Shell of electronic equipment and electronic equipment

Abstract

The invention belongs to the technical field of electronic equipment, and particularly relates to a shell of electronic equipment and the electronic equipment, the shell of the electronic equipment is formed by integral injection molding of a non-continuous fiber reinforced polyamide composite material, and the non-continuous fiber reinforced polyamide composite material is formed by compounding non-continuous fibers and polyamide resin. The long axis direction of the discontinuous fibers is parallel to the inner wall face of the shell, the discontinuous fibers are arranged layer by layer in the wall thickness direction of the shell, the heat conductivity coefficient of the shell in the wall thickness direction of the shell is 0.05-0.4 W / m.K, the emissivity of the outer surface of the shell is 0.7-0.98, and the tensile modulus of the shell is 15-35 Gpa, so that heat in the shell can be quickly dissipated, and the heat dissipation efficiency of the shell is improved. The performance stability of the electronic equipment is improved, the heat conductivity coefficient of the shell in the wall thickness direction of the shell is small, heat transferred to the skin is little in the heat dissipation process, the good heat insulation effect is achieved, and therefore the wearing comfort degree is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of electronic equipment, and particularly relates to a housing of an electronic equipment and the electronic equipment. Background Art

[0002] Consumer electronics, as necessities of daily life, encompass a wide range of categories, including smartphones, laptops, and tablets. They enrich our lives and bring unprecedented convenience to entertainment and communication. Furthermore, the emergence of smart wearable devices such as headphones, smartwatches, and AR / VR devices has propelled the consumer electronics market to new heights.

[0003] With the incorporation of technological aesthetics, consumer electronics design is increasingly prioritizing not only functionality and aesthetics but also user experience, including the feel of the skin. The outer supporting casings of consumer electronics often contain metal. In high-temperature environments, the metal surface has a low emissivity, making it feel hotter to the touch. In low-temperature environments, it absorbs less heat and feels cooler, impacting wearing comfort. This is even more pronounced in environments with extreme temperatures or radiation. Furthermore, consumer electronics generate significant heat during operation. Without effective heat management, this heat can accumulate inside the device, causing it to overheat. Excessive temperatures not only affect device performance and stability but can also damage internal components, shortening the device's lifespan.

[0004] Therefore, existing electronic devices still need to be improved. Summary of the Invention

[0005] The purpose of the present invention is to provide a housing of an electronic device and an electronic device, wherein the housing of the electronic device is integrally injection-molded from a discontinuous fiber-reinforced polyamide composite material, wherein the discontinuous fiber-reinforced polyamide composite material is composited from discontinuous fibers and polyamide resin, the long axis direction of the discontinuous fibers is arranged parallel to the inner wall surface of the housing, and the discontinuous fibers are arranged in layers along the wall thickness direction of the housing, thereby reducing the thermal conductivity of the housing along its wall thickness direction. The thermal conductivity of the housing along its wall thickness direction is small, and during the heat dissipation process, less heat is transferred to the skin, which has a good thermal insulation effect, thereby improving wearing comfort. A housing with a high external surface emissivity will dissipate heat faster through thermal radiation, preventing heat from accumulating inside the device and causing a temperature increase, thereby ensuring the performance and stability of the device.

[0006] A first aspect of the present invention provides a shell of an electronic device, wherein the shell is integrally injection-molded from a discontinuous fiber-reinforced polyamide composite material, wherein the discontinuous fiber-reinforced polyamide composite material is composited from discontinuous fibers and polyamide resin, wherein the long axis direction of the discontinuous fibers is arranged parallel to the inner wall surface of the shell, and the discontinuous fibers are arranged in layers along the wall thickness direction of the shell, the thermal conductivity coefficient of the shell along its wall thickness direction is 0.05W / m·K to 0.4W / m·K, the emissivity of the outer surface of the shell is 0.7 to 0.98, and the tensile modulus of the shell is 15GPa to 35GPa.

[0007] In some embodiments of the present invention, the outer surface emissivity of the shell is 0.85-0.98.

