A patch machine control method and system based on machine vision

Abstract

The present application relates to the technical field of chip mounter control, and provides a chip mounter control method and system based on machine vision, which comprises the following steps: obtaining corresponding solder paste area data by acquiring solder paste area images in stages in the staged mounting of the chip mounter through machine vision, and constructing a mounting pressure and solder paste area change relationship model according to the pressure data and the solder paste area data of each stage, wherein the relationship model reflects the current solder paste fluid characteristics; substituting the preset solder paste area requirements of each welding point into the mounting pressure and solder paste area change relationship model to obtain the second pressurizing pressure of the mounting of each welding point, and controlling the pressure of the mounting head corresponding to the welding point, so that the mounting pressure can be accurately controlled in the component mounting process of the chip mounter, the solder paste change in the pressure adaptation process is adapted, the mounting and subsequent welding efficiency is improved, and the production quality of the circuit board is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip mounter control, and particularly relates to a chip mounter control method and system based on machine vision. BACKGROUND

[0002] When the chip mounter is used to mount components on a PCB, the mounting pressure needs to be moderate so that each soldering point can be fully wetted by the solder paste. If the mounting pressure is too small, the soldering end or pin of the component will float on the surface of the solder paste, and the solder paste cannot firmly adhere to the component, so that the component is prone to move during transmission and reflow soldering. If the mounting pressure is too large, the solder paste will be squeezed out too much, which can easily cause the solder paste to stick together and form a bridge during reflow soldering. In severe cases, the component can be damaged. If the mounting pressure is too small or too large, the amount of solder paste squeezed out will be affected, and the mounting quality of the component will be affected. However, the state of the solder paste will change over time as the mounting process progresses. Therefore, it is difficult to meet the requirements by using a fixed mounting pressure to control the downward pressure of the mounting component, and it is difficult to ensure that the solder paste can fully wet each soldering point. This affects the mounting and subsequent soldering efficiency and reduces the product quality. SUMMARY

[0003] The present application provides a chip mounter control method based on machine vision, which is used to solve the problem that the mounting pressure control of the chip mounter in the prior art cannot meet the characteristics of the solder paste.

[0004] The first aspect of the present application provides a chip mounter control method based on machine vision, comprising:

[0005] A light pressure signal is sent, and after receiving the pressure feedback signal, a first solder paste contour area image is obtained based on the machine vision system, and first solder paste area data is obtained. After a mounting pressure signal is sent, a second solder paste contour image is obtained, and second solder paste area data is obtained.

[0006] The light pressure and the first pressure data are obtained, and a mounting pressure and solder paste area change relationship model is constructed according to the first solder paste area data and the second solder paste area data.

[0007] The preset solder paste area requirement of each soldering point is substituted into the mounting pressure and solder paste area change relationship model to obtain the second pressure of each soldering point mounting, and the pressure of the mounting head corresponding to the soldering point is controlled.

[0008] Optionally, the first solder paste area data is extracted, and specifically:

[0009] The solder paste printing amount of the soldering point is obtained, and the solder paste non-pressing area is calculated according to the solder paste printing amount in a preset proportion. The first solder paste area in the first solder paste contour area image is identified, and the first solder paste extrusion area is obtained by subtracting the non-pressing area from the first solder paste area.

[0010] The second solder paste area data is obtained by identifying a second solder paste area in the second solder paste contour area image and subtracting the first solder paste area from the second solder paste area to obtain a second solder paste extrusion area.

[0011] Optionally, before the sending of the patch light pressure signal, the method further comprises:

[0012] The position of each solder joint of the mounted component and the mounting head control data are obtained, the mounting head control parameters corresponding to each solder joint are constructed, and the mounting head control scheme corresponding to each solder joint is obtained.

[0013] The pressure control of the mounting head corresponding to each solder joint further comprises: identifying the second pressurizing pressure range of each solder joint, identifying the pressurizing pressure of each solder joint that can meet the mounting head control scheme in the second pressurizing pressure range, obtaining the third pressurizing pressure of each solder joint, and setting the execution order and the pressurizing pressure of the control scheme of each solder joint.

[0014] The second aspect of the present application provides a patch machine control system based on machine vision, comprising:

[0015] The machine vision processing module is configured to send a patch light pressure signal, obtain a first solder paste contour area image based on a machine vision system after receiving a pressure feedback signal, and obtain first solder paste area data; obtain a second solder paste contour image after sending a patch pressurizing signal, and obtain second solder paste area data.

