Temperature control method, BMC (Baseboard Management Controller) and related equipment

Abstract

The invention discloses a temperature control method, a BMC and related equipment, and relates to the technical field of computers. For a newly introduced component, the BMC can obtain description information and actual working temperature of the component, and the description information comprises target working temperature or alarm temperature of the component. Wherein the target working temperature refers to the expected temperature when the first assembly works normally; the alarm temperature refers to the temperature for triggering the alarm for the first component. And then, the BMC generates a first temperature control strategy for the first component according to the description information, and controls the first temperature adjusting part according to the first temperature control strategy and the actual working temperature of the first component. Therefore, the BMC can automatically generate the strategy adopted for temperature regulation and control of the component, and temperature regulation and control of the component are realized according to the strategy, so that operation and maintenance personnel do not need to update the version of the BMC for the component, and the operation and maintenance difficulty of the operation and maintenance personnel for the BMC can be reduced.

Description

Technical Field

[0001] The present application relates to the field of computer technology, and in particular to a temperature control method, a BMC, and related equipment. Background Art

[0002] Currently, computing devices often include multiple replaceable components. For example, a server typically includes field-replaceable units (FRUs), such as network cards, redundant arrays of independent disks (RAID), and graphics processing units (GPUs).

[0003] In practical applications, each component on a computing device must operate within a certain temperature range to function properly. Excessively high or low temperatures can damage the components. Therefore, the baseboard management controller (BMC) within the computing device controls the temperature control components according to pre-configured policies to ensure that the components on the computing device can operate at a normal temperature. For example, if the temperature of a component on the computing device is detected to be too high, the BMC can control the fan to rotate at a higher speed according to the pre-configured policy to improve the fan's cooling effect, thereby reducing the temperature of the component.

[0004] Because different components on a computing device typically have different operating temperatures during normal operation, the BMC needs to be updated whenever a new component is introduced to the device so that the temperature control strategy used by the updated BMC can adapt to the newly introduced component. However, as different components are introduced to a computing device, frequent BMC updates are required, which increases the workload of adapting these components on the computing device and increases the difficulty of BMC operation and maintenance. Summary of the Invention

[0005] This application provides a temperature control method to achieve component temperature control while avoiding frequent BMC version updates and reducing the difficulty of BMC operation and maintenance. In addition, this application also provides a BMC, a single board, a computing device, a computer-readable storage medium, and a computer program product.

[0006] In the first aspect, the present application provides a temperature control method that can be applied to a BMC. For a newly introduced first component (such as an accelerator card, a network card, or a hard disk), the BMC will obtain the description information and the actual operating temperature of the first component. The description information includes the target operating temperature or the alarm temperature of the first component. The target operating temperature refers to the temperature that the first component is expected to reach when it is working normally; the alarm temperature refers to the temperature at which the alarm is triggered for the first component, that is, when the temperature of the first component reaches the alarm temperature, the BMC can trigger the alarm. Then, the BMC generates a first temperature control strategy for the first component based on the obtained description information. The first temperature control strategy can be used to indicate the temperature control direction for the first component, so that the BMC can control the first temperature control component according to the first temperature control strategy and the actual operating temperature of the first component. The first temperature control component can be, for example, a fan, a liquid cooling radiator, or a heating plate, etc., for adjusting the temperature of the first component. In addition, different types of first temperature control components can be used to perform different temperature controls on the first component. A first temperature control component such as a fan, a liquid cooling radiator, etc. can cool the first component; a first temperature control component such as a heating plate, etc. can heat the first component.

[0007] In this way, for the newly introduced first component, the BMC can automatically generate a strategy (i.e., a first temperature control strategy) for temperature control of the first component based on the target operating temperature or alarm temperature of the first component, so that during the operation of the first component, according to the automatically generated strategy and the actual operating temperature of the first component, the temperature control component is controlled to adjust the temperature of the first component to avoid the temperature of the first component reaching the alarm temperature. That is, the BMC can automatically generate a strategy to adapt to the temperature control of the first component. In this way, in the process of introducing a new component on the computing device, the operation and maintenance personnel do not need to update the BMC version, thereby reducing the workload required for the operation and maintenance personnel to adapt the new component on the computing device and reducing the operation and maintenance difficulty of the operation and maintenance personnel for the BMC.

[0008] In one possible embodiment, the first temperature control component is used to lower the temperature of the first component. For example, the first temperature control component may be a fan or a liquid cooling radiator. Thus, when the BMC controls the first temperature control component based on the first temperature control strategy and the actual operating temperature of the first component, specifically when the actual operating temperature of the first component exceeds the alarm temperature (indicating that the temperature of the first component is too high), the BMC may send a temperature reduction instruction to the first temperature control component, instructing the first temperature control component to lower the temperature of the first component. In this way, if the temperature of the first component is too high, the BMC can send a temperature reduction instruction to the first temperature control component, causing the first temperature control component to lower the temperature of the first component, thereby reducing the temperature of the first component and preventing the first component from being overheated and affecting its operation or causing damage to the first component.

[0009] In one possible embodiment, the first temperature control component is used to increase the temperature of the first component. For example, the first temperature control component may be a heater, etc. Thus, when the BMC controls the first temperature control component based on the first temperature control strategy and the actual operating temperature of the first component, specifically when the actual operating temperature of the first component falls below the alarm temperature (indicating that the temperature of the first component is too low), the BMC may send a temperature increase instruction to the first temperature control component, instructing the first temperature control component to increase the temperature of the first component. In this way, if the temperature of the first component is too low, the BMC can control the first temperature control component to increase the temperature of the first component by sending a temperature increase instruction to the first temperature control component, thereby preventing the first component from being too low and affecting its operation or causing it to freeze.

[0010] In one possible implementation, a first component is located on a computing device, which also includes a second component (in actual application, the computing device may include any number of components). The BMC may also obtain description information of the second component and the actual operating temperature of the second component, where the description information of the second component includes the target operating temperature or alarm temperature of the second component. Furthermore, the BMC may generate a second temperature control policy for the second component based on the description information of the second component. When controlling the first temperature control component, the BMC may specifically control the first temperature control component based on the first temperature control policy, the second temperature control policy, the actual operating temperature of the first component, and the actual operating temperature of the second component. In this way, the BMC can achieve comprehensive temperature control of multiple components by comprehensively considering the actual operating temperatures and temperature control policies of multiple components, thereby avoiding the situation where the temperatures of some components are too low or too high during the control of the temperature control components, and ensuring that each component operates within an appropriate temperature range.

