Chip transmission detection device

Abstract

The application provides a chip transmission detection device, which comprises a transmission mechanism and a detection station. The detection station comprises a mounting frame, a pressing detection mechanism, a visual detection mechanism and a test seat. The transmission mechanism delivers the chip to the test seat. The chip passes through the visual detection mechanism during the process of being driven by the transmission mechanism to move to the test seat. The visual detection mechanism is displaced along the direction perpendicular to the movement direction of the transmission mechanism to visually detect the chip surface. The pressing detection mechanism comprises a driving mechanism and a pressing plate assembly. The buffer part is surrounded by an elastic member to form an air cavity. The gas in the air cavity exerts an interaction force between the elastic member and the pressing plate assembly during the process of the pressing plate assembly contacting the chip. The application is used to solve the problems of the chip test efficiency being affected by the chips damaged before the test in the prior art and the chip yield being affected by the high damage rate during the chip test.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor production testing, and in particular to chip transmission detection equipment. Background Art

[0002] Before a chip is put into use, its performance needs to be tested. A three-temperature tester is a device used to test semiconductor chips or related components in different temperature environments. It simulates low, room, and high temperatures to evaluate the chip's performance and lifespan under various operating conditions. This ensures that the chip maintains stable performance under various temperature fluctuations in actual applications after packaging and sale. Specifically, the chip is placed in a chip fixture, and the three-temperature tester's lifting pressure plate presses against the chip surface, transferring heat to the chip through the pressure plate to simulate the ambient temperature.

[0003] When using a three-temperature tester to test a chip, the pre-temperature-adjusted chip is transferred to a test jig, and then the test plate of the test jig is pressed down to the chip surface to simulate different working environment temperatures of the chip to test the working performance of the chip under different ambient temperatures. In the prior art, the chip is directly transferred from the pre-temperature-adjusting station to the test jig, and then the test plate is pressed down to perform performance testing on the chip. Since the chip has a certain defective rate, and the test plate in the prior art presses down the chip due to the large force applied, there is a possibility that the chip under test will be damaged. If the chip is directly transferred from the pre-temperature-adjusting station to the test jig, when the performance of the chip cannot be tested normally, there are two possibilities: the chip is damaged before the test or damaged during the test. Testing a chip that has been damaged before the test affects the chip testing efficiency, and the damage to the chip caused by the test plate pressing down will cause the chip defective rate to increase further, thereby increasing the production cost of the chip.

[0004] In view of this, it is necessary to improve the chip testing equipment in the prior art to solve the above-mentioned problems. It should be noted that the above introduction to the background technology is only for the convenience of providing a clear and complete description of the technical solutions of this application and facilitating the understanding of those skilled in the art. It should not be assumed that the above technical solutions are well known to those skilled in the art simply because they are described in the background technology section of this application. Summary of the Invention

[0005] The purpose of the present invention is to disclose a chip transmission detection device to solve the problem in the prior art that chips that have been damaged before testing are tested, which affects the chip testing efficiency, and the problem that a high damage rate exists during the chip testing process, which affects the chip yield.

[0006] To achieve the above-mentioned object, the present invention provides a chip transmission and testing device, comprising: a transmission mechanism and a testing station, wherein the testing station comprises a mounting frame, a downward pressure detection mechanism, a visual detection mechanism, and a test seat, and the transmission mechanism transfers the chip to the test seat;

[0007] The visual inspection mechanism is mounted on the mounting frame. The chip passes through the visual inspection mechanism when the transmission mechanism drives the chip through the mounting frame to move to the test seat. The visual inspection mechanism moves along a direction perpendicular to the movement direction of the transmission mechanism to perform visual inspection on various parts of the chip surface.

[0008] The downward pressure detection mechanism includes a driving mechanism and a pressure plate assembly. The pressure plate assembly is connected to the driving mechanism through a buffer portion. An air cavity is surrounded by an elastic member in the buffer portion. During the contact between the pressure plate assembly and the chip, the gas introduced into the air cavity exerts an interaction force between the elastic member and the pressure plate assembly.

