A reflow soldering apparatus for PCB processing

Abstract

The application relates to the technical field of circuit board welding printing equipment, and discloses a reflow soldering device for PCB processing, which comprises a support, a positioning seat for positioning a circuit board body is fixedly arranged at the top of the support, a fixed plate is fixedly connected to the bottom of the positioning seat, and a fixed ring is fixedly sleeved at the top of the fixed plate. In the application, the tin paste on the sidewall of the bottom end of the inserted pin in the electroplating through hole is scraped and reserved through the inner wall of the communicating hole on the fixed ring, the shearing mechanism is used to remove the tin paste of the excess length of the pin which is difficult to flow into the electroplating through hole, the tin paste of the part is prevented from causing additional pollution of the reflow furnace, the amount of the tin paste in the electroplating through hole is ensured to be sufficient, secondary pin trimming is not needed, the scraped tin paste is attached to the pin through the expansion of the elastic diaphragm before shearing in cooperation with the adjusting mechanism and the shearing mechanism, the pin is fixed, the stability of the trimming process is ensured, and the pin is covered with sufficient tin paste.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board welding printing equipment, and particularly relates to a reflow soldering equipment for PCB processing. BACKGROUND

[0002] The reflow soldering equipment is a kind of equipment for realizing reliable connection of through-hole components and surface-mounted components and a PCB (printed circuit board) by using surface mounting technology and through-hole reflow soldering technology. The existing reflow soldering equipment comprises a tin paste coating mechanism, a patch mechanism and a reflow furnace. The tin paste coating mechanism is used for coating tin paste as solder at positions around the arrangement position of electronic components, and filling through holes of the PCB. The patch mechanism is used for arranging surface-mounted components on the PCB and inserting pins of the through-hole components into corresponding through holes. Then, the PCB is placed into the connection inlet of the reflow furnace by using a conveying mechanism. The PCB is heated by hot air in the reflow furnace, and the tin paste melts, wherein the auxiliary component volatilizes. The tin paste at the pins of the through-hole components includes solder around the top surface of the through hole and in the through hole. When heated, the tin paste reflows into the through hole to fill the through hole and complete the through-hole reflow soldering. The PCB after welding needs to be trimmed to complete the welding processing of the PCB.

[0003] However, in the process of using the traditional reflow soldering equipment, the pins of the through-hole components inserted into the through holes will take out the tin paste in the through holes for too long distance, and the tin paste in part of the through holes will adhere to the side surface and the bottom end of the pin to form a "match head", which leads to insufficient tin filling between the pin in the through hole and the inner wall of the through hole, and the hole rate of the through hole increases in the process of reflow soldering, and the phenomenon of false welding occurs. In addition, the tin paste adhered to the bottom end of the pin is easy to melt and fall into the reflow furnace under the blowing of the hot air in the reflow furnace, which shortens the period of cleaning and maintenance of the equipment during the through-hole reflow soldering process of the reflow furnace, and leads to the increase of production cost. SUMMARY

[0004] The present application provides a reflow soldering equipment for PCB processing, which has the advantages of ensuring sufficient tin paste content in the through hole and removing the tin paste adhered to the pin, so as to solve the problem that the tin paste in the through hole is easy to be taken out by the pin for too long distance, which leads to lack of solder in the through hole, and the tin paste is easy to be blown into the reflow furnace by air flow.

[0005] To achieve the above-mentioned purpose, the technical scheme adopted by the present application is as follows: a reflow soldering equipment for PCB processing, comprising a support, a positioning seat for positioning a circuit board body is fixedly arranged at the top of the support, a fixed plate is fixedly connected to the bottom of the positioning seat, a fixed ring is fixedly sleeved at the top of the fixed plate, the number of the fixed rings is set to be a plurality, and the number and position of the fixed rings correspond to the number and position of the plated through holes.

[0006] The inner side of the fixed ring is provided with a communication hole near the center, the diameter of the communication hole is matched with the diameter of the pin, one side of the support is provided with a shearing mechanism, the shearing mechanism is used for shearing the pin after the corresponding through-hole component is attached to the circuit board.

