Cleaning system
By setting up two sets of cleaning equipment back to back and sharing the drainage and water supply systems, and combining a weighing device to calculate the remaining cleaning times of the treatment tank, automatic liquid replacement and drainage control are achieved, which solves the problems of high cost and low degree of automation of existing cleaning equipment and improves production efficiency and safety.
Patent Information
- Application Number
- CN202510770993.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-10
- Publication Date
- 2025-09-12
AI Technical Summary
Existing cleaning equipment is expensive and has a low degree of automation, requiring manual intervention, posing safety risks and impacting equipment production capacity.
A cleaning system is designed with two groups of cleaning equipment arranged back-to-back, sharing the drainage and water supply system. A weighing device is used to calculate the remaining number of cleaning times in the treatment tank, realizing automatic liquid exchange and drainage control. Liquid exchange and drainage control devices are also provided to simplify the control logic and avoid manual intervention.
It reduces equipment costs, improves production efficiency, reduces the risk of manual intervention, and increases equipment capacity.
Smart Images

Figure CN120640808A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of cleaning equipment for solar cell production, and in particular to a cleaning system for automatically processing chemical liquid of the cleaning equipment. Background Art
[0002] With the increasing global demand for renewable energy, the solar photovoltaic industry has experienced rapid growth. During the solar cell manufacturing process, silicon wafers undergo cleaning (wet processing), diffusion, annealing, coating, and screen printing. Currently, common cleaning equipment consists of trough-type and chain-type equipment. Trough-type equipment uses a basket to carry the silicon wafers. A robotic arm carries the basket and immerses it in various treatment tanks for cleaning. Each tank requires different solutions to facilitate the wet processing of the silicon wafers.
[0003] However, existing cleaning equipment is independent equipment. For example, a set of cleaning equipment needs to be equipped with corresponding liquid distribution system, liquid drainage system, water supply system, etc. This results in each set of cleaning equipment taking up a large space and the corresponding cost is also high.
[0004] In addition, existing cleaning equipment requires the use of acidic and / or alkaline solutions such as HCL, H202, NAOH, and KOH. However, the replacement and drainage of liquids in existing cleaning equipment require intervention by process personnel. The intervention process not only poses risks of contact with chemicals and exposure to exposure, but also results in a long liquid preparation time, thereby affecting equipment production capacity.
[0005] Therefore, how to provide a low-cost and automatically controlled cleaning system is a technical problem to be solved. Summary of the Invention
[0006] In order to solve the technical problems of high cost and low automation of cleaning systems in the prior art, the present invention proposes a cleaning system.
[0007] The cleaning system proposed by the present invention comprises:
[0008] Two groups of cleaning equipment, the two groups of cleaning equipment are arranged back to back, each group of cleaning equipment includes at least one cleaning equipment, each cleaning equipment includes a plurality of processing tanks arranged in sequence, a first weighing device provided at the loading position for weighing the weight of silicon wafers before processing, and a second weighing device provided at the unloading position for weighing the weight of silicon wafers after processing;
[0009] A liquid preparation system for transporting and proportioning the required liquid medicine to the treatment tank;
[0010] A drainage system shared by two groups of cleaning equipment, comprising drainage branches with first valves connected one-to-one to the treatment tanks of each cleaning equipment, and a drainage main pipe connected to the drainage branches;
[0011] A water supply system, which is shared by two groups of cleaning equipment, and provides cleaning water and pharmaceutical preparation water to the cleaning equipment;
[0012] The control system includes a liquid replacement control device and a liquid discharge control device. The liquid replacement control device controls the liquid distribution system to deliver and proportion the required liquid to the treatment tank, and calculates the remaining number of treatments for each treatment tank based on the relationship between the liquid distribution capacity and the weight of the silicon wafer. When the remaining number of treatments in the treatment tank is less than 1, a liquid discharge signal is sent to the liquid discharge control device. After the liquid discharge control device controls the valve of the liquid discharge branch pipe connected to the corresponding treatment tank in the liquid discharge system to discharge the liquid, the liquid replacement control device replaces the liquid in the corresponding treatment tank.
