Rotary wafer film uncovering equipment

Abstract

The invention discloses rotary wafer film uncovering equipment, and belongs to the technical field of wafer processing. A rotary wafer film uncovering device comprises an operation table and a lifting device, a substrate is arranged on the upper side of the operation table, an adsorption mechanism is arranged in the substrate, and the adsorption mechanism is used for adsorbing and loosening a wafer; a wafer film on the wafer is provided with at least one raising opening; an overturning shaft is arranged on the base plate, an overturning driving device is arranged on the upper side of the operation table, and the overturning driving device is connected with the overturning shaft; a film clamping mechanism and a lifting frame are arranged on the upper side of the operation table, and the film clamping mechanism is arranged on the lifting frame. According to the rotary type wafer film uncovering equipment provided by the invention, when the wafer film is separated, the overturning driving device can drive the wafer to rotate, so that a relatively large angle is always formed between the wafer film and the wafer, the wafer film can be completely separated, and the wafer film which is not removed is not left on the wafer.

Description

Technical Field

[0001] The invention belongs to the technical field of wafer processing, and in particular relates to a rotary wafer film peeling device. Background Art

[0002] The wafer thinning process usually involves sticking a protective film on the front side of the wafer after the front side process is completed, then thinning is performed, and then the film is peeled off before the back side process is performed.

[0003] Currently, when peeling off the film from a wafer, the wafer is usually placed horizontally, and then a corner of the wafer film is pulled vertically to separate the wafer from the wafer film. This operation has the following problems: As the film peeling process progresses, the wafer film gradually moves upward, and the part where the wafer film adheres to the wafer is farther and farther away from the corner of the initially clamped wafer. The angle between the wafer film and the wafer is also getting smaller and smaller, which makes the force separating the wafer film from the wafer smaller, and the force in other directions becomes larger, which can easily cause the wafer film to be torn, resulting in a portion of the wafer film remaining on the wafer that is difficult to separate. Therefore, the present application proposes a rotary wafer film peeling device. When the wafer film is separated, the flip drive device will drive the wafer to rotate, and the wafer film will always form a large angle with the wafer. The force between the wafer film and the wafer is kept within a large range, so that the wafer film can be completely separated, and no uncleaned wafer film will remain on the wafer. Summary of the Invention

[0004] The purpose of the present invention is to provide a rotary wafer film peeling device to solve the problem raised in the above background technology that as the film peeling proceeds, the angle between the wafer film and the wafer becomes smaller and smaller, which makes the force separating the wafer film and the wafer smaller and the force in other directions becomes larger, which easily causes the wafer film to be torn.

[0005] To achieve the above objectives, the present invention provides the following technical solutions: a rotary wafer peeling device comprising an operating table and a lifting device, wherein a base plate is provided on the upper side of the operating table, and an adsorption mechanism is provided inside the base plate, the adsorption mechanism being used to adsorb and release the wafer; The wafer film on the wafer is provided with at least one upward opening; The base plate is provided with a turning shaft, the upper side of the operating table is provided with a turning drive device, and the turning drive device is connected to the turning shaft; The upper side of the operating table is provided with a film clamping mechanism and a lifting frame, the film clamping mechanism is provided on the lifting frame, and the film clamping mechanism is used to clamp and release at least one upward opening of the wafer film; The lifting frame is connected with a lifting plate, and the lifting plate is connected with the lifting device.

[0006] In a further technical solution, the adsorption mechanism includes a suction cup, an air inlet and outlet pipe, and an air pump. A groove and an air vent are provided in the substrate, and the suction cup is provided in the groove. Multiple suction cups are connected through the air inlet and outlet pipes, and the air inlet and outlet pipes are connected to the air pump.

[0007] In a further technical solution, the air vents are connected to the groove, and a plurality of suction cups are distributed in a circular array around the center line of the groove.

[0008] In a further technical solution, the membrane clamping mechanism includes a lower clamping jaw, an upper clamping jaw, a mounting seat, and a clamping hydraulic rod. The lower clamping jaw is movably connected to the upper clamping jaw, and the lower clamping jaw is connected to the mounting seat, and the upper clamping jaw is movably connected to the mounting seat.

[0009] In a further technical solution, the lower clamping jaw and the upper clamping jaw are respectively located on the upper and lower sides of the wafer film, the upper clamping jaw is movably connected to the clamping hydraulic rod, and the output end of the clamping hydraulic rod is movably connected to the lifting frame.

