A semiconductor testing apparatus

Abstract

The application provides a semiconductor testing device, which comprises a workbench, a testing assembly arranged above the testing lower mold through a mounting frame, the testing assembly comprising a driving mechanism and a floating testing mechanism, the driving mechanism being connected with the floating testing mechanism after vertically penetrating through the mounting frame from top to bottom; the floating testing mechanism comprising a pressing plate assembly and a buffer assembly, the pressing plate assembly being connected to the bottom end of the buffer assembly, the buffer assembly comprising a mounting plate, a buffer piece and a floating assembly, the buffer cavity being formed in the buffer piece through elastic pieces, the top end of the floating assembly being embedded in the buffer piece and the bottom end being connected to the pressing plate assembly; the mounting plate forming an air path communicating with the buffer cavity, the top end of the floating assembly rising in the buffer piece and contacting the elastic pieces when the pressing plate assembly abuts against the chip contained in the testing lower mold. The application is used to solve the problem that the buffer structure between the pressing plate and the driving mechanism is relatively complex in the prior art, and the production and detection efficiency of the chip is affected due to the need for frequent replacement and maintenance.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor production testing, and in particular to a semiconductor testing device. BACKGROUND

[0002] Before chips are put into use, their performance needs to be detected, wherein a three-temperature testing machine is a device for testing semiconductor chips or related elements under different temperature environments, which simulates low temperature, normal temperature and high temperature three temperature environments to evaluate the performance and service life of the chips under various working conditions, so as to ensure that the chips can maintain stable performance under various temperature changes in actual application after being packaged and sold. Specifically, the chip is placed in a chip fixture, and the three-temperature testing machine has a lifting pressing plate that presses the upper surface of the chip, and the chip is heat-transferred by the pressing plate to achieve the effect of simulating the environmental temperature.

[0003] The pressing plate of the three-temperature testing machine is driven by a driving mechanism (such as a pneumatic cylinder) to vertically lift and press the upper surface of the chip. Since the size, volume and precision of the chip are different, the pressing force that the chip can withstand is different. Pressing the chip with consistent pressing force may cause damage to the chip. To avoid the problem of the chip being damaged due to the pressing force, the pressing plate needs to be equipped with a buffer structure to avoid damage to the chip. The buffer structure in the prior art usually includes a guide rod and a spring, which plays a buffering effect through compression and extension of the spring. To maintain uniform buffering effect on the pressing plate, not less than two springs need to be uniformly arranged between the driving mechanism and the pressing plate. First, due to the limitation of the structure of the spring, the spring can only achieve vertical extension and contraction when used in combination with the guide rod. However, the introduction of the guide rod increases the complexity of the buffer structure. Further, the service life of the spring is limited due to its own fatigue, and it needs to be replaced and maintained more frequently, thereby affecting the production and detection efficiency of the chip.

[0004] Therefore, it is necessary to improve the semiconductor testing device in the prior art to solve the above problems. It should be noted that the above introduction to the background art is only for the convenience of clearly and completely describing the technical solutions of the present application, and for the convenience of understanding by those skilled in the art. The above technical solutions cannot be considered as known by those skilled in the art only because they are described in the background art part of the present application. SUMMARY

[0005] The present application aims to disclose a semiconductor testing device to solve the problem of the prior art that the buffer structure between the pressing plate and the driving mechanism is relatively complex, and the need for frequent replacement and maintenance affects the production and detection efficiency of the chip.

[0006] In order to achieve the above object, the application provides a semiconductor testing device, comprising a workbench provided with a testing lower mold for accommodating a chip, a testing assembly arranged on the workbench through a mounting frame, the testing assembly comprising a driving mechanism and a floating testing mechanism, the driving mechanism vertically penetrating the mounting frame from top to bottom and being connected with the floating testing mechanism;

[0007] The floating testing mechanism comprises a pressing plate assembly and a buffer assembly, the top end of the buffer assembly being connected with the driving mechanism, the pressing plate assembly being connected to the bottom end of the buffer assembly, the buffer assembly comprising a mounting plate, a buffer piece and a floating assembly, the buffer piece being surrounded by an elastic piece to form a buffer cavity, the top end of the floating assembly being embedded in the buffer piece and the bottom end being connected to the pressing plate assembly;

[0008] The mounting plate forms an air path in communication with the buffer cavity, and when the pressing plate assembly abuts against the chip accommodated in the testing lower mold, the top end of the floating assembly rises in the buffer piece and is in contact with the elastic piece.

