Liquid metal type heat dissipation structure and rectifier thereof

Abstract

The liquid gold type heat dissipation structure comprises a heat collection plate and a plurality of heat conduction liquid gold pipes, a vacuum cavity is formed in each heat conduction liquid gold pipe, capillary structures are arranged on the inner walls of the vacuum cavities, refrigerants are contained in the vacuum cavities, the refrigerants are attached to the capillary structures, and the heat conduction liquid gold pipes are arranged in the capillary structures. One part of each heat conduction liquid gold pipe is installed in the heat collection plate to form an evaporation part, and the other part of each heat conduction liquid gold pipe protrudes out of the heat collection plate and extends outwards to form a condensation part. A unique liquid gold type heat dissipation structure is adopted, the core is that heat is transmitted through refrigerant phase change circulation, the initial infrastructure cost and continuous operation energy consumption are greatly reduced, meanwhile, the interior of the heat conduction liquid gold pipe is closed circulation, the problem that a flow channel is blocked due to water quality degradation is thoroughly solved, and the service life of the heat conduction liquid gold pipe is prolonged. Therefore, heat exchange efficiency attenuation and over-temperature shutdown risks caused by heat exchange efficiency attenuation and over-temperature shutdown are avoided, efficient heat dissipation which is easy to maintain and long in service life is achieved fundamentally, and the heat dissipation device can be applied to various different working environments.

Description

Technical Field

[0001] The present invention relates to the technical field of rectifiers, and in particular to a liquid metal heat dissipation structure and a rectifier thereof. Background Art

[0002] In the field of rectifier power supplies, heat dissipation performance directly determines the reliability and service life of the equipment. Currently, mainstream heat dissipation solutions are mainly divided into two categories: water cooling and air cooling.

[0003] The water-cooling heat dissipation system is a closed structure. Its sealed body can effectively isolate external acidic and alkaline corrosive gases / liquids and protect internal electronic components. However, its heat dissipation function relies on complex external facilities, including a water supply system, water treatment equipment, and cooling towers. The infrastructure costs are high, and the evaporation of cooling water and the continuous energy consumption of circulating refrigeration significantly increase production costs. At the same time, after long-term use, impurities are easily generated in the water, causing blockage of the flow channel, resulting in reduced heat exchange efficiency and even triggering over-temperature protection shutdown.

[0004] The air-cooled heat dissipation system has an open structure. Although it eliminates the external dependence of the water cooling system and reduces the complexity of initial deployment, its open body design leads to inherent defects. In industrial sites with high temperature, high humidity, high dust, strong acidity and alkalinity, or liquid splashing, external pollutants can directly invade the interior of the equipment, causing circuit corrosion, component short circuits and blockage of the heat dissipation air ducts. Under harsh working conditions, sudden shutdowns are prone to occur, causing production interruptions and significant economic losses to users. Summary of the Invention

[0005] The purpose of the present invention is to address the deficiencies of the prior art and provide a liquid metal heat dissipation structure and a rectifier thereof to solve the problems raised in the background art.

[0006] To achieve this object, the present invention adopts the following technical solutions:

[0007] In one aspect, the present invention provides a liquid metal heat dissipation structure, comprising:

[0008] A heat collecting plate having a first heat absorbing surface and a second heat absorbing surface, wherein the first heat absorbing surface and the second heat absorbing surface are used to mount heat-generating power components and absorb the heat generated by the components;

[0009] A plurality of heat transfer liquid gold tubes, each of which has a vacuum cavity formed therein, an inner wall of the vacuum cavity being provided with a capillary structure, and a refrigerant being contained in the vacuum cavity, the refrigerant being attached to the capillary structure, a portion of each heat transfer liquid gold tube being installed in a heat collection plate to form an evaporation portion, and the remaining portion of the heat transfer liquid gold tube protruding from the heat collection plate and extending outward to form a condensation portion, the refrigerant in the evaporation portion being used to absorb heat from the heat collection plate and flow to the condensation portion;

[0010] The core heat dissipation mechanism is installed at the condensation part and is used to absorb the heat of the refrigerant in the condensation part and make the refrigerant flow back to the evaporation part along the capillary structure.

[0011] As a preferred solution of the liquid metal heat dissipation structure, the core heat dissipation mechanism is a heat dissipation fin group, which includes a plurality of fins, each of which is provided with a plurality of second circular mounting holes, and the condensation portion of the heat transfer liquid gold tube sequentially passes through the second circular mounting holes of the plurality of fins, so that the fins are axially spaced along the condensation portion of the heat transfer liquid gold tube;

[0012] The condensation part and the evaporation part of the heat transfer liquid gold tube are arranged vertically or in parallel. When the condensation part and the evaporation part of the heat transfer liquid gold tube are arranged vertically, several of the fins are distributed at intervals along the first horizontal direction, and the condensation parts of several heat transfer liquid gold tubes are staggered left and right; when the condensation part and the evaporation part of the heat transfer liquid gold tube are arranged parallel, several of the fins are distributed at intervals along the second horizontal direction.

