Multi-layer circuit board pressing equipment for electronic computer

Abstract

The invention discloses multi-layer circuit board pressing equipment for an electronic computer, and relates to the technical field of circuit board pressing, the multi-layer circuit board pressing equipment comprises a mounting box, a multi-layer pressing mechanism mounted in the mounting box, the multi-layer pressing mechanism comprises two frames, and extrusion plates are fixed on opposite sides of the two frames; the glue solution flow control mechanism is mounted on the mounting box; the multi-layer pressing mechanism is installed to evenly apply pressure to the workpiece, so that multiple layers of the workpiece are tightly attached together, then the glue solution flow control mechanism is used for conducting regional melting on PP sheets in the workpiece under the condition that the pressure is uniform and unchanged, the PP sheets form high-low temperature regions, the movement range of glue solution in the high-temperature regions is limited, and therefore the PP sheets can be melted in the high-low temperature regions. The glue solution loss is avoided, the glue solution content of each area of the workpiece is ensured to be uniform, the influence of non-uniform glue solution and glue solution loss on the fitting degree between layers of the workpiece is avoided, and the pressing quality of the workpiece is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board pressing, and in particular to a multi-layer circuit board pressing device for electronic computers. Background Art

[0002] Multi-layer circuit board lamination is to press two layers of copper foil and the inner core board together using PP sheets. The steps are as follows: stack the inner board, PP film and copper foil in order, completely cure the resin under high temperature and high pressure to form a stable interlayer structure, and quickly cool down to fix the shape to reduce deformation caused by thermal stress.

[0003] However, during the circuit board lamination process, when the PP sheet melts into glue, the glue will overflow under high pressure, resulting in glue loss. The loss of glue will not only waste PP material, but also reduce the bonding strength of the multilayer board, affecting the quality of the circuit board. Summary of the Invention

[0004] The present invention provides a multi-layer circuit board pressing device for electronic computers to solve the above-mentioned deficiencies in the prior art.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions: A multi-layer circuit board pressing device for an electronic computer includes a mounting box and: A multi-layer pressing mechanism is installed inside the installation box, and the multi-layer pressing mechanism includes two frames, and an extrusion plate is fixed on opposite sides of the two frames; A glue flow control mechanism is mounted on the mounting box, and includes two sets of mounting plates, with a plurality of heating strips fixed on one side of the mounting plates facing the extrusion plates; The driving mechanism is installed on the installation box and is connected with the multi-layer pressing mechanism and the glue flow control mechanism.

[0006] Furthermore, the installation box includes a control cabinet, and an operation box is fixed on the top of the control cabinet.

[0007] Furthermore, the multi-layer pressing mechanism further includes two double-section reciprocating threaded rods rotatably connected to the top of the control cabinet, the top of the double-section reciprocating threaded rod is fixed with a pulley 1, and the two pulleys 1 are connected to a belt 1 for transmission; A one-way gear 1 is installed on the outside of the bottom end of one of the two-stage reciprocating threaded rods; The external threaded sleeve of the double-section reciprocating threaded rod is provided with two movable plates 1, and the movable plates 1 are fixedly connected to the frame; A workpiece is placed on top of the extrusion plate below.

[0008] Furthermore, the multi-layer pressing mechanism also includes a plurality of guide rods 1 fixed to the top of the control cabinet, and two guide plates are sleeved on the outside of the guide rods 1, and the guide plates are fixedly connected to the frame.

[0009] Furthermore, the glue flow control mechanism further includes two reciprocating screws rotatably connected to the top of the control cabinet, and one set of the reciprocating screws is arranged inside the lower frame; A square rod is fixed on the top of the reciprocating screw rod 1, and a reciprocating screw rod 2 is provided on the top of the square rod. The reciprocating screw rod 2 is rotatably connected to the interior of the upper frame. A square hole is opened at the bottom of the reciprocating screw rod 2, and the square rod is sleeved inside the square hole. The outsides of the two reciprocating screw rods are fixed with pulleys 2, and the outsides of the two pulleys 2 are connected with belts 2; A one-way gear 2 is installed on the outside of one of the reciprocating screws 1.

