Electronic device and shielding member

Abstract

The embodiment of the invention provides electronic equipment and a shielding part. The electronic equipment comprises a main board, a camera device and a shielding piece. The mainboard comprises a first connecting terminal and a grounding terminal. The camera device comprises a camera module, a circuit board and a second connecting terminal. The camera module is electrically connected with the circuit board. The second connecting terminal is electrically connected with the circuit board. The first connection terminal and the second connection terminal are electrically connected. A containing space is formed between the shielding piece and the main board. And the first connecting terminal and the second connecting terminal are positioned in the accommodating space. The shielding piece comprises a shielding frame and a shielding cover which are electrically connected. The shielding frame is connected with the mainboard. The shielding frame is electrically connected with the grounding end. And the shielding cover is connected with the shielding frame. The second connection terminal is electrically connected with the shielding cover. The electronic equipment provided by the embodiment of the invention can reduce the possibility that the photographing experience is influenced by signal interference on the photographing device.

Description

Electronic equipment and shielding components

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on February 2, 2023, with application number 202310120762.4 and application name “Electronic device and shielding component”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The embodiments of the present application relate to the field of terminal technology, and in particular to an electronic device and a shielding component. Background Art

[0003] With the explosive growth of electronic devices such as smartphones and tablets, electronic devices have more and more functions. Since people expect electronic devices to meet more functional requirements, the functions that electronic devices themselves can realize are increasing. For example, electronic devices include camera devices. People expect the camera performance of electronic devices to be higher and higher in order to obtain high-resolution images. The camera device includes a camera module, such as a rear camera module. The camera module is used to take pictures of a selected target and form corresponding image information. The camera module includes a light inlet for receiving light. External light can enter the camera module through the light inlet. The camera module can be electrically connected to the mainboard. For example, the camera module can be electrically connected to the mainboard through a circuit board to achieve signal interaction. However, when the electronic device performs the shooting function, there is a situation where the camera device is interfered with by the signal, resulting in screen distortion, freeze or freezing on the shooting interface, affecting the shooting experience of the electronic device.

[0004] Summary of the Invention

[0005] The embodiments of the present application provide an electronic device and a shielding component, which can reduce the possibility that a camera device is affected by signal interference and thus affects the shooting experience.

[0006] A first aspect of the present application provides an electronic device, which includes a mainboard, a camera device, and a shielding component.

[0007] The mainboard includes a first connection terminal and a ground terminal. The camera device includes a camera module, a circuit board, and a second connection terminal. The camera module is electrically connected to the circuit board. The second connection terminal is electrically connected to the circuit board. The first connection terminal and the second connection terminal are electrically connected. A storage space is formed between the shielding member and the mainboard. The first connection terminal and the second connection terminal are located within the storage space. The shielding member includes an electrically connected shielding frame and a shielding cover. The shielding frame is connected to the mainboard. The shielding frame is electrically connected to the ground terminal. The shielding cover is connected to the shielding frame. The second connection terminal is electrically connected to the shielding cover.

[0008] In the electronic device of the present application, a mainboard includes a first connection terminal and a ground terminal, and a camera device includes a camera module, a circuit board, and a second connection terminal. The first connection terminal and the second connection terminal are connected. The first connection terminal and the second connection terminal are electrically connected. The camera device and the mainboard are communicatively connected to achieve signal exchange. A shielding member is connected to the mainboard, and the shielding member covers the outside of the first connection terminal and the second connection terminal. The shielding member is electrically connected to the ground terminal of the mainboard to achieve grounding. The second connection terminal is electrically connected to the shielding member. Therefore, the first connection terminal, the second connection terminal, the shielding cover, and the shielding frame can be grounded through the ground terminal of the mainboard, thereby facilitating the reduction of the ground impedance at the connector formed by the first connection terminal and the second connection terminal, avoiding impedance mutations at the connector formed by the first connection terminal and the second connection terminal, and at the same time facilitating the elimination of parasitic capacitance formed between the connector formed by the first connection terminal and the second connection terminal and the ground terminal of the mainboard, thereby facilitating the reduction of the possibility of electromagnetic signals interfering with the first connection terminal and the second connection terminal and causing electromagnetic coupling, thereby ensuring the stability of the signal transmission process between the camera device and the mainboard, allowing the electronic device to smoothly perform the shooting function and improving the shooting experience. The shielding member can also effectively shield the electromagnetic signal from causing adverse effects and interference to the first connecting terminal and the second connecting terminal, thereby further helping to reduce the possibility of interference to the interactive signal between the camera device and the mainboard.

[0009] In a possible implementation manner, the shielding frame is a ring-shaped structure. The first connecting terminal is located inside the shielding frame.

[0010] The shielding frame is arranged around the first connecting terminal, so that the shielding frame can provide a good shielding effect for the first connecting terminal in any direction.

[0011] In one possible embodiment, the shielding frame includes a bottom flange, a first side panel, and a top flange. Both the bottom flange and the top flange are connected to the first side panel. The bottom flange is electrically connected to a ground terminal. The outer surface of the top flange, facing away from the mainboard, is electrically connected to the inner surface of the shielding cover, facing the mainboard.

[0012] The outer surface of the top flange facing away from the mainboard is electrically connected to the inner surface of the shielding cover facing the mainboard, which is conducive to achieving a larger electrical connection area between the shielding cover and the shielding frame, thereby effectively reducing impedance and maintaining a good electrical connection between the two.

[0013] In a possible implementation manner, the outer surface of the top flange facing away from the mainboard directly abuts against the inner surface of the shielding cover facing the mainboard, so that the top flange is electrically connected to the shielding cover.

[0014] The width of at least a portion of the top flange is greater than the width of the bottom flange.

[0015] Setting the width of at least part of the top flange to be larger is beneficial to increasing the contact area between the shielding cover and the shielding frame, thereby effectively compensating for the contact area between the shielding cover and the shielding frame and reducing the possibility that the contact area does not meet the requirements due to unevenness of the contact surfaces of the shielding cover and the shielding frame.

[0016] The bottom flange is set to a relatively small width, which can help reduce the positive projection area of ​​the bottom flange on the mainboard while meeting the connection strength between the bottom flange and the mainboard, thereby reducing the space occupancy rate of the bottom flange on the mainboard and reducing the possibility of reducing the area on the mainboard where electronic devices can be installed due to the bottom flange occupying too much space on the mainboard.

[0017] In a possible implementation manner, the shielding cover and the first side plate are clamped together.

[0018] The shielding cover and the first side plate are connected in a snap-fit ​​manner, which is conducive to quick assembly or separation of the shielding cover and the shielding frame, thereby improving the efficiency of assembly or separation.

[0019] In a possible implementation manner, a clamping portion is provided on one of the shielding cover and the first side plate, and a clamping portion is provided on the other one, wherein the clamping portion is clamped with the clamping portion.

[0020] In one possible embodiment, the shielding cover includes a top plate and a second side plate connected to each other. A snap-fit ​​portion is provided on one of the first and second side plates, and a locking portion is provided on the other. First and second connection terminals are provided between the top plate and the main board. An outer surface of the top flange facing away from the main board is electrically connected to an inner surface of the top plate facing the main board.

[0021] In a possible implementation, there are multiple second side panels, and a gap exists between two adjacent second side panels.

[0022] Each second side plate is independently arranged so that when any second side plate is deformed during the clamping process, the other second side plates will not be pulled.

[0023] In a possible implementation, the outer surface of the top flange facing away from the main board directly abuts against the inner surface of the top plate facing the main board, so that the top flange is electrically connected to the top plate.

[0024] In a possible implementation manner, the shielding cover and the shielding frame are engaged with each other.

[0025] The shielding cover and the shielding frame are connected by a snap-fit ​​method, which is conducive to quick assembly or separation of the shielding cover and the shielding frame, thereby improving the efficiency of assembly or separation work.

[0026] In a possible implementation manner, a surface of the second connection terminal facing away from the first connection terminal is bonded to the shielding cover by conductive adhesive, so that the second connection terminal is electrically connected to the shielding cover.

[0027] In one possible embodiment, the electronic device further includes a reinforcing member. At least a portion of the reinforcing member is disposed on a side of the second connection terminal facing away from the first connection terminal. The reinforcing member is a conductive structure. The reinforcing member is electrically connected to the second connection terminal. The reinforcing member is electrically connected to the shielding cover.

[0028] The reinforcing member protects the second connection terminal, effectively preventing it from being damaged by external forces. The shielding member applies compressive stress to the second connection terminal, ensuring the connection reliability and stability between the first and second connection terminals and reducing the possibility of the second connection terminal being pulled out of the first connection terminal and disconnected.

[0029] In a possible implementation manner, the shielding cover directly abuts against the reinforcing member.

[0030] The shielding cover of the shielding member is in direct contact with the reinforcing member to achieve electrical connection, so that no additional structural member for achieving electrical connection is required between the shielding member and the reinforcing member, which is beneficial to reducing the number of parts used and the assembly process.

[0031] In one possible embodiment, the electronic device further includes a conductive member disposed between the shielding cover and the reinforcing member, electrically connecting the shielding cover and the reinforcing member.

[0032] The shielding cover and the reinforcing member can jointly press the conductive member to ensure good contact between the shielding member and the reinforcing member and the conductive member, thereby maintaining the stability of the electrical connection state between the shielding member and the reinforcing member and the conductive member.

[0033] In a possible implementation manner, the conductive element is a flexible structure.

[0034] Since the conductive part can be compressed and deformed, when there are uneven surfaces on the surface of at least one of the shielding cover and the reinforcement of the shielding part, the conductive part can compensate by its own deformation, thereby ensuring that the shielding cover of the shielding part and the conductive part, as well as the reinforcement and the conductive part, maintain a close fit and contact state, so that the shielding cover of the shielding part and the reinforcement maintain a good electrical connection state, which is beneficial to reducing impedance.

[0035] In a possible implementation manner, the reinforcing member is capacitively coupled to the shielding cover.

[0036] The non-direct contact between the reinforcing member and the shielding cover can avoid poor contact between the shielding cover and the reinforcing member, thereby reducing the possibility of Passive Inter-Modulation (PIM) problems and spurious emission (RSE) problems caused by poor contact.

[0037] In a possible implementation, the electronic device further includes a high-dielectric layer, which is disposed between the reinforcing member and the shielding cover.