[0008] In some embodiments of the present invention, the tensile modulus of the shell is 20 GPa to 30 GPa.

[0009] In some embodiments of the present invention, the thermal conductivity of the shell along its wall thickness direction is 0.1 W / m·K to 0.2 W / m·K.

[0010] In some embodiments of the present invention, the tensile strength of the shell is 180 MPa to 450 MPa.

[0011] In some embodiments of the present invention, the shell has a melt index of 10 g / 10 min to 30 g / 10 min at 300°C.

[0012] In some embodiments of the present invention, the thermal deformation temperature of the shell is 250°C to 350°C.

[0013] In some embodiments of the present invention, the density of the shell is 1.2 g / cm 3 ~2.5g / cm 3 .

[0014] In some embodiments of the present invention, the mass percentage of the discontinuous fibers in the shell is 20% to 55%.

[0015] In some embodiments of the present invention, the discontinuous fibers include at least one of synthetic fibers and inorganic fibers.

[0016] In some embodiments of the present invention, the type of polyamide resin includes at least one of PA6, PA66, PA610, PA612, PA1010, PA11, PA12, PA1212, PA1012, PA1111, PA1213, PA1313, PPA, PA4T, PA6T, PA9T, PA10T, PA12T, and PA46.

[0017] A second aspect of the present invention further provides an electronic device, which includes the housing of the electronic device described in the first aspect.

[0018] The housing of the electronic device in the present invention is integrally injection-molded from a discontinuous fiber-reinforced polyamide composite material, wherein the discontinuous fiber-reinforced polyamide composite material is composited from discontinuous fibers and polyamide resin, the long axis of the discontinuous fibers is arranged parallel to the inner wall surface of the housing, and the discontinuous fibers are arranged layer by layer along the wall thickness direction of the housing, thereby reducing the thermal conductivity of the housing along its wall thickness direction. The thermal conductivity of the housing along its wall thickness direction is relatively low, and during the heat dissipation process, less heat is transferred to the skin, which has a good thermal insulation effect, thereby improving wearing comfort. A housing with a high external surface emissivity will dissipate heat more quickly through thermal radiation, preventing heat from accumulating inside the device and causing a temperature increase, thereby ensuring the performance and stability of the device.

[0019] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are specifically listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0021] Figure 1 Schematic diagram of the structure of the housing in some embodiments of the present invention;

[0022] Figure 2 for Figure 1 Schematic diagram of the cross section of the middle shell along its length.

[0023] Figure 3 for Figure 1 Schematic diagram of the cross section of the middle shell along its thickness direction.

[0024] Figure 4 This is a schematic diagram of some embodiments of the present invention in which the long axis direction of the discontinuous fibers is arranged parallel to the inner wall surface of the shell.

[0025] Description of reference numerals:

[0026] 100 - shell; 101 - shell interior; 102 - shell exterior; 10 - discontinuous fiber. DETAILED DESCRIPTION

[0027] Exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments described herein. Rather, these embodiments are provided to enable a more thorough understanding of the present invention and to fully convey the scope of the present invention to those skilled in the art.

[0028] It should be understood that the terms used herein are for the purpose of describing specific example embodiments only and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "one", "an" and "said" as used herein may also be meant to include plural forms. The terms "comprise", "include", "contain" and "have" are inclusive and therefore specify the presence of stated features, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, steps, operations, elements, parts, and / or combinations thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring them to be performed in the specific order described or illustrated, unless the order of execution is clearly indicated. It should also be understood that additional or alternative steps may be used.

[0029] In the description of the embodiments of the present invention, technical terms such as "first" and "second" are used solely to distinguish between different objects and should not be understood to indicate or imply relative importance or to implicitly specify the quantity, specific order, or primary and secondary relationship of the technical features indicated. In the description of the embodiments of the present invention, "plurality" means more than two, unless otherwise specifically defined.

[0030] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present invention. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute a separate or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0031] In the description of the embodiments of the present invention, the term "and / or" is simply a description of the association relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent the following three situations: A exists alone, A and B exists simultaneously, and B exists alone. In addition, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0032] In the description of the embodiments of the present invention, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0033] In the description of the embodiments of the present invention, unless otherwise expressly specified or limited, technical terms such as "installed," "connected," "connect," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and can refer to internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of the present invention based on specific circumstances.