[0010] Furthermore, the glue flow control mechanism further includes a second movable plate rotatably connected to the outside of the first reciprocating screw and the second reciprocating screw; A guide rod two is fixed between the two upper movable plates two and between the two lower movable plates two, and a bidirectional screw is rotatably connected thereto, one end of the bidirectional screw is fixed with a one-way gear three, one side of the one-way gear three is meshed with a rack, and the rack is fixed to one side of the frame, and the external thread sleeve of the bidirectional screw is provided with two movable plates three, and the movable plate three sleeves are arranged on the outside of the guide rod two, the two lower movable plates three are located at the bottom of the two lower mounting plates, and the two movable plates three are respectively fixedly connected to the two mounting plates, and the two upper movable plates three are located at the top of the two upper mounting plates, and the two movable plates three are respectively fixedly connected to the two mounting plates; Also included is a heating frame fixed inside the frame.

[0011] Furthermore, the driving mechanism includes a motor fixed on the top of the control cabinet, and a gear 1 is fixed to the output end of the motor. One side of the gear 1 is engaged with the one-way gear 1, and the other side is engaged with the one-way gear 2.

[0012] Compared with the existing technology, the beneficial effects of the present invention are: The present invention installs a multi-layer pressing mechanism to apply uniform pressure to the workpiece, so that the multiple layers of the workpiece are tightly fitted together. Then, the glue flow control mechanism is used to melt the PP sheet in the workpiece in different areas under uniform and constant pressure, so that the PP sheet forms high and low temperature areas, limits the activity range of the glue in the high-temperature area, avoids the loss of glue, and ensures that the glue content in each area of ​​the workpiece is uniform, avoids the uneven glue and glue loss affecting the fit between the layers of the workpiece, and ensures the pressing quality of the workpiece. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic diagram of the structural box of a multi-layer circuit board pressing device for electronic computers proposed by the present invention.

[0014] Figure 2 This is a schematic diagram of the internal structure of an operating box of a multi-layer circuit board pressing device for electronic computers proposed by the present invention.

[0015] Figure 3 This is a schematic structural diagram from the first perspective of a glue flow control mechanism of a multi-layer circuit board pressing device for electronic computers proposed by the present invention.

[0016] Figure 4 This is a schematic structural diagram from a second perspective of a glue flow control mechanism of a multi-layer circuit board pressing device for electronic computers proposed by the present invention.

[0017] Figure 5 This is a schematic structural diagram from a third perspective of a glue flow control mechanism of a multi-layer circuit board pressing device for electronic computers proposed by the present invention.

[0018] Figure 6 This is a schematic structural diagram from the fourth perspective of the glue flow control mechanism of the multi-layer circuit board pressing equipment for electronic computers proposed by the present invention.

[0019] In the figure: 1. Installation box; 11. Control cabinet; 12. Operation box; 2. Multi-layer pressing mechanism; 21. Double-section reciprocating threaded rod; 22. Moving plate one; 23. One-way gear one; 24. Pulley one; 25. Belt one; 26. Guide rod one; 27. Guide plate; 28. Frame; 29. ​​Extrusion plate; 210. Workpiece; 3. Glue flow control mechanism; 31. Reciprocating screw one; 32. Pulley two; 33. Belt two; 34. Square rod; 35. Reciprocating screw two; 36. Moving plate two; 37. Bidirectional screw; 38. Guide rod two; 39. Moving plate three; 310. Installation plate; 311. Heating strip; 312. Heating frame; 313. One-way gear three; 314. Rack; 315. One-way gear two; 4. Driving mechanism; 41. Motor; 42. Gear one. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0021] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0022] In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined. In addition, the terms "installed", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be a communication between the two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0023] Example: Refer to Figures 1-6 : A multi-layer circuit board pressing device for an electronic computer, comprising a mounting box 1, and further comprising: The multi-layer pressing mechanism 2 is installed inside the installation box 1. The multi-layer pressing mechanism 2 includes two frames 28. Extrusion plates 29 are fixed on opposite sides of the two frames 28. The glue flow control mechanism 3 is mounted on the mounting box 1 and includes two sets of mounting plates 310 . A plurality of heating strips 311 are fixed to the side of the mounting plates 310 facing the extrusion plate 29 . The driving mechanism 4 is installed on the installation box 1 , and is connected to the multi-layer pressing mechanism 2 and the glue flow control mechanism 3 .

