Double-sided heat dissipation module based on pre-pasted power device and preparation process

Abstract

The invention relates to a double-sided heat dissipation module based on a pre-pasting type power device. The double-sided heat dissipation module comprises a tube shell, at least one pre-pasting type power device, a lower insulation heat dissipation plate, an upper insulation heat dissipation plate, an upper heat dissipation device, at least one conductive component and protection glue. The tube shell is provided with a hollow area; the pre-pasting type power device, the lower insulation heat dissipation plate, the upper insulation heat dissipation plate and the conductive member are all located in the hollow area. The upper surface of the lower insulation heat dissipation plate and the lower surface of the upper insulation heat dissipation plate are provided with circuit layers. The upper surface and the lower surface of the pre-mounted power device are respectively mounted at corresponding positions between the two circuit layers to realize electrical connection; a plurality of signal pins are arranged on the tube shell; and the protection glue is filled in the hollow area. The invention also relates to a preparation technology of the double-sided heat dissipation module based on the pre-pasted power device.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit manufacturing, in particular to a double-sided heat dissipation module based on pre-mounted power devices and a preparation process thereof. Background Art

[0002] Traditional module packaging has two key characteristics. First, the chip is directly mounted on an insulating heat sink, with internal electrical continuity and current conduction achieved through bonding wires. This significantly increases the total circuit inductance, resulting in significant electrical interference and poor performance. Second, the single-sided heat dissipation design dissipates heat downward through the insulating heat sink at the bottom, while the top of the chip is sealed by a housing or plastic compound, leaving no heat dissipation channel. This often results in inefficient heat transfer, leading to heat accumulation and potentially causing electrical failure or circuit breakage.

[0003] Therefore, it is desired to provide a double-sided heat dissipation module based on pre-mounted power devices and a preparation process, in order to solve the above technical problems. Summary of the Invention

[0004] The first object of the present invention is to provide a double-sided heat dissipation module based on pre-mounted power devices, comprising a tube shell, at least one pre-mounted power device, a lower insulating heat dissipation plate, an upper insulating heat dissipation plate, an upper heat sink, at least one conductive member, and protective adhesive;

[0005] The tube shell has a hollow area;

[0006] The pre-mounted power device, the lower insulating heat dissipation plate, the upper insulating heat dissipation plate and the conductive member are all located in the hollow area;

[0007] The upper surface of the lower insulating heat dissipation plate and the lower surface of the upper insulating heat dissipation plate are both provided with a circuit layer;

[0008] The upper and lower surfaces of the pre-mounted power device are respectively mounted at corresponding positions between the two circuit layers to achieve electrical connection;

[0009] The upper and lower surfaces of the conductive frame are mounted at corresponding positions between the two circuit layers;

[0010] The tube shell is provided with a plurality of signal pins, and the signal pins are electrically connected to corresponding positions of the circuit layer of the lower insulating heat dissipation plate respectively;

[0011] The protective glue is filled in the hollow area, and the lower surface of the lower insulating heat dissipation plate and the upper part of the upper radiator are exposed outside the protective glue.

[0012] Preferably, the protective adhesive is epoxy resin protective adhesive.

[0013] Preferably, components are electrically connected between the two circuit layers.

[0014] Preferably, the upper surface of the upper insulating heat dissipation plate and the lower surface of the lower insulating heat dissipation plate are both covered with a protective layer.

[0015] Specifically, the upper insulating heat dissipation plate and the lower insulating heat dissipation plate are ceramic substrates.

[0016] Furthermore, the protective layer is a copper clad layer.

[0017] Optionally, the upper radiator is an air-cooled radiator or a water-cooled radiator.

[0018] Optionally, the tube shell is provided with a plurality of connection holes.

[0019] The second object of the present invention is to provide a preparation process of a double-sided heat dissipation module based on pre-mounted power devices, comprising the following steps:

[0020] S1. Prepare a lower insulating heat sink plate and an upper insulating heat sink plate printed with a circuit layer, and print adhesive material at the corresponding position of the circuit layer of the lower insulating heat sink plate;

[0021] S2. Mounting the pre-mounted power device and the conductive member on corresponding positions of the circuit layer of the lower insulating heat dissipation plate to achieve electrical connection;

[0022] S3. Printing adhesive material on the upper surface of the pre-mounted power device and the conductive component, and attaching an insulating heat sink to achieve electrical connection between the circuit layer of the upper insulating heat sink and the pre-mounted power device and the conductive component;

[0023] S4, curing treatment of adhesive material;

[0024] S5. Install the components processed in S4 in the hollow area of ​​the tube shell, and weld the signal pins on the tube shell to the corresponding positions on the circuit layer on the lower insulating heat dissipation plate to achieve electrical connection;

[0025] S6. Adhere and mount the upper radiator on the upper surface of the upper insulating heat dissipation plate;

[0026] S7. Pour protective glue into the hollow area of ​​the tube shell and heat to solidify it.

