Temperature control method and device for mining cooling clothes, electronic equipment and storage medium

Abstract

The invention relates to the technical field of coal mine underground mining, in particular to a temperature control method and device for mining cooling clothes, electronic equipment and a storage medium. The method comprises the following steps: receiving a temperature control instruction for performing temperature control on the mining cooling clothes; in response to the temperature control instruction, obtaining control information corresponding to a semiconductor chilling plate according to a preset sensible temperature, an environment temperature and a first sensible temperature of a wearer of the mining cooling suit; the control information is adopted to control the semiconductor chilling plate, the control information is adjusted according to the hot end temperature of the semiconductor chilling plate, and the semiconductor chilling plate is used for cooling a PCM phase change material through a temperature transfer wire so as to reduce the sensible temperature of a wearer of the mining cooling clothes. According to the invention, the reliability of temperature control of the mining cooling clothes can be improved, and the accuracy of temperature control of the mining cooling clothes can be improved.

Description

Technical Field

[0001] The present disclosure relates to the technical field of underground coal mining, and in particular to a temperature control method, device, electronic device and storage medium for cooling clothing for mining. Background Art

[0002] During the mining process, geothermal heat gradually intensifies with increasing depth, severely impacting underground mining activities. Consequently, with the advancement of science and technology, mining cooling suits have emerged. These can lower body temperature while improving work comfort. Liquid-cooled suits, for example, can control the liquid pump based on the temperature difference between the target and actual temperatures. However, these suits lack the control required for phase-change cooling, resulting in poor cooling performance. Furthermore, the multiple independent phase-change cooling units in these suits are complex to control and exhibit poor control reliability. Summary of the Invention

[0003] The present disclosure provides a temperature control method, device, electronic device, and storage medium for a mining cooling suit. These methods eliminate the need for multiple independent phase-change refrigeration units for control, reduce the complexity of temperature control for the mining cooling suit, and improve the reliability of temperature control for the mining cooling suit. Furthermore, they can control the temperature of semiconductor cooling chips, improving the accuracy of temperature control for the mining cooling suit. The technical solutions of the present disclosure are as follows:

[0004] According to a first aspect of an embodiment of the present disclosure, a temperature control method for a mining cooling suit is provided, comprising:

[0005] Receive temperature control instructions for temperature control of mining cooling suits;

[0006] In response to the temperature control instruction, obtaining control information corresponding to the semiconductor refrigeration chip according to the preset body temperature, the ambient temperature and the first body temperature of the wearer of the mining cooling suit;

[0007] The control information is used to control the semiconductor refrigeration chip, and the control information is adjusted according to the hot end temperature of the semiconductor refrigeration chip, wherein the semiconductor refrigeration chip is used to cool the phase change material (PCM) through a temperature transfer wire to reduce the body temperature perceived by the wearer of the mining cooling suit.

[0008] According to some embodiments, when the control information is used to control the semiconductor refrigeration chip, the method further includes:

[0009] Starting a radiator at a preset speed, wherein the radiator is used to dissipate heat from the semiconductor refrigeration plate;

[0010] Wherein, after the control information is adjusted according to the hot end temperature of the semiconductor refrigeration plate collected by the cold end temperature sensor, the method further includes:

[0011] The preset rotational speed is adjusted according to the adjusted control information, and the radiator is controlled to operate at the adjusted rotational speed.

[0012] According to some embodiments, adjusting the control information according to the hot end temperature of the semiconductor refrigeration chip includes:

[0013] Obtaining the hot end temperature of the semiconductor refrigeration plate through a temperature sensor;

[0014] Obtaining a temperature difference according to the preset perceived temperature and a second perceived temperature of the wearer of the mining cooling suit;

[0015] When it is determined that the temperature difference is less than or equal to the temperature difference threshold and the hot end temperature of the semiconductor refrigeration plate is greater than the temperature threshold, the control information is adjusted according to the hot end temperature of the semiconductor refrigeration plate, the second body temperature perceived by the wearer of the mining cooling suit and the ambient temperature to obtain the adjusted control information.

[0016] According to some embodiments, the method further comprises:

[0017] When it is determined that the temperature difference is less than or equal to the temperature difference threshold, stopping using the control information to control the semiconductor refrigeration chip;

[0018] The perceived temperature of the wearer of the mining cooling suit is acquired once every preset time period, and the cooling strategy of the semiconductor refrigeration plate is determined according to the perceived temperature of the wearer of the mining cooling suit acquired each time.

[0019] According to some embodiments, after stopping using the control information to control the semiconductor refrigeration chip, the method further includes:

[0020] Obtaining the cooling demand information;

[0021] When the cooling demand information indicates maintaining the cold end temperature of the semiconductor refrigeration chip, the control information is adjusted according to the hot end temperature of the semiconductor refrigeration chip, the third body temperature of the wearer of the mining cooling suit and the ambient temperature to obtain the adjusted control information.

[0022] According to some embodiments, after stopping using the control information to control the semiconductor refrigeration chip, the method further includes:

[0023] Obtaining the cooling demand information;

[0024] When the cooling requirement information indicates that the cold end temperature of the semiconductor refrigeration chip should not be maintained and the hot end temperature of the semiconductor refrigeration chip is lower than a temperature threshold, the radiator is turned off.

[0025] According to some embodiments, a thermal insulation layer is provided between the cold end and the hot end of the semiconductor refrigeration plate, and the thermal insulation layer includes a water-repellent outer cloth, a thermal insulation fiber felt and an elastic thermal insulation layer.