[0007] Further, the inner side of the fixed ring is fixedly provided with an elastic diaphragm for guiding the pin inserted into the communication hole, the elastic diaphragm is an annular diaphragm, and the cross section of the inner annular surface of the elastic diaphragm is arc-shaped.

[0008] The arc-shaped annular surface of the elastic diaphragm is used for guiding during the process of inserting the pin into the communication hole, so as to ensure the stability of the insertion process.

[0009] Further, the inner arc surface of the elastic diaphragm is provided with a tin paste coating, and the amount of tin paste coated on each electroplated through hole is the remaining tin paste volume after the tin paste at the bottom of the pin is removed, which meets the filling of the electroplated through hole in the subsequent welding process.

[0010] The amount of pre-coated tin paste meets the requirement of melting and filling the electroplated through hole in the subsequent heating and welding process after the part carried out by the pin bottom is removed.

[0011] Further, the shearing mechanism comprises a driving mechanism and a shearing head, and the driving mechanism is used for driving the shearing head to move.

[0012] The shearing mechanism is matched to remove the tin paste at the bottom of the pin after the tin paste on the side wall of the pin is separated, so as to avoid the participation of the part of tin paste in the subsequent welding process.

[0013] Further, a support cavity is surrounded between the elastic diaphragm and the fixed ring, the inner side of the fixed ring is provided with an adjusting mechanism, and the adjusting mechanism can adjust the air pressure in the support cavity. After the pin is inserted into the communication hole, the air pressure is increased to make the inner side of the elastic diaphragm close to the pin.

[0014] The shearing mechanism is matched, the air pressure in the support cavity is increased to make the elastic diaphragm close to the pin before shearing, so that the tin paste on the inner side is attached to the pin at the position of the electroplated through hole, the continuity of the tin paste and the tin paste in the electroplated through hole is ensured, and the stability of the pin in the subsequent shearing process is ensured through the pressure between the elastic diaphragm and the pin.

[0015] Further, the adjusting mechanism comprises an adjusting ring, the fixed ring is provided with an annular adjusting cavity, the adjusting ring is slidably sleeved in the adjusting cavity, the adjusting ring is used for changing the air pressure of the adjusting cavity at the top of the adjusting ring, and one side of the fixed ring is provided with a connecting hole, the connecting hole is used for connecting the support cavity and the adjusting cavity.

[0016] The air pressure in the adjusting cavity is changed by moving the adjusting ring, and the air pressure in the support cavity is adjusted by the connecting hole.

[0017] Further, the bottom of the adjusting ring is fixedly connected with a moving ring, a reset spring is movably arranged in the adjusting cavity, and a wear-resistant block is arranged on one side of the shearing head.

[0018] Through cooperation of the wear-resistant block and the moving ring, when the shearing head moves to the position corresponding to the pin to be sheared, the moving ring moves to change the air pressure in the adjusting cavity, so that the air pressure in the supporting cavity is increased to cooperate with the shearing action.

[0019] Further, one side of the support is fixedly provided with a reflow furnace, and the bottom of the support is fixedly provided with a collection box.

[0020] The reflow furnace is used for reflow soldering process of the circuit board after the patching is completed, and the collection box collects the sheared pins and the tin paste attached to the sheared pins.

[0021] The present application has the following advantages:

[0022] The reflow soldering device for PCB processing provided by the present application scrapes the tin paste attached to the side wall of the pin to the bottom of the electroplated through hole through the inner wall of the communication hole in the fixing ring, and removes the tin paste at the bottom of the pin together with the excess length of the pin by using the shearing mechanism, so that the amount of the tin paste in the electroplated through hole is ensured to be stable and sufficient, and the subsequent trimming of the excess length of the pin on the circuit board and the reduction of the tin paste in the electroplated through hole brought out of the reflow furnace by the pin to cause additional pollution are avoided. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative effort on the basis of the provided drawings:

[0024] Figure 1 It is a schematic diagram of the overall structure of the present application;