[0010] In a further technical solution, a central character board and a support frame are provided on the upper side of the lifting frame, the central character board is connected to the lifting frame, and the central character board and the support frame can only move up and down relative to each other.

[0011] In a further technical solution, a front-rear displacement mechanism and a waste film storage box are provided on the upper side of the operating table, the support frame is connected to the front-rear displacement mechanism, and the waste film storage box is located on the lower side of the base plate.

[0012] In a further technical solution, the front-rear displacement mechanism includes a housing, a threaded rod, a drive motor, and a threaded slider.

[0013] In a further technical solution, the shell is arranged on an operating table, a threaded rod is inserted into the shell, the threaded rod is connected to the threaded slider through threads, the threaded slider is slidably connected to the shell, and the threaded slider is connected to the support frame.

[0014] In a further technical solution, the lifting device is arranged on the support frame.

[0015] Beneficial effects: When the wafer film is detached, the flip driving device drives the wafer to rotate, so that the wafer film will always form a large angle between the wafer and the wafer, and the wafer film can be completely detached without leaving any uncleaned wafer film on the wafer.

[0016] The present invention provides a rotary wafer film peeling device, in which the front and rear displacement mechanism can drive the film clamping mechanism to move forward and backward, thereby extending the lower clamping jaws and the upper clamping jaws into the upper and lower sides of the wafer film, and after the flip driving device drives the substrate to rotate, the wafer is rotated to a vertical state. At this time, the film clamping mechanism and the wafer are staggered front and back. After the film clamping mechanism is released, the wafer film clamped on it will fall into the waste film storage box and be collected together for subsequent unified processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 Schematic diagram of the structure of the rotary wafer film stripping device of the present invention; Figure 2 A top view of the rotary wafer peeling device of the present invention; Figure 3 A side view of the rotary wafer peeling device of the present invention; Figure 4 Schematic diagram of the internal structure of the rotary wafer film stripping device of the present invention; Figure 5 For the present invention Figure 4 Schematic diagram of the enlarged structure at A in the middle; Figure 6 For the present invention Figure 4 Schematic diagram of the enlarged structure at B in the middle; Description of reference numerals: 1. Operating table; 2. Base plate; 201. Air vent; 3. Adsorption mechanism; 301. Suction cup; 302. Air inlet and outlet pipes; 303. Air pump; 4. Wafer; 5. Wafer film; 6. Flip axis; 7. Flip drive device; 8. Film clamping mechanism; 801. Lower clamping jaw; 802. Upper clamping jaw; 803. Mounting seat; 804. Clamping hydraulic rod; 9. Lifting frame; 10. Lifting plate; 11. Lifting device; 12. Middle plate; 13. Support frame; 14. Forward and backward displacement mechanism; 1401. Shell; 1402. Threaded rod; 1403. Drive motor; 1404. Threaded slider; 15. Waste film storage box. DETAILED DESCRIPTION

[0018] The specific embodiments of the present invention are described in detail below, but it should be understood that the protection scope of the present invention is not limited by the specific embodiments.

[0019] Example 1: like Figures 1-6 As shown, a rotary wafer peeling device includes an operating table 1 and a lifting device 11. The device is characterized in that a base plate 2 is provided on the upper side of the operating table 1, and an adsorption mechanism 3 is provided inside the base plate 2. The adsorption mechanism 3 is used to adsorb and release a wafer 4. The wafer film 5 on the wafer 4 is provided with at least one upward opening; A turning shaft 6 is provided on the base plate 2, and a turning drive device 7 is provided on the upper side of the operating table 1, and the turning drive device 7 is connected to the turning shaft 6; A film clamping mechanism 8 and a lifting frame 9 are provided on the upper side of the operating table 1. The film clamping mechanism 8 is provided on the lifting frame 9. The film clamping mechanism 8 is used to clamp and release at least one upward opening of the wafer film 5. The lifting frame 9 is connected to a lifting plate 10 , and the lifting plate 10 is connected to a lifting device 11 .

[0020] Example 2: like Figures 1-6 As shown, on the basis of Example 1, the film clamping mechanism 8 includes a lower clamping jaw 801, an upper clamping jaw 802, a mounting seat 803, and a clamping hydraulic rod 804. The lower clamping jaw 801 is movably connected to the upper clamping jaw 802, and the lower clamping jaw 801 is connected to the mounting seat 803, and the upper clamping jaw 802 is movably connected to the mounting seat 803. The lower clamping jaw 801 and the upper clamping jaw 802 are respectively located on the upper and lower sides of the wafer film 5, the upper clamping jaw 802 is movably connected to the clamping hydraulic rod 804, and the output end of the clamping hydraulic rod 804 is movably connected to the lifting frame 9.