[0011] In one possible implementation, the first temperature control component may be a fan. When the BMC controls the first temperature control component based on the first temperature control strategy, the second temperature control strategy, the actual operating temperature of the first component, and the actual operating temperature of the second component, it may first determine a first speed for the fan based on the first temperature strategy and the actual operating temperature of the first component, and then determine a second speed for the fan based on the second temperature strategy and the actual operating temperature of the second component. Then, when the first speed is greater than the second speed, the BMC controls the fan speed to the first speed. In this way, the BMC can control the fan to rotate at an appropriate speed by comprehensively considering the actual operating temperatures of multiple components and the temperature control strategies, thereby enabling the fan to maintain the temperature of each component within a normal temperature range.

[0012] In one possible embodiment, the first temperature control component may be a liquid cooling radiator. When the BMC controls the first temperature control component based on the first temperature control strategy, the second temperature control strategy, the actual operating temperature of the first component, and the actual operating temperature of the second component, it may first determine a first flow rate for the liquid cooling radiator based on the first temperature strategy and the actual operating temperature of the first component, and then determine a second flow rate for the liquid cooling radiator based on the second temperature strategy and the actual operating temperature of the second component. Then, when the first flow rate is greater than the second flow rate, the BMC controls the liquid cooling flow rate of the liquid cooling radiator to the first flow rate. In this way, the BMC can control the flow of liquid used for liquid cooling in the liquid cooling radiator to an appropriate flow rate by comprehensively considering the actual operating temperatures of multiple components and the temperature control strategies, thereby enabling the temperature of each component to be maintained within a normal temperature range using the liquid cooling radiator.

[0013] In one possible implementation, a computing device includes not only a first component, a second component, and a first temperature control component, but also a second temperature control component and a third component. The BMC uses the first temperature control component to adjust the temperature of the first and second components located in the first area according to the first and second temperature control policies. Furthermore, the BMC uses the second temperature control component to adjust the temperature of the third component located in the second area according to a third temperature control policy generated for the third component. In this way, the BMC can use different temperature control components to control the temperature of components in different areas, so that the components in each area can be maintained within a normal temperature range.

[0014] In one possible implementation, the first component includes a persistent storage medium that stores description information of the first component. Therefore, when the BMC obtains the description information of the first component, it may specifically read the description information from the persistent storage medium in the first component. In this way, the BMC can effectively regulate the temperature of the first component based on the obtained description information of the first component, so that the first component can continue to operate within a normal temperature range.

[0015] In a second aspect, the present application provides a BMC, which includes an acquisition module for acquiring description information and an actual operating temperature of a first component, the description information including a target operating temperature or an alarm temperature of the first component, the target operating temperature being the temperature expected to be reached when the first component is operating normally, and the alarm temperature being used to indicate the temperature at which an alarm is triggered for the first component; a generation module for generating a first temperature control strategy for the first component based on the description information; and a control module for controlling a first temperature adjustment component based on the first temperature control strategy and the actual operating temperature of the first component, the first temperature adjustment component being used to adjust the temperature of the first component.

[0016] In one possible embodiment, the first temperature adjustment component is used to lower the temperature of the first component; the control module is used to send a temperature reduction instruction to the first temperature adjustment component when the actual operating temperature is higher than the alarm temperature, and the temperature reduction instruction is used to instruct the first temperature adjustment component to lower the temperature of the first component.

[0017] In one possible embodiment, the first temperature adjustment component is used to increase the temperature of the first component; the control module is used to send a temperature increase instruction to the first temperature adjustment component when the actual operating temperature is lower than the alarm temperature, and the temperature increase instruction is used to instruct the first temperature adjustment component to increase the temperature of the first component.

[0018] In one possible embodiment, the first component is located in a computing device, and the computing device also includes a second component; the acquisition module is further used to obtain description information of the second component and the actual operating temperature of the second component, and the description information of the second component includes the target operating temperature or alarm temperature of the second component; the generation module is further used to generate a second temperature control strategy for the second component based on the description information of the second component; the control module is specifically used to control the first temperature adjustment component according to the first temperature control strategy, the second temperature control strategy, the actual operating temperature of the first component and the actual operating temperature of the second component.

[0019] In one possible embodiment, the first temperature control component includes a fan; a control module is specifically used to: determine a first speed for the fan based on a first temperature strategy and the actual operating temperature of the first component; determine a second speed for the fan based on a second temperature strategy and the actual operating temperature of the second component; when the first speed is greater than the second speed, control the fan speed to the first speed.

[0020] In one possible embodiment, the first temperature control component includes a liquid-cooled radiator; the control module is specifically used to: determine a first flow rate for the liquid-cooled radiator based on a first temperature strategy and the actual operating temperature of the first component; determine a second flow rate for the liquid-cooled radiator based on a second temperature strategy and the actual operating temperature of the second component; when the first flow rate is greater than the second flow rate, control the liquid cooling flow rate of the liquid-cooled radiator to the first flow rate.

[0021] In one possible embodiment, the computing device further includes a second temperature control component and a third component. The BMC uses the first temperature control component to adjust the temperatures of the first component and the second component located in the first area according to the first temperature control strategy and the second temperature control strategy. In addition, the BMC uses the second temperature control component to adjust the temperature of the third component located in the second area according to the third temperature control strategy generated for the third component.

[0022] In a possible implementation, the first component includes a persistent storage medium, which is used to store description information of the first component; and the acquisition module is specifically used to read the description information of the first component from the persistent storage medium.

[0023] The BMC provided in the second aspect corresponds to the temperature control method in the first aspect. Therefore, the technical effects of the second aspect and any implementation method of the second aspect can be referred to the relevant description of the technical effects of the corresponding implementation method in the first aspect, and will not be repeated here.

[0024] In a third aspect, the present application provides a BMC, comprising a power supply circuit and a processing circuit. The power supply circuit is used to supply power to the processing circuit, and the processing circuit is used to execute the temperature control method in the first aspect or any implementation of the first aspect.

[0025] In a fourth aspect, the present application provides a single board, the single board including a BMC, the BMC being configured to execute the temperature control method of the first aspect or any implementation of the first aspect. For example, the single board may be a main board, an expansion board, or the like, without limitation.

[0026] In a fifth aspect, the present application provides a computing device, which includes a BMC, and the BMC is used to execute the temperature control method in the first aspect or any implementation of the first aspect.

[0027] In a sixth aspect, the present application provides a computer-readable storage medium, which stores instructions. When the computer-readable storage medium is run on a computing device, the computing device executes the operating steps of the temperature control method described in the first aspect or any implementation of the first aspect.

[0028] In a seventh aspect, the present application provides a computer program product comprising instructions, which, when executed on a computing device, enables the computing device to execute the operating steps of the temperature control method described in the first aspect or any one of the implementations of the first aspect.

