Chip independent temperature control system and method

Abstract

The invention relates to the technical field of chip testing, in particular to a chip independent temperature control system and method. The chip independent temperature control system comprises a heating assembly which comprises at least two heaters, any heater is used for bearing a corresponding to-be-tested chip, and the heating power of any heater is independently controlled; the cooling assembly comprises a cooling plate, and any heater is attached to the surface of the cooling plate; in a chip feeding and discharging stage, any heater is controlled to heat so as to realize that the heater reaches a target test temperature threshold value under the action of the cooling plate; and in the chip test stage, any heater is controlled to heat so as to realize that the chip to be tested and the heater reach the target test temperature threshold under the action of the cooling plate. The system can independently adjust and control the test temperatures of different chips to be tested, so that the temperatures of the different chips to be tested are kept consistent, and the accuracy of a test result is prevented from being influenced by the temperature difference between the different chips to be tested.

Description

Technical Field

[0001] The present application relates to the field of chip testing technology, and in particular to a chip independent temperature control system and method. Background Art

[0002] With the rapid development of the semiconductor industry, chip performance improvements are often accompanied by higher power consumption and heat generation. Maintaining a stable test environment temperature is particularly important during chip-level batch burn-in testing for chips with high heat loads.

[0003] However, most of the temperature testing systems for chips or wafers currently on the market are mainly designed for small-load chip products. In these application scenarios, the heat generated by the chip or wafer during the entire testing process is relatively small, and the temperature difference between chips is relatively easy to control. An integrated temperature control system can meet the needs.

[0004] When it comes to high-power, heat-generating chips, existing integrated temperature control solutions are insufficient in terms of heat dissipation and precise temperature control of individual chips. The lack of an effective single-chip temperature regulation mechanism can lead to large temperature variations, which not only affects the consistency and accuracy of test results but can also damage the chip due to overheating, reducing the quality and yield of test screening. Summary of the Invention

[0005] The embodiments of the present application at least provide a chip independent temperature control system and method, which can independently adjust and control the test temperature of different chips to be tested to keep the temperature of different chips to be tested consistent, thereby avoiding the accuracy of the test results affected by temperature differences between different chips to be tested.

[0006] In a first aspect, an embodiment of the present application provides a chip independent temperature control system, comprising:

[0007] A heating assembly comprising at least two heaters, each of which is used to carry a corresponding chip to be tested, and the heating power of each heater is independently controlled;

[0008] A cooling assembly includes a cooling plate, and any one of the heaters is attached to the surface of the cooling plate;

[0009] During the chip loading and unloading stage, any one of the heaters is controlled to heat so that the heater reaches a target test temperature threshold under the action of the cooling plate; and,

[0010] During the chip testing phase, any one of the heaters is controlled to heat so that the chip to be tested and the heater reach a target test temperature threshold under the action of the cooling plate.

[0011] In an optional embodiment, the heating assembly further includes at least one circuit board, any one of the heaters is electrically connected to the corresponding circuit board, and any one of the circuit boards is configured to adjust the heating power of the corresponding heater according to the temperature of any one of the connected heaters.

[0012] In an optional embodiment, the heating assembly further includes at least two temperature sensors connected to the corresponding circuit boards, and any one of the temperature sensors is inserted into the heater to detect the temperature of the corresponding heater.

[0013] In an optional embodiment, any two adjacently arranged circuit boards are arranged at intervals, and at least two heaters corresponding to the same circuit board are arranged at intervals along the extension direction of the circuit board.

[0014] In an optional embodiment, a refrigerant channel is provided in the cooling plate, a medium inlet is provided at one end of the refrigerant channel, and a medium outlet is provided at the other end, the flow rate of the medium is a preset flow value, and the temperature of the medium inlet is a preset temperature value.

[0015] In an optional embodiment, a groove is provided on the surface of the cooling plate facing the heating component, and any one of the circuit boards is installed in the groove.

[0016] In an optional embodiment, the system further includes a positioning assembly, the positioning assembly including a positioning plate, the positioning plate partially covering the heating assembly and the cooling plate, the positioning plate being provided with at least two positioning grooves, and any one of the heaters is embedded in the corresponding positioning groove.

