Variable-pressure circulating wind-liquid homologous heat dissipation equipment for data center

Abstract

The invention provides a variable-pressure circulation type wind-liquid homologous heat dissipation device for a data center, and the device comprises a mounting assembly which is disposed in a data center cabinet, a heat dissipation assembly which is disposed in the data center cabinet, and a heat dissipation assembly which is disposed in the data center cabinet. The lifting heat dissipation circulating mechanism is arranged on the mounting assembly and is used for lifting to change the heat dissipation position; and the air-liquid circulating mechanism is arranged above the lifting heat dissipation circulating mechanism and is used for circularly supplying cold air and cold liquid to the heat dissipation element. According to the invention, the heat dissipation space can be saved, and heat dissipation can be carried out in a movable and folding manner, so that the problems of coexistence of energy waste and local overheating phenomena, complex structure and large space occupation caused by the fact that most of the existing traditional heat dissipation devices are designed in a fixed manner and cannot be dynamically adjusted according to load differences of different areas in the data center are solved.

Description

Technical Field

[0001] The present invention relates to the technical field, and in particular to a variable pressure circulating air-liquid homogenous heat dissipation device for a data center. Background Art

[0002] With the rapid development of cloud computing, artificial intelligence, and big data technologies, the power density of single data center cabinets continues to climb. Traditional air cooling technology is no longer able to meet the cooling requirements of high-density computing scenarios. Liquid cooling, with its efficient heat conduction performance, has gradually become a mainstream approach to data center cooling. However, pure liquid cooling systems have issues such as high initial investment costs, complex maintenance, and insufficient response time to transient thermal shocks.

[0003] Meanwhile, while air cooling offers the advantages of low cost and flexible deployment, its heat dissipation efficiency is limited by the specific heat capacity of air, making it difficult to meet the stringent PUE (power usage effectiveness) requirements of future data centers. Therefore, combining the advantages of air cooling with liquid cooling to achieve efficient heat dissipation through "air-liquid synergy" has become a hot topic in industry research.

[0004] Some existing solutions achieve synergistic heat dissipation through independent air-cooling and liquid-cooling modules, but these solutions present complex structures and require significant space. Furthermore, traditional heat dissipation equipment is often fixed and cannot dynamically adjust to varying loads within the data center, leading to both energy waste and localized overheating. Summary of the Invention

[0005] In view of the shortcomings of the existing technology, the purpose of the present invention is to provide a variable pressure circulating air-liquid homologous heat dissipation device for data centers, which can save heat dissipation space and can be moved and folded for heat dissipation, so as to solve the problem that most of the existing traditional heat dissipation devices are fixed in design and cannot be dynamically adjusted according to the load differences in different areas of the data center, resulting in energy waste and local overheating, as well as complex structure and large space occupation.

[0006] To achieve the above-mentioned object, the present invention is implemented through the following technical solutions: a variable pressure circulation type air-liquid co-source heat dissipation device for a data center, comprising a mounting assembly, which is arranged inside a cabinet of the data center; A lifting heat dissipation circulation mechanism is provided on the mounting assembly and is used to lift and lower the heat dissipation position; The air-liquid circulation mechanism is arranged above the lifting heat dissipation circulation mechanism and is used for circulating and supplying cold air and cold liquid to the heat dissipation element.

[0007] Furthermore, the mounting assembly includes a base, a slide bar and fixing ears, the slide bar is fixedly mounted on both sides of the top of the base, the fixing ears are fixedly mounted on the top of the slide bar, and the base is mounted on the bottom of the data center cabinet.

[0008] Furthermore, the lifting and cooling circulation mechanism includes a sliding mounting plate, a lifting drive assembly, a torsional swinging drive assembly, a water-cooled cooling arm, an air-liquid mixed cooling arm, a gear 1, a linkage sleeve 1, a gear 2, a linkage sleeve 2 and a lifting and swinging staggered assembly. The sliding mounting plate is slidably mounted on the surface of the slide rod. The lifting drive assembly is arranged at the center of the top of the base and is used to drive the sliding mounting plate to adjust the height. The torsional swinging drive assembly is arranged at the center of the top of the sliding mounting plate and is used to drive the water-cooled cooling arm and the air-liquid mixed cooling arm to swing on the sliding mounting plate. A linkage sleeve 1 is fixedly installed on the side of the top of the water-cooled cooling arm close to the sliding mounting plate. The gear 1 is fixedly mounted on the surface of the linkage sleeve 1 and is located at the top of the sliding mounting plate. The linkage sleeve 2 is fixedly mounted on the side of the top of the air-liquid mixed heat dissipation arm close to the sliding mounting plate. The gear 2 is longitudinally slidably mounted on the top of the surface of the linkage sleeve 2. The water-cooled heat dissipation arm and the air-liquid mixed heat dissipation arm are both provided with cooling coils. The water-cooled heat dissipation arm is rotated with one side of the top of the sliding mounting plate through the linkage sleeve 1, and the air-liquid mixed heat dissipation arm is rotated with the other side of the top of the sliding mounting plate through the linkage sleeve 2. The lifting and swinging staggered component is arranged on the side of the top of the sliding mounting plate close to the gear 2, and is used to drive the linkage sleeve 2 to lift and change the longitudinal position.

[0009] Furthermore, the lifting drive assembly includes a servo motor, a fixing frame, a screw and a screw sleeve. The fixing frame is fixedly installed at the top center of the base, the servo motor is fixedly installed at the bottom of the fixing frame, the bottom of the screw passes through the fixing frame and is fixedly installed with the output end of the servo motor, the screw sleeve is threadedly connected to the surface of the screw, and the top of the screw sleeve is fixedly installed with the bottom of the sliding mounting plate.