[0013] Furthermore, the remaining number of treatments in the treatment tank is calculated by the formula [G 总 -(G0+…+G i )] / G i+1 Calculated, G 总 is the total weight of silicon wafers that can be processed corresponding to the liquid capacity of the first treatment tank at the upstream of the cleaning equipment before the treatment begins. G0 is the weight of silicon wafers that are processed for the first time after the first treatment tank at the upstream of the cleaning equipment is filled with liquid. G i is the weight of the silicon wafer processed most recently after the solution is prepared, G i+1 is the weight of the next batch of silicon wafers to be processed.
[0014] Furthermore, the liquid draining device controls the liquid draining of each processing tank in the same cleaning equipment in sequence from upstream to downstream according to the position of the processing tank in the cleaning equipment.
[0015] Furthermore, the cleaning equipment also includes a liquid level meter for detecting the liquid level of the treatment tank. The liquid replacement control device counts the cleaning time and liquid preparation time of each treatment tank based on the signal of the liquid level meter during the cleaning and dispensing process. The liquid discharge control device counts the liquid discharge time based on the signal of the liquid level meter during the liquid discharge process.
[0016] Furthermore, each group of cleaning equipment includes one cleaning equipment. When two cleaning equipment are started, the cleaning equipment with the fastest liquid preparation time in the upstream treatment tank is given priority to prepare liquid, and 排1 * After β% of the time, the cleaning equipment with relatively slow preparation time for the liquid in the upstream treatment tank starts to prepare the liquid. 排1 The drainage time of the most upstream treatment tank of the cleaning equipment with priority liquid distribution, 0<β<100.
[0017] Furthermore, the drainage system also includes a buffer branch pipe with a second valve connected to each treatment tank in a one-to-one correspondence, at least one buffer tank connected to the buffer branch pipe, and the drainage port of the buffer tank is connected to the drainage main pipe.
[0018] Furthermore, the liquid discharge control device calculates the buffer time difference Δt=t between the next processing tank of the processing tank to be prepared located at the upstream of the two cleaning devices. 排2 +t 配2 +t 洗2 -t 下游处理 -t 配1 -t 洗1 , and when the buffer time difference is greater than γ, the treatment tank is controlled to drain through the buffer branch pipe, γ≥0, t 排2 , t 洗2 and t 下游处理 are respectively the sum of the drainage time, cleaning time of the next treatment tank to be prepared located at the upstream and the treatment time of the downstream treatment tank, the t 配1 and t 洗1 It refers to the liquid preparation time and cleaning time of the upstream treatment tank to be prepared in the same cleaning equipment.
[0019] Furthermore, the liquid exchange control device is set in a one-to-one correspondence with the cleaning equipment, and the liquid exchange control device is equipped with a one-button start-stop function. When the detection device detects an abnormality, the liquid exchange control device pauses or restarts the liquid preparation function through the one-button start-stop function.
[0020] Furthermore, the medical solution includes an acidic solution and / or an alkaline solution.
[0021] The present invention arranges two groups of cleaning equipment back to back so that the two groups of cleaning equipment can share a drainage system, etc., thereby saving costs. The present invention further improves production efficiency by calculating the remaining cleaning times of the treatment tank and then controlling the corresponding treatment tank to drain, clean and replace the liquid in time. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] The present invention is described in detail below with reference to the embodiments and accompanying drawings, in which:
[0023] Figure 1 It is a schematic diagram of the structural framework of an embodiment of the present invention.
[0024] Figure 2 is a processing flow chart of an embodiment of the present invention. DETAILED DESCRIPTION
[0025] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.
[0026] Thus, a feature indicated in this specification is intended to illustrate one of the features of one embodiment of the present invention, rather than to imply that every embodiment of the present invention must have the described feature. In addition, it should be noted that this specification describes many features. Although certain features can be combined together to illustrate possible system designs, these features can also be used in other, not explicitly described, combinations. Thus, unless otherwise noted, the described combinations are not intended to be limiting.