[0026] According to a second aspect of an embodiment of the present disclosure, a temperature control device for a cooling suit for a mine is provided, comprising:

[0027] An instruction receiving unit, configured to receive a temperature control instruction for controlling the temperature of the mining cooling suit;

[0028] an information acquisition unit, configured to obtain control information corresponding to the semiconductor refrigeration chip in response to the temperature control instruction and based on a preset body temperature, an ambient temperature, and a first body temperature of the wearer of the mining cooling suit;

[0029] A temperature control unit is used to control the semiconductor refrigeration chip using the control information and adjust the control information according to the hot end temperature of the semiconductor refrigeration chip, wherein the semiconductor refrigeration chip is used to cool the PCM phase change material through a temperature transfer wire to reduce the perceived temperature of the wearer of the mining cooling suit.

[0030] According to a third aspect of an embodiment of the present disclosure, there is provided an electronic device, including:

[0031] processor;

[0032] a memory for storing instructions executable by the processor;

[0033] The processor is configured to execute the instructions to implement the temperature control method for mining cooling clothing described in any one of the aforementioned aspects.

[0034] According to a fourth aspect of an embodiment of the present disclosure, a storage medium is provided. When instructions in the storage medium are executed by a processor of an electronic device, the electronic device is enabled to execute the temperature control method for mining cooling clothing described in any one of the aforementioned aspects.

[0035] According to a fifth aspect of an embodiment of the present disclosure, a computer program product is provided, including a computer program, which implements the method described in any one of the aforementioned aspects when executed by a processor.

[0036] The technical solutions provided by the embodiments of the present disclosure bring at least the following beneficial effects:

[0037] In some or related embodiments, a temperature control instruction for controlling the temperature of a mining cooling suit is received; in response to the temperature control instruction, control information corresponding to a semiconductor refrigeration chip is obtained based on a preset perceived temperature, an ambient temperature, and a first perceived temperature of the wearer of the mining cooling suit; the semiconductor refrigeration chip is controlled using the control information, and the control information is adjusted based on the hot end temperature of the semiconductor refrigeration chip, wherein the semiconductor refrigeration chip is used to cool a PCM phase change material via a heat transfer conductor to reduce the perceived temperature of the wearer of the mining cooling suit. Therefore, the control information can be determined based on the preset perceived temperature, the ambient temperature, and the actual perceived temperature of the wearer, thereby improving the accuracy of the control information determination, eliminating the need for multiple independent phase change refrigeration units for control, reducing the complexity of the mining cooling suit's temperature control, and improving the reliability of the mining cooling suit's temperature control. At the same time, the PCM phase change material can be cooled via the heat transfer conductor, and the semiconductor refrigeration chip can be coupled controlled, thereby improving the accuracy of the mining cooling suit's temperature control.

[0038] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The accompanying drawings herein are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and together with the description are used to explain the principles of the present disclosure, and do not constitute an improper limitation of the present disclosure.

[0040] Figure 1 This is a flow chart of a first method for controlling the temperature of a mining cooling suit provided by an embodiment of the present disclosure;

[0041] Figure 2 This is a flow chart of a second method for controlling the temperature of a cooling suit for mining provided by an embodiment of the present disclosure;

[0042] Figure 3 This is a schematic diagram illustrating an example of a temperature control method for a mining cooling suit provided in an embodiment of the present disclosure;

[0043] Figure 4 This is an example schematic diagram of a control device for a mine cooling suit provided by an embodiment of the present disclosure;

[0044] Figure 5 This is a schematic diagram showing an example of the structure of a cooling and heat dissipation module for a mining cooling suit provided by an embodiment of the present disclosure;

[0045] Figure 6 This is an example schematic diagram of a thermal insulation layer provided by an embodiment of the present disclosure;

[0046] Figure 7This is a block diagram of a temperature control device for a cooling suit for mining according to an exemplary embodiment;

[0047] Figure 8 It is a block diagram of an electronic device according to an exemplary embodiment. DETAILED DESCRIPTION

[0048] In order to enable ordinary persons in the art to better understand the technical solutions of the present disclosure, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings.

[0049] The present disclosure provides a method, device, electronic device, and storage medium for controlling a temperature of a cooling suit for a mine. In some embodiments, the terms "temperature control method for a cooling suit for a mine" and "information processing method" and "communication method" are interchangeable; the terms "temperature control device for a cooling suit for a mine" and "information processing device" and "communication device" are interchangeable; and the terms "information processing system" and "communication system" are interchangeable.

[0050] The embodiments of the present disclosure are not exhaustive and are merely illustrative of some embodiments, and are not intended to be a specific limitation on the scope of protection of the present disclosure. In the absence of contradiction, each step in a certain embodiment can be implemented as an independent embodiment, and the steps can be arbitrarily combined. For example, a solution after removing some steps in a certain embodiment can also be implemented as an independent embodiment, and the order of the steps in a certain embodiment can be arbitrarily exchanged. In addition, the optional implementation methods in a certain embodiment can be arbitrarily combined; in addition, the embodiments can be arbitrarily combined. For example, some or all steps of different embodiments can be arbitrarily combined, and a certain embodiment can be arbitrarily combined with the optional implementation methods of other embodiments.

[0051] In each embodiment of the present disclosure, unless otherwise specified or provided for by logic, the terms and / or descriptions between the embodiments are consistent and can be referenced by each other. The technical features in different embodiments can be combined to form a new embodiment based on their inherent logical relationships.

[0052] The terms used in the embodiments of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure.

[0053] In the embodiments of the present disclosure, unless otherwise specified, elements expressed in the singular, such as "a", "an", "the", "above", "said", "the", "the", etc., may mean "one and only one", or "one or more", "at least one", etc. For example, when using articles such as "a", "an", "the" in English in translation, the noun following the article may be understood as a singular expression or a plural expression.

[0054] In the embodiments of the present disclosure, “plurality” refers to two or more.

