Heat dissipation optical module and optimization method thereof

Abstract

The invention relates to the technical field of optical modules, in particular to a heat dissipation optical module and an optimization method thereof, and the heat dissipation optical module comprises a heat dissipation assembly, a circuit board assembly and an upper cover plate. A first window is arranged on the surface of the upper cover plate; the heat dissipation assembly comprises a plurality of heat conduction blocks, and the heat conduction blocks penetrate through the first window to abut against chips needing heat dissipation correspondingly arranged on the circuit board assembly while being fixed to the upper cover plate based on the heat dissipation assembly. The heat of the chip needing heat dissipation on the circuit board assembly is conducted out to the device, located outside, of the heat dissipation assembly through the heat conduction block, and the heat conducted out of the chip needing heat dissipation can be dissipated to the external environment. The heat dissipation assembly is exposed out of the upper cover plate, heat can be directly conducted out, and the heat dissipation efficiency is higher.

Description

Technical Field

[0001] The present invention relates to the technical field of optical modules, and in particular to a heat dissipation optical module and an optimization method thereof. Background Art

[0002] Optical modules, optical components, and electronic components are typically integrated together. To ensure network data meets the requirements of high speed, high power consumption, and low latency, the heat generated by module power consumption is one of the challenges that must be addressed. Existing high-speed optical modules face a heat dissipation bottleneck: high chip power consumption and small area result in very high heat flux density at the chip location.

[0003] Currently, most digital signal processing (DSP) chip manufacturers for 800G and above solutions directly provide unpackaged chips. The chips need to be bonded to a printed circuit board (PCB) or adapter board. The internal layout must be carefully considered, and thermal design must be implemented to ensure that chip heat can be dissipated quickly and efficiently, reducing heat accumulation and ensuring that the chips inside the module are at normal operating temperature.

[0004] Existing technologies use a vapor chamber to dissipate heat, but most of these are placed inside the housing. After receiving heat, the vapor chamber needs to transfer it to the housing, which then dissipates the heat. Because the vapor chamber must first transfer the heat to the housing, which then dissipates it, the heat dissipation efficiency is low. As optical modules speed up, chip power consumption increases, generating more heat. This heat cannot be dissipated in time, leading to heat accumulation and affecting chip operation. The vapor chamber is also prone to being improperly restrained within the housing, affecting its heat dissipation.

[0005] In view of this, overcoming the defects of the prior art is an urgent problem to be solved in this technical field. Summary of the Invention

[0006] The technical problem to be solved by the embodiments of the present invention is the low efficiency of the heat dissipation method in which the heat spreader is arranged inside the housing of the optical module.

[0007] A further technical problem to be solved by the embodiments of the present invention is how to design a solution for optimizing the material layout of each part of the heat dissipation component under the improved solution scenario proposed by the present invention.

[0008] The embodiment of the present invention adopts the following technical solutions: In a first aspect, the present invention provides a heat dissipation optical module, comprising: a heat dissipation component 1, a circuit board component 2, and an upper cover 3; a first window 300 is provided on the surface of the upper cover 3; The heat dissipation assembly 1 includes a plurality of heat conducting blocks 11 . When the heat dissipation assembly 1 is fixed to the upper cover 3 , the heat conducting blocks 11 pass through the first window 300 and abut against the corresponding chip 20 requiring heat dissipation on the circuit board assembly 2 .

[0009] Preferably, the heat dissipation assembly 1 also includes a first radiator 10 and a first heat spreader 12. The outer surface of the upper cover plate 3 is provided with a first fixed area 30, and the first radiator 10 is fixed on the first fixed area 30; the first fixed area 30 is provided with the first window 300, and the first heat spreader 12 is fixed at the first window 300, and the upper surface of the first heat spreader 12 is in contact with the lower surface of the first radiator 10.

[0010] Preferably, the first heat spreader 12 includes a first heat spreader 120 and a second heat spreader 121 from top to bottom, the first heat spreader 120 is clamped in the first window 300, the part of the second heat spreader 121 protruding from the first heat spreader 120 abuts against the inner edge of the first window 300, and the heat conductive block 11 is coupled to the second heat spreader 121.

[0011] Preferably, the heat dissipation assembly 1 further includes a second heat spreader 13, which includes a fourth heat spreader 130 and a fifth heat spreader 131 from top to bottom, and the fifth heat spreader 131 is coupled to the heat conducting block 11; The outer surface of the upper cover plate 3 is provided with a first fixing area 30 , the first fixing area 30 is provided with the first window 300 , the fourth soaking stage 130 is fixed on the first fixing area 30 , and the fifth soaking stage 131 is embedded in the first window 300 .

[0012] Preferably, the heat dissipation assembly 1 further includes a second heat sink 15, the second heat sink 15 includes a heat dissipation portion 150 and a first heat conduction portion 151, and the heat conduction block 11 is coupled to the first heat conduction portion 151; The outer surface of the upper cover plate 3 is provided with a first fixing area 30 , and the first fixing area 30 is provided with a first window 300 . The heat dissipation portion 150 is fixedly provided on the first fixing area 30 , and the first heat conducting portion 151 passes through the first window 300 , so that the heat conducting block 11 abuts against the chip 20 to be cooled.

[0013] Preferably, the heat dissipation assembly 1 further includes a third radiator 16 and a heat conducting plate 14 , the heat conducting plate 14 is fixedly connected to the third radiator 16 , the heat conducting plate 14 is fixedly connected to the heat conducting block 11 , and the third radiator 16 is relatively fixed to the upper cover plate 3 .

[0014] Preferably, the third radiator 16 includes a top cover 160 and array-arranged heat dissipation fins 161, the top cover 160 covers the top of the heat dissipation fins 161, the top cover 160 and the heat dissipation fins 161 are integrally formed by die-casting, and the other side of the heat dissipation fins 161 is fixedly connected to the heat conduction plate 14.

[0015] Preferably, the heat dissipation component 1 is provided with one or more longitudinal through holes 102 , which penetrate the heat dissipation component 1 and communicate with the surface of the chip to be cooled, and a sensor is provided inside the longitudinal through hole 102 .