[0027] Specifically, in step S5, ultrasonic welding is used to achieve electrical connection between the signal pins on the tube shell and the corresponding positions on the circuit layer on the lower insulating heat dissipation plate.

[0028] Specifically, in step S6, a heat-conductive double-sided adhesive material is pre-attached to the lower surface of the upper heat sink, and then the upper heat sink is adhesively mounted on the upper surface of the upper insulating heat dissipation plate.

[0029] The double-sided heat dissipation module based on pre-mounted power devices and the preparation process of the present invention have the following advantages over the prior art:

[0030] (1) Good heat dissipation performance: Double-sided heat dissipation module design, the chip heat is dissipated from the top and bottom insulating heat dissipation plates together, the heat dissipation effect is 20% higher than that of conventional single-sided heat dissipation modules, the thermal performance is good, and the product electrical output is stable.

[0031] (2) Good electrical performance: The chip is pre-attached to the power device in advance, without the need for wire bonding, and the chip's electrical properties are efficiently introduced into the power device without performance degradation. At the same time, the pre-attached power device is mounted on the lower insulating heat sink to achieve efficient interconnection between the source and gate. The top is interconnected with the upper insulating heat sink to achieve drain-side interconnection. Again, no wire bonding is required, resulting in low total circuit inductance, high electrical performance, and excellent transmission performance.

[0032] (3) High power density: This double-sided heat dissipation pre-attachment design introduces the drain end to the upper interconnection without bonding wires, effectively utilizing the layout space, saving more than 50% of the space, and significantly improving the power density.

[0033] (4) High reliability: Based on good thermal conductivity performance (double-sided heat dissipation design), small overall size (high power density), no bonding wire process (avoiding the risk of reliability failure of bonding wires), and high mechanical strength (protective glue filling process), the reliability of the product is significantly enhanced.

[0034] (5) High flexibility: This design has high power density, which allows more room for internal product design and can integrate more designs and functions. It can be expanded into a drive and power integrated module with high flexibility.

[0035] (6) Cost savings: From the perspective of packaging cost, this design has no bonding wire costs and high power density, which makes the structure small and reduces the overall packaging cost. From the perspective of client assembly, the package size is small, and the client chassis assembly size can be made smaller, saving the client chassis cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 This is a structural schematic diagram of a double-sided heat dissipation module based on pre-mounted power devices and a manufacturing process according to Example 1;

[0037] Figure 2 This is a schematic diagram of the internal structure of a double-sided heat dissipation module based on pre-mounted power devices and its preparation process according to Example 1;

[0038] Figure 3 Schematic diagram of the structure of the shell and tube in Example 1;

[0039] Figure 4 This is a schematic diagram of the product after step S1 in Example 2;

[0040] Figure 5 This is a schematic diagram of the product after step S2 in Example 2;

[0041] Figure 6 This is a schematic diagram of the product after step S3 in Example 2;

[0042] Figure 7 This is a schematic diagram of the product after step S5 in Example 2;

[0043] Figure 8 This is a schematic diagram of the product after step S6 in Example 2;

[0044] Figure 9 This is a schematic diagram of the product after step S7 in Example 2 is completed. DETAILED DESCRIPTION

[0045] The specific implementation of the present invention is further described in detail below with reference to the accompanying drawings.

[0046] Example 1

[0047] In this embodiment, if Figure 1 and Figure 2 As shown, a double-sided heat dissipation module based on pre-mounted power devices includes a tube shell 1, at least one pre-mounted power device 2, a lower insulating heat dissipation plate 3, an upper insulating heat dissipation plate 4, an upper heat sink 5, at least one conductive component 6 and a protective glue 7.

[0048] Pre-mounted power devices refer to chips that are pre-mounted on the circuit frame and plastic-sealed into one piece to achieve double-sided heat dissipation or embedded structural packaging.

