Thermal management device

Abstract

The heat management device comprises an air heat exchanger and an integrated assembly. The integrated assembly is located on one side of the air heat exchanger in the height direction of the heat management device. The heat management device is provided with a refrigerant flow path, the refrigerant flow path is used for circulating a refrigerant, and the air heat exchanger and part of the integrated assembly are both arranged in the refrigerant flow path. The heat management device comprises the air heat exchanger and the integrated assembly, the integrated assembly is located on one side of the air heat exchanger in the height direction of the heat management device, blocking of the integrated assembly to the air heat exchanger can be reduced, and then the heat exchange efficiency of the air heat exchanger is improved.

Description

Technical Field

[0001] The present application relates to the field of thermal management technology, and in particular to a thermal management device. Background Art

[0002] A thermal management device is a heat exchange device used to exchange heat for a device or component, such as a battery, circuit board, or charging station.

[0003] In the related art, a thermal management device includes a cabinet, an air heat exchanger and an integrated component. The integrated component is located in the cabinet, and the air heat exchanger is located in the cabinet or is arranged on a side wall of the cabinet. Summary of the Invention

[0004] The inventors have discovered that the relative position of the integrated component and the air heat exchanger affects the heat exchange efficiency of the air heat exchanger.

[0005] The purpose of this application is to provide a thermal management device that improves the heat exchange efficiency of an air heat exchanger by adjusting the relative position relationship between an integrated component and an air heat exchanger.

[0006] The thermal management device provided by the present application includes an air heat exchanger and an integrated component; along the height direction of the thermal management device, the integrated component is located on one side of the air heat exchanger;

[0007] The thermal management device has a refrigerant flow path for circulating refrigerant, and the air heat exchanger and part of the integrated components are both arranged in the refrigerant flow path.

[0008] In this application, the thermal management device includes an air heat exchanger and an integrated component. Along the height direction of the thermal management device, the integrated component is located on one side of the air heat exchanger, which can reduce the obstruction of the integrated component to the air heat exchanger, thereby improving the heat exchange efficiency of the air heat exchanger. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 This is a schematic diagram of the overall structure of the thermal management device of the present application from one angle;

[0010] Figure 2 This is a schematic diagram of the overall structure of the thermal management device of the present application from another angle;

[0011] Figure 3 This is a schematic diagram of the internal structure of the thermal management device of this application from one angle;

[0012] Figure 4 This is a schematic structural diagram of the first air guide plate and the second air guide plate in the thermal management device of this application;

[0013] Figure 5 This is a schematic diagram of the internal structure of the thermal management device of this application from another angle;

[0014] Figure 6 This is a structural schematic diagram of the integrated components, the first fan, the compressor and each pipe in the thermal management device of the present application from one angle;

[0015] Figure 7 This is a structural schematic diagram of the integrated components, the first fan, the compressor and each pipe in the thermal management device of the present application from another angle;

[0016] Figure 8 This is a schematic structural diagram of an embodiment of an integrated component in the thermal management device of the present application;

[0017] Figure 9 This is a structural diagram of another embodiment of the integrated component in the thermal management device of the present application;

[0018] Figure 10 A schematic diagram of an embodiment of the thermal management system of the present application;

[0019] Figure 11 This is a schematic diagram of another embodiment of the thermal management system of the present application. DETAILED DESCRIPTION

[0020] To facilitate understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the disclosure of the present application.

[0021] Figures 1 to 9 The figure shows a thermal management device in accordance with the present application, comprising an air heat exchanger 400 and an integrated assembly 900. The integrated assembly 900 is located on one side of the air heat exchanger 400 along the height direction H of the thermal management device. The thermal management device 900 has a refrigerant flow path for circulating refrigerant, and the air heat exchanger 400 and part of the integrated assembly 900 are both disposed in the refrigerant flow path. In the present application, the thermal management device comprises an air heat exchanger 400 and an integrated assembly 900. Along the height direction of the thermal management device, the integrated assembly 900 is located on one side of the air heat exchanger 400, which can reduce the obstruction of the integrated assembly 900 on the air heat exchanger 400, thereby improving the heat exchange efficiency of the air heat exchanger 400.

[0022] refer to Figures 3 to 7As shown, in some embodiments, the thermal management device includes a compressor 100, which is arranged in the refrigerant flow path. Along the height direction H of the thermal management device, the compressor 100 and the integrated component 900 are respectively located on both sides of the air heat exchanger 400; the thermal management device of the present application places the compressor 100 and the integrated component 900 on both sides of the condenser 200 along the height direction H of the thermal management device. On the one hand, it can reduce the obstruction of the compressor 100 and the integrated component 900 to the air heat exchanger 400, and improve the heat exchange efficiency of the thermal management device. On the other hand, distributing the compressor 100, the integrated component 900 and the air heat exchanger 400 in parallel along the height direction of the thermal management device can reduce the thickness of the thermal management device, so that it can be better applied to the heat dissipation of energy storage devices, such as batteries, circuit boards, etc.