[0016] Preferably, the diameter of the longitudinal through hole 102 is 0.3 mm-0.5 mm.

[0017] Preferably, the sensor is a thermocouple sensor 105 , which is in contact with the chip 20 requiring heat dissipation on the circuit board assembly 2 , and is used to measure the temperature of the chip 20 requiring heat dissipation.

[0018] Preferably, the sensor is specifically a sensing optical fiber whose head is made of at least three sections of customized length gratings, wherein the first section grating 1021 is used to reflect the light signal of the first wavelength λ1, the second section grating 1022 is used to reflect the light signal of the second wavelength λ2, and the third section grating 1023 is used to reflect the light signal of the second wavelength λ3; wherein the lengths of the first section grating 1021, the second section grating 1022 and the third section grating 1023 are determined by the thickness of the structural part divided by the longitudinal direction of the heat dissipation component 1.

[0019] In a second aspect, the present invention provides, based on the first aspect, a method for optimizing a heat dissipation optical module, which is applicable to the heat dissipation optical module described in the first aspect, comprising: The signal transceiver end of the sensing optical fiber is controlled to synchronously or time-share transmit an optical signal of a first wavelength λ1, an optical signal of a second wavelength λ2, and an optical signal of a third wavelength λ3. The detected temperature of each structural component in the longitudinal direction of the heat dissipation assembly 1 is analyzed based on the offset of the central wavelength of the reflected optical signal; thereby adjusting the size of each structural component to obtain the final structural size of the heat dissipation assembly 1.

[0020] Compared with the prior art, the beneficial effects of the embodiments of the present invention are: first, the heat of the chip to be cooled on the circuit board assembly is conducted to the device located outside the heat dissipation assembly through the heat conductive block, and the heat conducted from the chip to be cooled can be dissipated to the external environment through the first window. Compared with the heat dissipation method of "chip to be cooled-heat sink-housing-external environment" in the prior art, the heat dissipation assembly is exposed from the upper cover plate, so that the heat can be directly conducted out, and the heat dissipation efficiency is more efficient.

[0021] On the second aspect, in the preferred solution, by setting a longitudinal through hole on the surface of the radiator and placing a sensor in the longitudinal through hole, the sensor can detect the longitudinal temperature change of the entire heat dissipation assembly, thereby providing more objective detection parameters for the size, shape, orientation, etc. of each layer of heat sink in the heat dissipation assembly, thereby providing a basis for designing and adjusting the heat dissipation assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0023] Figure 1 is a connection relationship diagram of an optical communication system provided by an embodiment of the present invention; Figure 2 This is a diagram showing a connection structure of an optical network terminal and an optical module provided by an embodiment of the present invention; Figure 3 1 is a schematic diagram of a module box of an optical module provided by an embodiment of the present invention; Figure 4 This is a structural diagram of a first heat dissipation optical module provided by an embodiment of the present invention; Figure 5 The embodiment of the present invention provides Figure 4 Exploded view of the heat dissipation optical module; Figure 6 Schematic diagram of a sealing strip for a heat dissipation optical module provided by an embodiment of the present invention; Figure 7 Schematic diagram of a circuit board body of a heat dissipation optical module provided by an embodiment of the present invention; Figure 8 This is a schematic structural diagram of a first vapor chamber of a heat dissipation optical module provided by an embodiment of the present invention; Figure 9 2 is a schematic structural diagram of a second heat dissipation optical module provided by an embodiment of the present invention; Figure 10 This is a schematic structural diagram of a second vapor chamber of a heat dissipation optical module provided by an embodiment of the present invention; Figure 11 2 is a schematic structural diagram of a third heat dissipation optical module provided by an embodiment of the present invention; Figure 12 This is a structural schematic diagram of a heat dissipation portion and a first heat conduction portion of a heat sink provided by an embodiment of the present invention; Figure 13This is a structural diagram of a heat dissipation optical module provided by an embodiment of the present invention, in which the heat dissipation portion is a heat dissipation rib; Figure 14 This is a structural diagram of a heat dissipation optical module provided by an embodiment of the present invention, in which the heat dissipation portion is a heat dissipation tooth; Figure 15 2 is a schematic structural diagram of a fourth heat dissipation optical module provided by an embodiment of the present invention; Figure 16 This is a schematic structural diagram of a heat-conducting block of a heat-dissipating optical module provided by an embodiment of the present invention; Figure 17 Schematic diagram of a dispensing slot for a heat dissipation optical module provided by an embodiment of the present invention; Figure 18 Schematic diagram of coupling between a dispensing groove and a heat dissipation fin of a heat dissipation optical module provided by an embodiment of the present invention; Figure 19 1 is a schematic structural diagram of a thermocouple sensor of a heat dissipation optical module provided by an embodiment of the present invention; Figure 20a 1 is a schematic structural diagram of a longitudinally extending through hole of a heat dissipation optical module provided by an embodiment of the present invention; Figure 20b This is a schematic diagram of a test hole marking of a heat dissipation optical module provided by an embodiment of the present invention; Figure 21 Schematic diagram of an optical fiber sensor with a heat dissipation optical module provided by an embodiment of the present invention; Figure 22 The present invention provides a flow chart of a method for optimizing a heat dissipation optical module. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0025] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as meaning open inclusion, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the specific features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present invention. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the specific features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner, that is, although they may be carried in the embodiments or examples of the above terms due to reasons such as the order and position of appearance, it is not limited to that they can be carried in combination by one embodiment or example.

[0026] In the description of the present invention, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention.

[0027] In the description of the present invention, the terms "first" and "second" are used only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, unless otherwise specified, the meaning of "multiple" is two or more. In addition, for example, the description may also use the method of adding "A" and "B" at the end to describe the same type of nouns as two independent individuals. In this case, the corresponding features defined as "A" and "B" are only used to distinguish the description purposes of the same type of individuals, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features.