[0055] In some embodiments, the terms "at least one," "one or more," "a plurality of," "multiple," etc. may be used interchangeably.

[0056] The prefixes such as "first" and "second" in the embodiments of the present disclosure are only used to distinguish different description objects and do not constitute any restriction on the position, order, priority, quantity or content of the description objects. For the statement of the description object, please refer to the description in the context of the claims or embodiments, and no unnecessary restriction should be constituted due to the use of prefixes. For example, if the description object is a "field", the ordinal number before the "field" in the "first field" and the "second field" does not limit the position or order between the "fields". "First" and "second" do not limit whether the "fields" they modify are in the same message, nor do they limit the order of the "first field" and the "second field". For another example, if the description object is a "level", the ordinal number before the "level" in the "first level" and the "second level" does not limit the priority between the "levels". For another example, the number of description objects is not limited by the ordinal number and can be one or more. Taking "first device" as an example, the number of "devices" can be one or more. In addition, the objects modified by different prefixes can be the same or different. For example, if the description object is "device", then the "first device" and the "second device" can be the same device or different devices, and their types can be the same or different; for another example, if the description object is "information", then the "first information" and the "second information" can be the same information or different information, and their contents can be the same or different.

[0057] In some embodiments, "terminal" or "terminal device" may be referred to as "user equipment (UE)", "user terminal" "mobile station (MS)", "mobile terminal (MT)", subscriber station, mobile unit, subscriber unit, wireless unit, remote unit, mobile device, wireless device, wireless communication device, remote device, mobile subscriber station, access terminal, mobile terminal, wireless terminal, remote terminal, handset, user agent, mobile client, client, etc.

[0058] In some embodiments, data, information, etc. may be obtained with the user's consent.

[0059] It should be noted that the terms "first," "second," and the like in the specification and claims of the present disclosure and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or precedence. It should be understood that the numbers used in this manner are interchangeable where appropriate so that the embodiments of the present disclosure described herein can be implemented in an order other than those illustrated or described herein. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of apparatus and methods consistent with certain aspects of the present disclosure as detailed in the appended claims.

[0060] Figure 1 This is a flow chart of a first method for controlling the temperature of a cooling suit for mining provided by an embodiment of the present disclosure. Figure 1 As shown, the temperature control method of the cooling suit for mining can be used in the scenario of controlling the temperature of the cooling suit for mining, comprising the following steps:

[0061] In step S11, a temperature control instruction for controlling the temperature of the mining cooling suit is received;

[0062] In some embodiments, the execution subject of the embodiments of the present disclosure may be, for example, an electronic device. Specifically, the electronic device may be a cooling suit for mining, or a device capable of communicating with the cooling suit, though this is not a limitation in the embodiments of the present disclosure. The electronic device does not specifically refer to a fixed device. For example, when the device identifier of an electronic device changes, the electronic device may also change accordingly.

[0063] In some embodiments, a cooling suit for mining may be, for example, clothing worn by a wearer that can adjust the wearer's perceived temperature. Specifically, for example, the cooling suit for mining can lower the body's perceived temperature. The cooling suit for mining is not specific to a particular type of cooling suit. For example, when the structure of the cooling suit changes, the cooling suit may also change accordingly. For example, when the logo associated with the cooling suit changes, the cooling suit may also change accordingly.

[0064] According to some embodiments, the temperature control instruction may be, for example, an instruction received by an execution subject for controlling a cooling suit for a mine. The temperature suit control instruction does not specifically refer to a fixed instruction. The temperature control instruction does not specifically refer to a fixed instruction. The temperature control instruction includes, but is not limited to, a voice temperature control instruction, a click temperature control instruction, a timed temperature control instruction, a text temperature control instruction, and the like. The specific temperature control instruction that may be received may, for example, be related to the structure of the cooling suit for a mine. For example, when the cooling suit for a mine is provided with a voice receiving device, the temperature control instruction may be a voice temperature control instruction.

[0065] In some embodiments, when controlling the temperature of the mining cooling suit, a temperature control instruction for controlling the temperature of the mining cooling suit may be received.

[0066] In step S12, in response to the temperature control instruction, control information corresponding to the semiconductor refrigeration chip is obtained according to the preset body temperature, the ambient temperature and the first body temperature of the wearer of the mining cooling suit;

[0067] In some embodiments, the preset perceived temperature may be, for example, a pre-set desired perceived temperature. The preset perceived temperature does not specifically refer to a fixed temperature. For example, the same mining cooling suit may correspond to different preset perceived temperatures when corresponding to different wearers. The preset perceived temperature may be determined, for example, based on the wearer's temperature setting instructions, or based on the wearer's physical parameters, or based on the wearer's historical perceived temperature settings, or based on the current ambient temperature. The determination of the preset perceived temperature may be a combination of the above-mentioned multiple methods or one of them. The embodiments of the present disclosure are not limited thereto. When determined based on the wearer's physical parameters, a temperature recognition model may be used for determination.

[0068] According to some embodiments, the ambient temperature may be, for example, the ambient temperature collected when the mining cooling suit receives a temperature control instruction, and specifically, the temperature of the environment in which the mining cooling suit is currently located. The ambient temperature is not specifically a fixed temperature. For example, if the ambient temperature measuring device changes, the ambient temperature may also change accordingly.

[0069] In some embodiments, the perceived temperature may be, for example, the temperature felt by the wearer. The perceived temperature may be measured, for example, by a body temperature sensor. The perceived temperature is not necessarily a fixed temperature. For example, different perceived temperatures may be obtained when measured at different times. For example, if the body temperature sensor changes, the perceived temperature may also change accordingly.

