An intelligent electronic component automatic test system

Abstract

The application relates to the technical field of test systems, in particular to an automatic test system for intelligent electronic components, which comprises a test device, a test bearing mechanism is arranged in the test device, the test bearing mechanism cooperates with the electronic component to test the electronic component, a component bearing assembly is arranged on the test bearing mechanism, the electronic component is supported through the component bearing assembly, a position adjusting mechanism and a component fixing assembly are installed on the test bearing mechanism, the position adjusting mechanism adjusts the position of the electronic component to realize accurate positioning, when the electronic component is tested, the staff only needs to place the electronic component on the component bearing plate, accurate installation operation is not needed, the test platform is pushed into the interior of the test device, automatic fixing of the electronic component and plug connection of the pins of the electronic component can be realized, synchronous fixing of multiple samples can be realized, the fixing efficiency is high, and the pins cannot be damaged due to human factors.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of test systems, in particular to an automatic test system for intelligent electronic components. BACKGROUND

[0002] Thermal cycle test is an important part of intelligent electronic component reliability test. By simulating temperature change environment, the stability of mechanical and electrical performance can be evaluated. In thermal cycle test, fixing electronic components is an important step, mainly to ensure the stability of components during testing and the accuracy of test results. In thermal cycle test, rapid temperature changes may cause thermal expansion and contraction of components. If the position of components changes during testing, it may cause inconsistency and irreproducibility of test results. Fixing components can simulate their installation state in actual application, making test conditions closer to real use environment. However, when fixing electronic components, workers often need to fix electronic component samples one by one, which is not only troublesome but also inefficient. In order to ensure the most realistic installation state, a jack is often provided to cooperate with the pins on the electronic component. The size of the jack and the pin is adapted, so that the worker needs to pay special attention to avoid damaging the pin when inserting the pin, which further affects the installation efficiency of the component. SUMMARY

[0003] The present application aims to provide an automatic test system for intelligent electronic components to solve the problems raised in the background.

[0004] To achieve the above-mentioned purpose, the present application provides the following technical scheme:

[0005] An automatic test system for intelligent electronic components, comprising a test device, wherein a test bearing mechanism is provided in the test device, and the test bearing mechanism cooperates with the electronic component to test the electronic component;

[0006] A component bearing assembly is provided on the test bearing mechanism to support the electronic component, and a position adjusting mechanism and a component fixing assembly are installed on the test bearing mechanism;

[0007] The position adjusting mechanism adjusts the position of the electronic component for accurate positioning;

[0008] The component fixing assembly cooperates with the position adjusting mechanism to fix the electronic component.

[0009] Preferably, the test bearing mechanism comprises a test platform, a displacement carrier and an ejection frame. The test platform is movably installed on the test device, and the displacement carrier is connected with the test platform to lock the test platform.

[0010] Preferably, the ejection frame is mounted on the test platform, and the test platform can be unlocked through the ejection frame.

[0011] Preferably, the device bearing assembly is a moving carrier strip, and the moving carrier strip is connected with a displacement carrier strip, and the moving carrier strip is driven to move up and down through the displacement carrier strip.

[0012] Preferably, the moving carrier strip is movably connected with the test platform, and the test platform can drive the moving carrier strip to move synchronously.

[0013] Preferably, the position adjusting mechanism comprises a moving bearing strip, a connecting strip plate and a limiting top rod, and the moving carrier strip drives the moving bearing strip to move towards the electronic component when the moving carrier strip moves downward.

[0014] Preferably, the moving carrier strip also drives the limiting top rod to move towards the electronic component when the moving carrier strip moves downward, and the position of the electronic component is adjusted from both ends of the electronic component through the cooperation of the moving bearing strip and the limiting top rod.

[0015] Preferably, the moving bearing strip is connected with the connecting strip plate, and the moving bearing strip drives the connecting strip plate to rotate when the moving bearing strip moves, so that the connecting strip plate adjusts the position of the electronic component from both sides of the electronic component.

[0016] Preferably, the device fixing assembly comprises a gravity frame and a downward pressing carrier, and the moving carrier strip drives the gravity frame to rotate when the moving carrier strip moves downward, so that the gravity frame drives the downward pressing carrier to move downward relative to the moving carrier strip.

[0017] Preferably, the downward pressing carrier presses on the electronic component, and the electronic component is tightly fixed from above.