[0009] As a further improvement of the present invention, the mounting frame includes two groups of support rods symmetrically arranged on both sides of the length direction of the test seat, the top ends of the support rods are vertically upward and connected to the top plate, and the support rods are fixed to the back plate perpendicular to the length direction of the transmission mechanism. The visual inspection mechanism includes a translation mechanism and a detection lens, and the translation mechanism drives the detection lens to move in a direction perpendicular to the length direction of the transmission mechanism;

[0010] The back plate is provided with a clearance opening, and the transmission mechanism is translated to the top of the test seat through the clearance opening. When the chip passes through the clearance opening with the transmission mechanism, the detection lens is driven by the translation mechanism to move and perform visual inspection on the chip.

[0011] As a further improvement of the present invention, the buffer portion includes a first mounting block and a second mounting block, a cavity is enclosed between the first mounting block and the second mounting block, the elastic member is formed as a sheet and is clamped between the first mounting block and the second mounting block, the first mounting block is fixed to the bottom end of the driving mechanism, and the air cavity is formed by separating the internal space of the cavity and enclosed by the first mounting block and the elastic member;

[0012] The buffer part also includes a floating assembly, and the floating assembly includes a connecting seat and a movable block. The connecting seat is fixedly connected to the upper surface of the pressure plate assembly, and the bottom end of the movable block is fixedly connected to the connecting seat. The top end of the movable block passes through the bottom wall of the second mounting block and is located in the cavity. A protrusion is formed on the side wall of one end of the movable block passing through the cavity, and the protrusion overlaps the bottom wall of the second mounting block when the pressure plate assembly is not under force.

[0013] As a further improvement of the present invention, the buffer portion also has a mounting plate, which forms an air path along the length direction, and the top wall of the first mounting block forms an air inlet hole, which is connected to the air path, and the gas enters the air cavity through the air path and the air inlet hole. The elastic part is selected as a silicone sheet, and the top edge of the movable block is formed as a rounded chamfer.

[0014] As a further improvement of the present invention, the present invention further comprises: a workbench, the test seat being detachably connected to the workbench, the support rod being vertically fixed to the upper surface of the workbench, the transmission mechanism comprising a guide assembly and a transmission assembly, the guide assembly comprising a guide rail and a slider slidably engaged with the guide rail, the guide rail being disposed in a gap between the support rod and the test seat;

[0015] The transfer assembly includes a base plate and a transfer seat. The slider is fixed to the lower surface of the base plate. The transfer seat is detachably connected to the upper surface of the base plate. The transfer seat is provided with a plurality of accommodating grooves adapted to the chips.

[0016] As a further improvement of the present invention, the back plate is fixedly connected to the L-shaped plate along the length direction, and the top and bottom surfaces of the L-shaped plate are arranged perpendicular to the plane where the back plate is located;

[0017] The translation mechanism includes a driving wheel, a driven wheel, and a drive motor. The driving wheel and the driven wheel are rotatably connected to the lower surface of the L-shaped plate. The drive motor is fixed to the upper surface of the L-shaped plate and the driving end is coaxially fixed with the driving wheel. A transmission belt is wound between the driving wheel and the driven wheel, and the detection lens is installed on the transmission belt.

[0018] The top wall of the L-shaped plate is fixedly connected to the first sensor, the detection lens is connected to the sensing sheet, and the transmission belt drives the detection lens to move to the end of the L-shaped plate and the sensing sheet moves into the sensing area of ​​the first sensor.

[0019] As a further improvement of the present invention, the pressure plate assembly includes a first plate body and a second plate body, and the first plate body and the second plate body enclose a temperature regulating liquid path.

[0020] As a further improvement of the present invention, the temperature-adjusting liquid path is formed on the upper surface of the second plate body, and the first plate body covers the upper surface of the second plate body to seal the temperature-adjusting liquid path;

[0021] The second plate body forms a liquid through hole connected to the temperature control liquid circuit, the mounting plate forms a liquid channel and the top surface and side surface of the mounting plate respectively form a first hole position and a second hole position of the liquid channel, the second hole position is connected to the liquid through hole through a hose, and an insulation plate is provided between the top end of the first plate body and the mounting seat.