[0070] According to some embodiments, the first sensible temperature may be, for example, a temperature directly collected during temperature control. The first sensible temperature is used to distinguish from other sensible temperatures and does not specifically refer to a fixed temperature.

[0071] According to some embodiments, a semiconductor refrigeration chip can be, for example, a refrigeration device made of semiconductors. The semiconductor refrigeration chip does not specifically refer to a fixed refrigeration chip. For example, when the semiconductor material in the semiconductor refrigeration chip changes, the semiconductor refrigeration chip can also change accordingly. The name of the semiconductor refrigeration chip is not limited. For example, the semiconductor refrigeration chip can also be referred to as a semiconductor refrigeration device, a semiconductor refrigeration component, etc.

[0072] In some embodiments, control information may refer to information for controlling a semiconductor cooler. This control information is not specifically fixed information. For example, if the method for determining the control information changes, the control information may also change accordingly. For example, if the specific information included in the control information changes, the control information may also change accordingly.

[0073] In some embodiments, for example, in response to the temperature control instruction, control information corresponding to the semiconductor refrigeration plate is obtained according to the preset body temperature, the ambient temperature and the first body temperature of the wearer of the mining cooling suit.

[0074] Specifically, in response to the temperature control instruction, control information corresponding to the semiconductor refrigeration plate can be obtained according to at least one of the preset body temperature, the ambient temperature and the first body temperature of the wearer of the mining cooling suit.

[0075] In step S13, the control information is used to control the semiconductor refrigeration chip, and the control information is adjusted according to the hot end temperature of the semiconductor refrigeration chip, wherein the semiconductor refrigeration chip is used to cool the PCM phase change material through the temperature transfer wire to reduce the perceived temperature of the wearer of the mining cooling suit.

[0076] According to some embodiments, a semiconductor refrigeration chip includes a cold end and a hot end. These two parts are important components of semiconductor refrigeration and play different roles in the cooling process. The cold end absorbs heat, causing its temperature to drop, thereby achieving a cooling effect; the hot end dissipates the absorbed heat, causing its temperature to rise, thus forming a heat exchange.

[0077] In some embodiments, the hot-end temperature may be, for example, the temperature acquired by temperature acquisition at the hot end of a semiconductor cooler. The hot-end temperature is not necessarily a fixed temperature. For example, if the temperature acquisition device changes, the hot-end temperature may also change accordingly. For example, if the hot-end temperature acquisition time point changes, the hot-end temperature may also change accordingly.

[0078] In some embodiments, PCM phase change materials can be a type of refrigeration material, which refers to a substance that changes state while maintaining a constant temperature and can provide latent heat. PCM phase change materials are not specifically defined as fixed materials. For example, PCM phase change materials can include inorganic and organic materials.

[0079] In some embodiments, the control information can be used to control the semiconductor refrigeration chip, and the control information can be adjusted according to the hot end temperature of the semiconductor refrigeration chip, wherein the semiconductor refrigeration chip is used to cool the PCM phase change material through a heat transfer wire to reduce the body temperature of the wearer of the mining cooling suit.

[0080] In some or related embodiments, a temperature control instruction for controlling the temperature of a mining cooling suit is received; in response to the temperature control instruction, control information corresponding to a semiconductor refrigeration chip is obtained based on a preset perceived temperature, an ambient temperature, and a first perceived temperature of the wearer of the mining cooling suit; the semiconductor refrigeration chip is controlled using the control information, and the control information is adjusted based on the hot end temperature of the semiconductor refrigeration chip, wherein the semiconductor refrigeration chip is used to cool a PCM phase change material via a heat transfer conductor to reduce the perceived temperature of the wearer of the mining cooling suit. Therefore, the control information can be determined based on the preset perceived temperature, the ambient temperature, and the actual perceived temperature of the wearer, thereby improving the accuracy of the control information determination, eliminating the need for multiple independent phase change refrigeration units for control, reducing intermittent cooling, reducing the complexity of the mining cooling suit's temperature control, and improving the reliability of the mining cooling suit's temperature control. At the same time, the PCM phase change material can be cooled via the heat transfer conductor, and the semiconductor refrigeration chip can be coupled controlled, thereby improving the accuracy of the mining cooling suit's temperature control.

[0081] Figure 2 This is a flow chart of a second method for controlling the temperature of a cooling suit for mining provided by an embodiment of the present disclosure. Figure 2 As shown, the temperature control method of the mining cooling suit can be used in mineral resource mining, artificial underground mineral mining, and scenarios where humans wearing mining cooling suits need to cool down, including the following steps:

[0082] In step S21, a temperature control instruction for controlling the temperature of the mining cooling suit is received;

[0083] Among them, the relevant descriptions have been mentioned above and will not be repeated here.

[0084] According to some embodiments, Figure 3 This is a schematic diagram illustrating an example of a temperature control method for a mining cooling suit provided by an embodiment of the present disclosure. The mining cooling suit of the present disclosure can also be referred to as a phase change mining cooling suit, which offers excellent cooling performance, is adjustable, and is comfortable to wear. The temperature control method of the present disclosure can enhance this wearing experience.

[0085] In some embodiments, the execution subject of the embodiment of the present disclosure may be, for example, an electronic device, which may also be called a mine cooling suit control device. An example schematic diagram of the mine cooling suit control device may be as shown in FIG. Figure 4 Among them, the structural example schematic diagram of the cooling-heat dissipation module of the mining cooling suit can be as follows. Figure 5As shown, the mining cooling suit control device may include, for example, a power supply, an embedded processor, a display screen, sensors (including a body temperature sensor, a cold-end temperature sensor, a hot-end temperature sensor, and an ambient temperature sensor), a cooling fan, and a semiconductor cooling plate. The power supply powers all other hardware, the embedded processor provides signal analysis and overall control, the display screen displays various data, the body temperature sensor collects actual body temperature, the cold-end temperature sensor collects the cold-end temperature of the semiconductor cooling plate, the hot-end temperature sensor collects the hot-end temperature of the semiconductor cooling plate, and the ambient temperature sensor collects the ambient temperature. The semiconductor cooling plate receives control signals from the embedded processor to cool itself, and the cooling fan provides cooling and heat dissipation for the semiconductor cooling plate.