[0034] The first aspect of the present invention provides a housing of an electronic device, Figures 1 to 4 According to the introduction, the shell 100 of the electronic device is integrally injection-molded from a discontinuous fiber reinforced polyamide composite material, wherein the discontinuous fiber reinforced polyamide composite material is composited from discontinuous fibers 10 and polyamide resin, and the long axis direction of the discontinuous fibers 10 is arranged parallel to the inner wall surface of the shell 100, and the discontinuous fibers 10 are arranged in layers along the wall thickness direction of the shell 100. The thermal conductivity coefficient of the shell 100 along its wall thickness direction is 0.05W / m·K~0.4W / m·K, the outer surface emissivity of the shell 100 is 0.7~0.98, and the tensile modulus of the shell 100 is 15GPa~35GPa.

[0035] In the embodiment of the present invention, the non-continuous fiber 10 can be understood as a short-cut fiber, and the shell 100 has an inner wall surface and an outer surface of the shell. Figure 3 and Figure 4 The shell interior 101 and the shell exterior 102 are shown to schematically illustrate the arrangement direction of the non-continuous fibers 10. Since the thermal conductivity of the non-continuous fibers 10 is relatively high, the long axis direction of the non-continuous fibers 10 is designed to be parallel to the inner wall surface of the shell 100, and the non-continuous fibers 10 are arranged layer by layer along the wall thickness direction of the shell 100 to avoid the formation of fiber heat conduction channels along the direction perpendicular to the inner wall surface of the shell, thereby reducing the thermal conductivity of the shell 100 along its wall thickness direction, thereby increasing the emissivity of the outer surface of the shell. The shell 100 will dissipate heat faster through thermal radiation in a direction parallel to the shell surface, effectively reducing the temperature inside the shell. Moreover, since the thermal conductivity of the shell along its wall thickness direction is relatively low, the amount of heat transferred to the skin during heat dissipation is relatively small, which has a good thermal insulation effect, thereby improving wearing comfort.

[0036] In an embodiment of the present invention, the outer surface emissivity of the shell 100 is 0.7 to 0.98. Surface emissivity is the ability of the shell surface to radiate heat. A shell with a high emissivity will dissipate heat faster through thermal radiation, preventing heat from accumulating inside the device and causing the temperature to rise, thereby ensuring the performance and stability of the device. In addition, at the same ambient temperature, the surface temperature of a shell with a high emissivity can reach equilibrium with the environment faster, thereby affecting the touch temperature. The outer surface emissivity of the shell 100 provided by the present invention can be a value in the interval consisting of any two values ​​within the above range, for example, it can be 0.7 to 0.85, or it can be 0.85 to 0.98, and so on. For example, in an embodiment of the present invention, the outer surface emissivity of the shell 100 can also be one of 0.7, 0.72, 0.74, 0.75, 0.78, 0.8, 0.82, 0.84, 0.85, 0.88, 0.9, 0.92, 0.94, 0.95, 0.96, 0.98, or any value that meets the above range.

[0037] In an embodiment of the present invention, the thermal conductivity of the shell 100 along the wall thickness direction is 0.05W / m·K to 0.4W / m·K. Thermal conductivity refers to the amount of heat transferred through an area of ​​1 square meter within 1 second under stable heat transfer conditions, when the temperature difference between the two surfaces of a 1-meter-thick material is 1 degree (K, ℃). The unit is watt / meter·degree (W / (m·K), where K can be replaced by ℃. The smaller the thermal conductivity, the more effective the shell 100 can be insulated, avoiding heat accumulation in a fixed position inside the device, reducing the temperature rise outside the shell 100, avoiding users feeling excessively high temperatures or discomfort during use, and improving comfort. The thermal conductivity of the shell 100 provided by the present invention along the wall thickness direction can be a value in the interval consisting of any two values ​​within the above range, such as 0.05W / m·K to 0.1W / m·K, or 0.1W / m·K~0.2W / m·K, and can also be 0.2W / m·K~0.4W / m·K, and so on. For example, the thermal conductivity of the housing 100 along its wall thickness direction in the embodiment of the present invention can also be one of 0.05W / m·K, 0.08W / m·K, 0.1W / m·K, 0.12W / m·K, 0.15W / m·K, 0.18W / m·K, 0.2W / m·K, 0.22W / m·K, 0.25W / m·K, 0.28W / m·K, 0.3W / m·K, 0.32W / m·K, 0.35W / m·K, 0.38W / m·K, 0.4W / m·K, or any value that meets the above range.