[0024] The installation box 1 includes a control cabinet 11 , and an operation box 12 is fixed on the top of the control cabinet 11 .

[0025] The multi-layer pressing mechanism 2 also includes two double-section reciprocating threaded rods 21 rotatably connected to the top of the control cabinet 11. A pulley 24 is fixed to the top of the double-section reciprocating threaded rod 21. A belt 25 is connected to the two pulleys 24 for transmission. A one-way gear 23 is mounted on the outside of the bottom end of one of the two-section reciprocating threaded rods 21; The external threaded sleeve of the double-section reciprocating threaded rod 21 is provided with two movable plates 1 22 , and the movable plates 1 22 are fixedly connected to the frame 28 ; A workpiece 210 is placed on top of the lower pressing plate 29 .

[0026] The multi-layer pressing mechanism 2 further includes a plurality of guide rods 26 fixed to the top of the control cabinet 11 . Two guide plates 27 are sleeved on the outside of the guide rods 26 , and the guide plates 27 are fixedly connected to the frame 28 .

[0027] The glue flow control mechanism 3 also includes two reciprocating screws 31 rotatably connected to the top of the control cabinet 11, and the reciprocating screws 31 are sleeved inside the lower frame 28; A square rod 34 is fixed to the top of the reciprocating screw 31, and a reciprocating screw 35 is provided on the top of the square rod 34. The reciprocating screw 35 is rotatably connected to the inside of the upper frame 28. A square hole is opened at the bottom of the reciprocating screw 35, and the square rod 34 is sleeved inside the square hole. The outside of the two reciprocating screw rods 31 is fixed with pulleys 32, and the outside of the two pulleys 32 is connected with belts 33; A one-way gear 2 315 is installed on the outside of one of the reciprocating screws 31 .

[0028] The glue flow control mechanism 3 further includes a second moving plate 36 rotatably connected to the outside of the reciprocating screw 1 31 and the reciprocating screw 2 35; A guide rod 2 38 and a bidirectional screw 37 are fixed between the two upper movable plates 2 36 and between the two lower movable plates 2 36. One end of the bidirectional screw 37 is fixed with a one-way gear 313. One side of the one-way gear 313 is meshed with a rack 314. The rack 314 is fixed to one side of the frame 28. The external thread of the bidirectional screw 37 is provided with two movable plates 39. The movable plates 39 are sleeved on the outside of the guide rod 2 38. The two lower movable plates 39 are located at the bottom of the two lower mounting plates 310, and the two movable plates 39 are fixedly connected to the two mounting plates 310 respectively. The two upper movable plates 39 are located at the top of the two upper mounting plates 310, and the two movable plates 39 are fixedly connected to the two mounting plates 310 respectively. A heating frame 312 is also included and fixed inside the frame 28 .

[0029] The driving mechanism 4 includes a motor 41 fixed to the top of the control cabinet 11. A gear 1 42 is fixed to the output end of the motor 41. One side of the gear 1 42 is engaged with the one-way gear 1 23, and the other side is engaged with the one-way gear 2 315.