[0010] Furthermore, the torsional swing drive assembly includes a stepper motor, a driving disk, a toggle column, a driving frame and a rack. The stepper motor is fixedly mounted at the bottom center of the sliding mounting plate. The output end of the stepper motor passes through the sliding mounting plate and extends to the top of the sliding mounting plate and is fixedly connected to the driving disk. The toggle column is fixedly mounted on the top of the driving disk close to the side of the driving frame. A sliding groove is provided inside the driving frame to slide with the toggle column. The rack is fixedly mounted at both ends of the driving frame and meshes with gear one and gear two. Guide units are fixedly mounted on both sides of the bottom of the driving frame.

[0011] Furthermore, the lifting and swinging interlaced assembly includes an electromagnetic push rod, a lifting plate, a limiting ring, a limiting plate and a limiting slide column. The electromagnetic push rod is fixedly mounted on the back of the limiting plate, the limiting plate is fixedly mounted on the rear side of the top of the sliding mounting plate close to the side of gear two, the lifting plate is fixedly mounted on the output end of the electromagnetic push rod, the lifting plate is rotatably sleeved on the surface of the limiting ring, the limiting ring is fixedly mounted on the top of the surface of the linkage sleeve two, the limiting slide column is fixedly mounted on both sides of the bottom of the lifting plate close to the limiting plate, and slides with the limiting plate, the surface of the linkage sleeve two is sleeved with a spring, the top of the spring contacts the bottom of the limiting ring, and the bottom of the spring contacts the top of gear two.

[0012] Furthermore, the guide unit includes a limiting slide and a limiting sliding block, the limiting slide is fixedly mounted on both sides of the top of the sliding mounting plate, and the limiting sliding block is fixedly mounted on both sides of the bottom of the driving frame and slidingly cooperates with the limiting slide.

[0013] Furthermore, the air-liquid circulation mechanism includes a heat dissipation water tank, a sealing cover, a heat dissipation fan, an air collecting cover, a cooling air supply pipe, an air supply hose, a semiconductor refrigeration plate, a variable frequency speed regulation water pump, a return water tee joint and a water supply tee joint. The heat dissipation water tank is arranged on the top of the screw, and the two sides are fixedly installed with the fixing ears. The bottom of the heat dissipation water tank is rotatably matched with the top of the screw. The heat dissipation fans are provided in two groups and are symmetrically installed on both sides of the top of the heat dissipation water tank. The sealing cover is threadedly connected to the top center of the heat dissipation water tank. The semiconductor refrigeration plate is fixedly installed at the back center of the heat dissipation water tank. The air collecting cover is fixedly connected to the front of the heat dissipation fan. One end of the cooling air supply pipe is connected to the air collecting cover, and the other end passes through the heat dissipation water tank from top to bottom. The hot water tank extends to the bottom of the heat dissipation water tank and is connected to the water-cooled radiator arm and the air-liquid mixed radiator arm through a hose. The part of the cooling air supply pipe inside the heat dissipation water tank is made of cooling material. The variable frequency speed regulation water pump is fixedly installed at the center of the bottom of the inner wall of the heat dissipation water tank. The output end of the variable frequency speed regulation water pump passes through the heat dissipation water tank and extends to the bottom of the heat dissipation water tank and is connected to the water supply tee joint. The other two ends of the water supply tee joint are respectively connected to the cooling coils inside the water-cooled radiator arm and the air-liquid mixed radiator arm through hoses. The bottom of the heat dissipation water tank is connected to the return water tee joint through a hose, and the other two ends of the return water tee joint are connected to one end of the cooling coils inside the water-cooled radiator arm and the air-liquid mixed radiator arm through a hose.

[0014] Furthermore, ventilation holes are provided on the top of the water-cooled heat dissipation arm and the air-liquid mixed heat dissipation arm. Several groups of ventilation holes are provided and cooperate with the bottom hose of the cooling air supply pipe for air cooling and heat dissipation. Several groups of cleaning brushes are fixedly installed on the top of the air-liquid mixed heat dissipation arm.

[0015] The beneficial effects of the present invention are as follows: the present invention drives the screw and the screw sleeve through a servo motor to drive the sliding mounting plate to move longitudinally, so that the heat dissipation mechanism accurately matches the heat dissipation requirements of processors at different levels in the data center cabinet, avoiding energy waste and swinging to increase efficiency: the stepper motor drives the water-cooled heat dissipation arm and the air-liquid mixed heat dissipation arm to swing synchronously, expanding the heat dissipation area and forming a dynamic airflow, breaking the thermal boundary layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Other features, objects and advantages of the present invention will become more apparent upon reading the detailed description of non-limiting embodiments with reference to the following drawings: Figure 1 It is a structural schematic diagram of the present invention; Figure 2 For the present invention Figure 1 A schematic diagram of a three-dimensional structure from another perspective; Figure 3 It is a schematic structural diagram of the torsional swing drive assembly of the present invention; Figure 4 For the present invention Figure 3 Schematic diagram of the explosion structure; Figure 5 For the present invention Figure 4 A schematic diagram of the enlarged structure at point A; Figure 6 It is a schematic diagram of the structure of the air-liquid circulation mechanism of the present invention.

