Optical module

Abstract

The invention provides an optical module. A light emitting component comprises a base, a first cover plate, a laser array, a first optical fiber array and a second optical fiber array. The first optical fiber array comprises a first optical fiber ribbon, and the second optical fiber array comprises a second optical fiber ribbon. One end, facing the optical port, of the first cover plate is provided with a first opening, so that the first optical fiber ribbon and the second optical fiber ribbon pass through the first opening. The first sealing part is arranged in the first opening to block the first opening, so that the cooling medium is prevented from entering the cavity formed by the base and the first cover plate through the first opening, and the liquid cooling device is more suitable for a liquid cooling environment. And a barrier is arranged between the base and the first cover plate and faces the first opening. The blocking bar comprises a plurality of baffles arranged at intervals, and gaps are formed between the adjacent baffles so that the first optical fiber ribbons and the second optical fiber ribbons can pass through the gaps. And the uncured first sealing part is limited in a gap between the adjacent baffles, so that the first sealing part is prevented from entering a cavity formed by the first cover plate and the base through the gap.

Description

Technical Field

[0001] The present disclosure relates to the field of optical communication technology, and in particular to an optical module. Background Art

[0002] With the development of new services and applications such as cloud computing, mobile internet, and video, advances in optical communication technology are becoming increasingly important. As a key component in optical communication equipment, optical modules enable photoelectric signal conversion. As optical communication technology evolves, the data transmission rate of these modules continues to increase.

[0003] As the transmission rate of optical modules continues to increase, the need for heat dissipation increases. Liquid cooling can be used to dissipate heat from optical modules. For example, by immersing the optical module in a cooling medium, the cooling medium dissipates the heat from the module. Summary of the Invention

[0004] The embodiments of the present disclosure provide an optical module that provides sealed protection for a light emitting component, thereby preventing a cooling medium from affecting the optical path of the light emitting component and is suitable for a liquid cooling environment.

[0005] The optical module provided in the embodiment of the present disclosure includes:

[0006] circuit boards;

[0007] A light emitting component, electrically connected to the circuit board, comprising:

[0008] Laser arrays;

[0009] A first optical fiber array is located on the light output path of the laser array, and the first optical fiber array includes a first optical fiber ribbon;

[0010] A second optical fiber array is located on the light output path of the laser array, and the second optical fiber array includes a second optical fiber ribbon;

[0011] a base, embedded in the circuit board, the base being configured to support the laser array, the first optical fiber array, and the second optical fiber array;

[0012] A first cover plate is connected to the base; the first cover plate has a first opening at one end facing the optical port to allow the first optical fiber ribbon and the second optical fiber ribbon to pass through;

[0013] a barrier fence located between the base and the first cover plate and disposed toward the first opening, the barrier fence comprising a plurality of spaced-apart baffles with gaps between adjacent baffles to allow the first optical fiber ribbon and the second optical fiber ribbon to pass through the gaps;

[0014] The first sealing portion is located on the side of the partition fence facing the light port and is arranged along the first opening to seal the first opening, wherein the first optical fiber ribbon and the second optical fiber ribbon pass through the first sealing portion; the first sealing portion is confined to the gap between adjacent baffles to prevent the first sealing portion from passing through the gap into the cavity formed by the first cover plate and the base.

[0015] The optical module provided herein includes a circuit board and a light-emitting component. The light-emitting component includes a base, a first cover plate, a laser array, a first optical fiber array, and a second optical fiber array. The base is connected to the first cover plate, and the laser array, the first optical fiber array, and the second optical fiber array are located in a cavity formed by the base and the first cover plate. The first optical fiber array and the second optical fiber array are respectively located in the light output path of the laser array. The first optical fiber array includes a first optical fiber ribbon, and the second optical fiber array includes a second optical fiber ribbon, which transmit the optical signal output by the laser array. The first cover plate has a first opening at one end facing the optical port to avoid the first and second optical fiber ribbons, allowing the first and second optical fiber ribbons to pass through the first opening. When the optical module is in a liquid cooling environment, the cooling medium may enter the cavity formed by the base and the first cover plate through the first opening, thereby affecting the light path transmission of the light-emitting component. To this end, a first sealing portion is provided in the first opening to block the first opening, thereby preventing the cooling medium from entering the cavity formed by the base and the first cover plate through the first opening, making it more suitable for liquid cooling environments. The uncured first sealing portion is fluid and may flow into the cavity formed by the base and the first cover plate. For this purpose, a baffle is provided between the base and the first cover plate and toward the first opening. The first sealing portion is provided along one side of the baffle. The baffle includes a plurality of baffles arranged at intervals, with gaps between adjacent baffles to allow the first optical fiber ribbon and the second optical fiber ribbon to pass along the gaps. The uncured first sealing portion is confined to the gaps between adjacent baffles, thereby preventing the first sealing portion from passing through the gaps between adjacent baffles into the cavity formed by the first cover plate and the base. At the same time, the gaps between adjacent baffles can separate adjacent optical fibers, preventing the optical fibers from gathering together, thereby facilitating the filling of the first sealing portion in the gaps between the optical fibers. In the present disclosure, the first opening is sealed by the first sealing portion, and the cavity formed by the base and the first cover plate is sealed and protected, thereby preventing the cooling medium from passing through the first opening into the cavity formed by the base and the first cover plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] To more clearly illustrate the technical solutions of the present disclosure, the following briefly describes the drawings used in some embodiments of the present disclosure. Obviously, the drawings described below are merely illustrations of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, and the like involved in the embodiments of the present disclosure.

[0017] Figure 1 A partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0018] Figure 2 A partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0019] Figure 3 is a structural diagram of an optical module according to some embodiments;

[0020] Figure 4 is an exploded view of an optical module according to some embodiments;

[0021] Figure 5 An assembly diagram of an interface claw provided according to some embodiments of the present disclosure;

[0022] Figure 6 An exploded view of an interface claw assembly according to some embodiments of the present disclosure;

[0023] Figure 7 A schematic diagram of assembling an interface claw and an optical fiber plug according to some embodiments of the present disclosure;

[0024] Figure 8 An exploded view of an assembly of an interface claw and an optical fiber plug according to some embodiments of the present disclosure;

[0025] Figure 9 A structural diagram of an interface claw provided according to some embodiments of the present disclosure;

[0026] Figure 10 An exploded view of an interface claw provided according to some embodiments of the present disclosure;

[0027] Figure 11 A cross-sectional structural diagram of an interface claw provided according to some embodiments of the present disclosure;

[0028] Figure 12 This is an exploded cross-sectional view of an interface claw provided according to some embodiments of the present disclosure;

[0029] Figure 13An exploded view of an optical fiber plug assembly structure provided according to some embodiments of the present disclosure;

[0030] Figure 14 A diagram of an assembly structure of a limit piece and a pin provided according to some embodiments of the present disclosure;

[0031] Figure 15 A schematic diagram of an optical port connection structure provided according to some embodiments of the present disclosure;

[0032] Figure 16 A partial schematic diagram of an optical port connection provided according to some embodiments of the present disclosure;

[0033] Figure 17 A structural diagram of a connector provided according to some embodiments of the present disclosure;

[0034] Figure 18 A cross-sectional structural diagram of a connector provided according to some embodiments of the present disclosure;

[0035] Figure 19 A structural diagram of an assembly between a connector and a lower housing according to some embodiments of the present disclosure;

[0036] Figure 20 for Figure 19 A partial enlarged view of point A in the middle;

[0037] Figure 21 An exploded view of an assembly of a connector and a lower housing according to some embodiments of the present disclosure;

[0038] Figure 22 This is a structural diagram of an assembly of a connector, an upper shell, and a lower shell according to some embodiments of the present disclosure;

[0039] Figure 23 An exploded view of an assembly of a connector, an upper housing, and a lower housing according to some embodiments of the present disclosure;

[0040] Figure 24 for Figure 23 A partial enlarged view of point B in the middle;

[0041] Figure 25 A structural diagram of an extended optical cable provided according to some embodiments of the present disclosure;

[0042] Figure 26 A cross-sectional structural diagram of an isolation member provided according to some embodiments of the present disclosure;

[0043] Figure 27 A cross-sectional view of an assembly of a connector and an extension optical cable according to some embodiments of the present disclosure;

[0044] Figure 28A cross-sectional view of an assembly of an extension optical cable and an optical cable plug according to some embodiments of the present disclosure;

[0045] Figure 29 A schematic diagram of assembling a circuit board and a light emitting component according to some embodiments of the present disclosure;

[0046] Figure 30 A cross-sectional view of an assembly of a circuit board and a light emitting component according to some embodiments of the present disclosure;

[0047] Figure 31 A structural diagram of a light emitting component provided according to some embodiments of the present disclosure;

[0048] Figure 32 A cross-sectional structural diagram of a light emitting component provided according to some embodiments of the present disclosure;

[0049] Figure 33 A partially exploded view of a light emitting component provided according to some embodiments of the present disclosure;

[0050] Figure 34 A schematic diagram of a barrier structure provided according to some embodiments of the present disclosure;

[0051] Figure 35 A cross section of a light emitting component provided according to some embodiments of the present disclosure Figure 1 ;

[0052] Figure 36 A cross section of a light emitting component provided according to some embodiments of the present disclosure Figure 2 ;

[0053] Figure 37 A cross section of a light emitting component provided according to some embodiments of the present disclosure Figure 3 ;

[0054] Figure 38 A cross section of a light emitting component provided according to some embodiments of the present disclosure Figure 4 ;

[0055] Figure 39 The second cover assembly section provided according to some embodiments of the present disclosure Figure 1 ;

[0056] Figure 40 The second cover assembly section provided according to some embodiments of the present disclosure Figure 2 ;

[0057] Figure 41 A cross-sectional view of an assembly of a first cover plate and a circuit board according to some embodiments of the present disclosure;

[0058] Figure 42A cross-sectional view of a base and a circuit board assembly according to some embodiments of the present disclosure;

[0059] Figure 43 This is a schematic diagram of assembling a second sealing portion according to some embodiments of the present disclosure;

[0060] Figure 44 An exploded view of a second sealing portion provided according to some embodiments of the present disclosure;

[0061] Figure 45 This is a schematic diagram of assembling a third sealing portion according to some embodiments of the present disclosure;

[0062] Figure 46 This is a schematic diagram of assembling a third sealing portion according to some embodiments of the present disclosure;

[0063] Figure 47 A bottom structural diagram of a base provided according to some embodiments of the present disclosure;

[0064] Figure 48 A schematic diagram of assembling a light receiving component and a circuit board according to some embodiments of the present disclosure;

[0065] Figure 49 A cross-sectional view of an assembly of a light receiving component and a circuit board 300 according to some embodiments of the present disclosure;

[0066] Figure 50 The assembly and decomposition of a light receiving component and a circuit board 300 according to some embodiments of the present disclosure is shown in FIG. Figure 1 ;

[0067] Figure 51 The assembly and decomposition of a light receiving component and a circuit board 300 according to some embodiments of the present disclosure is shown in FIG. Figure 2 ;

[0068] Figure 52 An assembly section of an upper housing, a circuit board, and a lower housing provided according to some embodiments of the present disclosure Figure 1 ;

[0069] Figure 53 for Figure 52 A partial enlarged view of point C in the middle;

[0070] Figure 54 An assembly section of an upper housing, a circuit board, and a lower housing provided according to some embodiments of the present disclosure Figure 2 ;

[0071] Figure 55 An upper housing, a circuit board, and a lower housing assembly and decomposition method according to some embodiments of the present disclosure are provided. Figure 1 ;

[0072] Figure 56 An assembly section of an upper housing, a circuit board, and a lower housing provided according to some embodiments of the present disclosure Figure 3 ;

[0073] Figure 57 An upper housing, a circuit board, and a lower housing assembly and decomposition method according to some embodiments of the present disclosure are provided. Figure 2 ;

[0074] Figure 58 This is a diagram of an assembly structure of a circuit board and a lower housing according to some embodiments of the present disclosure;

[0075] Figure 59 An assembly cross section of a circuit board and a lower housing provided according to some embodiments of the present disclosure Figure 1 ;

[0076] Figure 60 An assembly cross section of a circuit board and a lower housing provided according to some embodiments of the present disclosure Figure 2 ;

[0077] Figure 61 for Figure 60 A partial enlarged view of point D in the middle;

[0078] Figure 62 Another assembly diagram of a circuit board and a lower housing according to some embodiments of the present disclosure is provided;

[0079] Figure 63 This is an exploded view of another assembly of a circuit board and a lower housing provided according to some embodiments of the present disclosure;

[0080] Figure 64 A cross-sectional view of another assembly of a circuit board and a lower housing provided according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0081] Some embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. However, the embodiments described are only some of the embodiments of the present disclosure, not all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments provided in the present disclosure are within the scope of protection of the present disclosure.

[0082] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as open and inclusive, that is, "including, but not limited to"; the terms "first" and "second" are not to be understood as indicating or implying relative importance or indicating an upper limit on quantity; the term "plurality" means two or more; the term "connected" is to be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, or an integral connection, and can be directly connected or indirectly connected through an intermediate medium; the use of the terms "suitable for" or "configured to" means open and inclusive language, which does not exclude equipment that is suitable for or configured to perform additional tasks or steps; terms such as "parallel", "perpendicular", "same", "consistent", "level" and so on are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges generated in practice, and also include differences based on the same design concept but due to manufacturing reasons.

[0083] In optical communication technology, to establish information transmission between information processing devices, it is necessary to load the information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When transmitting optical signals within information transmission equipment, they can reduce optical power loss, thereby enabling high-speed, long-distance, and low-cost information transmission. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment typically includes optical fibers and optical waveguides.

[0084] Optical modules can convert optical signals into electrical signals between information processing devices and information transmission devices. For example, at least one of the optical signal input or output ends of an optical module is connected to an optical fiber, and at least one of the electrical signal input or output ends of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber. Because multiple information processing devices can transmit information via electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is referred to as the optical module's host computer. Furthermore, the optical signal input or output end of the optical module can be referred to as an optical port, and the electrical signal input or output end of the optical module can be referred to as an electrical port.

