Electronic packaging module and manufacturing method thereof

Abstract

The invention provides an electronic packaging module and a manufacturing method thereof, and the method comprises the steps: providing a circuit substrate, arranging an electronic element and at least three conductive columns on the surface of the circuit substrate, and enabling the electronic element and the conductive columns to be electrically connected to the circuit substrate. The electronic component is provided with a plane far away from the circuit substrate, and each conductive column is provided with an end face far away from the circuit substrate. The distance between the end face and the surface is greater than the distance between the plane and the surface. Next, a sealing material covering the electronic component and the conductive pillar is provided on the surface of the circuit board, and a heat dissipation material is provided on the sealing material. The heat dissipation material covers the electronic component and the conductive columns and is in direct contact with the end face of each conductive column. Then, the sealing material is cured to form a sealing layer between the circuit substrate and the heat dissipation material, and the sealing layer surrounds the electronic component and the conductive column. Thus, a bonding material does not need to be used between the heat dissipation material and the sealing material, the situation that the heat dissipation material falls off is reduced, and the yield of the electronic packaging module is improved.

Description

Technical Field

[0001] The invention relates to an electronic packaging module. Background Art

[0002] In highly integrated electronic packaging modules, there are two ways to install heat dissipation elements (such as heat sinks) within the module. One method is to form a sealing layer covering the electronic components and then attach the heat dissipation element to the sealing layer using double-sided tape or similar adhesive materials. However, because the adhesive material between the sealing layer and the heat dissipation element is easily detached during subsequent processing, this method is not conducive to improving the yield of the electronic packaging module.

[0003] Another method is to place the heat dissipation element on the electronic component to be dissipated before forming the sealing layer covering the electronic component, and then perform the plastic sealing process to cover the electronic component. However, because the sealing layer is formed after the heat dissipation element is set, there is a very high proportion of the situation where the sealing layer partially covers the top of the heat dissipation element. These parts of the sealing layer covering the heat dissipation element must be removed through subsequent processes (such as grinding processes), otherwise it will affect the heat dissipation effect of the electronic packaging module. Therefore, this method increases the complexity of the packaging process. In addition, the heat dissipation elements in the above methods are not grounded, which easily leads to electromagnetic interference (EMI). Summary of the Invention

[0004] Therefore, at least one embodiment of the present invention provides an electronic packaging module, which helps to improve the yield of the packaging module.

[0005] At least one embodiment of the present invention provides a method for manufacturing the electronic packaging module.

[0006] The present invention provides a method for manufacturing an electronic packaging module, comprising providing a circuit substrate; arranging an electronic component on a surface of the circuit substrate, and the electronic component is electrically connected to the circuit substrate, and the electronic component has a plane away from the circuit substrate; arranging at least three conductive posts on the surface of the circuit substrate, and the conductive posts are electrically connected to the circuit substrate, each conductive post has an end face away from the circuit substrate, and the distance between the end face of the conductive post and the surface of the circuit substrate is greater than the distance between the plane of the electronic component and the surface of the circuit substrate; after arranging the electronic component and the conductive posts on the circuit substrate, arranging a sealing material on the surface of the circuit substrate, and the sealing material covers the electronic component and the conductive posts; after arranging the sealing material on the circuit substrate, arranging a heat dissipation material on the sealing material, the heat dissipation material covers the electronic component and the conductive posts, and the heat dissipation material directly contacts the end face of each conductive post; and after arranging the heat dissipation material on the sealing material, curing the sealing material to form a sealing layer, which is located between the circuit substrate and the heat dissipation material and surrounds the electronic component and the conductive posts.

[0007] The present invention also provides an electronic packaging module, which includes a circuit substrate having a surface, an electronic component arranged on the surface of the circuit substrate, at least three conductive posts arranged on the surface of the circuit substrate, a sealing layer arranged on the circuit substrate, and a heat dissipation material arranged on the sealing layer. The electronic component is electrically connected to the circuit substrate, and the electronic component has a plane away from the circuit substrate. The conductive posts are electrically connected to the circuit substrate, and each conductive post has an end face away from the circuit substrate. The distance between the end face of the conductive post and the surface of the circuit substrate is greater than the distance between the plane of the electronic component and the surface of the circuit substrate. The sealing layer covers the electronic component and the conductive post. The heat dissipation material covers the electronic component and the conductive post, and the sealing layer is located between the circuit substrate and the heat dissipation material. The heat dissipation material directly contacts the end face of each conductive post.

