Silicon carbide module power device packaging structure

Abstract

The invention relates to a silicon carbide module power device packaging structure which comprises a lower shell, and an upper shell is arranged at the top of the lower shell. A plurality of fixing rods are fixedly connected to the inner wall of the lower shell; the end part of the fixed rod is in threaded connection with a nut; cooling substrates are mounted on the inner walls of the lower shell and the upper shell; buffer layers are fixedly connected to the middle parts of the lower shell and the upper shell; a plurality of groups of honeycomb holes are formed in the middle of the buffer layer; a silicon carbide power device body is arranged between the lower shell and the upper shell; a terminal connecting piece is mounted in the middle of the silicon carbide power device body; cooling pipes are mounted on the side walls of the lower shell and the upper shell; the main air duct and the branch air ducts are additionally arranged in the buffer layer, heat can be blown from the main air duct during heat transfer, then honeycomb hole heat is guided through the branch air ducts, the honeycomb hole heat is accelerated at arc-shaped moving bends of the branch air ducts and finally discharged through the air outlets, and heat discharging in the lower shell and the upper shell is accelerated.

Description

Technical Field

[0001] The present invention relates to the technical field of silicon carbide power module packaging, and in particular to a silicon carbide module power device packaging structure. Background Art

[0002] The SiC module (Insulated Gate Bipolar Transistor Module) is a high-power semiconductor device that integrates an insulated gate bipolar transistor (SiC) and its supporting circuits. It is widely used in power electronics systems for efficient control and conversion of electrical energy.

[0003] The silicon carbide module power device package achieves low-inductance electrical interconnection through a multi-layer ceramic substrate, adopts a double-sided heat dissipation structure with a microchannel cold plate to improve thermal management efficiency, and uses an integrated metal frame combined with a buffer design to enhance mechanical reliability and environmental adaptability.

[0004] When the silicon carbide module is packaged and used, it will dissipate heat to the surrounding environment. When dissipating heat, it will first pass through the buffer layer and then reach the cooling substrate. When the buffer layer is affected by heat for a long time, it will age, which will affect the buffering effect. Summary of the Invention

[0005] To this end, the technical problem to be solved by the present invention is to overcome the problem in the prior art that when the silicon carbide module is packaged and used, it will dissipate heat to the surrounding environment. When the heat is dissipated, it will first pass through the buffer layer and then reach the cooling substrate. When the buffer layer is affected by heat for a long time, it will age, which will affect the buffering effect.

[0006] In order to solve the above technical problems, the present invention provides a silicon carbide module power device packaging structure, comprising a lower shell, an upper shell is arranged on the top of the lower shell; a plurality of fixing rods are fixedly connected to the inner wall of the lower shell; the ends of the fixing rods are threadedly connected to nuts; a cooling substrate is installed on the inner wall of the lower shell and the upper shell; a buffer layer is fixedly connected to the middle of the lower shell and the upper shell; a plurality of honeycomb holes are provided in the middle of the buffer layer; a silicon carbide power device body is installed between the lower shell and the upper shell; a terminal connector is installed in the middle of the silicon carbide power device body; the side walls of the lower shell and the upper shell are installed There is a cooling pipe; the end of the cooling pipe is fixedly connected with a connecting flange; a main air duct is opened inside the buffer layer; the inner wall of the main air duct is connected with multiple branch air ducts; the branch air duct is arranged in an arc shape; the side walls of the lower shell and the upper shell are opened with air outlets; the air outlets are connected with the connecting flange and the main air duct; adding a main air duct and a branch air duct inside the buffer layer can blow heat from the main air duct during heat transfer, and then guide the heat of the honeycomb holes through the branch air duct, accelerate in the arc-shaped moving bend of the branch air duct, and finally discharge it through the air outlet, thereby accelerating the discharge of heat from the lower shell and the upper shell.

[0007] In one embodiment of the present invention, a pair of windshield pads are provided on the side walls of the upper shell and the lower shell; the windshield pads and the lower shell are connected to the upper shell by screws; by adding the windshield pads, the windshield pads can be pushed open by the thrust of the airflow when the airflow passes through, and when pushed open, the main air duct can be opened to allow the airflow to pass through, and at the same time, when the airflow stops, it can automatically restore and close the air outlet, thereby protecting the main air duct and the branch air duct.

