Liquid cooling plate for laser and laser

Abstract

The invention discloses a liquid cooling plate for a laser and the laser, the liquid cooling plate is used for placing and cooling a pumping source, a cooling flow channel is arranged in the liquid cooling plate, the flow channel wall of the cooling flow channel is used for guiding cooling liquid to flow along a first plane parallel to the liquid cooling plate, and a flow guide structure is arranged in the cooling flow channel. The flow guide structure is used for changing the cooling liquid flowing along the first plane to flow along a second plane which forms an included angle with the first plane, so that the cooling liquid is guided to flow towards the hot spot position of the pumping source. Through the arrangement, the flowing direction of the cooling liquid can be changed, and the cooling liquid parallel to the cooling flow channel is changed to flow towards the hot spot position of the pumping source, so that the flowing direction of the cooling liquid is changed into a jet flow form, and the hot spot position of the pumping source is directly subjected to jet flow heat dissipation; and the boundary layer is very thin, so that the heat exchange effect is multiplied.

Description

Technical Field

[0001] The present invention relates to the technical field of lasers, and in particular to a liquid cooling plate for lasers and a laser. Background Art

[0002] Currently, laser technology research and development focuses on continuously increasing the power of single chips. However, as chip power increases, the heat generated also intensifies, significantly increasing the heat flux density, which places higher demands on the cooling system. Existing water-cooled plates mostly use convection heat transfer, which can maintain good heat dissipation for chips with power ranges of 35W to 45W. However, when the chip power climbs to 55W, their heat dissipation capacity becomes insufficient. As laser output power continues to increase, the laser chip is prone to overheating and burning. Summary of the Invention

[0003] The purpose of the present invention is to propose a liquid cooling plate and a laser for a laser, aiming to solve the problem that the heat dissipation capacity of the heat dissipation system in the existing high-power laser is insufficient, which easily leads to excessive temperature and burning of the laser chip.

[0004] In a first aspect, the present invention provides a liquid cooling plate for a laser, wherein the liquid cooling plate is used to place and cool a pump source, and a cooling channel is provided in the liquid cooling plate, wherein the channel wall of the cooling channel is used to guide the cooling liquid to flow along a first plane parallel to a first plane where the liquid cooling plate is located, and a guide structure is provided in the cooling channel, wherein the guide structure is used to change the cooling liquid flowing along the first plane to flow along a second plane set at an angle to the first plane, thereby guiding the cooling liquid to flow toward the hot spot position of the pump source.

[0005] In one embodiment, the guide structure is a protrusion formed on the channel wall of the cooling channel, and a guide surface arranged parallel to the second plane is formed on the protrusion.

[0006] In one embodiment, the flow area of ​​the protrusion in the cooling channel is smaller than the flow area on the liquid inlet side of the cooling channel; and / or,

[0007] A plurality of the guide structures are arranged at intervals along the extension track of the cooling channel and are arranged corresponding to the pump sources.

[0008] In one embodiment, the first plane is perpendicular to the second plane.

[0009] In one embodiment, the cooling channel includes a first channel wall close to the pump source and a second channel wall away from the pump source;

[0010] The flow guide structure includes at least one first protrusion formed on the first flow channel wall and at least one second protrusion formed on the second flow channel wall, and the first protrusion and the second protrusion are staggered.

[0011] In one embodiment, both the first protrusion and the second protrusion are square protrusions.

[0012] In one embodiment, the distance between the first flow channel wall and the second flow channel wall is L, the height of the first protrusion extending relative to the first flow channel wall protrusion, and the height of the second protrusion extending relative to the second flow channel wall protrusion are both H, 2.2 mm ≤ LH ≤ 2.8 mm; and / or,

[0013] The width of the first protrusion and the second protrusion along the extension track of the cooling channel is greater than 3 mm.

[0014] In one embodiment, the cooling channels are arranged in a serpentine shape, and grooves are provided on the channel walls of the cooling channels. The grooves are provided corresponding to the pump sources and are used to reduce the distance between the channel walls of two adjacent cooling channels.

[0015] In one embodiment, the base of the pump source is a structural member made of copper metal or aluminum alloy.

[0016] In a second aspect, the present invention further provides a laser, comprising:

[0017] A pump source, comprising a base and a plurality of laser chips disposed in the base;

[0018] and a liquid cooling plate for a laser according to any of the above embodiments;

[0019] Wherein, the pump source is placed on the liquid cooling plate and is arranged corresponding to the flow guide structure.