[0028] When describing some embodiments, the expressions “coupled”, “coupled” and “connected” and their derivatives may be used. For example, when describing some embodiments, the term “connected” may be used to indicate that two or more components are in direct physical or electrical contact with each other. For another example, when describing some embodiments, the term “coupled” may be used to indicate that two or more components are in direct physical or electrical contact. However, the term “connected” or “coupled” may also mean that two or more components are not in direct contact with each other, but still cooperate or interact with each other, such as “optical coupling”, “wireless connection”, etc. The embodiments disclosed herein are not necessarily limited to the contents of the present invention.

[0029] In the description of the present invention, the expression "A and / or B" (where A and B are used to formally represent specific characteristic contents) is involved, and the corresponding expressions include the following three combinations: only A, only B, and a combination of A and B.

[0030] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and errors associated with measurement of the particular quantity (i.e., limitations of the measurement system).

[0031] In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0032] Figure 1 FIG. 1 is a connection diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system mainly includes an optical network terminal 6, a remote server 7, a local information processing device 8, an optical module 9, an optical fiber 60 and a network cable 61.

[0033] One end of optical fiber 60 is connected to remote server 7, and the other end is connected to optical network terminal 6 via optical module 9. Optical fiber itself can support long-distance signal transmission, for example, signal transmission over several kilometers (6 to 8 kilometers). Furthermore, if repeaters are used, ultra-long-distance transmission is theoretically possible. Therefore, in typical optical communication systems, the distance between remote server 7 and optical network terminal 6 can typically reach several thousand, tens of kilometers, or even hundreds of kilometers.

[0034] One end of the network cable 61 is connected to the local information processing device 8, and the other end is connected to the optical network terminal 6. The local information processing device 8 can be any one or more of the following devices: a router, a switch, a computer, a mobile phone, a tablet computer, a television, etc.

[0035] The physical distance between remote server 7 and optical network terminal 6 is greater than the physical distance between local information processing device 8 and optical network terminal 6. The connection between local information processing device 8 and remote server 7 is completed by optical fiber 60 and network cable 61; the connection between optical fiber 60 and network cable 61 is completed by optical module 9 and optical network terminal 6.

[0036] Optical module 9 includes an optical port and an electrical port. The optical port is configured to connect to optical fiber 60, thereby establishing a bidirectional optical signal connection between the optical module 9 and the optical fiber 60. The electrical port is configured to connect to optical network terminal 6, thereby establishing a bidirectional electrical signal connection between the optical module 9 and the optical network terminal 6. Optical module 9 can convert optical signals into electrical signals, thereby establishing a connection between optical fiber 60 and optical network terminal 6. For example, optical signals from optical fiber 60 are converted into electrical signals by optical module 9 and then input into optical network terminal 6. Similarly, electrical signals from optical network terminal 6 are converted into optical signals by optical module 9 and then input into optical fiber 60.

[0037] The optical network terminal 6 includes a roughly rectangular housing, as well as an optical module interface 62 and a network cable interface 63 provided on the housing. The optical module interface 62 is configured to connect to the optical module 9, thereby establishing a bidirectional electrical signal connection between the optical network terminal 6 and the optical module 9. The network cable interface 63 is configured to connect to the network cable 61, thereby establishing a bidirectional electrical signal connection between the optical network terminal 6 and the network cable 61. The optical module 9 and the network cable 61 are connected via the optical network terminal 6. For example, the optical network terminal 6 transmits electrical signals from the optical module 9 to the network cable 61, and transmits signals from the network cable 61 to the optical module 9. Therefore, the optical network terminal 6 serves as the host computer of the optical module 9 and can monitor the operation of the optical module 9. In addition to the optical network terminal 6, the host computer of the optical module 9 may also include an optical line terminal (OLT) and the like.

[0038] A bidirectional signal transmission channel is established between the remote server 7 and the local information processing device 8 via the optical fiber 60 , the optical module 9 , the optical network terminal 6 and the network cable 61 .

[0039] Figure 2 FIG. 1 is a diagram showing a connection structure of an optical network terminal and an optical module according to some embodiments. In order to clearly show the connection relationship between the optical module 9 and the optical network terminal 6, Figure 2 Only the structure of the optical network terminal 6 related to the optical module 9 is shown. Figure 2 As shown, the optical network terminal 6 further includes a PCB circuit board 64 arranged in the housing, a cage 5 arranged on the surface of the PCB circuit board 64, an electrical connector arranged inside the cage 5, and a heat sink on the surface of the cage 5 ( Figure 2The heat sink is not shown in the figure. The electrical connector is configured to be connected to the electrical port of the optical module 9. The heat sink has protrusions such as fins to increase the heat dissipation area.

[0040] The optical module 9 is inserted into the cage 5 of the optical network terminal 6, which secures the optical module 9. Heat generated by the optical module 9 is transferred to the cage 5 and then dissipated through the heat sink. Once inserted, the optical module 9's electrical port connects to the electrical connector inside the cage 5, establishing a bidirectional electrical signal connection between the optical module 9 and the optical network terminal 6. Furthermore, the optical port of the optical module 9 connects to the optical fiber 60, establishing a bidirectional electrical signal connection between the optical module 9 and the optical fiber 60.

[0041] Figure 3 is a structural diagram of an optical module according to some embodiments, such as Figure 3 As shown, the optical module 9 includes an upper cover 3 , a base 4 and a circuit board body 21 .

[0042] The housing of the optical module 9 includes an upper cover 3 and a base 4. The upper cover 3 covers the base 4 to form the housing having an opening 92 and an opening 93. The outer contour of the housing is generally a square.

[0043] In some embodiments of the present invention, the base 4 includes a bottom plate and two lower side plates located on both sides of the bottom plate and arranged perpendicularly to the bottom plate; the upper cover plate 3 includes a cover plate and two upper side plates located on both sides of the cover plate and arranged perpendicularly to the cover plate, and is combined with two side walls and the two side plates to achieve the upper cover plate 3 covering the base 4.