[0086] In one embodiment of the present disclosure, the mining cooling suit is in a worn state, that is, the wearer has already put on the mining cooling suit.

[0087] in, Figure 6 The figure is a schematic diagram of an example of a thermal insulation layer provided by an embodiment of the present disclosure. A thermal insulation layer is provided between the cold end and the hot end of the semiconductor refrigeration plate, and the thermal insulation layer includes a water-repellent outer cloth, a thermal insulation fiber felt and an elastic thermal insulation layer.

[0088] In step S22, in response to the temperature control instruction, control information corresponding to the semiconductor refrigeration chip is obtained according to the preset body temperature, the ambient temperature and the first body temperature of the wearer of the mining cooling suit;

[0089] Among them, the relevant descriptions have been mentioned above and will not be repeated here.

[0090] According to some embodiments, for example, a preset perceived temperature is T1 and an ambient temperature is Tm. A body temperature sensor collects the wearer's current actual temperature, obtains the wearer's current physiological parameters, and determines the wearer's current actual perceived temperature T0 based on the physiological parameters. Control information can be determined based on T1, Tm, and T0, where the control information can specifically be, for example, a control current I.

[0091] According to some embodiments, Figure 3 As shown, for example, the control information can be determined according to the expected temperature, that is, the preset body-perceived temperature. Specifically, the control current I can be determined according to the expected temperature, that is, the preset body-perceived temperature.

[0092] In step S23, the radiator is started at a preset speed, wherein the radiator is used to dissipate heat from the semiconductor refrigeration plate;

[0093] Among them, the relevant descriptions have been mentioned above and will not be repeated here.

[0094] There is no restriction on the order in which steps S23 and S22 are executed. For example, steps S23 and S22 can be executed simultaneously, or step S23 can be executed first and then step S22, or step S22 can be executed first and then step S23.

[0095] The embedded processor may send a cooling fan control signal to start the cooling fan to pre-cool the semiconductor cooling plate, with the fan having an initial speed of R0. The initial speed may be, for example, a preset speed, which may be determined based on the ambient temperature, or based on a preset body temperature and the first body temperature, but this is not limited in the present embodiment.

[0096] In some embodiments, a radiator may be started at a preset rotation speed, wherein the radiator is used to dissipate heat from the semiconductor refrigeration plate.

[0097] In step S24, the control information is used to control the semiconductor refrigeration chip, and the control information is adjusted according to the hot end temperature of the semiconductor refrigeration chip, wherein the semiconductor refrigeration chip is used to cool the PCM phase change material through the heat transfer wire to reduce the perceived temperature of the wearer of the mining cooling suit;

[0098] Among them, the relevant descriptions have been mentioned above and will not be repeated here.

[0099] In some embodiments, upon determining the control information, a control signal for the semiconductor refrigeration chip may be issued to initiate cooling. A temperature sensor may acquire the semiconductor refrigeration chip's hot-end temperature Th and transmit it to an embedded processor. Specifically, the hot-end temperature may be acquired at predetermined intervals and transmitted to the embedded processor.

[0100] According to some embodiments, adjusting the control information according to the hot end temperature of the semiconductor refrigeration chip includes:

[0101] Obtaining the hot end temperature of the semiconductor refrigeration plate through a temperature sensor;

[0102] Obtaining a temperature difference according to the preset perceived temperature and a second perceived temperature of the wearer of the mining cooling suit;

[0103] If it is determined that the temperature difference is less than or equal to the temperature difference threshold and the hot-end temperature of the semiconductor refrigeration chip is greater than the temperature threshold, the control information is adjusted based on the hot-end temperature of the semiconductor refrigeration chip, the second perceived temperature of the wearer of the mining cooling suit, and the ambient temperature to obtain adjusted control information. Therefore, by adjusting the control information based on the hot-end temperature, the preset perceived temperature, and the second perceived temperature, the accuracy of the control information can be improved, thereby enhancing the cooling effect of the mining cooling suit.

[0104] According to some embodiments, obtaining the hot end temperature of the semiconductor refrigeration chip through the temperature sensor may specifically be, for example, obtaining the hot end temperature of the semiconductor refrigeration chip through a hot end temperature sensor.

[0105] In some embodiments, the second perceived temperature may be, for example, a real-time perceived temperature collected after the mining cooling suit is used. The second perceived temperature is not specifically a fixed temperature. For example, if the time point at which the second perceived temperature is collected changes, the second perceived temperature may also change accordingly. For example, the second perceived temperature may be collected every preset time interval.

[0106] According to some embodiments, the temperature threshold is not a fixed threshold. For example, when a modification instruction is received for the temperature threshold, the temperature threshold may change accordingly. For example, if the current environment of the mining cooling suit changes, the temperature threshold may also change accordingly.

[0107] According to some embodiments, the method further comprises:

[0108] When it is determined that the temperature difference is less than or equal to the temperature difference threshold, stopping using the control information to control the semiconductor refrigeration chip;

[0109] The wearer's perceived temperature is acquired at preset intervals, and a cooling strategy for the semiconductor refrigeration chip is determined based on the acquired perceived temperature. Therefore, after the semiconductor refrigeration chip stops operating, the decision to resume cooling can be made based on the next acquired perceived temperature, improving the intelligent nature of the cooling system.

