Apparatus for manufacturing display device

Abstract

An apparatus for manufacturing a display apparatus includes: a process section including a plurality of deposition sections performing a deposition process of depositing a deposition material on a display substrate and a cleaning process of cleaning an interior; and a controller for controlling the process part.

Description

[0001] This application claims priority to Korean Patent Application No. 10-2024-0030911, filed on March 4, 2024, and all benefits arising therefrom, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0002] Embodiments relate to devices, and more particularly, to devices for manufacturing display devices. Background Art

[0003] Mobile electronic devices are widely used. As mobile electronic devices, tablet personal computers and miniaturized electronic devices such as mobile phones are being widely used recently.

[0004] Mobile electronic devices include display devices to support various functions, such as providing visual information such as images to users. Recently, as components driving display devices are becoming increasingly miniaturized, the proportion of display devices in electronic devices is gradually increasing, and structures that can be bent from a flat state to form a predetermined angle are also being developed.

[0005] In the process of manufacturing a display device, a deposition process is required to deposit a deposition material on a substrate, and a cleaning process is also required to clean the interior of the deposition portion at a predetermined period. Summary of the Invention

[0006] An embodiment includes generating a schedule for each of a plurality of deposition sections such that the number of deposition sections performing a cleaning process simultaneously is reduced.

[0007] However, such technical features are merely examples, and the present disclosure is not limited thereto.

[0008] Additional features will be set forth in part in the description which follows and, in part, will be apparent from the description, or may be learned by practice of the presented embodiments of the disclosure.

[0009] In an embodiment of the present disclosure, an apparatus for manufacturing a display device includes: a process section including a plurality of deposition sections that perform a deposition process for depositing a deposition material on a display substrate and a cleaning process for cleaning the interiors of the plurality of deposition sections; and a controller that controls the process section. The controller includes: an initial scheduler that generates an initial schedule such that each of the plurality of deposition sections performs the deposition process A times (A is a natural number greater than 0) and then performs the cleaning process once; a determination section that determines whether the initial schedule satisfies a first condition that the number of deposition sections that simultaneously perform the cleaning process is B or less (B is a natural number greater than 0); an executor that, when the initial schedule satisfies the first condition, operates the plurality of deposition sections based on the initial schedule; and a modifier that, when the initial schedule does not satisfy the first condition, modifies the initial schedule to a first modified schedule such that one of the plurality of deposition sections that simultaneously perform the cleaning process performs the deposition process A-1 times and then performs the cleaning process once.

[0010] In an embodiment, the determination part may determine whether the first modification schedule satisfies a first condition, and the executor may operate the plurality of deposition parts based on the first modification schedule when the first modification schedule satisfies the first condition.

[0011] In an embodiment, the modifier may modify the initial schedule to a first modified schedule when the initial schedule does not satisfy the first condition so that another deposition part among the plurality of deposition parts simultaneously performing the cleaning process performs the deposition process A-2 times and then performs the cleaning process once.

[0012] In an embodiment, A may be approximately 7.

[0013] In an embodiment, B may be approximately 2.

[0014] In an embodiment, the plurality of deposition parts may be provided as eight.

[0015] In an embodiment of the present disclosure, an apparatus for manufacturing a display device includes: a first process part, including a plurality of first deposition parts, the plurality of first deposition parts performing a deposition process of depositing a deposition material on a display substrate and a first cleaning process of cleaning the interiors of the plurality of first deposition parts; a second process part, including a plurality of second deposition parts, the plurality of second deposition parts performing a deposition process and a second cleaning process of cleaning the interiors of the plurality of second deposition parts; and a controller, including: a first controller, controlling the first process part; and a second controller, controlling the second process part. The first controller includes: a first initial scheduler, which generates a first initial schedule so that each of the multiple first deposition parts performs the deposition process A times (A is a natural number greater than 0) and then performs the first cleaning process once; a first determination part, which determines whether the first initial schedule satisfies a first-1 condition that the number of first deposition parts that simultaneously perform the first cleaning process is less than B (B is a natural number greater than 0); a first executor, which operates the multiple first deposition parts based on the first initial schedule when the first initial schedule satisfies the first-1 condition; and a first modifier, which modifies the first initial schedule to a first-1 modified schedule when the first initial schedule does not satisfy the first-1 condition, so that one of the multiple first deposition parts that simultaneously perform the first cleaning process performs the deposition process A-1 times and then performs the first cleaning process once.

[0016] In an embodiment, the first determining part may determine whether the first-1 modification schedule satisfies the first-1 condition, and the first executor may operate the plurality of first depositing parts based on the first-1 modification schedule when the first-1 modification schedule satisfies the first-1 condition.

[0017] In an embodiment, A may be approximately 7.

[0018] In an embodiment, B may be approximately 1.

[0019] In an embodiment, the plurality of first deposition parts may be provided as five.

[0020] In an embodiment, the second controller may include: a second initial scheduler that generates a second initial schedule so that each of the multiple second deposition parts performs the deposition process A times and then performs the second cleaning process once; a second determination part that determines whether the second initial schedule satisfies a second-1 condition that the number of second deposition parts that simultaneously perform the second cleaning process is less than B; a second executor that operates the multiple second deposition parts based on the second initial schedule when the second initial schedule satisfies the second-1 condition; and a second modifier that modifies the second initial schedule to a second-1 modified schedule when the second initial schedule does not satisfy the second-1 condition so that one of the multiple second deposition parts that simultaneously perform the second cleaning process performs the deposition process A-1 times and then performs the second cleaning process once.

[0021] In an embodiment, the second determining part may determine whether the second-1 modification schedule satisfies the second-1 condition, and the second executor may operate the plurality of second depositing parts based on the second-1 modification schedule when the second-1 modification schedule satisfies the second-1 condition.

[0022] In an embodiment, the plurality of second deposition parts may be provided as five.

[0023] In embodiments, the deposition process may be performed by one of a plurality of first deposition parts and a plurality of second deposition parts.

[0024] These and / or other features will become apparent and more readily understood from the following detailed description of the embodiments, the accompanying drawings, and the claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The above and other features and advantages of illustrative embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0026] Figure 1 is a schematic plan view of an embodiment of an apparatus for manufacturing a display device;

[0027] Figure 2 is a schematic cross-sectional view of an embodiment of a deposition portion;

[0028] Figure 3 is a block diagram of an embodiment of a controller;

[0029] Figure 4 is a flowchart illustrating an embodiment of a method of manufacturing a display device;

[0030] Figure 5 is a view of an embodiment of the initial timeline;

[0031] Figure 6is a view of an embodiment of a first modification schedule;

[0032] Figure 7 is a schematic plan view of an embodiment of an apparatus for manufacturing a display device;

[0033] Figure 8 is a block diagram of an embodiment of a controller;

[0034] Figure 9 is a flowchart illustrating an embodiment of a method of manufacturing a display device;

[0035] Figure 10 is a schematic plan view of an embodiment of a display device;

[0036] Figure 11 is a schematic cross-sectional view of an embodiment of a display device; and

[0037] Figure 12 is an equivalent circuit diagram of an embodiment of a pixel of a display device. DETAILED DESCRIPTION

[0038] The embodiments illustrated in the accompanying drawings will now be described in detail with reference to their illustrative embodiments, wherein the same reference numerals refer to the same elements throughout. In this regard, the illustrated embodiments may have different forms and should not be construed as being limited to the description set forth herein. Accordingly, the following description of the embodiments is provided solely by reference to the accompanying drawings to illustrate the features described. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. Throughout the disclosure, the expression "at least one of a, b, and c" indicates only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or variations thereof.

[0039] Since the present disclosure allows for various changes and numerous embodiments, illustrative embodiments will be illustrated in the accompanying drawings and described in the written description. The effects and features of the present disclosure and methods for achieving them will be explained with reference to the embodiments described in detail below with reference to the accompanying drawings. However, the present disclosure is not limited to the following embodiments and can be implemented in various forms.

