Electronic device

Abstract

The invention provides an electronic device and electronic equipment. The electronic device comprises a substrate, a circuit layer, a plurality of through holes, a plurality of conductive members, a plurality of functional elements and a protection member. A first surface and a second surface are defined on the substrate, the circuit layer is arranged on the first surface, the through holes are communicated with the first surface and the second surface, a first opening close to the first surface and a second opening close to the second surface are defined, and the conductive parts are electrically connected to the circuit layer and arranged in the through holes respectively. The at least one conductive member has an exposed portion protruding from the second opening of the corresponding through hole, the functional element is arranged on the first surface and electrically connected with the one or more conductive members through the circuit layer, and the protection member is arranged on the first surface and covers the one or more functional elements.

Description

Technical Field

[0001] The present invention relates to an electronic device and an electronic equipment. Background Art

[0002] Known joining methods have the problem of insufficient mechanical strength, so there is a need to find a solution to this problem. Specifically, known electronic devices and methods often face a series of limitations. One obvious disadvantage is the limited contact area with the solder, because this contact area usually only utilizes the top surface, without utilizing the contact on the peripheral sides. This structure may lead to reduced mechanical strength, thereby reducing the ability to withstand push and pull forces, and making the device more prone to physical connection failures. In addition, insufficient contact area often leads to higher contact resistance, thereby reducing the electrical efficiency and reliability of the device. These limitations often result in known designs being unable to meet the growing demand for durable and high-performance electronic components. Summary of the Invention

[0003] One or more exemplary embodiments of the present invention are directed to providing an electronic device and an electronic device having the advantage of providing significant improvements, including increasing the contact area with the solder by achieving peripheral side contact, thereby not only enhancing the mechanical strength (increasing the ability to withstand push and pull forces) but also reducing the contact resistance, thereby providing an electronic device and an electronic device with strong performance and reliability.

[0004] The present invention provides an electronic device, comprising a substrate, a circuit layer, a plurality of through holes, a plurality of conductive members, a plurality of functional elements, and a protective member. The substrate is defined as having a first surface and a second surface opposite to the first surface; the circuit layer is disposed on the first surface of the substrate; the through hole connects the first and second surfaces of the substrate, at least one of the through holes defines a first opening and a second opening, the first opening being adjacent to the first surface of the substrate, the second opening being adjacent to the second surface of the substrate, a through hole volume being defined within the through hole, and the first opening of at least one of the through holes being partially covered by the circuit layer; the conductive members are electrically connected to the circuit layer and respectively disposed within the through holes, at least one of the conductive members defining a conductive member volume, and the conductive member volume of at least one of the conductive members being greater than the through hole volume of the corresponding through hole; the functional element is disposed on the first surface of the substrate and electrically connected to one or more of the conductive members through the circuit layer; the protective member is disposed on the first surface of the substrate and covers one or more of the functional elements.

[0005] The present invention provides another electronic device, comprising a substrate, a circuit layer, a plurality of through holes, a plurality of conductive members, a plurality of functional elements, and a protective member. The substrate is defined as having a first surface and a second surface opposite the first surface; the circuit layer is disposed on the first surface of the substrate; the through holes connect the first and second surfaces of the substrate, and at least one of the through holes defines a first opening and a second opening, with the first opening being adjacent to the first surface of the substrate and the second opening being adjacent to the second surface of the substrate; the conductive members are electrically connected to the circuit layer and disposed within the through holes, respectively, and at least one of the conductive members defines a exposed portion protruding from the second opening of a corresponding one of the through holes; the functional elements are disposed on the first surface of the substrate and electrically connected to one or more of the conductive members through the circuit layer; and the protective member is disposed on the first surface of the substrate and covers one or more of the functional elements.

[0006] The present invention provides another electronic device, comprising a substrate, a circuit layer, a plurality of through holes, a plurality of conductive members, a plurality of functional elements, and a protective member. The substrate is defined as having a first surface and a second surface opposite to the first surface; the circuit layer is disposed on the first surface of the substrate; the through holes connect the first and second surfaces of the substrate, and at least one of the through holes defines a first opening and a second opening, with the first opening being adjacent to the first surface of the substrate and the second opening being adjacent to the second surface of the substrate; the conductive members are electrically connected to the circuit layer and are respectively disposed within the through holes, and at least one of the conductive members defines a revealing portion protruding from the second opening of a corresponding one of the through holes; the functional elements are disposed on the first surface of the substrate and are electrically connected to one or more of the conductive members through the circuit layer; the protective member is disposed on the first surface of the substrate and covers one or more of the functional elements; wherein the ratio of a measured area of ​​the first opening to a measured area of ​​the revealing portion of the conductive member disposed in the corresponding through hole is not less than 1 / 4.