[0023] In the related art, the thermal management device includes a compressor 100, an integrated component 900 and an air heat exchanger 400. Along the height direction of the thermal management device, the integrated component 900 and the air heat exchanger 400 are located on the same side of the compressor 100. The integrated component 900 will block the contact between the air heat exchanger 400 and the wind from the external environment, thereby affecting the heat exchange efficiency of the air heat exchanger 400. The present application places the compressor 100 and the integrated component 900 on both sides of the condenser 200 along the height direction H of the thermal management device, reducing the obstruction of the compressor 100 and the integrated component 900 to the air heat exchanger 400, improving the heat exchange efficiency of the air heat exchanger, and thereby improving the heat exchange efficiency of the thermal management device.

[0024] refer to Figure 6 and Figure 7 As shown, in some embodiments, the thermal management device includes a first tube 1301 and a second tube 1302, the compressor 100 and the air heat exchanger 200 are both connected to the first tube 1301; the air heat exchanger 200 and the integrated component 900 are both connected to the second tube 1302; a transverse direction X is defined, the transverse direction X is perpendicular to the height direction H, and along the transverse direction X, the first tube 1301 and the second tube 1302 are both located on the same side of the air heat exchanger 200.

[0025] refer to Figure 1 and Figure 5As shown, in some embodiments, the thermal management device has a coolant flow path, which is used to circulate cooling liquid, and part of the integrated component 900 is arranged in the coolant flow path; the thermal management device includes a first fluid part 91 and a second fluid part 92, one of the first fluid part 91 and the second fluid part 92 has a coolant flow inlet, and the other of the first fluid part 91 and the second fluid part 92 has a coolant flow outlet; the first fluid part 91 and the second fluid part 92 are both located in the coolant flow path; the thermal management device includes a shell 800, at least part of the first fluid part 91 and at least part of the second fluid part 92 are connected to the shell 800; a transverse direction X is defined, and the transverse direction X is perpendicular to the height direction H. Along the transverse direction X, the first fluid part 91 and the second fluid part 92 are located on the same side of the shell 800, which can reduce the thickness of the thermal management device on the one hand, and facilitate heat dissipation of the energy storage device on the other hand, reducing the complexity of pipeline connection.

[0026] refer to Figure 8 and Figure 9 As shown, in some embodiments, the integrated component 900 includes a fluid management component 500, and the fluid management component 500 includes a flow channel portion 1 and a box portion 2, the flow channel portion 1 is connected to the box portion 2, the flow channel portion 1 has a flow channel, and the box portion 2 has a liquid storage cavity, the liquid storage cavity is used to store cooling liquid, and the cooling liquid flow path and the flow channel are both connected to the liquid storage cavity; the cooling liquid flow path has a third flow path L and a fourth flow path M, the first fluid portion 91 has a cooling liquid flow outlet, and the second fluid portion 92 has a cooling liquid flow inlet, the cooling liquid flow outlet is connected to the third flow path L, and the cooling liquid flow inlet is connected to the fourth flow path M.

[0027] refer to Figure 6 and Figure 7 As shown, further, in some embodiments, the thermal management device includes a first fluid pipe 901 and a second fluid pipe 902, the first fluid part 91 is connected to the first fluid pipe 901, and the second fluid part 92 is connected to the second fluid pipe 902, the pipeline of the first fluid pipe 901 is connected to the coolant outlet of the first fluid part 91; the pipeline of the second fluid pipe 902 is connected to the coolant inlet; the pipeline of the first fluid pipe 901 and the pipeline of the second fluid pipe 902 are both connected to the liquid storage chamber; the thickness direction Y of the thermal management device is defined, the thickness direction Y is perpendicular to the height direction H, along the thickness direction Y, the first fluid pipe 901 and the second fluid pipe 902 are both located on the same side of the air heat exchanger 400, reducing the obstruction to the air heat exchanger 400 and improving the heat exchange efficiency of the thermal management device.

[0028] In some embodiments, in some embodiments, the thermal management device includes a first tube 1301 and a second tube 1302, the compressor 100 and the air heat exchanger 200 are both connected to the first tube 1301; the air heat exchanger 200 and the integrated component 900 are both connected to the second tube 1302; a transverse direction X is defined, the transverse direction X is perpendicular to the height direction H, and along the transverse direction X, the first tube 1301 and the second tube 1302 are both located on the same side of the air heat exchanger 200.