[0030] Working principle: The starting motor 41 drives the gear 1 42 to rotate forward, and the forward rotation of the gear 1 42 satisfies the one-way gear 1 23 to drive the double-section reciprocating threaded rod 21 to rotate. The double-section reciprocating threaded rod 21 drives another double-section reciprocating threaded rod 21 to rotate synchronously through the pulley 1 24. The double-section reciprocating threaded rod 21 causes the two movable plates 1 22 to drive the frame 28 and the extrusion plate 29 to move closer to each other. In the process of the upper frame 28 moving downward, the reciprocating screw 2 35 is driven downward, and the square rod 34 is inserted deep into the reciprocating screw 2 35. The reciprocating screw 2 35 drives the movable plate 2 36, the bidirectional screw 37, the guide rod 2 38, the movable plate 39, the mounting plate 310 and the plurality of heating strips 311 installed above to move; When the two extrusion plates 29 approach each other, they apply pressure to the workpiece 210 so that the multi-layer workpiece 210 is uniformly compressed; The control motor 41 drives the gear 1 42 to reverse, and the reverse rotation of the gear 1 42 satisfies the one-way gear 2 315 to drive the reciprocating screw 1 31 to rotate. The reciprocating screw 1 31 drives another reciprocating screw 1 31 to rotate through the pulley 2 32 and the belt 2 33. The rotation of the reciprocating screw 1 31 drives the reciprocating screw 2 35 sleeved on the outside to rotate through the square rod 34. The reciprocating screw 1 31 and the reciprocating screw 2 35 rotate synchronously to make the movable plate 2 36 drive the bidirectional screw 37, the guide rod 2 38, the movable plate 3 39, the mounting plate 310 and the multiple heating strips 311 to move toward the extrusion plate 29. Although the one-way gear 313 is engaged with the rack 314 to rotate, the direction of movement toward the extrusion plate 29 does not satisfy the direction of driving the double-section reciprocating threaded rod 21 to rotate, and the one-way gear 313 is engaged with the rack 314 to rotate, but the direction of movement toward the extrusion plate 29 does not satisfy the direction of driving the double-section reciprocating threaded rod 21 to rotate. The heating strip 311 contacts the extrusion plate 29, and then the heating strip 311 is turned on. The heating strip 311 heats the workpiece 210 below through the extrusion plate 29. The workpiece 210 includes an inner core plate. Copper foil is provided on the top and bottom of the inner core plate, and a PP sheet (prepreg) is provided between the copper foil and the inner core plate. Because there is a gap between the two heating strips 311, the temperature between the two heating strips 311 is lower than the temperature below the heating strips 311. Therefore, part of the PP sheet below the heating strip 311 melts, but because the temperature between the two heating strips 311 is low, it cannot melt. The molten glue is confined to the high-temperature area and cannot cross the low-temperature area, thereby avoiding the loss of glue due to extrusion and ensuring the uniformity of the glue. After the area is melted, the motor 41 is started to drive the gear 1 42 to reverse, so that the movable plate 2 36 moved to the wire tail drives the bidirectional screw 37, the guide rod 2 38, the movable plate 39, the mounting plate 310 and the plurality of heating strips 311 away from the extrusion plate 29. During the process of moving away, the one-way gear 313 engages with the rack 314 to rotate in a direction that meets the direction of driving the bidirectional screw 37 to rotate, so that the two movable plates 39 drive the mounting plate 310 and the heating strip 311 to move, so that the heating strip 311 moves to face the low-temperature area. After the movable plate 2 36 moves to the wire tail, it moves downward, so that the heating strip 311 moves down and close to the extrusion plate 29. Then, the high-temperature area becomes a low-temperature area after being not heated, and the fluidity of the glue becomes poor. The low-temperature area is heated by the heating strip 311, and the unmelted PP sheet melts into glue, and is then confined in the high-temperature area and cannot cross the low-temperature area, thereby avoiding the loss of glue due to extrusion and ensuring the uniformity of the glue. After the PP sheet in the middle position is completely melted, turn off the heating strip 311, start the motor 41 to drive the gear 42 to reverse, reset the heating strip 311, start the heating frame 312 to heat the edge of the PP sheet to melt the edge of the PP sheet. The edge is melted last because the edge is in a low temperature state, which can limit the glue in the middle position and avoid the loss of the glue. Turn off the heating frame 312, wait for the workpiece 210 to cool completely, start the motor 41 to drive the gear 42 to rotate forward, and reset the extrusion plate 29.