[0007] Another electronic device provided by the present invention has a total thickness and includes a substrate, a circuit layer, a plurality of through holes, a plurality of conductive members, a plurality of functional elements, and a protective member. The substrate has a first surface and a second surface opposite to the first surface, and has a thickness; the circuit layer is disposed on the first surface of the substrate; the through holes connect the first surface and the second surface of the substrate, and at least one of the through holes defines a first opening and a second opening, the first opening being close to the first surface of the substrate and the second opening being close to the second surface of the substrate; the conductive members are electrically connected to the circuit layer and are respectively disposed in the through holes, and at least one of the conductive members is defined as a revealing portion protruding from the second opening of a corresponding one of the through holes; the functional elements are disposed on the first surface of the substrate and are electrically connected to one or more of the conductive members through the circuit layer; the protective member is disposed on the first surface of the substrate and covers one or more of the functional elements; wherein the thickness of the substrate is not greater than 50 μm.

[0008] Each of the aforementioned electronic devices also includes the following features:

[0009] In one embodiment, the thickness of the substrate is no greater than 100 μm.

[0010] In one embodiment, the thickness of the substrate is no greater than 50 μm.

[0011] In one embodiment, the electronic device itself further defines a total thickness, and the thickness of the substrate is no greater than half of the total thickness of the electronic device.

[0012] In one embodiment, the electronic device itself further defines a total thickness, and the thickness of the substrate is no greater than one-third of the total thickness of the electronic device.

[0013] In one embodiment, the substrate is a flexible substrate.

[0014] In one embodiment, the substrate is a composite substrate.

[0015] In one embodiment, at least a portion of the circuit layer is defined with a line pitch, and the line pitch is no greater than 50 μm.

[0016] In one embodiment, the line pitch of at least a portion of the circuit layer is no greater than 30 μm.

[0017] In one embodiment, the line pitch of at least a portion of the circuit layer is no greater than 15 μm.

[0018] In one embodiment, a thickness of at least a portion of the circuit layer is no greater than 20 μm.

[0019] In one embodiment, a thickness of at least a portion of the circuit layer is no greater than 10 μm.

[0020] In one embodiment, the circuit layer is formed by a sputtering process.

[0021] In one embodiment, in one of the corresponding conductive elements, an outer surface of the exposed portion has an average roughness Ra of not less than 0.5 μm.

[0022] In one embodiment, the conductive member includes one or more conductive materials, and the volume percentage of the one or more conductive materials is not less than 70% of the volume of the conductive member.

[0023] In one embodiment, within a corresponding through hole, a measured area of ​​the first opening is not larger than a measured area of ​​the second opening.

[0024] In one embodiment, within a corresponding through-hole, the conductive member defines an exposed portion protruding from the second opening of the through-hole.

[0025] In one embodiment, the conductive member includes one or more conductive materials uniformly distributed in a direction parallel to the substrate.

[0026] In one embodiment, the substrate includes a bottom plate and a connection plate stacked on the bottom plate, the first surface is a surface of the bottom plate, and the second surface is a surface of the connection plate.

[0027] In one embodiment, the conductive member further defines a hidden portion connected to the exposed portion, the hidden portion is arranged in one of the through holes, the conductive member includes one or more conductive materials, and the one or more conductive materials of the exposed portion are consistent with the one or more conductive materials of the hidden portion.

[0028] In one embodiment, the exposed portion defines a contact area, which is the area covered by the exposed portion on the second surface of the substrate. The contact area of ​​the exposed portion is defined with a lateral dimension in a direction parallel to the second surface of the substrate, and the lateral dimension of the contact area is at most 10 μm larger than the radius of the second opening of the through hole corresponding to the conductive member.

[0029] In one embodiment, the height of the exposed portion of the conductive member in a direction perpendicular to the substrate is not less than 5 μm.

[0030] In one embodiment, a height of the exposed portion of the conductive member in a direction perpendicular to the substrate is not less than 10% of the thickness of the substrate.