[0038] The shield and reinforcement are in non-electrical contact with the high-dielectric layer. Because capacitive coupling eliminates the risk of poor contact, there's no requirement for stable contact resistance between the shield and reinforcement, eliminating the need for surface treatments like nickel or gold plating. Furthermore, the placement of the high-dielectric layer can be freely and flexibly selected based on design requirements.

[0039] In a possible implementation manner, the material of the high dielectric layer includes a wave absorbing material.

[0040] The high dielectric layer can absorb and attenuate electromagnetic signals incident from space, reduce or eliminate reflected electromagnetic signals, and help reduce interference caused by adverse electromagnetic signals.

[0041] In a possible implementation, a relief hole is provided between the shielding cover and the shielding frame, and the circuit board is passed through the relief hole.

[0042] In a possible implementation manner, an insulating layer is provided on the outer surface of the shielding cover.

[0043] The insulating layer provided on the shielding cover can help maintain good insulation and isolation between the shielding cover and other conductive structural components. If the shielding cover is not provided with an insulating layer, there is a possibility that the shielding cover and other conductive structural components will be electrically connected. If there is poor contact between the shielding cover and other conductive structural components, it may cause passive inter-modulation (PIM) problems and stray radiation (RSE) problems between the shielding cover and other conductive structural components. The insulating layer provided on the outer surface of the shielding cover of the present application can effectively reduce the possibility of the above problems.

[0044] In a possible implementation, the electronic device further includes an electronic component, which is disposed on the mainboard, within the accommodating space, and spaced apart from the first connecting terminal.

[0045] The shielding member can shield the electronic components so that when the electronic components are in working state, the electromagnetic signals emitted by the electronic components are not easily transmitted to the devices located outside the shielding member and relatively close to the electronic components, effectively reducing the possibility of the electronic components causing signal interference to adjacent devices.

[0046] In one possible embodiment, an electronic device includes a housing and an antenna. A motherboard is disposed within the housing. The housing includes a frame. The antenna is disposed in the frame. A first connecting terminal, a second connecting terminal, and a shielding member are disposed proximate to the antenna.

[0047] Since the shielding member can provide effective shielding for the first connecting terminal and the second connecting terminal, when the antenna is in a working state of radiating wireless signals, the electromagnetic signal generated by the antenna is not likely to interfere with the first connecting terminal and the second connecting terminal, thereby reducing the possibility of the antenna having an adverse effect on the camera device when performing the shooting function.

[0048] A second aspect of the present application provides a shielding component for use in an electronic device. The shielding component includes a shielding frame and a shielding cover. The shielding cover is connected to the shielding frame. The shielding cover and the shielding frame are connected to form a receiving cavity. The receiving cavity has an opening. The shielding frame is used for grounding. The shielding cover is electrically connected to the shielding frame.

[0049] A third aspect of the present application provides an electronic device, which includes a mainboard, a camera device, and a shielding component.

[0050] The mainboard includes a first connection terminal and a ground terminal. The camera device includes a camera module, a circuit board, and a second connection terminal. The camera module is electrically connected to the circuit board. The second connection terminal is disposed on the circuit board. The first connection terminal and the second connection terminal are electrically connected. The shielding member is an integrally molded structure. The shielding member is connected to the mainboard. A storage space is formed between the shielding member and the mainboard. The first connection terminal and the second connection terminal are located within the storage space. The shielding member is electrically connected to the ground terminal. The second connection terminal is electrically connected to the shielding member.

[0051] In one possible embodiment, the shielding member includes a top wall and side walls. The side wall is annular in structure. The side wall is connected to the mainboard. The side wall is electrically connected to a ground terminal of the mainboard. The top wall is electrically connected to the second connection terminal.

[0052] The side wall of the shielding member is arranged around the first connecting terminal, so that the shielding member can provide a good shielding effect for the first connecting terminal in any direction.

[0053] In a possible implementation manner, a surface of the second connecting terminal facing away from the first connecting terminal is bonded to the top wall of the shielding component by conductive adhesive, so that the second connecting terminal is electrically connected to the top wall of the shielding component.

[0054] In one possible embodiment, the electronic device further includes a reinforcing member. The reinforcing member is disposed on a side of the second connecting terminal facing away from the first connecting terminal. The reinforcing member is a conductive structure. The reinforcing member is electrically connected to the second connecting terminal. The reinforcing member is electrically connected to a top wall of the shielding member.

[0055] The reinforcing member protects the second connection terminal, effectively preventing it from being damaged by external forces. The shielding member applies compressive stress to the second connection terminal, ensuring the connection reliability and stability between the first and second connection terminals and reducing the possibility of the second connection terminal being pulled out of the first connection terminal and disconnected.

[0056] In a possible implementation manner, the top wall of the shielding component directly abuts against the reinforcing component.

[0057] The top wall of the shielding member is in direct contact with the reinforcing member to achieve electrical connection, so that no additional structural member for achieving electrical connection is required between the shielding member and the reinforcing member, which is beneficial to reducing the number of parts used and the assembly process.

[0058] In one possible embodiment, the electronic device further includes a conductive member disposed between the top wall of the shielding member and the reinforcing member, and electrically connecting the top wall of the shielding member and the reinforcing member.

[0059] The shielding member and the reinforcing member can jointly press the conductive member to ensure good contact between the shielding member and the reinforcing member and the conductive member, thereby maintaining the stability of the electrical connection state between the shielding member and the reinforcing member and the conductive member.

[0060] In a possible implementation manner, the conductive element is a flexible structure.

[0061] Since the conductive part can be compressed and deformed, when there are uneven surfaces on the surface of at least one of the shielding part and the reinforcement part, the conductive part can compensate by its own deformation, thereby ensuring that the shielding part and the conductive part, as well as the reinforcement part and the conductive part maintain a close fit and contact state, so that the shielding part and the reinforcement part maintain a good electrical connection state, which is conducive to reducing impedance.

[0062] In a possible implementation manner, the reinforcing member is capacitively coupled to the top wall of the shielding member.

[0063] The non-direct contact between the reinforcing member and the shielding member can avoid poor contact between the shielding member and the reinforcing member, thereby reducing the possibility of Passive Inter-Modulation (PIM) problems and spurious emission (RSE) problems caused by poor contact.

[0064] In a possible implementation, the electronic device further includes a high-dielectric layer, which is disposed between the reinforcing component and the top wall of the shielding component.

[0065] The shield and reinforcement are in non-electrical contact with the high-dielectric layer. Because capacitive coupling eliminates the risk of poor contact, there's no requirement for stable contact resistance between the shield and reinforcement, eliminating the need for surface treatments like nickel or gold plating. Furthermore, the placement of the high-dielectric layer can be freely and flexibly selected based on design requirements.

[0066] In a possible embodiment, the shielding member has an avoidance hole, and the circuit board is passed through the avoidance hole.

[0067] In a possible implementation, an insulating layer is provided on the outer surface of the shielding element.

[0068] The insulating layer provided on the shielding member can help maintain a good insulation isolation state between the shielding member and other conductive structural members. If the shielding member is not provided with an insulating layer, there is a possibility that the shielding member and the other conductive structural members will be electrically connected. If there is poor contact between the shielding member and the other conductive structural members, it will lead to the possibility of Passive Inter-Modulation (PIM) problems and stray radiation (RSE) problems between the shielding member and the other conductive structural members. The insulating layer provided on the outer surface of the shielding member of the present application can effectively reduce the possibility of the above problems. BRIEF DESCRIPTION OF THE DRAWINGS

[0069] FIG1 is a schematic diagram of the structure of an electronic device provided by this application;

[0070] FIG2 is a schematic diagram of a partially exploded structure of an electronic device provided by this application;

[0071] FIG3 is a schematic diagram of a partial structure of the camera device provided by the present application;

[0072] FIG4 is a schematic diagram of a partial cross-sectional structure of an electronic device provided by the related art;

[0073] FIG5 is a schematic diagram of a partial structure of an electronic device provided by this application;

[0074] FIG6 is a schematic diagram of a partially exploded structure of an electronic device provided by this application;

[0075] FIG7 is a schematic diagram of a partial structure of an electronic device provided by this application;

[0076] FIG8 is a schematic diagram of a partial cross-sectional structure of an electronic device provided by the present application;

[0077] FIG9 is a schematic diagram of a partial structure of an electronic device provided by this application;

[0078] FIG10 is a schematic diagram of a partial structure of an electronic device provided by this application;

[0079] FIG11 is a schematic diagram of a partial cross-sectional structure of an electronic device provided by the present application;

[0080] FIG12 is an enlarged schematic diagram of point M in FIG11;

[0081] FIG13 is a schematic diagram of a partial cross-sectional structure of an electronic device provided by the present application;

[0082] FIG14 is a schematic diagram of a partial cross-sectional structure of an electronic device provided by the present application;

[0083] FIG15 is a schematic diagram of a partial cross-sectional structure of an electronic device provided by the present application;

[0084] FIG16 is a schematic diagram of a partial structure of an electronic device provided by this application;

[0085] FIG17 is a schematic diagram of a partial structure of an electronic device provided by this application;

[0086] FIG18 is a schematic diagram of a partial structure of the electronic device provided in this application.

[0087] FIGURES 10. Electronic device; 20. Display assembly; 30. Housing; 31. Back cover; 32. Frame; 40. Mainboard; 41. First connecting terminal; 42. Ground terminal; 50. Electronic component; 60. Camera device; 61. Camera module; 611. Optical imaging system; 612. Image sensor; 62. Circuit board; 63. Second connecting terminal; 70. Shielding member; 71. Shielding frame; 71a. Middle through hole; 711. Bottom flange; 712. First side panel; 7121. First outer side surface; 7122. Second outer side surface; 7123. Third outer side surface; 7124. Fourth outer side surface; 713. Top flange; 72. Shielding cover; 721. Top panel; 722. Second side panel; 70a. Top wall; 70b. Side wall; 80. Clamping portion; 90. Clamping portion; 100. Reinforcement member; 110. Conductive member; 120. High dielectric layer; 130. Avoidance hole; 140. Insulation layer; 150. Electronic component; 160. Antenna; 170. System-on-chip; 180. Accommodation space; 190. Connector; 200. Metal bracket; Z, thickness direction. DETAILED DESCRIPTION

[0088] The electronic device in the embodiments of the present application can be referred to as user equipment (UE) or terminal, etc. For example, the electronic device can be a tablet computer (portable Android device, PAD), a personal digital assistant (PDA), a handheld device with wireless communication function, a computing device, a vehicle-mounted device, a wearable device, a virtual reality (VR) terminal device, an augmented reality (AR) terminal device, a wireless terminal in industrial control (industrial control), a wireless terminal in self-driving (self-driving), a wireless terminal in remote medical (remote medical), a wireless terminal in smart grid (smart grid), a wireless terminal in transportation safety (transportation safety), a wireless terminal in smart city (smart city), a wireless terminal in smart home (smart home), and other mobile terminals or fixed terminals. In the embodiments of the present application, the form of the terminal device is not specifically limited.