[0008] In one embodiment of the present invention, a metal bellows is installed inside the main air duct; the metal bellows is connected to the cooling pipe through an installation assembly; by adding the metal bellows, the impact on the main air duct can be reduced when the buffer layer is squeezed, and the rigidity of the metal bellows is partially flexible, so that the main air duct is supported to reduce the impact of squeezing on the main air duct.

[0009] In one embodiment of the present invention, the mounting assembly includes a plurality of slots; the slots are provided in plurality on the metal bellows and the cooling pipe; an elastic clip is slidably fitted inside the slot; the metal bellows can be quickly fixed by adding the elastic clip, and the elastic clip can be removed when the metal bellows is removed, thereby increasing the replacement method of the metal bellows.

[0010] In one embodiment of the present invention, a plurality of positioning rods are fixedly connected to the inner wall of the lower shell; a positioning groove is provided on the inner wall of the upper shell; the positioning rods and the positioning grooves are correspondingly arranged and slidably matched; by adding the positioning rods and the positioning grooves, guidance can be added when the lower shell and the upper shell are engaged, thereby reducing the alignment adjustment of the lower shell and the upper shell.

[0011] In one embodiment of the present invention, the side wall of the upper shell is fixedly connected to a rotating seat; the middle part of the rotating seat is rotatably connected to a protective cover; the protective cover and the terminal connector are correspondingly arranged; by adding the protective cover, the terminal connector can be protected, thereby reducing damage.

[0012] In one embodiment of the present invention, a pair of round rods are fixed to the end of the protective cover; a pair of round grooves are opened on the side wall of the upper shell; the round rods and the round grooves are correspondingly arranged and slidably matched; by adding round rods and round grooves, the contact area between the protective cover and the upper shell can be increased during use, thereby increasing the stability of the protection when the protective cover protects the terminal connector.

[0013] In one embodiment of the present invention, diamond plates are provided inside the lower shell and the upper shell; the diamond plates are located between the buffer layer and the cooling substrate; by adding the diamond plates, the heat absorption of the diamond plates can be utilized to quickly absorb the remaining heat, thereby increasing the accumulation of heat and thus quickly eliminating it.

[0014] In one embodiment of the present invention, a gasket is provided at the end of the fixing rod; the gasket is located between the fixing rod and the nut; by adding the gasket, the friction between the nut and the upper shell can be increased through the gasket when the fixing rod is used, thereby increasing the stability of the nut after being fixed.

[0015] In one embodiment of the present invention, a sponge is fixed inside the circular groove; the sponge and the circular groove are arranged correspondingly; by adding the sponge, the gap between the round rod and the circular groove can be reduced when they are engaged, thereby increasing the stability during protection.

[0016] The above technical solution of the present invention has the following advantages over the prior art:

[0017] The silicon carbide module power device packaging structure described in the present invention adds a main air duct and a branch air duct inside the buffer layer. During heat transfer, the heat can be blown from the main air duct, and then the heat of the honeycomb holes is guided through the branch air duct. The heat is accelerated in the arc-shaped moving bend of the branch air duct and finally discharged through the air outlet, thereby accelerating the heat discharge from the lower shell and the upper shell.

[0018] The silicon carbide module power device packaging structure described in the present invention can push the wind shield pad open by the thrust of the airflow when the airflow passes through by adding a wind shield pad. After being pushed open, the main air duct can be opened to allow the airflow to pass through. At the same time, when the airflow stops, it can automatically restore and close the air outlet, thereby protecting the main air duct and branch air ducts. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to make the contents of the present invention more clearly understood, the present invention is further described in detail below based on specific embodiments of the present invention in conjunction with the accompanying drawings.

[0020] Figure 1 is a perspective view of the present invention;

[0021] Figure 2 Schematic diagram of the structure of the fixing rod in the present invention;

[0022] Figure 3 Schematic diagram of the structure of the upper shell in the present invention;

[0023] Figure 4 Schematic diagram of the structure of the buffer layer in the present invention;

[0024] Figure 5 It is a structural schematic diagram of the connecting flange in the present invention;

[0025] Figure 6 Schematic diagram of the structure of the main air duct in the present invention;

[0026] Figure 7 It is a structural schematic diagram of the circular groove in the present invention.