[0085] Figure 1 FIG. 1 is a partial structural diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system mainly includes a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .

[0086] One end of optical fiber 101 extends toward remote information processing device 1000, and the other end of optical fiber 101 is connected to optical module 200 through the optical port of optical module 200. Optical signals can be totally reflected in optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal undergoes multiple total reflections in optical fiber 101 to transmit the optical signal from remote information processing device 1000 to optical module 200, and vice versa, thereby achieving long-distance, low-power information transmission.

[0087] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 may be detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0088] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0089] The host computer 100 also includes an external electrical interface that can access an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to access a network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing device 2000 and the host computer 100 via the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is then transmitted to the remote information processing device 1000 via the optical fiber 101. For example, a first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that optical modules are tools for converting optical signals into electrical signals. During this conversion process, the information does not change, but the encoding and decoding methods of the information can change.

[0090] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0091] Figure 2 FIG1 is a partial structural diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structure of the host computer 100 related to the optical module 200 is shown. Figure 2 As shown, the host computer 100 further includes a PCB 105 disposed within the housing, a cage 106 disposed on the surface of the PCB 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed within the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has protruding structures such as fins to increase the heat dissipation area.

[0092] The optical module 200 is inserted into the cage 106 of the host computer 100. The cage 106 secures the optical module 200. Heat generated by the optical module 200 is transferred to the cage 106 and then dissipated through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 connects with the electrical connector inside the cage 106, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, thereby establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0093] Figure 3 is a structural diagram of an optical module according to some embodiments. Figure 4 FIG. 1 is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, the optical module 200 includes a housing, a circuit board 300 disposed in the housing, a light emitting component 400, and a light receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes one of the light emitting component 400 and the light receiving component 500.

[0094] The housing includes an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square.

[0095] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0096] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to achieve the upper shell 201 covering the lower shell 202.

[0097] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 The opening 205 is also located at the end of the optical module 200 ( Figure 3Alternatively, opening 204 is located at the end of optical module 200, while opening 205 is located on the side of optical module 200. Opening 204 is an electrical port, through which the gold finger 301 of circuit board 300 extends and is inserted into the electrical connector of host computer 100; opening 205 is an optical port, configured to receive an external optical fiber 101, thereby connecting optical fiber 101 to the light emitting component 400 and the light receiving component 500 in optical module 200.

[0098] The combined assembly of the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the light emitting component 400, the light receiving component 500, and the like within the housing. The upper housing 201 and the lower housing 202 provide encapsulation and protection for these components. Furthermore, during assembly of the circuit board 300, the light emitting component 400, and the light receiving component 500, the positioning components, heat dissipation components, and electromagnetic shielding components of these components are easily positioned, facilitating automated production.

[0099] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0100] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0101] For example, the unlocking component 600 is located on the outside of the two lower side panels 2022 of the lower housing 202 and includes a snap-fit ​​component that mates with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 secures the optical module 200 in the cage 106. When the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection between the snap-fit ​​component and the host computer, thereby releasing the optical module 200 from the cage 106 and allowing the optical module 200 to be removed from the cage 106.

[0102] The circuit board 300 includes circuit traces, electronic components, and chips. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include, for example, microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers, clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0103] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0104] The circuit board 300 further includes a gold finger 301 formed on the end surface thereof. The gold finger 301 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is connected to the electrical connector in the cage 106. The gold finger 301 can be provided on only one side of the circuit board 300 (e.g. Figure 4 The top surface shown in FIG300 can also be located on the upper and lower surfaces of the circuit board 300 to provide a greater number of pins, thus adapting to applications requiring a large number of pins. Gold fingers 301 are configured to establish an electrical connection with a host computer to facilitate power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, and more. Of course, some optical modules also use flexible circuit boards. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement them.

[0105] At least one of the light emitting component 400 or the light receiving component 500 is located on a side of the circuit board 300 away from the gold finger 301 .

[0106] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300 and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0107] In some embodiments, at least one of the light emitting component or the light receiving component may be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component may be disposed on a surface of the circuit board 300 or a side of the circuit board 300.

[0108] In some embodiments, a housing cavity is formed between the upper housing 201 and the lower housing 202. The circuit board 300 is disposed within the housing cavity. One end of the housing cavity forms the optical port side, where the opening 205 is located, and the other end forms the electrical port side, where the opening 204 is located.

[0109] In some embodiments, an interface clamp 900 is provided on the optical port side. The interface clamp 900 can establish a connection between the internal and external optical fibers. One end of the interface clamp 900 is connected to the optical fiber 101, and the other end is connected to the optical fiber ribbon inside the optical module, thereby connecting the internal and external optical signals.

[0110] Figure 5 This is an assembly diagram of an interface claw provided according to some embodiments of the present disclosure. Figure 6 This is an exploded view of an interface claw assembly according to some embodiments of the present disclosure. Figure 5 and Figure 6 As shown, in some embodiments, the interface claw 900c is used to establish an optical connection between an internal optical signal of the optical module and an external optical signal. The interface claw 900c is located at the end where the upper housing 201 and the lower housing 202 are connected.

[0111] In some embodiments, the end of the interface claw 900c facing the interior of the optical module is connected to the optical fiber plug 900b, and the end facing the exterior of the optical module is connected to the external optical cable 900a. The optical fiber plug 900b is used to secure the optical fiber ribbon inside the optical module, and the external optical cable 900a is used to transmit optical signals between the optical module and the outside world, thereby achieving optical coupling between the internal and external optical signals of the optical module within the interface claw 900c.

[0112] In some embodiments, the end of the interface claw 900c facing the fiber optic plug 900b includes two buckles 910c disposed in a vertically opposed relationship. The buckles 910c are secured to the end of the fiber optic plug 900b, connecting the fiber optic plug 900b to one end of the interface claw 900c. The end of the interface claw 900c facing the external optical cable 900a includes two fins 920c disposed in a horizontally opposed relationship. The external optical cable 900a has a snap-fit ​​groove 910a formed on either side. The fins 920c fit into the snap-fit ​​groove 910a, connecting the external optical cable 900a to the other end of the interface claw 900c.

[0113] In some embodiments, the external optical cable 900a can be inserted or removed from the end of the interface claw 900c, thereby achieving pluggable external optical cable 900. For example, a sliding sleeve 920a is provided around the outer periphery of the external optical cable 900a. After the fin 920c is inserted into the engaging groove 910a, the sliding sleeve 920a is slid toward the interior of the optical module to secure the external optical cable 900a within the interface claw 900c. The external optical cable 900a can be removed from the interface claw 900c by sliding the sliding sleeve 920a in the opposite direction and separating the fin 920c from the engaging groove 910a.

[0114] In some embodiments, a socket 930a is formed at the end of the external optical cable 900a facing the interface claw 900c, and a pin 910b passes through the optical fiber plug 900b. The pin 910b inside the interface claw 900c is inserted into the socket 930a to connect the optical fiber plug 900b with the external optical cable 900a, thereby realizing the connection between the internal and external optical signals.

[0115] In some embodiments, a limiting piece 920b is provided at one end of the optical fiber plug 900b facing the interior of the optical module, and the pin 910b passes through the limiting piece 920b. The limiting piece 920b is used to limit and fix the pin 910b.

[0116] In some embodiments, the electrical port side of the optical module is used to plug into a host computer. A gap is provided between the upper housing 201 on the electrical port side and the surface of the circuit board 300 to avoid wiring on the surface of the circuit board 300. A gap is also provided between the lower housing 202 and the surface of the circuit board 300 to accommodate absorbing material to prevent leakage of electromagnetic radiation.

[0117] Due to the presence of this gap, when the electrical port side of the optical module is inserted into the host computer, dust particles on the host computer are driven by the wind from the air duct of cage 106 and enter the optical module through the gap. Since the optical fiber is cylindrical, there are gaps between the fibers. Dust particles that enter the optical module can then be transported along these gaps to the side of the interface claw 900 facing the interior of the optical module.

[0118] In some embodiments, the side of the interface claw 900 facing the interior of the optical module has a larger assembly gap, and there is also an assembly gap between the side wall of the interface claw 900 and the side wall of the optical fiber plug 900b, so that dust particles entering the side of the interface claw 900 facing the interior of the optical module enter the interior of the interface claw 900 along the assembly gap on this side, and diffuse along the assembly gap between the side wall of the interface claw 900 and the side wall of the optical fiber plug 900b to the side of the interface claw 900 facing the outside of the optical module, that is, the optical port side of the optical module, thereby causing dust particles to adhere to the optical port end face of the interface claw 900, causing certain pollution to the optical port end face, affecting the use of the optical module, and even damaging the optical port end face of the optical module.

[0119] Figure 7 This is a schematic diagram of an assembly of an interface claw and an optical fiber plug according to some embodiments of the present disclosure. Figure 8 This is an exploded view of an interface claw and optical fiber plug assembly according to some embodiments of the present disclosure. Figure 7 and Figure 8 As shown, in some embodiments, the interface claw 900 adopts a split design to assemble the optical fiber plug 900b.

[0120] In some embodiments, the interface claw 900 adopts a split design. The interface claw 900 includes a cover shell 910 and a body 920. The cover shell 910 is covered on the surface of the body 920, and the two are covered and connected.

[0121] The cover 910 and the main body 920 are connected to each other at one end facing the interior of the optical module to form a receiving cavity 930. The optical fiber plug 900b is embedded in the receiving cavity 930.

[0122] In some embodiments, the body 920 includes a first connecting portion 940 and a second connecting portion 950. The first connecting portion 940 faces the interior of the optical module, i.e., toward the electrical port side; the second connecting portion 950 faces the exterior of the optical module, i.e., toward the optical port side. The end surface of the second connecting portion 950 facing the outside is the optical port end surface.

[0123] In some embodiments, the cover 910 is connected to the first connecting portion 940 and a receiving cavity 930 is formed between the cover 910 and the first connecting portion 940 .

[0124] In some embodiments, the surface of the cover shell 910 includes a first sealing plate 913, and the first sealing plate 913 is located above the cover shell 910. The first sealing plate 913 extends from above toward the accommodating cavity 930.

[0125] One end of the body 920 facing the interior of the optical module includes a second sealing plate 923 , which is located below the body 920 . The second sealing plate 923 extends from below toward the accommodating cavity 930 .

[0126] The first sealing plate 913 and the second sealing plate 923 are positioned vertically opposite each other, with a through-hole 960 formed between them. Through-hole 960 allows the interface claw 900 to be open, establishing a connection with the interior of the optical module. A fiber optic ribbon is connected to the optical fiber plug 900b and is routed through through-hole 960 toward the interior of the optical module.

[0127] In some embodiments, the end of the optical fiber plug 900b facing the interior of the optical module is wrapped by a first sealing plate 913 and a second sealing plate 923 at the top and bottom, respectively, so that the end face of the interface claw 900 facing the interior of the optical module forms a relatively closed end face, which to a certain extent prevents dust particles from entering the interface claw 900.

[0128] In some embodiments, the shape of the first sealing plate 913 is adapted to the upper end surface of the optical fiber plug 900b, and the shape of the second sealing plate 923 is adapted to the lower end surface of the optical fiber plug 900b, so that the first sealing plate 913 and the second sealing plate 923 can wrap the optical fiber plug 900b as much as possible to reduce the assembly gap.

[0129] Exemplarily, the first sealing plate 913 is recessed upward to form a recessed portion 9131, and the second sealing plate 923 is recessed downward to form a recessed portion 9231, so as to achieve a tight assembly between the first sealing plate 913 and the upper end of the optical fiber plug 900b and the second sealing plate 923 and the lower end of the optical fiber plug 900b, thereby reducing the assembly gap.

[0130] In some embodiments, a split design is adopted between the cover shell 910 and the first connecting portion 940. Therefore, when the optical fiber plug 900b is assembled in the accommodating cavity 930, the optical fiber plug 900b can be assembled in the accommodating cavity 930 first, and then the cover shell 910 is placed on the surface of the optical fiber plug 900b, so that the end face of the optical fiber plug 900b is wrapped by the first sealing plate 913 and the second sealing plate 923 in the upper and lower directions, forming a relatively closed end face, thereby reducing the dust particles entering the interior of the interface claw 900.

[0131] In some embodiments, a first hook arm 911 and a second hook arm 912 are formed on both sides of the cover 910. The first hook arm 911 and the second hook arm 912 are bent from both sides toward the center of the cover 910 to present a hook state.

[0132] A first recessed portion 928 a and a second recessed portion 928 b are respectively formed on both sides of the bottom of one end of the body 920 facing the optical module.

[0133] The first hook arm 911 is engaged with the first recessed portion 928 a , and the second hook arm 912 is engaged with the second recessed portion 928 b , so as to fix the cover 910 to the body 920 .

[0134] Exemplarily, the tail of the first hook arm 911 is bent toward the first recess 928a so that the tail is hooked on the first recess 928a; the tail of the second hook arm 912 is bent toward the second recess 928b so that the tail is hooked on the second recess 928b, thereby realizing the assembly of the cover shell 910 on the side wall of the main body 920.

[0135] In some embodiments, the first hook arm 911 is in contact with the first protrusion 921a, and the second hook arm 912 is in contact with the second protrusion 921b. The sidewall of the first connecting portion 940, excluding the first protrusion 921a and the second protrusion 921b, is located between the first hook arm 911 and the second hook arm 912. The first hook arm 911 wraps around one sidewall of the first connecting portion 940, and the second hook arm 912 wraps around the other sidewall of the first connecting portion 940.

[0136] Exemplarily, the first hook arm 911 abuts against the side wall of the first protruding portion 921 a , and the second hook arm 912 abuts against the side wall of the second protruding portion 921 b .

[0137] Figure 9 This is a structural diagram of an interface claw provided according to some embodiments of the present disclosure. Figure 10 This is an exploded view of an interface claw provided according to some embodiments of the present disclosure. Figure 9 、 Figure 10 As shown, in some embodiments, the interface claw 900 includes a cover shell 910 and a body 920 that are connected to each other.

[0138] In some embodiments, a through opening 960 is formed at one end of the interface clamp 900. The optical fiber ribbon is led out toward the interior of the optical module through the through opening 960.

