Transport method, substrate, and repair method

Abstract

The present invention is a transport method for transporting a plurality of objects from a starting substrate to a target substrate using a laser beam, the transport method including a transport step for transporting the plurality of objects from the starting substrate to the target substrate by the laser beam passing through a first optical system, and a transport step for transporting the plurality of objects from the starting substrate to the target substrate by the laser beam passing through the first optical system. The present invention relates to a transfer method for transferring a target substrate so as to obtain a remaining object that is not transferred and remains on a starting substrate, the transfer method further comprising a repair step for, after the transfer step, pre-determining whether or not the target substrate includes a region in which the object is missing, and if the target substrate includes the region in which the object is missing, repairing the target substrate so as to obtain the remaining object that is not transferred and remains on the starting substrate. And irradiating the remaining object on the starting substrate with laser light through the second optical system so as to convey the object to a part where the object is missing. As a result, it is possible to provide a conveyance method capable of conveying an object at a high yield.

Description

Technical Field

[0001] The invention relates to a conveying method, a substrate and a repairing method. Background Art

[0002] The commercialization of high-brightness blue LEDs has enabled the three primary colors of light to be aligned, leading to the use of light-emitting diodes (hereinafter referred to as LEDs) in a wide range of fields. These applications include not only displays and monitors for televisions and computers, but also a wide range of applications, from large displays like street corner digital signage and large screens at live performances to smaller displays like those used in smartwatches.

[0003] In the mass production process of displays, a technology is used to transfer LED chips formed on a starting substrate to a circuit substrate. Figures 11 to 13 FIG. 1 shows a portion of an example of a manufacturing process for LED chip mounted components including a conveying process. However, the manufacturing process to which the conveying device and conveying method of the present invention are applied is not limited to the following. Figures 11 to 13 The manufacturing process is shown.

[0004] First, if Figure 11 As shown in (a), a sapphire substrate 110 is prepared as a starting substrate. A plurality of LED chips 6 are provided on the surface of the sapphire substrate 110 as objects to be transported.

[0005] In the case where a defective LED chip 6D is included in the plurality of LED chips 6, Figure 11 As shown in FIG. 1( b ), laser light source 3 transmits laser light LT through sapphire substrate 110 at the interface between the defective LED chip 6D and sapphire substrate 110 and irradiates the back surface of sapphire substrate 110 (the back surface relative to the surface on which the LED chips 6 are provided), thereby peeling and removing the defective LED chip 6 from sapphire substrate 110. This process can be called a trimming process, for example. Furthermore, if there are no defective LED chips 6D, the trimming process can be omitted.

[0006] Next, prepare Figure 11(c) shows a first intermediate substrate 210 as the target substrate. The first intermediate substrate 210 includes an adhesive layer 211 on the surface. The first intermediate substrate 210 and the sapphire substrate 110 that has undergone a trimming process as needed are placed facing each other in such a manner that the LED chip 6 and the adhesive layer 211 face each other. In the above state, the laser light source 3 is irradiated with laser LL on the back side of the sapphire substrate 110. The laser irradiation is performed while the laser light source 3 is relatively moved to the sapphire substrate 110 and the first intermediate substrate 210. In this way, multiple LED chips 6 can be irradiated in sequence. As a result, the multiple LED chips 6 are transported from the sapphire substrate 110 to the first intermediate substrate 210 by the laser LL. The above process can be called a laser lift-off process, for example.

[0007] Ga may sometimes remain on the surface of each of the plurality of LED chips 6 conveyed to the first intermediate substrate 210. Figure 11 As shown in (d), Ga cleaning is performed in the cleaning layer 60 .

[0008] Next, prepare Figure 12 The second intermediate substrate (release substrate) 120 shown in the lower right of (e) is provided. The second intermediate substrate 120 includes an adhesive layer 121 on its surface. The first intermediate substrate 210 and the second intermediate substrate 120 are bonded together in such a manner that the plurality of LED chips 6 and the adhesive layer 121 of the second intermediate substrate 120 are in contact with each other to form a composite body 300. Figure 12 The transfer device 20 shown in the upper left of (e) is used to press the composite body 300 in the vertical direction. Figure 12 As shown in the lower right of (e), the first intermediate substrate 210 is peeled off while pressing the second intermediate substrate 120 with the pressing device 30. Thus, the transfer of the LED chips 6 from the first intermediate substrate 210 to the second intermediate substrate 120 is completed. This process can be called a chip transfer process.

[0009] If there is a defective LED chip 6D among the LED chips 6 transferred onto the second intermediate substrate 120, Figure 12 As shown in (f), the defective LED chip 6D is removed. Figure 11 The trimming step shown in (b) is performed in the same manner. Therefore, this step can also be called a trimming step. If there are no defective LED chips 6D on the second intermediate substrate 120, the trimming step can be omitted.

[0010] Then, if Figure 12As shown in (g), the LED chips 6 on the second intermediate substrate 120 as the starting substrate are transferred to the finished substrate 220 (including the adhesive layer 221 on the surface) as the destination substrate using laser LM. This process can also be called a transfer process.

[0011] The finished substrate 220 may be Figure 12 (g) may be in a wafer shape as shown in the lower left, or may be in a rectangular shape as shown in the lower right. In the transfer step, a plurality of LED chips 6 can be conveyed at various pitches.

[0012] If there is a missing portion of the LED chip 6 on the finished substrate 220 obtained after the transfer process (for example, the portion to which the defective LED chip 6D removed in the trimming process is to be transferred), Figure 13 As shown in (h), the supplementary chip 6R' can be added from the repair substrate 130 as the starting substrate, which includes the normal supplementary chip 6R', to the part of the LED chip that has fallen off the finished substrate 220 as the target substrate. This process can also be called a repair process.

[0013] Then, if Figure 13 As shown in (i), a plurality of LED chips 6 are transferred in batches to the circuit board 230 using a chip mounter 400 from the completed substrate 220 obtained as described above.

[0014] Then, if Figure 13 As shown in (j), the circuit board 230 is subjected to a reflow process in the reflow apparatus 40, whereby the circuits of the circuit board 230 and the electrodes of the plurality of LED chips 6 can be bonded.

[0015] In the trimming, laser stripping, and repair processes, laser irradiation is performed on a portion of the LED chip to ablate it, or laser irradiation is performed on the interface between the starting substrate and the LED chip to ablate the adhesive layer, thereby separating the starting substrate from the LED chip. For example, Patent Document 1 describes the use of a line beam when transferring multiple chips. Furthermore, Patent Document 2 discloses a technique for irradiating a specific irradiation target with laser light using a galvano scanner in a retransfer method and a laser-induced forward transfer method.

[0016] Prior art literature

[0017] Patent Literature

[0018] Patent Document 1: Japanese Patent Application Laid-Open No. 2021-61396

[0019] Patent Document 2: Japanese Patent No. 7111916

[0020] Patent Document 3: Japanese Patent Application Laid-Open No. 2023-5499 Summary of the Invention

[0021] Problems to be solved by the invention

[0022] In mass production involving the transport of objects, as in other mass production, there is a demand for an improvement in yield.

[0023] The present invention is made to solve the above-mentioned problems, and its purpose is to provide a conveying method capable of conveying an object with high yield, a substrate capable of conveying an object with high yield by being used in a repair process, and a repair method capable of completing the conveyance of an object with high yield.

[0024] Technical means to solve the problem

[0025] In order to solve the above-mentioned problem, the present invention provides a conveying method as a first embodiment, which uses a laser to convey a plurality of objects from a starting substrate to a destination substrate. The conveying method includes a conveying step,

[0026] The transporting step transports the plurality of objects from the starting substrate to the destination substrate using laser light that has passed through the first optical system.

[0027] In the conveying step, the conveying is performed in such a manner that the remaining objects that have not been conveyed and remain on the starting substrate are obtained.

[0028] The conveying method further includes a repair process, which, after the conveying process, pre-determines whether the destination substrate includes a portion where the object is missing. If the portion includes a portion where the object is missing, the remaining object on the starting substrate is irradiated with the laser through a second optical system to convey the remaining object to the portion where the object is missing.