[0044] The direction of the line connecting the opening 92 and the opening 93 may be consistent with the length direction of the optical module 9, or may be inconsistent with the length direction of the optical module 9. For example, the opening 92 is located at the end of the optical module 9 ( Figure 3 The opening 93 is also located at the end of the optical module 9 ( Figure 3 Alternatively, opening 92 is located at the end of optical module 9, while opening 93 is located on the side of optical module 9. Opening 92 is an electrical port, through which the gold finger of circuit board body 21 extends and is inserted into a host computer (such as optical network terminal 6); opening 93 is an optical port, configured to receive external optical fiber 60, so that optical fiber 60 connects to the interior of optical module 9.

[0045] The combined assembly of the upper cover 3 and base 4 facilitates the installation of components such as the circuit board body 21 into the housing. The upper cover 3 and base 4 provide encapsulation and protection for these components. Furthermore, during assembly of components such as the circuit board body 21, the positioning, heat dissipation, and electromagnetic shielding components of these components are easily positioned, facilitating automated production.

[0046] In some embodiments, the upper cover 3 and the base 4 are generally made of metal materials, which are conducive to electromagnetic shielding and heat dissipation.

[0047] In some embodiments, the optical module 9 further includes an unlocking component (not shown in the figure) located on the outer wall of its shell, and the unlocking component is configured to achieve a fixed connection between the optical module 9 and the host computer, or to release the fixed connection between the optical module 9 and the host computer.

[0048] For example, the unlocking components are located on the outer walls of the two lower side panels of the base 4 and include engaging components that mate with the cage of the host computer (e.g., the cage 5 of the optical network terminal 6). When the optical module 9 is inserted into the cage of the host computer, the engaging components of the unlocking components secure the optical module 9 in the cage. When the unlocking components are pulled, the engaging components of the unlocking components move accordingly, thereby changing the connection between the engaging components and the host computer, releasing the engaging relationship between the optical module 9 and the host computer, and allowing the optical module 9 to be removed from the cage of the host computer.

[0049] The circuit board body 21 includes circuit traces, electronic components, and chips. The circuit traces connect the electronic components and chips together according to the circuit design to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include, for example, microcontroller units (MCUs), limiting amplifiers (Limiting Amplifiers), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0050] The circuit board body 21 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also achieve a load-bearing function, such as stably carrying a chip; the rigid circuit board can also be inserted into the electrical connector in the upper computer cage.

[0051] The circuit board body 21 also includes a gold finger formed on its end surface. The gold finger is composed of a plurality of independent pins. The circuit board body 21 is inserted into the cage 5, and the gold finger is connected to the electrical connector in the cage 5. The gold finger can be provided on the surface of only one side of the circuit board body 21 (for example, Figure 3The gold fingers are configured to establish electrical connections with a host computer to facilitate power supply, grounding, I2C signal transmission, data signal transmission, and more. Of course, some optical modules also use flexible printed circuit boards. These boards are generally used in conjunction with rigid printed circuit boards to complement them.

[0052] In the present invention, the Figure 1-Figure 3 In the example, the small form-factor pluggable optical module (Small Form-factor Pluggable, abbreviated as: SFP) package is mainly used for demonstration, but it should be noted that in each embodiment of the present invention, the improvement of the optical path structure and / or circuit structure in the corresponding technical solution, the applicable packaging structure includes but is not limited to dense wavelength division optical communication module (Centum gigabits Form Pluggable, abbreviated as: CFP) package, SFP package, OSFP (full name: Octal Small Form-factor Pluggable, abbreviated as: OSFP) package, QSFP (full name: Quad Small Form-factor Pluggable, abbreviated as: QSFP) package, XFP (full name: 10 Gigabit SmallForm Factor The XFP package, as well as the corresponding different models of derivative versions of the aforementioned packages, such as the CFP2 package, CFP4 package, and CFP8 package, which are derivative versions of the CFP package; and the QSFP+ package, QSFP28 package, QSFP56 package, and QSFP-DD package, which are extended versions of the QSFP package. Since the packaging of optical modules is more of a shell format customized to suit the scene size, the optical path structure and / or circuit structure theory proposed by the creative work of this invention should also be applicable to possible future packaging formats, unless there is a clear technical conflict, and therefore should be understood to be within the scope of protection of this invention.

[0053] The preceding discussion primarily describes the application scenarios and basic structure of optical modules. The present invention provides a heat-dissipating optical module that directly dissipates heat, achieving greater heat dissipation efficiency. This ensures that heat from the chip dissipates quickly and efficiently, minimizing heat accumulation and ensuring that the chip inside the module maintains its normal operating temperature. This module addresses the heat dissipation challenges associated with the increasing speed of optical modules. The following describes the specific structure of this heat-dissipating optical module, along with accompanying figures.

[0054] Embodiment 1: Embodiment 1 of the present invention provides a heat dissipation optical module, such as Figure 4 and Figure 5 As shown, it includes: a heat dissipation component 1, a circuit board component 2 and an upper cover plate 3; a first window 300 is provided on the surface of the upper cover plate 3; the heat dissipation component 1 includes a plurality of heat-conducting blocks 11, and the heat-conducting blocks 11 pass through the first window 300 and abut against the chip 20 to be cooled and arranged on the circuit board component 2 while the heat dissipation component 1 is fixed to the upper cover plate 3.

[0055] In various embodiments of the present invention, the heat conducting block 11 may be integrally formed with other parts of the heat dissipation assembly 1 (for example, by turning), or the heat conducting block 11 may be processed as a separate independent unit (for example, Figure 5 The two heat conducting blocks 11 marked in the figure are independent units), and the following can also be used: Figure 5 The hybrid method shown is that the largest chip 20 that needs to dissipate heat is formed integrally with the first heat spreader 12, while the other smaller chips 20 that need to dissipate heat are implemented using the heat conducting block 11 in the form of an independent unit (ie, the embodiment of the present invention is based on Figure 5 Implementation solution). In actual situations, which heat-conducting blocks 11 adopt independent units and which heat-conducting blocks 11 adopt one-piece molding will also consider the packaging form of the corresponding chip 20 that needs heat dissipation. For example, if the chip 20 that needs heat dissipation is packaged in a metal shell, it may be more inclined to adopt the independent unit form. The reason is that the two can be fixed by soldering, which ensures the assembly stability while reducing the processing cost of the first heat spreader 12. In actual scenarios, whether to adopt the independent unit form will also consider the consistency of the heat dissipation requirements of the chip 20 that needs heat dissipation. Here, if some chips have higher heat dissipation requirements, independent units will also be considered, and heat-conducting blocks 11 with better thermal conductivity parameters will be used as a transition to the first heat spreader 12. In actual scenarios, the high consistency of the corresponding chips 20 that need heat dissipation will also be considered. If there are multiple chips with consistent chip surface heights after being fixed on the PCB board, it will be more inclined to make one-piece heat-conducting blocks 11 for these chips. This is also to improve the overall fixing stability between the first heat spreader 12 and the PCB board.