[0089] In the embodiment of the present application, FIG1 schematically shows the structure of an electronic device 10. Referring to FIG1 , the electronic device 10 is described as a handheld device with wireless communication function. The handheld device with wireless communication function can be, for example, a mobile phone.

[0090] FIG2 schematically shows a partial exploded structure of an electronic device 10. Referring to FIG1 and FIG2, the electronic device 10 according to an embodiment of the present application includes a display assembly 20, a housing 30, a mainboard 40, and an electronic device 50.

[0091] The display assembly 20 has a display area for displaying image information. The display assembly 20 presents image information to the user through the display area. The display assembly 20 is mounted on the housing 30.

[0092] The motherboard 40 can be connected to the housing 30 and located within the housing 30. The motherboard 40 can be located between the display assembly 20 and the housing 30, so that the motherboard 40 is not easily visible to the user from the outside of the electronic device 10. For example, the housing 30 includes a back cover 31 and a frame 32. The back cover 31 is connected to the frame 32. For example, the frame 32 can be, but is not limited to, a rectangular frame. The motherboard 40 can be disposed within the space formed by the back cover 31 and the frame 32.

[0093] The electronic device 50 is provided on the mainboard 40. The mainboard 40 may be a printed circuit board (PCB). The electronic device 50 is soldered to the mainboard 40 by a soldering process. The electronic device 50 includes, but is not limited to, a radio frequency integrated circuit (RFIC), a radio frequency power amplifier (RFPA), a wireless fidelity (WIFI) chip, a central processing unit (CPU), an intelligent algorithm chip, a power management chip (PMIC) or an application processor (AP). The application processor may be, for example, but is not limited to, used to carry a system-on-chip (SOC). The system-on-chip includes an image signal processing (ISP) module. Since the internal space of the electronic device 10 is relatively small, the electronic device 50 is highly integrated on the mainboard 40 to fully reduce the volume of the mainboard 40 and reduce the space occupancy of the mainboard 40.

[0094] The electronic device 10 may also include other components, such as a battery. The battery may be disposed within the housing 30. A battery is a structural component that converts chemical energy into electrical energy. The battery is used to provide electrical energy to the electronic device 10 to ensure its normal operation. For example, the battery may provide electrical energy to the display assembly 20 to enable the display assembly 20 to display image information or complete corresponding operating instructions. Alternatively, the battery may provide electrical energy to the mainboard 40 to ensure the normal operation of the electronic components 50 on the mainboard 40. For example, the battery may be a lithium-ion battery, such as a lithium iron phosphate battery.

[0095] Figure 3 schematically shows the local structure of the camera device. As shown in Figures 2 and 3, the electronic device 10 may include a camera device 60. The camera device 60 may include a camera module 61 and a circuit board 62. The camera module 61 can be electrically connected to the mainboard 40 through the circuit board 62 to achieve signal interaction. For example, the circuit board 62 can be, but is not limited to, a flexible printed circuit board (FPCB). The camera module 61 of the camera device 60 can be arranged in the housing 30. The housing 30 has a light-transmitting hole. Along the axial direction of the light-transmitting hole, the light inlet of the camera module 61 is arranged corresponding to the light-transmitting hole. External light can reach the light inlet through the light-transmitting hole. For example, the cross-sectional shape of the light-transmitting hole can be circular, elliptical or polygonal, which is not limited in this application. The camera device 60 can be a rear-mounted camera or a front-mounted camera, which is not limited in this application.

[0096] The camera module 61 may include an optical imaging system 611 and an image sensor 612. The optical imaging system 611 may include multiple lenses. When using the camera module 61 for shooting, the light on the object side may pass through the optical imaging system 611 and then be incident on the photosensitive surface of the image sensor 612. The photosensitive surface of the image sensor 612 refers to the surface that receives light. The optical imaging system 611 has a virtual imaging surface. The imaging surface of the optical imaging system 611 may coincide with the photosensitive surface of the image sensor 612. The image sensor 612 may be a sensor that converts the light signal incident on the photosensitive surface into an electrical signal. For example, the image sensor 612 may be a complementary metal oxide semiconductor (CMOS) sensor or a charge coupled device (CCD).

[0097] In the related art, FIG4 schematically shows a partial cross-sectional structure of an electronic device of the related art. As shown in FIG4, the image sensor 612 of the camera module 61 can be electrically connected to the system-on-chip 170 on the mainboard 40 through the circuit board 62 and the connector 190. The connector 190 includes two connecting terminals that plug into each other. For example, the connector 190 can be a board-to-board connector. When the camera device 60 of the electronic device 10 performs the shooting function, there is signal interaction, such as data signals or control signals, between the image sensor 612, the circuit board 62, the connector 190, the wires on the mainboard 40, and the image signal processing module of the system-on-chip 170. However, the connector 190 has a large ground impedance, making the connector 190 an impedance discontinuity point, with a sudden impedance change, which makes it easy to couple with external electromagnetic fields, and there is a situation where the data signal or control signal transmitted between the camera module 61 and the image signal processing module is interfered with, thereby causing the camera device 60 to be interfered with by the signal, resulting in a screen distortion, freeze, or other phenomena on the shooting interface, affecting the shooting experience of the electronic device 10. For example, when a radio frequency chip or a wireless fidelity chip transmits power, the generated electromagnetic signal may cause signal interference to the connector 190 .

[0098] In the electronic device 10 provided in the embodiment of the present application, a shielding member is provided on the mainboard 40 and covers the outside of the first connection terminal and the second connection terminal. The first connection terminal and the second connection terminal can be grounded through the shielding member, effectively reducing impedance. In addition, the shielding member can be used to shield the first connection terminal and the second connection terminal. Therefore, the electronic device 10 in the embodiment of the present application can reduce the possibility of electromagnetic signals interfering with the first connection terminal and the second connection terminal, thereby reducing the possibility of signal interference to the camera device 60 and improving the shooting experience of the electronic device 10.

[0099] FIG5 schematically shows a partial structure of an electronic device. FIG5 is a top view of the structure along the thickness direction Z of the mainboard 40 in FIG4 . FIG6 schematically shows a partial exploded structure of the electronic device 10 . Referring to FIG5 and FIG6 , the mainboard 40 of an embodiment of the present application includes a first connection terminal 41 and a ground terminal 42 . The first connection terminal 41 provides an interface for switching. The first connection terminal 41 can be electrically connected to the system-on-chip 170 on the mainboard 40. The ground terminal 42 is used for grounding.

[0100] The camera device 60 includes a camera module 61, a circuit board 62, and a second connection terminal 63. The camera module 61 is electrically connected to the circuit board 62. The second connection terminal 63 is disposed on the circuit board 62. The second connection terminal 63 is electrically connected to the circuit board 62. For example, the circuit board 62 may be a flexible circuit board. For example, the circuit board 62 may be a strip-shaped structure. The camera module 61 is electrically connected to one end of the circuit board 62, while the second connection terminal 63 is electrically connected to the other end of the circuit board 62. The first connection terminal 41 and the second connection terminal 63 are electrically connected. The first connection terminal 41 and the second connection terminal 63 are detachably connected to facilitate assembly or separation of the first connection terminal 41 and the second connection terminal 63, thereby facilitating assembly or separation of the camera device 60 and the mainboard 40. The first connection terminal 41 and the second connection terminal 63 are connected to form a connector. For example, the connector formed by the first connection terminal 41 and the second connection terminal 63 may be a board-to-board connector. The first connection terminal 41 and the second connection terminal 63 may be connected by plugging. For example, the first connection terminal 41 and the second connection terminal 63 each have a pin, and the two are plugged into each other through their respective pins (PIN pins) to achieve electrical connection. The camera module 61 can be connected to the mainboard 40 through the circuit board 62, the second connection terminal 63, and the first connection terminal 41 to achieve signal exchange such as data signals or control signals.

[0101] As shown in Figures 5 and 6, the electronic device 10 also includes a shielding member 70. The mainboard 40 can provide a mounting base for the shielding member 70. The shielding member 70 is connected to the mainboard 40. The shielding member 70 can avoid the electronic device 50 on the mainboard 40. A storage space 180 is formed between the shielding member 70 and the mainboard 40 (as shown in Figure 8). The first connecting terminal 41 and the second connecting terminal 63 are located in the storage space 180. The shielding member 70 is electrically connected to the ground terminal 42 of the mainboard 40 to achieve grounding of the shielding member 70.

[0102] Figure 7 schematically shows a partial structure of an electronic device. Figure 8 schematically shows a partial cross-sectional structure of an electronic device. Referring to Figures 6, 7 and 8, the shielding member 70 includes an electrically connected shielding frame 71 and a shielding cover 72. The shielding frame 71 is used for grounding. The shielding frame 71 is connected to the mainboard 40. The shielding frame 71 is electrically connected to the grounding terminal 42 of the mainboard 40. The shielding cover 72 is connected to the shielding frame 71. Exemplarily, the shielding cover 72 is detachably connected to the shielding frame 71. The shielding cover 72 is connected to the shielding frame 71 and forms a receiving cavity with an opening. After the shielding cover 72 and the shielding frame 71 are assembled, a shielding member 70 with a receiving cavity is formed. The second connecting terminal 63 is electrically connected to the shielding cover 72.

[0103] In the present application, the shielding frame 71 and the shielding cover 72 are electrically connected, and the shielding frame 71 is electrically connected to the ground terminal 42. Therefore, the shielding cover 72 is indirectly grounded through the shielding frame 71, and the second connection terminal 63 is indirectly grounded through the shielding cover 72 and the shielding frame 71. The assembled shielding member 70 can cover the first connection terminal 41 and the second connection terminal 63. At the same time, the shielding member 70 is grounded, which helps to eliminate the parasitic capacitance formed between the connector formed by the first connection terminal 41 and the second connection terminal 63 and the ground terminal 42 of the mainboard 40, thereby helping to reduce the possibility of electromagnetic coupling interference caused by electromagnetic signals to the first connection terminal 41 and the second connection terminal 63.