[0049] like Figure 3 As shown, the tube shell 1 has a hollow area 8;

[0050] The pre-mounted power device 2, the lower insulating heat dissipation plate 3, the upper insulating heat dissipation plate 4 and the conductive member 6 are all located in the hollow area 8;

[0051] The upper surface of the lower insulating heat dissipation plate 3 and the lower surface of the upper insulating heat dissipation plate 4 are both provided with circuit layers (9, 10);

[0052] The upper and lower surfaces of the pre-mounted power device 2 are respectively mounted at corresponding positions between the two circuit layers (9, 10) to achieve electrical connection;

[0053] The upper and lower surfaces of the conductive frame 6 are mounted at corresponding positions between the two circuit layers (9, 10);

[0054] The tube shell 1 is provided with a plurality of signal pins 11, and the signal pins 11 are electrically connected to corresponding positions of the circuit layer 9 of the lower insulating heat dissipation plate 3;

[0055] The protective glue 7 is filled in the hollow area 8 , and the lower surface of the lower insulating heat dissipation plate 3 and the upper part of the upper radiator 5 are exposed outside the protective glue 7 .

[0056] In this embodiment, the protective glue 7 is epoxy resin protective glue, which has good high-voltage insulation and high reliability.

[0057] In this embodiment, according to actual needs, a component 12 may be electrically connected between the two circuit layers (9, 10).

[0058] In this embodiment, the upper surface of the upper insulating heat dissipation plate 3 and the lower surface of the lower insulating heat dissipation plate 4 are both covered with protective layers (13, 14).

[0059] Specifically, the upper insulating heat dissipation plate 3 and the lower insulating heat dissipation plate 4 are ceramic substrates.

[0060] In this embodiment, the protective layers (13, 14) are copper clad layers.

[0061] In this embodiment, the upper radiator 5 is an air-cooled radiator or a water-cooled radiator, which can be selected according to actual needs.

[0062] In this embodiment, the tube shell 1 is provided with a plurality of connection holes 15 for facilitating installation with external devices.

[0063] Working Principle: The chip is pre-molded in a pre-mounted power device. The source and gate of the pre-mounted power device are mounted on the lower insulating heat sink, with the drain facing upward. The circuit is connected through the upper insulating heat sink, without the need for bonding wires. During operation, heat is dissipated through both the lower and upper insulating heat sinks. The lower insulating heat sink is cooled by water or air, while the upper insulating heat sink transfers heat to the top radiator, which is then cooled by external air.

[0064] Example 2

[0065] The method for preparing a double-sided heat dissipation module based on a pre-mounted power device according to Example 1 comprises the following steps:

[0066] S1, prepare the lower insulating heat dissipation plate 3 and the upper insulating heat dissipation plate 4 printed with the circuit layer (9, 10), and print the adhesive material 16 at the corresponding position of the circuit layer of the lower insulating heat dissipation plate 3, such as Figure 4 As shown;

[0067] S2, mount the pre-mounted power device 2, the conductive member 6 and the components 12 on the corresponding positions of the circuit layer of the lower insulating heat dissipation plate to achieve electrical connection, such as Figure 5 As shown;

[0068] S3, printing adhesive material 17 on the upper surface of the pre-mounted power device 2, the conductive member 6 and the component 12, and mounting the insulating heat dissipation plate 4, so as to realize the electrical connection between the circuit layer 10 of the upper insulating heat dissipation plate 4 and the pre-mounted power device 2, the component 12 and the conductive member 6, as shown in FIG. Figure 6 As shown;

[0069] S4, curing treatment of adhesive material;

[0070] S5, install the components processed in S4 in the hollow area 8 of the tube shell 1, and weld the signal pins 11 on the tube shell 1 to the corresponding positions on the circuit layer 9 on the lower insulating heat dissipation plate 3 to achieve electrical connection, such as Figure 7 As shown;

[0071] S6, the upper radiator 5 is bonded and mounted on the upper surface of the upper insulating heat dissipation plate 4, as shown in FIG. Figure 8 As shown;

[0072] S7, pouring protective glue 7 into the hollow area 8 in the tube shell 1 and heating it to solidify. Figure 9 shown.

[0073] In this embodiment, in step S5 , ultrasonic welding is used to achieve electrical connection between the signal pins 11 on the tube shell 1 and corresponding positions on the circuit layer 9 on the lower insulating heat dissipation plate 3 .

[0074] In this embodiment, in step S6 , a thermally conductive double-sided adhesive material 18 is pre-applied to the lower surface of the upper heat sink 5 , and then the upper heat sink 5 is adhesively mounted on the upper surface of the upper insulating heat dissipation plate 4 .

