A high-temperature-resistant pressing device and method for sealing a disc microfluidic chip

Abstract

A high-temperature-resistant pressing device and method for sealing a disc microfluidic chip relate to the fields of mechanics and microfluidics. The device solves the problems of sample volatilization in the chip in the existing high-temperature environment and the complicated operation of the traditional threaded pressing structure. The device comprises a carrier wall pressure locker, a support wall pressure locker, a bottom gasket, a disc microfluidic chip, a heat-conducting pressure-bearing cover plate and a high-temperature-resistant sealing ring, etc. The disc microfluidic chip is arranged on a stable bottom plate. The sample holes of the disc microfluidic chip are distributed on the same circumference. A circular ring type groove is formed on the disc microfluidic chip, and the sealing is realized by pressing and closing with the high-temperature-resistant sealing ring. The disc microfluidic chip is sealed by the mechanical locking pressing method, the function of sealing the chip to prevent sample and reaction liquid volatilization in the high-temperature environment is realized, and the heat-conducting pressure-bearing cover plate with the circular ring type groove in the lower part not only has the function of sealing the chip, but also has the auxiliary temperature regulating function of the microfluidic chip as a heat conductor.

Description

Technical Field

[0001] The present invention relates to the field of mechanics and microfluidic technology, and in particular to a high-temperature resistant pressing device and method for sealing a disc-type microfluidic chip. Background Art

[0002] With the current boom in microfluidics technology, disc-shaped microfluidic chips have become a hot area of ​​research and application due to their unique advantages. By integrating complex experimental processes into a disc-shaped structure and using centrifugal force to drive microfluidic movement, these chips offer significant advantages such as high integration, rapid analysis speed, and minimal sample and reagent consumption. They demonstrate enormous potential for application in a wide range of fields, including biomedical testing, chemical analysis, and drug screening. However, as the application of microfluidics continues to expand and deepen, the sealing problem of disc-shaped microfluidic chips has gradually become a key factor restricting their performance and application scope.

[0003] From the perspective of chip function realization, the core of microfluidic chips lies in the precise manipulation of microscale fluids. Disc-type microfluidic chips rely on centrifugal force to achieve orderly flow and reaction of fluids within the chip. If the seal is not tight, it will not only cause fluid leakage, making the experiment unable to proceed normally, but may also cause fluid crosstalk between different reaction areas, interfering with the reaction process and test results, and ultimately leading to inaccurate analysis data. Especially in biomedical testing, the accuracy of the sample is directly related to the reliability of disease diagnosis. Any tiny fluid leakage or cross-contamination may lead to serious consequences such as misdiagnosis. Therefore, reliable sealing is the key link to ensure that the fluid in the chip flows according to the preset path and the reaction proceeds normally, and it plays a decisive role in realizing the various functions of the chip.

[0004] In practical applications, many microfluidic analysis processes have strict temperature requirements. Take the polymerase chain reaction (PCR) as an example. This technology is widely used in fields such as genetic testing and disease diagnosis. It requires multiple temperature cycling steps such as high-temperature denaturation, low-temperature annealing, and thermostatic extension. The reaction temperature usually fluctuates frequently between 50°C and 95°C. Ordinary sealing methods are often difficult to maintain stability in high-temperature environments. Sealing materials are prone to softening, deformation, and aging, resulting in a sharp decline in sealing performance and the inability to maintain an effective sealing state. In addition, high temperatures may also cause a mismatch in the thermal expansion coefficient between the sealing structure and the chip, further increasing the risk of sealing failure. Therefore, the development of sealing technologies and devices with excellent high-temperature resistance is a necessary condition to ensure the stable operation of disc-type microfluidic chips under high-temperature conditions, which is of great significance for expanding the application of microfluidic technology in the field of high-temperature reactions.

[0005] Chinese patent publication number CN117861741A discloses a device and method for preventing aerosol contamination of disc-type microfluidic chips. The device includes: a synchronous wheel, a carrier, a disc-type microfluidic chip, a base and a sealing ring; the synchronous wheel is fastened to the carrier; the disc-type microfluidic chip is arranged on the base; the synchronous wheel is installed in conjunction with the base, and the synchronous wheel is driven to rotate by a motor and a synchronous belt, thereby driving the carrier and the base to rotate; the disc-type microfluidic chip is designed with an annular sample addition hole and a vent hole, which is compressed by a sealing ring to achieve sealing. The device uses a traditional threaded locking structure. During actual operation, it is necessary to manually rotate multiple circles of the thread repeatedly. Not only is the operation process lengthy and cumbersome, but it also requires the operator to have a certain degree of force control and operating skills, which consumes a lot of time and energy. Moreover, different operators have different operating forces, which will result in different degrees of compression, increasing the difficulty of operation. Even more problematic is that after the device experiences high-temperature reactions, due to the principle of thermal expansion and contraction, the threaded components expand and occlude tightly. As they cool and contract, they generate significant friction, causing the threaded connections to become stuck and difficult to open. Even forcible disassembly with tools can easily damage the threads or even the entire device. This not only greatly increases the operator's workload and reduces efficiency, but also incurs high costs for frequent replacement or repair, severely hindering the widespread use of this device in real-world production. Summary of the Invention

[0006] The present invention aims to solve the problems of sample volatilization in a chip in a high-temperature environment and the cumbersome operation of a traditional threaded pressing structure in the prior art.

