Heat dissipation device

Abstract

The invention discloses a heat dissipation device which comprises a bottom plate, a cover plate and a heat pipe, the bottom plate is provided with a containing groove, the containing groove internally comprises a plurality of heat dissipation areas, each heat dissipation area is internally provided with at least one first capillary structure, and the first capillary structures are connected with the bottom plate; the cover plate is arranged on the bottom plate and shields the opening of the containing groove, and the cover plate is connected with the first capillary structure; the multiple heat pipes are arranged, one end of each heat pipe penetrates through the cover plate and is arranged in the containing groove, a second capillary structure connected with the bottom plate is arranged in an inner cavity of each heat pipe, and the second capillary structures are connected with the first capillary structures. The heat transfer effect of the heat dissipation device can be improved, and the effect of enhancing the overall heat dissipation effect of the heat dissipation device is achieved.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation, and more specifically, to a 3DVC heat dissipation device. Background Art

[0002] Three-Dimensional Vapor Chambers (3DVCs) are primarily used for heat dissipation in high-power density devices. Existing 3DVC heat sinks primarily consist of a base plate, copper pillars, and a cover plate. The base plate forms a capillary structure using sintered copper mesh or copper powder, while the copper pillars are surrounded by powder rings to form a capillary structure, enabling heat transfer.

[0003] In the process of realizing the present invention, the inventors found that the prior art has at least the following problems: since 3DVC requires relatively high power, the above-mentioned capillary structure is difficult to meet its high power requirement, resulting in poor heat transfer effect, thereby affecting the heat dissipation effect of the heat dissipation device. Summary of the Invention

[0004] The embodiment of the present application provides a heat dissipation device, which can improve the heat transfer effect of the heat dissipation device, thereby enhancing the overall heat dissipation effect of the heat dissipation device.

[0005] The heat dissipation device provided in this application adopts the following technical solution:

[0006] A heat dissipation device, comprising:

[0007] The bottom plate is provided with a receiving groove, wherein the receiving groove includes a plurality of heat dissipation areas, each of the heat dissipation areas is provided with at least one first capillary structure, and the first capillary structure is connected to the bottom plate;

[0008] a cover plate, disposed on the bottom plate and covering the opening of the receiving groove, wherein the cover plate is connected to the first capillary structure;

[0009] A heat pipe, wherein a plurality of heat pipes are provided, one end of the heat pipe passes through the cover plate and is arranged in the accommodating groove, the inner cavity of the heat pipe is provided with a second capillary structure connected to the bottom plate, and the second capillary structure is connected to the first capillary structure.

[0010] Optionally, the first capillary structure includes a plurality of heat-conducting columns and a first heat-conducting member, the first heat-conducting member is connected to the peripheral wall of the heat-conducting column, and two sides of the heat-conducting column and the first heat-conducting member are respectively connected to the bottom plate and the cover plate.

[0011] Optionally, the plurality of heat-conducting columns are arranged in a ring shape, and the first heat-conducting member is bent and sequentially arranged around the peripheral wall of the heat-conducting column.

[0012] Optionally, a plurality of the heat-conducting columns are arranged in parallel and / or side by side, and the first heat-conducting component is arranged around a portion of the peripheral wall of the heat-conducting column.

[0013] Optionally, the base plate is further provided with a plurality of connecting fins, the connecting fins are spaced apart from the heat-conducting columns, and the ends of the first heat-conducting components are connected to the connecting fins; both ends of some of the connecting fins are provided with connecting ports, which are used to connect to the second capillary structure.

[0014] Optionally, part of the heat dissipation area is further provided with a second heat conducting member, the two connecting fins are connected via the second heat conducting member, and two sides of the second heat conducting member are respectively connected to the bottom plate and the cover plate.

[0015] Optionally, the heat-conducting column is configured as a copper column, and the first heat-conducting member and the second heat-conducting member are configured as flat copper wires.

