Optical module

Abstract

The embodiment of the invention provides an optical module. The optical module comprises an upper shell; the lower shell covers the upper shell to form a cavity; the circuit board is arranged in the cavity, the first optical chip assembly is arranged on the upper surface of the circuit board, and the first optical chip assembly is in electric signal connection with a wire on the circuit board through a first bonding wire; the second optical chip assembly is arranged on the upper surface of the circuit board, and the second optical chip assembly is in electric signal connection with the wire through a second bonding wire; the first lens assembly is arranged on the upper surface of the circuit board, a first containing cavity is formed between the first lens assembly and the circuit board, the first optical chip assembly and the second optical chip assembly are located in the first containing cavity, and the first lens assembly isolates heat conduction between the first optical chip assembly and the upper shell as well as between the second optical chip assembly and the upper shell; and the heat conduction assembly is arranged on the lower surface of the circuit board and is in heat conduction contact with the first optical chip assembly and the second optical chip assembly, and the heat conduction assembly is in heat conduction contact with the lower shell.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to an optical module. Background Art

[0002] With the development of new services and application models such as cloud computing, mobile Internet, and video, the development and progress of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for realizing the mutual conversion of optical and electrical signals and are one of the key components in optical communication equipment.

[0003] The optical chip components in the optical module generate a large amount of heat when working. During the operation of the optical module, the heat generated by the optical chip components needs to be dissipated in a timely manner. Summary of the Invention

[0004] The embodiments of the present application provide an optical module that can dissipate heat generated by an optical chip component in a timely manner, thereby improving the heat dissipation performance of the optical module.

[0005] According to a first aspect of an embodiment of the present application, an optical module is provided, including:

[0006] upper shell;

[0007] A lower shell body, covering the upper shell body to form a cavity;

[0008] A circuit board is disposed in the cavity, and a first electronic device and a second electronic device are disposed on the circuit board;

[0009] The second electronic device includes:

[0010] A first optical chip assembly is provided on the upper surface of the circuit board. The first optical chip assembly is electrically connected to a trace on the circuit board via a first bonding wire. The first optical chip assembly generates heat when in operation.

[0011] A second optical chip assembly is provided on the upper surface of the circuit board, the second optical chip assembly is connected to the electrical signal trace through a second bonding wire, and the second optical chip assembly generates heat when in operation;

[0012] A filter component is provided on the circuit board;

[0013] A first lens assembly is provided on the upper surface of the circuit board, a first accommodating cavity is formed between the first lens assembly and the circuit board, the first optical chip assembly and the second optical chip assembly are located in the first accommodating cavity, and the first lens assembly isolates heat conduction between the first optical chip assembly and the second optical chip assembly and the upper housing;

[0014] A heat conducting component is provided on the lower surface of the circuit board, the heat conducting component is in thermal conduction contact with the first optical chip component and the second optical chip component, and the heat conducting component is in thermal conduction contact with the lower housing;

[0015] The filter assembly is electrically connected to the first optical chip assembly and the second optical chip assembly, and the distance between the filter assembly and the first optical chip assembly and the second optical chip assembly is less than or equal to a first preset threshold; the accommodating space of the first accommodating cavity is smaller than the sum of the sizes of the first optical chip assembly, the second optical chip assembly and the filter assembly, the filter assembly is arranged on the lower surface of the circuit board, and the filter assembly is electrically connected to the first optical chip assembly and the second optical chip assembly through a third bonding wire, so that the distance between the filter assembly and the first optical chip assembly and the second optical chip assembly is less than or equal to the first preset threshold.

[0016] According to a second aspect of an embodiment of the present application, an optical module is provided, including:

[0017] upper shell;

[0018] A lower shell body, covering the upper shell body to form a cavity;

[0019] A circuit board is disposed in the cavity, and a first electronic device and a second electronic device are disposed on the circuit board;

[0020] The second electronic device includes:

[0021] A first optical chip assembly is provided on the upper surface of the circuit board. The first optical chip assembly is electrically connected to a trace on the circuit board via a first bonding wire. The first optical chip assembly generates heat when in operation.

[0022] A second optical chip assembly is provided on the upper surface of the circuit board, the second optical chip assembly is connected to the electrical signal trace through a second bonding wire, and the second optical chip assembly generates heat when in operation;

[0023] A first lens assembly is provided on the upper surface of the circuit board, a first accommodating cavity is formed between the first lens assembly and the circuit board, the first optical chip assembly and the second optical chip assembly are located in the first accommodating cavity, and the first lens assembly isolates heat conduction between the first optical chip assembly and the second optical chip assembly and the upper housing;

[0024] A heat conducting component is provided on the lower surface of the circuit board, the heat conducting component is in thermal conduction contact with the first optical chip component and the second optical chip component, and the heat conducting component is in thermal conduction contact with the lower housing;

[0025] The second electronic device further includes:

[0026] A filter assembly is provided on a circuit board; the filter assembly is electrically connected to the first optical chip assembly and the second optical chip assembly, and the distance between the filter assembly and the first optical chip assembly and the second optical chip assembly is less than or equal to a first preset threshold; the accommodation space of the first accommodation cavity is smaller than the sum of the sizes of the first optical chip assembly, the second optical chip assembly, and the filter assembly, the filter assembly is provided on the lower surface of the circuit board, and the filter assembly is electrically connected to the first optical chip assembly and the second optical chip assembly via a third bonding wire, so that the distance between the filter assembly and the first optical chip assembly and the second optical chip assembly is less than or equal to the first preset threshold;

[0027] The circuit board has a wire bonding pad located on the side of the first optical chip assembly and the second optical chip assembly; the side of the first heat conducting member protrudes from the side of the first optical chip assembly and extends to a side of the wire bonding pad facing away from the first optical chip assembly;

[0028] The side edge of the second heat conducting member protrudes from the side edge of the second optical chip assembly and extends to a side of the wire bonding pad facing away from the second optical chip assembly.

[0029] The optical module provided in the embodiment of the present application forms a cavity by covering an upper shell and a lower shell, and arranges a circuit board in the cavity; thus, the installation of the circuit board is facilitated, and the installation and assembly efficiency of the optical module is improved; a first electronic device and a second electronic device are arranged on the circuit board, wherein the second electronic device includes a first optical chip assembly and a second optical chip assembly, the first optical chip assembly and the second optical chip assembly are arranged on the upper surface of the circuit board, the first optical chip is connected to the wiring electrical signal on the circuit board through a first bonding wire, and the second optical chip is connected to the wiring electrical signal through a second bonding wire, and the first optical chip and the second optical chip both generate heat when working; a first lens assembly is arranged on the upper surface of the circuit board, and a first lens assembly and a second lens assembly are arranged on the upper surface of the circuit board. A first accommodating cavity is formed between the first optical chip assembly and the second optical chip assembly, and the first optical chip assembly and the second optical chip assembly are arranged in the first accommodating cavity. They are encapsulated by the first lens assembly, which facilitates the flexible setting of the positions of the first optical chip assembly and the second optical chip assembly on the circuit board; the first lens assembly isolates the heat conduction between the first optical chip assembly, the second optical chip assembly and the upper shell; in the embodiment of the present application, a heat-conducting assembly is arranged on the lower surface of the circuit board, the heat-conducting assembly is in thermal conduction contact with the first optical chip assembly and the second optical chip assembly, and the heat-conducting assembly is in thermal conduction contact with the lower shell; in this way, the heat-conducting assembly can conduct the heat generated by the first optical chip assembly and the second optical chip assembly during operation to the lower shell, thereby dissipating the heat through the lower shell, thereby improving the heat dissipation effect of the optical module.

[0030] In addition, the second electronic device includes a filter component, which is electrically connected to the first optical chip component and the second optical chip component, and the distance between the filter component and the first optical chip component and the second optical chip component is less than or equal to a first preset threshold; the accommodating space of the first accommodating cavity is smaller than the sum of the sizes of the first optical chip component, the second optical chip component and the filter component; in this way, the filter component is arranged on the lower surface of the circuit board, which facilitates the arrangement of the filter component and shortens the third bonding length between the filter component and the first optical chip component and the second optical chip component, so that the distance between the filter component and the first optical chip component and the second optical chip component is less than or equal to the first preset threshold, thereby improving the noise reduction effect of the filter component on the first optical chip component and the second optical chip component. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] To more clearly illustrate the technical solutions of this application, the following briefly introduces the drawings required for use in some embodiments of this application. Obviously, the drawings described below are only drawings of some embodiments of this application, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, or actual timing of the signals involved in the embodiments of this application.

[0032] Figure 1 A partial structural diagram of an optical communication system provided according to some embodiments of the present application;

[0033] Figure 2 A partial structural diagram of a host computer provided according to some embodiments of the present application;

[0034] Figure 3 A schematic diagram of the structure of an optical module provided according to some embodiments of the present application;

[0035] Figure 4 A schematic diagram of the exploded structure of an optical module provided according to some embodiments of the present application;

[0036] Figure 5 A schematic diagram of the structure of the lower housing, circuit board, and optical transceiver components in an optical module provided according to some embodiments of the present application;

[0037] Figure 6 A schematic diagram of the exploded structure of the lower housing, circuit board, and optical transceiver components in an optical module provided according to some embodiments of the present application;

[0038] Figure 7 A schematic diagram of the structure of the cooperation between the first optical transceiver component, the second optical transceiver component and the circuit board in the optical module provided according to an embodiment of the present application;

[0039] Figure 8 This is a schematic diagram of the exploded structure of the first optical transceiver component, the second optical transceiver component, and the circuit board in the optical module provided according to an embodiment of the present application;

[0040] Figure 9 A schematic diagram of the exploded structure of the circuit board, optical transceiver component, and heat conduction component in the optical module according to some embodiments of the present application;

[0041] Figure 10 Schematic diagram of the structure of the circuit board in the optical module provided according to some embodiments of the present application Figure 1 ;

[0042] Figure 11 yes Figure 8 A partial enlarged view of point A in the middle;

[0043] Figure 12 This is a cross-sectional view of the first optical transceiver component, the second optical transceiver component, and the circuit board in the optical module provided by an embodiment of the present application;

[0044] Figure 13 yes Figure 12 A partial enlarged view of point B in the middle;

[0045] Figure 14 This is a structural diagram of the first lens assembly in the optical module provided in the embodiment of the present application. Figure 1 ;

[0046] Figure 15 is a bottom view of the first lens assembly in the optical module provided in an embodiment of the present application;

[0047] Figure 16 It is along Figure 15 Cross-sectional view along the mid-CC line;

[0048] Figure 17 yes Figure 16 A partial enlarged view of point D in the middle;

[0049] Figure 18 This is a structural diagram of the first lens assembly in the optical module provided in the embodiment of the present application. Figure 2 ;

[0050] Figure 19 This is a structural diagram of the first lens assembly in the optical module provided in the embodiment of the present application. Figure 3 ;

[0051] Figure 20 This is an enlarged cross-sectional view of the cooperation between the first lens assembly, the first transmitting optical fiber ribbon, and the circuit board in the optical module provided by an embodiment of the present application;

[0052] Figure 21 This is a structural diagram of the first lens assembly in the optical module provided in the embodiment of the present application. Figure 4 ;

[0053] Figure 22 This is a structural diagram of the first lens assembly in the optical module provided in the embodiment of the present application. Figure 5 ;

[0054] Figure 23 This is a structural diagram of the cooperation between the first lens assembly, the first optical fiber bracket, and the first internal optical fiber ribbon in the optical module provided by an embodiment of the present application;

[0055] Figure 24 This is the decomposition structure of the first lens assembly, the first optical fiber bracket and the first internal optical fiber ribbon in the optical module provided in the embodiment of the present application Figure 1 ;

[0056] Figure 25 This is the decomposition structure of the first lens assembly, the first optical fiber bracket and the first internal optical fiber ribbon in the optical module provided in the embodiment of the present application Figure 2 ;

[0057] Figure 26 This is a schematic structural diagram of the cooperation between the first optical transceiver component and the second optical transceiver component in the optical module provided in an embodiment of the present application;

[0058] Figure 27 A schematic diagram of the exploded structure of the cooperation between the circuit board and the heat conducting component in the optical module provided according to some embodiments of the present application;

[0059] Figure 28 The structure of the circuit board in the optical module provided in some embodiments of the present application is shown in FIG. Figure 2 ;

[0060] Figure 29 A cross-sectional view of the coordination of a circuit board, an optical transceiver component, and a heat-conducting assembly in an optical module according to some embodiments of the present application;

[0061] Figure 30 A schematic structural diagram of a first lens assembly in an optical module according to some embodiments of the present application;

[0062] Figure 31 A cross-sectional view of the assembly of a circuit board, a first electronic device, and a heat dissipation assembly in an optical module according to some embodiments of the present application;

[0063] Figure 32 for Figure 31 A top view of

[0064] Figure 33 for Figure 31 Bottom view of

[0065] Figure 34A cross-sectional view of the assembly of a circuit board, a first optical transceiver component, and a lower housing in an optical module according to some embodiments of the present application;

[0066] Figure 35 Schematic diagram of the structure of the lower housing of the optical module provided in some embodiments of the present application Figure 1 ;

[0067] Figure 36 Schematic diagram of the structure of the lower housing of the optical module provided in some embodiments of the present application Figure 2 ;

[0068] Figure 37 A cross-sectional view of the cooperation between the upper housing, the circuit board, and the lower housing in the optical module according to some embodiments of the present application;

[0069] Figure 38 A schematic diagram of the exploded structure of the circuit board and the lower housing in the optical module according to some embodiments of the present application;

[0070] Figure 39 A schematic diagram of the exploded structure of the upper housing, circuit board, and lower housing in an optical module according to some embodiments of the present application;

[0071] Figure 40 A partial enlarged view of the cooperation between the upper housing and the circuit board in the optical module provided according to some embodiments of the present application;

[0072] Figure 41 This is a schematic diagram of the exploded structure of the upper housing and the circuit board in the optical module provided according to some embodiments of the present application;

[0073] Figure 42 Schematic diagram of the structure of the circuit board in the optical module provided according to some embodiments of the present application Figure 3 ;

[0074] Figure 43 A top view of a circuit board in an optical module according to some embodiments of the present application;

[0075] Figure 44 This is a schematic structural diagram of an upper housing in an optical module provided according to some embodiments of the present application;

[0076] Figure 45 A bottom view of an upper housing of an optical module provided according to some embodiments of the present application;

[0077] Figure 46 for Figure 45 A partial enlarged schematic diagram of point E in the middle;

[0078] Figure 47 Schematic diagram of the structure of the circuit board and the electronic device in the optical module provided in some embodiments of the present application Figure 1 ;

[0079] Figure 48 A schematic structural diagram of a first sub-electronic device in an optical module according to some embodiments of the present application;

[0080] Figure 49 A schematic diagram of the structure of the cooperation between the first sub-electronic component and the second sub-electronic component in the optical module provided according to some embodiments of the present application;

[0081] Figure 50 Schematic diagram of the structure of the circuit board and electronic components in the optical module provided according to some embodiments of the present application Figure 2 ;

[0082] Figure 51 Schematic diagram of the structure of the circuit board in the optical module provided according to some embodiments of the present application Figure 4 ;

[0083] Figure 52 Schematic diagram of the structure of the circuit board in the optical module provided according to some embodiments of the present application Figure 5 . DETAILED DESCRIPTION

[0084] Some embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. However, the embodiments described are only some of the embodiments of the present disclosure, not all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments provided in the present disclosure are within the scope of protection of the present disclosure.

[0085] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as open and inclusive, that is, "including, but not limited to"; the terms "first" and "second" are not to be understood as indicating or implying relative importance or indicating an upper limit on quantity; the term "plurality" means two or more; the term "connected" is to be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, or an integral connection, and can be directly connected or indirectly connected through an intermediate medium; the use of the terms "suitable for" or "configured to" means open and inclusive language, which does not exclude equipment that is suitable for or configured to perform additional tasks or steps; terms such as "parallel", "perpendicular", "same", "consistent", "level" and so on are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges generated in practice, and also include differences based on the same design concept but due to manufacturing reasons.

[0086] In optical communication technology, to establish information transmission between information processing devices, it is necessary to load the information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When transmitting optical signals within information transmission equipment, they can reduce optical power loss, thereby achieving high-speed, long-distance, and low-cost information transmission. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment typically includes optical fibers and optical waveguides.

[0087] Optical modules can convert optical signals into electrical signals between information processing devices and information transmission devices. For example, at least one of the optical signal input or output ends of an optical module is connected to an optical fiber, and at least one of the electrical signal input or output ends of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber. Because multiple information processing devices can transmit information via electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is referred to as the optical module's host computer. Furthermore, the optical signal input or output end of the optical module can be referred to as an optical port, and the electrical signal input or output end of the optical module can be referred to as an electrical port.

[0088] Figure 1 FIG. 1 is a partial structural diagram of an optical communication system provided according to some embodiments of the present application. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .

[0089] One end of optical fiber 101 extends toward remote information processing device 1000, and the other end of optical fiber 101 is connected to optical module 200 through the optical port of optical module 200. Optical signals can be totally reflected in optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal undergoes multiple total reflections in optical fiber 101 to transmit the optical signal from remote information processing device 1000 to optical module 200, and vice versa, thereby achieving long-distance, low-power information transmission.

[0090] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 may be detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0091] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0092] The host computer 100 also includes an external electrical interface that can access an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to access a network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing device 2000 and the host computer 100 via the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is then transmitted to the remote information processing device 1000 via the optical fiber 101. For example, a first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that optical modules are tools for converting optical signals into electrical signals. During this conversion process, the information does not change, but the encoding and decoding methods of the information can change.

[0093] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0094] Figure 2 This is a partial structural diagram of a host computer according to some embodiments of the present application. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. Figure 2 As shown, the host computer 100 further includes a PCB 105 disposed within the housing, a cage 106 disposed on the surface of the PCB 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed within the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has protruding structures such as fins to increase the heat dissipation area.

[0095] The optical module 200 is inserted into the cage 106 of the host computer 100. The cage 106 secures the optical module 200. Heat generated by the optical module 200 is transferred to the cage 106 and then dissipated through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 connects with the electrical connector inside the cage 106, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, thereby establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0096] Figure 3 This is a schematic diagram of the structure of an optical module provided according to some embodiments of the present application. Figure 4 Schematic diagram of the decomposition structure of the optical module provided according to some embodiments of the present application. Figure 3 and Figure 4 As shown, the optical module 200 includes a housing, a circuit board 300 disposed in the housing, a light emitting component, and a light receiving component. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes one of the light emitting component and the light receiving component.

[0097] In some examples, the optical module 200 includes a first optical transceiver component 400 and a second optical transceiver component 500 .

[0098] In some examples, the first optical transceiver component 400 may include a first optical transmitting component.

[0099] In some examples, the first optical transceiver component 400 may include a first optical receiver component.

[0100] In some examples, the second optical transceiver component 500 may include a second optical transmitting component.

[0101] In some examples, the second optical transceiver component 500 may include a second optical receiver component.

[0102] The housing includes an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square.

[0103] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0104] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to achieve the upper shell 201 covering the lower shell 202.

[0105] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 The opening 205 is also located at the end of the optical module 200 ( Figure 3 Alternatively, opening 204 is located at the end of optical module 200, while opening 205 is located on the side of optical module 200. Opening 204 is an electrical port, through which the gold finger 301 of circuit board 300 extends and is inserted into the electrical connector of host computer 100; opening 205 is an optical port, configured to receive an external optical fiber 101, thereby connecting the first optical transceiver component 400 and the second optical transceiver component 500 in optical module 200.

[0106] The combined assembly of the upper housing 201 and the lower housing 202 facilitates installation of the circuit board 300, the first optical transceiver component 400, the second optical transceiver component 500, and the like within the housing. The upper housing 201 and the lower housing 202 provide encapsulation and protection for these components. Furthermore, during assembly of the circuit board 300, the first optical transceiver component 400, and the second optical transceiver component 500, the positioning components, heat dissipation components, and electromagnetic shielding components of these components are easily positioned, facilitating automated production.

[0107] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0108] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0109] For example, the unlocking component 600 is located on the outside of the two lower side panels 2022 of the lower housing 202 and includes a snap-fit ​​component that mates with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 secures the optical module 200 in the cage 106. When the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection between the snap-fit ​​component and the host computer, thereby releasing the optical module 200 from the cage 106 and allowing the optical module 200 to be removed from the cage 106.

[0110] The circuit board 300 includes circuit traces, electronic components, and chips. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include, for example, microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LIAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0111] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0112] The circuit board 300 further includes a gold finger 301 formed on the end surface thereof. The gold finger 301 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is connected to the electrical connector in the cage 106. The gold finger 301 can be provided on only one side of the circuit board 300 (e.g. Figure 4The top surface shown in FIG300 can also be located on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thus adapting to applications requiring a large number of pins. Gold fingers 301 are configured to establish an electrical connection with a host computer to facilitate power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, and more. Of course, some optical modules also use flexible circuit boards. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement them.

[0113] In some examples, at least one of the light emitting component or the light receiving component can be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component can be disposed on a surface of the circuit board 300 or a side of the circuit board 300.

[0114] In some examples, the optical module 200 may also include a first optical transceiver component 400 and a second optical transceiver component 500, and the first optical transceiver component 400 and the second optical transceiver component 500 are arranged on the circuit board 300, thereby improving the transmission rate of the optical module 200; for example, the first optical transceiver component 400 realizes the transmission of 400Gbit / s signal, and the second optical transceiver component 500 realizes the transmission of 400Gbit / s signal, so that the signal transmission rate of the optical module is 800Gbit / s.

