Display device, display substrate and manufacturing method thereof

Abstract

The invention discloses a display device, a display substrate and a manufacturing method of the display substrate. The display substrate comprises a back plate, a light-emitting unit substrate and a sealing structure. The back plate comprises a driving circuit structure; the light-emitting unit substrate comprises a plurality of light-emitting units; the back plate is connected with the light-emitting unit substrate in a box-to-box manner; a sealing structure is arranged at the edge positions of the back plate and the light-emitting unit substrate, and the sealing structure comprises a bearing platform, first frame sealing glue and a second connecting layer; the bearing platform is arranged on one of the back plate and the light-emitting unit substrate; the first frame sealing glue is arranged on one of the back plate and the light-emitting unit substrate; the second connecting layer is arranged on the surface of the bearing platform, the bearing platform is connected with the first frame sealing glue through the second connecting layer, and the melting point of the second connecting layer is smaller than that of the bearing platform. Through the arrangement of the bearing platform, the first frame sealing glue and the second connecting layer, the thickness of the sealing structure can be changed during bonding, the bonding areas are kept in full contact, and the bonding quality is improved.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display device, a display substrate and a manufacturing method thereof. Background Art

[0002] LED (light-emitting diode) displays, with their high brightness and reliability, have become a new direction in display research and application. As research progresses, LED size is gradually decreasing, which also brings numerous technical challenges. Currently, there are two main directions in MicroLED (micro light-emitting diode) display development: the first involves bonding epitaxial wafers to display backplanes and then performing patterning to form MicroLEDs; the second involves mass bonding of MicroLEDs to display backplanes. A key technical aspect of this second direction is mass bonding of MicroLEDs. Summary of the Invention

[0003] The purpose of the present application is to provide a display device, a display substrate and a manufacturing method thereof with good bonding effect between a light-emitting unit substrate and a backplane.

[0004] The present application discloses a display substrate, which includes:

[0005] a backplane, the backplane comprising a driving circuit structure;

[0006] A light-emitting unit substrate, comprising a plurality of light-emitting units;

[0007] The back plate is connected to the light emitting unit substrate; a sealing structure is provided at the edge of the back plate and the light emitting unit substrate, and the sealing structure includes:

[0008] A supporting platform, the supporting platform is provided on one of the back plate or the light emitting unit substrate;

[0009] a first frame sealant, the first frame sealant being disposed on one of the back plate or the light-emitting unit substrate;

[0010] The second connecting layer is provided on the surface of the support platform, the support platform and the first frame sealing glue are connected through the second connecting layer, and the melting point of the second connecting layer is lower than the melting point of the support platform.

[0011] Optionally, the backplane further includes:

[0012] a plurality of first electrical connection points, wherein the first electrical connection points are connected to the driving circuit structure;

[0013] The light emitting unit substrate further includes:

[0014] a plurality of second electrical connection points, wherein the second electrical connection points are connected to the light-emitting units;

[0015] A first connection layer is provided on the surface of the first electrical connection point or the second electrical connection point, the first electrical connection point and the second electrical connection point are electrically connected through the first connection layer, and the melting point of the first connection layer is lower than the melting point of the first electrical connection point and the second electrical connection point.

[0016] Optionally, the second connection layer and the first connection layer are made of the same material; the first electrical connection point, the second electrical connection point and the base are made of the same material.

[0017] Optionally, the second connecting layer has the same thickness as the first connecting layer.

[0018] Optionally, the second connection layer and the first connection layer are made of tin; the first electrical connection point, the second electrical connection point and the base are made of copper.

[0019] Optionally, an orthographic projection of the first frame sealant onto the support platform falls within an outer contour of the support platform.

[0020] Optionally, a retaining wall is provided on one side of the support platform close to the electrical connection point.

[0021] Optionally, the height of the retaining wall is less than the sum of the heights of the base and the second connecting layer.

[0022] Optionally, a second sealing glue is provided on the top of the retaining wall, and the sum of the height of the second sealing glue and the retaining wall is smaller than the distance between the back plate and the light emitting unit substrate.