[0021] Example 3: like Figures 1-6As shown, an embodiment of the present invention provides a rotary wafer film peeling device, which includes an operating table 1 and a lifting device 11. A substrate 2 is provided on the upper side of the operating table 1, and an adsorption mechanism 3 is provided inside the substrate 2. The adsorption mechanism 3 is used to adsorb and release the wafer 4.

[0022] Specifically, the adsorption mechanism 3 includes a suction cup 301, an air inlet and outlet pipe 302, and an air pump 303. A groove and an air vent 201 are provided in the substrate 2. The air vent 201 is connected to the groove. The suction cup 301 is provided in the groove, and multiple suction cups 301 are distributed in a circular array around the center line of the groove. Multiple suction cups 301 are connected through the air inlet and outlet pipe 302, and the air inlet and outlet pipe 302 is connected to the air pump 303.

[0023] The air pump 303 can absorb external gas and allow the gas to enter the air inlet and outlet pipes 302. The gas flow in the air inlet and outlet pipes 302 can absorb the gas at the suction cup 301 or pass gas into the suction cup 301, pressing the wafer 4 on the upper side of the suction cup 301. Then the air pump 303 is started to absorb the gas in the suction cup 301, allowing the suction cup 301 to be adsorbed on the wafer 4, thereby fixing the position between the suction cup 301 and the wafer 4, and the suction cup 301 is fixedly connected to the substrate 2. At this time, the position of the wafer 4 is fixed, that is, the adsorption mechanism 3 sucks the wafer 4, and the air pump 303 passes gas into the suction cup 301, which can separate the suction cup 301 from the wafer 4. At this time, the adsorption mechanism 3 releases the wafer 4.

[0024] Before tearing the film, an opening needs to be set at a corner of the wafer film 5 that is bonded to the wafer 4. The opening can be made by the stripping liquid of the wafer 4 contacting and mixing with the wafer 4, so that an upward opening appears at one or more corners of the wafer 4. The upward opening is that the wafer film 5 is lifted toward the side away from the wafer 4. The wafer film 5 on the wafer 4 is provided with at least one upward opening.

[0025] In order to separate the wafer 4 from the wafer film 5, a flip shaft 6 is provided on the substrate 2, and a flip drive device 7 is provided on the upper side of the operating table 1. The flip drive device 7 is connected to the flip shaft 6 and can drive the flip shaft 6 to rotate, thereby driving the substrate 2 to rotate, so that the substrate 2 can rotate forward and reverse, and the wafer 4 on the substrate 2 rotates together with the substrate 2. The flip drive device 7 can use a motor to drive the flip shaft 6 to rotate. In order to facilitate the control of the rotation angle of the motor, the flip drive device 7 should also include a driver and an encoder.

[0026] Specifically, a film clamping mechanism 8 and a lifting frame 9 are provided on the upper side of the operating table 1 . The film clamping mechanism 8 is provided on the lifting frame 9 . The film clamping mechanism 8 is used to clamp and release at least one upward opening of the wafer film 5 .

[0027] More specifically, the film clamping mechanism 8 includes a lower clamping jaw 801, an upper clamping jaw 802, a mounting seat 803, and a clamping hydraulic rod 804. The lower clamping jaw 801 is movably connected to the upper clamping jaw 802, and the lower clamping jaw 801 is connected to the mounting seat 803. The upper clamping jaw 802 is movably connected to the mounting seat 803. The lower clamping jaw 801 and the upper clamping jaw 802 are respectively located on the upper and lower sides of the wafer film 5. The upper clamping jaw 802 is movably connected to the clamping hydraulic rod 804, and the output end of the clamping hydraulic rod 804 is movably connected to the lifting frame 9.

[0028] The clamping hydraulic rod 804 can be a hydraulic cylinder. When the clamping hydraulic rod 804 is started, it can push the upper clamping jaw 802 to rotate downward or upward. When the upper clamping jaw 802 rotates downward, it will approach the lower clamping jaw 801, thereby clamping the wafer film 5, and when the upper clamping jaw 802 rotates upward, it will move away from the lower clamping jaw 801, thereby loosening the wafer film 5.