[0008] Based on the above, at least one embodiment of the present invention provides support for the heat dissipation element above the electronic component by disposing at least three conductive pillars between the circuit substrate and the heat dissipation material, with the end faces of these conductive pillars elevated above the plane of the electronic component. Furthermore, at least one embodiment of the present invention secures the heat dissipation material to the sealing layer by first disposing a sealing material on the circuit substrate, then disposing a heat dissipation material above the sealing material, and curing the sealing material to form a sealing layer. This eliminates the need for an adhesive between the heat dissipation material and the sealing material, thereby reducing the likelihood of the heat dissipation material falling off due to adhesive failure and thereby improving the yield of the electronic packaging module. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figures 1A to 1C A cross-sectional view is shown of a method for manufacturing an electronic packaging module according to at least one embodiment of the present invention.

[0010] Figure 2 A top view of a method for manufacturing an electronic packaging module according to at least one embodiment of the present invention is shown.

[0011] Figure 3 A cross-sectional view of an electronic packaging module according to at least one embodiment of the present invention is shown.

[0012] Figure 4 A cross-sectional view of an electronic packaging module according to at least one embodiment of the present invention is shown.

[0013] The description of the accompanying drawings is as follows:

[0014] 100: Electronic packaging module

[0015] 110: Circuit board

[0016] 110f: Surface

[0017] 120,130: Electronic components

[0018] 120p: Flat

[0019] 140: Conductive column

[0020] 140e: End face

[0021] 160: Sealing layer

[0022] 160': Sealing material

[0023] 180,380: heat dissipation materials

[0024] d1, d2: distance

[0025] P1: Pressure

[0026] w1: width DETAILED DESCRIPTION

[0027] At least one embodiment of the present invention discloses an electronic packaging module 100 (indicated at Figure 2 ) is produced by Figures 1A to 1C A series of steps in the following are used to illustrate at least one embodiment of the present invention. First, please refer to Figure 1AA circuit substrate 110 is provided. The circuit substrate 110 may include a surface 110f and a surface (not shown) opposite to the surface 110f. Subsequently, an electronic component 120 may be disposed on the surface 110f of the circuit substrate 110 using surface mount technology (SMT), such as solder, and the electronic component 120 may be electrically connected to the circuit substrate 110. Although not shown in the figures, in detail, the electronic component 120 may be electrically connected to the circuit layer (not shown) of the circuit substrate 110 via a plurality of solder materials (not shown), such as solder balls or solder paste, disposed on the surface 110f of the circuit substrate 110.

[0028] like Figure 1A As shown, the electronic component 120 has a plane 120p away from the circuit substrate 110. That is, the plane 120p of the electronic component 120 is facing away from the circuit substrate 110. On the other hand, in this embodiment, this step may also include setting the electronic component 130 on the surface 110f of the circuit substrate 110 by surface mounting technology such as soldering. The electronic component 120 and the electronic component 130 can be active components such as transistors, or passive components such as capacitors or inductors. For example, in this embodiment, the electronic component 120 is a packaged chip or an unpackaged die, and the electronic component 130 is a capacitor or an inductor. However, in other embodiments of the present invention, the types of each electronic component 120 and the electronic component 130 are not limited to the above embodiments.

[0029] like Figure 1A As shown, at least three conductive pillars 140 can be disposed on the surface 110 f of the circuit substrate 110 using surface mounting technology such as soldering, and these conductive pillars 140 are electrically connected to the circuit substrate 110. Specifically, the conductive pillars 140 can be electrically connected to the circuit layer (not shown) of the circuit substrate 110 via a plurality of solder materials (not shown), such as solder balls or solder paste, disposed on the surface 110 f of the circuit substrate 110.

[0030] Each conductive pillar 140 has an end surface 140e facing away from the circuit substrate 110. The distance d1 between this end surface 140e and the surface 110f of the circuit substrate 110 is actually greater than the distance d2 between the plane 120p of the electronic component 120 and the surface 110f of the circuit substrate 110. In other words, the end surface 140e also faces away from the circuit substrate 110. When the solder material connecting the conductive pillar 140 and the electronic component 120 to the circuit substrate 110 is the same size, the height of the conductive pillar 140 (not shown, essentially the height after deducting the solder material from the distance d1) can be greater than the height of the electronic component 120 (not shown, essentially the height after deducting the solder material from the distance d2). The conductive pillar 140 can be, for example, a copper pillar or similar metal pillar, and the ratio of the height of the conductive pillar 140 to its width w1 can be between 2 and 10. For example, the height of the conductive pillar 140 ranges from 0.2 mm to 5.0 mm, and the width w1 of the conductive pillar 140 ranges from 0.1 mm to 1.0 mm.