[0115] In some examples, at least one of the first optical transceiver component 400 or the second optical transceiver component 500 is located on a side of the circuit board 300 away from the gold finger 301 .

[0116] In some embodiments, the first optical transceiver component 400 and the second optical transceiver component 500 are physically separated from the circuit board 300 and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0117] In some embodiments, at least one of the first optical transceiver component 400 or the second optical transceiver component 500 may be directly disposed on the circuit board 300. For example, at least one of the first optical transceiver component 400 or the second optical transceiver component 500 may be disposed on a surface of the circuit board 300 or a side of the circuit board 300.

[0118] In some examples, the circuit board 300 is equipped with a DSP chip. The DSP chip processes electrical signals transmitted to the first optical transceiver component 400 and the second optical transceiver component 500, or processes electrical signals transmitted from the first optical transceiver component 400 and the second optical transceiver component 500 to the gold finger. When processing signals, the DSP chip generates a large amount of heat. To meet the requirements of high-speed signal transmission, an integrated DSP chip is often used, combining multiple functional units into a single package.

[0119] In some examples, the first optical transmitter of the first optical transceiver 400 corresponds to a DSP chip, the first optical receiver corresponds to a DSP chip, and the second optical transmitter of the second optical transceiver 500 corresponds to a DSP chip, the second optical receiver corresponds to a DSP chip. In this way, multiple DSP chips are integrated and packaged into a single chip, which is then mounted on the circuit board 300 and electrically connected to the traces on the circuit board 300 to process the electrical signals output by the gold finger.

[0120] In some examples, the DSP chip can transmit the processed electrical signal to the gold finger.

[0121] In some examples, multiple DSP chips are relatively concentrated on the circuit board 300. The heat generated during operation is concentrated on the circuit board 300, which is difficult to dissipate. As a result, the heat dissipation effect of the optical module is poor, which limits the transmission of high-speed signals.

[0122] In some examples, the integrated DSP chip combines multiple functional units and packages them into one chip, resulting in a larger integrated packaged chip. In order to avoid other electrical components on the circuit board 300, the integrated DSP chip needs to be set in a relatively fixed position on the circuit board 300, resulting in a longer routing distance between the DSP chip and the first optical transmission component of the first optical transceiver component 400 or the second optical transmission component of the second optical transceiver component 500. The electrical signal transmitted on the routing between the DSP chip and the laser driver chip is easily interfered with, which is not conducive to the transmission of high-speed signals.

[0123] Figure 5 This is a schematic diagram of the structure of the lower housing, circuit board, and optical transceiver components in the optical module provided according to some embodiments of the present application. Figure 6 This is a schematic diagram of the exploded structure of the lower housing, circuit board, and optical transceiver components in the optical module provided according to some embodiments of the present application. Figure 7 This is a structural diagram of the cooperation between the first optical transceiver component, the second optical transceiver component and the circuit board in the optical module provided according to an embodiment of the present application.

[0124] Reference Figure 5-Figure 7 As shown, in some examples of the embodiments of the present application, the optical module may include a lower housing 202 .

[0125] In some examples, the optical module may include a circuit board 300 . The circuit board 300 may be disposed on the lower housing 202 .

[0126] In some examples, the optical module may include an optical transceiver component, which may be disposed on the circuit board 300 .

[0127] In some examples, the optical transceiver component may be disposed on the upper surface of the circuit board 300 .

[0128] In some examples, the optical transceiver component may include a first optical transceiver component 400 .

[0129] In some examples, the optical transceiver component may include a second optical transceiver component 500 .

[0130] In some examples, the first optical transceiver component 400 and the second optical transceiver component 500 may be arranged along the length direction of the circuit board 300 (eg Figure 5 The arrangement is in the direction indicated by the x-axis.

[0131] In some examples, the first optical transceiver component 400 and the second optical transceiver component 500 may be arranged side by side along the length direction of the circuit board 300 .

[0132] In some examples, the first optical transceiver component 400 and the second optical transceiver component 500 may be staggered along the length direction of the circuit board 300 .

[0133] In some examples, the first optical transceiver component 400 and the second optical transceiver component 500 may be arranged along the width direction of the circuit board 300 (eg Figure 5 The arrangement is in the direction shown by the y-axis.

[0134] In some examples, the first optical transceiver component 400 and the second optical transceiver component 500 may be arranged side by side along the width direction of the circuit board 300 .

[0135] In some examples, the first optical transceiver component 400 and the second optical transceiver component 500 may be staggered along the width direction of the circuit board 300 .

[0136] In some examples, a first electronic device (not shown) may be provided on the circuit board 300 .

[0137] In some examples, the first electronic component may include a capacitor.

[0138] In some examples, the first electronic component may include a resistor.

[0139] In some examples, the first electronic device may include a transistor.

[0140] In some examples, the first electronic device may include a MOSFET.

[0141] In some examples, the first electronic device may include an MCU.

[0142] In some examples, the first electronic device may include an inductor.

[0143] In some examples, the first electronic device may include other types of electronic devices, which is not limited in some examples of the embodiments of the present application.

[0144] In some examples, a gold finger 301 is provided at one end of the circuit board 300, and the gold finger 301 is configured to transmit electrical signals. For example, as described in detail in the aforementioned embodiments of the present application, the gold finger 301 can be electrically connected to the cage of the host computer, thereby enabling the transmission of electrical signals between the optical module and the host computer. In some examples, the circuit board 300 can have a wiring (not shown in the figure), and the gold finger 301 can be electrically connected to the electronic components on the circuit board 300 through the wiring, thereby transmitting electrical signals to the electronic components on the circuit board 300 through the wiring.

[0145] In some examples, the first optical transceiver component 400 and the second optical transceiver component 500 may be disposed on the circuit board 300 .

[0146] Figure 8 This is a schematic diagram of the exploded structure of the first optical transceiver component, the second optical transceiver component, and the circuit board in the optical module provided according to an embodiment of the present application. Figure 9 This is a schematic diagram of the exploded structure of the circuit board, optical transceiver component, and heat conduction component in the optical module provided according to some embodiments of the present application. Figure 10 Schematic diagram of the structure of the circuit board in the optical module provided according to some embodiments of the present application Figure 1 , Figure 11 yes Figure 8 A magnified partial view of point A in the middle.

[0147] For some examples, refer to Figures 8-11 As shown, a second electronic component may be provided on the circuit board 300 .

[0148] In some examples, the second electronic device may include a first optical chip assembly 401. The first optical transceiver component 400 may include a first optical chip assembly 401.

[0149] In some examples, the first optical chip assembly 401 may include a first laser chip.

[0150] In some examples, the first optical chip assembly 401 may include a first laser driver chip. The first laser driver chip may be electrically connected to the first laser chip.

[0151] In some examples, the first optical chip assembly 401 may be a first optical transmission assembly.

[0152] In some examples, wiring may be arranged on the circuit board 300. The first optical chip assembly 401 may be electrically signal-connected to the wiring.

[0153] In some examples, the first laser driver chip can be connected to the trace.

[0154] In some examples, the first optical chip assembly 401 can be configured to receive an electrical signal transmitted by a trace to emit a laser signal. The first optical chip assembly 401 generates heat when in operation.

[0155] In some examples, the first optical chip assembly 401 is a bare chip assembly.

[0156] In some examples, the first optical chip assembly 401 may be disposed on the upper surface of the circuit board 300 .

[0157] In some examples, the first optical chip assembly 401 is connected to the wiring electrical signal through bonding wires.

[0158] In some examples, the first optical chip assembly 401 may include a DSP chip corresponding to the first optical transmitter assembly. The DSP chip may be integrated with the first laser driver chip as a bare chip. The first optical chip assembly 401 generates heat during operation. This shortens the wiring distance between the DSP chip and the first laser driver chip. In some examples, the wiring between the gold finger and the first optical chip assembly 401 may be located on the surface layer of the circuit board.

[0159] In some examples, the second electronic device may include a second optical chip assembly 402. The first optical transceiver component 400 may include a second optical chip assembly 402.

[0160] In some examples, the second optical chip assembly 402 may include a first optical receiver chip.

[0161] In some examples, the second optical chip assembly 402 may include a TIA, which is electrically connected to the first optical receiver chip, and to the trace.

[0162] In some examples, the second optical chip assembly 402 may be a first optical receiving assembly. The first optical receiving assembly may be configured to receive an externally transmitted laser signal and convert the laser signal into an electrical signal. The second optical chip assembly 402 generates heat during operation. In some examples, the first optical chip assembly 401 and the second optical chip assembly 402 may be arranged side by side on the circuit board 300.

[0163] In some examples, the first optical chip assembly 401 and the second optical chip assembly 402 can be arranged side by side along the width direction of the circuit board 300 .

[0164] In some examples, the first optical chip assembly 401 and the second optical chip assembly 402 can be arranged side by side along the length direction of the circuit board 300 .

[0165] In some examples, the first optical chip assembly 401 and the second optical chip assembly 402 can form a first optical transceiver component 400 on the circuit board 300 .

[0166] In some examples, the second optical chip assembly 402 can be a bare chip assembly.

[0167] In some examples, the second optical chip assembly 402 can be disposed on the upper surface of the circuit board 300 .

[0168] In some examples, the second optical chip assembly 402 can include a second laser chip.

[0169] In some examples, the second optical chip assembly 402 may include a second laser driver chip, the second laser driver chip being electrically connected to the second laser chip, and the second laser driver chip being electrically connected to the trace.

[0170] In some examples, the second optical chip assembly 402 may be a second optical transmitter assembly and may be configured to receive an electrical signal transmitted by a trace to emit a laser signal.

[0171] In some examples, the first optical chip assembly 401 and the second optical chip assembly 402 form a first light emitting component that can emit multiple laser beams of different wavelengths.

[0172] In some examples, the first optical chip assembly 401 may be a first light receiving assembly, the second optical chip assembly 402 may be a second light receiving assembly, and the first optical chip assembly 401 and the second optical chip assembly 402 may form a first light receiving component.

[0173] In some examples, the second electronic device may include a third optical chip assembly 501. The second optical transceiver component 500 may include a third optical chip assembly 501.

[0174] In some examples, the third optical chip assembly 501 may include a third laser chip.

[0175] In some examples, the third optical chip assembly 501 may include a third laser driver chip. The third laser driver chip may be electrically connected to a third laser chip. The third laser driver chip may be electrically connected to the trace. In some examples, the third optical chip assembly 501 may be a third laser emitting assembly.

[0176] In some examples, the third optical chip assembly 501 can be configured to receive an electrical signal transmitted by a trace to emit a laser signal. The third optical chip assembly 501 generates heat when in operation.

[0177] In some examples, the third optical chip assembly 501 may be a bare chip.

[0178] In some examples, the third optical chip assembly 501 may be disposed on the upper surface of the circuit board 300 . In some examples, the second electronic device may include a fourth optical chip assembly 502 .

[0179] In some examples, the configuration of the fourth optical chip assembly 502 may be the same as or similar to the configuration of the second optical chip assembly 402 in the aforementioned embodiment of the present application. For details, please refer to the detailed description of the aforementioned embodiment of the present application, which will not be repeated in the embodiments of the present application.

[0180] In some examples, the fourth optical chip assembly 502 and the third optical chip assembly 501 can be constructed to form a second optical transceiver component 500 .

[0181] In some examples, the fourth optical chip assembly 502 and the third optical chip assembly 501 can be constructed to form a second optical emitting component.

[0182] In some examples, the fourth optical chip assembly 502 and the third optical chip assembly 501 can be constructed to form a second light receiving component.

[0183] In some examples, a wire bonding pad (not shown) may be provided on the circuit board 300. The wire bonding pad may be electrically connected to a trace.

[0184] In some examples, the first optical chip assembly 401 can be wire-bonded to a first one of the wire-bonding pads.

[0185] In some examples, the first wire bonding pad is located at a side of the first optical chip assembly 401. In this way, the bonding distance between the first optical chip assembly 401 and the first wire bonding pad can be shortened.

[0186] In some examples, the second optical chip assembly 402 can be wire-bonded to a second one of the wire-bonding pads.

[0187] In some examples, the second wire bonding pad is located at a side of the second optical chip assembly 402. In this way, the bonding distance between the second optical chip assembly 402 and the second wire bonding pad can be shortened.

[0188] In some examples, the third optical chip assembly 501 can be wire-bonded to a third of the wire-bonding pads.

[0189] In some examples, the third wire bonding pad is located at a side of the third optical chip assembly 501. In this way, the bonding distance between the third optical chip assembly 501 and the third wire bonding pad can be shortened.

[0190] In some examples, the fourth optical chip assembly 502 can be wire-bonded to a fourth of the wire-bonding pads.

[0191] In some examples, the fourth wire bonding pad is located at a side of the fourth optical chip assembly 502. In this way, the bonding distance between the fourth optical chip assembly 502 and the fourth wire bonding pad can be shortened.

[0192] In some examples, the circuit board 300 may be provided with a through hole (not shown in the figure). The through hole may penetrate the upper and lower surfaces of the circuit board 300.

[0193] In some examples, the through hole may include a first through hole. The first through hole may be provided corresponding to the first optical chip assembly 401 .

[0194] In some examples, the through hole may include a second through hole, which may be disposed corresponding to the second optical chip assembly 402 .

[0195] In some examples, the circuit board 300 may be provided with a via hole (not shown in the figure). The via hole may penetrate the upper and lower surfaces of the circuit board 300.

[0196] In some examples, the through-hole may include a via.

[0197] In some examples, the through-hole may include an opening extending through the upper and lower surfaces of the circuit board 300 .

[0198] In some examples, the first optical transceiver component 400 may include a first lens assembly 410 .

[0199] In some examples, the first lens assembly 410 can cover the first light emitting assembly and the first light receiving assembly. The first lens assembly can package the first light emitting assembly and the first light receiving assembly on a circuit board.

[0200] In some examples, the first lens assembly 410 can provide packaging and protection for the first light emitting assembly and the first light receiving assembly.

[0201] In some examples, the laser signal emitted by the first optical transmission assembly can be transmitted, reflected, and focused by the first lens assembly 410 and then transmitted to the internal transmission optical fiber ribbon. For example, the laser signal can be transmitted to the first transmission optical fiber ribbon, which is connected to a fiber optic adapter, thereby transmitting the optical signal to an external optical fiber connected to the fiber optic adapter to achieve optical signal transmission.

[0202] In some examples, the external optical fiber transmits the optical signal to the optical fiber adapter, and the internal receiving optical fiber ribbon connected to the optical fiber adapter, such as the first receiving optical fiber ribbon, transmits the optical signal to the first lens assembly 410. The first lens assembly 410 converges, reflects and transmits the received optical signal and then incidents it into the first optical receiving component provided on the circuit board 300. The first optical receiving component converts the optical signal into an electrical signal and transmits it to the gold finger 301.

[0203] In some examples, the structure of the second optical transceiver component 500 may be the same as or similar to that of the first optical transceiver component 400 . For example, the second optical transceiver component 500 may include: a second lens assembly 510 .

[0204] In some examples, the second lens assembly 510 can be disposed on the second light emitting assembly and the second light receiving assembly. The second lens assembly 510 can package the second light emitting assembly and the second light receiving assembly on a circuit board.

[0205] In some examples, the functions of the second lens assembly 510 and the first lens assembly 410 may be the same or similar. For details, please refer to the detailed description of the first lens assembly 410 , which will not be described in detail in the embodiments of the present application.

[0206] In some examples, the first optical chip assembly 401 and the second optical chip assembly 402 can be constructed to form a first chipset 420 .

[0207] In some examples, the first chipset 420 is electrically connected between the first optical transceiver component 400 and the gold finger 301. It is understood that the first chipset 420 generates heat when processing and transmitting electrical signals.

[0208] In some examples, the first chipset 420 may be a DSP chip corresponding to the first optical transceiver component 400 . For example, the first chipset 420 may include a DSP chip corresponding to the first optical transmitting component and a DSP chip corresponding to the first optical receiving component.

[0209] In some examples, the third optical chip assembly 501 and the fourth optical chip assembly 502 can be constructed to form a second chipset 520 .

[0210] In some examples, the second chipset 520 is electrically connected between the second optical transceiver component 500 and the gold finger 301 . It is understandable that the second chipset 520 generates heat when processing and transmitting electrical signals.

[0211] In some examples, the second chipset 520 may be a DSP chip corresponding to the second optical transceiver component 500 . For example, the second chipset 520 may include a DSP chip corresponding to the second optical transmitting component and a DSP chip corresponding to the second optical receiving component.

[0212] In some examples of the embodiments of the present application, the wiring between the gold finger 301 and the first chipset 420 can be located on the surface of the circuit board 300; in some examples, the wiring between the gold finger and the second chipset 520 can be located on the inner layer of the circuit board 300.

[0213] In some examples, the first lens assembly 410 can be covered on the first chipset 420, thereby packaging the first chipset 420 on the circuit board 300; that is, in some examples of the embodiments of the present application, the first chipset 420 can be packaged on the circuit board 300 together with the first optical transmitting assembly and the first optical receiving assembly through the first lens assembly 410.

[0214] In some examples, the second lens assembly 510 can cover the second chipset 520, thereby packaging the second chipset 520 on the circuit board 300. That is, in some examples of the embodiments of the present application, the second chipset 520 can be packaged on the circuit board 300 together with the second optical transmitter and the second optical receiver via the second lens assembly 510. This allows the first chipset 420 and the second chipset 520 to be separately packaged at different locations on the circuit board 300. This allows the heat generated by the first chipset 420 and the second chipset 520 during operation to be distributed at different locations on the circuit board 300. The heat on the circuit board 300 is dispersed, which is beneficial for heat dissipation of the optical module and the transmission of high-speed signals.

[0215] In some examples, the first chipset 420, the first optical transmitting component and the first optical receiving component are packaged on the circuit board 300 through the first lens component 410, thereby shortening the wiring distance between the first chipset 420 and the first optical transmitting component, so that the wiring distance between the first chipset 420 and the first optical transmitting component is smaller than the wiring distance between the first chipset 420 and the gold finger 301, thereby improving the anti-interference capability of the electrical signal between the first chipset 420 and the first transmitting component; the second chipset 520, the second optical transmitting component and the second optical receiving component are packaged on the circuit board 300 through the second lens component 510, thereby shortening the wiring distance between the second chipset 520 and the second optical transmitting component, so that the wiring distance between the second chipset 520 and the second optical transmitting component is smaller than the wiring distance between the second chipset 520 and the gold finger 301, thereby improving the anti-interference capability of the electrical signal between the second chipset 520 and the second transmitting component.

[0216] In some examples, the structures of the first optical transceiver component 400 and the second optical transceiver component 500 may be the same or similar; for ease of description, in some examples of the embodiments of the present application, the first optical transceiver component 400 is used as a specific example for description.

[0217] In some examples, the first light emitting assembly may include a first laser chip 431. The first laser chip 431 is disposed on the circuit board 300 and may emit a laser signal.

[0218] In some examples, the first laser chip 431 can emit four laser signals.

[0219] In some examples, the first light receiving component includes a first light receiving chip 432. The first light receiving chip 432 is disposed on the circuit board 300 and can receive laser signals.

[0220] In some examples, the first optical receiver chip 432 can receive four laser signals. It is understood that in some examples of the present invention, the wavelengths of the four laser signals emitted by the first laser chip 431 can be different, and the wavelengths of the four laser signals received by the first optical receiver chip 432 can also be different.

[0221] In some examples, the first laser chip 431 and the first light receiving chip 432 may be arranged side by side on the circuit board 300 .

[0222] In some examples, the first chipset 420 and the second chipset 520 may be identical or similar. For ease of description, the first chipset 420 is used as a specific example. The first chipset 420 may include a first sub-chip 421 and a second sub-chip 422. The first sub-chip 421 is electrically connected between the first laser chip 431 and the gold finger 301. In some examples, the first sub-chip 421 may be wire-bonded to the first laser chip 431, thereby electrically connecting the first sub-chip 421 to the first laser chip 431. Alternatively, the first sub-chip 421 may be wire-bonded to a trace on the circuit board 300, thereby electrically connecting the first sub-chip 421 to the gold finger 301.

[0223] In some examples, the first lens assembly may have a first groove, and the first laser chip 431 and the first light receiving chip 432 may be located in the first groove.

[0224] In some examples, the first lens assembly may have a second groove, the second groove being connected to the first groove, and a first accommodating cavity being formed between the second groove, the first groove, and the circuit board.

[0225] In some examples, the first sub-chip 421 may be located in the second cavity.

[0226] In some examples, the second sub-chip 422 may be located in the second cavity.

[0227] In some examples of the embodiments of the present application, a bonding height between the first sub-chip 421 and the trace is higher than a bottom wall height of the first groove.

[0228] In some examples, the bonding height between the second sub-chip 422 and the trace is higher than the bottom wall height of the first groove.

[0229] It can be understood that the first laser chip 431 needs to emit an optical signal under the drive of the laser driver chip. Therefore, in some embodiments of the present application, the first sub-chip 421 can be a first bare chip integrating the first laser driver chip and the DSP chip. After the first bare chip integrating the first laser driver chip and the DSP chip is set on the circuit board 300, it is packaged on the circuit board 300 through the first lens assembly 410.