[0007] To solve the above technical problems, the present invention is achieved through the following technical solutions:

[0008] Solution 1: The present invention proposes a high-temperature resistant pressing device for sealing a disc-shaped microfluidic chip, the device comprising a carrier, a carrier wall press locker, a heat-conducting pressure-bearing cover plate, a bottom gasket, a high-temperature resistant sealing ring, a disc-shaped microfluidic chip, a stable bottom plate, a bracket, and a bracket wall press locker;

[0009] The stable base plate is fastened to the carrier by screws and threads, the disc-type microfluidic chip is arranged on the stable base plate, and a bottom gasket is installed between the disc-type microfluidic chip and the stable base plate for connection, and the disc-type microfluidic chip is provided with an annular groove, and the size of the annular groove matches the high-temperature resistant sealing ring; the heat-conductive pressure-bearing cover plate is arranged above the high-temperature resistant sealing ring, and an annular groove matching the size of the high-temperature resistant sealing ring is provided below the heat-conductive pressure-bearing cover plate; the carrier wall pressure locker and the bracket wall pressure locker respectively press the inner ring and outer ring of the heat-conductive pressure-bearing cover plate, and the pressure is evenly applied to the heat-conductive pressure-bearing cover plate through the mechanical pressing and locking structure, so that the heat-conductive pressure-bearing cover plate, the high-temperature resistant sealing ring and the disc-type microfluidic chip are tightly pressed together.

[0010] Furthermore, a preferred embodiment is provided, wherein the disc-type microfluidic chip is in the shape of a ring as a whole, and at least one detection chamber is provided at equal intervals on the outer ring thereof, and the detection chambers are arranged in a circumferentially symmetrical manner.

[0011] Furthermore, a preferred embodiment is provided, wherein the top of the reaction chamber is provided with sample addition holes and air holes, and the sample addition holes and air holes are evenly distributed on the same circular ring.

[0012] Further, a preferred embodiment is provided, wherein the device comprises a carrier wall pressure locker shaft, a bracket wall pressure locker shaft, and a positioning pin;

[0013] Two hollow grooves are symmetrically arranged on the carrier wall, and the hollow grooves cooperate with the carrier wall pressure lock shaft; two hollow grooves are symmetrically arranged on the bracket wall, and the hollow grooves cooperate with the bracket wall pressure lock shaft. The bracket wall pressure lock shaft is used in conjunction with the bracket wall pressure lock to apply pressure to the inner ring of the heat-conducting pressure cover plate, and cooperates with the carrier wall pressure lock shaft and the carrier wall pressure lock to achieve uniform compression of the heat-conducting pressure cover plate.

[0014] Furthermore, a preferred embodiment is provided, in which a circular hole is provided on the top of the carrier wall locker, which is used to install the carrier wall locker on the carrier wall locker axis, so that the carrier wall locker rotates around the axis on the carrier wall, and there is a hollow rectangular wall in the middle, and a handle for pressing is provided on the top of the outer side of the rectangular wall. The outer contour of the bottom of the carrier wall locker is composed of a straight line tangent to a quarter circle, and a tooth is provided at the upper end of the quarter circle to form a groove, which is used to combine with the positioning pin on the planting rack to fix the carrier wall locker.

[0015] Furthermore, a preferred embodiment is provided, in which a circular hole is provided on the top of the bracket wall locker, which is used to install the bracket wall locker on the bracket wall locker axis on the bracket wall, so that the bracket wall locker rotates around the axis on the bracket wall, and there is a hollow rectangular wall in the middle, and a handle for pressing is provided on the top of the outer side of the rectangular wall. The outer contour of the bottom of the bracket wall locker is composed of a straight line tangent to a quarter circle, and a tooth is provided at the upper end of the quarter circle to form a groove, which is combined with the positioning pin on the bracket to fix the bracket wall locker.

[0016] Furthermore, a preferred embodiment is provided, in which two carrier wall locks are symmetrically distributed on the carrier wall, and two bracket wall locks are symmetrically distributed on the bracket wall, and the line connecting the pressing points of the carrier wall locks on the heat-conducting pressure cover plate crosses the line connecting the pressing points of the bracket wall locks on the heat-conducting pressure cover plate, and the intersection is located at the center of the circular heat-conducting pressure cover plate.