[0031] In one embodiment, the exposed portion of the conductive element defines a tip.

[0032] In one embodiment, the exposed portion of the conductive element defines a recess.

[0033] In one embodiment, the thickness of the substrate is no greater than half of the total thickness.

[0034] The present invention provides an electronic device comprising a circuit board and at least one of the aforementioned electronic devices, wherein the circuit board comprises a circuit wiring layer, the electronic device is electrically connected to the circuit wiring layer of the circuit board, wherein one of the functional elements is electrically connected to the circuit wiring layer through multiple connections between multiple of the conductive members and the circuit wiring layer.

[0035] The present invention provides a method for manufacturing an electronic device, comprising the following steps: providing a substrate on which a circuit layer and one or more functional elements are arranged; forming a protective member to cover the functional elements; and forming a plurality of through holes, and arranging a plurality of conductive members in the through holes, wherein at least one of the conductive members has an exposed portion protruding from a second opening of the corresponding through hole.

[0036] The present invention provides a method for manufacturing an electronic device, comprising the following steps: providing a circuit board including a circuit wiring layer; and electrically connecting an electronic device to the circuit wiring layer of the circuit board, wherein one of the functional elements is electrically connected to the circuit wiring layer through multiple connections between multiple of the conductive members and the circuit wiring layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 FIG. 1 is a schematic cross-sectional view of an electronic device according to an embodiment of the present invention.

[0038] Figure 1A yes Figure 1 A partial enlarged view of the circled part.

[0039] Figure 1B FIG. 1 is a schematic diagram of another form of the conductive member of the present invention.

[0040] Figure 2 yes Figure 1 A top view of the electronic device is shown.

[0041] Figure 3 FIG. 1 is a cross-sectional schematic diagram of an electronic device according to another embodiment of the present invention.

[0042] Figure 4 FIG. 1 is a cross-sectional schematic diagram of an electronic device according to another embodiment of the present invention.

[0043] 5A to 5I A cross-sectional diagram showing Figure 1 manufacturing process of electronic devices.

[0044] Figure 6A The manufacturing process of the electronic device according to the embodiment of the present invention is shown.

[0045] Figure 6B It is a cross-sectional schematic diagram of an electronic device manufactured according to an embodiment of the present invention. DETAILED DESCRIPTION

[0046] The following will describe the lighting device and lighting equipment according to the preferred embodiments of the present invention with reference to the relevant drawings, wherein the same elements will be described with the same reference symbols. It should be understood that the following description provides many different embodiments for implementing different implementations of some embodiments of the present invention. The specific elements and arrangements described below are only for the purpose of simply and clearly describing some embodiments of the present invention. Of course, these embodiments are only for illustrative purposes and are not intended to limit the scope of the present invention. In addition, repeated numbers or labels may be used in different embodiments. These repetitions are only for the purpose of simply and clearly describing some embodiments of the present invention and do not represent any correlation between the different embodiments and / or structures discussed.

[0047] Figure 1is a cross-sectional view of the electronic device 1 of this embodiment, as shown in FIG. Figure 1 As shown, the electronic device 1 includes a substrate 10, a circuit layer 20, a plurality of through holes 30, a plurality of conductive members 40, a plurality of functional elements 50 and a protective member 60. Figure 1 and cooperate with Figure 1A and Figure 2 ,in Figure 1A yes Figure 1 A partial enlarged view of the middle circle part 1a, Figure 2 1 is a top view of the electronic device 1. The substrate 10 has a first surface 11S and a second surface 12S opposite to each other; the circuit layer 20 is disposed on the first surface 11S of the substrate 10; the through hole 30 connects the first surface 11S and the second surface 12S of the substrate 10, and at least one through hole 30 defines a first opening 31 near the first surface 11S of the substrate 10 and a second opening 32 near the second surface 12S of the substrate 10, and the through hole 30 defines a through hole volume formed therein, wherein the first opening 31 of one of the through holes 30 is partially covered by the circuit layer 20, that is, the first opening 31 of one of the through holes 30 is partially covered by the circuit layer 20. It can be sealed by part of the circuit layer 20 or the connection pad extending from the circuit layer 20; the conductive members 40 are electrically connected to the circuit layer 20 and are respectively arranged in the through holes 30, and at least one conductive member 40 defines a conductive member volume formed by it, and the conductive member volume of one conductive member 40 is larger than the through hole volume of the corresponding through hole 30; the functional element 50 is arranged on the first surface 11S of the substrate 10 and is electrically connected to one or more conductive members 40 through the circuit layer 20; the protective member 60 is arranged on the first surface 11S of the substrate 10 and covers one or more functional elements 50.