[0029] Furthermore, in some embodiments, the thermal management device includes a filter element 137, a first coolant pipe 1401 and a third pipe 1303, the second pipe 1302 and the third pipe 1033 are both connected to the filter element 137, the third pipe 1303 is connected to the integrated component 900, and the first coolant pipe 1401 is connected to the box body 2; the filter element 7 and the first coolant pipe 1401 are both located in the shell 800, and along the transverse direction X, at least part of the filter element 7, the first coolant pipe 1401 and the third pipe 1303 are all located on the same side of the air heat exchanger 400, thereby reducing obstruction to the air heat exchanger 400 and improving the heat exchange efficiency of the thermal management device.

[0030] Reference 3 to Figure 7 As shown, in some embodiments, the thermal management device includes a first fan 300. Along the height direction H, the compressor 100 and the integrated component 900 are located on both sides of the air heat exchanger 200, and the first fan 300 and the compressor 100 are located on the same side of the air heat exchanger 300. A transverse direction X is defined, and the transverse direction X is perpendicular to the height direction H. Along the transverse direction X, the first fan 300 is located on one side of the compressor 100. In the present application, the first fan 300 and the air heat exchanger 300 are staggered along the height direction H, and the first fan 300 and the air heat exchanger 300 are placed along the transverse direction X of the thermal management device. On the one hand, the thickness direction of the thermal management device can be reduced. On the other hand, the first fan 300 can assist in heat dissipation for the compressor 100, and then flow out after passing through the windward surface of the air heat exchanger 300, and then exchange heat with the air heat exchanger 300.

[0031] It should be noted that the first fan 300 used in the present application is a centrifugal fan, which has the characteristics of axial air intake and radial air exhaust, where axial and radial both refer to the rotating axis of the impeller of the fan.

[0032] refer to Figures 1 to 5As shown, in some embodiments, the thermal management device includes a shell 800, and the compressor 100, the air heat exchanger 200 and the integrated component 900 are all located in the shell 800; the shell 800 has a base plate 81, and the compressor 100 is connected to the base plate 81; along the height direction H, the integrated component 900 is away from the base plate 81 relative to the air heat exchanger 200, and the air heat exchanger 400 is away from the base plate 81 relative to the compressor 100, which can reduce the thickness of the thermal management device.

[0033] refer to Figure 1 and Figure 2 As shown, in some embodiments, the thermal management device includes an electrical control box 83, which is connected to at least a portion of the shell 800; the thickness direction Y of the thermal management device is defined, and the thickness direction Y is perpendicular to the height direction H. Along the thickness direction Y, the electrical control box 83 is located on one side of the air heat exchanger 200; further, in some embodiments, the air heat exchanger 200 is arranged opposite to the electrical control box 83. By arranging the electrical control box 83 opposite to the air heat exchanger 200 and arranging the electrical control box 83 on the side wall of the shell 800, the space occupied by the electrical control box 83 in the thermal management device can be reduced, thereby reducing the volume of the thermal management device.

[0034] refer to Figure 1 and Figure 2 As shown, in some embodiments, the thermal management device has a first air duct 700, at least part of the compressor 100 and at least part of the air heat exchanger 200 are located in the first air duct 700, the thermal management device has a first air outlet 82, and the first air outlet 82 is connected to the first air duct 700; the first air outlet 82 has an air outlet direction 802, and the air heat exchanger 200 has a windward surface, at least part of the windward surface intersects with the air outlet direction 802, so that the heat in the first air duct 700 is exchanged with the air heat exchanger 200.

[0035] refer to Figure 4 and Figure 7 As shown, further, in some embodiments, the thermal management device includes a first air guide plate 811 and a second air guide plate 812, the first air guide plate 811 and the second air guide plate 812 are both connected to the shell 800, the first air guide plate 811 is located between the compressor 100 and the air heat exchanger 200, and at least part of the second air guide plate 812 is located between the integrated component 900 and the air heat exchanger 200; the first air guide plate 811 has a first air guide surface 8111, and the second air guide plate 812 has a second air guide surface 8121, at least part of the first air guide surface 8111 and at least part of the second air guide surface 8121 both intersect with the air outlet direction 802, so that the wind generated by the first fan 300 passes through the first air guide surface 8111 of the first air guide plate 811 and the second air guide surface 8121 of the second air guide plate 812 to change the wind direction, so that the wind passes through the air heat exchanger 200, and then exchanges heat with the air heat exchanger 200.

