A semiconductor processing apparatus having a trimming function
Through the combination of automatic positioning, buffering and negative pressure components, the problems of workpiece damage and debris accumulation in semiconductor processing are solved, and high-precision and efficient processing effects are achieved.
Patent Information
- Application Number
- CN202511113706.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-11
- Publication Date
- 2025-10-21
- Estimated Expiration
- 2045-08-11
AI Technical Summary
During the semiconductor processing process, the workpiece is easily damaged, resulting in a decrease in yield. Existing technologies cannot effectively avoid hard damage and debris accumulation problems.
Automatic positioning structural components are used, combined with laser and color difference detection to achieve workpiece posture and depth compensation; a buffer structure is used to buffer excessive rotation during processing, combined with a negative pressure component to remove debris and reduce temperature.
It improves the accuracy and yield of workpiece processing, avoids hard damage and debris accumulation, and ensures the safety and efficiency of workpieces during processing.
Smart Images
Figure CN120620053B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of semiconductor processing, in particular to semiconductor processing equipment with a finishing function. Background Art
[0002] Semiconductors are widely used in radios, televisions, and even in temperature measurement. Diodes, for example, are devices made of semiconductors. The term "semiconductors" generally refers to their applications in integrated circuits, consumer electronics, communications systems, photovoltaic power generation, lighting, and high-power power conversion. Chips are fundamental to our modern lives, from televisions and computers to cars and mobile phones. Almost every device involving human-computer interaction requires a chip.
[0003] The processing of semiconductors requires very precise control. Some sensor workpieces need to maintain relatively high precision during the processing process. It is necessary to avoid damage to the substrate and part of the workpiece at all times to ensure the best working performance of the sensor. The processing and polishing process of semiconductors is extremely important. Problems are most likely to occur in this process. Some semiconductor substrates are usually harder. If they do not get proper buffering during processing, hard damage will occur to the workpiece, resulting in a significant reduction in the yield rate of the workpiece. This problem needs to be solved in a timely manner. Summary of the Invention
[0004] The object of the present invention is to provide a semiconductor processing equipment with a finishing function to solve the problems raised in the prior art.
[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: the processing equipment includes a processing frame, a capturing platform is provided on the processing frame, a positioning platform is provided on the capturing platform, a sliding positioner is slidably connected to the positioning platform, a lifting compensation platform is provided at the bottom of the positioning platform, a balance detection component is provided on the capturing platform, and the balance detection component is electrically connected to the lifting compensation platform; a rotating tool is provided on the processing frame, a swing arm motor is provided in the rotating tool, a swing arm motor is provided on the output end of the swing arm motor, a transmission gear set is provided in the rotating tool, a swing arm is installed on the transmission gear set, a polishing cover is provided on the swing arm, a polishing motor is provided on the polishing cover, a polishing gear is provided on the output end of the polishing motor, a polishing wheel set is provided in the polishing cover, the polishing wheel set is meshed with the polishing gear, the positioning platform is slidably connected to the capturing platform, a negative pressure component is provided on the capturing platform, the negative pressure component is inductively connected to the polishing cover, a supporting box is installed on the processing frame, a control microcomputer is provided on the supporting box, and the control microcomputer is connected to the lifting compensation platform, the balance detection component, The polishing motor is electrically connected, and the sensor or semiconductor silicon plate is sent to the processing frame and then to the capture table. After waiting for the sliding positioner and the lifting compensation table to approach each other and be completely fixed, the balance detection component is started. The balance detection component detects its posture and transmits the detection information to the lifting compensation table and the sliding positioner to compensate for the posture of the workpiece to be processed. Then the swing arm motor is started, and the swing arm motor drives the transmission gear group to work, drives the swing arm to rotate, and the polishing cover on the swing arm will rotate and cover the sensor workpiece. The polishing motor works, and the polishing gear on it drives the polishing wheel group to rotate. The polishing wheel group will grind and polish the sensor workpiece. At this time, the capture table and the positioning table drive the sensor workpiece to move to achieve comprehensive polishing. During the processing, the negative pressure component works to remove the debris from grinding and polishing in time to prevent the debris from damaging the sensor workpiece again. The above processes are all controlled by the program in the control microcomputer.
