Silicon carbide module power device structure and manufacturing process thereof

Abstract

The invention relates to a silicon carbide module power device structure and a manufacturing process thereof. The silicon carbide module power device structure comprises a sealing cover, and the bottom of the sealing cover is fixedly connected with a cooling plate; the top of the cooling plate is fixedly connected with a DBC substrate. The top of the DBC substrate is fixedly connected with a plurality of silicon carbide chips; convex plates are symmetrically and fixedly connected to the top of the cooling plate, and the convex plates are of a labyrinth-shaped structure; a groove corresponding to the convex plate is formed in the bottom of the DBC substrate; the bottom of the cooling plate is fixedly connected with a radiator; a plurality of fins are fixedly connected to the bottom of the radiator; by arranging the convex plate, the cooling plate and the DBC substrate can be clamped and the contact area can be increased, so that a gap between the cooling plate and the DBC substrate can be reduced, and the transmission effect of the DBC substrate on heat generated by the silicon carbide chip is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of silicon carbide modules, and in particular to a silicon carbide module power device structure and a manufacturing process thereof. Background Art

[0002] Silicon carbide modules are power semiconductor modules made with silicon carbide as their core material, primarily used for efficient conversion and control of electrical energy in power electronics systems. Silicon carbide is a wide-bandgap semiconductor material with excellent properties such as high breakdown electric field, high thermal conductivity, and high electron mobility. Compared to traditional silicon-based materials, silicon carbide modules can operate at higher voltages, higher frequencies, and higher temperatures, significantly reducing system losses, improving efficiency, and reducing size and weight.

[0003] The processing of silicon carbide modules is a complex process, mainly involving the following steps: silicon carbide wafer preparation, epitaxial growth, device manufacturing, module packaging, testing and screening.

[0004] In the prior art, when welding the DBC substrate and cooling plate of a silicon carbide module, there may be errors in the flatness of the surface of the DBC substrate or the cooling plate due to processing reasons, which will cause a gap between the DBC substrate and the cooling plate, thereby affecting the heat dissipation of the silicon carbide chip.

[0005] Therefore, to address the above problems, a silicon carbide module power device structure and a manufacturing process thereof are proposed. Summary of the Invention

[0006] To this end, the technical problem to be solved by the present invention is to overcome the problem in the prior art that the surface of the DBC substrate or the cooling plate has flatness errors due to processing reasons, resulting in a gap between the DBC substrate and the cooling plate, thereby affecting the heat dissipation of the silicon carbide chip.

[0007] In order to solve the above technical problems, the present invention provides a silicon carbide module power device structure, including a cover, the bottom of the cover is fixedly connected to a cooling plate; the top of the cooling plate is fixedly connected to a DBC substrate; the top of the DBC substrate is fixedly connected to a plurality of silicon carbide chips; the top of the cooling plate is symmetrically fixed with a convex plate, and the convex plate has a maze-shaped structure; the bottom of the DBC substrate is provided with a groove corresponding to the convex plate; the bottom of the cooling plate is fixedly connected to a heat sink; the bottom of the heat sink is fixedly connected to a plurality of fins; by providing the convex plate, the cooling plate and the DBC substrate can be clamped and the contact area can be increased, thereby reducing the gap between the cooling plate and the DBC substrate, and improving the heat transmission effect of the DBC substrate on the silicon carbide chips.

[0008] In one embodiment of the present invention, a mounting plate is fixedly connected to one side of the radiator; a plurality of mesh plates are fixedly connected to the inner wall of the mounting plate, and a fan is rotatably connected to one side of the mesh plate; a plurality of guide grooves are opened on the inner wall of the fin, and the inner wall of the guide groove is inclined; by setting the guide groove, the cooling airflow produced by the mounting plate can be forced to cool the fin through the guide groove, thereby reducing the accumulated heat on the surface of the fin, ensuring that the radiator and the fin can stably dissipate heat for the silicon carbide chip.