[0040] Hereinafter, embodiments will be described with reference to the accompanying drawings, wherein like reference numerals refer to like elements throughout and repeated descriptions thereof will be omitted.

[0041] Although terms such as "first" and "second" may be used to describe various elements, these elements must not be limited to the above terms. The above terms are used to distinguish one element from another.

[0042] As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.

[0043] It will be understood that as used herein, the terms “comprises” and / or “comprising” and variations thereof specify the presence of stated features or elements, but do not preclude the addition of one or more other features or elements.

[0044] It will be further understood that when a layer, region or element is referred to as being "on" another layer, region or element, it can be directly or indirectly on the other layer, region or element. That is, for example, intervening layers, regions or elements may be present.

[0045] For the convenience of explanation, the size of the elements in the drawings may be exaggerated or reduced. As an example, for the convenience of description, the size and thickness of each element shown in the drawings are arbitrarily represented, and therefore, the present disclosure is not necessarily limited thereto.

[0046] The x-axis, y-axis, and z-axis are not limited to the three axes of the rectangular coordinate system and can be interpreted in a broad sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or can represent different orientations that are not perpendicular to each other.

[0047] Where the illustrative embodiments may be implemented differently, a particular order of processes may be performed in an order different from that described. As an example, two processes described in succession may be performed substantially simultaneously or in a reverse order.

[0048] As used herein, "about" or "approximately" includes the stated value and means within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art, taking into account the measurements in question and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, the term "about" can mean within one or more standard deviations, or within ±30%, 20%, 10%, 5% of the stated value.

[0049] As used herein, the term "controller" is intended to mean a hardware component that performs a predetermined function. For example, the hardware component may include a circuit such as a field programmable gate array (FPGA) or an application specific integrated circuit (ASIC).

[0050] Figure 1 is a schematic plan view of an embodiment of an apparatus 1 for manufacturing a display device.

[0051] refer to Figure 1 , an apparatus 1 for manufacturing a display device may include a process portion 11 and a controller (eg, Figure 3 Specifically, the process section 11 may include a loading section 111 , a transport section 112 , and a deposition section 113 .

[0052] The loading portion 111 may serve as an entrance of the apparatus 1 for manufacturing a display device, and a display substrate DS may be loaded from the outside into the loading portion 111. The loading portion 111 may be connected to the conveying portion 112. The display substrate DS may be transferred to the conveying portion 112 through the loading portion 111.

[0053] The internal pressure of the loading section 111 can be adjusted to be equal to or similar to atmospheric pressure. In an alternative embodiment, the internal pressure of the loading section 111 can be adjusted to be equal to or similar to a vacuum state. In an embodiment, when the display substrate DS is loaded from the outside, the pressure of the loading section 111 can be adjusted to be equal to or similar to atmospheric pressure. In addition, when the display substrate DS is transferred to the transport section 112, the pressure of the loading section 111 can be adjusted to be equal to or similar to a vacuum state.

[0054] The conveyor section 112 may be connected to the loading section 111 and the deposition section 113. The conveyor section 112 may receive or transfer a display substrate DS from the deposition section 113 or the loading section 111. In this case, the conveyor section 112 may include a robot arm 1121. The robot arm 1121 may transfer the display substrate DS from the loading section 111 to the conveyor section 112. Furthermore, the robot arm 1121 may transfer the display substrate DS from the conveyor section 112 to the deposition section 113, or transfer a display substrate DS after a process is completed from the deposition section 113 to the conveyor section 112.

[0055] The deposition section 113 can perform a deposition process and a cleaning process. The deposition process may be a process of depositing a deposition material on the display substrate DS. The cleaning process may be a process of cleaning the interior of the deposition section 113. Multiple deposition sections 113 may be provided. Multiple deposition sections 113 may perform the same deposition process. Accordingly, the deposition material may be deposited on the display substrate DS by one of the multiple deposition sections 113. The deposition section 113 may be connected to the transport section 112. In other words, each of the multiple deposition sections 113 may be connected to the transport section 112.

[0056] In an embodiment, eight deposition sections 113 may be provided. In an embodiment, the plurality of deposition sections 113 may include a first-1 deposition section 1131, a first-2 deposition section 1132, a first-3 deposition section 1133, a first-4 deposition section 1134, a first-5 deposition section 1135, a first-6 deposition section 1136, a first-7 deposition section 1137, and a first-8 deposition section 1138. The plurality of deposition sections 113 may be arranged circumferentially around the transport section 112. The plurality of deposition sections 113 may be arranged within a radius of the robotic arm 1121. However, this is provided as one embodiment, and the number and arrangement of the deposition sections 113 are not limited thereto.

[0057] The deposition process for manufacturing the display device may be performed by the deposition part 113. In one embodiment, chemical vapor deposition (CVD) may be performed in the deposition part 113. In another embodiment, plasma enhanced chemical vapor deposition (PECVD) may be performed in the deposition part 113. In another embodiment, atomic layer deposition (ALD) or plasma enhanced atomic layer deposition (PEALD) may be performed in the deposition part 113.

[0058] Here, the display substrate DS may be a display device being manufactured. The display substrate DS may include glass, or a polymer resin such as polyethersulfone, polyarylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyimide, polycarbonate, triacetyl cellulose (TAC), or cellulose acetate propionate.

[0059] In an embodiment, the display substrate DS may be a mother substrate for a group of unit regions. In this case, each unit region may be a display device being manufactured. The display substrate DS may be separated by a cutting process. In an embodiment, the display substrate DS may be separated into a plurality of partial substrates. In an embodiment, a partial substrate may be a substrate in which the display substrate DS is split in half. In an alternative embodiment, the display substrate DS may be separated along the unit regions. In an embodiment, the entire display substrate DS may be a display device being manufactured.

[0060] In an embodiment, the display substrate DS may be laser cut by a laser device. In another embodiment, the display substrate DS may be cut by a knife.

[0061] The controller can control the process part 11. In an embodiment, the controller can control each of the plurality of deposition parts 113. Figures 2 to 6 Describe the controller in detail.

[0062] A process in which a deposition material is deposited on a display substrate DS is described. The display substrate DS can be loaded from the outside into the loading section 111. The display substrate DS loaded into the loading section 111 can be transferred to the transport section 112. The transport section 112 can transfer the display substrate DS to one of the plurality of deposition sections 113. When the deposition process for the display substrate DS is completed at one of the plurality of deposition sections 113, the transport section 112 can receive another display substrate DS. The display substrate DS after the deposition process is completed can be transported to the outside through the loading section 111.

[0063] Figure 2 is a schematic cross-sectional view of an embodiment of the deposition portion 113 .

[0064] The deposition part 113 may include a chamber 10 , a first support 20 , a second support 30 , a mask assembly 40 , a deposition source 50 , a magnetic part 60 , a vision part 70 , and a pressure adjuster 80 .

[0065] A space may be defined within the chamber 10. The display substrate DS and the mask assembly 40 may be accommodated in the space. In this case, a portion of the chamber 10 may be open. The gate valve 101 may be installed in the open portion of the chamber 10. In this case, the open portion of the chamber 10 may be opened or closed according to the operation of the gate valve 101.

[0066] In this case, the display substrate DS may refer to a substrate 100 (refer to FIG. Figure 11 ) on which at least one of an organic layer, an inorganic layer, and a metal layer is deposited. In an alternative embodiment, the display substrate DS may be a substrate 100 (refer to FIG. 1 ) on which at least one of an organic layer, an inorganic layer, and a metal layer is not deposited. Figure 11 ).

[0067] The first support member 20 can support the display substrate DS. In this case, the first support member 20 can be in the form of a plate fixed inside the chamber 10. In another embodiment, the first support member 20 can be in the form of a shuttle in which the display substrate DS is disposed (e.g., placed) and can be linearly moved inside the chamber 10. In another embodiment, the first support member 20 can include an electrostatic chuck or an adhesive chuck provided in the chamber 10 to be fixed or movable inside the chamber 10.