[0230] In some examples of the embodiments of the present application, the second sub-chip 422 is electrically connected between the first optical receiving chip and the gold finger 301. In some examples, the second sub-chip 422 can be wire-bonded to the first optical receiving chip 432, so that the second sub-chip 422 is electrically connected to the first optical receiving chip 432; in addition, the first sub-chip 421 can be electrically connected to the traces on the circuit board 300 by wire bonding, so that the first sub-chip 421 is electrically connected to the gold finger 301.

[0231] In some examples of the embodiments of the present application, a bonding height between the second sub-chip 422 and the trace is higher than a bottom wall height of the first groove.

[0232] It is understood that after receiving the optical signal, the first optical receiver chip 432 needs to amplify the electrical signal through the TIA. Therefore, in some embodiments of the present application, the second sub-chip 422 can be a second bare chip that integrates the TIA and DSP chip. In some examples of the embodiments of the present application, the first laser chip 431, the first bare chip, the first optical receiver chip 432, and the second bare chip can be packaged on the circuit board 300 via the first lens assembly 410, thereby forming the first optical transceiver component 400.

[0233] Figure 12 This is a cross-sectional view of the first optical transceiver component, the second optical transceiver component, and the circuit board in the optical module provided by the embodiment of the present application. Figure 13 yes Figure 12 In some examples of the embodiments of the present application, refer to Figure 12 and Figure 13As shown, for ease of explanation, in the embodiments of the present application, the cooperation between the first optical transceiver component 400 and the circuit board 300 is used as an example for explanation. After the first lens assembly 410 is disposed on the circuit board 300, a first accommodating cavity 404 can be formed between the first lens assembly 410 and the circuit board 300. For example, in some examples, a groove can be provided on the circuit board 300, and the first lens assembly 410 can be covered in the notch of the groove, thereby forming the first accommodating cavity 404. The first optical transmitting assembly and the first optical receiving assembly can be disposed in the first accommodating cavity 404; in addition, the first chipset 420 can also be disposed in the first accommodating cavity 404. In other words, the first laser chip, the first sub-chip, the first optical receiving chip, and the second sub-chip are packaged on the circuit board 300 via the first lens assembly 410.

[0234] It will be appreciated that in some embodiments of the present application, the structures of the first optical transceiver component 400 and the second optical transceiver component 500 can be identical or similar. Therefore, after the second lens assembly 510 is positioned on the circuit board 300, a second accommodating cavity 504 can be formed between the second lens assembly 510 and the circuit board 300. The second optical transmitting assembly, the second optical receiving assembly, and the second chipset 520 can be positioned within the second accommodating cavity 504. This allows the first chipset and the second chipset to be positioned at different locations on the circuit board 300, facilitating the distribution of heat generated by the first and second chipsets during operation to different locations on the circuit board 300. This facilitates heat dissipation from the optical module and facilitates high-speed signal transmission. In some examples of the present application, the second accommodating cavity 504 can be formed in the same or similar manner as the first accommodating cavity 404. For example, a groove can be provided on the circuit board 300, with the second lens assembly 510 positioned to cover the notch of the groove, thereby forming the second accommodating cavity 504.

[0235] Figure 14 This is a structural diagram of the first lens assembly in the optical module provided in the embodiment of the present application. Figure 1 , Figure 15 : is a bottom view of the first lens assembly in the optical module provided in an embodiment of the present application, Figure 16 It is along Figure 15 Cross-sectional view of the CC line, Figure 17 yes Figure 16 A partial enlarged view of point D in the middle. Figure 14-16As shown, in some examples of the embodiments of the present application, the structures of the first lens assembly 410 and the second lens assembly can be the same or similar. In some examples of the embodiments of the present application, the first lens assembly 410 is used as a specific example for description. The first lens assembly 410 has a first groove 411 and a second groove 412. The first groove 411 and the second groove 412 are connected. In some examples, the first groove 411 and the second groove 412 are formed on the side of the first lens assembly 410 facing the circuit board, so that after the first lens assembly 410 is placed on the circuit board, a first accommodating cavity is formed between the first groove 411 and the second groove 412 and the circuit board.

[0236] In some examples of the embodiments of the present application, the first laser chip and the first light receiving chip can be located in the first groove 411; that is, when the first lens assembly 410 is connected to the circuit board, the first groove 411 can be inverted on the side of the first laser chip and the first light receiving chip facing away from the circuit board.

[0237] In some examples, the first groove 411 may include a first sub-groove 4111 and a second sub-groove 4112. The first laser chip and the first light receiving chip may be arranged side by side on the circuit board, and the first sub-groove 4111 and the second sub-groove 4112 may be arranged along the arrangement direction of the first laser chip and the first light receiving chip. The first sub-groove 4111 may be inverted on the side of the first light receiving chip facing away from the circuit board, and the second sub-groove 4112 may be inverted on the side of the first laser chip facing away from the circuit board; that is, the first light receiving chip is located within the first sub-groove 4111, and the first laser chip is located within the second sub-groove 4112.

[0238] In some examples, the bottom wall of the second sub-recess 4112 is provided with a second converging lens 4114, and the second converging lens 4114 is configured to converge the laser beam emitted by the first laser chip. As described in detail in the aforementioned embodiment of the present application, the first laser chip can emit 4 emission laser beams of different wavelengths; therefore, 4 second converging lenses 4114 can be provided, and the 4 second converging lenses 4114 respectively converge 4 emission laser beams of different wavelengths; it can be understood that the number of second converging lenses 4114 can also be 6, 8, etc. In the embodiment of the present application, there is no limit on the number of second converging lenses 4114. Figure 13 As shown, the emitted laser beam converged by the second converging lens 4143 can propagate within the first lens assembly 410 .

[0239] It is understood that the four beams of different wavelengths emitted by the first laser chip propagate outward to another receiving device, such as another optical module connected to a host computer. Generally, the receiving device has a certain upper threshold for the optical power it can receive. In other words, the optical power of the beams emitted by the first laser chip that reach the second converging lens 4114 must be controlled within a certain range to prevent the optical power from exceeding the upper threshold of the receiving device and causing damage to the receiving device.

[0240] To this end, in some examples of the embodiments of the present application, the bottom wall of the second sub-recess 4112 may be provided with a light-absorbing layer (not shown in the figure), wherein the second converging lens 4114 protrudes from the light-absorbing layer. That is to say, in some examples of the embodiments of the present application, the light-absorbing layer may be provided at a position other than the second converging lens 4114; or, the second converging lens 4114 is not provided with a light-absorbing layer. In this way, the light-absorbing layer can absorb part of the divergent light beam emitted by the first laser chip, so that the optical power of the light beam entering the second converging lens is within the receiving optical power range of the receiving device, which can effectively protect the receiving device from damage. In some examples, the light-absorbing layer may be a plating layer, a coating layer, a spray layer, or an adhesive layer.

[0241] In some examples of the embodiments of the present application, the second sub-groove 4112 can be connected to the first sub-groove 4111. It is understood that in some examples, the second sub-groove 4112 and the first sub-groove 4111 can also be isolated from each other. By setting the second sub-groove 4112 and the first sub-groove 4111 to be connected to each other, when the second sub-groove 4112 and the first sub-groove 4111 are processed and produced, the second sub-groove 4112 and the first sub-groove 4111 can be processed and formed at the same time, saving the process of processing the first sub-groove 4111 and the second sub-groove 4112, thereby reducing the production and processing costs of the first lens assembly 410.

[0242] In some examples, the bottom wall of the first sub-recess 4111 is provided with a first converging lens 4113, and the first converging lens 4113 is configured to converge the laser beam onto the first light receiving chip. As described in detail in the aforementioned embodiments of the present application, the first light receiving chip can receive four receiving laser beams of different wavelengths. Therefore, four first converging lenses 4113 can also be provided, and the four first converging lenses 4113 respectively converge the four receiving laser beams of different wavelengths onto the first light receiving chip. It can be understood that the number of first converging lenses 4113 can also be other numbers, such as 6, 8, etc.; the embodiment of the present application does not limit the number of first converging lenses 4113. Among them, the propagation path of the received laser beam in the first lens assembly 410 can be parallel or approximately parallel to the propagation path of the transmitted laser beam in the first lens assembly 410, and the propagation direction of the received laser beam in the first lens assembly 410 is opposite to that of the transmitted laser beam.

[0243] In some examples, the bottom wall of the first sub-groove 4111 protrudes from the bottom wall of the second sub-groove 4112; in this way, the first converging lens 4113 can converge the laser beam on the first light receiving chip within the effective focal length range; the second converging lens can converge the laser beam emitted by the first laser chip within the effective focal length range.

[0244] In some examples of the embodiments of the present application, the arrangement direction of the first sub-chip and the second sub-chip on the circuit board can be consistent with the arrangement direction of the first laser chip and the first light receiving chip. For example, the first laser chip and the first light receiving chip are arranged along the arrangement direction of the first sub-groove 4111 and the second sub-groove 4112; the first sub-chip and the second sub-chip can also be arranged along the arrangement direction of the first sub-groove 4111 and the second sub-groove 4112.

[0245] It is understood that, as described in detail in the aforementioned embodiments of this application, the first sub-chip can be formed by integrating a first laser driver chip and a DSP chip, and the second sub-chip can be formed by integrating a TIA and a DSP chip. Generally, the first sub-chip and the second sub-chip occupy a relatively large area on the circuit board. To facilitate packaging of the first sub-chip, the second sub-chip, the first laser chip, and the first light receiving chip, in some examples of the embodiments of this application, along the arrangement direction of the first sub-chip and the second sub-chip, the width of the second groove 412 can be greater than the width of the first groove 411. The first lens assembly 410 can also be configured such that the width of the first end is greater than the width of the second end, wherein the first end is the end that covers the first chipset 420, and the second end is the end that covers the first laser chip and the first light receiving chip.

[0246] In some examples of the embodiments of the present application, to facilitate electrical connection between the first laser chip and the first sub-chip, the first laser chip and the first sub-chip can be arranged along the length direction of the circuit board, wherein the surfaces of the first laser chip and the first sub-chip facing away from the circuit board can be flush, thereby facilitating a reduction in the bonding distance between the first laser chip and the first sub-chip and improving the anti-interference capability of electrical signals transmitted between the first sub-chip and the first laser chip.

[0247] In some examples of the embodiments of the present application, the first sub-chip is connected to a trace on the circuit board via a bonding wire, that is, one end of the bonding wire is connected to a pad on the first sub-chip, and the other end of the bonding wire is connected to the trace on the circuit board via a pad on the circuit board. The height of the bonding wire between the first sub-chip and the trace is higher than the surface height of the bottom wall of the first groove.

[0248] The second sub-chip is connected to the wiring on the circuit board through bonding, and the bonding height between the second sub-chip and the wiring is higher than the height of the bottom wall of the first groove.

[0249] To prevent the bottom wall of the second groove 412 from interfering with the bonding between the first and second sub-chips and the traces on the circuit board, thereby affecting signal transmission, in some examples of the present application, the second groove 412 is recessed within the first groove 411, thereby avoiding bonding between the first and second sub-chips and the traces. In some examples, the distance between the bottom wall of the second groove 412 and the circuit board surface is greater than the distance between the bottom wall of the first groove 411 and the circuit board.

[0250] In some examples of the embodiments of the present application, in order to facilitate the installation and fixing of the first lens assembly 410 on the circuit board, refer to Figure 14 and Figure 15 As shown, a second glue dispensing groove 1001 and a second glue overflow groove 1002 are provided on the side of the first lens assembly 410 facing the circuit board, and the first glue dispensing groove 1041 and the second glue overflow groove 1002 are provided on the peripheral wall of the second groove 412, wherein the second glue overflow groove 1002 is recessed in the end face of the peripheral wall of the second groove 412, and the second glue dispensing groove 1001 is recessed in the second glue overflow groove 1002; wherein the second glue overflow groove 1002 and the second glue dispensing groove 1001 are arranged at intervals along the peripheral wall of the second groove 412.

[0251] In some examples, to facilitate glue overflow, the second glue overflow groove 1002 can pass through the inner and outer side walls of the second groove 412, so that the glue overflowing from the second glue dispensing groove 1001 first flows in the second glue overflow groove 1002. After the second glue overflow groove 1002 is filled, the glue can also flow along both sides of the second glue overflow groove 1002 into the second groove 412 or to the circuit board outside the first lens assembly 410, thereby avoiding the problem of excessive glue in the second glue overflow groove 1002 causing a gap between the first lens assembly 410 and the circuit board, thereby improving the tightness of the contact between the first lens assembly 410 and the circuit board.

[0252] For some examples, refer to Figure 14 and Figure 15 As shown, in order to facilitate the exhaust of hot air generated in the first accommodating cavity, an exhaust groove 1003 may be provided on the side of the first lens assembly 410 facing the circuit board.

[0253] In some examples, the exhaust groove 1003 can pass through the inside and outside of the first accommodating cavity, so that the inside and outside of the first accommodating cavity are connected to each other; in this way, it is convenient to discharge the hot air in the first accommodating cavity, and the heat generated by the first sub-chip and the second sub-chip can be dissipated in time.

[0254] In some examples, the venting groove can isolate the second glue overflow groove from the bottom wall of the first lens assembly in contact with the circuit board. This can prevent glue in the second glue overflow groove from being siphoned into the space between the bottom wall of the first lens assembly in contact with the circuit board.

[0255] Figure 18 This is a structural diagram of the first lens assembly in the optical module provided in the embodiment of the present application. Figure 2 , Figure 19 This is a structural diagram of the first lens assembly in the optical module provided in the embodiment of the present application. Figure 3 , Figure 20 This is an enlarged cross-sectional view of the first lens assembly, the first transmitting optical fiber ribbon and the circuit board in the optical module provided by the embodiment of the present application. Figures 16-20 As shown, in some examples of the embodiments of the present application, the first lens assembly 410 may further be provided with a first reflecting lens 4131; in some examples, the top of the first lens assembly 410 may further have a third groove 413, and the first reflecting lens 4131 may be provided in the third groove 413. The first reflecting lens 4131 is tilted relative to the light emitting surface of the first reflective assembly; or, in some examples, it can also be understood that the first reflecting lens 4131 is tilted relative to the bottom wall of the first groove, so that the light beam converged by the first converging lens 4113 is tilted relative to the first reflecting lens 4131, so that the first reflecting lens 4131 can reflect the light beam. For example, referring to Figure 17 As shown, the emitted laser beam converged by the first converging lens 4113 propagates in the first lens assembly 410. After the emitted laser beam is irradiated onto the reflective surface of the first reflecting lens 4131, the first reflecting lens 4131 reflects the emitted laser beam, thereby changing the propagation direction of the first laser beam, so that the first emitted laser beam is transmitted to the first emitting optical fiber ribbon.

[0256] Reference Figure 16 、 Figure 17 and Figure 20 As shown, in some examples of the embodiments of the present application, the front end of the first lens assembly 410 has a fourth groove 414, and the fourth groove 414 is located on the reflective surface side of the first reflective lens 4131. The front end surface of the first lens assembly 410 can be the end where the first transmitted laser beam emerges from the first lens assembly 410, or the end where the first received laser beam is incident on the first lens assembly 410. In some examples of the embodiments of the present application, the first optical transceiver component 400 further includes: a first internal optical fiber ribbon, one end of which extends into the fourth groove 414, so that the first transmitted laser beam is incident on the first internal optical fiber ribbon and transmitted along the first internal optical fiber ribbon, or the first received laser beam received by the first internal optical fiber ribbon is transmitted from the fourth groove 414 to the first lens assembly 410 and reflected by the first reflective lens 4131.

[0257] Reference Figure 20As shown, in some examples of the embodiments of the present application, to facilitate supporting the first internal optical fiber ribbon, in some examples, the optical module may further include a first optical fiber bracket 450. The first internal optical fiber ribbon is passed through the first optical fiber bracket 450, and the end of the first internal optical fiber ribbon protrudes from the end surface of the first optical fiber bracket 450 and extends into the fourth groove 414. The first optical fiber bracket 450 can be connected to the first end of the first lens assembly 410, so that the first optical fiber bracket 450 is opposite to the fourth groove 414.

[0258] Figure 21 This is a structural diagram of the first lens assembly in the optical module provided in the embodiment of the present application. Figure 4 , Figure 22 This is a structural diagram of the first lens assembly in the optical module provided in the embodiment of the present application. Figure 5 . Reference Figure 21 and Figure 22 As shown, in some examples of the embodiments of the present application, a third converging lens 4141 and a fourth converging lens 4142 are provided in the fourth groove 414. It is understood that the third converging lens 4141 can be disposed on the transmission path of the first transmitted laser beam, thereby collimating the first transmitted laser beam reflected by the first reflective lens into the first inner optical fiber ribbon and transmitting it within the first inner optical fiber ribbon. The first inner optical fiber ribbon may include a first transmitting optical fiber ribbon and a first receiving optical fiber ribbon; in some examples, the third converging lens 4141 can be disposed opposite the end face of the first transmitting optical fiber ribbon; the fourth converging lens 4142 can be disposed on the transmission path of the first received laser beam, thereby converging the first received laser beam received by the first inner optical fiber ribbon into the first lens assembly 410 and transmitting it within the first lens assembly 410; the fourth converging lens 4142 can be disposed opposite the end face of the first receiving optical fiber ribbon.

[0259] In some examples of the embodiments of the present application, the number of the third converging lenses 4141 may be the same as the number of the first converging lenses; the number of the fourth converging lenses 4142 may be the same as the number of the second converging lenses.

[0260] In some examples of the embodiments of the present application, the front end of the first lens assembly 410 further includes a first bottom wall 4101, a first side wall 4102, a second side wall 4103, a third side wall 4104, a first top wall 4105, and a second top wall 4106; the first side wall 4102 and the second side wall 4103 are located on both sides of the first bottom wall 4101, the first top wall 4105 is connected to the first side wall 4102, and the first top wall 4105 is opposite to the first bottom wall 4101; the second top wall 4106 is connected to the second side wall 4103, and the second top wall 4106 is opposite to the first bottom wall 4101 The third side wall 4104 is connected to the first bottom wall 4101, the first side wall 4102, the second side wall 4103, the first top wall 4105, and the second top wall 4106. In some examples of the embodiments of the present application, the first bottom wall 4101, the first side wall 4102, the second side wall 4103, the third side wall 4104, the first top wall 4105, and the second top wall 4106 collectively form a first slot 415. The fourth groove 414 is recessed in the third side wall 4104, that is, the notch direction of the fourth groove 414 is consistent with the opening direction of the first slot 415. The first slot 415 can be used to insert a first optical fiber holder, thereby securing the first optical fiber holder to the first lens assembly 410.

[0261] In some examples, the exhaust groove can isolate the second glue overflow groove from the first bottom wall; the overflow glue in the second glue overflow groove can be isolated by the exhaust groove, which can prevent the glue from being siphoned between the first bottom wall and the circuit board.

[0262] For some examples, refer to Figure 21 and Figure 22 As shown, the first top wall 4105 has a first guide slope 1051 on the side facing away from the third side wall 4104, and the distance between the end of the first guide slope 1051 facing the third side wall 4104 and the first bottom wall 4101 is smaller than the distance between the end of the first guide slope 1051 facing away from the third side wall 4104 and the first bottom wall 4101, so that the first guide slope 1051 is inclined relative to the first bottom wall 4101; the second top wall 4106 has a second guide slope 1061 on the side facing away from the third side wall 4104, and the distance between the end of the second guide slope 1061 facing the third side wall 4104 and the first bottom wall 4101 is smaller than the distance between the end of the second guide slope 1061 facing away from the third side wall 4104 and the first bottom wall 4101, so that the second guide slope 1061 is inclined relative to the first bottom wall 4101. Thus, the opening of the first slot 415 is in a constricted shape. When inserting the first optical fiber holder into the first slot 415 , the first optical fiber holder is inserted from the large opening end to the small opening end, which facilitates the insertion and installation of the first optical fiber holder.

[0263] In some examples of the embodiments of the present application, in order to facilitate the fixation of the first optical fiber bracket, refer to Figure 21and Figure 22 As shown, the third side wall 4104 may further be provided with a first glue dispensing groove 1041, the top of the first glue dispensing groove 1041 is connected to the fourth groove 414, and the bottom of the first glue dispensing groove 1041 is connected to the first bottom wall 4101. In some examples, the depth of the first glue dispensing groove 1041 is less than the depth of the fourth groove 414, and is along the width direction of the first lens assembly 410 (for example Figure 21 In the direction shown by the x-axis), the width of the first glue dispensing groove 1041 is smaller than the width of the fourth groove 414.

[0264] In some examples, the first glue dispensing groove 1041 can be located on a side of the fourth groove 414 facing the circuit board. Generally, the first lens assembly 410 can be located on the upper surface of the circuit board, and therefore, the first glue dispensing groove 1041 can be located below the fourth groove 414. In some examples of the embodiments of the present application, when fixing the first optical fiber bracket, glue can be dispensed in the first glue dispensing groove 1041, and then the first optical fiber bracket can be inserted into the first slot 415, and the first optical fiber bracket can be fixed by dispensing glue in the first glue dispensing groove 1041. In the embodiment of the present application, the first glue dispensing groove 1041 is connected to the fourth groove 414. In this way, the fourth groove 414 can also serve as a glue overflow groove, and the excess glue in the first glue dispensing groove 1041 can overflow into the fourth groove 414. In addition, the depth of the first glue dispensing groove 1041 is less than the depth of the fourth groove 414, and the width of the first glue dispensing groove 1041 is less than the width of the fourth groove 414. In this way, the amount of glue overflowing into the fourth groove 414 is limited and will not affect the light inserted into the fourth groove 414. In addition, the bottom end of the first glue dispensing groove 1041 is connected to the first bottom wall 4101. In this way, some glue can also overflow onto the first bottom wall 4101, thereby forming an adhesive fixation between the first bottom wall 4101 and the first optical fiber bracket, thereby improving the stability of the fixation of the first optical fiber bracket.