[0056] In practical applications, the optical module further includes a base 4, the upper cover 3 and the base 4 are fixed to each other, and the circuit board assembly 2 is fixedly disposed between the base 4 and the upper cover 3; the heat conducting block 11 can be made of a metal block or other material with good thermal conductivity. In one embodiment, the heat conducting block 11 can be made of a copper block, and the heat conducting block 11 and the chip 20 to be dissipated can be fixedly connected by soldering or thermal adhesive.

[0057] In order to ensure the stability of the circuit board assembly 2 working inside the upper cover 3 and the base 4, as shown in FIG. Figure 6 and Figure 7As shown, sealing strips 40 are provided on both sides of the interior of the base 4. The sealing strips 40 are used to seal the junction between the upper cover 3 and the base 4 to prevent dust and moisture from entering the interior of the optical module, thereby ensuring the stability of the optical module. In addition, a first positioning protrusion 41 and a second positioning protrusion 42 are provided on the bottom of the inner surface of the base 4. The circuit board assembly 2 includes a circuit board body 21, which is provided with a first positioning notch 210 and a second positioning notch 211. The first positioning protrusion 41 is provided near the front end of the base, and the second positioning protrusion 42 is provided near the rear end of the base 4. The first positioning notch 210 engages with the first positioning protrusion 41, and the second positioning notch 211 engages with the second positioning protrusion 42. The first positioning protrusion 41 is provided with a screw hole 410 for fixing the upper cover 3 and the base 4.

[0058] The heat of the chip 20 to be cooled on the circuit board assembly 2 is conducted to the device located outside the heat dissipation assembly 1 through the heat conductive block 11, and the heat conducted from the chip 20 to be cooled can be dissipated to the external environment through the first window 300. Compared with the heat dissipation method of "chip 20 to be cooled-heat sink-housing-external environment" in the prior art, the heat dissipation assembly 1 is exposed from the upper cover plate 3, so that the heat can be directly conducted out, and the heat dissipation efficiency is more efficient.

[0059] In this embodiment, various combination solutions of the heat dissipation components 1 are provided for the above-mentioned solution, and each combination solution is described below.

[0060] In the first embodiment, see Figure 5 As shown, the heat dissipation assembly 1 further includes a first radiator 10 and a first vapor chamber 12. The outer surface of the upper cover 3 is provided with a first fixing area 30, and the first radiator 10 is fixed on the first fixing area 30. The first radiator 10 is provided with a plurality of heat dissipation channels. The first fixing area 30 is provided with a first window 300, and the first vapor chamber 12 is fixed at the first window 300. The upper surface of the first vapor chamber 12 abuts against the lower surface of the first radiator 10. Figure 5 and Figure 8 As shown, the first heat spreader 12 includes a first heat spreader 120 and a second heat spreader 121 from top to bottom. The first heat spreader 120 is clamped in the first window 300, and the second heat spreader 121 protrudes from the first heat spreader 120 and abuts against the inner edge of the first window 300. The heat conductive block 11 is coupled to the second heat spreader 121.

[0061] In order to improve the thermal conductivity of the first heat spreader 12, when the heat conducting block 11, the first heat spreader 120 and the second heat spreader 121 are integrally formed, capillaries and heat dissipation medium may be provided inside the heat conducting block 11, the first heat spreader 120 and the second heat spreader 121; wherein the first heat spreader 120, the second heat spreader 121 and the heat conducting block 11 are interconnected, so that the heat dissipation medium in the heat conducting block 11 that has absorbed heat can quickly flow into the first heat spreader 120 to achieve heat exchange. Capillaries are provided inside the first and second soaking stages 120, 121, and the heat conducting block 11, which can be used to drive the reflux of liquid heat dissipating medium, thereby ensuring rapid replenishment of the cold medium. The liquid medium in the second soaking stage 121 and the heat conducting block 11 is drawn to the evaporation area of ​​the first soaking stage 120 by capillary action to fill the vacancy left by vaporization. The vaporized hot medium naturally diffuses to the second soaking stage 121 and the heat conducting block 11 with a lower temperature under the action of the pressure difference and condenses without the need for additional power. The capillary structure covers the first and second soaking stages 120, 121, and the heat conducting block 11, forming a continuous reflux network.

[0062] In actual application scenarios, if the circuit structure is relatively complex, the heat conducting block 11 can be directly welded to the first heat spreader 12 to improve the convenience during installation.

[0063] For the first heat spreader 12, the volume of the second heat spreader 121 is greater than the volume of the first heat spreader 120 and greater than the volume of the heat conductive block 11. During the installation process, the first positioning notch 210 and the second positioning notch 211 of the circuit board body 21 are aligned with the first positioning protrusion 41 and the second positioning protrusion 42 respectively, the first heat spreader 12 is placed on the circuit board assembly 2, the upper cover 3 is buckled with the base 4, and the first heat spreader 120 is clamped at the first window 300 for limiting. Finally, the first radiator 10 is installed on the first fixing area 30 and fixed. The upper cover 3 and the base 4 are locked and fixed through the provided screw holes 410 to complete the installation.