[0068] The second support member 30 can support the mask assembly 40. In this case, the second support member 30 can be disposed inside the chamber 10. The second support member 30 can fine-tune the position of the mask assembly 40. In this case, the second support member 30 can separately include a driver or an alignment unit to move the mask assembly 40 in different directions.

[0069] In another embodiment, the second support 30 may be in the shape of a shuttle. In this case, the mask assembly 40 may be disposed (e.g., placed) on the second support 30. The second support 30 may transfer the mask assembly 40. In an embodiment, the second support 30 may be moved to the outside of the chamber 10, and after the mask assembly 40 is disposed (e.g., placed) on the second support 30, the second support 30 may enter the chamber 10 from the outside of the chamber 10.

[0070] In this case, the first support member 20 may be integral with the second support member 30. In this case, the first support member 20 and the second support member 30 may include a movable shuttle. In this case, the first support member 20 and the second support member 30 may include a structure that fixes the mask assembly 40 to the display substrate DS while the display substrate DS is disposed (e.g., placed) on the mask assembly 40, and the display substrate DS and the mask assembly 40 may be linearly moved simultaneously.

[0071] Hereinafter, for convenience of description, a form in which the first support 20 and the second support 30 are distinguished from each other and disposed at different positions and a form in which the first support 20 and the second support 30 are disposed inside the chamber 10 are mainly described in detail.

[0072] The mask assembly 40 may be disposed to face the display substrate DS inside the chamber 10. The deposition material M may pass through the mask assembly 40 and be deposited on the display substrate DS.

[0073] The deposition source 50 may be disposed to face the mask assembly 40 and may supply the deposition material M so that the deposition material M passes through the deposition area of ​​the mask assembly 40 and is deposited on the display substrate DS. In this case, the deposition source 50 may evaporate or sublime the deposition material M by applying heat to the deposition material M. The deposition source 50 may be fixed inside the chamber 10 or disposed inside the chamber 10 to move linearly in one direction.

[0074] The magnetic portion 60 may be disposed within the chamber 10 so as to face the display substrate DS and / or the mask assembly 40. In this case, the magnetic portion 60 may apply a magnetic force to the mask assembly 40 and press the mask assembly 40 toward the display substrate DS. In particular, the magnetic portion 60 may not only prevent the mask assembly 40 from sagging, but also allow the mask assembly 40 to be adjacent to the display substrate DS. In addition, the magnetic portion 60 may maintain a uniform spacing between the mask assembly 40 and the display substrate DS.

[0075] The vision section 70 may be disposed in the chamber 10 and may capture the positions of the display substrate DS and the mask assembly 40. In this case, the vision section 70 may include a camera that captures the display substrate DS and the mask assembly 40. The positions of the display substrate DS and the mask assembly 40 may be determined based on the images captured by the vision section 70, and deformation of the mask assembly 40 may be determined. Furthermore, based on the captured images, the first support member 20 may fine-tune the position of the display substrate DS, or the second support member 30 may fine-tune the position of the mask assembly 40. Hereinafter, the case where the second support member 30 fine-tunes the position of the mask assembly 40 and aligns the positions of the display substrate DS and the mask assembly 40 will be primarily described in detail.

[0076] The pressure regulator 80 may be connected to the chamber 10 and may adjust the internal pressure of the chamber 10. In an embodiment, the pressure regulator 80 may adjust the internal pressure of the chamber 10 to be equal to or similar to atmospheric pressure. In addition, the pressure regulator 80 may adjust the internal pressure of the chamber 10 to be equal to or similar to a vacuum state.

[0077] The pressure regulator 80 may include a connecting pipe 81 and a pump 82. The connecting pipe 81 is connected to the chamber 10, and the pump 82 is mounted to the connecting pipe 81. In this case, depending on the operation of the pump 82, external air may be introduced through the connecting pipe 81, or the gas inside the chamber 10 may be guided to the outside through the connecting pipe 81.

[0078] A method of manufacturing the display device is described through the deposition part 113. First, the display substrate DS may be prepared.

[0079] The pressure regulator 80 may maintain the interior of the chamber 10 at a state equal to or similar to the atmospheric pressure. The gate valve 101 may operate to open an opening portion of the chamber 10.

[0080] Then, the display substrate DS can be loaded into the interior of the chamber 10 from the outside. In this case, the display substrate DS can be loaded into the chamber 10 in various ways. In an embodiment, the display substrate DS can be loaded into the interior of the chamber 10 from the outside of the chamber 10 by a robot arm provided outside the chamber 10. In another embodiment, in the case where the first support 20 is formed in a shuttle shape, the first support 20 can be transported from the interior of the chamber 10 to the outside of the chamber 10, and then the display substrate DS can be set (e.g., placed) on the first support 20 by a separate robot arm provided outside the chamber 10, and the first support 20 can be loaded into the interior of the chamber 10 from the outside of the chamber 10.

[0081] As described above, the mask assembly 40 may be disposed inside the chamber 10. In another embodiment, the mask assembly 40 may be loaded into the interior of the chamber 10 from the outside of the chamber 10 in the same manner or a similar manner as the display substrate DS.

[0082] When the display substrate DS is loaded into the interior of the chamber 10, the display substrate DS may be disposed (e.g., placed) on the first support 20. In this case, the vision portion 70 may capture the positions of the display substrate DS and the mask assembly 40. The positions of the display substrate DS and the mask assembly 40 may be determined based on the image captured by the vision portion 70. In this case, the deposition portion 113 may include a separate controller (not shown) for determining the positions of the display substrate DS and the mask assembly 40.

[0083] When the determination of the positions of the display substrate DS and the mask assembly 40 is completed, the second support member 30 may finely adjust the position of the mask assembly 40 .

[0084] Then, the deposition source 50 operates to supply the deposition material M toward the mask assembly 40, and the deposition material M passing through the plurality of patterned holes of the mask assembly 40 may be deposited on the display substrate DS. In this case, the deposition source 50 may move parallel to the display substrate DS and the mask assembly 40, or the display substrate DS and the mask assembly 40 may move parallel to the deposition source 50. That is, the deposition source 50 may move relative to the display substrate DS and the mask assembly 40. In this case, the pump 82 may maintain the pressure of the chamber 10 at a state equal to or similar to vacuum by sucking gas inside the chamber 10 and discharging the gas to the outside.

[0085] As described above, the deposition material M supplied from the deposition source 50 may pass through the mask assembly 40 , be deposited on the display substrate DS, and thus form at least one of a plurality of layers (eg, organic layers, inorganic layers, and metal layers stacked in the display device described below).

[0086] Figure 3 is a block diagram of an embodiment of controller 12, Figure 4 is a flowchart illustrating an embodiment of a method of manufacturing a display device, Figure 5 is a view of an embodiment of an initial schedule ISC, and Figure 6 is a diagram of an embodiment of a first modification schedule MSC1.

[0087] refer to Figures 1 to 6 , the controller 12 may include an initial scheduler 121 , a determination part 122 , a modifier 123 and an executor 124 .

[0088] First, refer to Figures 3 to 5 , the initial scheduler 121 may generate the initial schedule ISC such that each of the plurality of deposition parts 113 performs a deposition process A times (A is a natural number greater than 0) and then performs a cleaning process once.

[0089] exist Figure 5 In the example, the numbers written in the cells indicate the order of the deposition process. Figure 5 In the example, the horizontal length of a cell represents the time required to perform a deposition process or a cleaning process. Figure 5 , the initial schedule ISC of the first-1 deposition portion 1131 to the first-8 deposition portion 1138 is known.

[0090] Despite Figure 5, it is shown that the time required for the cleaning process is longer than the time required for the deposition process, but this is only an example, and the time required for the cleaning process and the time required for the deposition process are not limited thereto. Figure 5 , it is shown that the time required for the deposition process of the plurality of deposition parts 113 is the same and the time required for the cleaning process of the plurality of deposition parts 113 is the same, but this is only an example, and the time required for the cleaning process of the plurality of deposition parts 113 and the time required for the deposition process may be different.

[0091] In an embodiment, Figure 5 As shown in , A may be about 7. That is, in the initial schedule ISC, each of the first-1 to first-8 deposition parts 1131 to 1138 may perform the deposition process seven times and the cleaning process once.