[0265] In some examples of the embodiments of this application, refer to Figure 21 and Figure 22As shown, the first lens assembly 410 is provided with a plug-in post 416, which can be set on the third side wall 4104 and extend toward the first slot 415. In some examples, a plug-in hole can be set on the first optical fiber bracket 450, and the plug-in post 416 is inserted into the first plug-in hole, thereby positioning and fixing the first optical fiber bracket 450. It is understood that in some examples, a plug-in hole can also be set on the third side wall 4104, the plug-in hole is connected to the first slot 415, and the plug-in post 416 is set on the side of the first optical fiber bracket facing the third side wall 4104, and the plug-in post 416 is inserted into the plug-in hole, thereby positioning and fixing the first optical fiber bracket. In some examples, there can be two plug-in posts 416, one of which is located on one side of the fourth groove 414 along the width direction, and the other plug-in post 416 is located on the other side of the fourth groove 414 along the width direction.

[0266] It is understandable that in some examples of the embodiments of the present application, the plug-in column 416 may be provided on one side of the fourth groove 414 and the plug-in hole may be provided on the other side.

[0267] In some examples of the embodiments of the present application, to enhance the stability of the first optical fiber support in supporting the first internal optical fiber ribbon, the first optical fiber support is typically longer. In some examples, the length of the first optical fiber support is greater than twice the length of the first bottom wall 4101. To enhance the stability of the first bottom wall 4101 in supporting the first optical fiber support, in some examples, the front end of the first lens assembly 410 further comprises a first extension portion, which includes a first extended bottom wall 4107, a first extended side wall 4108, and a second extended side wall 4109. The first extended bottom wall 4107 is connected to the end of the first bottom wall 4101 facing away from the third side wall 4104. In some examples, the first extended bottom wall 4107 and the first bottom wall 4101 can be formed as one piece; the first extended side wall 4108 is connected to the end of the first side wall 4102 facing away from the third side wall 4104. In some examples, the first extended side wall 4108 can be formed as one piece with the first side wall 4102; the second extended side wall 4109 is connected to the end of the second side wall 4103 facing away from the third side wall 4104. The second extended side wall 4109 can be formed as one piece with the second side wall 4103.

[0268] The first extended sidewall 4108 and the second extended sidewall 4109 are connected to opposite sides of the first extended bottom wall 4107. The first extended sidewall 4108 is lower than the first sidewall 4102, while the second extended sidewall 4109 is lower than the second sidewall 4103. A third guide slope 1081 is formed at the top of the first extended sidewall 4108, while a fourth guide slope 1091 is formed at the top of the second extended sidewall 4109. The distance between the end of the third guide slope 1081 facing the first extended bottom wall 4107 and the second extended sidewall 4109 is smaller than the distance between the end of the third guide slope 1081 facing away from the first extended bottom wall 4107 and the second extended sidewall 4109. The distance between the end of the fourth guide slope 1091 facing the first extended bottom wall 4107 and the first extended sidewall 4108 is smaller than the distance between the end of the fourth guide slope 1091 facing away from the first extended bottom wall 4107 and the first extended sidewall 4108. This results in the top opening of the first extended portion having a tapered shape.

[0269] In some examples, the sum of the lengths of the first extended bottom wall 4107 and the first bottom wall 4101 is greater than half the length of the first optical fiber holder. Thus, after the first optical fiber holder is inserted into the first slot 415, the center of the first optical fiber holder is located on the first extended bottom wall 4107 and the first bottom wall 4101, thereby improving the stability of the support provided to the first optical fiber holder.

[0270] In some examples of the embodiments of the present application, the first lens assembly 410 further includes a fourth sidewall 41010 and a fifth sidewall 41011. The fourth sidewall 41010 and the fifth sidewall 41011 are disposed on opposite sides of the first bottom wall 4101. The fourth sidewall 41010 is connected to the first top wall 4105, and the fifth sidewall 41011 is connected to the second top wall 4106. A fifth groove 417 is formed between the fourth sidewall 41010 and the fifth sidewall 41011, and the fifth groove 417 is connected to the first slot 415. In some examples, the fifth groove 417 can extend through the front and rear ends of the first lens assembly 410, wherein the rear end of the first lens assembly 410 can be the end of the first lens assembly 410 facing away from the first optical fiber support 450.

[0271] In some examples, the bottom wall of the fifth groove 417 has a height difference, and the third groove 413 is recessed below the bottom wall of the fifth groove 417. For example, the bottom wall of the fifth groove 417 facing the rear end is lower than the bottom wall of the fifth groove 417 facing the front end. In this way, the thickness of the bottom wall of the fifth groove 417 facing the front end is greater than the thickness of the bottom wall of the fifth groove 417 facing the rear end, which facilitates the formation of the third groove 413 by recessing the bottom wall of the fifth groove 417. The third groove 413 can be recessed in the bottom wall of the fifth groove 417 facing the front end. In some examples of the embodiments of the present application, the width of the fifth groove 417 can be greater than the width of the third groove 413, so that the third groove 413 can be arranged on the bottom wall of the fifth groove 417; the width of the third groove 413 can be greater than the width of the fourth groove 414; in this way, the first reflecting lens 4131 can cover the width direction of the fourth groove 414 and can reflect the first emitted laser beam and the first received laser beam; in addition, the width of the fifth groove 417 can be smaller than the width of the first slot 415; in this way, the first top wall 4105 is formed on the fourth side wall 41010, and the second top wall 4106 is formed on the fifth side wall 41011, which facilitates the processing and forming of the first top wall 4105 and the second top wall 4106.

[0272] In some examples, the side of the bottom wall of the fifth groove 417 facing the gold finger 301 is an inclined surface; in this way, the height difference of the bottom wall of the fifth groove 417 is transitioned through the inclined surface, so that the height difference of the bottom wall of the fifth groove 417 is smoothly transitioned, which can reduce the bending of the internal optical fiber ribbon limited in the fifth groove 417 and effectively protect the internal optical fiber ribbon.

[0273] In some examples of the embodiments of the present application, a sixth groove 418 is defined on the side of the fourth sidewall 41010 facing away from the fifth sidewall 41011, and a seventh groove 419 is defined on the side of the fifth sidewall 41011 facing away from the fourth sidewall 41010. In other words, the sixth groove 418 and the seventh groove 419 are disposed opposite each other. This facilitates the removal of the first lens assembly 410 through the sixth groove 418 and the seventh groove 419, improving the ease of removal and transfer of the first lens assembly 410.

[0274] Figure 23 This is a structural diagram of the cooperation between the first lens assembly, the first optical fiber bracket, and the first internal optical fiber ribbon in the optical module provided by an embodiment of the present application. Figure 24 This is the decomposition structure of the first lens assembly, the first optical fiber bracket and the first internal optical fiber ribbon in the optical module provided in the embodiment of the present application Figure 1 , Figure 25 This is the decomposition structure of the first lens assembly, the first optical fiber bracket and the first internal optical fiber ribbon in the optical module provided in the embodiment of the present application Figure 2 . Reference Figure 23-Figure 25As shown, in some examples of the embodiments of the present application, the first optical fiber bracket 450 is inserted into the first slot. Figure 24 As shown, when the first optical fiber bracket 450 is inserted into the first slot, it can be firstly Figure 20 In the negative direction of the middle y-axis, the first optical fiber bracket 450 is inserted into the first extension portion from the top opening of the first extension portion. At this time, the third guiding bevel and the fourth guiding bevel play a guiding role for the first optical fiber bracket 450, facilitating the insertion of the first optical fiber bracket 450. After the bottom of the first optical fiber bracket 450 contacts the bottom wall of the first extension portion, it can be inserted along the Figure 24 The direction shown by the center x-axis moves the first optical fiber bracket 450 toward the third side wall. At this time, the first guide bevel and the second guide bevel guide the first optical fiber bracket 450, which facilitates the insertion of the first optical fiber bracket 450 and improves the assembly and installation efficiency of the first optical fiber bracket 450.

[0275] In some examples of the embodiments of the present application, the first internal optical fiber ribbon includes: a first transmitting optical fiber ribbon 430 and a first receiving optical fiber ribbon. One end of the first transmitting optical fiber ribbon 430 extends into the fourth groove 414, and the end face of the first transmitting optical fiber ribbon 430 is opposite to the third converging lens. In some examples, a first gap is provided between the end face of the first transmitting optical fiber ribbon 430 and the third converging lens. This prevents the end face of the first transmitting optical fiber ribbon 430 from contacting the third converging lens, thereby improving the coupling efficiency of the optical signal. In some examples, the end face of the first transmitting optical fiber ribbon 430 can be a bevel. In this way, when the first transmitting laser beam transmitted from the third converging lens is irradiated onto the end face of the first transmitting optical fiber ribbon 430, it will not be reflected back into the first lens assembly 410 by the end face of the first transmitting optical fiber ribbon 430, thereby reducing interference with the first transmitting laser beam.

[0276] In some examples, the first transmitting optical fiber ribbon 430 may include four optical fibers, each of which transmits one first transmitting laser beam, thereby meeting the transmission of four first transmitting laser beams.

[0277] In some examples of the embodiments of the present application, one end of the first receiving optical fiber ribbon 440 extends into the fourth groove 414, and the end face of the first receiving optical fiber ribbon 440 is opposite to the fourth converging lens. In some examples, a second gap is provided between the end face of the first receiving optical fiber ribbon 440 and the fourth converging lens. This prevents the end face of the first receiving optical fiber ribbon 440 from contacting the fourth converging lens, thereby improving the coupling efficiency of the optical signal. The fourth converging lens converges the first receiving laser beam transmitted by the first receiving optical fiber ribbon 440 and transmits it within the first lens assembly 410. After reflection by the first reflecting lens 4131, it is transmitted from the second converging lens to the first light receiving chip. The second gap can be the same as or similar to the first gap. In some examples, the first receiving optical fiber ribbon 440 can also include four optical fibers, each of which transmits one first receiving laser beam, thereby satisfying the transmission of four first receiving laser beams.

[0278] In some examples, in order to facilitate the fixation and support of the first transmitting optical fiber ribbon 430 and the first receiving optical fiber ribbon 440, the first transmitting optical fiber ribbon 430 and the first receiving optical fiber ribbon 440 can be passed through the first optical fiber bracket 450; wherein, the end face of the first transmitting optical fiber ribbon 430 and the end face of the first receiving optical fiber ribbon 440 protrude from the first optical fiber bracket 450; when the first optical fiber bracket 450 is inserted into the first slot, the end face of the first transmitting optical fiber ribbon 430 and the end face of the first receiving optical fiber ribbon 440 extend into the fourth groove. By passing the first transmitting optical fiber ribbon 430 and the first receiving optical fiber ribbon 440 through the first optical fiber bracket 450, and inserting the first optical fiber bracket 450 into the first slot, it is convenient to connect the first transmitting optical fiber ribbon 430 and the first receiving optical fiber ribbon 440 with the first lens assembly 410, thereby improving the assembly efficiency of the first transmitting optical fiber ribbon 430, the first receiving optical fiber ribbon 440 and the first lens assembly 410; by controlling the end faces of the first transmitting optical fiber ribbon 430 and the first receiving optical fiber ribbon 440 to protrude from the first optical fiber bracket 450, so that after the first optical fiber bracket 450 is inserted into the first slot, the side wall of the first optical fiber bracket 450 abuts against the third side wall 4104, thereby facilitating the limitation of the distance between the end face of the first transmitting optical fiber ribbon 430 and the third converging lens, and facilitating the limitation of the distance between the end face of the first receiving optical fiber ribbon 440 and the fourth converging lens.

[0279] In some examples of the embodiments of this application, refer to Figure 20 and Figure 21As shown, one of the first lens assembly 410 and the first fiber optic support 450 is provided with a plug-in post 416, and the other of the first lens assembly 410 and the first fiber optic support 450 is provided with a plug-in hole 451. The plug-in post 416 is inserted into the plug-in hole 451, thereby fixing and positioning the first fiber optic support 450. This facilitates alignment of the end face of the first transmitting fiber optic ribbon 430 with the third converging lens, and alignment of the end face of the first receiving fiber optic ribbon 440 with the fourth converging lens. In some examples, the plug-in post 416 is provided on the first lens assembly 410 and the plug-in hole 451 is provided on the first fiber optic support 450. It is understood that in some examples, the plug-in post 416 can also be provided on the first fiber optic support 450, and the plug-in hole 451 is correspondingly provided on the first lens assembly 410.

[0280] Figure 26 This is a schematic diagram of the structure of the cooperation between the first optical transceiver component and the second optical transceiver component in the optical module provided by the embodiment of the present application. Figure 26 As shown, in some examples of the embodiments of the present application, the first optical transceiver component 400 and the second optical transceiver component 500 can be arranged along the length direction of the circuit board; in this way, the limited space on the circuit board can be fully utilized and the space utilization rate on the circuit board can be improved. Among them, the second lens assembly 510 has the same structure as the first lens assembly 410. For example, the second lens assembly 510 has the same or similar structure as the first lens assembly 410. Figure 26 As shown, the second lens assembly 510 may also have a fourth sidewall and a fifth sidewall, with a fifth groove 517 formed between the fourth and fifth sidewalls. In some examples, the second lens assembly 510 is located on the side of the first lens assembly 410 facing away from the gold finger, and the first transmitting optical fiber ribbon 430 and the first receiving optical fiber ribbon 440 are confined within the fifth groove 517 of the second lens assembly 510. As described in detail in the previous embodiments of this application, the bottom wall of the fifth groove 517 has a height difference, and the side of the bottom wall of the fifth groove 517 facing the gold finger is an inclined surface. In this way, the provision of the inclined surface allows the height difference on the bottom wall of the fifth groove 517 to transition smoothly. After the first transmitting optical fiber ribbon 430 and the first receiving optical fiber ribbon 440 are confined in the fifth groove 517, the degree of bending of the first transmitting optical fiber ribbon 430 and the first receiving optical fiber ribbon 440 can be reduced, thereby providing better protection for the first transmitting optical fiber ribbon 430 and the first receiving optical fiber ribbon 440.

[0281] It can be understood that in some examples, the first optical transceiver component may be located on the side of the second optical transceiver component facing away from the gold finger. In this case, the second transmitting optical fiber ribbon 530 and the second receiving optical fiber ribbon 540 of the second optical transceiver component may be confined to the fifth groove 417 of the first lens assembly 410.

[0282] The optical module provided in the embodiment of the present application is further provided with a first chipset and a second chipset on the circuit board, the first chipset is provided in the first accommodating cavity, and the second chipset is provided in the second accommodating cavity; in this way, the first chipset and the second chipset are distributed at different positions on the circuit board, so that the heat generated by the first chipset and the second chipset when processing and transmitting electrical signals is distributed at different positions on the circuit board, which is convenient for heat dissipation and is conducive to improving the heat dissipation effect of the optical module; in addition, the first chipset is provided in the first accommodating cavity, and the second chipset is provided in the second accommodating cavity; in this way, after the first chipset is electrically connected to the gold finger through the wiring on the circuit board, the heat between the first chipset and the first optical transmitting component is The routing distance is smaller than the routing distance between the gold finger, which shortens the routing distance between the first chipset and the first optical emission component, thereby reducing the interference during the transmission of electrical signals between the first chipset and the first optical emission component; the second chipset is electrically connected to the gold finger through the routing on the circuit board, and the routing distance between the second chipset and the second optical emission component is smaller than the routing distance between the gold finger, which shortens the routing distance between the second chipset and the second optical emission component, thereby reducing the interference during the transmission of electrical signals between the second chipset and the second optical emission component, and improving the anti-interference ability of the optical module for the transmission of high-speed signals, that is, improving the transmission performance of the optical module for high-speed signals.

[0283] Figure 27 This is a schematic diagram of the exploded structure of the circuit board and the heat conduction component in the optical module provided according to some embodiments of the present application. Figure 28 The structure of the circuit board in the optical module provided in some embodiments of the present application is shown in FIG. Figure 2 .

[0284] For some examples, refer to Figure 27 and Figure 28 As shown, a heat conducting component 302 may be provided on the circuit board 300 .

[0285] In some examples, the heat conducting component 302 can be disposed on the lower surface of the circuit board 300. The heat conducting component 302 can be in thermal contact with the lower housing to conduct heat from the circuit board 300 to the lower housing for heat dissipation.

[0286] In some examples, the thermal conductive assembly 302 may include a first thermal conductive sub-component 3021 .

[0287] In some examples, the first sub-heat conducting member 3021 may be disposed on the lower surface of the circuit board 300 .

[0288] In some examples, the first heat conducting sub-member 3021 may protrude from the lower surface of the circuit board 300 .

[0289] In some examples, the first sub-heat-conducting member 3021 may include a first flexible heat-conducting member. In some examples, the first sub-heat-conducting member 3021 may include a hard heat-conducting member. For example, the first sub-heat-conducting member 3021 may be a copper block, an aluminum block, or a copper foil block.

[0290] In some examples, the thermally conductive assembly may include a first thermally conductive connector (not shown).

[0291] In some examples, the first thermally conductive connection member may be disposed in the first through hole and in thermally conductive contact with the first optical chip assembly 401 .

[0292] In some examples, the first thermally conductive connection member may be a thermally conductive layer disposed on an inner wall of the through hole.

[0293] In some examples, the thermally conductive layer may be a copper clad layer.

[0294] In some examples, the thermally conductive layer may be an aluminum foil layer.

[0295] In some examples, the thermally conductive layer may be a copper foil layer.

[0296] In some examples, the thermally conductive layer may be a metal layer or an alloy layer that is a good thermal conductor.

[0297] In some examples, the first thermally conductive connection member may be a thermally conductive block disposed in the first through hole.

[0298] In some examples, the thermally conductive block may be a copper pillar.

[0299] In some examples, the thermally conductive block can be an aluminum column.

[0300] In some examples, the heat conductive block may be a gold column, a platinum column, or the like.

[0301] In some examples, the heat conduction assembly may include a heat transfer element (not shown in the figures). The heat transfer element may be thermally connected to the first heat conductive connector.

[0302] In some examples, the heat transfer element and the first heat conductive connecting element may be separate components.

[0303] In some examples, the heat transfer element and the first heat conductive connection element may be an integral part.

[0304] In some examples, a portion of the heat transfer element may be located within the through hole.

[0305] In some examples, another portion of the heat transfer member may be located outside the through hole. The heat transfer member may protrude from the lower surface of the circuit board 300. The heat transfer member may be in thermally conductive contact with the lower housing.

[0306] In some examples, the heat transfer element may be a first thermally conductive copper layer laid on the lower surface of the circuit board 300 .

[0307] In some examples, the first thermally conductive copper layer can be in thermally conductive contact with the thermally conductive layer.

[0308] In some examples, the first thermally conductive copper layer can be in thermally conductive contact with the thermally conductive block.

[0309] In some examples, the through hole may be an opening that passes through the upper and lower surfaces of the circuit board 300 .

[0310] In some examples, the first optical chip assembly can be inserted into the opening to be in thermal contact with the heat transfer element, thereby increasing the thermal contact area between the first optical chip assembly 401 and the heat transfer element, thereby improving the heat dissipation efficiency of the first optical chip assembly 401.

[0311] In some examples, the heat transfer member can be inserted into the opening to be in thermally conductive contact with the first optical chip assembly.

[0312] In some examples, the heat transfer member can be inserted into the opening, the first optical chip assembly can be inserted into the opening, and the heat transfer member is in thermally conductive contact with the first optical chip assembly.

[0313] In some examples, the heat transfer element may be a heat conductive copper block.

[0314] In some examples, the heat transfer element may be a heat conductive aluminum block.

[0315] In some examples, the heat transfer element may be a heat conductive gold block.

[0316] In some examples, the heat transfer member may be a heat conductive copper foil block.

[0317] In some examples, the heat transfer element may be a heat-conducting gold foil block.

[0318] In some examples of the embodiments of the present application, the heat transfer element may be a good heat conductor. In some examples of the embodiments of the present application, there is no limitation on the specific type of the heat transfer element.

[0319] In some examples, the side of the heat transfer member protrudes from the side of the first optical chip assembly 401 .

[0320] In some examples, the side edges of the heat transfer member extend outward. The side edges of the first heat transfer member extend to the side of the first wire bonding pad facing away from the first optical chip assembly 401. In this way, the first heat transfer member can cover the entire heat-generating area of ​​the first optical chip assembly 401, thereby promptly directing the heat generated by the first optical chip assembly 401 to the lower housing for dissipation, thereby improving the heat dissipation efficiency of the first optical chip assembly 401.

[0321] In some examples, the heat generated by the first optical chip assembly 401 during operation can be transferred from the first heat-conducting connection member to the heat transfer member, and then transferred from the heat transfer member to the lower housing for heat dissipation.

[0322] In some examples, the first flexible heat conductive member may be disposed on a side of the heat transfer member facing away from the circuit board 300 .

[0323] In some examples, the heat transfer member may be in thermally conductive contact with the lower housing via a first flexible heat conductive member.

[0324] In some examples, the first flexible thermally conductive member may include thermally conductive adhesive.

[0325] In some examples, the first flexible thermally conductive member may include a thermally conductive pad.