[0038] In an embodiment of the present invention, the tensile modulus of the shell 100 is 15GPa to 35GPa. The tensile modulus refers to the ratio of tensile stress to strain caused by stretching, and the ability of the shell 100 to resist tensile deformation within the elastic limit. When the tensile modulus of the shell 100 is too low, a higher thickness is required to maintain structural strength and stability, and there is no thinning effect. In particular, when the shell 100 vibrates, a higher tensile modulus is required; and when the tensile modulus of the shell 100 is too high, the amount of fiber added is high, which will cause the viscosity of the polyamide to be too high when it is melted, and cracks, breakages and unsatisfactory injection molding are likely to occur during the injection molding process. The tensile modulus of the shell 100 provided by the present invention can be a value in the interval composed of any two values ​​within the above range, for example, it can be 15GPa to 20GPa, or it can be 20GPa to 30GPa, or it can be 30GPa to 35GPa, and so on. Exemplarily, the tensile modulus of the shell 100 in the embodiment of the present invention can also be one of 15GPa, 16GPa, 17GPa, 18GPa, 19GPa, 20GPa, 21GPa, 22GPa, 23GPa, 24GPa, 25GPa, 26GPa, 27GPa, 28GPa, 29GPa, 30GPa, 31GPa, 32GPa, 33GPa, 34GPa, 35GPa or any value that meets the above range.

[0039] In some embodiments of the present invention, the tensile strength of the shell 100 is 180MPa to 450MPa. Tensile strength refers to the maximum stress that the shell can withstand when it breaks under a tensile load or reaches a specified bending moment. This stress is the maximum positive stress during tension. It reflects the shell's ability to resist stretching and is used to measure the tensile properties of the shell. When the tensile strength of the shell 100 is too low, it reflects that the shell's ability to resist damage is worse and the shell yield is lower; and when the tensile strength of the shell 100 is too high, the fiber addition amount is high, which will cause the viscosity of the polyamide to be too high when it is melted, and cracks, ruptures and unsatisfactory injection molding are likely to occur during the injection molding process. The tensile strength of the shell 100 provided by the present invention can be a value in the interval composed of any two values ​​within the above range, for example, it can be 180MPa to 300MPa, or it can be 300MPa to 450MPa, and so on. Exemplarily, the tensile strength of the shell 100 in the embodiment of the present invention can also be one of 180MPa, 190MPa, 200MPa, 210MPa, 220MPa, 230MPa, 240MPa, 250MPa, 260MPa, 270MPa, 280MPa, 290MPa, 300MPa, 310MPa, 320MPa, 330MPa, 340MPa, 350MPa, 360MPa, 370MPa, 380MPa, 390MPa, 400MPa, 410MPa, 420MPa, 430MPa, 440MPa, 450MPa or any value that meets the above range.