[0139] In some embodiments, a receiving cavity 930 is formed between the cover shell 910 and the first connecting portion 940 to receive the optical fiber plug.

[0140] In some embodiments, a notch 914 is formed at the end of the cover 910 to provide an overlapping space for placing the cover 910 on the surface of the body 920.

[0141] In some embodiments, the cover 910 can be pushed toward the surface of the body 920 in the direction from the first connection portion 940 to the second connection portion 950, or the cover 910 can be pushed away from the surface of the body 920 in the opposite direction. For example, a rib 917 is formed on the surface of the cover 910. The rib 917 is protruding to increase friction against the force acting on the cover 910, thereby allowing the cover 910 to be assembled or disassembled with the body 920 more smoothly.

[0142] In some embodiments, a first protrusion 921 a and a second protrusion 921 b are formed on both sides of the body 920 to achieve assembly connection with the lower shell 202 .

[0143] In some embodiments, a first recessed portion 928 a and a second recessed portion 928 b are formed on both sides of the bottom of one end of the body 920 facing the optical module, respectively, to achieve assembly connection with the cover 910 .

[0144] In some embodiments, the end surface of the interface claw 900 facing the interior of the optical module is relatively closed, forming a relatively blocked end surface, thereby reducing dust particles from entering the interior of the interface claw 900 .

[0145] In some embodiments, the optical fiber plug 900b is sealed from above by a first sealing plate 913, and from below by a second sealing plate 923. Due to the arrangement of the first sealing plate 913 and the second sealing plate 923, the interface claw 900 adopts a split, detachable design, which facilitates the assembly and removal of the optical fiber plug 900b while ensuring a relatively closed end surface.

[0146] In some embodiments, the optical fiber plug 900 b is assembled between the side walls of the first connecting portion 940 .

[0147] The upper and lower sealing of the first sealing plate 913 and the second sealing plate 923 forms a relatively closed end face, thereby blocking dust particles diffused from the electrical port to a certain extent and reducing the amount of dust particles that enter the interface claw 900. This relatively closed end face, when the optical fiber plug 900b is assembled within the first connecting portion 940, has an assembly gap between the outer edges of the optical fiber plug 900b and the inner walls of the first connecting portion 940. However, a small amount of dust particles may still enter the interface claw 900 through the assembly gaps on both sides and diffuse to the optical port side, causing contamination of the optical port end face.

[0148] In some embodiments, a first stepped portion 925 and a second stepped portion 926 are respectively formed on the sidewalls on both sides of the first connection portion 940 .

[0149] The first step portion 925 and the second step portion 926 each include a plurality of step surfaces, thereby creating multiple layers of barriers to dust particles entering the interface claw 900 .

[0150] The first step portion 925 and the second step portion 926 on both sides block the movement of dust, increase the resistance to dust movement, and make the dust particles adsorbed on the step surface, thereby further reducing the dust particles diffused to the end face of the optical port.

[0151] In some embodiments, buckles 927 are formed on the side walls on both sides of the second connecting portion 950 to achieve assembly with an optical fiber plug that fixes an external optical fiber.

[0152] Figure 11 : is a cross-sectional structural diagram of an interface claw provided according to some embodiments of the present disclosure, Figure 12 This is a cross-sectional exploded view of an interface claw provided according to some embodiments of the present disclosure. Figure 11 and Figure 12 As shown, in some embodiments, the cover shell 910 is covered on the surface of the body 920.

[0153] In some embodiments, a notch 914 is formed at the end of the cover 910, and a support surface 922 is formed on the surface of the first connecting portion 910. The notch 914 and the support surface 922 provide a force acting surface for the cover 910 to be set on the surface of the body 920, thereby covering the cover 910 on the surface of the body 920.

[0154] In some embodiments, a receiving cavity 930 is formed between the cover 910 and the first connecting portion 940 . The optical fiber plug 900 b is disposed in the receiving cavity 930 .

[0155] In some embodiments, a stopper 920b is provided on one side of the optical fiber plug 900b. The stopper 920b is connected to the end face of the optical fiber plug 900b and is disposed together with the optical fiber plug 900b within the accommodating cavity 930.

[0156] The limiting piece 920b can block the end face of the interface claw 900, thereby preventing dust particles from entering the interface claw 900 and reducing the contamination of the optical port end face by dust particles.

[0157] In some embodiments, an embedding groove 929 is formed on the surface of the lower housing 202. The optical fiber plug 900b and the limiting piece 920b are disposed in the embedding groove 929, thereby limiting the position of the optical fiber plug 900b and the limiting piece 920b.

[0158] Figure 13 This is an exploded view of an optical fiber plug assembly structure provided according to some embodiments of the present disclosure. Figure 13 As shown, in some embodiments, a notch 923b is formed in the middle of the limiting piece 920b to nest the limiting piece 920b on the optical fiber plug 900b and fix the limiting piece 920b on the optical fiber plug 900b.

[0159] In some embodiments, pins 910b are inserted on both sides of the limiting plate 920b. The pins 910b pass through the optical fiber plug 900b until they extend out of the optical fiber plug 900b and emerge. The limiting plates 920b are used to limit and fix the pins 910b.

[0160] One end of the interface claw 900 is embedded with a fiber optic plug 900b, which optically connects to the internal optical fiber ribbon. The other end is embedded with a fiber optic cable plug that secures the optical fiber 101. A pin 910b extends through the fiber optic plug 900b and emerges from the plug. The exposed structure is used to connect to the fiber optic cable plug that secures the optical fiber 101, thereby achieving a coupling connection between the fiber optic cable plug that secures the optical fiber 101 and the fiber optic plug 900b that secures the internal optical fiber.

[0161] In some embodiments, two sides of the optical fiber plug 900b are formed with jacks 930b, and the pins 910b are plugged into and connected to the jacks 930b.

[0162] In some embodiments, a first limiting hole 921b and a second limiting hole 922b are respectively formed on both sides of the notch 923b to limit the insertion hole 930b respectively.

[0163] In some embodiments, buckles 927 are formed on both sides of the second connecting portion 950. The buckles 927 on both sides are arranged opposite to each other and are used to connect to the optical cable plug that fixes the optical fiber 101.

[0164] Figure 14 A diagram of a limiter and pin assembly structure provided according to some embodiments of the present disclosure is shown in FIG. Figure 14 As shown, in some embodiments, the limiting piece 920b is used to limit and fix the pin 910b.

[0165] In some embodiments, a slot 911b is formed at the end of the pin 910b, and the diameter of the slot 911b is smaller than the diameter of the main body of the pin 910b.

[0166] In some embodiments, the first limiting hole 921b is connected to a first connecting hole 924b, the first connecting hole 924b is connected to the first limiting hole 921b, and the diameter of the first connecting hole 924b is larger than the diameter of the first limiting hole 921b. The second limiting hole 922b is connected to a second connecting hole 925b, the second connecting hole 925b is connected to the second limiting hole 922b, and the diameter of the second connecting hole 925b is larger than the diameter of the second limiting hole 922b.

[0167] In some embodiments, the first limiting hole 921b is engaged with the slot 911b, and the second limiting hole 772 is engaged with another slot.

[0168] The diameter of the main part of the pin 910b is larger than the diameter of the first limiting hole 921b, and the diameter of the main part of the pin 910b is smaller than the diameter of the first connecting hole 924b. Then the pin 910b is inserted into the first connecting hole 924b and moves along the slot 911b from the first connecting hole 924b to the first limiting hole 921b, thereby fixing the pin 910b in the first limiting hole 921b.

[0169] The slot 911b can move left and right between the first connecting hole 924b and the first limiting hole 921b to limit the pin 910b on the limiting piece 920b, or can be moved in the opposite direction to remove the pin 910b from the limiting piece 920b.

[0170] In some embodiments, as communication rates increase, the overall power consumption of optical modules increases, and heat dissipation requirements also increase. Currently, heat dissipation can be achieved through air cooling, liquid cooling, and other methods. Liquid cooling methods include immersion and spray cooling, depending on the heat exchange method. Immersion and spray cooling systems achieve heat exchange through direct contact between the cooling medium and the heat sink.

[0171] An immersion liquid cooling system directly immerses the host computer and optical modules in a cooling medium. The cooling medium absorbs heat generated by the heat sink and transfers it to water in a heat exchanger. This heat is then transferred to the heat sink through a water circulation system. For example, the cooling medium is a refrigerant, such as a fluorinated liquid.

[0172] The electrical port side of the optical module is used to insert into the host computer. There is a gap between the upper shell 201 on the electrical port side and the surface of the circuit board 300 to avoid wiring on the surface of the circuit board 300. There is also a gap between the lower shell 202 and the surface of the circuit board 300 to set absorbing material in the gap to prevent the leakage of electromagnetic radiation and facilitate assembly. In addition, there is also an assembly gap at the optical port end. When the optical module is in a liquid cooling environment, the cooling medium will penetrate into the interior of the optical module along the assembly gap at the electrical port end, or the assembly gap at the optical port end, or the assembly gap between the upper shell 201 and the lower shell 202. The cooling medium that penetrates into the interior of the optical module can absorb the heat generated by the internal components and transfer the heat to the upper shell 201, and then transmit the heat to the outside through the upper shell 201.

[0173] Since the cooling medium has a certain refractive index, it will affect the optical path of the light emitting component 400 or the light receiving component 500. Therefore, the light emitting component 400 or the light receiving component 500 needs to be sealed to prevent the cooling medium from entering the light emitting component 400 or the light receiving component 500.

[0174] In some embodiments, when immersing the optical module in a cooling medium, both the upper housing 201 and the lower housing 202 must be immersed in the cooling medium to provide liquid cooling and heat dissipation to the exterior of the optical module. Since the interface claw 900 is located at the end where the upper and lower housings 201 and 202 meet, the interface claw 900 is also immersed in the cooling medium, allowing the cooling medium to enter the interior through the opening of the interface claw 900. Because the cooling medium has a specific refractive index, and the optical interface connecting the internal and external optical signals is located within the interface claw 900, the cooling medium may affect the optical interface connecting the internal and external optical signals, thereby affecting the transmission of the optical signal.

[0175] In some embodiments, the opening of the interface claw 900 may be coated with a sealing medium, such as sealant, to seal the interface claw 900 and prevent the cooling medium from entering the interface claw 900, thereby not affecting the optical docking end faces of the internal and external optical signals.

[0176] Figure 15 Schematic diagram of an optical port connection structure provided according to some embodiments of the present disclosure. Figure 16 FIG. 1 is a partial schematic diagram of an optical port connection according to some embodiments of the present disclosure. Figure 15 and Figure 16 As shown, in some embodiments, a fixing portion 700 is provided at the end where the upper housing 201 and the lower housing 202 are covered and connected. The optical fiber ribbon 400a inside the optical module passes through the fixing portion 700 and extends to the outside of the optical module.

[0177] In some embodiments, the optical fiber ribbon 400a is fixed in the fixing portion 700 to provide a bearing structure for the optical fiber ribbon 400a, thereby avoiding direct force applied to the optical fiber ribbon 400a and preventing the optical fiber ribbon 400a from breaking.

[0178] In some embodiments, the optical fiber ribbon 400 a extends outside the optical module to form a pigtail 800 .

[0179] In some embodiments, one end of the pigtail 800 located outside the optical module is connected to the optical cable plug 900d.

[0180] In some embodiments, the optical cable plug 900d is optically connected to the external optical cable to achieve optical connection between the internal optical signal and the external optical signal, and the optical connection end surface between the internal optical signal and the external optical signal is extended. Exemplarily, the optical connection end surface between the internal optical signal and the external optical signal is extended to the outside of the cooling medium to prevent the cooling medium from affecting the optical connection end surface between the internal optical signal and the external optical signal.

[0181] Figure 17 This is a structural diagram of a connector provided according to some embodiments of the present disclosure. Figure 18 FIG. 1 is a cross-sectional structural diagram of a connector according to some embodiments of the present disclosure. Figure 17 and Figure 18 As shown, in some embodiments, the fixing portion 700 includes a protruding portion 710 , a first limiting portion 720 , a second limiting portion 730 , an abutting portion 740 , a fixing portion 750 and a cavity 760 .

[0182] In some embodiments, the surface of the protrusion 710 is protruding relative to the surfaces of the first limiting portion 720 and the second limiting portion 730. The surface of the protrusion 710 and the surfaces of the first limiting portion 720 and the second limiting portion 730 are arranged in a stepped manner.

[0183] The raised portion 710 includes a surface that protrudes toward the upper housing 201 relative to the surfaces of the first limiting portion 720 and the second limiting portion 730, so as to be position-limitedly connected to the upper housing 201. The raised portion 710 includes a surface that protrudes toward the lower housing 202 relative to the surfaces of the first limiting portion 720 and the second limiting portion 730, so as to be position-limitedly connected to the lower housing 202.

[0184] In some embodiments, the first and second limiting portions 720, 730 are used to limit assembly with the lower housing 202, thereby increasing the secureness of assembly with the lower housing 202. A step is formed between the first and second limiting portions 720, 730 to increase the secureness of assembly with the lower housing 202. For example, along the width of the circuit board 300, the length of the first limiting portion 720 is less than the length of the second limiting portion 730. The first limiting portion 720 is retracted relative to the second limiting portion 730, thereby forming a step between the first and second limiting portions 720, 730.

[0185] In some embodiments, the protrusion 710, the first limiting portion 720, the second limiting portion 730, the abutting portion 740, and the fixing portion 750 are hollow structures, forming a cavity 760. The optical fiber ribbon 400a and the pigtail 800 in the optical module are optically connected in the cavity 760.

[0186] Figure 19 This is a structural diagram of an assembly of a connector and a lower housing according to some embodiments of the present disclosure. Figure 20 for Figure 19 A partial enlarged view of point A in the middle, Figure 21 This is an exploded view of a connector and a lower housing assembly according to some embodiments of the present disclosure. Figure 19-21 As shown, in some embodiments, the fixing portion 700 is limited to the lower housing 202. The fixing portion 700 is located at the end of the lower housing 202. Exemplarily, the fixing portion 700 is located at the optical port end of the lower housing 202.