[0326] In some examples, when the circuit board 300 is installed on the lower shell, the first flexible thermal conductive member can be located between the lower shell and the circuit board 300. The first flexible thermal conductive member can have a certain deformation, thereby absorbing the installation gap between the circuit board 300 and the lower shell, improving the tightness of the thermal conduction contact between the heat transfer member and the lower shell, reducing the thermal conduction resistance, and thus improving the thermal conduction efficiency.

[0327] In some examples, the thermal conductive assembly 302 may include a second thermal conductive sub-component 3022 .

[0328] In some examples, the second sub-heat conducting member 3022 may be disposed on the lower surface of the circuit board 300 .

[0329] In some examples, the second heat conducting sub-member 3022 may protrude from the lower surface of the circuit board 300 .

[0330] In some examples, the second sub-thermal conductor 3022 may include a second flexible thermal conductor.

[0331] In some examples, the second heat-conducting sub-member 3022 may include a hard heat-conducting member, such as a copper block, an aluminum block, or a copper foil block.

[0332] In some examples, the thermally conductive assembly may include a second thermally conductive connector (not shown).

[0333] In some examples, the second thermally conductive connector may be disposed in the second through hole and in thermally conductive contact with the second optical chip assembly 402 .

[0334] In some examples, the second thermally conductive connection member may be a thermally conductive layer disposed on an inner wall of the second through hole.

[0335] In some examples, the thermally conductive layer may be a copper clad layer.

[0336] In some examples, the thermally conductive layer may be an aluminum foil layer.

[0337] In some examples, the thermally conductive layer may be a copper foil layer.

[0338] In some examples, the thermally conductive layer may be a metal layer or an alloy layer that is a good thermal conductor.

[0339] In some examples, the second thermally conductive connection member may be a thermally conductive block disposed in the second through hole.

[0340] In some examples, the thermally conductive block may be a copper pillar.

[0341] In some examples, the thermally conductive block can be an aluminum column.

[0342] In some examples, the heat conductive block may be a gold column, a platinum column, or the like.

[0343] In some examples, the heat transfer member may be thermally connected to the second heat conductive connection member.

[0344] In some examples, the heat transfer element and the second heat conductive connecting element may be separate components.

[0345] In some examples, the heat transfer element and the second heat conductive connection element may be an integrated element.

[0346] In some examples, a portion of the heat transfer element may be located within the through hole.

[0347] In some examples, another portion of the heat transfer member may be located outside the through hole. The heat transfer member may protrude from the lower surface of the circuit board 300. The heat transfer member may be in thermally conductive contact with the lower housing.

[0348] In some examples, the through hole may be an opening that passes through the upper and lower surfaces of the circuit board 300 .

[0349] In some examples, the second optical chip assembly can be inserted into the opening to be in thermal contact with the heat transfer element, thereby increasing the thermal contact area between the second optical chip assembly 402 and the heat transfer element, thereby improving the heat dissipation efficiency of the second optical chip assembly 402.

[0350] In some examples, the side of the heat transfer member protrudes from the side of the second optical chip assembly 402 .

[0351] In some examples, the side of the heat transfer member can extend outward. The side of the heat transfer member extends to the side of the second wire bonding pad facing away from the second optical chip assembly 402. In this way, the heat transfer member can cover the entire heat generating area of ​​the second optical chip assembly 402, thereby promptly directing the heat generated by the second optical chip assembly 402 to the lower housing for dissipation, thereby improving the heat dissipation efficiency of the second optical chip assembly 402.

[0352] In some examples, the heat generated by the second optical chip assembly 402 during operation can be transferred from the second heat-conducting connection member to the heat transfer member, and then transferred from the heat transfer member to the lower housing for heat dissipation.

[0353] In some examples, the second flexible heat conductive member may be disposed on a side of the heat transfer member facing away from the circuit board 300 .

[0354] In some examples, the heat transfer member may be in thermally conductive contact with the lower housing via a second flexible heat conductive member.

[0355] In some examples, the second flexible thermally conductive member may include thermally conductive adhesive.

[0356] In some examples, the second flexible thermally conductive member may include a thermally conductive pad.

[0357] In some examples, when the circuit board 300 is installed on the lower shell, the second flexible thermal conductive member can be located between the lower shell and the circuit board 300. The second flexible thermal conductive member can have a certain deformation, thereby absorbing the installation gap between the circuit board 300 and the lower shell, improving the tightness of the thermal conduction contact between the heat transfer member and the lower shell, reducing the thermal conduction resistance, and thus improving the thermal conduction efficiency.

[0358] In some examples, the heat conducting assembly 302 may include a third heat conducting sub-element 3023. The third heat conducting sub-element 3023 may be in thermally conductive contact with the third optical chip assembly 501. The third heat conducting sub-element 3023 may be in thermally conductive contact with the lower housing.

[0359] In some examples, the specific setting method of the third sub-heat conductive member 3023 can be the same as or similar to the setting method of the first sub-heat conductive member 3021 and the second sub-heat conductive member 3022 in the aforementioned embodiments of the present application. For details, please refer to the detailed description of the first sub-heat conductive member 3021 and the second sub-heat conductive member 3022 in the aforementioned embodiments of the present application, and the embodiments of the present application will not go into details about this.

[0360] In some examples, the thermal conductive assembly 302 may include a fourth thermal conductive sub-component 3024. The fourth thermal conductive sub-component 3024 may be in thermal conductive contact with the fourth optical chip assembly 502. The fourth thermal conductive sub-component 3024 may be in thermal conductive contact with the lower housing.

[0361] In some examples, the specific setting method of the fourth sub-heat conductive member 3024 can be the same as or similar to the setting method of the first sub-heat conductive member 3021 and the second sub-heat conductive member 3022 in the aforementioned embodiments of the present application. For details, please refer to the detailed description of the first sub-heat conductive member 3021 and the second sub-heat conductive member 3022 in the aforementioned embodiments of the present application, and the embodiments of the present application will not go into details about this.

[0362] In some examples, the second electronic device may include a filtering component 303 .

[0363] In some examples, the filter component 303 may be disposed on the circuit board 300 .

[0364] In some examples, the filter assembly 303 can be electrically connected to the first optical chip assembly 401. The filter assembly 303 can be configured to filter and reduce noise on the signal of the first optical chip assembly 401.

[0365] In some examples, the filter assembly 303 can be electrically connected to the second optical chip assembly 402. The filter assembly 303 can be configured to filter and reduce noise on the signal of the second optical chip assembly 402.

[0366] In some examples, the filter assembly 303 may be disposed on the upper surface of the circuit board 300. The filter assembly 303 is electrically connected to the first optical chip assembly 401 through wire bonding.

[0367] In some examples, the distance between the filter assembly 303 and the first optical chip assembly 401 that is electrically connected is less than a first preset threshold.

[0368] In some examples, the filter assembly 303 may be disposed on the upper surface of the circuit board 300. The filter assembly 303 is electrically connected to the second optical chip assembly 402 via wire bonding.

[0369] In some examples, the filter assembly 303 may be disposed on the lower surface of the circuit board 300. The first optical chip assembly 401 may be electrically connected to the first wire bonding pad via wire bonding. The filter assembly 303 may be electrically connected to the first wire bonding pad via a via.

[0370] In some examples, the filter assembly 303 may be disposed on the lower surface of the circuit board 300. The second optical chip assembly 402 may be electrically connected to the second wire bonding pad via wire bonding. The filter assembly 303 may be electrically connected to the second wire bonding pad via a via.

[0371] In some examples, the filtering component 303 may include a first sub-filtering component 3031 .

[0372] In some examples, the first sub-filter assembly 3031 may be located on a side of the first sub-heat conducting member 3021 facing away from the second sub-heat conducting member 3022 .

[0373] In some examples, the height of the first sub-filter component 3031 protruding from the lower surface of the circuit board 300 is higher than the height of the first sub-heat conducting member 3021 protruding from the lower surface of the circuit board 300 .

[0374] In some examples, the first sub-filter component 3031 may include a filter.

[0375] In some examples, the first sub-filter assembly 3031 may include multiple filters. The multiple filters may be arranged along the length of the circuit board 300 on a side of the first heat conducting sub-assembly 3021 facing away from the second heat conducting sub-assembly 3022 .

[0376] In some examples, the first sub-filter component 3031 can be electrically connected to the first wire bonding pad through a via.

[0377] In some examples, the filtering component 303 may include a second sub-filtering component 303 .

[0378] In some examples, the second sub-filter assembly 3032 may be located between the first sub-heat conducting member 3021 and the second sub-heat conducting member 3022 .

[0379] In some examples, the height of the second sub-filter component 3032 protruding from the lower surface of the circuit board 300 is higher than the height of the first sub-heat conducting member 3021 protruding from the circuit board 300 .

[0380] In some examples, the height at which the first heat conducting sub-member 3021 protrudes from the circuit board 300 and the height at which the second heat conducting sub-member 3022 protrudes from the circuit board 300 may be the same, close, or similar.

[0381] In some examples, the height of the second sub-filter component 3032 protruding from the circuit board 300 may be the same as, close to, or approximately the height of the first sub-filter component 3031 protruding from the circuit board 300 .

[0382] In some examples, the height at which the second sub-filter component 3032 protrudes from the circuit board 300 may be different from the height at which the first sub-filter component 3031 protrudes from the circuit board 300 .

[0383] In some examples, the second sub-filter component 3032 can be electrically connected to the first wire bonding pad through a via.

[0384] In some examples, the second sub-filter component 3032 can be electrically connected to the second wire bonding pad through a via.

[0385] In some examples, the second sub-filter component 3032 can include a filter.

[0386] In some examples, the second sub-filter component 3032 may include multiple filters.

[0387] In some examples, the filtering component 303 may include a third sub-filtering component 3033 .

[0388] In some examples, the third sub-filter assembly 3033 may be disposed on a side of the second sub-heat conducting member 3022 facing away from the first sub-heat conducting member 3021 .

[0389] In some examples, the third sub-filter assembly 3033 is electrically connected to the second optical chip assembly 402 .

[0390] In some examples, the third sub-filter component 3033 is electrically connected to the second wire bonding pad through a via.

[0391] In some examples, the height of the third sub-filter component 3033 protruding from the lower surface of the circuit board 300 is higher than the height of the second sub-heat conducting member 3022 protruding from the lower surface of the circuit board 300 .

[0392] In some examples, the height of the third sub-filter component 3033 protruding from the lower surface of the circuit board 300 can be the same as, close to, or approximately the same as that of the first sub-filter component 30313 .

[0393] In some examples, the height of the third sub-filter component 3033 protruding from the lower surface of the circuit board 300 may be the same as or similar to that of the second sub-filter component 3032 .

[0394] In some examples, the third sub-filter assembly 3033 may include multiple filters. The multiple filters may be arranged along the length direction of the circuit board 300 on a side of the second sub-heat conducting member 3022 facing away from the first sub-heat conducting member 3021 .

[0395] In some examples, the filtering component 303 may include a fourth sub-filtering component 3034 .

[0396] In some examples, the fourth sub-filter assembly 3034 may be located at one end of the first sub-heat conducting member 3021 along the length direction.

[0397] In some examples, the fourth sub-filter component 3034 can be electrically connected to the first wire bonding pad through a via.

[0398] In some examples, the fourth sub-filter assembly 3034 may be located at one end of the second sub-heat conducting member 3022 along the length direction.

[0399] In some examples, the fourth sub-filter component 3034 can be electrically connected to the second wire bonding pad through a via.

[0400] In some examples, the fourth sub-filter assembly 3034 may be located at both ends of the first sub-heat conducting member 3021 along the length direction.

[0401] In some examples, the fourth sub-filter assembly 3034 may be located at both ends of the second sub-heat conducting member 3022 along the length direction.

[0402] In some examples, the filtering component 303 may include a fifth sub-filtering component 3035 .

[0403] In some examples, the fifth sub-filter assembly 3035 may be located on a side of the third sub-heat conducting member 3023 facing away from the fourth sub-heat conducting member 3024 .

[0404] In some examples, the height of the fifth sub-filter component 3035 protruding from the lower surface of the circuit board 300 is higher than the height of the third sub-heat conducting member 3023 protruding from the lower surface of the circuit board 300 .

[0405] In some examples, the fifth sub-filter component 3035 can include a filter.

[0406] In some examples, the fifth sub-filter assembly 3035 may include multiple filters. The multiple filters may be arranged along the length direction of the circuit board 300 on a side of the third sub-heat conducting member 3023 facing away from the fourth sub-heat conducting member 3024 .

[0407] In some examples, the fifth sub-filter component 3035 can be electrically connected to the third wire bonding pad through a via.

[0408] In some examples, the filtering component 303 may include a sixth sub-filtering component 3036 .

[0409] In some examples, the sixth sub-filter assembly 3036 may be located between the third sub-heat conducting member 3023 and the fourth sub-heat conducting member 3024 .

[0410] In some examples, the height of the sixth sub-filter component 3036 protruding from the lower surface of the circuit board 300 is higher than the height of the third sub-heat conducting member 3023 protruding from the circuit board 300 .

[0411] In some examples, the height of the sixth sub-filter component 3036 protruding from the circuit board 300 may be the same as, close to, or approximately the height of the third sub-filter component 3033 protruding from the circuit board 300 .

[0412] In some examples, the height at which the sixth sub-filter component 3036 protrudes from the circuit board 300 may be different from the height at which the third sub-filter component 3033 protrudes from the circuit board 300 .

[0413] In some examples, the sixth sub-filter component 3036 can be electrically connected to the third wire bonding pad through a via.

[0414] In some examples, the sixth sub-filter component 3036 can be electrically connected to the fourth wire bonding pad through a via.

[0415] In some examples, the sixth sub-filter component 3036 can include a filter.

[0416] In some examples, the sixth sub-filter component 3036 may include multiple filters.

[0417] In some examples, the filtering component 303 may include a seventh sub-filtering component 3037 .

[0418] In some examples, the seventh sub-filter assembly 3037 may be disposed on a side of the fourth sub-heat conducting member 3024 facing away from the third sub-heat conducting member 3023 .

[0419] In some examples, the seventh sub-filter assembly 3037 is electrically connected to the fourth optical chip assembly 502 .

[0420] In some examples, the seventh sub-filter component 3037 is electrically connected to the fourth wire bonding pad through a via.

[0421] In some examples, the height of the seventh sub-filter component 3037 protruding from the lower surface of the circuit board 300 is higher than the height of the fourth sub-heat conducting member 3024 protruding from the lower surface of the circuit board 300 .

[0422] In some examples, the height of the seventh sub-filter component 3037 protruding from the lower surface of the circuit board 300 can be the same as, close to, or approximately the same as that of the fifth sub-filter component 3035 .

[0423] In some examples, the height of the seventh sub-filter component 3037 protruding from the lower surface of the circuit board 300 can be the same as or similar to that of the sixth sub-filter component 3036 .

[0424] In some examples, the seventh sub-filter assembly 3037 may include multiple filters. The multiple filters may be arranged along the length of the circuit board 300 on a side of the fourth sub-heat conducting member 3024 facing away from the third sub-heat conducting member 3023 .

[0425] In some examples, the filtering component 303 may include an eighth sub-filtering component 3038 .

[0426] In some examples, the eighth sub-filter assembly 3038 may be located at one end of the third sub-heat conducting member 3023 along the length direction.

[0427] In some examples, the eighth sub-filter component 3038 can be electrically connected to the third wire bonding pad through a via.

[0428] In some examples, the eighth sub-filter assembly 3038 may be located at one end of the fourth sub-heat conducting member 3024 along the length direction.

[0429] In some examples, the eighth sub-filter component 3038 can be electrically connected to the fourth wire bonding pad through a via.

[0430] In some examples, the eighth sub-filter assembly 3038 may be located at both ends of the third sub-heat conducting member 3023 along the length direction.

[0431] In some examples, the eighth sub-filter assembly 3038 may be located at both ends of the fourth sub-heat conducting member 3024 along the length direction.

[0432] Figure 29 This is a cross-sectional view of the coordination of a circuit board, an optical transceiver component, and a heat-conducting component in an optical module according to some embodiments of the present application. Figure 30 Schematic diagram of the structure of the first lens assembly in the optical module according to some embodiments of the present application. Figure 31 This is a cross-sectional view of the cooperation of a circuit board, a first electronic device, and a heat dissipation assembly in an optical module provided according to some embodiments of the present application. Figure 32 for Figure 31 A top view of Figure 33 for Figure 31 Bottom view of .

[0433] For some examples, refer to Figure 29-Figure 31 As shown, in order to facilitate packaging of the first optical chip assembly and the second optical chip assembly, the optical module may include a first lens assembly 403 .

[0434] In some examples, the first lens assembly 403 can be disposed on the circuit board 300 .

[0435] In some examples, the first lens assembly 403 can be disposed on the upper surface of the circuit board 300 .

[0436] In some examples, a first receiving cavity 404 may be formed between the first lens assembly 403 and the circuit board 300 .

[0437] In some examples, the first lens assembly 403 may have a first groove 4031 on a side facing the circuit board 300 . When the first lens assembly 403 is disposed on the circuit board 300 , a first accommodating cavity 404 is formed between the first groove 4031 and the circuit board 300 .

[0438] In some examples, the first optical chip assembly 401 may be disposed in the first receiving cavity 404 .

[0439] In some examples, the second optical chip assembly 402 can be disposed in the first receiving cavity 404 .

[0440] In some examples, the first groove 4031 may include a first sub-groove 311 .

[0441] In some examples, the first sub-recess 311 may be configured to accommodate the first laser chip of the first optical chip assembly 401 .

[0442] In some examples, the first sub-recess 311 may be configured to accommodate the first light receiving chip of the second optical chip assembly 402 .

[0443] In some examples, the first groove 4031 may include a second sub-groove 312 .

[0444] In some examples, the recess depth of the second sub-groove 312 may be greater than the recess depth of the first sub-groove 311 .

[0445] In some examples, the second sub-recess 312 may be configured to accommodate the first laser driver chip of the first optical chip assembly 401 .

[0446] In some examples, the second sub-recess 312 can be configured to accommodate a TIA of the second optical chip assembly 402 .

[0447] In some examples, the first lens assembly 403 can be bonded to the upper surface of the circuit board 300 .

[0448] In some examples, the first lens assembly 403 can be optically connected to the first internal optical fiber. The first lens assembly 403 can be configured to converge, reflect, and collimate the laser beam emitted by the first laser chip into the first internal optical fiber, and transmit it outward through the first internal optical fiber. The first lens assembly 403 can be configured to receive an optical signal transmitted by the first internal optical fiber and converge, reflect, and collimate the optical signal to the first optical receiving chip.

[0449] In some examples, the distance between the filter assembly 303 and the second optical chip assembly 402 that is electrically connected is less than a first preset threshold.

[0450] In some examples, the accommodation space of the first accommodation cavity 404 is smaller than the sum of the sizes of the first optical chip assembly 401, the second optical chip assembly 402, and the filter assembly 303. As a result, when the filter assembly 303 is disposed on the upper surface of the circuit board, the first lens assembly cannot encapsulate the first optical chip assembly 401 and the second optical chip assembly 402.

[0451] In some examples, the accommodation space of the first accommodation cavity is smaller than the sum of the dimensions of the first optical chip assembly 401, the second optical chip assembly 402, and the filter assembly 303. After the first lens assembly encapsulates the first optical chip assembly 401 and the second optical chip assembly 402, if the filter assembly 303 is disposed on the top surface of the circuit board, the filter assembly is located outside the first lens assembly; as a result, the electrical connection distance between the filter assembly 303 and the first optical chip assembly 401 and the second optical chip assembly 402 is greater than a first preset threshold.

[0452] In some examples, the filter assembly 303 can be arranged on the lower surface of the circuit board 300 and connected to the wire bonding pad on the upper surface of the circuit board 300 through a via. In this way, the electrical connection distance between the filter assembly 303 and the first optical chip assembly 401 can be less than or equal to the first preset threshold value. This is conducive to shortening the electrical connection distance between the filter assembly and the first optical chip assembly, and improving the filtering effect of the filter assembly on filtering the signal of the first optical chip assembly. The electrical connection distance between the filter assembly 303 and the second optical chip assembly 402 can be made less than or equal to the first preset threshold value. This is conducive to shortening the electrical connection distance between the filter assembly and the second optical chip assembly, and improving the filtering effect of the filter assembly on filtering the signal of the second optical chip assembly. In addition, the size of the first lens assembly 403 can be reduced, which facilitates the arrangement and layout of the first lens assembly 403 on the circuit board 300, and avoids the first lens assembly 403 interfering with the first electronic device on the circuit board 300.

[0453] In some examples, the first lens assembly 403 isolates heat conduction between the first optical chip assembly 401 and the upper housing.

[0454] In some examples, the first lens assembly 403 isolates the heat conduction between the second optical chip assembly 402 and the upper housing.

[0455] In some examples, the heat generated by the first optical chip assembly 401 during operation can be conducted to the lower surface of the circuit board 300 via the thermally conductive assembly, and then conducted to the lower housing for dissipation. Thus, after the first optical chip assembly 401 is encapsulated by the first lens assembly 403, the first lens assembly 403 isolates the heat conduction between the first optical chip assembly 401 and the upper housing. The heat generated by the first optical chip assembly 401 can be conducted to the lower housing for dissipation via the thermally conductive assembly, which facilitates heat dissipation of the first optical chip assembly 401 and improves the heat dissipation efficiency of the first optical chip assembly 401.