[0029] Based on the implementation methods provided in the above aspects, this application can also be further combined to provide more implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 A schematic diagram of the structure of an exemplary computing device provided in this application;

[0031] Figure 2 A schematic flow chart of a temperature control method provided in this application;

[0032] Figure 3 Automatically generate temperature control strategies and temperature control schematics for multiple components of the BMC 101;

[0033] Figure 4 A schematic diagram of the structure of a BMC provided in this application. DETAILED DESCRIPTION

[0034] To reduce the operational difficulty for maintenance personnel regarding the BMC when introducing new components on a computing device, this application provides a temperature control method. For a newly introduced component on a computing device, the BMC can automatically generate a temperature control strategy for that component and regulate the temperature of the component according to the strategy to prevent the temperature of the first component from reaching an alarm temperature. In this way, maintenance personnel do not need to update the BMC version when introducing a new component on a computing device. This reduces the workload required for maintenance personnel to adapt the new component to the computing device and reduces the operational difficulty for maintenance personnel regarding the BMC.

[0035] The technical solution in this application will be described below in conjunction with the drawings provided in this application.

[0036] See also Figure 1 , shows a schematic diagram of the structure of a computing device. Figure 1 As shown, the computing device 10 includes a BMC 101, a plurality of temperature control components, and a plurality of components. Figure 1 The temperature control component 102 and the temperature control component 103, and components 1 to N (N is a positive integer greater than 1) are used as an example for description. In addition, different hardware components in the computing device 10 can be connected via a bus, such as a Peripheral Component Interconnect Express (PCIe) bus or other types of bus connections.

[0037] Among them, the components in the computing device 10 (including adjustment components 1 to N) can specifically be components based on hardware implementation, such as a network card, a processor, a memory, or an accelerator card. Among them, the processor can be, for example, a central processing unit (CPU), or can be other types of processors such as an application-specific integrated circuit (ASIC). The memory can be, for example, dual inline memory modules (DIMM), double data rate synchronous dynamic random-access memory (DDR), and high bandwidth memory (HBM). The accelerator card can be, for example, a GPU, a neural-network processing unit (NPU), or a data processing unit (DPU). Different components can have the same or different functions.

[0038] For example, the components in the computing device 10 may include a persistent storage medium and a temperature sensor. Figure 1 The example in which component N includes a persistent storage medium and a temperature sensor is taken, and other components are similar. The persistent storage medium in component N is used to persistently store data, and can be a medium that can achieve persistent storage of data, such as an electrically erasable programmable read only memory (EEPROM), a flash memory, etc., and is not limited to this. The temperature sensor is used to measure the temperature of component N. In actual application, component N may also include other components, such as a controller ( Figure 1(not shown), the controller can be used to control component N to execute corresponding logic, such as data calculation, task scheduling, etc.

[0039] The temperature control component (including the temperature control component 102 and the temperature control component 103) refers to the hardware used for temperature control, such as a fan, a liquid cooling radiator, and a heating plate. Among them, the temperature control components such as the fan and the liquid cooling radiator can be used to cool the components in the computing device 10 to prevent the components from being damaged by overheating. The temperature control components such as the heating plate can be used to heat the components in the computing device 10 to prevent the components from being damaged by freezing due to the low temperature. And, as Figure 1 As shown, temperature control components 102 and 103 can be responsible for regulating the temperatures of components in different zones. Specifically, temperature control component 102 is used to regulate the temperatures of components 1 to X (where X is a positive integer less than N) located in zone 1, while temperature control component 103 is used to regulate the temperatures of components X+1 to N located in zone 2. This means that the operating states of temperature control components 102 and 103 can differ. Alternatively, temperature control components 102 and 103 can jointly regulate the temperatures of all components, and the operating states of temperature control components 102 and 103 can remain consistent.

[0040] The BMC 101 can monitor the temperature of components 1 to N in the computing device 10 , and when the temperature of a component is too high or too low, adjust the temperature of the component using the temperature adjustment component 102 and the temperature adjustment component 103 .

[0041] In actual application scenarios, if the BMC 101 controls the temperature of multiple components in the computing device 10 based on a fixed configuration policy, when a new component is introduced into the computing device 10, the fixed configuration policy in the BMC 101 may not meet the temperature control requirements of the newly introduced component. For example, when the BMC 101 controls the temperature of a component based on the policy, it is easy to cause the temperature of the component to be too high or too low, thereby affecting the operating performance of the component. For this reason, every time a new component is introduced into the computing device 10, the operation and maintenance personnel need to update the version of the BMC 101 so that the policy for temperature control in the BMC 101 can adapt to the newly introduced component. This means that when the computing device 10 introduces multiple different components one after another, the operation and maintenance personnel need to frequently update the version of the BMC 101, which will increase the workload of adapting the component on the computing device 10 and increase the difficulty of operation and maintenance of the BMC 101.

[0042] Based on this, Figure 1 In the computing device 10 shown, the BMC 101 can automatically generate a temperature control policy for newly introduced components, so as to avoid the operation and maintenance personnel from frequently updating the version of the BMC 101.

[0043] In specific implementation, taking the newly introduced component as component N as an example, the description information of component N can be stored in the persistent storage medium. For example, before component N is connected to the computing device 10, the description information can be written to the persistent storage medium. In this way, when component N is connected to the computing device 10, the BMC 101 can obtain the description information of component N from the persistent storage medium in component N. The description information includes the temperature that component N is expected to reach when it is working normally, that is, the target operating temperature. Alternatively, the description information includes the alarm temperature of component N, that is, when the temperature of component N reaches the alarm temperature, it indicates that the temperature of component N is too high or too low, and a corresponding alarm needs to be issued for component N. Alternatively, the description information can include both the target operating temperature and the alarm temperature. Then, the BMC 101 can generate a temperature control strategy for component N based on the description information of component N. BMC 101 can monitor the actual operating temperature of component N and control the temperature control component 103 based on the generated temperature control strategy and the actual operating temperature obtained by monitoring, so as to adjust the temperature of component N using temperature control component 103 so that the temperature of component N remains near the target operating temperature (and does not reach the alarm temperature).

[0044] In this way, for the newly introduced component N, BMC 101 can automatically generate a temperature control strategy based on the target operating temperature and alarm temperature (or one of the temperature information) of component N, and regulate the temperature of component N according to the temperature control strategy. There is no need for operation and maintenance personnel to update the version of BMC 101. This can effectively reduce the workload required for operation and maintenance personnel to adapt new components on the computing device 10, and reduce the operation and maintenance difficulty of BMC 101 for operation and maintenance personnel.

[0045] It is worth noting that the above Figure 1 The computing device 10 shown is for illustrative purposes only and is not intended to be limiting. For example, other computing devices may include only one temperature control component or a greater number of temperature control components. This application does not limit the specific architecture of the computing device in which the BMC 101 resides.

[0046] For ease of understanding, an embodiment of the temperature control method provided in this application is described below in conjunction with the accompanying drawings.