[0022] As a further improvement of the present invention, the driving mechanism passes vertically downward through the top plate and forms a support seat on the side wall, and the support seat is provided with a mounting hole for the hose to pass through.

[0023] As a further improvement of the present invention, the transfer seat includes a first transfer seat and a second transfer seat, the first transfer seat is arranged above the second transfer seat, the second transfer seat slides with the base plate through a slider and a guide rail, the base plate is provided with a slide rail parallel to the guide rail, and the first transfer seat slides with the base plate through the slide rail.

[0024] Compared with the prior art, the present invention has the following advantages: the inspection station includes a mounting frame, a downward pressure detection mechanism, a visual inspection mechanism, and a test seat, wherein the downward pressure detection mechanism cooperates with the test seat to perform temperature variation detection on the chip. The mounting frame of the inspection station is provided with a back plate for the transmission mechanism to pass through, and the visual inspection mechanism is assembled on the back plate and located above the point where the transmission mechanism passes through. When the transmission mechanism is used to transport the chip to the test seat, when the transmission mechanism moves below the visual inspection mechanism, the visual inspection mechanism inspects the chip and transports the chip without abnormality to the test seat. The driving mechanism constituting the downward pressure detection mechanism drives the pressure plate assembly to move downward as a whole until it fits the chip. The buffer portion connected between the pressure plate assembly and the driving mechanism effectively buffers the pressure applied to the chip during the downward pressure of the pressure plate assembly. Specifically, the buffer portion is surrounded by an air cavity formed by elastic members, and gas is introduced into the air cavity so that a mutual force is applied between the movable block constituting the buffer portion and the elastic member. Compared with a rigid connection method, the instantaneous force applied to the chip surface during the downward pressure of the pressure plate assembly is effectively reduced, thereby effectively avoiding damage to the chip caused by excessive force applied by the pressure plate assembly to the chip surface. Furthermore, the chip that has undergone temperature testing is transferred again to the transmission mechanism to drive the chip to move away from the test seat, and when the transmission mechanism drives the chip through the backplane, the visual inspection mechanism can again perform visual inspection on the chip surface to ensure that the chip surface is in an undamaged state. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 This is a schematic diagram of the overall structure of the chip transmission and detection equipment in the present invention;

[0026] Figure 2 for Figure 1 Schematic diagram of the cross section along FF direction;

[0027] Figure 3 This is a structural diagram illustrating the coordination relationship between the buffer portion and the pressure plate assembly in the present invention;

[0028] Figure 4 for Figure 3 Schematic diagram of the cross section along EE direction;

[0029] Figure 5for Figure 1 Enlarged view of part A in the middle;

[0030] Figure 6 for Figure 1 Enlarged view of middle part B;

[0031] Figure 7 for Figure 2 Enlarged view of middle C part;

[0032] Figure 8 for Figure 4 Enlarged view of part D in the middle. DETAILED DESCRIPTION

[0033] The present invention is described in detail below with reference to the various embodiments shown in the accompanying drawings, but it should be noted that these embodiments are not limitations of the present invention, and any equivalent transformations or substitutions in functions, methods, or structures made by ordinary technicians in this field based on these embodiments are all within the scope of protection of the present invention.