[0092] When the initial scheduler 121 generates the initial schedule ISC, the determination unit 122 may determine whether the initial schedule ISC satisfies a first condition. Here, the first condition may be that the number of deposition units 113 simultaneously performing a cleaning process is approximately B or less (B is a natural number greater than 0). In an embodiment, B may be approximately 2. In other words, the determination unit 122 may determine whether the initial schedule ISC satisfies the first condition that the number of deposition units 113 simultaneously performing a cleaning process is two or less.

[0093] In the examples, reference Figure 5 In the initial schedule ISC shown in FIG, it is known that the first-2 deposition section 1132, the first-3 deposition section 1133, and the first-4 deposition section 1134 simultaneously perform the cleaning process in section A. That is, in the initial schedule ISC, it is known that the number of deposition sections 113 that simultaneously perform the cleaning process is three. Accordingly, the determination section 122 may determine that the initial schedule ISC does not satisfy the first condition.

[0094] When the initial schedule ISC satisfies the first condition, the actuator 124 may operate the plurality of deposition parts 113 based on the initial schedule ISC. Figure 5 As shown in , when the initial schedule ISC does not satisfy the first condition, the modifier 123 may modify the initial schedule ISC into the first modified schedule MSC1.

[0095] refer to Figures 3 to 6 When the initial schedule ISC does not satisfy the first condition, the modifier 123 may modify the initial schedule ISC into the first modified schedule MSC1.

[0096] picture Figure 5 Same, in Figure 6 In the example, the numbers written in the cells indicate the order of the deposition process. Figure 6 In the example, the horizontal length of a cell represents the time required to perform a deposition process or a cleaning process. Figure 6 , the first modification schedule MSC1 of the first-1 deposition section 1131 to the first-8 deposition section 1138 is known.

[0097] When the initial schedule ISC does not satisfy the first condition, the modifier 123 may modify the initial schedule ISC to a first modified schedule MSC1 such that one of the plurality of deposition parts 113 simultaneously performing the cleaning process performs the deposition process A-1 times and then performs the cleaning process once.

[0098] In addition, when the initial schedule ISC does not satisfy the first condition, the modifier 123 may modify the initial schedule ISC to a first modified schedule MSC1 so that another one of the plurality of deposition parts 113 simultaneously performing the cleaning process performs the deposition process A-2 times and then performs the cleaning process once.

[0099] In an embodiment, in the case where A is 7, when the initial schedule ISC does not satisfy the first condition, the modifier 123 may modify the initial schedule ISC to a first modified schedule MSC1 such that one of the plurality of deposition parts 113 performs the deposition process six times and then performs the cleaning process once, and another one of the plurality of deposition parts 113 performs the deposition process five times and then performs the cleaning process once.

[0100] In an embodiment, Figure 5 and Figure 6 As shown in , because the initial schedule ISC does not satisfy the first condition, the modifier 123 may modify the initial schedule ISC to a first modified schedule MSC1 such that the 1st-4 deposition part 1134 performs the deposition process six times and then performs the cleaning process once, and the 1st-3 deposition part 1133 performs the deposition process five times and then performs the cleaning process once.

[0101] When the modifier 123 modifies the initial schedule ISC into the first modified schedule MSC1, the determination unit 122 may determine whether the first modified schedule MSC1 satisfies the first condition. In an embodiment, when B is 2, the determination unit 122 may determine whether the first modified schedule MSC1 satisfies the first condition that the number of deposition units 113 simultaneously performing the cleaning process is two or less.

[0102] In the examples, reference Figure 6In the first modified schedule MSC1 shown in FIG, it is known that the first-1 deposition section 1131, the first-3 deposition section 1133, and the first-4 deposition section 1134 simultaneously perform the cleaning process in section B. That is, in the first modified schedule MSC1, it is known that the number of deposition sections 113 that simultaneously perform the cleaning process is 3. Accordingly, the determining part 122 may determine that the first modified schedule MSC1 does not satisfy the first condition.

[0103] When the first modification schedule MSC1 satisfies the first condition, the actuator 124 may operate the plurality of deposition parts 113 based on the first modification schedule MSC1. Figure 6 As shown in , when the first modification schedule MSC1 does not satisfy the first condition, the modifier 123 may modify the first modification schedule MSC1 into the second modification schedule MSC2.

[0104] When the first modified schedule MSC1 does not satisfy the first condition, the modifier 123 may modify the first modified schedule MSC1 into the second modified schedule MSC2 so that the cleaning process start timing of one of the plurality of deposition parts 113 that simultaneously perform the cleaning process is advanced by one order.

[0105] In addition, when the first modified schedule MSC1 does not satisfy the first condition, the modifier 123 may modify the first modified schedule MSC1 into the second modified schedule MSC2 so that the cleaning process start timing of another one of the plurality of deposition parts 113 simultaneously performing the cleaning process is advanced by two orders.

[0106] In an embodiment, Figure 6 As shown in , because the first modification schedule MSC1 does not satisfy the first condition, the modifier 123 may modify the first modification schedule MSC1 to the second modification schedule MSC2 so that the 1st-4 deposition part 1134 performs the deposition process four times and then performs the cleaning process once, and the 1st-3 deposition part 1133 performs the deposition process three times and then performs the cleaning process once.

[0107] When the modifier 123 modifies the first modification schedule MSC1 into the second modification schedule MSC2, the determination unit 122 may determine whether the second modification schedule MSC2 satisfies the first condition. In an embodiment, when B is 2, the determination unit 122 may determine whether the second modification schedule MSC2 satisfies the first condition that the number of deposition units 113 that simultaneously perform the cleaning process is two or less.

[0108] When the second modification schedule MSC2 satisfies the first condition, the executor 124 may operate the plurality of deposition parts 113 based on the second modification schedule MSC2. In contrast, when the second modification schedule MSC2 does not satisfy the first condition, the modifier 123 may modify the second modification schedule MSC2 to a third modification schedule MSC3.

[0109] The above process may be repeated until the schedule modified by the modifier 123 satisfies the first condition. Therefore, the number of deposition parts 113 simultaneously performing the cleaning process may be less than B. In an embodiment, the number of deposition parts 113 simultaneously performing the cleaning process may be less than 2.

[0110] Figure 7 is a schematic plan view of an embodiment of an apparatus 2 for manufacturing a display device.

[0111] exist Figure 7 In, with Figure 1 The same reference numerals as in the drawings denote the same components, and thus, repeated descriptions thereof are omitted.

[0112] refer to Figure 7 , the apparatus 2 for manufacturing a display device may include a first process part 21, a second process part 22, a connector 23 and a controller (eg, Figure 8 Specifically, the first process section 21 may include a first loading section 211, a first conveying section 212, and a first deposition section 213. The second process section 22 may include a second loading section 221, a second conveying section 222, and a second deposition section 223.

[0113] The first loading section 211 may serve as an entrance of the apparatus 2 for manufacturing a display device, and a display substrate DS may be loaded from the outside into the first loading section 211. The first loading section 211 may be connected to the first conveying section 212. The display substrate DS may be transferred to the first conveying section 212 through the first loading section 211.

[0114] The internal pressure of the first loading section 211 can be adjusted to be equal to or similar to atmospheric pressure. In an alternative embodiment, the internal pressure of the first loading section 211 can be adjusted to be equal to or similar to a vacuum state. In an embodiment, when the display substrate DS is loaded from the outside, the pressure of the first loading section 211 can be adjusted to be equal to or similar to atmospheric pressure. In addition, when the display substrate DS is transferred to the first conveying section 212, the pressure of the first loading section 211 can be adjusted to be equal to or similar to a vacuum state.

[0115] The first conveyor section 212 may be connected to the first loading section 211 and the first depositing section 213. The first conveyor section 212 may receive or transfer a display substrate DS from the first depositing section 213 or the first loading section 211. In this case, the first conveyor section 212 may include a first robot arm 2121. The first robot arm 2121 may transfer the display substrate DS from the first loading section 211 to the first conveyor section 212. Furthermore, the first robot arm 2121 may transfer the display substrate DS from the first conveyor section 212 to the first depositing section 213, or transfer a display substrate DS after a process is completed from the first depositing section 213 to the first conveyor section 212.

