PCB temperature collection busbar and preparation method thereof

Abstract

The invention discloses a PCB temperature collection busbar and a preparation method thereof, and the busbar comprises a plastic support, a plurality of conductive aluminum bars disposed on the plastic support, and a plurality of temperature collection assemblies disposed on the conductive aluminum bars. The temperature collecting assembly comprises a nickel sheet arranged on the conductive aluminum bar, a PCB electrically connected with the nickel sheet, a thermistor electrically connected with the PCB, and a wire harness electrically connected with the PCB. The temperature acquisition assembly has the advantages that the mode of combining the wire harness and the PCB is adopted, temperature monitoring is carried out in cooperation with the thermistor, compared with the structure completely adopting the wire harness, more cost can be saved, compared with the structure completely adopting the FPC, the performance is more stable, and the temperature acquisition assembly is not prone to falling off under the vibration condition by controlling the length of the wire harness.

Description

Technical Field

[0001] The present invention relates to the field of battery pack busbars, and in particular to a PCB temperature-collecting busbar and a preparation method thereof. Background Art

[0002] Currently, battery pack temperature monitoring primarily relies on integrated temperature sensors in wiring harnesses or FPCs, or discrete thermistors. However, these designs have significant drawbacks: The large number of wiring harnesses required and their high unit price lead to high overall wiring harness costs, sometimes accounting for over 30% of the total busbar cost. Furthermore, FPCs have poor mechanical reliability, making them susceptible to breakage when subjected to vibration during vehicle operation, leading to a high risk of thermal stress failure. Furthermore, the complex process of assembling FPCs on the battery pack busbar reduces FPC yield (less than 85%). Discrete sensor solutions are susceptible to electromagnetic interference due to long wiring distances (temperature sampling errors exceeding ±2°C) and feature redundant wiring harnesses (battery packs with more than 48 strings increase wiring harness weight by 40%). Furthermore, the thermal expansion and contraction characteristics of aluminum busbars can easily lead to poor sensor contact or cracked solder joints. Existing temperature-sensing busbars lack integrated wiring management, making repair difficult (MTTR exceeding 30 minutes).

[0003] For example, Chinese patent publication number CN117154457A discloses a battery pack temperature acquisition wiring harness comprising a temperature sensor assembly and positive and negative lead assemblies. The temperature sensor assemblies are provided with at least two, each comprising a temperature measuring element, a first lead and a second lead connected to the temperature measuring element, and a connector socket connected to the ends of the first and second leads remote from the temperature measuring element. The positive and negative lead assemblies comprise connector plugs, the same number as the connector sockets and compatible with them, each of which is connected to a positive lead and a negative lead. The positive lead of each connector plug and the negative lead of one of the connector plugs are provided with a port connection. All negative leads, except those with a port connection, are connected to the connector plug with the negative lead having a port connection, and all negative leads are electrically connected. The manufacturing process of such a wiring harness requires complex processes and is costly.

[0004] In view of this, it is necessary to provide a PCB temperature collecting busbar and a preparation method thereof. Summary of the Invention

[0005] The present invention provides a PCB heating busbar and a preparation method thereof, which effectively solve the problems of high cost and poor stability of existing heating busbars.

[0006] The technical solution adopted in the present invention is:

[0007] The PCB heating busbar includes a plastic bracket, a plurality of conductive aluminum bars arranged on the plastic bracket, and a plurality of heating components respectively arranged on the conductive aluminum bars. The heating components include a nickel sheet arranged on the conductive aluminum bar, a PCB electrically connected to the nickel sheet, a thermistor electrically connected to the PCB, and a wiring harness electrically connected to the PCB.

[0008] Furthermore, the conductive aluminum busbar includes a No. 1 plate-shaped body, a No. 2 plate-shaped body, and an arc-shaped body connecting the No. 1 plate-shaped body and the No. 2 plate-shaped body. The No. 1 plate-shaped body and the No. 2 plate-shaped body are symmetrically arranged along the arc-shaped body. The arc-shaped body protrudes from the upper end surfaces of the No. 1 plate-shaped body and the No. 2 plate-shaped body. An arc-shaped groove is formed between the arc-shaped body, the No. 1 plate-shaped body, and the No. 2 plate-shaped body. Both the No. 1 plate-shaped body and the No. 2 plate-shaped body are provided with battery core welding holes, and the nickel sheet is provided on the No. 1 plate-shaped body or the No. 2 plate-shaped body.

[0009] Furthermore, the plastic bracket is provided with a wire-passing channel and a plurality of grooves arranged on both sides of the wire-passing channel. A conductive aluminum row is arranged in each of the grooves, and the conductive aluminum rows on both sides are arranged alternately.