[0017] In an optional embodiment, the depth of the positioning groove is not less than the height of the heater.

[0018] In an optional embodiment, the system further includes a chip fixing assembly, and the chip fixing assembly is configured to fix each of the chips to be tested to the corresponding heaters.

[0019] In an optional embodiment, the heater is provided with a through hole;

[0020] The chip fixing assembly includes an exhaust pipe and a joint. The exhaust pipe is arranged in the cooling plate and is connected to the through hole. The joint is arranged circumferentially of the cooling plate and is connected to the exhaust pipe. The joint is used to connect the exhaust pipe to the exhaust equipment.

[0021] In a second aspect, an embodiment of the present application further provides a chip independent temperature control method, applicable to the chip independent temperature control system described above, the method comprising:

[0022] Chip loading stage: According to the theoretical maximum heat output of each chip to be tested, the heating power of the corresponding heater is adjusted respectively, so that the corresponding heater reaches the preset target test temperature threshold under the action of the cooling plate;

[0023] Chip testing phase: When the temperature of the chip under test rises, the heating power of the corresponding heater is dynamically adjusted based on the temperature value of each heater monitored in real time to maintain the corresponding heater at the target test temperature threshold;

[0024] Chip test completion stage: When the chip under test is powered off and the temperature drops, the heating power of the corresponding heater is dynamically adjusted based on the temperature value of each heater monitored in real time to maintain each chip under test at the target test temperature threshold.

[0025] The above technical solution of this application has the following beneficial technical effects:

[0026] The chip independent temperature control system of the embodiment of the present application, wherein the heater and the cooling plate form multiple independent temperature control units, and any temperature control unit can adjust the heater temperature by independently adjusting the heating power of each heater, thereby ultimately achieving independent adjustment of the test temperature of the corresponding chip to be tested, so as to balance the individual differences of different chips to be tested during the test period and realize diversified testing. Furthermore, independent temperature control can not only offset the heat generation changes caused by different chip characteristics, but more importantly, when the heat generation increases sharply during the power-on test of the chip, or when the chip heat generation decreases sharply due to possible chip failure, the temperature can be maintained by adjusting the heater heating power through temperature feedback. This can prevent the temperature differences between the various chips to be tested from affecting the water cooling and disrupting the balance of the temperature control system, causing the accuracy of the test results of other chips to be affected, which is conducive to improving the accuracy of chip testing.

[0027] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. The drawings herein are incorporated into and constitute a part of the specification. These drawings illustrate embodiments consistent with the present application and, together with the specification, are used to illustrate the technical solutions of the present application. It should be understood that the following drawings only illustrate certain embodiments of the present application and should not be regarded as limiting the scope. For those of ordinary skill in the art, other relevant drawings can be obtained based on these drawings without inventive effort.

[0029] Figure 1 An exploded view of an independent chip temperature control system provided by an embodiment of the present application is shown;

[0030] Figure 2 Shown Figure 1 Assembly drawing of the provided chip independent temperature control system;

[0031] Figure 3 Shown Figure 2 A cross-sectional view of the provided chip independent temperature control system;

[0032] In the picture:

[0033] 1. Chip to be tested;

[0034] 100, positioning assembly; 101, positioning plate; 102, positioning slot;

[0035] 200, heating component; 201, circuit board; 202, heater; 2021, through hole; 203, temperature sensor;

[0036] 300, cooling assembly; 301, cooling plate; 302, refrigerant channel; 303, medium inlet; 304, medium outlet; 305, groove; 306, first through hole; 307, second through hole;

[0037] 400, chip fixing assembly; 401, exhaust pipe; 402, joint; 403, branch pipe. DETAILED DESCRIPTION

[0038] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application.

[0039] The embodiments of the present application will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0040] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly refer to one or more of the features. Throughout the description of this application, unless otherwise specified, "plurality" means two or more. Furthermore, "and / or" in the specification and claims refers to at least one of the connected entities, and the character " / " generally indicates an "or" relationship between the connected entities.

