Heat dissipation structure, electronic equipment, vehicle and heat dissipation control method

Abstract

The invention relates to a heat dissipation structure, electronic equipment, a vehicle and a heat dissipation control method.The heat dissipation structure comprises a radiator, an electric refrigerator and a one-way heat conduction piece, one side of the electric refrigerator is thermally coupled with the radiator, and the other side of the electric refrigerator is configured to be thermally coupled with a chip; one side of the one-way heat conduction piece is thermally coupled with the radiator, and the other side of the one-way heat conduction piece is thermally coupled with the chip, so that heat of the chip is conducted to the radiator in a one-way mode, by arranging the one-way heat conduction piece and the electric refrigerator, cooperative adjustment of various heat dissipation paths can be achieved, and therefore the heat dissipation efficiency can be improved; the problem of insufficient heat dissipation capability caused by heat concentration in the operation process of the host is relieved, so that the operation stability and reliability of a host system are improved; the one-way heat conduction piece is used for limiting heat from being transmitted back to the chip, the generation risk of condensate water during low-temperature operation of the electric refrigerator can be reduced, and the structure and electrical safety of the system can be guaranteed.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a heat dissipation structure, electronic equipment, vehicle, and heat dissipation control method. Background Art

[0002] With the continuous advancement of in-vehicle electronics, traditional automotive cockpits are gradually evolving towards intelligence. As a next-generation human-machine interaction platform, the smart cockpit has gradually integrated a variety of information processing and interaction functions. Typically equipped with multiple sensors, displays, and computing units, smart cockpits can collect real-time data on driver and passenger behavior, voice, posture, and other aspects. This data is uploaded to the cloud via the vehicle network or processed locally to enable dynamic resource allocation and information services, thereby enhancing the safety, convenience, and informationization of the cockpit system.

[0003] Smart cockpits already integrate features such as facial recognition, voice recognition, driver assistance, and gesture control. To meet the processing requirements of these functions, smart cockpits typically feature high-performance system-on-chips (SoCs). These chips boast high integration density and powerful computing capabilities, and are continuously evolving towards miniaturization, high computing power, and high bandwidth.

[0004] However, as the functions of smart cockpits continue to increase, the computing power demand of system-level chips has grown rapidly, and their power consumption levels and the heat generated per unit volume have also increased significantly. As a result, the cockpit domain host faces problems such as heat concentration and low heat dissipation efficiency during actual operation, which may have an adverse impact on the stability and reliability of the system. Summary of the Invention

[0005] The embodiments of the present application provide a heat dissipation structure, an electronic device, a vehicle, and a heat dissipation control method, which improve the heat dissipation efficiency of the heat dissipation structure to at least partially solve the above-mentioned technical problems.

[0006] In order to achieve the above-mentioned object, according to a first aspect of the present application, a heat dissipation structure is provided, comprising:

[0007] heat sink;

[0008] an electric cooler, one side of which is thermally coupled to the heat sink, and the other side of which is configured to be thermally coupled to the chip; and

[0009] A unidirectional heat conductor has one side thermally coupled to the heat sink and the other side configured to be thermally coupled to the chip so as to conduct heat of the chip to the heat sink in a unidirectional manner.

[0010] In some embodiments, the heat sink is made of metal;

[0011] And / or, the heat sink includes a body and heat dissipation fins arranged on the body, and the body is thermally coupled to the electric cooler and the one-way heat conductor respectively.

[0012] In some embodiments, the unidirectional heat conducting member includes at least one of a gravity heat pipe, a unidirectional heat conducting temperature vapor chamber, and a loop heat pipe.

[0013] In some embodiments, the electric cooler includes a hot surface and a cold surface, the hot surface is thermally coupled to the heat sink, and the cold surface is configured to be thermally coupled to the chip.

[0014] In some embodiments, a temperature equalizer is further included, and the unidirectional heat conducting element and the electric cooler are thermally coupled to the temperature equalizer respectively, so as to be thermally coupled to the chip through the temperature equalizer.

[0015] In some embodiments, the temperature equalizing member includes at least one of a temperature equalizing plate, a heat pipe, a copper plate, an aluminum alloy block, and a magnesium alloy block.

[0016] Some embodiments further include a fan connected to the radiator for cooling the radiator.

[0017] In some embodiments, the fan has multiple gears;

[0018] Alternatively, the fan has a stepless speed regulation structure.

[0019] In some embodiments, a first thermal interface material is provided between the heat sink and the electric cooler, and the electric cooler is thermally coupled to the heat sink via the first thermal interface material;

[0020] And / or, a second thermal interface material is provided between the heat sink and the one-way heat conductor, and the one-way heat conductor is thermally coupled to the heat sink via the second thermal interface material;

[0021] And / or, a third thermal interface material is provided between the electric refrigerator and the temperature equalizing member, and the electric refrigerator is thermally coupled to the electric refrigerator via the third thermal interface material;

[0022] And / or, a fourth thermal interface material is provided between the one-way heat conductor and the temperature uniform component, and the one-way heat conductor is thermally coupled to the temperature uniform component via the fourth thermal interface material;

[0023] And / or, the heat dissipation structure further includes a fifth thermal interface material, and the fifth thermal interface material is configured to be disposed between the temperature uniform component and the chip to thermally couple the temperature uniform component and the chip.

[0024] In some embodiments, the first thermal interface material, the second thermal interface material, the third thermal interface material, the fourth thermal interface material, and the fifth thermal interface material respectively include at least one of thermal conductive gel, thermal conductive grease, thermal conductive pad, phase change thermal conductive pad, and liquid metal.

[0025] According to a second aspect of the present application, an electronic device is provided, comprising a chip and the heat dissipation structure described in the above technical solution, wherein the one-way heat conductor and the electric cooler are both thermally coupled to the chip.

[0026] In some embodiments, the electronic device includes a vehicle computer.

[0027] According to a third aspect of the present application, a vehicle is provided, comprising the heat dissipation structure described in the above technical solution, or comprising the electronic device described in the above technical solution.

[0028] According to a fourth aspect of the present application, a heat dissipation control method is further provided, which is applied to the electronic device described in the above technical solution, and the method includes:

[0029] Determining a target temperature control logic according to the operating condition of the electronic device, the target temperature control logic including a correspondence between different temperature control strategies and different temperature control equations, the temperature control equations including multiple device operation influencing factors;

[0030] Obtaining parameter values ​​of the equipment operation influencing factors;

[0031] Determining a target temperature control strategy based on the parameter values ​​of the equipment operation influencing factors and the target temperature control logic;

[0032] The operation of the heat dissipation structure is controlled according to the target temperature control strategy.

[0033] In some embodiments, the operating condition of the electronic device includes a power-on condition and a stable operating condition, each of the power-on condition and the stable operating condition corresponds to a temperature control logic, and determining the target temperature control logic according to the operating condition of the electronic device includes:

[0034] In response to the operating condition of the electronic device being the power-on operating condition, determining the temperature control logic corresponding to the power-on operating condition as the target temperature control logic; or

[0035] In response to the operating condition of the electronic device being the stable operating condition, a temperature control logic corresponding to the stable operating condition is determined as the target temperature control logic.

[0036] In some embodiments, the heat dissipation structure includes a fan, and the fan is thermally coupled to the heat sink. In the temperature control logic corresponding to the startup condition, the correspondence between different temperature control strategies and different temperature control relationship equations includes:

[0037] If Tb ≥ T - P0 * Rja, then turn on the fan and the electric refrigerator;

[0038] If T - P0 * Rja0 ≤ Tb < T - P0 * Rja, then turn on the fan and turn off the electric refrigerator;

[0039] If Tb < T - P0 * Rja0, then turn off the fan and the electric refrigerator;

[0040] Where, T is the target control temperature, T = Tj / α, α is the safety factor; Tj is the maximum allowable operating temperature of the chip; Tb is the temperature of the circuit board where the chip is located; P0 is the power consumption of the chip at startup; Rja is the thermal resistance from the junction to the environment when the fan is at the maximum gear; Rja0 is the thermal resistance from the junction to the environment when the fan is not running.