[0010] Furthermore, the sides of the No. 1 plate-shaped body and the No. 2 plate-shaped body are both provided with a plurality of lateral protrusions, and the side walls of the groove are provided with card slots adapted to the lateral protrusions.

[0011] Furthermore, the wire passage is provided with a plurality of horizontally arranged through holes, and also includes a plurality of tying wires, and the two ends of the tying wires pass through two adjacent through holes to bundle and fix the wire harness of the temperature collection component on the same side of the wire passage.

[0012] Furthermore, a heat shrink tubing is provided on the outer side of the wiring harness located on the same side of the wiring channel.

[0013] Furthermore, a rubber coating layer is provided on the PCB, and the rubber coating layer covers the connection between the PCB and the thermistor and the wiring harness and the PCB.

[0014] Furthermore, the plastic bracket is a blister bracket, and the conductive aluminum bar and the plastic bracket are connected by blister.

[0015] Furthermore, the plastic bracket is an injection-molded bracket, and the conductive aluminum bar is connected to the plastic bracket by snap-fit ​​connection.

[0016] A preparation method for preparing the PCB heating busbar: S1, forming a conductive aluminum busbar and a plastic bracket so that the conductive aluminum busbar is fixed on the plastic bracket; S2, connecting a heating component to the conductive aluminum busbar; S3, binding and arranging the wiring harnesses of each heating component.

[0017] Beneficial effects of the invention:

[0018] 1. The combination of wiring harness and PCB is used with thermistors for temperature monitoring. Compared with the structure that uses only wiring harnesses, it can save more costs. Compared with the structure that uses only FPCs, the performance is more stable. By controlling the length of the wiring harness, the temperature sensing component is not easy to fall off under vibration conditions.

[0019] 2. The conductive aluminum busbar is configured with a first plate-shaped body, a second plate-shaped body, and an arc-shaped body. This prevents thermal expansion and contraction during use, extending the service life of the busbar and the entire PCB heating busbar. It also prevents further movement of the nickel sheet on the busbar.

[0020] 3. Use wire ties to bundle the wire harnesses on the plastic bracket to organize the scattered wire harnesses and prevent them from tearing the PCB during vibration. Compared with FPC, the wire harness is more flexible within the same space. Although FPC is flexible, it is fixed as a whole and has poor mobility. It also has poor thermal expansion and contraction characteristics compared to the wire harness, making it more prone to tearing.

[0021] 4. Several conductive aluminum bars are alternately arranged on both sides of the plastic bracket, so that one plastic bracket can hold multiple conductive aluminum bars, thereby improving the utilization rate of the plastic bracket. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is an overall schematic diagram of the PCB heating busbar provided in an embodiment of the present application.

[0023] Figure 2 A schematic diagram of the temperature collection component of the PCB temperature collection busbar provided in an embodiment of the present application.

[0024] Figure 3 A partial schematic diagram of a PCB heating busbar provided in an embodiment of the present application.

[0025] Figure 4 This is a schematic cross-sectional view of the conductive aluminum busbar of the PCB heating busbar provided in an embodiment of the present application.

[0026] Figure 5 This is a physical picture of the PCB heating busbar provided in the embodiment of this application.

[0027] The markings in the figure are: 1. Plastic bracket; 2. Conductive aluminum busbar; 3. Temperature sampling component; 31. Nickel sheet; 32. PCB; 33. Thermistor; 34. Wiring harness; 21. Plate-like body No. 1; 22. Plate-like body No. 2; 23. Arc-shaped body; 201. Arc-shaped groove; 101. Wire passage; 202. Lateral protrusion; 103. Through hole. DETAILED DESCRIPTION

[0028] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0029] like Figure 1 、 Figure 2 and Figure 5 As shown, the first embodiment provided by the present application is a PCB temperature busbar, including a plastic bracket 1, several conductive aluminum bars 2 arranged on the plastic bracket 1, and several temperature collection components 3 respectively arranged on the conductive aluminum bars 2. The temperature collection components 3 include a nickel sheet 31 arranged on the conductive aluminum bar 2, a PCB 32 electrically connected to the nickel sheet 31, a thermistor 33 electrically connected to the PCB 32, and a wiring harness 34 electrically connected to the PCB 32.

[0030] In actual use, the plastic bracket 1 is fixed in the battery pack, and the other end of the wiring harness 34 is connected via a connector and electrically connected to the battery pack's battery management system. The conductive aluminum bus 2 is connected to the battery cell to transmit current. During the battery transmission process, current flows through the conductive aluminum bus 2, nickel sheet 31, PCB 32, thermistor 33, and wiring harness 34. Due to the long-term current transmission, the temperature of the entire battery pack will change, which will also cause the temperature of PCB 32 to change. The resistance of thermistor 33 decreases as the temperature rises. The battery management system monitors the temperature of the entire battery pack by monitoring the resistance of thermistor 33.

