereby improving the overall aesthetics.
[0024] like Figure 6 As shown, the metal heat sink 15, the heat conducting block 16, the elastic member 5, the heat spreader 6 and the heat pipe 9 are all made of copper, and a plurality of strip-shaped heat dissipation grooves are evenly arranged on the bottom of the metal heat sink 15; By evenly arranging strip-shaped heat dissipation grooves at the bottom of the metal heat sink 15, the contact area between the metal heat sink 15 and the outside air can be increased, thereby accelerating the heat dissipation from the metal heat sink 15 to the air, thereby improving the heat dissipation effect on the silicon carbide chip body 3.
[0025] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same.
Claims
1. A silicon carbide power device packaging structure, characterized in that: include: A base plate (1), wherein a rectangular first mounting groove is provided on the top of the base plate (1), and first notches for injecting glue are provided on the four side walls of the first mounting groove; A ceramic ring (2) is fixedly mounted on the top of the substrate (1), the ceramic ring (2) is rectangular, and the first mounting groove is located on the inner side of the ceramic ring (2); A silicon carbide chip body (3) is installed in the first installation groove, and a lifting component for pushing the silicon carbide chip body (3) upward is provided at the bottom of the silicon carbide chip body (3), and the lifting component includes a mounting ring (4) and an elastic member (5), the mounting ring (4) is fixedly installed in the first installation groove, and the shape of the mounting ring (4) matches the shape of the first installation groove, the number of the elastic members (5) is multiple, and the middle part of the elastic member (5) is arched upward, and the multiple elastic members (5) are alternately fixedly connected to the inner walls on both sides of the mounting ring (4); A packaging component for pressing and fixing the silicon carbide chip body (3) is provided on the top of the silicon carbide chip body (3).
2. The silicon carbide power device packaging structure according to claim 1, characterized in that: The packaging assembly includes a heat spreader (6), a sealing block (7), a packaging plate (8), a heat pipe (9) and a heat dissipation fin (10), wherein the heat spreader (6) is pressed onto the top of the silicon carbide chip body (3), and silicone grease is applied between the heat spreader (6) and the silicon carbide chip body (3), the sealing block (7) is fixedly connected to the bottom of the heat spreader (6), and the number of the sealing blocks (7) is multiple, the packaging plate (8) is pressed onto the top of the heat spreader (6), and a rectangular second mounting groove is opened at the bottom of the packaging plate (8), the number of the heat pipe (9) is multiple, and the multiple heat pipes (9) are evenly installed side by side in the second mounting groove to form a heat pipe (9) array, the bottom of the heat pipe (9) is kept in contact with the top of the heat spreader (6), and silicone grease is also applied between the heat spreader (6) and the heat pipe (9), the number of the heat dissipation fin (10) is multiple, and the multiple heat dissipation fins (10) are evenly fixedly connected to the top of the packaging plate (8).
3. The silicon carbide power device packaging structure according to claim 2, characterized in that: A plurality of pins (11) are symmetrically connected to both sides of the silicon carbide chip body (3), and the thickness of the silicon carbide chip body (3) is smaller than the thickness of the ceramic ring (2).
4. The silicon carbide power device packaging structure according to claim 3, characterized in that: A placement groove is provided at a position on the bottom of the ceramic ring (2) facing the pin (11), and a plurality of sealing blocks (7) are correspondingly inserted into the plurality of placement grooves. The width of the placement groove matches the width of the pin (11), and the depth of the placement groove is greater than the thickness of the pin (11). The inner walls of the ceramic ring (2) are fixedly connected with limit blocks (12). The upper half of the limit blocks (12) is designed as an inclined surface. A pouring hole (13) and an exhaust hole (14) are provided on the top of the ceramic ring (2). The pouring hole (13) and the exhaust hole (14) are respectively located at symmetrical positions on the top of the ceramic ring (2). The pouring hole (13) and the exhaust hole (14) are both connected to the inner area of the ceramic ring (2).
5. The silicon carbide power device packaging structure according to claim 4, characterized in that: A rectangular third mounting groove is provided at the bottom of the substrate (1), a metal heat sink (15) of a size matching the third mounting groove is fixedly installed in the third mounting groove, a plurality of heat conducting blocks (16) are fixedly connected to the top of the metal heat sink (15), the heat conducting blocks (16) are inserted through the first mounting groove and the third mounting groove, and the top of the heat conducting block (16) is tightly fitted with the bottom of the mounting ring (4).
6. The silicon carbide power device packaging structure according to claim 5, characterized in that: The two heat dissipation fins (10) located on both sides of the top of the packaging board (8) are fixedly connected to the separated sides with insulating blocks (17), the number of the insulating blocks (17) corresponds to the number of the pins (11) one by one, and the insulating blocks (17) are provided with vertical slots on the side away from the heat dissipation fins (10), and the pins (11) facing the insulating blocks (17) are snapped into the slots.
7. The silicon carbide power device packaging structure according to claim 6, characterized in that: A decorative ring (18) is sleeved on the ceramic ring (2), and an annular slot (19) matching the bottom of the decorative ring (18) is provided on the top of the base plate (1), and the bottom of the decorative ring (18) is inserted into the annular slot (19).
8. The silicon carbide power device packaging structure according to claim 7, characterized in that: The top of the decorative ring (18) completely covers the ceramic ring (2), and a plurality of heat dissipation holes (20) for heat dissipation are provided on the four side walls of the decorative ring (18). A second notch matching the insulating block (17) is provided on the inner side of the decorative ring (18) at a position opposite to the insulating block (17), and the insulation is located in the second notch.
9. The silicon carbide power device packaging structure according to claim 8, characterized in that: The top opening size of the pouring hole (13) is larger than the top opening size of the exhaust hole (14), and the opening at the connection point between the exhaust hole (14) and the inner side of the ceramic ring (2) is close to the top surface of the ceramic ring (2).
10. The silicon carbide power device packaging structure according to claim 9, characterized in that: The metal heat sink (15), heat conducting block (16), elastic member (5), heat spreader (6) and heat pipe (9) are all made of copper, and a plurality of strip-shaped heat dissipation grooves are evenly arranged on the bottom of the metal heat sink (15).