[0009] As a further improvement of the application, the buffer piece comprises a first mounting block and a second mounting block, a cavity being formed between the first mounting block and the second mounting block, the elastic piece being formed as a sheet and being clamped between the first mounting block and the second mounting block, the first mounting block being fixedly connected to the mounting plate, the buffer cavity being formed by the internal space of the cavity and being surrounded by the first mounting block and the elastic piece;

[0010] The floating assembly comprises a connecting seat and a movable block, the connecting seat being fixedly connected to the upper surface of the pressing plate assembly, the bottom end of the movable block being fixedly connected to the connecting seat, the top end of the movable block being located in the cavity through the bottom wall of the second mounting block, a protruding portion being formed at the side wall of one end of the movable block in the cavity, the protruding portion being lapped on the bottom wall of the cavity formed by the second mounting block.

[0011] As a further improvement of the application, the floating testing mechanism further comprises a heat insulation plate, the top wall of the heat insulation plate being fixedly connected to the connecting seat, the top surface of the connecting seat being provided with a positioning groove formed as a ring, the top end of the movable block being embedded in the positioning groove and being fixed;

[0012] The bottom surface of the heat insulation plate is connected to the pressing plate assembly, the pressing plate assembly comprising a first plate body and a second plate body, a temperature adjusting liquid path being formed between the first plate body and the second plate body.

[0013] As a further improvement of the application, the temperature adjusting liquid path is formed on the upper surface of the second plate body, the temperature adjusting liquid path extending spirally from the center point of the second plate body to the side wall of the second plate body, the first plate body covering the upper surface of the second plate body to seal the temperature adjusting liquid path;

[0014] The second plate body forms a liquid passage hole in communication with the temperature-adjusting liquid passage, the mounting plate forms a liquid passage channel and first and second hole positions of the liquid passage channel are formed by the top surface and the side surface of the mounting plate respectively, and the second hole position is connected with the liquid passage hole through a hose.

[0015] As a further improvement of the present application, the gas passage is formed in the mounting plate along the length direction, the top wall of the first mounting block forms an air inlet hole, the air inlet hole and the gas passage are in communication with each other, the gas is introduced into the buffer cavity through the gas passage and the air inlet hole, the elastic member is selected as a silica gel sheet, and a round chamfer is formed at the top end edge of the movable block.

[0016] As a further improvement of the present application, the mounting frame comprises a guide plate and two groups of supporting rods, the two groups of supporting rods are distributed on both sides of the workbench along the length direction of the test lower mold, and the guide plate is fixedly connected to the top ends of the two groups of supporting rods.

[0017] The driving mechanism comprises a driving motor, a transmission mechanism and a lifting device, the lifting device is connected to the floating test mechanism after penetrating through the guide plate, and the driving motor drives the transmission mechanism to drive the floating test mechanism to displace along a direction perpendicular to the plane where the workbench is located.

[0018] As a further improvement of the present application, the lifting device comprises a lifting column and a screw rod, the screw rod is axially arranged in the lifting column, and the lifting column and the screw rod are threadedly matched;

[0019] The transmission mechanism comprises a driving wheel and a driven wheel, the driving end of the driving motor is coaxially fixed with the driving wheel, a transmission belt is wound around the driving wheel and the driven wheel, and the driven wheel is coaxially fixed with the screw rod.

[0020] The lifting column is connected with the floating test mechanism after penetrating through the guide plate vertically downward, the side wall of the lifting column is provided with a guide rail along the height direction, and the guide plate has a guide groove which is adapted to the guide rail and relatively slides.

[0021] As a further improvement of the present application, the top wall of the guide plate is fixedly connected with a distance measuring mechanism, the distance measuring mechanism comprises a mounting rod and first and second sensors connected to the mounting rod, the side wall of the lifting column is fixedly connected with a baffle, and the baffle reciprocally rises and falls in the sensing area of the first and second sensors.