[0029] According to the transport method of the first embodiment of the present invention, the remaining objects that were not transported during the transport process can be utilized in the repair process, thereby enabling the transport of objects with a high yield. Furthermore, according to the transport method of the first embodiment of the present invention, the objects transported during the transport process and the remaining objects replenished during the repair process can be placed in the same production batch, thereby forming an array chip that uniformly includes both the objects and the remaining objects across the entire surface, thereby suppressing in-plane variations in product quality. Furthermore, the repair process in the second optical system can be performed using the remaining objects remaining from the first optical system without requiring the preparation of a new starting substrate during the repair process, thereby effectively utilizing the objects on the starting substrate.

[0030] Preferably, it also includes a trimming process, which, before the conveying process, pre-determines whether the multiple objects on the starting substrate include defective objects, and if the defective objects are included, selectively removes the defective objects by passing through the laser of the second optical system.

[0031] In the preferred embodiment, defective objects can be removed before the transfer process, so only normal objects can be transferred to the target substrate during the transfer process.

[0032] For example, the same device including the first optical system and the second optical system, which is configured to branch the laser from the same laser light source and irradiate the first optical system and the second optical system with laser light respectively, can be used, and the same starting substrate can be used to implement the conveying process and the repair process without changing the product and making adjustments.

[0033] The apparatus for carrying out the conveying method of the first embodiment of the present invention is not particularly limited. For example, an apparatus including both the first optical system and the second optical system as described above may be used. Alternatively, an apparatus including the first optical system and an apparatus including a second optical system different from the above apparatus may be used.

[0034] In addition, the same device including the first optical system and the second optical system, which is configured to branch the laser from the same laser light source and irradiate the first optical system and the second optical system with laser respectively, and the same starting substrate can be used to implement the trimming process and the conveying process without changing the product and adjusting.

[0035] According to the transport method of this embodiment, objects can be transported with high productivity while minimizing the occupied space and equipment investment.

[0036] For example, in the transfer step, the object formed in a rectangular area on the starting substrate may be transferred to the destination substrate, and the remaining object may remain on the starting substrate.

[0037] The conveyance in the conveying step is not particularly limited, and for example, the object formed in a rectangular area may be conveyed to the target substrate.

[0038] In addition, the present invention provides a substrate having a plurality of objects for a repair process, wherein:

[0039] The plurality of objects are present on the surface of the substrate,

[0040] The surface of the substrate includes a first region and a second region in which the plurality of objects have different existence densities. The existence density of the first region is higher than the existence density of the second region.

[0041] This type of substrate of the present invention can be obtained, for example, by the conveying process of the conveying method of the first embodiment of the present invention. The substrate of the present invention can be used, for example, in the repair process of the conveying method of the first embodiment, and the object that was not conveyed and remains in the conveying process can be used as a residual object in the repair process, so the conveying method as a whole can convey the object with a high yield. Alternatively, the substrate of the present invention can also be used in the repair process of replenishing the object to the non-mounting part of the mounting substrate or circuit substrate on which multiple objects are mounted. Even in this case, the substrate of the present invention manufactured by the conveying method of the first embodiment of the present invention can be used again in the repair process of the mounting substrate or circuit substrate, so the object can be conveyed with a high yield as a whole. That is, if the substrate of the present invention is used in the repair process, the object can be conveyed with a high yield.

[0042] The plurality of objects may not exist in the second area.

[0043] An object may exist in the second region, but typically no object exists.

[0044] The second area may be larger than the first area.

[0045] The second region may be larger than the first region where the plurality of objects exist at a higher density.

[0046] For example, the second region may have a rectangular planar shape.

[0047] The planar shape of the second region is not particularly limited and may be, for example, a rectangle.

[0048] In this case, for example, the substrate may have a circular planar shape,

[0049] The first region may have a generally circular outer edge,

[0050] The second region may be surrounded by the first region. In this case, corners of the rectangular planar shape of the second region may be substantially inscribed with the outer edge of the first region.

[0051] The planar shape of the substrate is not particularly limited and may be circular. Alternatively, the outer edge of the first region may be substantially circular, and the second region may be surrounded by the first region. In this case, the corners of the rectangular planar shape of the second region may be substantially inscribed with the outer edge of the first region.

[0052] In this case, the distance between the intersection of the diagonal lines in the rectangular planar shape of the second region and the center of the approximate circle serving as the outer edge of the first region may be greater than or equal to 0% and less than or equal to 5% of the diameter of the approximate circle.

[0053] The distance between the intersection of the diagonal lines of the rectangular planar shape of the second region and the center of the approximately circle serving as the outer edge of the first region is not particularly limited, and may be, for example, 0% to 5% of the length of the diameter of the approximately circle.

[0054] The area of ​​the second region may be equal to or greater than 60% of the total area of ​​the first region and the second region.

[0055] The area of ​​the second region may be 60% or more of the total area of ​​the first region and the second region, or may be less than 60%.

[0056] For example, the planar shape of the second area may be a square including a square. Thus, the object can be conveyed efficiently and at a high speed in the second area.

[0057] Alternatively, the planar shape of the second region may have a pair of long sides and a pair of short sides.

[0058] A ratio of the length of the short side to the length of the long side is greater than or equal to 0.7 and less than 1.0.

[0059] The shape of the second region is not particularly limited.

[0060] For example, in the first area, the plurality of objects may exist in a matrix.

[0061] The arrangement of the plurality of objects present in the first region is not particularly limited, and may be, for example, in a matrix.

[0062] Typically, the second region is provided at least in an inner portion excluding an outer edge portion of the substrate.

[0063] The second region is typically provided in the inner portion excluding the outer edge portion of the substrate.

[0064] The second region may include a plurality of portions each excluding the plurality of objects.

[0065] In the substrate of the present invention, the second region may be a continuous region, but may also include a plurality of portions each of which does not include the object.

[0066] Typically, the second area has a size that allows other multiple objects to be arranged in a matrix.

[0067] The second region is typically not a gap between a plurality of objects arranged in a matrix, but has a size that allows a plurality of other objects to be arranged in a matrix.

[0068] In addition, the present invention provides a repair method for transferring an object from a first substrate to an object non-mounting portion of a second substrate, wherein:

[0069] The substrate of the present invention is used as the first substrate, and one or more of the plurality of objects in the first region are conveyed to the object non-mounting portion of the second substrate using laser light.

[0070] According to such a repair method, the substrate of the present invention is used, so that the object can be transported with a high yield.

[0071] Preferably, the second substrate has an object mounting portion where a plurality of objects of the first group are present and the object non-mounting portion where no objects are present.

[0072] The plurality of objects in the first group of the second substrate and the plurality of objects in the first region of the first substrate originate from a same starting substrate.

[0073] If this repair method is used, the transfer yield can be improved more reliably.

[0074] Moreover, if this type of substrate is used, the objects transported in the conveying process and the remaining objects replenished in the repair process can be set to the same production batch, so that an arrangement chip containing the objects and the remaining objects can be formed evenly across the entire surface, which can suppress in-plane deviations in the quality of the product.

[0075] Furthermore, in the present invention, as a second embodiment of a conveying method, there is provided a conveying method for conveying an object from a first substrate to a second substrate using a laser, wherein:

[0076] As the first substrate, the following substrate was used:

[0077] having a plurality of objects including the transport object,

[0078] The plurality of objects exist on the surface of the first substrate,

[0079] The surface of the first substrate includes a first region and a second region having different existence densities of the plurality of objects, the existence density of the first region being greater than the existence density of the second region.

[0080] The object to be conveyed exists in the first area.

[0081] According to the conveying method of the second embodiment of the present invention, for example, objects remaining without being conveyed in the conveying process can be used as remaining objects, so that the conveying method as a whole can achieve conveyance of objects with a high yield.

[0082] For example, as the second substrate, a substrate having a non-mounting portion for the object may be used.

[0083] The transport object can be transferred from the first substrate to the object non-mounting portion of the second substrate for replenishment.

[0084] In this manner, for example, objects that were not transported in the transport step and remain can be used as surplus objects in the repair process, and thus the entire transport method can achieve transport with a high yield.