[0036] refer to Figure 8 and Figure 9 As shown, in some embodiments, the integrated assembly 900 includes a first heat exchanger 3, and along the thickness direction Z of the thermal management device, the housing portion 2 and the first heat exchanger 3 are both located on the same side of the flow channel portion 1. In this application, on the one hand, integrating the housing portion 2 and the first heat exchanger 3 on the flow channel portion 1 can shorten the communication path from the cooling liquid in the water tank portion 2 to the first heat exchanger 3, thereby improving the working efficiency of the thermal management device; on the other hand, arranging the housing portion 2 and the first heat exchanger 3 on the same side of the flow channel portion 1 along the thickness direction Z of the thermal management device can reduce the thickness of the thermal management device, thereby enabling its application in the heat dissipation of energy storage devices, such as batteries, circuit boards, etc.

[0037] refer to Figure 8 As shown, further, in some embodiments, the integrated component 900 includes a second heat exchanger 4 and a first pump 5, and the second heat exchanger 4 and the first pump 5 are both connected to the flow channel portion 1; along the thickness direction Z of the thermal management device, the first heat exchanger 3, the second heat exchanger 4 and the first pump 5 are all located on the same side of the flow channel portion 1 to reduce the thickness of the thermal management device; the first direction X1 is defined as perpendicular to the thickness direction Z, and along the first direction X1, the second heat exchanger 4 is located on one side of the first heat exchanger 3, and the second heat exchanger 4 is closer to the box body portion 2 relative to the first heat exchanger 3.

[0038] In some embodiments, the integrated component 900 includes a first throttle valve 31, a first mounting module 33, a second throttle valve 41 and a second mounting module 43, the first mounting module 33 is connected to the first heat exchanger 3, the first throttle valve 31 is connected to the first mounting module 33, the second mounting module 43 is connected to the second heat exchanger 4, and the second throttle valve 41 is connected to the second mounting module 43; along the thickness direction Z of the thermal management device, the first throttle valve 31 and the first mounting module 33 are located on one side of the first heat exchanger 3, and the second throttle valve 41 and the second mounting module 43 are located on one side of the second heat exchanger 4.

[0039] refer to Figure 9 As shown, in some embodiments, the integrated component 900 includes a first pump 5 and a second pump 6, and the first pump 5 and the second pump 6 are both connected to the flow channel portion 1; along the thickness direction Z, the first pump 5 and the second pump 6 are both located on the same side of the flow channel portion 1; along the first direction X1, the second pump 6 is located on one side of the first pump 5, and the second pump 6 is closer to the box portion 2 relative to the first pump 5. The first pump 5 and the second pump 6 are placed on the same side of the flow channel portion 1 along the first direction X1, thereby reducing the thickness of the thermal management device; a second direction X2 is defined, and the second direction X2 is perpendicular to the first direction X1. Along the second direction X2, the first heat exchanger 3 and the second heat exchanger 4 are located on one side of the first pump 5 and the second pump 6.

[0040] refer to Figure 8and Figure 9 As shown, in some embodiments, the integrated component 900 includes a heating element 7, which is connected to the flow channel portion 1. Along the thickness direction Z, the first heat exchanger 3, the second heat exchanger 4, the first pump 5, the second pump 6 and the heating element 7 are all located on the same side of the flow channel portion 1.

[0041] In some embodiments, the integrated component 900 includes a liquid supply portion 111 and a liquid return portion 112; the liquid supply portion 111 and the liquid return portion 112 are both connected to the flow channel portion 1; along the second direction X2, the liquid supply portion 111 and the liquid return portion 112 are located on the same side of the flow channel portion 1, and relative to the flow channel portion 1, the liquid supply portion 111 and the liquid return portion 112 are away from the box portion 2; the liquid supply portion 111 is connected to the first fluid pipe 901, and the liquid return portion 112 is connected to the second fluid pipe 902.

[0042] In some embodiments, the integrated component 900 includes a first sensor 32, a second sensor 42, a third sensor 114 and a fourth sensor 113. The first sensor 32 is arranged on the first mounting module 33, and the second sensor is arranged on the second mounting module 43; the third sensor 113 is arranged on the liquid supply port 1111, and the fourth sensor 113 is arranged on the liquid return part 112.

[0043] In some embodiments, the housing 2 includes a pressure relief member 202. Along the first direction X1, the pressure relief member 202 and the liquid level probe 201 are located on the same side of the housing 2. The housing 2 has a liquid inlet 203, defining a second direction X2. The second direction X2 is perpendicular to the first direction X1. The liquid inlet 203 is arranged along the second direction X2. Arranging the liquid inlet 203 and the housing 2 along the second direction X2 can reduce the fluid resistance of the cooling liquid entering the housing 2 from the liquid inlet 203.