[0023] The present application also discloses a method for manufacturing a display substrate, wherein the display substrate comprises:

[0024] a back plate, on which a plurality of first electrical connection points are provided;

[0025] a light-emitting unit substrate, on which a plurality of second electrical connection points are provided;

[0026] A first connection layer is provided on a surface of the first electrical connection point or the second electrical connection point, the first electrical connection point and the second electrical connection point are electrically connected via the first connection layer, and the melting point of the first connection layer is lower than the melting point of the first electrical connection point and the second electrical connection point;

[0027] The back plate and the light emitting unit substrate are connected to each other; a sealing structure is provided at the edge of the back plate and the light emitting unit substrate, and the sealing structure is provided including:

[0028] A supporting platform is provided, wherein the supporting platform is provided on one of the back plate or the light emitting unit substrate;

[0029] Disposing a first frame sealant, wherein the first frame sealant is disposed on one of the back plate or the light emitting unit substrate;

[0030] A second connecting layer is provided, the second connecting layer being provided on the surface of the base, the base being connected to the first frame sealant via the second connecting layer, the melting point of the second connecting layer being lower than the melting point of the base and being lower than or equal to the melting point of the first connecting layer;

[0031] The display substrate is heated to a temperature higher than a melting point of the first connection layer.

[0032] Optionally, a retaining wall is provided on a side of the support platform close to the electrical connection point, and a height of the retaining wall is less than the sum of the heights of the support platform and the second connection layer.

[0033] Optionally, a second sealing glue is provided on the top of the retaining wall, and the sum of the height of the second sealing glue and the retaining wall is less than the distance between the back plate and the light emitting unit substrate.

[0034] The present application also discloses a display device, which includes the above-mentioned display substrate.

[0035] Compared with the related art, the present application provides a base, a first frame sealant and a second connecting layer, so that the sealing structure can produce thickness changes during bonding, so that the bonding area maintains sufficient contact and improves the bonding quality.

[0036] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the specification and, together with the description, serve to explain the principles of the specification.

[0038] Figure 1 Schematic diagram of the structure of a display substrate in related art.

[0039] Figure 2 It is a structural schematic diagram of the display substrate bonding process in the related art.

[0040] Figure 3 It is a cross-sectional view showing the substrate bonding process in the related art.

[0041] Figure 4 This is a schematic structural diagram of an embodiment of a display substrate in this application.

[0042] Figure 5 This is a schematic structural diagram of an embodiment of a display substrate in this application.

[0043] Figure 6 This is a schematic structural diagram of an embodiment of a display substrate in this application.

[0044] Figure 7 This is a schematic structural diagram of an embodiment of a display substrate in this application.

[0045] Figure 8 This is a schematic structural diagram of an embodiment of a display substrate in this application. DETAILED DESCRIPTION

[0046] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with this specification. Rather, they are merely examples of apparatus and methods consistent with certain aspects of this specification, as detailed in the appended claims.

[0047] The terminology used in this application is for the purpose of describing specific embodiments only and is not intended to limit the present disclosure. Unless otherwise defined, technical or scientific terms used in this specification should have the same ordinary meaning as those having ordinary skill in the art to which this application belongs. The terms "first," "second," and similar terms used in this specification and claims do not denote any order, quantity, or importance, but are simply used to distinguish different components. Similarly, terms such as "a" or "an" do not denote a limitation of quantity, but rather indicate the presence of one. "Multiple" or "several" means two or more. Unless otherwise indicated, terms such as "front," "rear," "lower," and / or "upper" are used for convenience only and are not intended to limit the scope of the present disclosure to a specific location or spatial orientation. Terms such as "include" or "comprising" mean that the elements or objects listed before "include" or "comprising" include the elements or objects listed after "include" or "comprising" and their equivalents, and do not exclude other elements or objects. Terms such as "connected" or "connected" are not limited to physical or mechanical connections and can include electrical connections, whether direct or indirect.

[0048] The terms used in this specification are for the purpose of describing specific embodiments only and are not intended to limit the present disclosure. As used in this specification and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0049] like Figures 1 to 3 As shown, in the related art, usually the mass bonding of Micro LEDs adopts the metal eutectic bonding method. Among them, the solid-liquid bonding method with relatively mild conditions melts the low-melting-point metal (mostly Sn, etc.) during the bonding process, and diffuses and reacts eutectically with the high-melting-point metal. The process is to produce a backplane with a driving circuit structure and a light-emitting unit substrate after the epitaxial layer GaN has been patterned. The two substrates are aligned, vacuumed and pressed together in the equipment. Then the frame sealant 5 is cured. The box is controlled at a certain vacuum degree, and the electrical connection points on the two sides of the substrate are pressed together by the external atmospheric pressure. It is then heated to the melting temperature of the low-melting-point metal (such as Sn) to perform eutectic bonding of the metal. This bonding scheme requires that the height of the frame sealant 5 after curing matches the total height of the two bonding electrical connection points to ensure sufficient contact of the bonding interface.