[0013] As an optimal solution for the liquid metal heat dissipation structure, the core heat dissipation mechanism is a water-cooled plate, a circulating water circuit is opened in the water-cooled plate, and the circulating water circuit is provided with a water inlet and a water outlet. The water inlet and the water outlet respectively pass through the wall of the water-cooled plate and are connected to water pipe joints. The water pipe joints are connected to an external water supply equipment to provide cooling water for the water-cooled plate.

[0014] As a preferred solution of the liquid metal heat dissipation structure, the heat collection plate includes two heat absorbing plates, the first heat absorbing surface and the second heat absorbing surface are the opposite sides of the two heat absorbing plates respectively, and the two facing sides of the two heat absorbing plates are respectively provided with a plurality of arc grooves, and the two heat absorbing plates are fitted together to form a plurality of first circular mounting holes, and a portion of the heat conducting liquid gold tube is embedded in the first circular mounting hole.

[0015] As a preferred solution of the liquid metal heat dissipation structure, the refrigerant is one or more of liquid metal, water or ammonia; and the capillary structure is one of axial micro-grooves, metal wire mesh or sintered metal powder.

[0016] On the other hand, the present invention provides a rectifier, including the above-mentioned liquid metal heat dissipation structure, and also including a body, the body is provided with a rectifier sealing area and a heat dissipation area, the heat collection plate and the evaporation part of the heat-conducting liquid gold tube are both installed in the rectifier sealing area, the condensation part of the heat-conducting liquid gold tube passes through the rectifier sealing area and extends to the heat dissipation area, the heat dissipation fin group or the water-cooling plate is installed in the heat dissipation area, the first heat absorption surface and the second heat absorption surface are both installed with a synchronization module and an IGBT module, the synchronization module is connected to a transformer assembly, the transformer assembly is connected to a first output copper bus through a conductive assembly, the synchronization module is connected to a second output copper bus through a conductive assembly, and the first output copper bus and the second output copper bus both extend out of the body as output poles.

[0017] As a preferred solution for the rectifier, the machine body is further provided with a heat dissipation area, and an auxiliary heat dissipation mechanism is further provided in the heat dissipation area, and the auxiliary heat dissipation mechanism is used to assist the heat dissipation fin group or the water cooling plate to quickly dissipate heat.

[0018] As a preferred solution for the rectifier, the auxiliary heat dissipation mechanism includes several cooling fans arranged in the heat dissipation area, and the body is provided with air inlets and air outlets at positions corresponding to the heat dissipation fin group or water cooling plate, and the cooling fans are installed at the air outlets.

[0019] As a preferred solution for the rectifier, the auxiliary heat dissipation mechanism includes a spray pipe installed in the heat dissipation area, the spray pipe is installed with a plurality of spray heads, and the spray heads are located above the heat dissipation fin group or the water cooling plate.

[0020] As a preferred solution of the rectifier, the auxiliary heat dissipation mechanism includes a cooling pipe installed on the heat dissipation area, and the cooling pipe is extended along the outer wall of the machine body.

[0021] Beneficial effects of the present invention:

[0022] (1) The present invention adopts a unique liquid metal heat dissipation structure, the core of which is to use the refrigerant phase change cycle to transfer heat. Specifically, the heat generated by the heat-generating power components during operation is collected on the heat collection plate, and the heat collection plate quickly transfers the heat to the heat-conducting liquid gold tube. The vacuum chamber of the heat-conducting liquid gold tube is filled with a small amount of volatile liquid refrigerant. The liquid refrigerant can absorb a large amount of heat and undergo a phase change, evaporating from liquid to gas. At this time, the air pressure of the evaporation part of the heat-conducting liquid gold tube will increase, and the gaseous refrigerant will diffuse rapidly to the condensation part with lower temperature and lower air pressure. The condensation part can use heat dissipation means such as air convection or liquid cooling to cause the gaseous refrigerant to release the latent heat of vaporization it carries and undergo a phase change again, condensing from gas to liquid. Due to the heat of the heat-conducting liquid gold tube, the heat of the heat-conducting liquid gold tube is condensed. The inner wall is lined with a special capillary structure, and the liquid refrigerant will adhere to the capillary structure. The liquid refrigerant will produce a surface tension effect in the capillary structure, generating a strong capillary force. The capillary force will drive the liquid refrigerant to overcome gravity, friction resistance, etc., and return from the condensation part to the evaporation part along the capillary structure, thereby realizing the continuous cycle of refrigerant heat absorption and heat release; the present invention does not need to rely on a complex external water supply system, greatly reducing the initial infrastructure cost and continuous operation energy consumption. At the same time, the interior of the heat transfer liquid gold tube is a closed cycle, which completely eliminates the problem of flow channel blockage caused by water quality deterioration, avoids the resulting heat exchange efficiency attenuation and over-temperature shutdown risks, and fundamentally realizes easy maintenance, long-life and efficient heat dissipation, and can be applied to a variety of different working environments.