[0027] Explanation of the reference numerals in the specification: 1. Lower shell; 11. Upper shell; 12. Fixing rod; 13. Nut; 14. Cooling substrate; 15. Honeycomb hole; 16. Buffer layer; 17. Silicon carbide power device body; 18. Terminal connector; 19. Cooling pipe; 101. Connecting flange; 102. Main air duct; 103. Branch air duct; 104. Air outlet; 2. Wind shield; 21. Screw; 3. Metal bellows; 31. Mounting assembly; 4. Slot; 41. Elastic clip; 5. Positioning rod; 51. Positioning groove; 6. Rotating seat; 61. Protective cover; 7. Round rod; 71. Round groove; 8. Diamond plate; 9. Gasket; 10. Sponge. DETAILED DESCRIPTION

[0028] The present invention will be further described below with reference to the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it. However, the embodiments are not intended to limit the present invention.

[0029] Reference Figures 1 to 7As shown, a silicon carbide module power device packaging structure of the present invention includes a lower shell 1, an upper shell 11 is provided on the top of the lower shell 1; a plurality of fixing rods 12 are fixedly connected to the inner wall of the lower shell 1; the ends of the fixing rods 12 are threadedly connected to nuts 13; a cooling substrate 14 is installed on the inner walls of the lower shell 1 and the upper shell 11; a buffer layer 16 is fixedly connected to the middle of the lower shell 1 and the upper shell 11; a plurality of honeycomb holes 15 are provided in the middle of the buffer layer 16; a carbon The silicon carbide power device body 17 is provided with a terminal connector 18 in the middle of the silicon carbide power device body 17; the side walls of the lower shell 1 and the upper shell 11 are provided with cooling pipes 19; the ends of the cooling pipes 19 are fixedly connected with connecting flanges 101; a main air duct 102 is provided inside the buffer layer 16; the inner wall of the main air duct 102 is connected with a plurality of branch air ducts 103; the branch air ducts 103 are arranged in an arc shape; the side walls of the lower shell 1 and the upper shell 11 are provided with air outlets 104; the air outlets 104 are connected to the side walls of the lower shell 1 and the upper shell 11; the air outlets 104 are connected to the side walls of the upper shell 1 The connecting flange 101 and the main air duct 102 are in a communicating relationship. When working, the fixing rod 12 and the nut 13 are used to connect the lower shell 1 and the upper shell 11. When the silicon carbide power device body 17 works, it will diffuse heat to the surroundings. The heat will be absorbed by the buffer layer 16 and then pass through the buffer layer 16 to the cooling substrate 14. When the heat passes through the buffer layer 16, the connecting flange 101 is connected to the air pump to blow the gas into the cooling pipe 19. The cooling pipe 19 then transmits the gas to the main air duct 102, and then transmits the gas to the branch air duct 103 through the main air duct 102. The branch air duct 103 moves in an arc shape and accelerates, blowing the heat inside the buffer layer 16, and carrying the heat out from the air outlet 104 along the main air duct 102; adding the main air duct 102 and the branch air duct 103 inside the buffer layer 16 can blow the heat from the main air duct 102 during heat transfer, and then guide the heat of the honeycomb hole 15 through the branch air duct 103, accelerate the arc-shaped movement bend of the branch air duct 103, and finally discharge it through the air outlet 104, thereby accelerating the heat discharge from the lower shell 1 and the upper shell 11.

[0030] Reference Figures 1 to 5 As shown, a pair of windshield pads 2 are provided on the side walls of the upper shell 11 and the lower shell 1; the windshield pads 2 and the lower shell 1 are connected to the upper shell 11 by screws 21; during operation, the windshield pads 2 will be blown when the airflow is discharged from the air outlet 104, and the middle part of the windshield pads 2 will be pushed open by the airflow. After being pushed open, the airflow will flow out through the middle part of the windshield pads 2, and when the airflow stops, the air outlet 104 will be closed. When closed, it can reduce foreign matter from entering the main air duct 102 through the air outlet 104; by adding the windshield pads 2, the windshield pads 2 can be pushed open by the thrust of the airflow when the airflow passes through, and when pushed open, the main air duct 102 can be opened to allow the airflow to pass through it. At the same time, when the airflow stops, it can also automatically restore and close the air outlet 104, thereby protecting the main air duct 102 and the branch air duct 103.