[0016] Optionally, the second capillary structure is configured as one or more layers of braided copper wires, and the second capillary structure is a flat structure or a cylindrical structure.

[0017] Optionally, the cover plate is provided with a first copper mesh, which is arranged on the end surface of the cover plate facing the bottom plate, and is connected to the first capillary structure and the second capillary structure.

[0018] Optionally, the bottom plate is provided with a second copper mesh, the second copper mesh is arranged in the receiving groove, and the second copper mesh is connected to the first capillary structure and the second capillary structure.

[0019] It can be seen from the above technical solutions that the embodiments of the present application have the following advantages:

[0020] By dividing the base plate into multiple heat dissipation areas, at least one first capillary structure is set in each heat dissipation area, and the base plate, multiple first capillary structures, multiple second capillary structures and the cover plate are interconnected, so that all capillary structures in each heat dissipation area in the device are connected as a whole. Heat can be quickly conducted to the multiple first capillary structures and the multiple second capillary structures through the base plate until it is transmitted to the end surface of the cover plate and the end of the heat pipe, and then the heat is taken away under the external air cooling equipment; the capillary structure in the present application forms a new heat dissipation transmission method. The arrangement of multiple capillary structures can greatly improve the heat conduction efficiency of the device, while reducing the heat accumulation in a certain area inside the device, significantly improving the heat dissipation performance of the device, making the heat transfer effect of the entire device better, and more effectively exerting the overall heat dissipation effect of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments recorded in the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0022] Figure 1 This is a schematic diagram of the overall structure of a heat dissipation device disclosed in an embodiment of the present application;

[0023] Figure 2 A cross-sectional view of the structure of a heat dissipation device disclosed in an embodiment of the present application;

[0024] Figure 3 A schematic diagram of a heat dissipation device disclosed in an embodiment of the present application with a cover removed to highlight the first capillary structure and the second capillary structure;

[0025] Figure 4 This is an enlarged schematic diagram of the structure of a heat dissipation device disclosed in an embodiment of the present application, highlighting the first heat conducting member, the second heat conducting member, and the connecting fins;

[0026] Figure 5 This is a structural schematic diagram of a heat dissipation device disclosed in an embodiment of the present application, highlighting the second copper mesh.

[0027] Description of reference numerals:

[0028] 1. Bottom plate; 11. Receiving groove; 12. First capillary structure; 121. Heat-conducting column; 122. First heat-conducting member; 13. Connecting fin; 131. Connecting port; 14. Second heat-conducting member; 15. Second copper mesh; 2. Cover plate; 21. First copper mesh; 3. Heat pipe; 31. Second capillary structure. DETAILED DESCRIPTION

[0029] The present application is further described in detail below with reference to the accompanying drawings.

[0030] The embodiment of the present application provides a heat dissipation device, which can improve the heat transfer effect of the heat dissipation device, thereby enhancing the overall heat dissipation effect of the heat dissipation device.

[0031] In order to enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only embodiments of a part of the present application, not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work should fall within the scope of protection of this application. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0032] The terms "first," "second," "third," "fourth," and the like in the specification and claims of this application and in the accompanying drawings are used to distinguish similar objects and are not necessarily used to describe a particular order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate so that the embodiments described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "including" and "having," and any variations thereof, are intended to cover non-exclusive inclusions, e.g., a process, method, system, product, or apparatus comprising a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such process, method, product, or apparatus.

[0033] See also Figure 1 and Figure 2 , is an embodiment of the heat dissipation device in the embodiment of the present application, the heat dissipation device includes a base plate 1, a cover plate 2 and a plurality of heat pipes 3, the base plate 1 is used to contact the heat source, the base plate 1 is provided with a receiving groove 11, the cover plate 2 is fixedly arranged on the base plate 1 and blocks the opening of the receiving groove 11, the plurality of heat pipes 3 are vertically and spaced apart, and one end of the heat pipe 3 passes through the cover plate 2 and is arranged in the receiving groove 11; the end of the heat pipe 3 away from the base plate 1 is located at the external air cooling device, by introducing multiple parallel arranged heat pipes 3, the number of heat transfer paths can be significantly increased, thereby expanding the effective heat exchange area, helping to reduce the local hot spot temperature peak, and achieving a more uniform overall temperature control effect.

