High-frequency high-speed board etching device

Abstract

The application relates to the field of circuit board etching technology, in particular to a high-frequency high-speed board etching device, which comprises a workbench and a laser etching device fixedly installed on the top of the workbench, a plurality of uniformly distributed conveying rollers are rotationally installed on the top of the workbench, a gas cylinder one is fixedly installed in the workbench, a lifting base is fixedly installed on the telescopic shaft end of the gas cylinder one, a plurality of strip-shaped connecting plates are fixedly installed on the top of the lifting base, a plurality of adsorption plates one are fixedly installed on the top of the strip-shaped connecting plates, adsorption mechanisms are arranged in the plurality of adsorption plates one, centering mechanisms are arranged at the two ends of the top of the plurality of adsorption plates one, and auxiliary mechanisms are arranged at the two ends of the bottom of the plurality of adsorption plates one. The device has the beneficial effect that the plurality of adsorption plates and the corresponding adsorption mechanisms are arranged to uniformly adsorb and fix the bottom and the end of a circuit board substrate, and effectively constrain the whole circuit board substrate.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of circuit board etching, in particular to a high-frequency high-speed circuit board etching device. BACKGROUND

[0002] Etching is an important process in the production process of circuit boards, and circuit board etching includes chemical etching, laser etching, plasma etching and the like. Among them, the high-frequency high-speed laser etching device has significant advantages in the manufacture of circuit boards. Laser etching is a high-precision, non-contact processing technology, mainly used for removing copper layers or dielectric materials to form conductive lines, drill holes or marks.

[0003] In the prior art, the circuit board is conveyed into the laser etching device by a conveying device, and then the copper foil is precisely vaporized and removed by a high-energy laser beam, the line part covered by the etching resist layer is reserved, and micron-level precision conductive pattern processing is realized. Since laser etching is carried out by ablation of the substrate by a high-energy laser beam, if the laser energy is too high, the scanning speed is too slow, or the local area is repeatedly etched, the local temperature of the circuit board substrate will rise sharply, the substrate material will expand unevenly due to heat, the internal stress will be concentrated and released, and the circuit board substrate may be warped. Some thin substrates are poor in rigidity and are more prone to deformation and warping after being heated, and the warped substrate will affect the quality of the finished circuit board. SUMMARY

[0004] The purpose of the present application is to provide a high-frequency high-speed circuit board etching device to solve the problems raised in the background art.

[0005] To achieve the above-mentioned purpose, the present application provides the following technical scheme: a high-frequency high-speed circuit board etching device, comprising a workbench and a laser etching device fixedly installed on the top of the workbench, a plurality of uniformly distributed conveying rollers are rotatably installed on the top of the workbench, a gas cylinder one is fixedly installed in the inside of the workbench, a lifting base is fixedly installed on the extension shaft end of the gas cylinder one, a plurality of uniformly distributed strip-shaped connecting plates are fixedly installed on the top of the lifting base, the plurality of strip-shaped connecting plates are arranged alternately with the plurality of conveying rollers, a plurality of adsorption plates one are fixedly installed on the top of the plurality of strip-shaped connecting plates, an adsorption mechanism is arranged in the inside of each of the plurality of adsorption plates one, a centering mechanism is arranged at the top of both ends of the plurality of adsorption plates one, and an auxiliary mechanism is arranged at both ends of the bottom of the plurality of adsorption plates one.

[0006] The adsorption mechanism comprises a connecting cavity one, the connecting cavity one is formed in the middle of the adsorption plate one, a plurality of uniformly distributed adsorption holes one are communicated with the top of the connecting cavity one, a plurality of uniformly distributed gas path connecting pipes one are communicated with the bottom of the connecting cavity one, and a total connecting pipe is communicated with the bottom of the plurality of gas path connecting pipes one.

[0007] The auxiliary mechanism comprises a mounting seat and a transmission assembly, one end of the mounting seat is rotationally installed at one end of the bottom of the adsorption plate 1, the adsorption plate 2 is slidably installed in the mounting seat, a connecting cavity 2 is formed in the adsorption plate 2, a plurality of adsorption holes 2 are uniformly distributed and communicated with one side of the connecting cavity 2, a plurality of gas path connectors 2 are uniformly distributed and communicated with one side of the connecting cavity 2 away from the plurality of adsorption holes 2, and one end of the plurality of gas path connectors 2 away from the connecting cavity 2 is respectively communicated with the corresponding gas path connector 1.