[0041] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0042] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0043] refer to Figures 1 to 3 , an embodiment of the present application provides a chip independent temperature control system, including: a heating component 200 and a cooling component 300. The heating component 200 includes at least two heaters 202, any heater 202 is used to carry the corresponding chip to be tested 1, and the heating power of any heater 202 is independently controlled. This embodiment exemplarily shows that the number of heaters 202 is forty-two, and the heaters 202 are distributed in an array, but this is not limited to the actual implementation. The cooling component 300 includes a cooling plate 301, and any heater is attached to the surface of the cooling plate 301. During the chip loading and unloading stage, any heater 202 is controlled to heat so that the heater 202 reaches the target test temperature threshold under the action of the cooling plate 301. During the chip testing stage, any heater 202 is controlled to heat so that the chip to be tested 1 and the heater 202 reach the target test temperature threshold under the action of the cooling plate 301.

[0044] The chip independent temperature control system, wherein the heater 202 and the cooling plate 301 form a plurality of independent temperature control units, any temperature control unit can adjust the temperature of the heater 202 by independently adjusting the heating power of each heater 202, thereby ultimately achieving independent adjustment of the test temperature of the corresponding chip 1 to be tested, so as to balance the individual differences of different chips 1 to be tested during the test period and realize diversified testing. Furthermore, independent temperature control can not only offset the heat generation changes caused by different chip characteristics, but more importantly, when the heat generation increases sharply during the power-on test of the chip, or when the heat generation of the chip decreases suddenly due to possible chip failure, the heating power of the heater 202 is adjusted through temperature feedback to achieve temperature maintenance, thereby preventing the temperature difference between the chips 1 to be tested from affecting the water cooling and breaking the balance of the temperature control system, causing the accuracy of the test results of other chips, which is conducive to improving the accuracy of chip testing.

[0045] In this embodiment, the heater 202 can adopt a customized ceramic heater (i.e., a ceramic sheet with a built-in heating wire). When using a customized ceramic heater, a high-power chip can be placed directly above the heater. Through the application of high thermal conductivity ceramics, the requirements of test indicators such as thermal conductivity, temperature control, and wear resistance can be met at the same time. In practical applications, the customized ceramic heater can specifically adopt an aluminum nitride ceramic heater. The thermal conductivity of aluminum nitride ceramics is generally between 170-230W / (m·K), which can ensure that heat is quickly and evenly distributed throughout the heating area, avoiding problems of local overheating or cold areas. In addition, aluminum nitride ceramics also have the advantages of high resistivity, good mechanical strength, wear resistance and crack resistance, and chemical stability.

[0046] In this embodiment, the heating assembly 200 further includes at least one circuit board 201. Each heater 202 is electrically connected to a corresponding circuit board 201. Each circuit board 201 is configured to adjust the heating power of the corresponding heater 202 based on the temperature of the connected heater 202. This embodiment exemplifies three circuit boards 201, each of which is electrically connected to fourteen heaters 202. This is not a limitation in actual implementation.

[0047] In this embodiment, the circuit board 201 has a first side attached to the cooling plate 301 and a second side facing away from the cooling plate 301. Each heater 202 can be electrically connected to the second side or side surface of the corresponding circuit board 201. For example, a connecting wire is provided on the side of the heater 202, with one end of the connecting wire extending to the second side of the corresponding circuit board 201 for electrical connection. Of course, the connection position and connection structure between the circuit board 201 and the heater 202 can be selected according to actual circumstances and are not limited to the methods discussed above.

[0048] In this embodiment, any two adjacent circuit boards 201 are spaced apart, and at least two heaters 202 corresponding to the same circuit board 201 are spaced apart along the extension direction of the circuit board 201. In other words, the heaters 202 can form an array of chip test sites. In a specific configuration, each circuit board 201 can be provided with a row of heaters 202 on either side. Of course, the arrangement of the circuit boards 201 and heaters 202 can be selected based on actual circumstances and is not limited to the configuration discussed above.