[0022] As a further improvement of the present application, the test lower mold is detachably connected to the workbench, the top wall of the test lower mold forms a positioning pin, and the lower surface of the second plate body is detachably connected with a test fixture which is adapted to the test lower mold.

[0023] As a further improvement of the present application, a pressure sensor is arranged between the lifting column and the floating test mechanism.

[0024] Compared with the prior art, the application has the advantages that the floating test mechanism has a buffering assembly, the mounting plate and the buffering piece of the buffering assembly are in a fixed state, and the buffering piece is surrounded by the elastic piece to form a buffering cavity, and the top end of the floating assembly connected with the pressing plate assembly is inserted into the buffering piece. The gas path formed in the mounting plate injects gas into the buffering cavity, when the pressing plate assembly is pressed to contact the chip placed on the test lower mold, the floating assembly is subjected to force to rise and the elastic piece is elastically deformed, and because the buffering cavity is injected with gas, the elastic piece forms a buffering cavity between the floating assembly and the buffering piece, compared with the conventional rigid structure, the pressure applied by the pressing plate assembly to the surface of the chip is effectively reduced. Further, the gas bag with buffering effect is formed by injecting gas into the buffering cavity surrounded by the elastic piece and the buffering piece, while having good buffering effect, only the elastic piece itself needs to be replaced and maintained to maintain the normal working state of the floating test mechanism, effectively simplifying the buffering structure and reducing the situation that the detection of the chip and the production efficiency are affected due to the damage of the buffering structure. BRIEF DESCRIPTION OF DRAWINGS

[0025] Figure 1 The structure schematic diagram is used to embody the floating test mechanism and the workbench assembly mode of the semiconductor test device of the application;

[0026] Figure 2 The sectional view schematic diagram is used to embody the cooperation relationship between the driving mechanism and the floating test mechanism in the application;

[0027] Figure 3 The specific structure schematic diagram of the floating test mechanism is used to embody the specific structure schematic diagram of the floating test mechanism in the application;

[0028] Figure 4 The sectional view schematic diagram is used to embody the cooperation relationship between the driving mechanism and the floating test mechanism in the application; Figure 3 The sectional view schematic diagram is used to embody the cooperation relationship between the driving mechanism and the floating test mechanism in the application;

[0029] Figure 5 The specific structure schematic diagram of the floating test mechanism is used to embody the specific structure schematic diagram of the floating test mechanism in the application;

[0030] Figure 6 The specific structure schematic diagram of the floating test mechanism is used to embody the specific structure schematic diagram of the floating test mechanism in the application;

[0031] Figure 7 The sectional view schematic diagram is used to embody the cooperation relationship between the driving mechanism and the floating test mechanism in the application; Figure 2 The sectional view schematic diagram is used to embody the cooperation relationship between the driving mechanism and the floating test mechanism in the application;

[0032] Figure 8 The sectional view schematic diagram is used to embody the cooperation relationship between the driving mechanism and the floating test mechanism in the application; Figure 4 The sectional view schematic diagram is used to embody the cooperation relationship between the driving mechanism and the floating test mechanism in the application; DETAILED DESCRIPTION

[0033] The present application will be described in detail below with reference to the embodiments shown in the drawings, but it should be noted that these embodiments are not limiting to the present application, and equivalent transformations or substitutions of function, method or structure made by those skilled in the art based on these embodiments are within the protection scope of the present application.

[0034] Referring to FIG. 1, a semiconductor testing device is shown, which comprises a floating testing mechanism 4, a driving mechanism 6, a testing lower mold 2 and a testing assembly. Figures 1 to 8 As shown in FIG. 1, a semiconductor testing device is disclosed, which has a floating testing mechanism 4 compared with the prior art, the mounting plate 51 and the buffer piece 52 constituting the buffer assembly 5 are in a fixed state, and the buffer piece 52 is surrounded by the elastic piece 523 to form a buffer cavity 524 inside, and the top end of the floating assembly 53 connected to the pressing plate assembly 41 is inserted into the buffer piece 52. The gas path 513 formed in the mounting plate 51 injects gas into the buffer cavity 524, when the pressing plate assembly 41 is pressed to contact the chip (not shown) placed in the testing lower mold 2, the floating assembly 53 is subjected to force to produce a rising trend, and the elastic piece 523 produces a certain elastic deformation, and because the buffer cavity 524 is injected with gas, the elastic piece 523 forms a buffer gas cavity between the floating assembly 53 and the buffer piece 52, which effectively reduces the pressure applied to the chip surface by the pressing plate assembly 41 compared with the conventional rigid structure. Further, the buffer cavity 524 surrounded by the elastic piece 523 and the buffer piece 52 is filled with gas to form an air bag with a buffering effect, which has a good buffering effect, and only needs to replace and maintain the elastic piece 523 itself to maintain the normal working state of the floating testing mechanism 4 as a whole, which effectively simplifies the buffering structure and reduces the impact on chip detection and production efficiency due to damage to the buffering structure compared with the prior art based on the spring to achieve the buffering effect of the pressing plate.