[0041] In some embodiments, the heat dissipation structure includes a fan, the fan is thermally coupled to the radiator, the fan has multiple gears, or the fan is a stepless speed regulation structure. In the temperature control logic corresponding to the stable operating condition, the correspondence between different temperature control strategies and different temperature control relational expressions includes:

[0042] If Ta + P * Rja < T and P < P1, then turn off the fan and the electric refrigerator;

[0043] If Ta + P * Rja < T and P ≥ P1, then turn on the fan and turn off the electric refrigerator;

[0044] If Ta + P * Rja < T and k < α, then turn on the fan and turn on the electric refrigerator;

[0045] If Ta + P * Rja ≥ T, then turn on the fan and the electric refrigerator;

[0046] Where, Ta is the temperature of the environment where the heat dissipation structure is located; P is the power consumption of the chip, P = V * i, V is the operating voltage of the chip, i is the average operating current of the chip; Rja is the thermal resistance from the junction to the environment when the fan is at the maximum gear; T is the target control temperature, T = Tj / α, α is the safety factor, Tj is the maximum allowable operating temperature of the chip; k is the safety factor, k = Tj / Tsoc, Tsoc is the real-time temperature of the chip.

[0047] In some embodiments, the fan has a first gear, a second gear, a third gear and a fourth gear with increasing wind speed. In the temperature control logic corresponding to the stable operating condition, the correspondence between different temperature control strategies and different temperature control relational expressions further includes:

[0048] If Ta+P*Rja<T, and P2≥P≥P1, then turn on the fan to the first gear and turn off the electric cooler;

[0049] If Ta+P*Rja<T, and P3>P≥P2, then turn on the fan to the second gear and turn off the electric cooler;

[0050] If Ta+P*Rja<T, and P4>P≥P3, then turn on the fan to the third gear and turn off the electric cooler;

[0051] If Ta+P*Rja<T, and P5>P≥P4, then turn on the fan to the fourth gear and turn off the electric cooler;

[0052] Among them, P5>P4>P3>P2>P1.

[0053] In some embodiments, the method further includes: in response to the electric refrigerator being in an on state, running anti-condensation control logic.

[0054] In some embodiments, the anti-condensation control logic includes a correspondence between different anti-condensation control strategies and different anti-condensation relationship equations, wherein the anti-condensation relationship equations include multiple condensation triggering factors. Executing the anti-condensation control logic includes:

[0055] Obtaining a parameter value of the condensation trigger factor;

[0056] Determining a target anti-condensation control strategy according to the parameter value of the condensation trigger factor and the anti-condensation control logic;

[0057] The operation of the electric refrigerator and the fan is controlled according to the target anti-condensation control strategy.

[0058] In some embodiments, in the anti-condensation control logic, the correspondence between different anti-condensation control strategies and different anti-condensation relationship equations includes:

[0059] If Tg<Ttec≤(1+f)*Tg, and k≥α, the operating power of the electric refrigerator remains unchanged, and the operating speed of the fan is reduced;

[0060] If Tg<Ttec≤(1+f)*Tg, and k<α, the operating power of the electric refrigerator remains unchanged, and the operating speed of the fan is increased;

[0061] If Ttec>(1+f)*Tg, and k≥α, the operating power of the electric refrigerator remains unchanged, and the operating speed of the fan is reduced;

[0062] If Ttec>(1+f)*Tg, and k<α, then increase the operating power of the electric refrigerator and increase the operating speed of the fan;

[0063] Among them, Ttec is the temperature of the cold surface of the electric refrigerator; f is the condensation safety factor, 0.1≤f≤0.3; Tg is the dew point temperature under the current environment; k is the safety factor, k=Tj / Tsoc, Tj is the maximum allowable operating temperature of the chip, and Tsoc is the real-time temperature of the chip.

[0064] The heat dissipation structure of the embodiment of the present application can achieve coordinated adjustment of multiple heat dissipation paths by setting a unidirectional heat conductor and an electric cooler, thereby helping to achieve faster heat dissipation efficiency, which is beneficial to solving the problem of insufficient heat dissipation capacity caused by heat concentration during the operation of the host, and thus can improve the operating stability and reliability of the host system.

[0065] At the same time, with the help of the directional heat flow conduction characteristics of the one-way heat conductor, the heat generated by the electric cooler during operation is difficult to be transferred back to the chip side through this path, which helps to limit the temperature rise of the chip and enables the electric cooler to operate under lower power conditions, thereby reducing the risk of low-temperature condensation in the electric cooler and having anti-condensation capabilities.

[0066] Specifically, the unidirectional heat conductor helps to transfer the heat generated by the chip to the radiator in one direction; at the same time, the electric cooler can actively cool the chip. While achieving cooling, the heat generated can be further released by conduction to the radiator, and the heat conducted to the radiator will not be transferred back to the chip through the unidirectional heat conductor, so that the electric cooler can work at a lower power to meet the cooling needs of the chip, thereby reducing the workload of the electric cooler.

[0067] When the electric cooler is running at reduced power, its temperature does not drop excessively, which helps prevent the cooler temperature from falling below the dew point of the current environment and reduces the risk of condensation. This can reduce structural leakage or electrical safety hazards caused by condensation, thereby improving overall system reliability.

[0068] Other features and advantages of the present application will be described in detail in the subsequent detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0069] To more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present application. Those skilled in the art can also derive other drawings based on these drawings without inventive effort.

[0070] In order to more completely understand the present application and its beneficial effects, the following description will be given in conjunction with the accompanying drawings, wherein the same drawing numbers represent the same parts in the following description.

[0071] Figure 1 is a schematic structural diagram of a heat dissipation structure provided in an exemplary embodiment of the present disclosure;

[0072] Figure 2 is a flow chart of a heat dissipation control method provided in an exemplary embodiment of the present disclosure.

[0073] Description of reference numerals:

[0074] 10. Heat dissipation structure; 20. Chip; 30. Circuit board; 100. Radiator; 110. Main body; 120. Heat dissipation fins; 200. Electric refrigerator; 210. Hot surface; 220. Cold surface; 300. One-way heat conductor; 400. Temperature equalizer; 500. Fan. DETAILED DESCRIPTION

[0075] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0076] According to the first aspect of this application, referring to Figure 1 The present disclosure provides a heat dissipation structure 10 suitable for cooling a heat-generating component that generates heat during operation. For example, the heat-generating component may be a chip 20. When used, the heat dissipation structure 10 forms a thermal coupling relationship with the chip 20, facilitating the timely transfer of heat generated by the chip 20 during operation to an external heat dissipation unit, thereby helping to lower the operating temperature of the chip 20 and mitigate heat accumulation in the chip 20 region.

[0077] It is understood that the heat dissipation structure 10 can be directly thermally connected to the heat-generating component, for example, by connecting to the surface of the chip 20 through a thermal interface material or metal contact surface. Alternatively, it can be indirectly connected to the heat-generating component through other structural components (such as a supporting substrate, a heat transfer sheet, etc.), thereby establishing an effective heat conduction path. This structural arrangement is conducive to providing a flexible heat dissipation channel design for the chip 20 without restricting the assembly space.

[0078] The heat dissipation structure 10 includes a radiator 100, an electric cooler 200, and a one-way heat conductor 300. The radiator 100 is used to exchange heat with the air to facilitate heat transfer from the heat-generating component to the environment, thereby helping to maintain the temperature of the heat-generating component in a relatively stable operating range.

[0079] For example, the heat sink 100 can be made of a metal material with high thermal conductivity, such as copper, aluminum, or alloys thereof. These materials have excellent thermal conductivity, facilitating rapid absorption and diffusion of heat from heat-generating components. To further increase the contact area between the heat sink 100 and the air, thereby increasing the rate of heat transfer per unit time, a plurality of heat dissipation fins 120 can be provided on the surface of the heat sink 100.

[0080] The so-called "heat dissipation fins 120" refer to sheet-like or columnar structures of a certain length and thickness that extend from the surface of the heat sink body 110. The structural form can be straight, corrugated, needle-shaped, or other configurations suitable for enhancing the convective heat transfer effect of air. The purpose of providing heat dissipation fins 120 is to expand the heat dissipation surface area without significantly increasing the volume, thereby enhancing the convective heat transfer efficiency between the heat sink 100 and the surrounding air to a certain extent. In addition, multiple airflow channels can be formed between the heat dissipation fins 120 to facilitate air flow, making it easier for heat to diffuse into the environment, which is beneficial to improving the overall heat dissipation performance.

[0081] It should be noted that the heat sink 100 can be constructed in an integral or split-assembly configuration. If it is a split-assembly configuration, the heat sink 120 can be secured to the heat sink 100 body by welding, screwing, or bonding with a thermally conductive adhesive to achieve a good heat conduction path. In specific implementations, the appropriate structural combination and material ratio can be selected based on the heat dissipation requirements and space constraints of the application scenario.

[0082] In some embodiments, reference Figure 1 One side of the electric cooler 200 is thermally coupled to the heat sink 100, and the other side is configured to be thermally coupled to the chip 20. The electric cooler 200 is used to actively cool the chip 20 when powered on, which helps to lower the operating temperature of the chip 20 and alleviate the heat accumulation caused by continuous operation of the chip 20.