[0049] In this embodiment, the heating component 200 also includes at least two temperature sensors 203 connected to the corresponding circuit board 201, and any temperature sensor 203 is inserted into the heater 202 to detect the temperature of the corresponding heater 202. That is to say, any temperature sensor 203 can feedback the temperature information of the corresponding heater to the circuit board 201, so that the circuit board 201 can adjust the heating power of the corresponding heater 202 according to the internal PID adjustment setting rules, thereby realizing independent adjustment and control of the heating power of each heater 202. In the specific setting, the temperature sensor 203 can adopt a thermocouple, which has a simple structure, a small size, a fast response speed, and can quickly reflect temperature changes. Of course, the temperature sensor 203 can also be sintered in the heater 202, or pasted on the bottom of the heater 202 (that is, the side of the heater 202 facing the cooling plate 301).

[0050] In this embodiment, a refrigerant channel 302 is provided in the cooling plate 301, and the refrigerant channel 302 is used for the refrigerant medium to pass through to cool the heater 202. One end of the refrigerant channel 302 is provided with a medium inlet 303, and the medium inlet 303 is used for the refrigerant medium to flow into the refrigerant channel 302, and the other end is provided with a medium outlet 304, and the medium outlet 304 is used for the refrigerant medium to flow out of the refrigerant channel 302. Wherein, the flow rate of the medium is a preset flow value, and the temperature of the medium inlet 303 is a preset temperature value. During use, by increasing or decreasing the flow rate and temperature of the medium, the cooling power of the cooling plate 301 can be changed, so that the heat dissipation of the chip to be tested 1 can be adjusted. Of course, in other embodiments, the cooling plate 301 can also adopt other cooling methods, such as the cooling plate 301 can be a semiconductor refrigerator (TEC).

[0051] In this embodiment, a groove 305 is provided on the surface of the cooling plate 301 facing the heating assembly 200, and any circuit board 201 is installed in the groove 305. In a specific configuration, installing the circuit board 201 in the groove 305 can prevent the protrusion of the circuit board 201 from interfering with the connecting wires of the heater 202, thereby facilitating the connection between the circuit board 201 and the connecting wires of each heater 202.

[0052] In this embodiment, the system further includes a positioning assembly 100, which includes a positioning plate 101. The positioning plate 101 covers a portion of the heating assembly 200 and the cooling plate 301. The positioning plate 101 is provided with at least two positioning slots 102, and any heater 202 is embedded in a corresponding positioning slot 102. During actual use, the positioning slots 102 can be used to position the heater 202 so that the user can place the chip 1 to be tested on the corresponding heater 202.

[0053] In this embodiment, the positioning plate 101 and the cooling plate 301 are connected. In the connected state, the positioning plate 101 and the cooling plate 301 clamp the heating component 200 to fix it. This arrangement makes it unnecessary for the heating component 200 to be separately connected and fixed to the cooling plate 301, which is beneficial to reduce the number of fixing parts used and improve assembly efficiency. It can also achieve rapid disassembly and assembly of the heating component 200, making it easy to maintain and replace the heating component 200. In the specific setting, the positioning plate 101 and the cooling plate 301 can be fixed by bolts. Of course, the connection method of the positioning plate 101 and the cooling plate 301 can be selected according to actual conditions and is not limited to the method discussed above.

[0054] In this embodiment, the depth of the positioning groove 102 is not less than the height of the heater 202. That is, in the assembled state, the side of the heater 202 facing away from the cooling plate 301 can be flush with the side of the positioning plate 101 facing away from the cooling plate 301, or the side of the heater 202 facing away from the cooling plate 301 can also protrude from the side of the positioning plate 101 facing away from the cooling plate 301.

[0055] In this embodiment, a limiting structure is provided on the inner wall of the positioning groove 102, and the limiting structure can physically limit the heater 202 to limit the height of the heater 202 embedded in the positioning groove 102. For example, the inner wall of the positioning groove 102 can be provided with a step or a flange, etc., and the step or flange can be used to physically limit the heater 202 to limit the height of the heater 202 embedded in the positioning groove 102. Of course, the positioning groove 102 can also limit the height of the heater 202 inserted into the positioning groove 102 by changing its inner diameter. This arrangement can ensure that the height of each heater 202 is consistent, and thus can ensure that the heat conduction path from each heating zone to the cooling plate 301 is the same, thereby avoiding local temperature differences.