[0104] The shielding member 70 is arranged on the periphery of the connector formed by the first connecting terminal 41 and the second connecting terminal 63. The shielding member 70 covers the connector formed by the first connecting terminal 41 and the second connecting terminal 63. The accommodating space 180 formed by the shielding member 70 and the main board 40 can also be called a shielding space. The opening of the accommodating cavity of the shielding member 70 faces the main board 40. The accommodating space 180 includes the accommodating cavity of the shielding member 70. The first connecting terminal 41 and the second connecting terminal 63 are located in the shielding space. The shielding member 70 can be used to provide effective shielding for the first connecting terminal 41 and the second connecting terminal 63, reduce the electromagnetic signals of other components outside the shielding member 70 or the electromagnetic signals of the environment in which the electronic device 10 is located to interfere with the first connecting terminal 41 and the second connecting terminal 63, and help reduce the possibility of interference in the signal interaction between the camera module 61 and the main board 40 due to interference from electromagnetic signals on the first connecting terminal 41 and the second connecting terminal 63, thereby improving the working stability of the camera device 60.

[0105] In the electronic device 10 of the present application, the mainboard 40 includes a first connection terminal 41 and a ground terminal 42, and the camera device 60 includes a camera module 61, a circuit board 62 and a second connection terminal 63. The first connection terminal 41 and the second connection terminal 63 are detachably connected. The first connection terminal 41 and the second connection terminal 63 are electrically connected. The camera device 60 is communicatively connected to the mainboard 40 to achieve signal interaction. The shielding member 70 is connected to the mainboard 40, and the shielding member 70 is covered on the outside of the first connection terminal 41 and the second connection terminal 63. The shielding member 70 is electrically connected to the ground terminal 42 of the mainboard 40 to achieve grounding. The second connection terminal 63 is electrically connected to the shielding member 70. Therefore, the first connection terminal 41, the second connection terminal 63, the shielding cover 72, and the shielding frame 71 can be grounded through the ground terminal 42 of the mainboard 40, thereby reducing the ground impedance of the connector formed by the first connection terminal 41 and the second connection terminal 63, avoiding the occurrence of impedance mutations in the connector formed by the first connection terminal 41 and the second connection terminal 63, and eliminating the parasitic capacitance formed between the connector formed by the first connection terminal 41 and the second connection terminal 63 and the ground terminal 42 of the mainboard 40, thereby reducing the possibility of electromagnetic signals interfering with the first connection terminal 41 and the second connection terminal 63 and causing electromagnetic coupling, ensuring the stability of the signal transmission process between the camera device 60 and the mainboard 40, allowing the electronic device 10 to smoothly perform the shooting function and improving the shooting experience. The shielding member 70 can also effectively shield the first connection terminal 41 and the second connection terminal 63 from adverse effects and interference caused by electromagnetic signals, thereby further reducing the possibility of interference with the interactive signal between the camera device 60 and the mainboard 40.

[0106] In some feasible embodiments, the shielding member 70, the shielding cover 72 and the shielding frame 71 of the present application can be welded to each other, which is beneficial to ensure that the shielding cover 72 and the shielding frame 71 have good connection reliability and stability, and reduce the possibility of the shielding cover 72 and the shielding frame 71 being separated due to accidental collision.

[0107] In some implementations, the shielding member 70, shielding cover 72, and shielding frame 71 of the present application are detachably connected, facilitating assembly or separation of the shielding cover 72 and shielding frame 71. The first connection terminal 41 and the second connection terminal 63 are disposed between the shielding cover 72 and the mainboard 40. When the first connection terminal 41 and the second connection terminal 63 need to be repaired or inspected, the shielding cover 72 can be removed from the shielding frame 71 without completely removing the shielding member 70 from the mainboard 40. After repairing or inspecting the first connection terminal 41 and the second connection terminal 63, the shielding cover 72 is reassembled with the shielding frame 71. Therefore, the detachable connection between the shielding cover 72 and the shielding frame 71 improves the efficiency of repair or inspection work. The assembly process may include, but is not limited to, installing the first connection terminal 41 on the mainboard 40. Then, the shielding frame 71 is placed around the first connection terminal 41. The shielding frame 71 is then connected to the mainboard 40. The second connection terminal 63 is connected to the first connection terminal 41. Finally, the shielding cover 72 is connected to the shielding frame 71. The assembled shielding member 70 covers the first connecting terminal 41 and the second connecting terminal 63 .

[0108] In some implementations, the shielding member 70 can be welded to the mainboard 40 via a welding process. Welding the shielding member 70 to the ground terminal 42 facilitates good grounding, ensures a strong connection between the shielding member 70 and the ground terminal 42, and improves the stability of the connection between the shielding member 70 and the ground terminal 42. For example, the shielding member 70 and the ground terminal 42 can be welded via soldering. Specifically, the shielding frame 71 of the shielding member 70 is welded to the mainboard 40 via a welding process. The shielding frame 71 of the shielding member 70 can be welded to the ground terminal 42.

[0109] In some implementations, the shielding cover 72 and the shielding frame 71 may both be made of conductive metal materials. For example, the shielding cover 72 and the shielding frame 71 may be made of stainless steel.

[0110] In some possible implementations, as shown in FIG6 , the electronic device 10 further includes an electronic component 150 . The electronic component 150 is disposed on the mainboard 40 . The electronic component 150 is disposed within the accommodating space 180 . The electronic component 150 is spaced apart from the first connection terminal 41 . The shielding member 70 can shield the electronic component 150 , so that when the electronic component 150 is in operation, the electromagnetic signal emitted by the electronic component 150 is less likely to propagate toward devices located outside the shielding member 70 and relatively close to the electronic component 150 , thereby effectively reducing the possibility of the electronic component 150 causing signal interference to adjacent devices. In some examples, the electronic component 150 can be an inductor. The electronic device 10 further includes an antenna. The housing 30 includes a back cover 31 and a frame 32 . The antenna can be disposed on the frame 32 . When the first connection terminal 41 and the shielding member 70 are disposed in an edge area of ​​the mainboard 40 near the antenna, the electronic component 150 (e.g., an inductor) near the first connection terminal 41 is relatively close to the antenna. In the embodiment of the present application, since the inductor is shielded by the shielding member 70 , the inductor is unlikely to cause signal interference to an adjacent antenna when in operation.

[0111] In some achievable embodiments, FIG9 schematically shows a partial structure of an electronic device. Referring to FIG6 and FIG9 , the shielding frame 71 may be a frame having a middle through hole 71 a. The first connection terminal 41 is located in the middle through hole 71 a. In some examples, the shielding frame 71 may be an annular frame. The shape of the orthographic projection of the shielding frame 71 on the mainboard 40 may be regular, such as a rectangle or a circle. The shape of the orthographic projection of the shielding frame 71 on the mainboard 40 may also be irregular, and this application does not specifically limit this. In some examples, the shielding frame 71 may also have a notch, and the shielding frame 71 is disconnected and discontinuous at the notch, so that the shielding frame 71 is not a continuous annular structure.

[0112] The first connection terminal 41 is located in the shielding frame 71. Exemplarily, there is a distance between the first connection terminal 41 and the shielding frame 71. Along the thickness direction Z of the mainboard 40, the orthographic projection of the first connection terminal 41 is located within the orthographic projection of the shielding frame 71, and the two do not overlap. The middle through hole 71a of the shielding frame 71 avoids the first connection terminal 41, thereby avoiding positional interference between the shielding frame 71 and the second connection terminal 63 during the assembly process of the second connection terminal 63 and the first connection terminal 41. In some examples, the shielding frame 71 can be an annular frame. The shielding frame 71 is arranged around the first connection terminal 41, so that the shielding frame 71 can provide a good shielding effect on the first connection terminal 41 in any direction.

[0113] In some achievable embodiments, as shown in Figures 6, 7 and 8, the shielding frame 71 includes a bottom flange 711, a first side plate 712 and a top flange 713. The bottom flange 711 and the top flange 713 are both connected to the first side plate 712. The bottom flange 711 and the top flange 713 are respectively arranged to intersect with the first side plate 712. The bottom flange 711 is electrically connected to the ground terminal 42 of the mainboard 40. Exemplarily, the bottom flange 711 can be welded to the ground terminal 42 of the mainboard 40. Exemplarily, the bottom flange 711 is a ring structure, and the shape of the ground terminal 42 of the mainboard 40 can match the bottom flange 711, that is, it can also be a ring structure. Exemplarily, the material of the ground terminal 42 can be, but is not limited to, copper or a copper alloy.

[0114] The outer surface of the top flange 713, facing away from the mainboard 40, is electrically connected to the inner surface of the shielding cover 72, facing the mainboard 40. This facilitates a larger electrical connection area between the shielding cover 72 and the shield frame 71, effectively reducing impedance and maintaining a good electrical connection between the two. The shielding cover 72 can be grounded to the ground terminal 42 of the mainboard 40 via the top flange 713, the first side plate 712, and the bottom flange 711. In some examples, the outer surface of the top flange 713, facing away from the mainboard 40, directly abuts the inner surface of the shielding cover 72, facing the mainboard 40, to electrically connect the top flange 713 and the shielding cover 72.

[0115] In some examples, along the thickness direction Z of the mainboard 40, a bottom flange 711 and a top flange 713 are respectively disposed at the bottom and top ends of the first side panel 712. The bottom flange 711 and the top flange 713 are located on either side of the first side panel 712. The bottom flange 711 can be folded outward away from the first connection terminal 41, while the top flange 713 can be folded inward toward the first connection terminal 41. Along the thickness direction Z of the mainboard 40, the orthographic projection of the top flange 713 does not overlap with the orthographic projection of the first connection terminal 41.