[0034] See also Figure 3The receiving groove 11 includes multiple heat dissipation zones, each of which is equipped with at least one first capillary structure 12. The first capillary structure 12 is connected to the base plate 1 and the cover plate 2. In this embodiment, the heat dissipation zones include an outer ring heat dissipation zone, a core heat dissipation zone, and a central heat dissipation zone. The central heat dissipation zone is located between the outer ring heat dissipation zone and the core heat dissipation zone. There are two central heat dissipation zones, one symmetrically located on either side of the core heat dissipation zone, with the outer ring heat dissipation zone surrounding the core and central heat dissipation zones. It can be understood that the introduction of multiple heat dissipation zones and the placement of a first capillary structure 12 within each heat dissipation zone effectively covers more heat source locations, thereby reducing the occurrence of localized hot spots. This design allows heat to be evenly distributed over a wider area, rather than being concentrated in a specific area and causing overheating risks. Compared to traditional solutions with a single heat dissipation zone, this approach is more adaptable to the layout requirements of electronic devices with complex geometries.

[0035] See also Figure 3 and Figure 4 The first capillary structure 12 includes multiple heat-conducting columns 121 and a first heat-conducting member 122. The heat-conducting columns 121 are fixedly connected to the base plate 1, and the first heat-conducting member 122 is connected to the surrounding wall of the heat-conducting columns 121. The heat-conducting columns 121 and the first heat-conducting member 122 are connected to the base plate 1 and the cover plate 2 on both sides, respectively. The connection between the first heat-conducting member 122 and the multiple heat-conducting columns 121 increases the number and complexity of the capillary channels, improving the capillary force in the heat dissipation area. This structure can significantly improve heat conduction efficiency, allowing heat to be quickly transferred to the cover plate 2 through the first capillary structure 12, thereby supporting higher heat load transfer requirements.

[0036] In this embodiment, the heat-conducting pillars 121 are configured as copper pillars, and the first heat-conducting member 122 is configured as a flat copper wire. Copper, as a metal material with excellent thermal conductivity, has a high thermal conductivity coefficient that helps quickly transfer heat from the heat source to the entire working area of ​​the heat dissipation device. By properly arranging the spacing between the copper pillars and using surface treatment processes (such as plating technology), heat can be rapidly diffused along the shortest distance, reducing the possibility of local overheating. The flat copper wire is cross-woven, with controllable length, making it easy to connect and design the desired shape, and it is also flexible and can be bent. The first capillary structure 12 formed by the first heat-conducting member 122 and the multiple heat-conducting pillars 121 will not fail due to bending, which can effectively enhance the heat transfer efficiency of the first capillary structure 12 and better dissipate heat from the heat source. Secondly, when the flat copper wire is attached to the copper pillar, a direct contact interface with low thermal resistance can be formed, reducing the additional heat loss caused by poor interface contact; compared with traditional sintered powder, the first capillary structure 12 formed by the copper pillar and the flat copper wire can provide stronger capillary pumping capability in a limited space, the molding process between the flat copper wire and the copper pillar is simpler, and the cost of using flat copper wire is lower than that of sintered copper powder.