[0034] Ginseng Figures 1 to 8 As shown, a chip transmission and detection device disclosed by the present invention comprises a transmission mechanism 1 and a detection station, wherein the detection station comprises a mounting frame 2, a downward pressure detection mechanism 4, a visual detection mechanism 3 and a test seat 61, wherein the downward pressure detection mechanism 4 cooperates with the test seat 61 to perform temperature change detection on the chip. The mounting frame 2 of the detection station is provided with a back plate 23 for the transmission mechanism 1 to pass through, and the visual detection mechanism 3 is assembled on the back plate 23 and is located above the point where the transmission mechanism 1 passes through. In the process of using the transmission mechanism 1 to transport the chip to the test seat 61, when the transmission mechanism 1 moves below the visual detection mechanism 3, the visual detection mechanism 3 inspects the chip and transports the chip without abnormality to the test seat 61. The driving mechanism 44 constituting the downward pressure detection mechanism 4 drives the pressure plate assembly 41 to move downward as a whole to fit the chip. The buffer portion 5 connected between the pressure plate assembly 41 and the driving mechanism 44 effectively buffers the pressure applied to the chip during the downward pressure of the pressure plate assembly 41. Specifically, the buffer portion 5 is surrounded by an air cavity 522 by an elastic member 521. The buffer portion 5 also includes a floating assembly 54, which is connected between the drive mechanism 44 and the pressure plate assembly 41. Gas is introduced into the air cavity 522 to exert a mutual force between the floating assembly 54 and the elastic member 521. Compared with a rigid connection method, this effectively reduces the instantaneous force applied to the chip surface during the downward pressure of the pressure plate assembly 41, thereby effectively preventing damage to the chip caused by excessive force applied by the pressure plate assembly 41. Furthermore, the chip that has undergone temperature testing is transferred again to the transmission mechanism 1 to drive the chip to move away from the test socket 61. When the transmission mechanism 1 drives the chip through the backplane 23, the visual inspection mechanism 3 can again perform a visual inspection of the chip surface to ensure that the chip surface is in an undamaged state.

[0035] Ginseng Figures 1 to 8 As shown, the chip transmission and detection equipment in this embodiment includes a transmission mechanism 1 and a detection station, the detection station includes a mounting frame 2, a downward pressure detection mechanism 4, a visual detection mechanism 3 and a test seat 61, the transmission mechanism 1 transfers the chip to the test seat 61; the visual detection mechanism 3 is assembled on the mounting frame 2, and the transmission mechanism 1 drives the chip through the mounting frame 2 to move to the test seat 61, passing through the visual detection mechanism 3, and the visual detection mechanism 3 is displaced along the movement direction perpendicular to the transmission mechanism 1 to perform visual inspection on various parts of the chip surface; the downward pressure detection mechanism 4 includes a driving mechanism 44 and a pressure plate assembly 41, the pressure plate assembly 41 is connected to the driving mechanism 44 through a buffer part 5, and the buffer part 5 is surrounded by an elastic member 521 to form an air cavity 522, and when the pressure plate assembly 41 contacts the chip, the gas introduced into the air cavity 522 exerts an interaction force between the elastic member 521 and the pressure plate assembly 41.

[0036] Ginseng Figure 3 、 Figure 4 and Figure 8 As shown, the buffer portion 5 includes a first mounting block 52 and a second mounting block 53, and a cavity (not marked) is formed between the first mounting block 52 and the second mounting block 53. The elastic member 521 is formed as a sheet-like member and is clamped between the first mounting block 52 and the second mounting block 53. The first mounting block 52 is fixed to the bottom end of the driving mechanism 44. The air cavity 522 is formed by separating the internal space of the cavity and is formed by the first mounting block 52 and the elastic member 521. The buffer portion 5 also includes a floating assembly 54. The floating assembly 54 includes a connecting seat 541 and a movable block 542. The connecting seat 541 is fixed to the upper surface of the pressure plate assembly 41, and the bottom end of the movable block 542 is fixed to the connecting seat 541. The top end of the movable block 542 passes through the bottom wall of the second mounting block 53 and is located in the cavity. A protrusion 5421 is formed on the side wall of one end of the movable block 542 passing through the cavity. The protrusion 5421 overlaps the bottom surface of the air cavity 522 surrounded by the second mounting block 53. The buffer portion 5 also has a mounting plate 51, which forms an air path 513 along the length direction. The top wall of the first mounting block 52 forms an air inlet hole 523, which is connected to the air path 513. The gas enters the air cavity 522 through the air path 513 and the air inlet hole 523. The elastic member 521 is selected as a silicone sheet, and the top edge of the movable block 542 is formed as a rounded chamfer (not marked).