[0456] In some examples, the heat generated by the second optical chip assembly 402 during operation can be conducted to the lower surface of the circuit board 300 via the thermally conductive assembly, and then conducted to the lower housing for dissipation. Thus, after the second optical chip assembly 402 is encapsulated by the first lens assembly, the second lens assembly isolates the heat conduction between the second optical chip assembly 402 and the upper housing. The heat generated by the second optical chip assembly 402 can be conducted to the lower housing for dissipation via the thermally conductive assembly, facilitating heat dissipation of the second optical chip assembly 402 and improving the heat dissipation efficiency of the second optical chip assembly 402.

[0457] In some examples, the optical module may include a second lens assembly (not numbered in the figure).

[0458] In some examples, the second lens assembly can be arranged along the length direction of the circuit board 300 with the first lens assembly 403 .

[0459] In some examples, the second lens assembly may be disposed on the circuit board 300 .

[0460] In some examples, the second lens assembly can be disposed on the upper surface of the circuit board 300 .

[0461] In some examples, a second accommodating cavity (not shown in the figures) may be formed between the second lens assembly and the circuit board 300 .

[0462] In some examples, the second lens assembly can be configured to encapsulate the third optical chip assembly.

[0463] In some examples, the second lens assembly can be configured to encapsulate the fourth optical chip assembly.

[0464] In some examples, the configuration of the second lens assembly can be the same as or similar to that of the first lens assembly 403. For details, please refer to the detailed description of the first lens assembly 403 in the aforementioned embodiments of the present application, which will not be repeated in the embodiments of the present application.

[0465] Figure 34 This is a cross-sectional view of the cooperation between the circuit board, the first optical transceiver component and the lower housing in the optical module provided according to some embodiments of the present application. Figure 35 Schematic diagram of the structure of the lower housing of the optical module provided in some embodiments of the present application Figure 1 , Figure 36 Schematic diagram of the structure of the lower housing of the optical module provided in some embodiments of the present application Figure 2 .

[0466] For some examples, refer to Figure 34-36 As shown, the lower housing 202 may include a bottom plate 2021 .

[0467] In some examples, the circuit board 300 may be disposed on the base plate 2021 .

[0468] In some examples, the heat conducting component can be in thermal contact with the base plate 2021. The heat conducting component can conduct heat generated by the first optical chip assembly and the second optical chip assembly during operation to the base plate 2021 for heat dissipation.

[0469] In some examples, the outer wall surface of the base plate 2021 may be provided with heat dissipation fins 211 .

[0470] In some examples, the lower housing 202 may include a first lower side plate 221 . The first lower side plate 221 may be connected to one side of the bottom plate 2021 .

[0471] In some examples, the bottom plate 2021 and the first lower side plate 221 may be an integral piece.

[0472] In some examples, the first lower side plate 221 can be disposed along the length direction of the bottom plate 2021 .

[0473] In some examples, the first lower side plate 221 may abut against one side edge of the circuit board 300. The first lower side plate 221 may be configured to limit the circuit board 300.

[0474] In some examples, the lower housing 202 may include a second lower side plate 222. The second lower side plate 222 may be connected to the other side of the bottom plate 2021. The second lower side plate 222 may be disposed opposite to the first lower side plate 221.

[0475] In some examples, the bottom plate 2021 and the second lower side plate 222 may be an integral piece.

[0476] In some examples, the second lower plate 222 may abut against the other side of the circuit board 300. The second lower plate 222 may be configured to limit the circuit board 300.

[0477] In some examples, the bottom plate 2021 , the first lower plate 221 , and the second lower plate 222 together form a mounting space for the circuit board 300 . The circuit board 300 is mounted between the first lower plate 221 and the second lower plate 222 .

[0478] In some examples, a first supporting boss 212 may be provided on the bottom plate 2021 .

[0479] In some examples, the first support boss 212 can be configured to support a lower surface of the circuit board 300 .

[0480] In some examples, the first supporting boss 212 may be located in the middle of the lower shell in the length direction.

[0481] In some examples, a plurality of first supporting bosses 212 may be provided. The plurality of first supporting bosses 212 may be provided on both sides of the bottom plate 2021 along the width direction of the bottom plate 2021 .

[0482] In some examples, to prevent the circuit board from moving relative to the lower housing when the optical module is plugged in or out of the host computer, a first positioning post may be provided on the first supporting boss, and the first positioning post may be inserted into a first positioning hole provided on the circuit board.

[0483] In some examples, a second supporting boss 213 may be provided on the bottom plate 2021 .

[0484] In some examples, the second supporting boss 213 may be configured to support a lower surface of the circuit board 300 .

[0485] In some examples, the second supporting boss 213 may be provided at an end of the lower housing facing away from the electrical port.

[0486] In some examples, the second supporting bosses 213 may include a plurality of bosses 213 , and the plurality of second supporting bosses 213 may be arranged opposite to each other along the width direction of the bottom plate 2021 .

[0487] In this way, the circuit board 300 is supported by the first supporting boss 212 and the second supporting boss 213, so that a certain gap is left between the lower surface of the circuit board 300 and the bottom plate 2021, making it easier to place the first electronic component on the lower surface of the circuit board 300. This can prevent interference between the first electronic component and the bottom plate 2021.

[0488] In some examples, the heat conducting component protrudes from the lower surface of the circuit board 300 so that the heat conducting component is in thermal contact with the bottom plate 2021 .

[0489] In some examples, the first supporting boss 212 and the second supporting boss 213 may protrude from the bottom plate 2021 at the same height.

[0490] In some examples, the heights of the first supporting boss 212 and the second supporting boss 213 protruding from the bottom plate 2021 may be the same, similar, or approximate.

[0491] In some examples, the upper surfaces of the first supporting boss 212 and the second supporting boss 213 may be flush.

[0492] In some examples, the height of the first supporting boss 212 protruding from the bottom plate 2021 may be greater than the height of the thermal conductive component protruding from the lower surface of the circuit board 300 .

[0493] In some examples, the height of the second supporting boss 213 protruding from the bottom plate 2021 may be greater than the height of the thermal conductive component protruding from the lower surface of the circuit board 300 .

[0494] In some examples, the lower housing may be provided with a fixing post, which may be located at an end of the lower housing near the electrical port.

[0495] In some examples, the fixing post may be provided with a threaded hole. The upper housing may be fixed to the fixing post by screws, thereby being fixedly connected to the lower housing.

[0496] In some examples, a first protrusion 214 may be provided on the bottom plate 2021 .

[0497] In some examples, the first protrusion 214 is disposed corresponding to the first heat conducting sub-component 3021 .

[0498] In some examples, the first protrusion 214 is in thermal contact with the first sub-heat conducting member 3021. Heat generated by the first optical chip assembly 401 during operation is conducted to the first protrusion 214 through the first sub-heat conducting member 3021. The first protrusion 214 conducts the heat to the bottom plate 2021 for heat dissipation.

[0499] In some examples, the first protrusion 214 and the base plate 2021 can be integrally formed. The first protrusion 214 can increase the strength of the base plate 2021 and prevent deformation of the base plate 2021. This improves the tightness and stability of the thermal contact between the base plate 2021 and the first sub-heat conducting member 3021, thereby improving the heat dissipation efficiency of the first optical chip assembly 401.

[0500] In some examples, the first protrusion 214 may be a heat sink.

[0501] In some examples, a second protrusion 215 may be provided on the bottom plate 2021 .

[0502] In some examples, the second protrusion 215 is disposed corresponding to the second heat conducting sub-component 3022 .

[0503] In some examples, the second protrusion 215 is in thermal contact with the second sub-heat conducting member 3022. Heat generated by the second optical chip assembly 402 during operation is conducted to the second protrusion 215 through the second sub-heat conducting member 3022. The second protrusion 215 conducts the heat to the bottom plate 2021 for heat dissipation.

[0504] In some examples, the second protrusion 215 and the base plate 2021 can be integrally formed. The second protrusion 215 can increase the strength of the base plate 2021 and prevent deformation of the base plate 2021. This improves the tightness and stability of the thermal contact between the base plate 2021 and the second sub-heat conducting member 3022, thereby increasing the heat dissipation efficiency of the second optical chip assembly 402.

[0505] In some examples, the second protrusion 215 can be a heat sink.

[0506] In some examples, a first recessed portion 216 may be defined between the first protruding portion 214 and the first lower plate 221 .

[0507] In some examples, the first sub-filter assembly may be located in the first recess 216. This facilitates the placement of the first sub-filter assembly.

[0508] In some examples, a second recessed portion 217 may be defined between the first protruding portion 214 and the second protruding portion 215 .

[0509] In some examples, the second sub-filter assembly may be located in the second recess 217. This facilitates the placement of the second sub-filter assembly.

[0510] In some examples, a third recessed portion 218 may be defined between the second protruding portion 215 and the second lower plate 222 .

[0511] In some examples, the third sub-filter assembly may be located in the third recess 218. This facilitates the placement of the third sub-filter assembly.

[0512] In some examples, a third protrusion 219 may be provided on the bottom plate 2021 .

[0513] In some examples, the third protrusion 219 may be disposed opposite to the third heat conducting sub-member 3023 .

[0514] In some examples, the configuration of the third protrusion 219 may be the same as or similar to the configuration of the first protrusion 214 . For details, please refer to the detailed description of the first protrusion 214 in the aforementioned embodiment of the present application, which will not be repeated in the embodiment of the present application.

[0515] In some examples, a fourth protrusion 2110 may be provided on the bottom plate 2021 .

[0516] In some examples, the fourth protrusion 2110 may be disposed opposite to the fourth heat conducting sub-member 3024 .

[0517] In some examples, the configuration of the fourth protrusion 2110 may be the same as or similar to the configuration of the second protrusion 215. For details, please refer to the detailed description of the second protrusion 215 in the aforementioned embodiments of the present application, which will not be repeated in the embodiments of the present application.

[0518] The optical module provided by the embodiment of the present application is provided with a first electronic device and a second electronic device on a circuit board, wherein the second electronic device includes a first optical chip assembly and a second optical chip assembly, the first optical chip assembly and the second optical chip assembly are provided on the upper surface of the circuit board, the first optical chip is connected to the wiring electrical signal on the circuit board through a first bonding wire, and the second optical chip is connected to the wiring electrical signal through a second bonding wire, and the first optical chip and the second optical chip both generate heat when working; a first lens assembly is provided on the upper surface of the circuit board, and a first accommodating cavity is formed between the first lens assembly and the second lens assembly, and the first optical chip assembly and the second optical chip assembly are provided in the first In the accommodating cavity, the first lens assembly is encapsulated to facilitate flexible setting of the positions of the first optical chip assembly and the second optical chip assembly on the circuit board; the first lens assembly isolates the heat conduction between the first optical chip assembly, the second optical chip assembly and the upper shell; in some examples of the embodiments of the present application, a heat-conducting assembly is arranged on the lower surface of the circuit board, the heat-conducting assembly is in thermal conduction contact with the first optical chip assembly and the second optical chip assembly, and the heat-conducting assembly is in thermal conduction contact with the lower shell; in this way, the heat-conducting assembly can conduct the heat generated by the first optical chip assembly and the second optical chip assembly during operation to the lower shell, thereby dissipating the heat through the lower shell, thereby improving the heat dissipation effect of the optical module.

[0519] In addition, the second electronic device includes a filter component, which is electrically connected to the first optical chip component and the second optical chip component, and the distance between the filter component and the first optical chip component and the second optical chip component is less than or equal to a first preset threshold; the accommodating space of the first accommodating cavity is smaller than the sum of the sizes of the first chip component, the second chip component and the filter component; thus, in some examples of the embodiments of the present application, the filter component is arranged on the lower surface of the circuit board, which facilitates the arrangement of the filter component and shortens the third bonding length between the filter component and the first optical chip component and the second optical chip component, so that the distance between the filter component and the first optical chip component and the second optical chip component is less than or equal to the first preset threshold, thereby improving the noise reduction effect of the filter component on the first optical chip component and the second optical chip component.

[0520] Figure 37 This is a cross-sectional view of the cooperation between the upper housing, the circuit board, and the lower housing in the optical module according to some embodiments of the present application. Figure 38This is a schematic diagram of the exploded structure of the circuit board and the lower housing in the optical module provided according to some embodiments of the present application. Figure 39 This is a schematic diagram of the exploded structure of the upper housing, circuit board, and lower housing in the optical module provided according to some embodiments of the present application.

[0521] In some examples of the embodiments of this application, refer to Figure 37-Figure 39 As shown, the circuit board can be arranged in a cavity formed by the upper shell and the lower shell covering each other.

[0522] In some examples, in order to dissipate heat generated by the first optical transceiver component and the second optical transceiver component, a heat dissipation copper layer (not shown in the figures) may be laid on the upper surface of the circuit board 300 .

[0523] In some examples, the heat dissipation copper layer may be one of the layers in the circuit board 300. The surface of the heat dissipation copper layer may not be coated with insulating ink.

[0524] In some examples, the heat dissipation copper layer may include a first heat dissipation copper layer.

[0525] In some examples, the heat sink copper layer can be in thermally conductive contact with the heat sink component.

[0526] In some examples, the first optical transceiver component 400 may be disposed on the first heat dissipation copper layer.

[0527] In some examples, the first optical chip assembly 401 of the first optical transceiver component 400 may be disposed on the first heat dissipation copper layer.

[0528] In some examples, the first heat dissipation copper layer may extend to the outside of the first optical transceiver component 400 .

[0529] In some examples, the first lens assembly can be covered on the first optical transceiver component 400. The first lens assembly isolates the heat transfer channel between the first optical transceiver component 400 and the upper housing 201.

[0530] In some examples, to facilitate heat transfer from the first optical transceiver assembly 400 to the upper housing 201 for dissipation, the first heat dissipation copper layer can extend to the outside of the first lens assembly. This allows heat generated by the first optical transceiver assembly 400 during operation to be transferred along the first heat dissipation copper layer to the outside of the first lens assembly. A heat transfer channel can be established between the first heat dissipation copper layer and the upper housing 201 on the outside of the first lens assembly to transfer heat generated by the first optical transceiver assembly 400 to the upper housing 201 for dissipation.

[0531] In some examples, the heat dissipation copper layer may include a second heat dissipation copper layer.

[0532] In some examples, the second optical transceiver component 500 may be disposed on the second heat dissipation copper layer.

[0533] In some examples, the second optical chip assembly 402 of the second optical transceiver component 500 can be disposed on the second heat dissipation copper layer.

[0534] In some examples, the second heat dissipation copper layer may extend to the outside of the second optical transceiver component 500 .

[0535] In some examples, the second lens assembly can be covered on the second optical transceiver component 500. The second lens assembly isolates the heat transfer channel between the second optical transceiver component 500 and the upper housing 201.

[0536] In some examples, to facilitate heat transfer from the second optical transceiver 500 to the upper housing 201 for dissipation, the second heat dissipation copper layer can extend to the outside of the second lens assembly. This allows heat generated by the second optical transceiver 500 during operation to be transferred along the second heat dissipation copper layer to the outside of the second lens assembly. A heat transfer channel can be established between the second heat dissipation copper layer and the upper housing 201 on the outside of the second lens assembly to transfer heat generated by the second optical transceiver 500 to the upper housing 201 for dissipation.

[0537] In some examples, the first heat dissipation copper layer and the second heat dissipation copper layer may be the same layer of the circuit board 300 .

[0538] In some examples, the first heat dissipation copper layer and the second heat dissipation copper layer may be arranged along the length direction of the circuit board 300 .

[0539] In some examples, a third electronic device may be provided on the upper surface of the circuit board 300 .

[0540] In some examples, the third electronic component may be disposed at an end of the circuit board 300 facing away from the gold finger 301 .

[0541] In some examples, the third electronic device may be disposed on a side of the second optical transceiver component 500 facing away from the first optical transceiver component 400 .

[0542] In some examples, the third electronic device may be at least one of a power supply device or a storage device.

[0543] In some examples, no electronic devices may be provided on the upper surface of the circuit board 300 between the first optical transceiver component 400 and the second optical transceiver component 500 .

[0544] In some examples, in order to prevent the portion of the second heat dissipation copper layer extending out of the second lens assembly 503 from contacting the third electronic device and causing a short circuit in the third electronic device, the portion of the second heat dissipation copper layer extending out of the second lens assembly can be located on the side of the third electronic device facing the second lens assembly.

[0545] In some examples, in order to improve the heat dissipation efficiency of the optical module 200, since no electronic devices are set on the upper surface of the circuit board 300 between the first optical transceiver component 400 and the second optical transceiver component 500; therefore, the length of the first heat dissipation copper layer extending out of the first lens assembly can be greater than the length of the second heat dissipation copper layer extending out of the second lens assembly.

[0546] In some examples, the first heat dissipation copper layer can extend beyond the first lens assembly by a first distance.

[0547] In some examples, the second heat dissipation copper layer can extend beyond the second lens assembly by a second distance.

[0548] In some examples, the first distance may be greater than the second distance.

[0549] In some examples, in order to facilitate positioning of the circuit board 300, prevent the circuit board 300 from moving in the cavity, and improve the stability of the electrical connection between the gold finger 301 of the circuit board 300 and the host computer. Figure 38 and Figure 39 As shown, a first positioning column 2121 may be provided on the first supporting boss 212 .

[0550] In some examples, the circuit board 300 may be provided with a first positioning hole 304. The first positioning post 2121 may be inserted into the first positioning hole 304. In this way, the position of the circuit board 300 in the cavity can be limited by the cooperation between the first positioning post 2121 and the first positioning hole 304.

[0551] In some examples, a second positioning column 2131 may be provided on the second supporting boss 213 .

[0552] In some examples, the circuit board 300 may be provided with a second positioning hole 305. The second positioning post 2131 may be inserted into the second positioning hole 305. In this manner, the second positioning post 2131 and the second positioning hole 305 cooperate to limit the position of the circuit board 300 within the cavity, thereby improving the stability of the electrical connection between the optical module 200 and the host computer 100.

[0553] In some examples, to secure the circuit board 300 within the cavity and enhance the stability of the connection between the optical module and the circuit board 300, a first pressure plate boss 2012 may be provided on the upper housing 201. The first pressure plate boss 2012 may be pressed against the upper surface of the circuit board 300. In this manner, the first pressure plate boss 2012 can be used to press the circuit board 300 against the first support boss 212, thereby limiting the position of the circuit board 300 along the height direction of the cavity, improving the stability of the circuit board 300 within the cavity, and thereby enhancing the stability of the connection between the optical module and the host computer.

[0554] In some examples, the first pressing plate boss 2012 may be disposed opposite to the first supporting boss 212 .

[0555] In some examples, the first pressing plate boss 2012 can be pressed onto the edge of the first positioning hole 304 .

[0556] In some examples, the first pressing plate boss 2012 may be located between the first optical transceiver component 400 and the second optical transceiver component 500 .

[0557] In some examples, a second pressing plate boss 2014 may be provided on the upper housing 201. The second pressing plate boss 2014 may be pressed against the upper surface of the circuit board 300.

[0558] In some examples, the second pressing plate boss 2014 may be located on a side of the second optical transceiver component 500 facing away from the first optical transceiver component 400 .

[0559] In some examples, the second pressing plate boss 2014 may be disposed opposite to the second supporting boss 213 .

[0560] In some examples, the second pressing plate boss 2014 can be pressed onto the edge of the second positioning hole 305 .

[0561] In some examples, a third pressing plate boss 2016 may be provided on the upper housing 201. The third pressing plate boss 2016 may be pressed against the upper surface of the circuit board 300.

[0562] In some examples, the third pressing plate boss 2016 may be located on a side of the first optical transceiver component 400 facing the gold finger 301 .

[0563] In some examples, a third positioning hole 309 may be provided on the circuit board 300 , and the fixing post 2111 may be inserted into the third positioning hole 309 .

[0564] In some examples, the third pressing plate boss 2016 can be pressed onto a side of the fixing column 2111 facing away from the electrical port.

[0565] In some examples of the embodiments of the present application, the circuit board 300 is pressed by the first pressure plate boss 2012, the second pressure plate boss 2014 and the third pressure plate boss 2016, so that both ends and the middle of the circuit board 300 are pressed and fixed, thereby improving the stability of the circuit board 300 in the cavity and improving the stability of the electrical connection between the optical module 200 and the host computer 100.

[0566] Figure 40 This is a partial enlarged view of the cooperation between the upper housing and the circuit board in the optical module provided according to some embodiments of the present application. Figure 41 This is a schematic diagram of the exploded structure of the upper housing and the circuit board in the optical module provided according to some embodiments of the present application.

[0567] For some examples, refer to Figure 40 and Figure 41 As shown, a heat transfer channel is established between the heat dissipation copper layer and the upper housing 201. In some examples of the present application, a first heat conduction boss 2013 may be provided on the upper housing 201. The first heat conduction boss 2013 may be provided on one side of the first pressure plate boss 2012.

[0568] In some examples, the first heat conducting boss 2013 can be in thermally conductive contact with the first heat dissipating copper layer.

[0569] In some examples, the first heat-conducting boss 2013 and the upper housing 201 may be an integral piece.

[0570] In some examples, the first thermally conductive boss 2013 can be located between the first lens assembly and the second lens assembly.

[0571] In some examples, the first heat-conducting boss 2013 can be connected to the first pressure plate boss 2012. In this way, after the heat on the first heat-dissipating copper layer is transferred to the first heat-conducting boss 2013, the heat can be transferred to the upper housing 201 through the first heat-conducting boss 2013 and the first pressure plate boss 2012. This increases the area of ​​the heat transfer channel between the first heat-dissipating copper layer and the upper housing 201 and improves the heat dissipation efficiency of the first optical transceiver component 400.