[0023] (2) The present invention creatively divides the rectifier into a rectifier sealing area and a heat dissipation area. Key electronic components are placed in the rectifier sealing area, which effectively isolates the invasion of external pollutants and improves the reliability and service life of the equipment in harsh industrial environments. At the same time, heat dissipation components such as the heat dissipation fin group, water-cooled plate, heat dissipation fan, and spray pipe are concentrated in a well-ventilated heat dissipation area. This area can flexibly select auxiliary heat dissipation methods such as air convection or liquid cooling according to actual application scenarios, and work in conjunction with the heat transfer liquid gold tube to achieve efficient and rapid heat discharge. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] To more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. Those skilled in the art can also derive other drawings based on these drawings without inventive effort.

[0025] Figure 1 It is a schematic diagram of the overall structure of the liquid metal heat dissipation structure described in the second embodiment of the present invention.

[0026] Figure 2 It is a schematic diagram of the disassembled structure of the liquid metal heat dissipation structure described in the second embodiment of the present invention.

[0027] Figure 3 It is a schematic diagram of the cross-section structure of the heat transfer liquid gold tube described in the present invention.

[0028] Figure 4 It is a schematic diagram of the overall structure of the liquid metal heat dissipation structure described in the third embodiment of the present invention.

[0029] Figure 5 It is a schematic diagram of the overall structure of the liquid metal heat dissipation structure described in the fourth embodiment of the present invention.

[0030] Figure 6 It is a schematic diagram of the disassembled structure of the liquid metal heat dissipation structure described in the fourth embodiment of the present invention.

[0031] Figure 7 It is a schematic diagram of the overall structure of the liquid metal heat dissipation structure described in Example 5 of the present invention.

[0032] Figure 8 It is a schematic diagram of the overall structure of the rectifier described in Example 7 of the present invention.

[0033] Figure 9 It is a schematic diagram of the internal structure of the rectifier described in Example 8 of the present invention.

[0034] Figure 10 It is a schematic diagram of the internal structure of the rectifier described in Example 8 of the present invention.

[0035] Figure 11 This is a schematic diagram of the disassembled structure of the rectifier described in Example 8 of the present invention.

[0036] Figure 12 It is a schematic diagram of the overall structure of the rectifier described in Example 10 of the present invention.

[0037] Description of reference numerals:

[0038] 1. Heat collecting plate; 11. Heat absorbing plate; 12. First heat absorbing surface; 13. Second heat absorbing surface; 14. Arc groove; 15. First circular mounting hole;

[0039] 2. Gold tube for heat transfer liquid; 21. Evaporation part; 22. Condensation part; 23. Capillary structure;

[0040] 3. Heat dissipation fin assembly; 31. Fin; 32. Second circular mounting hole;

[0041] 4. Machine body; 41. Rectification and sealing area; 42. Heat dissipation area; 43. Air inlet; 44. Air outlet;

[0042] 5. Synchronization module; 6. IGBT module; 7. Transformer assembly; 8. First output copper busbar; 9. Second output copper busbar; 10. Cooling fan; 11. Cooling pipe. DETAILED DESCRIPTION

[0043] The technical solution of the present invention will be further described below with reference to the accompanying drawings and through specific implementation methods.

[0044] Among them, the drawings are only used for illustrative purposes and represent only schematic diagrams rather than actual pictures, and should not be understood as limiting this patent; in order to better illustrate the embodiments of the present invention, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of the actual product; for those skilled in the art, it is understandable that some well-known structures and their descriptions in the drawings may be omitted.

[0045] The same or similar numbers in the drawings of the embodiments of the present invention correspond to the same or similar parts; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right", "inside", "outside" and the like indicate an orientation or position relationship based on the orientation or position relationship shown in the drawings, it is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation. Therefore, the terms describing the position relationship in the drawings are only used for illustrative purposes and cannot be understood as limiting this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0046] In the description of the present invention, unless otherwise expressly specified or limited, when the term "connection" or the like appears to indicate a connection relationship between components, such term should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be internal communication between two components or an interaction between two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood in specific circumstances.

[0047] Example 1:

[0048] like Figure 1 and Figure 2 As shown, this embodiment provides a liquid metal heat dissipation structure for a low-power rectifier, including a heat collection plate 1, a plurality of heat-conducting liquid metal tubes 2, and a core heat dissipation mechanism. The heat collection plate 1 can play a dual role of supporting and absorbing heat in the rectifier. It has a first heat absorption surface 12 and a second heat absorption surface 13. The heat-generating power components of the rectifier can be installed on the first heat absorption surface 12 and the second heat absorption surface 13. The heat collection plate 1 is preferably made of copper or aluminum. The heat generated by the heat-generating power components during operation can be quickly collected on the heat collection plate 1.