[0006] A translation motor is installed on the positioning table, a translation track is provided on the capture table, the output end of the translation motor is engaged with the teeth on the translation track, the positioning table is slidably connected to the longitudinal table, a removal cylinder is provided on the positioning table, the output end of the removal cylinder is connected to the longitudinal table, and the sliding positioner is slidably connected to the longitudinal table. During the processing, the translation motor works to drive the capture table to move horizontally, and the removal cylinder will drive the capture table to move longitudinally, thereby realizing the comprehensive processing of the sensor workpiece, and the assembly work before processing is precisely adjusted by the sliding positioner, which will fix the sensor workpiece to avoid the problem of workpiece offset.
[0007] The sliding locator includes a plurality of sliding positioning plates, each of which is slidingly connected to the corresponding longitudinal movement platform, and a fastening nut is rotatably connected to the longitudinal movement platform, and the inner edges of the fastening nuts are in sliding contact with the corresponding sliding positioning plates. A fine-tuning electric sheet is provided on the sliding positioning plate, and a fine-tuning plate is provided at the end of the fine-tuning electric sheet away from the sliding positioning plate. The fine-tuning electric sheet is electrically connected to the control microcomputer through a wire. When the sensor is assembled, the sensor workpiece is placed on the capture platform, and then the fastening nut is rotated. The sliding positioning plate approaches the sensor workpiece, and waits for the sliding positioning plate to rest on the sensor workpiece. After waiting for the signal from the balance detection component, the lifting compensation platform is started, and then the fine-tuning electric sheet is started. The control microcomputer supplies power to the corresponding fine-tuning electric sheet, and the fine-tuning gasket is deformed, thereby pushing out the fine-tuning plate. The fine-tuning plate adjusts the position of the workpiece until it meets the processing posture.
[0008] The balance detection assembly includes a calibrator and a balancer. The calibrator includes a calibration frame. The calibration frame is arranged on a supporting box. A calibration light bar is arranged on the lower end face of the calibration frame. The calibration light bar is slidingly connected to the calibration frame. A color difference measurement board is also arranged on the calibration frame. The color difference measurement board is electrically connected to the control microcomputer through a wire. During the installation process, the calibration light bar on the calibration frame will emit colored light, and the color difference measurement board will detect the colored lines below. If a complete colored ring appears on the workpiece, it proves that the workpiece is in a normal state at this time. If it is incomplete, an adjustment signal is transmitted to power the fine-tuning circuit, thereby adjusting the posture of the sensor.
[0009] The balancer includes a transmitting plate and a detecting plate. The transmitting plate is arranged on the longitudinal moving table. A plurality of laser modules are arranged on the transmitting plate. A laser detector is installed on the detecting plate. The laser detector and the laser module are electrically connected to the control microcomputer through wires respectively. When adjusting the processing depth, the lifting compensation table and the balancer need to coordinate. The laser module on the transmitting plate will emit light and be detected by the laser detector. At this time, the laser detector will transmit a signal. If the laser detector detects a complete laser signal, it proves that the processing depth is too shallow, otherwise it is too deep. At the same time, when the lifting and lowering are working, the time difference of detecting the laser can also be used to know the current convexity and concavity of the sensor, and feedback to the control microcomputer, waiting for the adjustment instruction of the processing depth.
[0010] The polishing cover includes a support cover and an adaptation cover, the adaptation cover is rotationally connected to the support cover, the support cover is fixedly connected to the swing arm, the polishing wheel group includes a connecting frame and multiple grinding wheels, each grinding wheel is rotationally connected to the connecting frame, the grinding wheel is provided with teeth, the grinding wheels are respectively engaged with the polishing gears, the connecting frame is rotationally connected to the support cover, when polishing, the processing instruction is transmitted to the swing arm motor, the swing arm drives the support cover to rotate, and the polishing gear on the polishing motor drives the teeth on the grinding wheel to engage, thereby processing the sensor workpiece below, and the connecting frame can slide in the support cover, which can cooperate with the buffering operation during the processing process. At the same time, shrapnel or springs can be installed in the support cover to ensure the timely rebound of the connecting frame.