[0031] Reference Figures 1 to 5 As shown, a metal bellows 3 is installed inside the main air duct 102; the metal bellows 3 is connected to the cooling pipe 19 through the installation component 31; during operation, when the lower shell 1 and the upper shell 11 are merged, the silicon carbide power device body 17 will squeeze the buffer layer 16, and the buffer layer 16 will deform at this time, and the metal bellows 3 will also deform during the deformation, but it will also push the main air duct 102 away during the deformation, so that the main air duct 102 will be opened during heat dissipation, so that it will not be blocked, and the metal bellows 3 can be disassembled and processed through the installation component 31 at the same time; by adding the metal bellows 3, the impact on the main air duct 102 when the buffer layer 16 is squeezed can be reduced, and the rigidity of the metal bellows 3 has a partial flexibility feature, so that the main air duct 102 is supported to reduce the impact of squeezing on the main air duct 102.

[0032] Reference Figures 1 to 5 As shown, the installation component 31 includes a plurality of slots 4; the slots 4 are multiple settings on the metal bellows 3 and the cooling pipe 19; an elastic clip 41 is slidably fitted inside the slot 4; during operation, when the metal bellows 3 needs to be removed, the elastic clip 41 can be removed from the slot 4 to unlock the metal bellows 3, and when the elastic clip 41 is removed, the metal bellows 3 can be pulled out and processed; by adding the elastic clip 41, the metal bellows 3 can be quickly fixed, and at the same time, the elastic clip 41 can be removed when the metal bellows 3 is removed, thereby increasing the replacement method of the metal bellows 3.

[0033] Reference Figures 1 to 5 As shown, a plurality of positioning rods 5 are fixed to the inner wall of the lower shell 1; a positioning groove 51 is provided on the inner wall of the upper shell 11; the positioning rods 5 and the positioning groove 51 are correspondingly arranged and slidably matched; during operation, the positioning rods 5 and the positioning groove 51 are aligned when the lower shell 1 and the upper shell 11 are connected, and then the contact area of ​​the lower shell 1 and the upper shell 11 can be increased after insertion, thereby stabilizing the lower shell 1 after fixation; by adding the positioning rods 5 and the positioning groove 51, guidance can be added when the lower shell 1 and the upper shell 11 are engaged, thereby reducing the alignment adjustment of the lower shell 1 and the upper shell 11.

[0034] Reference Figures 1 to 5As shown, the side wall of the upper shell 11 is fixedly connected to a rotating base 6; the middle part of the rotating base 6 is rotatably connected to a protective cover 61; the protective cover 61 and the terminal connector 18 are correspondingly arranged; during operation, the protective cover 61 can be rotated when the terminal connector 18 is not in use. After rotation, the protective cover 61 will cover the terminal connector 18 so that it is located outside the terminal connector 18. When it is located at the terminal connector 18, it can reduce the contact between external dust and the terminal connector 18. When the terminal connector 18 needs to be used, the protective cover 61 can be rotated to quickly open it; by adding the protective cover 61, the terminal connector 18 can be protected, thereby reducing damage.

[0035] Reference Figures 1 to 5 As shown, a pair of round rods 7 are fixed to the end of the protective cover 61; a pair of circular grooves 71 are opened on the side wall of the upper shell 11; the round rods 7 and the circular grooves 71 are correspondingly arranged and slidingly matched; during operation, the round rods 7 can be inserted into the circular grooves 71 after the protective cover 61 is rotated, thereby increasing the fixation of the round rods 7 and the circular grooves 71 when protecting the terminal connector 18; by increasing the round rods 7 and the circular grooves 71, the contact area between the protective cover 61 and the upper shell 11 can be increased during use, thereby increasing the stability of the protection when the protective cover 61 protects the terminal connector 18.

[0036] Reference Figures 1 to 5 As shown, a diamond plate 8 is provided inside the lower shell 1 and the upper shell 11; the diamond plate 8 is located between the buffer layer 16 and the cooling substrate 14; during operation, the remaining heat after the heat passes through the buffer layer 16 will be absorbed by the diamond plate 8, and at this time it will be transferred to the cooling substrate 14 through the diamond plate 8, thereby performing the next step of heat dissipation; by adding the diamond plate 8, the heat absorption of the diamond plate 8 can be utilized to quickly absorb the remaining heat, thereby increasing the aggregation of heat and thus quickly eliminating it.