[0047] See also Figure 2 , Figure 2 A flow chart of a temperature control method provided in an embodiment of the present application, which can be applied to Figure 1 The computing device 10 described above may be applied to other applicable computing devices. Figure 1The computing device 10 shown is used as an example for illustrative purposes, and Figure 2 The temperature control method shown is based on an example in which a component N is introduced into the computing device 10 .

[0048] in, Figure 2 The temperature control method shown may specifically include:

[0049] S201 : The BMC 101 obtains description information of a component N, which includes a target operating temperature or an alarm temperature of the component N. The target operating temperature is a temperature that the component N is expected to reach when operating normally, and the alarm temperature is a temperature that triggers an alarm for the component N.

[0050] In this embodiment, it is assumed that component N is newly introduced into computing device 10. Because component N has temperature requirements during operation, that is, if the temperature of component N is too high or too low, component N may be damaged. Therefore, before performing temperature control on the newly introduced component N, BMC 101 may first obtain relevant information about the temperature of component N.

[0051] In a first possible implementation, before component N is connected to the computing device 10, the component N may save its description information in a persistent storage medium configured by the component N, such as writing the description information to a designated storage area in the persistent storage medium. The description information of component N may include a target operating temperature and an alarm temperature, such as Figure 3 As shown. The target operating temperature is used to indicate the temperature that component N is expected to reach during normal operation; the alarm temperature is used to indicate the temperature at which an alarm is triggered for component N, such as the temperature reached when the alarm needs to be triggered because the temperature of component N is too high or too low (or is about to be too high or too low). In addition, component N can provide an out-of-band read and write interface. In this way, after component N is connected to the computing device 10, the BMC 101 can read the description information of component N from the persistent storage medium through the read and write interface to determine the temperature at which component N operates normally and the temperature threshold that affects the normal operation of the component.

[0052] In a second possible implementation, after component N is connected to computing device 10, BMC 101 may send a command to component N, instructing component N to feedback description information. Component N, in response to the command, feedbacks a response message to BMC 101, so that BMC 101 can parse the response message to obtain description information of component N, including the target operating temperature and the alarm temperature.

[0053] In the above various implementations, description information including the target operating temperature and the alarm temperature is used as an example for description. In other implementations, the description information may include either the target operating temperature or the alarm temperature, and this is not limited.

[0054] When the description information includes both the target operating temperature and the alarm temperature, the target operating temperature and the alarm temperature can indicate an appropriate temperature range within which the component N can operate normally.

[0055] In actual applications, the description information obtained by the BMC 101 may include not only the target operating temperature and the alarm temperature (or one of the temperature information), but also other information related to the component N. For example, a temperature sensor may be configured in the component N connected to the computing device 10, and the temperature sensor may be used to collect the temperature of the component N. In this case, the description information obtained by the BMC 101 may also include the address of the temperature sensor in the computing device 10. In this way, the BMC 101 can subsequently access the temperature sensor according to the address in the description information to obtain real-time temperature data of the component N. Of course, the description information may also include other types of information, and this is not limited to this.

[0056] S202: The BMC 101 generates a temperature control strategy 1 for component N according to the description information of component N.

[0057] After obtaining the description information, the BMC 101 may generate a temperature control strategy 1 for regulating the temperature of the component N according to the target operating temperature and the alarm temperature (or one of the temperature information) in the description information.

[0058] In a specific implementation, the description information obtained by BMC 101 may be in a first format, and BMC 101 may generate a temperature control policy in a second format based on the obtained description information for application and management by BMC 101. The first format may be, for example, a document format or a file format; and the second format may be, for example, a binary format or an extensible markup language (XML) format, etc., which are not limited thereto.

[0059] For example, Figure 3As shown, the temperature control policy 1 generated by BMC 101 may include the identifier of component N (such as its name), the address of the temperature sensor in component N, the target operating temperature, and the alarm temperature. In actual applications, the temperature control policy 1 generated by BMC 101 may also be implemented in other ways, which are not limited to this. Accordingly, when the description information includes one of the target operating temperature and the alarm temperature, the temperature control policy 1 generated by BMC 101 based on the description information may also include only one of the target operating temperature and the alarm temperature.

[0060] The temperature control strategy 1 may be used to indicate the temperature control direction for the component N. For example, when the temperature of the component N is greater than the warning temperature in the temperature control strategy 1, the temperature control strategy 1 may be used to determine whether to reduce the temperature of the component N (below the warning temperature).

[0061] S203: The BMC 101 obtains the actual operating temperature of the component N.

[0062] In actual application scenarios, component N generates heat during operation. This heat accumulation causes the temperature of component N to gradually increase, potentially exceeding the maximum temperature (alarm temperature) that component N can withstand. Alternatively, component N may be affected by a low-temperature environment during operation, causing the temperature of component N to gradually decrease, potentially dropping to the minimum temperature (alarm temperature) that component N can withstand. Therefore, BMC 101 can obtain the actual operating temperature of component N so as to timely control the temperature of component N based on the actual operating temperature of component N.

[0063] As a first implementation example, component N may include a temperature sensor, which may be used to measure the temperature of component N. Furthermore, the temperature sensor may send the measured actual operating temperature to BMC 101 so that BMC 101 can obtain the actual operating temperature of component N in real time.

[0064] As a second implementation example, after measuring the temperature of component N, the temperature sensor in component N can write the measured actual operating temperature of component N to a persistent storage medium, so that the BMC 101 can periodically access the persistent storage medium to obtain the actual operating temperature of component N.

[0065] As a third implementation example, the BMC 101 may access the temperature sensor in the component N according to the address of the temperature sensor in the temperature control strategy 1 to obtain the actual operating temperature of the component N measured by the temperature sensor.

[0066] S204 : The BMC 101 controls the temperature adjustment component 103 according to the temperature control strategy 1 and the actual operating temperature of the component N, wherein the temperature adjustment component 103 is used to adjust the temperature of the component N.

[0067] In this embodiment, the BMC 101 can control the temperature of the component N by controlling the temperature control component 103 so that the component N can operate within a normal temperature range.

[0068] In a first possible implementation, when temperature control component 103 is used to cool component N, BMC 101 may compare whether the actual operating temperature of component N is greater than the alarm temperature in temperature control strategy 1. If so, BMC 101 may determine to lower the temperature of component N according to temperature control strategy 1 and may send temperature reduction instruction 1 to temperature control component 103, instructing temperature control component 103 to use temperature reduction instruction 1 to lower the temperature of component N so that the temperature of component N is lower than the alarm temperature.