[0011] A buffer ratchet disk is provided on the adaptive cover, and a plurality of buffer grooves are provided on the buffer ratchet disk. A buffer spring and a buffer plate are respectively provided in each buffer groove. Each buffer plate is rotationally connected to the buffer groove through a rotating shaft. The two ends of the buffer spring respectively press against the buffer plate and the buffer groove. The buffer spring in the buffer groove is divided into two springs with two elastic coefficients. The installation order of the buffer springs with the same coefficient is interval installation. The connecting frame is in intermittent sliding contact with the corresponding buffer plate. When the grinding wheel is subjected to too much resistance, it proves that the connectivity of the sensor workpiece is too strong, or the processing area is too large. If the processing is ignored at this time, it is bound to cause excessive damage to the workpiece. Therefore, a buffer structure can be used to buffer the processing speed. At this time, the connecting frame will press against the buffer plate and, under the action of the buffer spring, buffer the sliding of the connecting frame. Under the action of the buffer ratchet disk, the connecting frame can stop in time after buffering to avoid excessive buffering, which causes the workpiece to heat up and break due to excessive rotation of the grinding wheel.
[0012] The negative pressure component includes a negative pressure fan and a guide bar. The negative pressure fan and the guide bar are respectively arranged on both sides of the positioning platform. The negative pressure fan is provided with a wind direction pipe, the adaptation cover is provided with a negative pressure groove, the negative pressure groove is provided with an air inlet, and the installation direction of the wind direction pipe is flush with the air inlet. During the processing, the negative pressure fan is started to blow the gas into the guide bar. Under the action of the guide bar, the airflow is recovered and guided to ensure the limitation of the airflow direction. At the same time, the wind direction pipe will also limit the direction of the airflow so that the airflow can also enter the negative pressure groove.
[0013] A pressure wheel is provided in the air inlet, and a guide blade is provided on the pressure wheel. A plurality of collecting holes are provided on the negative pressure groove, and each collecting hole is connected with the inner side of the adaptation cover on the side away from the negative pressure groove. A chip guide port is provided on the side of the negative pressure groove away from the air inlet. After the air flow enters the negative pressure groove, the air flow will be accelerated to move in the negative pressure groove under the action of the guide blade. The flowing gas will generate suction to remove the debris in the adaptation cover in time to avoid the problem of debris accumulation. At the same time, the grinding workpiece can also be cooled in time to ensure the optimal processing temperature.
[0014] Compared with the prior art, the present invention has the following beneficial effects:
[0015] 1. The present invention adopts a structural component with automatic positioning, which can timely obtain the current workpiece posture and the depth that needs to be compensated through parameters such as laser and color difference. At the same time, by detecting the time difference, the optimal processing depth of the current workpiece can be obtained, and the processing speed can be adjusted according to this data.
[0016] 2. The present invention adopts a polishing component with a buffer structure. During the processing, when the workpiece encounters large resistance, the polishing component with this structure will be fully buffered, and a spaced blocking structure is adopted to ensure that the workpiece avoids internal damage and delamination problems after processing, thereby improving the yield rate.
[0017] 3. The present invention adopts a negative pressure component with guidance. By guiding the airflow, it can fully ensure that the workpiece will not be scratched by debris during the processing. At the same time, by utilizing its own negative pressure properties, it can avoid the problem of blockage in the polishing component and can also cool the workpiece. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;
[0019] Figure 2 This is a schematic diagram of the main structure of the present invention;
[0020] Figure 3 This is a schematic diagram of the internal structure of the support box of the present invention;
[0021] Figure 4 It is a schematic diagram of the top view of the structure of the present invention;
[0022] Figure 5 It is a schematic diagram of the processing platform structure of the present invention;
[0023] Figure 6 for Figure 5 The structural diagram of the partially enlarged A in the middle;
[0024] Figure 7 for Figure 6 The structural diagram of the partial enlargement of B in the middle;
[0025] Figure 8 This is a structural diagram of the cooperation relationship between the translation track and the translation motor of the present invention;
[0026] Figure 9 It is a schematic structural diagram of the polishing assembly of the present invention.