[0017] Figure: 1. Base; 101. Sliding rod; 102. Fixing ear; 11. Servo motor; 12. Fixing bracket; 111. Screw; 112. Screw sleeve; 2. Sliding mounting plate; 21. Water-cooling radiator arm; 211. Ventilation hole; 22. Air-liquid mixing radiator arm; 221. Cleaning brush; 222. Cooling coil; 23. Gear 1; 231. Linkage sleeve 1; 24. Gear 2; 241. Lifting plate; 242. Electromagnetic push rod; 243. Limiting ring; 244. Linkage sleeve 2; 245. Limiting plate; 246 , limit slide; 247, spring; 25, stepper motor; 251, drive plate; 252, toggle column; 253, drive frame; 254, rack; 2531, limit slide; 2532, limit slider; 3, heat sink; 301, sealing cover; 302, cooling fan; 3021, air collecting cover; 3022, cooling air supply duct; 303, semiconductor refrigeration plate; 30221, air supply hose; 304, variable frequency speed regulation water pump; 3041, return water tee joint; 3042, water supply tee joint. DETAILED DESCRIPTION

[0018] In order to make the technical means, creative features, objectives and effects achieved by the present invention easier to understand, the present invention is further described below in conjunction with specific implementation methods.

[0019] See also Figure 1 , Figure 1 It is a structural schematic diagram of the present invention.

[0020] A variable pressure circulation type air-liquid homogenous heat dissipation device for a data center, comprising a mounting assembly, and arranged inside a data center cabinet; See also Figure 2 and Figure 3 , Figure 2 Schematic diagram of the internal structure of the tower; Figure 3 for Figure 2 A magnified view of the middle panel.

[0021] The mounting assembly includes a base 1, a slide bar 101, and mounting ears 102. The slide bar 101 is fixedly mounted on both sides of the top of the base 1, and the mounting ears 102 are fixedly mounted on the top of the slide bar 101. The base 1 is mounted on the bottom of the data center cabinet. The base 1 supports and mounts the slide bar 101. The mounting ears 102 and the heat sink 3 can also be used to limit the overall longitudinal position of the slide bar 101. Vertical installation at the rear of the data center cabinet does not affect the installation of the data processor inside the data center cabinet.

[0022] The lifting and cooling circulation mechanism is arranged on the mounting assembly and is used to lift and change the cooling position; the lifting and cooling circulation mechanism includes a sliding mounting plate 2, a lifting drive assembly, a torsional swing drive assembly, a water-cooled cooling arm 21, an air-liquid mixed cooling arm 22, a gear 1 23, a linkage sleeve 1 231, a gear 24, a linkage sleeve 244 and a lifting and swinging staggered assembly. The sliding mounting plate 2 is slidably mounted on the surface of the slide rod 101. The lifting drive assembly is arranged at the center of the top of the base 1 and is used to drive the sliding mounting plate 2 to adjust the height. The torsional swing drive assembly is arranged at the center of the top of the sliding mounting plate 2 and is used to drive the water-cooled cooling arm 21 and the air-liquid mixed cooling arm 22 to swing on the sliding mounting plate 2. The top of the water-cooled cooling arm 21 is fixedly mounted on one side close to the sliding mounting plate 2. It is equipped with a linkage sleeve 231, and a gear 23 is fixedly mounted on the surface of the linkage sleeve 231 and located at the top of the sliding mounting plate 2. A linkage sleeve 244 is fixedly mounted on the side of the top of the air-liquid mixed heat dissipation arm 22 close to the sliding mounting plate 2. The gear 24 is longitudinally slidably mounted on the top of the surface of the linkage sleeve 244. The inside of the water-cooled heat dissipation arm 21 and the air-liquid mixed heat dissipation arm 22 are both provided with a cooling coil 222. The water-cooled heat dissipation arm 21 rotates with one side of the top of the sliding mounting plate 2 through the linkage sleeve 231, and the air-liquid mixed heat dissipation arm 22 rotates with the other side of the top of the sliding mounting plate 2 through the linkage sleeve 244. The lifting and swinging staggered component is arranged on the side of the top of the sliding mounting plate 2 close to the gear 24, and is used to drive the linkage sleeve 244 to lift and change the longitudinal position; By means of the lifting drive assembly in conjunction with the sliding mounting plate 2, the heat dissipation position can be changed by sliding on the slide bar 101, and the heat dissipation intensity can be adjusted according to the heat dissipation requirements of different levels, and gear one 23 and gear two 24 are convenient for cooperating with the torsional swing drive assembly to swing the water-cooled heat dissipation arm 21 and the air-liquid mixed heat dissipation arm 22 for heat dissipation, thereby increasing the heat dissipation area, and when cross-swing heat dissipation is required, the height of the air-liquid mixed heat dissipation arm 22 can be adjusted by lifting the swing staggered assembly, so that the air-liquid mixed heat dissipation arm 22 and the water-cooled heat dissipation arm 21 are staggered to avoid collision during swinging, and at the same time, it can be easily folded into the bottom of the sliding mounting plate 2 for convenient height adjustment.

[0023] The lifting drive assembly includes a servo motor 11, a fixing frame 12, a screw 111 and a screw sleeve 112. The fixing frame 12 is fixedly mounted at the top center of the base 1. The servo motor 11 is fixedly mounted at the bottom of the fixing frame 12. The bottom of the screw 111 passes through the fixing frame 12 and is fixedly mounted to the output end of the servo motor 11. The screw sleeve 112 is threadedly connected to the surface of the screw 111. The top of the screw sleeve 112 is fixedly mounted to the bottom of the sliding mounting plate 2. The fixing frame 12 can install and fix the servo motor 11, and starting the servo motor 11 can drive the screw 111 to rotate, and after the screw 111 rotates, it drives the screw sleeve 112 to be raised and lowered. Since the screw sleeve 112 is fixed to the sliding mounting plate 2 and is then limited by the sliding rod 101, stable longitudinal adjustment can be achieved.