[0040] In some embodiments of the present invention, the melt index of the housing 100 at 300°C is 10g / 10min to 30g / 10min. The melt index is a key indicator for measuring the fluidity of a discontinuous fiber-reinforced polyamide composite material in a molten state at a certain temperature and pressure. When the melt index of the discontinuous fiber-reinforced polyamide composite material is low, the discontinuous fiber-reinforced polyamide composite material has poor fluidity in a molten state, making it difficult to fill complex molds and unable to achieve one-piece injection molding of the housing. When the melt index of the discontinuous fiber-reinforced polyamide composite material is too high, it means low molecular weight, short molecular chains, and poor crystallinity, resulting in insufficient internal structural strength of the material, thereby reducing tensile strength, impact toughness, and fatigue resistance, thereby affecting the mechanical properties of the housing 100. The melt index of the housing 100 provided by the present invention at 300°C can be a value within the range formed by any two values ​​within the above range, for example, it can be 10g / 10min to 15g / 10min, 15g / 10min to 25g / 10min, 25g / 10min to 30g / 10min, and so on. Exemplarily, the melt index of the shell 100 at 300°C in the embodiment of the present invention can also be one of 10g / 10min, 11g / 10min, 12g / 10min, 13g / 10min, 14g / 10min, 15g / 10min, 16g / 10min, 17g / 10min, 18g / 10min, 19g / 10min, 20g / 10min, 21g / 10min, 22g / 10min, 23g / 10min, 24g / 10min, 25g / 10min, 26g / 10min, 27g / 10min, 28g / 10min, 29g / 10min, 30g / 10min or any value that meets the above range. The non-continuous fiber reinforced polyamide composite material provided by the present invention has good fluidity and can be conveniently injection molded as one piece to form a shell 100 with uniform thickness and stable mechanical properties.

[0041] In some embodiments of the present invention, the heat deformation temperature of the housing 100 is 250°C to 350°C. The heat deformation temperature refers to the temperature at which the housing 100 undergoes a certain amount of deformation at high temperatures and is one of the important indicators for evaluating the heat resistance of the housing 100. In particular, when the housing 100 is a vibrating or contact heating unit, its heat deformation temperature must be greater than 270°C to ensure that it maintains dimensional and shape stability at high temperatures and meets actual usage requirements. The heat deformation temperature of the housing 100 provided by the present invention can be a value in the interval consisting of any two values ​​within the above range, for example, it can be 250°C to 270°C, or it can be 270°C to 350°C, and so on. For example, the heat deformation temperature of the housing 100 can also be one of 250°C, 260°C, 270°C, 280°C, 290°C, 300°C, 310°C, 320°C, 330°C, 340°C, 350°C, or any value that meets the above range.

[0042] In some embodiments of the present invention, the density of the housing 100 is 1.2 g / cm 3 ~3.0g / cm 3 When the density of the shell 100 is low, the amount of discontinuous fiber added is small, and the mechanical properties of the shell 100 are poor; when the density of the shell 100 is high, the content of discontinuous fiber in the discontinuous fiber reinforced polyamide composite material is too high, and the fluidity of the discontinuous fiber reinforced polyamide composite material will deteriorate. There will also be inconsistencies in the heating and flow states of the material during the injection molding process, resulting in injection molding difficulties. The shell 100 is prone to defects such as uneven thickness. The density of the shell 100 provided by the present invention can be a value in the interval formed by any two values ​​within the above range, such as 1.2 g / cm 3 ~1.3g / cm 3 , or 1.3 g / cm 3 ~1.5g / cm 3 , or 1.5g / cm 3 ~2.5g / cm 3 , and so on. For example, the density of the housing 100 in the embodiment of the present invention can also be 1.2g / cm 3 , 1.3g / cm 3 , 1.4g / cm 3 , 1.5g / cm 3 , 1.6g / cm 3 , 1.7g / cm 3 , 1.8g / cm 3 , 1.9g / cm 3 , 2.0g / cm 3 , 2.1g / cm 3 , 2.2g / cm 3 , 2.3g / cm3 , 2.4g / cm 3 , 2.5g / cm 3 or any value that satisfies the above range.