[0027] The cleaning system of the present invention includes two groups of cleaning equipment, and the two groups of cleaning equipment are arranged back to back. The front of the cleaning equipment refers to the side with a transparent observation window or an openable operating door, and the back of the cleaning equipment is the side opposite to the front.
[0028] Each cleaning system consists of at least one cleaning unit, each of which includes multiple processing tanks arranged in series, perpendicular to the front or back of the cleaning unit. Each cleaning unit has a loading station and a discharge station. The loading station is equipped with a first weighing device for weighing silicon wafers before processing, and the discharge station is equipped with a second weighing device for weighing silicon wafers after processing.
[0029] In addition to cleaning equipment, the cleaning system also includes a liquid distribution system, a drainage system, a water supply system and a control system.
[0030] The liquid dispensing system is used to transport and proportion the liquid required for the treatment tank. Two groups of cleaning equipment can share the same liquid dispensing system, but the control is relatively complex. It is better to configure one cleaning equipment with a liquid dispensing system to facilitate the individual control of the liquid for each cleaning equipment. Once a cleaning equipment fails, the corresponding liquid dispensing system can control the cleaning equipment to suspend liquid dispensing. Relatively speaking, the control logic and control pipelines are simpler and more reliable.
[0031] The drainage system allows all cleaning equipment to discharge waste liquid. The entire cleaning system can share a liquid distribution system, that is, the drainage system is shared by two groups of cleaning equipment. The drainage system includes a drainage branch pipe with a first valve connected to the treatment tank of each cleaning equipment one by one, and a drainage main pipe connected to all drainage branch pipes.
[0032] The water supply system provides cleaning water and water for dispensing medicines for the cleaning equipment, and can also be shared by two groups of cleaning equipment, thereby reducing costs.
[0033] The control system includes a liquid replacement control device and a liquid discharge control device.
[0034] The liquid exchange control device controls the liquid distribution system to deliver and proportion the required liquid to each treatment tank, and calculates the remaining number of treatments for each treatment tank based on the relationship between the liquid volume and the weight of the silicon wafer. When the remaining number of treatments in the treatment tank is less than 1, a drain signal is sent to the drain control device. The drain control device controls the valve of the drain branch pipe connected to the corresponding treatment tank in the drain system to drain the liquid, and then the liquid exchange control device exchanges the liquid for the corresponding treatment tank.
[0035] In the above embodiment, the processing tank can be prepared based on the production plan, or the relationship between the tank's solution capacity and the weight of the silicon wafers can be used to plan the production plan, or a combination of the two. The production plan primarily refers to the production process and the number of silicon wafers to be processed. For example, the type of solution is determined based on the production process, the weight of the silicon wafers that can be processed is calculated based on the tank's capacity, and the number of times the solution needs to be changed is planned.
[0036] The present invention arranges two groups of cleaning equipment back to back so that the two groups of cleaning equipment can share the same drainage system, saving costs and reducing space occupancy. In addition, the liquid exchange control device of the present invention also calculates the number of treatments of each treatment tank based on the relationship between the liquid capacity of each treatment tank and the weight of the silicon wafers. For the same cleaning equipment, the calculation can make the number of treatments of each tank in the same cleaning equipment the same, so that the various treatment tanks of the same cleaning equipment can meet the drainage conditions after processing the same batch of silicon wafers. In this way, only the remaining number of treatments of the upstream treatment tank in a cleaning equipment needs to be paid attention to, avoiding the need for separate monitoring of different treatment tanks, simplifying control costs. In addition, the liquid preparation of the present invention is fully automated, avoiding problems caused by human intervention.