[0024] The torsion and swing drive assembly includes a stepper motor 25, a drive disk 251, a toggle post 252, a drive frame 253 and a rack 254. The stepper motor 25 is fixedly mounted at the bottom center of the sliding mounting plate 2. The output end of the stepper motor 25 passes through the sliding mounting plate 2 and extends to the top of the sliding mounting plate 2 and is fixedly connected to the drive disk 251. The toggle post 252 is fixedly mounted on the top of the drive disk 251 near the side of the drive frame 253. A sliding groove is provided inside the drive frame 253 for sliding cooperation with the toggle post 252. The rack 254 is fixedly mounted at both ends of the drive frame 253 and meshes with gear 1 23 and gear 2 24. Guide units are fixedly mounted on both sides of the bottom of the drive frame 253. After the stepper motor 25 is started, it can drive the driving disk 251 to rotate, and after the driving disk 251 rotates, it can drive the toggle column 252 to rotate accordingly. When the toggle column 252 rotates, the slide groove of the driving frame 253 can drive the driving frame 253 to slide stably back and forth under the limit of the guide unit, so that the driving frame 253 can stably drive the rack 254 to move back and forth, thereby driving the gear 1 23 and gear 2 24 engaged therewith to twist synchronously through the movement of the rack 254. The twisting of gear 1 23 and gear 2 24 drives the water-cooled heat dissipation arm 21 and the air-liquid mixed heat dissipation arm 22 to twist accordingly through the linkage sleeve 1 231 and linkage sleeve 2 244 fixed thereto, thereby realizing torsional heat dissipation, increasing the heat dissipation area while forming dynamic airflow, breaking the local thermal boundary layer, and significantly improving the heat dissipation efficiency.

[0025] The lifting and swinging interlaced assembly includes an electromagnetic push rod 242, a lifting plate 241, a limiting ring 243, a limiting plate 245 and a limiting slide 246. The electromagnetic push rod 242 is fixedly mounted on the back of the limiting plate 245. The limiting plate 245 is fixedly mounted on the rear side of the top of the sliding mounting plate 2 near the gear 2 24. The lifting plate 241 is fixedly mounted on the output end of the electromagnetic push rod 242. The lifting plate 241 is rotatably sleeved on the surface of the limiting ring 243. The limiting ring 243 is fixedly mounted on the top of the surface of the linkage sleeve 244. The limiting slide 246 is fixedly mounted on both sides of the bottom of the lifting plate 241 near the limiting plate 245 and slides with the limiting plate 245. The surface of the linkage sleeve 244 is sleeved with a spring 247. The top of the spring 247 contacts the bottom of the limiting ring 243, and the bottom of the spring 247 contacts the top of the gear 24. By starting the electromagnetic push rod 242, the lifting plate 241 can be driven to be lifted. The limiting slide column 246 at the bottom of the lifting plate 241 and the stable sliding cooperation with the limiting plate 245 can make the lifting plate 241 stably lifted to avoid getting stuck. At the same time, the lifting plate 241 can drive the limiting ring 243 with the rotation limit to be lifted upward without affecting the torsion of the limiting ring 243 and the linkage sleeve 244. In the lifting process, the elastic force of the spring 247 can always make the gear 24 engage with the rack 254, ensuring that the gear 24 can be stably torsionally driven by the rack 254. The water-cooled heat dissipation arm 21 and the air-liquid mixed heat dissipation arm 22 can be folded into the bottom of the sliding mounting plate 2, which is convenient for maintenance and upgrading of equipment in the cabinet, while reducing space occupancy and adapting to the high-density deployment trend of data centers.

[0026] The guide unit includes a limiting slide 2531 and a limiting slider 2532. The limiting slide 2531 is fixedly mounted on both sides of the top of the sliding mounting plate 2, and the limiting slider 2532 is fixedly mounted on both sides of the bottom of the driving frame 253 and slides with the limiting slide 2531. After being fixed to the sliding mounting plate 2, the limiting slide 2531 can ensure that the limiting slider 2532 will not shake when sliding with it. At the same time, the limiting slider 2532 can stably limit the sliding stroke of the driving frame 253 to prevent twisting and jamming on both sides.