[0083] For example, the electric cooler 200 can utilize a semiconductor refrigeration chip. This semiconductor refrigeration chip operates based on the Peltier effect. When current passes through the junction between semiconductor materials of different conductivity types (e.g., N-type and P-type) within the refrigeration chip, a temperature difference is generated on both sides, resulting in one side absorbing heat and the other side releasing heat. Specifically, the heat-absorbing side is thermally coupled to the chip 20 to absorb heat from the chip 20; the heat-releasing side is thermally coupled to the heat sink 100 to conduct the heat to the heat sink 100, and then release the heat to the environment through the heat sink 100.

[0084] To enhance heat transfer efficiency, thermal interface materials, such as thermal grease, thermal pads, or high-thermal-conductivity ceramic layers, can be applied to both sides of the semiconductor cooling chip to fill the tiny gaps at the contact interface, thereby improving overall thermal coupling. Through this structural configuration, heat generated by chip 20 is rapidly absorbed by electric cooler 200 and conducted to heat sink 100 for release to the outside world, achieving multi-path heat dissipation.

[0085] It should be noted that the specific size, cooling capacity, and power supply method of the electric cooler 200 can be flexibly configured based on the heat dissipation requirements of the application scenario. For chips 20 with high heat loads, multiple electric coolers 200 can be arranged in parallel to enhance the overall heat absorption capacity. For space-constrained scenarios, ultra-thin semiconductor cooling sheets can be used to achieve a balance between compactness and heat dissipation performance.

[0086] In some embodiments, reference Figure 1 One side of the unidirectional heat conductor 300 is thermally coupled to the heat sink 100, and the other side is configured to be thermally coupled to the chip 20, so as to conduct the heat of the chip 20 to the heat sink 100 in a unidirectional manner. The unidirectional heat conductor 300 allows the heat generated by the chip 20 to be conducted to the heat sink 100 in a predetermined direction, and helps prevent the heat from being transferred back to the chip 20 from the heat sink 100, thereby improving the overall heat dissipation efficiency.

[0087] For example, the unidirectional heat conductor 300 can be a structure or material combination with thermal rectification properties. The so-called "unidirectional heat conductor" refers to the fact that there is a significant difference in the ability of the heat conductor to conduct heat in two relative directions, that is, it has a higher thermal conductivity in the forward direction (for example, from the chip 20 to the heat sink 100), while it exhibits a significantly reduced thermal conductivity in the reverse direction (for example, from the heat sink 100 to the chip 20), thereby forming a "one-way heat flow channel" effect to a certain extent. This structure helps to conduct heat along the desired path and reduces the impact of reverse thermal interference on the thermal control system.

[0088] Specifically, the unidirectional heat conductor 300 can be implemented using a heterogeneous material stack structure, for example, by periodically stacking materials with significantly different thermal conductivity to form a heat rectifier channel. Alternatively, it can be achieved by introducing a microstructured material with thermally asymmetric properties (such as a thermal diode structure) into the heat flow path. Another implementation method is to use a thermal switch mechanism, for example, a thermal control component allows heat flow within a specific temperature range, while inhibiting it under other temperature conditions, thereby forming a heat conduction capacity in a certain direction.

[0089] It should be noted that the provision of the one-way heat conductor 300 is crucial for assisting the normal operation of the electric refrigerator 200. Since the heat-dissipating side of the electric refrigerator 200 generates a certain amount of heat during operation, and this heat-dissipating side is thermally coupled to the heat sink 100, if the one-way heat conductor 300 is not provided, this heat may be transferred back to the chip 20 via the heat sink 100, causing the temperature around the chip 20 to rise, thus hindering effective cooling of the chip 20. By providing the one-way heat conductor 300, the reverse conduction path of heat from the heat sink 100 to the chip 20 can be blocked to a certain extent, thereby helping to achieve a more stable and efficient thermal control effect.

[0090] In some embodiments, the heat sink 100 is made of metal. For example, the metal may be copper, aluminum, or their alloys, which have excellent thermal conductivity. Aluminum is preferred in some applications due to its light weight, low cost, and good processability. Copper, on the other hand, has higher thermal conductivity and can be used in applications requiring more efficient heat dissipation. The appropriate metal material can be selected based on the system's comprehensive requirements for heat dissipation performance, cost control, and structural strength.

[0091] In some embodiments, reference Figure 1 The radiator 100 includes a main body 110 and heat dissipation fins 120 arranged on the main body 110. The main body 110 is thermally coupled with the electric refrigerator 200 and the one-way heat conductor 300 respectively. The main body 110 is used as a core structure for heat convergence and conduction. The material of the main body 110 can be a metal material with good thermal conductivity, such as copper, aluminum or their alloys. In order to facilitate the collection and release of multi-source heat during operation of the radiator 100, the main body 110 is configured to be thermally coupled with the electric refrigerator 200 and the one-way heat conductor 300 at the same time, that is, a part of the surface of the main body 110 is in contact with the heating side of the electric refrigerator 200, and the other part of the surface is in contact with the heat dissipation end of the one-way heat conductor 300, so as to establish a stable heat conduction path.

[0092] Among them, thermal coupling in this field generally refers to a thermal connection relationship with low thermal resistance between two components, which can be achieved through thermal interface materials (such as thermal adhesives, thermal gaskets) or mechanical fastening, thereby reducing energy loss during heat transfer to a certain extent.

[0093] The heat dissipation fins 120 provided on the body 110 are used to expand the heat exchange area between the radiator 100 and the ambient air. For example, the heat dissipation fins 120 can be a plurality of sheet-shaped, needle-shaped, or corrugated metal structures, spaced apart and arranged perpendicular to the surface of the body 110. The specific arrangement can be optimized based on factors such as the spatial layout and airflow direction. This structural arrangement can increase the heat release rate of the radiator 100 to the ambient air per unit time, thereby improving overall heat dissipation efficiency.

[0094] Since the main body 110 of the radiator 100 is thermally coupled with the heating end of the electric refrigerator 200 and the output end of the one-way heat conductor 300 at the same time, it can concentrate on receiving heat from two heat source directions during operation, and release the heat into the surrounding air through the main body 110 and the fin structure thereon, which helps to maintain the temperature stability of the working environment of the chip 20.

[0095] In addition, in order to improve the convective heat transfer efficiency between the radiator 100 and the air, forced ventilation components such as a fan 500 can be provided in the specific design to make the air flow between the fins, accelerate the heat exchange process, and further optimize the thermal management performance of the overall system.

[0096] In some embodiments, the unidirectional heat conductor 300 includes at least one of a gravity heat pipe, a unidirectional heat vapor chamber, and a loop heat pipe. Each of these components has the ability to transfer heat in a specific direction, which can, to a certain extent, limit heat conduction in the opposite direction, thereby preventing heat from being transferred back to the chip 20 due to the increased temperature of the heating surface of the heat sink 100 or the electric cooler 200.

[0097] For example, a gravity heat pipe is an element that uses the phase change of a working fluid and the action of gravity to conduct heat. It generally has a capillary structure inside and is filled with an appropriate amount of working fluid. When one end is heated, the working fluid vaporizes at that end, and the vapor flows along the internal space of the heat pipe to the cold end and condenses. After releasing heat, it becomes liquid again and then flows back to the heated end under the action of gravity, forming a closed loop. Therefore, the heat conduction direction of the gravity heat pipe is affected by its spatial arrangement. Generally, the heat transfer efficiency is higher in the direction of gravity, thus having certain unidirectional heat conduction characteristics, which is suitable for conducting the heat of the chip 20 to the radiator 100.

[0098] A unidirectional heat spreader is a heat-conducting structure with high in-plane heat diffusion capabilities but limited heat transfer in a vertical or specific direction. It typically consists of a closed cavity, a working fluid, and a capillary structure. Its operating principle is similar to that of a heat pipe, but its form is thinner and flatter, making it easier to deploy within a limited space. Through the rational design of its internal structure and flow channels, the heat spreader can achieve a unidirectional flow of heat from chip 20 to heat sink 100, somewhat suppressing reverse heat flow.

[0099] A loop heat pipe is a closed-type heat transfer device that uses capillary force to drive the circulation of a working fluid. Its structure includes an evaporation section, a condensation section, a liquid return pipe, and a gas channel, enabling efficient heat transfer while allowing for flexible spatial layout. Because the working fluid has a clear flow path in a specific direction, it can facilitate unidirectional heat transfer from chip 20 to heat sink 100, improving heat dissipation efficiency while also helping to prevent heat accumulation in the working area of ​​chip 20.