[0009] In one embodiment of the present invention, the radiator is connected to a first water pipe on one side and to a second water pipe on the other side; a pipeline is connected between the first water pipe and the second water pipe, and the pipeline is a serpentine structure; the pipeline and the fins are arranged correspondingly; by setting the first water pipe and the second water pipe, a circulating pump and a cooling water supply device can be connected between the first water pipe and the second water pipe. When the silicon carbide chip is started, the cooling water can be pumped by the circulating pump, and the cooling water can enter the interior of the first water pipe and exchange heat with the accumulated heat in the radiator and the fins, thereby further improving the cooling effect of the device on the fins, and then enhancing the heat dissipation function of the silicon carbide chip when it is working.

[0010] In one embodiment of the present invention, a plurality of first copper tubes are fixedly connected to the inner wall of the radiator; a spring is fixedly connected to the inner wall of the first copper tube; a piston is fixedly connected to the end of the spring; a second copper tube is fixedly connected to the end of the piston; the piston and the inner wall of the first copper tube are in sliding connection; gas is sealed between the inner wall of the first copper tube and the piston. As the temperature in the radiator rises, heat will be transferred to the sealed gas through the first copper tube and cause it to expand due to heat, so that the piston will slide with the second copper tube under the action of the airflow and stretch the spring. The exposed second copper tube can increase the heat exchange area between the radiator and the outside world, thereby accelerating the release rate of heat in the radiator. After the sealed gas pressure stabilizes, the second copper tube will be reset under the elastic force of the spring to hide the second copper tube. It is worth mentioning that when the spring is in a stable state, the end of the second copper tube should be flush with the outer wall of the radiator.

[0011] In one embodiment of the present invention, a plurality of fixed grooves are provided on the outer wall of the second copper tube; a circular ring is fixedly connected to the end of the first copper tube; a plurality of scrapers are fixedly connected to the inner wall of the circular ring; the scrapers and the fixed grooves are arranged correspondingly; by providing the fixed grooves and the scrapers, on the one hand, the second copper tube can be guided by the fixed grooves and the scrapers when sliding, thereby improving the stability of the second copper tube when moving; on the other hand, when the second copper tube stays in the outside world for a long time, dust and impurities will adhere to the inner wall of the fixed groove. At this time, the dust can be scraped off by the friction between the scrapers and the fixed groove, thereby improving the smoothness of the inner wall of the fixed groove.

[0012] In one embodiment of the present invention, a first magnetic piece is fixed to the inner wall of the fixed groove; a second magnetic piece is fixed to the inner wall of the scraper, and the second magnetic piece and the first magnetic piece are arranged correspondingly; the scraper is an arc-shaped structure; by arranging the first magnetic piece and the second magnetic piece, the end portion where the scraper and the circular ring are connected can be made of a rigid material, and the arc-shaped portion where the second magnetic piece is located can be made of an elastic material. Therefore, when the second copper tube is sliding, due to the magnetic attraction between the first magnetic piece and the second magnetic piece, the arc-shaped portion where the second magnetic piece is located at the end of the scraper can be tightly attached to the inner wall of the fixed groove, thereby ensuring that the scraper can stably clean the inner wall of the fixed groove.

[0013] In one embodiment of the present invention, a sliding rod is provided through the inner walls of a plurality of adjacent first copper tubes and is slidably connected thereto; a connecting plate is fixedly connected to the end of the sliding rod; the other end of the sliding rod is fixedly connected to the piston; by providing the sliding rod and the connecting plate, the sliding rod will pull the plurality of pistons together as a whole, so that when any piston pushes the second copper tube to dissipate heat, the second copper tubes in the remaining first copper tubes can slide out together with it to assist in dissipating heat for the radiator.

[0014] In one embodiment of the present invention, a sealing gasket is fixedly connected to one side of the first copper tube; the sealing gasket and the sliding rod are slidably connected; by providing the sealing gasket, the sealing gasket can seal the connection between the sliding rod and the first copper tube, thereby improving the airtightness between the sealed gas in the first copper tube and the outside world, and reducing the fluctuation of the air pressure in the sealed cavity in the first copper tube caused by the sliding of the sliding rod.

[0015] In one embodiment of the present invention, a drying box is fixedly connected to the other side of the mesh plate; the surface of the drying box is porous; by setting the drying box, a desiccant is stored in the drying box. When the fan is working, one side of the drying box serves as the suction side and is in a negative pressure state. The desiccant in the drying box absorbs moisture in the airflow to improve the dryness of the cooling airflow and reduce the moisture accumulated in the guide groove and its corrosive effect on it.