[0027] The air-liquid circulation mechanism is arranged above the lifting heat dissipation circulation mechanism and is used to circulate cold air and cold liquid to the heat dissipation element; the air-liquid circulation mechanism includes a heat dissipation water tank 3, a sealing cover 301, a heat dissipation fan 302, an air collecting cover 3021, a cold air supply pipe 3022, an air supply hose 30221, a semiconductor refrigeration plate 303, a variable frequency speed regulation water pump 304, a return water three-way joint 3041 and a water supply three-way joint 3042. The heat dissipation water tank 3 is arranged at the top of the screw 111, and the two sides are fixedly installed with the fixing ears 102. The bottom of the heat dissipation water tank 3 is rotatably matched with the top of the screw 111. Two groups of heat dissipation fans 302 are provided and are symmetrically installed on both sides of the top of the heat dissipation water tank 3. The sealing cover 301 is threadedly connected to the top center of the heat dissipation water tank 3. The semiconductor refrigeration plate 303 is fixedly installed at the back center of the heat dissipation water tank 3. The air collecting cover 3021 is fixedly connected to the front of the heat dissipation fan 302. One end of the cold air supply pipe 3022 The cooling air supply pipe 3022 is connected to the wind collecting cover 3021, and the other end passes through the heat dissipation water tank 3 from top to bottom and extends to the bottom of the heat dissipation water tank 3 and is connected to the water-cooled heat dissipation arm 21 and the air-liquid mixed heat dissipation arm 22 through a hose. The part of the cooling air supply pipe 3022 inside the heat dissipation water tank 3 is made of cooling material. The variable frequency speed regulating water pump 304 is fixedly installed at the center of the bottom of the inner wall of the heat dissipation water tank 3. The output end of the variable frequency speed regulating water pump 304 passes through the heat dissipation water tank 3 and extends to the bottom of the heat dissipation water tank 3 and is connected to the water supply tee joint 3042. The other two ends of the water supply tee joint 3042 are respectively connected to the cooling coil 222 inside the water-cooled heat dissipation arm 21 and the air-liquid mixed heat dissipation arm 22 through hoses. The bottom of the heat dissipation water tank 3 is connected to the return water tee joint 3041 through a hose, and the other two ends of the return water tee joint 3041 are connected to one end of the cooling coil 222 inside the water-cooled heat dissipation arm 21 and the air-liquid mixed heat dissipation arm 22 through hoses, thereby forming a liquid circulation. The starting power of the variable frequency speed regulating water pump 304 is determined according to the heat dissipation demand. When high pressure operation is required, the operating power of the variable frequency speed regulating water pump 304 is changed to increase the power so that the water can flow quickly to take away the heat. When low pressure operation is required, energy is saved, the operating power is reduced, and the liquid flow rate is reduced. At the same time, during the circulation, the output end of the variable frequency speed regulating water pump 304 cooperates with the water supply tee joint 3042 to simultaneously transport the cold liquid to the cooling coil 222 in the water-cooled radiator arm 21 and the air-liquid mixed radiator arm 22, and at the same time, the interior of the water-cooled radiator arm 21 and the air-liquid mixed radiator arm 22 is filled with a cooling block to increase the heat dissipation effect. After the cold liquid circulates through the cooling coil 222, it is returned through the return water tee joint 3041, so that the cold liquid after absorbing the heat returns to the interior of the heat dissipation water tank 3 and is transported by the variable frequency speed regulating water pump 304 again. At the same time, the semiconductor refrigeration plate 303 is refrigerated to keep the cold liquid at a relatively cold temperature, thereby ensuring the heat dissipation efficiency. During the cold liquid transportation process, the cooling fan 302 is started to compress the external wind through the wind collecting cover 3021 and then transported to the inside of the water-cooled heat sink arm 21 and the air-liquid mixed heat sink arm 22 through the cooling air supply pipe 3022. However, during the transportation process, due to the cooling of the cooling air supply pipe 3022, the external wind will be cooled again, so that the cooling effect is better and the heat dissipation performance is guaranteed. After entering the inside of the water-cooled heat sink arm 21 and the air-liquid mixed heat sink arm 22, due to the arrangement of the cooling coil 222, the cold wind and the cold liquid in the cooling coil 222 will combine to dissipate heat for the data processor of the data center, and the cooling air supply pipe 3022 will be used to cool the data processor of the data center. The cold air cooled by the semiconductor refrigeration plate 303 and the cold liquid delivered by the variable frequency speed regulating water pump 304 are simultaneously introduced into the heat dissipation arm to achieve a composite heat dissipation effect of "air cooling wrapped in liquid cooling". The cold air blows directly on the surface of the processor, quickly removing the sensible heat; the cold liquid absorbs latent heat through the cooling coil 222, forming a dual cooling mechanism, which is particularly suitable for instantaneous thermal shock in high-density computing scenarios. The variable frequency speed regulating water pump 304 dynamically adjusts the flow rate according to the heat dissipation demand, quickly circulates the cold liquid in high-pressure mode to cope with extreme working conditions, and reduces energy consumption in low-pressure mode. Combined with the precise temperature control of the semiconductor refrigeration plate 303, the system energy efficiency ratio (EER) is improved by more than 25%. A temperature sensor is added to the heat dissipation water tank 3 to monitor the coolant temperature in real time and transmit the data to the data center management platform through a wireless module. When the temperature exceeds the threshold, the system automatically starts the semiconductor refrigeration plate 303 to enhance cooling and triggers an alarm to notify the operation and maintenance personnel. According to the climate conditions of the data center area, the cooling power of the semiconductor refrigeration chip 303 is adjusted through software. For example, the cooling power is appropriately increased in high temperature and high humidity areas, and the power is reduced in low temperature and dry areas to save energy; By monitoring the current and vibration signals of key components such as the servo motor 11 and the stepper motor 25, potential faults can be warned in advance and predictive maintenance can be achieved.

[0028] The tops of both the water-cooled heat sink arm 21 and the air-liquid hybrid heat sink arm 22 are provided with ventilation holes 211. These ventilation holes 211 are provided with several groups of hoses that cooperate with the bottom of the cooling air supply duct 3022 for air cooling and heat dissipation. Several groups of cleaning brushes 221 are fixedly mounted on the tops of the air-liquid hybrid heat sink arms 22. The ventilation holes 211 facilitate the removal of cold air delivered by the cooling air supply duct 3022 into the water-cooled heat sink arm 21 and the air-liquid hybrid heat sink arm 22. Furthermore, the ventilation holes 211 can be configured as static-eliminating brushes to absorb static electricity from cabinets within the data center during the heat dissipation process, ensuring stable equipment operation. The integrated static-eliminating brushes in the ventilation holes 211 actively absorb static electricity within the cabinets during the heat dissipation process, reducing the failure rate of electronic components due to static electricity breakdown and extending the service life of the processor. The cleaning brushes 221 on the tops of the air-liquid hybrid heat sink arms 22 regularly clean dust from the processor surface to prevent local overheating caused by dust accumulation, thereby reducing the frequency of manual maintenance and lowering operation and maintenance costs.

[0029] Working principle: 1. Heat dissipation position adjustment The servo motor 11 drives the screw 111 to rotate, driving the screw sleeve 112 and the sliding mounting plate 2 to move longitudinally along the slide rod 101, thereby achieving height adjustment of the heat dissipation mechanism to match the heat dissipation requirements of processors at different levels.

[0030] 2. Dynamic swing of the cooling arm The stepper motor 25 drives the driving disk 251 to rotate, and the toggle column 252 drives the rack 254 to move back and forth through the slide groove of the driving frame 253, thereby driving gear 1 23 and gear 2 24 to twist synchronously, so that the water-cooled heat dissipation arm 21 and the air-liquid mixed heat dissipation arm 22 swing on the sliding mounting plate 2, expanding the heat dissipation area and forming dynamic airflow.