[0016] The relationship model construction module is configured to obtain light pressure and first pressurizing pressure data, and construct a mounting pressure and solder paste area change relationship model according to the first solder paste area data and the second solder paste area data.

[0017] The patch machine control module is configured to substitute the preset solder paste area requirement of each solder joint into the mounting pressure and solder paste area change relationship model to obtain the second pressurizing pressure of each solder joint, and control the pressure of the mounting head corresponding to each solder joint.

[0018] Optionally, in the machine vision processing module, the first solder paste area data is obtained by:

[0019] The solder paste printing amount of each solder joint is obtained, and the solder paste non-pressurized area is calculated according to the solder paste printing amount; the first solder paste area in the first solder paste contour area image is identified, and the first solder paste extrusion area is obtained by subtracting the non-pressurized area from the first solder paste area.

[0020] The second solder paste area data is obtained by identifying a second solder paste area in the second solder paste contour area image and subtracting the first solder paste area from the second solder paste area to obtain a second solder paste extrusion area.

[0021] Optionally, before sending the patch light pressure signal, the machine vision processing module further comprises:

[0022] The position of each soldering point of the mounted component and the mounting head control data are acquired, the mounting head control parameters corresponding to each soldering point are constructed, and the mounting head control scheme corresponding to each soldering point is obtained.

[0023] In the patch machine control module, the pressure of the mounting head corresponding to each soldering point is controlled, and specifically further comprises: according to the second pressure range of each soldering point, identifying the pressure of each soldering point that can meet the mounting head control scheme in the second pressure range, obtaining the third pressure of each soldering point, and setting the execution order and pressure of each soldering point control scheme.

[0024] The third aspect of the present application provides a patch machine control method and device based on machine vision, the device comprising a processor and a memory:

[0025] The memory is used to store program code and transmit the program code to the processor;

[0026] The processor is used to execute the method according to the instructions in the program code.

[0027] The fourth aspect of the present application provides a computer readable storage medium, which is used to store program code, and the program code is used to execute the method according to any one of the first aspect of the present application.

[0028] From the above technical solutions, the present application has the following advantages: the machine vision is used to obtain the corresponding solder paste area data by obtaining the solder paste area image in the patch machine stage type mounting in stages, and the mounting pressure and solder paste area change relationship model is constructed according to the pressure data and solder paste area data of each stage, and the relationship model reflects the current solder paste fluid characteristics; the preset solder paste area requirement of each soldering point is substituted into the mounting pressure and solder paste area change relationship model, the second pressure of each soldering point is obtained, the pressure of the mounting head corresponding to each soldering point is controlled, the mounting pressure can be accurately controlled in the process of mounting the component by the patch machine, the solder paste change in the pressure adaptation process is adapted, the patching and subsequent welding efficiency is improved, and the production quality of the circuit board is improved. BRIEF DESCRIPTION OF DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required by the embodiments or the prior art description. Obviously, the drawings described below only illustrate some of the embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0030] Figure 1 A flow chart of a patch machine control method based on machine vision;

[0031] Figure 2 A structure diagram of a patch machine control system based on machine vision. DETAILED DESCRIPTION

[0032] In order to make the purposes, features and advantages of the present application more obvious and easy to understand, the technical solutions in the embodiments of the present application will be described clearly and completely in combination with the drawings of the embodiments of the present application. Obviously, the embodiments described below are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of the present application.

[0033] The present application provides a patch machine control method based on machine vision, which is used to solve the problem that the patch machine mounting and pasting down pressure control is difficult to meet the characteristics of solder paste in the prior art.

[0034] Please refer to Figure 1 , Figure 1 A first flow chart of a patch machine control method based on machine vision provided by the embodiments of the present application.