[0050] However, in the actual process, since the height of the sealant 5 is fixed after solidification, during the heating reaction stage, the low melting point metal melts, causing the two interfaces of the two substrates that were originally in full contact to separate slightly, and the cross-sectional structure is Figure 1 becomes Figure 2 Although contact can be maintained to a certain extent under external pressure, the contact reaction effect is poor, and the low-melting-point metal on the backplane cannot fully diffuse to the electrical connection points on the substrate side of the light-emitting unit. Figure 3 The cross-sectional view of the actual sample shows that the bonding structure has obvious stratification. Through component analysis, it can be seen that the low melting point metal ( Figure 3 A region) to the light emitting unit substrate ( Figure 3 The diffusion of the low-melting-point metal is less, and no large amount of metal eutectic compound is generated at the bonding interface with the light-emitting unit substrate. The low-melting-point metal is mainly connected to the electrical connection point on the backplane side ( Figure 3 Eutectic combination occurs in the middle C region, and the overall effective eutectic reaction is small, which affects the bonding strength and effect.

[0051] like Figure 4 As shown, in order to solve the above problems, the present application provides a display substrate, which includes:

[0052] A backplane 10 including a driving circuit structure (not shown);

[0053] A light-emitting unit substrate 20 , wherein the light-emitting unit substrate 20 includes a plurality of light-emitting units (not shown);

[0054] The back plate 10 is connected to the light emitting unit substrate 20; a sealing structure 30 is provided at the edge of the back plate 10 and the light emitting unit substrate 20, and the sealing structure 30 includes:

[0055] a support platform 31 , the support platform 31 being disposed on one of the back plate 10 or the light emitting unit substrate 20 ;

[0056] A first sealant 33 , which is disposed on one of the back plate 10 or the light-emitting unit substrate 20 ;

[0057] The second connecting layer 32 is disposed on the surface of the support 31 . The support 31 and the first sealant 33 are connected via the second connecting layer 32 . The melting point of the second connecting layer 32 is lower than that of the support 31 .

[0058] The present application provides a base, a first frame sealant and a second connecting layer, so that the sealing structure can produce thickness changes during bonding, so that the bonding area maintains full contact and improves the bonding quality.

[0059] The following will describe in detail the various embodiments of the present application that are consistent with the above-mentioned creative concepts.

[0060] like Figure 4 As shown, the present application provides a display substrate. The display substrate includes a backplane 10 and a light-emitting unit substrate 20. The light-emitting unit substrate 20 integrates a plurality of light-emitting units arranged in an array, and the light-emitting unit can be a MicroLED light-emitting unit, or a mini LED light-emitting unit, etc. A plurality of second electrical connection points 21 are provided on one side of the light-emitting unit substrate 20. The second electrical connection point 21 can be made of copper, gold, silver, etc. The second electrical connection point 21 can be columnar, prism-shaped, or other special-shaped structures, etc. The plurality of second electrical connection points 21 are respectively electrically connected to the N and P poles of the plurality of light-emitting units.

[0061] The backplane 10 is integrated with a drive circuit structure. A plurality of first electrical connection points 11 are provided on one side of the backplane 10. These first electrical connection points 11 can be made of copper, gold, silver, or other materials. These first electrical connection points 11 can be cylindrical, pyramidal, or have other special shapes. These first electrical connection points 11 are electrically connected to the drive circuit structure.

[0062] The back plate 10 is connected to the light-emitting unit substrate 20 by aligning the boxes. After aligning, the positions of the first electrical connection points 11 correspond to the positions of the second electrical connection points 21. A first connection layer 12 is provided on the surface of the first electrical connection point 11 or the second electrical connection point 21. The melting point of the first connection layer 12 is lower than the melting points of the first electrical connection point 11 and the second electrical connection point 21. The first connection layer 12 can be made of aluminum, tin, indium, etc. The first connection layer 12 covers the surface of the first electrical connection point 11 on the side close to the second electrical connection point 21, or the first connection layer 12 covers the surface of the second electrical connection point 21 on the side close to the first electrical connection point 11. The first electrical connection point 11 and the second electrical connection point 21 are electrically connected through the first connection layer 12.