[0043] In some embodiments of the present invention, the mass percentage of the discontinuous fibers in the shell 100 is 20% to 55%. The main significance of adding discontinuous fibers is to improve the strength and stiffness properties of polyamide, so that the shell 100 exhibits better thermal stability and low dimensional shrinkage at high temperatures. It is understood that when the amount of discontinuous fibers added is too high, the fluidity of the discontinuous fiber-reinforced polyamide composite material will deteriorate. There will also be inconsistent heating and flow states of the material during the injection molding process, leading to injection molding difficulties. The shell 100 is prone to defects such as uneven thickness, which affects its dimensional stability and mechanical properties. When the amount of discontinuous fibers added is too low, the strength and stiffness of the discontinuous fiber-reinforced polyamide composite material cannot be significantly improved. The mass percentage of the discontinuous fibers in the shell 100 provided by the present invention can be a value within the interval consisting of any two values ​​within the above range, for example, it can be 20% to 35%, 35% to 45%, 45% to 55%, and so on. Illustratively, in the embodiment of the present invention, the mass percentage of the non-continuous fibers in the mass of the shell 100 can also be 20%, 21%, 22%, 23%, 24%, 25%, 26%, 27%, 28%, 29%, 30%, 31%, 32%, 33%, 34%, 35%, 36%, 37%, 38%, 39%, 40%, 41%, 42%, 43%, 44%, 45%, 46%, 47%, 48%, 49%, 50%, 51%, 52%, 53%, 54%, 55%, or any value that meets the above range.

[0044] In some embodiments of the present invention, the discontinuous fibers may be chopped fibers. For example, the length of the discontinuous fibers may be 0.01 cm to 1 cm. For example, the length of the discontinuous fibers may be one of 0.01 cm, 0.02 cm, 0.03 cm, 0.05 cm, 0.08 cm, 0.1 cm, 0.2 cm, 0.3 cm, 0.4 cm, 0.5 cm, 0.6 cm, 0.7 cm, 0.8 cm, 0.9 cm, and 1 cm, or any value within the above range.

[0045] In some embodiments of the present invention, the discontinuous fibers include at least one of synthetic fibers and inorganic fibers. The type of discontinuous fibers forming the housing 100 is not limited. The discontinuous fibers can be synthetic fibers, such as aramid fibers, orlon fibers, polyester fibers, nylon fibers, vinylon fibers, polypropylene fibers, and polyimide fibers. The discontinuous fibers can also be inorganic fibers, such as glass fibers, carbon fibers, boron fibers, whiskers, asbestos fibers, and metal fibers.

[0046] In some embodiments of the present invention, the type of polyamide resin includes at least one of PA6, PA66, PA610, PA612, PA1010, PA11, PA12, PA1212, PA1012, PA1111, PA1213, PA1313, PPA, PA4T, PA6T, PA9T, PA10T, PA12T, and PA46. Wherein, PA represents polyamide.

[0047] A second aspect of the present invention provides an electronic device, the key point being that the electronic device includes the housing 100 of the electronic device described in the first aspect.

[0048] In some embodiments of the present invention, the electronic device may be, but is not limited to, a smartphone, a laptop, a tablet computer, headphones, a smart watch, an AR / VR device, etc.

[0049] Unless otherwise defined, the technical terms used in the following examples have the same meanings as those generally understood by those skilled in the art to which the present invention belongs. The experimental reagents used in the following examples, unless otherwise specified, are all conventional biochemical reagents; the raw materials, instruments and equipment used in the following examples, etc., can be purchased on the market or can be obtained by existing methods; the dosage of the experimental reagents, unless otherwise specified, are the dosage of reagents in conventional experimental operations; the experimental methods, unless otherwise specified, are all conventional methods. It should be further explained that the following description is only exemplary and not a specific limitation of the present invention. Moreover, the selection of the following comparative examples is for comparison with the technical solution of the present invention to reflect the advanced nature of the technical solution of the present invention, and does not mean that the solution of the comparative examples is necessarily the prior art in this technical field.

[0050] The outer dimensions of the shells of the AR devices in the embodiment and the comparative example are consistent.

[0051] Example 1

[0052] An AR device housing 100 is integrally injection-molded from a discontinuous fiber-reinforced polyamide composite material composed of carbon fibers and PA6T. Specifically, the carbon fibers comprise 40% of the housing's mass. The housing is first dried in a dryer at 150°C for 3 hours to remove moisture from the carbon fibers and PA6T. The mold cavity temperature is then maintained at 150°C, and the housing is integrally injection-molded to produce the housing 100.