[0035] S100, a patch light pressure signal is sent, a first solder paste contour area image is acquired based on a machine vision system after receiving a pressure feedback signal, and first solder paste area data is acquired; a second solder paste contour image is acquired after a patch press signal is sent, and second solder paste area data is acquired;

[0036] It should be noted that before the patch machine performs the patching operation, the solder paste printing step will be performed first, the solder paste is brushed and printed on the pad, and then the mounted component is attached to the PCB in the patching step, and the pins are attached to the corresponding pads; the patch machine in the embodiment will adopt a phased mounting mode for high-density solder joint components, after sending the patch light pressure signal, the suction nozzle part of the patch machine will adsorb the mounted component at the attachment position under a preset light pressure, which is generally about 0.5N, which can be set according to the actual type of mounted component or solder paste. The purpose of the light pressure step in the phased mounting is to preliminarily position the mounted component on the pad, and temporarily fix the component by using the viscosity of the solder paste;

[0037] After sending the light pressure signal and receiving the pressure feedback signal, it indicates that the component is pressed on the solder paste at this moment with light pressure. The pressure sensor can be used to detect the reaction force of the mounting head. When the component is pressed, the solder paste will spread around the pad, the coverage area will increase and the height will decrease. At this time, the CMOS camera of the machine vision system can be used to capture the image of the solder paste under pressure, obtain the first solder paste contour area image, and identify the solder paste contour area in the image through the image processing part of the machine vision to obtain the area or the number of pixel points of the region, and obtain the first solder paste area data. After the light pressure stage of the phased mounting, the pressure mounting is carried out again. The pressure here is the preset target mounting pressure, which is generally 0.5-5N. When the pressure mounting is carried out, the machine vision is used to obtain the further pressure change image of the solder paste, obtain the second solder paste contour area image, identify the solder paste contour area through the image processing of the machine vision, obtain the area or the number of pixel points of the region, and obtain the second solder paste area data. The second solder paste area contour is pressed, the solder paste spreads around the pad, and the contour area is larger.

[0038] S200, obtaining light pressure and first pressure data, and constructing a mounting pressure and solder paste area change relationship model according to the first solder paste area data and the second solder paste area data;

[0039] It should be noted that the light pressure corresponds to the mounting pressure when the light pressure signal is sent, and the first pressure corresponds to the mounting pressure when the pressure signal is sent. There is a certain relationship between the mounting pressure and the solder paste area. The greater the mounting pressure, the greater the solder paste extrusion, and the greater the solder paste area. The corresponding paste flow dynamics function model can be set according to the type of solder paste. The solder paste, such as tin paste, is a typical non-Newtonian fluid. The Herschel-Bulkley model can be used to describe the rheological behavior of non-Newtonian fluid. The mounting pressure is replaced by shear stress. The first solder paste area data corresponding to the light pressure and the second solder paste area data corresponding to the first pressure are used to correct the paste flow dynamics function model, and the mounting pressure and the solder paste area change relationship model is constructed.

[0040] S300, substituting the preset solder paste area requirement of each welding point into the mounting pressure and solder paste area change relationship model to obtain the second pressure of each welding point mounting, and controlling the pressure of the mounting head corresponding to the welding point.

[0041] It should be noted that the mounting pressure and solder paste area change relationship model constructed in the foregoing steps can reflect the degree of solder paste diffusion and extension under different mounting pressures in the current solder paste state, and it is difficult for the naked eye to observe the millimeter-level solder paste diffusion, and it is more prone to errors to identify the solder pads on the PCB with the naked eye; the preset solder paste area requirement at each solder joint is substituted into the relationship model to obtain the corresponding mounting pressure, and the solder paste coverage of the pad area is usually required to be 75%-90%, and the corresponding solder paste area requirement can be set according to the pad size at each solder joint, so as to obtain the second pressing pressure required by the solder joint in the relationship model, and the second pressing pressure data is sent to the mounting head corresponding to the solder joint for pressure control.

[0042] In the embodiment, the corresponding solder paste area data is obtained by acquiring the solder paste area image in stages in the stage mounting of the placement machine through machine vision, and the mounting pressure and solder paste area change relationship model is constructed according to the pressure data and the solder paste area data of each stage, and the relationship model reflects the current solder paste fluid characteristics; the preset solder paste area requirement of each solder joint is substituted into the mounting pressure and solder paste area change relationship model to obtain the second pressing pressure of each solder joint mounting, and the pressure control is performed on the mounting head corresponding to the solder joint, so that the mounting pressure can be accurately controlled in the component mounting process of the placement machine, the solder paste change in the pressure adaptation process is improved, the placement and subsequent welding efficiency are improved, and the production quality of the circuit board is improved.