[0063] A sealing structure 30 is provided at the edge of the back panel 10 and the light-emitting unit substrate 20. The sealing structure 30 is used to seal the box body formed after the back panel 10 and the light-emitting unit substrate 20 are assembled to prevent the box body from being corroded by water and oxygen. The sealing structure 30 can also support the thickness of the box after the back panel 10 and the light-emitting unit substrate 20 are assembled. The sealing structure 30 includes a support platform 31, a second connecting layer 32 and a first frame sealing glue 33. The support platform 31 is provided on one of the back panel 10 or the light-emitting unit substrate 20, and the first frame sealing glue 33 is provided on one of the back panel 10 or the light-emitting unit substrate 20. The support platform 31 is an annular structure surrounding the edge of the display substrate. The support platform 31 can be made of copper, gold, silver or molybdenum. The shape and position of the first sealant 33 correspond to those of the support platform 31 . The first sealant 33 is an annular structure surrounding the edge of the display substrate, and the orthographic projection of the first sealant 33 onto the support platform 31 has an overlapping area with the support platform 31 .

[0064] The second connecting layer 32 is arranged on the surface of the support platform 31. Specifically, the second connecting layer 32 covers the side of the support platform 31 close to the first frame-sealing glue 33. The support platform 31 and the first frame-sealing glue 33 are connected through the second connecting layer 32. The melting point of the second connecting layer 32 is lower than the melting point of the support platform 31. Optionally, the second connecting layer 32 can be made of aluminum, tin, or indium. The support platform 31 and the first frame-sealing glue 33 can be arranged on the same side or on different sides. When arranged on the same side, the first frame-sealing glue 33 is arranged on the side of the second connecting layer 32 away from the support platform 31. When arranged on different sides, the support platform 31 and the first frame-sealing glue 33 are respectively arranged at corresponding positions of the back panel 10 and the light-emitting unit substrate 20. After the box is assembled, the support platform 31 and the first frame-sealing glue 33 are abutted through the second connecting layer 32.

[0065] In an optional embodiment, the second connection layer 32 and the first connection layer 12 are made of the same material. The first electrical connection point 11, the second electrical connection point 21, and the support 31 are made of the same material. For example, the first electrical connection point 11, the second electrical connection point 21, and the support 31 are made of copper, and the second connection layer 32 and the first connection layer 12 are made of tin; or the first electrical connection point 11, the second electrical connection point 21, and the support 31 are made of gold, and the second connection layer 32 and the first connection layer 12 are made of aluminum; or the first electrical connection point 11, the second electrical connection point 21, and the support 31 are made of silver, and the second connection layer 32 and the first connection layer 12 are made of indium, or other material combinations. In this way, the second connection layer 32 and the first connection layer 12, the first electrical connection point 11, the second electrical connection point 21, and the support 31 can be manufactured using the same equipment and completed in a single step, effectively saving costs. Of course, the second connection layer 32 and the first connection layer 12 can be made of different materials. The first electrical connection point 11, the second electrical connection point 21 and the support 31 may also be made of different materials and can be manufactured separately in different processes.

[0066] In an optional embodiment, the second connection layer 32 has the same thickness as the first connection layer 12. That is, the length of the second connection layer 32 in the direction from the base 31 to the first sealing glue 33 is equal to the length of the first connection layer 12 in the direction from the first electrical connection point 11 to the second electrical connection point 21. In this way, when the display substrate is heated to a temperature exceeding the melting temperature of the second connection layer 32 and the first connection layer 12, the second connection layer 32 and the first connection layer 12 will soften synchronously. The height of the sealing structure 30 is consistent with the total height of the first electrical connection point 11, the second electrical connection point 21 and the first connection layer 12, that is, the change in the box thickness of the display substrate is synchronized with the change in the total height of the first electrical connection point 11, the second electrical connection point 21 and the first connection layer 12. In this way, after softening, the first connecting layer 12 maintains full contact with the first electrical connection point 11 and the second electrical connection point 21, ensuring that the eutectic reaction between the first connecting layer 12 and the first electrical connection point 11 and the second electrical connection point 21 is fully carried out, thereby generating sufficient eutectic compounds at the contact surface between the first connecting layer 12 and the first electrical connection point 11 and at the contact surface between the first connecting layer 12 and the second electrical connection point 21, effectively improving the bonding strength and quality.