[0017] Solution 2: A method for using a high-temperature resistant pressing device for sealing a disc-type microfluidic chip, the method being implemented based on the device described in any one of Solution 1, the method comprising the following steps:

[0018] Step 1. Use a pipette to accurately draw a certain amount of reagents and samples, and slowly inject them through the 2mm diameter sample hole on the top of the disc-type microfluidic chip. Place the disc-type microfluidic chip steadily in the centrifuge adapter fixture, and set the centrifugation program to use centrifugal force to make the reagents and samples quickly pass through the diversion channel into the reaction chamber; after the liquid transfer is completed, take out the pre-cut annular adhesive material, the diameter of the annular adhesive material matches the circumference of the sample hole and pore distribution of the disc-type microfluidic chip; along the circumferential contour of the disc-type microfluidic chip, tightly fit the adhesive material on the surface of the sample hole and pore to complete the initial sealing; after sealing, use a dust-free wipe to gently wipe the residual liquid or impurities on the surface of the disc-type microfluidic chip, and place the disc-type microfluidic chip horizontally on a sterilized dedicated operating table to proceed to step 2;

[0019] Step 2. Release the carrier wall lock and smoothly rotate the opened carrier wall lock along the hinge structure to the side above the carrier. Similarly, when operating the bracket wall lock, first press the side snap switch to release the lock state, rotate it along the slide rail to the inside of the bracket, and slowly pull it upward at a 45-degree angle, starting from one side and then the other. Remove the cover and place it flat on the operating table covered with an anti-static mat with the cover surface facing up. Pick up the disc-shaped microfluidic chip with the front side facing up and place it horizontally on the center of the bottom gasket above the stable bottom plate in the carrier.

[0020] Step 3. Place the high-temperature resistant sealing ring directly above the sample loading hole of the disc-type microfluidic chip, ensuring that the inner ring of the high-temperature resistant sealing ring is completely aligned with the edge of the sample loading hole and the outer ring is tightly fitted with the sealing groove reserved in the disc-type microfluidic chip; place the cover plate steadily on the disc-type microfluidic chip; hold the rotating shafts on both sides of the bracket wall press lock with both hands and slowly rotate it counterclockwise to the outside of the bracket so that the wedge-shaped locking block at the end of the bracket wall press lock is tightly engaged with the positioning groove on the outside of the bracket to form a double fixed structure;

[0021] Step 4: Press the handle of the carrier wall lock to fix it, and press the handle of the bracket wall lock to fix it, and press the installed heat-conducting pressure cover plate to press the high-temperature resistant sealing ring.

[0022] The present invention is beneficial in that:

[0023] The present invention discloses a high-temperature resistant pressing device and method for sealing a disc-type microfluidic chip, which uses a mechanical method to seal the microfluidic chip, thereby achieving the function of sealing the chip in a high-temperature environment to prevent the volatilization of samples and reaction liquids. At the same time, the present invention is designed with a heat-conducting pressure-bearing cover plate, which not only seals the chip but also acts as a heat conductor to assist in regulating the temperature of the microfluidic chip. The device of the present invention has the advantages of simple operation and easy installation.

[0024] The present invention is also applicable to application fields such as biomedical testing, chemical analysis, and drug screening. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic diagram of the appearance of a high-temperature resistant pressing device for sealing a disc-type microfluidic chip according to the first embodiment.

[0026] Figure 2 This is a front cross-sectional view of a high-temperature resistant pressing device for sealing a disc-type microfluidic chip according to the first embodiment.

[0027] Figure 3 This is a side cross-sectional view of a high-temperature resistant pressing device for sealing a disc-type microfluidic chip according to the first embodiment.

[0028] Figure 4 This is a top view of a high-temperature resistant pressing device for sealing a disc-type microfluidic chip according to embodiment 1.

[0029] Figure 5 This is a bottom isometric view of a high-temperature resistant pressing device for sealing a disc-type microfluidic chip according to the first embodiment.

[0030] Figure 6 Schematic diagram of various angles of a carrier wall press locker of a high-temperature resistant pressing device for sealing a disc-type microfluidic chip according to embodiment 1.

[0031] Among them, (a) is the main view, (b) is the left view, and (c) is the axonometric view.

[0032] Figure 7 Schematic diagram of the motion trajectory of the carrier wall press locker of the high-temperature resistant pressing device for sealing a disc-type microfluidic chip according to the first embodiment.

[0033] Figure 8 Schematic diagram of a support wall press locker of a high-temperature resistant pressing device for sealing a disc-type microfluidic chip according to embodiment 1.

[0034] Among them, (a) is the main view, (b) is the left view, and (c) is the axonometric view.