[0043] The foregoing is a detailed description of a first embodiment of a placement machine control method based on machine vision provided by the present application, and the following is a detailed description of a second embodiment of a placement machine control method based on machine vision provided by the present application.

[0044] In the embodiment, a placement machine control method based on machine vision is further provided, and in the foregoing step S100, the first solder paste area data is extracted, specifically:

[0045] The solder paste printing amount of the solder joint is obtained, and the solder paste non-pressing area is calculated according to the solder paste printing amount in a preset proportion; the first solder paste area in the first solder paste contour area image is identified, and the first solder paste extrusion area is obtained by subtracting the non-pressing area from the first solder paste area;

[0046] The second solder paste area data is obtained, specifically: the second solder paste area in the second solder paste contour area image is identified, and the second solder paste extrusion area is obtained by subtracting the first solder paste area from the second solder paste area;

[0047] It should be noted that according to the different welding requirements corresponding to the welding points, the pad and the solder paste printing amount are also different, and the area of the solder paste without pressure is also different. The greater the solder paste printing amount, the greater the area of the solder paste without pressure. The solder paste is usually a spherical point on the pad during printing. The spherical particles of the solder paste help it to be uniformly distributed and smoothly pass through the template during printing, ensuring that the solder paste can be uniformly printed on the PCB pad. According to the solder paste printing amount, that is, the corresponding spherical volume, the area of the solder paste without pressure is calculated according to the ratio of the spherical volume to the cross-sectional area. The solder paste extrusion area can be obtained by subtracting the area of the solder paste without pressure from the first solder paste area. The solder paste extrusion amount under light pressure is obtained, and the solder paste is considered to be re-mounted under the pressure of the light pressure during the pressure mounting stage. Therefore, the solder paste extrusion amount under the pressure of the light pressure is obtained by subtracting the first solder paste area from the second solder paste area, and the second solder paste area data is obtained.

[0048] The size of the pad is generally in millimeter level, and the area ratio of the solder paste printed on the pad should be more than 75%. The measurement and recognition accuracy of machine vision can reach micrometer level, so the change of the solder paste distribution area can be accurately recognized.

[0049] Further, before the step S100 of sending the light pressure mounting signal, the method further comprises the steps of:

[0050] Obtaining the position of each welding point of the mounted component and the mounting head control data, constructing the mounting head control parameters corresponding to each welding point, and obtaining the mounting head control scheme corresponding to each welding point.

[0051] In the step S300, the pressure control of the mounting head corresponding to the welding point further comprises the steps of:

[0052] According to the second pressure range of each welding point mounting, the pressure of each welding point that can meet the mounting head control scheme in the second pressure range is identified, the third pressure of each welding point is obtained, and the execution order and the pressure of each welding point control scheme are set.

[0053] It should be noted that each soldering point needs to correspond to a solder paste printing position, i.e. a solder pad, so as to ensure that the solder paste can form an independent soldering point after melting; for a multi-soldering-point mounted component, a modular mounting head can be used, and a plurality of independent nozzles or a multi-degree-of-freedom array nozzle combination can be configured to control the pressure of the mounted component on each soldering point and to perform differential pressure control; however, for a mounted component with high-density soldering points, the number of nozzles is less than the number of soldering points, and at this time, the nozzles of the mounting head need to be set for multi-stage mounting control, and a plurality of soldering points are controlled to be pressed at the same time each time, so that the mounting head control scheme corresponding to the soldering points can be obtained based on the position of the soldering points and the mounting head control data, and each control scheme is which soldering points can be controlled to be pressed by which nozzle array of the mounting head to form a scheme feature in which a plurality of soldering points are pressed in association, but although the pressures of a plurality of soldering points in the same control scheme are consistent, the solder paste printing amounts of these soldering points are different and the solder paste areas required for mounting are also different, so the second pressing force range corresponding to each soldering point can be set according to the solder paste covering pad area required on the pad of each soldering point, and each soldering point can meet the uniform pressing relationship of the soldering points in the control scheme within the second pressing force range, and each mounting head control scheme is sequentially mounted and pressed according to the third pressing force allowed by the corresponding soldering point, so that each soldering point in the multi-soldering-point mounted component can be completed with the best mounting pressure.