[0016] The present invention also provides a silicon carbide module power device manufacturing process, which uses the silicon carbide module power device structure.

[0017] The above technical solution of the present invention has the following advantages over the prior art:

[0018] 1. The silicon carbide module power device structure and its manufacturing process described in the present invention can be clamped between the cooling plate and the DBC substrate by providing a convex plate to increase the contact area, thereby reducing the gap between the cooling plate and the DBC substrate and improving the DBC substrate's ability to transmit heat generated by the silicon carbide chip.

[0019] 2. The silicon carbide module power device structure and its manufacturing process described in the present invention provide a guide groove so that the cooling airflow produced by the mounting plate can forcefully cool the fins through the guide groove, thereby reducing the accumulated heat on the fin surface and ensuring that the radiator and fins can stably dissipate heat for the silicon carbide chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to make the contents of the present invention more clearly understood, the present invention is further described in detail below based on specific embodiments of the present invention in conjunction with the accompanying drawings.

[0021] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0022] Figure 2 Schematic diagram of the structure of the DBC substrate in the present invention;

[0023] Figure 3 Schematic diagram of the structure of the fin in the present invention;

[0024] Figure 4 Schematic diagram of the structure of the fan in the present invention;

[0025] Figure 5 Schematic diagram of the structure of the radiator in the present invention;

[0026] Figure 6 Schematic diagram of the structure of the pipeline in the present invention;

[0027] Figure 7 Schematic diagram of the structure of the first copper tube in the present invention;

[0028] Figure 8 Schematic diagram of the structure of the second copper tube in the present invention;

[0029] Figure 9 Schematic diagram of the structure of the ring in the present invention.

[0030] Explanation of the reference numerals in the specification: 1. Cover; 12. Cooling plate; 13. DBC substrate; 14. Silicon carbide chip; 15. Protruding plate; 16. Radiator; 17. Fin; 2. Mounting plate; 22. Fan; 23. Mesh plate; 24. Guide groove; 3. First water pipe; 32. Pipeline; 33. Second water pipe; 4. First copper pipe; 42. Spring; 43. Piston; 44. Second copper pipe; 5. Fixing groove; 52. Ring; 53. Scraper; 6. First magnetic sheet; 62. Second magnetic sheet; 7. Sliding rod; 72. Connecting plate; 8. Sealing gasket; 9. Drying box. DETAILED DESCRIPTION

[0031] The present invention will be further described below with reference to the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it. However, the embodiments are not intended to limit the present invention.

[0032] Reference Figures 1 to 9 As shown, a silicon carbide module power device structure of the present invention includes a cover 1, the bottom of the cover 1 is fixedly connected to a cooling plate 12; the top of the cooling plate 12 is fixedly connected to a DBC substrate 13; the top of the DBC substrate 13 is fixedly connected to a plurality of silicon carbide chips 14; the top of the cooling plate 12 is symmetrically fixed with a convex plate 15, and the convex plate 15 is a maze-shaped structure; the bottom of the DBC substrate 13 is provided with a groove corresponding to the convex plate 15; the bottom of the cooling plate 12 is fixedly connected to a heat sink 16; the bottom of the heat sink 16 is fixedly connected to a plurality of fins 17; during assembly, the silicon carbide chip 14 is welded to the surface of the DBC substrate 13 through a copper bridge, the DBC substrate 13 and the cooling plate 12 are fixed by welding, and the corners between the cover 1 and the cooling plate 12 are locked by bolts, the surface of the DBC substrate 13 is potted with silicone to dissipate heat and protect the silicon carbide chip 14, and the cooling plate 12 and the heat sink 16 are also bolted. When the heat sink 16 is connected to the cooling plate 12, the gap between the cooling plate 12 and the heat sink 16 is filled with thermal grease to increase the connection heat exchange area between the cooling plate 12 and the heat sink 16. When the DBC substrate 13 and the cooling plate 12 are welded, the cooling plate 12 and the DBC substrate 13 are forced to engage with each other through the convex plate 15 to increase the connection area between the cooling plate 12 and the DBC substrate 13, thereby expanding the heat exchange area between the DBC substrate 13 and the cooling plate 12, so that the heat emitted by the silicon carbide chip 14 during operation can be stably transferred to the cooling plate 12 through the DBC substrate 13, and then transferred to the heat sink 16 and the fins 17 through the cooling plate 12 to exchange heat with the outside world. By providing the convex plate 15, the cooling plate 12 and the DBC substrate 13 can be engaged and the contact area can be increased, thereby reducing the gap between the cooling plate 12 and the DBC substrate 13, and improving the heat transmission effect of the DBC substrate 13 on the silicon carbide chip 14.