[0187] In some embodiments, the fixing portion 700 includes a raised portion 710, a first stopper 720, and a second stopper 730. Along the width of the circuit board 300, the raised portion 710, the first stopper 720, and the second stopper 730 are of varying lengths. Consequently, the raised portion 710, the first stopper 720, and the second stopper 730 are sequentially bent and connected, thereby enhancing assembly security with the lower housing 202. For example, the first stopper 720 is further away from the sidewalls of the lower housing 202 than the raised portions 710 and the second stopper 730 on either side, and the first stopper 720 is more recessed relative to the raised portions 710 and the second stopper 730 on either side.

[0188] In some embodiments, a groove portion 2031, a first mating portion 2032, and a second mating portion 2033 are formed on the surface of the bottom plate 2021 of the lower housing 202. The surface of the groove portion 2031 is recessed relative to the first mating portion 2032 and the second mating portion 2033. The first mating portion 2032 connects the groove portion 2031 and the second mating portion 2033.

[0189] In some embodiments, the groove portion 2031 is matched and assembled with the protrusion portion 710, the first matching portion 2032 is matched and assembled with the first limiting portion 720, and the second matching portion 2033 is matched and assembled with the second limiting portion 730, thereby limiting the fixing portion 700 on the lower shell 202 and realizing the assembly connection between the fixing portion 700 and the lower shell 202.

[0190] In some embodiments, the protrusion 710 includes a surface protruding toward the lower housing 202 to be assembled with the lower housing 202. The groove portion 2031 is sunken relative to the first matching portion 2032 and the second matching portion 2033 to be mated with the protrusion 710.

[0191] In some embodiments, the first limiting portion 720 is farther away from the side wall of the lower shell 202 relative to the protrusions 710 and the second limiting portion 730 on both sides, and the two ends of the first matching portion 2032 are closer to the center of the lower shell 202 relative to the groove portion 2031 and the second matching portion 2033 to cooperate with the first limiting portion 720 for connection.

[0192] In some embodiments, the surface of the protrusion 710 and the surfaces of the first limiting portion 720 and the second limiting portion 730 are arranged in a stepped manner, and the surfaces of the groove portion 2031 and the first matching portion 2032 and the second matching portion 2033 are also arranged in a stepped manner.

[0193] Figure 22 This is a structural diagram of an assembly of a connector, an upper shell, and a lower shell according to some embodiments of the present disclosure. Figure 23 This is an exploded view of an assembly of a connector, an upper shell, and a lower shell provided according to some embodiments of the present disclosure. Figure 24 for Figure 23 A partial enlarged view of point B in the figure. Figure 22-24 As shown, in some embodiments, the upper housing 201 and the lower housing 202 are connected to form an enclosure, and the fixing portion 700 is located in the enclosure formed by the upper housing 201 and the lower housing 202. The fixing portion 700 is located at the end where the upper housing 201 and the lower housing 202 are connected to each other. The fixing portion 700 is located at the optical port end of the optical module.

[0194] In some embodiments, the protrusion 710 of the fixing portion 700 includes a surface that protrudes toward the upper housing 201. Thus, the upper surface of the protrusion 710 is arranged in a stepped manner with the upper surfaces of the first and second position-limiting portions 720 and 730. Accordingly, a matching portion 2012 is formed on the surface of the upper housing 201 to limit the upper surfaces of the protrusion 710, the first and second position-limiting portions 720, and 730.

[0195] In some embodiments, the protrusion 710 of the fixing portion 700 includes a surface that protrudes toward the lower housing 202. The lower surface of the protrusion 710 is arranged in a stepped manner with the lower surfaces of the first and second limiting portions 720 and 730. Correspondingly, the lower surface of the groove 2031 is arranged in a stepped manner with the lower surfaces of the first and second matching portions 2032 and 2033.

[0196] In some embodiments, the downwardly protruding end of the protrusion 710 is not at the same height as the first limiting portion 720, thereby forming a groove 770 therebetween. The surfaces of the first and second mating portions 2032, 2033 are higher than the surface of the groove 2031. The first mating portion 2032 is configured as a curved surface that curves toward the upper housing 201 to avoid interference with the groove 770.

[0197] In some embodiments, the protrusion 710, the first stopper 720, and the second stopper 730 have different lengths along the width of the circuit board 300. Accordingly, the groove 2031, the first mating portion 2032, and the second mating portion 2033 also have different lengths to mate with the protrusion 710, the first stopper 720, and the second stopper 730, respectively.

[0198] In some embodiments, the fixing portion 700 includes upper and lower protruding portions 710 perpendicular to the surface of the circuit board 300 to enhance assembly security with the upper and lower housings 201 and 202. In a direction parallel to the surface of the circuit board 300, the fixing portion 700 includes a first stopper 720 and a second stopper 730 that are connected by a left-right bend to enhance assembly security with the lower housing 202, allowing the lower housing 202 to be more securely assembled thereto.

[0199] Figure 25 FIG1 is a structural diagram of an extended optical cable provided according to some embodiments of the present disclosure. Figure 25 As shown, in some embodiments, the pigtail 800 includes an optical cable body 810, a first protective cover 820, a second protective cover 830, and an isolator 840. The optical cable body 810 passes through the first protective cover 820, the second protective cover 830, and the isolator 840.

[0200] In some embodiments, the first protective cover 820 is located at one end of the optical cable body 810 . The first protective cover 820 is used to connect to the fixing portion 700 , increase the stability of the pigtail 800 , and protect the pigtail 800 from being broken.

[0201] In some embodiments, the second protective cover 830 is located at the other end of the optical cable body 810 . The second protective cover 830 is used to connect to the optical cable plug 900 d and protect the pigtail 800 from being broken.

[0202] In some embodiments, the isolator 840 is sleeved on the outer wall of the optical cable body 810. The isolator 840 includes a sleeve 841, a first sleeve 842 sleeved on one end of the sleeve 841, and a second sleeve 843 sleeved on the other end of the sleeve 841.

[0203] When the optical module is immersed in the cooling medium, the cooling medium may penetrate the interior of the optical cable through cavity 760 and along the optical cable body 810. Due to capillary absorption, the cooling medium may flow along the optical cable body 810 to the other end of the pigtail 800, causing the cooling medium to contaminate the optical end face at the other end of the pigtail 800. Isolation member 840 ensures that even if the cooling medium enters the interior of the pigtail 800 through cavity 760, it cannot flow along the optical cable body 810 to the other end of the pigtail 800.

[0204] Figure 26 FIG. 1 is a cross-sectional structural diagram of an isolation member provided according to some embodiments of the present disclosure. Figure 26 As shown, in some embodiments, the optical cable body 810 passes through the first sleeve 842 , the casing 841 , and the second sleeve 843 .

[0205] In some embodiments, the sheath of the optical cable body 810 within the spacer 840 is broken, maintaining the integrity of the optical fiber. When the cooling medium that enters the pigtail 800 through the cavity 760 flows to the broken surface of the sheath, it stops flowing, thereby preventing the cooling medium from flowing to the other end of the pigtail 800.

[0206] Figure 27 This is a cross-sectional view of a connector and an extension optical cable assembly according to some embodiments of the present disclosure. Figure 27 As shown, in some embodiments, the fixing portion 700 includes an abutting portion 740 , a fixing portion 750 , and a cavity 760 . The pigtail 800 includes an optical cable body 810 and a first protective cover 820 .

[0207] In some embodiments, the optical fiber ribbon 400 a extends into the cavity 760 and passes through the cable body 810 .

[0208] In some embodiments, the first protective cover 820 is sleeved around the outer periphery of the optical cable body 810. The first protective cover 820 is open at one end to be nested on the outer periphery of the fixing portion 750. The first protective cover 820 is butt-jointed with the abutting portion 740, thereby connecting the first protective cover 820 to the fixing portion 700 and further connecting the pigtail 800 to the fixing portion 700.

[0209] Figure 28 This is a cross-sectional view of an extension optical cable and an optical cable plug assembly according to some embodiments of the present disclosure. Figure 28As shown, in some embodiments, the optical cable plug 900d includes a positioning portion 910d and a connecting end 920d. The second protective cover 830 of the pigtail 800 is formed with a matching portion 831 at one end thereof facing the optical cable plug 900d.

[0210] In some embodiments, the positioning portion 910d is connected to the matching portion 831, thereby achieving the connection between the optical cable plug 900d and the pigtail 800. Exemplarily, the positioning portion 910d is configured as a positioning post, and the matching portion 831 is configured as a positioning hole, and the two are nested and connected.

[0211] In some embodiments, the connection end 920d is used to connect to an external optical cable. For example, the connection end 920d and the external optical cable can be respectively inserted into an interface claw, and the connection end 920d and the external optical cable are connected inside the interface claw, thereby optically connecting the internal optical signal of the optical module with the external optical signal.

[0212] Figure 29 This is a schematic diagram of assembling a circuit board and a light emitting component according to some embodiments of the present disclosure. Figure 30 This is a cross-sectional view of a circuit board and a light emitting component assembly according to some embodiments of the present disclosure. Figure 29 and Figure 30 As shown, in some embodiments, the light emitting component 400 includes a base 410. The base 410 carries various light emitting devices on its surface.

[0213] In some embodiments, the base 410 has good heat dissipation properties, so the heat generated by the light emitting device is transferred through the base 410 to avoid heat concentration in the light emitting component 400.

[0214] In some embodiments, a through hole 302 is formed on the surface of the circuit board 300. The through hole 302 is a through hole. The base 410 is embedded in the through hole 302 to reduce the height difference between the laser array supported on the surface of the base 410 and the surface of the circuit board 300. This reduces the bonding length between the laser array and the surface of the circuit board 300, ensuring excellent high-frequency signal transmission performance.

[0215] In some embodiments, the base 410 is embedded in the through hole 302 , and the surface of the base 410 supports the circuit board 300 to achieve assembly between the base 410 and the circuit board 300 .

[0216] In some embodiments, the light-emitting component 400 includes a first cover 420. The first cover 420 has an opening that opens toward the surface of the base 410. The first cover 420 is disposed on the surface of the base 410 to cover and protect the light-emitting devices on the surface of the base 410. Furthermore, the first cover 420 has a first opening 421 that opens toward the optical port to allow the optical fiber ribbon of the light-emitting component 400 to pass through and establish an optical connection with the outside world.

[0217] In some embodiments, the first cover 420 is connected to the base 410. For example, the first cover 420 is buckled onto the surface of the base 410, and a cavity is formed between the first cover 420 and the base 410 to accommodate each light emitting device.

[0218] In some embodiments, the first cover 420 is buckled onto the surface of the circuit board 300 , and the circuit board 300 is located between the first cover 420 and the base 410 . At this time, the base 410 supports the circuit board 300 , and the circuit board 300 supports the first cover 420 .

[0219] Figure 31 This is a structural diagram of a light emitting component provided according to some embodiments of the present disclosure. Figure 32 FIG1 is a cross-sectional structural diagram of a light emitting component provided according to some embodiments of the present disclosure. Figure 33 This is a partial exploded view of a light emitting component provided according to some embodiments of the present disclosure. Figures 31-33 As shown, in some embodiments, the surface of the base 410 is covered with a first cover plate 420. Exemplarily, the first cover plate 420 is buckled onto the surface of the circuit board 300, and the circuit board 300 is located between the first cover plate 420 and the base 410.

[0220] In some embodiments, the base 410 carries a laser array 450 , a lens array 460 , a first optical fiber array 470 , and a second optical fiber array 480 . The surfaces of the laser array 450 , the lens array 460 , the first optical fiber array 470 , and the second optical fiber array 480 are covered by a first cover plate 420 .

[0221] Laser array 450 includes multiple lasers arranged in an array. Lens array 460 is located in the light path of laser array 450. Lens array 460 includes multiple collimating lenses, each located in the direction of light emission from the corresponding laser. These collimating lenses convert the signal light generated by the lasers into collimated light. A first optical fiber array 470 and a second optical fiber array 480 are respectively located in the light path of lens array 460 to transmit the collimated light signals.

[0222] The first optical fiber array 470 includes a first optical fiber ribbon 471, and the second optical fiber array 480 includes a second optical fiber ribbon 481. The first optical fiber ribbon 471 includes a plurality of optical fibers, and the second optical fiber ribbon 481 includes a plurality of optical fibers.

[0223] In some embodiments, a TEC 440 is provided on the surface of the base 410. A laser array 450 and a lens array 460 are disposed on the surface of the TEC 440. The TEC 440 includes a hot surface and a cold surface, which regulate the temperature of the laser array 450, keeping the temperature of each laser within a certain range to ensure laser performance.

[0224] In some embodiments, the base 410 includes a supporting surface 411 to support the circuit board 300. Exemplarily, the supporting surface 411 is formed on a surface of the base 410.

[0225] In some embodiments, the base 410 includes a groove 412. The TEC 440 is disposed in the groove 412. Exemplarily, the groove 412 is formed on a surface of the base 410.

[0226] The groove 412 is recessed relative to the supporting surface 411 so that the TEC 440 is sunken, thereby reducing the height difference between the laser array 450 on the surface of the TEC 440 and the surface of the circuit board 300, shortening the bonding length between the laser and the surface of the circuit board 300, and ensuring excellent high-frequency signal transmission performance.

[0227] In some embodiments, the base 410 includes a carrier 413. For example, the carrier 413 is formed on the surface of the base 410. The surface of the carrier 413 is provided with a first optical fiber array 470 and a second optical fiber array 480. The surface of the carrier 413 is higher than the supporting surface 411 to accommodate the optical axis height between the first optical fiber array 470, the second optical fiber array 480, and the lens array 460.

[0228] In some embodiments, the platform 413 has sidewalls 414 on both sides. The sidewalls 414 can limit the first optical fiber array 470 and the second optical fiber array 480, while also providing a support surface for the circuit board 300. For example, the through holes 302 are nested in the outer walls of the sidewalls 414, and the circuit board 300 is supported and connected to the outer walls of the sidewalls 414.