[0116] In some examples, as shown in Figures 6 and 8, the outer surface of the top flange 713 facing away from the mainboard 40 directly abuts the inner surface of the shielding cover 72 facing the mainboard 40, so that the top flange 713 is electrically connected to the shielding cover 72. As shown in Figures 6 and 9, the width of at least part of the top flange 713 is greater than the width of the bottom flange 711. The width of the top flange 713 and the width of the bottom flange 711 refer to the dimensions measured along the thickness direction Z perpendicular to the mainboard 40. After the shielding cover 72 and the shielding frame 71 are processed and manufactured, there is a possibility that the surface is uneven. If the contact surfaces of the shielding cover 72 and the shielding frame 71 are uneven, the actual contact area between the shielding cover 72 and the shielding frame 71 will be reduced, which is not conducive to maintaining a good electrical connection between the shielding cover 72 and the shielding frame 71. In the present application, setting the width of at least part of the top flange 713 to be larger is beneficial to increasing the contact area between the shielding cover 72 and the shielding frame 71, so as to effectively compensate for the contact area between the shielding cover 72 and the shielding frame 71, and reduce the possibility that the contact area does not meet the requirements due to the unevenness of the contact surface of the shielding cover 72 and the shielding frame 71.

[0117] The bottom flange 711 is set to a relatively small width, which can help reduce the positive projection area of ​​the bottom flange 711 on the main board 40 while meeting the connection strength between the bottom flange 711 and the main board 40, thereby reducing the space occupancy rate of the bottom flange 711 on the main board 40, and reducing the possibility of reducing the area on the main board 40 where the electronic device 50 can be set due to the bottom flange 711 occupying too much space on the main board 40.

[0118] Exemplarily, the width of the top flange 713 at any position is greater than the width of the bottom flange 711 .

[0119] For example, the width of some areas of the top flange 713 itself is greater than the width of the remaining areas. In areas where the top flange 713 needs to avoid the first connecting terminal 41, the width of the top flange 713 can be set to be relatively small, while in areas where the top flange 713 does not need to avoid the first connecting terminal 41, the width of the top flange 713 can be set to be relatively large. As a result, the top flange 713 can be set to a larger width as a whole without interfering with the position of the first connecting terminal 41, thereby facilitating a larger contact area between the shielding cover 72 and the shielding frame 71.

[0120] Exemplarily, the blank used to manufacture the shield frame 71 is a flat plate. A stamping process is first used to stamp out the blank, forming the shield frame 71 having a bottom flange 711, a first side plate 712, and a top flange 713. The shield frame 71 is then shaped to fully release the internal stress of the shield frame 71.

[0121] In some feasible embodiments, as shown in Figures 6, 7 and 8, the shielding cover 72 and the shielding frame 71 are snap-fitted to each other. The shielding cover 72 and the shielding frame 71 contact and press each other at the snap-fit ​​position, so that the shielding cover 72 and the shielding frame 71 can maintain good electrical connection at the snap-fit ​​position. A snap-fit ​​portion 80 is provided on one of the shielding cover 72 and the shielding frame 71, and a snap-fit ​​portion 90 is provided on the other. The shielding cover 72 and the shielding frame 71 can be snap-fitted to each other via the snap-fit ​​portion 80 and the snap-fit ​​portion 90. The snap-fitting method of the shielding cover 72 and the shielding frame 71 facilitates quick assembly or separation of the shielding cover 72 and the shielding frame 71, thereby improving the efficiency of the assembly or separation work.

[0122] The interlocking clamping portion 80 and the engaging portion 90 can be pressed and fitted together, allowing the shielding cover 72 and the shielding frame 71 to maintain a good electrical connection even at the engaging position between the clamping portion 80 and the engaging portion 90. After the clamping portion 80 is engaged with the engaging portion 90, the clamping portion 80 is restrained by the engaging portion 90, allowing the clamping portion 80 and the engaging portion 90 to maintain a stable connection. Under the action of external forces, the clamping portion 80 is unlikely to be dislodged from the engaging portion 90, reducing the possibility of the shielding cover 72 and the shielding frame 71 being separated by accidental collision, resulting in shielding failure of the shielding component 70.

[0123] In some examples, the engaging portion 80 may be a protrusion, and the engaging portion 90 may be a blind hole or a through hole.

[0124] In some examples, the shielding cover 72 can be an integrally molded structure. The shielding frame 71 can be an integrally molded structure. The snap-fit ​​portion 80 can be directly machined onto one of the shielding cover 72 and the shielding frame 71, and the snap-fit ​​portion 90 can be directly machined onto the other. Therefore, on the one hand, the shielding cover 72 and the shielding frame 71 can maintain good structural integrity; on the other hand, there is no need for an additional snap-fit ​​assembly including the snap-fit ​​portion 80 and the snap-fit ​​portion 90 between the shielding cover 72 and the shielding frame 71, which helps reduce the number of parts used and the number of assembly steps in which one of the shielding cover 72 and the shielding frame 71 needs to be assembled with the snap-fit ​​portion 80 and the other needs to be assembled with the snap-fit ​​portion 90.

[0125] In some examples, the outer surface of the top flange 713 facing away from the mainboard 40 directly abuts the inner surface of the shielding cover 72 facing the mainboard 40. At the same time, the shielding cover 72 and the shielding frame 71 are clamped together, which can improve the connection reliability between the shielding cover 72 and the shielding frame 71, so that the shielding cover 72 effectively presses the top flange 713, ensuring that the shielding cover 72 and the top flange 713 remain in a good fitting contact state, reducing the possibility of poor contact between the shielding cover 72 and the top flange 713 due to loosening of the shielding cover 72 and the shielding frame 71, thereby reducing the possibility of passive inter-modulation (PIM) problems and spurious radiation (RSE) problems caused by poor contact.

[0126] In some examples, the shielding frame 71 may include a first side plate 712, a bottom flange 711, and a top flange 713 that are connected. The shielding cover 72 and the first side plate 712 are snap-fitted to each other. The shielding cover 72 and the first side plate 712 are snap-fitted to each other, which facilitates quick assembly or separation of the shielding cover 72 and the shielding frame 71, thereby improving the efficiency of assembly or separation. Exemplarily, a snap-fit ​​portion 80 is provided on one of the shielding cover 72 and the first side plate 712, and a snap-fit ​​portion 90 is provided on the other. The snap-fit ​​portion 80 is snap-fitted to the snap-fit ​​portion 90. The outer surface of the top flange 713 of the shielding frame 71 facing away from the main board 40 is electrically connected to the inner surface of the top plate facing the main board 40.

[0127] As shown in Figures 6, 7 and 8, the shielding cover 72 may include a connected top plate 721 and a second side plate 722. The second side plate 722 and the top plate 721 of the shielding cover 72 are arranged to intersect with each other, and a predetermined angle is formed between the two. For example, the angle between the second side plate 722 and the top plate 721 can be 90°. There can also be an arc transition section between the second side plate 722 and the top plate 721 to reduce stress concentration between the second side plate 722 and the top plate 721. Exemplarily, the blank for manufacturing the shielding cover 72 is a flat plate. First, the blank is stamped using a stamping process to stamp out the shielding cover 72 having the second side plate 722 and the top plate 721. Then, the shielding cover 72 is shaped to fully release the internal stress of the shielding cover 72.

[0128] A snap-fit ​​portion 80 is provided on one of the first side plate 712 of the shield frame 71 and the second side plate 722 of the shield cover 72, and a snap-fit ​​portion 90 is provided on the other. The first connection terminal 41 and the second connection terminal 63 are provided between the top plate 721 of the shield cover 72 and the main board 40. The first connection terminal 41 and the second connection terminal 63 are provided on the side of the top plate 721 of the shield cover 72 that faces the main board 40.

[0129] In some examples, during the assembly process of the shielding cover 72 and the shielding frame 71, before the engaging portion 80 engages the engaging portion 90, the second side plate 722 of the shielding cover 72 may undergo elastic deformation. After the engaging portion 80 engages the engaging portion 90, the elastic restoring force of the second side plate 722 compresses and fits the engaging portion 80 and the engaging portion 90 against each other. Simultaneously, the top flange 713 of the shielding frame 71 and the top plate 721 of the shielding cover 72 compress and fit against each other.

[0130] In some examples, the shielding cover 72 is provided with a snap-fit ​​portion 80, and the shielding frame 71 is provided with a snap-fit ​​portion 90. For example, the snap-fit ​​portion 90 is provided on the first side plate 712 of the shielding frame 71, and the snap-fit ​​portion 80 is provided on the second side plate 722 of the shielding cover 72.

[0131] The engaging portion 90 on the first side plate 712 of the shield frame 71 has an opening facing away from the central through hole 71a, that is, the engaging portion 90 has an outwardly facing opening. The engaging portion 80 on the second side plate 722 of the shield cover 72 protrudes toward the accommodating space 180. After the shield cover 72 and the shield frame 71 are assembled, the second side plate 722 of the shield cover 72 is located outside the first side plate 712 of the shield frame 71 and is visible from the outside. The engaging portion 80 on the second side plate 722 is located within the engaging portion 90.

[0132] In some examples, after the shielding cover 72 is snapped into place with the shielding frame 71 , the second side plate 722 may abut against the first side plate 712 , so that the first side plate 712 and the second side plate 722 are in contact.

[0133] In some examples, the first side panel 712 of the shielding frame 71 may have multiple outer side surfaces. The shielding cover 72 may include multiple second side panels 722. The multiple second side panels 722 are each independent. There is a spacing between two adjacent second side panels 722, so that a gap is formed between the two adjacent second side panels 722. Each second side panel 722 is independently provided so that when any second side panel 722 is deformed during the clamping process, it will not pull the other second side panels 722. A clamping portion 80 may be provided on each second side panel 722. A clamping portion 90 is provided on the first side panel 712 at a position corresponding to the second side panel 722.

[0134] For example, Figure 10 schematically shows a partial structure of an electronic device. Referring to Figures 8 to 10 , the first side panel 712 of the shielding frame 71 includes a first outer side surface 7121, a second outer side surface 7122, a third outer side surface 7123, and a fourth outer side surface 7124 that are interconnected. The circuit board 62 of the camera device 60 can pass between the shielding cover 72 and the shielding frame 71. The circuit board 62 of the camera device 60 is positioned corresponding to the first outer side surface 7121. The third outer side surface 7123 can be a stepped surface. The shielding cover 72 can include five second side panels 722. Each of the first outer side surface 7121 corresponds to a second side panel 722, and the second side panel 722 is adjacent to the fourth outer side surface 7124, with a gap between the second side panel 722 and the circuit board 62 of the camera device 60. Each of the second outer side surface 7122 and the fourth outer side surface 7124 corresponds to a second side panel 722. The third outer side surface 7123 corresponds to two second side panels 722 , wherein a second side panel 722 close to the second outer side surface 7122 is relatively close to the first outer side surface 7121 , and a second side panel 722 close to the fourth outer side surface 7124 is relatively far away from the first outer side surface 7121 .