[0056] In this embodiment, the system further includes a chip fixing assembly 400, which is configured to fix each chip under test 1 to a corresponding heater 202. This configuration can achieve the goal of fixing the chip under test 1 to the corresponding heater 202, preventing the chip under test 1 from moving relative to the heater 202 and affecting the detection quality.

[0057] In this embodiment, the heater 202 is provided with a through hole 2021. The chip fixing assembly 400 includes an exhaust pipe 401 and a joint 402. The exhaust pipe 401 is arranged in the cooling plate 301 and is connected to the through hole 2021. The joint 402 is arranged around the cooling plate 301 and is connected to the exhaust pipe 401. The joint 402 is used to connect the exhaust pipe 401 to the exhaust device. When in use, the exhaust device draws air, and a negative pressure can be formed at the through hole 2021, thereby adsorbing the chip 1 to be tested at this position. In other words, the chip fixing assembly 400 can fix each chip 1 to be tested to the corresponding heater 202 by vacuuming. This arrangement not only ensures close contact between the chip and the heating block, but also reduces the air gap or impurities in the middle, thereby improving the heat conduction efficiency. Moreover, compared with the use of mechanical clamps, the vacuum adsorption method can avoid physical damage to the chip during clamping, and is also conducive to improving the efficiency of chip disassembly and assembly. In addition, since the exhaust pipe 401 is disposed inside the cooling plate 301 , the influence of the external environment (high temperature) on the pipe can be reduced, which helps to maintain the working performance of the chip fixing assembly 400 .

[0058] In this embodiment, there are multiple exhaust pipes 401, and each exhaust pipe 401 is connected to multiple through holes 2021. For example, the number of exhaust pipes 401 is one-third of the number of heating modules, and each exhaust pipe 401 is connected to three through holes 2021.

[0059] In this embodiment, the surface of the cooling plate 301 facing the heating assembly 200 is provided with at least one first through-hole 306. Each first through-hole 306 corresponds to a through-hole 2021, and each first through-hole 306 is connected to the corresponding through-hole 2021. The exhaust pipe 401 is provided with at least one branch pipe 403. Each branch pipe 403 is connected to a first through-hole 306, thereby connecting the exhaust pipe 401 to the corresponding through-hole 2021. In a specific configuration, the exhaust pipe 401 is provided with three branch pipes 403, so that the exhaust pipe 401 can be connected to three through-holes.

[0060] In this embodiment, at least one second through-hole 307 is provided on the side of the cooling plate 301. Each exhaust pipe 401 is connected to a corresponding connector 402 via a second through-hole 307. In other words, the connector 402 of each exhaust pipe 401 can be located outside the cooling plate 301, which facilitates connection between the connector 402 and the exhaust equipment.

[0061] The present application also provides a chip independent temperature control method, which is applicable to the chip independent temperature control system described above. The method includes:

[0062] Chip loading stage: According to the theoretical maximum heating value of each chip 1 to be tested, the heating power of the corresponding heater 202 is adjusted (greater than the maximum heating power of the chip) so that the corresponding heater 202 reaches the preset target test temperature threshold (low temperature, room temperature, high temperature) under the action of the cooling plate 301;

[0063] Chip testing phase: When the temperature of the chip 1 to be tested rises during testing, the heating power of the corresponding heater 202 is dynamically adjusted based on the temperature value of each heater 202 monitored in real time to maintain the corresponding heater 202 at the target test temperature threshold;

[0064] Chip test completion stage: When the chip 1 under test is powered off and the temperature drops, the heating power of the corresponding heater 202 is dynamically adjusted based on the temperature value of each heater 202 monitored in real time to maintain each chip under test 1 at the target test temperature.

[0065] In each stage, the cold medium acts continuously, which can shorten the temperature adjustment time, thereby shortening the time of the entire test process and improving the test effect.

[0066] In the above method, the chip under test 1 and the heater 202 are regarded as a whole heat load, and the heater 202 and the cooling plate 301 form a plurality of independent temperature control units. Any temperature control unit can adjust the temperature of the heater 202 by independently adjusting the heating power of each heater 202, thereby finally achieving independent adjustment of the test temperature of the corresponding chip under test 1, so as to balance the individual differences of different chips under test 1 during the test period and realize diversified testing. Furthermore, independent temperature control can not only offset the changes in heat generation caused by different chip characteristics, but more importantly, when the heat generation increases sharply during the power-on test of the chip, or when the heat generation of the chip decreases suddenly due to possible chip failure, the heating power of the heater 202 is adjusted through temperature feedback to achieve temperature maintenance, thereby avoiding the temperature difference between the chips under test 1 affecting the water cooling and breaking the balance of the temperature control system, causing the accuracy of the test results of other chips, which is conducive to improving the accuracy of chip testing.