[0049] One end of each heat transfer liquid gold tube 2 is installed in the heat collection plate 1 as the evaporation portion 21, and the other end protrudes from the heat collection plate 1 and extends outward to form the condensation portion 22. The core heat dissipation mechanism is installed in the condensation portion 22. The heat transfer liquid gold tube 2 is made of a metal tube, preferably copper or aluminum, so that the heat transfer liquid gold tube 2 has good thermal conductivity, and the heat collection plate 1 can quickly transfer heat to the heat transfer liquid gold tube 2;

[0050] like Figure 3 As shown, a vacuum cavity is provided inside each heat-conducting liquid gold tube 2, and a small amount of volatile liquid refrigerant is contained in the vacuum cavity. The liquid refrigerant can absorb the heat of the heat-conducting liquid gold tube 2. When the heat absorbed by the liquid refrigerant reaches the latent heat of vaporization, the liquid refrigerant will undergo a phase change, evaporating from liquid to gas. Since the vacuum cavity is a closed space, the gaseous refrigerant produced by evaporation is still in the vacuum cavity of the heat-conducting liquid gold tube 2. Therefore, the air pressure at the location of the evaporation part 21 of the heat-conducting liquid gold tube 2 will increase. Since the vacuum environment greatly reduces the resistance to gas flow, the gaseous refrigerant will diffuse rapidly to the condensation part 22 with lower temperature and lower air pressure. The core heat dissipation mechanism can cause the gaseous refrigerant in the condensation part 22 to release the latent heat of vaporization it carries, thereby undergoing a phase change again, condensing from gas to liquid.

[0051] The inner wall of the vacuum chamber is provided with a special capillary structure 23, and the liquid refrigerant will adhere to the capillary structure 23. There are countless tiny pores or channels inside the capillary structure 23. The surface tension effect of the liquid is used to generate a strong capillary force. The capillary force will drive the liquid refrigerant to overcome gravity, friction resistance, etc., and flow back from the condensation part 22 to the evaporation part 21 along the capillary structure 23 to absorb heat again, thereby realizing the continuous cycle of refrigerant heat absorption and heat release.

[0052] The core heat dissipation mechanism of this embodiment preferably adopts a heat dissipation fin group 3, which specifically includes a plurality of fins 31. The specific number of fins 31 can be flexibly set according to the heating power of the rectifier. Each fin 31 is punched and formed by aluminum strip, and the surface is electrophoretically treated to withstand corrosion in a high-acid and alkaline working environment and long-term flushing with a high-pressure water gun.

[0053] In addition, each fin 31 is provided with a plurality of second circular mounting holes 32, and the condensation portion 22 of the heat transfer liquid gold tube 2 passes through the second circular mounting holes 32 of the plurality of fins 31 in sequence, so that the fins 31 are distributed at intervals along the axial direction of the condensation portion 22 of the heat transfer liquid gold tube 2, and the fins 31 are welded to the surface of the condensation portion 22 of the heat transfer liquid gold tube 2 in a fixed-distance overlapping manner. The heat of the gaseous refrigerant in the condensation portion 22 will be evenly transferred to each fin 31 along its axial direction, and the heat will also diffuse on the surface of each fin 31, so that the surface temperature of the entire fin 31 tends to be uniform, thereby increasing the heat dissipation area. Finally, the fin 31 can be quickly cooled with the help of auxiliary heat dissipation means such as air cooling or water cooling.

[0054] The condensing portion 22 and the evaporating portion 21 of the heat transfer liquid gold tube 2 of this embodiment are arranged vertically, and the fins 31 are spaced apart along the first horizontal direction. It is understandable that the first horizontal direction described in this embodiment is the width direction of the heat collection plate 1. The overall length of the liquid metal heat dissipation structure is relatively small and the width is relatively large. It can be comprehensively selected and applied in combination with the placement of multiple devices and the heat dissipation wind direction. The placement of the liquid metal heat dissipation structure preferably adopts the arrangement of multiple devices in a front-to-back order, and the heat dissipation wind direction preferably adopts the direction parallel to the placement of the heat dissipation structure, so that the fins 31 in each device are in the fast-flowing air.

[0055] Preferably, the condensation parts 22 of the numerous heat-conducting liquid gold tubes 2 preferably adopt a left-right staggered distribution structural design, wherein the condensation parts 22 of a part of the heat-conducting liquid gold tubes 2 are vertically arranged toward the left, and the condensation parts 22 of another part of the heat-conducting liquid gold tubes 2 are vertically arranged toward the right, so that the condensation parts 22 of the numerous heat-conducting liquid gold tubes 2 are evenly distributed in the heat dissipating fin group 3, and heat can be transferred to each fin 31 more quickly.