[0135] In some examples, the outer surface of the top flange 713 facing away from the main board 40 directly abuts against the inner surface of the top plate 721 facing the main board 40 , so that the top flange 713 is electrically connected to the top plate 721 .

[0136] In some possible implementations, one end of the circuit board 62 is connected to the camera module 61 , and the other end is provided with a second connection terminal 63 . The second connection terminal 63 is provided at an end of the circuit board 62 away from the camera module 61 .

[0137] In some examples, Figure 11 schematically shows a partial cross-sectional view of an electronic device. Figure 12 is an enlarged view of point M in Figure 11. As shown in Figures 11 and 12, the shielding member 70 includes a clearance hole 130. In some examples, the end portion of the second connection terminal 63 provided on the circuit board 62 passes through the clearance hole 130 and is located together with the second connection terminal 63 within the accommodating space 180. After the shielding cover 72 and the shielding frame 71 are fastened together and assembled, the clearance hole 130 can be formed between the shielding cover 72 and the shielding frame 71. The circuit board 62 of the camera device 60 is inserted through the clearance hole 130. After the second connection terminal 63 and the first connection terminal 41 are connected, the circuit board 62 is located above the shielding frame 71. Exemplarily, the clearance hole 130 is provided corresponding to the first outer side surface 7121 of the first side plate 712. The circuit board 62 of the camera device 60 is provided corresponding to the first outer side surface 7121 of the first side plate 712.

[0138] In some implementations, the surface of the second connection terminal 63 facing away from the first connection terminal 41 is bonded to the shielding cover 72 with conductive adhesive, thereby electrically connecting the second connection terminal 63 to the shielding cover 72. The assembly method may include, but is not limited to, applying conductive adhesive to the surface of the second connection terminal 63 facing away from the first connection terminal 41 after the second connection terminal 63 and the first connection terminal 41 are assembled. The shielding cover 72 is then fastened to the shielding frame 71. After the shielding cover 72 and the shielding frame 71 are assembled, the shielding cover 72 is bonded to the conductive adhesive.

[0139] In some embodiments, as shown in FIG. 12 , the electronic device 10 further includes a reinforcing member 100. The reinforcing member 100 is located within the accommodating space 180. At least a portion of the reinforcing member 100 is disposed on the side of the second connection terminal 63 facing away from the first connection terminal 41. The shielding member 70 can apply a compressive stress to the reinforcing member 100 toward the second connection terminal 63 to ensure connection reliability and stability between the first connection terminal 41 and the second connection terminal 63, thereby reducing the possibility of the second connection terminal 63 being withdrawn from the first connection terminal 41 and becoming disconnected.

[0140] The reinforcing piece 100 provides protection for the second connecting terminal 63, effectively preventing the second connecting terminal 63 from being damaged by external forces. For example, the reinforcing piece 100 can separate the second connecting terminal 63 from the shielding member 70, reducing the possibility of damage to the second connecting terminal 63 caused by direct compressive stress applied by the shielding member 70. For example, the reinforcing piece 100 can be connected to the second connecting terminal 63.

[0141] The reinforcing member 100 is a conductive structure. The reinforcing member 100 is electrically connected to the second connection terminal 63. The reinforcing member 100 is also electrically connected to the shielding cover 72. Therefore, the second connection terminal 63 is electrically connected to the ground terminal 42 of the mainboard 40 through the reinforcing member 100, the shielding cover 72, and the shielding frame 71, thereby achieving indirect grounding.

[0142] In some embodiments, the structure of the above-mentioned shielding member 70 can be replaced by a compression steel sheet. For example, a strip-shaped compression steel sheet is provided above the reinforcement member 100 along the thickness direction Z of the main board 40. The compression steel sheet is used to compress the reinforcement member 100 and the second connection terminal 63 along the thickness direction Z of the main board 40. The two ends of the compression steel sheet can be grounded to the main board 40. For example, fasteners such as screws can be used to connect the ends of the compression steel sheet to the main board 40 for grounding. In this solution, the grounding area between the compression steel sheet and the main board 40 is small, and the area blocked by the compression steel sheet for the first connection terminal 41 and the second connection terminal 63 is also small. Compared with the structure of the above-mentioned shielding member 70, the grounding area between the shielding member 70 and the main board 40 is relatively large. At the same time, the shielding member 70 can cover the first connection terminal 41 and the second connection terminal 63, so that the shielding member 70 can effectively improve the shielding effect. In addition, the contact area between the reinforcing member 100 and the shielding member 70 is relatively large, which is conducive to achieving a larger electrical connection area between the reinforcing member 100 and the shielding member 70 and reducing impedance. Therefore, the simultaneous arrangement of the shielding member 70 and the reinforcing member 100 can effectively improve the shielding effect.

[0143] The reinforcing piece 100 may be made of a metal material. For example, the reinforcing piece 100 may be made of steel, such as stainless steel. For example, the reinforcing piece 100 may be made of a steel sheet.

[0144] In some examples, at least one of the second connection terminal 63 and the top plate 721 of the shielding cover 72 can be bonded to the reinforcing member 100. For example, the reinforcing member 100 can be connected to the second connection terminal 63 by bonding. For example, the reinforcing member 100 can be bonded to the second connection terminal 63 via a conductive adhesive layer, thereby achieving electrical connection between the reinforcing member 100 and the second connection terminal 63.

[0145] In some examples, the shielding cover 72 of the shielding member 70 directly abuts the reinforcing member 100. The shielding cover 72 of the shielding member 70 directly contacts the reinforcing member 100 to achieve electrical connection, so that there is no need to set up additional structural members to achieve electrical connection between the shielding member 70 and the reinforcing member 100, which helps to reduce the number of parts used and the assembly process. The shielding cover 72 is located on the side of the reinforcing member 100 facing away from the mainboard 40. After the shielding cover 72 and the shielding frame 71 are assembled, the shielding cover 72 can directly abut the reinforcing member 100. The shielding cover 72 can apply compressive stress to the reinforcing member 100 and the second connecting terminal 63 to ensure the stability of the connection between the second connecting terminal 63 and the first connecting terminal 41.

[0146] In some examples, Figure 13 schematically shows a partial cross-sectional structure of an electronic device. As shown in Figure 13, the shielding member 70 has an insulating layer 140. The outer surface of the shielding cover 72 can be provided with an insulating layer 140. The insulating layer 140 provided on the shielding cover 72 can help maintain a good insulation isolation state between the shielding cover 72 and other conductive structural parts. If the shielding cover 72 is not provided with an insulating layer 140, there is a situation where the shielding cover 72 and other conductive structural parts are electrically connected. If there is poor contact between the shielding cover 72 and other conductive structural parts, it will cause the shielding cover 72 and other conductive structural parts to generate passive intermodulation (PIM) problems and the possibility of generating stray radiation (RSE) problems. The outer surface of the shielding cover 72 of the present application is provided with an insulating layer 140, which can effectively reduce the possibility of the above-mentioned problems.

[0147] For example, an insulating varnish may be provided on the outer surface of the shielding cover 72. The insulating varnish is cured to form the insulating layer 140. For example, the insulating varnish may be sprayed on the outer surface of the shielding cover 72 by spraying.

[0148] In some examples, FIG14 schematically shows a partial cross-sectional structure of an electronic device. Referring to FIG13 , the electronic device 10 further includes a conductive member 110. The conductive member 110 is disposed between the shielding cover 72 of the shielding member 70 and the reinforcing member 100. The conductive member 110 can achieve electrical connection between the shielding member 70 and the reinforcing member 100. After the shielding cover 72 and the shielding frame 71 are assembled, the shielding cover 72 and the reinforcing member 100 can jointly press the conductive member 110 to ensure good contact between the shielding member 70 and the reinforcing member 100 and the conductive member 110, thereby maintaining the stability of the electrical connection between the shielding member 70 and the reinforcing member 100 and the conductive member 110.

[0149] The conductive member 110 can be a flexible structure that is inherently compressible and deformable. The shielding cover 72 of the shielding member 70 and the reinforcing member 100 can jointly compress the conductive member 110. Because the conductive member 110 is compressible and deformable, if there are irregularities on the surface of at least one of the shielding cover 72 of the shielding member 70 or the reinforcing member 100, the conductive member 110 can compensate by deforming itself. This ensures that the shielding cover 72 of the shielding member 70 and the conductive member 110, as well as the reinforcing member 100 and the conductive member 110, maintain close contact, thereby maintaining a good electrical connection between the shielding cover 72 of the shielding member 70 and the reinforcing member 100, and thus reducing impedance.

[0150] Exemplarily, the conductive member 110 may be a conductive cloth or a conductive adhesive layer.

[0151] In some examples, the reinforcing member 100 and the shielding cover 72 of the shielding member 70 are capacitively coupled to each other, thereby achieving an equivalent electrical connection between the reinforcing member 100 and the shielding member 70. A relatively large capacitor can be formed between the reinforcing member 100 and the shielding cover 72 of the shielding member 70, thereby coupling electrical signals from one of the reinforcing member 100 and the shielding member 70 to the other. The lack of direct contact between the reinforcing member 100 and the shielding cover 72 prevents poor contact between the shielding cover 72 and the reinforcing member 100, thereby reducing the likelihood of passive inter-modulation (PIM) and spurious emission (RSE) issues caused by poor contact.

[0152] Figure 15 schematically illustrates a partial cross-sectional view of an electronic device. As shown in Figure 15 , electronic device 10 further includes a high-dielectric layer 120. High-dielectric layer 120 is disposed between shielding cover 72 of shielding element 70 and reinforcing member 100. When shielding element 70, reinforcing member 100, and high-dielectric layer 120 are assembled, shielding cover 72 of shielding element 70 and reinforcing member 100 can jointly compress high-dielectric layer 120. This creates a capacitive coupling connection between shielding element 70, reinforcing member 100, and high-dielectric layer 120.

[0153] The high dielectric layer 120 is a film layer structure that itself has a relatively high dielectric constant. The high dielectric layer 120 can serve as an insulating medium, thereby isolating the reinforcing member 100 from the shielding member 70. The reinforcing member 100 and the shielding cover 72 of the shielding member 70 respectively form coupling surfaces with the areas corresponding to the high dielectric layer 120. According to the capacitance calculation formula, under the premise that the spacing between the reinforcing member 100 and the shielding cover 72 of the shielding member 70 and the area of ​​the coupling surface remain unchanged, the greater the dielectric constant of the insulating medium between the reinforcing member 100 and the shielding cover 72 of the shielding member 70, the greater the capacity of the equivalent capacitor formed. According to the capacitance impedance calculation formula, the greater the capacity of the capacitor, the smaller its capacitance impedance. The capacitance impedance is the equivalent impedance.