[0069] Furthermore, when the actual operating temperature of component N is lower than the alarm temperature, the BMC 101 may also compare whether the actual operating temperature is higher than the target operating temperature in the temperature control strategy 1. When the actual operating temperature is higher than the target operating temperature, the BMC 101 may send a temperature reduction instruction 2 to the temperature control component 103, so as to instruct the temperature control component 103 to lower the temperature of component N using the temperature reduction instruction 2, so as to control the temperature of component N to remain near the target operating temperature. The cooling effect of the temperature reduction instruction 2 on component N may be lower than the cooling effect of the temperature reduction instruction 1 on component N. Alternatively, the BMC 101 may not send a temperature reduction instruction to the temperature control component 103 before the actual operating temperature of component N reaches the alarm temperature, and this is not limited to this. When the actual operating temperature is lower than or equal to the target operating temperature, the BMC 101 does not send a temperature reduction instruction to the temperature control component 103.

[0070] For ease of understanding, some specific implementations of the temperature adjustment component 103 are exemplified below.

[0071] In a first example, the temperature control component 103 can be a fan. When the fan blades rotate, they push air over the surface of the component N, and use the flowing air to remove heat from the surface of the component N, thereby cooling the component N. Generally, the higher the fan speed, the faster the fan blades rotate. This results in a faster speed at which the blades push the air, and thus, more heat can be removed from the surface of the component N by the air flow, which in turn improves the cooling effect on the component N.

[0072] Therefore, when the actual operating temperature of component N is greater than the alarm temperature, BMC 101 can send cooling instruction 1 to the fan to increase the fan speed from the current speed to speed 1. When the actual operating temperature of component N is less than the alarm temperature but greater than the target operating temperature, BMC 101 can send cooling instruction 2 to the fan to increase the fan speed from the current speed to speed 2. Speed ​​1 is greater than speed 2. In this way, under the control of BMC 101, the temperature of component N can be maintained as close to the target operating temperature as possible, allowing component N to operate normally within the appropriate temperature range.

[0073] For example, the BMC 101 can set the fan speed using a pulse width modulation (PWM) signal. The PWM signal is the cooling command sent by the BMC 101 to the fan. A PWM signal is a voltage-regulating signal that adjusts the average voltage value by changing the time ratio between the high and low levels, thereby regulating the fan speed. In a specific implementation, the PWM signal is a periodic square wave signal, where the proportion of the high level time in the entire period determines the fan speed. For example, if the high level accounts for 20% and the low level accounts for 80%, the fan will rotate at 20% of the maximum speed. Therefore, when the actual operating temperature of component N is greater than the alarm temperature, the cooling command 1 sent by the BMC 101 to the fan can be a PWM signal with a high level accounting for 75% and a low level accounting for 25%, i.e., controlling the fan to rotate at 75% of the maximum speed. When the actual operating temperature of the component is lower than the alarm temperature but higher than the target operating temperature, the cooling instruction 2 sent by BMC101 to the fan can be a PWM signal with a high level accounting for 50% and a low level accounting for 50%, that is, the fan is controlled to rotate at 50% of the maximum speed.

[0074] In actual application, when the actual operating temperature of component N is lower than the alarm temperature, the fan speed can be determined based on the difference between the actual operating temperature of component N and the target operating temperature. For example, when the actual operating temperature is higher than the target operating temperature, the greater the difference between the actual operating temperature and the target operating temperature, the greater the speed at which the BMC 101 controls the fan, i.e., the temperature difference is positively correlated with the fan speed. The BMC 101 can calculate the fan speed achieved after controlling the fan based on a preset speed control algorithm, the actual operating temperature of component N, and the target operating temperature. Exemplarily, the speed control algorithm can be, for example, a proportional-integral-derivative (PID) algorithm, or other types of algorithms, which are not limited thereto.

[0075] In a second example, the temperature control component 103 can be a liquid cooling radiator. When the liquid (e.g., water) in the liquid cooling radiator flows, it absorbs heat near the component N, thereby cooling the component N. Typically, the larger the opening of the solenoid valve used to control the liquid flow in the liquid cooling radiator, the faster the liquid flows, the more heat can be removed from the vicinity of the component N, and the better the cooling effect.

[0076] Therefore, when the actual operating temperature of component N is greater than the alarm temperature, BMC 101 can send a cooling instruction 1 to the liquid-cooled radiator to control the liquid cooling flow rate (i.e., the flow rate of the liquid used for heat dissipation) in the liquid-cooled radiator to increase to flow rate 1. Accordingly, the opening of the solenoid valve of the liquid-cooled radiator increases from the current opening to opening 1. When the actual operating temperature of component N is less than the alarm temperature and greater than the target operating temperature, BMC 101 can send a cooling instruction 2 to the liquid-cooled radiator to control the liquid cooling flow rate (i.e., the flow rate of the liquid used for heat dissipation) in the liquid-cooled radiator to increase to flow rate 2. Accordingly, the opening of the solenoid valve of the liquid-cooled radiator increases from the current opening to opening 2. Flow rate 1 is greater than flow rate 2, i.e., opening 1 is greater than opening 2. In actual application, BMC 101 can control the opening of the solenoid valve of the liquid-cooled radiator according to a preset speed regulation algorithm, the actual operating temperature of component N, and the target operating temperature.

[0077] In a second possible implementation, when temperature control component 103 is used to raise the temperature of component N, BMC 101 may compare whether the actual operating temperature of component N is lower than the alarm temperature in temperature control strategy 1. If so, BMC 101 may determine to raise the temperature of component N according to temperature control strategy 1 and may send temperature raising instruction 1 to temperature control component 103, instructing temperature control component 103 to raise the temperature of component N so that the temperature of component N exceeds the alarm temperature.

[0078] Furthermore, if the actual operating temperature is greater than the alarm temperature, BMC 101 may also compare whether the actual operating temperature is less than the target operating temperature in temperature control strategy 1. If the actual operating temperature is less than the target operating temperature, BMC 101 may send temperature increase instruction 2 to temperature control component 103, instructing temperature control component 103 to increase the temperature of component N using temperature increase instruction 2 to maintain the temperature of component N near the target operating temperature. The temperature increase effect of temperature reduction instruction 2 on component N may be less than the temperature increase effect of temperature reduction instruction 1 on component N.

[0079] For example, the temperature control component 103 may be a heating plate, which can increase the temperature of components around the heating plate by generating heat. Then, when the actual operating temperature of component N is lower than the alarm temperature, the BMC 101 may send a temperature increase instruction 1 to the heating plate, and the temperature increase instruction 1 is used to instruct the heating plate to operate at power 1. When the actual operating temperature of component N is higher than the alarm temperature and lower than the target operating temperature, the BMC 101 may send a temperature increase instruction 2 to the heating plate, and the temperature increase instruction 2 is used to instruct the heating plate to operate at power 2. Wherein, power 1 is higher than power 2, and accordingly, the heat generated by the heating plate operating at power 1 per unit time is higher than the heat generated by operating at power 2. Wherein, the BMC 101 may control the power of the heating plate according to the actual operating temperature and target operating temperature of component N according to a preset speed control algorithm, so that under the heating of the heating plate, the temperature of component N can be kept as close to the target operating temperature as possible.