[0025] Figure 2 It is a schematic diagram of the structure at the positioning seat of the present application;

[0026] Figure 3 It is a schematic diagram of the structure section at the fixed plate of the present application;

[0027] Figure 4 It is an enlarged schematic diagram of the structure at A in the present application; Figure 3

[0028] Figure 5 It is a schematic diagram of the structure section at the top block of the present application. ​

[0029] In the figure: 1 - support, 2 - positioning seat, 3 - circuit board body, 4 - through-hole component, 5 - pin, 6 - fixed plate, 7 - fixed ring, 8 - elastic diaphragm, 9 - support cavity, 10 - adjusting cavity, 11 - adjusting ring, 12 - moving ring, 13 - return spring, 14 - electroplated through-hole, 15 - connecting hole, 16 - driving mechanism, 17 - shearing head, 18 - reflow oven, 19 - collection box, 20 - wear-resistant block, 21 - communication hole. DETAILED DESCRIPTION

[0030] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of the present application.

[0031] Embodiment one, as Figures 1-5 A reflow soldering device for PCB processing, comprising a support 1, a positioning seat 2 for positioning a circuit board body 3 is fixedly arranged on the top of the support 1, the carrying mechanism of the reflow soldering device moves the circuit board body 3 after the corresponding area is coated with tin paste, so that the position of the circuit board body 3 is fixed relative to the corresponding positioning seat 2, the corresponding pin 5 of the through-hole component 4 is used for inserting into the electroplated through-hole 14 on the circuit board body 3, the amount of tin paste coated at the electroplated through-hole 14 satisfies that the tin material between the inner wall of the electroplated through-hole 14 and the pin 5 and the tin material on the top surface of the circuit board body 3 around the top of the electroplated through-hole 14 is sufficient to fill the area between the electroplated through-hole 14 and the pin 5 after the volatilization of the additive, and the tin paste coated on the top surface of the circuit board body 3 around the top of the electroplated through-hole 14 avoids the position of the surface-mounted component 4 during coating, so as to avoid the tin beads in the subsequent reflow soldering process, affecting the welding quality.

[0032] The patch mechanism of the reflow soldering device arranges the surface-mounted component and the through-hole component 4 to the corresponding position on the top of the circuit board body 3, wherein the pin 5 of the through-hole component 4 passes through the corresponding electroplated through-hole 14 when arranged on the top surface of the circuit board body 3, one side of the support 1 is fixedly provided with a reflow oven 18, the carrying mechanism sends the circuit board body 3 with the electronic components arranged and pasted into the connection position of the reflow oven 18, so that the circuit board body 3 is driven by the conveying mechanism of the reflow oven 18 to pass through the reflow oven 18, the reflow oven 18 melts the tin paste on the circuit board body 3 through hot air, the PCB moves to the cooling assembly of the reflow oven 18 for cooling, the through-hole reflow soldering process of the circuit board body 3 is completed, and the welding processing of the circuit board body 3 is completed after the pin 5 is sheared.

[0033] The bottom of the positioning seat 2 is fixedly connected with a fixed plate 6, the top surface of the fixed plate 6 is attached to the bottom surface of the circuit board body 3 of the corresponding specification, the top of the fixed plate 6 is fixedly sleeved with a fixed ring 7, the number of the fixed ring 7 is set to be several, the number and position of the fixed ring 7 correspond to the number and position of the electroplated through hole 14, the inner side of the fixed ring 7 is provided with a communication hole 21 near the center, the axis of the communication hole 21 is collinear with the axis of the electroplated through hole 14, the diameter of the communication hole 21 is matched with the diameter of the pin 5, when the patch mechanism installs and pastes the through-hole component 4 to the top surface of the circuit board body 3, the pin 5 passes through the electroplated through hole 14 and then passes through the corresponding communication hole 21, the inner wall of the communication hole 21 is attached to the pin 5, thereby scraping the tin paste adhered to the side wall of the pin 5 relative to the pin 5, so that the scraped tin paste is always located near the bottom of the electroplated through hole 14, avoiding that the tin paste between the electroplated through hole 14 and the pin 5 is taken away by the pin 5 too far away, thereby affecting the reflow of the subsequent tin paste.