[0018] Compared with the prior art, the present application has the following advantages:

[0019] 1. When testing the electronic component, the worker only needs to place it on the device bearing plate, without the need for precise installation operation, and the test platform is pushed into the inside of the test device to realize automatic fixing of the electronic component and insertion of the pins, which is very convenient, can realize synchronous fixing of multiple samples, has high fixing efficiency, and will not cause damage to the pins due to human factors.

[0020] 2. When the test platform moves to the inside of the test device, it will drive the moving carrier to move down, and the moving support and the limiting top rod will also move down with the moving carrier, thereby pushing the electronic components to adjust their positions. At the same time, the rotating top plate will be driven to rotate with the movement of the moving support, and the position of the electronic components can also be adjusted under the action of the rotating top plate, that is, the electronic components can be accurately positioned on the moving carrier to prepare for the insertion of the pins.

[0021] 3. With the further downward movement of the moving carrier, the gravity frame will rotate, thereby driving the downward pressing carrier to move downward relative to the moving carrier and press on the electronic components to completely fix the electronic components. At the same time, the pins on the electronic components will be smoothly and accurately inserted into the pin matching holes, and no manual operation is required when pulling out, fully ensuring the safety of the pins. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 It is a schematic diagram of the assembly of the test device.

[0023] Figure 2 It is a schematic diagram of the assembly of the test device and the test platform.

[0024] Figure 3 It is a schematic diagram of the structure of the test device.

[0025] Figure 4 It is a first perspective view of the assembly of the test platform.

[0026] Figure 5 It is a second perspective view of the assembly of the test platform.

[0027] Figure 6 It is a schematic diagram of the structure of the test platform.

[0028] Figure 7 It is a first perspective view of the assembly of the moving carrier.

[0029] Figure 8 It is a second perspective view of the assembly of the moving carrier.

[0030] Figure 9 It is a schematic diagram of the structure of the moving carrier.

[0031] Figure 10 It is an exploded view of the assembly of the adapter plate.

[0032] Figure 11 It is a schematic diagram of the structure of the gravity frame.

[0033] In the figure: 1, test device; 11, cavity block; 12, block fitting hole; 13, cavity support rod; 2, test platform; 21, support bump; 22, support guide hole; 23, moving bearing hole; 24, locking load hole; 25, simulation bump; 26, pin fitting hole; 27, fitting boss; 28, fitting vertical bar; 281, fitting inclined bar; 29, lower bearing chassis; 3, displacement carrier; 31, limit carrier; 32, carrier driving bar; 33, carrier jack; 34, locking rod; 35, connecting rod; 4, ejector frame; 41, operating rod; 42, ejector rod; 5, moving carrier; 51, moving sleeve hole; 52, lower insertion bearing rod; 53, device bearing plate; 54, first fitting channel; 55, second fitting channel; 56, upper convex plate; 561, mounting jack; 57, bearing column; 571, upper top plate; 58, outer bump; 581, limiting groove; 582, bearing through hole; 59, lower convex plate; 591, support carrier; 592, limiting end plate; 6, moving bearing strip; 61, push top plate; 62, matching load bearing rod; 63, connecting bearing rod; 64, first spring; 65, link carrier; 66, fitting rod; 7, link strip; 71, sleeve connection hole; 72, outer extension plate; 73, fitting connection column; 74, rotating top plate; 75, rotating bearing hole; 76, fitting hole; 8, limit top rod; 81, second spring; 82, limit top plate; 83, fitting carrier; 9, gravity frame; 91, bearing rotation hole; 92, connection channel; 93, lower pressure carrier; 94, connection plug column. DETAILED DESCRIPTION

[0034] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0035] The present application provides a technical solution:

[0036] As shown in Figure 1 and Figure 2 , an intelligent electronic component automatic test system, comprising a test device 1, a test device 1 is provided with a test bearing mechanism, the test bearing mechanism is matched with the electronic component to test the electronic component, the test bearing mechanism is provided with a device bearing assembly, the electronic component is supported through the device bearing assembly, and the test bearing mechanism is provided with a position adjusting mechanism and a device fixing assembly, the position adjusting mechanism adjusts the position of the electronic component to make it accurately positioned, and the device fixing assembly is matched with the position adjusting mechanism to fix the electronic component.

[0037] As shown in Figure 3As shown, the cavity block 11 is symmetrically fixed in the test device 1, the cavity block 11 is provided with a block matching hole 12, and the cavity block 11 is fixedly provided with a cavity support rod 13.