[0085] Furthermore, in the present invention, as a conveying method of a third embodiment, there is provided a conveying method for conveying a plurality of objects on a first substrate to a second substrate, wherein:

[0086] The plurality of objects on the first substrate are residues after defective objects have been removed in advance.

[0087] The plurality of objects are transferred from the first substrate to the second substrate such that a portion of the second substrate where the defective objects to be removed are to be transferred becomes an object missing portion.

[0088] The transport method according to the third embodiment of the present invention prevents defective objects from being transported, thereby achieving high-yield transport. Furthermore, rather than performing the repair process during each trimming step, the transport process is performed together with the other objects, assuming that objects are present in the area where the defective objects were removed. This allows the repair process to be performed at a convenient time later in the process. In particular, when an object is transported multiple times, it may be transported after undergoing both the trimming and repair processes. However, this may result in defects, and repeating the trimming and repair processes each time a defect occurs is inefficient. In this case, the repair process is not performed immediately after the trimming process. Instead, the object is transported in a manner that allows it to remain in the defective area, and the trimming process is performed as needed. Furthermore, during each subsequent transport step, the trimming process is performed as needed, followed by the repair process, which is then performed in batches near the final stage. This improves the efficiency of the repair process.

[0089] In addition, in the present invention, as a fourth embodiment of a conveying method, there is provided a conveying method having:

[0090] a trimming step of removing defective objects from a first substrate on which a plurality of objects are present; and

[0091] a conveying step of conveying objects other than the removed defective objects to a second substrate;

[0092] In the conveying step, the objects other than the removed defective objects are conveyed to the second substrate such that the portion where the removed defective objects are to be conveyed becomes an object missing portion.

[0093] The transport method according to the fourth embodiment of the present invention prevents defective objects from being transported, thereby achieving high-yield transport. Furthermore, rather than performing the repair process during each trimming step, the transport process is performed together with the other objects, assuming that objects are present in the area where the defective objects were removed. This allows the repair process to be performed at a convenient later time. In particular, when an object is transported multiple times, it may be transported after undergoing both the trimming and repair processes. However, this may result in defects, and repeating the trimming and repair processes each time a defect occurs is inefficient. In this case, the repair process is not performed immediately after the trimming process. Instead, the object is transported in such a way that it remains at the defective area, and the trimming process is performed as needed. Furthermore, during each subsequent transport step, the trimming process is performed as needed, followed by the repair process, which is then performed in batches near the final stage. This improves the efficiency of the repair process.

[0094] The conveying method of the third embodiment or the fourth embodiment may further include, for example, a repairing step of replenishing the replenishment object to the location where the object is missing.

[0095] In this case, the plurality of objects on the first substrate and the supplementary objects may be derived from the same starting substrate.

[0096] If the conveying method includes such a repair process, the starting substrate used when manufacturing the first substrate can also be used in the repair process, so conveying with a higher yield can be achieved.

[0097] Moreover, if this type of substrate is used, the objects transported in the conveying process and the remaining objects replenished in the repair process can be set to the same production batch, so that an arrangement chip containing the objects and the remaining objects can be formed evenly across the entire surface, which can suppress in-plane deviations in the quality of the product.

[0098] In addition, in the present invention, as a fifth embodiment of a conveying method, a conveying method is provided for conveying a plurality of objects from a first substrate to a second substrate using a laser, the conveying method including a conveying step,

[0099] The transporting step transports the plurality of objects from the first substrate to the second substrate using laser light that has passed through the first optical system.

[0100] In the conveying step, the object is conveyed so as to obtain any remaining object that is not conveyed and remains on the first substrate.

[0101] The conveying method further includes a repair process, which, after the conveying process, pre-determines whether the second substrate includes a portion where the object is missing. If the portion where the object is missing is included, the remaining object on the first substrate is irradiated with the laser through a second optical system to convey the remaining object to the portion where the object is missing.

[0102] According to the transport method of the fifth embodiment of the present invention, the remaining objects that were not transported during the transport process can be utilized in the repair process, thereby enabling the transport of objects with a high yield. Furthermore, according to the transport method of the fifth embodiment of the present invention, the objects transported during the transport process and the remaining objects replenished during the repair process can be placed in the same production batch. This allows for the formation of an array chip containing both the objects and the remaining objects to be uniformly arranged across the entire surface, thereby suppressing in-plane variations in product quality. Furthermore, the repair process in the second optical system can be performed using the remaining objects remaining from the first optical system without requiring the preparation of a new starting substrate during the repair process, thereby effectively utilizing the objects on the starting substrate.

[0103] Effects of the Invention

[0104] As described above, the transport method according to the first embodiment of the present invention can transport objects with a high yield. Furthermore, the transport method according to the first embodiment of the present invention allows the objects transported in the transport process and the remaining objects replenished in the repair process to be placed in the same production batch. This allows for the formation of an arrayed chip containing both the objects and the remaining objects uniformly across the entire surface, thereby suppressing in-plane variations in product quality. Furthermore, the repair process in the second optical system can be performed using the remaining objects remaining in the first optical system without requiring a new starting substrate to be prepared in the repair process, effectively utilizing the objects on the starting substrate.

[0105] In addition, the substrate of the present invention, for example, can be used in the repair process of the conveying method of the first embodiment, so that the objects that were not conveyed in the conveying process and remain can be used as residual objects in the repair process, so that the objects can be conveyed with a high yield as a whole. Alternatively, the substrate of the present invention can also be used in the repair process of replenishing objects to the non-mounting part of the mounting substrate or circuit substrate on which multiple objects are mounted. Even in this case, the substrate of the present invention manufactured by the conveying method of the first embodiment of the present invention can be used again in the repair process of the mounting substrate or circuit substrate, so that the conveying method as a whole can convey objects with a high yield. That is, if the substrate of the present invention is used in the repair process, the yield of the repair process that can convey objects with a high yield can be improved.

[0106] Furthermore, the conveying method according to the second embodiment of the present invention can achieve conveying with a high yield.

[0107] Furthermore, the conveying method according to the third embodiment of the present invention can achieve conveying with a high yield.

[0108] Furthermore, the conveying method according to the fourth embodiment of the present invention can achieve conveying with a high yield.

[0109] Furthermore, the conveying method according to the fifth embodiment of the present invention can achieve conveying with a high yield. BRIEF DESCRIPTION OF THE DRAWINGS

[0110] [ Figure 1 ] is a flowchart showing an example of a conveying method according to the first embodiment of the present invention.

[0111] [ Figure 2 ] is a block diagram of an example of a conveying system that can implement the conveying method of the first embodiment of the present invention.

[0112] [ Figure 3 ] is a schematic diagram for explaining the conveying process in the conveying method of the first embodiment of the present invention.

[0113] [ Figure 4 ] is another schematic diagram used to illustrate the conveying process in the conveying method of the first embodiment of the present invention.

[0114] [ Figure 5 ] is another schematic diagram for illustrating the conveying process in the conveying method of the first embodiment of the present invention.

[0115] [ Figure 6 ] is a schematic three-dimensional view of a starting substrate after the conveying step in an example of the conveying method according to the first embodiment of the present invention.

[0116] [ Figure 7] is a schematic diagram for illustrating the repair process in an example of the conveying method of the first embodiment of the present invention.

[0117] [ Figure 8 ] is another schematic diagram for illustrating the repair process in an example of the conveying method of the first embodiment of the present invention.

[0118] [ Figure 9 ] is a schematic diagram for illustrating an example of a trimming process that can be performed by the conveying method of the first embodiment of the present invention.

[0119] [ Figure 10 ] is a block diagram of an example of a conveying device that can implement the conveying method of the first embodiment of the present invention.

[0120] [ Figure 11 ] is part of a manufacturing flow chart of an example of an LED chip-mounted component.

[0121] [ Figure 12 ] is the successor Figure 11 This is a part of a manufacturing flow chart of an example of a subsequent LED chip-mounted component.

[0122] [ Figure 13 ] is the successor Figure 12 This is a part of a manufacturing flow chart of an example of a subsequent LED chip-mounted component.