[0037] Usually, the size of silicon wafers that can be processed by a cleaning device is fixed, that is, the surface of the silicon wafers processed by a cleaning device has a specific size or several specific sizes. When the size of the silicon wafer is a specific size, the surface area of the silicon wafer can be expressed by the formula S = f(G). The processing tank is mainly for wet processing of the surface of the silicon wafer, so the liquid volume V has a certain relationship with the surface area S of the silicon wafer, and thus the liquid volume V has a certain relationship with the weight of the silicon wafer. In one embodiment, the total weight G of the silicon wafers that can be processed by the corresponding liquid volume after the liquid is prepared can be calculated in advance. 总 , then after the processing tank has processed a batch of silicon wafers each time, it can be calculated by the formula [G 总 -(G0+…+G i )] / G i+1It is calculated that since the number of silicon wafers processed in each batch may be the same or different, when the remaining number of processing times of the processing tank is calculated to be less than 1, the processing tank can be drained. 总 is the total weight of silicon wafers that can be processed corresponding to the liquid capacity of the first treatment tank at the upstream of the cleaning equipment before the treatment begins. G0 is the weight of silicon wafers that are processed for the first time after the first treatment tank at the upstream of the cleaning equipment is filled with liquid. G i is the weight of the silicon wafer processed most recently after the solution is prepared, G i+1 is the weight of the next batch of silicon wafers to be processed.
[0038] This embodiment calculates the remaining number of processing times of the processing tank by weight, which is simpler to implement. Therefore, in order to detect the quality of the silicon wafers after cleaning, the flower basket of each cleaning equipment is weighed and recorded when loading. After cleaning in each processing tank of the cleaning equipment (to remove impurities), each silicon wafer will lose 0.4-0.5 grams. Taking 600 wafers as an example, under normal cleaning quality, each flower basket will lose 240-300 grams at the unloading location. This is used to judge the cleaning quality of the silicon wafers, and it can also be used to judge whether the liquid medicine meets the requirements. Therefore, some existing cleaning equipment is equipped with corresponding weighing devices. The present invention uses the weighing device at the loading location to calculate the remaining number of processing times of the processing tank, so that the processing tank can be drained and replaced in advance, thereby improving production efficiency. The present invention can also set a weighing device at the unloading location, and the weighing device at the unloading location can be used to judge the cleaning quality of the silicon wafers.
[0039] In a preferred embodiment, the volume of the chemical solution in each treatment tank of the same cleaning equipment can be controlled according to the relationship between the chemical solution volume V and the weight of the silicon wafers during the preparation of the chemical solution, so that the weight of the silicon wafers that can be processed by the treatment tanks of the same cleaning equipment is similar or exactly the same, for example, 总 ±k range. Then, when controlling, we only need to focus on the remaining number of treatments in the upstream treatment tank of a cleaning device to simplify the control logic. Therefore, at this time, formula G 总 / (G0+…+G i ), G 总 is the total weight of silicon wafers that can be processed corresponding to the liquid capacity of the first treatment tank at the upstream of the cleaning equipment before the treatment begins. G0 is the weight of silicon wafers that are processed for the first time after the first treatment tank at the upstream of the cleaning equipment is filled with liquid. G i This preferred embodiment simplifies the entire logic of liquid drainage and liquid replacement control.
[0040] In a preferred embodiment, the drainage device controls the sequential drainage of each treatment tank within the same cleaning apparatus, from upstream to downstream, based on their position within the cleaning apparatus. Alternatively, the drainage of each treatment tank follows the loading and unloading direction. Each treatment tank can be drained, cleaned, and dispensed simultaneously with the last batch of cleaning (relative to the cleaning apparatus), reducing liquid processing time and increasing equipment capacity. This can be understood as "catch-up" drainage.
[0041] In one embodiment, the cleaning equipment further comprises a liquid level meter for detecting the liquid level in the treatment tank.
[0042] The liquid replacement control device can count the cleaning time and liquid preparation time of each treatment tank based on the signal of the liquid level meter during the cleaning and dispensing process. The liquid discharge control device can count the discharge time of each treatment tank based on the signal of the liquid level meter during the discharge process.
[0043] In addition to the liquid level meter, the liquid exchange control device can also use one or more signals from a flow meter, valve opening, or thermometer to calculate cleaning time and liquid preparation time. To simplify control, the above embodiment only uses the liquid level meter to calculate the time of each process in the treatment tank. In this embodiment, the water used in the liquid is hot water.