[0054] The above is a detailed description of a machine vision-based mounting machine control method of the first aspect of the present application, and the following is a detailed description of an embodiment of a machine vision-based mounting machine control system provided by the second aspect of the present application.

[0055] Please refer to Figure 2 , Figure 2 It is a structure diagram of a machine vision-based mounting machine control system. The embodiment provides a machine vision-based mounting machine control system, which comprises:

[0056] The machine vision processing module 10 is used to send a mounting light pressure signal, acquire a first solder paste contour area image based on a machine vision system and acquire first solder paste area data after receiving a pressure feedback signal, acquire a second solder paste contour image after sending a mounting pressing signal, and acquire second solder paste area data;

[0057] The relationship model construction module 20 is used to acquire light pressure and first pressing force data, and construct a mounting pressure and solder paste area change relationship model according to the first solder paste area data and the second solder paste area data;

[0058] The patch machine control module 30 is used for substituting the preset solder paste area requirement of each solder joint into the patch pressure and solder paste area change relation model to obtain the second pressing pressure of each solder joint patching, and the pressure control is performed on the patch head corresponding to the solder joint.

[0059] Further, in the machine vision processing module 10, the first solder paste area data is extracted, specifically:

[0060] The solder paste printing amount of the solder joint is obtained, and the solder paste non-pressing area is calculated according to the solder paste printing amount in a preset proportion; the first solder paste area in the first solder paste contour area image is identified, and the first solder paste extrusion area is obtained by subtracting the non-pressing area from the first solder paste area.

[0061] The second solder paste area data is obtained by identifying the second solder paste area in the second solder paste contour area image, and the second solder paste extrusion area is obtained by subtracting the first solder paste area from the second solder paste area.

[0062] Further, before the machine vision processing module 10 sends the patch light pressure signal, it further includes:

[0063] The position of each solder joint of the patch component and the patch head control data are obtained, the patch head control parameters corresponding to each solder joint are constructed, and the patch head control scheme corresponding to the solder joint is obtained.

[0064] The patch machine control module 30 controls the pressure of the patch head corresponding to the solder joint, and specifically further includes: according to the second pressing pressure range of each solder joint, identifying the pressing pressure of each solder joint that can meet the patch head control scheme in the second pressing pressure range, obtaining the third pressing pressure of each solder joint, and setting the execution order and pressing pressure of the control scheme of each solder joint.

[0065] The third aspect of the present application further provides a patch machine control method and device based on machine vision, including a processor and a memory: the memory is used for storing program code and transmitting the program code to the processor; the processor is used for executing the above-mentioned patch machine control method based on machine vision according to the instructions in the program code.

[0066] The fourth aspect of the present application provides a computer readable storage medium, characterized in that the computer readable storage medium is used for storing program code, and the program code is used for executing the above-mentioned patch machine control method based on machine vision.

[0067] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working process of the above-mentioned device and equipment can refer to the corresponding process in the foregoing method embodiments, which will not be described here.

[0068] In several embodiments provided in the present application, it should be understood that the disclosed system, device and method can be implemented in other manners. For example, the described device embodiments are merely schematic. For example, the division of the units is only a logical function division. There can be another division manner for the actual implementation, for example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the displayed or discussed mutual couplings or direct couplings or communication connections between different units, can be indirect couplings or communication connections through some interfaces, devices or units, and can be electrical, mechanical or in other forms.

[0069] The units described as separate components can or can not be physically separate, and the components shown as units can or can not be physical units, i.e., can be located in one place, or can be distributed on multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the embodiment.

[0070] In addition, each functional unit in each embodiment of the present application can be integrated into a processing unit, or each unit can be physically present separately, or two or more units can be integrated into one unit. The integrated unit can be realized in the form of hardware or in the form of a software functional unit.

[0071] The integrated unit, if realized in the form of a software functional unit and sold or used as an independent product, can be stored in a computer readable storage medium. Based on this understanding, the technical solutions of the present application essentially or the part of the prior art that contributes to the technical solutions or all or part of the technical solutions can be embodied in the form of a software product. The computer software product is stored in a storage medium, and includes a plurality of instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM, Read-Only Memory), a random access memory (RAM, Random Access Memory), a magnetic disk or an optical disk, and various media that can store program codes.