[0100] It should be understood that the above-mentioned one-way heat conductor 300 can be used alone or in combination according to the heat load requirements, device layout and space conditions. For example, a gravity heat pipe and a heat spreader are combined to form a composite one-way heat conduction module to adapt to the heat dissipation requirements in different working environments and enhance the system's thermal management capabilities and stability.

[0101] In some embodiments, reference Figure 1 The electric cooler 200 includes a hot surface 210 and a cold surface 220. The hot surface 210 is thermally coupled to the heat sink 100, and the cold surface 220 is configured to be thermally coupled to the chip 20. When the electric cooler 200 is powered on and operating, the temperature of the cold surface 220 decreases, absorbing heat generated by the chip 20 during operation, while the temperature of the hot surface 210 increases, releasing heat to the heat sink 100. Specifically, the cold surface 220 of the electric cooler 200 is configured to be thermally coupled to the chip 20, thereby directly cooling the chip 20, while the hot surface 210 is thermally coupled to the heat sink 100, allowing the heat absorbed by the hot surface 210 to be promptly transferred to the heat sink 100 and further dissipated into the air.

[0102] Exemplarily, the electric cooler 200 may be a semiconductor cooler based on the Peltier effect, which is usually composed of a plurality of thermoelectric pairs. When powered on, a temperature difference is generated at both ends, thereby achieving a directional heat extraction effect.

[0103] It is understood that to improve the thermal coupling efficiency with the chip 20 and the heat sink 100, a thermal interface material with high thermal conductivity can be configured between the hot surface 210 and the cold surface 220 to reduce thermal resistance and further enhance the heat transfer capability of the system.

[0104] The unidirectional heat conductor 300 is disposed between the chip 20 and the heat sink 100, helping to conduct heat generated by the chip 20 during operation toward the heat sink 100 in a predetermined direction, thereby limiting heat transfer back toward the chip 20. This structural design reduces heat accumulation in the chip 20 area and helps improve temperature control capabilities in the chip 20 area.

[0105] At the same time, the electric cooler 200 acts as an active heat dissipation unit, providing directional cooling for the chip 20. When the electric cooler 200 is operating, its cold surface 220 is in close proximity to the chip 20 to absorb heat, while its hot surface 210 is thermally coupled to the heat sink 100 to further release the heat. The directional nature of the one-way heat conductor 300 prevents heat from being transferred from the hot surface 210 of the electric cooler 200 to the heat sink 100 and then back to the chip 20, preventing secondary heat loads in the chip 20 area.

[0106] Since heat is not easily transferred back to the chip 20 , it helps to reduce the operating power required by the electric cooler 200 to maintain the target temperature, so that the electric cooler 200 can achieve the cooling purpose at relatively low power, thereby reducing its workload and further improving the overall heat dissipation efficiency.

[0107] In addition, when the electric refrigerator 200 is operated in a reduced power state, the temperature of its cold surface 220 will not be significantly lower than the ambient dew point temperature, thereby helping to reduce the possibility of condensation water forming. By suppressing the occurrence of condensation, the safety hazards such as structural leakage or electrical short circuit that may be caused by condensation water can be reduced, which has a positive significance for improving the stability and reliability of system operation. In some embodiments, referring to Figure 1 , further comprising a temperature-balancing member 400, the one-way heat conductor 300 and the electric cooler 200 are thermally coupled to the temperature-balancing member 400, thereby thermally coupling with the chip 20 through the temperature-balancing member 400. Specifically, the one-way heat conductor 300 and the electric cooler 200 are thermally coupled to the temperature-balancing member 400, respectively, so that these two different heat dissipation paths can be integrated with the temperature-balancing member 400 as a heat sink or heat source, thereby forming an effective thermal coupling relationship with the chip 20.

[0108] Through this arrangement, the heat generated by the chip 20 during operation can be simultaneously conducted to the heat sink 100 via the unidirectional heat conductor 300 via the temperature equalizer 400, or absorbed by the cold surface 220 of the electric cooler 200 to achieve active cooling, which helps to improve the flexibility of heat conduction under different operating conditions. The temperature equalizer 400 itself has a certain thermal conductivity, which can reduce the temperature gradient between different areas on the surface of the chip 20 to a certain extent, facilitating the uniform distribution of heat in the chip 20 and mitigating the occurrence of local hot spots.

[0109] For example, the temperature-regulating element 400 can be a temperature-regulating plate, a heat spreader, or a thermally conductive filler. It can be made of metal materials such as copper and aluminum with good thermal diffusion properties, or composite materials with high thermal conductivity. Based on actual design requirements, the structural dimensions and thermal capacity of the temperature-regulating element 400 can be optimized to achieve good dynamic thermal response and adapt to the chip 20 packaging form.

[0110] In some embodiments, the temperature-regulating element 400 includes at least one of a temperature-regulating plate, a heat pipe, a copper plate, an aluminum alloy block, and a magnesium alloy block. Such a structure has excellent thermal conductivity and can accelerate the diffusion rate of heat generated by the chip 20 within the temperature-regulating element 400 to a certain extent, thereby facilitating uniform heat transfer from the chip 20.

[0111] Specifically, the vapor chamber and heat pipes possess strong lateral thermal conductivity, making them suitable for distributing heat between the chip 20's heat source area and multiple heat dissipation paths, thereby improving the overall thermal diffusion efficiency of the cooling system. Copper plates, due to their high thermal conductivity and excellent mechanical strength, are often used in applications requiring rapid heat transfer. Aluminum and magnesium alloy blocks offer advantages such as light weight and ease of processing while maintaining a certain level of thermal conductivity, making them suitable for product designs with certain limitations on volume and weight.

[0112] In some embodiments, reference Figure 1 The heat dissipation structure 10 further includes a fan 500 connected to the heat sink 100 for cooling the heat sink 100. The fan 500's primary function is to generate airflow to facilitate heat exchange between the surface of the heat sink 100 and the surrounding air. Specifically, the fan 500's rotation drives air flow, allowing the hot air on the surface of the heat sink 100 to be replaced more quickly with cooler ambient air, thereby improving the heat dissipation efficiency of the heat sink 100.

[0113] For example, the fan 500 can be an axial fan 500 or a centrifugal fan 500, and the specific type can be selected based on actual heat dissipation requirements and space constraints. The fan 500 can be connected to the heat sink 100 using various methods, such as mechanical fixing, snap-on connection, or threaded connection, to accommodate different structural design requirements. Proper configuration of the fan 500 helps reduce surface temperature accumulation on the heat sink 100 and helps maintain the thermal stability of the heat sink 100 and the overall heat dissipation structure 10.

[0114] Furthermore, "the fan 500 is connected to the heat sink 100" is not limited to direct physical contact; it can also be understood as an indirect connection via a bracket or heat conductor to achieve effective airflow cooling of the heat sink 100. This structural arrangement can, to a certain extent, promote heat transfer to the ambient air, thereby helping to reduce the operating temperature of heat-generating components and improve the thermal management of the entire system.

[0115] In some embodiments, the fan 500 has multiple gears. The fan 500 speed can be adjusted to accommodate different cooling requirements. Specifically, the multiple gears enable the fan 500 to operate within different speed ranges, such as low, medium, and high, thereby flexibly adjusting the air volume and speed based on the temperature changes of the chip 20 and the heat dissipation structure 10.

[0116] This design helps reduce the speed of fan 500 when the chip 20 is under low thermal load, thereby reducing noise and energy consumption. When the chip 20 is under high thermal load, the speed of fan 500 can be increased, accelerating air flow and enhancing heat dissipation. Through multi-speed control, fan 500 can achieve a certain balance between heat dissipation efficiency and system energy consumption, thereby improving the overall adaptability and reliability of heat dissipation structure 10.

[0117] In addition, the adjustment method of the multi-stage fan 500 can be manual switching, automatic temperature control adjustment or intelligent adjustment based on external control signals. The specific method can be selected and optimized according to the application scenario and system requirements.

[0118] In some embodiments, fan 500 has a stepless speed regulation structure. By continuously adjusting the speed of fan 500, flexible cooling of heat sink 100 is achieved. Stepless speed regulation can smoothly adjust the speed of fan 500 based on the real-time temperature changes of chip 20 and heat dissipation structure 10, thereby achieving more precise heat dissipation control under different operating conditions.