[0229] The optical module is in contact with the cooling medium, and the cooling medium may enter the optical module along the electrical port or the optical port, causing the cooling medium to enter the optical emitting component 400 or the optical receiving component 500, affecting the optical emitting optical path or the optical receiving optical path.

[0230] In the present disclosure, the optical module is packaged and designed to make the optical path sufficiently airtight, thereby isolating the optical path from the cooling medium to meet the requirements of liquid cooling environment applications.

[0231] In some embodiments, the first cover plate 420 is connected to the base 410. The first cover plate 420 has a first opening 421 at one end facing the optical port to allow the first optical fiber ribbon 471 and the second optical fiber ribbon 481 to pass through the first opening 421. An open cavity 490 is formed between the surface of the carrier 413 through which the first optical fiber ribbon 471 and the second optical fiber ribbon 481 pass and the first opening 421. The first optical fiber ribbon 471 and the second optical fiber ribbon 481 pass through the open cavity 490. When the optical module is immersed in the cooling medium, the cooling medium may enter the interior of the light emitting component 400 through the open cavity 490, thereby affecting its optical path.

[0232] Figure 34 Schematic diagram of a barrier structure according to some embodiments of the present disclosure. Figure 34 As shown, in some embodiments, at the optical port, a barrier 416 is provided between the first cover plate 420 and the base 410 . The barrier 416 is provided along the first opening 421 .

[0233] In some embodiments, the barrier 416 includes a plurality of spaced-apart baffles 4161. Gaps are defined between adjacent baffles 4161 to allow the first optical fiber ribbon 471 and the second optical fiber ribbon 481 to pass through the gaps.

[0234] In some embodiments, the gaps between adjacent baffles 4161 are filled with a sealing medium. This sealing medium allows the first and second optical fiber ribbons 471, 481 to pass through while also sealing the gaps between adjacent baffles. For example, the sealing medium wraps around the first optical fiber ribbon 471 and fills the gaps above and below the first optical fiber ribbon 471.

[0235] In some embodiments, the space between the baffle 4161 and the sidewall 414 is also filled with a sealing medium to seal the space between the sidewall and the baffle, thereby blocking the first opening 421 and preventing the cooling medium from entering the cavity formed by the first cover plate 420 and the base 410 through the first opening 421, thereby protecting the optical transmission path of the light emitting component 400. The barrier 416 filled with the sealing medium in the gap is equivalent to a wall standing upright in the first opening 421, thereby blocking the first opening 421 and allowing the first optical fiber ribbon 471 and the second optical fiber ribbon 481 to pass through, preventing the cooling medium from affecting the optical transmission path of the light emitting component 400.

[0236] In some embodiments, the thickness of the baffles 4161 is limited, and the thickness of the sealing medium filled in the gaps between adjacent baffles 4161 is limited. As a result, the cooling medium may penetrate the sealing medium in the gaps and enter the cavity formed by the first cover plate 420 and the base 410. In addition, the uncured sealing medium has a certain degree of fluidity. When the thickness of the baffles 4161 is limited, the uncured sealing medium may flow into the cavity formed by the first cover plate 420 and the base 410, thereby contaminating the optical transmission path of the light emitting component 400.

[0237] Figure 35 A cross section of a light emitting component provided according to some embodiments of the present disclosure Figure 1 , Figure 36 A cross section of a light emitting component provided according to some embodiments of the present disclosure Figure 2 .like Figure 35 and Figure 36 As shown, in some embodiments, along the length direction of the circuit board 300, one end of the first cover plate 420 is bent downward to connect to the surface of the circuit board 300, and the other end is open to allow the first optical fiber ribbon 471 and the second optical fiber ribbon 481 to pass through.

[0238] In some embodiments, a first sealing portion 1100 is provided at the first opening 421. The first sealing portion 1100 blocks the first opening 421 while ensuring the passage of the first optical fiber ribbon 471 and the second optical fiber ribbon 481. Exemplarily, the first optical fiber ribbon 471 and the second optical fiber ribbon 481 pass through the first sealing portion 1100.

[0239] The first opening 421 is sealed by the first sealing portion 1100 to prevent the cooling medium from entering the cavity formed by the first cover plate 420 and the base through the first opening 421 .

[0240] In some embodiments, the first sealing portion 1100 has a certain thickness, part of which is located inside the first opening 421 and part of which is located outside the first opening 421 to prevent the cooling medium from penetrating the first sealing portion 1100 and entering the cavity formed by the first cover plate 420 and the base 410.

[0241] In some embodiments, the uncured first sealing portion 1100 is fluid and may flow into the cavity formed by the first cover plate 420 and the base 410 , thereby contaminating the light path inside the cavity.

[0242] In some embodiments, a barrier 416 is provided on one side of the first sealing portion 1100 facing the cavity formed by the first cover plate 420 and the base 410. The barrier 416 is provided along the first opening 421. The barrier 416 has a limiting effect on the first sealing portion 1100.

[0243] In some embodiments, the barrier 416 includes a plurality of spaced-apart baffles 4161. The first sealing portion 1100 is located on a side of the baffle 4161 facing the light port.

[0244] In some embodiments, gaps are defined between adjacent baffles 4161, and optical fibers in the first and second optical fiber ribbons 471, 481 pass through the gaps between adjacent baffles 4161. The uncured first sealing portion 1100 has a certain viscosity and is confined within the gaps between adjacent baffles 4161, thereby limiting its fluidity and preventing it from flowing into the cavity formed by the first cover plate 420 and the base 410.

[0245] In some embodiments, the cooling medium needs to penetrate the thickness of the first sealing portion 1100 located on the outside of the baffle 4161 and the thickness of the first sealing portion 1100 restricted in the gap between adjacent baffles 4161, which undoubtedly increases the difficulty of penetration, thereby better isolating the cooling medium outside the cavity formed by the first cover plate 420 and the base 410.

[0246] In some embodiments, although the uncured first sealing portion 1100 is fluid, since the first sealing portion 1100 is located outside the baffle 4161, the flow distance of the first sealing portion 1100 is increased and the flow capacity of the first sealing portion 1100 is reduced, so that the first sealing portion 1100 can be restricted in the gap between adjacent baffles 4161 and will not continue to flow toward the inside of the cavity, thereby avoiding the first sealing portion 1100 from contaminating the light emitting component 400.

[0247] In some embodiments, the first optical fiber ribbon 471 includes multiple optical fibers, and the second optical fiber ribbon 481 includes multiple optical fibers. Because optical fibers are soft, they may be close together, resulting in smaller gaps between them. With smaller gaps, when sealant is applied to the gaps between the optical fibers to seal them, the sealant will flow along the fiber surfaces due to capillary absorption, rather than remaining in the gaps, thereby reducing the sealing effectiveness of the gaps between the optical fibers.

[0248] In some embodiments, the optical fibers are separated by baffles 4161 to prevent the optical fibers from being close together, so that there are larger gaps between the optical fibers, thereby ensuring the sealing effect of the gaps between the optical fibers.

[0249] In some embodiments, barrier 416 is located within open cavity 490. Barrier 416 is located on the surface of carrier 413. Barrier 416 has a certain height, and its surface is higher than the surface of carrier 413, so as to increase the barrier effect of barrier 416 on the sealing medium.

[0250] In some embodiments, the side walls 414 and the barrier fence 416 form a cavity, and the cavity is filled with a first sealing portion 1100 to seal the cavity formed by the first opening 421 and the base 410, isolating the cooling medium from the outside and preventing the cooling medium from entering the cavity formed by the first cover plate 420 and the base 410 along the open cavity 490.

[0251] In some embodiments, the first sealing portion 1100 may be a sealant. The sealant exhibits fluidity and a certain viscosity at low temperatures and solidifies at high temperatures to form a solid seal. The sidewalls 414 and the barrier ribs 416 act as position limiters for the fluid sealant, thereby limiting its flow range.

[0252] In some embodiments, the first sealing portion 1100 is confined within a cavity defined by the sidewalls 414 and the barrier ribs 416. The opposite ends of the barrier ribs 416 may form similar barrier portions to further restrict the first sealing portion 1100.

[0253] In some embodiments, a recessed portion 415 is formed within the cavity enclosed by the sidewalls 414 and the barrier 416. The recessed portion 415 is located on the side of the barrier 416 facing the optical port. The recessed portion 415 is recessed relative to the surface of the carrier 413. This recessed portion accommodates the first sealing portion 1100, limiting the flow space within the first sealing portion 1100 and enhancing its positional retention.

[0254] In some embodiments, the first sealing portion 1100 is connected to the barrier 416 and is restrained by the barrier 416. While restraining the first sealing portion 1100, the barrier 416 prevents the first sealing portion 1100 from flowing from the side of the barrier 416 facing the optical port to the side of the barrier 416 facing the electrical port, thereby protecting the optical path and optical components below the first cover plate 420.

[0255] Figure 37 A cross section of a light emitting component provided according to some embodiments of the present disclosure Figure 3 , Figure 38 A cross section of a light emitting component provided according to some embodiments of the present disclosure Figure 4 .like Figure 37 and Figure 38 As shown, in some embodiments, each optical fiber in the first optical fiber ribbon 471 and the second optical fiber ribbon 481 passes through the first sealing portion 1100 and extends to establish an optical connection with the outside.

[0256] In some embodiments, the barrier 416 acts as a fence, blocking the first sealing portion 1100 and preventing the first sealing portion 1100 from passing through the barrier 416 and flowing into the cavity formed by the first cover plate 420 and the base 410, thereby protecting the optical path and optical components of the light emitting component 400. Exemplarily, the barrier 416 is relatively high to enhance the limiting and blocking effect on the first sealing portion 1100.

[0257] Figure 39 The second cover assembly section provided according to some embodiments of the present disclosure Figure 1 , Figure 40 The second cover assembly section provided according to some embodiments of the present disclosure Figure 2 .like Figure 39 and Figure 40 As shown, in some embodiments, a TEC 440 is provided on the surface of the base 410 , and a laser array 450 and a lens array 460 are provided on the surface of the TEC 440 .

[0258] In some embodiments, when the optical module is in a liquid cooling environment, the cooling medium enters the interior of the optical module along the assembly gap, electrical port, or optical port between the upper shell 201 and the lower shell 202. If the selected cooling medium is incompatible with the internal materials of the optical module, it may cause corrosion, resulting in failure or damage to the optical device. In the optical emitting component 400, the laser array 450 is one of the key components. Therefore, a second cover plate 430 is projected on the surface of the laser array 450 and the lens array 460. The second cover plate 430 covers the laser array 450 and the lens array 460 to provide multiple protections for the laser array 450 and the lens array 460.

[0259] In some embodiments, the second cover plate 430 is located between the first cover plate 420 and the circuit board 300. The surface of the second cover plate 430 is covered by the first cover plate 420. One end of the second cover plate 430 overlaps the side wall 414, and the other end is located on the surface of the circuit board 300.

[0260] In some embodiments, a lap portion 4141 is formed at the end of the side wall 414. One end of the second cover 430 is lapped on the lap portion 4141, and the other end is bent downward to connect to the surface of the circuit board 300, thereby achieving a fixed connection of the second cover 430.

[0261] Figure 41 This is a cross-sectional view of the assembly of the first cover plate and the circuit board according to some embodiments of the present disclosure. Figure 42 This is a cross-sectional view of a base and circuit board assembly according to some embodiments of the present disclosure. Figure 41 and Figure 42 As shown, in some embodiments, the base 410 supports the circuit board 300 , and the circuit board 300 supports the first cover 420 .

[0262] In some embodiments, there is an assembly gap between the first cover plate 420 and the circuit board 300. When the optical module is in a liquid cooling environment, the cooling medium may enter the light emitting component 400 along the assembly gap, thereby affecting the light emission path.

[0263] In some embodiments, there is also an assembly gap between the base 410 and the circuit board 300. When the optical module is in a liquid cooling environment, the cooling medium may enter the light emitting component 400 along the assembly gap, thereby affecting the light emission path.

[0264] Figure 43 This is a schematic diagram of assembling a second sealing portion according to some embodiments of the present disclosure. Figure 44 This is an exploded view of the second sealing portion provided according to some embodiments of the present disclosure. Figure 43 and Figure 44 As shown, in some embodiments, a second sealing portion 1200 is provided on the outer periphery of the first cover plate 420 to seal the assembly gap between the first cover plate 420 and the circuit board 300 .

[0265] In some embodiments, a second sealing portion 1200 is provided on the outer periphery of both side walls of the first cover plate 420 along the width direction of the circuit board 300 and on the outer periphery of the side wall of the first cover plate 420 facing the electrical port. The second sealing portion 1200 can block the assembly gap between the first cover plate 420 and the circuit board, thereby improving the airtightness between the first cover plate 420 and the circuit board and preventing the cooling medium from entering the interior of the light emitting component 400 through the assembly gap between the first cover plate 420 and the circuit board, thereby protecting the light emission optical path.

[0266] In some embodiments, the second sealing portion 1200 is configured to be U-shaped and wrap around the outer periphery of the first cover plate 420 .

[0267] Figure 45 FIG. 1 is a schematic diagram of assembling a third sealing portion according to some embodiments of the present disclosure. Figure 45 As shown, in some embodiments, a third sealing portion 1300 is provided around the assembly gap between the base 410 and the circuit board 300 to seal the assembly gap between the base 410 and the circuit board 300 .

[0268] In some embodiments, the third sealing portion 1300 is arranged around the outer periphery of the second cover plate 430 and the two side walls 414 to seal the assembly gap between the base 410 and the circuit board 300, increase the airtightness between the base 410 and the circuit board 300, and prevent the cooling medium from entering the interior of the light emitting component 400 along the assembly gap between the base 410 and the circuit board 300, thereby protecting the light emitting optical path.

[0269] In some embodiments, the third sealing portion 1300 is configured to be U-shaped and wrap around the outer periphery of the base 410 .

[0270] Figure 46 FIG1 is a schematic diagram of an assembly of a first cover plate and a base according to some embodiments of the present disclosure. Figure 46 As shown, in some embodiments, the first cover plate 420 is connected to the base 410 in a covering manner.