[0035] Referring to FIG. 1, a semiconductor testing device is shown, which comprises a floating testing mechanism 4, a driving mechanism 6, a testing lower mold 2 and a testing assembly. Figures 1 to 8 As shown in FIG. 1, a semiconductor testing device is disclosed, which has a floating testing mechanism 4 compared with the prior art, the mounting plate 51 and the buffer piece 52 constituting the buffer assembly 5 are in a fixed state, and the buffer piece 52 is surrounded by the elastic piece 523 to form a buffer cavity 524 inside, and the top end of the floating assembly 53 connected to the pressing plate assembly 41 is inserted into the buffer piece 52. The gas path 513 formed in the mounting plate 51 injects gas into the buffer cavity 524, when the pressing plate assembly 41 is pressed to contact the chip (not shown) placed in the testing lower mold 2, the floating assembly 53 is subjected to force to produce a rising trend, and the elastic piece 523 produces a certain elastic deformation, and because the buffer cavity 524 is injected with gas, the elastic piece 523 forms a buffer gas cavity between the floating assembly 53 and the buffer piece 52, which effectively reduces the pressure applied to the chip surface by the pressing plate assembly 41 compared with the conventional rigid structure. Further, the buffer cavity 524 surrounded by the elastic piece 523 and the buffer piece 52 is filled with gas to form an air bag with a buffering effect, which has a good buffering effect, and only needs to replace and maintain the elastic piece 523 itself to maintain the normal working state of the floating testing mechanism 4 as a whole, which effectively simplifies the buffering structure and reduces the impact on chip detection and production efficiency due to damage to the buffering structure compared with the prior art based on the spring to achieve the buffering effect of the pressing plate.

[0036] Ginseng Figures 3 to 8 As shown, the buffer member 52 includes a first mounting block 521 and a second mounting block 522, and a cavity is formed between the first mounting block 521 and the second mounting block 522. The elastic member 523 is formed as a sheet member and is clamped between the first mounting block 521 and the second mounting block 522. The first mounting block 521 is fixed to the mounting plate 51, and the buffer cavity 524 is formed by separating the internal space of the cavity and is formed by the first mounting block 521 and the elastic member 523; the floating assembly 53 includes a connecting seat 531 and a movable block 532, the connecting seat 531 is fixed to the upper surface of the pressure plate assembly 41, and the bottom end of the movable block 532 is fixed to the connecting seat 531, and the top end of the movable block 532 passes through the bottom wall of the second mounting block 522 and is located in the cavity. A protrusion 5321 is formed on the side wall of one end of the movable block 532 passing through the cavity, and the protrusion 5321 overlaps the bottom wall of the cavity surrounded by the second mounting block 522.

[0037] Specific reference Figure 7 As shown, the test lower mold 2 is detachably connected to the workbench 1. The top wall of the test lower mold 2 forms a positioning pin 21. The lower surface of the pressure plate assembly 41 is detachably connected to a test fixture (not shown) that is compatible with the test lower mold 2. Specifically, the test lower mold 2 is provided with a receiving port 24 for placing the chip. Figure 7 The illustrated test lower mold 2 has only one receiving opening 24, so the test fixture mounted on the lower surface of the pressure plate assembly 41 is suitable for the test lower mold 2 with a single receiving opening 24. When a chip needs to be tested, the chip is placed in the receiving opening 24, and the drive mechanism 6 drives the floating test mechanism 4 to move downward as a whole until the test fixture connected to the lower surface of the pressure plate assembly 41 contacts the chip surface. As the test fixture contacts the chip, the movable block 532 is subjected to an upward force from the pressure plate assembly 41 as a whole. The protrusion 5321 at the top of the movable block 532, which penetrates the second mounting block 522, tends to move upward within the cavity and contact the elastic member 523. The buffer cavity 524 formed by the elastic member 523 and the first mounting block 521, which is inflated to form a cushioning airbag, continues to move downward, applying downward pressure to the protrusion 5321 of the movable block 532, thereby controlling the pressure applied by the pressure plate assembly 41 on the chip surface to prevent damage to the chip due to excessive downward pressure.