[0075] The advantages of this manufacturing process are: 1. The materials used in the manufacturing process are mature and easy to implement; 2. The processes involved in the manufacturing process are mature and easy to implement; 3. The entire process circuit mainly relies on surface interconnection for conductivity, without the use of bonding wires, resulting in a simple manufacturing process and fast operation. 4. This process uses a protective adhesive potting process to achieve internal circuit sealing and enhance the mechanical strength of the product, eliminating the need for external housing assembly protection. This reduces costs and significantly improves reliability.

[0076] The preferred embodiments of the present invention have been specifically described above, but the present invention is not limited to the described embodiments. Those skilled in the art may make various equivalent modifications or substitutions without departing from the spirit of the present invention. These equivalent modifications or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A double-sided heat dissipation module based on pre-mounted power devices, characterized in that: It includes a tube shell, at least one pre-mounted power device, a lower insulating heat dissipation plate, an upper insulating heat dissipation plate, an upper heat sink, at least one conductive member and a protective adhesive; The tube shell has a hollow area; The pre-mounted power device, the lower insulating heat dissipation plate, the upper insulating heat dissipation plate and the conductive member are all located in the hollow area; The upper surface of the lower insulating heat dissipation plate and the lower surface of the upper insulating heat dissipation plate are both provided with a circuit layer; The upper and lower surfaces of the pre-mounted power device are respectively mounted at corresponding positions between the two circuit layers to achieve electrical connection; The upper and lower surfaces of the conductive frame are mounted at corresponding positions between the two circuit layers; The tube shell is provided with a plurality of signal pins, and the signal pins are electrically connected to corresponding positions of the circuit layer of the lower insulating heat dissipation plate respectively; The protective glue is filled in the hollow area, and the lower surface of the lower insulating heat dissipation plate and the upper part of the upper radiator are exposed outside the protective glue.

2. A double-sided heat dissipation module based on pre-mounted power devices according to claim 1, characterized in that: The protective glue is epoxy resin protective glue.

3. The double-sided heat dissipation module based on pre-mounted power devices according to claim 1, characterized in that: Components are electrically connected between the two circuit layers.

4. A double-sided heat dissipation module based on pre-mounted power devices according to any one of claim 1, characterized in that: The upper surface of the upper insulating heat dissipation plate and the lower surface of the lower insulating heat dissipation plate are both covered with a protective layer.

5. A double-sided heat dissipation module based on pre-mounted power devices according to claim 4, characterized in that: The upper insulating heat dissipation plate and the lower insulating heat dissipation plate are ceramic substrates.

6. The double-sided heat dissipation module based on pre-mounted power devices according to claim 5, characterized in that: The protective layer is a copper clad layer.

7. The double-sided heat dissipation module based on pre-mounted power devices according to claim 1, characterized in that: The upper radiator is an air-cooled radiator or a water-cooled radiator.

8. The double-sided heat dissipation module based on pre-mounted power devices according to claim 1, characterized in that: The tube shell is provided with a plurality of connection holes.

9. The process for preparing a double-sided heat dissipation module based on pre-mounted power devices according to claims 1 to 8, characterized in that: The following steps are included: S1. Prepare a lower insulating heat sink plate and an upper insulating heat sink plate printed with a circuit layer, and print adhesive material at the corresponding position of the circuit layer of the lower insulating heat sink plate; S2. Mounting the pre-mounted power device and the conductive member on corresponding positions of the circuit layer of the lower insulating heat dissipation plate to achieve electrical connection; S3. Printing adhesive material on the upper surface of the pre-mounted power device and the conductive component, and attaching an insulating heat sink to achieve electrical connection between the circuit layer of the upper insulating heat sink and the pre-mounted power device and the conductive component; S4, curing treatment of adhesive material; S5. Install the components processed in S4 in the hollow area of ​​the tube shell, and weld the signal pins on the tube shell to the corresponding positions on the circuit layer on the lower insulating heat dissipation plate to achieve electrical connection; S6. Adhere and mount the upper radiator on the upper surface of the upper insulating heat dissipation plate; S7. Pour protective glue into the hollow area of ​​the tube shell and heat to solidify it.

10. The process for preparing a double-sided heat dissipation module based on pre-mounted power devices according to claim 9, characterized in that: In step S5 , ultrasonic welding is used to achieve electrical connection between the signal pins on the tube shell and the corresponding positions on the circuit layer on the lower insulating heat dissipation plate.

11. The process for preparing a double-sided heat dissipation module based on pre-mounted power devices according to claim 9 or 10, characterized in that: In step S6, a heat-conductive double-sided adhesive material is pre-attached on the lower surface of the upper heat sink, and then the upper heat sink is adhesively mounted on the upper surface of the upper insulating heat dissipation plate.

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