[0048] In one embodiment, the thickness of substrate 10 is no greater than 100 μm. In another embodiment, the thickness of substrate 10 is no greater than 50 μm. From another perspective, the thickness of substrate 10 may also be defined in other ways, such as being no greater than half the total thickness of electronic device 1 as a whole. In another embodiment, the thickness of substrate 10 may be no greater than one-third of the total thickness of electronic device 1.

[0049] In one embodiment, the circuit layer 20 is formed by a thin copper process (such as a sputtering process (thin film process)), an evaporation process, an electroplating process, an electroless plating process, or a copper foil process (such as using rolled copper foil, annealed copper foil, rolled annealed copper foil (RA copper foil)). In one embodiment, at least a portion of the circuit layer 20 is defined with a line spacing of no more than 50 μm. In another embodiment, the line spacing of at least a portion of the circuit layer 20 is no more than 30 μm. In another embodiment, the line spacing of at least a portion of the circuit layer 20 is no more than 15 μm. In one embodiment, the functional element 50 contacts the circuit layer 20 through the connection pad portion 21, and the connection pad portion 21 can be regarded as a part of the circuit layer 20. In one embodiment, the thickness of at least a portion of the circuit layer 20 is no more than 20 μm. In another embodiment, the thickness of at least a portion of the circuit layer 20 is no more than 10 μm.

[0050] In one embodiment, within a corresponding through hole 30 , the measured area of ​​the first opening 31 is not greater than the measured area of ​​the second opening 32 .

[0051] In one embodiment, one or more functional elements 50 are functional chips. In another embodiment, one or more functional elements 50 may be functional package elements.

[0052] In one embodiment, the conductive member 40 includes one or more conductive materials, such as but not limited to copper or silver, with a content of not less than 70% (volume percentage). In one embodiment, the conductive member 40 includes one or more conductive materials, and the conductive member 40 is parallel to the substrate 10 and has multiple cross sections, and the one or more conductive materials are uniformly distributed.

[0053] In one embodiment, at least one conductive member 40 is defined as a hidden portion 41 located in the corresponding through hole 30 and a visible portion 42 protruding from the second opening 32 of the corresponding through hole 30, and the hidden portion 41 is connected to the visible portion 42. The conductive member 40 includes one or more conductive materials, and the one or more conductive materials of the visible portion 42 are consistent with the one or more conductive materials of the hidden portion 41 in a direction parallel to the substrate 10. In one embodiment, as Figure 1B As shown, the exposed portion 42 is defined with a contact area 42R, which is the area covered by the exposed portion 42 on the second surface 12S of the substrate 10. The contact area 42R of the exposed portion 42 is defined with a lateral dimension in a direction parallel to the second surface 12S of the substrate 10. The lateral dimension of the contact area 42R is at most 10 μm larger than the radius of the second opening 32 of the through hole 30 corresponding to the conductive member 40.

[0054] In one embodiment, the height of the exposed portion 42 of the conductive element 40 in the direction perpendicular to the substrate 10 is not less than 5 μm. In another embodiment, the height of the exposed portion 42 of the conductive element 40 in the direction perpendicular to the substrate is not less than 10% of the thickness of the substrate 10.

[0055] like Figure 1A As shown, at least one conductive member 40 is defined with an exposed portion 42 that protrudes from the second opening 32 of the corresponding one of the through-holes 30 and is exposed / revealed or can be further exposed outside the second surface 12S of the substrate 10, and a hidden portion 41 connected to the exposed portion 42 and disposed within the corresponding one of the through-holes 30. The exposed portion 42 is defined with an outer surface 42S, which can be a non-planar or uneven surface, and the outer surface 42S has an average roughness Ra, wherein the average roughness Ra of the outer surface 42S is not less than 0.5 μm.

[0056] like Figure 3 As shown, in another embodiment of the electronic device 1', it includes a protective member 60' of another shape, such as a dome shape. The conductive members 40' and 40" respectively define an exposed portion 42' and an exposed portion 42", with the distal end of the exposed portion 42' having a pointed tip and the distal end of the exposed portion 42" having a recessed pit. As described above, the distal end of the exposed portion has an outer surface with an average roughness Ra.