[0116] The first deposition section 213 may perform a deposition process and a first cleaning process. The deposition process may be a process of depositing a deposition material on the display substrate DS. The first cleaning process may be a process of cleaning the interior of the first deposition section 213. A plurality of first deposition sections 213 may be provided. In an embodiment, five first deposition sections 213 may be provided. The first deposition section 213 may be connected to the first conveyor section 212. In other words, each of the plurality of first deposition sections 213 may be connected to the first conveyor section 212.

[0117] In an embodiment, four first depositing sections 213 may be provided. The plurality of first depositing sections 213 may be arranged circumferentially around the first conveying section 212. The plurality of first depositing sections 213 may be arranged within a radius of the first robotic arm 2121. However, this is provided as one embodiment, and the number and arrangement of the first depositing sections 213 are not limited thereto.

[0118] The second loading section 221 may serve as an entrance of the apparatus 2 for manufacturing a display device, and the display substrate DS may be transported to the outside from the second loading section 221. The second loading section 221 may be connected to the second conveying section 222. The display substrate DS may be transferred to the second loading section 221 through the second conveying section 222.

[0119] The internal pressure of the second loading section 221 can be adjusted to be equal to or similar to atmospheric pressure. In an alternative embodiment, the internal pressure of the second loading section 221 can be adjusted to be equal to or similar to a vacuum state. In an embodiment, when the display substrate DS is transported from the second loading section 221 to the outside, the pressure of the second loading section 221 can be adjusted to be equal to or similar to atmospheric pressure. Alternatively, when the display substrate DS is transferred from the second transport section 222 to the second loading section 221, the pressure of the second loading section 221 can be adjusted to be equal to or similar to a vacuum state.

[0120] The second conveyor section 222 may be connected to the second loading section 221 and the second deposition section 223. The second conveyor section 222 may receive or transfer a display substrate DS from the second deposition section 223 or the second loading section 221. In this case, the second conveyor section 222 may include a second robotic arm 2221. The second robotic arm 2221 may transfer the display substrate DS from the second loading section 221 to the second conveyor section 222. Furthermore, the second robotic arm 2221 may transfer the display substrate DS from the second conveyor section 222 to the second deposition section 223, or transfer a display substrate DS after a process is completed from the second deposition section 223 to the second conveyor section 222.

[0121] The second deposition section 223 may perform a deposition process and a second cleaning process. The deposition process may be a process of depositing a deposition material on the display substrate DS. The second cleaning process may be a process of cleaning the interior of the second deposition section 223. A plurality of second deposition sections 223 may be provided. In an embodiment, five second deposition sections 223 may be provided. The second deposition section 223 may be connected to the second conveyor section 222. In other words, each of the plurality of second deposition sections 223 may be connected to the second conveyor section 222.

[0122] In an embodiment, four second depositing sections 223 may be provided. The plurality of second depositing sections 223 may be arranged circumferentially around the second conveying section 222. The plurality of second depositing sections 223 may be arranged within a radius of the second robotic arm 2221. However, this is provided as one embodiment, and the number and arrangement of the second depositing sections 223 are not limited thereto.

[0123] The connector 23 may connect the first process part 21 to the second process part 22. The connector 23 may serve as a passage connecting the first process part 21 to the second process part 22. The display substrate DS may be transferred from the first process part 21 to the second process part 22 through the connector 23.

[0124] The controller can control the process part. In an embodiment, the controller can control each of the plurality of first deposition parts 213 and the plurality of second deposition parts 223. Figures 8 to 10 Describe the controller in detail.

[0125] The plurality of first deposition parts 213 and the plurality of second deposition parts 223 may perform the same deposition process. A deposition material may be deposited on the display substrate DS by one of the plurality of first deposition parts 213 and the plurality of second deposition parts 223.

[0126] The process of depositing a deposition material on a display substrate DS is described below. The display substrate DS can be loaded from the outside into the first loading section 211. The display substrate DS loaded into the first loading section 211 can be transferred to the first conveyor section 212. The first conveyor section 212 can transfer the display substrate DS to one of the plurality of first deposition sections 213. When the deposition process of the display substrate DS is completed at one of the plurality of first deposition sections 213, the first conveyor section 212 can receive another display substrate DS. The display substrate DS after the deposition process is completed can sequentially pass through the connector 23, the second conveyor section 222, and the second loading section 221, and then be transferred to the outside.

[0127] In an alternative embodiment, the display substrate DS may be loaded from the outside into the first loading section 211, may sequentially pass through the first conveyor section 212 and the connector 23, and then be transferred to the second conveyor section 222. The second conveyor section 222 may transfer the display substrate DS to one of the plurality of second deposition sections 223. When the deposition process of the display substrate DS is completed at one of the plurality of second deposition sections 223, the second conveyor section 222 may receive the display substrate DS again. The display substrate DS after the deposition process is completed may be transferred to the outside through the second loading section 221.

[0128] Figure 8 is a block diagram of an embodiment of the controller 24, and Figure 9 is a flowchart illustrating an embodiment of a method of manufacturing a display device.

[0129] exist Figure 8 and Figure 9 In, with Figures 1 to 7 The same reference numerals as in the drawings denote the same components, and thus, repeated descriptions thereof are omitted.

[0130] refer to Figures 7 to 9 , the controller 24 may include a first controller 241 and a second controller 242. Specifically, the first controller 241 may control the first process part 21, and the second controller 242 may control the second process part 22.

[0131] The first controller 241 may include a first initial scheduler 2411 , a first determining portion 2412 , a first modifier 2413 , and a first executor 2414 .

[0132] The first initial scheduler 2411 may generate a first initial schedule ISC1 such that each of the plurality of first deposition parts 213 performs a deposition process A times (A is a natural number greater than 0) and then performs a first cleaning process once.

[0133] In an embodiment, A may be about 7. That is, in the first initial schedule ISC1, each of the plurality of first deposition parts 213 may perform the deposition process seven times and the first cleaning process once.

[0134] When the first initial scheduler 2411 generates the first initial schedule ISC1, the first determination unit 2412 may determine whether the first initial schedule ISC1 satisfies the first-1 condition. Here, the first-1 condition may be a condition that the number of first deposition units 213 simultaneously performing the first cleaning process is B or less (B is a natural number greater than 0). In an embodiment, B may be approximately 1. In other words, the first determination unit 2412 may determine whether the first initial schedule ISC1 satisfies the first-1 condition that the number of first deposition units 213 simultaneously performing the first cleaning process is 1 or less.

[0135] When the first initial schedule ISC1 satisfies the first-1 condition, the first executor 2414 may operate the plurality of first deposition parts 213 based on the first initial schedule ISC1. Conversely, when the first initial schedule ISC1 does not satisfy the first-1 condition, the first modifier 2413 may modify the first initial schedule ISC1 into the first-1 modified schedule MSC1-1.

[0136] When the first initial schedule ISC1 does not satisfy the first-1 condition, the first modifier 2413 may modify the first initial schedule ISC1 into a first-1 modified schedule MSC1-1 so that one of the plurality of first deposition parts 213 simultaneously performing the first cleaning process performs the deposition process A-1 times and then performs the first cleaning process once.

[0137] In addition, when the first initial schedule ISC1 does not satisfy the first-1 condition, the first modifier 2413 can modify the first initial schedule ISC1 to the first-1 modified schedule MSC1-1 so that another one of the multiple first deposition parts 213 that simultaneously perform the first cleaning process performs the deposition process A-2 times and then performs the first cleaning process once.

[0138] In an embodiment, in a case where A is 7, when the first initial schedule ISC1 does not satisfy the first-1 condition, the first modifier 2413 may modify the first initial schedule ISC1 to a first-1 modified schedule MSC1-1, so that one of the plurality of first deposition parts 213 performs the deposition process six times and then performs the first cleaning process once, and another one of the plurality of first deposition parts 213 performs the deposition process five times and then performs the first cleaning process once.