[0037] Specific combination Figure 4 and Figure 8As shown, in this embodiment, the bottom wall of the first mounting block 52 and the top wall of the second mounting block 53 are in contact with each other. An elastic member 521, optionally a silicone sheet, is sandwiched between the first and second mounting blocks 52, 53, and forms an air cavity 522 with a groove (not labeled) formed in the bottom wall of the first mounting block 52. It should be noted that the air inlet (not labeled) of the air path 513 is formed on a side wall of the mounting plate 51 perpendicular to its length. After entering the air path 513, gas flows through the air inlet 523 into the air cavity 522. More specifically, the amount of gas entering the air cavity 522 is automatically adjustable. When the drive mechanism 44 drives the pressure plate assembly 41 into contact with the chip, an interaction force is generated between the top of the movable block 542 and the elastic member 521, which forms an airbag. This effectively controls the pressure applied by the pressure plate assembly 41 to the chip, preventing damage to the chip due to excessive pressure. It should be noted that the top wall of the connecting seat 541 forms a positioning groove 5411, and the bottom end of the movable block 542 is embedded in the positioning groove 5411 and fixed. In this embodiment, the first mounting block 52 and the second mounting block 53 are detachably connected by bolts (not shown). When the elastic member 521 approaches its fatigue limit after a period of operation, the bolts between the first and second mounting blocks 52, 53 are loosened and the elastic member 521 clamped between the first and second mounting blocks 52, 53 is replaced. Compared with conventional spring buffer structures, this has the advantages of simple structure and easy maintenance.

[0038] Ginseng Figure 3 、 Figure 4 and Figure 8 As shown, the pressure plate assembly 41 includes a first plate 411 and a second plate 412, which enclose a temperature-regulating liquid path 413. The temperature-regulating liquid path 413 is formed on the upper surface of the second plate 412. The first plate 411 covers the upper surface of the second plate 412 to seal the temperature-regulating liquid path 413. The second plate 412 defines a liquid path hole 414 that communicates with the temperature-regulating liquid path 413. The mounting plate 51 forms a liquid path (not labeled), with the top and side surfaces of the mounting plate 51 forming a first hole 511 and a second hole 512 of the liquid path, respectively. The second hole 512 is connected to the liquid path hole 414 via a flexible hose. A heat shield 42 is provided between the top of the first plate 411 and the connecting seat 541. The drive mechanism 44 extends vertically downward through the top plate 22 of the mounting frame 2 and forms a support seat 421 on the side wall. The support seat 421 defines a mounting hole 422 for the flexible hose to pass through.

[0039] It should be noted that liquids of varying temperatures are introduced into the temperature-regulating liquid path 413 formed within the pressure plate assembly 41 to alter the temperature of the pressure plate assembly 41. This, when the pressure plate assembly 41 is pressed down to contact the chip, simulates the varying temperatures of the chip's operating environment. Furthermore, in conjunction with the first hole 511 and second hole 512 formed in the mounting plate 51, a hose (not shown) is first connected to the first hole 511 and then into the liquid path. The liquid then flows through the hose (not shown) via the second hole 512 and the liquid through-hole 414 into the temperature-regulating liquid path 413. In this embodiment, the temperature-regulating liquid path 413 is formed in a spiral configuration on the upper surface of the second plate 412, ensuring that the temperature-regulating liquid introduced into the temperature-regulating liquid path 413 uniformly cools the second plate 412. The external fluid path is connected to the mounting plate 51. When the fluid path is connected to the first hole 511 via a hose (not shown), the hose can first be passed through the mounting hole 422 formed in the support base 421 to provide support for the hose. Furthermore, the mounting hole 422 can also be used to guide electrical wires or other circuits, depending on actual production needs. Furthermore, the drive mechanism 44 can be optionally configured as a pneumatic cylinder, with its driving end passing through the top plate 22 to drive the lifting and lowering of the pressure plate assembly 41. Alternatively, it can be a conventional screw and threaded rod that drive the lifting and lowering of the pressure plate assembly 41, or any other structure that can achieve the lifting function, which will not be described in detail here.