[0123] [ Figure 14 ] is a schematic diagram showing a first example of a substrate of the present invention.

[0124] [ Figure 15 ]yes Figure 14 A schematic enlarged view of a portion 101a of the substrate is shown.

[0125] [ Figure 16 ]yes Figure 14 A schematic enlarged view of portion 102s of the substrate is shown.

[0126] [ Figure 17 ] is a schematic diagram showing a second example of the substrate of the present invention.

[0127] [ Figure 18 ] is a schematic diagram showing a third example of the substrate of the present invention.

[0128] [ Figure 19 ] is a schematic diagram showing a fourth example of the substrate of the present invention.

[0129] [ Figure 20 ] is a schematic diagram showing a fifth example of the substrate of the present invention.

[0130] [ Figure 21] is a schematic diagram showing a sixth example of the substrate of the present invention.

[0131] [ Figure 22 ] is a schematic diagram showing the seventh example of the substrate of the present invention.

[0132] [ Figure 23 ] is a schematic diagram showing an eighth example of the substrate of the present invention.

[0133] [ Figure 24 ] is a schematic diagram showing a ninth example of the substrate of the present invention.

[0134] [ Figure 25 ] is a schematic diagram showing the tenth example of the substrate of the present invention.

[0135] [ Figure 26 ] is a schematic diagram showing the eleventh example of the substrate of the present invention.

[0136] [ Figure 27 ] is a schematic diagram showing the twelfth example of the substrate of the present invention.

[0137] [ Figure 28 ] is a schematic diagram showing the thirteenth example of the substrate of the present invention.

[0138] [ Figure 29 ] is a schematic diagram showing the fourteenth example of the substrate of the present invention.

[0139] [ Figure 30 ] is a schematic diagram showing the fifteenth example of the substrate of the present invention.

[0140] [ Figure 31 ] is a schematic diagram showing the sixteenth example of the substrate of the present invention.

[0141] [ Figure 32 ] is a schematic diagram showing the seventeenth example of the substrate of the present invention.

[0142] [ Figure 33 ] is a schematic diagram showing the eighteenth example of the substrate of the present invention.

[0143] [ Figure 34 ] is a schematic diagram showing the nineteenth example of the substrate of the present invention.

[0144] [ Figure 35 ] is a schematic diagram showing the twentieth example of the substrate of the present invention.

[0145] [ Figure 36 ] is a schematic diagram showing the twenty-first example of the substrate of the present invention.

[0146] [ Figure 37 ] is an illustration of an example of the repair method of the present invention. DETAILED DESCRIPTION

[0147] As described above, there is a demand for development of a conveying method capable of conveying objects with high yield.

[0148] The present inventors have diligently studied the above-mentioned subject and have found that by transporting the remaining objects that were not transported in the transport process to the location where the objects were missing in the repair process, the objects can be transported with high yield, thereby completing the present invention.

[0149] Furthermore, the present inventors have discovered that, for example, if a substrate obtained in the above-described transport step is used in a repair step, the object can be transported with a high yield, thereby completing the present invention.

[0150] That is, a conveying method according to a first embodiment of the present invention conveys a plurality of objects from a starting substrate to a destination substrate using laser light, and the conveying method includes a conveying step.

[0151] The transporting step transports the plurality of objects from the starting substrate to the destination substrate using laser light that has passed through the first optical system.

[0152] In the conveying step, the conveying is performed in such a manner that the remaining objects that have not been conveyed and remain on the starting substrate are obtained.

[0153] The conveying method further includes a repair process, which, after the conveying process, pre-determines whether the target substrate includes a portion where the object is missing. If the portion includes a portion where the object is missing, the remaining object on the starting substrate is irradiated with the laser through a second optical system to convey the remaining object to the portion where the object is missing.

[0154] In addition, the substrate of the present invention has a plurality of objects to be used in the repair process, wherein:

[0155] The plurality of objects are present on the surface of the substrate,

[0156] The surface of the substrate includes a first region and a second region in which the plurality of objects have different existence densities. The existence density of the first region is higher than the existence density of the second region.

[0157] Hereinafter, the present invention will be described in detail, but the present invention is not limited thereto.

[0158] In the present invention, the transfer yield refers to the quotient obtained by dividing the number of non-defective objects transferred to the destination substrate by the number of non-defective objects on the source substrate.

[0159] [First embodiment]

[0160] A transport method according to a first embodiment of the present invention is a transport method for transporting a plurality of objects from a source substrate to a destination substrate using laser light.

[0161] Figure 1 A flow chart of an example of the transport method according to the first embodiment of the present invention is shown in FIG. The transport method includes a transport step and a repair step after the transport step. The transport method according to the first embodiment of the present invention may include a repair step before the transport step, but the repair step is an optional step in the transport method according to the first embodiment of the present invention.

[0162] The apparatus and system that can implement the conveying method of the first embodiment of the present invention are not particularly limited. The conveying method of the first embodiment of the present invention can be used, for example, Figure 2 The illustrated embodiment is implemented in the transport system 10 , but may also be implemented in other devices or systems.

[0163] Figure 2 The transport system 10 shown includes a first optical system 1 , a second optical system 2 , a laser light source 31 and a laser light source 32 , and a determination mechanism 5 .

[0164] The first optical system 1 is configured to receive the laser light L1 from the laser light source 31. The first optical system 1 may include a homogenizer, a mask, a projection lens, and a carrier, which are not shown in the figure but are along the optical path of the laser light L1. The homogenizer is configured to make the intensity distribution of the laser light L1 oscillated from the laser light source 31 uniform. The mask has a pattern that shapes the irradiation shape of the laser light L1 into a desired shape. The carrier is configured to hold a starting substrate and a target substrate. The projection lens is configured to image the laser light onto the irradiation object of the starting substrate on the carrier. In addition, the structure of the first optical system 1 is not limited to these.

[0165] The second optical system 2 is configured to receive the laser light L2 from the laser light source 32. The second optical system 2 includes a homogenizer, an aperture, a current scanner, a mask, a projection lens, and a stage, which are not shown in the figure but are arranged along the optical path of the laser light L2. The aperture is used to form a laser beam of a size that allows the current scanner to operate appropriately. The stage is configured to hold the starting substrate and / or the destination substrate. The other components are the same as those of the first optical system 1. In addition, the structure of the second optical system 2 is not limited to these.

[0166] The first optical system 1, the determination mechanism 5, and the second optical system 2 are connected to each other through a transmission mechanism T. The transmission mechanism T is configured to transmit Figure 2 The starting substrate and / or destination substrate are not shown in the figure.

[0167] Below, refer to the use Figure 2Each step in the conveying method according to the first embodiment of the present invention will be described in more detail by taking the example of the conveying system 10 of FIG.

[0168] (Transportation process)

[0169] The transport process is as follows Figure 3 As shown in FIG. 1 , a process of transferring a plurality of objects 6 from a starting substrate 100 to a destination substrate 200 by means of the laser light L1 passing through the first optical system 1 is schematically shown. Figure 11 (c) The laser lift-off process described above.

[0170] In the conveying process, for example, Figure 3 As shown, the laser light L1 from the laser light source 31 is sequentially irradiated onto each of the plurality of objects from the back side of the source substrate 100 .

[0171] Alternatively, you can Figure 4 and Figure 5 As shown, the laser light L1 is simultaneously irradiated onto the plurality of objects 6 from the back side of the source substrate 100 , thereby simultaneously transporting the plurality of objects 6 to the surface of the target substrate 200 . Figure 4 This is an example of irradiating a plurality of objects 6 (1×m (m>2)) arranged in a row with a laser beam L1 having a linear irradiation pattern. Figure 5 This is an example of irradiating a plurality of (n×m (n>2, m>2)) objects 6 arranged in multiple columns and rows with laser light L1 having a rectangular irradiation pattern. The irradiation pattern can be appropriately changed by, for example, a mask (not shown) included in the first optical system 1 .