[0057] like Figure 4 As shown, in another embodiment of the electronic device 1 ', the substrate 10 ' comprises a bottom plate 11 ' and a connecting plate 12 ' stacked on the bottom plate 11 ', wherein the first surface 11S is the upper surface of the bottom plate 11 ', and the second surface 12S is the lower surface of the connecting plate 12 '. It should be noted that the bottom plate 11 ' is generally considered to be a substrate, which can be a single-layer structure or a multi-layer structure, and its materials can be the same or different, and the connecting plate 12 'here can be a substrate that can be bonded to the bottom plate 11 ', or it can be an adhesive layer covering the bottom plate 11 '. If the connecting plate 12 ' is a substrate, the substrate 10 ' can essentially be regarded as a composite substrate, and the connecting plate 12' can also be a single-layer structure or a multi-layer structure, and its materials can also be the same or different. In terms of the electronic device 1, the thickness of the substrate 10 used is not greater than one-third of the total thickness of the electronic device 1. The bottom plate 11' and the connecting plate 12' can be made of different materials, but the present invention is not limited to this. In another embodiment, the substrate 10' may include one or more substrates in addition to the bottom plate 11' and the connecting plate 12'; in this case, the additional one or more substrates may be stacked between the bottom plate 11' and the connecting plate 12'.

[0058] The following will refer to 5A to 5I The manufacturing process of the electronic device 1 of the present invention will be described.

[0059] Here, the substrate 10 is, for example, a flexible substrate. Figure 5A As shown, the substrate 10 is placed on the rigid plate 100 in advance.

[0060] In this embodiment, if Figure 5B As shown, the circuit layer 20 is then disposed on the substrate 10 , and the circuit layer 20 includes one or more connection pads 21 , which can be regarded as a part of the circuit layer 20 .

[0061] like Figure 5C As shown, one or more functional elements 50 are disposed on the first surface 11S of the substrate 10 and are electrically connected to the circuit layer 20 , for example, via one or more connection pads 21 .

[0062] like Figure 5D As shown, the protection member 60 is disposed on the first surface 11S of the substrate 10 and covers one or more functional elements 50 .

[0063] like Figure 5E As shown, the base plate 10 and the rigid plate 100 are separated from each other.

[0064] like Figure 5F As shown, the additional film 10 a is attached to the second surface 12S of the substrate 10 , and one or more through holes 30 are formed on the substrate 10 using the additional film 10 a by, for example, a laser process.

[0065] like Figure 5G As shown, a plurality of conductive members 40 are respectively disposed in the plurality of through holes 30 .

[0066] like Figure 5H As shown, the additional film 10a is separated from the substrate 10, and a portion of each conductive member 40 protrudes from the second surface 12S of the substrate 10 to form an exposed portion. Thus, a temporary electronic device 1A is obtained.

[0067] like Figure 5I As shown, the temporary electronic device 1A is cut into appropriate sizes to form one or more electronic devices 1 .

[0068] In one embodiment, the substrate 10 may not be a flexible substrate. Figures 5A to 5E In the embodiment, the rigid board 100 and some related steps may be omitted.

[0069] In one embodiment, the substrate 10 may be a single-layer substrate or a multi-layer substrate. For example, the substrate 10' may be a multi-layer substrate, which may be applied to 5A to 5I The manufacturing process is shown.

[0070] In one embodiment, the additional film 10a may also be used as Figure 4It should be noted that the conductive member 40 of this embodiment still protrudes from the second surface 12S of the substrate 10 .

[0071] As mentioned above, the electronic device 1 has been completed. Figure 6A Then, one or more circuit boards 200 may be provided, wherein each circuit board 200 is provided with a circuit wiring layer 220, and a bonding material 70 is formed on the pad portion 221 of the circuit wiring layer 220. It should be noted that the pad portion 221 can be considered as a part of the circuit wiring layer 220. Then, one or more electronic devices 1 are placed on the circuit board 200, and the conductive member 40 is placed on the bonding material 70 pre-disposed on the pad portion 221 of the circuit wiring layer 220. Here, the bonding material 70 can be formed using a soldering process.