[0020] The embodiments of the present invention have the following beneficial effects:

[0021] The liquid cooling plate and laser for lasers of the invention are used. The flow channel wall of the cooling channel is used to guide the cooling liquid to flow along a first plane parallel to the liquid cooling plate. The guide structure is used to change the cooling liquid flowing along the first plane to flow along a second plane set at an angle to the first plane, thereby guiding the cooling liquid to flow toward the hot spot position of the pump source. Through such a setting, the guide structure can guide the flow direction of the cooling liquid to be set at an angle to the plane where the liquid cooling plate is located, and can change the flow direction of the cooling liquid, changing the cooling liquid parallel to the cooling channel to flow toward the hot spot position of the pump source. The guide structure shrinks the cross-sectional area of ​​the cooling channel, further increasing the flow speed of the cooling liquid, and at the same time, the cooling liquid flows toward the pump. The coolant flowing at the hot spot of the source absorbs a large amount of heat and its temperature rises rapidly in the process of flowing toward the hot spot, which reduces the viscosity of the coolant, reduces the jet flow resistance, and reduces the surface tension of the liquid, thereby changing the flow direction of the coolant to a jet form, and directly performing jet heat dissipation on the hot spot of the pump source. Since the jet will compress the boundary layer of the fluid to the extreme, its boundary layer is very thin, so its heat transfer effect will be multiplied. At the same time, due to the turbulent effect of the guide structure, local eddies will be generated near the guide structure. The formation of eddies will also enhance the heat dissipation effect of the hot spot of the pump source. By setting a liquid cooling plate structure with better heat dissipation capability, the laser can be adapted to higher power laser chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0023] in:

[0024] Figure 1 Schematic diagram of a pump source and a liquid cooling plate in a laser according to an embodiment.

[0025] Figure 2 for Figure 1 Exploded view of the pump source and liquid cooling plate shown.

[0026] Figure 3 for Figure 1 Schematic diagram of the liquid cold plate shown.

[0027] Figure 4 for Figure 3 Middle AA section view.

[0028] Figure 5 for Figure 4 Enlarged schematic diagram of part C in the middle.

[0029] Figure 6 for Figure 3 Middle BB cross-section view.

[0030] Figure 7 Schematic diagram of a liquid cooling plate in one embodiment.

[0031] Figure 8 for Figure 7 A top view of the liquid cold plate is shown.

[0032] Figure 9 for Figure 8 Middle DD cross-sectional view.

[0033] Figure 10 for Figure 9 Enlarged schematic diagram of part F in the middle.

[0034] Figure 11 for Figure 8 Middle EE cross-sectional view.

[0035] Figure 12 Schematic diagram of a liquid cooling plate in one embodiment.

[0036] Figure 13 for Figure 12 Middle GG cross-sectional view.

[0037] Figure 14 FIG. 4 is a cross-sectional view of a liquid cooling plate in one embodiment.

[0038] Figure 15 1 is a cross-sectional view of a pump source and a liquid cooling plate in one embodiment.

[0039] Figure 16 for Figure 15 Enlarged schematic diagram of the middle H part.

[0040] Figure 17 Schematic diagram of cooling liquid flow simulation at a flow guide structure in a liquid cooling plate according to an embodiment.

[0041] Figure 18 Schematic diagram of a simulation of a laser in one embodiment.

[0042] Figure 19 FIG. 4 is a simulation diagram of a laser in another embodiment.

[0043] Figure numbers: 100, pump source; 200, liquid cooling plate; 210, cooling channel; 211, first channel wall; 212, second channel wall; 213, groove; 220, guide structure; 221, first protrusion; 222, second protrusion; 2221, guide surface; 230, plate body; 240, liquid inlet connector; 250, liquid outlet connector. DETAILED DESCRIPTION

[0044] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0045] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the various components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0046] In addition, the descriptions of "first", "second", etc. in the present invention are for descriptive purposes only and should not be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the said features. In addition, the technical solutions between the various embodiments can be combined with each other, but this must be based on the fact that they can be implemented by ordinary technicians in this field. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0047] With the development of laser technology and the continuous increase in chip power, the heat generated by the chip during operation has increased dramatically, and the heat flux density has increased significantly. If the heat generated by high-power chips cannot be dissipated promptly and effectively, the chip temperature will rise rapidly. This increase in chip temperature can cause a series of serious problems, such as reduced chip photoelectric conversion efficiency, unstable output optical power, shortened device life, and even permanent damage to the chip, seriously affecting the reliability and stability of the laser.