[0139] When the first modifier 2413 modifies the first initial schedule ISC1 into the first-1 modified schedule MSC1-1, the first determining unit 2412 may determine whether the first-1 modified schedule MSC1-1 satisfies the first-1 condition. In an embodiment, when B is 1, the first determining unit 2412 may determine whether the first-1 modified schedule MSC1-1 satisfies the first-1 condition that the number of first deposition units 213 simultaneously performing the first cleaning process is one or less.

[0140] When the first-1 modification schedule MSC1-1 satisfies the first-1 condition, the first executor 2414 may operate the plurality of first deposition parts 213 based on the first-1 modification schedule MSC1-1. Conversely, when the first-1 modification schedule MSC1-1 does not satisfy the first-1 condition, the first modifier 2413 may modify the first-1 modification schedule MSC1-1 into the first-2 modification schedule MSC1-2.

[0141] When the first-1 modification schedule MSC1-1 does not satisfy the first-1 condition, the first modifier 2413 may modify the first-1 modification schedule MSC1-1 to the first-2 modification schedule MSC1-2 so that the cleaning process start timing of one of the plurality of first deposition parts 213 simultaneously performing the first cleaning process is advanced by one order.

[0142] In addition, when the first-1 modification schedule MSC1-1 does not satisfy the first-1 condition, the first modifier 2413 can modify the first-1 modification schedule MSC1-1 to the first-2 modification schedule MSC1-2 so that the cleaning process start timing of another one of the multiple first deposition parts 213 that simultaneously perform the first cleaning process is advanced by two orders.

[0143] When the first modifier 2413 modifies the first-1 modification schedule MSC1-1 into the first-2 modification schedule MSC1-2, the first determining unit 2412 may determine whether the first-2 modification schedule MSC1-2 satisfies the first-1 condition. In an embodiment, when B is 1, the first determining unit 2412 may determine whether the first-2 modification schedule MSC1-2 satisfies the first-1 condition that the number of first deposition units 213 simultaneously performing the first cleaning process is one or less.

[0144] When the first-2 modification schedule MSC1-2 satisfies the first-1 condition, the first executor 2414 may operate the plurality of first deposition parts 213 based on the first-2 modification schedule MSC1-2. Conversely, when the first-2 modification schedule MSC1-2 does not satisfy the first-1 condition, the first modifier 2413 may modify the first-2 modification schedule MSC1-2 into the first-3 modification schedule MSC1-3.

[0145] The above process may be repeated until the schedule modified by the first modifier 2413 satisfies the first-1 condition. Therefore, the number of first deposition parts 213 simultaneously performing the first cleaning process may be B or less. In an embodiment, the number of first deposition parts 213 simultaneously performing the first cleaning process may be 1 or less.

[0146] The second controller 242 may include a second initial scheduler 2421 , a second determining portion 2422 , a second modifier 2423 , and a second executor 2424 .

[0147] The second initial scheduler 2421 may generate a second initial schedule ISC2 such that each of the plurality of second deposition parts 223 performs the deposition process A times (A is a natural number greater than 0) and then performs the second cleaning process once.

[0148] In an embodiment, A may be about 7. That is, in the second initial schedule ISC2 , each of the plurality of second deposition parts 223 may perform the deposition process seven times and the second cleaning process once.

[0149] When the second initial scheduler 2421 generates the second initial schedule ISC2, the second determination unit 2422 may determine whether the second initial schedule ISC2 satisfies the second-1 condition. Here, the second-1 condition may be a condition that the number of second deposition units 223 simultaneously performing the second cleaning process is B or less (B is a natural number greater than 0). In an embodiment, B may be approximately 1. In other words, the second determination unit 2422 may determine whether the second initial schedule ISC2 satisfies the second-1 condition that the number of second deposition units 223 simultaneously performing the second cleaning process is 1 or less.

[0150] When the second initial schedule ISC2 satisfies the second-1 condition, the second executor 2424 may operate the plurality of second deposition parts 223 based on the second initial schedule ISC2. Conversely, when the second initial schedule ISC2 does not satisfy the second-1 condition, the second modifier 2423 may modify the second initial schedule ISC2 into the second-1 modified schedule MSC2-1.

[0151] When the second initial schedule ISC2 does not satisfy the second-1 condition, the second modifier 2423 can modify the second initial schedule ISC2 to the second-1 modified schedule MSC2-1 so that one of the plurality of second deposition parts 223 that simultaneously perform the second cleaning process performs the deposition process A-1 times and then performs the second cleaning process once.

[0152] In addition, when the second initial schedule ISC2 does not satisfy the second-1 condition, the second modifier 2423 can modify the second initial schedule ISC2 to the second-1 modified schedule MSC2-1, so that another one of the multiple second deposition parts 223 that simultaneously perform the second cleaning process performs the deposition process A-2 times and then performs the second cleaning process once.

[0153] In an embodiment, in a case where A is 7, when the second initial schedule ISC2 does not satisfy the second-1 condition, the second modifier 2423 may modify the second initial schedule ISC2 to a second-1 modified schedule MSC2-1, so that one of the plurality of second deposition parts 223 performs the deposition process six times and then performs the second cleaning process once, and another one of the plurality of second deposition parts 223 performs the deposition process five times and then performs the second cleaning process once.

[0154] When the second modifier 2423 modifies the second initial schedule ISC2 into the second-1 modified schedule MSC2-1, the second determining unit 2422 may determine whether the second-1 modified schedule MSC2-1 satisfies the second-1 condition. In an embodiment, when B is 1, the second determining unit 2422 may determine whether the second-1 modified schedule MSC2-1 satisfies the second-1 condition that the number of second deposition parts 223 simultaneously performing the second cleaning process is one or less.

[0155] When the second-1 modification schedule MSC2-1 satisfies the second-1 condition, the second executor 2424 may operate the plurality of second deposition parts 223 based on the second-1 modification schedule MSC2-1. Conversely, when the second-1 modification schedule MSC2-1 does not satisfy the second-1 condition, the second modifier 2423 may modify the second-1 modification schedule MSC2-1 to the second-2 modification schedule MSC2-2.

[0156] When the second-1 modification schedule MSC2-1 does not satisfy the second-1 condition, the second modifier 2423 may modify the second-1 modification schedule MSC2-1 to the second-2 modification schedule MSC2-2 so that the cleaning process start timing of one of the plurality of second deposition parts 223 simultaneously performing the second cleaning process is advanced by one order.

[0157] In addition, when the second-1 modification schedule MSC2-1 does not satisfy the second-1 condition, the second modifier 2423 can modify the second-1 modification schedule MSC2-1 to the second-2 modification schedule MSC2-2, so that the cleaning process start timing of another one of the multiple second deposition parts 223 that simultaneously perform the second cleaning process is advanced by two orders.

[0158] When the second modifier 2423 modifies the second-1 modification schedule MSC2-1 into the second-2 modification schedule MSC2-2, the second determining unit 2422 may determine whether the second-2 modification schedule MSC2-2 satisfies the second-1 condition. In an embodiment, when B is 1, the second determining unit 2422 may determine whether the second-2 modification schedule MSC2-2 satisfies the second-1 condition that the number of the second deposition parts 223 simultaneously performing the second cleaning process is one or less.

[0159] When the second-2 modification schedule MSC2-2 satisfies the second-1 condition, the second executor 2424 may operate the plurality of second deposition parts 223 based on the second-2 modification schedule MSC2-2. Conversely, when the second-2 modification schedule MSC2-2 does not satisfy the second-1 condition, the second modifier 2423 may modify the second-2 modification schedule MSC2-2 to the second-3 modification schedule MSC2-3.

[0160] The above process may be repeated until the schedule modified by the second modifier 2423 satisfies the second-1 condition. Therefore, the number of second deposition parts 223 simultaneously performing the second cleaning process may be B or less. In an embodiment, the number of second deposition parts 223 simultaneously performing the second cleaning process may be 1 or less.