[0031] 3. Wind-fluid synergistic circulation Cooling liquid circulation: The variable frequency speed regulating water pump 304 draws cooling liquid from the cooling water tank 3, diverts it through the water supply tee 3042 to the cooling coil 222 of the water cooling arm 21 and the air-liquid mixing cooling arm 22. After absorbing the heat of the processor, it returns to the cooling water tank 3 through the return water tee 3041 and is re-cooled by the semiconductor refrigeration plate 303. Cold air circulation: The cooling fan 302 compresses the outside air and sends it into the cooling air supply pipe 3022 through the air collecting cover 3021. The cold air is further cooled by the semiconductor refrigeration plate 303 in the pipe, and then transported to the inside of the heat dissipation arm, and cooperates with the cold liquid in the cooling coil 222 to perform composite heat dissipation on the processor.

[0032] 4. Anti-collision and adaptive folding The electromagnetic push rod 242 pushes the lifting plate 241 to rise, and drives the linkage sleeve 244 and the air-liquid mixed heat dissipation arm 22 to rise through the limit ring 243 to avoid collision with the water-cooled heat dissipation arm 21; the spring 247 ensures that the gear 24 and the rack 254 are always engaged to ensure the stability of the swing drive. The heat dissipation arm can be folded into the bottom of the sliding mounting plate 2 for easy maintenance.

[0033] 5. Static elimination and self-cleaning The static elimination brush in the ventilation hole 211 absorbs static electricity in the cabinet; the cleaning brush 221 on the top of the air-liquid mixing heat dissipation arm 22 cleans dust on the surface of the processor during the swinging process to prevent local overheating.

[0034] Example 1: Cooling of Standard Cabinets in Small and Medium-Sized Data Centers Application Scenario The data center of a small or medium-sized internet company uses standard 42U cabinets with a cabinet power density of 8kW per cabinet. Multiple servers are deployed inside, and the processor load varies, with some areas experiencing higher loads and others experiencing lower loads. Device Configuration Lifting drive assembly: A servo motor 11 with a rated power of 200W is selected, and a screw 111 with a diameter of 20mm and a corresponding screw sleeve 112 are matched. The fixing frame 12 is made of high-strength aluminum alloy to ensure that it can stably support the sliding mounting plate 2 and the heat dissipation mechanism thereon.

[0035] Torsional swing drive assembly: The power of the stepper motor 25 is 100W, the diameter of the drive disk 251 is 100mm, the diameter of the toggle column 252 is 10mm, the size of the drive frame 253 is designed to be a rectangular frame with a length of 150mm and a width of 50mm according to the swing amplitude requirements, and the module of the rack 254 is 2 and the length is 200mm.

[0036] Radiating arm: Both the water-cooled radiating arm 21 and the air-liquid mixed radiating arm 22 use a copper cooling coil 222 with a coil diameter of 8mm. The radiating arm is 400mm long and 100mm wide. The ventilation holes 211 have a diameter of 5mm and are evenly distributed on the surface of the radiating arm. The cleaning brush 221 is made of soft nylon and its length is consistent with the width of the radiating arm.

[0037] Air-liquid circulation mechanism: The heat dissipation water tank 3 has a volume of 50L and is made of stainless steel. A rubber sealing ring is used to seal the sealing cover 301 and the water tank. The cooling fan 302 has a power of 150W and an air volume of 1000m³ / h. The diameter of the wind collecting hood 3021 is 200mm. The diameter of the cooling air supply pipe 3022 is 80mm and the length is 3m. The diameter of the air supply hose 30221 is consistent with that of the cooling air supply pipe, and the length is adjusted according to the internal layout of the cabinet. The cooling power of the semiconductor refrigeration plate 303 is 500W. The flow range of the variable frequency speed regulating water pump 304 is 5-20L / min and the lift is 5m.

[0038] Working process After the data center is started, the servo motor 11 drives the screw 111 to rotate according to the preset program, so that the sliding mounting plate 2 moves to the middle position of the cabinet, preliminarily matching the overall heat dissipation requirements; The stepper motor 25 starts working, driving the rack 254 to reciprocate through the drive plate 251, the toggle post 252 and other components, thereby causing the water-cooled heat dissipation arm 21 and the air-liquid mixed heat dissipation arm 22 to swing at an amplitude of 30 degrees and a frequency of 10 times per minute, thereby expanding the heat dissipation area; The variable frequency speed regulating water pump 304 delivers the cold liquid in the cooling water tank 3 to the cooling coil 222 of the cooling arm at a flow rate of 10 L / min according to the cooling demand. At the same time, the cooling fan 302 compresses the outside air and sends it into the cooling air supply pipe 3022 through the air collecting cover 3021. The cold air is cooled to 15°C by the semiconductor cooling plate 303 in the pipe and then delivered to the interior of the cooling arm to cooperate with the cold liquid to cool the processor. During operation, the static elimination brush in the ventilation hole 211 continuously absorbs static electricity in the cabinet, and the cleaning brush 221 on the top of the air-liquid mixed heat dissipation arm 22 cleans the dust on the surface of the processor during the swinging process. When it is detected that the temperature of the processor in a certain area rises, the servo motor 11 drives the sliding mounting plate 2 to move toward the area, lowering the height of the heat dissipation arm to enhance the local heat dissipation intensity.

[0039] Example 2: Cooling of high-density computing areas in large data centers Application Scenario The high-density computing area of ​​a large financial data center has a cabinet power density of up to 20kW / cabinet and uses customized 48U cabinets. A large number of high-performance servers are deployed inside, and the processor load is extremely high, placing extremely strict requirements on heat dissipation efficiency and stability.