[0044] It should be noted that the first direction X1 of the integrated component 900 in this application corresponds to the height direction H of the thermal management device, the second direction X2 corresponds to the lateral direction X of the thermal management device, and the thickness direction Z corresponds to the thickness direction Y of the thermal management device.

[0045] Furthermore, in some embodiments, the thermal management device includes a first cooling liquid pipe 1401 , which is connected to the box body 2 , and a pipe of the first cooling liquid pipe 1401 is in communication with the liquid inlet 203 for circulating cooling liquid.

[0046] refer to Figure 6 and Figure 7As shown, in some embodiments, the thermal management device includes a first pipe 1304, a second pipe 1305, a third pipe 1306, a fourth pipe 1307 and a fifth pipe 1308, the first pipe 1304 and the third pipe 1306 are both connected to the third pipe 1033, the first pipe 1304 is connected to the first throttle valve 31, the second pipe 1305 is connected to the first heat exchanger 3, the second pipe 1305 and the fourth pipe 1307 are both connected to the fifth pipe 1308, the third pipe 1306 is connected to the second throttle valve 41, the fourth pipe 1307 is connected to the second heat exchanger 4, and the first pipe 1304, the second pipe 1305, the third pipe 1306, the fourth pipe 1307 and the fifth pipe 1308 are all used to circulate refrigerant.

[0047] refer to Figure 10 and Figure 11 As shown, the present application also provides a thermal management system, including a first heat exchanger 3 and a second heat exchanger 4, the first heat exchanger 3 has a first water side flow channel 312 and a first agent side flow channel 311, the second heat exchanger 4 has a second water side flow channel 412 and a second agent side flow channel 411, the first water side flow channel 312 and the second water side flow channel 412 are both used to circulate cooling liquid, and the first agent side flow channel 311 and the second agent side flow channel 411 are both used to circulate refrigerant; the thermal management system includes a water side flow path, the water side flow path includes a first flow path H, a first water side branch F and a second water side branch I, the first water side branch F and the second water side branch I are both connected to the first flow path H, the first heat exchanger 3 is partially arranged on the first water side branch F, and the second heat exchanger 4 is partially arranged on the second water side branch I; on the water side flow path, the first heat exchanger 3 and the second heat exchanger 4 are arranged in parallel.

[0048] In the present application, the thermal management system includes a first heat exchanger 3 and a second heat exchanger 4. Both the first heat exchanger and the second heat exchanger have a water side flow channel for circulating cooling liquid, and both the first heat exchanger and the second heat exchanger have an agent side flow channel for circulating refrigerant. In addition, on the water side flow channel, the first heat exchanger and the second heat exchanger are arranged in parallel. The refrigerant and the cooling liquid can not only exchange heat in the first heat exchanger, but also can simultaneously exchange heat in the second heat exchanger, thereby improving the heat exchange efficiency between the refrigerant and the cooling liquid.

[0049] In some embodiments, the thermal management system has a coolant flow path and a refrigerant flow path, the coolant flow path is located on the water side flow path, the coolant flow path is used to circulate the cooling liquid, and the refrigerant flow path is used to circulate the refrigerant.

[0050] It should be noted that the cooling liquid in this application is used to cool the energy storage device, such as water, and the heat exchange fluid and refrigerant are both refrigerants, such as refrigerants R410A, R32, R290, etc.

[0051] In some embodiments, the cooling liquid flow path includes a first flow path H, a first water side branch F and a second water side branch I; the first flow path H, the first water side branch F and the second water side branch I are all used to circulate cooling liquid, such as water; the first water side branch F and the second water side branch I are both connected to the first flow path H; the first water side branch F and the second water side branch I are arranged in parallel.

[0052] In some embodiments, the thermal management system includes a compressor 100 and an air heat exchanger 200; the refrigerant flow path includes a second flow path A, a first agent side branch B and a second agent side branch C, the second flow path A, the first agent side branch B and the second agent side branch C are all used to circulate refrigerant, and the first agent side branch B and the second agent side branch C are both connected to the second flow path A; the compressor 100 and the air heat exchanger 200 are both located in the second flow path A, the first heat exchanger 3 is located in the first agent side branch B, and the second heat exchanger 4 is located in the second agent side branch C, the first heat exchanger 3 and the second heat exchanger 4 are respectively connected in series with the air heat exchanger 200, that is, the refrigerant in the second flow path A flows into the first heat exchanger 3 and the second heat exchanger 4 respectively through the air heat exchanger 200.