[0031] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A multi-layer circuit board pressing device for an electronic computer, comprising a mounting box (1), characterized in that: Also includes: A multi-layer pressing mechanism (2) is installed inside the installation box (1), the multi-layer pressing mechanism (2) comprising two frames (28), and an extrusion plate (29) is fixed on opposite sides of the two frames (28); A glue flow control mechanism (3) is mounted on the mounting box (1), the glue flow control mechanism (3) comprising two sets of mounting plates (310), a plurality of heating strips (311) being fixed on one side of the mounting plates (310) facing the extrusion plate (29); A driving mechanism (4) is installed on the installation box (1), and the driving mechanism (4) is connected to the multi-layer pressing mechanism (2) and the glue flow control mechanism (3).

2. The multi-layer circuit board pressing device for electronic computers according to claim 1, characterized in that: The installation box (1) comprises a control cabinet (11), and an operating box (12) is fixed on the top of the control cabinet (11).

3. The multi-layer circuit board pressing device for electronic computers according to claim 2, characterized in that: The multi-layer pressing mechanism (2) further comprises two double-section reciprocating threaded rods (21) rotatably connected to the top of the control cabinet (11), a pulley (24) being fixed to the top of the double-section reciprocating threaded rod (21), and a belt (25) being connected to the two pulleys (24) for transmission. A one-way gear 1 (23) is installed on the outside of the bottom end of one of the two-section reciprocating threaded rods (21); The external threaded sleeve of the double-section reciprocating threaded rod (21) is provided with two movable plates (22), and the movable plates (22) are fixedly connected to the frame (28); A workpiece (210) is placed on top of the extrusion plate (29) below.

4. The multi-layer circuit board pressing device for electronic computers according to claim 3, characterized in that: The multi-layer pressing mechanism (2) further comprises a plurality of guide rods (26) fixed on the top of the control cabinet (11), wherein the guide rods (26) are externally sleeved with two guide plates (27), and the guide plates (27) are fixedly connected to the frame (28).

5. The multi-layer circuit board pressing device for electronic computers according to claim 4, characterized in that: The glue flow control mechanism (3) further includes two reciprocating screw rods (31) rotatably connected to the top of the control cabinet (11), and the reciprocating screw rods (31) are sleeved inside the lower frame (28); A square rod (34) is fixed to the top of the reciprocating screw rod 1 (31), and a reciprocating screw rod 2 (35) is provided on the top of the square rod (34). The reciprocating screw rod 2 (35) is rotatably connected to the inside of the upper frame (28). A square hole is provided at the bottom of the reciprocating screw rod 2 (35), and the square rod (34) is sleeved inside the square hole. The outsides of the two reciprocating screw rods (31) are fixed with pulleys (32), and the external transmission of the two pulleys (32) is connected with belts (33); A one-way gear 2 (315) is installed on the outside of one of the reciprocating screws 1 (31).

6. The multi-layer circuit board pressing device for electronic computers according to claim 5, characterized in that: The glue flow control mechanism (3) further includes a second movable plate (36) rotatably connected to the outside of the first reciprocating screw (31) and the second reciprocating screw (35); A guide rod 2 (38) and a bidirectional screw (37) are fixed between the two upper movable plates 2 (36) and between the two lower movable plates 2 (36). One end of the bidirectional screw (37) is fixed with a one-way gear 3 (313). One side of the one-way gear 3 (313) is meshed with a rack (314). The rack (314) is fixed to one side of the frame (28). The external thread of the bidirectional screw (37) is provided with two movable plates 3 (39). The movable plates 3 (39) are sleeved on the outside of the guide rod 2 (38). The two lower movable plates 3 (39) are located at the bottom of the two lower mounting plates (310), and the two movable plates 3 (39) are respectively fixedly connected to the two mounting plates (310). The two upper movable plates 3 (39) are located at the top of the two upper mounting plates (310), and the two movable plates 3 (39) are respectively fixedly connected to the two mounting plates (310). Also included is a heating frame (312) fixed inside the frame (28).

7. The multi-layer circuit board pressing device for electronic computers according to claim 6, characterized in that: The driving mechanism (4) includes a motor (41) fixed on the top of the control cabinet (11), and a gear 1 (42) is fixed to the output end of the motor (41). One side of the gear 1 (42) is engaged with the one-way gear 1 (23), and the other side is engaged with the one-way gear 2 (315).

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