[0154] The shielding member 70 and the reinforcing member 100 are not in electrical contact with the high-dielectric layer 120. Because capacitive coupling eliminates the risk of poor contact, there are no requirements for the stability of the contact resistance between the shielding member 70 and the reinforcing member 100 and the high-dielectric layer 120. Consequently, surface treatments such as nickel plating or gold plating are not required for the shielding member 70 and the reinforcing member 100. Furthermore, the placement of the high-dielectric layer 120 can be freely and flexibly selected based on design requirements.

[0155] For example, when a high-frequency electrical signal is generated on the reinforcing member 100 , the high-frequency electrical signal may be released to the shielding member 70 through capacitive coupling between the reinforcing member 100 and the shielding member 70 .

[0156] For example, the high dielectric layer 120 itself can have good elasticity, so that it can be used in a small space, and the rebound ability of the high dielectric layer 120 can be used to absorb the assembly tolerance and processing tolerance of the shielding part 70 and the reinforcement part 100, ensuring that the shielding part 70 and the reinforcement part 100 are each in a good pressure state with the high dielectric layer 120.

[0157] For example, the high dielectric layer 120 may include an elastomer and magnesium powder or aluminum powder disposed in the elastomer. The elastomer may be made of plastic.

[0158] For example, the high dielectric layer 120 may include an absorbing material, so that the high dielectric layer 120 can absorb and attenuate electromagnetic signals incident from space, reduce or eliminate reflected electromagnetic signals, and help reduce interference caused by undesirable electromagnetic signals. For example, the absorbing material of the high dielectric layer 120 may include sendust.

[0159] In some possible implementations, a partial structure of an electronic device is schematically shown in Figure 16. Referring to Figure 16, unlike the above embodiment in which the shielding member 70 includes a shielding frame 71 and a shielding cover 72, the shielding member 70 of this embodiment is an integrally formed structure.

[0160] The shielding member 70 is connected to the mainboard 40. For example, the shielding member 70 is welded to the mainboard 40. A storage space is formed between the shielding member 70 and the mainboard 40. The first connection terminal 41 and the second connection terminal 63 are located in the storage space. The shielding member 70 is electrically connected to the ground terminal 42. The second connection terminal 63 is electrically connected to the shielding member 70.

[0161] In some examples, the shield 70 includes a top wall 70a and side walls 70b. The side walls 70b are connected to the mainboard 40. The side walls 70b are electrically connected to the ground terminal 42 of the mainboard 40. For example, the shield 70 is welded to the ground terminal 42. The top wall 70a is electrically connected to the second connection terminal 63. The first connection terminal 41, the second connection terminal 63, the top wall 70a, and the side walls 70b can be grounded via the ground terminal 42 of the mainboard 40.

[0162] The side wall 70b can be an annular structure. The side wall 70b of the shielding member 70 is arranged around the first connecting terminal 41, so that the shielding member 70 can provide a good shielding effect for the first connecting terminal 41 in any direction. The shape of the side wall 70b can be regular, such as rectangular or circular. The shape of the side wall 70b can also be irregular, and this application does not specifically limit this. In some examples, the side wall 70b can also have a notch, and the side wall 70b is disconnected and discontinuous at the notch, so that the side wall 70b is not a continuous annular structure.

[0163] Conductive adhesive is bonded between the surface of the second connection terminal 63 facing away from the first connection terminal 41 and the top wall 70a of the shield 70, thereby electrically connecting the second connection terminal 63 to the top wall 70a of the shield 70. The assembly method may include, but is not limited to, applying conductive adhesive to the surface of the second connection terminal 63 facing away from the first connection terminal 41 after the second connection terminal 63 and the first connection terminal 41 are assembled. The shield 70 is then assembled with the mainboard 40. After the shield 70 and the mainboard 40 are assembled, the top wall 70a of the shield 70 is bonded with the conductive adhesive.

[0164] The electronic device 10 further includes a reinforcing member 100 . The reinforcing member 100 is disposed on a side of the second connection terminal 63 facing away from the first connection terminal 41 . The reinforcing member 100 is a conductive structure and is electrically connected to the second connection terminal 63 and the top wall 70 a of the shielding member 70 .

[0165] The reinforcing piece 100 provides protection for the second connecting terminal 63, effectively preventing the second connecting terminal 63 from being damaged by external forces. The shielding piece 70 applies compressive stress to the reinforcing piece 100 toward the second connecting terminal 63, thereby ensuring the reliability and stability of the connection between the first connecting terminal 41 and the second connecting terminal 63 and reducing the possibility of the second connecting terminal 63 being removed from the first connecting terminal 41 and disconnected.

[0166] In some examples, the top wall 70a of the shielding member 70 directly abuts the reinforcing member 100. Direct contact between the top wall 70a of the shielding member 70 and the reinforcing member 100 achieves electrical connection, eliminating the need for additional structural members for electrical connection between the shielding member 70 and the reinforcing member 100, thereby reducing the number of parts used and the number of assembly steps. The top wall 70a of the shielding member 70 is located on the side of the reinforcing member 100 facing away from the mainboard 40. After the shielding member 70 and the mainboard 40 are assembled, the top wall 70a of the shielding member 70 can directly abut the reinforcing member 100. The top wall 70a of the shielding member 70 can apply compressive stress to the reinforcing member 100 and the second connecting terminal 63 to ensure the stability of the connection between the second connecting terminal 63 and the first connecting terminal 41.

[0167] In some examples, the electronic device 10 further includes a conductive member 110. The conductive member 110 is disposed between the top wall 70a of the shielding member 70 and the reinforcement member 100. The conductive member 110 electrically connects the top wall 70a of the shielding member 70 and the reinforcement member 100. The conductive member 110 is disposed between the top wall 70a of the shielding member 70 and the reinforcement member 100. The conductive member 110 can achieve an electrical connection between the shielding member 70 and the reinforcement member 100. After the shielding member 70 is assembled with the mainboard 40, the top wall 70a of the shielding member 70 and the reinforcement member 100 can jointly compress the conductive member 110 to ensure good contact between the shielding member 70 and the reinforcement member 100, thereby maintaining the stability of the electrical connection between the shielding member 70 and the reinforcement member 100 and the conductive member 110. For example, the conductive member 110 can be a flexible structure that is inherently compressible and deformable. Because the conductive member 110 is compressible and deformable, if there are irregularities on the surface of at least one of the shielding member 70 and the reinforcing member 100, the conductive member 110 can compensate for these irregularities by deforming itself. This ensures close contact between the shielding member 70 and the conductive member 110, as well as between the reinforcing member 100 and the conductive member 110, maintaining a good electrical connection between the shielding member 70 and the reinforcing member 100, thereby reducing impedance. For example, the conductive member 110 may be a conductive fabric or a conductive adhesive layer.

[0168] In some examples, the reinforcing member 100 and the top wall 70a of the shielding member 70 are capacitively coupled, thereby achieving an equivalent electrical connection between the reinforcing member 100 and the shielding member 70. A relatively large capacitor is formed between the reinforcing member 100 and the top wall 70a of the shielding member 70, thereby coupling electrical signals from one of the reinforcing member 100 and the shielding member 70 to the other. The lack of direct contact between the reinforcing member 100 and the shielding member 70 prevents poor contact between the two members, thereby reducing the likelihood of passive inter-modulation (PIM) and spurious emission (RSE) issues caused by poor contact.

[0169] In some examples, the electronic device 10 further includes a high-dielectric layer 120. The high-dielectric layer 120 is disposed between the reinforcing member 100 and the top wall 70a of the shielding member 70. When the shielding member 70, the reinforcing member 100, and the high-dielectric layer 120 are assembled, the top wall 70a of the shielding member 70 and the reinforcing member 100 can jointly compress the high-dielectric layer 120. The shielding member 70, the reinforcing member 100, and the high-dielectric layer 120 form a capacitive coupling connection.

[0170] The shielding member 70 and the reinforcing member 100 are not in electrical contact with the high-dielectric layer 120. Because capacitive coupling eliminates the risk of poor contact, there are no requirements for the stability of the contact resistance between the shielding member 70 and the reinforcing member 100 and the high-dielectric layer 120. Consequently, surface treatments such as nickel plating or gold plating are not required for the shielding member 70 and the reinforcing member 100. Furthermore, the placement of the high-dielectric layer 120 can be freely and flexibly selected based on design requirements.

[0171] In some examples, the shielding member 70 has an escape hole 130 , through which the circuit board 62 passes.

[0172] In some examples, an insulating layer 140 is provided on the outer surface of the shielding member 70. The insulating layer 140 provided on the shielding member 70 can help maintain a good insulation isolation state between the shielding member 70 and other conductive structural members. If the shielding member 70 is not provided with the insulating layer 140, there is a possibility that the shielding member 70 and the other conductive structural members will be electrically connected. If there is poor contact between the shielding member 70 and the other conductive structural members, it will cause the shielding member 70 and the other conductive structural members to generate Passive Inter-Modulation (PIM) problems and the possibility of generating stray radiation (RSE) problems. The insulating layer 140 is provided on the outer surface of the shielding member 70 of the present application, which can effectively reduce the possibility of the above-mentioned problems.

[0173] In some possible implementations, FIG17 schematically shows a partial structure of an electronic device. The electronic device 10 may include one or more camera devices 60. For each camera device 60, a corresponding shielding member 70 may be provided in accordance with any of the methods in the above-described embodiments. Referring to FIG17 , the electronic device 10 further includes an antenna 160. In conjunction with FIG1 to FIG3 , the housing 30 includes a back cover 31 and a frame 32. The back cover 31 may be connected to the frame 32. The antenna 160 is provided on the frame 32. Exemplarily, the antenna 160 is provided on the inner wall of the frame 32 facing the mainboard 40. The first connecting terminal 41, the second connecting terminal 63 and the shielding member 70 are provided near the antenna 160. The first connecting terminal 41, the second connecting terminal 63 and the shielding member 70 may be provided on the edge area of ​​the mainboard 40, so that the edge area of ​​the mainboard 40 can be effectively utilized, thereby facilitating improving the utilization rate of the mainboard 40. Since the shielding member 70 can provide effective shielding for the first connecting terminal 41 and the second connecting terminal 63, when the antenna 160 is in the working state of radiating wireless signals, the electromagnetic signal generated by the antenna 160 is not likely to interfere with the first connecting terminal 41 and the second connecting terminal 63, thereby reducing the possibility of the antenna 160 having an adverse effect on the camera device 60 when performing the shooting function.