[0064] The structure of the optical module provided in the first embodiment is adopted, and its heat dissipation method is: the chip 20 that needs to dissipate heat on the circuit board assembly 2 transfers the heat to the heat-conducting block 11, the heat-conducting block 11 transfers the heat to the first heat spreader 12, the first heat spreader 12 transfers the heat quickly to the first heat sink 10 through the second heat spreader 121 and the first heat spreader 120 in sequence, and the first heat sink 10 transfers the heat of the chip 20 that needs to dissipate heat to the external environment.

[0065] In the second embodiment, if Figure 9 and Figure 10As shown, the heat dissipation assembly 1 further includes a second heat spreader 13, which includes, from top to bottom, a fourth heat spreader 130 and a fifth heat spreader 131. The fifth heat spreader 131 is coupled to the heat conductive block 11. The outer surface of the upper cover 3 is provided with a first fixing area 30, and the first fixing area 30 is provided with a first window 300. The fourth heat spreader 130 is fixed to the first fixing area 30, and the fifth heat spreader 131 is embedded in the first window 300. When the fourth heat spreader 130, the fifth heat spreader 131, and the heat conductive block 11 are integrally formed and internally interconnected, the heat dissipating medium that has absorbed heat in the heat conductive block 11 can quickly flow into the fourth heat spreader 130, achieving heat exchange.

[0066] That is, in this embodiment, the fourth soaking plate 130 of the second soaking plate 13 is fixed to the exterior of the upper cover 3, and the fifth soaking plate 131 and the thermally conductive block 11 are located between the upper cover 3 and the circuit board assembly 2. In this embodiment, the first heat sink 10 is disposed in an environment external to the upper cover 3 (not shown in the figure), meaning that the first heat sink 10 is an external heat sink.

[0067] For the second heat spreader 13, the volume of the fourth heat spreader 130 is greater than the volume of the fifth heat spreader 131 and is greater than the volume of the heat conductive block 11. During the installation process, the first positioning notch 210 and the second positioning notch 211 of the circuit board body 21 are aligned with the first positioning protrusion 41 and the second positioning protrusion 42 respectively, the upper cover 3 is buckled with the base 4, the second heat spreader 13 is placed on the first fixing area 30, and the fifth heat spreader 131 and the heat conductive block 11 are passed through the first window 300 to limit the second heat spreader 13 and fix the second heat spreader 13 so that it is fixed on the upper cover 3.

[0068] The structure of the optical module provided in the second embodiment is adopted, and its heat dissipation method is: the chip 20 requiring heat dissipation on the circuit board assembly 2 conducts heat to the heat-conducting block 11, the heat-conducting block 11 conducts heat to the second heat spreader 13, and the second heat spreader 13 conducts heat to the external environment through the fifth heat spreader 131 and the fourth heat spreader 130 in sequence, and the heat is then discharged through the first radiator 10 arranged externally.

[0069] In a third embodiment, Figure 11 and Figure 12As shown, the heat dissipation assembly 1 further includes a second heat sink 15, which includes a heat dissipation portion 150 and a first heat conducting portion 151, and the heat conducting block 11 is coupled to the first heat conducting portion 151; the outer surface of the upper cover 3 is provided with a first fixing area 30, and the first fixing area 30 is provided with a first window 300, the heat dissipation portion 150 is fixedly provided on the first fixing area 30, and the first heat conducting portion 151 passes through the first window 300, so that the heat conducting block 11 abuts against the chip 20 to be cooled. Figure 12 、 Figure 13 and Figure 14 As shown, the heat dissipation structure of the heat dissipation portion 150 is a heat dissipation channel, a heat dissipation rib or a heat dissipation tooth array. The heat dissipation portion 150 and the first heat conducting portion 151 can be integrally formed.

[0070] The structure of the optical module provided in the third embodiment is adopted, and its heat dissipation method is as follows: the heat dissipation chip 20 on the circuit board assembly 2 conducts heat to the heat-conducting block 11, the heat-conducting block 11 conducts heat to the first heat-conducting part 151, the first heat-conducting part 151 conducts heat to the heat dissipation part 150, and finally the heat dissipation structure of the heat dissipation part 150 dissipates the heat to the external environment.

[0071] In the fourth embodiment, Figure 15 and Figure 16 As shown, the heat dissipation assembly 1 also includes a third heat sink 16 and a heat conducting plate 14. The heat conducting plate 14 is fixedly connected to the third heat sink 16, and the heat conducting plate 14 is fixedly connected to the heat conducting block 11. The third heat sink 16 is relatively fixed to the upper cover plate 3. The third heat sink 16 includes a top cover 160 and an array of heat dissipation fins 161. The top cover 160 covers the top of the heat dissipation fins 161. The top cover 160 and the heat dissipation fins 161 are integrally formed by die-casting. The other side of the heat dissipation fins 161 is fixedly connected to the heat conducting plate 14. The heat dissipation fins 161 can be fixedly connected to the heat conducting plate 14 by welding or gluing.

[0072] In the preferred embodiment, in order to improve the heat exchange efficiency between the heat conducting plate 14 and the heat dissipating fins 161 and improve the heat dissipation performance of the optical module, Figure 17 As shown, the upper surface of the heat conducting plate 14 is provided with a plurality of dispensing grooves 140, and the plurality of dispensing grooves 140 are arranged in an array, see Figure 18As shown, the glue dispensing groove 140 is coupled to the lower end of the heat dissipating fin 161. The width of the glue dispensing groove 140 is greater than the thickness of the heat dissipating fin 161. In one embodiment, the difference between the width of the glue dispensing groove 140 and the thickness of the heat dissipating fin 161 can be 0.1mm-0.4mm. The gap between the glue dispensing groove 140 and the heat dissipating fin 161 can be filled with thermally conductive glue for fixation.

[0073] The structure of the optical module provided in the fourth embodiment is adopted, and its heat dissipation method is as follows: the chip 20 requiring heat dissipation on the circuit board assembly 2 transfers the heat to the heat-conducting block 11, the heat-conducting block 11 transfers the heat to the heat-conducting plate 14, and the heat-conducting plate 14 transfers the heat to the external environment through the heat dissipation fins 161 and the top cover 160 in sequence.