[0035] Figure 9Schematic diagram of the motion trajectory of the support wall press locker of the high-temperature resistant pressing device for sealing a disc-type microfluidic chip according to the first embodiment.

[0036] Figure 10 Schematic diagrams of various angles of a disk-type microfluidic chip in embodiment 1.

[0037] Figure 11 This is a flow chart of a method for using a high-temperature resistant pressing device for sealing a disc-type microfluidic chip as described in embodiment eight.

[0038] Among them, there are a carrier 1, a carrier wall pressure locker 2, a heat-conducting pressure-bearing cover plate 3, a bottom gasket 4, a high-temperature resistant sealing ring 5, a disc-type microfluidic chip 6, a stable bottom plate 7, a bracket 8, a bracket wall pressure locker 9, and a hollow groove 10. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solutions and advantages of the implementation methods of this application clearer, the technical solutions in the implementation methods of this application will be clearly and completely described below in combination with the drawings in the implementation methods of this application. Obviously, the described implementation methods are only part of the implementation methods of this application, not all of the implementation methods.

[0040] Embodiment 1. This embodiment proposes a high-temperature resistant pressing device for sealing a disc-shaped microfluidic chip. The device includes: a carrier 1, a carrier wall press lock 2, a heat-conducting pressure-bearing cover plate 3, a bottom gasket 4, a high-temperature resistant sealing ring 5, a disc-shaped microfluidic chip 6, a stable bottom plate 7, a bracket 8, a bracket wall press lock 9, and a hollow groove 10;

[0041] The stable base plate 7 is the basic supporting component of the entire device and is fastened to the carrier 1 by means of precisely designed screws and threads. This installation method not only ensures the stability of the connection between the two, but also facilitates subsequent disassembly and maintenance. The disc-type microfluidic chip 6 is arranged on the stable base plate 7. In order to ensure the flatness and cushioning effect of the placement of the disc-type microfluidic chip 6, a bottom gasket 4 is specially installed between the disc-type microfluidic chip 6 and the stable base plate 7 for connection. The sample loading holes of the disc-type microfluidic chip 6 are distributed on the same circumference. The disc-shaped microfluidic chip 6 is provided with a circular groove of precise dimensions. The dimensions of the groove have been precisely calculated and designed to perfectly match the size of the high-temperature resistant sealing ring 5. When the high-temperature resistant sealing ring 5 is compressed, it can form an effective sealing barrier, preventing external environmental factors from interfering with the fluid experiment inside the disc-shaped microfluidic chip 6, ensuring the sealing and accuracy of the experimental process. The heat-conducting pressure-bearing cover plate 3 is precisely placed above the high-temperature resistant sealing ring 5, and below it is also provided with a circular groove of the same size as the high-temperature resistant sealing ring 5. This design further enhances the fixing effect of the high-temperature resistant sealing ring 5 during the compression process, allowing the high-temperature resistant sealing ring 5 to remain stable under pressure, avoiding displacement or deformation, thereby further improving the sealing performance. At the same time, the heat-conducting pressure-bearing cover plate 3 also has excellent thermal conductivity, which can evenly conduct heat in high-temperature environments, ensuring the temperature consistency of the disc-shaped microfluidic chip 6 during the experiment and avoiding the influence of local temperature differences on the experimental results. The carrier wall pressure lock 2 and the bracket wall pressure lock 9 are key executive components for realizing the sealing function of the device. They respectively press against the inner and outer rings of the heat-conducting pressure-bearing cover plate 3. Through a unique mechanical press-locking structure, they evenly apply pressure to the heat-conducting pressure-bearing cover plate 3, tightly pressing the heat-conducting pressure-bearing cover plate 3, the high-temperature-resistant sealing ring 5, and the disc-shaped microfluidic chip 6 together, thus achieving an efficient and reliable seal. This mechanical press-locking method is not only convenient to operate and can quickly complete the sealing process, but also provides a stable sealing effect that can withstand the test of harsh operating conditions such as high temperature and high pressure.