[0072] like Figure 6B As shown, the bonding material 70 and the pad portion 221 of the circuit layer 220 can be transformed into a eutectic bond, so that the conductive member 40 can be electrically connected to the pad portion 221 of the circuit layer 220. This step can be achieved by heating or further increasing pressure.

[0073] In summary, this manufacturing method includes at least the following steps: for example, step 1: providing a substrate 10 having a circuit layer 20 and one or more functional elements 50 disposed thereon; step 2: forming a protective member 60 to cover the functional elements 50; and step 3: forming a plurality of through-holes 30 and disposing a plurality of conductive elements 40 in the through-holes 30, wherein at least one conductive element 40 protrudes from a corresponding through-hole 30. By performing steps 1 to 3, an electronic device 1 can be manufactured.

[0074] For further assembly, step 4 integrates Figure 6A and Figure 6B In the steps shown, the electronic device 1 is bonded to the circuit board 200 to complete the electronic device.

[0075] In summary, the advantages of the electronic device and related manufacturing method of the present invention are that they provide significant improvements, including increasing the contact area with the solder by implementing peripheral side contacts, thereby enhancing mechanical strength. It should be noted that it is reasonable to understand all features in different combinations in this specification, as well as the configuration defined by the scope of the claims.

[0076] Some embodiments of the present invention are summarized below.

[0077] An electronic device includes a substrate, a circuit layer, multiple through holes, multiple conductive members, multiple functional elements, and a protective member. The substrate is defined as having a first surface and a second surface opposite the first surface; the circuit layer is disposed on the first surface of the substrate; the through holes connect the first and second surfaces of the substrate, each through hole defining a first opening and a second opening, the first opening being adjacent to the first surface of the substrate, the second opening being adjacent to the second surface of the substrate, a through hole volume being defined within the through hole, and at least one of the through holes having the first opening partially covered by the circuit layer; the conductive members are electrically connected to the circuit layer and disposed within the through holes, each conductive member defining a conductive member volume, and at least one of the conductive members having a conductive member volume greater than the through hole volume of the corresponding through hole; the functional element is disposed on the first surface of the substrate and electrically connected to one or more of the conductive members through the circuit layer; the protective member is disposed on the first surface of the substrate and covers one or more of the functional elements.

[0078] This invention provides another electronic device, which includes a substrate, a circuit layer, a plurality of through holes, a plurality of conductive members, a plurality of functional elements, and a protective member. The substrate is defined as having a first surface and a second surface opposite the first surface; the circuit layer is disposed on the first surface of the substrate; the through holes connect the first and second surfaces of the substrate, and at least one of the through holes defines a first opening and a second opening, with the first opening being adjacent to the first surface of the substrate and the second opening being adjacent to the second surface of the substrate; the conductive members are electrically connected to the circuit layer and are respectively disposed within the through holes, and at least one of the conductive members defines a exposed portion protruding from the second opening of a corresponding one of the through holes; the functional elements are disposed on the first surface of the substrate and are electrically connected to one or more of the conductive members through the circuit layer; and the protective member is disposed on the first surface of the substrate and covers one or more of the functional elements.

[0079] This invention provides another electronic device, which includes a substrate, a circuit layer, a plurality of through holes, a plurality of conductive members, a plurality of functional elements, and a protective member. The substrate is defined as having a first surface and a second surface opposite to the first surface; the circuit layer is disposed on the first surface of the substrate; the through hole connects the first surface and the second surface of the substrate, and at least one of the through holes defines a first opening and a second opening, with the first opening being adjacent to the first surface of the substrate and the second opening being adjacent to the second surface of the substrate; the conductive members are electrically connected to the circuit layer and are respectively disposed in the through holes, and at least one of the conductive members defines an exposed portion protruding from the second opening of a corresponding one of the through holes and exposed to the second surface of the substrate; the functional elements are disposed on the first surface of the substrate and are electrically connected to one or more of the conductive members through the circuit layer; the protective member is disposed on the first surface of the substrate and covers one or more of the functional elements; wherein the ratio of the measured area of ​​the first opening to the measured area of ​​the exposed portion of the conductive member disposed in the corresponding through hole is not less than 1 / 4.