[0008] Preferably, four guide rods 1 are fixedly installed at the bottom of the lifting base and are slidably connected with the inside of the workbench.

[0009] Preferably, the centering mechanism comprises a centering plate and a plurality of limiting sliding grooves 2, the limiting sliding grooves 2 are respectively formed at one end of the adsorption plate 1, a plurality of limiting sliding blocks 2 are fixedly installed at the bottom of the centering plate and are slidably installed in the limiting sliding grooves 2, a plurality of limiting sliding grooves 1 are formed at one side of the centering plate close to the inner wall of the workbench, limiting sliding blocks 1 are slidably installed in the limiting sliding grooves 1, a transmission rod is rotationally installed at one end of the limiting sliding block 1 away from the centering plate, one end of the transmission rod away from the limiting sliding block 1 is rotationally connected with the inner wall of the workbench, and a plurality of springs 1 are fixedly installed between one side of the centering plate close to the limiting sliding blocks 1 and the inner wall of the workbench.

[0010] Preferably, a gas cylinder 2 is fixedly installed at one end of the inside of the laser etching device, a limiting baffle is fixedly installed at the telescopic shaft end of the gas cylinder 2, guide rods 2 are fixedly installed at both ends of the top of the limiting baffle, and one end of the guide rods 2 is slidably connected with the laser etching device.

[0011] Preferably, the transmission assembly comprises two extension blocks, a turnover plate, a plurality of uniformly distributed springs 2, two grooves, two top blocks, and two adjusting cavities, the two extension blocks are fixedly installed at both sides of the mounting seat, the turnover plate is rotationally installed at one side of the adsorption plate 2, the springs 2 are fixedly installed at one side of the adsorption plate 2 close to the turnover plate, the grooves are respectively formed at both ends of the mounting seat, a strip-shaped rod is rotationally sleeved at one end of the turnover plate away from the adsorption plate 2, both ends of the strip-shaped rod are slidably installed in the grooves, the adjusting cavities are respectively formed at both ends of the inside of the workbench, the top blocks are fixedly installed at both sides of the inner wall of the laser etching device, and the top blocks are matched with the extension blocks.

[0012] Preferably, the adjusting cavity comprises a strip-shaped groove and an inclined groove, the strip-shaped groove and the inclined groove are communicated with each other, and the strip-shaped groove and the inclined groove are matched with the strip-shaped rod.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] 1. By setting up multiple adsorption plates and corresponding adsorption mechanisms, the bottom and end of the circuit board substrate are evenly adsorbed and fixed, and the circuit board substrate is effectively constrained as a whole, solving the problems of rapid increase in local temperature of the circuit board substrate, uneven expansion of the substrate material due to heat, and poor rigidity of some thinner substrates, which cause warping after heating, thus avoiding affecting the quality of the finished circuit board.

[0015] 2. Through the auxiliary mechanism, when the multiple adsorption plates 1 rise to the top limit position, the adsorption plate 2 also moves to the top limit position, and its top is flush with the top of the corresponding adsorption plate 1. The adsorption plate 1 and the adsorption plate 2 cooperate with each other to increase the support area of ​​the circuit board substrate. At the same time, the points for adsorption and fixation of the circuit board substrate are also increased. On the basis of the multiple adsorption plates 1, the adsorption and fixation effect of the circuit board substrate is further enhanced. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0017] Figure 2 Schematic diagram of the internal structure of the workbench of the present invention;

[0018] Figure 3 This is a schematic diagram of the top view of the workbench of the present invention;

[0019] Figure 4 For the present invention Figure 3 A partial enlarged view in FIG;

[0020] Figure 5 This is a schematic diagram of the top structure of the lifting base of the present invention;

[0021] Figure 6 This is a schematic diagram of the connection structure between the adsorption plate 1 and the center plate of the present invention;

[0022] Figure 7 This is a schematic diagram of the centering mechanism structure of the present invention;

[0023] Figure 8 is a cross-sectional view of an adsorption plate of the present invention;

[0024] Figure 9 This is a schematic diagram of the structure of the mounting base end portion of the present invention;

[0025] Figure 10 This is an internal cross-sectional view of the mounting base of the present invention.