[0029] In order to drive the lifting frame 9 to move up and down, the lifting frame 9 is connected to a lifting plate 10, which is connected to a lifting device 11. The lifting device 11 can drive the lifting plate 10 to move up and down, thereby driving the lifting plate 10 to move up and down, which can drive the film clamping mechanism 8 to move up and down. The film clamping mechanism 8 clamps one of the upward openings of the wafer film 5. The upward movement of the film clamping mechanism 8 can gradually separate the wafer film 5 from the wafer 4. The lifting device 11 can be a cylinder, or a lead screw and nut structure.

[0030] The flip drive device 7 can drive the flip shaft 6 to rotate, and then drive the substrate 2 to rotate, so that the substrate 2 can rotate forward and backward, and the wafer 4 on the substrate 2 rotates together with the substrate 2. When the wafer film 5 on the wafer 4 is torn off, the lifting device 11 drives the lifting plate 10 to move up, and the lifting frame 9 and the film clamping mechanism 8 connected to the lifting plate 10 move up together. The upper mouth clamped by the film clamping mechanism 8 will pull the wafer film 5. At the same time, the flip drive device 7 drives the flip shaft 6 to rotate, so that the substrate 2 rotates downward, and when rotating, the film clamping mechanism 8 The lower half of the substrate 2 rotates downward, so that the film clamping mechanism 8 pulls the wafer film 5 upward, and the wafer 4 rotates downward and gradually separates from the wafer film 5. The two cooperate with each other to speed up the separation speed of the wafer film 5, and when the wafer film 5 is separated, the flipping drive device 7 will drive the wafer 4 to rotate, so the wafer film 5 will always form a larger angle with the wafer 4, and the larger the angle, the more uniform the force will be when the wafer film 5 is separated, and the wafer film 5 can be completely separated, and no uncleaned wafer film 5 will remain on the wafer 4.

[0031] It should be noted that a central plate 12 and a support frame 13 are provided on the upper side of the lifting frame 9 . The central plate 12 is connected to the lifting frame 9 . The central plate 12 and the support frame 13 can only move relative to each other up and down.

[0032] More specifically, a front-to-back displacement mechanism 14 and a waste film storage box 15 are provided on the upper side of the operating table 1, and the support frame 13 is connected to the front-to-back displacement mechanism 14. The waste film storage box 15 is located on the lower side of the substrate 2. The front-to-back displacement mechanism 14 can drive the film clamping mechanism 8 to move back and forth, thereby extending the lower clamping jaw 801 and the upper clamping jaw 802 into the upper and lower sides of the wafer film 5, and after the flipping drive device 7 drives the substrate 2 to rotate, the wafer 4 is rotated to a vertical state. At this time, the film clamping mechanism 8 and the wafer 4 are staggered front and back. After the film clamping mechanism 8 is loosened, the wafer film 5 clamped on it will fall into the waste film storage box 15 and be collected together for subsequent unified processing.

[0033] Please refer to Figure 3 The front-rear displacement mechanism 14 includes a shell 1401, a threaded rod 1402, a drive motor 1403, and a threaded slider 1404. The shell 1401 is set on the operating table 1, and the threaded rod 1402 is inserted into the shell 1401. The threaded rod 1402 is connected to the threaded slider 1404 through threads. The threaded slider 1404 is slidably connected to the shell 1401. The threaded slider 1404 is connected to the support frame 13, and the lifting device 11 is set on the support frame 13.

[0034] In summary: The embodiment of the present invention provides a rotary wafer film peeling device, the flip drive device 7 can drive the flip shaft 6 to rotate, and then drive the substrate 2 to rotate, so that the substrate 2 can rotate forward and backward, and the wafer 4 on the substrate 2 rotates together with the substrate 2. When the wafer film 5 on the wafer 4 is torn off, the lifting device 11 drives the lifting plate 10 to move upward, and the lifting frame 9 and the film clamping mechanism 8 connected to the lifting plate 10 move upward together. The upper mouth clamped by the film clamping mechanism 8 will pull the wafer film 5, and at the same time, the flip drive device 7 drives the flip shaft 6 to rotate, so that the substrate 2 rotates downward , and when rotating, the half substrate 2 on the lower side of the film clamping mechanism 8 rotates downward, so that the film clamping mechanism 8 pulls the wafer film 5 upward, and the wafer 4 rotates downward and gradually separates from the wafer film 5. The two cooperate with each other to speed up the separation speed of the wafer film 5, and when the wafer film 5 is separated, the flipping drive device 7 will drive the wafer 4 to rotate, so the wafer film 5 will always form a larger angle with the wafer 4, and the larger the angle, the more uniform the force will be when the wafer film 5 is separated, and the wafer film 5 can be completely separated, and no uncleaned wafer film 5 will remain on the wafer 4.