[0080] In this way, for a newly introduced component N, BMC 101 can automatically generate a temperature control policy for the component N. During the operation of component N, the temperature control component 103 is controlled according to the automatically generated temperature control policy to adjust the temperature of component N so that the temperature of component N is within an appropriate temperature range. In this way, when a new component N is introduced to the computing device 10, the operation and maintenance personnel do not need to update the BMC 101 version. This can reduce the workload and adaptation time required for the operation and maintenance personnel to adapt the new component N to the computing device 10, and reduce the difficulty of operation and maintenance for the operation and maintenance personnel for BMC 101. This also facilitates the expansion of the component ecosystem of the computing device 10.

[0081] It is worth noting that in this embodiment, BMC 101 is used as an example to describe temperature control of a component (i.e., component N) using temperature control component 103. In actual application scenarios, computing device 10 may include multiple components, such as Figure 1 Therefore, in a further possible embodiment, the BMC 101 can control the temperature control component 103 for multiple components. The following description takes the BMC 101 controlling the temperature control component 103 for component N and component N-1 as an example.

[0082] In a specific implementation, when a new component N-1 is introduced to the computing device 10, the BMC 101 can obtain the description information of the component N-1 (including the target operating temperature and the alarm temperature) from the persistent storage medium of the component N-1, and automatically generate a temperature control policy 2 for the component N-1 based on the description information. The specific implementation process of the BMC 101 generating the temperature control policy 2 can be found in the above description of the generation of the temperature control policy 1, and is not further described here.

[0083] Then, BMC 101 may obtain actual operating temperature 1 of component N and actual operating temperature 2 of component N-1, and control temperature adjustment component 103 according to actual operating temperature 1 of component N, temperature control strategy 1, actual operating temperature of component N-1, and temperature control strategy 2.

[0084] For example, BMC 101 may determine control mode 1 for temperature control component 103 of component N based on actual operating temperature 1 of component N and temperature control strategy 1. Furthermore, BMC 101 may determine control mode 2 for temperature control component 103 of component N-1 based on actual operating temperature 2 of component N-1 and temperature control strategy 2. Then, BMC 101 may determine a final control mode for temperature control component 103 based on control mode 1 and control mode 2, and control temperature control component 103 according to the final control mode.

[0085] Taking the temperature control component 103 as an example, specifically a fan, the BMC 101 can determine that the fan speed corresponding to component N is speed 1 based on the actual operating temperature 1 of component N and the temperature control strategy 1. The fan rotates based on the speed 1 to keep the temperature of component N near the target operating temperature corresponding to component N. Similarly, the BMC 101 can determine that the fan speed corresponding to component N-1 is speed 2 based on the actual operating temperature 2 of component N-1 and the temperature control strategy 2. Then, the BMC 101 can determine the target speed based on speed 1 and speed 2, and control the fan rotation based on the determined target speed. The target speed, for example, can be the maximum value of speed 1 and speed 2, that is, when speed 1 is greater than speed 2, the target speed is speed 1. Alternatively, the target speed can be the average value of speed 1 and speed 2, etc., and this is not limited.

[0086] It is worth noting that the above description uses the example of the BMC 101 controlling the temperature control component 103 using a temperature control strategy including a target operating temperature and an alarm temperature. When the temperature control strategy 1 generated by the BMC 101 based on the description information only includes the target operating temperature, the BMC 101 can control the temperature control component 103 based on the difference between the actual operating temperature of the component N and the target operating temperature. For example, in a cooling scenario, the greater the difference between the actual operating temperature of the component N and the target operating temperature (indicating that the temperature of the component N is higher), the BMC 101 can control the temperature control component 103 to operate in a more significant cooling manner to improve the cooling effect on the component N. When the temperature control strategy 1 generated by the BMC 101 based on the description information only includes the alarm temperature, the BMC 101 can control the temperature control component 103 based on the difference between the actual operating temperature of the component N and the alarm temperature. For example, in a cooling scenario, the smaller the difference between the actual operating temperature of component N and the alarm temperature (indicating that the temperature of component N is closer to the alarm temperature), the BMC 101 can control the temperature control component 103 to operate in a more significant cooling manner to improve the cooling effect on component N.

[0087] Similarly, for multiple components in the computing device 10, the BMC 101 can automatically generate a corresponding temperature control strategy for each component according to the above method, and determine the control mode corresponding to each component according to the actual operating temperature of each component and the temperature control strategy corresponding to the component. Thus, the BMC 101 can determine the final target control mode based on the control modes corresponding to the multiple components, and control the temperature control component 103 according to the target control mode, such as Figure 3 shown.

[0088] In actual application, when multiple temperature control components are deployed in the computing device 10, such as Figure 1 The computing device 10 in the embodiment is equipped with a temperature control component 102 and a temperature control component 103. The BMC 101 can control different temperature control components to control the temperature of components in different areas of the computing device 10. For example, Figure 1In the computing device 10 shown, the BMC 101 can use the temperature control component 102 to control the temperature of components 1 to X in area 1, so that the temperature of each component in components 1 to X can be close to the target operating temperature corresponding to the component. At the same time, the BMC 101 can use the temperature control component 103 to control the temperature of components X+1 to N in area 2, so that the temperature of each component in components X+1 to N can be close to the target operating temperature corresponding to the component. That is, the BMC 101 can use different temperature control components to control the temperature of components located in different physical areas of the computing device 10. The specific implementation method of the BMC 101 using each temperature control component to control the temperature of one or more components in the area can be found in the relevant description above and will not be repeated here.

[0089] It is worth noting that other reasonable step combinations that can be thought of by those skilled in the art based on the above description also fall within the scope of protection of this application. Secondly, those skilled in the art should also be familiar with that the embodiments described in the specification are all preferred embodiments, and the actions involved are not necessarily required by this application.

[0090] Combination of the above Figures 1 to 3 The temperature control method provided in the embodiment of the present application is introduced, and then the structure of the processor and computing device provided in the embodiment of the present application is introduced with reference to the accompanying drawings.

[0091] See also Figure 4 , shows a schematic structural diagram of a BMC, the BMC 400 includes:

[0092] An acquisition module 401 is configured to acquire description information and an actual operating temperature of a first component. The description information includes a target operating temperature or an alarm temperature of the first component. The target operating temperature is a temperature that the first component is expected to reach when operating normally. The alarm temperature indicates a temperature at which an alarm is triggered for the first component.

[0093] A generating module 402 is configured to generate a first temperature control strategy for the first component according to the description information;

[0094] The control module 403 is configured to control a first temperature adjustment component according to a first temperature control strategy and an actual operating temperature of the first component, wherein the first temperature adjustment component is configured to adjust the temperature of the first component.