[0067] In an optional embodiment, the orthographic projection of the first frame sealant 33 onto the support platform 31 falls within the outer contour of the support platform 31. The orthographic projection of the first frame sealant 33 onto the back panel 10 is covered by the orthographic projection of the support platform 31 onto the back panel 10. In this way, when the second connecting layer 32 covers the side of the support platform 31 close to the first frame sealant 33, the support platform 31 and the second connecting layer 32 can better support the first frame sealant 33.

[0068] like Figure 5 and Figure 7 As shown, in an optional embodiment, a retaining wall 40 structure is provided on one side of the support 31 close to the electrical connection point. The retaining wall 40 is an annular structure surrounding the edge of the display substrate. The retaining wall 40 structure is provided between the support 31 and the electrical connection point, which can prevent the material of the second connection layer 32 from melting and overflowing to the area where the light-emitting unit is located when the display substrate is heated to a temperature exceeding the melting temperature of the second connection layer 32 and the first connection layer 12, thereby affecting the structure of the area where the light-emitting unit is located and further affecting the light-emitting effect of the display substrate. Optionally, the retaining wall 40 can be made of a material such as silicon nitride or silicon oxide. Optionally, the height of the retaining wall 40 is less than the sum of the heights of the support 31 and the second connection layer 32. In this way, the cost of materials can be effectively saved. Optionally, a second sealing glue 41 is provided on the top of the retaining wall 40, and the sum of the heights of the second sealing glue 41 and the retaining wall 40 is less than the distance between the back plate 10 and the light-emitting unit substrate 20. In this way, the second sealing glue 41 cooperates with the retaining wall 40 to better prevent the material of the second connecting layer 32 from melting and overflowing to the area where the light-emitting unit is located when the display substrate is heated to a temperature exceeding the melting temperature of the second connecting layer 32 and the first connecting layer 12. At the same time, it also saves material costs and does not affect the support of the sealing structure 30 for the box thickness.

[0069] like Figure 6 and Figure 8As shown, in an optional embodiment, a retaining wall 40 structure is provided on the side of the support 31 close to the electrical connection point, and a retaining wall 40 structure is also provided on the side of the support 31 away from the electrical connection point. The retaining wall 40 is an annular structure surrounding the edge of the display substrate. The retaining wall 40 structure is provided on the side of the support 31 away from the electrical connection point to prevent the material of the second connection layer 32 from melting and overflowing to the outside when the display substrate is heated to a temperature exceeding the melting temperature of the second connection layer 32 and the first connection layer 12, thereby affecting the normal operation of the process equipment. Optionally, the retaining wall 40 can be made of a material such as silicon nitride or silicon oxide. Optionally, the height of the retaining wall 40 is less than the sum of the heights of the support 31 and the second connection layer 32. In this way, material costs can be effectively saved. Optionally, a second frame sealant 41 is provided on the top of the retaining wall 40, and the sum of the heights of the second frame sealant 41 and the retaining wall 40 is less than the distance between the backplane 10 and the light-emitting unit substrate 20. In this way, the second sealing glue 41 cooperates with the retaining wall 40 to better prevent the material of the second connecting layer 32 from melting and overflowing to the outside when the display substrate is heated to a temperature exceeding the melting temperature of the second connecting layer 32 and the first connecting layer 12. At the same time, it also saves material costs and does not affect the support of the sealing structure 30 for the box thickness.

[0070] The present application also discloses a method for manufacturing a display substrate. The display substrate includes a backplane 10 and a light-emitting unit substrate 20. A plurality of light-emitting units are integrated on the light-emitting unit substrate 20 so that the light-emitting units are arranged in an array with the light-emitting unit substrate 20. The light-emitting unit can be a Micro LED light-emitting unit, or a quantum dot light-emitting unit, etc. A plurality of second electrical connection points 21 are provided on one side of the light-emitting unit substrate 20. The second electrical connection point 21 can be made of copper, gold, or silver, etc. The second electrical connection point 21 can be columnar, prism-shaped, or other special-shaped structures, etc. The plurality of second electrical connection points 21 are electrically connected to the plurality of light-emitting units respectively.