[0026] In the accompanying drawings, the list of components represented by each reference number is as follows: 1. Workbench; 2. Laser etching device; 3. Conveyor roller; 4. Cylinder 1; 5. Lifting base; 6. Guide rod 1; 7. Adsorption plate 1; 8. Connecting chamber 1; 9. Adsorption hole 1; 10. Air pipe 1; 11. Centering plate; 12. Limit slider 2; 13. Limit slide 2; 14. Limit slide 1; 15. Limit slider 1; 16. Transmission rod; 17. Spring 1; 18. Cylinder 2; 19. Limit baffle; 20. Guide rod 2; 21. Mounting seat; 22. Adsorption plate 2; 23. Connecting chamber 2; 24. Adsorption hole 2; 25. Air pipe 2; 26. Extension block; 27. Flip plate; 28. Spring 2; 29. ​​Groove; 30. Strip rod; 31. Top block; 32. Strip groove; 33. Inclined groove; 34. Strip connecting plate; 35. Main pipe. DETAILED DESCRIPTION

[0027] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0028] The present invention provides a technical solution: Figures 1-10 The high-frequency and high-speed plate etching device shown in the figure includes a workbench 1 and a laser etching device 2 fixedly mounted on the top of the workbench 1. A plurality of evenly distributed conveying rollers 3 are rotatably mounted on the top of the workbench 1. A cylinder 4 is fixedly mounted inside the workbench 1. A lifting base 5 is fixedly mounted on the telescopic shaft end of the cylinder 4. A plurality of evenly distributed strip connecting plates 34 are fixedly mounted on the top of the lifting base 5. The plurality of strip connecting plates 34 are staggered with the plurality of conveying rollers 3. A suction plate 7 is fixedly mounted on the top of each of the plurality of strip connecting plates 34. A suction mechanism is provided inside each of the plurality of suction plates 7. A centering mechanism is provided at both ends of the top of each of the plurality of suction plates 7. Auxiliary mechanisms are provided at both ends of the bottom of each of the plurality of suction plates 7.

[0029] The adsorption mechanism includes a connecting chamber 8, which is opened in the middle of the adsorption plate 7. The top of the connecting chamber 8 is connected to a plurality of evenly distributed adsorption holes 9. The bottom of the connecting chamber 8 is connected to a plurality of evenly distributed gas pipes 10. The bottoms of the plurality of gas pipes 10 are connected together to a main pipe 35.

[0030] The auxiliary mechanism comprises a mounting seat 21 and a transmission assembly, the mounting seat 21 is rotationally installed at one end of the bottom of the adsorption plate one 7, the inside of the mounting seat 21 is slidably installed with an adsorption plate two 22, the inside of the adsorption plate two 22 is provided with a connecting cavity two 23, one side of the connecting cavity two 23 is communicated with a plurality of uniformly distributed adsorption holes two 24, one side of the connecting cavity two 23 away from the plurality of adsorption holes two 24 is communicated with a plurality of uniformly distributed gas path connecting pipes two 25, and one end of the plurality of gas path connecting pipes two 25 away from the connecting cavity two 23 is respectively communicated with a corresponding gas path connecting pipe one 10.

[0031] Four uniformly distributed guide rods one 6 are fixedly installed at the bottom of the lifting base 5, and the four guide rods one 6 are all slidably connected with the inside of the workbench 1.

[0032] The centering mechanism comprises a centering plate 11 and a plurality of limiting sliding grooves two 13, the plurality of limiting sliding grooves two 13 are respectively provided at one end of the plurality of adsorption plates one 7, the bottom of the centering plate 11 is fixedly installed with a plurality of uniformly distributed limiting sliding blocks two 12, the plurality of limiting sliding blocks two 12 are respectively slidably installed in the inside of the corresponding limiting sliding grooves two 13, a plurality of uniformly distributed limiting sliding grooves one 14 are provided on the side of the centering plate 11 close to the inner wall of the workbench 1, the inside of the plurality of limiting sliding grooves one 14 is slidably installed with a plurality of limiting sliding blocks one 15, one end of the plurality of limiting sliding blocks one 15 away from the centering plate 11 is rotationally installed with a transmission rod 16, one end of the plurality of transmission rods 16 away from the corresponding limiting sliding blocks one 15 is rotationally connected with the inner wall of the workbench 1, and a plurality of springs one 17 are fixedly installed between the side of the centering plate 11 close to the plurality of limiting sliding blocks one 15 and the inner wall of the workbench 1.