[0074] In order to measure the actual chip surface temperature in the actual temperature test of the high-speed module without destroying the chip heat dissipation channel inside the module, such as Figure 19 and Figure 20a As shown, the heat dissipation component 1 is provided with one or more longitudinal through holes 102, and the longitudinal through holes 102 pass through the heat dissipation component 1 and are connected to the surface of the chip to be cooled. A sensor is provided inside the longitudinal through hole 102. In one embodiment, the diameter of the longitudinal through hole 102 is 0.3mm-0.5mm. By providing the longitudinal through holes 102 on the surface of the radiator and placing the sensor inside the longitudinal through hole 102, the sensor can detect the longitudinal temperature change of the entire heat dissipation component, thereby providing more objective detection parameters for the size, shape, orientation, etc. of each layer of heat sink in the heat dissipation component, thereby providing a basis for designing and adjusting the heat dissipation component. Several heat sink solutions are provided below.

[0075] In one embodiment, see Figure 20a As shown, the sensor is a thermocouple sensor 105, which is in contact with the heat dissipation chip 20 on the circuit board assembly 2. A temperature probe is provided at the lower end of the thermocouple sensor 105, which is simplified as a circle in the figure. The thermocouple sensor 105 is used to measure the temperature of the heat dissipation chip 20, wherein the position of the longitudinal through hole 102 can be set corresponding to the heat dissipation chip 20. Figure 20b As shown, in the preferred embodiment, a test hole mark 1020 can be set at the position of the longitudinal through hole 102 on the surface of the radiator to accurately identify the position of placing the thermocouple sensor 105, wherein the test hole mark 1020 can be a circular ring as shown in the figure, wherein the longitudinal through hole 102 is located at the center of the ring, or a circular groove can be opened at the location of the longitudinal through hole 102 for marking and identification, or other applicable marking methods, which are not specifically limited here.

[0076] In a preferred embodiment, the sensor is specifically a sensing optical fiber whose head is made of at least three sections of customized length gratings, wherein the first section grating 1021 is used to reflect the light signal of the first wavelength λ1, the second section grating 1022 is used to reflect the light signal of the second wavelength λ2, and the third section grating 1023 is used to reflect the light signal of the second wavelength λ3; wherein the lengths of the first section grating 1021, the second section grating 1022 and the third section grating 1023 are determined by the thickness of the structural member divided in the longitudinal direction of the heat dissipation component 1.

[0077] Based on the above preferred scheme, an embodiment of the present invention provides an optimization method for a heat dissipation optical module based on a sensing optical fiber, including: controlling the signal transceiver end of the sensing optical fiber to synchronously or time-share send an optical signal of a first wavelength λ1, an optical signal of a second wavelength λ2, and an optical signal of a third wavelength λ3, and analyzing the detected temperature of each structural component in the longitudinal direction of the heat dissipation component 1 according to the offset of the central wavelength of the reflected optical signal; thereby adjusting the size of each structural component to obtain the final structural size of the heat dissipation component 1.

[0078] In the embodiment of the present invention, in addition to providing the principle description of the above-mentioned optimization method, an optimization method for a heat dissipation optical module is also provided. This optimization method is applicable to the corresponding optical module design stage. How to achieve the optimal material cost without performance degradation through the method of the embodiment of the present invention? As described in the above embodiment, the scenario applicable to the method of this embodiment is a sensor. The sensor is specifically a sensing optical fiber with a head made of at least three sections of customized length gratings, wherein, Figure 21 As shown (it should be noted that Figure 21 Just refer to Figure 19 The heat dissipation assembly is shown in the cross-sectional view of the sensor optical fiber layout structure. For those skilled in the art, it can also be arranged to a similar Figure 5 、 Figure 9 、 Figure 11 、 Figure 14 、 Figure 15 heat dissipation component scenario, and the corresponding number of grating segments can be matched according to the difference in the number of layers of the heat dissipation component in different scenarios, which will not be described in detail here), the first grating 1021 is used to reflect the light signal of the first wavelength λ1, the second grating 1022 is used to reflect the light signal of the second wavelength λ2, and the third grating 1023 is used to reflect the light signal of the second wavelength λ3; wherein the lengths of the first grating 1021, the second grating 1022 and the third grating 1023 are determined by the thickness of the structural member divided in the longitudinal direction of the heat dissipation component 1 (it should be noted that this is an original optimization solution of the present invention, which cannot be supported by the thermocouple sensor 105 introduced in the above embodiment), as Figure 21 Shown, including: In step 201, the signal transceiver end of the sensing optical fiber is controlled to synchronously or time-share transmit an optical signal of a first wavelength λ1, an optical signal of a second wavelength λ2, and an optical signal of a third wavelength λ3.

[0079] Whether the signals are sent synchronously or in time-sharing depends mainly on whether the signal transceiver uses multiple transmitters and receivers (in which case synchronous transmission is used) or uses a single tunable laser to transmit the optical signal of the first wavelength λ1, the optical signal of the second wavelength λ2, and the optical signal of the third wavelength λ3 (in which case time-sharing transmission is used).

[0080] In step 202 , the detected temperatures of the various structural components in the longitudinal direction of the heat dissipation assembly 1 are analyzed based on the shift of the central wavelength of the reflected optical signal.

[0081] In essence, it still utilizes optical signals of different wavelengths, which will only be reflected in the adapted grating area. Thus, the reflection of the optical signal of the first wavelength λ1, the optical signal of the second wavelength λ2 and the optical signal of the third wavelength λ3 is limited, and the corresponding central wavelength offset reflects the temperature condition of the corresponding grating area.

[0082] In step 203 , the dimensions of each structural component are adjusted to obtain the final structural dimensions of the heat dissipation assembly 1 .

[0083] In addition, the structural dimensions of the final heat dissipation assembly 1 show various situations in the above embodiments, for example: Figure 5-Figure 8 The first heat sink 10 and the first heat spreader 12 are shown as Figure 9 and Figure 10 The second heat sink 13 shown in FIG. Figure 11-14 The second radiator 15 shown, and Figure 15-18 The third heat sink 16 and the heat conducting plate 14 are shown. Further, as an optional implementation of the present invention, Figure 21 It also represents a region including a fourth grating 1024 and a matching optical signal detection region of the fourth wavelength λ4, thereby performing more detailed detection of the region of the heat dissipation component 1 to match the needs of the actual scenario.