[0044] Since each cleaning device can independently complete the corresponding processing process of the silicon wafer, in a preferred embodiment, each cleaning device group includes one cleaning device, that is, two cleaning devices are arranged back to back and share a set of drainage system. When the two cleaning devices are started, the cleaning device with the relatively faster liquid preparation time in the upstream processing tank is given priority to prepare the liquid and is 排1 * After β% of the time, the cleaning equipment with a relatively slow preparation time for the liquid in the upstream treatment tank starts to prepare the liquid, t 排1 The drainage time of the most upstream treatment tank of the cleaning equipment with priority liquid distribution, 0<β<100.
[0045] If the liquid preparation time of the treatment tanks at the upstream of the two cleaning devices is the same, one cleaning device can be randomly controlled to start dispensing liquid first, and then 排1 *After β% of the time, another cleaning device is controlled to start dispensing liquid.
[0046] For example, β can be a value of around 50, that is, the range of β is 50±A. Regardless of whether the two cleaning equipment use the same process, the discharge of the two cleaning equipment can be staggered for a certain period of time to avoid the problem of slow drainage flow rate and affected drainage rate caused by the drainage main of the drainage system taking care of the waste discharge of two cleaning equipment at the same time. This situation can be avoided by staggering the production and / or discharge of the two back-to-back cleaning equipment. The staggered time of the two cleaning equipment should be no less than 2 hours.
[0047] In a further embodiment, the drainage system further includes a buffer branch pipe with a second valve connected to each treatment tank in a one-to-one correspondence, at least one buffer tank connected to the buffer branch pipe, and the drainage port of the buffer tank is connected to the drainage main pipe.
[0048] Although in the previous embodiments, the liquid preparation times of the two groups of cleaning equipment have been staggered, that is, the drainage times have been staggered at the beginning, but since the present invention involves two groups of cleaning equipment, the processes of the two groups of cleaning equipment are the same or different, especially when they are different, due to the different reaction times of each treatment tank, different drainage times, etc., it is possible that multiple treatment tanks need to be drained as soon as possible. Therefore, setting a buffer tank, even if only one buffer tank is set, can effectively avoid this situation. In particular, setting a buffer tank will not increase the complexity of the drainage system and can avoid drainage conflicts between the two groups of cleaning equipment.
[0049] In a preferred embodiment, the liquid discharge control device calculates the buffer time difference of the next treatment tank of the treatment tank to be prepared located at the most upstream of the two cleaning devices. It should be noted that the treatment tank to be prepared located at the most upstream is referred to here. When the cleaning system is first started, the treatment tank to be prepared located at the most upstream is the same treatment tank as the first treatment tank of the cleaning device (the treatment tank located at the most upstream). However, as the liquid discharge proceeds, at any subsequent time point, the treatment tank to be prepared located at the most upstream may be the second, third or nth treatment tank. Then, the next treatment tank of the treatment tank to be prepared located at the most upstream refers to the corresponding third, fourth or n+1th treatment tank.
[0050] The buffer time difference of the processing tank is calculated by the formula Δt=t 排2 +t 配2 +t 洗2 -t 下游处理 -t 配1 -t 洗1 Calculate and control the treatment tank to drain through the buffer branch when the buffer time difference is greater than γ, γ≥0, t 排2 , t 洗2 and t 下游处理 are the sum of the drainage time and cleaning time of the next treatment tank to be prepared at the upstream and the treatment time of the downstream treatment tank, t 配1 and t 洗1 It refers to the liquid preparation time and cleaning time of the upstream treatment tank to be prepared in the same cleaning equipment.
[0051] This embodiment calculates the required drainage time, liquid preparation time and cleaning time of the processing tank, and then subtracts the processing time of its downstream, the liquid preparation time and the cleaning time of the previous processing tank, and then obtains a buffer time difference. When the buffer time difference is γ, it means that the processing tank takes a long time from the start of drainage to the complete processing of the next batch of silicon wafers. If the processing tank cannot increase the drainage priority, then even if the previous processing tank has processed the corresponding silicon wafers, it is still necessary to wait for the processing tank for a long time, which is not conducive to the optimization of the production line. Therefore, in this case, the drainage priority of the processing tank is increased, and the liquid is discharged through the buffer tank. Then the buffer tank can discharge the waste liquid to the drainage main according to the timing to avoid pipeline congestion, thereby improving the efficiency of the production line.