[0071] The drive circuit structure is integrated on the backplane 10. Several first electrical connection points 11 are provided on one side of the backplane 10. These first electrical connection points 11 can be made of copper, gold, silver, or other materials. These first electrical connection points 11 can be cylindrical, pyramidal, or have other special shapes. These first electrical connection points 11 are electrically connected to the drive circuit structure.

[0072] The back plate 10 is connected to the light-emitting unit substrate 20 by aligning the back plate 10. After aligning, the positions of the first electrical connection points 11 correspond to the positions of the second electrical connection points 21. A first connection layer 12 is provided on the surface of the first electrical connection point 11 or the second electrical connection point 21. The melting point of the first connection layer 12 is lower than the melting points of the first electrical connection point 11 and the second electrical connection point 21. The first connection layer 12 can be made of aluminum, tin, indium, or the like. The first connection layer 12 covers the surface of the first electrical connection point 11 on the side close to the second electrical connection point 21, or the first connection layer 12 covers the surface of the second electrical connection point 21 on the side close to the first electrical connection point 11. The first electrical connection point 11 and the second electrical connection point 21 are electrically connected through the first connection layer 12.

[0073] A sealing structure 30 is provided at the edge of the backplane 10 and the light-emitting unit substrate 20. The sealing structure 30 includes a base 31, a first frame sealant 33, and a second connecting layer 32. The base 31 is provided on one of the backplane 10 or the light-emitting unit substrate 20. The first frame sealant 33 is provided on one of the backplane 10 or the light-emitting unit substrate 20. The second connecting layer 32 is provided on the surface of the base 31. The base 31 and the first frame sealant 33 are connected via the second connecting layer 32. The melting point of the second connecting layer 32 is lower than the melting point of the base 31 and the melting point of the second connecting layer 32 is lower than or equal to the melting point of the first connecting layer 12.

[0074] Heat the display substrate to a temperature higher than the melting point of the first connection layer 12. At this time, the second connection layer 32 and the first connection layer 12 will soften synchronously. The height of the sealing structure 30 is consistent with the total height of the first electrical connection point 11, the second electrical connection point 21 and the first connection layer 12, that is, the change in the box thickness of the display substrate is synchronized with the change in the total height of the first electrical connection point 11, the second electrical connection point 21 and the first connection layer 12. In this way, after the first connection layer 12 is softened, it maintains full contact with the first electrical connection point 11 and the second electrical connection point 21, ensuring that the eutectic reaction of the first connection layer 12 with the first electrical connection point 11 and the second electrical connection point 21 is fully carried out, thereby generating sufficient eutectic compounds at the contact surface between the first connection layer 12 and the first electrical connection point 11 and the contact surface between the first connection layer 12 and the second electrical connection point 21, effectively improving the bonding strength and quality.

[0075] Optionally, a retaining wall 40 may be provided on a side of the support platform 31 close to the electrical connection point, and a height of the retaining wall 40 is less than the sum of the heights of the support platform 31 and the second connection layer 32 .

[0076] Optionally, a second sealing glue 41 may be provided on the top of the retaining wall 40 , and the sum of the heights of the second sealing glue 41 and the retaining wall 40 is smaller than the distance between the back plate 10 and the light emitting unit substrate 20 .

[0077] Optionally, a retaining wall 40 may be provided on a side of the platform 31 close to the electrical connection point and a retaining wall 40 may be provided on a side of the platform 31 away from the electrical connection point. A second sealant 41 may be provided on top of the retaining wall 40, and the sum of the heights of the second sealant 41 and the retaining wall 40 may be less than the distance between the back plate 10 and the light-emitting unit substrate 20.

[0078] The present application also discloses a display device, which includes the above-mentioned display substrate.

[0079] Other embodiments of the present invention will readily occur to those skilled in the art upon consideration of the present invention and practice of the invention claimed herein. This specification is intended to cover any variations, uses, or adaptations of the present invention that follow the general principles of this specification and include common knowledge or customary techniques in the art not claimed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present invention being indicated by the following claims.