[0053] In some embodiments, the first heat exchanger 3 includes a first agent side flow channel 311, and the second heat exchanger 4 includes a second agent side flow channel 411. The first agent side flow channel 311 and the second agent side flow channel 411 are both used to circulate refrigerant; the first agent side flow channel 311 is connected to the first agent side branch B, and the second agent side flow channel 411 is connected to the second agent side branch C; the first agent side flow channel 311 and the second agent side flow channel 411 are both connected to the second flow path A; the thermal management system also includes a third agent side branch E and a fourth agent side branch J, and the first agent side flow channel 311 is connected to the first agent side branch B, and the second agent side flow channel 411 is connected to the second agent side branch C. The third agent side branch E and the fourth agent side branch J are both used for circulating refrigerant. The third agent side branch E is at least partially located in the first agent side branch B, and the fourth agent side branch J is at least partially located in the second agent side branch C. The first agent side flow channel 311 is connected to the third agent side branch E, and the second agent side flow channel 411 is connected to the fourth agent side branch J; the third agent side branch E and the fourth agent side branch A are both connected to the second flow channel A to form a refrigerant flow cycle. The third agent side branch E and the fourth agent side branch J are both provided with thermal insulation cotton 138.

[0054] refer to Figure 10 and Figure 11As shown, in some embodiments, the thermal management system includes a first fan 300 and a drying filter 137, and the first fan 300 and the drying filter 137 are both arranged in the second flow path A; relative to the drying filter 137, the first fan 300 is close to the air heat exchanger 200, and the first fan 300 is used to drive the wind flow around the air heat exchanger 200; the first agent side branch B and the second agent side branch C are both connected to the drying filter 137, and the drying filter 137 can filter impurities and harmful substances in the refrigerant in the second flow path A, reduce the content of harmful impurities in the refrigerant, such as solid pollutants, corrosive substances, etc., and can also filter moisture in the refrigerant to reduce the freezing of the refrigerant on other components to ensure the normal operation of the thermal management system.

[0055] refer to Figure 10 As shown, in some embodiments, the thermal management system includes a water tank 2 and a first pump 5. The first pump 5 is arranged in the first flow path H. The water tank 2 is connected to the first flow path H. The first pump 5 drives the cooling liquid in the water tank 2 to flow to the first flow path H, and then flows to the first water side branch F and the second water side branch I respectively.

[0056] refer to Figure 11 As shown, in some embodiments, the thermal management system includes a water tank 2, a first pump 5 and a second pump 6. The water tank 2 is connected to the first flow path H, the first pump 5 is arranged in the first water side branch F, and the second pump 6 is arranged in the second water side branch I. The first pump 5 can drive the cooling liquid in the water tank 2 to flow to the first water side branch F, and the first pump 6 can drive the cooling liquid in the water tank 2 to flow to the second water side branch I.

[0057] In some embodiments, the first water side branch F is connected to the first water side flow channel 312, and the second water side branch I is connected to the second water side flow channel 412; the thermal management system includes a third water side branch D and a fourth water side branch K, the third water side branch D is at least partially located in the first water side branch F, the fourth water side branch K is at least partially located in the second water side branch I, the third water side branch D is connected to the first water side flow channel 312, and the fourth water side branch K is connected to the second water side flow channel 412.

[0058] In some embodiments, the cooling liquid flow path includes a third flow path L and a fourth flow path M, both of which are used to circulate cooling liquid, and the third water side branch D and the fourth water side branch K are both connected to the third flow path L; the fourth flow path M is connected to the water tank 2; the third flow path L and the fourth flow path M are both used to circulate cooling liquid; the thermal management system includes a heating element 7 and a first sensor 113, the heating element 7 and the first temperature and pressure sensor 113 are both arranged in the third flow path L, the heating element 7 is used to regulate the temperature of the cooling liquid in the third flow path L, and the first temperature and pressure sensor 113 is used to monitor the temperature of the cooling liquid in the third flow path L.

[0059] refer to Figure 10 and Figure 11 As shown, in some embodiments, the thermal management system includes a first throttle valve 31, a second throttle valve 41, a second sensor 32 and a third sensor 42. The first throttle valve 31 is arranged on the first agent side branch B, for adjusting the refrigerant flow of the first agent side branch B, and the second throttle valve 31 is arranged on the second agent side branch C, for adjusting the refrigerant flow of the second agent side branch C; the second sensor 32 is arranged on the third agent side branch E, for sensing the temperature and pressure of the third agent side branch E, and the third sensor 42 is arranged on the fourth agent side branch J, for sensing the temperature and pressure of the fourth agent side branch J; the second sensor 32 is connected to the first heat exchanger 3, and the third sensor 42 is connected to the second heat exchanger 4.