[0031] In the above design, the wiring harness 34 in the temperature sampling component 3 is low in cost and saves costs. The temperature can be effectively monitored by using the PCB 32 and the thermistor 33, and the entire busbar is easy to assemble.

[0032] Specifically: Figure 2 and Figure 3 As shown, the conductive aluminum bus 2 includes a plate-like body 21, a plate-like body 22, and an arc-shaped body 23 connecting the plate-like body 21 and the plate-like body 22. The plate-like body 21 and the plate-like body 22 are symmetrical along the arc-shaped body 23. The arc-shaped body 23 protrudes from the upper end surfaces of the plate-like body 21 and the plate-like body 22. An arc-shaped groove 201 is formed between the arc-shaped body 23, the plate-like body 21 and the plate-like body 22. The plate-like body 21 and the plate-like body 22 are both provided with battery core welding holes. The nickel sheet 31 is provided on the plate-like body 21 or the plate-like body 22.

[0033] In actual use, the positive and negative electrodes of a single battery cell are welded to the cell welding holes of the first and second plate-shaped bodies 21 and 22, respectively, of the same conductive aluminum busbar 2. Because the battery pack generates heat during operation, the temperature of the conductive aluminum busbar 2 rises accordingly. Aluminum has significant thermal expansion and contraction properties. When the first and second plate-shaped bodies 21 and 22 are heated, they expand toward the curved body 23. The arcuate grooves 201 provide a buffer for these expanded portions, preventing deformation of the conductive aluminum busbar 2 toward its end faces.

[0034] In the above design, the structural design and specific implementation methods of the conductive aluminum busbar 2 can effectively prevent deformation of the conductive aluminum busbar 2 due to thermal expansion and contraction during use, thereby improving the safety of the conductive aluminum busbar 2.

[0035] Specifically: Figure 1 As shown, the plastic bracket 1 is provided with a wire-passing channel 101 and a plurality of grooves arranged on both sides of the wire-passing channel 101. A conductive aluminum row 2 is arranged in each of the grooves, and the conductive aluminum rows 2 on both sides are arranged alternately.

[0036] In actual use, the wire channel 101 arranges the wire harness 34 and provides insulation support for multiple conductive aluminum bars 2 through a plastic bracket 1.

[0037] In the above design, the structural design of the plastic bracket 1 facilitates the installation of multiple temperature collection components 3.

[0038] Specifically: Figure 3 As shown, the sides of the No. 1 plate-shaped body 21 and the No. 2 plate-shaped body 22 are both provided with a plurality of lateral protrusions 202 , and the side walls of the groove are provided with slots adapted to the lateral protrusions 202 .

[0039] During actual use, the first plate-shaped body 21 and the plastic bracket 1 , and the second plate-shaped body 22 and the plastic bracket 1 are further fixed by the cooperation between the card slot and the lateral protrusion 202 .

[0040] In the above design, the conductive aluminum bar 2 can be fixed by providing the engagement groove and the lateral protrusion 202 .

[0041] Specifically: Figure 1 and Figure 3 As shown, the wire passage 101 is provided with a plurality of horizontally arranged through holes 103 and also includes a plurality of tying wires. The two ends of the tying wires pass through two adjacent through holes 103 and then bundle and fix the wire harness 34 of the temperature collection component 3 on the same side of the wire passage 101.

[0042] During actual use, multiple wire harnesses 34 at the same position are bundled together by tying wires to fix the wire harnesses 34 .

[0043] In the above design, by providing a through hole 103 for the wire harness 34 to pass through, it is convenient to reduce the weight of the plastic bracket 1 and to fix the wire harness 34.

[0044] Specifically, the outer side of the wire harness 34 located on the same side of the wire passage 101 is covered with a heat shrink tubing.

[0045] In actual application, the plurality of wire harnesses 34 are bound and tightened by heat shrink tubing, which can effectively prevent the wire harnesses 34 from being scattered.

[0046] Specifically, a rubber coating layer is provided on the PCB 32 , and the rubber coating layer covers the connection between the PCB 32 and the thermistor 33 , and the connection between the wiring harness 34 and the PCB 32 .

[0047] In actual use, the thermistor 33 and the connector of the wiring harness 34 are fixed by providing a rubber coating layer to ensure that the thermistor 33 and the wiring harness 34 are fixed on the PCB 32.