[0027] In the figure: 1. Processing stand; 2. Capture table; 201. Translation track; 3. Positioning table; 301. Translation motor; 302. Vertical movement table; 303. Removal of cylinder; 4. Sliding positioner; 401. Sliding positioning plate; 402. Fastening nut; 403. Fine-tuning electric plate; 404. Fine-tuning plate; 5. Lifting compensation table; 601. Calibrator; 602. Balancer; 603. Calibration frame; 604. Calibration light bar; 605. Color difference measuring plate; 606. Transmitter plate; 607. Detection plate; 608. Laser module; 609. Laser detector; 7. Rotating fixture; 8. Swing arm motor; 18. Swing gear; 9. Transmission gear set; 10. Swing arm; 11. Polishing cover; 1101. Support cover; 1102. Adaptive cover; 1103. Buffer ratchet disc; 1104. Buffer groove; 1105. Buffer spring; 1106. Buffer plate; 1108. Negative pressure groove; 1109. Air inlet; 1110. Pressure wheel; 1111. Guide blade; 1112. Collecting hole; 1113. Chip guide port; 12. Polishing motor; 13. Polishing gear; 14. Polishing wheel assembly; 1401. Connecting frame; 1402. Grinding wheel; 15. Negative pressure assembly; 1501. Negative pressure fan; 1502. Guide row; 1503. Wind direction row pipe; 16. Support box; 17. Control microcomputer. DETAILED DESCRIPTION
[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0029] Example: Figures 1-9As shown, the present invention provides a technical solution, the processing equipment includes a processing frame 1, a capture platform 2 is provided on the processing frame 1, a positioning platform 3 is provided on the capture platform 2, a sliding positioner 4 is slidably connected to the positioning platform 3, a lifting compensation platform 5 is provided at the bottom of the positioning platform 3, a balance detection component is provided on the capture platform 2, the balance detection component is electrically connected to the lifting compensation platform 5, a rotating tool 7 is provided on the processing frame 1, a swing arm motor 8 is provided in the rotating tool 7, a swing arm motor 8 is provided on the output end of the swing arm motor 8, a transmission gear set 9 is provided in the rotating tool 7, and the transmission gear set 9 is provided in the rotating tool 7. The wheel group 9 is provided with a swing arm 10, a polishing cover 11 is provided on the swing arm 10, a polishing motor 12 is provided on the polishing motor 12, a polishing gear 13 is provided on the output end of the polishing motor 12, a polishing wheel set 14 is provided in the polishing cover 11, the polishing wheel set 14 is meshed with the polishing gear 13, the positioning platform 3 is slidably connected to the capture platform 2, a negative pressure component 15 is provided on the capture platform 2, the negative pressure component 15 is inductively connected to the polishing cover 11, a support box 16 is provided on the support box 16, a control microcomputer 17 is provided on the control microcomputer 17, and the control microcomputer 17 is connected to the lifting plate 2 through a wire. The lifting compensation platform 5, the balance detection component, and the polishing motor 12 are electrically connected. The sensor or semiconductor silicon plate is sent to the processing frame 1 and then to the capture platform 2. After the sliding positioner 4 and the lifting compensation platform 5 are close to each other and completely fixed, the balance detection component is started. The balance detection component detects its posture and transmits the detection information to the lifting compensation platform 5 and the sliding positioner 4. The posture compensation adjustment of the workpiece to be processed is then started. The swing arm motor 8 is then driven by the swing arm motor 8 to drive the transmission gear set 9 to work, and the swing arm 10 is driven Rotation, the polishing cover 11 on the swing arm 10 will rotate and cover the sensor workpiece, the polishing motor 12 will work, and the polishing gear 13 on it will drive the polishing wheel group 14 to rotate, and the polishing wheel group 14 will grind and polish the sensor workpiece. At this time, the capture platform 2 and the positioning platform 3 drive the sensor workpiece to move to achieve comprehensive polishing. During the processing, the negative pressure component 15 will work to remove the debris from the grinding and polishing in time to prevent the debris from damaging the sensor workpiece again. The above processes are all controlled by the program in the control microcomputer 17.