[0048] In a laser's cooling system, the hotspot is crucial for heat dissipation. This hotspot refers to the bottom of the pump source base, corresponding to the chip mounting location within the pump source. During laser operation, the chip serves as the primary heat source, generating heat that is transferred through the chip mounting location to the bottom of the pump source base. Due to the high power operation of the chip, this area at the bottom of the base becomes a concentrated heat source, known as the hotspot. The temperature in this area is significantly higher than that of the surrounding area, making it the part of the cooling system with the largest temperature gradient and the most pressing need for heat dissipation.

[0049] See also Figures 1 to 19The present invention discloses a laser comprising a pump source 100 and a liquid cooling plate 200. The pump source 100 comprises a base and a plurality of laser chips disposed within the base. The pump source 100 is placed on the liquid cooling plate 200. The liquid cooling plate 200 is provided with a cooling channel 210. The channel wall of the cooling channel 210 is configured to guide the coolant to flow along a first plane parallel to the liquid cooling plate 200. The cooling channel 210 is provided with a guide structure 220. The pump source 100 and the guide structure 220 are disposed correspondingly. The guide structure 220 is configured to redirect the coolant flowing along the first plane to flow along a second plane disposed at an angle to the first plane, thereby guiding the coolant toward the hotspot of the pump source 100. Specifically, the coolant can be water, an ethylene glycol-based coolant, or the like.

[0050] Figure 2 、 Figure 5 、 Figure 7 and Figure 10 , the plane where the direction indicated by arrow X and the direction indicated by arrow Y are located is the first plane, and the plane where the direction indicated by arrow X and the direction indicated by arrow Z are located is the second plane.

[0051] It can be understood that the guide structure is used to change the coolant flowing along the first plane to flow along a second plane set at an angle to the first plane, thereby guiding the coolant to flow toward the hot spot of the pump source. By setting it in this way, the guide structure can guide the flow direction of the coolant to be set at an angle to the plane where the liquid cooling plate is located, and can change the flow direction of the coolant, and change the coolant parallel to the cooling channel 210 to flow toward the hot spot of the pump source 100. The guide structure 220 shrinks the cross-sectional area of ​​the cooling channel 210, further increasing the flow rate of the coolant. At the same time, the coolant flows toward the hot spot of the pump source 100. The coolant absorbs a large amount of heat in the process of flowing toward the hot spot and the temperature rises rapidly, which makes the coolant Reducing the viscosity of the liquid can reduce the jet flow resistance and reduce the surface tension of the liquid, thereby changing the flow direction of the coolant to a jet form, directly performing jet heat dissipation on the hot spot position of the pump source 100, and forming a jet point at the hot spot position. Since the jet will compress the boundary layer of the fluid to the extreme, its boundary layer is very thin, so its heat transfer effect will increase exponentially, and the heat transfer coefficient of the jet is increased by 3-5 times compared with conventional convection. At the same time, due to the turbulent effect of the guide structure 220, local eddies will be generated near the guide structure 220. The formation of eddies will also enhance the heat dissipation effect on the hot spot position of the pump source 100. Through the liquid cooling plate 200 structure with better heat dissipation capability, the laser can be adapted to higher power laser chips.

[0052] The laser of the present invention only needs to improve the structure of the liquid cooling plate 200 to adapt to the existing laser structure setting, which can reduce the optimization cost of the laser's heat dissipation structure. It has high adaptability to the heat dissipation of the pump source 100 and can effectively reduce the unit watt cost of the original laser when using a 55W laser chip.

[0053] Specifically, due to limitations in the heat dissipation system, existing technologies can only adopt a 45W chip pump source configuration scheme, that is, using a 45W laser chip as the basic light-emitting unit of the pump source. A single pump source can be configured with 14 45W chips. The coupling efficiency of this pump source can reach 85%-95%, and the output power of a single pump source can reach approximately 550W. Therefore, in order to achieve the 3000W laser output power target, based on the output power of a single pump source, six pump sources are required. These six pump sources are integrated into the laser in a specific layout, connected to the corresponding power supply and control system, to build a complete 3000W laser system.