[0080] It should be understood that the present description is not limited to the exact structure that has been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present description is limited only by the appended claims.

[0081] The above description is only a preferred embodiment of this specification and is not intended to limit this specification. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of this specification should be included in the scope of protection of this specification.

Claims

1. A display substrate, characterized in that: include: a backplane, the backplane comprising a driving circuit structure; A light-emitting unit substrate, comprising a plurality of light-emitting units; The back plate is connected to the light emitting unit substrate; A sealing structure is provided at the edge of the back plate and the light emitting unit substrate, and the sealing structure includes: A supporting platform, the supporting platform is provided on one of the back plate or the light emitting unit substrate; a first frame sealant, the first frame sealant being disposed on one of the back plate or the light-emitting unit substrate; The second connecting layer is provided on the surface of the support platform, the support platform and the first frame sealing glue are connected through the second connecting layer, and the melting point of the second connecting layer is lower than the melting point of the support platform.

2. The display substrate according to claim 1, wherein: The backplane further comprises: a plurality of first electrical connection points, wherein the first electrical connection points are connected to the driving circuit structure; The light emitting unit substrate further includes: a plurality of second electrical connection points, wherein the second electrical connection points are connected to the light-emitting units; A first connection layer is provided on the surface of the first electrical connection point or the second electrical connection point, the first electrical connection point and the second electrical connection point are electrically connected through the first connection layer, and the melting point of the first connection layer is lower than the melting point of the first electrical connection point and the second electrical connection point.

3. The display substrate according to claim 2, wherein: The second connection layer and the first connection layer are made of the same material; the first electrical connection point, the second electrical connection point and the support are made of the same material.

4. The display substrate according to claim 3, wherein: The second connection layer has the same thickness as the first connection layer.

5. The display substrate according to claim 3, wherein: The second connection layer and the first connection layer are made of tin; the first electrical connection point, the second electrical connection point and the base are made of copper.

6. The display substrate according to claim 1, wherein: The orthographic projection of the first frame sealant onto the support platform falls within the outer contour of the support platform.

7. The display substrate according to claim 2, wherein: A retaining wall is provided on one side of the support platform close to the electrical connection point.

8. The display substrate according to claim 7, wherein: The height of the retaining wall is less than the sum of the heights of the cap and the second connecting layer.

9. The display substrate according to claim 8, wherein: A second sealing glue is provided on the top of the retaining wall, and the sum of the height of the second sealing glue and the retaining wall is less than the distance between the back plate and the light emitting unit substrate.

10. A method for manufacturing a display substrate, characterized in that: The display substrate comprises: a back plate, on which a plurality of first electrical connection points are provided; a light-emitting unit substrate, on which a plurality of second electrical connection points are provided; A first connection layer is provided on a surface of the first electrical connection point or the second electrical connection point, the first electrical connection point and the second electrical connection point are electrically connected via the first connection layer, and the melting point of the first connection layer is lower than the melting point of the first electrical connection point and the second electrical connection point; The back plate and the light emitting unit substrate are connected to each other; a sealing structure is provided at the edge of the back plate and the light emitting unit substrate, and the sealing structure is provided including: A supporting platform is provided, wherein the supporting platform is provided on one of the back plate or the light emitting unit substrate; Disposing a first frame sealant, wherein the first frame sealant is disposed on one of the back plate or the light emitting unit substrate; A second connecting layer is provided, the second connecting layer being provided on the surface of the base, the base being connected to the first frame sealant via the second connecting layer, the melting point of the second connecting layer being lower than the melting point of the base and being lower than or equal to the melting point of the first connecting layer; The display substrate is heated to a temperature higher than a melting point of the first connection layer.

11. The method for manufacturing a display substrate according to claim 10, wherein: A retaining wall is provided on one side of the support platform close to the electrical connection point, and a height of the retaining wall is less than the sum of the heights of the support platform and the second connection layer.

12. The method for manufacturing a display substrate according to claim 11, wherein: A second sealing glue is provided on the top of the retaining wall, and the sum of the height of the second sealing glue and the retaining wall is less than the distance between the back plate and the light emitting unit substrate.

13. A display device, characterized in that: The display device comprises the display substrate according to any one of claims 1 to 9.

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