[0030] A translation motor 301 is installed on the positioning table 3, and a translation rail 201 is provided on the capture table 2. The output end of the translation motor 301 is engaged with the teeth on the translation rail 201. The positioning table 3 is slidably connected with a longitudinal movement table 302. A removal cylinder 303 is provided on the positioning table 3. The output end of the removal cylinder 303 is connected to the longitudinal movement table 302. The sliding positioner 4 is slidably connected to the longitudinal movement table 302. During the processing, the translation motor 301 works to drive the capture table 2 to move horizontally, and the removal cylinder 303 will drive the capture table 2 to move longitudinally, thereby realizing the comprehensive processing of the sensor workpiece. The assembly work before processing is precisely adjusted by the sliding positioner 4. The sliding positioner 4 will fix the sensor workpiece to avoid the problem of workpiece offset.
[0031] The sliding positioner 4 includes a plurality of sliding positioning plates 401, each of which is slidably connected to the corresponding longitudinal moving platform 302. A fastening nut 402 is rotatably connected to the longitudinal moving platform 302. The inner edges of the fastening nuts 402 are in sliding contact with the corresponding sliding positioning plates 401. A fine-tuning electric sheet 403 is provided on the sliding positioning plate 401. A fine-tuning plate 404 is provided at one end of the fine-tuning electric sheet 403 away from the sliding positioning plate 401. The fine-tuning electric sheet 403 is electrically connected to the control microcomputer 17 through a wire. The sensor is During assembly, the sensor workpiece is placed on the capture table 2, and then the fastening nut 402 is rotated and the sliding positioning plate 401 is close to the sensor workpiece. After waiting for the sliding positioning plate 401 to rest on the sensor workpiece and waiting for the signal from the balance detection component, the lifting compensation table 5 is started, and then the fine-tuning chip 403 is started. The control microcomputer 17 supplies power to the corresponding fine-tuning chip 403, and the fine-tuning gasket is deformed, thereby pushing out the fine-tuning plate 404. The fine-tuning plate 404 adjusts the position of the workpiece until the composite processing posture is reached.
[0032] The balance detection component includes a calibrator 601 and a balancer 602. The calibrator 601 includes a calibration frame 603. The calibration frame 603 is arranged on the support box 16. A calibration light bar 604 is provided on the lower end surface of the calibration frame 603. The calibration light bar 604 is slidingly connected to the calibration frame 603. A color difference measurement board 605 is also provided on the calibration frame 603. The color difference measurement board 605 is electrically connected to the control microcomputer 17 through a wire. During the installation process, the calibration light bar 604 on the calibration frame 603 will emit colored light, and the color difference measurement board 605 will detect the colored lines below. If a complete colored ring appears on the workpiece, it proves that the workpiece is in a normal state at this time. If it is incomplete, an adjustment signal is transmitted to power the fine-tuning circuit 403, thereby adjusting the posture of the sensor.
[0033] The balancer 602 includes a transmitting plate 606 and a detecting plate 607. The transmitting plate 606 is arranged on the longitudinal moving stage 302. A plurality of laser modules 608 are arranged on the transmitting plate 606. A laser detector 609 is installed on the detecting plate 607. The laser detector 609 and the laser module 608 are electrically connected to the control microcomputer 17 through wires. When adjusting the processing depth, the lifting compensation stage 5 and the balancer 602 need to coordinate with each other. The laser module 608 on the transmitting plate 606 will emit light and be detected by the laser detector 609. At this time, the laser detector 609 will transmit a signal. If the laser detector 609 detects a complete laser signal, it proves that the processing depth is too shallow, otherwise it is too deep. At the same time, when the lifting and lowering are working, the time difference of detecting the laser can also be used to know the current convexity and concavity of the sensor, and feedback is fed back to the control microcomputer 17, waiting for the adjustment instruction of the processing depth.