[0072] The above embodiments are merely used to illustrate the technical solutions of the present application, rather than limit them. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent replacements to some technical features. Such modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A machine vision-based placement machine control method, characterized by The method comprises the following steps: sending a patch light pressure signal, obtaining a first solder paste contour area image based on a machine vision system after receiving a pressure feedback signal, and obtaining first solder paste area data; obtaining a second solder paste contour image after sending a patch pressure signal, and obtaining second solder paste area data; obtaining light pressure and first pressure data, and constructing a patch pressure and solder paste area change relationship model according to the first solder paste area data and the second solder paste area data; substituting the preset solder paste area requirement of each welding point into the patch pressure and solder paste area change relationship model to obtain the second pressure of each welding point, and controlling the pressure of the corresponding patch head of the welding point.

2. The machine vision-based patch placement machine control method of claim 1, wherein, The first solder paste area data is obtained in detail as follows: obtaining the solder paste printing amount of the welding point, obtaining the non-pressured area of the solder paste according to the solder paste printing amount, identifying the first solder paste area in the first solder paste contour area image, and obtaining the first solder paste extrusion area by subtracting the non-pressured area from the first solder paste area; The second solder paste area data is obtained in detail as follows: identifying the second solder paste area in the second solder paste contour area image, and obtaining the second solder paste extrusion area by subtracting the first solder paste area from the second solder paste area.

3. The machine vision-based patch placement machine control method of claim 1, wherein, Before the patch light pressure signal is sent, the following steps are further included: obtaining the position of each welding point of the patch component and the patch head control data, constructing the patch head control parameter corresponding to each welding point, and obtaining the patch head control scheme corresponding to the welding point; The pressure control of the patch head corresponding to the welding point further comprises the following steps: identifying the pressure of each welding point in the second pressure range that can meet the patch head control scheme according to the second pressure range of each welding point, obtaining the third pressure of each welding point, and setting the execution order and pressure of the control scheme of each welding point.

4. A machine vision based placement machine control system, characterized by, The method comprises the following steps: a machine vision processing module for sending a patch light pressure signal, obtaining a first solder paste contour area image based on a machine vision system after receiving a pressure feedback signal, and obtaining first solder paste area data; obtaining a second solder paste contour image after sending a patch pressure signal, and obtaining second solder paste area data; a relationship model construction module for obtaining light pressure and first pressure data, and constructing a patch pressure and solder paste area change relationship model according to the first solder paste area data and the second solder paste area data; a patch machine control module for substituting the preset solder paste area requirement of each welding point into the patch pressure and solder paste area change relationship model to obtain the second pressure of each welding point, and controlling the pressure of the corresponding patch head of the welding point.

5. The machine vision-based placement machine control system of claim 4, wherein, In the machine vision processing module, the first solder paste area data is obtained in detail as follows: obtaining the solder paste printing amount of the welding point, obtaining the non-pressured area of the solder paste according to the solder paste printing amount, identifying the first solder paste area in the first solder paste contour area image, and obtaining the first solder paste extrusion area by subtracting the non-pressured area from the first solder paste area; The second solder paste area data is obtained, specifically, a second solder paste area in a second solder paste contour area image is identified, and a second solder paste extrusion area is obtained by subtracting the first solder paste area from the second solder paste area.

6. The machine vision-based placement machine control system of claim 4, wherein, Before the light pressing signal of the patch is sent, the machine vision processing module further comprises the following steps: The position of each soldering point of the mounted component and the mounting head control data are obtained, the mounting head control parameters corresponding to each soldering point are constructed, and the mounting head control scheme corresponding to the soldering point is obtained; The patch machine control module further comprises the following steps: according to the second pressing pressure range of each soldering point, the pressing pressure of each soldering point that can meet the mounting head control scheme in the second pressing pressure range is identified, the third pressing pressure of each soldering point is obtained, and the execution order and the pressing pressure of the control scheme of each soldering point are set.

7. A machine vision-based placement machine control apparatus, characterized by, The device comprises a processor and a memory: The memory is used for storing program code and transmitting the program code to the processor; The processor is used for executing the machine vision-based patch machine control method according to the instructions in the program code.

8. A computer-readable storage medium, characterized in that, The computer readable storage medium is used for storing program code, and the program code is used for executing the machine vision-based patch machine control method. The computer readable storage medium is used for storing program code, and the program code is used for executing the machine vision-based patch machine control method.

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