[0271] In some embodiments, the first cover plate 420 is buckled onto the surface of the base 410. The first cover plate 420 and the base 410 are connected to form an enclosed cavity, in which the TEC 440, the laser array 450, the lens array 460, etc. can be placed. For example, the first cover plate 420 is buckled onto the surface of the supporting surface 411. The supporting surface 411 supports not only the first cover plate 420 but also the circuit board 300.

[0272] In some embodiments, the first cover plate 420 is covered and connected to the base 410, which can increase the airtightness of the assembly of the first cover plate 420 and the base 410. The TEC440, the laser array 450, the lens array 460, etc. are assembled in the package cavity formed between the first cover plate 420 and the base 410, which provides better sealing protection for the TEC440, the laser array 450, and the lens array 460 to adapt to the liquid cooling environment.

[0273] In some embodiments, the enclosure formed by the first cover plate 420 and the base 410 has an opening facing the optical port to allow passage of the first optical fiber ribbon 471 and the second optical fiber ribbon 481. For example, a sealing medium may be filled in the opening to seal the opening, further enhancing the airtightness of the assembly between the first cover plate 420 and the base 410.

[0274] In some embodiments, a gap is left between the edge of the circuit board 300 and the side wall 414 of the base 410 to allow the first cover plate 420 to be embedded, thereby achieving a covering connection between the first cover plate 420 and the base 410. For example, an assembly gap exists between the first cover plate 420 and the circuit board 300. A sealing medium can be applied along the surface of the circuit board 300 and the outer periphery of the first cover plate 420 to seal the assembly gap between the first cover plate 420 and the circuit board 300, thereby increasing the airtightness of the assembly and preventing the cooling medium from entering the package cavity along the assembly gap during liquid cooling, thereby enabling the light emitting component 400 to better adapt to the liquid cooling environment.

[0275] Figure 47 FIG. 1 is a bottom structure diagram of a base provided according to some embodiments of the present disclosure. Figure 47 As shown, in some embodiments, the bottom of the base 410 is located on the lower surface of the circuit board 300 .

[0276] In some embodiments, a fourth sealing portion 1400 is provided at the bottom of the base 410, the fourth sealing portion 1400 surrounds the side of the bottom of the base 410, and the fourth sealing portion 14000 connects the base 410 and the lower surface of the circuit board 300 to seal the gap between the bottom of the base 410 and the lower surface of the circuit board 300, thereby preventing the cooling medium from entering the optical path on the base 410 along the gap during liquid cooling.

[0277] Figure 48 Schematic diagram of an assembly of a light receiving component and a circuit board according to some embodiments of the present disclosure. Figure 48 As shown, in some embodiments, the light receiving component 500 is located on the lower surface of the circuit board 300. The light receiving component 500 includes a first light receiving component 510 and a second light receiving component 520. The first light receiving component 510 and the second light receiving component 520 can be located on the lower surface of the circuit board 300 respectively.

[0278] In some embodiments, the first light receiving component 510 includes a third cover plate 511, and the second light receiving component 520 includes a fourth cover plate 521. The third cover plate 511 is connected to the surface of the circuit board 300 to form a cavity, and the fourth cover plate 521 is connected to the surface of the circuit board 300 to form a cavity. The third cover plate 511 covers the surface of each light receiving device of the first light receiving component 510, and the fourth cover plate 521 covers the surface of each light receiving device of the second light receiving component 520.

[0279] In some embodiments, the first light receiving component 510 includes a third optical fiber ribbon 513, and the second light receiving component 520 includes a fourth optical fiber ribbon 523. The third optical fiber ribbon 513 transmits an external optical signal inwardly into the cavity formed by the third cover plate 511 and the circuit board 300. Correspondingly, the fourth optical fiber ribbon 523 transmits an external optical signal inwardly into the cavity formed by the fourth cover plate 521 and the circuit board 300.

[0280] In some embodiments, the end of the third cover plate 511 facing the optical port is semi-enclosed and has a second opening 5111 formed therein. This allows the optical receiver to be covered as much as possible while also allowing the third optical fiber ribbon 513 to be guided out of the cavity formed by the third cover plate 511 and the circuit board 300 and extending toward the optical port. The end of the fourth cover plate 521 facing the optical port is semi-enclosed and has a third opening 5211 formed therein. This allows the optical receiver to be covered as much as possible while also allowing the fourth optical fiber ribbon 523 to be guided out of the cavity formed by the fourth cover plate 521 and the circuit board 300 and extending toward the optical port.

[0281] In some embodiments, one end of the base 410 protrudes relative to one surface of the circuit board 300, and the other end of the base 410 protrudes relative to another surface of the circuit board 300. For example, the top end of the base 410 protrudes relative to the upper surface of the circuit board 300, and the bottom end protrudes relative to the lower surface of the circuit board 300.

[0282] In some embodiments, the base 410 is located at the center of the width of the circuit board 300. To prevent the third and fourth optical fiber ribbons 513, 523 from being covered by the lower housing 202 as they pass along the surface of the base 410, the third and fourth optical fiber ribbons 513, 523 pass along either side of the base 410. The third optical fiber ribbon 513 passes along one side of the base 410 and across the surface of the circuit board 300, while the fourth optical fiber ribbon 523 passes along the other side of the base 410 and across the surface of the circuit board 300. In this configuration, the third and fourth optical fiber ribbons 513, 523 are located on the surface of the circuit board 300, lower than the bottom surface of the base 410, thereby preventing them from being covered by the lower housing 202 when assembled with the base 410.

[0283] In some embodiments, due to the limited width of the surface of the circuit board 300, in order to ensure that the third optical fiber ribbon 513 and the fourth optical fiber ribbon 523 pass along both sides of the base 410 respectively, the first light receiving component 510 is arranged near one edge of the circuit board 300, and the second light receiving component 520 is arranged near the other edge of the circuit board 300.

[0284] In some embodiments, to facilitate the collection of the third and fourth optical fiber ribbons 513, 523, a first notch 417 and a second notch 418 are formed on either side of the base 410. The third optical fiber ribbon 513 is guided through the second opening 5111, extending along one sidewall of the base 410 onto the surface of the circuit board 300, and then collected within the first notch 417. The fourth optical fiber ribbon 523 is guided through the third opening 5211, extending along the other sidewall of the base 410 onto the surface of the circuit board 300, and then collected within the second notch 418.

[0285] Figure 49 FIG1 is a cross-sectional view of an assembly of a light receiving component and a circuit board 300 according to some embodiments of the present disclosure. Figure 50 The assembly and decomposition of a light receiving component and a circuit board 300 according to some embodiments of the present disclosure is shown in FIG. Figure 1 , Figure 51 The assembly and decomposition of a light receiving component and a circuit board 300 according to some embodiments of the present disclosure is shown in FIG. Figure 2 .like Figures 49-51 As shown, in some embodiments, the first light receiving component 510 is disposed near one edge of the circuit board 300 , and the second light receiving component 520 is disposed near another edge of the circuit board 300 .

[0286] In some embodiments, the first light receiving component 510 includes a third cover plate 511, a first optical fiber ribbon fixing portion 512, a third optical fiber ribbon 513, a first light receiving chip 514, and a first transimpedance amplifier chip 515. The first optical fiber ribbon fixing portion 512, the third optical fiber ribbon 513, the first light receiving chip 514, and the first transimpedance amplifier chip 515 are respectively located on the surface of the circuit board 300 and are covered by the third cover plate 511.

[0287] The third cover plate 511 is connected to the circuit board 300 to form a wrapping cavity to wrap the first optical fiber ribbon fixing portion 512, the third optical fiber ribbon 513, the first optical receiving chip 514, and the first transimpedance amplifier chip 515, thereby protecting these optical components.

[0288] In some embodiments, the second light receiving component 520 includes a fourth cover plate 521, a second optical fiber ribbon fixing portion 522, a fourth optical fiber ribbon 523, a second light receiving chip 524, and a second transimpedance amplifier chip 525. The second optical fiber ribbon fixing portion 522, the fourth optical fiber ribbon 523, the second light receiving chip 524, and the second transimpedance amplifier chip 525 are respectively located on the surface of the circuit board 300 and are covered by the fourth cover plate 521.

[0289] The fourth cover plate 521 is connected to the circuit board 300 to form a wrapping cavity to wrap the second optical fiber ribbon fixing portion 522, the fourth optical fiber ribbon 523, the second light receiving chip 524, and the second transimpedance amplifier chip 525, thereby protecting these optical components.

[0290] In some embodiments, the third cover plate 511 has a second opening 5111 at one end facing the optical port to allow passage of the third optical fiber ribbon 513, allowing the third optical fiber ribbon 513 to exit from the cavity formed by the third cover plate 511 and the circuit board 300 and extend toward the optical port. The fourth cover plate 521 has a third opening 5211 at one end facing the optical port to allow passage of the fourth optical fiber ribbon 523, allowing the fourth optical fiber ribbon 523 to exit from the cavity formed by the fourth cover plate 521 and the circuit board 300 and extend toward the optical port.

[0291] In some embodiments, when the optical module is in a liquid cooling environment, the cooling medium will enter the third cover plate 511 and the fourth cover plate 521 along the second opening 5111 and the third opening 5211 respectively, thereby affecting the optical path transmission of the first light receiving component 510 and the second light receiving component 520.

[0292] In some embodiments, an assembly gap is provided between the upper housing 201 and the lower housing 202 to facilitate assembly of the two. When the optical module is in a liquid-cooled environment, the cooling medium will enter the interior of the optical module along this assembly gap. When the optical module is in a liquid-cooled environment, the cooling medium will enter the interior of the optical module along this assembly gap.

[0293] In some embodiments, a gap b exists between the edge of the circuit board 300 and the inner wall of the lower housing 202. This facilitates assembly between the circuit board 300 and the lower housing 202 while also providing a safe distance for the circuit board 300 to prevent breakdown. Exemplarily, the gap b is 0.1 μm. When the optical module is in a liquid-cooled environment, the cooling medium flows along the gap b toward the third cover plate 511 or the fourth cover plate 521.

[0294] In some embodiments, the sidewall of the third cover plate 511 is close to one edge of the circuit board 300, and the sidewall of the fourth cover plate 521 is close to the other edge of the circuit board 300. For example, the distance between the sidewall of the fourth cover plate 521 and the other edge of the circuit board 300 is a. When the optical module is in a liquid cooling environment, due to the small distance a, the cooling medium may penetrate the space a and enter the third cover plate 511 or the fourth cover plate 521, and enter the third cover plate 511 along the assembly gap between the third cover plate 511 and the surface of the circuit board 300, or enter the fourth cover plate 521 along the assembly gap between the fourth cover plate 521 and the surface of the circuit board 300, thereby affecting the optical path transmission.

[0295] In some embodiments, a sealing agent, such as a sealant, is applied along the periphery of the third cover plate 511 and the second opening 5111 to seal the assembly gap between the third cover plate 511 and the circuit board 300 and the second opening 5111, thereby preventing the cooling medium from entering the first light receiving component 510 through the assembly gap between the third cover plate 511 and the circuit board 300 and the second opening 5111, thereby isolating the cooling medium from entering. Accordingly, a sealing agent is applied along the periphery of the fourth cover plate 521 and the third opening 5211 to seal the assembly gap between the fourth cover plate 521 and the circuit board 300 and the third opening 5211, thereby isolating the cooling medium from entering. When the sealing agent is applied to the second opening 5111, the third optical fiber ribbon 513 will pass through the sealing agent and extend outward. When the sealing agent is applied to the third opening 5211, the fourth optical fiber ribbon 523 will pass through the sealing agent and extend outward.

[0296] In some embodiments, when a sealing medium, such as sealant, is coated along the second opening 5111, the sealant is cured by heat, and the gas inside the cavity formed by the third cover plate 511 and the circuit board 300 expands due to the heat. The gas that expands due to the heat will break through the weak position of the uncured sealant at the second opening 5111, and form a hole at the second opening 5111. The cooling medium penetrates into the cavity through the pore, reducing the sealing effect of the second opening 5111.

[0297] In some embodiments, a first vent hole 5112 is formed on the surface of the third cover plate 511. Gas that expands due to heat in the cavity formed by the third cover plate 511 and the circuit board 300 overflows through the first vent hole 5112, thereby preventing the formation of pores at the second opening 5111 and ensuring a sealing effect on the second opening 5111. Accordingly, a second vent hole 5212 is formed on the surface of the fourth cover plate 521. Gas that expands due to heat in the cavity formed by the fourth cover plate 521 and the circuit board 300 overflows through the second vent hole 5212, ensuring a sealing effect on the third opening 5211.

[0298] In some embodiments, to prevent the third optical fiber ribbon 513 and the fourth optical fiber ribbon 523 from passing through the surface of the base 410 and being covered by the lower housing 202, the first light receiving component 510 is positioned near one edge of the circuit board 300, and the second light receiving component 520 is positioned near the other edge of the circuit board 300. For example, the distance from the sidewall of the third cover 511 to one edge of the circuit board 300 is 0.4 μm, and the distance from the sidewall of the fourth cover 521 to the other edge of the circuit board 300 is 0.4 μm.

[0299] In some embodiments, since the distance from the side wall of the third cover plate 511 to an edge of the circuit board 300 is small and the space is narrow, it is difficult to control the amount of sealant when applying the sealant in the narrow space: if the amount of sealant applied is large, the sealant will easily exceed the edge of the circuit board 300, causing interference when the circuit board 300 and the lower shell 202 are assembled; if the amount of sealant applied is small, the amount of sealant applied is insufficient, which reduces the sealing effect on the periphery of the third cover plate 511, causing the cooling medium to easily penetrate the sealant and enter the interior of the third cover plate 511.

[0300] Figure 52 An assembly section of an upper housing, a circuit board, and a lower housing provided according to some embodiments of the present disclosure Figure 1 , Figure 53 for Figure 52 A partial enlarged view of point C in the middle. Figure 52 、 Figure 53 As shown, in some embodiments, the upper shell 201 and the lower shell 202 are covered and connected to form a wrapping cavity, and the circuit board 300 is located in the wrapping cavity.