[0056] The heat collection plate 1 of this embodiment specifically includes two heat absorbing plates 11, and the first heat absorbing surface 12 and the second heat absorbing surface 13 are respectively the opposite sides of the two heat absorbing plates 11. The two heat absorbing plates 11 are respectively provided with a plurality of arc grooves 14 on the opposite sides thereof. The two heat absorbing plates 11 are fitted together to form a plurality of first circular mounting holes 15, and a portion of the heat transfer liquid gold tube 2 is embedded in the first circular mounting hole 15, and the heat transfer liquid gold tube 2 and the heat collection plate 1 are organically pressed together.

[0057] Preferably, the refrigerant described in this embodiment can be one or more of liquid metal, water or ammonia, preferably liquid metal. Liquid metal has revolutionary advantages as a heat dissipation medium. It has ultra-high thermal conductivity, and the thermal conductivity coefficient is greater than 20W / (m·K), which is 40-60 times that of traditional water-cooled liquid; at the same time, its boiling point is greater than 2000°C, which is much higher than that of organic refrigerants. There is no risk of phase change leakage under high temperature conditions, and the long-term sealing of the heat dissipation structure can be guaranteed; and the metal is non-volatile and non-decomposable in nature, which can avoid problems such as scale accumulation, microbial growth, and chemical corrosion in the water cooling system, ensuring that the heat dissipation structure can operate maintenance-free for a long time.

[0058] Preferably, the capillary structure 23 described in this embodiment can adopt one of axial micro-grooves, metal wire mesh or sintered metal powder, preferably axial micro-grooves. The micro-grooves are an artificial precision capillary structure 23, which is formed by processing grooves or channels with a width of microns on the solid surface. It has core advantages such as high thermal conductivity, low flow resistance, and strong directional transport capability, and can drive the liquid refrigerant to flow back from the condensation part 22 to the evaporation part 21.

[0059] This embodiment does not need to rely on a complex external water supply system, which greatly reduces the initial infrastructure cost and continuous operation energy consumption. At the same time, the interior of the thermal liquid gold tube 2 is a closed loop, which completely eliminates the problem of flow channel blockage caused by water quality deterioration, avoids the resulting heat exchange efficiency degradation and over-temperature shutdown risks, and fundamentally achieves easy maintenance, long-life and efficient heat dissipation. It can be applied to various working environments. The specific number of the thermal liquid gold tubes 2 can be flexibly set according to the heating power of the rectifier to meet the heat dissipation requirements of the rectifier.

[0060] Example 2:

[0061] This embodiment is basically the same as the liquid gold heat dissipation structure of the first embodiment, and also includes a heat collection plate 1, a heat-conducting liquid gold tube 2 and a heat dissipation fin group 3. The main difference is that this embodiment has two condensation parts 22, which can further accelerate the heat dissipation efficiency.

[0062] like Figure 4 As shown, the middle portion of the heat transfer liquid gold tube 2 of this embodiment is installed within the heat collection plate 1 as the evaporation portion 21, while the ends protrude from the end portion of the heat collection plate 1 and extend outward to form the condensation portion 22. The condensation portions 22 at both ends of the heat transfer liquid gold tube 2 are each equipped with a heat dissipation fin group 3. The condensation portions 22 at both ends of the heat transfer liquid gold tube 2 are arranged perpendicular to the evaporation portion 21, and the fins 31 are spaced apart along the first horizontal direction. It can be understood that the first horizontal direction described in this embodiment is the width direction of the heat collection plate 1. This liquid metal heat dissipation structure has better heat dissipation performance and can be applied to high-power rectifiers.

[0063] Example 3:

[0064] The liquid metal heat dissipation structure of this embodiment is basically the same as that of the first embodiment, and also includes a heat collection plate 1, a heat conducting liquid metal tube 2 and a heat dissipation fin group 3. The main difference is that:

[0065] like Figure 5 and Figure 6 As shown, the condensing portion 22 and the evaporating portion 21 of the heat-conducting liquid gold tube 2 of this embodiment are arranged in parallel, and the fins 31 are spaced apart along the second horizontal direction. It can be understood that the second horizontal direction described in this embodiment is the length direction of the heat collection plate 1. The overall length of the liquid gold heat dissipation structure is long, while the width is small. It can be comprehensively selected and applied in combination with the placement of multiple devices and the heat dissipation wind direction. The placement of the liquid gold heat dissipation structure preferably adopts the method of placing multiple devices in parallel left and right, and the heat dissipation wind direction preferably adopts the direction parallel to the placement of the heat dissipation structure, so that the fins 31 in each device are in the fast-flowing air.

[0066] Example 4:

[0067] This embodiment is basically the same as the liquid gold heat dissipation structure of the third embodiment, and also includes a heat collection plate 1, a heat-conducting liquid gold tube 2 and a heat dissipation fin group 3. The main difference is that this embodiment has two condensation parts 22, which can further accelerate the heat dissipation efficiency.