[0040] Ginseng Figures 1 to 8 As shown, the mounting frame 2 includes two groups of support rods 21 symmetrically arranged on both sides of the length direction of the test seat 61. The top ends of the support rods 21 are vertically upward and connected to the top plate 22. The support rods 21 are fixed to the back plate 23 perpendicular to the movement direction of the transmission mechanism 1. The visual inspection mechanism 3 includes a translation mechanism 31 and a detection lens 32. The translation mechanism 31 drives the detection lens 32 to move along the length direction perpendicular to the transmission mechanism 1; the back plate 23 is provided with a clearance port 231, and the transmission mechanism 1 is translated to the top of the test seat 61 through the clearance port 231. When the chip passes through the clearance port 231 with the transmission mechanism 1, the detection lens 32 is driven by the translation mechanism 31 to move and perform visual inspection on the chip. Specifically, the back plate 23 is fixedly connected to the L-shaped plate 232 along the length direction, and the top and bottom surfaces of the L-shaped plate 232 are arranged perpendicular to the plane where the back plate 23 is located; the translation mechanism 31 includes a driving wheel 311, a driven wheel 312 and a driving motor 314, the driving wheel 311 and the driven wheel 312 are rotatably connected to the lower surface of the L-shaped plate 232, the driving motor 314 is fixedly connected to the upper surface of the L-shaped plate 232 and the driving end is coaxially fixed with the driving wheel 311, a transmission belt 313 is wound around the driving wheel 311 and the driven wheel 312, and the detection lens 32 is installed on the transmission belt 313; the side wall of the L-shaped plate 232 is fixedly connected to the first sensor 233, the detection lens 32 is connected to the sensing plate 321, and the transmission belt 313 drives the detection lens 32 to move to the end of the L-shaped plate 232 and the sensing plate 321 moves to the sensing area of ​​the first sensor 233.

[0041] It should be noted that the detection lens 32 is specifically mounted on the transmission belt 313 via a clamping seat (not labeled). In this embodiment, the driving pulley 311 and the driven pulley 312 are rotatably connected to the bottom surface of the L-shaped plate 232 to achieve the purpose of distributing the transmission belt 313 in a posture parallel to the back plate 23, thereby enabling the detection lens 32 to inspect the surface of the chip in a state perpendicular to the chip. More specifically, the clamping seat (not labeled) is connected to a linear motor (not labeled) on the side away from the transmission belt 313. The driving end of the linear motor is connected to the detection lens 32. The transmission belt 313 drives the detection lens 32 to move in a direction perpendicular to the transmission mechanism 1 so that the detection lens 32 can be directly above the chip. The detection lens 32 is then driven by the linear motor to rise and fall so that the detection lens 32 can inspect the chip surface. Specifically, when the transmission mechanism 1 drives the chip to move to the bottom of the visual inspection mechanism 3, the transmission mechanism 1 can be suspended. After the inspection lens 32 completes the inspection of the chip, the transmission mechanism 1 is instructed to transmit the chip that has passed the inspection to the test seat 61, so as to screen out damaged chips and not proceed to the next test, so as to improve the chip inspection efficiency to a certain extent.