[0054] The heat dissipation system of this embodiment, through the structural arrangement of the liquid cooling plate 200, can improve the heat dissipation capacity of the pump source. This allows for the use of a 55W chip pump source configuration scheme, which uses a 55W laser chip as the basic light-emitting unit of the pump source. A single pump source can be configured with 14 55W chips, achieving a coupling efficiency range of 85%-95% and an output power of approximately 670W. Therefore, to achieve the target laser output power of 3000W, five pump sources are required based on the output power of a single pump source. These five pump sources are integrated into the laser in a specific layout, connected to the corresponding power supply and control system, to construct a complete 3000W laser system.

[0055] Comparing the two pump source configurations, we can see that the 55W chip pump source reduces the number of pump sources from six to five compared to the 45W chip pump source. This reduction in the number of pump sources directly reduces costs. In terms of raw material procurement, the number of chips, optical components, circuit boards, and other materials is reduced, lowering procurement costs. In the manufacturing process, fewer assembly steps reduce labor costs and potentially shorten production cycles. In terms of subsequent maintenance, the reduced number of pump sources means fewer points of failure, less maintenance workload, and effectively controlled maintenance costs.

[0056] Therefore, in the embodiment of the present invention, by using a 55W chip to construct a pump source, the cost of the laser is successfully reduced while ensuring the output power of the laser, which has significant economic benefits.

[0057] In one embodiment, see 1 to Figure 5 、 Figure 9 and Figure 10 、 Figure 16 The flow-guiding structure 220 is a protrusion formed on the wall of the cooling channel 210. A flow-guiding surface 2221, arranged parallel to the second plane, is formed on the protrusion. Through this configuration, the flow-guiding surface 2221 can redirect the coolant flowing parallel to the cooling channel 210 and the first plane to flow toward the hotspot of the pump source 100. The flow-guiding structure 220 shrinks the cross-sectional area of ​​the cooling channel 210, further increasing the flow velocity of the coolant. The coolant flows toward the hotspot of the pump source 100. During this process, the coolant absorbs a large amount of heat, rapidly increasing its temperature. This reduces the viscosity of the coolant, reduces the jet flow resistance, and lowers the surface tension of the liquid, thereby changing the flow direction of the coolant to a jet form, thereby increasing the heat exchange efficiency at the hotspot of the pump source 100.

[0058] Specifically, the coolant in the form of a jet can enhance the heat dissipation effect at the hotspot of the pump source 100. On the one hand, the jet form will compress the boundary layer of the coolant fluid to the extreme, forming a very thin boundary layer. The thinner the boundary layer, the greater the temperature gradient near the flow channel wall of the cooling channel 210, the smaller the thermal resistance, and thus the higher the heat exchange efficiency. At the same time, because the boundary layer is extremely thin, the heat exchange between the coolant fluid and the flow channel wall of the cooling channel 210 is more sufficient, and the heat exchange effect is multiplied. On the other hand, the direction and speed of the coolant jet can be precisely controlled by the protrusion arrangement of the guide structure 220, so that it can accurately enhance the heat dissipation at the hotspot of the pump source 100, facilitating adaptive settings for the local heat dissipation needs of electronic equipment, with a simple design and low cost.

[0059] Further, in this embodiment, please refer to 1 to Figure 5 、 Figure 9 and Figure 10 、 Figure 16 , the first plane is arranged perpendicular to the second plane, that is, the flow direction of the guide structure 220 guides the coolant to be arranged perpendicular to the plane where the liquid cooling plate 200 is located. It can be understood that the coolant parallel to the cooling channel 210 is changed to be perpendicular to the plane where the liquid cooling plate 200 is located. On the one hand, when the flow direction of the coolant is perpendicular to the plane of the liquid cooling plate 200, the coolant can more fully exchange heat with the channel wall of the cooling channel 210. This vertical flow method helps to break the thermal boundary layer, further reduce thermal resistance, and improve heat exchange efficiency. On the other hand, the vertically flowing coolant will produce stronger disturbances during the flow process, making the temperature distribution in the coolant more uniform, avoiding the occurrence of local overheating or overcooling, and thus improving the overall heat dissipation effect.