[0033] Reference Figures 3 to 5As shown, one side of the radiator 16 is fixed with a mounting plate 2; the inner wall of the mounting plate 2 is fixed with a plurality of mesh plates 23, and one side of the mesh plate 23 is rotatably connected with a fan 22; the inner wall of the fin 17 is provided with a plurality of guide grooves 24, and the inner wall of the guide groove 24 is inclined; when the silicon carbide chip 14 is started, the fan 22 can be powered and started synchronously, and the fan 22 will generate a cooling airflow and blow it to the surface of the fin 17. The airflow can flow between the fins 17 through the guide grooves 24, so that the airflow can quickly take away the heat accumulated on the surface of each fin 17, and at the same time, through The guide groove 24 has an inclined structure, and the guide groove 24 can be specifically set as the guide grooves 24 between adjacent fins 17 are set in reverse and staggered. On the one hand, the expanded guide groove 24 can expand the flow range after the airflow passes through, and on the other hand, the shrinking guide groove 24 can bundle the airflow, thereby accelerating the flow rate of the airflow; by setting the guide groove 24, the cooling airflow produced by the mounting plate 2 can be forced to cool the fins 17 through the guide groove 24, thereby reducing the accumulated heat on the surface of the fin 17, ensuring that the radiator 16 and the fin 17 can stably dissipate heat for the silicon carbide chip 14.

[0034] Reference Figure 6 As shown, the radiator 16 is connected to a first water pipe 3 on one side and to a second water pipe 33 on the other side; a pipe 32 is connected between the first water pipe 3 and the second water pipe 33, and the pipe 32 is a serpentine structure; the pipe 32 and the fin 17 are correspondingly arranged; by setting the first water pipe 3 and the second water pipe 33, a circulating pump and a cooling water supply device can be connected between the first water pipe 3 and the second water pipe 33. When the silicon carbide chip 14 is started, the cooling water can be pumped by the circulating pump, and the cooling water can enter the interior of the first water pipe 3 and exchange heat with the accumulated heat in the radiator 16 and the fin 17, thereby further improving the cooling effect of the device on the fin 17, and thereby enhancing the heat dissipation function of the silicon carbide chip 14 when it is working.

[0035] Reference Figures 6 to 8As shown, a plurality of first copper tubes 4 are fixedly connected to the inner wall of the radiator 16; a spring 42 is fixedly connected to the inner wall of the first copper tube 4; a piston 43 is fixedly connected to the end of the spring 42; a second copper tube 44 is fixedly connected to the end of the piston 43; the piston 43 and the inner wall of the first copper tube 4 are in sliding connection; gas is sealed between the inner wall of the first copper tube 4 and the piston 43. As the temperature in the radiator 16 rises, heat will be transferred to the sealed gas through the first copper tube 4 and cause it to expand due to heat, so that the piston 43 will slide with the second copper tube 44 under the action of the airflow and cause the spring 42 to stretch. The exposed second copper tube 44 can increase the heat exchange area between the radiator 16 and the outside world, thereby accelerating the release rate of heat in the radiator 16. After the sealed gas pressure stabilizes, the second copper tube 44 will be reset under the elastic force of the spring 42 to hide the second copper tube 44. It is worth mentioning that when the spring 42 is in a stable state, the end of the second copper tube 44 should be flush with the outer wall of the radiator 16.