[0301] In some embodiments, before assembling the circuit board 300 with the lower housing 202, a small amount of glue, for example, 0.3-0.4 μm, is applied to the space between the sidewall of the third cover plate 511 and the edge of the circuit board 300 and the space between the sidewall of the fourth cover plate 521 and the edge of the circuit board 300 to prevent interference with the assembly between the two housings. When the circuit board 300 and the lower housing 202 are assembled, the small amount of glue applied may not seal the assembly gap b.

[0302] When the optical module is in a liquid-cooled environment, the cooling medium that enters the optical module through the assembly gap between the upper housing 201 and the lower housing 202 will flow along the assembly gap b toward the light receiving component. Because the space between the sidewall of the third cover plate 511 and the edge of the circuit board 300, and the space between the sidewall of the fourth cover plate 521 and the edge of the circuit board 300, is less coated with sealant, the cooling medium can easily penetrate the applied sealant and enter the interior of the third cover plate 511 or the fourth cover plate 521.

[0303] Figure 54 An assembly section of an upper housing, a circuit board, and a lower housing provided according to some embodiments of the present disclosure Figure 2 , Figure 55 An upper housing, a circuit board, and a lower housing assembly and decomposition method according to some embodiments of the present disclosure are provided. Figure 1 .like Figure 54 、 Figure 55 As shown, in some embodiments, the upper shell 201 and the lower shell 202 are covered and connected to form a wrapping cavity, and the circuit board 300 is located in the wrapping cavity.

[0304] In some embodiments, the first light receiving component 510 and the second light receiving component 520 are respectively located on the lower surface of the circuit board 300. For example, the first light receiving component 510 and the second light receiving component 520 are respectively located at the edge of the circuit board 300.

[0305] In some embodiments, a first cavity 2023 is formed on the bottom surface of the lower housing 202 around one side wall of the lower housing 202, and a second cavity 2024 is formed around the other side wall of the lower housing 202. One side of the first cavity 2023 is the inner wall of one side wall of the lower housing 202, and the bottom surface is the bottom surface of the lower housing 202. One side of the second cavity 2024 is the inner wall of the other side wall of the lower housing 202, and the bottom surface is the bottom surface of the lower housing 202.

[0306] In some embodiments, the first cavity 2023 is open at one end facing the surface of the circuit board 300 to enclose the first light receiving component 510 . The second cavity 2024 is open at one end facing the surface of the circuit board 300 to enclose the second light receiving component 520 .

[0307] In some embodiments, a sealing medium, such as sealant, is injected into the first cavity 2023 and the second cavity 2024. When the circuit board 300, the first light receiving component 510, and the second light receiving component 520 are assembled with the lower housing 202, the first light receiving component 510 is embedded in the first cavity 2023, and the second light receiving component 520 is embedded in the second cavity 2024, so that the first cavity 2023 is wrapped around the outer periphery of the third cover plate 511, and the second cavity 2024 is wrapped around the outer periphery of the fourth cover plate 521.

[0308] In some embodiments, gaps are respectively defined between the first cavity 2023 and the second cavity 2024 and the surface of the circuit board 300 , so that the sealing medium inside flows along the gaps toward the surface of the circuit board 300 .

[0309] In some embodiments, when the first light receiving component 510 is inserted into the first cavity 2023 and the second light receiving component 520 is inserted into the second cavity 2024, the sealing medium in the first cavity 2023 is squeezed between the first light receiving component 510 and the sealing medium and fills the first cavity 2023. Similarly, the sealing medium in the second cavity 2024 also fills the second cavity 2024.

[0310] In some embodiments, the volume of the first cavity 2023 is greater than the volume of the third cover plate 511. When the circuit board 300 is assembled with the lower housing 202, the sealing medium within the first cavity 2023 fills the space between the inner wall of the first cavity 2023 and the outer wall of the third cover plate 511, thereby flowing along the periphery of the third cover plate 511 onto the surface of the circuit board 300. As the sealing medium flows, it simultaneously blocks the second opening 5111 and the space between the periphery of the third cover plate 511 and the edge of the circuit board. Because the first cavity 2023 is formed around the sidewalls of the lower housing 202, the sealing medium within the first cavity 2023 also blocks the gap between the edge of the circuit board 300 and the inner wall of the lower housing 202. When the second opening 5111 is blocked, the third optical fiber ribbon 513 passes through the sealing medium and extends outward.

[0311] The volume of the second cavity 2024 is greater than that of the fourth cover plate 521. Therefore, when the circuit board 300 is assembled with the lower housing 202, the sealing medium within the second cavity 2024 fills the space between the inner wall of the second cavity 2024 and the outer wall of the fourth cover plate 521, thereby overflowing along the outer periphery of the fourth cover plate 521 onto the surface of the circuit board 300. This overflow simultaneously blocks the third opening 5211 and the space between the outer periphery of the fourth cover plate 521 and the edge of the circuit board. Because the second cavity 2024 is formed around the sidewalls of the lower housing 202, the sealing medium within the second cavity 2024 also blocks the gap between the edge of the circuit board 300 and the inner wall of the lower housing 202. When the third opening 5211 is blocked, the fourth optical fiber ribbon 523 extends outward through the sealing medium.

[0312] In the present disclosure, the sealing medium filled within the first cavity 2023 flows along the outer periphery of the third cover plate 511 onto the surface of the circuit board 300, thereby blocking the second opening 5111, the space between the outer periphery of the third cover plate 511 and the edge of the circuit board, and the gap between the edge of the circuit board 300 and the inner wall of the lower housing 202. This prevents the cooling medium from entering the third cover plate through the second opening 5111 and also prevents the cooling medium from overflowing through the gap between the edge of the circuit board 300 and the inner wall of the lower housing 202 to the vicinity of the first light receiving component 510. Furthermore, because the space between the outer periphery of the third cover plate 511 and the edge of the circuit board 300 is also filled with the sealing medium, the cooling medium is unlikely to penetrate into the third cover plate 511, thus providing multi-faceted sealing protection for the first light receiving component, thereby ensuring that the optical path transmission within the third cover plate 511 is not affected by the cooling medium. The same applies to the second light receiving component, making it more suitable for liquid cooling environments.

[0313] In some embodiments, before assembling the circuit board 300 with the lower housing 202, a sealing medium, such as sealant, may be applied along the second opening 5111 to seal the second opening 5111. In this case, as described above, the first vent hole 5112 needs to be defined on the surface of the third cover plate 511. Alternatively, before assembling the circuit board 300 with the lower housing 202, the second opening 5111 may be sealed with the sealing medium within the first cavity 2023 rather than applying the sealing medium along the second opening 5111. In this case, since the sealing medium is present at the second opening 5111, the first vent hole 5112 still needs to be defined on the surface of the third cover plate 511.

[0314] In some embodiments, a first relief notch 2025 is formed at the end of the first cavity 2023 facing the optical port to facilitate the passage of the third optical fiber ribbon 513. A second relief notch 2026 is formed at the end of the second cavity 2024 facing the optical port to facilitate the passage of the fourth optical fiber ribbon 523. When a sealing agent is applied to the second opening 5111, the third optical fiber ribbon 513 passing through the second opening 5111 will also be coated with the sealing agent. The recessed surface of the first relief notch 2025 is further away from the circuit board 300 than the recessed surface of the second opening 5111, thereby facilitating the passage of the sealing agent applied to the third optical fiber ribbon 513. This prevents the first relief notch 2025 from lifting the third optical fiber ribbon 513 and thereby breaking it. The bottom height of the second relief notch 2026 is also lower than the bottom height of the third opening 5211.

[0315] In some embodiments, since the first cavity 2023 is formed around one side wall of the lower shell 202, the sealing medium filled in the first cavity 2023 overflows along the inner wall surface of the side wall of the lower shell 202 to the surface of the circuit board 300, and the sealing medium is applied to the space between the outer wall of the third cover plate 511 and the edge of the circuit board 300. At the same time, the sealing medium is applied to the assembly gap b between the edge of the circuit board 300 and the side wall of the lower shell 202. Then, the outer wall of the third cover plate 511 and the side wall of the lower shell 202 are both coated with the sealing medium. In this way, the glue coating space around the third cover plate 511 can be increased, and the glue coating space is formed by the third cover plate 511. The space between the outer wall of the cover plate 511 and the edge of the circuit board is expanded to the space between the outer wall of the third cover plate 511 and the inner wall surface of the side wall of the lower housing 202, thereby increasing the amount and thickness of glue applied, enhancing the sealing effect of the outer periphery of the third cover plate 511, and simultaneously blocking the assembly gap b between the edge of the circuit board 300 and the side wall of the lower housing 202, thereby preventing the cooling medium from flowing along the assembly gap b toward the first light receiving component 510. Even if the cooling medium penetrates the assembly gap b and enters the interior, it is difficult to penetrate the sealing medium applied between the inner wall of the lower housing 202 and the third cover plate 511 and enter the first light receiving component 510. The same is true for the second light receiving component 520.

[0316] Figure 56 An assembly section of an upper housing, a circuit board, and a lower housing provided according to some embodiments of the present disclosure Figure 3 , Figure 57 An upper housing, a circuit board, and a lower housing assembly and decomposition method according to some embodiments of the present disclosure are provided. Figure 2 .like Figure 56 and Figure 57 As shown, in some embodiments, the circuit board 300 is assembled with the lower housing 202. The first light receiving component 510 and the second light receiving component 520 are respectively located on the lower surface of the circuit board 300, and the first cavity 2023 and the second cavity 2024 are respectively located on the surface of the lower housing 202. The first cavity 2023 is open toward the lower surface of the circuit board 300 to enclose the first light receiving component 510, and the second cavity 2024 is open toward the lower surface of the circuit board 300 to enclose the second light receiving component 520.

[0317] In some embodiments, there is a certain gap between the side wall of the first cavity 2023 and the side wall of the third cover plate 511, so that the sealing medium filled in the first cavity 2023 flows along the gap to the surface of the circuit board 300, sealing the outer periphery of the third cover plate 511, and at the same time sealing the assembly gap between the edge of the circuit board 300 and the inner wall of the side wall of the lower shell 202.

[0318] In some embodiments, a gap H1 is provided between the first cavity 2023 and the surface of the circuit board 300 , so that the sealing medium filled in the first cavity 2023 can flow toward the surface of the circuit board 300 .

[0319] In some embodiments, the amount of sealing medium injected into the first cavity 2023 accounts for half of the volume of the first cavity 2023, so that the first light receiving component 510 can be embedded in the first cavity 2023 during assembly. During assembly, the sealing medium in the first cavity 2023 will fill the first cavity 2023 due to the squeezing force between the first light receiving component 510 and the sealing medium, thereby flowing along the gap H1 toward the surface of the circuit board 300, blocking the outer periphery of the third cover plate 511, increasing the thickness of the glue coating on the outer periphery of the third cover plate 511, and simultaneously blocking the assembly gap between the edge of the circuit board 300 and the inner wall of the side wall of the lower housing 202.

[0320] Figure 58 FIG1 is a diagram of an assembly structure of a circuit board and a lower housing according to some embodiments of the present disclosure. Figure 59 An assembly cross section of a circuit board and a lower housing provided according to some embodiments of the present disclosure Figure 1 , Figure 60 An assembly cross section of a circuit board and a lower housing provided according to some embodiments of the present disclosure Figure 2 , Figure 61 for Figure 60 A partial enlarged view of point D in the figure. Figures 58-61 As shown, in some embodiments, the first light receiving component 510 is located between the circuit board 300 and the first cavity 2023 , and the second light receiving component 520 is located between the circuit board 300 and the second cavity 2024 .

[0321] In some embodiments, the sealing medium injected into the first cavity 2023 will fill the first cavity 2023 when the circuit board 300 and the lower housing 202 are assembled. Under pressure, the sealing medium in the first cavity 2023 flows along the outer periphery of the third cover plate 511 toward the surface of the circuit board 300. The sealing medium is further applied to the gap between the outer periphery of the third cover plate 511 and the circuit board 300, and further applied to the second opening 5111. More importantly, the sealing medium fills the space between the outer periphery of the third cover plate 511 and the inner sidewall of the lower housing 202. This not only blocks the assembly gap b between the edge of the circuit board 300 and the sidewall of the lower housing 202, but also fills the space from the outer periphery of the third cover plate 511 to the edge of the circuit board 300. Ultimately, the sealing medium fills the space between the outer periphery of the third cover plate 511 and the inner sidewall of the lower housing 202. Figure 36 and Figure 37 The black solid dots indicated in the figure indicate the filling state of the sealing medium.

[0322] Because the assembly gap b between the edge of the circuit board 300 and the sidewall of the lower housing 202 is blocked, cooling medium that enters the interior of the optical module along the assembly gap between the upper housing 201 and the lower housing 202 is prevented from passing through the assembly gap b. Even if a small amount of cooling medium does penetrate the assembly gap b and enter the interior of the optical module, the sealing medium blocks the outer periphery of the third cover plate 511, and the sealing medium within the first cavity 2023 increases the adhesive space between the outer rear surface of the third cover plate 511 and the edge of the circuit board 300, ensuring a sufficient amount and thickness of adhesive. Therefore, it is difficult for the cooling medium to penetrate the sealing medium behind the outer rear surface of the third cover plate 511 and enter the interior of the third cover plate 511.

[0323] In some embodiments, the distance between the outer periphery of the third cover plate 511 and the edge of the circuit board 300 is 0.4 μm, and the distance between the edge of the circuit board 300 and the inner wall of the side wall of the lower shell 202 is 0.1 μm. Therefore, the distance between the outer periphery of the third cover plate 511 and the inner wall of the side wall of the lower shell 202 is 0.5 μm. When the sealing medium is applied to the space formed by the outer periphery of the third cover plate 511 and the edge of the circuit board 300 alone, the thickness of the applied sealing medium reaches 0.3 μm to avoid affecting the assembly with the lower shell 202. If the sealing medium is applied to the space formed by the outer periphery of the third cover plate 511 and the edge of the circuit board 300 in conjunction with the first cavity 2023, the applied sealing medium can fill the space between the outer periphery of the third cover plate 511 and the inner wall of the side wall of the lower shell 202. In this case, the thickness of the applied sealing medium can reach 0.5 μm. It can be seen that the first cavity 2023 can increase the amount of sealing medium coated on the periphery of the third cover plate 511, increase the amount of glue applied, and thus increase the thickness of the glue. At the same time, it can also seal the gap between the edge of the circuit board 300 and the inner wall of the side wall of the lower shell 202, increase the airtightness, and isolate the cooling medium from the outside.