[0048] In the above design, the design of the rubber layer and the specific implementation method facilitate the fixation of the temperature collection component 3.

[0049] Specifically, the plastic bracket 1 is a blister bracket, and the conductive aluminum bar 2 is connected to the plastic bracket 1 by blister.

[0050] In actual use, the conductive aluminum bar 2 and the plastic bracket 1 are fixed together by hot riveting.

[0051] In the above design, the plastic bracket 1 and the conductive aluminum bar 2 are formed by vacuum forming, which has the advantage of low cost.

[0052] Specifically, the plastic bracket 1 is an injection-molded bracket, and the conductive aluminum bar 2 is connected to the plastic bracket 1 by snap-fit ​​connection.

[0053] In actual use, the plastic bracket 1 and the conductive aluminum bar 2 are fixed and formed by snapping.

[0054] In the above design, the plastic bracket 1 and the conductive aluminum bus 2 are fixed and formed by snap-fitting to ensure the accuracy of the plastic bracket 1 and the connection accuracy between the plastic bracket 1 and the conductive aluminum bus 2 .

[0055] The second embodiment provided in this application is a preparation method for preparing the PCB32 heating busbar, S1, forming the conductive aluminum busbar 2 and the plastic bracket 1 so that the conductive aluminum busbar 2 is fixed on the plastic bracket 1; S2, connecting the heating component 3 with the conductive aluminum busbar 2; S3, binding and arranging the wiring harness 34 of each heating component 3.

[0056] In the above design, the preparation method can realize the rapid assembly of the PCB32 heating busbar.

[0057] The third embodiment provided in the present application is a PCB32 temperature collection busbar, which includes a plastic bracket 1, several conductive aluminum bars 2 arranged on the plastic bracket 1, and several temperature collection components 3 respectively arranged on the conductive aluminum bars 2. The temperature collection components 3 include a nickel sheet 31 arranged on the conductive aluminum bar 2, a PCB32 electrically connected to the nickel sheet 31, a thermistor 33 electrically connected to the PCB32, and a wiring harness 34 electrically connected to the PCB32. The conductive aluminum busbar 2 includes a first plate-shaped body 21, a second plate-shaped body 22, and an arc-shaped body 23 connecting the first and second plate-shaped bodies 21 and 22. The first and second plate-shaped bodies 21 and 22 are symmetrical along the arc-shaped body 23. The arc-shaped body 23 protrudes from the upper end surfaces of the first and second plate-shaped bodies 21 and 22. An arc-shaped groove 201 is formed between the arc-shaped body 23, the first and second plate-shaped bodies 21 and 22. The first and second plate-shaped bodies 21 and 22 are each provided with a battery core welding hole. The nickel sheet 31 is provided on the first plate-shaped body 21. The plastic bracket 1 is provided with a wire-passing channel 101 and a plurality of grooves provided on both sides of the wire-passing channel 101. A conductive aluminum busbar 2 is provided in each groove, and the conductive aluminum busbars 2 on both sides are alternately provided. The sides of the No. 1 plate-like body 21 and the No. 2 plate-like body 22 are both provided with a number of lateral protrusions, and the side walls of the grooves are provided with slots adapted to the lateral protrusions. The wire through hole 103 is provided with a number of horizontally arranged through holes 103, and also includes a number of ties, the two ends of which pass through two adjacent through holes 103 to bundle and fix the wire harness 34 of the temperature collection component 3 on the same side of the wire through channel 101. The outer side of the wire harness 34 on the same side of the wire through channel 101 is covered with a heat shrink tubing. The PCB 32 is provided with a rubber coating layer, and the rubber coating layer is coated on the connection between the PCB 32 and the thermistor 33 and the connection between the wire harness 34 and the PCB 32. The plastic bracket 1 is a blister bracket, and the conductive aluminum bar 2 is connected to the plastic bracket 1 by blister. The plastic bracket 1 is an injection molded bracket, and the conductive aluminum bar 2 is connected to the plastic bracket 1 by snap-fit.