[0034] The polishing cover 11 includes a support cover 1101 and an adaptable cover 1102, the adaptable cover 1102 is rotatably connected to the support cover 1101, the support cover 1101 is fixedly connected to the swing arm 10, the polishing wheel set 14 includes a connecting frame 1401 and a plurality of grinding wheels 1402, each grinding wheel 1402 is rotatably connected to the connecting frame 1401, the grinding wheels 1402 are provided with teeth, the grinding wheels 1402 are respectively engaged with the polishing gear 13, the connecting frame 1401 and the support cover 1101 are rotatably connected to the support cover 1101, the supporting cover 1101 is fixedly connected to the swing arm 10, the polishing wheel set 14 includes a connecting frame 1401 and a plurality of grinding wheels 1402, each grinding wheel 1402 is rotatably connected to the connecting frame 1401, the grinding wheels 1402 are respectively engaged with the polishing gear 13, the connecting frame 1401 and the support cover 1101 are rotatably connected to the support cover 1101, the supporting cover 1101 is fixedly connected to the swing arm 10, the polishing wheel set 14 includes a connecting frame 1401 and a plurality of grinding wheels 1402, Rotate the connection. When polishing is performed, the processing instructions are transmitted to the swing arm motor 8, the swing arm 10 drives the support cover 1101 to rotate, and the polishing gear 13 on the polishing motor 12 drives the teeth on the grinding wheel 1402 to engage, thereby processing the sensor workpiece below, and the connecting frame 1401 can slide in the support cover 1101, which can cooperate with the buffering operation during the processing. At the same time, a shrapnel or spring can be installed in the support cover 1101 to ensure the timely rebound of the connecting frame 1401.
[0035] A buffer ratchet disc 1103 is provided on the adaptation cover 1102, and a plurality of buffer grooves 1104 are provided on the buffer ratchet disc 1103. A buffer spring 1105 and a buffer plate 1106 are provided in each buffer groove 1104. Each buffer plate 1106 is rotatably connected to the buffer groove 1104 through a rotating shaft. The two ends of the buffer spring 1105 respectively press against the buffer plate 1106 and the buffer groove 1104. The buffer spring 1105 in the buffer groove 1104 is divided into two springs with two elastic coefficients. The installation order of the buffer springs 1105 with the same coefficient is interval installation. The connecting frame 1401 and the corresponding buffer plate 1106 slide intermittently. Contact, when the grinding wheel 1402 is subject to too much resistance, it proves that the connectivity of the sensor workpiece is too strong, or the processing area is too large. If the processing is ignored at this time, it will inevitably lead to excessive damage to the workpiece. Therefore, a buffer structure can be used to buffer the processing speed. At this time, the connecting frame 1401 will resist the buffer plate 1106 and buffer the sliding of the connecting frame 1401 under the action of the buffer spring 1105. Under the action of the buffer ratchet disk 1103, the connecting frame 1401 can stop in time after buffering to avoid excessive buffering, which will cause the workpiece to heat up and break due to excessive rotation of the grinding wheel 1402.
[0036] The negative pressure component 15 includes a negative pressure fan 1501 and a guide bar 1502. The negative pressure fan 1501 and the guide bar 1502 are respectively arranged on both sides of the positioning platform 3. The negative pressure fan 1501 is provided with a wind direction pipe 1503, the adaptation cover 1102 is provided with a negative pressure groove 1108, and the negative pressure groove 1108 is provided with an air inlet 1109. The wind direction pipe 1503 is flush with the installation direction of the air inlet 1109. During the processing, the negative pressure fan 1501 is started to blow the gas into the guide bar 1502. Under the action of the guide bar 1502, the airflow is recovered and guided, thereby ensuring the limitation of the airflow direction. At the same time, the wind direction pipe 1503 will also limit the direction of the airflow so that the airflow can also enter the negative pressure groove 1108.
[0037] A pressure wheel 1110 is provided in the air inlet 1109, and a guide blade 1111 is provided on the pressure wheel 1110. A plurality of collecting holes 1112 are provided on the negative pressure groove 1108. Each collecting hole 1112 is connected to the inner side of the adaptation cover 1102 on the side away from the negative pressure groove 1108. A chip guide port 1113 is provided on the side of the negative pressure groove 1108 away from the air inlet 1109. After the airflow enters the negative pressure groove 1108, under the action of the guide blade 1111, the airflow will accelerate to move in the negative pressure groove 1108, and the flowing gas will generate suction to remove the debris in the adaptation cover 1102 in time to avoid the problem of debris accumulation. At the same time, the grinding wheel 1402 workpiece can also be cooled in time to ensure the optimal processing temperature.