[0060] In some embodiments, the thermal management system includes a first needle valve 131 and a second needle valve 134, both of which are arranged in the second flow path A, and the compressor 100 is arranged between the first needle valve 131 and the second needle valve 134, for adjusting the gas flow of the second flow path A; the thermal management system also includes a liquid level probe 201, which is arranged in the water tank 2, for detecting the water level of the cooling liquid in the water tank 2, and the water tank 2 has a liquid replenishing port 203, for replenishing the cooling liquid for the water tank 2.

[0061] In some embodiments, the thermal management system includes a heating element 7, which is arranged in the third flow path L. The cooling liquid in the third flow path L is used to dissipate heat from the energy storage device. When the temperature of the cooling liquid is low, the heating element 7 can heat the cooling liquid in the third flow path L to ensure that the temperature of the cooling liquid is moderate and reduce damage to the energy storage device; the cooling liquid flowing through the energy storage device returns to the water tank through the fourth flow path M.

[0062] In some embodiments, the thermal management system includes a temperature sensor 132 and a pressure sensor 135 . The temperature sensor 132 and the pressure sensor 135 are both disposed in the second flow path A to monitor the temperature and pressure of the cooling liquid in the second flow path A.

[0063] refer to Figure 10 and Figure 11As shown, in some embodiments, the thermal management system includes a refrigerant circulation path and a cooling liquid circulation path, and the refrigerant and the cooling liquid exchange heat to achieve the purpose of cooling; the refrigerant circulation path is: in the second flow path A, the gaseous refrigerant discharged from the compressor 100 enters the air heat exchanger 200, releasing a large amount of heat; the first fan 300 is started, and the first fan 300 drives the surrounding wind to dissipate heat from the air heat exchanger 200. After the refrigerant is filtered by the drying filter 137, it enters the first agent side branch B and the second agent side branch C respectively. The refrigerant in the first agent side branch B passes through the first throttle valve 31 and enters the first agent side branch of the first heat exchanger 3. Side channel 311, the refrigerant in the first agent side channel 311 exchanges heat with the coolant in the first water side channel 312, thereby cooling the coolant to achieve the purpose of cooling, and then the refrigerant in the first agent side channel 311 flows into the third agent side branch E, and finally returns to the second channel A, the refrigerant in the second agent side branch C passes through the second throttle valve 41 and enters the second agent side channel 411 of the second heat exchanger 4, the refrigerant in the second agent side channel 411 exchanges heat with the coolant in the second water side channel 412, and cools the coolant, and then the refrigerant in the second agent side branch C flows into the fourth agent side branch J, and finally returns to the second channel A.

[0064] In some embodiments, the circulation path of the coolant is as follows: the coolant in the water tank 2 enters the first water side branch F and the second water side branch I through the fourth water side branch K respectively by driving the first pump 5 and the second pump 6, or enters the first water side branch F and the second water side branch I respectively through the fourth water side branch K by driving the first pump 5; the coolant in the first water side branch F passes through the first water side channel 312 of the first heat exchanger 3, enters the third water side branch D, and then flows into the third flow path L, the coolant in the second water side branch I passes through the second water side channel 412 of the second heat exchanger 4, enters the fourth water side branch K, and then flows into the third flow path L, and the cooling liquid in the third flow path L passes through the heating element 7 and enters the energy storage device for heat dissipation.

[0065] It should be noted that the first heat exchanger 3 and the second heat exchanger 4 are evaporators, which can be selected from plate evaporators, microchannel evaporators, etc.; the air heat exchanger 200 is a microchannel heat exchanger.

[0066] The above embodiments are only used to illustrate the present application and are not intended to limit the technical solutions described in the present application. The understanding of the present application should be based on technical personnel in the relevant technical field. Although this specification has described the present application in detail with reference to the above embodiments, ordinary technical personnel in the field should understand that technical personnel in the relevant technical field can still modify or replace the present application with equivalents, and all technical solutions and improvements that do not depart from the spirit and scope of the present application should be included in the scope of the claims of the present application.

Claims

1. A thermal management device, characterized in that: The thermal management device comprises an air heat exchanger (400) and an integrated component (900); along the height direction (H) of the thermal management device, the integrated component (900) is located on one side of the air heat exchanger (400); The thermal management device (900) has a refrigerant flow path for circulating refrigerant, and the air heat exchanger (400) and part of the integrated component (900) are both arranged in the refrigerant flow path.

2. The thermal management device according to claim 1, characterized in that: The thermal management device comprises a compressor (100), the compressor (100) being arranged in the refrigerant flow path, and along the height direction (H) of the thermal management device, the compressor (100) and the integrated component (900) being respectively located on both sides of the air heat exchanger (400).