[0038] Ginseng Figures 3 to 8 As shown, the air path 513 is formed in the mounting plate 51 along the length direction, and the top wall of the first mounting block 521 forms an air inlet 525, which is connected to the air path 513. The gas flows into the buffer cavity 524 through the air path 513 and the air inlet 525. The elastic member 523 is optionally a silicone sheet, and the top edge of the movable block 532 is formed as a rounded chamfer. Figure 4 and Figure 8As shown, the bottom wall of the first mounting block 521 and the top wall of the second mounting block 522 are attached to each other in the embodiment, and the elastic member 523 selected as a silica gel sheet is clamped between the first mounting block 521 and the second mounting block 522 and forms a buffer cavity 524 with the groove (not labeled) formed on the bottom wall of the first mounting block 521. It should be noted that the gas inlet (not labeled) of the gas path 513 is formed on the side wall of the mounting plate 51 perpendicular to the length direction, and the gas entering the gas path 513 passes through the gas inlet hole 525 into the buffer cavity 524. More specifically, the amount of gas entering the buffer cavity 524 can be adjusted automatically. When the driving mechanism 6 drives the floating test mechanism 4 to press down until the pressing plate assembly 41 contacts the chip, there is an interaction force between the top end of the movable block 532 and the elastic member 523 formed as an air bag, thereby effectively controlling the pressure applied by the pressing plate assembly 41 to the chip, avoiding the problem of chip damage due to excessive pressure.

[0039] Referring to Figures 3 to 8 As shown, the floating test mechanism 4 further includes a heat insulation plate 42, the top wall of the heat insulation plate 42 is fixedly connected to the connecting seat 531, the top surface of the connecting seat 531 is provided with a positioning groove 5311 formed in a ring shape, and the bottom end of the movable block 532 is embedded in the positioning groove 5311 and fixed; the bottom surface of the heat insulation plate 42 is connected to the pressing plate assembly 41, and the pressing plate assembly 41 includes a first plate body 411 and a second plate body 412. The first plate body 411 and the second plate body 412 are surrounded to form a temperature adjusting liquid path 413. The temperature adjusting liquid path 413 is formed on the upper surface of the second plate body 412, and the temperature adjusting liquid path 413 extends spirally from the center point of the second plate body 412 to the side wall close to the second plate body 412. The first plate body 411 covers the upper surface of the second plate body 412 to seal the temperature adjusting liquid path 413; the second plate body 412 forms a liquid path through hole 414 in communication with the temperature adjusting liquid path 413, and the mounting plate 51 forms a liquid path passage (not labeled) and forms a first hole site 511 and a second hole site 512 of the liquid path passage on the top surface and the side surface of the mounting plate 51 respectively. The second hole site 512 is connected to the liquid path through hole 414 through a hose (not shown).