[0034] One side of the support 1 is provided with a shearing mechanism, the shearing mechanism includes a driving mechanism 16 and a shearing head 17, the shearing mechanism is used for shearing the pin 5 after the corresponding through-hole component 4 is installed and pasted to the circuit board body 3, the driving mechanism 16 can be set as a mechanical arm, the driving mechanism 16 is used for driving the shearing head 17 to move, so that the shearing head 17 moves to the bottom of the pin 5 to be trimmed, the shearing head 17 shears the pin 5 to remove the tin paste adhered to the bottom of the pin 5, and at the same time, subsequent trimming of the pin 5 is not required, thereby ensuring that the circuit board body 3 avoids that the tin paste adhered to the bottom of the pin 5 is blown and falls into the furnace body under the blowing action of the hot air in the reflow furnace 18, thereby increasing the pollution degree of the reflow furnace 18, thereby prolonging the period required for cleaning and maintenance of the reflow process of the through-hole reflow soldering in the reflow furnace 18, thereby reducing the production cost while ensuring the welding quality of the electroplated through hole 14.

[0035] The inner side of the fixed ring 7 is fixedly provided with an elastic diaphragm 8 used for guiding the pin 5 inserted into the communication hole 21, the elastic diaphragm 8 is an annular diaphragm and the cross section of the inner side annular surface of the elastic diaphragm 8 is arc-shaped, the pin 5 is guided to the communication hole 21 after passing through the electroplated through hole 14, thereby ensuring the stability of the pin 5 insertion process, the bottom of the support 1 is fixedly provided with a collection box 19, the collection box 19 collects the waste after the pin 5 is sheared, thereby facilitating subsequent recycling, after the tin paste at the bottom of the pin 5 is removed, the amount of tin paste between the corresponding electroplated through hole 14 and the pin 5 and the volume of the tin paste around the top and bottom surfaces of the electroplated through hole 14 meet the filling of the electroplated through hole 14 in the subsequent welding process, the inner side arc surface of the elastic diaphragm 8 is provided with a tin paste-repellent coating, the tin paste-repellent coating can be set as a diamond-like carbon coating, thereby avoiding that the elastic diaphragm 8 adheres to the tin paste.

[0036] In the embodiment two, as Figures 2-5On the basis of the first embodiment, the fixed ring 7 is provided with an annular adjusting cavity 10, the adjusting ring 11 is slidably sleeved in the adjusting cavity 10, the adjusting ring 11 is used for changing the air pressure of the adjusting cavity 10 at the top of the adjusting ring 11, the elastic diaphragm 8 and the fixed ring 7 surround the supporting cavity 9, the fixed ring 7 is provided with a connecting hole 15 on one side, the connecting hole 15 is used for connecting the supporting cavity 9 and the adjusting cavity 10, when the pin 5 is inserted into the communicating hole 21, the adjusting ring 11 is located at the bottom of the adjusting cavity 10, the arc surface of the elastic diaphragm 8 is used for guiding the insertion action of the pin 5, the bottom of the adjusting ring 11 is fixedly connected with the moving ring 12, the reset spring 13 is movably arranged in the adjusting cavity 10, and the reset spring 13 is used for driving the moving ring 12 to move to the top of the adjusting ring 11, and the reset spring 13 is used for driving the adjusting ring 11 to move to the bottom of the adjusting cavity 10. Figure 5 The side of the shearing head 17 is provided with the wear-resistant block 20.