[0038] The test bearing mechanism includes a test table 2, a variable position bearing strip 3 and an ejection frame 4. The test table 2 is movably installed on the test device 1. The variable position bearing strip 3 is connected with the test table 2 and can lock the test table 2. The ejection frame 4 is installed on the test table 2 and can unlock the test table 2.

[0039] As shown in Figure 2 , Figure 4 , Figure 5 and Figure 6 , the test table 2 is fixedly provided with a support protrusion 21, the support protrusion 21 is provided with a support guide hole 22, the test table 2 is symmetrically provided with a moving bearing hole 23, the cavity support rod 13 is inserted into the moving bearing hole 23, and the two ends of the test table 2 are respectively provided with a locking bearing hole 24. The locking bearing holes 24 at the two ends respectively lock the test table 2 at different positions. The test table 2 is fixedly provided with a plurality of simulation protrusions 25, the simulation protrusions 25 are provided with a pin matching hole 26, the test table 2 beside the simulation protrusions 25 is fixedly provided with a matching boss 27, and the test table 2 beside the matching boss 27 is further fixedly provided with a matching vertical strip 28. The matching vertical strip 28 is symmetrically provided with a matching inclined surface strip 281. The lower end of the test table 2 is fixedly provided with a lower bearing frame 29.

[0040] The variable position bearing strip 3 is symmetrically fixedly provided with a limiting bearing rod 31, the limiting bearing rod 31 is inserted into the block matching hole 12, and the upper end of the limiting bearing rod 31 is fixedly provided with a bearing driving strip 32. The bearing driving strip 32 is provided with a bearing insertion hole 33, the bearing insertion hole 33 is inserted with a locking rod 34, the locking rod 34 is matched with the locking bearing hole 24 to fix the test table 2, and the variable position bearing strip 3 is symmetrically hinged with a connecting rod 35. The other end of the connecting rod 35 is hinged with the test table 2.

[0041] The ejection frame 4 is fixedly provided with an operating rod 41 and an ejection rod 42. The ejection rod 42 is inserted into the locking bearing hole 24 from the lower side of the locking bearing hole 24. The ejection frame 4 is in contact with the lower bearing frame 29 before moving upward.

[0042] As shown in Figure 4 , Figure 5 , Figure 8 and Figure 9 , the device bearing assembly is a moving bearing strip 5, so the moving bearing strip 5 is connected with the variable position bearing strip 3 and moves up and down by the variable position bearing strip 3.

[0043] The mobile carrier 5 is symmetrically provided with a mobile sleeve hole 51, and a bearing driving strip 32 is inserted into the mobile sleeve hole 51. The mobile carrier 5 is fixedly provided with a lower insertion bearing rod 52, and the lower insertion bearing rod 52 is inserted into the support guide hole 22. The mobile carrier 5 is fixedly provided with a plurality of device bearing plates 53. The device bearing plate 53 is provided with a first matching channel 54 and a second matching channel 55. The device bearing plate 53 between the first matching channel 54 and the second matching channel 55 is fixedly provided with an upper convex plate 56. The upper convex plate 56 is provided with a mounting insertion hole 561. The second matching channel 55 is symmetrically provided with a bearing column 57 on both sides. The bearing column 57 is fixedly provided with an upper top plate 571. The device bearing plate 53 is also symmetrically provided with an outer convex block 58 on both sides. The outer convex block 58 is provided with a limiting groove 581 and a bearing through hole 582. The device bearing plate 53 is fixedly provided with a lower convex plate 59 at the lower end. The lower convex plate 59 is symmetrically provided with a support bearing column 591 on both sides. The support bearing column 591 is fixedly provided with a limiting end plate 592.

[0044] The mobile carrier 5 is movably connected with the test carrier 2, and the test carrier 2 can drive the mobile carrier 5 to move synchronously.

[0045] As shown in Figure 6 , Figure 7 , Figure 10 and Figure 11 , the position adjusting mechanism includes a mobile bearing strip 6, a link strip plate 7 and a limiting top rod 8. When the mobile carrier 5 moves downward, the mobile bearing strip 6 is driven to move in the direction of the electronic components.