[0040] It should be noted that the temperature adjusting liquid path 413 formed in the pressing plate assembly 41 is filled with liquid at different temperatures to change the temperature of the pressing plate assembly 41, which simulates the effect of different temperatures of the chip working environment when the pressing plate assembly 41 is pressed to contact the chip. Further, in cooperation with the first hole site 511 and the second hole site 512 formed in the mounting plate 51, the hose (not shown) is first connected to the first hole site 511 to pass into the liquid path passage, and then flows into the temperature adjusting liquid path 413 through the second hole site 512 and the liquid path through hole 414. In the embodiment, the temperature adjusting liquid path 413 is formed in a spiral shape on the upper surface of the second plate body 412 to achieve the effect that the temperature adjusting liquid filled in the temperature adjusting liquid path 413 can uniformly cool the second plate body 412. Specifically, in combination with Figure 3 andFigure 4 As shown, the floating test mechanism 4 in the embodiment specifically includes a mounting plate 51, two sets of pressing plate assemblies 41, and two sets of buffer members 52 and floating assemblies 53, and the heat insulation plates 42 are arranged in two sets corresponding to the floating assemblies 53 and the pressing plate assemblies 41. As known from the foregoing, the lower surface of the second plate body 412 of the pressing plate assembly 41 in the embodiment is detachably connected to the test fixture, and the floating test mechanism 4 is driven by the driving mechanism 6 to move along a direction perpendicular to the plane of the workbench 1. Figure 7 As shown, the test lower mold 2 has a receiving opening 24, and a test fixture adapted to the test lower mold 2 is detachably connected to the lower surfaces of the two sets of pressing plate assemblies 41. Further, when the test lower mold 2 has two or four receiving openings 24, the test fixture connected to the pressing plate assemblies 41 can be one or two corresponding to the two sets of pressing plate assemblies 41, and is adapted to the test lower mold 2.

[0041] It should be noted that the test lower mold 2 has positioning blocks 23, the workbench 1 has an opening (not labeled) for mounting the test lower mold 2, and the test lower mold 2 is placed from bottom to top at the edge of the top surface and is attached to the lower surface of the workbench 1, at which time the positioning blocks 23 are passed out of the positions corresponding to the openings of the workbench 1, and the test lower mold 2 is fixed to the workbench 1 by bolts or other connecting members. Further, Figure 7 As shown, the test lower mold 2 is provided with a temperature control liquid path 22, and when the chip is placed in the receiving opening 24, different temperature liquids are introduced into the temperature control liquid path 22 to simulate different working environment temperatures of the chip, and further, when the pressing plate assembly 41 is attached to the chip, a better temperature regulation effect is achieved. Further, after the test of the batch of chips is completed, the liquid is reversely extracted from the temperature control liquid path 413 by the first hole 511, and the liquid is introduced into the temperature control liquid path 413 again when the next chip test is performed.

[0042] Referring to Figure 1 and Figure 2 and Figure 5 and Figure 6 As shown, the mounting frame 3 includes a guide plate 31 and two sets of support rods 32, the two sets of support rods 32 are distributed on both sides of the workbench 1 in the length direction of the test lower mold 2, and the guide plate 31 is fixed to the top ends of the two support rods 32; the driving mechanism 6 includes a driving motor 61, a transmission mechanism 62, and a lifting device (not labeled), the lifting device is connected to the floating test mechanism 4 after passing through the guide plate 31, and the driving motor 61 drives the transmission mechanism 62 to drive the floating test mechanism 4 to move along a direction perpendicular to the plane of the workbench 1.

[0043] Referring to Figure 5 and Figure 6As shown, the lifting device includes a lifting column 631 and a screw rod 632, the screw rod 632 is axially arranged in the lifting column 631, and the lifting column 631 is threadedly connected with the screw rod 632; the transmission mechanism 62 includes a driving wheel 621 and a driven wheel 622, the driving end of the driving motor 61 is coaxially fixed with the driving wheel 621, the driving wheel 621 and the driven wheel 622 are connected by a transmission belt 623, and the driven wheel 622 is coaxially fixed with the screw rod 632; the lifting column 631 is vertically downwardly arranged through the guide plate 31 and is connected with the floating test mechanism 4, the sidewall of the lifting column 631 is provided with a guide rail 633 in the height direction, and the guide plate 31 is provided with a guide groove 311 which is adapted to the guide rail 633 and relatively slides. The pressure sensor 43 is arranged between the lifting column 631 and the floating test mechanism 4, and specifically, the pressure sensor 43 is connected between the mounting plate 51 and the lifting column 631.