[0042] The disc-shaped microfluidic chip 6 has a regular annular shape, with multiple detection chambers evenly distributed around its outer ring. These chambers are precisely spaced and arranged in a circularly symmetrical pattern. This layout design not only fully utilizes the chip's annular space but also enables multiple samples to be analyzed and processed simultaneously in different detection chambers, greatly improving detection throughput and experimental efficiency. The disc-shaped microfluidic chip 6 is made of a high-performance polymer material. This polymer material is specially formulated and processed to achieve uniform texture and strong chemical stability. This uniform texture ensures that the chip maintains stable physical and chemical properties under various environmental conditions such as temperature and pressure, preventing experimental results from being affected by differences in material properties. Its transparent structure provides researchers with an excellent observation window. Each detection chamber is equipped with a dedicated microfluidic channel, which acts like a "capillary" in the microscopic world, tightly connecting the detection chamber to the central reaction chamber. Fabricated using micro-nanofabrication technology, the microfluidic channels have precise dimensions and smooth inner walls, enabling precise control of fluid flow. Whether it's the direction, flow rate, or flow rate of the fluid, it can all be precisely adjusted through the design of the microfluidic channel and external control equipment to ensure that the sample can be smoothly and orderly transported from the detection chamber to the reaction chamber along the preset path, providing stable material transfer for subsequent sample reactions and analysis. At the top of the reaction chamber, there are sample holes and air holes. The sample holes corresponding to all microfluidic channels are neatly and orderly distributed on the same circular ring structure, forming a unique "sample hole array." The size and shape of the high-temperature resistant sealing ring 5 have been rigorously calculated and designed to perfectly match the circular ring structure where the sample holes are located, achieving precise adaptation. This is conducive to the fixation of the high-temperature resistant sealing ring 5 during the compression process.

[0043] The device described in this embodiment also includes a carrier wall pressure lock shaft, a bracket wall pressure lock shaft, and a positioning pin. Two carefully designed hollow grooves 10 are symmetrically distributed on the carrier wall, forming a tight fit with the carrier wall pressure lock shaft. The carrier wall pressure lock shaft is made of high-strength alloy material, with excellent wear resistance and mechanical strength, and can withstand large pressure and torque. It is firmly installed in the carrier hollow groove 10, not only ensuring the stability of the carrier wall pressure lock 2 installation, but also providing flexible and reliable support for its subsequent rotation, pressing and other actions. When the operator needs to start the sealing operation, the carrier wall pressure lock shaft can assist the carrier wall pressure lock to smoothly apply pressure, so that the force is evenly transmitted to the inner ring of the heat-conducting pressure cover plate 3. Similarly, two hollow grooves 10 are also symmetrically provided on the bracket wall, and the bracket wall pressure lock shaft is installed there. The design and material selection of the bracket wall pressure lock shaft echo those of the carrier wall pressure lock shaft, and it also has excellent mechanical properties. During the sealing process, the bracket wall pressure lock shaft cooperates with the bracket wall pressure lock 9 to accurately apply pressure to the inner ring of the heat-conducting pressure cover plate 3, and cooperates with the carrier wall pressure lock shaft and the carrier wall pressure lock 2 to achieve uniform compression of the heat-conducting pressure cover plate 3, thereby ensuring that the high-temperature resistant sealing ring 5 fits tightly with the disc-type microfluidic chip 6 to achieve an ideal sealing effect.

[0044] Preferably, the device described in this embodiment also includes two carrier wall locks 2 symmetrically distributed on the carrier wall, and two bracket wall locks 9 distributed on the bracket wall. The line connecting the pressing points of the carrier wall locks 2 on the heat-conducting pressure cover plate 3 crosses the line connecting the pressing points of the bracket wall locks 9 on the heat-conducting pressure cover plate 3, and the intersection is located at the center of the circular heat-conducting pressure cover plate 3.

[0045] Preferably, the carrier wall press lock 2 is provided with a circular hole at the top, and the circular hole is used to install the carrier wall press lock 2 on the axis on the carrier wall, so that the carrier wall press lock 2 can rotate around the axis on the carrier wall, and there is a hollow rectangular wall in the middle, and a handle for pressing is provided on the top of the outer side of the wall. The outer contour of the bottom of the carrier wall press lock 2 is composed of a straight line and a quarter circle tangent to each other, and the curve transition is natural and smooth, so that the surface formed by the circle can smoothly pass through the surface to be pressed during the rotation, and the surface formed by the straight line can accurately press and fix the surface to be pressed. A tooth is provided at the upper end of the quarter circle to form a groove, which can be combined with the positioning pin on the planting frame 1 to fix the carrier wall press lock 2.

[0046] The device described in this embodiment also includes a bracket wall press lock 9 with a circular hole at the top. This hole is used to mount the bracket wall press lock 9 on the shaft on the bracket wall so that the bracket wall press lock 9 can rotate around the shaft on the bracket wall. There is a hollow rectangular wall in the middle, and a handle for pressing is provided at the top of the outer side of the wall. The outer contour of the bottom of the bracket wall press lock 9 is composed of a straight line and a quarter circle tangent to each other, and the curve transition is natural and smooth. The function is that during rotation, the surface formed by the circle can smoothly pass through the surface to be pressed, and the surface formed by the straight line can accurately press and fix the surface to be pressed. A tooth is provided at the upper end of the quarter circle to form a groove, which can be combined with the positioning pin on the bracket 8 to fix the bracket wall press lock 9.