[0036] Reference Figure 8 and Figure 9 As shown, a plurality of fixing grooves 5 are provided on the outer wall of the second copper tube 44; a circular ring 52 is fixedly connected to the end of the first copper tube 4; a plurality of scrapers 53 are fixedly connected to the inner wall of the circular ring 52; the scrapers 53 and the fixing grooves 5 are correspondingly arranged; by providing the fixing grooves 5 and the scrapers 53, on the one hand, the second copper tube 44 can be guided by the fixing grooves 5 and the scrapers 53 when sliding, thereby improving the stability of the second copper tube 44 when moving; on the other hand, when the second copper tube 44 stays in the outside world for a long time, dust and impurities will adhere to the inner wall of the fixing groove 5. At this time, the dust can be scraped off by the friction between the scrapers 53 and the fixing groove 5, thereby improving the smoothness of the inner wall of the fixing groove 5.

[0037] Reference Figure 8 and Figure 9 As shown, the inner wall of the fixed groove 5 is fixed with a first magnetic piece 6; the inner wall of the scraper 53 is fixed with a second magnetic piece 62, and the second magnetic piece 62 and the first magnetic piece 6 are correspondingly arranged; the scraper 53 is an arc-shaped structure; by arranging the first magnetic piece 6 and the second magnetic piece 62, the end portion where the scraper 53 and the ring 52 are connected can be a rigid material, and the arc-shaped portion where the second magnetic piece 62 is located can be an elastic material. Therefore, when the second copper tube 44 is sliding, due to the magnetic attraction between the first magnetic piece 6 and the second magnetic piece 62, the arc-shaped portion where the second magnetic piece 62 is located at the end of the scraper 53 can be close to the inner wall of the fixed groove 5, thereby ensuring that the scraper 53 can stably clean the inner wall of the fixed groove 5.

[0038] Reference Figure 7As shown, a sliding rod 7 is provided through the inner walls of adjacent multiple first copper tubes 4 and is slidably connected; the end of the sliding rod 7 is fixedly connected to a connecting plate 72; the other end of the sliding rod 7 is fixedly connected to the piston 43; by providing the sliding rod 7 and the connecting plate 72, the sliding rod 7 will pull the multiple pistons 43 into a whole, so that when any piston 43 pushes the second copper tube 44 to dissipate heat, the second copper tubes 44 in the remaining first copper tubes 4 can slide out together with it to assist in dissipating heat to the radiator 16.

[0039] Reference Figure 7 As shown, a sealing gasket 8 is fixed to one side of the first copper tube 4; the sealing gasket 8 and the sliding rod 7 are slidingly connected; by providing the sealing gasket 8, the sealing gasket 8 can seal the connection between the sliding rod 7 and the first copper tube 4, thereby improving the airtightness between the sealed gas in the first copper tube 4 and the outside world, and reducing the fluctuation of the air pressure in the sealed cavity in the first copper tube 4 caused by the sliding of the sliding rod 7.

[0040] Reference Figure 4 As shown, a drying box 9 is fixedly connected to the other side of the mesh plate 23; the surface of the drying box 9 is porous; by setting the drying box 9, a desiccant is stored in the drying box 9. When the fan 22 is working, one side of the drying box 9 is the suction side and is in a negative pressure state. The desiccant in the drying box 9 absorbs moisture in the airflow to improve the dryness of the cooling airflow and reduce the moisture accumulated in the guide groove 24 and its corrosive effect on it.

[0041] The present invention also provides a silicon carbide module power device manufacturing process, which uses the silicon carbide module power device structure.