[0037] Reference Figures 1 to 5 As shown, a gasket 9 is provided at the end of the fixing rod 12; the gasket 9 is located between the fixing rod 12 and the nut 13; during operation, when the nut 13 is installed on the fixing rod 12, the gasket 9 is first placed on the fixing rod 12, and then the nut 13 is used to install it on the fixing rod 12, so that when it contacts the upper shell 11, the gasket 9 is squeezed to increase the friction; by adding the gasket 9, the friction between the nut 13 and the upper shell 11 can be increased through the gasket 9 when the fixing rod 12 is used, thereby increasing the stability of the nut 13 after it is fixed.

[0038] Reference Figures 1 to 5As shown, a sponge 10 is fixed inside the circular groove 71; the sponge 10 and the circular groove 71 are correspondingly arranged; during operation, when the round rod 7 is inserted into the circular groove 71, the sponge 10 will be squeezed, and the sponge 10 will be deformed during the squeezing, and when deformed, it will fill the gap between the round rod 7 and the circular groove 71; by adding the sponge 10, the gap between the round rod 7 and the circular groove 71 can be reduced when the round rod 7 and the circular groove 71 are engaged, thereby increasing the stability during protection.

[0039] Working principle: Use fixing rod 12 and nut 13 to connect lower shell 1 and upper shell 11. When the silicon carbide power device body 17 works, it will diffuse heat to the surroundings. The heat will be absorbed by the buffer layer 16, and then pass through the buffer layer 16 to the cooling substrate 14. When the heat passes through the buffer layer 16, the connecting flange 101 is connected to the air pump to blow the gas into the cooling pipe 19, and then the cooling pipe 19 is transferred to the main air duct 102, and then transferred to the branch air duct 103 through the main air duct 102. The arc-shaped acceleration movement inside the branch air duct 103 blows the heat inside the buffer layer 16, and carries the heat out from the air outlet 104 along the main air duct 102; when the air outlet 104 discharges the air flow, it will blow on the windshield pad 2, and at this time the middle of the windshield pad 2 will be The airflow pushes it open, and when pushed open, the airflow will flow out through the middle of the windshield pad 2. When the airflow stops, the air outlet 104 will be closed. When closed, it can reduce the entry of foreign matter into the main air duct 102 through the air outlet 104; when the lower shell 1 and the upper shell 11 are merged, the silicon carbide power device body 17 will squeeze the buffer layer 16. At this time, the buffer layer 16 will be deformed, and the metal bellows 3 will also be deformed during the deformation, but it will also push the main air duct 102 open during the deformation, so that the main air duct 102 will be opened during heat dissipation, so that it will not be blocked. At the same time, the metal bellows 3 can be disassembled for processing through the installation component 31; when the metal bellows 3 needs to be removed, the elastic clip 41 can be removed from the slot 4 The metal bellows 3 is thereby unlocked, and when the elastic clip 41 is taken out, the metal bellows 3 can be pulled out for processing; when the lower shell 1 and the upper shell 11 are connected, the positioning rod 5 and the positioning groove 51 are aligned, and then after insertion, the contact area between the lower shell 1 and the upper shell 11 can be increased, thereby ensuring stability after fixation; when the terminal connector 18 is not in use, the protective cover 61 can be rotated, and when rotated, the protective cover 61 will cover the terminal connector 18 so that it is located outside the terminal connector 18. When it is located on the terminal connector 18, it can reduce the contact between external dust and the terminal connector 18. When the terminal connector 18 needs to be used, the protective cover 61 can be rotated to quickly open it; after the protective cover 61 is rotated, the circular The rod 7 is inserted into the circular groove 71, thereby increasing the fixation of the round rod 7 and the circular groove 71 when protecting the terminal connector 18; after the heat passes through the buffer layer 16, the remaining heat will be absorbed by the diamond plate 8, and at this time it will be transmitted to the cooling substrate 14 through the diamond plate 8, thereby performing the next step of heat dissipation; when the nut 13 is installed on the fixing rod 12, the gasket 9 is first placed on the fixing rod 12, and then the nut 13 is used to install it on the fixing rod 12, so that when it contacts the upper shell 11, it squeezes the gasket 9 to increase friction; when the round rod 7 is inserted into the circular groove 71, it squeezes the sponge 10, and the sponge 10 will deform during the squeezing, and when it is deformed, it will fill the gap between the round rod 7 and the circular groove 71.