[0037] In this embodiment, a first capillary structure 12 is provided in the outer ring heat dissipation region. Within the first capillary structure 12 in this heat dissipation region, multiple heat-conducting columns 121 are arranged in a ring shape, and first heat-conducting members 122 are sequentially arranged in a curved shape around the walls of the heat-conducting columns 121. By tightly wrapping the first heat-conducting members 122 around the walls of the multiple heat-conducting columns 121 to form an annular capillary network, this helps guide the working fluid to be more evenly distributed in the edge areas and corners of the receiving groove 11, thereby achieving a more ideal temperature field balance. Furthermore, the tight wrapping of the first heat-conducting members 122 around the walls of the heat-conducting columns 121 increases the effective contact area of ​​the heat transfer path, forming a low-thermal-resistance direct contact interface to reduce local thermal resistance and enable heat to diffuse more quickly throughout the cavity. This also enhances the mechanical stability of the first capillary structure 12, preventing deformation or loosening that may occur during prolonged use and ensuring long-term reliable operation.

[0038] In this embodiment, at least six groups of first capillary structures 12 are provided in the core heat dissipation region and the central heat dissipation region. These six groups of first capillary structures 12 are arranged side by side or in parallel to conserve space within the receiving tank 11 and improve the space utilization of the receiving tank 11. Within the first capillary structures 12 in these heat dissipation regions, multiple thermally conductive columns 121 are arranged side by side and / or in parallel, and first thermally conductive members 122 are disposed around portions of the walls of the thermally conductive columns 121. It can be understood that the parallel and / or side-by-side arrangement of the heat-conducting columns 121 improves the pressure resistance of the overall structure. This arrangement enables the temperature equilibrium plate to maintain good geometric stability and durability when facing external pressure changes; at the same time, the heat-conducting columns 121 form a stable mechanical frame to support the complex internal capillary structure, and greatly expand the effective surface area of ​​the capillary channel through the first heat-conducting member 122. Since an independent and continuous small channel network is formed on each heat-conducting column 121, the first heat-conducting member 122 can make heat spread rapidly along the shortest distance. The surrounding copper wire layout can also guide energy to move along a predetermined trajectory, ultimately achieving the effect of increasing the amount of energy transferred per unit time, thereby accelerating the heat transfer efficiency between the base plate 1 and the cover plate 2.

[0039] Please continue reading Figure 2 and Figure 3 Multiple heat pipes 3 are provided, distributed across the core and central heat dissipation areas. This helps reduce the peak temperatures in these areas, resulting in more uniform temperature control for the entire heat dissipation device. A second capillary structure 31, connected to the base plate 1, is located within the heat pipe 3. This second capillary structure 31 is connected to the first capillary structure 12 and can rapidly conduct heat from the base plate 1 to a location away from the heat source through extremely low thermal resistance. It can be understood that by dividing the base plate 1 into multiple heat dissipation areas, at least one first capillary structure 12 is arranged in each heat dissipation area, and the base plate 1, multiple first capillary structures 12, multiple second capillary structures 31 and the cover plate 2 are interconnected, so that all capillary structures in each heat dissipation area in the device are connected as a whole, and heat can be quickly conducted to the multiple first capillary structures 12 and the multiple second capillary structures 31 through the base plate 1, until it is transmitted to the end surface of the cover plate 2 and the end of the heat pipe 3, and then the heat is taken away under the external air cooling equipment; the first capillary structure 12 and the second capillary structure 31 in the present application form a new heat dissipation transmission mode. The setting of multiple first capillary structures 12 can greatly improve the heat conduction efficiency of the device, while reducing the heat accumulation in a certain area inside the device. The second capillary structure 31 realizes heat dissipation in different dimensions. The first capillary structure 12 and the second capillary structure 31 significantly improve the heat dissipation performance of the device, so that the heat transfer effect of the entire device is better and the overall heat dissipation effect of the device is more effectively exerted.

[0040] Specifically, the second capillary structure 31 is configured as one or more layers of braided copper wire, which is formed by interlacing and weaving multiple copper wires. Compared with the prior art, the integrity of the sintering molding of the surrounding copper powder capillary structure is difficult to control. The molding process of the second capillary structure 31 in this application is easier to control. The second capillary structure 31 is a flat structure or a cylindrical structure. In this embodiment, the second capillary structure 31 is preferably a cylindrical structure. The cylindrical second capillary structure 31 is sintered in the inner cavity of the heat pipe 3, so that the second capillary structure 31 is fixed to the heat pipe 3, thereby reducing the thermal resistance. It can be understood that the heat is conducted from the base plate 1, and continues to be conducted to the outer wall of the heat pipe 3 through the end of the second capillary structure 31 connected to the base plate 1, and then heat is exchanged with the air.