[0033] One end of the inside of the laser etching device 2 is fixedly installed with a gas cylinder two 18, the telescopic shaft end of the gas cylinder two 18 is fixedly installed with a limiting baffle 19, both ends of the top of the limiting baffle 19 are fixedly installed with guide rods two 20, and one end of the two guide rods two 20 is slidably connected with the laser etching device 2.

[0034] The transmission assembly comprises two extension blocks 26, a turnover plate 27, a plurality of uniformly distributed springs two 28, two grooves 29, two top blocks 31 and two adjusting cavities, the two extension blocks 26 are respectively fixedly installed on the two sides of the mounting seat 21, the turnover plate 27 is rotationally installed on one side of the adsorption plate two 22, the plurality of uniformly distributed springs two 28 are fixedly installed on the side of the adsorption plate two 22 close to the turnover plate 27, the two grooves 29 are respectively provided at the two ends of the mounting seat 21, a strip-shaped rod 30 is rotationally sleeved in the inside of one end of the turnover plate 27 away from the adsorption plate two 22, both ends of the strip-shaped rod 30 are respectively slidably installed in the inside of the two grooves 29, the two adjusting cavities are respectively provided at the two ends of the inside of the workbench 1, the two top blocks 31 are respectively fixedly installed on the two sides of the inner wall of the laser etching device 2, and the two top blocks 31 are respectively matched with the two extension blocks 26.

[0035] The adjusting cavity comprises a strip-shaped groove 32 and an inclined groove 33, the strip-shaped groove 32 and the inclined groove 33 are communicated with each other, and the strip-shaped groove 32 and the inclined groove 33 are matched with the strip-shaped rod 30.

[0036] Working principle: one end of the plurality of conveying rollers 3 is connected with a driving device, the driving device is used to drive the plurality of conveying rollers 3 to rotate, the connection between the driving device and the plurality of conveying rollers 3 is prior art, which will not be repeated here, in use, the circuit board substrate is placed on the top of the conveying roller 3, with the rotation of the plurality of conveying rollers 3, the circuit board substrate is conveyed to the lower side of the laser etching device 2, when one side of the circuit board substrate contacts the limiting baffle 19, the plurality of conveying rollers 3 stop rotating at this time;

[0037] Subsequently, the air cylinder one 4 is started, the lifting base 5 is pushed to rise, the lifting base 5 rises at the same time, driving the four guide rods one 6 at the bottom to rise synchronously, under the action of the four guide rods one 6, the lifting base 5 always moves in the vertical direction, with the rising of the lifting base 5, the plurality of strip-shaped connecting plates 34 and the adsorption plate one 7 on the top rise synchronously, the top of the plurality of adsorption plates one 7 contacts the circuit board substrate, the bottom of the circuit board substrate is separated from the plurality of conveying rollers 3, at this time, the plurality of auxiliary mechanisms and the two centering mechanisms operate synchronously;

[0038] The movement process of one of the two centering mechanisms is as follows: with the rising of the plurality of adsorption plates one 7, under the action of the plurality of springs one 17, the centering plate 11 has a tendency to move to the middle of the plurality of adsorption plates one 7, the plurality of transmission rods 16 are all correspondingly rotated, the limiting sliding block one 15 at the bottom end of the plurality of transmission rods 16 respectively slides in the corresponding limiting sliding groove one 14, with the sliding of the centering plate 11, the plurality of limiting sliding blocks two 12 at the bottom respectively slide in the corresponding limiting sliding groove two 13; the movement process of the other centering mechanism is the same as above, with the simultaneous movement of the two centering plates 11 to each other, cooperating with the use of the limiting baffle 19, the circuit board substrate can be preliminarily limited on the top of the plurality of adsorption plates one 7;