[0047] Embodiment 2: A method for using a high-temperature resistant and convenient pressing device for sealing a disc-type microfluidic chip, comprising the following steps:

[0048] Step 1. Prepare the reagents. To a sterile centrifuge tube, add the following reagents in sequence: 10 μL of 10× PCR buffer (containing Mg²⁺), 8 μL of dNTP mix (2.5 mM each), 2 μL of forward primer (10 μM), 2 μL of reverse primer (10 μM), 1 μL of Taq DNA polymerase (5 U / μL), and 2 μL of DNA sample (for nucleic acid testing of respiratory diseases, such as COVID-19). Finally, top up to 100 μL with ultrapure water. When adding reagents, use a micropipette to pipette accurately and avoid introducing bubbles to ensure the accuracy of the reaction system. Place the centrifuge tube on a vortex shaker at an appropriate speed for 1-2 seconds to thoroughly mix the reaction system. Then, briefly centrifuge the tube to allow any liquid to settle to the bottom of the tube, ensuring that the reaction system is at the bottom of the tube for subsequent transfer to the chip.

[0049] The disc-shaped microfluidic chip 6 uses high-strength polycarbonate (PC) as its main material and has a symmetrical radial structure. Around the central axis, 12 independent detection chambers, each with a volume of 10 μL, are distributed evenly and spaced uniformly. The disc-shaped microfluidic chip is constructed of a polymer material with a uniform texture and transparency. Each detection chamber is connected to the reaction chamber via a dedicated microfluidic channel. The top of the reaction chamber is equipped with a sample injection port and air holes, which serve a universal function. During the production process, a three-dimensional model is first designed using CAD software, and a microstructure negative pattern is formed on a PET film by laser engraving. This is used as a template, and a high-precision mold is processed on a PC sheet using CNC micro-milling technology. The preheated PC sheet and PMMA cover sheet are then hot-pressed at 125°C and 6MPa pressure using a hot-melt adhesive film. After cooling and demolding, holes are punched. A 2% polyvinyl alcohol solution is then used to hydrophilize the inside of the chip to improve fluid fluidity. This ensures that the chip is leak-free under a pressure of 2MPa, and that the liquid can be evenly distributed to each detection chamber under centrifugal drive to meet the stringent requirements of PCR reactions.

[0050] Step 2: Use a pipette to precisely draw up a predetermined amount of reagent and sample and slowly inject through the 2mm diameter sample wells at the top of the disc-shaped microfluidic chip 6. To avoid bubbles that could affect subsequent experiments, keep the pipette tip close to the well wall and inject at a constant speed. The chip is then placed firmly in a dedicated centrifuge adapter and the centrifugation program is set: first, run at 5000 rpm for 30 seconds, using centrifugal force to rapidly propel the reagents and sample through the flow channels into the reaction chamber. The speed is then lowered to 1500 rpm and maintained at a low speed for 2 minutes to allow time for the reagents and sample to fully blend. Finally, return to high speed at 5000 rpm for 1 minute to ensure uniform mixing and facilitate transfer of the mixture through the microchannels to the detection chamber. After liquid transfer is complete, remove the pre-cut adhesive ring material. This is a silicone material with excellent sealing and chemical resistance, with a diameter that matches the chip's sample wells and pore distribution. Following the chip's circumference, apply the adhesive tightly to the sample wells and pores, ensuring no gaps or bubbles remain. This completes the initial seal. After sealing, gently wipe any remaining liquid or impurities from the chip surface with a dust-free wipe. Place the chip horizontally and steadily on a sterilized, dedicated workbench, awaiting subsequent mounting of the carrier and the next round of experimental procedures.

[0051] Step three, release the carrier wall latch 2 to ensure that the carrier wall latch 2 can rotate flexibly. Rotate the opened carrier wall latch 2 smoothly along the hinge structure to the side above the carrier to avoid interfering with subsequent operations. Similarly, when operating the bracket wall latch 9, first press the snap switch on the side to release the lock state, and then gently rotate it along the slide rail to the inside of the bracket 8 to fully expose the external space of the bracket 8. Hold the anti-slip grooves on both sides of the heat-conducting pressure cover 3 with both hands, and slowly pull it up at a 45-degree angle in the order of "one side first and then the other side". Carefully remove the heat-conducting pressure cover 3 and place it flat on an operating table covered with an anti-static mat, with the surface of the heat-conducting pressure cover 3 facing up to prevent dust contamination. Then, pick up the disc-type microfluidic chip 6 with the front facing up, and be careful to keep your fingers touching only the edge of the chip, and avoid touching the microchannels and reaction areas on the surface. Place the disc-shaped microfluidic chip 6 firmly on the center of the bottom gasket 4 above the stable base plate 7 in the carrier. This gasket is made of highly elastic silicone material, which provides excellent cushioning and shock absorption. Carefully align the upper limit holes on the disc-shaped microfluidic chip 6 with the corresponding limit posts on the bracket 8 to ensure that the disc-shaped microfluidic chip 6 does not change position.