[0044] It should be noted that the top wall of the guide plate 31 is vertically provided with a support plate 34, the support plate 34 is used for assembling the driving motor 61 and the transmission mechanism 62, and specifically, the driving motor 61 is mounted on the lower surface of the support plate 34, the driving wheel 621 and the driven wheel 622 are assembled on the upper surface of the support plate 34, the driving wheel 621 is coaxially fixed with the driving end of the driving motor 61 which is penetrated by the support plate 34, the screw rod 632 is vertically upwardly penetrated by the support plate 34 from below and is coaxially fixed with the driven wheel 622, the screw rod 632 is driven to rotate in the positive direction and the reverse direction by controlling the forward rotation and the reverse rotation of the driving motor 61, and then the lifting column 631 which is threadedly connected with the screw rod 632 is controlled to ascend or descend relative to the guide plate 31. It should be noted that the driving motor 61 is connected with the control panel 71, and the control panel 71 is connected with the pressure sensor 43. Figure 5 As shown, the support plate 34 is fixedly connected with a bearing 341, and the screw rod 632 is penetrated by the bearing 341 to achieve the effect of rotatingly connecting with the support plate 34. Further, in the embodiment, the lifting column 631 is hollow in the axial direction, and the outer wall of the lifting column 631 is surrounded by four mutually perpendicular sidewalls, and the guide rail 633 is arranged on the opposite sides of the lifting column 631, which effectively improves the lifting stability of the lifting column 631.

[0045] It should be noted that the top wall of the guide plate 31 is vertically provided with a support plate 34, the support plate 34 is used for assembling the driving motor 61 and the transmission mechanism 62, and specifically, the driving motor 61 is mounted on the lower surface of the support plate 34, the driving wheel 621 and the driven wheel 622 are assembled on the upper surface of the support plate 34, the driving wheel 621 is coaxially fixed with the driving end of the driving motor 61 which is penetrated by the support plate 34, the screw rod 632 is vertically upwardly penetrated by the support plate 34 from below and is coaxially fixed with the driven wheel 622, the screw rod 632 is driven to rotate in the positive direction and the reverse direction by controlling the forward rotation and the reverse rotation of the driving motor 61, and then the lifting column 631 which is threadedly connected with the screw rod 632 is controlled to ascend or descend relative to the guide plate 31. It should be noted that the driving motor 61 is connected with the control panel 71, and the control panel 71 is connected with the pressure sensor 43. Figure 5 and Figure 6As shown, the top wall of the guide plate 31 is vertically fixed with a distance measuring mechanism 33. The distance measuring mechanism 33 includes a mounting rod 333 and a first sensor 331 and a second sensor 332 connected to the mounting rod 333. A baffle 634 is fixed to the sidewall of a lifting column 631, which reciprocates within the sensing area of ​​the first sensor 331 and the second sensor 332. It should be noted that in this embodiment, the first sensor 331 and the second sensor 332 are infrared sensors. The distance between the first sensor 331 and the second sensor 332 defines the height range within which the lifting column 631 can drive the floating test mechanism 4. Furthermore, the pressure sensor 43 connected between the floating test mechanism 4 and the lifting column 631 can firstly provide feedback before chip testing on the pressure that the chip will be subjected to from the floating test mechanism 4. If the pressure exceeds the pressure range that the chip can withstand, the lifting range of the lifting column 631 can be adjusted, that is, the installation height of the second sensor 332 on the mounting rod 333 can be adjusted. Secondly, the pressure sensor 43 can monitor the pressure applied to the chip in real time during chip testing, further preventing damage to the chip due to excessive pressure.

[0046] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the present invention. They are not intended to limit the scope of protection of the present invention. Any equivalent implementation methods or changes that do not deviate from the technical spirit of the present invention should be included in the scope of protection of the present invention.