[0095] In one possible embodiment, the first temperature adjustment component is used to reduce the temperature of the first component;

[0096] The control module 403 is configured to send a temperature reduction instruction to the first temperature adjustment component when the actual operating temperature is higher than the alarm temperature. The temperature reduction instruction is configured to instruct the first temperature adjustment component to reduce the temperature of the first component.

[0097] In one possible embodiment, the first temperature adjustment component is used to increase the temperature of the first component;

[0098] The control module 403 is configured to send a temperature raising instruction to the first temperature regulating component when the actual operating temperature is lower than the alarm temperature. The temperature raising instruction is configured to instruct the first temperature regulating component to raise the temperature of the first component.

[0099] In one possible implementation, the first component is located in a computing device, and the computing device further includes a second component;

[0100] The acquisition module 401 is further configured to acquire description information of the second component and an actual operating temperature of the second component, wherein the description information of the second component includes a target operating temperature or an alarm temperature of the second component;

[0101] The generating module 402 is further configured to generate a second temperature control strategy for the second component based on the description information of the second component;

[0102] The control module 403 is specifically configured to control the first temperature adjustment component according to the first temperature control strategy, the second temperature control strategy, the actual operating temperature of the first component, and the actual operating temperature of the second component.

[0103] In one possible implementation, the first temperature adjustment component includes a fan;

[0104] The control module 403 is specifically configured to:

[0105] Determining a first speed for the fan according to the first temperature strategy and the actual operating temperature of the first component;

[0106] determining a second speed for the fan according to the second temperature strategy and the actual operating temperature of the second component;

[0107] When the first rotational speed is greater than the second rotational speed, the rotational speed of the fan is controlled to be the first rotational speed.

[0108] In one possible implementation, the first temperature adjustment component includes a liquid cooling radiator;

[0109] The control module 403 is specifically configured to:

[0110] Determining a first flow rate for the liquid cooling radiator according to the first temperature strategy and the actual operating temperature of the first component;

[0111] determining a second flow rate for the liquid cooling radiator according to the second temperature strategy and the actual operating temperature of the second component;

[0112] When the first flow rate is greater than the second flow rate, the liquid cooling flow rate of the liquid cooling radiator is controlled to be the first flow rate.

[0113] In one possible embodiment, the computing device further includes a second temperature control component and a third component. The BMC uses the first temperature control component to adjust the temperatures of the first component and the second component located in the first area according to the first temperature control strategy and the second temperature control strategy. In addition, the BMC uses the second temperature control component to adjust the temperature of the third component located in the second area according to the third temperature control strategy generated for the third component.

[0114] In one possible implementation, the first component includes a persistent storage medium, and the persistent storage medium is used to store description information of the first component;

[0115] The acquisition module 401 is specifically configured to read the description information of the first component from a persistent storage medium.

[0116] because Figure 4 The BMC 400 shown corresponds to the above Figure 2 The method performed by BMC 101 in the embodiment shown is Figure 4 For the specific implementation of the BMC 400 and its technical effects, see the above Figure 2 The description of the relevant parts in the illustrated embodiment will not be repeated here.

[0117] The present application provides a BMC, which includes a power supply circuit and a processing circuit. The power supply circuit is used to supply power to the processing circuit, and the processing circuit is used to execute Figure 2 The method performed by the BMC 101 in the illustrated embodiment.

[0118] The present application provides a single board, which includes a BMC, which can be used to execute Figure 2 The method executed by the BMC 101 in the illustrated embodiment. For example, the single board may be a main board, or an expansion board, etc., which is not limited thereto.

[0119] The present application also provides a computer-readable storage medium. The computer-readable storage medium can be any available medium that can be stored by a computing device or a data storage device such as a data center that contains one or more available media. The available medium can be a magnetic medium (e.g., a floppy disk, a hard disk, a magnetic tape), an optical medium (e.g., a DVD), or a semiconductor medium (e.g., a solid-state drive). The computer-readable storage medium includes instructions that instruct the computing device to execute the above-mentioned temperature control method.

[0120] The present application also provides a computer program product. The computer program product includes one or more computer instructions. When the computer instructions are loaded and executed on a computing device, the computer program product fully or partially generates the process or function described in the present application.

[0121] The computer instructions may be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions may be transmitted from one website, computer, or data center to another website, computer, or data center via wired (e.g., coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means.

[0122] The computer program product may be a software installation package. When any of the aforementioned temperature control methods is required, the computer program product may be downloaded and executed on a computing device.

[0123] The above embodiments can be implemented in whole or in part by software, hardware, firmware or any other combination. When implemented using software, the above embodiments can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded or executed on a computer, the process or function described in the embodiment of the present application is generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions can be transmitted from one website, computer, server or data center to another website, computer, server or data center via a wired (e.g., coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) method. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that contains one or more available media sets. The available medium can be a magnetic medium (e.g., a floppy disk, a hard disk, a tape), an optical medium (e.g., a DVD), or a semiconductor medium. The semiconductor medium can be a solid-state drive.

[0124] The terms used in the above embodiments are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in the specification and claims of this application, the singular expressions "one", "a kind of", "said", "above", "the" and "this" are intended to also include expressions such as "one or more", unless the context clearly indicates otherwise. It should also be understood that in the embodiments of the present application, "one or more" refers to one, two or more; the character " / " generally indicates that the objects associated with each other are in an "or" relationship. In the embodiments of the present application. "Simultaneously" means within the same time period, including situations at the same time. The terms "first", "second", etc. in the specification, claims and drawings of this application are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchangeable where appropriate, and this is merely a way of distinguishing objects with the same properties when describing them in the embodiments of the present application.

[0125] References to "one embodiment" or "some embodiments" in this specification mean that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in one or more embodiments of the present application. Thus, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in yet other embodiments" appearing in various places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more but not all embodiments," unless otherwise specifically emphasized. The terms "including," "comprising," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0126] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present application, and such modifications or substitutions should be included in the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A temperature control method, characterized in that: The method is applied to a baseboard management controller (BMC), and the method includes: Obtaining description information and an actual operating temperature of a first component, the description information including a target operating temperature or an alarm temperature of the first component, the target operating temperature being a temperature expected to be reached when the first component is operating normally, and the alarm temperature being a temperature at which an alarm is triggered for the first component; generating a first temperature control strategy for the first component according to the description information; A first temperature adjustment component is controlled according to the first temperature control strategy and the actual operating temperature of the first component, where the first temperature adjustment component is used to adjust the temperature of the first component.

2. The method according to claim 1, characterized in that The first temperature regulating component is used to reduce the temperature of the first component; The controlling the first temperature adjustment component according to the first temperature control strategy and the actual operating temperature of the first component includes: When the actual operating temperature is higher than the alarm temperature, a temperature reduction instruction is sent to the first temperature adjustment component, where the temperature reduction instruction is used to instruct the first temperature adjustment component to reduce the temperature of the first component.