[0174] In some examples, an electronic component 150 is disposed on the mainboard 40. The electronic component 150 is disposed within the accommodation space 180. The shielding member 70 can shield the electronic component 150. When the electronic component 150 is in operation, the electromagnetic signal emitted by the electronic component 150 is less likely to propagate toward the antenna 160, which is located outside the shielding member 70 and relatively close to the electronic component 150. This effectively reduces the possibility of signal interference caused by the electronic component 150 on the antenna 160.

[0175] In some examples, as shown in Table 1, a comparison of relevant data between the electronic device 10 according to the embodiment of the present application and the electronic device 10 according to the related art is exemplarily described:

[0176] Table 1:

[0177] The operating frequency band of the antenna 160 can support the N1 band, the N3 band and the B39 band. When the antenna 160 operates in these frequency bands, if the shielding member 70 is not provided on the outside of the connector formed by the first connecting terminal 41 and the second connecting terminal 63, the isolation between the connector formed by the first connecting terminal 41 and the second connecting terminal 63 and the antenna 160 can be -41.2dB. In the present application, a shielding member 70 is provided on the outside of the connector formed by the first connecting terminal 41 and the second connecting terminal 63, so that when the antenna 160 operates in these frequency bands, the isolation between the antenna 160 and the connector can be -50.7dB, so that the isolation is improved, and then the isolation requirements between the antenna 160 and the connector are met, reducing the possibility of signal interference. Exemplarily, the camera device 60 can be a rear camera of the electronic device 10.

[0178] It should be noted that isolation is used to quantitatively characterize the strength of electromagnetic coupling, and its unit is dB.

[0179] The operating frequency band of the antenna 160 can support the N41 band and the WIFI 2.4 GHz band. When the antenna 160 operates in these frequency bands, if the shielding member 70 is not provided on the outside of the connector formed by the first connecting terminal 41 and the second connecting terminal 63, the isolation between the connector formed by the first connecting terminal 41 and the second connecting terminal 63 and the antenna 160 can be -40.2 dB. The connector formed outside the first connecting terminal 41 and the second connecting terminal 63 of the present application is provided with a shielding member 70, so that when the antenna 160 operates in these frequency bands, the isolation between the antenna 160 and the connector can be -50.1 dB, so that the isolation can be improved, and then the isolation requirements between the antenna 160 and the connector are met, reducing the possibility of signal interference.

[0180] In some examples, in the related art, a shielding member 70 is not provided on the outside of the connector formed by the first connection terminal 41 and the second connection terminal 63. In an environment with electromagnetic signals, the maximum value of the electric field strength measurement value at the position of the first connection terminal 41 and the second connection terminal 63 can be 42dB V / m. In the present application, a shielding member 70 is provided on the outside of the connector formed by the first connection terminal 41 and the second connection terminal 63. In the same environment, the maximum value of the electric field strength measurement value at the position of the first connection terminal 41 and the second connection terminal 63 can be 26dB V / m, thereby relatively optimizing 16dB V / m. Therefore, providing the shielding member 70 can effectively protect the first connection terminal 41 and the second connection terminal 63 and reduce signal interference.

[0181] In some possible implementations, FIG18 schematically shows a partial cross-sectional structure of an electronic device. Referring to FIG18 , the electronic device 10 further includes a metal bracket 200. The mainboard 40 may be connected to the metal bracket 200. The metal bracket 200 is used to provide support and an installation base for the mainboard 40. A partial area of ​​the metal bracket 200 may be located on one side of the shielding member 70. The shielding member 70 may be located between the mainboard 40 and the metal bracket 200. Since the shielding member 70 is grounded and is covered on the outside of the connector formed by the first connecting terminal 41 and the second connecting terminal 63, the shielding member 70 can effectively isolate the connector formed by the first connecting terminal 41 and the second connecting terminal 63 and the metal bracket 200, thereby reducing the possibility of electromagnetic signal interference in the connector formed by the first connecting terminal 41 and the second connecting terminal 63 due to the provision of the metal bracket 200.

[0182] The outer surface of the shielding member 70 may have an insulating layer 140 so that the metal bracket 200 and the shielding member 70 are kept in an insulated and isolated state and no electrical connection occurs between the two.

[0183] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of this application based on specific circumstances.

[0184] The embodiments of the present application do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the embodiments of the present application. In the description of the embodiments of the present application, the meaning of "plurality" is two or more, unless otherwise specifically specified.

[0185] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the embodiments of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0186] The term "plurality" in this document refers to two or more. The term "and / or" in this document simply describes a relationship between related objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A alone, A and B together, or B alone. Furthermore, the character " / " in this document generally indicates an "or" relationship between the related objects; in a formula, the character " / " indicates a "division" relationship between the related objects.

[0187] It will be understood that the various numerical numbers involved in the embodiments of the present application are merely distinctions for the convenience of description and are not intended to limit the scope of the embodiments of the present application.

[0188] It can be understood that in the embodiments of the present application, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

Claims

1. An electronic device, characterized in that: include: A mainboard, comprising a first connecting terminal and a grounding terminal; A camera device, comprising a camera module, a circuit board and a second connection terminal, wherein the camera module is electrically connected to the circuit board, the second connection terminal is electrically connected to the circuit board, and the first connection terminal is electrically connected to the second connection terminal; A shielding member forms a housing space with the mainboard, the first connecting terminal and the second connecting terminal are located in the housing space, the shielding member includes an electrically connected shielding frame and a shielding cover, the shielding frame is connected to the mainboard, the shielding frame is electrically connected to the grounding terminal, the shielding cover is connected to the shielding frame, and the second connecting terminal is electrically connected to the shielding cover.

2. The electronic device according to claim 1, characterized in that: The shielding frame is a ring-shaped structure, and the first connecting terminal is located in the shielding frame.

3. The electronic device according to claim 1 or 2, characterized in that: The shielding frame includes a bottom flange, a first side plate and a top flange, the bottom flange and the top flange are both connected to the first side plate, the bottom flange is electrically connected to the grounding terminal, and the outer surface of the top flange facing away from the mainboard is electrically connected to the inner surface of the shielding cover facing the mainboard.

4. The electronic device according to claim 3, characterized in that: The outer surface of the top flange facing away from the mainboard directly abuts against the inner surface of the shielding cover facing the mainboard, so that the top flange is electrically connected to the shielding cover, and at least part of the width of the top flange is greater than the width of the bottom flange.

5. The electronic device according to claim 3, characterized in that: The shielding cover and the first side plate are clamped with each other.

6. The electronic device according to claim 5, characterized in that: A clamping portion is disposed on one of the shielding cover and the first side plate, and a clamping portion is disposed on the other of the shielding cover and the first side plate, and the clamping portion is clamped with the clamping portion.

7. The electronic device according to claim 6, characterized in that: The shielding cover includes a connected top plate and a second side plate, the clamping portion is arranged on one of the first side plate and the second side plate, and the clamping portion is arranged on the other side, the first connecting terminal and the second connecting terminal are arranged between the top plate and the main board, and the outer surface of the top flange facing away from the main board is electrically connected to the inner surface of the top plate facing the main board.

8. The electronic device according to claim 7, characterized in that: There are multiple second side plates, and there is a gap between two adjacent second side plates.

9. The electronic device according to claim 7, characterized in that: The outer surface of the top flange facing away from the main board directly abuts against the inner surface of the top plate facing the main board, so that the top flange is electrically connected to the top plate.

10. The electronic device according to any one of claims 1 to 9, characterized in that: The shielding cover and the shielding frame are clamped with each other.

11. The electronic device according to any one of claims 1 to 10, characterized in that: The surface of the second connection terminal facing away from the first connection terminal is bonded to the shielding cover by conductive adhesive, so that the second connection terminal is electrically connected to the shielding cover.

12. The electronic device according to any one of claims 1 to 10, characterized in that: The electronic device further includes a reinforcing piece, at least part of which is disposed on a side of the second connection terminal facing away from the first connection terminal, the reinforcing piece is a conductive structure, and is electrically connected to the second connection terminal and the shielding cover.

13. The electronic device according to claim 12, characterized in that: The shielding cover directly contacts the reinforcing member.

14. The electronic device according to claim 12, characterized in that: The electronic device further comprises a conductive member, which is disposed between the shielding cover and the reinforcing member and electrically connects the shielding cover and the reinforcing member.

15. The electronic device according to claim 14, characterized in that: The conductive element is a flexible structure.

16. The electronic device according to claim 12, characterized in that: The reinforcing piece is capacitively coupled to the shielding cover.

17. The electronic device according to claim 16, characterized in that: The electronic device further comprises a high dielectric layer, and the high dielectric layer is arranged between the reinforcing piece and the shielding cover.

18. The electronic device according to claim 17, characterized in that: The material of the high dielectric layer includes a wave absorbing material.

19. The electronic device according to any one of claims 1 to 18, characterized in that: An escape hole is provided between the shielding cover and the shielding frame, and the circuit board is passed through the escape hole.

20. The electronic device according to any one of claims 1 to 19, characterized in that: An insulating layer is disposed on the outer surface of the shielding cover.

21. The electronic device according to any one of claims 1 to 20, characterized in that: The electronic device further includes an electronic component, which is disposed on the mainboard, disposed in the accommodation space, and spaced apart from the first connection terminal.

22. The electronic device according to any one of claims 1 to 21, characterized in that: The electronic device comprises a shell and an antenna, the mainboard is arranged in the shell, the shell comprises a frame, the antenna is arranged in the frame, and the first connecting terminal, the second connecting terminal and the shielding component are arranged close to the antenna.

23. A shielding member for electronic equipment, characterized in that: include: Shielding frame and shielding cover; The shielding cover is connected to the shielding frame, the shielding cover is connected to the shielding frame and forms a receiving cavity, the receiving cavity has an opening, the shielding frame is used for grounding, and the shielding cover is electrically connected to the shielding frame.

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