[0047] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0048] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A semiconductor testing apparatus characterized by comprising: The utility model provides a chip testing device, including: Workbench, workbench is equipped with the test lower mould containing chip, workbench is located test lower mould just above through the installation frame sets up test assembly, test assembly includes drive mechanism and floating test mechanism, drive mechanism passes through installation frame from top to bottom vertically and is connected with floating test mechanism later; Floating test mechanism includes pressing plate assembly and buffer assembly, the top of buffer assembly is connected with drive mechanism, the bottom of pressing plate assembly is connected to buffer assembly, buffer assembly includes mounting plate, buffer piece and floating assembly, buffer piece is surrounded by elastic piece in buffer cavity, the top of floating assembly is embedded in buffer piece and the bottom is connected to pressing plate assembly; The mounting plate forms a gas path connected with the buffer cavity, when the pressing plate assembly abuts against the chip contained in the test lower mould, the top of the floating assembly rises in the buffer piece and contacts with the elastic piece; The buffer piece includes a first mounting block and a second mounting block, the cavity is formed between the first mounting block and the second mounting block, the elastic piece is formed as a sheet and is clamped between the first mounting block and the second mounting block, the first mounting block is fixedly connected to the mounting plate, the buffer cavity is formed by the internal space of the cavity and is surrounded by the first mounting block and the elastic piece; The floating assembly includes a connecting seat and a movable block, the connecting seat is fixedly connected to the upper surface of the pressing plate assembly, the bottom of the movable block is fixedly connected to the connecting seat, the top of the movable block passes through the bottom wall of the second mounting block and is located in the cavity, a protruding portion is formed at the side wall of one end of the movable block in the cavity, and the protruding portion is lapped on the bottom wall of the second mounting block surrounding the cavity; The installation frame includes a guide plate and two groups of supporting rods, the two supporting rods are distributed on both sides of the workbench in the length direction of the test lower mould, and the guide plate is fixedly connected to the top of the two supporting rods; The drive mechanism includes a drive motor, a transmission mechanism and a lifting device, the lifting device is connected to the floating test mechanism after passing through the guide plate, and the drive motor drives the transmission mechanism to drive the floating test mechanism to displace along a direction perpendicular to the plane of the workbench.

2. The semiconductor testing apparatus according to claim 1, wherein The floating test mechanism further includes a heat insulation plate, the top wall of the heat insulation plate is fixedly connected to the connecting seat, a positioning groove in the form of a ring is formed in the top surface of the connecting seat, the top of the movable block is embedded in the positioning groove and is fixed; The bottom surface of the heat insulation plate is connected to the pressing plate assembly, and the pressing plate assembly includes a first plate body and a second plate body, and a temperature adjusting liquid path is formed between the first plate body and the second plate body.

3. The semiconductor testing apparatus according to claim 2, wherein The temperature adjusting liquid path is formed on the upper surface of the second plate body, the temperature adjusting liquid path extends spirally from the center point of the second plate body to the side wall of the second plate body, and the first plate body covers the upper surface of the second plate body to seal the temperature adjusting liquid path; The second plate body forms a liquid path through hole connected with the temperature adjusting liquid path, the mounting plate forms a liquid path channel, and the first hole and the second hole of the liquid path channel are respectively formed on the top surface and the side surface of the mounting plate, and the second hole is connected with the liquid path through hole through a hose.

4. The semiconductor testing apparatus according to claim 1, wherein The gas passage is formed in the mounting plate along the length direction, the top wall of the first mounting block forms an air inlet hole, the air inlet hole and the gas passage are communicated with each other, the gas is introduced into the buffer cavity through the gas passage and the air inlet hole, the elastic member is selected as a silica gel sheet, and the top edge of the movable block is formed with a round chamfer.

5. The semiconductor testing apparatus according to claim 4, wherein The lifting device comprises a lifting column and a screw rod, the screw rod is arranged in the lifting column in the axial direction, and the lifting column and the screw rod are threadedly connected; The transmission mechanism comprises a driving wheel and a driven wheel, the driving end of the driving motor is fixed coaxially with the driving wheel, the driving wheel and the driven wheel are connected by a transmission belt, and the driven wheel is fixed coaxially with the screw rod; The lifting column is connected with the floating test mechanism after penetrating through the guide plate vertically downward, the side wall of the lifting column is provided with a guide rail along the height direction, and the guide plate is provided with a guide groove which is matched with the guide rail and slides relative to the guide rail.

6. The semiconductor testing apparatus according to claim 5, wherein The top wall of the guide plate is fixed with a distance measuring mechanism, the distance measuring mechanism comprises a mounting rod and first and second sensors connected to the mounting rod, the side wall of the lifting column is fixedly connected with a baffle, and the baffle reciprocates up and down in the sensing area of the first and second sensors.

7. The semiconductor testing apparatus according to claim 3, wherein The test lower die is detachably connected to the workbench, the top wall of the test lower die forms a positioning pin, and the lower surface of the second plate body is detachably connected with a test fixture matched with the test lower die.

8. The semiconductor testing apparatus according to claim 6, wherein The pressure sensor is arranged between the lifting column and the floating test mechanism.

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