[0039] The movement process of one of the auxiliary mechanisms is as follows: the mounting seat 21 is vertically arranged in the initial state, and the mounting seat 21 moves upward synchronously with the corresponding adsorption plate one 7 while the adsorption plate one 7 rises, at this time, the two ends of the strip-shaped rod 30 first slide upward along the respective corresponding strip-shaped grooves 32, and with the continuous upward movement of the mounting seat 21, the two extension blocks 26 at the top of the mounting seat 21 gradually approach the respective corresponding top blocks 31, when the two top blocks 31 act on the two extension blocks 26 respectively, the two extension blocks 26 drive the mounting seat 21 to rotate under the force, and with the rotation of the mounting seat 21, the two ends of the strip-shaped rod 30 slide into the respective corresponding inclined grooves 33 at this time, under the path of the two inclined grooves 33, the two ends of the strip-shaped rod 30 slide to the middle of the mounting seat 21 under the action of the two grooves 29, at this time, the turnover plate 27 pushes the adsorption plate two 22 to move outward of the mounting seat 21 under the force, and the plurality of springs two 28 are stretched under the force, when the plurality of adsorption plate one 7 rises to the top limit position, at this time, the adsorption plate two 22 also moves to the top limit position, and the top thereof is flush with the top of the corresponding adsorption plate one 7; the movement processes of the remaining plurality of auxiliary mechanisms are the same as above, the plurality of adsorption plate one 7 are flush with the top of the corresponding adsorption plate two 22 respectively, such arrangement increases the support area of the circuit board substrate, and also increases the point position of the adsorption and fixation of the circuit board substrate, and further enhances the effect of the adsorption and fixation of the circuit board substrate on the basis of the plurality of adsorption plate one 7;

[0040] Finally, the plurality of main connecting pipes 35 are pumped by the negative pressure device, under the action of the plurality of gas path connecting pipes one 10 and the plurality of gas path connecting pipes two 25, negative pressure is formed in the plurality of connecting cavities one 8 and the plurality of connecting cavities two 23, and the plurality of adsorption holes one 9 and the plurality of adsorption holes two 24 can uniformly adsorb and fix the bottom and the end of the circuit board substrate, and effectively constrain the whole circuit board substrate, so that the problem of edge lifting does not occur when the laser etching device 2 etches the circuit board substrate, and the problems of local temperature of the circuit board substrate rising sharply, the substrate material expanding unevenly under heat, and some thin substrates being poor in rigidity and being warped after being heated are solved, thereby avoiding affecting the quality of the finished circuit board, and after the etching of the circuit board substrate is completed, the cylinder one 4 drives the lifting base 5 to descend, and the circuit board substrate is located on the top of the plurality of conveying rollers 3 again, then the cylinder two 18 drives the limiting baffle 19 to move upward, and the plurality of conveying rollers 3 rotate again to convey the etched circuit board substrate to the next process.

[0041] It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting; it is not intended to exclude myriad other embodiments of the present application that other inventors can develop based on the same general inventive concepts embodied by the described embodiments. That is, although the present application is described in terms of particular embodiments and illustrative figures, it should be apparent that the scope of the present application is not limited to these specific embodiments.

[0042] While the embodiments of the application have been shown and described herein, it will be understood by those skilled in the art that many changes, modifications, substitutions and alterations to these embodiments can be made without departing from the principles and spirits of the application, and it is intended that the scope of the application be limited solely by the scope of the appended claims and the equivalents thereof.