[0053] In the housing 100 , the long axis direction of the carbon fibers is parallel to the inner wall surface of the housing 100 , and the carbon fibers are arranged in layers along the wall thickness direction of the housing 100 .

[0054] Example 2

[0055] An AR device housing 100 is integrally injection-molded from a discontinuous fiber-reinforced polyamide composite material composed of carbon fibers and PA612. Specifically, the carbon fibers comprise 40% of the housing's mass. The housing is first dried at 150°C for 3 hours to remove moisture from the carbon fibers and PA612. The mold cavity temperature is then maintained at 150°C, and the housing is integrally injection-molded to form the housing 100.

[0056] In the housing 100 , the long axis direction of the carbon fibers is parallel to the inner wall surface of the housing 100 , and the carbon fibers are arranged in layers along the wall thickness direction of the housing 100 .

[0057] Comparative Example 1

[0058] A housing 100 for an AR device is made of a magnesium-lithium alloy. Specifically, the magnesium-lithium alloy is sheared and heated by screw rotation and heat provided by a heater outside the material tube to form a partially molten semi-solid slurry containing a spherical solid phase. The slurry has good fluidity. In this state, the slurry is injected into a mold at high speed to form the housing 100 of the AR device.

[0059] Comparative Example 2

[0060] A housing 100 of an AR device is integrally injection-molded from a discontinuous fiber-reinforced polyamide composite material, wherein the discontinuous fiber-reinforced polyamide composite material is composited from carbon fiber and PA6T.

[0061] The only difference between Comparative Example 2 and Example 1 is that the long axis direction of the carbon fibers in the shell 100 in Comparative Example 2 is arranged in a disordered manner, that is, they can be arranged parallel to the inner wall surface of the shell 100 or perpendicular to the inner wall surface of the shell 100.

[0062] Performance Testing

[0063] 1. Surface emissivity

[0064] Test instrument: infrared radiometer

[0065] Referring to the ASTM E1933 standard, an infrared radiometer is used to measure the radiation energy on the shell surface and compare it with the blackbody radiation energy at the same temperature to obtain the surface emissivity of the shell.

[0066] 2. Thermal conductivity test

[0067] The shell specimens were tested using a thermal conductivity tester in accordance with ASTM D5470.

[0068] 3. Tensile modulus test

[0069] The shell specimens were tested using a universal material testing machine in accordance with ASTM D882-2018.

[0070] 4. Tensile strength test

[0071] The shell specimens were tested using a universal material testing machine in accordance with ASTM D882-2018.

[0072] 5. Melt index test

[0073] The shell specimens were tested using a melt flow rate tester according to GB / T3682-2000. They were vacuum dried before testing and placed in a barrel. Discharging began after the sample melted. After the discharge stabilized, the specimens were cut with scissors every three seconds. The specimens were weighed after ten cuts and converted to g / 10min, which is the melt index value of the sample. The test conditions were: 300°C, 1.2kg.

[0074] 6. Heat deformation temperature test

[0075] The shell specimens were tested using a heat distortion temperature testing machine according to ASTM D648, with a loading stress of 1.82 (MPa), a heating rate of 2°C / min, and a deformation threshold of 0.25 mm.

[0076] 7. Density test

[0077] Use a density tester to test the density of the shell sample according to GB / T 1463-2005 standard. Test 5 samples in parallel and take the average value.

[0078]

[0079] The data in Table 1 demonstrates that, compared to Comparative Example 2, in Examples 1 and 2 of the present invention, by adjusting the orientation of the discontinuous fibers so that their long axes are parallel to the inner wall of the shell, the shell's outer surface emissivity is increased, allowing the shell to dissipate heat more quickly through thermal radiation. Furthermore, at the same ambient temperature, the surface temperature of the high-emissivity material reaches equilibrium with the skin more quickly than the magnesium-lithium alloy in Comparative Example 1, thereby affecting the skin's tactile sensation. In high-temperature environments, the skin feels less hot; in low-temperature environments, the heat absorption is minimized, resulting in a less cold feel.