[0052] In the above embodiment, the liquid exchange control device may also be equipped with a one-button start-stop function. When the detection device detects an abnormality, the liquid exchange control device may pause or restart the liquid preparation function through the one-button start-stop function.
[0053] Figure 1 A preferred embodiment of the cleaning system of the present invention is shown. Two cleaning devices are arranged back to back so that the two cleaning devices 1 share the same drainage system 7 and water heater (water supply system), thus saving one set of water supply system and drainage system.
[0054] The robot arm 2 is positioned along the processing direction of the cleaning apparatus. Multiple processing tanks 3 are arranged sequentially within the two cleaning apparatuses 1. Each cleaning apparatus is equipped with a liquid exchange control device, while the drainage control device is not shown. A loading device 5 is provided on the left side of the cleaning apparatus, with a flower basket 6 mounted on top of the loading device 5. In this embodiment, the drainage system 7 has a herringbone-shaped drainage branch and main drainage pipe when viewed from above. The drainage system 7 is connected to a wastewater tank 8. Each drainage branch pipe connected to the processing tank is equipped with a manual valve 701 and a solenoid valve 702.
[0055] After the technical solution of the present invention is applied to the cleaning system, the remaining number of cleanings that can be completed by the liquid in the treatment tank can be automatically calculated. When the remaining number of cleanings is less than 1, no manual operation is required. The control system controls and cooperates with the treatment tank, the drainage system, the liquid mixing system, etc. to realize automatic discharge, self-cleaning, and liquid mixing of the liquid in the treatment tank without manual mixing. At the same time, a one-button start and stop liquid mixing is added to prevent the need for re-liquid mixing or stopping in the event of an emergency during the liquid mixing process. The treatment tank consists of a main tank and a sub-tank. The sub-tank is connected to the main tank with a circulation pipe for circulation. It is also provided with a liquid inlet pipe, a liquid discharge pipe, a thermometer, a liquid level gauge (magnetostrictive liquid level gauge, ultrasonic liquid level gauge, etc.), and a pump, a manual valve, a solenoid valve, a flow meter (metering barrel), etc. are provided on the pipe.
[0056] Figure 2The specific usage method of the present invention is shown. A specific production plan can be formulated based on the relationship between the volume of the chemical solution and the weight of the silicon wafers. The liquid replacement control device controls the liquid preparation system to prepare the required chemical solution for each treatment tank according to the specific process requirements. The chemical solution includes an acidic solution and / or an alkaline solution. Then, the weight of the silicon wafers weighed at the loading location is counted, and the weight of the silicon wafers that have been processed by the batch chemical solution in the corresponding treatment tank (which can be a treatment tank that can process the least number of silicon wafers, or all treatment tanks, or the most upstream treatment tank) is counted. Under the premise of knowing the weight of the least processed silicon wafers in each batch, or the premise of knowing the weight of the next batch of silicon wafers, the liquid replacement control device can calculate the remaining number of processing times for each treatment tank based on the relationship between the volume of the chemical solution and the weight of the silicon wafers. If the remaining number of times for the corresponding treatment tank is less than 1, the liquid discharge control device controls the corresponding treatment tank to discharge the liquid.
[0057] For example, if each processing tank is counted separately, then the processing tank whose remaining number of times is less than 1 will be drained. If the number of silicon wafers that can be processed by all processing tanks is similar, the processing tank at the upstream or that can process the least number of silicon wafers will be selected for monitoring. Then, when the remaining number of times in the processing tank is less than 1, the drainage control device controls the processing tanks of the cleaning equipment to perform catch-up drainage. The drainage, cleaning, and liquid preparation can be performed at the same time as the last batch of cleaning, which reduces the liquid processing time and improves the equipment production capacity. It can be understood as a "catch-up" liquid change, and each cleaning tank (or multiple cleaning tanks as a batch) is prepared and replaced one by one (batch) in the direction from loading to unloading.