[0324] In some embodiments, when the first light receiving component 510 and the second light receiving component 520 are respectively at a large distance from the edge of the circuit board 300, a sealing medium can be directly filled in the second opening 5111 to block the second opening 5111. A sealing medium is applied around the outer periphery of the third cover plate 511 to block the assembly gap between the third cover plate 511 and the circuit board 300. At this time, a first air vent 5112 is formed on the surface of the third cover plate 511. Similarly, a sealing medium is directly filled in the third opening 5211 to block the third opening 5211. A sealing medium is applied around the outer periphery of the fourth cover plate 521 to block the assembly gap between the fourth cover plate 511 and the circuit board 300. At this time, a first air vent 5212 is formed on the surface of the fourth cover plate 521.

[0325] Figure 62 Another assembly diagram of a circuit board and a lower housing according to some embodiments of the present disclosure is provided. Figure 63This is another exploded view of the assembly of a circuit board and a lower housing provided according to some embodiments of the present disclosure. Figure 64 This is a cross-sectional view of another circuit board and lower housing assembly according to some embodiments of the present disclosure. Figures 62-64 As shown, in some embodiments, the circuit board 300 is assembled with the lower housing 202. The first light receiving component 510 and the second light receiving component 520 are respectively located on the lower surface of the circuit board 300, and the first cavity 2023a and the second cavity 2024a are respectively located on the surface of the lower housing 202. The first cavity 2023a is open toward the lower surface of the circuit board 300 to enclose the first light receiving component 510, and the second cavity 2024a is open toward the lower surface of the circuit board 300 to enclose the second light receiving component 520.

[0326] In some embodiments, the first cavity 2023a and the second cavity 2024a are open at one end facing the exterior of the optical module. For example, the surfaces of the first cavity 2023a and the second cavity 2024a facing the exterior of the optical module are hollowed out, that is, the bottom plate 2021 of the lower housing 202 is hollowed out at the corresponding locations. A first through-hole 2027 and a second through-hole 2028 are formed on the hollowed-out surfaces of the first cavity 2023a and the second cavity 2024a, respectively.

[0327] In some embodiments, a first sealing plate 2029a is embedded in the first through hole 2027 to seal the first cavity 2023a, and a second sealing plate 2029b is embedded in the second through hole 2028 to seal the second cavity 2024a.

[0328] The first cavity 2023a differs from the first cavity 2023 in the aforementioned embodiment in that the surface of the first cavity 2023a facing the exterior of the optical module is hollowed out and sealed by a first sealing plate 2029a. The relationship between the first cavity 2023a and the first light receiving component 510 can be referred to as the relationship between the first cavity 2023 and the first light receiving component 510. The same applies to the second cavity 2024a.

[0329] In some embodiments, the circuit board 300 and the lower housing 202 are first assembled together, and then a sealing medium, such as sealant, is poured into the first cavity 2023a through the first through-hole 2027. Because the volume of the first cavity 2023a is larger than that of the third cover plate 511, the sealing medium in the first cavity 2023a flows toward the circuit board 300, being further applied to the gap between the outer perimeter of the third cover plate 511 and the circuit board 300, and further applied to the second opening 5111. More importantly, the sealing medium fills the space between the outer perimeter of the third cover plate 511 and the inner sidewall of the lower housing 202. This not only blocks the assembly gap between the edge of the circuit board 300 and the sidewall of the lower housing 202, but also fills the space from the outer perimeter of the third cover plate 511 to the edge of the circuit board 300. Ultimately, the sealing medium fills the space between the outer perimeter of the third cover plate 511 and the inner sidewall of the lower housing 202. After the plugging is completed, the first sealing plate 2029a is embedded in the first through hole 2027 to achieve sealing.

[0330] In some embodiments, a gap H2 is defined between the first cavity 2023a and the surface of the circuit board 300. Because the surface of the first cavity 2023a facing the exterior of the optical module is hollowed out, to prevent the sealing medium encapsulated within the first cavity 2023a from overflowing along the gap H2, the gap H2 should be set relatively small. For example, the gap H2 is set smaller than the gap H1.

[0331] In some embodiments, a sealing medium is injected into the first cavity 2023a and the second cavity 2024a along their openings toward the outside of the optical module. The sealing medium injected into the first cavity 2023a flows along the periphery of the third cover plate 511 onto the surface of the circuit board, thereby blocking the second opening 5111 and the space between the periphery of the third cover plate 511 and the edge of the circuit board, and also blocking the gap between the edge of the circuit board 300 and the inner wall of the lower housing 202. This prevents the cooling medium from entering the third cover plate 511 along the second opening 5111 and also prevents the cooling medium from flowing along the gap between the edge of the circuit board 300 and the inner wall of the lower housing 202 to the vicinity of the first light receiving component 510. At the same time, because the space between the outer periphery of the third cover plate 511 and the edge of the circuit board 300 is also filled with a sealing medium, the cooling medium is unlikely to penetrate into the third cover plate 511. This provides multi-faceted sealing protection for the first light receiving component 510, thereby ensuring that the light path transmission within the third cover plate 511 is not affected by the cooling medium. The same applies to the second light receiving component 520, making it more suitable for liquid cooling environments.

[0332] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in the present disclosure should be included within the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. An optical module, characterized in that: include: circuit boards; A light emitting component, electrically connected to the circuit board, comprising: Laser arrays; A first optical fiber array is located on the light output path of the laser array, and the first optical fiber array includes a first optical fiber ribbon; A second optical fiber array is located on the light output path of the laser array, and the second optical fiber array includes a second optical fiber ribbon; a base, embedded in the circuit board, the base being configured to support the laser array, the first optical fiber array, and the second optical fiber array; A first cover plate is connected to the base; the first cover plate has a first opening at one end facing the optical port to allow the first optical fiber ribbon and the second optical fiber ribbon to pass through; a barrier fence located between the base and the first cover plate and disposed toward the first opening, the barrier fence comprising a plurality of spaced-apart baffles with gaps between adjacent baffles to allow the first optical fiber ribbon and the second optical fiber ribbon to pass through the gaps; The first sealing portion is located on the side of the partition fence facing the light port and is arranged along the first opening to seal the first opening, wherein the first optical fiber ribbon and the second optical fiber ribbon pass through the first sealing portion; the first sealing portion is confined to the gap between adjacent baffles to prevent the first sealing portion from passing through the gap into the cavity formed by the first cover plate and the base.

2. The optical module according to claim 1, wherein A through hole is formed on the surface of the circuit board, the base is embedded in the through hole, one end of the base protrudes relative to one surface of the circuit board, and the other end of the base protrudes relative to the other surface of the circuit board; The optical module includes: upper shell; The lower shell is connected to the upper shell to form a housing cavity for accommodating the circuit board; a gap is defined between the edge of the circuit board and the inner wall of the lower shell; a first cavity is defined on the bottom surface of the lower shell around one inner wall of the lower shell, and a second cavity is defined around the other inner wall of the lower shell; a gap is defined between the first cavity and the second cavity and the surface of the circuit board; a sealing medium is injected into each of the first cavity and the second cavity; The first light receiving component includes a third cover plate and a third optical fiber ribbon. The third cover plate has a second opening formed at an end thereof to allow the third optical fiber ribbon to pass through. An assembly gap exists between the third cover plate and the circuit board. The first light receiving component is disposed adjacent to an edge of the circuit board to allow the third optical fiber ribbon to pass along one side of the base. The first light receiving component is embedded in the first cavity so that a sealing medium in the first cavity seals the second opening and the space between the edge of the first light receiving component and the edge of the circuit board, and seals the gap between the edge of the circuit board and an inner wall of the lower housing. The second light receiving component includes a fourth cover plate and a fourth optical fiber ribbon. A third opening is formed at the end of the fourth cover plate to allow the fourth optical fiber ribbon to pass through; there is an assembly gap between the fourth cover plate and the circuit board; the second light receiving component is arranged close to the other edge of the circuit board to allow the fourth optical fiber ribbon to pass through along the other side of the base; the second light receiving component is embedded in the second cavity to seal the third opening, the space between the edge of the second light receiving component and the other edge of the circuit board through the sealing medium in the second cavity, and the gap between the other edge of the circuit board and the other inner wall of the lower shell.

3. The optical module according to claim 1, wherein: A through hole is formed on the surface of the circuit board, and the base is embedded in the through hole. The top end of the base protrudes relative to one surface of the circuit board, and the bottom end of the base protrudes relative to the other surface of the circuit board; The optical module includes: upper shell; The lower housing is connected to the upper housing to form a housing cavity for accommodating the circuit board; a gap is defined between the edge of the circuit board and the inner wall of the lower housing; a first cavity is formed on the bottom surface of the lower housing around one inner wall of the lower housing, and a second cavity is formed around the other inner wall of the lower housing; the first cavity and the second cavity are open at one end facing the surface of the circuit board and at one end facing the exterior of the optical module; The first light receiving component includes a third cover plate and a third optical fiber ribbon. The third cover plate has a second opening formed at an end thereof to allow the third optical fiber ribbon to pass through. An assembly gap exists between the third cover plate and the circuit board. The first light receiving component is disposed near an edge of the circuit board to allow the third optical fiber ribbon to pass through along one side of the base. The first light receiving component is embedded in the first cavity so that a sealing medium injected into the first cavity seals the second opening and the space between the edge of the first light receiving component and the edge of the circuit board, and seals the gap between the edge of the circuit board and an inner wall of the lower housing. The second light receiving component includes a fourth cover plate and a fourth optical fiber ribbon. A third opening is formed at the end of the fourth cover plate to allow the fourth optical fiber ribbon to pass through; an assembly gap is formed between the fourth cover plate and the circuit board, and the first light receiving component is arranged close to the other edge of the circuit board to allow the fourth optical fiber ribbon to pass through along the other side of the base; the second light receiving component is embedded in the second cavity to seal the third opening, the space between the edge of the second light receiving component and the other edge of the circuit board, and the gap between the other edge of the circuit board and the other inner wall of the lower shell by injecting a sealing medium into the second cavity.

4. The optical module according to claim 1, wherein: A groove is formed on the surface of the base, and the groove is recessed relative to the supporting surface; a TEC is provided in the groove, and the laser array is provided on the surface of the TEC; The base surface is formed with a carrier, the carrier surface is higher than the supporting surface; the carrier has side walls on both sides; the ends of the side walls are formed with overlapping parts; the space between the side walls and the baffle is filled with a sealing medium to block the space between the side walls and the baffle; The surface of the laser array is irradiated with a second cover plate, which is located between the first cover plate and the circuit board; one end of the second cover plate is located on the surface of the overlapping portion, and the other end is bent downward and connected to the surface of the circuit board.

5. The optical module according to claim 1, wherein: A carrier is formed on the surface of the base to carry the first optical fiber array and the second optical fiber array; side walls are provided on both sides of the carrier; A recessed portion is formed in the cavity enclosed by the side wall and the barrier rib, and the recessed portion is located on the side of the barrier rib facing the light port; the recessed portion is sunken relative to the surface of the carrier to limit the first sealing portion.

6. An optical module, characterized in that: include: circuit boards; A light emitting component is electrically connected to the circuit board, and the light emitting component includes: Laser arrays; A first optical fiber array is located on the light output path of the laser array, and the first optical fiber array includes a first optical fiber ribbon; A second optical fiber array is located on the light output path of the laser array, and the second optical fiber array includes a second optical fiber ribbon; a base, embedded in the circuit board, the base being configured to support the laser array, the first optical fiber array, and the second optical fiber array; A first cover plate is connected to the base; the first cover plate has a first opening at one end facing the optical port to allow the first optical fiber ribbon and the second optical fiber ribbon to pass through; A baffle is located between the base and the first cover plate and is arranged along the first opening. The baffle includes a plurality of baffles arranged at intervals, and there are gaps between adjacent baffles to allow the first optical fiber ribbon and the second optical fiber ribbon to pass along the gaps; the gaps between adjacent baffles are filled with a sealing medium to seal the gaps between the adjacent baffles.

7. The optical module according to claim 6, wherein: A first sealing portion is provided on the side of the barrier facing the light port; A carrier is formed on the surface of the base to carry the first optical fiber array and the second optical fiber array; side walls are provided on both sides of the carrier; A recessed portion is formed in the cavity enclosed by the side wall and the barrier rib, and the recessed portion is located on the side of the barrier rib facing the light port; the recessed portion is sunken relative to the surface of the carrier to limit the first sealing portion.

8. The optical module according to claim 6, wherein: A supporting surface is formed on the surface of the base to support the circuit board; A groove is formed on the surface of the base, and the groove is recessed relative to the supporting surface; a TEC is provided in the groove, and the laser array is provided on the surface of the TEC; A carrier is formed on the surface of the base, and the surface of the carrier is higher than the supporting surface; and side walls are provided on both sides of the carrier.

9. The optical module according to claim 6, wherein: A groove is formed on the surface of the base, and the groove is recessed relative to the supporting surface; a TEC is provided in the groove, and the laser array is provided on the surface of the TEC; The base surface is formed with a carrier, the carrier surface is higher than the supporting surface; the carrier has side walls on both sides; the ends of the side walls are formed with overlapping parts; the space between the side walls and the baffle is filled with a sealing medium to block the space between the side walls and the baffle; The surface of the laser array is irradiated with a second cover plate, which is located between the first cover plate and the circuit board; one end of the second cover plate is located on the surface of the overlapping portion, and the other end is bent downward and connected to the surface of the circuit board.

10. The optical module according to claim 6, wherein: A second sealing portion is provided around the outer periphery of the first cover plate to seal an assembly gap between the first cover plate and the circuit board; A third sealing portion is provided around the assembly gap between the base and the circuit board to seal the assembly gap between the base and the circuit board.

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