[0040] Obviously, the above embodiments are merely examples for clarity of explanation and are not intended to limit the implementation methods. Those skilled in the art will appreciate that other variations or modifications can be made based on the above description. It is not necessary and impossible to enumerate all implementation methods here. Obvious variations or modifications arising therefrom remain within the scope of protection of the present invention.

Claims

1. A silicon carbide module power device packaging structure, comprising a lower housing (1), characterized in that: An upper shell (11) is provided on the top of the lower shell (1); a plurality of fixing rods (12) are fixedly connected to the inner wall of the lower shell (1); the ends of the fixing rods (12) are threadedly connected to nuts (13); a cooling substrate (14) is installed on the inner walls of the lower shell (1) and the upper shell (11); a buffer layer (16) is fixedly connected to the middle of the lower shell (1) and the upper shell (11); a plurality of honeycomb holes (15) are provided in the middle of the buffer layer (16); a silicon carbide power device body (17) is installed between the lower shell (1) and the upper shell (11); the silicon carbide power device body (17) A terminal connector (18) is installed in the middle; cooling pipes (19) are installed on the side walls of the lower shell (1) and the upper shell (11); the ends of the cooling pipes (19) are fixedly connected with connecting flanges (101); a main air duct (102) is opened inside the buffer layer (16); the inner wall of the main air duct (102) is connected with a plurality of branch air ducts (103); the branch air ducts (103) are arranged in an arc shape; air outlets (104) are opened on the side walls of the lower shell (1) and the upper shell (11); the air outlets (104) are in a communicating relationship with the connecting flange (101) and the main air duct (102).

2. The silicon carbide module power device packaging structure according to claim 1, characterized in that: A pair of windshield pads (2) are provided on the side walls of the upper shell (11) and the lower shell (1); the windshield pads (2) and the lower shell (1) are connected to the upper shell (11) via screws (21).

3. The silicon carbide module power device packaging structure according to claim 2, characterized in that: A metal bellows (3) is installed inside the main air duct (102); the metal bellows (3) is connected to the cooling pipe (19) via a mounting assembly (31).

4. The silicon carbide module power device packaging structure according to claim 3, characterized in that: The mounting assembly (31) includes a plurality of slots (4); the slots (4) are provided in a plurality on the metal bellows (3) and the cooling pipe (19); and an elastic clip (41) is slidably fitted inside the slots (4).

5. The silicon carbide module power device packaging structure according to claim 4, characterized in that: The inner wall of the lower shell (1) is fixedly connected with a plurality of positioning rods (5); the inner wall of the upper shell (11) is provided with positioning grooves (51); the positioning rods (5) and the positioning grooves (51) are correspondingly arranged and slidably matched.

6. The silicon carbide module power device packaging structure according to claim 5, characterized in that: The side wall of the upper housing (11) is fixedly connected with a rotating seat (6); the middle part of the rotating seat (6) is rotatably connected with a protective cover (61); the protective cover (61) and the terminal connector (18) are correspondingly arranged.

7. The silicon carbide module power device packaging structure according to claim 6, characterized in that: A pair of round rods (7) are fixedly connected to the end of the protective cover (61); a pair of round grooves (71) are opened on the side wall of the upper shell (11); the round rods (7) and the round grooves (71) are correspondingly arranged and slidably matched.

8. The silicon carbide module power device packaging structure according to claim 7, characterized in that: A diamond plate (8) is provided inside the lower shell (1) and the upper shell (11); the diamond plate (8) is located between the buffer layer (16) and the cooling substrate (14).

9. The silicon carbide module power device packaging structure according to claim 8, characterized in that: A washer (9) is provided at the end of the fixing rod (12); the washer (9) is located between the fixing rod (12) and the nut (13).

10. The silicon carbide module power device packaging structure according to claim 9, characterized in that: A sponge (10) is fixedly connected inside the circular groove (71); the sponge (10) and the circular groove (71) are correspondingly arranged.

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