Processing method for blind scooping of circuit board

Abstract

The invention discloses a circuit board blind scooping processing method, which comprises the following steps of providing a whole substrate, dividing the whole substrate into a plurality of processing jointed boards, and designing a blind scooping program of each processing jointed board on a blind scooping machine; a single processing jointed board is used as a production unit, a milling cutter of a blind scooping machine starts to carry out blind scooping at a preset depth from the surface of the base plate along a set blind scooping path, scooping of a blind scooping groove is completed, a frame of each single-piece product is left, and a spacing bar is arranged between every two adjacent single-piece products; the base plate subjected to shape fishing is formed, and a semi-finished product is obtained; and performing solder mask treatment on the semi-finished product, performing appearance inspection, and obtaining a finished product after the inspection is qualified. The manufacturing method has the advantages that only forming and solder mask procedures are needed, the manufacturing process is simple, the structure is simple, excessive sharp corners and burrs are avoided, impurity sources are reduced, the product quality is improved, and cleaning is convenient in the manufacturing process.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB processing, and in particular to a processing method for blind fishing of a circuit board. Background Art

[0002] The description in this section merely provides background information related to the present disclosure and may not constitute prior art.

[0003] At present, the thickness of the plug-hole breathable board is uniformly 59mil thick substrate, and the breathable holes are uniformly drilled with a 50mil drill bit. The small hole diameter is easy to be blocked. If the BGA area needs to be plugged, it is hollowed out in the form of slots. The current production process is relatively complicated: drilling, forming, brushing, electroplating and solder masking. The formed breathable board has many sharp corners and burrs, which are easy to fall off during use, and are easy to get hair stuck when cleaning, causing anti-sticking.

[0004] It should be noted that the above technical background is merely provided to provide a clear and complete description of the technical solutions of the present invention and to facilitate understanding by those skilled in the art. Simply because these solutions are described in the technical background section of the present invention, it should not be assumed that the above technical solutions are well known to those skilled in the art. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a processing method for blind fishing of circuit boards in view of the shortcomings of the existing technology.

[0006] The present application discloses a method for blindly fishing a circuit board, comprising the following steps:

[0007] Providing a whole substrate, dividing the whole substrate into a plurality of processing panels, and designing a blind scooping program for each processing panel on a blind scooping machine;

[0008] Taking a single processed panel as a production unit, the milling cutter of the blind fishing machine starts from the surface of the substrate and blind fishes along a set blind fishing path at a preset depth to complete the fishing of the blind fishing groove, leaving a border of each single product, and spacers between adjacent single products;

[0009] Molding the completed substrate to obtain a semi-finished product;

[0010] The semi-finished products are subjected to solder mask treatment and appearance inspection, and the finished products are obtained after passing the inspection.

[0011] Furthermore, in the above-mentioned circuit board blind fishing processing method, the thickness of the substrate is 90 mil.

[0012] Furthermore, in the above-mentioned circuit board blind fishing processing method, in the step of "starting from the surface of the substrate, the milling cutter of the blind fishing machine performs blind fishing along the set blind fishing path at a preset depth to complete the fishing of the blind fishing groove", the preset depth is 60 mil.

[0013] Furthermore, in the above-mentioned circuit board blind fishing processing method, in the step of "starting from the surface of the substrate, the milling cutter of the blind fishing machine performs blind fishing along the set blind fishing path at a preset depth to complete the fishing shape of the blind fishing groove, leaving the border of each single-piece product", when the spacing between any side of the length or width of the single-piece product is greater than or equal to 5 cm, a support point is provided in the blind fishing groove.

[0014] Furthermore, in the above-mentioned circuit board blind fishing processing method, the step of "starting from the surface of the substrate, the milling cutter of the blind fishing machine performs blind fishing along the set blind fishing path at a preset depth to complete the fishing shape of the blind fishing groove, leaving the border of each single-piece product, and the adjacent single-piece products are spaced as spacers", the narrowest spacing between adjacent single-piece products is used, and the border of the single-piece product is made by reducing 5 mil on one side.

[0015] Furthermore, in the above-mentioned circuit board blind fishing processing method, when the width of the spacer strip is greater than or equal to 2mm, the spacer strip is made with a 2mm width; when the width of the spacer strip is less than 2mm, the spacer strip is made with a minimum diameter minus 10mil on one side.

[0016] In summary, the above structure adopted in the embodiment of the present invention has the following advantages:

[0017] The processing method for blind fishing of circuit boards described in the present invention only requires forming and solder masking processes, has a simple production process and a simple structure, is free of excessive sharp corners and burrs, reduces the source of impurities, improves product quality, and is easy to clean during the production process. After optimization, the scrap rate of products is reduced from 0.35% to 0.24%, and the defective rate of products is reduced from 4.06% to 3.12%.

[0018] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and illustration and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of this specification or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments recorded in this specification. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0020] Figure 1 Schematic diagram of a whole substrate in a method for blindly fishing a circuit board according to an embodiment of the present invention;

[0021] Figure 2 It is a cross-sectional view of a substrate blind fishing in a method for blind fishing of a circuit board in an embodiment of the present invention.

[0022] Reference numerals in the above figures: 1. substrate; 2. single-piece product; 3. spacer bar; 4. support point. DETAILED DESCRIPTION

[0023] To help those skilled in the art better understand the technical solutions in this specification, the following will provide a clear and complete description of the technical solutions in the embodiments of this specification, in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of this specification, not all of them. All other embodiments derived by those skilled in the art based on the embodiments in this specification without creative effort shall fall within the scope of protection of this specification.

[0024] The following is an explanation of the embodiments of the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. It is stated in advance. The following embodiments will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention.