[0040] Device Configuration Lifting drive assembly: The servo motor 11 has a rated power of 500W, the screw 111 has a diameter of 30mm, the screw sleeve 112 matches the screw 111, and the fixing frame 12 is made of carbon fiber reinforced composite material to reduce weight and improve strength.

[0041] Torsional swing drive assembly: The power of the stepper motor 25 is 200W, the diameter of the drive disk 251 is 150mm, the diameter of the toggle column 252 is 15mm, the size of the drive frame 253 is a rectangular frame with a length of 250mm and a width of 80mm, and the module of the rack 254 is 3 and the length is 300mm.

[0042] Radiating arm: The radiating arm is made of copper alloy, the diameter of the cooling coil 222 is 10 mm, the length of the radiating arm is 500 mm, the width is 150 mm, the diameter of the ventilation hole 211 is 8 mm, and the cleaning brush 221 is made of microfiber material to improve the cleaning effect.

[0043] Air-liquid circulation mechanism: The heat dissipation water tank 3 has a capacity of 100L and is made of titanium alloy to ensure corrosion resistance. The cooling fan 302 has a power of 300W and an air volume of 2000m³ / h. The diameter of the wind collecting hood 3021 is 300mm. The diameter of the cooling air supply pipe 3022 is 100mm and the length is 5m. The diameter of the air supply hose 30221 is consistent with that of the cooling air supply pipe, and the length is adjusted according to the cabinet layout. The cooling power of the semiconductor refrigeration plate 303 is 1000W. The flow range of the variable frequency speed regulating water pump 304 is 10-30L / min and the lift is 8m.

[0044] Working process Before the data center is started, the servo motor 11 drives the sliding mounting plate 2 to move to the bottom of the cabinet to provide close-range heat dissipation support for the high-power processor; The stepper motor 25 drives the heat dissipation arm to swing at an amplitude of 45 degrees and a frequency of 15 times per minute, rapidly expanding the heat dissipation range. The variable frequency speed regulating water pump 304 delivers the cooling liquid at a flow rate of 20L / min. The cooling fan 302 cools the cold air to 10°C and then delivers it to the inside of the heat dissipation arm, achieving efficient heat dissipation. The system monitors the processor temperature in real time through a temperature sensor. When the temperature exceeds the set threshold, the semiconductor refrigeration plate 303 automatically increases the cooling power, and the variable frequency speed regulation water pump 304 increases the flow rate to 25L / min. At the same time, the servo motor 11 fine-tunes the position of the sliding mounting plate 2 to ensure that the processor temperature is stable within a safe range.

[0045] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. It is obvious to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, from all points of view, the embodiments should be regarded as illustrative and non-restrictive. The scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes that fall within the meaning and range of equivalents of the claims are included in the present invention. Any reference signs in the claims should not be construed as limiting the claim to which they relate.

[0046] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A variable pressure circulating air-liquid heat dissipation device for a data center, characterized by: It includes a mounting assembly, which is arranged inside a data center cabinet; A lifting heat dissipation circulation mechanism is provided on the mounting assembly and is used to lift and lower the heat dissipation position; The air-liquid circulation mechanism is arranged above the lifting heat dissipation circulation mechanism and is used for circulating and supplying cold air and cold liquid to the heat dissipation element.

2. The variable pressure circulation type air-liquid heat dissipation device for a data center according to claim 1, characterized in that: The mounting assembly comprises a base (1), a slide bar (101) and fixing ears (102), wherein the slide bar (101) is fixedly mounted on both sides of the top of the base (1), the fixing ears (102) are fixedly mounted on the top of the slide bar (101), and the base (1) is mounted on the bottom of a data center cabinet.

3. The variable pressure circulation type air-liquid heat dissipation device for a data center according to claim 1, characterized in that: The lifting and cooling circulation mechanism comprises a sliding mounting plate (2), a lifting drive assembly, a torsion swing drive assembly, a water-cooling cooling arm (21), an air-liquid mixing cooling arm (22), a gear 1 (23), a linkage sleeve 1 (231), a gear 2 (24), a linkage sleeve 2 (244) and a lifting and swinging staggered assembly. The sliding mounting plate (2) is slidingly mounted on the surface of the slide bar (101). The lifting drive assembly is arranged at the center of the top of the base (1) and is used to drive the sliding mounting plate (2) to adjust its height. The torsion swing drive assembly is arranged at the center of the top of the sliding mounting plate (2) and is used to drive the water-cooling cooling arm (21) and the air-liquid mixing cooling arm (22) to swing on the sliding mounting plate (2). A linkage sleeve 1 (231) is fixedly mounted on one side of the top of the water-cooling cooling arm (21) close to the sliding mounting plate (2). The gear 1 (23) The linkage sleeve (231) is fixedly mounted on the surface of the linkage sleeve (231) and is located at the top of the sliding mounting plate (2). The linkage sleeve (244) is fixedly mounted on the side of the top of the air-liquid mixed heat dissipation arm (22) close to the sliding mounting plate (2). The gear (24) is longitudinally slidably mounted on the top of the linkage sleeve (244). The interiors of the water-cooled heat dissipation arm (21) and the air-liquid mixed heat dissipation arm (22) are both provided with a cooling coil (222). The water-cooled heat dissipation arm (21) is rotatably matched with one side of the top of the sliding mounting plate (2) through the linkage sleeve (231). The air-liquid mixed heat dissipation arm (22) is rotatably matched with the other side of the top of the sliding mounting plate (2) through the linkage sleeve (244). The lifting and swinging staggered component is arranged on the side of the top of the sliding mounting plate (2) close to the gear (24), and is used to drive the linkage sleeve (244) to lift and change the longitudinal position.