3. The thermal management device according to claim 2, characterized in that: The thermal management device has a cooling liquid flow path, the cooling liquid flow path is used to circulate cooling liquid, and part of the integrated component (900) is arranged in the cooling liquid flow path; The thermal management device comprises a first fluid portion (91) and a second fluid portion (92), one of the first fluid portion (91) and the second fluid portion (92) having a coolant inlet, the other of the first fluid portion (91) and the second fluid portion (92) having a coolant outlet, and both the first fluid portion (91) and the second fluid portion (92) are arranged in the coolant flow path; The thermal management device comprises a housing (800), and at least a portion of the first fluid portion (91) and at least a portion of the second fluid portion (92) are connected to the housing (800); A transverse direction (X) is defined, wherein the transverse direction (X) is perpendicular to the height direction (H), and along the transverse direction (X), the first fluid portion (91) and the second fluid portion (92) are located on the same side of the housing (800).

4. The thermal management device according to claim 3, characterized in that: The housing (800) has a bottom plate (81), and the compressor (100) and the integrated component (900) are both located in the housing (800); Along the height direction (H), the integrated assembly (900) is away from the base plate (81) relative to the air heat exchanger (400), and the air heat exchanger (400) is away from the base plate (81) relative to the compressor (100).

5. The thermal management device according to claim 3, characterized in that: The thermal management device comprises a filter element (7) and a first cooling liquid pipe (1401); the compressor (100) and the integrated component (900) are both connected to the filter element (7); the first cooling liquid pipe (1401) is connected to the box body (2); The filter element (7) and the first coolant pipe (1401) are both located in the housing (800), and along the transverse direction (X), at least a portion of the filter element (7) and the first coolant pipe (1401) are both located on the same side of the air heat exchanger (400).

6. The thermal management device according to claim 1, characterized in that: The integrated component (900) includes a fluid management component (500), and the fluid management component (500) includes a flow channel portion (1) and a box portion (2), wherein the flow channel portion (1) is connected to the box portion (2), the flow channel portion (1) has a flow channel, and the box portion (2) has a liquid storage cavity, wherein the liquid storage cavity is used to store cooling liquid, and the liquid storage cavity is connected to the flow channel.

7. The thermal management device according to claim 6, characterized in that: The thermal management device comprises a first fluid pipe (901) and a second fluid pipe (902), defining a thickness direction (Y) of the thermal management device, wherein the thickness direction (Y) is perpendicular to the height direction (H), and along the thickness direction (Y), the first fluid pipe (901) and the second fluid pipe (902) are both located on the same side of the air heat exchanger (400); The thermal management device includes a first fluid portion (91) and a second fluid portion (92), one of the first fluid portion (91) and the second fluid portion (92) having a coolant inlet, and the other of the first fluid portion (91) and the second fluid portion (92) having a coolant outlet; The first fluid tube (901) is connected to the first fluid portion (91), and the second fluid tube (902) is connected to the second fluid portion (92); the cooling liquid outlet is connected to the pipeline of the first fluid tube (901), and the cooling liquid inlet is connected to the pipeline of the second fluid tube (902); the pipeline of the first fluid tube (901) and the pipeline of the second fluid tube (902) are both connected to the liquid storage chamber.

8. The thermal management device according to any one of claims 1 to 7, characterized in that: The thermal management device comprises a first fan (300), and along the height direction (H), the first fan (300) and the compressor (100) are located on the same side of the air heat exchanger (300); A transverse direction (X) is defined, the transverse direction (X) being perpendicular to the height direction (H), and along the transverse direction (X), the first fan (300) is located on one side of the compressor (100).

9. The thermal management device according to claim 8, characterized in that: The thermal management device has a first air duct (700), and at least part of the compressor (100) and at least part of the air heat exchanger (400) are both located in the first air duct (700). The thermal management device comprises a housing (800), the housing (800) having a first air outlet (82), and the first air outlet (82) is in communication with the first air duct (700); The first air outlet (82) has an air outlet direction (802), the air heat exchanger (400) has a windward surface, and the air outlet direction (802) intersects with at least a portion of the windward surface.

10. The thermal management device according to claim 9, characterized in that: The thermal management device comprises a first air guide plate (811) and a second air guide plate (812), wherein the first air guide plate (811) and the second air guide plate (812) are both connected to the housing (800), at least a portion of the first air guide plate (811) is located between the compressor (100) and the air heat exchanger (400), and at least a portion of the second air guide plate (812) is located between the integrated component (900) and the air heat exchanger (400); The first wind guide plate (811) has a first wind guide surface (8111), and the second wind guide plate (812) has a second wind guide surface (8121), and at least a portion of the first wind guide surface (8111) and at least a portion of the second wind guide surface (8121) intersect with the wind outlet direction (802).

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