3. The method according to claim 1, characterized in that The first temperature regulating component is used to increase the temperature of the first component; The controlling the first temperature adjustment component according to the first temperature control strategy and the actual operating temperature of the first component includes: When the actual operating temperature is lower than the alarm temperature, a temperature raising instruction is sent to the first temperature regulating component, where the temperature raising instruction is used to instruct the first temperature regulating component to raise the temperature of the first component.

4. The method according to any one of claims 1 to 3, characterized in that The first component is located in a computing device, the computing device further includes a second component, and the method further includes: Obtaining description information of the second component and an actual operating temperature of the second component, where the description information of the second component includes a target operating temperature or an alarm temperature of the second component; generating a second temperature control strategy for the second component according to the description information of the second component; Then, controlling the first temperature adjustment component according to the first temperature control strategy and the actual operating temperature of the first component includes: The first temperature adjustment component is controlled according to the first temperature control strategy, the second temperature control strategy, the actual operating temperature of the first component, and the actual operating temperature of the second component.

5. The method according to claim 4, characterized in that The first temperature adjustment component includes a fan; The controlling the first temperature adjustment component according to the first temperature control strategy, the second temperature control strategy, the actual operating temperature of the first component, and the actual operating temperature of the second component includes: determining a first speed for the fan according to the first temperature strategy and an actual operating temperature of the first component; determining a second speed for the fan according to the second temperature strategy and the actual operating temperature of the second component; When the first rotational speed is greater than the second rotational speed, the rotational speed of the fan is controlled to be the first rotational speed.

6. The method according to claim 4, characterized in that The first temperature regulating component includes a liquid cooling radiator; The controlling the first temperature adjustment component according to the first temperature control strategy, the second temperature control strategy, the actual operating temperature of the first component, and the actual operating temperature of the second component includes: determining a first flow rate for the liquid cooling radiator according to the first temperature strategy and an actual operating temperature of the first component; determining a second flow rate for the liquid-cooled radiator according to the second temperature strategy and the actual operating temperature of the second component; When the first flow rate is greater than the second flow rate, the liquid cooling flow rate of the liquid cooling radiator is controlled to be the first flow rate.

7. The method according to any one of claims 4 to 6, characterized in that The computing device also includes a second temperature control component and a third component. The BMC uses the first temperature control component to adjust the temperature of the first component and the second component located in the first area according to the first temperature control strategy and the second temperature control strategy. The BMC also uses the second temperature control component to adjust the temperature of the third component located in the second area according to a third temperature control strategy generated for the third component.

8. The method according to any one of claims 1 to 7, characterized in that The first component includes a persistent storage medium, and the persistent storage medium is used to store description information of the first component; The obtaining description information of the first component includes: The description information of the first component is read from the persistent storage medium.

9. A baseboard management controller BMC, characterized in that: The BMC includes: an acquisition module, configured to acquire description information and an actual operating temperature of a first component, wherein the description information includes a target operating temperature or an alarm temperature of the first component, wherein the target operating temperature is a temperature expected to be reached when the first component is operating normally, and the alarm temperature is used to indicate a temperature at which an alarm is triggered for the first component; a generating module, configured to generate a first temperature control strategy for the first component according to the description information; The control module is used to control a first temperature adjustment component according to the first temperature control strategy and the actual operating temperature of the first component, wherein the first temperature adjustment component is used to adjust the temperature of the first component.

10. The BMC according to claim 9, characterized in that: The first temperature regulating component is used to reduce the temperature of the first component; The control module is configured to send a temperature reduction instruction to the first temperature adjustment component when the actual operating temperature is higher than the alarm temperature, wherein the temperature reduction instruction is configured to instruct the first temperature adjustment component to reduce the temperature of the first component.

11. The BMC according to claim 9, characterized in that: The first temperature regulating component is used to increase the temperature of the first component; The control module is configured to send a temperature increase instruction to the first temperature adjustment component when the actual operating temperature is lower than the alarm temperature, wherein the temperature increase instruction is configured to instruct the first temperature adjustment component to increase the temperature of the first component.

12. The BMC according to any one of claims 9 to 11, characterized in that: The first component is located in a computing device, and the computing device further includes a second component; The acquisition module is further configured to acquire description information of the second component and an actual operating temperature of the second component, wherein the description information of the second component includes a target operating temperature or an alarm temperature of the second component; The generating module is further configured to generate a second temperature control strategy for the second component according to the description information of the second component; The control module is specifically configured to control the first temperature adjustment component according to the first temperature control strategy, the second temperature control strategy, the actual operating temperature of the first component, and the actual operating temperature of the second component.

13. The BMC according to claim 12, wherein: The first temperature adjustment component includes a fan; The control module is specifically used to: determining a first speed for the fan according to the first temperature strategy and an actual operating temperature of the first component; determining a second speed for the fan according to the second temperature strategy and the actual operating temperature of the second component; When the first rotational speed is greater than the second rotational speed, the rotational speed of the fan is controlled to be the first rotational speed.

14. The BMC according to claim 12, wherein: The first temperature regulating component includes a liquid cooling radiator; The control module is specifically used to: determining a first flow rate for the liquid cooling radiator according to the first temperature strategy and an actual operating temperature of the first component; determining a second flow rate for the liquid-cooled radiator according to the second temperature strategy and the actual operating temperature of the second component; When the first flow rate is greater than the second flow rate, the liquid cooling flow rate of the liquid cooling radiator is controlled to be the first flow rate.

15. The BMC according to any one of claims 12 to 14, characterized in that: The computing device also includes a second temperature control component and a third component. The BMC uses the first temperature control component to adjust the temperature of the first component and the second component located in the first area according to the first temperature control strategy and the second temperature control strategy. The BMC also uses the second temperature control component to adjust the temperature of the third component located in the second area according to a third temperature control strategy generated for the third component.

16. The BMC according to any one of claims 9 to 15, characterized in that: The first component includes a persistent storage medium, and the persistent storage medium is used to store description information of the first component; The acquisition module is specifically configured to read the description information of the first component from the persistent storage medium.

17. A baseboard management controller (BMC), characterized in that: The BMC includes a power supply circuit and a processing circuit, the power supply circuit is used to supply power to the processing circuit, and the processing circuit is used to perform the steps of the method according to any one of claims 1 to 8.

18. A single board, characterized in that: The single board includes a baseboard management controller BMC, and the BMC is used to execute the steps of the method according to any one of claims 1 to 8.

19. A computing device, characterized in that The method comprises a baseboard management controller (BMC), wherein the BMC is configured to execute the steps of the method according to any one of claims 1 to 8.

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