[0172] In the conveying process of the conveying method according to the first embodiment of the present invention, Figure 6 As shown in the example, the object 6R that has not been conveyed and remains on the starting substrate 100 is conveyed. For example, the object 6 formed in a rectangular area on the starting substrate 100 can be conveyed to the target substrate 200. Figure 6 As shown, the remaining object 6R remains in the rectangular region on the starting substrate 100 , but the method of leaving the remaining object 6R is not particularly limited.

[0173] (Repair process)

[0174] The repair process is as follows: after the conveying process, it is pre-determined whether the target substrate 200 includes a portion where the object 6 is missing. If the portion includes a portion where the object 6 is missing, the remaining object 6R of the starting substrate 100 is irradiated with laser L2 through the second optical system 2 to convey the remaining object 6R to the portion where the object 6 is missing.

[0175] Figure 7FIG. 2 shows an example of determining whether or not a portion where the object 6 is missing is included on the target substrate 200. However, the unit to be determined in the repair process is not limited to Figure 7 Unit shown.

[0176] exist Figure 7 In the Figure 2 In the judgment mechanism 5 shown, the detection laser L from the tester 51 is used. D , an example of optically detecting a missing portion 6S of an object 6.

[0177] When it is found out through the above determination that the portion 6S containing the object 6 is missing, for example, Figure 8 As shown, the laser light source 32 irradiates the remaining object 6R on the source substrate 100 with laser light L2 through the second optical system 2 , and the remaining object 6R is transported to the portion 6S of the target substrate 200 where the object 6 is missing.

[0178] In this manner, by replenishing the remaining objects 6R remaining after the transport process to the location 6S, a portion of the remaining objects 6R remaining on the starting substrate 100 after the transport process can be utilized without waste. Consequently, the utilization efficiency of the non-defective objects 6 on the starting substrate can be improved. In other words, the transport method of the first embodiment of the present invention enables the transport of objects 6 with a high yield.

[0179] Furthermore, the objects 6 conveyed in the conveying step and the remaining objects 6R replenished in the repairing step originate from the same starting substrate 100 and can be considered to be from the same production lot.

[0180] Before, as referenced Figure 11 (a) and Figure 13 (h) As clearly explained above, the object 6 supplied in the laser lift-off process and the supplementary chip 6R' supplied in the repair process are supplied from different substrates. In this case, the object 6 supplied in the transport process and the supplementary chip 6R' supplied in the repair process are from different production batches, which may cause unevenness in the light emission state.

[0181] On the other hand, in the conveying method of the first embodiment of the present invention, the object 6 conveyed in the conveying process and the remaining object 6R replenished in the repair process can be set to the same production batch, so that an arrangement chip containing the object 6 and the remaining object 6R can be formed evenly on the entire surface.

[0182] In addition, the target substrate 200 of the repair process is not particularly limited as long as it is a substrate after the transport process. Figure 11 (c) shows the first intermediate substrate 210 immediately after the object 6 is conveyed in the conveying step. Figure 12 (e) lower right and Figure 12 (f) The second intermediate substrate (release substrate) 120, and Figure 12 (g) Figure 13 (h) and Figure 13 The finished substrate 220 shown in (i) is used as the target substrate 200. In the transport method of the first embodiment of the present invention, the target substrate 200 can be repaired after the transport process when necessary. Even when multiple transport processes are performed, the trimming and repair processes can be omitted, thereby improving productivity. This method is particularly suitable for processes involving two to five transport processes.

[0183] As the starting substrate 100 used in the transport process and the repair process, for example, Figure 11 (a) shows a sapphire substrate 110.

[0184] (Finishing process)

[0185] Figure 1 The optional trimming step shown is a step in which, before the conveying step, it is determined in advance whether a plurality of objects 6 on the starting substrate 100 include a defective object, and if a defective object is included, the defective object is selectively removed by the laser light L2 that has passed through the second optical system 2. Figure 11 (b) The finishing process shown.

[0186] More specifically, for example, the determination mechanism 5 is used to determine whether or not defective objects are included among the objects 6 on the starting substrate 100. This determination may be performed optically by the tester 51 as described above, or by other means.

[0187] Then, for example Figure 9 As shown, the defective object 6D passes through the second optical system 2 and is selectively removed by the laser light L2 from the laser light source 32 .

[0188] This prevents the defective object 6D from being transferred to the target substrate 200 .

[0189] In the transfer process, the portion of the target substrate 200 that faces the portion of the source substrate 100 where the defective object 6D exists becomes the missing portion 6S of the object 6. In the repair process, the remaining object 6R can be transferred to the portion 6S.

[0190] Alternatively, the trimming step before the transfer step may be omitted, and all of the multiple objects 6 on the target substrate 100 that are to be transferred to the target substrate 200 may be transferred to the target substrate 200 during the transfer step. In this case, the same trimming step as in the reference step may be performed. Figure 12 (f) In the trimming step similar to the trimming step described above, the defective object 6D is removed, and the portion where the removed defective object 6D existed becomes the missing portion 6S of the object 6 .

[0191] Above, we show the use of Figure 2 The first optical system 1 and the second optical system 2 shown are examples of the transport system 10 as separate devices, but the transport method of the first embodiment of the present invention can also be performed by a single device including the first optical system 1 and the second optical system 2.

[0192] Figure 10 Detailed Description of the Preferred Embodiment 1 A block diagram showing an example of a conveying device capable of implementing the conveying method according to the first embodiment of the present invention is shown in FIG.

[0193] Figure 10 The transport device 10 ′ shown includes a first optical system 1 and a second optical system 2 , and is configured to split laser light L from a common laser light source 3 and irradiate the first optical system 1 and the second optical system 2 with laser light L1 or laser light L2 .

[0194] Below, we will discuss in more detail Figure 10 The conveying device 10' shown will be described.

[0195] Figure 10 The illustrated conveying device 10 ′ includes a first optical system 1 , a second optical system 2 , a laser light source 3 , a determination mechanism 5 , a controller 4 , a homogenizer 31 , a plurality of reflection mirrors M, and a transport mechanism T.

[0196] The first optical system 1 and the second optical system 2 are identical to those of the reference except that they do not include a homogenizer. Figure 2 The optical systems described are the same.

[0197] The homogenizer 31 is configured to make the intensity distribution of the laser light L oscillated from the laser light source 3 uniform.

[0198] One of the multiple reflective mirrors M is movable, and the controller 4 can switch the optical path of the laser light L from the laser light source 3 between the optical path to the first optical system 1 and the optical path to the second optical system 2. The other reflective mirrors are used to align the optical paths of the laser light L, the laser light L1, and the laser light L2.

[0199] The transmission mechanism T and the judgment mechanism 5 and Figure 2 Same as shown.

[0200] By using this device, the transfer and repair steps described above can be performed without requiring a retooling process using the same starting substrate 100. This allows the transfer and repair steps to be performed without requiring a retooling process, which previously resulted in decreased productivity and inter-process variations due to alignment accuracy. This improves productivity and minimizes inter-process variations. Furthermore, by using only a single laser light source 3, equipment investment, maintenance costs, and system footprint can be reduced.

[0201] Furthermore, by using this device, trimming and transport steps can be performed without using the same starting substrate 100 for production adjustments. This improves productivity and reduces inter-process variations for the same reasons as above. Furthermore, by using only a single laser light source 3, equipment investment, maintenance costs, and system footprint can be reduced.

[0202] As a modified example, the transport device 10' may include a common projection lens and mask that are transported between the first optical system 1 and the second optical system 2 by a transport mechanism M, and a stage that is transported between the first optical system 1, the second optical system 2, and the determination mechanism 5 by the transport mechanism M. The projection lens, the mask, and the transport mechanism M may be provided in a manner similar to the embodiment of FIG. Figure 2 Alternatively, the transport device 10 ′ may include a mask having two patterns: a pattern for the first optical system 1 and a pattern for the second optical system 2 .

[0203] The conveying object 6 in the conveying device of the present invention is not particularly limited. The conveying device of the present invention can be used to convey LED chips such as μ-LEDs, for example.