Claims

1. A high-frequency high-speed plate etching device, comprising a workbench (1) and a laser etching device (2) fixedly installed on the top of the workbench (1), characterized in that: The top of the workbench (1) is rotatably provided with a plurality of uniformly distributed conveying rollers (3), the inside of the workbench (1) is fixedly provided with a cylinder (4), the telescopic shaft end of the cylinder (4) is fixedly provided with a lifting base (5), the top of the lifting base (5) is fixedly provided with a plurality of uniformly distributed strip-shaped connecting plates (34), the plurality of strip-shaped connecting plates (34) are staggered with the plurality of conveying rollers (3), the top of each of the plurality of strip-shaped connecting plates (34) is fixedly provided with an adsorption plate (7), the inside of each of the plurality of adsorption plates (7) is provided with an adsorption mechanism, the top of each of the plurality of adsorption plates (7) is commonly provided with a centering mechanism, and the two ends of the bottom of each of the plurality of adsorption plates (7) are provided with an auxiliary mechanism. The adsorption mechanism comprises a connecting cavity (8) which is formed in the middle of the adsorption plate (7), a plurality of uniformly distributed adsorption holes (9) are communicated with the top of the connecting cavity (8), and a plurality of uniformly distributed gas path connecting pipes (10) are communicated with the bottom of the connecting cavity (8). The auxiliary mechanism comprises a mounting seat (21) and a transmission assembly, one end of the bottom of the adsorption plate (7) is rotatably provided with the mounting seat (21), the inside of the mounting seat (21) is slidably provided with an adsorption plate (22), the inside of the adsorption plate (22) is provided with a connecting cavity (23), one side of the connecting cavity (23) is communicated with a plurality of uniformly distributed adsorption holes (24), and one side of the connecting cavity (23) away from the plurality of adsorption holes (24) is communicated with a plurality of uniformly distributed gas path connecting pipes (25), and one end of each of the plurality of gas path connecting pipes (25) away from the connecting cavity (23) is communicated with the corresponding gas path connecting pipe (10). The transmission assembly comprises two extension blocks (26), a turnover plate (27), a plurality of uniformly distributed springs (28), two grooves (29), two top blocks (31) and two adjusting cavities, the two extension blocks (26) are fixedly arranged on the two sides of the mounting seat (21), the turnover plate (27) is rotatably arranged on one side of the adsorption plate (22), the plurality of uniformly distributed springs (28) are fixedly arranged on one side of the adsorption plate (22) close to the turnover plate (27), the two grooves (29) are formed in the two ends of the mounting seat (21), a strip-shaped rod (30) is rotatably arranged in the inside of one end of the turnover plate (27) away from the adsorption plate (22), the two ends of the strip-shaped rod (30) are slidably arranged in the two grooves (29), the two adjusting cavities are formed in the two ends of the inside of the workbench (1), and the two top blocks (31) are fixedly arranged on the two sides of the inner wall of the laser etching device (2) and are matched with the two extension blocks (26).

2. The high-frequency high-speed board etching device according to claim 1, characterized by: The bottom of the lifting base (5) is fixedly provided with four uniformly distributed guide rods (6), and the four guide rods (6) are slidably connected with the inside of the workbench (1).

3. The high frequency high speed board etching device according to claim 1, wherein: The centering mechanism comprises a centering plate (11) and a plurality of limiting sliding grooves II (13), the plurality of limiting sliding grooves II (13) are respectively arranged at one end of the plurality of adsorbing plates I (7), the bottom of the centering plate (11) is fixedly installed with a plurality of limiting sliding blocks II (12) which are uniformly distributed, the plurality of limiting sliding blocks II (12) are respectively and slidingly installed in the corresponding limiting sliding grooves II (13), a plurality of limiting sliding grooves I (14) which are uniformly distributed are arranged on the side of the centering plate (11) close to the inner wall of the workbench (1), the limiting sliding grooves I (14) are slidingly installed with limiting sliding blocks I (15) inside, the ends of the limiting sliding blocks I (15) away from the centering plate (11) are rotatably installed with transmission rods (16), the ends of the transmission rods (16) away from the corresponding limiting sliding blocks I (15) are rotatably connected with the inner wall of the workbench (1), and the side of the centering plate (11) close to the plurality of limiting sliding blocks I (15) is fixedly installed with a plurality of springs I (17) between the inner wall of the workbench (1).

4. The high frequency high speed board etching device according to claim 1, wherein: One end of the laser etching device (2) is fixedly installed with a cylinder II (18), the telescopic shaft end of the cylinder II (18) is fixedly installed with a limiting baffle (19), the top of the limiting baffle (19) is fixedly installed with guide rods II (20) at both ends, and one end of the two guide rods II (20) is slidingly connected with the laser etching device (2).

5. The high frequency high speed board etching device according to claim 1, wherein: The adjusting cavity comprises a strip-shaped groove (32) and an inclined groove (33), the strip-shaped groove (32) and the inclined groove (33) are in communication with each other, and the strip-shaped groove (32) and the inclined groove (33) are matched with the strip-shaped rod (30).

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