[0058] In actual use, the plastic bracket 1 is fixed in the battery pack, and one end of the wiring harness 34 is electrically connected to the PCB 32. The wiring harness 34 is laid along the wire channel 101 through a connector, and the other end of the wiring harness 34 is connected and electrically connected to the battery pack's battery management system. The battery cell welding holes of the No. 1 plate-shaped body 21 and the No. 2 plate-shaped body 22 are respectively connected to the positive and negative poles of the battery cells to achieve current transmission. During the battery transmission process, current flows through the conductive aluminum bus 2, nickel sheet 31, PCB 32, thermistor 33, and wiring harness 34. Since long-term current transmission causes changes in the temperature of the entire battery pack, which in turn causes changes in the temperature of the PCB 32, the resistance of thermistor 33 decreases as the temperature rises. The battery management system monitors the temperature of the entire battery pack by monitoring the resistance of thermistor 33. Furthermore, since the current generates heat transfer, the temperature of the conductive aluminum busbar 2 rises. Since aluminum has the property of thermal expansion and contraction, the conductive aluminum busbar 2 will expand when heated. At this time, the first plate-shaped body 21 and the second plate-shaped body 22 will expand toward the side of the arc-shaped groove 201. When the battery pack stops charging and discharging, the conductive aluminum busbar 2 will cool down relative to the charging and discharging process. At this time, the first plate-shaped body 21 and the second plate-shaped body 22 cool and contract, and the arc-shaped body 23 will compensate for the contraction of the first plate-shaped body 21 and the second plate-shaped body 22.

[0059] In the above design, the conductive aluminum bar 2 can effectively prevent thermal expansion and contraction, and the temperature collection component 3 uses a wiring harness 34 + PCB 32 for conduction and signal transmission, which is convenient for laying the entire temperature collection component 3 and significantly reduces the cost compared to using all wiring harnesses.

[0060] To explain in further detail, it should be understood that the above is only a specific embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A PCB heating busbar, comprising a plastic support (1) and a plurality of conductive aluminum bars (2) arranged on the plastic support (1), characterized in that: The invention also includes a plurality of temperature collection components (3) respectively arranged on the conductive aluminum bar (2), wherein the temperature collection components (3) include a nickel sheet (31) arranged on the conductive aluminum bar (2), a PCB (32) electrically connected to the nickel sheet (31), a thermistor (33) electrically connected to the PCB (32), and a wiring harness (34) electrically connected to the PCB (32).

2. The PCB heating busbar according to claim 1, characterized in that: The conductive aluminum bar (2) comprises a first plate-shaped body (21), a second plate-shaped body (22), and an arc-shaped body (23) connecting the first plate-shaped body (21) and the second plate-shaped body (22). The first plate-shaped body (21) and the second plate-shaped body (22) are symmetrically arranged along the arc-shaped body (23). The arc-shaped body (23) protrudes from the upper end surfaces of the first plate-shaped body (21) and the second plate-shaped body (22). An arc-shaped groove (201) is formed between the arc-shaped body (23), the first plate-shaped body (21), and the second plate-shaped body (22). The first plate-shaped body (21) and the second plate-shaped body (22) are both provided with a core welding hole.

3. The PCB heating busbar according to claim 1, characterized in that: The plastic support (1) is provided with a wire-passing channel (101) and a plurality of grooves arranged on both sides of the wire-passing channel (101), each of the grooves being provided with a conductive aluminum row (2), and the conductive aluminum rows (2) on both sides being arranged alternately.

4. The PCB heating busbar according to claim 2, characterized in that: The sides of the first plate-shaped body (21) and the second plate-shaped body (22) are both provided with a plurality of lateral protrusions (202), and the side walls of the groove are provided with slots adapted to the lateral protrusions (202).

5. The PCB heating busbar according to claim 1, characterized in that: The wire passage (101) is provided with a plurality of horizontally arranged through holes (103), and also includes a plurality of binding wires, the two ends of which pass through two adjacent through holes (103) to bind and fix the wire harness (34) of the temperature collection component (3) on the same side of the wire passage (101).

6. The PCB heating busbar according to claim 3, characterized in that: The outer side of the wire harness (34) located on the same side of the wire passage (101) is covered with a heat shrink tubing.

7. The PCB heating busbar according to claim 1, characterized in that: The PCB (32) is provided with a rubber coating layer, and the rubber coating layer covers the connection between the PCB (32) and the thermistor (33) and the connection between the wiring harness (34) and the PCB (32).

8. The PCB heating busbar according to claim 1, characterized in that: The plastic support (1) is a blister support, and the conductive aluminum bar (2) is connected to the plastic support (1) by blister.

9. The PCB heating busbar according to claim 1, characterized in that: The plastic bracket (1) is an injection-molded bracket, and the conductive aluminum bar (2) is connected to the plastic bracket (1) by snap-fit ​​connection.

10. A preparation method for preparing the PCB temperature collecting busbar according to any one of claims 1 to 9, characterized in that: S1. Molding the conductive aluminum bar (2) and the plastic bracket (1) so that the conductive aluminum bar (2) is fixed on the plastic bracket (1); S2. Connecting the temperature collection component (3) with the conductive aluminum bar (2); S3. Binding and arranging the wire harnesses (34) of each temperature collection component (3).

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