[0060] For details, please refer to 1 to Figure 5 、 Figure 9 and Figure 10 、 Figure 16 The cooling channel 210 includes a first channel wall 211 close to the pump source 100 and a second channel wall 212 away from the pump source 100; the flow guide structure 220 includes at least one first protrusion 221 formed on the first channel wall 211 and at least one second protrusion 222 formed on the second channel wall 212. The first protrusion 221 and the second protrusion 222 are staggered. By so configuring, please refer to Figure 17 The guide structure 220 and the channel wall of the cooling channel 210 can be constructed to form an S-shaped channel to increase the turbulent effect of the guide structure 220 and generate local eddies near the guide structure 220, thereby enhancing the heat dissipation effect at the hot spot position of the pump source 100.

[0061] Figure 5 and Figure 10 The arrows in the middle cooling channel 210 indicate the flow trajectory of the coolant. When the coolant approaches the guide surface 2221, it will be restricted by the guide surface 2221 to move toward the first channel wall 211, thereby changing the flow direction of the coolant to a jet form, directly performing jet heat dissipation on the hot spot position of the pump source 100.

[0062] Afterwards, the coolant will move toward the second channel wall 212 under the restriction of the first channel wall 211, the first protrusion 221 and the second protrusion 222. In this way, the guide structure 220 and the channel wall of the cooling channel 210 can be constructed to form an S-shaped channel to increase the turbulent effect of the guide structure 220 and generate local vortices near the guide structure 220, thereby enhancing the heat dissipation effect of the hot spot position of the pump source 100.

[0063] Understandably, see Figure 5 and Figure 10 When one first protrusion 221 is provided, one or two second protrusions 222 may be provided. When two second protrusions 222 are provided, the coolant can be restricted by the guide surfaces 2221 of the two second protrusions 222 to move toward the first flow channel wall 211 when passing through the two second protrusions 222. The number and distribution of the first protrusions 221 and the second protrusions 222 can be adjusted according to the setting requirements of the liquid cooling plate 200.

[0064] In this embodiment, both the first protrusion 221 and the second protrusion 222 are square protrusions. This arrangement allows the coolant to flow parallel to the cooling channel 210 and the first plane, changing it to flow perpendicular to the first plane where the liquid cooling plate 200 is located. This allows the heat exchange efficiency at the flow guide structure 220 to be 3 to 5 times that of a parallel flow.

[0065] For details, please refer to 1 to Figure 5, the spacing dimension between the first flow channel wall 211 and the second flow channel wall 212 is L, the height dimension of the first protrusion 221 relative to the first flow channel wall 211, and the height dimension of the second protrusion 222 relative to the second flow channel wall 212 are both H, 2.2mm≤LH≤2.8mm, further, LH=2.2mm, 2.3mm, 2.4mm, 2.5mm, 2.6mm, 2.7mm or 2.8mm. Through such a setting, it can be ensured that the flow area at the guide structure 220 is large enough to prevent the flow channel from being too small and blocked, which affects the circulation of the coolant in the cooling channel 210. Furthermore, the width dimension of the first protrusion 221 and the second protrusion 222 along the extension trajectory of the cooling channel 210 is greater than 3mm.

[0066] Of course, in other embodiments, the first plane may also be arranged to form an angle α with the second plane, wherein 70°≤α<90°.

[0067] In one embodiment, see 1 to Figure 6 、 Figure 9 and Figure 10 The flow area at the protrusion within the cooling channel 210 is smaller than the flow area on the liquid inlet side of the cooling channel 210. This arrangement allows for the formation of local eddies at the protrusions, thereby increasing the heat exchange efficiency at the hotspot of the pump source 100. Specifically, these local eddies can enhance the heat dissipation at the hotspot of the pump source 100. On the one hand, these local eddies can stir the coolant fluid, allowing heat to diffuse more rapidly within the fluid. This heat diffusion helps to reduce the temperature at the hotspot of the pump source 100, thereby improving the overall heat dissipation and cooling performance of the liquid cooling plate 200.

[0068] In one embodiment, see 1 to Figure 14 Several guide structures 220 are arranged at intervals along the extension of the cooling channel 210 and corresponding to the pump sources 100. This arrangement allows the location and number of the guide structures 220 to be specifically configured based on the layout space of the pump sources 100 and the distribution of their hot spots, thereby maximizing the heat dissipation effect of the guide structures 220 at the hot spots of the pump sources 100.