[0031] It is worth noting that the order in which the electronic components 120, 130, and conductive pillars 140 are disposed on the circuit substrate 110 is not limited to the order described above. For example, in at least one embodiment of the present invention, the electronic components 120 and 130 may be disposed on the circuit substrate 110 first, followed by the conductive pillars 140. In another embodiment of the present invention, the conductive pillars 140 may be disposed on the circuit substrate 110 first, followed by the electronic components 120 and 130.

[0032] After the electronic components 120, 130 and the conductive pillars 140 are arranged on the circuit substrate 110, please refer to Figure 1B A sealing material 160' is disposed on the surface 110f of the circuit substrate 110, and the sealing material 160' covers the electronic components 120, 130, and the conductive pillars 140. It is worth noting that in various embodiments of the present invention, the sealing material 160' can be disposed on the surface 110f of the circuit substrate 110 by vacuum printing.

[0033] Specifically, this step involves vacuum printing to form a fluid sealing material 160' on the surface 110f of the circuit substrate 110. Because the entire object to be printed is placed in a sealed cavity during vacuum printing, and the cavity is maintained in a vacuum state, sealing material 160' can be formed more evenly, reducing the generation of bubbles.

[0034] Please continue to refer to Figure 1CAfter the sealing material 160' is disposed on the circuit substrate 110, a heat dissipation material 180 is disposed on the sealing material 160'. The heat dissipation material 180 covers the electronic components 120, the electronic components 130, and the conductive pillars 140, and the heat dissipation material 180 directly contacts the end surface 140e of each conductive pillar 140. Since the conductive pillars 140 are directly in contact with the heat dissipation material 180, when the heat dissipation material 180 comprises a metal material (e.g., copper), the heat dissipation material 180 can be electrically connected to the conductive pillars 140. The heat dissipation material 180 can also be electrically connected to a ground circuit (not shown) on the circuit substrate 110 through the conductive pillars 140, thereby grounding the heat dissipation material 180 and preventing electromagnetic interference.

[0035] It is worth mentioning that the above-mentioned disposing of the heat dissipation material 180 on the sealing material 160' further includes: applying a pressure P1 to the heat dissipation material 180, and this pressure P1 is directed toward the electronic component 120 and the conductive pillar 140, so that the heat dissipation material 180 is attached to the end surface 140e of the conductive pillar 140. In other words, the pressure P1 extends from the end surface 140e of the conductive pillar 140 toward the surface 110f of the circuit substrate 110 (i.e., Figure 1C The heat dissipation material 180 is closely attached to the electronic component 120 and the conductive pillar 140 .

[0036] The pressure P1 can be as low as 10kg / cm 2 Up to 20kg / cm 2 This helps reduce the amount of gas distributed between the plane 120p of the electronic component 120 and the heat dissipation material 180 (for example, air bubbles that are not completely eliminated when the heat dissipation material 180 and the electronic component 120 are bonded together), and also helps reduce the amount of gas distributed between the end surface 140e of the conductive pillar 140 and the heat dissipation material 180 (for example, air bubbles that are not completely eliminated when the heat dissipation material 180 and the conductive pillar 140 are bonded together).

[0037] It is worth noting that the aforementioned step of disposing the heat dissipation material 180 on the sealing material 160' can be performed in a vacuum environment within a temperature range of 60°C to 180°C. Because the sealing material 160' is in a fluid state within this temperature range, under vacuum and pressure P1, the heat dissipation material 180 can not only remove the sealing material 160' covering the flat surface 120p of the electronic component 120, but also expel the air within the sealing material 160', allowing the heat dissipation material 180 to directly and closely contact the flat surface 120p of the electronic component 120. Furthermore, the step of disposing the heat dissipation material 180 on the sealing material 160' can be, but is not limited to, performed in a vacuum environment.

[0038] After heat dissipation material 180 is disposed on sealing material 160', sealing material 160' can be cured by, for example, cooling, continuously heating, drying, or UV irradiation to form sealing layer 160. Sealing layer 160 is located between circuit substrate 110 and heat dissipation material 180 and surrounds electronic components 120, electronic components 130, and conductive pillars 140. The material of sealing layer 160 (i.e., sealing material 160') may include, for example, liquid epoxy resin (Epoxy Liquid Compound) or a similar insulating material with thermal conductivity.