[0042] Working principle: The silicon carbide chip 14 is welded to the surface of the DBC substrate 13 through a copper bridge. The DBC substrate 13 and the cooling plate 12 are welded and fixed. The cover 1 and the cooling plate 12 are locked at the corners by bolts. The surface of the DBC substrate 13 is encapsulated with silicone to dissipate heat and protect the silicon carbide chip 14. The cooling plate 12 and the radiator 16 are also bolted. At the same time, the gap between the cooling plate 12 and the radiator 16 is filled with thermal grease to increase the connection heat exchange area between the cooling plate 12 and the radiator 16. When the DBC substrate 13 and the cooling plate 12 are welded, the convex plate 15 is used to force the cooling plate 12 and the DBC substrate 13 to engage to increase the cooling The connection area between the cooling plate 12 and the DBC substrate 13 is increased, thereby expanding the heat exchange area between the DBC substrate 13 and the cooling plate 12, so that the heat emitted by the silicon carbide chip 14 during operation can be stably transferred to the cooling plate 12 through the DBC substrate 13, and then transferred to the radiator 16 and the fins 17 through the cooling plate 12 to exchange heat with the outside world; when the silicon carbide chip 14 is started, the fan 22 can be powered and started synchronously by the power supply, and the fan 22 will generate a cooling airflow and blow it to the surface of the fin 17. The airflow can flow between the fins 17 through the guide groove 24, so that the airflow can quickly take away the heat accumulated on the surface of each fin 17, and at the same time, through the inclined structure of the guide groove 24, the guide groove 2 The specific arrangement may be that the guide grooves 24 between adjacent fins 17 are arranged in a reverse staggered manner. On the one hand, the expanded guide grooves 24 can expand the flow range of the airflow after passing through, and on the other hand, the narrowed guide grooves 24 can bundle the airflow, thereby accelerating the flow rate of the airflow; by arranging the first water pipe 3 and the second water pipe 33, a circulation pump and a cooling water source supply device can be connected between the first water pipe 3 and the second water pipe 33. When the silicon carbide chip 14 is started, the cooling water can be pumped by the circulation pump, and the cooling water can enter the interior of the first water pipe 3 and exchange heat with the heat accumulated in the radiator 16 and the fins 17, thereby further improving the cooling effect of the device on the fins 17, thereby enhancing the working of the silicon carbide chip 14. Heat dissipation function during operation; gas is sealed between the inner wall of the first copper tube 4 and the piston 43. As the temperature in the radiator 16 rises, heat will be transferred to the sealed gas through the first copper tube 4 and cause it to expand due to the heat, so that the piston 43 will slide with the second copper tube 44 under the action of the airflow and cause the spring 42 to stretch. The exposed second copper tube 44 can increase the heat exchange area between the radiator 16 and the outside, thereby accelerating the release rate of heat in the radiator 16. After the sealed gas pressure stabilizes, the second copper tube 44 will be reset under the elastic force of the spring 42 to hide the second copper tube 44. It is worth mentioning that when the spring 42 is in a stable state, the end of the second copper tube 44 should be flush with the outer wall of the radiator 16;By setting the fixed groove 5 and the scraper 53, on the one hand, the second copper tube 44 can be guided by the fixed groove 5 and the scraper 53 when sliding, thereby improving the stability of the second copper tube 44 when moving. On the other hand, when the second copper tube 44 stays in the outside world for a long time, dust and impurities will adhere to the inner wall of the fixed groove 5. At this time, the dust can be scraped off by the friction between the scraper 53 and the fixed groove 5, thereby improving the smoothness of the inner wall of the fixed groove 5; by setting the first magnetic piece 6 and the second magnetic piece 62, the end portion where the scraper 53 and the ring 52 are connected can be made of a rigid material, and the arc portion where the second magnetic piece 62 is located can be made of an elastic material. Therefore, when the second copper tube 44 is sliding, due to the magnetic attraction between the first magnetic piece 6 and the second magnetic piece 62, the arc portion where the second magnetic piece 62 is located at the end of the scraper 53 can be close to the inner wall of the fixed groove 5, thereby ensuring that the scraper 53 can stably contact the fixed groove 5 inner wall cleaning function; by providing a slide bar 7 and a connecting plate 72, the slide bar 7 will pull the multiple pistons 43 together as a whole, so that when any piston 43 pushes the second copper tube 44 to dissipate heat, the second copper tubes 44 in the remaining first copper tubes 4 can slide out together with it to assist in dissipating heat to the radiator 16; by providing a sealing gasket 8, the sealing gasket 8 can seal the connection between the slide bar 7 and the first copper tube 4, thereby improving the airtightness between the sealed gas in the first copper tube 4 and the outside world, and reducing the fluctuation of the air pressure in the sealed cavity of the first copper tube 4 caused by the sliding of the slide bar 7; by providing a drying box 9, the drying box 9 stores desiccant. When the fan 22 is working, one side of the drying box 9 is the suction side and is in a negative pressure state. The desiccant in the drying box 9 will absorb moisture in the airflow, thereby improving the dryness of the cooling airflow and reducing the moisture accumulated in the guide groove 24 and its corrosive effect on it.