[0052] Step 4. Use tweezers to carefully pick up the high-temperature resistant sealing ring 5, which is made of fluororubber and has good chemical corrosion resistance and high-temperature stability. Place the high-temperature resistant sealing ring 5 precisely above the sample loading hole of the disc-type microfluidic chip 6, ensuring that the inner ring of the sealing ring is completely aligned with the edge of the sample loading hole, and the outer ring fits tightly with the sealing groove reserved for the disc-type microfluidic chip 6 to avoid misalignment or distortion. Place the heat-conducting pressure-bearing cover plate 3 steadily above the disc-type microfluidic chip 6. Operate the bracket wall lock 9, pinch the rotating shafts on both sides of the lock with both hands, and slowly rotate it counterclockwise to the outside of the bracket 8, so that the wedge-shaped locking block at the end of the bracket wall lock 9 is tightly engaged with the positioning groove on the outside of the bracket 8 to form a double fixed structure to ensure that the entire device remains stable during subsequent use and will not loosen or shift.

[0053] Step 5: Press the handle of the carrier wall lock 2 to fix it, and press the installed heat-conducting pressure-bearing cover 3 against the high-temperature resistant sealing ring 5, thus realizing a high-temperature resistant and convenient pressing device for sealing the disc-type microfluidic chip, and completely fixing it. At this point, the amplification detection experiment officially begins.

[0054] Those skilled in the art will understand that the above description is only a preferred embodiment of the present invention, and the features described in the various embodiments and / or claims of the present disclosure may be combined or coupled in various ways, even if such a combination or coupling is not explicitly described in the present disclosure. It is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the scope of protection of the present invention.

[0055] Although preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they are aware of the basic inventive concepts. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention. Obviously, those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, the present invention is intended to include such changes and modifications as fall within the scope of the claims and their equivalents.

Claims

1. A high temperature resistant pressing device for sealing a disc-type microfluidic chip, characterized in that: The device comprises a carrier (1), a carrier wall pressure lock (2), a heat-conducting pressure-bearing cover plate (3), a bottom gasket (4), a high-temperature resistant sealing ring (5), a disc-type microfluidic chip (6), a stable bottom plate (7), and a bracket wall pressure lock (9); The stable base plate (7) is fastened to the carrier (1) by screws and threads, the disc-type microfluidic chip (6) is arranged on the stable base plate (7), and a bottom gasket (4) is installed between the disc-type microfluidic chip (6) and the stable base plate (7) for connection. The disc-type microfluidic chip (6) is provided with an annular groove, and the size of the annular groove matches the high-temperature resistant sealing ring (5); the heat-conducting pressure-bearing cover plate (3) is provided on the high-temperature resistant sealing ring ( 5), a circular groove matching the size of the high-temperature resistant sealing ring (5) is provided below the heat-conducting pressure-bearing cover plate (3); the carrier wall pressure locker (2) and the bracket wall pressure locker (9) respectively press the inner ring and outer ring of the heat-conducting pressure-bearing cover plate (3), and through the mechanical pressing and locking structure, the pressure is evenly applied to the heat-conducting pressure-bearing cover plate (3), so that the heat-conducting pressure-bearing cover plate (3), the high-temperature resistant sealing ring (5) and the disc-type microfluidic chip (6) are tightly pressed together.

2. The high temperature resistant pressing device for sealing a disc-type microfluidic chip according to claim 1, characterized in that: The disc-type microfluidic chip (6) is in the shape of a ring as a whole, and at least one detection chamber is arranged at equal intervals on its outer ring, and the detection chambers are arranged in a circumferentially symmetrical manner.

3. The high temperature resistant pressing device for sealing a disc-type microfluidic chip according to claim 2, characterized in that: The top of the reaction chamber is provided with sample addition holes and air holes, and the sample addition holes and air holes are evenly distributed on the same circular ring.

4. The high temperature resistant pressing device for sealing a disc-type microfluidic chip according to claim 1, characterized in that: The device also includes a carrier wall pressure lock shaft, a bracket wall pressure lock shaft, and a positioning pin; Two hollow grooves (10) are symmetrically provided on the carrier wall, and the hollow grooves (10) cooperate with the carrier wall pressure lock shaft; two hollow grooves (10) are symmetrically provided on the bracket wall, and the hollow grooves (10) cooperate with the bracket wall pressure lock shaft. The bracket wall pressure lock shaft cooperates with the bracket wall pressure lock (9) to apply pressure to the inner ring of the heat-conducting pressure cover plate (3), and cooperates with the carrier wall pressure lock shaft and the carrier wall pressure lock (2) to achieve uniform compression of the heat-conducting pressure cover plate (3).