[0039] Although the heat dissipation material 180 is in direct contact with the plane 120p of the electronic component 120 in this embodiment, the present invention is not limited to this embodiment. Figure 3 In other embodiments, the sealing layer 160 may also be disposed between the heat dissipation material 380 and the flat surface 120p of the electronic component 120. It is worth noting that the number of conductive pillars 140 is at least three. Therefore, before the sealing material 160' cures, even if the electronic component 120 cannot support the heat dissipation material 380, the conductive pillars 140 can still support the heat dissipation material 380, thereby preventing the heat dissipation material 380 from directly contacting the flat surface 120p of the electronic component 120.

[0040] In particular, please refer to Figure 2 , Figure 2 The top view of the sealing layer 160 (and the circuit substrate 110) is shown after the sealing layer 160 is formed, and a plurality of heat dissipation materials 180 are arranged spaced apart from each other on the sealing layer 160 in this connected state. After the sealing layer 160 is formed, the sealing layer 160 and the circuit substrate 110 can be cut by, for example, mechanical cutting, laser cutting, or ion beam cutting. At this point, at least one circuit board has been formed. Figure 4 The electronic package module 100 is shown.

[0041] Please refer to Figure 4 The electronic package module 100 includes a circuit substrate 110, an electronic component 120, at least three conductive pillars 140, a sealing layer 160, and a heat dissipation material 180. The circuit substrate 110 has a surface 110f, and the electronic component 120 is disposed on the surface 110f of the circuit substrate 110 and is electrically connected to the circuit substrate 110. On the other hand, the conductive pillars 140 are disposed on the surface 110f of the circuit substrate 110 and are electrically connected to the circuit substrate 110.

[0042] The electronic component 120 has a plane 120p that is spaced apart from the circuit substrate 110, and each conductive pillar 140 has an end surface 140e that is spaced apart from the circuit substrate 110. A distance d1 between the end surface 140e of the conductive pillar 140 and the surface 110f is greater than a distance d2 between the plane 120p and the surface 110f of the electronic component 120. In this embodiment, the electronic packaging module 100 further includes an electronic component 130, but the present invention is not limited to this embodiment. In other embodiments, the electronic packaging module 100 may also not include the electronic component 130.

[0043] It is worth mentioning that the number of electronic components 120 and electronic components 130 in the present invention is not limited to this embodiment, and the number of electronic components 120 and electronic components 130 can be any integer greater than one. For example, in this embodiment, one electronic component 120 and two electronic components 130 can be provided on the circuit substrate 110. However, in other embodiments, two electronic components 120 and one electronic component 130 can also be provided on the circuit substrate 110. In addition, although the electronic components 120 and the electronic components 130 in this embodiment are disposed on one side of the circuit substrate 110 (i.e., the surface 110f), in other embodiments, the electronic components 120 and the electronic components 130 can also be disposed on opposite sides of the circuit substrate 110 (i.e., the surface 110f and the other surface opposite to the surface 110f).

[0044] The sealing layer 160 is disposed on the circuit substrate 110 and covers the electronic components 120 and the conductive pillars 140. The heat dissipation material 180 is disposed on the sealing layer 160 and covers the electronic components 120 and the conductive pillars 140. In addition, since the sealing layer 160 of this embodiment can also cover the electronic components 130, the heat dissipation material 180 can also cover the electronic components 130. The sealing layer 160 is located between the circuit substrate 110 and the heat dissipation material 180, and the heat dissipation material 180 directly contacts the end surface 140e of each conductive pillar 140. In this way, the heat dissipation material 180 can be electrically connected to the ground circuit on the circuit substrate 110 through the conductive pillars 140, thereby achieving grounding of the heat dissipation material 180.

[0045] It is worth mentioning that, Figure 4 As shown, heat dissipation material 180 directly contacts flat surface 120p of electronic component 120. Specifically, from a cross-sectional view, heat dissipation material 180 of this embodiment is T-shaped, with the protruding portion of the T-shape aligned above electronic component 120, while conductive pillars 140 are aligned with the flat surface of the T-shape. Therefore, when the height of electronic component 120 is smaller than that of conductive pillars 140, the protruding portion of the T-shape can still contact flat surface 120p of electronic component 120.