[0043] Obviously, the above embodiments are merely examples for clarity of explanation and are not intended to limit the implementation methods. Those skilled in the art will appreciate that other variations or modifications can be made based on the above description. It is not necessary and impossible to enumerate all implementation methods here. Obvious variations or modifications arising therefrom remain within the scope of protection of the present invention.

Claims

1. A silicon carbide module power device structure, comprising a cover (1), characterized in that: The bottom of the cover (1) is fixedly connected to a cooling plate (12); the top of the cooling plate (12) is fixedly connected to a DBC substrate (13); the top of the DBC substrate (13) is fixedly connected to a plurality of silicon carbide chips (14); the top of the cooling plate (12) is symmetrically fixedly connected to a convex plate (15), and the convex plate (15) is a maze-shaped structure; the bottom of the DBC substrate (13) is provided with a groove corresponding to the convex plate (15); the bottom of the cooling plate (12) is fixedly connected to a radiator (16); the bottom of the radiator (16) is fixedly connected to a plurality of fins (17).

2. The silicon carbide module power device structure according to claim 1, characterized in that: A mounting plate (2) is fixedly connected to one side of the radiator (16); a plurality of mesh plates (23) are fixedly connected to the inner wall of the mounting plate (2), and a fan (22) is rotatably connected to one side of the mesh plate (23); a plurality of guide grooves (24) are provided on the inner wall of the fin (17), and the inner wall of the guide groove (24) is inclined.

3. The silicon carbide module power device structure according to claim 2, characterized in that: One side of the radiator (16) is connected to a first water pipe (3), and the other side is connected to a second water pipe (33); a pipeline (32) is connected between the first water pipe (3) and the second water pipe (33), and the pipeline (32) is a serpentine structure; the pipeline (32) and the fin (17) are correspondingly arranged.

4. The silicon carbide module power device structure according to claim 3, characterized in that: A plurality of first copper tubes (4) are fixedly connected to the inner wall of the radiator (16); a spring (42) is fixedly connected to the inner wall of the first copper tube (4); a piston (43) is fixedly connected to the end of the spring (42); a second copper tube (44) is fixedly connected to the end of the piston (43); and the piston (43) and the inner wall of the first copper tube (4) are in sliding connection.

5. The silicon carbide module power device structure according to claim 4, characterized in that: The outer wall of the second copper tube (44) is provided with a plurality of fixing grooves (5); the end of the first copper tube (4) is fixedly connected with a circular ring (52); the inner wall of the circular ring (52) is fixedly connected with a plurality of scrapers (53); the scrapers (53) and the fixing grooves (5) are arranged correspondingly.

6. The silicon carbide module power device structure according to claim 5, characterized in that: A first magnetic piece (6) is fixedly connected to the inner wall of the fixing groove (5); a second magnetic piece (62) is fixedly connected to the inner wall of the scraper (53), and the second magnetic piece (62) and the first magnetic piece (6) are correspondingly arranged; and the scraper (53) is an arc-shaped structure.

7. The silicon carbide module power device structure according to claim 6, characterized in that: A sliding rod (7) is provided through the inner walls of the adjacent plurality of first copper tubes (4) and is slidably connected thereto; the end of the sliding rod (7) is fixedly connected to a connecting plate (72); and the other end of the sliding rod (7) is fixedly connected to the piston (43).

8. The silicon carbide module power device structure according to claim 7, characterized in that: A sealing gasket (8) is fixedly connected to one side of the first copper tube (4); the sealing gasket (8) and the sliding rod (7) are in sliding connection.

9. The silicon carbide module power device structure according to claim 8, characterized in that: A drying box (9) is fixedly connected to the other side of the screen plate (23); the surface of the drying box (9) is porous.

10. A process for manufacturing a silicon carbide module power device, characterized in that: The manufacturing process uses a silicon carbide module power device structure as described in any one of claims 1 to 9.

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