[0046] The mobile bearing strip 6 is fixedly provided with a push top plate 61. The push top plate 61 is symmetrically provided with a matching bearing rod 62 on both sides. The mobile bearing strip 6 is also symmetrically provided with a connecting bearing rod 63. The connecting bearing rod 63 is inserted into the bearing through hole 582. The connecting bearing rod 63 is sleeved with a first spring 64. The two ends of the first spring 64 are respectively fixed to the mobile bearing strip 6 and the outer convex block 58. The other end of the connecting bearing rod 63 is fixedly provided with a link bearing block 65. The link bearing block 65 is fixedly provided with a matching rod 66. The matching rod 66 is in contact with the matching inclined surface strip 281 on the matching vertical strip 28 close to the mobile carrier 5.

[0047] As shown in Figure 4 , Figure 6 and Figure 7As shown, the mobile carrier 5 moves downward, and the limit top rod 8 also moves in the direction of the electronic components. The mobile carrier 6 cooperates with the limit top rod 8 to adjust the position of the electronic components from both ends. The limit top rod 8 is inserted into the mounting jack 561 on the upper flange plate 56. One end of the limit top rod 8 is fixedly provided with a limit top plate 82, and the other end is fixedly provided with a matching carrier block 83. The matching carrier block 83 is in contact with the matching inclined surface strip 281 on the matching vertical strip 28 away from the mobile carrier 5. The limit top rod 8 is also sleeved with a second spring 81, and both ends of the second spring 81 are fixedly arranged on the matching carrier block 83 and the upper flange plate 56.

[0048] As shown in Figure 7 and Figure 10 The mobile carrier 6 is connected with the connection strip plate 7. When the mobile carrier 6 moves, the connection strip plate 7 rotates, thereby adjusting the position of the electronic components from both sides. One end of the connection strip plate 7 is provided with a sleeving connecting hole 71, and the matching carrier rod 62 is inserted into the sleeving connecting hole 71. The other end of the connection strip plate 7 is fixedly provided with an extension plate 72, and the extension plate 72 is fixedly provided with a matching connecting column 73. The matching connecting column 73 is connected with a rotating top plate 74, and the rotating top plate 74 is provided with a rotating bearing hole 75. The bearing column 57 is inserted into the rotating bearing hole 75, and the rotating top plate 74 is also provided with a matching connecting hole 76. The matching connecting column 73 is inserted into the matching connecting hole 76.

[0049] As shown in Figure 8 and Figure 11 The device fixing assembly includes a gravity frame 9 and a downward pressing carrier 93. When the mobile carrier 5 moves downward, the gravity frame 9 rotates, and the downward pressing carrier 93 moves downward relative to the mobile carrier 5. The downward pressing carrier 93 is pressed on the electronic components to fix them from above. The gravity frame 9 is below the device bearing plate 53. The gravity frame 9 is symmetrically provided with a bearing rotating hole 91, and the bearing rotating hole 91 is inserted with a supporting carrier column 591. The gravity frame 9 is also symmetrically provided with a connecting channel 92, and the connecting channel 92 is connected with the downward pressing carrier 93. The downward pressing carrier 93 is inserted into the limiting groove 581, and the lower end of the downward pressing carrier 93 is symmetrically fixedly provided with a connecting plug column 94. The connecting plug column 94 is inserted into the connecting channel 92, and the connecting plug column 94 is in contact with the inner wall of the connecting channel 92.