[0068] like Figure 7 As shown, the middle portion of the heat transfer liquid gold tube 2 of this embodiment is installed within the heat collection plate 1 as the evaporation portion 21, while the ends protrude from the end portion of the heat collection plate 1 and extend outward to form the condensation portion 22. The condensation portion 22 at both ends of the heat transfer liquid gold tube 2 is installed with a heat dissipation fin group 3. The condensation portion 22 at both ends of the heat transfer liquid gold tube 2 is arranged parallel to the evaporation portion 21, and the fins 31 are spaced apart along the second horizontal direction. It can be understood that the second horizontal direction described in this embodiment is the length direction of the heat collection plate 1. This liquid metal heat dissipation structure has better heat dissipation performance and can be applied to high-power rectifiers.

[0069] Embodiment 5:

[0070] This embodiment is basically the same as any of the liquid metal heat dissipation structures described in embodiments one to four, and also includes a heat collection plate 1, a heat-conducting liquid gold tube 2 and a core heat dissipation mechanism. The main difference is that the core heat dissipation mechanism of this embodiment adopts a water-cooled plate, which can also help the refrigerant in the condensation part 22 to dissipate heat quickly.

[0071] Specifically, the water-cooled plate is installed at the condensation part 22 of the heat transfer liquid gold tube 2. A circulating water circuit is opened in the water-cooled plate. The circulating water circuit is provided with a water inlet and a water outlet. The water inlet and the water outlet respectively pass through the wall of the water-cooled plate and are connected with water pipe joints. The water pipe joints are connected to the external water supply equipment. The external water supply equipment provides cooling water for the water-cooled plate, and the heat of the refrigerant is taken away by the water flow.

[0072] Example 6:

[0073] like Figure 8As shown, this embodiment provides a rectifier, including any liquid metal heat dissipation structure described in Examples 1 to 5, and also including a body 4, the body 4 is provided with a rectifier sealing area 41 and a heat dissipation area 42, the heat collection plate 1 and the evaporation part 21 of the heat transfer liquid gold tube 2 are both installed in the rectifier sealing area 41, and the condensation part 22 of the heat transfer liquid gold tube 2 passes through the rectifier sealing area 41 and extends to the heat dissipation area 42, the core heat dissipation mechanism such as the heat dissipation fin group 3 or the water cooling plate is installed in the heat dissipation area 42, the first heat absorption surface 12 and the second heat absorption surface 13 of the heat collection plate 1 are both installed with a synchronization module 5 and an IGBT module 6, the synchronization module 5 is connected to a transformer assembly 7, the transformer assembly 7 is connected to a first output copper bus 8 through a conductive assembly, the synchronization module 5 is connected to a second output copper bus 9 through a conductive assembly, the first output copper bus 8 and the second output copper bus 9 are both extended to the outside of the body 4 as output poles, the transformer assembly 7, the synchronization module 5 and the IGBT module 6 and other electronic components described in this embodiment are all conventional structures of the rectifier, and are not repeated here.

[0074] For the rectifier of low-power models, the sealed rectifier area 41 in the body 1 of this embodiment is a sealed structure, while the heat dissipation area 42 can adopt an open structure, relying on the flowing air of the environment to exchange heat with the core heat dissipation mechanisms such as the heat dissipation fin group 3 or the water-cooled plate. At the same time, the body 4 is preferably made of aluminum or copper. The electronic components in the rectifier sealing area 41 can also be assisted in heat dissipation by the body 4, and heat can be taken away without using other heat dissipation methods. It is suitable for low-power models; during maintenance, the core heat dissipation mechanism in the heat dissipation area 42 can be directly rinsed with water to remove dust and other dirt accumulated on the core heat dissipation mechanism, thereby achieving easy maintenance and long-life efficient heat dissipation.

[0075] Embodiment seven:

[0076] The rectifier of this embodiment is basically the same as that of the sixth embodiment, and also includes a rectifier sealing area 41 and a heat dissipation area 42. The main difference is that, for the rectifier of a high-power model, this embodiment adds an auxiliary heat dissipation mechanism in the heat dissipation area 42 to assist the core heat dissipation mechanism such as the heat dissipation fin group 3 or the water-cooling plate to quickly dissipate heat.

[0077] like Figures 9 to 11 As shown, the auxiliary heat dissipation mechanism adopts a heat dissipation fan 10. The number of the heat dissipation fans 10 can be flexibly set according to the heating power of the rectifier. The body 4 is provided with an air inlet 43 and an air outlet 44 at the position corresponding to the core heat dissipation mechanism. The heat dissipation fan 10 is installed at the air outlet 44. When the heat dissipation fan 10 is started, forced convection air will enter from the air inlet 43 and flow through the surface of the core heat dissipation mechanism. When the air contacts the surface of the core heat dissipation mechanism with a higher temperature, heat exchange will occur, thereby quickly dissipating the heat.

[0078] The heat dissipation fan 10 and the rectifier of this embodiment adopt a split design. When the heat dissipation fan 10 is damaged, it can be directly removed and replaced, which makes maintenance simpler and more convenient.