[0572] In some examples, the first heat conducting boss 2013 and the first pressure plate boss 2012 may be an integral piece.

[0573] In some examples, the first pressing plate boss 2012 may protrude beyond the first heat conducting boss 2013. This prevents the first heat conducting boss 2013 from being pressed against the circuit board 300 over a large area, thereby effectively protecting the circuit board 300 from damage.

[0574] In some examples, a second heat conducting boss 2015 may be provided on the upper housing 201. The second heat conducting boss 2015 may be provided between the second pressing plate boss 2014 and the second optical transceiver component 500.

[0575] In some examples, the second heat-conducting boss 2015 can be in thermal contact with the second heat-dissipating copper layer. Heat on the second heat-dissipating copper layer can be conducted to the upper housing 201 through the second heat-conducting boss 2015 and dissipated from the upper housing 201.

[0576] In some examples, the second heat conducting boss 2015 can be separated from the second pressing boss 2014 , so as to facilitate avoiding the third electronic device 308 on the circuit board 300 and facilitating the arrangement of the third electronic device 308 on the circuit board 300 .

[0577] In some examples, the second pressing plate boss 2014 may protrude beyond the second heat conducting boss 2015. This prevents the second heat conducting boss 2015 from being pressed against the circuit board 300 over a large area, thereby effectively protecting the circuit board 300 from damage.

[0578] Figure 42 Schematic diagram of the structure of the circuit board in the optical module provided according to some embodiments of the present application Figure 3 , Figure 43 This is a top view of a circuit board in an optical module according to some embodiments of the present application.

[0579] For some examples, refer to Figures 41-43 As shown, in order to facilitate thermal conduction contact between the first heat-conducting boss 2013 and the first heat-dissipating copper layer, a third flexible heat-conducting member 306 may be provided between the first heat-dissipating copper layer and the first heat-conducting boss 2013 .

[0580] In some examples, the third flexible thermally conductive member 306 may be thermally conductive adhesive.

[0581] In some examples, the third flexible thermally conductive member 306 may be a thermally conductive pad.

[0582] In some examples, the first heat-conducting boss 2013 is pressed onto the third flexible heat-conducting member 306. The third flexible heat-conducting member 306 can deform to absorb the pressing force of the first heat-conducting boss 2013 on the circuit board 300, thereby protecting the circuit board 300 from damage.

[0583] In some examples, a fourth flexible heat conducting member 307 may be provided between the second heat conducting boss 2015 and the second heat dissipating copper layer.

[0584] In some examples, the fourth flexible heat-conducting member 307 may be a thermally conductive adhesive.

[0585] In some examples, the fourth flexible thermally conductive member 307 may be a thermally conductive pad.

[0586] In some examples, the second heat-conducting boss 2015 is pressed onto the fourth flexible heat-conducting member 307. The fourth flexible heat-conducting member 307 can deform to absorb the pressing force of the second heat-conducting boss 2015 on the circuit board 300, thereby protecting the circuit board 300 from damage.

[0587] Figure 44 This is a schematic structural diagram of an upper housing in an optical module according to some embodiments of the present application. Figure 45 This is a bottom view of an upper housing in an optical module provided according to some embodiments of the present application. Figure 46 for Figure 45 A partial enlarged schematic diagram of point E in the middle.

[0588] For some examples, refer to Figure 44 and Figure 45 As shown, the first pressing plate boss 2012 may be provided on a side of the upper housing 201 facing the circuit board 300 .

[0589] In some examples, two first pressing plate bosses 2012 may be provided. The two first pressing plate bosses 2012 may be disposed opposite to each other along the width direction of the circuit board 300 .

[0590] In some examples, there may be a gap between the two first pressing plate bosses 2012 . The first optical transceiver component 400 may be located between the two first pressing plate bosses 2012 .

[0591] In some examples, the first heat-conducting boss 2013 can be integral with the first pressure plate boss 2012. Heat from the first heat-conducting boss 2013 can be conducted to the upper housing 201 through the first pressure plate boss 2012. This can increase the area of ​​the heat-conducting channel between the first heat-dissipating copper layer and the upper housing 201, improving the heat dissipation efficiency of the first optical transceiver component 400.

[0592] In some examples, the first pressing plate boss 2012 may protrude beyond the first heat conducting boss 2013. Thus, the first pressing plate boss 2012 may secure the circuit board 300, thereby preventing the first heat conducting boss 2013 from directly pressing against the circuit board 300 over a large area, thereby protecting the circuit board 300 from damage.

[0593] In some examples, the second pressing plate boss 2014 may be disposed at an end of the upper housing 201 facing away from the electrical port.

[0594] In some examples, two second pressing plate bosses 2014 may be provided. The two second pressing plate bosses 2014 may be disposed opposite to each other along the width direction of the circuit board 300 .

[0595] In some examples, there may be a gap between the two second pressing plate bosses 2014. The third electronic component 308 may be disposed between the two second pressing plate bosses 2014. This facilitates the placement of the third electronic component 308.

[0596] In some examples, the second heat conducting boss 2015 can be separated from the second pressing plate boss 2014. In this way, the area of ​​the circuit board 300 occupied by the second heat conducting boss 2015 can be reduced, which facilitates the arrangement of the third electronic device 308.

[0597] In some examples, in order to improve the electromagnetic shielding performance of the optical module and prevent external electromagnetic signals from interfering with the electrical signals on the circuit board 300, refer to Figure 46 As shown, a pressing strip 2017 may be provided on the upper housing 201. The pressing strip 2017 may be located at one end of the upper housing 201 close to the electrical port.

[0598] In some examples, the pressing strip 2017 can extend along the width direction of the circuit board 300. The pressing strip 2017 can be pressed against the upper surface of the circuit board 300 to seal the electrical port of the optical module 200, thereby shielding external electromagnetic signals and preventing external electromagnetic signals from interfering with the electrical signals on the circuit board 300.

[0599] In some examples, an electromagnetic shielding member may be provided between the pressing strip 2017 and the circuit board 300 .

[0600] In some examples, the electromagnetic shielding component may be made of electromagnetic compatibility (EMC) materials.

[0601] In some examples, the electromagnetic shielding member can be provided on the upper surface of the circuit board 300. The pressing strip 2017 can be pressed onto the electromagnetic shielding member. In this way, the electromagnetic shielding member can fill and shield the gap between the pressing strip 2017 and the upper surface of the circuit board 300, thereby improving the electromagnetic shielding effect.

[0602] In some examples, the end of the pressing strip 2017 may be an arcuate wall 171. The arcuate wall 171 may be attached to the peripheral wall of the fixing column 2111, thereby improving the electromagnetic shielding effect of the electrical port and enhancing the anti-interference capability of the optical module 200.

[0603] Some examples of the embodiments of the present application provide optical modules, in which a heat dissipation copper layer is laid on the upper surface of the circuit board. The heat dissipation copper layer may include a first heat dissipation copper layer and a second heat dissipation copper layer. The first heat dissipation copper layer and the second heat dissipation copper layer can be arranged along the length direction of the circuit board; a third electronic device can be provided on the side of the circuit board facing away from the gold finger, and no electronic device is provided in the middle of the circuit board (i.e., between the first heat dissipation copper layer and the second heat dissipation copper layer); in this way, after the first optical transceiver component is set on the first heat dissipation copper layer, the first heat dissipation copper layer extends a first distance from the first optical transceiver component, and after the second optical transceiver component is set on the second heat dissipation copper layer, the second heat dissipation copper layer extends a second distance from the second optical transceiver component, and the first distance is greater than the second distance; in this way, a first pressure plate boss can be provided on the upper shell to be pressed onto the circuit board. On the upper surface of the housing, the first pressure plate boss is located between the first optical transceiver component and the second optical transceiver component; the first heat-conducting boss is in heat-conducting contact with the first heat-dissipating copper layer, and the first heat-conducting boss can be connected to the first pressure plate boss to form a whole, thereby increasing the cross-sectional area of ​​the heat transfer channel for the first heat-dissipating copper layer to transfer heat to the upper shell, and improving the heat dissipation efficiency of the optical module; a second pressure plate boss is provided on the upper shell, and the second pressure plate boss is located on the side of the second optical transceiver component that is away from the first optical transceiver component, and the second heat-conducting boss is provided between the second pressure plate boss and the second optical transceiver component, and the second heat-conducting boss can be in heat-conducting contact with the second heat-dissipating copper layer, and the second heat-conducting boss and the second pressure plate boss can be separated; in this way, it is convenient to avoid the third electronic device provided on the circuit board, and it is convenient to reasonably arrange the third electronic device on the circuit board.

[0604] Figure 47 Schematic diagram of the structure of the circuit board and the electronic device in the optical module provided in some embodiments of the present application Figure 1 , Figure 48 Schematic diagram of the structure of the first sub-electronic device in the optical module according to some embodiments of the present application. Figure 49 This is a schematic structural diagram of the cooperation between the first sub-electronic component and the second sub-electronic component in the optical module provided according to some embodiments of the present application.

[0605] In some examples, the first heat dissipation copper layer and the second heat dissipation copper layer occupy the layout space of electronic components on the circuit board; after the upper shell and the lower shell are covered, the first heat conductive boss on the upper shell is in thermal conduction contact with the first heat dissipation copper layer, and the second heat conductive boss is in thermal conduction contact with the second heat dissipation copper layer, and the first heat conductive boss and the second heat conductive boss will occupy the layout space of electronic components on the circuit board.

[0606] To improve the performance of optical modules, a large number of electronic devices are usually required on the circuit board to process the electrical signals. Figures 47-49 As shown, in some examples of the embodiments of the present application, the electronic device may include a first sub-electronic device 310. The first sub-electronic device 310 may be provided on a circuit board 300.

[0607] In some examples, the first electronic sub-device 310 may include a capacitor.

[0608] In some examples, the first electronic sub-device 310 may include a resistor.

[0609] In some examples, the first electronic sub-device 310 may include an inductor.

[0610] In some examples, the first sub-electronic device 310 may include other types of electronic devices. The type of the first sub-electronic device 310 in the embodiment of the present application is only used as an example to illustrate the specific type of the first sub-electronic device 310 and does not limit the specific type of the first sub-electronic device 310.

[0611] In some examples, the first electronic sub-device 310 may have a first exposed electrode 3101 .

[0612] In some examples, the first exposed electrode 3101 can be electrically connected to a trace on the circuit board 300 .

[0613] In some examples, the first electronic sub-device 310 may be mounted on the surface of the circuit board 300 in a patch manner.

[0614] In some examples, the first electronic sub-device 310 may include a first body 3102 .

[0615] In some examples, the first exposed electrodes 3101 may be located on both sides of the first body 3102 .

[0616] In some examples, the first electronic sub-device 310 can have a first width L.

[0617] In some examples, the first body 3102 can have a third width.

[0618] In some examples, the first width L may be 0.6 mm-1.6 mm.

[0619] In some examples, the first width L may be 1.0 mm-1.6 mm.

[0620] In some examples, the first width L may be 0.6 mm-1.0 mm.

[0621] In some examples, the first width L may be 0.6 mm, 1.0 mm, or 1.6 mm.

[0622] In some examples, the first body 3102 can have a third width g.

[0623] In some examples, the first exposed electrode 3101 can have a fifth width e.

[0624] In some examples, the fifth width e may be 0.2 mm-0.4 mm.

[0625] In some examples, the fifth width e may be 0.2 mm-0.3 mm.

[0626] In some examples, the fifth width e may be 0.3 mm-0.4 mm.

[0627] In some examples, the fifth width e may be 0.2 mm, 0.3 mm, or 0.4 mm.

[0628] In some examples, the electronic device may include a second sub-electronic device 320 . The second sub-electronic device 320 may be disposed on a side of the first sub-electronic device 310 facing away from the circuit board 300 .

[0629] In some examples, the second sub-electronic component 320 can be mounted on the side of the first sub-electronic component 310 facing away from the circuit board 300 using a patch arrangement. This eliminates the need for the second sub-electronic component 320 to be mounted on the surface of the circuit board 300, transforming the surface-mount placement of the circuit board 300 into a three-dimensional placement. This improves the utilization of the three-dimensional space within the optical module and allows for the placement of more electronic components within the limited space on the circuit board 300, meeting the miniaturization and performance requirements of the optical module.

[0630] In some examples, the second electronic sub-device 320 may include a second body.

[0631] In some examples, the second electronic sub-device 320 may include a second exposed electrode 3201 .

[0632] In some examples, the second exposed electrodes 3201 may be located on both sides of the second body.

[0633] In some examples, the second exposed electrode 3201 can be electrically connected to the first exposed electrode 3101 .

[0634] In some examples, the second electronic sub-device 320 can have a second width.

[0635] In some examples, the second width can be less than or equal to the first width. Thus, the second sub-electronic device 320 is retracted within the first sub-electronic device 310, so that when the first sub-electronic devices 310 are arranged on the circuit board 300, the distance between two adjacent first sub-electronic devices 310 can be shortened, thereby improving the utilization of the limited layout space of the circuit board 300.

[0636] In some examples, the second width may be greater than the third width, so that the second exposed electrode 3201 can extend onto the first exposed electrode 3101 , thereby facilitating electrical connection between the second exposed electrode 3201 and the first exposed electrode 3101 .

[0637] In some examples, the second width may be 0.4 mm-1.0 mm.

[0638] In some examples, the second width may be 0.4 mm-0.6 mm.

[0639] In some examples, the second width may be 0.6 mm-1.0 mm.

[0640] In some examples, the second width may be 0.4 mm, 0.6 mm, or 1.0 mm.

[0641] In some examples, the second body may have a fourth width that is smaller than the third width.

[0642] In some examples, the second exposed electrode 3201 can have a sixth width.

[0643] In some examples, the sixth width may be 0.1 mm-0.4 mm.

[0644] In some examples, the sixth width may be 0.1 mm-0.3 mm.

[0645] In some examples, the sixth width may be 0.3 mm-0.4 mm.

[0646] In some examples, the sixth width may be 0.1 mm-0.2 mm.

[0647] In some examples, the sixth width may be 0.2 mm-0.4 mm.

[0648] In some examples, the sixth width may be 0.2 mm-0.3 mm.

[0649] In some examples, the sixth width may be 0.1 mm, 0.2 mm, 0.3 mm, or 0.4 mm.

[0650] It should be noted here that the numerical values ​​and numerical ranges involved in some embodiments of the present application are approximate values. Due to the influence of the manufacturing process, there may be a certain range of errors. Those skilled in the art may consider this part of the error to be negligible.

[0651] Figure 50 Schematic diagram of the structure of the circuit board 300 and the electronic device in the optical module 200 provided according to some embodiments of the present application Figure 2 .

[0652] In some examples, after the upper housing 201 and the lower housing 202 are covered, the upper and lower spaces on the surface of the circuit board 300 are limited.

[0653] In some examples, the distance from the surface of the circuit board 300 to the inner wall of the corresponding side of the cavity may be less than the sum of the heights of the first sub-electronic device 310 and the second sub-electronic device 320 .

[0654] In some examples, the electronic device may include a third sub-electronic device. The third sub-electronic device may be disposed on a side of the second sub-electronic device 320 facing away from the first sub-electronic device 310 .

[0655] In some examples, the coordination relationship between the third sub-electronic device and the second sub-electronic device 320 can refer to the coordination relationship between the second sub-electronic device 320 and the first sub-electronic device 310. This embodiment of the present application will not be further described.

[0656] In some examples, the distance from the surface of the circuit board 300 to the inner wall of the corresponding side of the cavity may be less than the sum of the heights of the first sub-electronic device 310 , the second sub-electronic device 320 , and the third sub-electronic device.

[0657] In some examples, the number of electronic devices may be greater. For example, the electronic device may include a fourth sub-electronic device, a fifth sub-electronic device, and so on. In some examples of the embodiments of the present application, only the first sub-electronic device 310 and the second sub-electronic device 320 are used as specific examples for illustration, and the number of electronic devices is not limited.

[0658] In some examples, the distance measured between the upper surface of the circuit board 300 and the upper housing may be less than the sum of the heights of the first sub-electronic device 310 and the second sub-electronic device 320 .

[0659] In some examples, this is to facilitate the arrangement of the first electronic sub-device 310 and the second electronic sub-device 320. Figure 50 As shown, an eighth groove 313 may be provided on the surface of the circuit board 300 , and the first sub-electronic device 310 may be provided in the eighth groove 313 .

[0660] In some examples, the distance between the bottom wall of the eighth groove 313 and the inner wall of the cavity may be greater than the sum of the heights of the first sub-electronic device 310 and the second sub-electronic device 320 .

[0661] In some examples, the eighth groove 313 may include a third sub-groove that is recessed in the upper surface of the circuit board 300 .

[0662] In some examples, the distance between the bottom wall of the third sub-recess and the upper housing may be greater than the sum of the heights of the first sub-electronic device 310 and the second sub-electronic device 320 .

[0663] In some examples, the distance between the lower surface of the circuit board 300 and the lower housing is less than the sum of the heights of the first sub-electronic component 310 and the second sub-electronic component 320 .

[0664] In some examples, since the first supporting boss and the second supporting boss are supported on the lower surface of the circuit board 300, the heights of the first supporting boss and the second supporting boss may be less than the sum of the heights of the first electronic device and the second electronic device.

[0665] In some examples, the eighth groove 313 may include a fourth sub-groove that is recessed into the lower surface of the circuit board 300 .

[0666] In some examples, the first sub-electronic device 310 may be disposed in the fourth sub-recess.

[0667] In some examples, the distance between the bottom wall of the fourth sub-recess and the bottom plate may be greater than the sum of the heights of the first sub-electronic device 310 and the second sub-electronic device 320 .

[0668] According to the optical module provided in the embodiment of the present application, an electronic device is arranged on the circuit board, and the electronic device can be electrically connected to the gold finger through the wiring on the circuit board so as to process the electrical signal on the circuit board; the arrangement of the first heat dissipation copper layer and the second heat dissipation copper layer occupies the space on the circuit board where the electronic device is arranged; the electronic device may include a first sub-electronic device, which is arranged on the circuit board, and the first sub-electronic device has a first exposed electrode, and the first exposed electrode is configured to be electrically connected to the wiring on the circuit board; the electronic device may include a second sub-electronic device, and the second sub-electronic device is arranged on the side of the first electronic device facing away from the circuit board, and the second electronic device has a second exposed electrode, and the second exposed electrode is electrically connected to the first exposed electrode; in this way, the two-dimensional patch layout of the electronic device on the surface of the circuit board is converted into a three-dimensional space layout, making full use of the three-dimensional space within the optical module, and completing the layout of more electronic devices in a limited layout space, which is beneficial to the miniaturization and performance improvement of the optical module.

[0669] Based on the description of the aforementioned embodiments of this application, it can be understood that in some examples of the embodiments of this application, the overall size of the optical module is relatively small and the power consumption is relatively high. Therefore, the size of the circuit board is relatively small, and when multiple electronic components are mounted on the circuit board, the layout area on the circuit board is limited.

[0670] For example, in some examples, the first heat dissipation copper layer occupies the patch layout space on the surface of the circuit board.

[0671] In some examples, the second heat dissipation copper layer occupies patch layout space on the surface of the circuit board.

[0672] It is understood that, when placing components on a circuit board, the entire printed circuit board (PCB) can be divided into panels. For example, the entire PCB can be divided into panels by cutting. Components are then placed on the separated boards. For example, solder paste application and SMT assembly processes are performed on the boards.

[0673] In some examples of the embodiments of the present application, due to the small size of the circuit board, the layout area on the single board is limited, and the layout is difficult. In order to fully utilize the internal space of the optical module, the layout efficiency on the circuit board is improved, and the production and processing of the circuit board is facilitated.

[0674] Figure 51 Schematic diagram of the structure of the circuit board in the optical module provided according to some embodiments of the present application Figure 4 , Figure 52 Schematic diagram of the structure of the circuit board in the optical module provided according to some embodiments of the present application Figure 5 .

[0675] Reference Figure 51 and Figure 52 As shown, in some examples of the embodiments of the present application, the side of the circuit board 300 may have board-dividing connection ribs.

[0676] In some examples, the panel connection ribs can be part of the connection ribs reserved when the entire PCB is cut into panels. In other words, when the entire PCB is cut into panels, a portion of the area can be reserved so that the PCB boards can be connected to each other through the panel connection ribs.

[0677] In some examples, the sub-board connection ribs are connected to adjacent circuit boards 300. Here, the adjacent circuit boards 300 may be two adjacent circuit boards 300 on the entire PCB.

[0678] In some examples, after the circuit board 300 is split, it may have four sides. Split-board connection ribs may be reserved on the four sides of the circuit board 300, allowing multiple PCBs to be assembled into a complete board. In other words, the entire PCB board is not completely split; adjacent PCBs are connected by split-board connection ribs to form a complete PCB board.

[0679] In some examples, electronic components may be arranged on each individual board of the circuit board 300 on the entire PCB.

[0680] In some examples, after the electronic device patch assembly is completed on each circuit board 300 , the board connection ribs may be cut by laser cutting to obtain a single circuit board 300 with the assembly completed.

[0681] In some examples, the circuit board 300 may include a gold finger area 314 . The gold fingers 301 may be disposed in the gold finger area 314 .

[0682] In some examples, the gold finger area 314 extends from the electrical port to the outside of the cavity, so as to facilitate electrical connection between the gold finger 301 and the host computer 100 .