[0204] [Substrate]

[0205] A first example of the substrate of the present invention is shown in Figure 14 In addition, Figure 14 An enlarged view of a portion 101a of the substrate is shown in FIG. Figure 15 In the example, the part 102s is magnified. Figure 1 Shown in Figure 16 middle.

[0206] Figure 14 The substrate 1000 is shown with a Figure 15 Multiple objects 6R are shown. Multiple objects 6R exist on the surface of substrate 1000. The surface of substrate 1000 has a first region 101 and a second region 102. The density of multiple objects 6R in first region 101 and second region 102 differs. More specifically, the density of objects 6R in first region 101 is greater than the density of objects 6R in second region 102.

[0207] Although not limited to this, such a substrate 1000 can be obtained by conveying the substrate 1000 in the conveying step of the conveying method of the first embodiment of the present invention described above in such a manner as to obtain the remaining objects that are not conveyed and remain on the starting substrate. Figure 6 The starting substrate 100 shown is an example of a substrate 1000 according to the present invention. By using this substrate 1000 in the repair process of the transport method according to the first embodiment of the present invention, objects 6R that were not transported during the transport process and remain can be used as surplus objects in the repair process, thereby enabling the transport method as a whole to transport objects 6 and 6R with a high yield. Alternatively, the substrate 1000 according to the present invention can be used in a repair process to replenish objects to a non-mounted portion of a mounting substrate or circuit board that already has multiple objects 6R mounted on it. Even in this case, the substrate 1000 according to the present invention, manufactured by the transport method according to the first embodiment of the present invention, can be reused in the repair process of the mounting substrate or circuit board, thereby enabling the overall transport of objects 6 and 6R with a high yield. In other words, using the substrate 1000 according to the present invention in the repair process enables the transport of objects with a high yield.

[0208] In addition, in Patent Document 3 Figure 2 , describes an LED chip forming substrate in which one LED chip is formed on a singulated small quadrilateral planar substrate. However, the substrate 1000 of the present invention is different from the LED chip forming substrate described in Patent Document 3 in that it has a plurality of objects 6 .

[0209] Below, we will discuss in more detail Figures 14 to 16 However, the matters described below are matters related to the substrate 1000 of the first example, and the substrate of the present invention is not limited to the following matters.

[0210] The substrate 1000 is, for example, Figure 14 As shown in FIG, the substrate 1000 has a circular surface shape. However, the planar shape of the substrate 1000 of the present invention is not limited to a circular shape.

[0211] The substrate 1000 of the first example further includes an outer edge portion 103. No object exists in the outer edge portion 103. In the substrate 1000 of the first example, the second region 102 is provided at least in the inner portion excluding the outer edge portion 103 of the substrate 1000. However, the substrate 1000 of the present invention may also be provided as follows. Figure 17 As shown, there is no portion where the object does not exist at the outer edge. The width of the outer edge portion 103 is preferably 10% or less of the radius of the substrate 1000, and more preferably 5% or less.

[0212] Figure 15The object 6R shown, that is, the object to be conveyed, is not particularly limited and may be, for example, an LED chip such as a μ-LED, or may be other micro electronic components.

[0213] like Figure 14 As shown in FIG. 1 , the first region 101 has a circular outer edge 101c when viewed macroscopically. However, when the object 6R is a chip, for example, Figure 15 As shown in FIG. 1 , the outer edge 101c of the first region is not a perfect curve, but has multiple angles. Figure 15 The shape formed by the outer edge 101 c having multiple corners as shown, the concept of circle and ellipse is expressed as “substantially circular.” That is, in the substrate 1000 , the first region 101 has the outer edge 101 c that is substantially circular.

[0214] In the first area 101, as Figure 15 As shown in FIG. 1 , a plurality of objects 6R exist in a matrix. Figure 15 In the illustrated example, a plurality of objects 6R are arranged in a matrix with gaps 6A therebetween.

[0215] exist Figures 14 to 16 In the substrate 1000 shown, there are no multiple objects in the second area 102. Specifically, the second area 102 is the area where the substrate 1000 is transported by the transport method of the first embodiment of the present invention. Figure 16 The second area 102 is the area after the plurality of parts 102s shown by the dotted line transport the plurality of objects 6. Figure 16 As shown by the dotted line in the middle, a plurality of other objects 6 can be arranged in a matrix. Although there is no particular limitation, the size can also be such that hundreds to tens of thousands of objects can be arranged in a matrix. Figure 15 As shown, gaps 6A between the plurality of objects 6R existing in a matrix are clearly different.

[0216] In the substrate 1000, the second region 102 has a rectangular planar shape. More specifically, the second region 102 is a square. In such a substrate 1000, Figure 14 As shown, the corners of the rectangular planar shape of the second region 102 are substantially inscribed within the outer edge 101c of the first region 101. This reduces the area of ​​the first region 101, for example, the number of objects remaining during the transport process. Furthermore, this allows for efficient and high-speed transport of objects within the second region.

[0217] However, for example Figure 18 As in the third example shown in FIG. 1 , the corners of the rectangular planar shape of the second region 102 may not be inscribed in the outer edge 101c of the first region 101. Figure 19 For example, the second region 102 may have a planar shape with a pair of long sides and a pair of short sides, and the ratio of the length of the short sides to the length of the long sides may be set to be greater than 0.7 and less than 1.0. Alternatively, Figure 20 and Figure 21 Even if the planar shape is a combination of rectangles as in the fifth and sixth examples shown respectively, the area of ​​the first region 101, for example, the number of remaining objects remaining in the conveying process can be reduced.

[0218] In the first example substrate 1000, the second region 102 is larger than the first region 101. In the present invention, the area of ​​the second region 102 is preferably at least 60% of the total area of ​​the first and second regions 101, 102. The maximum value of the ratio of the area of ​​the second region 102 to the total area of ​​the first and second regions 101, 102 is approximately 64% (= 2 / π) when the corners of the square planar shape of the second region 102 are inscribed in the outer edge 101c of the first region 101, as in the first example substrate 1000.

[0219] The substrate 1000 of the present invention is, for example, used in a repair process. Therefore, it only needs to have the number of objects 6R required for repair. The number of objects 6R required for repair is typically small, so the first region 101 can be smaller than the second region 102. The more objects 6 are transported during the transport process, the higher the transport yield. Therefore, a smaller first region 101 remaining during the transport process is advantageous in terms of transport yield.

[0220] Furthermore, in the first example substrate 1000, the distance between the intersection point C2 of the diagonal lines of the rectangular planar shape of the second region 102 and the center C1 of the approximately circle serving as the outer edge 101c of the first region 101 is greater than or equal to 0% and less than or equal to 5% of the length of the diameter of the approximately circle. More specifically, in the first example substrate 1000, the distance between C1 and C2 is zero and coincides with each other.

[0221] The planar shape of the first region 101 can be controlled, for example, by the arrangement of the plurality of objects 6 when the starting substrate 100 is fabricated and the planar shape of the second region 102. The planar shape of the second region 102 can be controlled, for example, by transferring a portion of the plurality of objects 6 from the starting substrate 100 on which the plurality of objects 6 are arranged. Transferring a portion of the plurality of objects 6 can be performed for each object 6, or by simultaneously transferring a plurality of objects 6 using mass transfer. Furthermore, transferring a portion of the plurality of objects 6 can also be performed using multiple mass transfers.

[0222] During mass transfer, all objects 6 in the transfer target region may be transferred, but some objects 6R may remain in the transfer target region serving as the second region 102. Therefore, the second region 102 may contain the objects 6R if the density is lower than that of the first region 101.

[0223] As described above, the first region 101 and the second region 102 in the substrate 1000 of the present invention can be variously deformed.

[0224] For example, Figure 22 As shown in the seventh example, the second region 102 may include a plurality of portions 102A and 102B, each of which does not include a plurality of objects 6R. An intermediate portion 104 including the objects 6R exists between the portions 102A and 102B.

[0225] The substrate 1000 of the seventh example can be obtained, for example, by conveying the plurality of objects 6R included in portions of the first region 101 of the substrate 1000 of the first example that are adjacent to the four sides of the second region 102 .