[0079] Embodiment 8:

[0080] This embodiment is basically the same as the rectifier of embodiment seven, and also includes a body 4, a rectifier sealing area 41 and a heat dissipation area 42. The main difference is that the auxiliary heat dissipation mechanism of this embodiment adopts a spray pipe method, which can also assist the heat dissipation fin group 3 or the water-cooled plate core heat dissipation mechanism to quickly dissipate heat.

[0081] Specifically, the spray pipe is installed in the heat dissipation area 42, and several spray heads are installed on the spray pipe. The spray heads are located above the core heat dissipation mechanism. The spray heads can spray cooling water to the core heat dissipation mechanism, and the cooling water takes away the heat of the fins 31, further accelerating the heat dissipation efficiency of the heat dissipation fin group 3.

[0082] At the same time, the rectifier sealing area 41 of this embodiment adopts a sealed space, retaining only the channel through which the heat transfer liquid gold tube 2 passes, and the channel is waterproofed by sealing means such as sealing rings, which can effectively prevent cooling water from invading the rectifier sealing area 41 and maintain the normal operation of the rectifier.

[0083] Embodiment 9:

[0084] This embodiment is basically the same as the rectifier of embodiment seven or eight, and also includes a body 4, a rectifier sealing area 41 and a heat dissipation area 42. The main difference is that the auxiliary heat dissipation mechanism of this embodiment adopts a combination of a heat dissipation fan 10 and a spray pipe to further improve the heat dissipation efficiency of the core heat dissipation mechanism.

[0085] Preferably, the cooling fan 10 of this embodiment is a waterproof fan with a waterproof grade ≥ IP51, which can be used in high-pH open water flushing scenarios, thereby meeting the cooling requirements of high-power rectifiers.

[0086] Embodiment 10:

[0087] like Figure 12 As shown, this embodiment is basically the same as the rectifier of embodiments six to nine, and also includes a body 4, a rectifier sealing area 41 and a heat dissipation area 42. The main difference is that the auxiliary heat dissipation mechanism of this embodiment is additionally provided with a cooling pipe 11, and the cooling pipe 11 is extended along the outer wall of the body 1, and the cooling pipe 11 is externally connected to a water supply device, and the water supply device introduces cooling water into the cooling pipe 11. The cooling water can exchange heat with the body 1, thereby assisting the body 1 in heat dissipation.

[0088] Example 11:

[0089] This embodiment is basically the same as the rectifier of embodiment six, and also includes a body 4, a rectifier sealing area 41 and a heat dissipation area 42. The main difference is that the condensation part 22 of the heat transfer liquid gold tube 2 of this embodiment adopts liquid cooling forced heat dissipation means to help the refrigerant in the condensation part 22 to quickly dissipate heat.

[0090] The condensation portion 22 of the heat transfer liquid gold tube 2 of this embodiment extends to the outside of the rectification sealing area 41, and a cooling water pool is set in the heat dissipation area 42. The condensation portion 22 is directly immersed in the cooling water pool. At this time, the cooling water and the heat transfer liquid gold tube 2 are in direct contact. Heat exchange is carried out between the cooling water and the refrigerant in the heat transfer liquid gold tube 2, which can also promote the phase change of the gaseous refrigerant into the liquid refrigerant and return to the evaporation portion 21.

[0091] It should be noted that when the cooling water is in direct contact with the thermal liquid gold tube 2, the surface of the thermal liquid gold tube 2 needs to be coated with a waterproof material with good thermal conductivity, such as a nano-hydrophobic coating. This type of waterproof material can ensure the sealing of the thermal liquid gold tube 2 while not affecting the thermal conductivity of the heat dissipation structure.

[0092] It should be noted that the above-described specific embodiments are merely preferred embodiments of the present invention and the technical principles employed. Those skilled in the art will appreciate that various modifications, equivalent substitutions, and variations may be made to the present invention. However, as long as these modifications do not depart from the spirit of the present invention, they are intended to be within the scope of protection of the present invention. Furthermore, certain terms used in the specification and claims of this application are not intended to be limiting and are provided solely for ease of description.

Claims

1. A liquid metal heat dissipation structure, characterized in that: include: A heat collecting plate (1), the heat collecting plate (1) having a first heat absorbing surface (12) and a second heat absorbing surface (13), the first heat absorbing surface (12) and the second heat absorbing surface (13) being used for mounting heat-generating power components and absorbing heat generated thereby; A plurality of heat transfer liquid gold tubes (2), each heat transfer liquid gold tube (2) has a vacuum cavity formed inside, the inner wall of the vacuum cavity is provided with a capillary structure (23), and a refrigerant is contained in the vacuum cavity, the refrigerant is attached to the capillary structure (23), a portion of each heat transfer liquid gold tube (2) is installed in the heat collection plate (1) to form an evaporation portion (21), and the remaining portion of the heat transfer liquid gold tube (2) protrudes from the heat collection plate (1) and extends outward to form a condensation portion (22), and the refrigerant in the evaporation portion (21) is used to absorb heat from the heat collection plate (1) and flow to the condensation portion (22); A core heat dissipation mechanism is installed at the condensation portion (22) and is used to absorb the heat of the refrigerant in the condensation portion (22) and allow the refrigerant to flow back to the evaporation portion (21) along the capillary structure (23).