[0110] According to some embodiments, after stopping using the control information to control the semiconductor refrigeration chip, the method further includes:

[0111] Obtaining the cooling demand information;

[0112] When the cooling demand information indicates maintaining the cold-end temperature of the semiconductor refrigeration chip, the control information is adjusted based on the hot-end temperature of the semiconductor refrigeration chip, the third body temperature perceived by the wearer of the mining cooling suit, and the ambient temperature to obtain adjusted control information. Therefore, the control information can be adjusted based on the cooling demand information, improving the consistency of the cooling performance of the mining cooling suit with the demand and enhancing the user experience of the mining cooling suit.

[0113] According to some embodiments, after stopping using the control information to control the semiconductor refrigeration chip, the method further includes:

[0114] Obtaining the cooling demand information;

[0115] When the cooling requirement information indicates that the cold end temperature of the semiconductor refrigeration chip should not be maintained and the hot end temperature of the semiconductor refrigeration chip is less than a temperature threshold, the radiator is turned off. This can reduce the waste of resources caused by continuous use of the radiator and improve resource utilization.

[0116] According to some embodiments, the temperature threshold may be, for example, 15°C. The embedded processor determines whether the temperature difference between the desired perceived temperature and the current actual perceived temperature, i.e., the second perceived temperature, is ERROR ≤ 0. If the determination result is negative, the processor continues to determine whether the hot-end temperature Th of the semiconductor refrigeration plate is greater than 15°C. Since the semiconductor refrigeration plate causes its hot end to heat up, the hot-end temperature must be greater than 15°C at this time. The cold end of the semiconductor strain gauge continuously lowers the PCM material temperature through the heat transfer wire, thereby cooling the human body. The processor continues to determine whether ERROR ≤ 0 in a loop until the actual perceived temperature reaches the desired perceived temperature. If the determination result is positive, ERROR ≤ 0, the embedded processor temporarily turns off the semiconductor refrigeration plate control current I to achieve the initial cooling goal.

[0117] In some embodiments, embedded sensors determine whether the cooling temperature needs to be maintained based on cooling requirements, i.e., cooling demand information. If so, ambient and body temperature sensors are used to continuously monitor the current ambient and body temperatures for cyclic control. If not, the hot-end temperature Th is determined to be greater than 15°C. If so, the cooling fan continues to dissipate heat from the semiconductor refrigeration chip until the hot-end temperature reaches a safe 15°C. If not, the cooling fan is turned off, completing all cooling operations. Cooling demand information can, for example, include temporary or continuous cooling.

[0118] In step S25, the preset rotational speed is adjusted according to the adjusted control information, and the radiator is controlled to operate at the adjusted rotational speed.

[0119] Among them, the relevant descriptions have been mentioned above and will not be repeated here.

[0120] According to some embodiments, when determining the adjusted control information, the preset speed can be adjusted based on the adjusted control information. Specifically, for example, the initial speed can be adjusted based on the adjusted control current I, and the heat sink can be controlled to operate at the adjusted speed. That is, the heat sink speed can be adjusted based on the control information. The control current I can also be referred to as the cooling current, and the heat sink can specifically be a cooling fan. Specifically, for example, the greater the cooling current I, the greater the cooling fan speed R.

[0121] In some embodiments, the radiator is started at a preset speed, the preset speed is adjusted according to the adjusted control information, and the radiator is controlled to operate at the adjusted speed. This allows coupling control of semiconductor wafers and radiators, improves the accuracy of temperature control of mining cooling suits, improves the consistency between the preset perceived temperature and the actual perceived temperature, dissipates heat for semiconductor refrigeration sheets, improves the safety of mining cooling suits, and allows circulating refrigeration for mining cooling suits, which helps reduce energy consumption and extend effective working time.

[0122] A block diagram of a temperature control device for a mine cooling suit is shown according to an exemplary embodiment. Figure 7 , the apparatus 700 comprises:

[0123] The instruction receiving unit 701 is used to receive a temperature control instruction for controlling the temperature of the mining cooling suit;

[0124] An information acquisition unit 702 is configured to respond to the temperature control instruction and acquire control information corresponding to the semiconductor cooling chip according to the preset body temperature, the ambient temperature, and the first body temperature of the wearer of the mining cooling suit;

[0125] The temperature control unit 703 is used to control the semiconductor refrigeration chip using the control information and adjust the control information according to the hot end temperature of the semiconductor refrigeration chip, wherein the semiconductor refrigeration chip is used to cool the PCM phase change material through the heat transfer wire to reduce the perceived temperature of the wearer of the mining cooling suit.

[0126] According to some embodiments, the temperature control unit 703, when used to control the semiconductor refrigeration chip using the control information, is further specifically used to:

[0127] Starting a radiator at a preset speed, wherein the radiator is used to dissipate heat from the semiconductor refrigeration plate;

[0128] Wherein, after the control information is adjusted according to the hot end temperature of the semiconductor refrigeration plate collected by the cold end temperature sensor, the method further includes:

[0129] The preset rotational speed is adjusted according to the adjusted control information, and the radiator is controlled to operate at the adjusted rotational speed.

[0130] According to some embodiments, the temperature control unit 703 is configured to adjust the control information according to the hot end temperature of the semiconductor refrigeration chip, specifically to:

[0131] Obtaining the hot end temperature of the semiconductor refrigeration plate through a temperature sensor;

[0132] Obtaining a temperature difference according to the preset perceived temperature and a second perceived temperature of the wearer of the mining cooling suit;

[0133] When it is determined that the temperature difference is less than or equal to the temperature difference threshold and the hot end temperature of the semiconductor refrigeration plate is greater than the temperature threshold, the control information is adjusted according to the hot end temperature of the semiconductor refrigeration plate, the second body temperature perceived by the wearer of the mining cooling suit and the ambient temperature to obtain the adjusted control information.