[0069] It is understood that the hotspot location specifically refers to the bottom of the pump source base corresponding to the chip mounting location within the pump source. In this embodiment, the pump source 100 is equipped with two rows of chips. The flow guide structure 220 is positioned corresponding to the chip locations, and the injection points are positioned corresponding to the chips. This design is based on a precise understanding of the hotspot location and is targeted to achieve more efficient heat dissipation at the hotspot, ensuring stable operation of the chips at an appropriate temperature environment, thereby safeguarding the overall performance and reliability of the laser.

[0070] Specifically, on the surface of the liquid cooling plate 200 , the location and number of the pump sources 100 may be irregular. By providing multiple guide structures 220 , targeted heat dissipation can be performed at different hotspot locations, thereby adapting to more complex heat distribution conditions.

[0071] At the same time, the provision of multiple guide structures 220 is also conducive to enhancing the heat dissipation effect. Multiple guide structures 220 are each provided for a pump source 100, which helps to further reduce the operating temperature of the pump source 100 and reduce the risk of performance degradation or failure due to overheating, thereby improving the reliability and stability of the laser operation.

[0072] Of course, multiple guide structures 220 can also be set up corresponding to multiple pump sources 100. The setting of multiple guide structures 220 can also provide more flexibility for the design of the cooling channel 210. By adjusting the position, shape and number of each guide structure 220, the layout of the channel and the flow path of the coolant can be further optimized, thereby improving the heat dissipation efficiency.

[0073] Specifically, the pump source 100 is fixedly connected to the liquid cooling plate 200 , that is, the pump source 100 is firmly fixed on the liquid cooling plate 200 . The pump source 100 can effectively transfer heat to the liquid cooling plate 200 , thereby achieving efficient heat dissipation.

[0074] In a more specific embodiment, the pump source 100 and the liquid cooling plate 200 may be connected by threaded connection or snap connection.

[0075] When a threaded connection is used between the pump source 100 and the liquid cooling plate 200, two matching threaded holes can be machined on the contact surfaces of the pump source 100 and the liquid cooling plate 200, and then bolts are used to thread the walls of the two threaded holes to detachably connect the pump source 100 and the liquid cooling plate 200.

[0076] When a snap-fit ​​connection is used between the pump source 100 and the liquid cooling plate 200, a snap-fit ​​structure, such as an elastic snap or a rotating snap, is designed on the contact surface between the pump source 100 and the liquid cooling plate 200. By pressing or rotating the pump source 100, it mates with the snap-fit ​​structure on the liquid cooling plate 200, achieving a quick connection.

[0077] Of course, the connection between the pump source 100 and the liquid cooling plate 200 can also adopt other technical means. The specific choice of technical means can be adjusted according to factors such as the actual application scenario, cost, and maintenance convenience of the laser.

[0078] In one embodiment, see 1 to Figure 14The cooling channels 210 are arranged in a serpentine pattern, with grooves 213 formed in the walls of the cooling channels 210. These grooves 213 are positioned in correspondence with the pump sources 100 and serve to reduce the distance between the walls of two adjacent cooling channels 210. This arrangement increases the contact area between the coolant corresponding to the pump sources 100 and the walls of the cooling channels 210, thereby enhancing the heat dissipation and cooling effect at the pump sources 100.

[0079] Specifically, the liquid cooling plate 200 includes a plate body 230, and a liquid inlet connector 240 and a liquid outlet connector 250 installed on the plate body 230. A cooling channel 210 is provided in the plate body 230, and the liquid inlet connector 240 and the liquid outlet connector 250 are both connected to the cooling channel 210. Through such a configuration, coolant can circulate in the cooling channel 210, thereby dissipating heat and cooling the pump source 100 through the coolant.

[0080] Understandably, see Figure 13 and Figure 14 When the cooling channel 210 is arranged in a serpentine shape, the cooling channel can be arranged in a single-channel serpentine shape or a double-channel serpentine shape, or a combination of the two. Figure 13 and Figure 14 The arrows in the cooling channel 210 indicate the flow path of the coolant. Of course, if the liquid inlet connector 240 and the liquid outlet connector 250 are swapped, Figure 13 and Figure 14 The flow trajectory of the internal coolant should flow in the reverse direction.

[0081] In one embodiment, see 1 to Figure 6 The base of the pump source 100 is a structural component made of copper metal or aluminum alloy.