[0038] Working principle: send the sensor or semiconductor silicon plate to the processing frame 1, and then send it to the capture table 2, wait for the sliding locator 4 and the lifting compensation table 5 to approach each other and fix them completely, then start the balance detection component, the balance detection component detects its posture, the calibration light bar 604 on the calibration frame 603 will emit colored light, and the color difference measurement plate 605 will detect the colored lines below, the laser module 608 on the transmitting plate 606 will emit light, and be detected by the laser detector 609, and transmit the detection information to the lifting compensation table 5 and the sliding locator 4, and adjust the posture compensation of the workpiece to be processed, then start the swing arm motor 8, the swing arm motor 8 drives the transmission gear group 9 to work, and drives the swing arm 10 to rotate, the polishing cover 11 on the swing arm 10 will rotate, covering the sensor workpiece, the polishing motor 12 is working, and the polishing gear 13 thereon drives the polishing wheel disc group 14 to rotate, and the polishing gear 13 on the polishing motor 12 drives the teeth on the grinding wheel 1402 to engage, so as to process the sensor workpiece below, and the connecting frame 1401 can slide in the support cover 1101. Under the action of the buffer ratchet disc 1103, the connecting frame 1401 can stop in time after buffering to avoid excessive buffering, which causes the workpiece to heat up and break due to excessive rotation of the grinding wheel 1402. The translation motor 301 is working to drive the capture table 2 to move horizontally, and removing the cylinder 303 will drive the capture table 2 to move longitudinally to achieve comprehensive polishing. During the processing, the negative pressure fan 1501 is started to blow the gas into the guide bar 1502. Under the action of the guide bar 1502, the airflow is recovered and guided to prevent debris from damaging the sensor workpiece again.
[0039] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.
Claims
1. A semiconductor processing equipment with a finishing function, characterized in that: The processing equipment comprises a processing frame (1), wherein a capture platform (2) is provided on the processing frame (1), a positioning platform (3) is provided on the capture platform (2), a sliding positioner (4) is slidably connected to the positioning platform (3), a lifting compensation platform (5) is provided at the bottom end of the positioning platform (3), a balance detection component is provided on the capture platform (2), and the balance detection component is electrically connected to the lifting compensation platform (5), a rotating tool (7) is provided on the processing frame (1), a swing arm motor (8) is provided in the rotating tool (7), a swing arm motor (8) is provided at the output end of the swing arm motor (8), a transmission gear set (9) is provided in the rotating tool (7), a swing arm (10) is installed on the transmission gear set (9), and the swing arm (10) is provided. ) is provided with a polishing cover (11), a polishing motor (12) is provided on the polishing cover (11), a polishing gear (13) is provided on the output end of the polishing motor (12), a polishing wheel set (14) is provided in the polishing cover (11), the polishing wheel set (14) is meshed with the polishing gear (13), the positioning platform (3) is slidably connected to the capture platform (2), a negative pressure component (15) is provided on the capture platform (2), the negative pressure component (15) is inductively connected to the polishing cover (11), a support box (16) is installed on the support box (16), a control microcomputer is provided on the control microcomputer (17), and the control microcomputer (17) is electrically connected to the lifting compensation platform (5), the balance detection component, and the polishing motor (12) through a wire; A translation motor (301) is installed on the positioning platform (3), a translation track (201) is provided on the capture platform (2), an output end of the translation motor (301) is engaged with teeth on the translation track (201), a longitudinal movement platform (302) is slidably connected to the positioning platform (3), a removal cylinder (303) is provided on the positioning platform (3), an output end of the removal cylinder (303) is connected to the longitudinal movement platform (302), and the sliding positioner (4) is slidably connected to the longitudinal movement platform (302); The sliding positioner (4) includes a plurality of sliding positioning plates (401), each of the sliding positioning plates (401) is slidably connected to the corresponding longitudinal moving platform (302), a fastening nut (402) is rotatably connected to the longitudinal moving platform (302), the inner edges of the fastening nuts (402) are in sliding contact with the corresponding sliding positioning plates (401), a fine-tuning electric sheet (403) is provided on the sliding positioning plate (401), a fine-tuning plate (404) is provided at one end of the fine-tuning electric sheet (403) away from the sliding positioning plate (401), and the fine-tuning electric sheet (403) is electrically connected to the control microcomputer (17) through a wire; The balance detection assembly includes a calibrator (601) and a balancer (602). The calibrator (601) includes a calibration frame (603). The calibration frame (603) is arranged on a supporting box (16). A calibration light bar (604) is provided on the lower end surface of the calibration frame (603). The calibration light bar (604) is slidably connected to the calibration frame (603). A color difference measurement board (605) is also provided on the calibration frame (603). The color difference measurement board (605) is electrically connected to the control microcomputer (17) through a wire.