[0025] It should be understood that although terms such as "first," "second," and "third" may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. In addition, the term "or" as used herein may include any one or more combinations of the associated listed items, as appropriate.

[0026] Reference Figures 1 to 2 As shown, the embodiment of the present application discloses a method for blindly fishing a circuit board, comprising the following steps:

[0027] Providing a whole substrate, dividing the whole substrate into a plurality of processing panels, and designing a blind scooping program for each processing panel on a blind scooping machine;

[0028] Taking a single processed panel as a production unit, the milling cutter of the blind fishing machine starts from the surface of the substrate and blind fishes along a set blind fishing path at a preset depth to complete the fishing of the blind fishing groove, leaving a border of each single product, and spacers between adjacent single products;

[0029] Molding the completed substrate to obtain a semi-finished product;

[0030] The semi-finished products are subjected to solder mask treatment and appearance inspection, and the finished products are obtained after passing the inspection.

[0031] Specifically, in this embodiment, the thickness of the substrate is 90 mil.

[0032] Specifically, in this embodiment, in the step of "starting from the surface of the substrate, the milling cutter of the blind fishing machine performs blind fishing along the set blind fishing path at a preset depth to complete the fishing of the blind fishing groove", the preset depth is 60 mil, and the blind fishing depth is less than the depth of the substrate, thereby realizing blind fishing processing.

[0033] Specifically, in this embodiment, in the step of "starting from the surface of the substrate, the milling cutter of the blind scooping machine performs blind scooping along the set blind scooping path at a preset depth to complete the scooping of the blind scooping groove, leaving the border of each single-piece product", when the spacing between any side of the length or width of the single-piece product is greater than or equal to 5 cm, a support point is provided in the blind scooping groove. When the empty position of the blind scooping groove of the finished board is less than 5 cm, there is no need to set a support point because the thickness of the substrate is large and the spacing is small, and no support is required.

[0034] Specifically, in this embodiment, in the step of "starting from the surface of the substrate, the milling cutter of the blind fishing machine performs blind fishing along the set blind fishing path at a preset depth to complete the fishing of the blind fishing groove, leaving the border of each single-piece product, and the adjacent single-piece products are spaced as spacers", the narrowest spacing is used between adjacent single-piece products, and the border of the single-piece product is made by reducing 5 mil on one side.

[0035] Specifically, in this embodiment, when the width of the spacer bar is greater than or equal to 2 mm, the spacer bar is made of 2 mm; when the width of the spacer bar is less than 2 mm, it will affect the finished board, and the spacer bar is made with the minimum diameter minus 10 mil on one side.

[0036] The processing method for blind fishing of circuit boards provided in this embodiment only requires forming and solder masking steps, has a simple production process, a simple structure, no excessive sharp corners and burrs, reduces the source of impurities, improves product quality, is easy to clean during the production process, does not scrape the dust-free cloth to produce dandruff, reduces the risk of impurities, and after optimization, the scrap rate of the product is reduced from 0.35% to 0.24%, and the defective rate of the product is reduced from 4.06% to 3.12%.

[0037] The contents disclosed above are only preferred feasible embodiments of the present invention and do not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the contents of the description and drawings of the present invention are included in the scope of the patent application of the present invention.

[0038] The various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on the differences from other embodiments.

[0039] Although the present application has been described through embodiments, those skilled in the art will appreciate that there are many modifications and variations to the present application without departing from the spirit of the present application. It is intended that the appended embodiments include these modifications and variations without departing from the present application.

Claims

1. A method for blind fishing of a circuit board, characterized in that: The following steps are involved: Providing a whole substrate, dividing the whole substrate into a plurality of processing panels, and designing a blind scooping program for each processing panel on a blind scooping machine; Taking a single processed panel as a production unit, the milling cutter of the blind fishing machine starts from the surface of the substrate and blind fishes along a set blind fishing path at a preset depth to complete the fishing of the blind fishing groove, leaving a border of each single product, and spacers between adjacent single products; Molding the completed substrate to obtain a semi-finished product; The semi-finished products are subjected to solder mask treatment and appearance inspection, and the finished products are obtained after passing the inspection.

2. The method for blindly fishing a circuit board according to claim 1, characterized in that: The thickness of the substrate is 90 mil.

3. The method for blindly fishing a circuit board according to claim 2, characterized in that: In the step of "starting from the surface of the substrate, the milling cutter of the blind fishing machine performs blind fishing along the set blind fishing path at a preset depth to complete the fishing of the blind fishing groove", the preset depth is 60 mil.

4. The method for blindly fishing a circuit board according to claim 1, characterized in that: In the step of "starting from the surface of the substrate, the milling cutter of the blind fishing machine performs blind fishing along a set blind fishing path at a preset depth to complete the fishing shape of the blind fishing groove, leaving the border of each single-piece product", when the distance between any one side of the length or width of the single-piece product is greater than or equal to 5 cm, a support point is provided in the blind fishing groove.

5. The method for blind fishing of a circuit board according to claim 1, characterized in that: In the step "starting from the surface of the substrate, the milling cutter of the blind fishing machine performs blind fishing along the set blind fishing path at a preset depth to complete the fishing shape of the blind fishing groove, leaving the border of each single-piece product, and the adjacent single-piece products are spaced as spacers", the narrowest spacing between adjacent single-piece products is used as the basis, and the border of the single-piece product is made by reducing 5 mil on one side.

6. The method for blindly fishing a circuit board according to claim 1, characterized in that: When the width of the spacer bar is greater than or equal to 2 mm, the spacer bar is made of 2 mm; when the width of the spacer bar is less than 2 mm, the spacer bar is made with the minimum diameter minus 10 mil on one side.

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