[0058] Taking texturing as an example, the number of silicon wafers processed in each batch is the same, that is, the weight is the same. It is calculated that the new liquid can be used for 200 batches of cleaning. When the liquid is for the 200th cleaning, the remaining number is 0, which is less than 1. The loading device is controlled to stop loading. At this time, the 200th cleaning is in progress. After the flower basket is cleaned in the first treatment tank and placed in the second treatment tank, the drainage system of the first treatment tank is controlled to start draining. After draining, pure water is used to clean the residual liquid in the tank body through the liquid inlet pipe. After the cleaning is completed, the liquid is prepared. A flow meter (or metering barrel) can be provided on the liquid exchange pipe, which is connected to the computer to control its ratio. After the preparation of the first treatment tank is completed, when the flower basket is in the second After the cleaning is completed in the treatment tank and it enters the third treatment tank, the second treatment tank repeats the drainage, cleaning and liquid preparation procedures of the first treatment tank. When the flower basket enters the fifth treatment tank, the third treatment tank is draining (cleaning and liquid preparation), and the fourth treatment tank can also drain (cleaning and liquid preparation) at the same time to further improve the liquid preparation efficiency. At this time, the third and fourth treatment tanks are the same batch of liquid replacement tanks, which saves liquid preparation time. Until the flower basket is cleaned, the last tank is also completed with liquid preparation, realizing liquid preparation while cleaning. After all tanks are replaced and prepared, the temperature of the liquid in each tank is tested to see if it meets the standard. After meeting the standard, the new liquid begins to be used and the equipment begins to load.
[0059] The treatment tank of the present invention is composed of a main tank and a sub-tank. The sub-tank is connected to the main tank by a circulation pipe for circulation overflow. It is also provided with a liquid inlet pipe, a liquid discharge pipe, a thermometer, and a liquid level gauge (magnetostrictive liquid level gauge, ultrasonic liquid level gauge, etc.). According to different processes, the cleaning tank can be selected to always maintain an overflow state. The main tank overflows through the overflow port and flows into the sub-tank. The sub-tank passes through the circulation pipe (the pipe is provided with a circulation pump, a manual valve, and a solenoid valve). The thermometer is mainly used to detect the temperature of the liquid in the tank body. The liquid level gauge is used to monitor and prevent the tank body from breaking or other reasons that cause the liquid level in the tank body to be extremely low and cannot be discovered in time, resulting in poor cleaning effect. The liquid exchange system includes a liquid exchange tank, a liquid exchange pipe, a pump body, a manual valve, a solenoid valve, and a flow meter (metering barrel). The liquid exchange system is connected to the part 301-liquid inlet pipe, which includes pure water (hot water), HCL, H202, NAOH, KOH and other solutions. The flow meter can monitor and dispense the liquid according to the preset liquid ratio.
[0060] The present invention controls the liquid replacement, drainage, and cleaning of the processing tank through a computer, and can complete liquid preparation without manual operation. At the same time, a one-button start and stop function is added to the computer to prevent emergencies during the liquid preparation process that require re-liquid preparation or stoppage of operation. The weight of the flower basket can also be recorded and analyzed. The flower basket is weighed and recorded when the material is loaded. After cleaning (to remove impurities), the average weight of each piece will be reduced by about 0.4-0.5 grams. Taking 600 pieces as an example, under normal cleaning quality, each flower basket will lose 240-300 grams. This can be used to judge the cleaning quality of the silicon wafers and determine whether the liquid meets the requirements.
[0061] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.