[0050] In the test of electronic components, it is placed on the device support plate 53, so that the pin passes through the second matching channel 55, without the need for staff to fix it, only need to put it, more convenient and fast, after placing the electronic components, pull the ejection frame 4 up by operating the lever 41, so that the ejection rod 42 ejects the locking rod 34 inserted in the locking hole 24, so that the test platform 2 is in the unlocked state, it can be pushed to the inside of the test device 1 to move, at the same time, release the ejection frame 4 to move down until the test platform 2 moves to the working point, at this time, the locking rod 34 is aligned with the other locking hole 24, so that the locking rod 34 is inserted into the locking hole 24 aligned with it under the action of gravity, realizing the fixation of the test platform 2. During the movement of the test platform 2 to the inside of the test device 1, the displacement carrier 3 will be driven to move down under the action of the connecting rod 35, which will drive the moving carrier 5 to move down with the displacement of the carrier 3, which will drive the matching rod 66 to move in the direction of the moving carrier 5 under the action of the matching inclined surface 281 at one end of the matching upright 28, which will drive the push plate 61 to move, which will push the electronic components from one end, and the matching carrier 83 will be pushed away from the moving carrier 5 under the action of the matching inclined surface 281 at the other end of the matching upright 28, so that the limiting plate 82 pushes the electronic components from the other end, and the moving carrier 6 will drive the rotating plate 74 to rotate under the action of the matching connecting column 73 when moving, which will push the electronic components from both sides under the action of the rotating plate 74, which will adjust the position of the electronic components under the cooperation of the push plate 61, the limiting plate 82 and the rotating plate 74, so that the position of the electronic components is accurate and finally limited by the push plate 61, the limiting plate 82 and the rotating plate 74. When the position of the electronic components is adjusted, the pins on the electronic components are aligned with the pin matching hole 26 on the simulation protrusion 25, and the gravity frame 9 will be in contact with the matching boss 27 with the further downward movement of the moving carrier 5, which will drive the gravity frame 9 connected to the lower pressure carrier 93 to rotate downward under the limitation of the matching boss 27, which will drive the lower pressure carrier 93 to move downward with the rotation of the gravity frame 9, so that the lower pressure carrier 93 is pressed on the electronic components to realize the complete fixation of the electronic components, and the pins on the electronic components will be inserted into the pin matching hole 26 with the downward movement of the moving carrier 5, completing the insertion of the pins. The whole process does not need to be operated by human, which is very convenient and can realize the synchronous fixation of multiple samples with high efficiency, and also avoids the phenomenon of pin damage caused by human operation. When the test is completed, move the ejection frame 4 up again to move the locking rod 34 up to unlock the test platform 2, then pull the test platform 2 to the outside of the test device 1,With the test platform 2 moving out, the moving strip 5 is moved up, and the gravity frame 9 is reversely rotated under the action of gravity, the lower pressing carrier 93 is moved up to release the electronic components, and the moving bearing strip 6 and the limiting top rod 8 are reset under the action of the first spring 64 and the second spring 81, so that the electronic components are completely released, and the electronic components can be quickly taken down, and the pins have moved out of the pin matching hole 26, the components for position adjustment and position fixation of the electronic components are away from the electronic components, so that the electronic components can be quickly and conveniently taken out.

[0051] Although embodiments of the present application have been shown and described, it is to be understood that various modifications, substitutions, replacements and changes can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. An automatic testing system for intelligent electronic components, comprising a testing device, characterized in that: The testing device is equipped with a testing support mechanism, which works in conjunction with electronic components to test the electronic components. The test support mechanism includes a test platform, a displacement carrier bar, and an ejector frame. The test platform is movably mounted on the test device, and the displacement carrier bar is connected to the test platform to lock the test platform. The test support mechanism is equipped with a device support component to support electronic components, and the test support mechanism is also equipped with a position adjustment mechanism and a device fixing component. The device carrier component is a movable carrier bar, which is connected to a displacement carrier bar. The displacement carrier bar drives the movable carrier bar to move up and down. The movable carrier bar is movably connected to the test platform, and the test platform drives the movable carrier bar to move synchronously. The position adjustment mechanism adjusts the position of the electronic components to achieve precise positioning. The position adjustment mechanism includes a movable support bar, a connecting bar, and a limiting top rod. When the movable support bar moves downward, it drives the movable support bar to move towards the electronic components. When the movable carrier moves downward, it also drives the limiting top rod to move towards the electronic components. The movable carrier is connected to the connecting strip plate. The device fixing assembly works in conjunction with the position adjustment mechanism to fix the electronic components; The device fixing assembly includes a gravity frame and a lower pressure frame. When the moving carrier moves downward, it will drive the gravity frame to rotate, so that the gravity frame drives the lower pressure frame to move downward relative to the moving carrier.

2. The intelligent electronic component automatic testing system according to claim 1, characterized in that: The ejector frame is installed on the test platform, and the test platform can be unlocked through the ejector frame.

3. The intelligent electronic component automatic testing system according to claim 2, characterized in that: The electronic component's position is adjusted from both ends by the cooperation of the movable support bar and the limiting rod.

4. The intelligent electronic component automatic testing system according to claim 3, characterized in that: When the movable support bar moves, it will cause the connecting bar to rotate, thereby allowing the connecting bar to adjust the position of the electronic components from both sides.

5. The intelligent electronic component automatic testing system according to claim 4, characterized in that: The lower ballast presses down on the electronic components, clamping and securing them from above.

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