[0037] When the shearing mechanism shears the pin 5, the driving mechanism 16 drives the shearing head 17 to move to the bottom of the pin 5, the wear-resistant block 20 abuts against the moving ring 12, the moving ring 12 is retracted into the adjusting cavity 10, the moving ring 12 drives the adjusting ring 11 to move, the adjusting ring 11 compresses the cavity at the top of the adjusting cavity 10, the cavity of the adjusting cavity 10 is connected with the supporting cavity 9 through the connecting hole 15, the air pressure in the supporting cavity 9 increases along with the increase of the air pressure of the adjusting cavity 10, the air pressure in the supporting cavity 9 makes the elastic diaphragm 8 further close to the pin 5, the scraped tin paste on the inner side is re-coated on the outer wall of the pin 5, the effective contact between the scraped tin paste and the pin 5 at the position of the through-hole 14 is ensured, part of the elastic diaphragm 8 is in close contact with the pin 5 to further fix the pin 5, the position of the pin 5 is fixed during the shearing process, and the stability of the reflow soldering equipment is improved.

[0038] The above description of disclosed embodiments enables one of ordinary skill in the art to make or use the application. Various modifications to these embodiments will be readily apparent to those of ordinary skill in the art, and the generic principles defined herein can be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A reflow soldering apparatus for PCB processing, comprising a support (1), a positioning seat (2) for positioning a circuit board body (3) is fixedly arranged on the top of the support (1), characterized in that, The bottom of the positioning seat (2) is fixedly connected with a fixed plate (6), the top of the fixed plate (6) is fixedly sleeved with a fixed ring (7), the number of the fixed ring (7) is set to be several, and the number and position of the fixed ring (7) correspond to the number and position of the electroplating through hole (14); A communication hole (21) is formed at the inner side of the fixed ring (7) near the center, the diameter of the communication hole (21) is matched with the diameter of the pin (5), one side of the support (1) is provided with a shearing mechanism, and the shearing mechanism is used for shearing the pin (5) after the corresponding through hole component (4) is attached to the circuit board body (3); An elastic diaphragm (8) for guiding the pin (5) inserted into the communication hole (21) is fixedly arranged at the inner side of the fixed ring (7), the elastic diaphragm (8) is an annular diaphragm, and the cross section of the inner annular surface of the elastic diaphragm (8) is arc-shaped; A supporting cavity (9) is formed between the elastic diaphragm (8) and the fixed ring (7), the inner side of the fixed ring (7) is provided with an adjusting mechanism, the adjusting mechanism can adjust the air pressure in the supporting cavity (9), and the air pressure is increased after the pin (5) is inserted into the communication hole (21) to make the inner side of the elastic diaphragm (8) close to the pin (5).

2. The reflow soldering apparatus for PCB processing according to claim 1, wherein, The inner arc surface of the elastic diaphragm (8) is provided with a tin paste coating, and the amount of tin paste coated on each electroplating through hole (14) is the volume of tin paste remaining after the tin paste at the bottom of the pin (5) is removed, which can meet the filling of the electroplating through hole (14) in the subsequent welding process.

3. The reflow soldering apparatus for PCB processing according to claim 1, wherein The shearing mechanism comprises a driving mechanism (16) and a shearing head (17), and the driving mechanism (16) is used for driving the shearing head (17) to move.

4. The reflow soldering apparatus for processing PCBs according to claim 3, wherein, The adjusting mechanism comprises an adjusting ring (11), the fixed ring (7) is provided with an annular adjusting cavity (10) in the inner side, the adjusting ring (11) is slidably sleeved in the adjusting cavity (10), the adjusting ring (11) is used for changing the air pressure of the adjusting cavity (10) located at the top cavity of the adjusting ring (11), one side of the fixed ring (7) is provided with a connecting hole (15), and the connecting hole (15) is used for connecting the supporting cavity (9) and the adjusting cavity (10).

5. The reflow soldering apparatus for processing PCBs according to claim 4, wherein, The bottom of the adjusting ring (11) is fixedly connected with a moving ring (12), the adjusting cavity (10) is movably provided with a return spring (13), one side of the shearing head (17) is provided with a wear-resistant block (20), and the moving ring (12) can drive the moving ring (12) to contract into the adjusting cavity (10) before shearing in cooperation with the wear-resistant block (20).

6. The reflow soldering apparatus for PCB processing according to claim 1, wherein One side of the support (1) is fixedly provided with a reflow furnace (18), and the bottom of the support (1) is fixedly provided with a collection box (19).

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