[0080] Compared with Comparative Example 2, the long axis direction of the non-continuous fibers in Examples 1 and 2 of the present invention is arranged parallel to the inner wall surface of the shell, and the non-continuous fibers are arranged in layers along the wall thickness direction of the shell, avoiding the formation of fiber heat conduction channels along the vertical inner wall surface of the shell, reducing the thermal conductivity coefficient, avoiding users feeling too high temperature or discomfort during use, and improving the comfort of use.

[0081] 8. High temperature and high humidity reliability test

[0082] The product is placed in a test environment with a temperature of 85°C and a humidity of 85% for 120 hours, and then its performance is tested.

[0083] 9. High temperature and high humidity power-on test

[0084] Place the product in a test environment with a temperature of 85°C and a humidity of 85%, power on the product, and then test its performance.

[0085] 10. 2-meter drop reliability test

[0086] Place the product at a height of 2 meters and drop it to the ground to cause a collision. Then observe whether the shell is intact and test its performance.

[0087] The housings of the AR devices in Example 1 and Example 2 were assembled into products and reliability verification was performed. The test results are shown in Table 2.

[0088] Table 2 Summary of reliability test results of the housing in the embodiments and comparative examples

[0089] Group High temperature and high humidity storage High temperature and high humidity power supply fall Example 1 OK OK OK Example 2 OK OK OK

[0090] The shell 100 of the electronic device in the present invention has a high outer surface emissivity, which can quickly dissipate the heat inside the shell and improve the performance stability of the electronic device. In addition, the thermal conductivity coefficient of the shell along its wall thickness direction is small. During the heat dissipation process, less heat is transferred to the skin, which has a good thermal insulation effect, thereby improving wearing comfort. At the same time, the high modulus can ensure that the mechanical properties of the shell meet the use requirements.

[0091] It can also be seen from the results in Table 2 that the housing in the embodiment of the present invention passed various reliability tests and was qualified.

[0092] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A housing of an electronic device, characterized in that: The shell is integrally injection-molded from a discontinuous fiber reinforced polyamide composite material, wherein the discontinuous fiber reinforced polyamide composite material is composited from discontinuous fibers and polyamide resin. The long axis direction of the non-continuous fibers is arranged parallel to the inner wall surface of the shell, and the non-continuous fibers are arranged in layers along the wall thickness direction of the shell. The thermal conductivity coefficient of the shell along its wall thickness direction is 0.05W / m·K~0.4W / m·K, the outer surface emissivity of the shell is 0.7~0.98, and the tensile modulus of the shell is 15GPa~35GPa.

2. The housing of the electronic device according to claim 1, wherein The outer surface emissivity of the shell is 0.85 to 0.98; and / or, The tensile modulus of the shell is 20 GPa to 30 GPa; and / or, The thermal conductivity of the shell along the wall thickness direction is 0.1W / m·K to 0.2W / m·K.

3. The housing of the electronic device according to claim 1, wherein: The tensile strength of the shell is 180 MPa to 450 MPa.

4. The housing of the electronic device according to claim 1, wherein The shell has a melt index of 10 g / 10 min to 30 g / 10 min at 300° C.

5. The housing of the electronic device according to claim 1, wherein: The thermal deformation temperature of the shell is 250°C to 350°C.

6. The housing of the electronic device according to claim 1, wherein: The density of the shell is 1.2 g / cm 3 ~3.0g / cm 3 .

7. The housing of the electronic device according to claim 1, wherein: The mass percentage of the discontinuous fibers in the shell is 20% to 55%.

8. The housing of the electronic device according to claim 1, wherein: The discontinuous fibers include at least one of synthetic fibers and inorganic fibers.

9. The housing of the electronic device according to claim 7, wherein: The type of the polyamide resin includes at least one of PA6, PA66, PA610, PA612, PA1010, PA11, PA12, PA1212, PA1012, PA1111, PA1213, PA1313, PPA, PA4T, PA6T, PA9T, PA10T, PA12T, and PA46.

10. An electronic device, characterized in that: A housing of an electronic device comprising the electronic device according to any one of claims 1 to 9.

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