[0084] The optimization method of the embodiment of the present invention can be further combined with simulation software to achieve a more accurate structural design of the optical module. Furthermore, the technical solution of the present invention can also be used to optimize the relevant parameter configurations in the simulation software, forming a closed loop of technical logic. Of course, in the implementation process of the embodiment of the present invention, the size of the corresponding longitudinal through-hole 102 must be as small as possible. Furthermore, when inserting the sensing optical fiber into the longitudinal through-hole 102, it is also necessary to pre-fill the longitudinal through-hole 102 with thermal conductive adhesive to improve the accuracy of the entire detection process.

[0085] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A heat dissipation optical module, characterized in that: include: A heat dissipation component (1), a circuit board component (2) and an upper cover plate (3); a first window (300) is provided on the surface of the upper cover plate (3); The heat dissipation assembly (1) comprises a plurality of heat-conducting blocks (11). The heat-conducting blocks (11) are fixed to the upper cover plate (3) and, while passing through the first window (300), abut against the corresponding chip (20) to be cooled and arranged on the circuit board assembly (2).

2. The heat dissipation optical module according to claim 1, characterized in that: The heat dissipation assembly (1) further comprises a first heat sink (10) and a first heat spreader (12); the outer surface of the upper cover plate (3) is provided with a first fixing area (30), and the first heat sink (10) is fixed on the first fixing area (30); the first fixing area (30) is provided with a first window (300), and the first heat spreader (12) is fixed at the first window (300), and the upper surface of the first heat spreader (12) abuts against the lower surface of the first heat sink (10).

3. The heat dissipation optical module according to claim 2, characterized in that: The first heat spreader (12) includes a first heat spreader (120) and a second heat spreader (121) from top to bottom, the first heat spreader (120) is snapped into the first window (300), the portion of the second heat spreader (121) protruding from the first heat spreader (120) abuts against the inner edge of the first window (300), and the heat conducting block (11) is coupled to the second heat spreader (121).

4. The heat dissipation optical module according to claim 1, wherein: The heat dissipation assembly (1) further includes a second heat spreader (13), the second heat spreader (13) including, from top to bottom, a fourth heat spreader (130) and a fifth heat spreader (131), the fifth heat spreader (131) being coupled to the heat conducting block (11); The outer surface of the upper cover plate (3) is provided with a first fixing area (30), the first fixing area (30) is provided with the first window (300), the fourth heat equalizing platform (130) is fixed on the first fixing area (30), and the fifth heat equalizing platform (131) is embedded in the first window (300).

5. The heat dissipation optical module according to claim 1, characterized in that: The heat dissipation assembly (1) further comprises a second heat sink (15), the second heat sink (15) comprising a heat dissipation portion (150) and a first heat conduction portion (151), and the heat conduction block (11) is coupled to the first heat conduction portion (151); The outer surface of the upper cover plate (3) is provided with a first fixed area (30), the first fixed area (30) is provided with a first window (300), the heat dissipation portion (150) is fixedly provided on the first fixed area (30), and the first heat conduction portion (151) passes through the first window (300), so that the heat conduction block (11) abuts against the chip (20) to be cooled.

6. The heat dissipation optical module according to claim 1, characterized in that: The heat dissipation assembly (1) further comprises a third heat sink (16) and a heat conducting plate (14), wherein the heat conducting plate (14) is fixedly connected to the third heat sink (16), the heat conducting plate (14) is fixedly connected to the heat conducting block (11), and the third heat sink (16) is relatively fixed to the upper cover plate (3).

7. The heat dissipation optical module according to claim 6, characterized in that: The third radiator (16) comprises a top cover (160) and arrayed heat dissipation fins (161), wherein the top cover (160) covers the top of the heat dissipation fins (161), and the top cover (160) and the heat dissipation fins (161) are integrally formed by die-casting, and the other side of the heat dissipation fins (161) is fixedly connected to the heat conducting plate (14).

8. The heat dissipation optical module according to any one of claims 1 to 7, characterized in that: The heat dissipation component (1) is provided with one or more longitudinal through holes (102), the longitudinal through holes (102) passing through the heat dissipation component (1) and communicating with the surface of the chip to be dissipated heat, and a sensor is provided inside the longitudinal through hole (102).

9. The heat dissipation optical module according to claim 8, characterized in that: The diameter of the longitudinal through hole (102) is 0.3 mm to 0.5 mm.

10. The heat dissipation optical module according to claim 8, characterized in that: The sensor is a thermocouple sensor (105), the thermocouple sensor (105) is in contact with the chip (20) requiring heat dissipation on the circuit board assembly (2), and the thermocouple sensor (105) is used to measure the temperature of the chip (20) requiring heat dissipation.

11. The heat dissipation optical module according to claim 8, characterized in that: The sensor is specifically a sensing optical fiber whose head is made of at least three sections of gratings with customized lengths, wherein the first section of the grating (1021) is used to reflect a light signal of a first wavelength λ1, the second section of the grating (1022) is used to reflect a light signal of a second wavelength λ2, and the third section of the grating (1023) is used to reflect a light signal of a second wavelength λ3; wherein the lengths of the first section of the grating (1021), the second section of the grating (1022), and the third section of the grating (1023) are determined by the thickness of the structural member divided in the longitudinal direction of the heat dissipation component (1).

12. A method for optimizing a heat dissipation optical module, applicable to the heat dissipation optical module according to claim 11, characterized in that: include: The signal transceiver end of the sensing optical fiber is controlled to synchronously or time-share transmit an optical signal of a first wavelength λ1, an optical signal of a second wavelength λ2, and an optical signal of a third wavelength λ3, and the detected temperature of each structural component in the longitudinal direction of the heat dissipation component (1) is analyzed based on the offset of the central wavelength of the reflected optical signal; thereby adjusting the size of each structural component to obtain the final structural size of the heat dissipation component (1).

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