[0226] In addition, for example, when forming the second region 102, Figure 23 and Figure 24 As shown in the eighth and ninth examples respectively, the first region 101 is intentionally increased to destroy the rectangular planar shape. Figure 24 As shown, a portion 104 where the object 6R exists remains in the center of the substrate 1000 .

[0227] In addition, for example, when forming the second region 102, Figure 25 、 Figure 26 and Figure 27 As in the tenth to twelfth examples shown, a plurality of portions (eg, 102a, 102b, ..., 102n) each not including a plurality of objects 6R are formed.

[0228] Furthermore, if Figure 28 As in the thirteenth example shown, the planar shape of the second region 102 may also be a substantially circular shape. Such a second region 102 may be formed, for example, by transporting the object 6 in units. Figure 28 The thirteenth example shown is advantageous in that the first region 101 can be reduced in size compared to the first example.

[0229] The above shows an example in which the planar shape of the substrate 1000 is a circular shape. For example, Figure 29 and Figure 30The fourteenth and fifteenth examples are rectangular in planar shape. In addition, for fixing or alignment, an orientation flat or notch may be provided on the circular substrate, or the corners of the rectangle may be chamfered.

[0230] For example, by Figure 29 By making the planar shape of the second region 102 similar to the planar shape of the substrate 1000 as in the example shown, the size of the first region 101 can be reduced.

[0231] For example, if multiple objects 6 are transferred one by one, the planar shape of the second area 102 can also be set to a circle or rectangle as described above, and then the destroyed shapes can be set to a polygon with a pentagon or larger shape, or a part of the side or part of the side of a polygon with a quadrilateral or larger shape can be changed into a curved shape, etc. for appropriate design.

[0232] Although this is an extreme example, for example, Figures 31 to 36 As in the sixteenth to twenty-first examples shown, a small amount of the first region 101 is left, and the remainder is used as the second region 102. The substrate 1000 of these examples is also included in the substrate 1000 of the present invention.

[0233] [Substrate on the other side]

[0234] The substrate of the present invention described above is another substrate having a plurality of objects to be used in a repair process, and can also be referred to as the following substrate:

[0235] The plurality of objects are arranged in a matrix on the surface of the substrate.

[0236] The surface of the substrate includes an area having a size capable of arranging a plurality of objects in a matrix, and no objects are arranged in the area.

[0237] Refer again Figures 14 to 16 , multiple objects 6R on the substrate 1000 are as follows Figure 15 As shown, for example, the substrate 1000 is arranged in a matrix of 2×2 or more. Although there is no particular limitation, the size can be such that hundreds to tens of thousands of objects can be arranged in a matrix. In addition, the surface of the substrate 1000 includes a Figure 16 An area 102 is shown that is large enough for a plurality of objects 6. No objects 6 are arranged in the area 102.

[0238] Furthermore, the substrate 1000 of the present invention can be, for example, a substrate obtained in the transport step of the transport method of the first embodiment of the present invention after a plurality of objects 6 have been transported from the starting substrate 100. However, the substrate 1000 of the present invention is not limited to the substrate obtained in the transport step of the transport method of the first embodiment of the present invention. For example, a target substrate having a plurality of objects transported obtained by the transport method of the first embodiment of the present invention can be used as the second starting substrate, and a substrate obtained by transporting a plurality of objects 6 from the second starting substrate in the transport step of the transport method of the first embodiment is also included in the substrate of the present invention. An object-carrying substrate obtained by transporting a plurality of objects 6 from the second starting substrate is used as the third starting substrate, and substrates obtained in the transport step of the transport method of the first embodiment or subsequent starting substrates are also included in the substrate of the present invention.

[0239] [Repair method]

[0240] The repair method of the present invention transports the object from the first substrate to the object non-mounting portion of the second substrate. In the repair method,

[0241] The substrate of the present invention is used as the first substrate, and one or more of the plurality of objects in the first region are conveyed to the object non-mounting portion of the second substrate using laser light.

[0242] Below, refer to Figure 37 An example of the repair method of the present invention will be described. However, the repair method of the present invention is not limited to Figure 37 Example shown.

[0243] In the repair method of the above example, the object 6R is transferred from the first substrate 1000 to the object non-mounting portion 6S of the second substrate 200 .

[0244] Here, the substrate 1000 of the present invention described above is used as the first substrate, and one or more objects 6R among the plurality of objects 6R in the first area 101 are conveyed to the object non-mounting portion 6S of the second substrate 200 using the laser light L2 from the laser light source 32 .

[0245] According to this repair method, the substrate 1000 of the present invention is used, and thus the objects 6 and 6R can be conveyed with a high yield.

[0246] Furthermore, in the example described above, the second substrate 200 preferably has an object mounting portion 202 where the first group of objects 6 are located, and an object non-mounting portion 6S where no objects are located. The first group of objects 6 on the second substrate 200 and the first region 101 of the first substrate 1000 are preferably derived from the same starting substrate. For example, the first group of objects 6 on the second substrate 200 can be transported during the transport step of the transport method of the first embodiment.

[0247] If this repair method is used, the transfer yield can be improved more reliably.

[0248] In addition, if this type of substrate is used, the objects transported in the conveying process and the remaining objects replenished in the repair process can be set to the same production batch, so that an arrangement chip containing the objects and the remaining objects can be formed evenly across the entire surface, which can suppress in-plane deviations in the quality of the product.

[0249] [Various embodiments of the transport method]

[0250] The conveying method of the present invention includes various embodiments. Hereinafter, the second to fifth embodiments will be described in order.

[0251] [Second embodiment]

[0252] A conveying method according to a second embodiment conveys an object from a first substrate to a second substrate using a laser. In the conveying method,

[0253] As the first substrate, the following substrate was used:

[0254] having a plurality of objects including the transport object,

[0255] The plurality of objects exist on the surface of the first substrate,

[0256] The surface of the first substrate includes a first region and a second region having different existence densities of the plurality of objects, the existence density of the first region being greater than the existence density of the second region.

[0257] The object to be conveyed exists in the first area.

[0258] For example, the substrate of the present invention can be used as a first substrate to transport an object to a second substrate as a destination substrate. In other words, the substrate of the present invention can also be used in a transport method other than a repair process.

[0259] According to the conveying method of the second embodiment of the present invention, for example, objects remaining without being conveyed in the conveying process can be used as remaining objects, so that the conveying method as a whole can realize conveying of objects with a high yield.

[0260] In the above embodiment, for example, a substrate having an object non-mounting portion may be used as the second substrate, and the transported object may be transferred from the first substrate to the object non-mounting portion of the second substrate for replenishment.

[0261] In this manner, for example, objects that were not transported in the transport step and remain can be used as surplus objects in the repair process, and thus the entire transport method can achieve transport with a high yield.

[0262] [Third embodiment]

[0263] A conveying method according to a third embodiment conveys a plurality of objects on a first substrate to a second substrate. In the conveying method,

[0264] The plurality of objects on the first substrate are residues after defective objects have been removed in advance.

[0265] The plurality of objects are transferred from the first substrate to the second substrate such that a portion of the second substrate where the defective objects to be removed are to be transferred becomes an object missing portion.

[0266] According to the conveying method of the third embodiment of the present invention, defective objects can be prevented from being conveyed, thereby achieving conveyance with a high yield.

[0267] [Fourth embodiment]

[0268] The conveying method of the fourth embodiment has the following features:

[0269] a trimming step of removing defective objects from a first substrate on which a plurality of objects are present; and

[0270] a conveying step of conveying objects other than the removed defective objects to a second substrate;

[0271] In the conveying step, the objects other than the removed defective objects are conveyed to the second substrate such that the portion where the removed defective objects are to be conveyed becomes an object missing portion.

[0272] According to the conveying method of the fourth embodiment of the present invention, defective objects can be prevented from being conveyed, thereby achieving conveyance with a high yield.

[0273] The transport method of the third embodiment or the fourth embodiment described above may further include, for example, a repairing step of replenishing the replenishment object to the portion where the object is missing.

[0274] In this case, the plurality of objects on the first substrate and the supplementary objects may be derived from the same starting substrate.