[0041] Please continue reading Figure 3 and Figure 4 , the bottom plate 1 is provided with a plurality of connecting fins 13, the connecting fins 13 are spaced apart from the heat-conducting columns 121, and the plurality of connecting fins 13 are arranged in parallel. The setting of the connecting fins 13 is intended to increase the heat exchange area, thereby improving the overall heat dissipation efficiency. The end of the first heat conductor 122 is connected to the connecting fin 13, and both ends of some connecting fins 13 are provided with connecting ports 131, which are used to connect to the second capillary structure 31. In this embodiment, the second capillary structure 31 is located at the connecting port 131, and the end of the second capillary structure 31 is connected to the bottom plate 1, and the peripheral wall of the second capillary structure 31 is connected to the connecting fin 13. It can be understood that the first heat conductor 122 is connected to the connecting fin 13 to realize the energy flow between the first heat conductor 122 and the connecting fin 13, and the connecting fin 13 is connected to the second capillary structure 31 to realize the energy flow between the connecting fin 13 and the second capillary structure 31.

[0042] Furthermore, to enable energy flow between the connecting fins 13, a second heat conductor 14 is provided in some heat dissipation areas. Two connecting fins 13 are connected via the second heat conductor 14, and the two sides of the second heat conductor 14 are respectively connected to the base plate 1 and the cover plate 2. In this embodiment, the second heat conductor 14 is a flat copper wire. Since the heat pipes 3 are distributed in the core heat dissipation area and the middle heat dissipation area, the connecting fins 13 and the second heat conductor 14 are correspondingly provided in the core heat dissipation area and the middle heat dissipation area. Energy flow between the connecting fins 13 is achieved through the second heat conductor 14, thereby forming an integral connection between the base plate 1, the second capillary structure 31, the connecting fins 13, the second heat conductor 14, and the first capillary structure 12. This connects the heat transfer channels within the heat dissipation device as a whole, thereby improving the heat transfer effect and more effectively exerting the heat dissipation function.

[0043] In this embodiment, the first capillary structure 12 in the peripheral heat dissipation area is arranged around the second heat conducting member 14, and the second heat conducting member 14 is arranged around the first capillary structure 12 in the central heat dissipation area and the first capillary structure 12 in the core heat dissipation area, showing a trend of gradually denser capillary structure arrangement from the edge to the center. It can be understood that the overlapping arrangement of multiple layers of capillary structures forms a gradient capillary force, which significantly improves the heat dissipation performance by optimizing the heat flow path and enhancing the heat transfer capacity. Secondly, by arranging the capillary structures with different densities in different heat dissipation areas, the local high temperature of the heat source can be diffused layer by layer to a larger area, dispersing the heat flow through redundant paths, avoiding sudden temperature rise at a single point, achieving multi-layer heat distribution, and synergistically improving heat conduction efficiency.

[0044] See also Figure 5 The cover plate 2 is provided with a first copper mesh 21 (not shown). The first copper mesh 21 is disposed on the end surface of the cover plate 2 facing the base plate 1 and is connected to the first capillary structure 12 and the second capillary structure 31. The base plate 1 is provided with a second copper mesh 15. The second copper mesh 15 is disposed within the receiving groove 11 and is connected to the first capillary structure 12 and the second capillary structure 31. In this embodiment, both the first copper mesh 21 and the second copper mesh 15 are provided with holes for accommodating the thermal conductive pillars 121, the connecting fins 13, and the second capillary structure 31.