Claims
1. A cleaning system, characterized in that: include: Two groups of cleaning equipment, the two groups of cleaning equipment are arranged back to back, each group of cleaning equipment includes at least one cleaning equipment, each cleaning equipment includes a plurality of processing tanks arranged in sequence, a first weighing device provided at the loading position for weighing the weight of silicon wafers before processing, and a second weighing device provided at the unloading position for weighing the weight of silicon wafers after processing; A liquid preparation system for conveying and proportioning the required liquid medicine to the treatment tank; A drainage system shared by two groups of cleaning equipment, comprising drainage branches with first valves connected one-to-one to the treatment tanks of each cleaning equipment, and a drainage main pipe connected to the drainage branches; A water supply system, which is shared by two groups of cleaning equipment, and provides cleaning water and pharmaceutical preparation water to the cleaning equipment; The control system includes a liquid replacement control device and a liquid discharge control device. The liquid replacement control device controls the liquid distribution system to deliver and proportion the required liquid to the treatment tank, and calculates the remaining number of treatments for each treatment tank based on the relationship between the liquid distribution capacity and the weight of the silicon wafer. When the remaining number of treatments in the treatment tank is less than 1, a liquid discharge signal is sent to the liquid discharge control device. After the liquid discharge control device controls the valve of the liquid discharge branch pipe connected to the corresponding treatment tank in the liquid discharge system to discharge the liquid, the liquid replacement control device replaces the liquid in the corresponding treatment tank.
2. The cleaning system according to claim 1, wherein: The remaining number of treatments in the treatment tank is calculated by the formula [G 总 -(G0+…+G i )] / G i+1 Calculated, G 总 is the total weight of silicon wafers that can be processed corresponding to the liquid capacity of the first treatment tank at the upstream of the cleaning equipment before the treatment begins. G0 is the weight of silicon wafers that are processed for the first time after the first treatment tank at the upstream of the cleaning equipment is filled with liquid. G i is the weight of the silicon wafer processed most recently after the solution is prepared, G i+1 is the weight of the next batch of silicon wafers to be processed.
3. The cleaning system according to claim 1, wherein: The liquid discharge device controls the liquid discharge of each processing tank in the same cleaning equipment in sequence from upstream to downstream according to the position of the processing tank in the cleaning equipment.
4. The cleaning system according to claim 3, wherein: The cleaning equipment also includes a liquid level meter for detecting the liquid level of the treatment tank. The liquid replacement control device counts the cleaning time and liquid preparation time of each treatment tank based on the signal of the liquid level meter during the cleaning and dispensing process. The liquid discharge control device counts the liquid discharge time based on the signal of the liquid level meter during the liquid discharge process.
5. The cleaning system according to claim 4, wherein: Each group of cleaning equipment includes one cleaning equipment. When two cleaning equipment are started, the cleaning equipment with the fastest liquid preparation time in the upstream treatment tank is given priority to prepare liquid and 排1 * After β% of the time, the cleaning equipment with relatively slow preparation time for the liquid in the upstream treatment tank starts to prepare the liquid. 排1 The drainage time of the most upstream treatment tank of the cleaning equipment with priority liquid distribution, 0<β<100.
6. The cleaning system according to claim 5, wherein: The drainage system further includes a buffer branch pipe with a second valve connected to each treatment tank in a one-to-one correspondence, at least one buffer tank connected to the buffer branch pipe, and a drainage port of the buffer tank connected to the drainage main pipe.
7. The cleaning system according to claim 6, wherein: The liquid discharge control device calculates the buffer time difference Δt=t between the next processing tank of the processing tank to be prepared located at the upstream of the two cleaning equipments. 排2 +t 配2 +t 洗2 -t 下游处理 -t 配1 -t 洗1 , and when the buffer time difference is greater than γ, the treatment tank is controlled to drain through the buffer branch pipe, γ≥0, t 排2 , t 洗2 and t 下游处理 are respectively the sum of the drainage time, cleaning time of the next treatment tank to be prepared located at the upstream and the treatment time of the downstream treatment tank, the t 配1 and t 洗1 It refers to the liquid preparation time and cleaning time of the upstream treatment tank to be prepared in the same cleaning equipment.
8. The cleaning system according to any one of claims 1 to 7, characterized in that: The liquid exchange control device is set in a one-to-one correspondence with the cleaning equipment. The liquid exchange control device is equipped with a one-button start-stop function. When the detection device detects an abnormality, the liquid exchange control device pauses or restarts the liquid preparation function through the one-button start-stop function.
9. The cleaning system according to any one of claims 1 to 7, characterized in that: The medical solution includes an acidic solution and / or an alkaline solution.
Citation Information
Patent Citations
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