[0275] If the conveying method includes such a repair process, the starting substrate used when making the first substrate can also be used in the repair process, thereby suppressing deviations that may occur due to differences in the starting substrates, such as deviations in brightness or color from other normal objects.

[0276] [Fifth embodiment]

[0277] A transport method according to a fifth embodiment uses laser light to transport a plurality of objects from a first substrate to a second substrate. The transport method includes a transport step.

[0278] The transporting step transports the plurality of objects from the first substrate to the second substrate using laser light that has passed through the first optical system.

[0279] In the conveying step, the object is conveyed so as to obtain any remaining object that is not conveyed and remains on the first substrate.

[0280] The conveying method further includes a repair process, which, after the conveying process, pre-determines whether the second substrate includes a portion where the object is missing. If the portion where the object is missing is included, the remaining object on the first substrate is irradiated with the laser through a second optical system to convey the remaining object to the portion where the object is missing.

[0281] As previously explained, the starting substrate used in the transfer method of the present invention is not limited to a starting substrate on which multiple objects are formed. A target substrate obtained by a single transfer method can also be used as a second starting substrate. Such a second starting substrate can also be a substrate having a resin layer formed on a laser-transparent substrate such as synthetic quartz.

[0282] Therefore, with the transport method according to the fifth embodiment of the present invention, the remaining objects that were not transported during the transport process can be utilized in the repair process, similar to the first embodiment, thereby enabling the transport of objects with a high yield. Furthermore, with the transport method according to the fifth embodiment of the present invention, the objects transported during the transport process and the remaining objects replenished during the repair process can be made from the same production batch, thereby enabling the formation of an array chip containing both the objects and the remaining objects uniformly across the entire surface, thereby suppressing in-plane variations in the quality of the product. Furthermore, without having to prepare a new starting substrate during the repair process, the repair process in the second optical system can be performed using the remaining objects remaining from the first optical system, thereby effectively utilizing the objects on the starting substrate.

[0283] The present invention is not limited to the above-described embodiments, which are merely examples, and any embodiments having substantially the same structure and achieving the same functions and effects as the technical concept described in the claims of the present invention are within the technical scope of the present invention.

Claims

1. A transport method for transporting a plurality of objects from a starting substrate to a destination substrate using a laser, the transport method comprising a transport step, The transporting step transports the plurality of objects from the starting substrate to the destination substrate using laser light that has passed through the first optical system. In the conveying step, the conveying is performed in such a manner that the remaining objects that have not been conveyed and remain on the starting substrate are obtained. The conveying method further includes a repair process, which, after the conveying process, pre-determines whether the destination substrate includes a portion where the object is missing. If the portion includes a portion where the object is missing, the remaining object on the starting substrate is irradiated with the laser through a second optical system to convey the remaining object to the portion where the object is missing.

2. The conveying method according to claim 1 further includes a trimming process, which, before the conveying process, pre-determines whether the multiple objects on the starting substrate include defective objects, and if the defective objects are included, selectively removes the defective objects by passing through the laser of the second optical system.

3. The conveying method according to claim 1, wherein: Using the same device including the first optical system and the second optical system, which is configured to branch the laser from the same laser light source and irradiate the first optical system and the second optical system with laser respectively, and using the same starting substrate, the conveying process and the repair process are carried out without changing the product and adjusting.

4. The conveying method according to claim 2, wherein: Using the same device including the first optical system and the second optical system, which is configured to branch the laser from the same laser light source and irradiate the first optical system and the second optical system with laser light respectively, and using the same starting substrate, the trimming process and the conveying process are carried out without changing the product and adjusting.

5. The conveying method according to any one of claims 1 to 4, wherein: In the transfer step, the object formed in the rectangular area on the starting substrate is transferred to the destination substrate, and the remaining object remains on the starting substrate.

6. A substrate having a plurality of objects for a repair process, wherein: The plurality of objects are present on the surface of the substrate, The surface of the substrate includes a first region and a second region in which the plurality of objects have different existence densities. The existence density of the first region is higher than the existence density of the second region.

7. The substrate according to claim 6, wherein The plurality of objects do not exist in the second area.

8. The substrate according to claim 6, wherein The second area is larger than the first area.

9. The substrate according to claim 6, wherein The second region has a rectangular planar shape.

10. The substrate according to claim 9, wherein The substrate has a circular planar shape, The first region has a substantially circular outer edge, The second area is surrounded by the first area, Corners of the rectangular planar shape of the second region are substantially inscribed in the outer edge of the first region.

11. The substrate according to claim 10, wherein The distance between the intersection of diagonal lines in the rectangular planar shape of the second region and the center of the approximate circle as the outer edge of the first region is 0% to 5% of the length of the diameter of the approximate circle.

12. The substrate according to claim 8, wherein The area of ​​the second region is greater than or equal to 60% of the total area of ​​the first region and the second region.

13. The substrate according to claim 9, wherein The planar shape of the second region is a square.

14. The substrate according to claim 9, wherein The planar shape of the second region has a pair of long sides and a pair of short sides, A ratio of the length of the short side to the length of the long side is greater than or equal to 0.7 and less than 1.

0.

15. The substrate according to claim 6, wherein In the first area, the plurality of objects exist in a matrix.

16. The substrate according to claim 6, wherein The second region is provided at least in an inner portion excluding an outer edge portion of the substrate.

17. The substrate according to claim 6, wherein The second region includes a plurality of portions each excluding the plurality of objects.

18. The substrate according to claim 6, wherein The second area has a size that allows other multiple objects to be arranged in a matrix.

19. A repair method for transferring an object from a first substrate to a non-object-mounting portion of a second substrate, wherein: The substrate according to any one of claims 6 to 18 is used as the first substrate, and one or more of the plurality of objects in the first region are conveyed to the object non-mounting portion of the second substrate using laser light.

20. The repair method according to claim 19, wherein: The second substrate has an object mounting portion where a plurality of objects of the first group are present and an object non-mounting portion where no objects are present. The plurality of objects in the first group of the second substrate and the plurality of objects in the first region of the first substrate originate from a same starting substrate.

21. A conveying method for conveying an object from a first substrate to a second substrate using a laser, wherein: As the first substrate, the following substrate was used: having a plurality of objects including the transport object, The plurality of objects exist on the surface of the first substrate, The surface of the first substrate includes a first region and a second region having different existence densities of the plurality of objects, the existence density of the first region being greater than the existence density of the second region. The object to be conveyed exists in the first area.

22. The conveying method according to claim 21, wherein: As the second substrate, a substrate having a non-mounting portion for the object is used. The transport object is transferred from the first substrate to the object non-mounting portion of the second substrate for replenishment.

23. A method for conveying a plurality of objects on a first substrate to a second substrate, wherein: The plurality of objects on the first substrate are residues after defective objects have been removed in advance. The plurality of objects are transferred from the first substrate to the second substrate such that a portion of the second substrate where the defective objects to be removed are to be transferred becomes an object missing portion.

24. A conveying method comprising: a trimming step of removing defective objects from a first substrate on which a plurality of objects are present; and a conveying step of conveying objects other than the removed defective objects to a second substrate; In the conveying step, the objects other than the removed defective objects are conveyed to the second substrate such that the portion where the removed defective objects are to be conveyed becomes an object missing portion.

25. The transfer method according to claim 23 or 24, further comprising a repairing step, The repairing step is to replenish the replenishment object to the missing part of the object.

26. The repair method according to claim 25, wherein: The plurality of objects on the first substrate and the supplementary objects originate from the same starting substrate.

27. A conveying method for conveying a plurality of objects from a first substrate to a second substrate using a laser, the conveying method comprising a conveying step, The transporting step transports the plurality of objects from the first substrate to the second substrate using laser light that has passed through the first optical system. In the conveying step, the object is conveyed so as to obtain any remaining object that is not conveyed and remains on the first substrate. The conveying method further includes a repair process, which, after the conveying process, pre-determines whether the second substrate includes a portion where the object is missing. If the portion where the object is missing is included, the remaining object on the first substrate is irradiated with the laser through a second optical system to convey the remaining object to the portion where the object is missing.

Images