[0161] Figure 10 is a schematic plan view of an embodiment of the display device 3, and Figure 11 is a schematic cross-sectional view of the display device 3 .

[0162] refer to Figure 10 , the display device 3 may include a display area DA and a non-display area NDA surrounding the display area DA. In an embodiment, the pixel PX may be connected to a scan line SLm and a data line DLLn, where m and n are natural numbers greater than 0. In an embodiment, the scan line SLm may extend in a first direction x, and the data line DLLn may extend in a second direction y that crosses the first direction x. Figure 10 and Figure 11 The display device 3 may include a display substrate S. The display substrate S may include a substrate 100 and layers of the display layer DL except for the emission layer 2222 and the common electrode 2223 .

[0163] The display layer DL and the thin film encapsulation layer TFE may be disposed on the substrate 100 in a third direction z crossing a plane defined by the scan lines SLm and the data lines DLLn. The display layer DL may include a pixel circuit layer PCL and a display element layer DEL.

[0164] The substrate 100 may include glass or a polymer resin such as polyethersulfone, polyarylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyimide, polycarbonate, cellulose triacetate, or cellulose acetate propionate.

[0165] A barrier layer (not shown) may be further provided between the display layer DL and the substrate 100. The barrier layer may prevent penetration of foreign matter and may be a material including silicon nitride (SiN x , x>0) and silicon oxide (SiO x , x>0) a single layer or multiple layers.

[0166] The pixel circuit layer PCL may be disposed on the substrate 100. The pixel circuit layer PCL may include a thin film transistor TFT, a buffer layer 1111, a first insulating layer 13a, a second insulating layer 13b, a third insulating layer 15, and a planarization layer 17 under and / or over the thin film transistor TFT.

[0167] The buffer layer 1111 may include an inorganic insulating material such as silicon nitride, silicon oxynitride, and silicon oxide, and include a single layer or a plurality of layers including the above inorganic insulating material.

[0168] The thin film transistor (TFT) may include a semiconductor layer 127, which may include polycrystalline silicon. In alternative embodiments, the semiconductor layer 127 may include amorphous silicon, an oxide semiconductor, or an organic semiconductor. The semiconductor layer 127 may include a channel region 12c, a drain region 12a, and a source region 12b, with the drain region 12a and the source region 12b located on opposite sides of the channel region 12c. The gate electrode 14 may overlap the channel region 12c.

[0169] The gate electrode 14 may include a low-resistance metal material, a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), and titanium (Ti), and have a single-layer structure or a multi-layer structure including the above materials.

[0170] The first insulating layer 13a between the semiconductor layer 127 and the gate electrode 14 may include silicon oxide (SiO x ), silicon nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO x ) of inorganic insulating materials.

[0171] The second insulating layer 13b may cover the gate electrode 14. Similar to the first insulating layer 13a, the second insulating layer 13b may include silicon oxide (SiO x ), silicon nitride (SiNx ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO x , which may be an inorganic insulating material of ZnO and / or ZnO2).

[0172] The upper electrode Cst2 of the storage capacitor Cst can be disposed on the second insulating layer 13b. The upper electrode Cst2 can overlap the gate electrode 14 thereunder. In this case, the overlapping gate electrode 14 and the upper electrode Cst2 with the second insulating layer 13b therebetween can constitute the storage capacitor Cst. That is, the gate electrode 14 can function as the lower electrode Cst1 of the storage capacitor Cst.

[0173] As described above, the storage capacitor Cst may overlap with the thin film transistor TFT. In an embodiment, the storage capacitor Cst may be formed so as not to overlap with the thin film transistor TFT.

[0174] The upper electrode Cst2 may include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W) and / or copper (Cu), and include a single layer or multiple layers containing the above materials.

[0175] The third insulating layer 15 may cover the upper electrode Cst2. The third insulating layer 15 may include silicon oxide (SiO x ), silicon nitride (SiN x ), silicon oxynitride (SiON), aluminum oxide (Al2O3), titanium oxide (TiO2), tantalum oxide (Ta2O5), hafnium oxide (HfO2) or zinc oxide (ZnO x , which may be ZnO and / or ZnO 2 ). The third insulating layer 15 may include a single layer or a plurality of layers including an inorganic insulating material.

[0176] The drain electrode 16a and the source electrode 16b may each be disposed on the third insulating layer 15. The drain electrode 16a and the source electrode 16b may each include a material having relatively high electrical conductivity. The drain electrode 16a and the source electrode 16b may each include a conductive material including molybdenum (Mo), aluminum (Al), copper (Cu), and titanium (Ti), and may include a single layer or multiple layers including the above materials. In an embodiment, the drain electrode 16a and the source electrode 16b may each have a multilayer structure of Ti / Al / Ti.

[0177] The planarization layer 17 may include an organic insulating material. The planarization layer 17 may include an organic insulating material including a general polymer such as polymethyl methacrylate (PMMA) or polystyrene (PS), a polymer derivative having a phenol group, an acrylic polymer, an imide polymer, an aryl ether polymer, an amide polymer, a fluorine polymer, a paraxylene polymer, a vinyl alcohol polymer, or any combination thereof.

[0178] The display element layer DEL may be disposed on the pixel circuit layer PCL having the above structure. The display element layer DEL may include an organic light emitting diode OLED, and a pixel electrode 2221 of the organic light emitting diode OLED may be electrically connected to the thin film transistor TFT through a contact hole defined in the planarization layer 17 .

[0179] The pixel PX may include an organic light emitting diode OLED and a thin film transistor TFT. For example, each pixel PX may emit red, green, or blue light through the organic light emitting diode OLED, or emit red, green, blue, or white light.

[0180] The pixel electrode 2221 may include a conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), indium gallium oxide (IGO), or aluminum zinc oxide (AZO). In another embodiment, the pixel electrode 2221 may include a reflective layer containing silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or any combination thereof. In another embodiment, the pixel electrode 2221 may further include a layer above / below the reflective layer, the layer including ITO, IZO, ZnO, or In2O3.

[0181] A pixel defining layer 19 may be disposed on the pixel electrode 2221. The pixel defining layer 19 defines an opening 19OP that exposes a central portion of the pixel electrode 2221. The pixel defining layer 19 may include an organic insulating material and / or an inorganic insulating material. The opening 19OP may define an emission area EA for light emitted from the organic light emitting diode OLED. In embodiments, the width of the opening 19OP may correspond to the width of the emission area EA.

[0182] The emission layer 2222 may be disposed in the opening 19OP of the pixel defining layer 19. The emission layer 2222 may include a polymer organic material or a low molecular weight organic material that emits light having a predetermined color. In another embodiment, the emission layer 2222 may include a quantum dot material. The emission layer 2222 may be formed by discharging droplets using an apparatus for manufacturing a display device.

[0183] Although not shown, the first functional layer and the second functional layer may be disposed under the emission layer 2222 and on the emission layer 2222, respectively. For example, the first functional layer may include a hole transport layer (HTL), or include an HTL and a hole injection layer (HIL). The second functional layer is an element disposed on the emission layer 2222 and is optional. The second functional layer may include an electron transport layer (ETL) and / or an electron injection layer (EIL). Like the common electrode 2223 described below, the first functional layer and / or the second functional layer may be a common layer covering the entire substrate 100.

[0184] The common electrode 2223 may include a conductive material having a relatively low work function. In an embodiment, the common electrode 2223 may include a (semi) transparent layer containing silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), or any alloy thereof. In an alternative embodiment, the common electrode 2223 may further include a layer on the (semi) transparent layer, the layer including ITO, IZO, ZnO, or In2O3.

[0185] The thin film encapsulation layer TFE may be provided on the common electrode 2223. In an embodiment, the thin film encapsulation layer TFE may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. Figure 11 3 , the thin film encapsulation layer TFE includes a first inorganic encapsulation layer 31 , an organic encapsulation layer 32 , and a second inorganic encapsulation layer 33 stacked in sequence.