[0119] This structure is beneficial for reducing the speed of fan 500 to a lower level when the chip 20 load is low, thereby reducing energy consumption and noise. When the chip 20 load is high, the fan 500 speed can be increased to increase air flow, thereby enhancing the cooling effect. Through stepless speed regulation, fan 500 can balance cooling efficiency and system energy consumption to a certain extent, improving the overall adaptability and stability of the heat dissipation structure 10.

[0120] In addition, stepless speed regulation is usually achieved with the help of an electronic speed regulator or PWM (pulse width modulation) technology. The specific adjustment method can be configured according to actual application requirements to meet the heat dissipation requirements in different scenarios.

[0121] In some embodiments, a first thermal interface material is provided between the heat sink 100 and the electric refrigerator 200, and the electric refrigerator 200 is thermally coupled to the heat sink 100 through the first thermal interface material. The first thermal interface material is used to fill the microscopic gaps between the contact surfaces of the heat sink 100 and the electric refrigerator 200, thereby helping to improve the heat conduction efficiency between the two. Through the first thermal interface material, the electric refrigerator 200 can form a relatively stable thermal coupling relationship with the heat sink 100, which is beneficial for the effective transfer of heat generated by the electric refrigerator 200 to the heat sink 100, thereby promoting the heat exchange between the heat sink 100 and the outside air and improving the overall heat dissipation effect. The first thermal interface material may include materials such as thermal grease, thermal adhesive, and thermal gaskets, and its specific selection can be optimized according to the actual needs and manufacturing process of the heat dissipation structure 10.

[0122] In some embodiments, a second thermal interface material is provided between the heat sink 100 and the one-way heat conductor 300, and the one-way heat conductor 300 is thermally coupled to the heat sink 100 via the second thermal interface material. The second thermal interface material is used to fill the tiny gap between the contact surfaces of the heat sink 100 and the one-way heat conductor 300, thereby helping to reduce the interfacial thermal resistance and promote the conduction of heat from the one-way heat conductor 300 to the heat sink 100. Through the second thermal interface material, the one-way heat conductor 300 can form an effective thermal coupling relationship with the heat sink 100, which helps to improve the heat transfer efficiency and thereby enhance the heat dissipation performance of the heat sink 100. Exemplarily, the second thermal interface material can be thermal grease, thermal adhesive, or thermal gasket, etc., and its specific material type and thickness can be selected and adjusted according to specific structural requirements and process conditions.

[0123] In some embodiments, a third thermal interface material is provided between the electric refrigerator 200 and the temperature equalizer 400, and the electric refrigerator 200 is thermally coupled to the electric refrigerator 200 through the third thermal interface material. The third thermal interface material is used to fill the small gap between the contact surface of the electric refrigerator 200 and the temperature equalizer 400 to reduce the interface thermal resistance and promote effective heat conduction. Through the third thermal interface material, the electric refrigerator 200 can form a good thermal coupling relationship with the temperature equalizer 400, which is beneficial to enhance the cooling effect and achieve rapid heat transfer. Exemplarily, the third thermal interface material can be thermal grease, thermal adhesive, thermal gasket, etc., and its specific type and thickness can be selected and adjusted according to actual application requirements.

[0124] In some embodiments, a fourth thermal interface material is provided between the one-way heat conductor 300 and the temperature equalizer 400, and the one-way heat conductor 300 is thermally coupled to the temperature equalizer 400 through the fourth thermal interface material. The fourth thermal interface material is used to fill the tiny unevenness between the contact surface of the one-way heat conductor 300 and the temperature equalizer 400, thereby helping to reduce the interface thermal resistance and promote efficient heat conduction. Through the fourth thermal interface material, the one-way heat conductor 300 can form a good thermal coupling relationship with the temperature equalizer 400, which is beneficial to the effective dispersion and uniform distribution of the heat conducted by the one-way heat conductor 300, and further improve the thermal management performance of the overall heat dissipation structure 10. Exemplarily, the fourth thermal interface material can be thermal grease, thermal adhesive, thermal gasket, etc., and the selection of specific materials can be adjusted according to the application environment and process requirements.

[0125] In some embodiments, the heat dissipation structure 10 further includes a fifth thermal interface material, which is configured to be disposed between the temperature equalizer 400 and the chip 20 so as to thermally couple the temperature equalizer 400 with the chip 20. The fifth thermal interface material is disposed between the temperature equalizer 400 and the chip 20 to fill the minute unevenness between the contact surfaces of the temperature equalizer 400 and the chip 20, thereby helping to reduce the thermal resistance of the contact interface and promote the heat conduction efficiency between the temperature equalizer 400 and the chip 20. Through the fifth thermal interface material, the thermal coupling effect between the temperature equalizer 400 and the chip 20 can be enhanced, which is beneficial for more effectively transferring the heat generated by the chip 20 to the temperature equalizer 400, thereby assisting the overall heat dissipation structure 10 to achieve a more uniform and efficient heat dissipation effect. By way of example, the fifth thermal interface material can be made of materials such as thermal grease, thermal adhesive, and thermal gaskets, and the specific selection can be appropriately adjusted according to actual working conditions and heat dissipation requirements.

[0126] In some embodiments, the first, second, third, fourth, and fifth thermal interface materials each comprise at least one of thermally conductive gel, thermal grease, a thermal pad, a phase change thermal pad, and liquid metal. Such thermal interface materials can fill tiny gaps at the interfaces of the heat dissipation structure 10, thereby reducing interfacial thermal resistance and promoting efficient heat conduction. The specific thermal interface material selected can be appropriately selected based on the thermal management requirements, structural compatibility, and environmental conditions of the actual application.

[0127] According to a second aspect of the present disclosure, an electronic device is provided, comprising a chip 20 and the heat dissipation structure 10 of the above embodiment, wherein a unidirectional heat conductor 300 and an electric cooler 200 are both thermally coupled to the chip 20. The electronic device has all the beneficial effects of the heat dissipation structure 10 described above, which will not be further elaborated herein.

[0128] In some embodiments, the electronic device includes a vehicle computer. Vehicle computers often have high requirements for heat dissipation performance. The provision of the heat dissipation structure 10 can be beneficial to the temperature control of the heat-generating components inside the vehicle computer, thereby improving the stability and operational reliability of the vehicle computer system.

[0129] According to a third aspect of the present disclosure, a vehicle is provided, comprising the heat dissipation structure 10 of the above embodiment, or comprising the electronic device of the above embodiment. The vehicle has all the advantages of the heat dissipation structure 10 or the electronic device, which will not be described in detail in this disclosure.

[0130] The vehicle may be a fuel vehicle, a plug-in hybrid vehicle, a new energy vehicle, etc., and this disclosure does not make any specific limitations on this.

[0131] According to the fourth aspect of the present disclosure, referring to Figure 1 、 Figure 2, provides a heat dissipation control method, which is applied to the electronic device in the above embodiment. The heat dissipation control method has all the beneficial effects of the above electronic device, and this disclosure will not be repeated here.

[0132] The method includes steps S100 to S400, which are described in detail below.

[0133] S100 , determining a target temperature control logic according to the working condition of the electronic device, where the target temperature control logic includes a correspondence between different temperature control strategies and different temperature control equations, where the temperature control equations include multiple equipment operation influencing factors.

[0134] S200: Obtain parameter values ​​of factors affecting equipment operation.

[0135] S300: Determine a target temperature control strategy based on parameter values ​​of equipment operation influencing factors and target temperature control logic.

[0136] S400: Control the operation of the heat dissipation structure 10 according to the target temperature control strategy.

[0137] In the above-mentioned embodiment, the target temperature control logic can be a set of mapping relationships, defining the corresponding relationships between multiple temperature control strategies and corresponding temperature control equations. The temperature control strategies may include, but are not limited to, fan 500 speed control and electric cooler 200 startup threshold setting. The temperature control equations are used to reflect the linkage between various device operation influencing factors (such as chip 20 temperature, ambient temperature, ambient humidity, etc.) and temperature control strategies.

[0138] Among them, the "working conditions of electronic equipment" may include different system operating states, such as the working conditions of the equipment may include the equipment being not started, stable operation, just started, idle, navigation, audio and video playback, high-performance computing or peripheral interaction; the "temperature control relationship" in the "temperature control logic" may be in function form, table lookup form or rule set form.

[0139] In S200, the parameters of the factors affecting the operation of the equipment are obtained, which can be dynamically collected by the internal sensors of the system (such as temperature sensors, voltage sensors, current sensors, load monitoring modules, etc.), and can be pre-processed by the control module, such as filtering, normalization or state recognition, to improve the accuracy of judgment.