[0134] According to some embodiments, the temperature control unit 703 is further configured to:

[0135] When it is determined that the temperature difference is less than or equal to the temperature difference threshold, stopping using the control information to control the semiconductor refrigeration chip;

[0136] The perceived temperature of the wearer of the mining cooling suit is acquired once every preset time period, and the cooling strategy of the semiconductor refrigeration plate is determined according to the perceived temperature of the wearer of the mining cooling suit acquired each time.

[0137] According to some embodiments, after the temperature control unit 703 stops using the control information to control the semiconductor refrigeration chip, it is further configured to:

[0138] Obtaining the cooling demand information;

[0139] When the cooling demand information indicates maintaining the cold end temperature of the semiconductor refrigeration chip, the control information is adjusted according to the hot end temperature of the semiconductor refrigeration chip, the third body temperature of the wearer of the mining cooling suit and the ambient temperature to obtain the adjusted control information.

[0140] According to some embodiments, after the temperature control unit 703 stops using the control information to control the semiconductor refrigeration chip, it is further configured to:

[0141] Obtaining the cooling demand information;

[0142] When the cooling requirement information indicates that the cold end temperature of the semiconductor refrigeration chip should not be maintained and the hot end temperature of the semiconductor refrigeration chip is lower than a temperature threshold, the radiator is turned off.

[0143] According to some embodiments, the temperature control unit 703 is used in which a thermal insulation layer is provided between the cold end and the hot end of the semiconductor refrigeration plate, and the thermal insulation layer includes a water-repellent outer cloth, an insulating fiber felt and an elastic thermal insulation layer.

[0144] Regarding the apparatus in the above embodiment, the specific manner in which each module performs operations has been described in detail in the embodiment of the method, and will not be elaborated here.

[0145] In some or related embodiments, a command receiving unit is configured to receive a temperature control command for controlling the temperature of a mining cooling suit; an information acquiring unit is configured to, in response to the temperature control command, acquire control information corresponding to a semiconductor refrigeration chip based on a preset perceived temperature, an ambient temperature, and a first perceived temperature of the wearer of the mining cooling suit; and a temperature control unit is configured to control the semiconductor refrigeration chip using the control information and adjust the control information based on the hot end temperature of the semiconductor refrigeration chip. The semiconductor refrigeration chip is configured to cool a PCM phase change material via a heat transfer conductor to reduce the perceived temperature of the wearer of the mining cooling suit. Therefore, the control information can be determined based on the preset perceived temperature, the ambient temperature, and the actual perceived temperature of the wearer, thereby improving the accuracy of the control information determination. This eliminates the need for multiple independent phase change refrigeration units, reduces the complexity of the mining cooling suit's temperature control, and improves the reliability of the mining cooling suit's temperature control. Furthermore, the PCM phase change material can be cooled via the heat transfer conductor, enabling coupled control of the semiconductor refrigeration chip, thereby improving the accuracy of the mining cooling suit's temperature control.

[0146] Figure 8 A schematic block diagram of an example electronic device 800 that can be used to implement embodiments of the present disclosure is shown. The electronic device 800 is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital assistants, cellular phones, smartphones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are provided as examples only and are not intended to limit the implementation of the present disclosure described and / or claimed herein.

[0147] like Figure 8 As shown, the electronic device 800 includes a computing unit 801, which can perform various appropriate actions and processes according to a computer program stored in a read-only memory (ROM) 802 or a computer program loaded from a storage unit 808 into a random access memory (RAM) 803. In the RAM 803, various programs and data required for the operation of the electronic device 800 can also be stored. The computing unit 801, the ROM 802, and the RAM 803 are connected to each other via a bus 804. An input / output (I / O) interface 805 is also connected to the bus 804.

[0148] Multiple components in the electronic device 800 are connected to the I / O interface 805, including an input unit 806, such as a keyboard, a mouse, etc.; an output unit 807, such as various types of displays, speakers, etc.; a storage unit 808, such as a magnetic disk, an optical disk, etc.; and a communication unit 809, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 809 allows the electronic device 800 to exchange information / data with other devices via a computer network such as the Internet and / or various telecommunication networks.

[0149] The computing unit 801 can be any general-purpose and / or specialized processing component with processing and computing capabilities. Some examples of the computing unit 801 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various specialized artificial intelligence (AI) computing chips, various computing units running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. The computing unit 801 performs the various methods and processes described above, such as the vehicle number recognition method. For example, in some embodiments, the vehicle number recognition method can be implemented as a computer software program tangibly embodied in a machine-readable medium, such as the storage unit 808. In some embodiments, part or all of the computer program can be loaded and / or installed onto the electronic device 800 via the ROM 802 and / or the communication unit 809. When the computer program is loaded into the RAM 803 and executed by the computing unit 801, one or more steps of the vehicle number recognition method described above can be performed. Alternatively, in other embodiments, the computing unit 801 can be configured to perform the vehicle number recognition method by any other suitable means (e.g., via firmware).

[0150] Various embodiments of the systems and techniques described herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), system-on-chip systems (SOCs), programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments can include being implemented in one or more computer programs that are executable and / or interpreted on a programmable system that includes at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0151] The program code for implementing the method of the present disclosure can be written in any combination of one or more programming languages. These program codes can be provided to a processor or controller of a general-purpose computer, a special-purpose computer, or other programmable data processing device so that when the program code is executed by the processor or controller, the functions / operations specified in the flow chart and / or block diagram are implemented. The program code can be executed entirely on the machine, partially on the machine, as a stand-alone software package, partially on the machine and partially on a remote machine, or entirely on a remote machine or server.