[0067] The one or more embodiments of this specification are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of one or more embodiments of this specification shall be included within the scope of protection of this application.

[0068] The above are only specific embodiments of the present application, but the scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A chip independent temperature control system, characterized in that: include: A heating assembly comprising at least two heaters, each of which is used to carry a corresponding chip to be tested, and the heating power of each heater is independently controlled; A cooling assembly includes a cooling plate, and any one of the heaters is attached to the surface of the cooling plate; During the chip loading and unloading stage, any one of the heaters is controlled to heat so that the heater reaches a target test temperature threshold under the action of the cooling plate; and, During the chip testing phase, any one of the heaters is controlled to heat so that the chip to be tested and the heater reach a target test temperature threshold under the action of the cooling plate.

2. The chip independent temperature control system according to claim 1, characterized in that: The heating assembly further includes at least one circuit board, and any of the heaters is electrically connected to the corresponding circuit board. Any of the circuit boards is configured to adjust the heating power of the corresponding heater according to the temperature of any of the connected heaters.

3. The chip independent temperature control system according to claim 2, characterized in that: The heating assembly further includes at least two temperature sensors connected to the corresponding circuit boards, and any one of the temperature sensors is inserted into the heater to detect the temperature of the corresponding heater.

4. The chip independent temperature control system according to claim 2, characterized in that: Any two adjacently arranged circuit boards are arranged at intervals, and at least two heaters corresponding to the same circuit board are arranged at intervals along the extending direction of the circuit board.

5. The chip independent temperature control system according to claim 1, characterized in that: A refrigerant channel is provided in the cooling plate, a medium inlet is provided at one end of the refrigerant channel, and a medium outlet is provided at the other end. The flow rate of the medium is a preset flow value, and the temperature of the medium inlet is a preset temperature value.

6. The chip independent temperature control system according to claim 2, characterized in that: A groove is provided on the surface of the cooling plate facing the heating component, and any one of the circuit boards is installed in the groove.

7. The chip independent temperature control system according to claim 1, characterized in that: The system further includes a positioning assembly, which includes a positioning plate. The positioning plate covers a portion of the heating assembly and the cooling plate. The positioning plate is provided with at least two positioning grooves, and any one of the heaters is embedded in the corresponding positioning groove.

8. The chip independent temperature control system according to claim 7, characterized in that: The depth of the positioning groove is no greater than the height of the heater.

9. The chip independent temperature control system according to claim 1, characterized in that: The system further includes a chip fixing assembly, which is configured to fix each of the chips to be tested to the corresponding heaters.

10. The chip independent temperature control system according to claim 9, characterized in that: The heater is provided with a through hole; The chip fixing assembly includes an exhaust pipe and a joint. The exhaust pipe is arranged in the cooling plate and is connected to the through hole. The joint is arranged circumferentially of the cooling plate and is connected to the exhaust pipe. The joint is used to connect the exhaust pipe to the vacuum equipment.

11. A chip independent temperature control method, applicable to the chip independent temperature control system according to any one of claims 1 to 10, characterized in that: The method comprises: Chip loading stage: According to the theoretical maximum heat output of each chip to be tested, the heating power of the corresponding heater is adjusted respectively, so that the corresponding heater reaches the preset target test temperature threshold under the action of the cooling plate; Chip testing phase: When the chip under test is powered on and the temperature rises, the heating power of the corresponding heater is dynamically adjusted based on the temperature value of each heater monitored in real time to maintain the corresponding heater at the target test temperature threshold; Chip test completion stage: When the chip under test is powered off and the temperature drops, the heating power of the corresponding heater is dynamically adjusted based on the temperature value of each heater monitored in real time to maintain each chip under test at the target test temperature threshold.

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