[0035] The front-to-back displacement mechanism 14 can drive the film clamping mechanism 8 to move forward and backward, thereby extending the lower clamping jaw 801 and the upper clamping jaw 802 into the upper and lower sides of the wafer film 5, and after the flip driving device 7 drives the substrate 2 to rotate, the wafer 4 is rotated to a vertical state. At this time, the film clamping mechanism 8 and the wafer 4 are staggered front and back. After the film clamping mechanism 8 is released, the wafer film 5 clamped on it will fall into the waste film storage box 15 and be collected together for subsequent unified processing.

[0036] The above disclosures are only a few specific embodiments of the present invention. However, the embodiments of the present invention are not limited thereto. Any changes that can be conceived by those skilled in the art should fall within the scope of protection of the present invention.

Claims

1. A rotary wafer peeling device, comprising an operating table (1) and a lifting device (11), characterized in that: A substrate (2) is provided on the upper side of the operating table (1), and an adsorption mechanism (3) is provided inside the substrate (2), and the adsorption mechanism (3) is used to adsorb and release the wafer (4); The wafer film (5) on the wafer (4) is provided with at least one upward opening; A turning shaft (6) is provided on the base plate (2), a turning drive device (7) is provided on the upper side of the operating table (1), and the turning drive device (7) is connected to the turning shaft (6); A film clamping mechanism (8) and a lifting frame (9) are provided on the upper side of the operating table (1); the film clamping mechanism (8) is provided on the lifting frame (9); and the film clamping mechanism (8) is used to clamp and release at least one upward opening of the wafer film (5); The lifting frame (9) is connected to a lifting plate (10), and the lifting plate (10) is connected to a lifting device (11).

2. The rotary wafer peeling device according to claim 1, wherein: The adsorption mechanism (3) comprises a suction cup (301), an air inlet and outlet pipe (302), and an air pump (303). A groove and an air vent (201) are provided in the substrate (2). The suction cup (301) is provided in the groove. A plurality of the suction cups (301) are connected via the air inlet and outlet pipe (302), and the air inlet and outlet pipe (302) is connected to the air pump (303).

3. The rotary wafer peeling device according to claim 2, wherein: The vent hole (201) is connected to the groove, and a plurality of suction cups (301) are distributed in a circular array around the center line of the groove.

4. The rotary wafer peeling device according to claim 1, wherein: The membrane clamping mechanism (8) comprises a lower clamping jaw (801), an upper clamping jaw (802), a mounting seat (803), and a clamping hydraulic rod (804); the lower clamping jaw (801) is movably connected to the upper clamping jaw (802), and the lower clamping jaw (801) is connected to the mounting seat (803); and the upper clamping jaw (802) is movably connected to the mounting seat (803).

5. The rotary wafer peeling device according to claim 4, wherein: The lower clamping jaw (801) and the upper clamping jaw (802) are respectively located on the upper and lower sides of the wafer film (5); the upper clamping jaw (802) is movably connected to the clamping hydraulic rod (804); and the output end of the clamping hydraulic rod (804) is movably connected to the lifting frame (9).

6. The rotary wafer film peeling device according to claim 1, wherein: A central plate (12) and a support frame (13) are provided on the upper side of the lifting frame (9); the central plate (12) is connected to the lifting frame (9); and the central plate (12) and the support frame (13) can only move relative to each other up and down.

7. The rotary wafer film peeling device according to claim 6, characterized in that: A front-rear displacement mechanism (14) and a waste film storage box (15) are provided on the upper side of the operating table (1); the support frame (13) is connected to the front-rear displacement mechanism (14); and the waste film storage box (15) is located on the lower side of the base plate (2).

8. The rotary wafer film peeling device according to claim 7, characterized in that: The front-rear displacement mechanism (14) comprises a housing (1401), a threaded rod (1402), a drive motor (1403), and a threaded slider (1404).

9. The rotary wafer peeling device according to claim 8, wherein: The housing (1401) is arranged on the operating table (1), a threaded rod (1402) is inserted into the housing (1401), the threaded rod (1402) is connected to the threaded slider (1404) via threads, the threaded slider (1404) is slidably connected to the housing (1401), and the threaded slider (1404) is connected to the support frame (13).

10. The rotary wafer film peeling device according to claim 9, characterized in that: The lifting device (11) is arranged on a support frame (13).

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