[0186] The first inorganic encapsulation layer 31 and the second inorganic encapsulation layer 33 may include an inorganic material of at least one of aluminum oxide, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride. The organic encapsulation layer 32 may include a polymer material. The polymer material may include acrylic resin, epoxy resin, polyimide, and polyethylene. In an embodiment, the organic encapsulation layer 32 may include acrylate.

[0187] In another embodiment, the thin film encapsulation layer TFE may have a structure in which the internal space between the substrate 100 and the upper substrate is encapsulated. The substrate 100 and the upper substrate, which is a transparent member, are bonded to each other using a sealing member. In this case, a desiccant or a filler may be provided in the internal space. The sealing member may be a sealant. In another embodiment, the sealing member may include a material cured by a laser beam. In an embodiment, the sealing member may include glass frit. Specifically, the sealing member may include an organic sealant such as a urethane resin, an epoxy resin, an acrylic resin, or an inorganic sealant such as silicone. As a urethane resin, for example, urethane acrylate, etc. may be used. As an acrylic resin, for example, butyl acrylate or ethylhexyl acrylate, etc. may be used. The sealing member may include a material cured by heat.

[0188] Figure 12 is an equivalent circuit diagram of an embodiment of a pixel PX of a display device.

[0189] Each pixel PX may include a pixel circuit PC and a display element connected to the pixel circuit PC. For example, the display element may be an organic light-emitting diode (OLED). The pixel circuit PC may include a first thin-film transistor T1, a second thin-film transistor T2, and a storage capacitor Cst. Each pixel PX may emit, for example, red, green, blue, or white light from the organic light-emitting diode OLED.

[0190] The second thin film transistor T2 is a switching thin film transistor that can be connected to the scan line SL and the data line DLL and can transmit a data voltage to the first thin film transistor T1 based on a switching voltage, the data voltage being input from the data line DLL and the switching voltage being input from the scan line SL. A storage capacitor Cst can be connected to the second thin film transistor T2 and the driving voltage line PL and can store a voltage corresponding to a difference between a voltage transmitted from the second thin film transistor T2 and a first power supply voltage ELVDD supplied to the driving voltage line PL.

[0191] The first thin film transistor T1 is a driving thin film transistor that can be connected to the driving voltage line PL and the storage capacitor Cst. It can control a driving current based on the voltage stored in the storage capacitor Cst. The driving current flows from the driving voltage line PL to the organic light emitting diode OLED. The organic light emitting diode OLED can emit light with a preset brightness corresponding to the driving current. The counter electrode (e.g., cathode) of the organic light emitting diode OLED can receive a second power supply voltage ELVSS.

[0192] Although the reference Figure 12The pixel circuit PC is described as including two thin film transistors and one storage capacitor, but the present disclosure is not limited thereto. The number of thin film transistors and the number of storage capacitors may be variously changed according to the design of the pixel circuit PC. In an embodiment, in addition to the two thin film transistors, the pixel circuit PC may further include four or more thin film transistors.

[0193] Through the embodiments, the efficiency of an apparatus for manufacturing a display device can be improved.

[0194] The effects of the present disclosure are not limited to the above-mentioned effects, and other effects not mentioned can be clearly understood by those having ordinary skill in the art from the claims.

[0195] It should be understood that the embodiments described herein should be considered in a descriptive sense only and not for purposes of limitation. Descriptions of features or advantages within each embodiment should generally be considered applicable to other similar features or advantages in other embodiments. Although the embodiments have been described with reference to the accompanying drawings, it will be understood by those skilled in the art that various changes in form and details may be made thereto without departing from the spirit and scope of the present invention as defined by the claims.

Claims

1. An apparatus for manufacturing a display device, comprising: a process part including a plurality of deposition parts that perform a deposition process of depositing a deposition material on a display substrate and a cleaning process of cleaning the insides of the plurality of deposition parts; as well as A controller for controlling the process, wherein the controller comprises: an initial scheduler that generates an initial schedule such that each of the plurality of deposition parts performs the deposition process A times and then performs the cleaning process once, where A is a natural number greater than 0; a determining part, determining whether the initial schedule satisfies a first condition that the number of deposition parts that simultaneously perform the cleaning process is less than B, where B is a natural number greater than 0; an actuator that operates the plurality of deposition parts based on the initial schedule in response to the initial schedule satisfying the first condition; and A modifier, in response to the initial schedule not satisfying the first condition, modifies the initial schedule into a first modified schedule so that one deposition part among the multiple deposition parts that simultaneously perform the cleaning process performs the deposition process A-1 times and then performs the cleaning process once.

2. The device according to claim 1, wherein The determination portion determines whether the first modification schedule satisfies the first condition, and the executor operates the plurality of deposition portions based on the first modification schedule in response to the first modification schedule satisfying the first condition.

3. The device according to claim 1, wherein The modifier modifies the initial schedule to the first modified schedule in response to the situation that the initial schedule does not satisfy the first condition, so that another deposition part among the multiple deposition parts that simultaneously perform the cleaning process performs the deposition process A-2 times and then performs the cleaning process once.

4. The device according to claim 1, wherein A is 7.

5. The device according to claim 1, wherein B is 2.

6. The device according to claim 1, wherein The plurality of deposition parts are provided in eight pieces.

7. An apparatus for manufacturing a display device, comprising: a first process part including a plurality of first deposition parts that perform a deposition process of depositing a deposition material on a display substrate and a first cleaning process of cleaning the interiors of the plurality of first deposition parts; a second process part including a plurality of second deposition parts that perform the deposition process and a second cleaning process that cleans the interiors of the plurality of second deposition parts; as well as Controller, including: A first controller controls the first process portion, wherein the first controller includes: a first initial scheduler that generates a first initial schedule such that each of the plurality of first deposition parts performs the deposition process A times and then performs the first cleaning process once, where A is a natural number greater than 0; a first determining part for determining whether the first initial schedule satisfies a first-1 condition that the number of first deposition parts simultaneously performing the first cleaning process is B or less, where B is a natural number greater than 0; The first executor, in response to the first initial schedule satisfying the first-1 condition, operating the plurality of first deposition sections based on the first initial schedule; and A first modifier, in response to the first initial schedule not satisfying the first-1 condition, modifying the first initial schedule to a first-1 modified schedule such that one of the plurality of first deposition parts that simultaneously perform the first cleaning process performs the deposition process A-1 times and then performs the first cleaning process once; and A second controller controls the second process portion.

8. The device according to claim 7, wherein The first determining portion determines whether the first-1 modification schedule satisfies the first-1 condition, and the first executor operates the plurality of first depositing portions based on the first-1 modification schedule in response to the first-1 modification schedule satisfying the first-1 condition.

9. The device according to claim 7, wherein A is 7.

10. The device according to claim 7, wherein B is 1.

11. The device according to claim 7, wherein The plurality of first deposition parts are provided in five.

12. The device according to claim 7, wherein The second controller includes: a second initial scheduler that generates a second initial schedule such that each of the plurality of second deposition parts performs the deposition process A times and then performs the second cleaning process once; a second determining part, determining whether the second initial schedule satisfies a second-1 condition that the number of second deposition parts simultaneously performing the second cleaning process is B or less; a second actuator, in response to the second initial schedule satisfying the second-1 condition, operating the plurality of second deposition parts based on the second initial schedule; and A second modifier modifies the second initial schedule into a second-1 modified schedule in response to the second initial schedule not satisfying the second-1 condition, so that one second deposition part among the plurality of second deposition parts that simultaneously perform the second cleaning process performs the deposition process A-1 times and then performs the second cleaning process once.

13. The device according to claim 12, wherein The second determining portion determines whether the second-1 modification schedule satisfies the second-1 condition, and the second actuator operates the plurality of second depositing portions based on the second-1 modification schedule in response to the second-1 modification schedule satisfying the second-1 condition.

14. The device according to claim 12, wherein The plurality of second deposition parts are provided in five.

15. The device according to claim 7, wherein The deposition process is performed by one of the plurality of first deposition parts and the plurality of second deposition parts.

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