4. The variable pressure circulation type air-liquid heat dissipation device for a data center according to claim 3, characterized in that: The lifting drive assembly comprises a servo motor (11), a fixing frame (12), a screw (111) and a screw sleeve (112), wherein the fixing frame (12) is fixedly mounted at the top center of the base (1), the servo motor (11) is fixedly mounted at the bottom of the fixing frame (12), the bottom of the screw (111) passes through the fixing frame (12) and is fixedly mounted to the output end of the servo motor (11), the screw sleeve (112) is threadedly connected to the surface of the screw (111), and the top of the screw sleeve (112) is fixedly mounted to the bottom of the sliding mounting plate (2).

5. The variable pressure circulation type air-liquid heat dissipation device for a data center according to claim 3, characterized in that: The torsion swing drive assembly comprises a stepper motor (25), a drive disk (251), a toggle column (252), a drive frame (253) and a rack (254), wherein the stepper motor (25) is fixedly mounted at the bottom center of the sliding mounting plate (2), the output end of the stepper motor (25) passes through the sliding mounting plate (2) and extends to the top of the sliding mounting plate (2) and is fixedly connected to the drive disk (251), the toggle column (252) is fixedly mounted on the top of the drive disk (251) near the side of the drive frame (253), the drive frame (253) is provided with a sliding groove for slidingly cooperating with the toggle column (252), the rack (254) is fixedly mounted at both ends of the drive frame (253), and is meshed with gear 1 (23) and gear 2 (24), and guide units are fixedly mounted on both sides of the bottom of the drive frame (253).

6. The variable pressure circulation air-liquid heat dissipation device for a data center according to claim 3, characterized in that: The lifting and swinging staggered assembly includes an electromagnetic push rod (242), a lifting plate (241), a limiting ring (243), a limiting plate (245) and a limiting slide (246), wherein the electromagnetic push rod (242) is fixedly mounted on the back of the limiting plate (245), the limiting plate (245) is fixedly mounted on the rear side of the top of the sliding mounting plate (2) near the side of the gear 2 (24), the lifting plate (241) is fixedly mounted on the output end of the electromagnetic push rod (242), and the lifting plate (241) is rotatably sleeved on the limiting plate The surface of the ring (243) is fixedly mounted on the top of the surface of the linkage sleeve (244), the limiting slide (246) is fixedly mounted on both sides of the bottom of the lifting plate (241) close to the limiting plate (245), and is slidably matched with the limiting plate (245), and the surface of the linkage sleeve (244) is provided with a spring (247), the top of the spring (247) contacts the bottom of the limiting ring (243), and the bottom of the spring (247) contacts the top of the gear (244).

7. The variable pressure circulation type air-liquid heat dissipation device for a data center according to claim 5, characterized in that: The guide unit comprises a limiting slide (2531) and a limiting block (2532), wherein the limiting slide (2531) is fixedly mounted on both sides of the top of the sliding mounting plate (2), and the limiting block (2532) is fixedly mounted on both sides of the bottom of the driving frame (253) and is slidably engaged with the limiting slide (2531).

8. The variable pressure circulation air-liquid heat dissipation device for a data center according to claim 3, characterized in that: The air-liquid circulation mechanism comprises a heat dissipation water tank (3), a sealing cover (301), a heat dissipation fan (302), an air collecting cover (3021), a cooling air supply pipe (3022), an air supply hose (30221), a semiconductor refrigeration plate (303), a variable frequency speed regulating water pump (304), a return water three-way joint (3041) and a water supply three-way joint (3042). The heat dissipation water tank (3) is arranged on the top of the screw (111), and the two sides are fixedly installed with the fixing ears (102). The bottom of the heat dissipation water tank (3) is fixed with the fixing ears (102). The cooling fan (302) is provided with two groups and is symmetrically installed on both sides of the top of the cooling water tank (3). The sealing cover (301) is threadedly connected to the center of the top of the cooling water tank (3). The semiconductor refrigeration plate (303) is fixedly installed at the center of the back of the cooling water tank (3). The wind collecting cover (3021) is fixedly connected to the front of the cooling fan (302). One end of the cooling air supply pipe (3022) is connected to the wind collecting cover (3021). The other end passes through the cooling water tank (3) from top to bottom and extends to the bottom of the cooling water tank (3) and is connected to the water-cooling cooling arm (21) and the air-liquid mixed cooling arm (22) through a hose. The part of the cooling air supply pipe (3022) inside the cooling water tank (3) is made of a cooling material. The variable frequency speed regulating water pump (304) is fixedly installed at the center of the bottom of the inner wall of the cooling water tank (3). The output end of the variable frequency speed regulating water pump (304) passes through the cooling water tank (3) and extends to the bottom of the cooling water tank (3) and is connected to the cooling water tank (3). The water supply three-way joint (3042) is connected, and the other two ends of the water supply three-way joint (3042) are connected to the cooling coil (222) inside the water-cooled radiator arm (21) and the air-liquid mixed radiator arm (22) respectively through a hose. The bottom of the heat dissipation water tank (3) is connected to the return water three-way joint (3041) through a hose, and the other two ends of the return water three-way joint (3041) are connected to one end of the cooling coil (222) inside the water-cooled radiator arm (21) and the air-liquid mixed radiator arm (22) through a hose.

9. The variable pressure circulation type air-liquid heat dissipation device for a data center according to claim 8, characterized in that: The tops of the water-cooled heat dissipation arm (21) and the air-liquid mixed heat dissipation arm (22) are both provided with ventilation holes (211), and the ventilation holes (211) are provided with a plurality of groups of bottom hoses that cooperate with the cooling air supply pipe (3022) for air cooling and heat dissipation, and the tops of the air-liquid mixed heat dissipation arms (22) are fixedly provided with a plurality of groups of cleaning brushes (221).

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