[0140] For example, under high load conditions, the target temperature control strategy may be to increase the speed of the fan 500 and start the electric cooler 200 at the same time to quickly reduce the temperature of the core chip 20; under low load conditions, the strategy of reducing the speed of the fan 500 and turning off the electric cooler 200 may be adopted to reduce energy consumption and noise levels.

[0141] Through the above method, it is possible to achieve refined control of the heat dissipation structure 10, and to a certain extent adapt to complex and changeable application scenarios. It is particularly suitable for application equipment with high temperature control requirements, such as smart vehicle terminals, high-computing power edge computing equipment, etc.

[0142] In some embodiments, the operating conditions of the electronic device include a startup condition and a stable operating condition. The startup condition and the stable operating condition each correspond to a temperature control logic. Determining the target temperature control logic according to the operating condition of the electronic device includes the following steps:

[0143] S110 : In response to the electronic device being in a power-on state, determining a temperature control logic corresponding to the power-on state as a target temperature control logic.

[0144] The temperature control logic referred to herein can be a set of preset control rules designed to address the rapid temperature rise and high cooling requirements of chip 20 during startup. For example, when the vehicle's interior temperature is high, this temperature control logic can trigger the electric cooler 200 to activate first and control the fan 500 to run at a high speed. This helps to control the temperature rise of chip 20 in a relatively short period of time, mitigating the impact of thermal shock on hardware performance.

[0145] S120 : In response to the operating condition of the electronic device being a stable operating condition, determining a temperature control logic corresponding to the stable operating condition as a target temperature control logic.

[0146] During stable operation, the chip 20 load is relatively stable, and the cooling strategy can be dynamically adjusted based on factors such as the real-time collected chip 20 temperature, ambient temperature, and load level. For example, the fan 500 speed or the drive current of the electric cooler 200 can be adjusted based on the chip 20 temperature trend. This balances cooling efficiency and energy consumption to a certain extent, which helps extend the device lifespan and improve overall operational stability.

[0147] It should be noted that the working condition can be determined based on a multi-factor comprehensive judgment of parameters such as system startup status, operating time, chip 20 temperature rise rate, load distribution, etc., and implemented through software control logic. The specific implementation method can be flexibly configured according to the actual product design, and this is not the only limitation.

[0148] Among them, the startup condition can be understood as the stage when the electronic device is just powered on and started. This stage may be accompanied by hardware initialization, instantaneous current fluctuations or high-frequency wake-up of chip 20, and the thermal load shows a rapid upward trend; while the stable operation condition corresponds to the system entering a relatively stable task processing stage after initialization is completed. The thermal load fluctuation in this stage is low, and the thermal management demand tends to be balanced.

[0149] Since the thermal characteristics corresponding to different working conditions are different, this solution sets the temperature control logic for different working conditions to improve the adaptability and effectiveness of the temperature control strategy.

[0150] In some embodiments, obtaining parameter values ​​of factors influencing device operation includes obtaining target control temperature T, temperature Tb of circuit board 30 where chip 20 is located, power consumption P0 of chip 20 when powered on, junction-to-ambient thermal resistance Rja when fan 500 is at maximum speed, and junction-to-ambient thermal resistance Rja0 when fan 500 is not running. Where T = Tj / α, where α is a safety factor, and Tj is the maximum allowable operating temperature of chip 20.

[0151] In the above embodiment, the heat dissipation structure 10 includes a fan 500, which is thermally coupled to the heat sink 100. In the temperature control logic corresponding to the power-on condition, the correspondence between different temperature control strategies and different temperature control equations includes the following:

[0152] If Tb≥T-P0*Rja, the fan 500 and the electric refrigerator 200 are turned on.

[0153] If T-P0*Rja0≤Tb<T-P0*Rja, the fan 500 is turned on and the electric refrigerator 200 is turned off.

[0154] If Tb<T-P0*Rja0, the fan 500 and the electric refrigerator 200 are turned off.

[0155] Among them, T is the target control temperature, T=Tj / α, α is the safety factor; Tj is the maximum allowable operating temperature of the chip 20; Tb is the temperature of the circuit board 30 where the chip 20 is located; P0 is the power consumption of the chip 20 when the power is turned on; Rja is the junction-to-ambient thermal resistance when the fan 500 is turned on to the maximum gear; Rja0 is the junction-to-ambient thermal resistance when the fan 500 is not turned on.

[0156] In the above embodiment, if Tb ≥ T-P0*Rja, fan 500 and electric cooler 200 are turned on. When Tb ≥ T-P0*Rja, indicating that the electronic device is in the power-on state and the internal temperature of the host is high, chip 20 consumes a large amount of power, posing a certain degree of overheating risk. In this case, relying solely on natural heat dissipation or fan 500 for heat dissipation may not be able to meet the heat dissipation requirements, causing the chip 20 temperature to continue to rise, which may affect the normal startup and operational stability of the device.

[0157] Based on this, the temperature control strategy is to activate the electric cooler 200 and fan 500, utilizing the cooling function of the electric cooler 200 to cool the chip 20. This helps to suppress the rapid rise in chip 20 temperature and promote the smooth startup process of the host. The electric cooler 200 can absorb heat more efficiently when the chip 20 generates concentrated heat. Combined with the heat dissipation of the fan 500, this helps the overall cooling system quickly respond to high temperature conditions and reduces system risks caused by temperature anomalies.

[0158] Therefore, enabling the electric cooler 200 during the high power consumption startup phase can alleviate the extreme increase in the temperature of the chip 20 and the host to a certain extent, which is beneficial to improving the startup stability and reliability of the electronic device.

[0159] In the above embodiment, if T-P0*Rja0≤Tb<T-P0*Rja, the fan 500 is turned on and the electric cooler 200 is turned off. When T-P0*Rja0≤Tb<T-P0*Rja, it indicates that the internal temperature of the host is at a high level, but has not yet reached a level where the electric cooler 200 must be activated to assist in heat dissipation.

[0160] At this time, turning on the fan 500 is beneficial to enhancing the heat exchange efficiency between the radiator 100 and the air, and can meet the heat dissipation requirements to a certain extent, thereby helping to maintain the temperature of the chip 20 within a safe range and slowing down the temperature rise trend.

[0161] Turning off the electric refrigerator 200 can avoid the extra energy consumption and heat transfer problems that may be generated during its operation, thereby improving the energy efficiency of the overall heat dissipation system.

[0162] Therefore, in this temperature range, the temperature control strategy of only turning on fan 500 is beneficial to balancing the heat dissipation efficiency and system energy consumption, and promoting stable operation of the equipment.

[0163] In the above embodiment, if Tb<T-P0*Rja0, the fan 500 and the electric refrigerator 200 are turned off. When Tb<T-P0*Rja0, it indicates that the internal temperature of the host is at a relatively low level.

[0164] At this time, the heat dissipation structure 10 can meet the heat dissipation demand to a certain extent through natural heat dissipation, and there is no need to turn on the fan 500 and the electric refrigerator 200 to assist in cooling.

[0165] Turning off the fan 500 and the electric cooler 200 is beneficial to reducing the energy consumption and operating noise of the device, and also helps to extend the service life of the relevant components of the heat dissipation system.

[0166] Therefore, in this temperature range, adopting a temperature control strategy of shutting down the fan 500 and the electric cooler 200 helps to achieve a balance between heat dissipation efficiency and system energy consumption, and promotes stable and energy-saving operation of the equipment.

[0167] In some embodiments, obtaining the parameter values of the device operation impact factors includes: obtaining the temperature Ta of the environment where the heat dissipation structure 10 is located, the power consumption P of the chip 20, the junction-to-ambient thermal resistance Rja when the fan 500 is at the maximum gear, the target control temperature T, the safety factor k, and the real-time temperature Tsoc of the chip 20. Among them, P = V * i, where V is the working voltage of the chip 20 and i is the average working current of the chip 20; T = Tj / α, where α is the safety factor and Tj is the maximum allowable working temperature of the chip 20; k = Tj / Tsoc.

[0168] In the above embodiments, the heat dissipation structure 10 includes a fan 500. The fan 500 is thermally coupled to the radiator 100. The fan 500 has multiple gears, or the fan 500 is a stepless speed regulation structure. In the temperature control logic corresponding to the stable operation condition, the corresponding relationship between different temperature control strategies and different temperature control relational expressions includes the following:

[0169] If Ta + P * Rja < T and P < P1, then turn off the fan 500 and the electric refrigerator 200.

[0170] If Ta + P * Rja < T and P ≥ P1, then turn on the fan 500 and turn off the electric refrigerator 200.

[0171] If Ta + P * Rja < T and k < α, then turn on the fan 500 and turn on the electric refrigerator 200.