2. The liquid metal heat dissipation structure according to claim 1, characterized in that: The core heat dissipation mechanism is a heat dissipation fin group (3), the heat dissipation fin group (3) includes a plurality of fins (31), each of the fins (31) is provided with a plurality of second circular mounting holes (32), the condensation portion (22) of the heat transfer liquid gold tube (2) sequentially passes through the second circular mounting holes (32) of the plurality of fins (31), so that the fins (31) are distributed axially at intervals along the condensation portion (22) of the heat transfer liquid gold tube (2); The condensation portion (22) and the evaporation portion (21) of the heat transfer liquid gold tube (2) are arranged vertically or in parallel. When the condensation portion (22) and the evaporation portion (21) of the heat transfer liquid gold tube (2) are arranged vertically, a plurality of the fins (31) are distributed at intervals along a first horizontal direction, and the condensation portions (22) of the heat transfer liquid gold tube (2) are distributed in a left-right staggered manner. When the condensation portion (22) and the evaporation portion (21) of the heat transfer liquid gold tube (2) are arranged in parallel, a plurality of the fins (31) are distributed at intervals along a second horizontal direction.

3. The liquid metal heat dissipation structure according to claim 1, characterized in that: The core heat dissipation mechanism is a water-cooled plate, in which a circulating water circuit is opened. The circulating water circuit is provided with a water inlet and a water outlet. The water inlet and the water outlet respectively pass through the wall of the water-cooled plate and are connected to water pipe joints. The water pipe joints are connected to an external water supply equipment to provide cooling water for the water-cooled plate.

4. The liquid metal heat dissipation structure according to claim 1, characterized in that: The heat collecting plate (1) comprises two heat absorbing plates (11), the first heat absorbing surface (12) and the second heat absorbing surface (13) are respectively opposite sides of the two heat absorbing plates (11), and the two heat absorbing plates (11) are provided with a plurality of arc grooves (14) on the opposite sides thereof. The two heat absorbing plates (11) are fitted together to form a plurality of first circular mounting holes (15), and a portion of the heat conducting liquid gold tube (2) is embedded in the first circular mounting hole (15).

5. The liquid metal heat dissipation structure according to claim 1, characterized in that: The refrigerant is one or more of liquid metal, water or ammonia; and the capillary structure (23) is one of axial micro-grooves, metal wire mesh or sintered metal powder.

6. A rectifier comprising the liquid metal heat dissipation structure according to any one of claims 2 to 5, characterized in that: The invention also includes a machine body (4), wherein the machine body (4) is provided with a rectifying sealing area (41) and a heat dissipation area (42), the heat collecting plate (1) and the evaporation part (21) of the heat conducting liquid gold tube (2) are both installed in the rectifying sealing area (41), the condensation part (22) of the heat conducting liquid gold tube (2) passes through the rectifying sealing area (41) and extends into the heat dissipation area (42), the heat dissipation fin group (3) or the water cooling plate is installed in the heat dissipation area (42), the first heat absorbing surface (12) and the second heat absorbing surface (13) are both installed with a synchronization module (5) and an IGBT module (6), the synchronization module (5) is connected to a transformer assembly (7), the transformer assembly (7) is connected to a first output copper busbar (8) through a conductive assembly, the synchronization module (5) is connected to a second output copper busbar (9) through a conductive assembly, and the first output copper busbar (8) and the second output copper busbar (9) are both extended outside the machine body (4) as output poles.

7. The rectifier according to claim 6, characterized in that: An auxiliary heat dissipation mechanism is also provided in the heat dissipation zone (42), and the auxiliary heat dissipation mechanism is used to assist the heat dissipation fin group (3) or the water cooling plate in rapidly dissipating heat.

8. The rectifier according to claim 7, characterized in that: The auxiliary heat dissipation mechanism includes a plurality of heat dissipation fans (10) arranged in a heat dissipation area (42); an air inlet (43) and an air outlet (44) are provided on the machine body (4) at positions corresponding to the heat dissipation fin group (3) or the water-cooling plate; and the heat dissipation fans (10) are installed at the air outlet (44).

9. The rectifier according to claim 7 or 8, characterized in that: The auxiliary heat dissipation mechanism comprises a spray pipe installed in the heat dissipation area (42), the spray pipe is equipped with a plurality of spray heads, and the spray heads are located above the heat dissipation fin group (3) or the water cooling plate.

10. The rectifier according to claim 9, characterized in that: The auxiliary heat dissipation mechanism comprises a cooling pipe (11) installed on the heat dissipation area (42), and the cooling pipe (11) is extended along the outer wall of the machine body (1).

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