[0046] However, the shape of the heat dissipation material in the present invention is not limited to this embodiment. Figure 3 For example, the heat dissipation material 380 is in a straight line shape with a uniform thickness, as seen from the cross-sectional view. That is, if the height of the electronic component 120 is less than that of the conductive pillar 140, the sealing layer 160 can be distributed between the heat dissipation material 380 and the plane 120p of the electronic component 120.

[0047] In summary, at least one embodiment of the present invention supports the heat dissipation element above the electronic component by disposing at least three conductive pillars between the circuit substrate and the heat dissipation material, with the end faces of these conductive pillars being higher than the plane of the electronic component. Furthermore, at least one embodiment of the present invention secures the heat dissipation material to the sealing layer by first disposing a sealing material on the circuit substrate, then disposing a heat dissipation material above the sealing material, and curing the sealing material to form a sealing layer. This eliminates the need for an adhesive between the heat dissipation material and the sealing material, thereby reducing the likelihood of the heat dissipation material falling off due to adhesive failure and thereby improving the yield of the electronic packaging module.

[0048] Furthermore, because at least one embodiment of the present invention first applies the sealing material to the circuit substrate before covering the heat sink material over the sealing material, it reduces the risk of the sealing material overflowing and covering the upper surface of the heat sink material (i.e., the surface of the heat sink material facing away from the electronic components). Consequently, the step of removing the sealing material from the upper surface of the heat sink material can be omitted, simplifying the electronic packaging module manufacturing process.

[0049] Although the present invention has been disclosed above with reference to the embodiments, they are not intended to limit the present invention. Those skilled in the art may make modifications and improvements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A method for manufacturing an electronic packaging module, characterized in that: The method comprises: Providing a circuit substrate; An electronic component is disposed on a surface of the circuit substrate, and the electronic component is electrically connected to the circuit substrate, wherein the electronic component has a plane away from the circuit substrate; At least three conductive posts are disposed on the surface of the circuit substrate, and the conductive posts are electrically connected to the circuit substrate, wherein each of the conductive posts has an end surface away from the circuit substrate, and a distance between the end surface of the conductive post and the surface of the circuit substrate is greater than a distance between the plane of the electronic component and the surface of the circuit substrate; After the electronic components and the conductive pillars are arranged on the circuit substrate, a sealing material is arranged on the surface of the circuit substrate, and the sealing material covers the electronic components and the conductive pillars; After the sealing material is disposed on the circuit substrate, a heat dissipation material is disposed on the sealing material, wherein the heat dissipation material covers the electronic components and the conductive pillars and directly contacts the end surface of each of the conductive pillars; and After the heat dissipation material is disposed on the sealing material, the sealing material is cured to form a sealing layer, wherein the sealing layer is located between the circuit substrate and the heat dissipation material and surrounds the electronic component and the conductive column.

2. The method according to claim 1, wherein The heat dissipation material directly contacts the flat surface of the electronic component.

3. The method according to claim 1, wherein The sealing layer is distributed between the heat dissipation material and the plane of the electronic component.

4. The method according to claim 1, wherein The sealing material is provided on the surface of the circuit substrate in a vacuum printing manner.

5. The method according to claim 1, wherein Providing the heat dissipation material on the sealing material includes: A pressure is applied to the heat dissipation material, and the pressure is directed toward the electronic component and the conductive pillar, so that the heat dissipation material adheres to the end surface of the conductive pillar.

6. An electronic packaging module manufactured according to the method of claim 1, characterized in that: The electronic package module includes: a circuit substrate having a surface; an electronic component disposed on the surface of the circuit substrate and electrically connected to the circuit substrate, wherein the electronic component has a plane away from the circuit substrate; at least three conductive posts disposed on the surface of the circuit substrate and electrically connected to the circuit substrate, wherein each of the conductive posts has an end surface away from the circuit substrate, and a distance between the end surface of the conductive post and the surface of the circuit substrate is greater than a distance between the plane of the electronic component and the surface of the circuit substrate; a sealing layer, disposed on the circuit substrate and covering the electronic components and the conductive pillars; and A heat dissipation material is disposed on the sealing layer and covers the electronic components and the conductive posts, wherein the sealing layer is located between the circuit substrate and the heat dissipation material, and the heat dissipation material directly contacts the end surface of each of the conductive posts.

7. The electronic packaging module according to claim 6, wherein: The heat dissipation material directly contacts the flat surface of the electronic component.

8. The electronic packaging module according to claim 7, wherein: The sealing layer is distributed between the heat dissipation material and the plane of the electronic component.

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