[0172] If Ta + P * Rja ≥ T, then turn on the fan 500 and the electric refrigerator 200.

[0173] Among them, Ta is the temperature of the environment where the heat dissipation structure 10 is located; P is the power consumption of the chip 20, P = V * i, where V is the working voltage of the chip 20 and i is the average working current of the chip 20; Rja is the junction-to-ambient thermal resistance when the fan 500 is at the maximum gear; T is the target control temperature, T = Tj / α, where α is the safety factor and Tj is the maximum allowable working temperature of the chip 20; k is the safety factor, k = Tj / Tsoc, and Tsoc is the real-time temperature of the chip 20.

[0174] In the above embodiments, if Ta + P * Rja < T and P < P1, then turn off the fan 500 and the electric refrigerator 200. When Ta + P * Rja < T and P < P1, it indicates that the electronic device is in a medium or low power consumption operation state and the external environmental temperature is relatively favorable.

[0175] At this time, the heat dissipation requirement is low, and the fan 500 and the electric refrigerator 200 can be turned off, and the effective control of the temperature of the chip 20 can be achieved by using natural heat dissipation or air-cooled heat dissipation methods.

[0176] This temperature control strategy is beneficial to reducing system energy consumption and improving the energy efficiency and stability of device operation while ensuring that the temperature of the chip 20 is maintained within a safe range.

[0177] In the above embodiment, if Ta + P * Rja < T and P ≥ P1, the fan 500 is turned on and the electric cooler 200 is turned off. When Ta + P * Rja < T and P ≥ P1, it indicates that the electronic device is in a high power consumption state, but the ambient temperature is relatively favorable. It will be understood that P1 is set based on prior knowledge, and this application does not limit its specific value.

[0178] At this time, by turning on the fan 500 and turning off the electric refrigerator 200, it is beneficial to utilize a heat dissipation method combining natural heat dissipation and air cooling to meet the heat dissipation requirements of most operating scenarios.

[0179] If Ta+P*Rja<T, and k<α, the fan 500 is turned on, and the electric cooler 200 is turned on. When Ta+P*Rja<T, and k<α, it indicates that the device is in a relatively extreme heat dissipation condition.

[0180] To cope with this extreme working condition, it is beneficial to turn on the fan 500 and start the electric refrigerator 200 at the same time. By briefly turning on the electric refrigerator 200, the temperature of the chip 20 is suppressed, thereby assisting the heat dissipation structure 10 to quickly reduce the temperature of the chip 20, which is conducive to maintaining stable operation of the equipment.

[0181] This temperature control strategy helps to improve the system's responsiveness to sudden high-temperature environments and reduce potential risks of the chip 20 due to temperature fluctuations.

[0182] In the above embodiment, if Ta+P*Rja≥T, the fan 500 and the electric refrigerator 200 are turned on. When Ta+P*Rja≥T, it indicates that the device is in a high power consumption and high ambient temperature working condition.

[0183] In this operating condition, it is beneficial to activate both the fan 500 and the electric cooler 200 to enhance heat dissipation. Since the fan 500 alone cannot meet the temperature control requirements of the chip 20, activating the electric cooler 200 can further reduce the temperature of the chip 20, helping to ensure the safe and stable operation of the chip 20.

[0184] In some embodiments, the fan 500 has a first gear, a second gear, a third gear, and a fourth gear with increasing wind speed. In the temperature control logic corresponding to the stable operating condition, the correspondence between different temperature control strategies and different temperature control relationship equations also includes the following:

[0185] If Ta+P*Rja<T, and P2≥P≥P1, the fan 500 is turned on to the first gear, and the electric refrigerator 200 is turned off.

[0186] If Ta+P*Rja<T, and P3>P≥P2, the fan 500 is turned on to the second gear, and the electric refrigerator 200 is turned off.

[0187] If Ta+P*Rja<T, and P4>P≥P3, the fan 500 is turned on to the third gear, and the electric refrigerator 200 is turned off.

[0188] If Ta+P*Rja<T, and P5>P≥P4, the fan 500 is turned on to the fourth gear, and the electric refrigerator 200 is turned off.

[0189] Among them, P5>P4>P3>P2>P1. Through the above method, it is beneficial to adjust the speed of fan 500 to meet the heat dissipation requirements according to different power consumption, while avoiding the activation of electric refrigerator 200 and reducing energy consumption. It can be understood that P2, P3, P4 and P5 can be preset thresholds based on the system's heat dissipation performance and power consumption characteristics. When the real-time power consumption of chip 20 exceeds the corresponding threshold, the control logic drives fan 500 to switch to the corresponding gear to improve heat dissipation capacity. In this embodiment, the fan has four gears. In other embodiments, the number of fan gears can also be set in other forms. The corresponding adjustment of the threshold setting can meet different control requirements.

[0190] In some embodiments, the heat dissipation control method further includes: executing anti-condensation control logic in response to the electric refrigerator 200 being in the on state. Specifically, if the temperature of the cold surface 220 of the electric refrigerator 200 is too low during operation, moisture in the air may condense into water droplets on the cold surface 220, resulting in condensation, which in turn poses a potential safety hazard and risk of equipment damage. Therefore, executing the anti-condensation control logic can inhibit or mitigate the occurrence of condensation to a certain extent, thereby improving the safety and reliability of system operation.

[0191] In some embodiments, the anti-condensation control logic includes a correspondence between different anti-condensation control strategies and different anti-condensation relationship equations. The anti-condensation relationship equations include multiple condensation triggering factors. Running the anti-condensation control logic includes the following:

[0192] Get the parameter value of the condensation trigger factor.

[0193] The target anti-condensation control strategy is determined based on the parameter value of the condensation trigger factor and the anti-condensation control logic.

[0194] The operations of the electric refrigerator 200 and the fan 500 are controlled according to the target anti-condensation control strategy.

[0195] In some embodiments, obtaining the parameter values ​​of the condensation trigger factor includes obtaining the temperature Ttec of the cold surface 220 of the electric refrigerator 200, the condensation safety factor f, the dew point temperature Tg in the current environment, the safety factor k, and the real-time temperature Tsoc of the chip 20. Here, k = Tj / Tsoc, where Tj is the maximum allowable operating temperature of the chip 20; and 0.1 ≤ f ≤ 0.3. It will be understood that the current dew point temperature Tg represents the temperature at which water vapor in the air condenses under the current temperature and humidity conditions.

[0196] In the above embodiment, in the anti-condensation control logic, the correspondence between different anti-condensation control strategies and different anti-condensation relationship equations includes:

[0197] If Tg<Ttec≤(1+f)*Tg, and k≥α, the operating power of the electric refrigerator 200 remains unchanged, and the operating speed of the fan 500 is reduced.

[0198] If Tg<Ttec≤(1+f)*Tg, and k<α, the operating power of the electric refrigerator 200 remains unchanged, and the operating speed of the fan 500 is increased.

[0199] If Ttec>(1+f)*Tg, and k≥α, the operating power of the electric refrigerator 200 is increased, and the operating speed of the fan 500 is reduced.

[0200] If Ttec>(1+f)*Tg, and k<α, the operating power of the electric refrigerator 200 is increased, and the operating speed of the fan 500 is increased.

[0201] Among them, Ttec is the temperature of the cold surface 220 of the electric refrigerator 200; f is the condensation safety factor, 0.1≤f≤0.3; Tg is the dew point temperature under the current environment; k is the safety factor, k=Tj / Tsoc, Tj is the maximum allowable operating temperature of the chip 20, and Tsoc is the real-time temperature of the chip 20.

[0202] The above design is conducive to reducing the possibility of condensation on the cold surface 220 of the electric refrigerator 200 and lowering the risk of condensed water formation on the basis of meeting the heat dissipation requirements.

[0203] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0204] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0205] The embodiments, implementation methods and related technical features of the present application can be combined and replaced with each other without conflict.

[0206] The above are merely preferred embodiments of the present application and do not constitute any form of limitation to the present application. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present application without departing from the content of the technical solution of the present application are still within the scope of the technical solution of the present application.

Claims

1. A heat dissipation structure, characterized in that: include: heat sink; an electric cooler, one side of which is thermally coupled to the heat sink, and the other side of which is configured to be thermally coupled to the chip; and A unidirectional heat conductor has one side thermally coupled to the heat sink and the other side configured to be thermally coupled to the chip so as to conduct heat of the chip to the heat sink in a unidirectional manner.