[0042] Ginseng Figures 1 to 8 As shown, the chip transmission and detection equipment also includes: a workbench 6, a test seat 61 detachably connected to the workbench 6, the aforementioned support rod 21 is vertically fixed to the upper surface of the workbench 6, the transmission mechanism 1 includes a guide component 11 and a transmission component 14, the guide component 11 includes a guide rail 111 and a slider 112 that slides with the guide rail 111, and the guide rail 111 is arranged in the gap between the support rod 21 and the test seat 61; the transmission component 12 includes a base plate 13 and a transmission component 14, the slider 112 is fixed to the lower surface of the base plate 13, the transmission component 14 is detachably connected to the upper surface of the base plate 13, and the transmission seat 14 has a plurality of accommodating grooves 143 adapted to the chip. Furthermore, the transfer assembly 14 includes a first transfer seat 141 and a second transfer seat 142. The first transfer seat 141 is arranged above the second transfer seat 142. The second transfer seat 142 is fixed to the base plate 13. The base plate 13 slides with the guide rail 111 through the slider 112. The upper surface of the base plate 13 is parallel to the guide rail 111 and is provided with a slide rail 114. The first transfer seat 141 slides with the base plate 13 through the slide rail 114.

[0043] Specifically, the chip to be tested is placed in the receiving slot 143 of the second transfer seat 142. The first transfer seat 141 is unloaded. A linear motor (not labeled) drives the base plate 13 to move along the length of the guide rail 111 until it passes under the inspection lens 32. The inspection lens 32 then inspects the chip to be tested on the second transfer seat 142. The base plate 13 then continues to move to the second transfer seat 142 and directly above the test seat 61. At this point, a linear motor (not labeled) drives the first transfer seat 141 to translate along the guide rail 114 to directly above the second transfer seat 142. At this point, the test fixture (not labeled) connected to the pressure plate assembly 41 of the downward pressure inspection mechanism 4 brings the inspected chip to a high point. The drive mechanism 44 drives the pressure plate assembly 41 and the test fixture downward until the inspected chip is placed in the receiving slot 143 of the first transfer seat 141. The first transfer seat 141 then moves in the opposite direction to clear the space above the second transfer seat 142. Then the pressure plate assembly 41 is moved downward to allow the test fixture to pick up the chip to be tested in the receiving groove 143 opened by the second transfer seat 142, and then the bottom plate 13 is moved as a whole to make way for the space above the test seat 61. The test fixture continues to move downward with the pressure plate assembly 41 to place the chip into the test seat 61. The pressure plate assembly 41 continues to press down until it is in place, and the chip is tested by the test fixture and the test seat 61.

[0044] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the present invention. They are not intended to limit the scope of protection of the present invention. Any equivalent implementation methods or changes that do not deviate from the technical spirit of the present invention should be included in the scope of protection of the present invention.

[0045] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0046] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A chip transmission detection device, characterized in that: include: A transmission mechanism and a testing station, wherein the testing station includes a mounting frame, a downward pressure testing mechanism, a visual testing mechanism, and a test seat, and the transmission mechanism transfers the chip to the test seat; The visual inspection mechanism is mounted on the mounting frame. The chip passes through the visual inspection mechanism when the transmission mechanism drives the chip through the mounting frame to move to the test seat. The visual inspection mechanism moves along a direction perpendicular to the movement direction of the transmission mechanism to perform visual inspection on various parts of the chip surface. The pressure detection mechanism includes a driving mechanism and a pressure plate assembly, wherein the pressure plate assembly is connected to the driving mechanism via a buffer portion, wherein an air cavity is formed by an elastic member within the buffer portion, and when the pressure plate assembly contacts the chip, the gas introduced into the air cavity exerts an interaction force between the elastic member and the pressure plate assembly; The buffer portion includes a first mounting block and a second mounting block, wherein a cavity is enclosed between the first mounting block and the second mounting block, the elastic member is formed as a sheet and clamped between the first mounting block and the second mounting block, the first mounting block is fixed to the bottom end of the driving mechanism, and the air cavity is formed by separating the internal space of the cavity and enclosed by the first mounting block and the elastic member; The buffer portion further includes a floating assembly, the floating assembly including a connecting seat and a movable block, the connecting seat being fixedly connected to the upper surface of the pressure plate assembly, the bottom end of the movable block being fixedly connected to the connecting seat, the top end of the movable block passing through the bottom wall of the second mounting block and being located in the cavity, a protrusion being formed on the side wall of one end of the movable block passing through the cavity, and the protrusion being overlapped on the bottom wall of the second mounting block when the pressure plate assembly is not under force; The buffer portion also has a mounting plate, which forms an air path along the length direction. The top wall of the first mounting block forms an air inlet hole, which is connected to the air path. The gas enters the air cavity through the air path and the air inlet hole. The elastic member is selected as a silicone sheet, and the top edge of the movable block is formed as a rounded chamfer.