[0080] The present invention provides another electronic device, which has a defined total thickness and includes a substrate, a circuit layer, a plurality of through holes, a plurality of conductive members, a plurality of functional elements, and a protective member. The substrate is defined as having a first surface and a second surface opposite to the first surface, and the substrate has a thickness; the circuit layer is disposed on the first surface of the substrate; the through holes connect the first surface and the second surface of the substrate, and at least one of the through holes defines a first opening and a second opening, the first opening being adjacent to the first surface of the substrate, and the second opening being adjacent to the second surface of the substrate; the conductive members are electrically connected to the circuit layer and are respectively disposed in the through holes, and at least one of the conductive members defines an exposed portion exposed from the second surface of the substrate; the functional elements are disposed on the first surface of the substrate and are electrically connected to one or more of the conductive members through the circuit layer; the protective member is disposed on the first surface of the substrate and covers one or more of the functional elements; wherein the thickness of the substrate is not greater than 50 μm.

[0081] Each of the aforementioned electronic devices also includes the following features:

[0082] In one embodiment, the thickness of the substrate is no greater than 100 μm.

[0083] In one embodiment, the thickness of the substrate is no greater than 50 μm.

[0084] In one embodiment, the electronic device itself further defines a total thickness, and the thickness of the substrate is no greater than half of the total thickness of the electronic device.

[0085] In one embodiment, the substrate is a flexible substrate.

[0086] In one embodiment, the substrate is a composite substrate.

[0087] In one embodiment, at least a portion of the circuit layer is defined with a line pitch, and the line pitch is no greater than 50 μm.

[0088] In one embodiment, the line pitch of at least a portion of the circuit layer is no greater than 30 μm.

[0089] In one embodiment, the line pitch of at least a portion of the circuit layer is no greater than 15 μm.

[0090] In one embodiment, a thickness of at least a portion of the circuit layer is no greater than 20 μm.

[0091] In one embodiment, a thickness of at least a portion of the circuit layer is no greater than 10 μm.

[0092] In one embodiment, the circuit layer is formed by a sputtering process.

[0093] In one embodiment, in one of the corresponding conductive elements, an outer surface of the exposed portion has an average roughness Ra of not less than 0.5 μm.

[0094] In one embodiment, the conductive member includes one or more conductive materials, and the volume percentage of the one or more conductive materials is not less than 70% of the volume of the conductive member.

[0095] In one embodiment, within a corresponding through hole, a measured area of ​​the first opening is not larger than a measured area of ​​the second opening.

[0096] In one embodiment, within a corresponding through-hole, the conductive element defines an exposed portion protruding from the second opening of the through-hole and exposed on the second surface of the substrate.

[0097] In one embodiment, the conductive member includes one or more conductive materials uniformly distributed in a direction parallel to the substrate.

[0098] In one embodiment, the electronic device itself further defines a total thickness, and the thickness of the substrate is no greater than half of the total thickness of the electronic device.

[0099] In one embodiment, the substrate includes a bottom plate and a connecting plate stacked on the bottom plate, the first surface is a surface of the bottom plate, and the second surface is a surface of the connecting plate.

[0100] In one embodiment, the conductive member further defines a hidden portion connected to the exposed portion, the hidden portion is arranged in one of the through holes, the conductive member includes one or more conductive materials, and the one or more conductive materials of the exposed portion are consistent with the one or more conductive materials of the hidden portion.

[0101] In one embodiment, the exposed portion of the conductive member defines a contact area, which is the area covered by the exposed portion on the second surface of the substrate. The contact area of ​​the exposed portion is defined by a lateral dimension in a direction parallel to the second surface of the substrate, and the lateral dimension of the contact area is at most 10 μm larger than the radius of the second opening of the through hole corresponding to the conductive member.

[0102] In one embodiment, a height of the exposed portion of a corresponding conductive element in a direction perpendicular to the substrate is not less than 5 μm.

[0103] In one embodiment, a height of the exposed portion of the conductive member in a direction perpendicular to the substrate is not less than 10% of the thickness of the substrate.

[0104] In one embodiment, the exposed portion of the conductive element defines a tip or a pit.

[0105] In addition, the present invention also provides an electronic device, including a circuit board and at least one of the aforementioned electronic devices, the circuit board including a circuit wiring layer, the electronic device being electrically connected to the circuit wiring layer of the circuit board, wherein one of these functional elements is electrically connected to the circuit wiring layer through multiple connections between multiple of these conductive members and the circuit wiring layer.

[0106] The manufacturing method of the electronic device provided by the present invention includes the following steps: providing a substrate, on which a circuit layer and one or more functional elements are arranged; forming a protective member to cover the functional elements; and forming a plurality of through holes and arranging a plurality of conductive members in the through holes, one of which protrudes from the substrate.