[0152] In the context of the present disclosure, a machine-readable medium can be a tangible medium that can contain or store a program for use by or in conjunction with an instruction execution system, device or equipment. A machine-readable medium can be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium can include, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, device or equipment, or any suitable combination of the foregoing. A more specific example of a machine-readable storage medium can include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0153] To provide interaction with a user, the systems and techniques described herein can be implemented on a computer having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user can provide input to the computer. Other types of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, voice input, or tactile input).

[0154] The systems and techniques described herein can be implemented in a computing system that includes back-end components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes front-end components (e.g., a user computer with a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such back-end components, middleware components, or front-end components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), the Internet, and a blockchain network.

[0155] A computer system may include a client and a server. The client and server are typically remote from each other and typically interact via a communication network. This client-server relationship is established by computer programs running on the respective computers, creating a client-server relationship. The server may be a cloud server, also known as a cloud computing server or cloud host, a host product within a cloud computing service ecosystem that addresses the management difficulties and limited scalability of traditional physical hosts and VPS services ("Virtual Private Servers" or "VPS"). The server may also be a server in a distributed system or a server integrated with blockchain.

[0156] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in this disclosure can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solutions disclosed in this disclosure can be achieved. This is not limited herein.

[0157] The above specific embodiments do not constitute a limitation on the scope of protection of this disclosure. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this disclosure shall be included within the scope of protection of this disclosure.

Claims

1. A temperature control method for cooling clothing for mines, characterized in that: include: Receive temperature control instructions for temperature control of mining cooling suits; In response to the temperature control instruction, obtaining control information corresponding to the semiconductor refrigeration chip according to the preset body temperature, the ambient temperature and the first body temperature of the wearer of the mining cooling suit; The control information is used to control the semiconductor refrigeration chip, and the control information is adjusted according to the hot end temperature of the semiconductor refrigeration chip, wherein the semiconductor refrigeration chip is used to cool the PCM phase change material through the temperature transfer wire to reduce the body temperature perceived by the wearer of the mining cooling suit.

2. The method according to claim 1, characterized in that When the control information is used to control the semiconductor refrigeration chip, the method further includes: Starting a radiator at a preset speed, wherein the radiator is used to dissipate heat from the semiconductor refrigeration plate; Wherein, after the control information is adjusted according to the hot end temperature of the semiconductor refrigeration plate collected by the cold end temperature sensor, the method further includes: The preset rotational speed is adjusted according to the adjusted control information, and the radiator is controlled to operate at the adjusted rotational speed.

3. The method according to claim 1, characterized in that The adjusting the control information according to the hot end temperature of the semiconductor refrigeration chip includes: Obtaining the hot end temperature of the semiconductor refrigeration plate through a temperature sensor; Obtaining a temperature difference according to the preset perceived temperature and a second perceived temperature of the wearer of the mining cooling suit; When it is determined that the temperature difference is less than or equal to the temperature difference threshold and the hot end temperature of the semiconductor refrigeration plate is greater than the temperature threshold, the control information is adjusted according to the hot end temperature of the semiconductor refrigeration plate, the second body temperature perceived by the wearer of the mining cooling suit and the ambient temperature to obtain the adjusted control information.

4. The method according to claim 3, characterized in that The method further comprises: When it is determined that the temperature difference is less than or equal to the temperature difference threshold, stopping using the control information to control the semiconductor refrigeration chip; The perceived temperature of the wearer of the mining cooling suit is acquired once every preset time period, and the cooling strategy of the semiconductor refrigeration plate is determined according to the perceived temperature of the wearer of the mining cooling suit acquired each time.

5. The method according to claim 4, characterized in that After stopping using the control information to control the semiconductor refrigeration chip, the method further includes: Obtaining the cooling demand information; When the cooling demand information indicates maintaining the cold end temperature of the semiconductor refrigeration chip, the control information is adjusted according to the hot end temperature of the semiconductor refrigeration chip, the third body temperature of the wearer of the mining cooling suit and the ambient temperature to obtain the adjusted control information.

6. The method according to claim 4, characterized in that After stopping using the control information to control the semiconductor refrigeration chip, the method further includes: Obtaining the cooling demand information; When the cooling requirement information indicates that the cold end temperature of the semiconductor refrigeration chip should not be maintained and the hot end temperature of the semiconductor refrigeration chip is lower than a temperature threshold, the radiator is turned off.

7. The method according to claim 1, characterized in that in, A thermal insulation layer is provided between the cold end and the hot end of the semiconductor refrigeration plate, and the thermal insulation layer comprises a water-repellent outer cloth, a thermal insulation fiber felt and an elastic thermal insulation layer.

8. A temperature control device for cooling clothing for mines, characterized in that: include: An instruction receiving unit, configured to receive a temperature control instruction for controlling the temperature of the mining cooling suit; an information acquisition unit, configured to obtain control information corresponding to the semiconductor refrigeration chip in response to the temperature control instruction and based on a preset body temperature, an ambient temperature, and a first body temperature of the wearer of the mining cooling suit; A temperature control unit is used to control the semiconductor refrigeration chip using the control information and adjust the control information according to the hot end temperature of the semiconductor refrigeration chip, wherein the semiconductor refrigeration chip is used to cool the PCM phase change material through a temperature transfer wire to reduce the perceived temperature of the wearer of the mining cooling suit.

9. An electronic device, characterized in that: include: processor; a memory for storing instructions executable by the processor; The processor is configured to execute the instructions to implement the temperature control method for mining cooling clothing according to any one of claims 1 to 7.

10. A storage medium storing instructions, characterized in that: When the instruction is executed on an electronic device, the electronic device is caused to execute the temperature control method for a mining cooling suit according to any one of claims 1 to 7.

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