[0045] It is understood that the porous structure of the first copper mesh 21 can prevent local heat accumulation at the connection with the first capillary structure 12 and the second capillary structure 31. At the same time, the first copper mesh 21 increases the effective surface area for heat exchange and shortens the cycle period. Because the base plate 1 is in direct contact with the heat source, the high thermal conductivity of the second copper mesh 15 can quickly diffuse the local high temperature to the entire surface of the base plate 1, improving the temperature uniformity performance. Secondly, the porous structure of the second copper mesh 15 enhances the capillary force, ensuring the continuity of the circulation through capillary action. Compared with the sintered powder structure, the uniform porosity of the second copper mesh 15 provides a more stable transmission path. The mechanical strength of the second copper mesh 15 can resist thermal expansion and external pressure, preventing the base plate 1 from deforming due to heat and affecting the sealing performance. It is important to emphasize that the first copper mesh 21, the first capillary structure 12, the second capillary structure 31, and the second copper mesh 15 together form an efficient closed loop. By strengthening the capillary force, optimizing the circulation path, and improving the heat uniformity, the thermal conductivity efficiency and heat dissipation stability of the heat dissipation device are significantly improved.

[0046] As described above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A heat dissipation device, characterized in that: include: The bottom plate is provided with a receiving groove, wherein the receiving groove includes a plurality of heat dissipation areas, each of the heat dissipation areas is provided with at least one first capillary structure, and the first capillary structure is connected to the bottom plate; a cover plate, disposed on the bottom plate and covering the opening of the receiving groove, wherein the cover plate is connected to the first capillary structure; A heat pipe, wherein a plurality of heat pipes are provided, one end of the heat pipe passes through the cover plate and is arranged in the accommodating groove, the inner cavity of the heat pipe is provided with a second capillary structure connected to the bottom plate, and the second capillary structure is connected to the first capillary structure.

2. The heat dissipation device according to claim 1, characterized in that: The first capillary structure includes a plurality of heat-conducting columns and a first heat-conducting member. The first heat-conducting member is connected to the peripheral wall of the heat-conducting column. Both sides of the heat-conducting column and the first heat-conducting member are respectively connected to the bottom plate and the cover plate.

3. The heat dissipation device according to claim 2, characterized in that: The plurality of heat-conducting columns are arranged in a ring shape, and the first heat-conducting component is bent and sequentially arranged around the peripheral wall of the heat-conducting column.

4. The heat dissipation device according to claim 2, characterized in that: The plurality of heat-conducting columns are arranged in parallel and / or side by side, and the first heat-conducting member is arranged around a portion of the peripheral wall of the heat-conducting column.

5. The heat dissipation device according to claim 2, characterized in that: The bottom plate is also provided with a plurality of connecting fins, which are spaced apart from the heat-conducting columns, and the ends of the first heat-conducting components are connected to the connecting fins; both ends of some of the connecting fins are provided with connecting ports, which are used to connect to the second capillary structure.

6. The heat dissipation device according to claim 5, characterized in that: Part of the heat dissipation area is further provided with a second heat conducting member, the two connecting fins are connected via the second heat conducting member, and two sides of the second heat conducting member are respectively connected to the bottom plate and the cover plate.

7. The heat dissipation device according to claim 6, characterized in that: The thermally conductive pillar is configured as a copper pillar, and the first thermally conductive member and the second thermally conductive member are configured as flat copper wires.

8. The heat dissipation device according to claim 1, wherein: The second capillary structure is configured as one or more layers of braided copper wires, and the second capillary structure is a flat structure or a cylindrical structure.

9. The heat dissipation device according to claim 1, wherein: The cover plate is provided with a first copper mesh, which is arranged on the end surface of the cover plate facing the bottom plate, and is connected to the first capillary structure and the second capillary structure.

10. The heat dissipation device according to claim 1, wherein: The bottom plate is provided with a second copper mesh, the second copper mesh is arranged in the receiving groove, and the second copper mesh is connected to the first capillary structure and the second capillary structure.

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