[0082] It is understandable that the pump source 100 in the prior art is usually made of copper metal, which is more expensive than aluminum alloy. When a copper metal base is used in the prior art, the laser can effectively dissipate heat when using a 35W to 45W laser chip, but when using a 55W laser chip, the heat dissipation capacity is insufficient.

[0083] In the laser of this embodiment, when the base of the pump source 100 is made of copper metal, since copper metal has better thermal conductivity than aluminum alloy, the liquid cooling plate 200 has a better heat dissipation effect on the pump source 100. At the same time, since the liquid cooling plate 200 has a higher heat dissipation efficiency for the pump source 100, the laser can be adapted to higher power laser chips. In this case, the current in the laser can be opened to 55A, and the power of the laser chip can reach 55W or even higher. Please refer to Figure 18 , the operating temperature of the laser is within a controllable range and is relatively stable.

[0084] In addition, since the liquid cooling plate 200 of this embodiment has a higher heat dissipation efficiency for the pump source 100, replacing the copper metal of the pump source 100 with aluminum alloy can also maintain a good heat dissipation and cooling effect, thereby meeting the application of low-power laser chips. For example, the laser is adapted to 35W~45W laser chips, thereby saving the manufacturing cost of the pump source 100. At this time, the current in the laser can be opened to 50A, and the power of the laser chip can reach 45W. Please refer to Figure 19 , the operating temperature of the laser is within a controllable range and is relatively stable.

[0085] The above disclosure is merely a preferred embodiment of the present invention and certainly cannot be used to limit the scope of the present invention. Therefore, equivalent changes made according to the claims of the present invention are still within the scope of the present invention.

Claims

1. A liquid cooling plate for a laser, characterized in that: The liquid cooling plate is used to place and cool the pump source. A cooling channel is provided in the liquid cooling plate. The channel wall of the cooling channel is used to guide the cooling liquid to flow along a first plane parallel to the liquid cooling plate. A guide structure is provided in the cooling channel. The guide structure is used to change the cooling liquid flowing along the first plane to flow along a second plane set at an angle to the first plane, thereby guiding the cooling liquid to flow toward the hot spot position of the pump source.

2. The liquid cooling plate for laser according to claim 1, characterized in that: The flow-guiding structure is a protrusion formed on the flow channel wall of the cooling flow channel, and a flow-guiding surface arranged parallel to the second plane is formed on the protrusion.

3. The liquid cooling plate for laser according to claim 2, characterized in that: The flow area of ​​the protrusion in the cooling channel is smaller than the flow area on the liquid inlet side of the cooling channel; and / or, A plurality of the guide structures are arranged at intervals along the extension track of the cooling channel and are arranged corresponding to the pump sources.

4. The liquid cooling plate for laser according to claim 2, characterized in that: The first plane is arranged perpendicular to the second plane.

5. The liquid cooling plate for laser according to claim 2, characterized in that: The cooling channel includes a first channel wall close to the pump source and a second channel wall away from the pump source; The flow guide structure includes at least one first protrusion formed on the first flow channel wall and at least one second protrusion formed on the second flow channel wall, and the first protrusion and the second protrusion are staggered.

6. The liquid cooling plate for laser according to claim 5, characterized in that: The first protrusion and the second protrusion are both square protrusions.

7. The liquid cooling plate for laser according to claim 5, characterized in that: The distance between the first flow channel wall and the second flow channel wall is L, the height of the first protrusion extending relative to the first flow channel wall protrusion, and the height of the second protrusion extending relative to the second flow channel wall protrusion are both H, 2.2 mm ≤ LH ≤ 2.8 mm; and / or, The width of the first protrusion and the second protrusion along the extension track of the cooling channel is greater than 3 mm.

8. The liquid cooling plate for laser according to claim 2, characterized in that: The cooling channels are arranged in a serpentine shape, and grooves are provided on the channel walls of the cooling channels. The grooves are provided corresponding to the pump sources and are used to reduce the distance between the channel walls of two adjacent cooling channels.

9. A laser, characterized in that: The laser comprises: A pump source, comprising a base and a plurality of laser chips disposed in the base; and the liquid cooling plate for a laser according to any one of claims 1 to 8; Wherein, the pump source is placed on the liquid cooling plate and is arranged corresponding to the flow guide structure.

10. The laser according to claim 9, characterized in that The base of the pump source is a structural component made of copper metal or aluminum alloy.

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