2. The semiconductor processing equipment with a finishing function according to claim 1, characterized in that: The balancer (602) includes a launch plate (606) and a detection plate (607), wherein the launch plate (606) is arranged on the longitudinal moving platform (302), a plurality of laser modules (608) are arranged on the launch plate (606), and a laser detector (609) is installed on the detection plate (607), and the laser detector (609) and the laser module (608) are electrically connected to the control microcomputer (17) through wires.
3. The semiconductor processing equipment with a finishing function according to claim 1, characterized in that: The polishing cover (11) comprises a supporting cover (1101) and an adapting cover (1102), the adapting cover (1102) being rotationally connected to the supporting cover (1101), the supporting cover (1101) being fixedly connected to the swing arm (10), the polishing wheel assembly (14) comprising a connecting frame (1401) and a plurality of grinding wheels (1402), each of the grinding wheels (1402) being rotationally connected to the connecting frame (1401), the grinding wheels (1402) being provided with teeth, the grinding wheels (1402) being respectively engaged with the polishing gears (13), and the connecting frame (1401) being rotationally connected to the supporting cover (1101).
4. The semiconductor processing equipment with a finishing function according to claim 3, characterized in that: A buffer ratchet disc (1103) is provided on the adaptable cover (1102), and a plurality of buffer grooves (1104) are provided on the buffer ratchet disc (1103). A buffer spring (1105) and a buffer plate (1106) are provided in each buffer groove (1104). Each buffer plate (1106) is rotatably connected to the buffer groove (1104) via a rotating shaft. Two ends of the buffer spring (1105) respectively abut against the buffer plate (1106) and the buffer groove (1104). The buffer spring (1105) in the buffer groove (1104) is divided into springs with two elastic coefficients. The installation order of the buffer springs (1105) with the same coefficient is interval installation. The connecting frame (1401) is in intermittent sliding contact with the corresponding buffer plate (1106).
5. The semiconductor processing equipment with a finishing function according to claim 4, characterized in that: The negative pressure assembly (15) comprises a negative pressure fan (1501) and a guide bar (1502), the negative pressure fan (1501) and the guide bar (1502) being respectively arranged on both sides of the positioning platform (3), the negative pressure fan (1501) being provided with a wind direction pipe (1503), the adaptive cover (1102) being provided with a negative pressure groove (1108), the negative pressure groove (1108) being provided with an air inlet (1109), and the installation direction of the wind direction pipe (1503) and the air inlet (1109) being flush.
6. The semiconductor processing equipment with a finishing function according to claim 5, characterized in that: A pressure wheel (1110) is provided in the air inlet (1109), and a guide blade (1111) is provided on the pressure wheel (1110). A plurality of collecting holes (1112) are provided on the negative pressure groove (1108), and each collecting hole (1112) is connected to the inner side of the adaptation cover (1102) on the side away from the negative pressure groove (1108). A chip guide port (1113) is provided on the side of the negative pressure groove (1108) away from the air inlet (1109).
Citation Information
Patent Citations
Automatic polishing device
CN105290944A
Micro-hole grinding and finishing device
CN115194575A