2. The heat dissipation structure according to claim 1, characterized in that: The radiator is made of metal; And / or, the heat sink includes a body and heat dissipation fins arranged on the body, and the body is thermally coupled to the electric cooler and the one-way heat conductor respectively.

3. The heat dissipation structure according to claim 1, characterized in that: The one-way heat conducting member includes at least one of a gravity heat pipe, a one-way heat conducting temperature equalizing plate and a loop heat pipe.

4. The heat dissipation structure according to claim 1, characterized in that: The electric cooler includes a hot surface and a cold surface, the hot surface is thermally coupled to the heat sink, and the cold surface is configured to be thermally coupled to the chip.

5. The heat dissipation structure according to any one of claims 1 to 4, characterized in that: A temperature equalizing member is further included. The one-way heat conducting member and the electric cooler are thermally coupled to the temperature equalizing member respectively, so as to be thermally coupled to the chip through the temperature equalizing member.

6. The heat dissipation structure according to claim 5, characterized in that: The temperature equalizing member includes at least one of a temperature equalizing plate, a heat pipe, a copper plate, an aluminum alloy block, and a magnesium alloy block.

7. The heat dissipation structure according to claim 5, characterized in that: The device further comprises a fan connected to the radiator for cooling the radiator.

8. The heat dissipation structure according to claim 7, characterized in that: The fan has multiple gears; Alternatively, the fan has a stepless speed regulation structure.

9. The heat dissipation structure according to claim 7, characterized in that: A first thermal interface material is provided between the heat sink and the electric refrigerator, and the electric refrigerator is thermally coupled to the heat sink via the first thermal interface material; And / or, a second thermally conductive interface material is provided between the heat sink and the one-way heat conductor, and the one-way heat conductor is thermally coupled to the heat sink via the second thermally conductive interface material; And / or, a third thermal interface material is provided between the electric refrigerator and the temperature equalizing member, and the electric refrigerator is thermally coupled to the electric refrigerator via the third thermal interface material; And / or, a fourth thermal interface material is provided between the one-way heat conductor and the temperature uniform component, and the one-way heat conductor is thermally coupled to the temperature uniform component via the fourth thermal interface material; And / or, the heat dissipation structure further includes a fifth thermal interface material, and the fifth thermal interface material is configured to be disposed between the temperature uniform component and the chip to thermally couple the temperature uniform component and the chip.

10. The heat dissipation structure according to claim 9, characterized in that: The first thermal interface material, the second thermal interface material, the third thermal interface material, the fourth thermal interface material and the fifth thermal interface material respectively include at least one of thermal conductive gel, thermal conductive silicone grease, thermal conductive pad, phase change thermal conductive pad and liquid metal.

11. An electronic device, characterized in that: The heat dissipation structure comprises a chip and any one of claims 1 to 10, wherein the one-way heat conductor and the electric cooler are both thermally coupled to the chip.

12. The electronic device according to claim 11, characterized in that: The electronic device includes a vehicle computer.

13. A vehicle, characterized in that: The heat dissipation structure comprises any one of claims 1 to 10, or the electronic device comprises the electronic device according to claim 11 or 12.

14. A heat dissipation control method, characterized in that: Applied to the electronic device according to claim 11, the method comprises: Determining a target temperature control logic according to the operating condition of the electronic device, the target temperature control logic including a correspondence between different temperature control strategies and different temperature control equations, the temperature control equations including multiple device operation influencing factors; Obtaining parameter values ​​of the equipment operation influencing factors; Determine a target temperature control strategy according to the parameter values of the device operation influence factors and the target temperature control logic; Control the operation of the heat dissipation structure according to the target temperature control strategy.

15. The heat dissipation control method according to claim 14, wherein: The working conditions of the electronic device include a power-on working condition and a stable operation working condition. The power-on working condition and the stable operation working condition respectively correspond to a temperature control logic. Determining the target temperature control logic according to the working condition of the electronic device includes: In response to the working condition of the electronic device being the power-on working condition, determining the temperature control logic corresponding to the power-on working condition as the target temperature control logic; or In response to the working condition of the electronic device being the stable operation working condition, determining the temperature control logic corresponding to the stable operation working condition as the target temperature control logic.

16. The heat dissipation control method according to claim 15, characterized in that: The heat dissipation structure includes a fan. The fan is thermally coupled to the radiator. In the temperature control logic corresponding to the power-on working condition, the corresponding relationship between different temperature control strategies and different temperature control relationships includes: If Tb≥T - P0*Rja, then turn on the fan and the electric cooler; If T - P0*Rja0≤Tb<T - P0*Rja, then turn on the fan and turn off the electric cooler; If Tb<T - P0*Rja0, then turn off the fan and the electric cooler; Where, T is the target control temperature, T = Tj / α, α is a safety factor; Tj is the maximum allowable working temperature of the chip; Tb is the temperature of the circuit board where the chip is located; P0 is the power consumption of the chip at startup; Rja is the junction-to-ambient thermal resistance when the fan is at the maximum gear; Rja0 is the junction-to-ambient thermal resistance when the fan is not on.

17. The heat dissipation control method according to claim 15, wherein: The heat dissipation structure includes a fan. The fan is thermally coupled to the radiator. The fan has multiple gears or the fan is a stepless speed regulation structure. In the temperature control logic corresponding to the stable operation working condition, the corresponding relationship between different temperature control strategies and different temperature control relationships includes: If Ta + P*Rja<T and P<P1, then turn off the fan and the electric cooler; If Ta + P*Rja<T and P≥P1, then turn on the fan and turn off the electric cooler; If Ta + P*Rja<T and k<α, then turn on the fan and turn on the electric cooler; If Ta + P*Rja≥T, then turn on the fan and the electric cooler; Where, Ta is the temperature of the environment where the heat dissipation structure is located; P is the power consumption of the chip, P = V*i, V is the working voltage of the chip, i is the average working current of the chip; Rja is the junction-to-ambient thermal resistance when the fan is at the maximum gear; T is the target control temperature, T = Tj / α, α is a safety factor, Tj is the maximum allowable working temperature of the chip; k is a safety factor, k = Tj / Tsoc, Tsoc is the real-time temperature of the chip.

18. The heat dissipation control method according to claim 17, wherein: The fan has a first gear, a second gear, a third gear and a fourth gear with increasing wind speed. In the temperature control logic corresponding to the stable operation working condition, the corresponding relationship between different temperature control strategies and different temperature control relationships further includes: If Ta+P*Rja<T, and P2≥P≥P1, then turn on the fan to the first gear and turn off the electric cooler; If Ta+P*Rja<T, and P3>P≥P2, then turn on the fan to the second gear and turn off the electric cooler; If Ta+P*Rja<T, and P4>P≥P3, then turn on the fan to the third gear and turn off the electric cooler; If Ta+P*Rja<T, and P5>P≥P4, then turn on the fan to the fourth gear and turn off the electric cooler; Among them, P5>P4>P3>P2>P1.

19. The heat dissipation control method according to any one of claims 16 to 18, characterized in that: The method further includes executing anti-condensation control logic in response to the electric refrigerator being in an on state.

20. The heat dissipation control method according to claim 19, wherein: The anti-condensation control logic includes a correspondence between different anti-condensation control strategies and different anti-condensation relationship equations, wherein the anti-condensation relationship equations include multiple condensation triggering factors. The operation of the anti-condensation control logic includes: Obtaining a parameter value of the condensation trigger factor; Determining a target anti-condensation control strategy according to the parameter value of the condensation trigger factor and the anti-condensation control logic; The operation of the electric refrigerator and the fan is controlled according to the target anti-condensation control strategy.

21. The heat dissipation control method according to claim 20, wherein: In the anti-condensation control logic, the corresponding relationship between different anti-condensation control strategies and different anti-condensation relationship equations includes: If Tg<Ttec≤(1+f)*Tg, and k≥α, the operating power of the electric refrigerator remains unchanged, and the operating speed of the fan is reduced; If Tg<Ttec≤(1+f)*Tg, and k<α, the operating power of the electric refrigerator remains unchanged, and the operating speed of the fan is increased; If Ttec>(1+f)*Tg, and k≥α, the operating power of the electric refrigerator remains unchanged, and the operating speed of the fan is reduced; If Ttec>(1+f)*Tg, and k<α, then increase the operating power of the electric refrigerator and increase the operating speed of the fan; Among them, Ttec is the temperature of the cold surface of the electric refrigerator; f is the condensation safety factor, 0.1≤f≤0.3; Tg is the dew point temperature under the current environment; k is the safety factor, k=Tj / Tsoc, Tj is the maximum allowable operating temperature of the chip, and Tsoc is the real-time temperature of the chip.

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