2. The chip transmission detection equipment according to claim 1, characterized in that: The mounting frame includes two sets of support rods symmetrically arranged on both sides of the length direction of the test seat, the top ends of the support rods are vertically upward and connected to the top plate, and the support rods are fixed to the back plate perpendicular to the length direction of the transmission mechanism. The visual inspection mechanism includes a translation mechanism and an inspection lens, and the translation mechanism drives the inspection lens to move in a direction perpendicular to the length direction of the transmission mechanism; The back plate is provided with a clearance opening, and the transmission mechanism is translated to the top of the test seat through the clearance opening. When the chip passes through the clearance opening with the transmission mechanism, the detection lens is driven by the translation mechanism to move and perform visual inspection on the chip.

3. The chip transmission detection equipment according to claim 2, characterized in that: Also includes: A workbench, wherein the test seat is detachably connected to the workbench, the support rod is vertically fixed to the upper surface of the workbench, the transmission mechanism includes a guide assembly and a transmission assembly, the guide assembly includes a guide rail and a slider slidably engaged with the guide rail, and the guide rail is provided in the gap between the support rod and the test seat; The transfer assembly includes a base plate and a transfer seat. The slider is fixed to the lower surface of the base plate. The transfer seat is detachably connected to the upper surface of the base plate. The transfer seat is provided with a plurality of accommodating grooves adapted to the chips.

4. The chip transmission detection equipment according to claim 2, characterized in that: The back plate is fixedly connected to the L-shaped plate along the length direction, and the top and bottom surfaces of the L-shaped plate are arranged perpendicular to the plane where the back plate is located; The translation mechanism includes a driving wheel, a driven wheel, and a drive motor. The driving wheel and the driven wheel are rotatably connected to the lower surface of the L-shaped plate. The drive motor is fixed to the upper surface of the L-shaped plate and the driving end is coaxially fixed with the driving wheel. A transmission belt is wound between the driving wheel and the driven wheel, and the detection lens is installed on the transmission belt. The top wall of the L-shaped plate is fixedly connected to the first sensor, the detection lens is connected to the sensing sheet, and the transmission belt drives the detection lens to move to the end of the L-shaped plate and the sensing sheet moves into the sensing area of ​​the first sensor.

5. The chip transmission detection equipment according to claim 4, characterized in that: The pressure plate assembly includes a first plate body and a second plate body, and the first plate body and the second plate body enclose a temperature regulating liquid path.

6. The chip transmission detection equipment according to claim 5, characterized in that: The temperature-adjusting liquid path is formed on the upper surface of the second plate, and the first plate covers the upper surface of the second plate to seal the temperature-adjusting liquid path; The second plate body forms a liquid through hole connected to the temperature control liquid circuit, the mounting plate forms a liquid channel and the top surface and side surface of the mounting plate respectively form a first hole position and a second hole position of the liquid channel, the second hole position is connected to the liquid through hole through a hose, and an insulation plate is provided between the top end of the first plate body and the mounting seat.

7. The chip transmission detection equipment according to claim 6, characterized in that: The driving mechanism passes through the top plate vertically downward and forms a support seat on the side wall. The support seat is provided with a mounting hole for the hose to pass through.

8. The chip transmission detection equipment according to claim 3, characterized in that: The transfer seat includes a first transfer seat and a second transfer seat, the first transfer seat is arranged above the second transfer seat, the second transfer seat is fixed to the base plate, the base plate slides with the workbench through sliders and guide rails, the base plate is provided with a slide rail parallel to the guide rail, and the first transfer seat slides with the base plate through the slide rail.

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