5. The high temperature resistant pressing device for sealing a disc-type microfluidic chip according to claim 4, characterized in that: A circular hole is provided on the top of the carrier wall press lock (2) for mounting the carrier wall press lock (2) on the carrier wall press lock shaft so that the carrier wall press lock (2) rotates around the shaft on the carrier wall. A hollow rectangular wall is provided in the middle, and a handle for pressing is provided on the top of the outer side of the rectangular wall. The outer contour of the bottom of the carrier wall press lock (2) is composed of a straight line tangent to a quarter circle, and a tooth is provided at the upper end of the quarter circle to form a groove for combining with a positioning pin on the planting rack to fix the carrier wall press lock (2).

6. The high temperature resistant pressing device for sealing a disc-type microfluidic chip according to claim 4, characterized in that: The bracket wall press lock (9) is provided with a circular hole at the top for mounting the bracket wall press lock (9) on the bracket wall press lock shaft on the bracket wall so that the bracket wall press lock (9) rotates around the shaft on the bracket wall. A hollow rectangular wall is provided in the middle, and a handle for pressing is provided at the top of the outer side of the rectangular wall. The outer contour of the bottom of the bracket wall press lock (9) is composed of a straight line tangent to a quarter circle, and a tooth is provided at the upper end of the quarter circle to form a groove, which is combined with a positioning pin on the bracket to fix the bracket wall press lock (9).

7. The high temperature resistant pressing device for sealing a disc-type microfluidic chip according to claim 1, characterized in that: Two carrier wall pressure locks (2) are symmetrically distributed on the carrier wall, and two bracket wall pressure locks (9) are symmetrically distributed on the bracket wall. The line connecting the pressing points of the carrier wall pressure locks (2) on the heat-conducting pressure cover plate (3) and the line connecting the pressing points of the bracket wall pressure locks (9) on the heat-conducting pressure cover plate (3) cross each other, and the intersection point is located at the center of the circular heat-conducting pressure cover plate (3).

8. A method for using a high-temperature resistant pressing device for sealing a disc-type microfluidic chip, characterized in that: The method of use is implemented based on the device according to any one of claims 1 to 7, and the method comprises the following steps: Step 1: Use a pipette to accurately absorb a certain amount of reagents and samples, and slowly inject them through the sample loading hole with a diameter of 2 mm on the top of the disc-type microfluidic chip (6). Place the disc-type microfluidic chip (6) stably in the centrifuge adapter fixture, and set the centrifugal program to use centrifugal force to make the reagents and samples quickly pass through the guide channel into the reaction chamber; after the liquid transfer is completed, take out the pre-cut annular adhesive material, the diameter of the annular adhesive material matches the distribution circumference of the sample loading hole and pore of the disc-type microfluidic chip (6); along the circumferential contour of the disc-type microfluidic chip (6), tightly fit the adhesive material on the surface of the sample loading hole and pore to complete the initial sealing; after the sealing is completed, use a dust-free wipe to gently wipe the residual liquid or impurities on the surface of the disc-type microfluidic chip (6), and place the disc-type microfluidic chip (6) horizontally on a special operating table that has been sterilized, and proceed to step 2; Step 2: Release the carrier wall pressure lock (2), and rotate the opened carrier wall pressure lock (2) smoothly along the hinge structure to the side above the carrier. Similarly, when operating the bracket wall pressure lock (9), first press the buckle switch on the side to release the lock state, rotate it along the slide rail to the inside of the bracket, and slowly pull it up at a 45-degree angle in the order of one side first and then the other side. Remove the heat-conducting pressure cover (3) and place it flat on an operating table covered with an anti-static mat with the surface of the heat-conducting pressure cover (3) facing up; pick up the disc-type microfluidic chip (6) with the front side facing up, and place the disc-type microfluidic chip (6) horizontally on the center of the bottom gasket (4) above the stable bottom plate (7) in the carrier; Step 3: Place the high-temperature resistant sealing ring (5) directly above the sample loading hole of the disc-type microfluidic chip (6), keeping the inner ring of the high-temperature resistant sealing ring (5) completely aligned with the edge of the sample loading hole, and the outer ring tightly fitting the sealing groove reserved in the disc-type microfluidic chip (6); place the heat-conducting pressure-bearing cover plate (3) steadily above the disc-type microfluidic chip (6); pinch the rotating shafts on both sides of the bracket wall pressure lock (9) with both hands, and slowly rotate it counterclockwise to the outside of the bracket, so that the wedge-shaped locking block at the end of the bracket wall pressure lock (9) is tightly engaged with the positioning groove on the outside of the bracket, forming a double fixed structure; Step 4: Press the handle of the carrier wall pressure lock (2) to fix it, and press the handle of the bracket wall pressure lock (9) to fix it, and press the installed heat-conducting pressure cover (3) to press the high-temperature resistant sealing ring (5).

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