[0107] The above description is for illustrative purposes only and is not intended to be limiting. Any equivalent modifications or variations that do not depart from the spirit and scope of the present invention should be included in the scope of the appended claims.

Claims

1. An electronic device comprising: a substrate defining a first surface and a second surface opposite to the first surface; a circuit layer, disposed on the first surface of the substrate; a plurality of through holes connecting the first surface and the second surface of the substrate, wherein at least one of the through holes defines a first opening and a second opening, the first opening being close to the first surface of the substrate, and the second opening being close to the second surface of the substrate; a plurality of conductive members electrically connected to the circuit layer and respectively disposed in the through holes, wherein at least one of the conductive members defines an exposed portion protruding from the second opening of a corresponding one of the through holes; a plurality of functional elements disposed on the first surface of the substrate and electrically connected to one or more of the conductive elements through the circuit layer; as well as A protective member is disposed on the first surface of the substrate and covers one or more of the functional elements. 2 . The electronic device according to claim 1 , wherein the electronic device itself further defines a total thickness, and the thickness of the substrate is no greater than half of the total thickness of the electronic device. 3 . The electronic device according to claim 1 , wherein at least a portion of the circuit layer defines a line pitch, and the line pitch is no greater than 50 μm. The electronic device according to claim 1 , wherein a thickness of at least a portion of the circuit layer is no greater than 20 μm. 5 . The electronic device according to claim 1 , wherein in a corresponding one of the conductive members, an outer surface of the exposed portion has an average roughness of not less than 0.5 μm. The electronic device according to claim 1 , wherein the conductive member comprises one or more conductive materials, and a volume percentage of the one or more conductive materials is not less than 70% of a total volume of the conductive member.

7. An electronic device according to claim 1, wherein the conductive part further defines a hidden part connected to the exposed part, the hidden part is arranged in one of the through holes, the conductive part includes one or more conductive materials, and the one or more conductive materials of the exposed part are consistent with the one or more conductive materials of the hidden part.

8. The electronic device according to claim 1, wherein the exposed portion of the conductive member defines a contact area, the contact area being the area covered by the exposed portion on the second surface of the substrate, the contact area of ​​the exposed portion defining a lateral dimension in a direction parallel to the second surface of the substrate, the lateral dimension of the contact area being at most 10 μm larger than the radius of the second opening of the through hole corresponding to the conductive member. 9 . The electronic device according to claim 1 , wherein a height of the exposed portion of the conductive member in a direction perpendicular to the substrate is not less than 10% of a thickness of the substrate.

10. An electronic device comprising: a substrate defining a first surface and a second surface opposite to the first surface; a circuit layer, disposed on the first surface of the substrate; a plurality of through holes connecting the first surface and the second surface of the substrate, wherein at least one of the through holes defines a first opening and a second opening, the first opening being close to the first surface of the substrate, and the second opening being close to the second surface of the substrate; a plurality of conductive members electrically connected to the circuit layer and respectively disposed in the through holes, wherein at least one of the conductive members defines an exposed portion protruding from the second opening of a corresponding one of the through holes; a plurality of functional elements disposed on the first surface of the substrate and electrically connected to one or more of the conductive elements through the circuit layer; as well as a protective member, disposed on the first surface of the substrate and covering one or more of the functional elements; Wherein, the ratio of the measured area of ​​the first opening to the measured area of ​​the exposed portion of the conductive member provided in the corresponding through hole is not less than 1 / 4. 11 . The electronic device according to claim 10 , wherein at least a portion of the circuit layer defines a line pitch, and the line pitch is no greater than 50 μm. 12 . The electronic device according to claim 10 , wherein in a corresponding one of the conductive members, an outer surface of the exposed portion has an average roughness of not less than 0.5 μm. 13 . The electronic device according to claim 10 , wherein the conductive member comprises one or more conductive materials, and a volume percentage of the one or more conductive materials is not less than 70% of a total volume of the conductive member.

14. The electronic device according to claim 10, wherein the exposed portion defines a contact area, the contact area being an area of ​​the exposed portion covering the second surface of the substrate in a direction parallel to the second surface of the substrate, and a lateral dimension of the contact area being at most 10 μm larger than a radius of the second opening of the through hole corresponding to the conductive member.

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