[0683] In some examples, the gold finger area 314 does not require patch panels. The gold finger area 314 may not be provided with board connection ribs. In this way, the gold finger area 314 is exposed outside the cavity, which can optimize the appearance of the optical module 200.

[0684] In some examples, the circuit board 300 may include a first layout area 315 . The first layout area 315 may be connected to one end of the gold finger area 314 .

[0685] In some examples, the first fabric area 315 may be located within the cavity.

[0686] In some examples, the first optical transceiver component can be disposed in the first layout area 315 , and the first optical transceiver component occupies the layout space of the first layout area 315 .

[0687] In some examples, the side edges of the first fabrication area 315 may be provided with board-splitting ribs. Thus, the board-splitting ribs connect to adjacent circuit boards 300, thereby providing support for the first fabrication area 315 and facilitating solder paste application and SMT placement in the first fabrication area 315.

[0688] In some examples, the circuit board 300 may include a clamping area 316 .

[0689] In some examples, the clamping plate area 316 may be connected to an end of the first fabric area 315 facing away from the gold finger area 314 .

[0690] In some examples, to facilitate the arrangement of the unlocking component, the first lower side plate and the second lower side plate of the lower housing have recessed portions, and the unlocking component can be connected to the recessed portions.

[0691] In some examples, when the unlocking component moves relative to the lower housing, the matching relationship between the optical module and the host computer can be released.

[0692] In some examples, the clamping area 316 is retracted from the first fabric area 315 along the width direction of the circuit board 300 .

[0693] In some examples, the clamping area 316 can be configured as a clamping position for clamping the circuit board 300 when the circuit board 300 is transported or installed.

[0694] In some examples, to avoid damaging the circuit board 300 when clamping the circuit board 300 , the clamping area 316 may not be patched.

[0695] In some examples, since the clamping plate area 316 is not subjected to patch placement, the clamping plate area 316 does not need to be supported when patch placement is performed on the circuit board 300 .

[0696] In some examples, the side edges of the clamping plate area 316 may not be provided with panel connection ribs. In this way, after the SMD components are placed on the circuit board 300, the circuit board 300 can be quickly depaneled, thereby improving the efficiency of depaneling the circuit board 300.

[0697] In some examples, the circuit board 300 may include a second fabric area 317 . The second fabric area 317 may be connected to a side of the clamping plate area 316 facing away from the first fabric area 315 .

[0698] In some examples, the splint area 316 may be located between the first fabric area 315 and the second fabric area 317 .

[0699] In some examples, the clamping area 316 may be retracted into the second fabric area 317 along the width direction of the circuit board 300 .

[0700] In some examples, the width of the splinting area 316 may be smaller than the width of the first fabric area 315 .

[0701] In some examples, the width of the splint area 316 may be smaller than the width of the second fabric area 317 .

[0702] In some examples, the side edges of the second fabric area 317 may be provided with split-panel connection ribs. This allows the split-panel connection ribs to support the second fabric area 317 during patch placement, preventing it from bending and deforming, and facilitating solder paste application and patch placement in the second fabric area 317.

[0703] In some examples, the circuit board 300 may include a top panel area 318 . The top panel area 318 may be connected to an end of the second fabric area 317 facing away from the first fabric area 315 .

[0704] In some examples, the top plate area 318 can be configured to abut against the inner wall of the cavity to limit the circuit board 300 .

[0705] In some examples, the sides of the top panel area 318 may be provided with split-panel connecting ribs. This allows the split-panel connecting ribs to support the top panel area 318 when solder paste and SMD components are applied to the top panel area 318, thereby preventing the top panel area 318 from bending or deforming.

[0706] In some examples, the top panel area 318 may have a first side panel. The first side edge 3181 may be a side of the top panel area 318 facing away from the second fabric area 317 .

[0707] In some examples, the split-panel connecting ribs may include first split-panel connecting ribs 3301. The first split-panel connecting ribs 3301 may be provided on the first side 3181.

[0708] In some examples, the first split-board connecting ribs 3301 may be provided on both sides of the first side edge 3181 along the width direction of the circuit board 300 .

[0709] In some examples, after the circuit board 300 is debonded, the first debonding connecting ribs 3301 can be smoothed to make the first side edge 3181 smooth, facilitating contact between the first side edge 3181 and the inner wall of the cavity and improving the stability of the circuit board 300 within the cavity.

[0710] In some examples, the top panel area 318 may have a second side 3182 , which may be connected to the first side 3181 .

[0711] In some examples, the second side 3182 may extend along the length direction of the circuit board 300 toward the second layout area 317 .

[0712] In some examples, the top panel area 318 may have a third side 3183. The third side 3183 may be connected to the first side 3181. The third side 3183 may be disposed opposite to the second side 3182.

[0713] In some examples, the third side 3183 may extend along the length direction of the circuit board 300 toward the second layout area 317 .

[0714] In some examples, the first split-panel connecting rib 3301 may be provided on the second side 3182 .

[0715] In some examples, the first split-panel connecting rib 3301 may be provided on the third side 3183 .

[0716] In some examples, there may be two groups of first panel connecting ribs 3301 , one of which may be located on the second side 3182 , and the other of which may be located on the third side 3183 .

[0717] In some examples, the second fabric area 317 may have a fourth side 3171 . The fourth side 3171 may extend along the length direction of the circuit board 300 .

[0718] In some examples, the second fabric area 317 may have a fifth side 3172 . The fifth side 3172 may extend along the length direction of the circuit board 300 .

[0719] In some examples, the fourth side 3171 and the fifth side 3172 may be disposed opposite to each other.

[0720] In some examples, the second positioning hole 305 may include a first sub-positioning hole 3051 . The first sub-positioning hole 3051 may be located between the second side 3182 and the fourth side 3171 .

[0721] In some examples, the second positioning hole 305 may include a second sub-positioning hole 3052 . The second sub-positioning hole 3052 may be located between the third side 3183 and the fifth side 3172 .

[0722] In some examples, the second sub-positioning hole 3052 may be disposed opposite to the first sub-positioning hole 3051 .

[0723] In some examples, the panel connecting ribs may include a second panel connecting rib 3302. The second panel connecting rib 3302 may be located in the middle of the fourth side 3171. Thus, the second panel connecting rib 3302 may support the second fabric area 317, facilitating patch placement in the second fabric area 317.

[0724] In some examples, after the circuit board 300 is decoupled, the second decoupling rib 3302 is separated from the first sub-positioning hole 3051. This allows the second decoupling rib 3302 to avoid the first sub-positioning hole 3051, ensuring the integrity of the first sub-positioning hole 3051 and facilitating positioning of the circuit board 300 within the cavity.

[0725] In some examples, after the circuit board 300 is decoupled, the third decoupling rib 3303 is separated from the second sub-positioning hole 3052. This allows the third decoupling rib 3303 to avoid the second sub-positioning hole 3052, ensuring the integrity of the second sub-positioning hole 3052 and facilitating positioning of the circuit board 300 within the cavity.

[0726] In some examples, the first fabric area 315 may have a sixth side 3151 . The sixth side 3151 may extend along the length direction of the circuit board 300 .

[0727] In some examples, one end of the sixth side 3151 may be connected to the clamping area 316 , and the other end of the sixth side 3151 may be connected to the gold finger area 314 .

[0728] In some examples, the first positioning hole 304 may include a third sub-positioning hole 3041 . The third sub-positioning hole 3041 may be located in the middle of the sixth side 3151 .

[0729] In some examples, the split-board connecting ribs may include a fourth split-board connecting rib 3304. The fourth split-board connecting rib 3304 may be located at the end of the sixth side surface facing the clamping area 316. In this manner, the fourth split-board connecting rib 3304 can avoid the third sub-positioning hole 3041. This ensures the integrity of the third sub-positioning hole 3041 and facilitates positioning of the circuit board 300.

[0730] In some examples, the split-panel connecting ribs may include a fifth split-panel connecting rib 3305 . The fifth split-panel connecting rib 3305 may be located at an end of the sixth side 3151 facing away from the clamping plate area 316 . In this way, the fifth split-panel connecting rib 3305 may avoid the third sub-positioning hole 3041 .

[0731] In some examples, the first fabric area 315 may have a seventh side 3152 . The seventh side 3152 may extend along the length direction of the circuit board 300 .

[0732] In some examples, the seventh side 3152 can be disposed opposite to the sixth side 3151 .

[0733] In some examples, the first positioning hole 304 may include a fourth sub-positioning hole 3042 . The fourth sub-positioning hole 3042 may be located in the middle of the seventh side 3152 .

[0734] In some examples, the fourth sub-positioning hole 3042 may be disposed opposite to the third sub-positioning hole 3041 .

[0735] In some examples, the split-panel connecting ribs may include a sixth split-panel connecting rib 3306 . The sixth split-panel connecting rib 3306 may be located at an end of the seventh side 3152 facing the clamping plate area 316 . In this way, the sixth split-panel connecting rib 3306 may avoid the fourth sub-positioning hole 3042 .

[0736] In some examples, the sixth panel connecting rib 3306 can be disposed opposite the fourth panel connecting rib 3304. Thus, the fourth panel connecting rib 3304 and the sixth panel connecting rib 3306 can support the first fabric area 315 from both sides, facilitating patch placement on the first fabric area 315.

[0737] In some examples, the split-panel connecting ribs may include a seventh split-panel connecting rib 3307 . The seventh split-panel connecting rib 3307 may be located at an end of the seventh side 3152 facing away from the clamping plate area 316 . In this way, the seventh split-panel connecting rib 3307 may avoid the fourth sub-positioning hole 3042 .

[0738] In some examples, the seventh split-panel connecting rib 3307 can be disposed opposite the fifth split-panel connecting rib 3305. In this way, the fourth split-panel connecting rib 3304, the fifth split-panel connecting rib 3305, the sixth split-panel connecting rib 3306, and the seventh split-panel connecting rib 3307 can support the first fabric area 315 at its four corners, facilitating patch placement on the first fabric area 315.

[0739] According to the optical modules provided in some examples of the embodiments of the present application, the optical modules themselves are relatively small, resulting in a limited area on the circuit board that can be used to arrange electronic devices. In addition, a heat dissipation copper layer is laid on the surface of the circuit board, and the first optical transceiver component is arranged on the first heat dissipation copper layer. In order to dissipate the heat generated by the first optical transceiver component, the first heat dissipation copper layer extends from the first optical transceiver component, and the first heat dissipation copper layer and the first optical transceiver component occupy the space for the components on the circuit board; the second optical transceiver component is arranged on the second heat dissipation copper layer. In order to dissipate the heat generated by the second optical transceiver component, the second heat dissipation copper layer extends from the second optical transceiver component, and the second heat dissipation copper layer and the second optical transceiver component occupy the space for the components on the circuit board; The transceiver components occupy the layout space on the circuit board; in order to facilitate the arrangement of multiple electronic devices on a circuit board with limited layout area; in some examples of the embodiments of the present application, panel connection ribs can be set on the side of the circuit board, that is, when the circuit board is divided into panels, some areas on the side of the circuit board are reserved without separation, so that the entire circuit board is not completely separated, that is, a panel is formed; in this way, layout can be carried out on the entire panel, and after the layout is completed, the panel connection ribs can be cut to complete the panel division; layout is carried out on the entire panel formed by the panel, which increases the layout space, facilitates layout on the circuit board, and improves the production and processing efficiency of the optical module.

[0740] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present disclosure.

Claims

1. An optical module, characterized in that: include: upper shell; A lower shell, covering the upper shell to form a cavity; A circuit board is disposed in the cavity, and a second electronic device is disposed on the circuit board; The second electronic device includes: a first optical chip assembly disposed on an upper surface of the circuit board, the first optical chip assembly being electrically connected to a trace on the circuit board via a first bonding wire, and generating heat when the first optical chip assembly is in operation; a second optical chip assembly, disposed on the upper surface of the circuit board, the second optical chip assembly being electrically signal-connected to the trace via a second bonding wire, and generating heat when the second optical chip assembly is in operation; A filter component is provided on the circuit board; a first lens assembly, disposed on an upper surface of the circuit board, forming a first accommodating cavity between the first lens assembly and the circuit board, wherein the first optical chip assembly and the second optical chip assembly are located in the first accommodating cavity, and wherein the first lens assembly isolates heat conduction between the first optical chip assembly and the second optical chip assembly and the upper housing; a heat conducting component, disposed on the lower surface of the circuit board, the heat conducting component being in thermal conduction contact with the first optical chip component and the second optical chip component, and the heat conducting component being in thermal conduction contact with the lower housing; In which, the filter assembly is electrically connected to the first optical chip assembly and the second optical chip assembly, and the distance between the filter assembly and the first optical chip assembly and the second optical chip assembly is less than or equal to a first preset threshold; the accommodating space of the first accommodating cavity is smaller than the sum of the sizes of the first optical chip assembly, the second optical chip assembly and the filter assembly, and the filter assembly is arranged on the lower surface of the circuit board. The filter assembly is electrically connected to the first optical chip assembly and the second optical chip assembly through a third bonding wire, so that the distance between the filter assembly and the first optical chip assembly and the second optical chip assembly is less than or equal to the first preset threshold.

2. The optical module according to claim 1, wherein The lower housing comprises: base plate; a first lower side plate connected to one side of the bottom plate; a second lower side plate connected to the other side of the bottom plate, the second lower side plate being arranged opposite to the first lower side plate; The bottom plate is provided with a first supporting boss and a second supporting boss, wherein one side surface of the first supporting boss is connected to the first lower side plate; and one side surface of the second supporting boss is connected to the second lower side plate; The circuit board is arranged between the first lower side plate and the second lower side plate, and the circuit board is supported on the first supporting boss and the second supporting boss; the heat conducting component protrudes from the lower surface of the circuit board to be in heat conduction contact with the bottom plate.

3. The optical module according to claim 2, wherein: The first supporting boss and the second supporting boss protrude from the bottom plate at the same height, and the first supporting boss and the second supporting boss protrude from the bottom plate at a height greater than the heat conducting component protrudes from the lower surface of the circuit board; The bottom plate is provided with a first protrusion and a second protrusion; The heat conducting component comprises: a first heat conducting sub-member disposed on the lower surface of the circuit board, the first heat conducting sub-member being located between the first protruding portion and the first optical chip assembly, the first heat conducting sub-member being in thermal contact with the first optical chip assembly and the first protruding portion; The second heat conducting sub-component is provided on the lower surface of the circuit board, is located between the second protruding portion and the second optical chip assembly, and is in thermal contact with the second optical chip assembly and the second protruding portion.

4. The optical module according to claim 3, wherein: A first recessed portion is provided between the first protruding portion and the first lower side plate, a second recessed portion is provided between the first protruding portion and the second protruding portion, and a third recessed portion is provided between the second protruding portion and the second lower side plate; The filtering component includes: a first sub-filter assembly, located on a side of the first sub-heat-conducting member facing away from the second sub-heat-conducting member, the first sub-filter assembly being electrically connected to the first optical chip assembly; the height of the first sub-filter assembly protruding from the circuit board being higher than the height of the heat-conducting assembly protruding from the circuit board, the first sub-filter assembly being located in the first recessed portion; a second sub-filter assembly, located between the first sub-heat conducting member and the second sub-heat conducting member, the second sub-filter assembly being electrically connected to the first optical chip assembly and the second optical chip assembly respectively; the height of the second sub-filter assembly protruding from the circuit board is higher than the height of the heat conducting assembly protruding from the circuit board, and the second sub-filter assembly being located in the second recessed portion; The third sub-filter assembly is located on a side of the second sub-heat conducting component facing away from the first sub-heat conducting component. The third sub-filter assembly is electrically connected to the second optical chip assembly and is located in the third recessed portion.

5. The optical module according to claim 3, wherein: The circuit board has through holes penetrating the upper surface and the lower surface, and the through holes include: a first through hole and a second through hole; The heat conducting component further comprises: a first heat-conducting connecting member, disposed in the first through hole, the first heat-conducting connecting member being in thermal contact with the first optical chip assembly; a heat transfer member disposed on the lower surface of the circuit board, the heat transfer member being in thermal contact with the first heat-conducting connecting member; The first sub-heat conductive member is disposed between the heat transfer member and the first protrusion, and the first sub-heat conductive member is in thermal contact with the heat transfer member and the first protrusion respectively; the first sub-heat conductive member includes a first flexible heat conductive member; a second heat-conducting connecting member disposed in the second through hole, the second heat-conducting connecting member being in heat-conducting contact with the second optical chip assembly, and the second heat-conducting connecting member being in heat-conducting contact with the heat transfer member; The second heat conducting sub-member is provided between the heat transfer member and the second protrusion, and is in thermal conduction contact with the heat transfer member and the second protrusion respectively; the second heat conducting sub-member includes a second flexible heat conducting member.

6. The optical module according to claim 5, characterized in that The inner wall of the through hole is provided with a heat-conducting layer, or a heat-conducting block is passed through the through hole; The first heat-conducting connection member includes any one of the heat-conducting layer and the heat-conducting block, and the second heat-conducting connection member includes any one of the heat-conducting layer and the heat-conducting block; The heat transfer member, the first heat-conducting connecting member and the second heat-conducting connecting member are integrated into one piece.

7. The optical module according to claim 6, wherein: The circuit board has a via hole penetrating the upper surface and the lower surface, and the through hole includes the via hole; The heat transfer member is a heat-conducting copper layer provided on the lower surface, and the heat-conducting copper layer is in thermal conduction contact with the heat-conducting layer or the heat-conducting block; and / or, The through hole is an opening that passes through the upper and lower surfaces of the circuit board, and at least one of the first optical chip assembly and the heat transfer member is inserted into the opening; at least one of the second optical chip assembly and the heat transfer member is inserted into the opening; the heat transfer member is a heat-conducting copper block.

8. The optical module according to claim 5, wherein: The circuit board has a wire bonding pad, which is located on the side of the first optical chip assembly and the second optical chip assembly; the first optical chip assembly is electrically connected to the filter assembly through the wire bonding pad, and the second optical chip assembly is electrically connected to the filter assembly through the wire bonding pad; The side edge of the heat transfer member protrudes from the side edge of the first optical chip assembly and extends to the side of the wire bonding pad facing away from the first optical chip assembly; The side edge of the heat transfer member protrudes from the side edge of the second optical chip assembly and extends to a side of the wire bonding pad facing away from the second optical chip assembly.

9. The optical module according to claim 1, wherein: The second electronic device further includes: a third optical chip assembly, disposed on the upper surface of the circuit board, the third optical chip assembly being electrically connected to the circuit board, and generating heat when the third optical chip assembly is in operation; a fourth optical chip assembly, disposed on the upper surface of the circuit board, the fourth optical chip assembly being electrically connected to the circuit board, and generating heat when the fourth optical chip assembly is in operation; The third optical chip assembly is arranged on one side of the first optical chip assembly along the length direction of the circuit board, and the fourth optical chip assembly is arranged on one side of the second optical chip assembly along the length direction of the circuit board; The optical module further includes: a second lens assembly, disposed on the upper surface of the circuit board; a second accommodating cavity is formed between the second lens assembly and the circuit board, and the third optical chip assembly and the fourth optical chip assembly are located in the second accommodating cavity; The heat conducting assembly is in thermally conductive contact with the third optical chip assembly and the fourth optical chip assembly.

10. An optical module, characterized in that: include: upper shell; A lower shell, covering the upper shell to form a cavity; A circuit board is disposed in the cavity, and a second electronic device is disposed on the circuit board; The second electronic device includes: a first optical chip assembly disposed on an upper surface of the circuit board, the first optical chip assembly being electrically connected to a trace on the circuit board via a first bonding wire, and generating heat when the first optical chip assembly is in operation; a second optical chip assembly, disposed on the upper surface of the circuit board, the second optical chip assembly being electrically signal-connected to the trace via a second bonding wire, and generating heat when the second optical chip assembly is in operation; a first lens assembly, disposed on an upper surface of the circuit board, forming a first accommodating cavity between the first lens assembly and the circuit board, wherein the first optical chip assembly and the second optical chip assembly are located in the first accommodating cavity, and wherein the first lens assembly isolates heat conduction between the first optical chip assembly and the second optical chip assembly and the upper housing; a heat conducting component, disposed on the lower surface of the circuit board, the heat conducting component being in thermal conduction contact with the first optical chip component and the second optical chip component, and the heat conducting component being in thermal conduction contact with the lower housing; The second electronic device further includes: A filter assembly is provided on the circuit board; the filter assembly is electrically connected to the first optical chip assembly and the second optical chip assembly, and the distance between the filter assembly and the first optical chip assembly and the second optical chip assembly is less than or equal to a first preset threshold; the accommodating space of the first accommodating cavity is smaller than the sum of the sizes of the first optical chip assembly, the second optical chip assembly, and the filter assembly; the filter assembly is provided on the lower surface of the circuit board, and the filter assembly is electrically connected to the first optical chip assembly and the second optical chip assembly through a third bonding wire, so that the distance between the filter assembly and the first optical chip assembly and the second optical chip assembly is less than or equal to the first preset threshold; The circuit board has a wire bonding pad, which is located on the side of the first optical chip assembly and the second optical chip assembly; the side of the heat conducting assembly protrudes from the side of the first optical chip assembly and extends to the side of the wire bonding pad facing away from the first optical chip assembly; The side edge of the heat conducting component protrudes from the side edge of the second optical chip component and extends to a side of the wire bonding pad facing away from the second optical chip component.

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